Knocking Down the Bone Pile: Electronics Assembly Industry Outlook

The next two to three years on the horizon should bring some challenges and opportunities for the electronics assembly industry. My perspective on the electronics supply chain is very broad in nature. Our firm is involved in PCB rework/repair, including the supply of niche PCB rework, repair, and assembly products, as well as the training of soldering technicians, engineers, and wire/cable harness users and suppliers.

In terms of markets, due to the very diverse nature of our business, we are involved in the military, aerospace, semiconductor, industrial, communications, EMS, IoT, computer, trade school, training center, education, research, and medical fields. The nature of our varied businesses and thousands of customers over 20+ years puts us in the mix from design through prototyping, manufacturing, and product support. Geographically, our products go directly into the market around the world, our rework and repair services are a harbinger of the EMS build market, and our training services are hyper-focused in the Midwest of the United States. Therefore, we see much of the activity in the global electronics supply chain. There are numerous PCB rework/repair challenges being faced by North American customers. One trend has to do with increasing package sizes, which are being driven by the market desires. In the past five years alone, the state-of-the-art semiconductor package has gone from approximately 10 to 30 billion transistors on a single package. These larger package devices—such as LGAs, BGAs, and CCGAs with greater than 50 x 50 mm overall package size—challenge rework equipment and processing capabilities.

To read this entire column, which appeared in the November 2019 issue of SMT007 Magazine, click here.

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2019

Knocking Down the Bone Pile: Electronics Assembly Industry Outlook

12-17-2019

Geographically, our products go directly into the market around the world, our rework and repair services are a harbinger of the EMS build market, and our training services are hyper-focused in the Midwest of the United States. Therefore, we see much of the activity in the global electronics supply chain. There are numerous PCB rework/repair challenges being faced by North American customers. One trend has to do with increasing package sizes, which are being driven by the market desires. In the past five years alone, the state-of-the-art semiconductor package has gone from approximately 10 to 30 billion transistors on a single package.

View Story

Knocking Down the Bone Pile: Process Methods for Reworking High Lead Count SMT Parts

10-09-2019

There are numerous methods for getting the solder onto the right pads in the right volume during SMT rework of high pin count or very small footprint SMT devices. The most common types of solder deposition include printing, dispensing, and hand soldering. Each of these methods has pros and cons, depending on a variety of factors in the rework process.

View Story

Knocking Down the Bone Pile: BGA and PCB Warpage—What to Do

07-10-2019

Warpage of BGA packages or PCBs can occur when any heating and subsequent cooling cycle is gone through. This may leave the package to bow in the middle. Pushing the corners up or downward will show up in bridging (caught on X-ray) or cause opens that would show up on endoscopic or visual inspection. Here's what you need to do.

View Story

Knocking Down the Bone Pile: Straightening Out Those Corners

05-22-2019

A PCB can be dropped, dinged, or mishandled as it is placed into a board carrier in the PCB assembly operations area. When the laminated material is damaged in this manner, can it be repaired? The answer, like most engineering answers, is that it depends. Read on.

View Story

Inspection of BGAs After Rework

03-21-2019

After removing and replacing a ball grid array (BGA), the acceptability of the interconnection of the solder balls to the PCB should be assured, because this assurance and the criteria for that assurance are the customer’s outgoing inspection criteria.

View Story

How Much is Too Much?

01-09-2019

One of the typical questions process engineers pose regarding the PCB rework process is, "How many heat cycles are too much?" Asked in another way, the question is, "How would one define a limit on the number of times a PCB can be reworked while still being reasonably assured that the reliability has not been impacted based on its operational environment?" Find out how.

View Story
Back

2018

Knocking Down the Bone Pile: Electronics Assembly Industry Outlook

12-17-2019

Geographically, our products go directly into the market around the world, our rework and repair services are a harbinger of the EMS build market, and our training services are hyper-focused in the Midwest of the United States. Therefore, we see much of the activity in the global electronics supply chain. There are numerous PCB rework/repair challenges being faced by North American customers. One trend has to do with increasing package sizes, which are being driven by the market desires. In the past five years alone, the state-of-the-art semiconductor package has gone from approximately 10 to 30 billion transistors on a single package.

View Story

Knocking Down the Bone Pile: Process Methods for Reworking High Lead Count SMT Parts

10-09-2019

There are numerous methods for getting the solder onto the right pads in the right volume during SMT rework of high pin count or very small footprint SMT devices. The most common types of solder deposition include printing, dispensing, and hand soldering. Each of these methods has pros and cons, depending on a variety of factors in the rework process.

View Story

Knocking Down the Bone Pile: BGA and PCB Warpage—What to Do

07-10-2019

Warpage of BGA packages or PCBs can occur when any heating and subsequent cooling cycle is gone through. This may leave the package to bow in the middle. Pushing the corners up or downward will show up in bridging (caught on X-ray) or cause opens that would show up on endoscopic or visual inspection. Here's what you need to do.

