RTW IPC APEX EXPO 2019: Panasonic Highlights New Products, IPC STEM Student Outreach Program
Sean M. Murray, GM of North American Sales EAG Group for Panasonic, and Nolan Johnson, I-Connect007 Managing Editor, discuss two new product announcements at the show—PanaCIM process tracker software and MPM-WX—and being a sponsor for the IPC STEM Student Outreach Program.
RTW IPC APEX EXPO 2019: KYZEN Intros New Aquanox Aqueous Cleaner
In an interview with I-Connect007 Technical Editor Pete Starkey, KYZEN Executive VP Thomas M. Forsythe introduces the latest member of the Aquanox family of aqueous cleaners and comments on issues of compatibility, rinsability, and consistency of operation.
RTW IPC APEX EXPO 2019: KIC Speaks on Data, Voiding and Traceability
Bjorn Dahle, president of KIC, talks with I-Connect007 Technical Editor Pete Starkey about how the industry has shifted its focus from the machine to data; the issue on voiding and how manufacturers can address this process challenge; and traceability.
RTW IPC APEX EXPO: OK International Soldering Robot Integrates CV Technology
Bryan Gass, vice president at OK International, talks with I-Connect007 Managing Editor Nolan Johnson about their new soldering robot that integrates their Connection Validation (CV) technology. Launched at the IPC APEX EXPO last year, the CV technology provided the company a springboard to have a good start into 2018, and to achieve growth throughout the year.
Day One, Nothing but Fun: The Show Warms Up
The first official day of the IPC APEX EXPO 2019 was full of excitement, activity and business getting done. From the exuberant crowd at the ribbon cutting ceremony, to the closing moments of day number one, the show floor was bustling. Spirits were high from both attendees and exhibitors, sending the signal that optimism and business strength are still the industry mood.
RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.
IPC Conferences Set the Tone for Innovation During IPC APEX EXPO 2019
Monday's docket of sessions at IPC APEX EXPO 2019 presented a wide-ranging array of topics, including the Automotive Executive Forum, the Connected Factory Initiative Workgroup mapping out the future of CFX, the DFX committee celebrating the release of the IPC 2231 Guidelines document, and the Critical Components Traceability Workgroup addressing the creation of a secure supply chain.
SMTAI 2018 Closes on a High Note
SMTA International 2018, which took place in Rosemont, Illinois is now in the history books. This multi-day event, held October 14-18, at the Donald E. Stephens Convention Center, was packed with keynotes, conferences, lively discussions, committee meetings and a two-day exhibition.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
Weiner’s World – March 2017
The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.
RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
Nordson EFD Discusses Dispensing Technologies, Solder Reliability and Innovation
Philippe Mysson, business development manager for solder paste at Nordson EFD, discusses a host of solder-related issues, including reliability, the benefits of solder paste dispensing systems, challenges facing their customers and how Nordson EFD is helping to address those issues, and finally, latest trends driving innovation in solder alloys.
Industry 4.0: Creating a Standard
Mentor Graphics Valor Division's Dan Hoz, general manager, and Ofer Lavi Ben David, product line director, discuss where Industry 4.0 is taking the industry, and the changes it will bring to both large and small companies, customers, and the supply chain, including how Mentor connects different machines on the shop floor to provide universal Industry 4.0 visibility.
Kester Highlights Strategies to Address High-Reliability Issues
Lynnette Colby, global product manager at Kester, discusses the biggest challenge their customers are facing—high reliability—and how using materials other than halogen can help address this issue. She also talks about how a complete solder solution—including the paste, flux and wire—help ensure the reliability of the electronics assembly.
The Key to Understanding Industry 4.0: Show, Don’t Tell!
At the recent productronica event in Germany, Mentor Graphics set up a racecar track in their booth. In an interview with I-Connect007, Michael Ford, senior marketing development manager at Mentor's Valor Division, explains why it's a perfect analogy for understanding Industry 4.0.
Saki Takes 3D Inspection to the Next Level
Eddie Ichiyama, general manager of Saki Europe GmbH and Saki Prague, discusses Saki's new 3D AOI and X-ray inspection equipment, the global inspection marketplace, and the move to reduce or eliminate the human interface. He also talked about their R&D center in the Czech Republic and its activities in the region.
AIM Solder Talks Innovations to Address Assembly, Reliability Issues
David Suraski, executive vice president at AIM Solder's assembly materials division, sat down with us at productronica 2015 to discuss the latest industry trends and customer challenges facing the solder industry, and innovations that are helping customers address their issues. Suraski also talked about reliability issues, and how the company is addressing them.
Electrolube Discusses Conformal Coating Innovations
At productronica 2015, SMT007 editor, Stephen Las Marias, interviewed Phil Kinner, technical director of Electrolube's Coatings Division, about the latest conformal coating challenges being faced by their customers, and how they are addressing these issues. He also talked about the trends driving product innovation strategies at Electrolube, and some of the new solutions they are offering the market.