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Implementing a Capacity Planning Tool
09/22/2017 | David Prunier, MC Assembly
RTW SMTAI: MIRTEC on Staying Ahead of the Curve
09/21/2017 | Real Time with...SMTAI
RTW SMTAI: Gary Tanel Discusses How SMTA Helps the Industry Evolve
09/20/2017 | Real Time with...SMTAI
Drying Boards after Rework Cleaning—To Do or Not to Do?
09/19/2017 | Bob Wettermann, BEST Inc.
What's Up in Scandinavia's EMS Industry?
09/18/2017 | Dieter G. Weiss, Weiss Engineering
SMT :: Associations
RTW SMTAI: Gary Tanel Discusses How SMTA Helps the Industry Evolve
At the SMTA International 2017 exhibition in Rosemont, Illinois, Gary Tanel, president of the SMTA Dallas Chapter, speaks with I-Connect007 Publisher Barry Matties on a myriad of topics, including the goal of the SMTA as an industry association, and how it is helping the industry evolve. They also discussed challenges and strategies in bringing more young people to the industry.
Training and Education: Key to Improving Electronics Assembly
For this month's issue of SMT Magazine, we spoke with Luis Ramirez and Dan Prina of EMS firm MC Assembly to discuss the challenges of and strategies in improving the PCB assembly process from an EMS provider’s perspective. We also spoke with Manncorp's Tom Beck and Chris Ellis to get their viewpoints on the subject as an equipment provider.
Stephen V. Chavez Talks Mil/Aero PCB Design
Stephen V. Chavez, CID+, is the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS), a military contractor that builds all manner of cutting-edge tools for the American warfigher. He’s been designing military and aerospace PCBs for decades, and he’s a veteran of the United States Marine Corps. I caught up with Steph and asked for his thoughts on designing PCBs for the military and aerospace markets.
IMPACT Interview: Fern Abrams, IPC
At the recent IMPACT Washington D.C. 2017 event, I-Connect007's Patty Goldman speaks with IPC's Fern Abrams to get the inside story on the meeting with EPA.
The Need for Assembly Training and Education
While investing in the latest technologies and having a systems-based approach in your assembly processes are important, the key factors that will make you successful in your continuous improvement goal are the skills, training, and education of your workforce. However you look at it, the human factor remains a critical issue when it comes to your overall efficiency.
IPC: Department of Labor Releases RFI to Seek Information on Overtime Regulations
This week, the Department of Labor (DOL) released a Request for Information (RFI) to gather additional feedback from the public on the overtime regulations, which define and delimit exemptions from the Fair Labor Standards Act’s minimum wage and overtime requirements for certain executive, administrative, professional, outside sales and other employees.
Perspectives from a First-Timer
Brad Heath, president and CEO of EMS company VirTex, is a first-time attendee of IMPACT Washington D.C. In an interview with I-Connect007 Managing Editor Patty Goldman, he talks about his impressions of the recent IMPACT Washington D.C. event, and how he thinks the industry benefits from such meetings with the policy makers in the government.
STI Electronics' Dave Raby Shares His Insights on IMPACT Washington DC 2017
During the recent IMPACT Washington D.C. 2017 event, I-Connect007 Managing Editor Patty Goldman caught up with Dave Raby, president and CEO of EMS firm STI Electronics, to discuss about the event and their meetings with representatives of the government that came over to hear what the collective electronics manufacturing industry has to say.
The Role of Industry Associations in Training and Education
Industry associations, such as the IPC and the SMTA, help advance the electronics manufacturing industry through standardization, training, education, advocacy, and interaction through trade events, exhibitions and symposiums. They help members to become aware of the latest technology developments happening in their industry verticals, and of the market trends shaping the direction of the industry.
The Skills Gap – Meet People Where They Are!
A perennial concern in the U.S. electronics manufacturing industry is the lack of skilled talent in many parts of the country. According to a recent IPC member survey, most companies have a hard time recruiting qualified production workers, engineers, and other technical professionals.
The Importance of Training for your Organization
In our recent survey on assembly training and education, another question we asked is about the importance of training to your organization. Around 85% of our respondents consider training really important to their workforce. In fact, the majority of respondents—47%—say it is very important.
The Importance of Conformal Coating, Now and in the Future
At the SMTA Michigan Expo and Tech Forum, held in Grand Rapids on May 11, Technical Editor Happy Holden spent a few minutes with AIM Solder’s Technical Marketing Manager Tim O’Neill to discuss O’Neill’s presentation on the topic of conformal coating over no-clean fluxes.
Better Together: How HDP User Group Showcases the Industry’s Best Side
HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.
Assembly Training and Education
Even if your PCB assembly process is optimized, there is always room for improvement. And no matter how successful your company has been in the past, you just can’t rest on your laurels. It is always in your best interest to strive towards a better operations model. We've created a survey to help us gauge the importance of training and education in your workforce, and the benefits that you get in ensuring that your operators and engineers have the most current knowledge and skill sets.
President Donald Trump Launches Workforce Development Week
Earlier this week President Donald Trump announced “Workforce Development Week.” As such, President Trump spent the last four days promoting job creation and even signed executive order expanding apprenticeship programs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
HDP User Group 2017 European Meeting Highlights Technology Progress
The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.
