KIC Offers Automation and Smart Oven Technology for the Smart Factory


Reading time ( words)

KIC today announced that it will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 5-6, 2016 at Hotel Riu Guadalajara. KIC will demonstrate how its smart oven technologies lead to reduced production costs, higher quality and the new capabilities that the electronic assembly market demands.

One exciting aspect of these smart technologies is that they are retrofitable on virtually all oven models at nearly any age. Now the entire factory can use smart oven technologies. 

KIC’s technology provides either near instant oven changeover time or dramatically reduced downtime. Additionally, KIC’s automatic systems eliminate manual tasks such as periodic manual profiling and reduce the opportunities for human mistakes in setting up and running the ovens.

KIC’s smart oven technologies automatically measure the PCB profile and its match to the relevant process window. Share this continuous and near real-time process and traceability data with all authorized personnel and MES over the factory’s LAN. True process data helps the maintenance people troubleshoot and fix issues faster. 

About KIC

Based in San Diego, KIC is the industry leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and then worked to create the next generation of thermal systems to help manufacturers improve the thermal process quality while reducing cost.

KIC products include the KIC K2, X5, KICstart2, ProBot, 24/7 Wave, KIC RPI and KIC Footprint. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and automatic thermal process systems, and has won numerous industry awards.

For more information, click here.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

This Month in SMT007 Magazine: Business Practices Drive the Smart Factory, Not the Other Way Around (Part 1)

03/19/2020 | I-Connect007 Editorial Team
In Part 1 of this conversation, Sagi Reuven— business development manager at Mentor, a Siemens Business—makes the case that smart factory implementations must start with traditional process analysis and improvement before the data capture process is useful. He also covers how sometimes the key to utilizing Industry 4.0 comes from a change in mindset rather than a drastic change or investment in new equipment or processes.

IPC APEX EXPO 2020 Attendees Speak: Camille Sybert

03/13/2020 | I-Connect007 Editorial Team
"There’s a need for flexible solutions, so people are trying to make the most of the equipment that they buy, and they want to have the equipment that’s able to be flexible in scale with what it is that they’re looking for," said Camille Sybert of Nordson Electronics Solutions. "We have customers asking about future capabilities that they might not be ready for right now, but they want to know that it’s something that can be easily integrated into their processes in the future, as they’re in a position to better be able to do so."



Copyright © 2020 I-Connect007. All rights reserved.