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- From The Show
We Have the Best Practice for That
08/13/2018 | Stephen Las Marias, I-Connect007
Strategies for Choosing Solder Paste for Successful Electronics Assembly
08/10/2018 | Jason Fullerton, Alpha Assembly Solutions
How Investment in Staff Well-Being Impacts Manufacturing Productivity
08/09/2018 | Sue Poole, JJS Manufacturing
Alpha's Revolutionary Approach to Low-Temp Soldering
08/07/2018 | Patty Goldman, I-Connect007
Factronix on Cleaning, the Market and More
08/06/2018 | Barry Matties, I-Connect007
SMT :: From The Show
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
RTW NEPCON CHINA: Mycronic Meets High-volume Demand with Solder Jet Printing
Mycronic VP for Global Dispensing and Managing Director Clemens Jargon discusses how the flexibility of solder jet printing helps reduce downtime in the line, thus increasing total line speed and enabling it to keep up with high-volume demand.
RTW NEPCON China: Viscom Talks 3D AOI Developments
Guido Bornemann, head of sales for Asia at Viscom, speaks with I-Connect007 Editor Stephen Las Marias about inspection challenges such as false calls and improving first pass yields. He also talks about the latest developments in 3D AOI to address these issues as well as test strategies to achieve zero defects.
Weiner’s World – March 2017
The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.
RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
Super Dry Discusses Tower System Developments
Rich Heimsch, director of the Americas for Super Dry-Totech, sits with I-Connect007's Andy Shaughnessy during the recent IPC APEX EXPO in Las Vegas to discuss the latest product developments at his company, as well as opportunities they are looking at.
K&S and Assembléon: A Perfect Marriage of Technology and Services
Jeroen de Groot and Chan Pin Chong of Kulicke & Soffa talk about the company's acquisition of Assembléon and its benefits to their customers. They also discuss the latest innovations happening at the company's product lines and key trends driving their product development strategies.
Nordson EFD Discusses Dispensing Technologies, Solder Reliability and Innovation
Philippe Mysson, business development manager for solder paste at Nordson EFD, discusses a host of solder-related issues, including reliability, the benefits of solder paste dispensing systems, challenges facing their customers and how Nordson EFD is helping to address those issues, and finally, latest trends driving innovation in solder alloys.
Industry 4.0: Creating a Standard
Mentor Graphics Valor Division's Dan Hoz, general manager, and Ofer Lavi Ben David, product line director, discuss where Industry 4.0 is taking the industry, and the changes it will bring to both large and small companies, customers, and the supply chain, including how Mentor connects different machines on the shop floor to provide universal Industry 4.0 visibility.
Kester Highlights Strategies to Address High-Reliability Issues
Lynnette Colby, global product manager at Kester, discusses the biggest challenge their customers are facing—high reliability—and how using materials other than halogen can help address this issue. She also talks about how a complete solder solution—including the paste, flux and wire—help ensure the reliability of the electronics assembly.
The Key to Understanding Industry 4.0: Show, Don’t Tell!
At the recent productronica event in Germany, Mentor Graphics set up a racecar track in their booth. In an interview with I-Connect007, Michael Ford, senior marketing development manager at Mentor's Valor Division, explains why it's a perfect analogy for understanding Industry 4.0.
Saki Takes 3D Inspection to the Next Level
Eddie Ichiyama, general manager of Saki Europe GmbH and Saki Prague, discusses Saki's new 3D AOI and X-ray inspection equipment, the global inspection marketplace, and the move to reduce or eliminate the human interface. He also talked about their R&D center in the Czech Republic and its activities in the region.
AIM Solder Talks Innovations to Address Assembly, Reliability Issues
David Suraski, executive vice president at AIM Solder's assembly materials division, sat down with us at productronica 2015 to discuss the latest industry trends and customer challenges facing the solder industry, and innovations that are helping customers address their issues. Suraski also talked about reliability issues, and how the company is addressing them.
Electrolube Discusses Conformal Coating Innovations
At productronica 2015, SMT007 editor, Stephen Las Marias, interviewed Phil Kinner, technical director of Electrolube's Coatings Division, about the latest conformal coating challenges being faced by their customers, and how they are addressing these issues. He also talked about the trends driving product innovation strategies at Electrolube, and some of the new solutions they are offering the market.
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