RTW NEPCON CHINA: Mycronic Meets High-volume Demand with Solder Jet Printing
Mycronic VP for Global Dispensing and Managing Director Clemens Jargon discusses how the flexibility of solder jet printing helps reduce downtime in the line, thus increasing total line speed and enabling it to keep up with high-volume demand.
Mentor Graphics: Connecting the Manufacturing Environment
Oren Manor serves as the director of business development for Mentor Graphics Valor Division. In this interview with SMT Magazine, Manor discusses the latest updates in their OML community, their case study regarding Phoenix Contact’s implementation of their IoT solution in its facilities, and what’s new in ODB++.
SMTA West Penn Expo: Who Says There’s No Such Thing as a Free Lunch!
Bill Capen of DRS Technologies, the president of the SMTA West Pennsylvania Chapter, speaks with I-Connect007's Patty Goldman about the recent West Penn Expo & Tech Forum. He also talks about the group's upcoming chapter meetings this year, and the latest developments happening in the military segment.
San Diego IPC Designers Council Meeting Held at Del Mar Show
The Del Mar Electronics and Manufacturing Show is a long-time favorite among PCB professionals. What better place to hold a meeting of the San Diego Chapter of the IPC Designers Council? Each year, the San Diego Chapter of the Designers Council hosts their largest meeting of the year at the Del Mar show. This year, approximately 50 PCB designers and electronics professionals attended the lunch-and-learn meeting.
IMPACT 2017: Electronics Industry Leaders Meet with Members of Congress and Trump Administration on Capitol Hill
IPC places a high priority on making our presence known in the halls of government to educate our government officials on the policies that will strengthen the advanced manufacturing industry.
The Challenge of Filling PCB Assembly Positions
U.S. manufacturers are having a difficult time filling open positions. They cannot find workers with the necessary skills to fill the openings. If we look specifically at the PCB assembly industry, the rhetoric is similar. There are more openings than people to fill them. The discussions reveal that lower wages, lack of skills, and sometimes the reported low unemployment rate in the United States is part of the problem.
IMPACT Washington 2017 Just Around the Corner
IPC's Government Relations team has worked around-the-clock to ensure that IMPACT Washington D.C. 2017 is the best yet. During this two-and-a-half day event, executives from IPC-member companies will have the opportunity to speak with leaders in Congress and the Administration in support of our common priorities.
The Building Blocks of Industry 4.0
At the recent IPC APEX EXPO, Kevin Decker-Weiss, director of sales at CircuitByte, joins panellist from Mentor Graphics and EMS firm Saline Lectronics in a roundtable on the building blocks of Industry 4.0 hosted by Scoop. Here is his take on that panel and the show.
Capitol Connection: IMPACT Update—To CEOs on Why You Should Attend IMPACT Washington, D.C. 2017
Here at IPC, we place a high priority on making our presence known in the halls of government, because so many policy debates have a direct effect on the electronics manufacturing industry. IMPACT Washington, D.C. 2017 is a chance to join with fellow industry executives in advocating for better public policies for a stronger, more advanced manufacturing economy.
RTW IPC APEX EXPO: Sanjay Huprikar Lays Out Plans to Grow IPC Membership
Sanjay Huprikar, IPCs vice president of member success, discusses IPCs plans to expand membership around the world.
Weiner’s World – March 2017
The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.
Successful, Long-Term Growth at Prime Technological Services
Publisher Barry Matties sat down with Prime Technological Services CEO Greg Chesnutt at IPC APEX EXPO, to glean how they continue to find success and have been able to maintain such an impressive growth rate over the last four years.
Mike Carano on the First PCB Executive Forum Held at IPC APEX EXPO 2017
When John Mitchell came on board as president of IPC, he decided to tap the members of the Raymond E. Pritchard Hall of Fame for suggestions and advice. So he established the IPC Ambassador Council and tasked them to create special programs for IPC conferences. It is this group of people who put together the recent PCB Executive Forum that was presented at IPC APEX EXPO 2017.
Ray Pritchard Looks Back at IPC’s Beginning and His Role in Getting it Started
I have known Ray Pritchard for a long time—as long as I’ve been involved with IPC, in fact. He directed the organization for 35 years before turning over the reins. One could say he grew up with the organization—or vice versa. Ray was always a bundle of energy and still is, still joking and warm, a great people person, and I am sure he had a little something to do with the spirit of camaraderie and cooperation that is the hallmark of the IPC we know today.
RTW IPC APEX EXPO: Ray Prasad Discusses Revised IPC-7530 Reflow Profile Guidelines
IPC Hall of Famer Ray Prasad, chairman of the IPC-7530 committee, provides an overview of the newly revised IPC-7530, which provides users with guidelines on how to successfully profile and characterize PCB assemblies with high levels of efficiency.
A New Power Design Methodology for PCB Designs
Advanced PCB design is an iterative process of analysis-fix-analysis. Historically, this process is very time-consuming, requiring analysis experts and PCB designers to work together to find and fix layout problems. This article describes a new PCB design methodology that allows a PCB designer to perform the power design without having to run expert-level analysis tools. This methodology provides the setup automation for advanced analysis without the need to understand every minute parameter, and can be completed in a few steps.