View Story

Knocking Down the Bone Pile: Straightening Out Those Corners

05-22-2019

A PCB can be dropped, dinged, or mishandled as it is placed into a board carrier in the PCB assembly operations area. When the laminated material is damaged in this manner, can it be repaired? The answer, like most engineering answers, is that it depends. Read on.

View Story

Inspection of BGAs After Rework

03-21-2019

After removing and replacing a ball grid array (BGA), the acceptability of the interconnection of the solder balls to the PCB should be assured, because this assurance and the criteria for that assurance are the customer’s outgoing inspection criteria.

View Story

How Much is Too Much?

01-09-2019

One of the typical questions process engineers pose regarding the PCB rework process is, "How many heat cycles are too much?" Asked in another way, the question is, "How would one define a limit on the number of times a PCB can be reworked while still being reasonably assured that the reliability has not been impacted based on its operational environment?" Find out how.

View Story
Back

2017

Knocking Down the Bone Pile: Electronics Assembly Industry Outlook

12-17-2019

Geographically, our products go directly into the market around the world, our rework and repair services are a harbinger of the EMS build market, and our training services are hyper-focused in the Midwest of the United States. Therefore, we see much of the activity in the global electronics supply chain. There are numerous PCB rework/repair challenges being faced by North American customers. One trend has to do with increasing package sizes, which are being driven by the market desires. In the past five years alone, the state-of-the-art semiconductor package has gone from approximately 10 to 30 billion transistors on a single package.

View Story

Knocking Down the Bone Pile: Process Methods for Reworking High Lead Count SMT Parts

10-09-2019

There are numerous methods for getting the solder onto the right pads in the right volume during SMT rework of high pin count or very small footprint SMT devices. The most common types of solder deposition include printing, dispensing, and hand soldering. Each of these methods has pros and cons, depending on a variety of factors in the rework process.

View Story

Knocking Down the Bone Pile: BGA and PCB Warpage—What to Do

07-10-2019

Warpage of BGA packages or PCBs can occur when any heating and subsequent cooling cycle is gone through. This may leave the package to bow in the middle. Pushing the corners up or downward will show up in bridging (caught on X-ray) or cause opens that would show up on endoscopic or visual inspection. Here's what you need to do.

View Story

Knocking Down the Bone Pile: Straightening Out Those Corners

05-22-2019

A PCB can be dropped, dinged, or mishandled as it is placed into a board carrier in the PCB assembly operations area. When the laminated material is damaged in this manner, can it be repaired? The answer, like most engineering answers, is that it depends. Read on.

View Story

Inspection of BGAs After Rework

03-21-2019

After removing and replacing a ball grid array (BGA), the acceptability of the interconnection of the solder balls to the PCB should be assured, because this assurance and the criteria for that assurance are the customer’s outgoing inspection criteria.

View Story

How Much is Too Much?

01-09-2019

One of the typical questions process engineers pose regarding the PCB rework process is, "How many heat cycles are too much?" Asked in another way, the question is, "How would one define a limit on the number of times a PCB can be reworked while still being reasonably assured that the reliability has not been impacted based on its operational environment?" Find out how.

View Story
Back

2016

Knocking Down the Bone Pile: Electronics Assembly Industry Outlook

12-17-2019

Geographically, our products go directly into the market around the world, our rework and repair services are a harbinger of the EMS build market, and our training services are hyper-focused in the Midwest of the United States. Therefore, we see much of the activity in the global electronics supply chain. There are numerous PCB rework/repair challenges being faced by North American customers. One trend has to do with increasing package sizes, which are being driven by the market desires. In the past five years alone, the state-of-the-art semiconductor package has gone from approximately 10 to 30 billion transistors on a single package.

View Story

Knocking Down the Bone Pile: Process Methods for Reworking High Lead Count SMT Parts

10-09-2019

There are numerous methods for getting the solder onto the right pads in the right volume during SMT rework of high pin count or very small footprint SMT devices. The most common types of solder deposition include printing, dispensing, and hand soldering. Each of these methods has pros and cons, depending on a variety of factors in the rework process.

View Story

Knocking Down the Bone Pile: BGA and PCB Warpage—What to Do

07-10-2019

Warpage of BGA packages or PCBs can occur when any heating and subsequent cooling cycle is gone through. This may leave the package to bow in the middle. Pushing the corners up or downward will show up in bridging (caught on X-ray) or cause opens that would show up on endoscopic or visual inspection. Here's what you need to do.

View Story

Knocking Down the Bone Pile: Straightening Out Those Corners

05-22-2019

A PCB can be dropped, dinged, or mishandled as it is placed into a board carrier in the PCB assembly operations area. When the laminated material is damaged in this manner, can it be repaired? The answer, like most engineering answers, is that it depends. Read on.

