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Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

07/31/2018 | T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

AIM Solder Receives Best Presentation Awards at SMTA China East Technical Conference

07/12/2018 | AIM Solder
AIM Solder's Dillon Zhu and Derek Wang have received Best Presentation awards for their respective technical sessions at the SMTA China East Technical Conference in Shanghai.

AIM to Feature REL61 at the SMTA Ohio Expo & Tech Forum

07/10/2018 | AIM Solder
AIM Solder will highlight its novel REL electronic solders, REL22 and REL61, at the SMTA Ohio Expo & Tech Forum, scheduled to take place on July 12, 2018 at Embassy Suites Cleveland Rockside in Independence, Ohio.

June 2018 Issue of SMT007 Magazine Available Now

06/04/2018 | I-Connect007
Manufacturers are having to navigate critical challenges that rock their boat when faced with assembling flexible printed circuits. In the June 2018 issue of SMT007 Magazine, we examine these concerns and highlight some of the strategies and techniques used to address them. Hear from companies such as Lenthor Engineering, Miraco, BEST Inc., Vexos, Thermaltronics, Rehm Thermal Systems, Alpha Assembly Solutions, AIM Metals and Alloys, and more!

AIM's Karl Seelig Now an Independent Consultant

01/08/2018 | AIM Solder
AIM Solder has announced that Karl Seelig, VP of Technology, will transition to the role of independent consultant as of January 1, 2018.
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