RTW IPC APEX EXPO: IPC Validation Services Update
Randy Cherry, IPC's Director of Validations Services speaks with Guest Editor Judy Warner. Randy gives an update on the QML and QPL programs, including updates on the newest QPL program for copper clad laminates. They also discuss the growing value of industry engagement with VS as the number of certified facilities increases.
Time-Lapse Video: The IPC APEX EXPO 2017 Show in Under Seven Minutes!
During IPC APEX EXPO 2017, we at I-Connect007 had our time-lapse camera running from setup to closing. The camera was positioned high in our studio, where we conducted our RealTimewith…IPC APEX EXPO video interviews, aimed down the main aisle.
Real Time with...IPC: IPC Market Research Update
Sharon Starr updated everyone on the Market Research services, industry forecasting and research projects her group publishes. She also mentioned a "call to action" for a meeting tomorrow with IPC members, seeking input on needed metrics for their new Pulse of the Industry program she will be rolling out this year, which will be a "Industry Health Scorecard".
Real Time with...IPC: Alpha Discusses Improving LED Reliability Issues
At this week's IPC APEX EXPO 2017 in San Diego, California, Steve Godber, LED Commercial Manager at Alpha Assembly Solutions, discusses with I-Connect007's Stephen Las Marias the reliability and voiding challenges in the LED market, and how the company is helping their customers address these issues through their solder technologies.
Real Time with...IPC 2017 Videos Now Available for Viewing
Over 70 video interviews from the IPC APEX EXPO 2017 show in San Diego, CA are now available for viewing. See the opening ceremony, hear from suppliers and others on their new products, learn more about the HDP Users Group. Don't miss the videos by IPC President John Mitchell and his staff.
Applying the New IPC Standard for Traceability Makes Compliance and Reporting Easier
IPC has created IPC-1782, a new standard and specification for traceability practices across all levels of electronics manufacturing, and specifically for electronics assembly. With this new standard, companies that are practicing basic levels of traceability can evolve to higher levels, and will be able to clearly define the expectations of what is required for compliance and conformance to customer needs.
Evaluation of the Use of ENEPIG in Small Solder Joints
When soldering to ENEPIG, all of the palladium is dissolved into the solder joint, and creates a palladium-rich region at the base of the solder joint. The shrinking solder joint sizes due to the ever decreasing size of parts cause the relative size of this palladium-rich microstructure to grow relative to the overall joint thickness. This study evaluates the impact of industry standard Pd thicknesses on thin solder joints through shear testing.
More Than Just Dry Air: Controlling Oxidation and Intermetallics in Moisture-Sensitive Devices
Our new columnist Richard Heimsch will be focusing on the management of moisture sensitivity in his column “More Than Just Dry Air.” His inaugural article talks about controlling oxidation and intermetallics in moisture-sensitive devices.
CES 2017: Disruptive Technologies
Those of you that have read my previous columns covering CES 2017 know that at recent CES shows I have seen many drones, autonomous cars, IoT devices, robots, and many other items ranging from robots who stand in for your doctor to smart trash cans who tell you via Alexa, Google, or soon, Cortana on your own computer, that since you have thrown away two empty milk cartons in the last few days it may be time to order more milk; just say yes and consider it ordered.
On Location at HKPCA: IPC’s Mitchell and Carmichael on Asia, the Global Industry Outlook, and Trump
While in Shenzhen, China recently, with the PCB industry’s biggest trade show as a backdrop, Publisher Barry Matties sat down once again to interview IPC President John Mitchell and IPC Asia President Phil Carmichael. This time they discussed trends they’re seeing in the Asia-Pacific region and what a Trump presidency means to the industry.
Real Time With...HKPCA & IPC Show 2016: IPC Hand Soldering World Championship in China
IPC President John Mitchell speaks with Editor Stephen Las Marias about the highlights of this year’s IPC Hand Soldering World Championship, which was held in China for the first time. He discusses how IPC has managed to keep the event so popular and successful for such a long time.
LA/Orange County SMTA Tech Expo a Success
On November 3, I had the pleasure of attending the LA/OC SMTA Tech Expo in Long Beach, California, and meet with chapter President Kathy Palumbo and Vice President Scott Penin, to learn more about this annual event and the chapter’s ongoing activities.
Real Time with...HKPCA & IPC Show 2016 Slideshow - Day 2
The 2016 IPC Hand Soldering World Championship was held concurrently for the first time at the International Printed Circuit & APEX South China Fair (HKPCA and IPC Show 2016) in Shenzhen, China. View the slideshow here.
Tin Whisker Mitigation Methodologies Report from SMART Group, Part 2
Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In the second part of this two-part article series, Editor Pete Starkey concludes his review of the SMART Group's recent seminar, which is focused on tin whisker mitigation methodologies and strategies.
