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Saki Corporation will demonstrate its 2D and 3D automated optical inspection (AOI) systems at NEPCON South China in booth 1G35. Saki's AOI systems' unique Phase Measurement Profilometry technology and quad-directional side cameras inspect and measure QFNs, J-leads, and connectors, and enable the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed. NEPCON South China is being held August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.
On display will be Saki's BF-3Di-L1, for L size boards, and BF-3Di-D1, with dual lanes. The systems measure heights from 0 to 20mm and from all four directions without a dead angle. They enable full automation with very low false calls and zero escapes. Failures of microchips with small pads and parts that have bottom electrodes are detected and the software directly reads sample and component height data to analyze assembly conditions.
Also on display will be Saki's BF-TristarII high-speed selective solder inspection and simultaneous two-sided inspection system. Two separate production processes can now be done in one simple process. It can inspect top-side SMT and bottom-side reflow or through-hole components on both sides in one pass, including inspection for stray parts. This compact machine can even be easily installed into a cell production line.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automatic recognition through robotic vision technology, applying ground-breaking image processing tools to solve inspection problems associated with printed circuit board assembly. Saki Corporation has headquarters in Tokyo, Japan with offices and sales and support centers around the world. Saki has Quality Management System JIS Q 9001:2008 and ISO 9001:2008 certifications.