SMT :: Science

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High-reliability, Low-temperature Solder Alloys

Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

EPTAC Preparing Young People for Future in Industry

In this video interview from the show, Guest Editor Kelly Dack and Leo Lambert, VP/technical director of EPTAC Corporation, describe the impact of internships and apprenticeships, the importance of IPC specifications, the effectiveness of certification.

Watch & Learn! Latest Installment of I-007e Micro Webinar Series Features EV Charging Controller Case Study

The eleventh episode of the popular micro webinar series “Coatings Uncoated!” is now available to view. In “Cycle Time Constrains Coverage,” topic expert Phil Kinner from Electrolube examines the trade-off between cycle time and coverage required while considering an electric vehicle charging controller case study. If you are in the assembly business, an EMS company, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.

Trends From the Show: Solder and Software

In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.

I-007e Micro Webinar: Primary Flight Control Case Study on Condensation and Coverage

The seventh episode of the popular webinar series “Coatings Uncoated!” is now available to view. Author of "The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments" and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.

I-007e Micro Webinars Releases Part 3 in ‘Coatings Uncoated!’ Series

Have you ever wondered about the process of corrosion and the formation of tin whiskers? The third episode of the popular webinar series, "Coatings Uncoated," is now available to view. Author of "The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments" and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation.

The IPC Education Foundation’s New Column

The IPC Education Foundation’s new column with I-Connect007 will feature Charlene Gunter du Plessis, Aaron Birney, and Corey Lynn. These IPC Education Foundation members will share updates on programs and activities here. Find out more about the authors below and read "Foundations of the Future" in the SMT007 Week Newsletter.

Is Captive Making a Comeback?

Andy Shaughnessy recently spoke with Altium’s Steve Chalgren, senior VP of business strategy and planning. Steve shared his thoughts about why improved manufacturing and automated EMS equipment, such as robotics, might lead smaller OEMs to become captive shops like the old days. Is captive making a comeback?

A Walking Tour of Mycronic Equipment at productronica 2019

I-Connect007 pays a visit to the Mycronic booth at productronica 2019 in Munich, and Jeff Leal, product manager for Mysmart, takes us on a walking tour of just one of the lines on display at the show. Jeff takes us through a series of dispensing and conformal coating machines.

The Future of the World Is Truly in the Hands of Our Youth

At I-Connect007, we are proud to once again sponsor the STEM Outreach Program at the upcoming IPC APEX EXPO 2020. Another way we support our youth is by sharing the stories of young people who are doing amazing things. Dylan Nguyen is a great student, musician, and creative thinker. Recently, he shared with me the details of his school science fair project, “Kite: Powering the Future,” which solved a problem that he faced. Dylan is a leader with a bright future, and the world is lucky to have kids like him.


André Bodegom on European Challenges, Automation, and Automotive

Editor Pete Starkey speaks with André Bodegom, managing director for Adeon Technologies in the Netherlands, about changes he has seen over the years in major industry sectors, challenges in the European market, and other areas of growth.

Oren Manor on the Siemens-Mentor Integration

In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Oren Manor, director of business development for Siemens, in the Siemens booth. Oren introduces us to the in-booth production equipment that integrates factory automation, motion controls, and MES solutions. He points out that the recent effort to automate SMT lines is now expanding into the areas of final assembly, box build, and manual assembly as well.

Meet Alfred Macha, SMT007 Columnist

Meet Alfred Macha, one of our SMT007 columnists! Macha’s columns concentrate on process validation, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more. Alfred Macha brings 20 years of senior leadership roles in quality and operations management working for Sanmina, DDi (now TTM Technologies), Anaren (now TTM Technologies), and HEI Microelectronics.

Mentor and Seica Partner for Data Prep and Testing Big Boards

Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

High School Team's Robotics Entry on Spotlight at Wisconsin Expo & Tech Forum

In May, I took the opportunity to drive around Lake Michigan and visit the SMTA Milwaukee Chapter’s Wisconsin Expo & Tech Forum. Held at the Crowne Plaza Milwaukee Airport Hotel, this was a well-organized and attended table-top expo and technical forum, with over 60 exhibitors, and a high school team with their FIRST Robotics entry.

A Preview of the 2016 International Microwave Symposium

The 2016 International Microwave Symposium (IMS) is taking place May 22–27 in San Francisco. I-Connect007's Barry Matties spoke with IMS’s Amanda Scacchitti about the upcoming show, the keynote speakers, and how IMS continues to put an emphasis on STEM education with their own STEM program for kids.
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