HKPCA & IPC Bring Hand-Soldering Competition World Championships to China
Helen Guo, member services director at IPC Greater China, discusses with I-Connect007's Edy Yu IPC’s activities and initiatives in China. She also discusses the upcoming International Printed Circuit and APEX South China Fair 2016, which will feature the hand-soldering competition world championship for the first time in China.
KIC Shows Solutions to Voiding Problems via Optimized Reflow Profiling
At the recent SMTAI event, MB (Marybeth) Allen of KIC speaks with I-Connect007's Patty Goldman about her company, and discusses some of the details of her presentation titled "Optimized Reflow Profiling to Minimize Voiding".
Increasing Reliability through Predictive Analysis
At SMTA International 2016, Joe Russeau of Precision Analytical Laboratory discusses with I-Connect007's Patty Goldman the paper he was presented, which was co-authored by Mark Northrup and Tim Estes. The paper presents early data comparing the results of two different analytical test methods to determine how well they correlate with each other as predictors of PC board cleanliness and reliability.
Mentor Graphics’ PADS Platform Bridges Design and Manufacturing
At PCB West, Barry Matties spoke with Paul Musto about Mentor’s PADS environment and their introduction of scalable software tools to help design better boards, from the enterprise level down to the entry level and hobbyists. They also discussed the evolution of the design process infrastructure in North America vs. Asia, and what design engineers should focus on to increase their value.
One World, One Industry: Voting—A Civic Duty and Industry Opportunity
On Tuesday, November 8, more than 240 million people in the United States will have the opportunity to go to the polls and vote, make their voices heard in government, and influence the direction of public policy for years to come. Much of the world is closely watching with interest in this major U.S. election.
Real Time with... SMTAI: Gary Tanel on His Founder's Award, SMTA Benefits
Gary Tanel, vice president of business development at McDonald Technologies and president of the SMTA Dallas Chapter, speaks with I-Connect007’s Andy Shaughnessy about his SMTA Founder's Award—the highest honor given by SMTA.
Real Time with... SMTAI: KYZEN Pushes Cleaning Data to the Cloud
At the recent SMTA International exhibition, Tom Forsythe, executive vice president of Kyzen, discusses with I-Connect007’s Andy Shaughnessy their latest system that helps customers have a better handle on their cleaning process.
Saline Lectronics Invests in the Millennial Generation
You're heard all the knocks against millennials: they're flaky job-hoppers and they're tough to motivate. But Saline Lectronics has a larger presence of these younger employees, and they find quite a few advantages to hiring staff who are far from retirement age. Saline's Jason Sciberra explains how he manages and motivates these young people.
Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow – Results of an Industry Round-Robin
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. This article details a round robin study that has been performed by IPC Task group 8-81f, to guide high-reliability end-users on the applicability and limitations of this mitigation strategy.
IPC Certification Program's 'Space Hardware Addendums' Training and Certification
In this article, Sharon Montana-Beard of Blackfox discusses the IPC Certification Program's Space Hardware Addendums training and certification, the topics covered in the training course, and the benefits of the program.
Transline Technology is Bullish on Design Engineers
At the International Microwave Symposium, I met with Chris Savalia, vice president and co-owner of Transline Technology. We discussed the California-based fabricator’s philosophy, the challenges of the RF and microwave markets, and the need to engage with young design engineers now.
Happy’s Essential Skills: Computer-Aided-Manufacturing, Part 1—Automation Protocols
I have addressed automation planning previously in this series, so I hope by now you realize the difference between ‘automation’ and ‘mechanization.’ In printed circuit fabrication and assembly, most of what is advertised is mechanization. But when you get to assembly test, then you begin to see true automated solutions.
Silicon Valley SMTA Chapter President Kevin McClay on Evolution and Current Status of SMTA
Kevin McClay, president of Silicon Valley SMTA Chapter, speaks with I-Connect007’s Judy Warner on the activities of the SMTA in the Valley, and the challenge of attracting young talent to join the manufacturing engineering industry.
SMTA Reaching Out to Locals and Students
Tanya Martin, executive director of the SMTA, speaks with I-Connect007's Patty Goldman at the recent SMTA-Ohio expo about local one-day expos that are spread across the country throughout the year, and the increasing interest in student chapters on campuses.
Sensible Design: When Coatings Go Wrong
This month, I consider some of the more common, and often very frustrating, problems that may be encountered when coating electronic circuit boards and components. I also discuss some practical solutions. As we all know, nothing in life is straightforward.
Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
This study will compare the results from testing two solder pastes using the IPC-J-STD-004B IPC TM-650 126.96.36.199 surface insulation resistance test and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
ITRI’s Wang Talks Future of Soldering and Paste Printing
In an interview with SMT Magazine, Wang Chao, technology manager at UK-based ITRI Ltd, discusses the biggest challenges in solder paste printing, how the solder paste material impacts the process, and the future for soldering and paste printing.
Conversations with STI Electronics' Dave Raby at IPC IMPACT Washington, D.C.
Dave Raby, president and CEO of EMS firm STI Electronics and an eager participant at this year’s IMPACT Washington, D.C. event, speaks with I-Connect007’s Patty Goldman about his expectations at this year’s conference.