View Story

Inspection of BGAs After Rework

03-21-2019

After removing and replacing a ball grid array (BGA), the acceptability of the interconnection of the solder balls to the PCB should be assured, because this assurance and the criteria for that assurance are the customer’s outgoing inspection criteria.

View Story

How Much is Too Much?

01-09-2019

One of the typical questions process engineers pose regarding the PCB rework process is, "How many heat cycles are too much?" Asked in another way, the question is, "How would one define a limit on the number of times a PCB can be reworked while still being reasonably assured that the reliability has not been impacted based on its operational environment?" Find out how.

View Story
Back

2015

Knocking Down the Bone Pile: Electronics Assembly Industry Outlook

12-17-2019

Geographically, our products go directly into the market around the world, our rework and repair services are a harbinger of the EMS build market, and our training services are hyper-focused in the Midwest of the United States. Therefore, we see much of the activity in the global electronics supply chain. There are numerous PCB rework/repair challenges being faced by North American customers. One trend has to do with increasing package sizes, which are being driven by the market desires. In the past five years alone, the state-of-the-art semiconductor package has gone from approximately 10 to 30 billion transistors on a single package.

View Story

Knocking Down the Bone Pile: Process Methods for Reworking High Lead Count SMT Parts

10-09-2019

There are numerous methods for getting the solder onto the right pads in the right volume during SMT rework of high pin count or very small footprint SMT devices. The most common types of solder deposition include printing, dispensing, and hand soldering. Each of these methods has pros and cons, depending on a variety of factors in the rework process.

View Story

Knocking Down the Bone Pile: BGA and PCB Warpage—What to Do

07-10-2019

Warpage of BGA packages or PCBs can occur when any heating and subsequent cooling cycle is gone through. This may leave the package to bow in the middle. Pushing the corners up or downward will show up in bridging (caught on X-ray) or cause opens that would show up on endoscopic or visual inspection. Here's what you need to do.

View Story

Knocking Down the Bone Pile: Straightening Out Those Corners

05-22-2019

A PCB can be dropped, dinged, or mishandled as it is placed into a board carrier in the PCB assembly operations area. When the laminated material is damaged in this manner, can it be repaired? The answer, like most engineering answers, is that it depends. Read on.

View Story

Inspection of BGAs After Rework

03-21-2019

After removing and replacing a ball grid array (BGA), the acceptability of the interconnection of the solder balls to the PCB should be assured, because this assurance and the criteria for that assurance are the customer’s outgoing inspection criteria.

View Story

How Much is Too Much?

01-09-2019

One of the typical questions process engineers pose regarding the PCB rework process is, "How many heat cycles are too much?" Asked in another way, the question is, "How would one define a limit on the number of times a PCB can be reworked while still being reasonably assured that the reliability has not been impacted based on its operational environment?" Find out how.

View Story
Back

2014

Knocking Down the Bone Pile: Electronics Assembly Industry Outlook

12-17-2019

Geographically, our products go directly into the market around the world, our rework and repair services are a harbinger of the EMS build market, and our training services are hyper-focused in the Midwest of the United States. Therefore, we see much of the activity in the global electronics supply chain. There are numerous PCB rework/repair challenges being faced by North American customers. One trend has to do with increasing package sizes, which are being driven by the market desires. In the past five years alone, the state-of-the-art semiconductor package has gone from approximately 10 to 30 billion transistors on a single package.

View Story

Knocking Down the Bone Pile: Process Methods for Reworking High Lead Count SMT Parts

10-09-2019

There are numerous methods for getting the solder onto the right pads in the right volume during SMT rework of high pin count or very small footprint SMT devices. The most common types of solder deposition include printing, dispensing, and hand soldering. Each of these methods has pros and cons, depending on a variety of factors in the rework process.

View Story

Knocking Down the Bone Pile: BGA and PCB Warpage—What to Do

07-10-2019

Warpage of BGA packages or PCBs can occur when any heating and subsequent cooling cycle is gone through. This may leave the package to bow in the middle. Pushing the corners up or downward will show up in bridging (caught on X-ray) or cause opens that would show up on endoscopic or visual inspection. Here's what you need to do.

View Story

Knocking Down the Bone Pile: Straightening Out Those Corners

05-22-2019

A PCB can be dropped, dinged, or mishandled as it is placed into a board carrier in the PCB assembly operations area. When the laminated material is damaged in this manner, can it be repaired? The answer, like most engineering answers, is that it depends. Read on.

View Story

Inspection of BGAs After Rework

03-21-2019

After removing and replacing a ball grid array (BGA), the acceptability of the interconnection of the solder balls to the PCB should be assured, because this assurance and the criteria for that assurance are the customer’s outgoing inspection criteria.

View Story

How Much is Too Much?

01-09-2019

One of the typical questions process engineers pose regarding the PCB rework process is, "How many heat cycles are too much?" Asked in another way, the question is, "How would one define a limit on the number of times a PCB can be reworked while still being reasonably assured that the reliability has not been impacted based on its operational environment?" Find out how.

View Story
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