Zentech’s Matt Turpin on IMPACT Washington, D.C.’s Benefits
At the recent IMPACT Washington, D.C. 2016 event in Capitol Hill, Matt Turpin, CEO of EMS firm Zentech discusses with I-Connect007's Patty Goldman his expectations on the event, its importance, and how, so far, it has helped the electronics manufacturing industry in the United States.
IPC President John Mitchell Discusses IPC's Footprint in China
At the Capital Club in Beijing, IPC’s president John Mitchell met with I-Connect007’s Edy Yu to discuss the current activites of IPC China. Some of the topics covered included the growing China membership, training, trade shows and IPC China’s standards development effort.
EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry
Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.
EDA Tools: Automation vs. Control
Stephen V. Chavez, CID+, is currently the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS). He's also a frequent speaker at the IPC APEX EXPO Design Forum. I caught up with Stephen and asked for his thoughts on the EDA tools of today, and whether he’d prefer to have more control vs. more automation.
Bright Future/Bright Plan: Photostencil
Photostencil is looking at a multitude of new developments right now, not least of which is the opening of a “new from the ground up” factory that will allow them to address their customer’s greatest needs, including the growing challenge of miniaturization. Photostencil’s VP of Global Sales, Rachel Short, talks to Guest Editor Kelly Dack about the new factory, the positive outlook the company’s customers are exhibiting for 2015 and 2016, and customer reports of projected growth of 3–7%. Short also discusses the new nickel-cobalt electroform stencil, which is more durable and helps alleviate stretch.
Ventec's Commitment to FOD Elimination Sets the Trend
The European Space agency has led the drive for ultra-clean laminates and pre-pregs, completely free from foreign object debris. Ventec were one of the first to respond to ESA’s call for the laminate industry to support Appendix A to IPC-4101D, which the committee has agreed will be adopted. Mark Goodwin fills in the background.
What’s in a Name? ICAPE Group’s Glenn Colescott Explains
Glenn Colescott, director of ICAPE USA, speaks with I-Connect007's Patty Goldman about his company, their expansion plans, why they attend regional shows like the SMTA West Penn Chapter Expo & Tech Forum, and how they make customers get over the phobia over a trading company.
Soldering Experts on Hand at SMTA’s West Penn Chapter Expo & Tech Forum
At the recent SMTA West Penn Chapter Expo & Tech Forum, Marilyn Lawrence, founder and president of Conformance Technologies Inc., speaks with I-Connect007's Patty Goldman about the importance of solder training, and how far it has come through the years.
IMPACT Washington, D.C. 2016: Industry Leaders Advocate for a Pro-Manufacturing Policy Agenda
IPC places a high priority on educating government officials about key policy issues of importance to the electronics industry. That’s why top executives from leading electronics companies gathered in Washington, D.C. recently for “IMPACT Washington, D.C. 2016.”
3D printing, China’s SMT equipment and robotics markets, IPC’s mandate, counterfeiters, and Taiwan PCB makers’ shift to automotive electronics—Gene Weiner talks about these things and more in this new article.
Selective Soldering: Design, Process Challenges and Practical Solutions
A SMART Group workshop at the Bromsgrove, UK, premises of equipment and process materials distributor APP Electronics, set out to provide the answers, with a programme combining technical presentations, live demonstrations and hands-on sessions, introduced and moderated by Nigel Burtt, senior electronics manufacturing engineer at Renishaw and SMART Technical Committee Chairman.
IPC APEX EXPO: Zentech's Matt Turpin Talks Strategies for Success in CM Industry
Zentech's Matt Turpin, named as one the electronics industry's Rising Stars by the IPC, speaks with I-Connect007 guest editor Dan Beaulieu on how to become successful in the electronics contract manufacturing space.
IPC APEX EXPO: IPC Government Relations—Your Advocate in Washington
IPC's VP of Government Relations, John Hasselman, explains IPC's "meet the policy makers" initiative (site visits by congressmen) to help build and broaden relationships with these decision makers.
IPC President John Mitchell on the Past, Present, and Future, Pt. 2
In Part 2 of our on-the-show-floor interview with John Mitchell, conducted at IPC APEX EXPO 2016, John continues describing IPC’s key measures, and then invites industry folks who are reading this to participate in a unique challenge—some might say experiment. The question is, will there be any takers?
IPC APEX EXPO: EPTAC Updates on Soldering Committee Developments
Leo Lambert, vice president and technical director at EPTAC Corp., provides I-Connect007 guest editor Joe Fjelstad an update on some of the standard developments at IPC's soldering and assembly committee.
IPC President John Mitchell on the Past, Present, and Future, Part 1
We conducted this interview with IPC President John Mitchell on the show floor at IPC APEX EXPO to discuss the event, the changes on the IPC board, and the key metrics that IPC uses to measure their own performance and effectiveness. John also invites the industry to a unique challenge.
Walt Custer Elaborates on his Annual IPC APEX EXPO Forecast Presentation
IPC APEX EXPO 2016 has come and gone, and this year, Walt Custer’s annual presentation forecasting the upcoming year for the industry was much anticipated, as always. I met up with Walt at the show to learn about his presentation and dig deeper into his findings.
IPC APEX EXPO: Electrolube to Educate PCB Designers on Coatings
Phil Kinner, technical director of coatings for Electrolube, discusses a paper on condensation testing that he presented at IPC APEX EXPO, and his plans to educate PCB designers about conformal coatings to help them avoid problems during manufacturing.
IPC APEX EXPO: Technica USA and ASM Americas Highlight Expanded Partnership
In this interview with I-Connect007’s Andy Shaughnessy, Jeff Timms, Managing Director, ASM Assembly Systems Americas, and Frank Medina, president of Technica, discuss their expanded cooperation.
IPC APEX EXPO: IPC's Fern Abrams Provides Updates on RoHS, REACH Directives
Fern Abrams, director of regulatory affairs and government relations at IPC, discusses with I-Connect007's Stephen Las Marias the latest updates on the changes happening in the RoHS and REACH directives this year, as well as IPC's new initiatives and advocacies.
IPC APEX EXPO: AIM's O'Neill Highlights M8 Solder Paste
Timothy O'Neill, technical marketing manager at AIM Solder, updates I-Connect007 Guest Editor Mark Thompson about the company's M8 solder paste, which they launched at last year's APEX. O'Neill discusses how the product improves print quality and reduces voiding on bottom-terminated devices.
Product Compliance Requires Supply Chain Transparency
Changes to the RoHS, REACH, and conflict minerals regulations make the need for supply chain transparency more crucial than ever. In line with this, full material declaration (FMD) is quickly becoming the "gold standard" data requirement for an OEM to accurately assess the risk of restricted materials in a product.
Manufacturing Institutes Can Boost the Nation
In his most recent State of the Union address, President Obama highlighted a remarkable trend of recent years: the turnaround in many corners of America’s manufacturing sector. Nearly 900,000 new jobs have been created by U.S. manufacturers in the last six years.
New Year, New Outlook for the Electronics Manufacturing Industry
As an advocate for the electronics manufacturing industry, my job is to educate and encourage policymakers to create a favorable legislative and regulatory environment for advanced manufacturing to grow and succeed. From that perspective, I think we should be proud of the significant progress we made in several areas in 2015.
Doug Pauls Explains Ion Chromatography
Doug Pauls, principal materials and process engineer at Rockwell Collins and chair of the IPC Cleaning and Coating Committee, drew upon his 25 years' experience in the use of ion chromatography for electronics assembly improvement to discuss ROSE techniques, how ion chromatography can be used to determine electronic cleanliness, what specifications exist and how they were derived, and how ion chromatography can be used for process troubleshooting and optimization.
Mr. Laminate Tells All: Who Would Like a Mil-Spec Audit?
I remember when IPC-4101 was completed and released in December 1997 and the question came up “should IPC create a policeman program to enforce it?” To a person that helped create IPC-4101, absolutely no one wanted such an audit program ever again. Including me and the IPC staff liaisons. Maybe we should have rethought that position.
OEM Applications: MacDermid’s OEM Director Embraces Renewed Focus
Lenora Toscano, OEM director for MacDermid’s electronics solutions division, discusses the needs of the end-user market of PCBs, her own role at the company, which involves much interaction with OEMs, and the benefits that both she and MacDermid bring to SMTA and IPC meetings.
2015's Most Read SMT Interviews
For 2015, we have interviewed a lot of industry experts and technologists to get their insights on the SMT, PCB assembly and EMS industries. In these interviews, they've talked about the latest developments happening in the industry—from a technology, manufacturing process, or business standpoints. Before we close this year, here's a look at the top 10 most-read interviews on SMT007.
VDMA Productronics: Pushing Forward the German Electronics Manufacturing Industry
VDMA Electronics, Micro and Nano Technologies is one of the 40 Sector Associations within VDMA. Its sector group Productronics covers the whole semiconductor front and backend processes, packaging, all the way to PCB manufacturing and assembly. Dr. Eric Maiser, managing director of Productronics, discusses the group, its activities, member services, and the electronics manufacturing industry.
A Closer Look at SMTA
Tanya Martin, director of operations at SMTA, responded to our I-Connect007 questionnaire recently, which focused on the association’s mission, membership statistics, and how SMTA best serves its members. She also talks about how SMTA satisfies its members' need for technical information, and some of SMTA's success stories in the industry.
iNEMI: Leading the Way to Successful Electronics Manufacturing
iNEMI CEO Bill Bader talks about the consortium’s goals and mission, its collaborative projects, as well as its roadmap for the electronics manufacturing industry. Bader also highlights iNEMI’s milestones in line with the major trends that have happened in the electronics industry, including the transition to lead-free, addressing tin whisker growth, and the move towards HFR-free PCB materials.
IPC: Connecting Electronics Industries
John Mitchell, president and CEO of IPC—Association Connecting Electronics Industries, provides the basic overview of the association—its goals and basic mission, activities, and how it best serves its membership. He also provides a snapshot of how IPC promotes technology development in the industry through standardization.
The Associations Issue
Well, it’s the end of the year. How did that happen? It really is true that every year goes by a little faster. You young whippersnappers out there won’t know what I’m talking about, but just you wait and see. We changed it up for our December issues this year. Instead of doing a year-end review, we decided to devote this month to our associations and trade organizations—at least some, because when you start poking around, you will find there are scads of them.
SMART Group: The Guiding Influence in the Electronics Industry
Founded in 1984, the SMART Group promotes advanced manufacturing technologies and helps companies cope with the challenges of surface mount technology. In an interview with I-Connect007, Keith Bryant, chairman of SMART Group, discusses the association, its activities, and how it is supporting the electronics manufacturing and SMT industries.
SMTA: Working Hard for the Global Industry
SMTA President Bill Barthel, who is currently serving his second term to this elected position, and who also happens to be the quality solutions manager at Plexus, discusses with I-Connect007's Patty Goldman the role of SMTA, its conference's offerings, the pending departure of longtime SMTA Executive Administrator JoAnn Stromberg, and various opportunities for members of the association.
Navigating the Global Materials Supply Chain: A Roundtable Discussion
At SMTAI recently, I-Connect007's Andy Shaughnessy sat down for a roundtable discussion with some key players from the materials side of the supply chain. Participants included two executives from Ventec: Mark Goodwin, COO USA and Europe for Ventec International Group; and Jack Pattie, president of Ventec USA. Also participating in the roundtable were Schoeller Electronics CEO Michael Keuthen and Bob Willis, from the National Physics Laboratory (NPL).
Making Connections with Associations
To provide our readers more information about their associations, this month's issue of SMT Magazine features articles and interviews with SMTA, IPC, iNEMI, SMART Group, and VDMA Productronics, to help understand more their activities, goals, and missions, and how they are helping push forward the electronics manufacturing industry.
Surface Mount Technology Association—a New Milestone
With a grand mission, SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. The organization delivers the right information at the right time to empower the workforce, who collectively advances technology, innovates new products, and serves the global industry.
ELCOSINT - The Future of High Temperature Interconnect
The increasing need for electronic assemblies to endure high-temperature operating conditions in aerospace, automotive, oil and gas drilling, power management and renewable energy applications, whether those conditions involve high ambient temperatures, high cycle temperatures or high junction temperatures, is driving the development of high temperature interconnection technologies.
IPC-A-610: What's New With Rev F?
Why are new revisions created anyway? Can’t IPC just issue updates to the existing revision? Who defines what the changes are going to be and who approves of those changes? Why can’t they make changes for all the new technologies available? And the best question of all: Why does my product have some conditions that are not covered in the documents and specifications? Leo Lambert explains.
EIPC Summer Conference: Day 2
Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.
New Embedded Component Standard Finalized
Solberg Technical Consulting's Vern Solberg talks to I-Connect007 about the recently launched standard, the IPC-7092, which focuses on embedded component technology. According to Solberg, this new standard took the earlier standards involved with passive devices, and combined it with standards on newer technologies using active devices, to help form components that can be manufactured and placed on layers within the PCB.
iNEMI Managing Director: New, Disruptive Technology on the Horizon
Dr. Haley Fu, managing director of Asia Pacific for iNEMI, and Publisher Barry Matties spoke recently. Fu gave her overview of the last eight years with iNEMI along with her opinion of what the most significant changes have been, globally and for the Asia market in particular. She predicts that in the future, the PCB will probably adopt optical architectures instead of copper, because using copper for the trace means that the land space and the property will not satisfy the future high-speed data transport rate.
IPC Plating Sub-committee 4-14: Surface Finish Specifications
IPC specifications are reference documents to be called out by designers and OEMs. Designers may take exception with one or more items in the specification to ensure that the product meets the requirements of its intended use. The acronym AAUBUS (as agreed upon between user and supplier) is part of any specification. Specifications are consensus documents. They are agreed upon by a panel of interested industry participants composed of suppliers, manufacturers, assembly houses (CMs) and end-users. The IPC Plating Sub-committee 4-14 is no exception.
A Look at Saki’s Approach to 2D, 3D and X-ray Technology
At NEPCON 2015, I-Connect007 Publisher Barry Matties sat down with Nori Koike, COO of Saki Japan, to discuss the latest demands for 3D and their approach to inspection. With more than 20 years of experience, they have built a line-up of tools that covers the inspection spectrum. Koike also stresses the importance of using inspection data as a tool to improve and automate the process.
IMPACT 2015: An In-Depth Look
IPC understands that presenting a unified voice for the electronics industry is essential for advancing policies that affect the industry’s long-term future and strengthens the U.S. and global economy. That is why 22 IPC member-company executives descended on the nation’s capital for IMPACT 2015: IPC on Capitol Hill, IPC’s annual advocacy event.
Material Witness: How About that Technical Roadmap!
You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.
IPC Validation Services 2014
Guest Editor Judy Warner talks with IPC's Director of Validation Services, Randy Cherry. Randy has been busy since launching IPC's Validation Services a year ago, with 16 QML audits completed and rapidly growing interest shown at this year's show. Randy also discusses future plans for auditing to IPC intellectual property standards 1071A and 1072, as well as to PCB standard 6012.
A Conversation (and Day) with Joe Fjelstad, Part 5
Our five-part interview series with Verdant Electronics Founder Joe Fjelstad wraps up with a look back at the point when Fjelstad’s career began focusing on circuit board technology, and he details his patented Occam process, and why this game-changing, disruptive technology has yet to become standard practice in the industry. Also explained: Why Fjelstad has been referred to as an “iconoclastic polemicist,” and how a Native American story he heard long ago has resonated throughout his career and life.
Zentech: Expanding EMS Solutions and Supporting Innovation
Zentech CEO and President Matt Turpin sat down with I-Connect007 Publisher Barry Matties recently for a wide-ranging discussion of the state of both domestic and global manufacturing, and Zentech’s recent acquisition that will significantly expand the company’s capabilities. They also focused on supply chain issues, automation, regulations, and the importance of STEM education in the U.S.
Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”
I-Connect007 Publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry, and Vaughan detailed Zentech’s involvement with National Manufacturing Day, a nationwide effort focused on STEM (Science, Technology, Engineering and Math) that simultaneously brought high school students together with 1,600 manufacturing companies from around the U.S.
Benefits of Soldering with Vacuum Profiles
Requirements for void-free solder joints are continuously increasing in the field of electronics manufacturing, bringing new challenges that are evolving on a daily basis due to the relentless introduction of new variants of so-called bottom-terminated components (BTCs). Connector geometries alone are not decisive—numerous pitfalls are of greater significance.
Bernie Kessler: Pioneering Spirit Then and Now
I-Connect007’s Patty Goldman sat down with longtime friend and IPC Hall of Famer Bernie Kessler at IPC APEX EXPO 2015 in San Diego. Among other things, the two discussed the early days of IPC, and the beginnings of APEX EXPO.
Raising a Unified Voice for an Advanced Manufacturing Economy
The electronics manufacturing industry is an important sector in the global economy, and John Hasselmann, VP of Government Relations at IPC, is an advocate for policies that will help our industry as well as the prosperity and welfare of billions of people.
Hunter Technology on Design Operations and Business Strategies
Immediately following IPC APEX EXPO 2015, Guest Editor Kelly Dack paid a visit to Hunter Technology’s facility in Milpitas, California, where he interviewed Ian Grover, vice president of design engineering, and Chris Alessio, vice president of sales and programs. Discussed are Hunter’s design operations as well as the company’s overall business strategy.
Trending at Freedom CAD: New Crop of Next‐Gen Designers
Scott McCurdy, director of sales and marketing at Freedom CAD Services, expresses his vision for what North America is bringing to the table in the world of circuit design. I‐Connect007 Publisher Barry Matties and McCurdy also discuss China, trends in product design, tools, and more.
Japan’s Thermosetting Plastics Association Represents at IPC APEX EXPO 2015
At the International Reception, held opening night of IPC APEX EXPO 2015, I-Connect Technical Editor Pete Starkey made the rounds and found some visitors from Japan, namely, Kazutaka Masaoka, from Thermosetting Plastics Association (JTPIA). In this brief interview conducted amongst the reception attendees, Masaoka-san and Starkey discuss Japanese vs. North American circuit board quality and business trends.
Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts
At IPC APEX EXPO 2015, I-Connect007 Technical Editor Pete Starkey caught up with EIPC's Michael Weinhold and Alun Morgan, who were happy to discuss both recent and ongoing focuses for EIPC, namely, reliability. Also touched on was the importance of the alignment of global standardization processes, especially for Asia.
Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans
I-Connect007 Publisher Barry Matties caught up with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox's expansion plans for North America (Tempe, Arizona and Guadalajara, Mexico) and Malaysia (Penang). Dill also describes the highly successful veteran’s training program, which is being spearheaded at the Blackfox headquarters in Longmont, Colorado.
Bob Neves Receives Award, Talks Bergman Tribute
I-Connect007 Publisher Barry Matties sat down with Bob Neves, one of the first recipients of the Dieter Bergman Fellowship award, to talk about the tribute held for Dieter on Wednesday night of IPC APEX EXPO 2015, and some of the reasons behind the newly created award.
EPTAC Expansion Includes CID Curriculum
Leo Lambert, vice president and technical director of EPTAC, discusses EPTAC's latest expansion, which includes IPC's certified interconnect designer (CID) curriculum.
Proposed EU Legislation Receives Industry Support
Given the wide variety of opinions and proposed amendments on the conflict minerals legislation, it is hard to predict what will be included in the final legislation or when it will be passed into law. IPC will continue to stay involved, advocate for our members and keep you informed.
SMTA: Call for Papers for 2015 Events
SMTA announces abstracts are now being accepted for several events taking place in 2015. All submissions must be non-commercial in nature and focus on technology research rather than a company product.
BEST, Inc.: Branching Out to Bare Board Rework
Bob Wetterman, president of BEST, Inc., joins Guest Editor Mark Thompson to discuss the company's move into reworking unpopulated boards, building products that facilitate faster rework and repair, and IPC certification and training.
APEX NEWS 2007
On the show floor at IPC Printed Circuits Expo/APEX/Designers Summit, the more than 400 exhibitors provided product information, process knowledge, and interactive tools to a constant flow of attendees.
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