Designing Electronics for Harsh Conditions
We expect a lot from our products, especially our electronic products. Think about it: cellphones, wearables, medical devices—for some reason we think they should still work after being immersed in liquid, left outdoors in freezing temperatures or dropped on concrete from a standing position.
Tips & Tricks: Machine Assist Time
Assist time is the human intervention required to keep a machine producing during normal operation. It does not include errors, maintenance, setup, and prototyping. There are many reasons for a machine to require assistance. PCB loading, stencil wiping, paste addition, feeder replenishment, and PCBA unloading—some require labor, some can be automated, but all will require some amount of time to complete.
Nano Dimension’s 3D Printing: Prototypes at the Push of a Button?
SICK AG is a global manufacturer of sensors and sensor solutions for industrial applications, with headquarters located in Waldkirch, Germany. After a demo of Nano Dimension’s new 3D printing machine at productronica, Barry Matties met with SICK’s Danny Wernet to discuss its pros and cons and get his overall impression of the technology. Are 3D prototypes really as simple as feeding in a Gerber file and pushing a button?
Indium's Karthik Vijay Talks Engineering for Automotive Applications
Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.
Creating a Healthy Work Environment
In an interview with SMT007 Magazine, Wolfgang Koehler, CEO of the North America branch of ULT, discusses how their business has been over the past year, their challenges and opportunities, and how they are helping their customers. Another topic of discussion is investing in new equipment—the key parameters to consider, and what’s driving customers to buy their systems.
Tips & Tricks: Assembly Panelization
Thoughtful PCB array and panel design can reduce line stoppage, improve changeover time and reduce material scrap. Fiducial location and design are good aids to prevent mistakes, but may still result in line stoppage. If you have fiducial recognition issues, making the shape of the mask opening different than the fiducial feature may help the vision system discern the target feature easier.
PCB Pad Repair Techniques
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.
Focus on the New
It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.
Top 10 Most-Read SMT007 Columns of 2017
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.
Step Stencil Technologies and Their Effect on the SMT Printing Process
Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.
Solder Printing Process Inputs Impacting Distribution of Paste Volume
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.
Improving Solder Paste Printing
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.
What Matters Most is Communication
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.
DFx on High-Density Assemblies
Use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process, and reliability. The type of end product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end products will look very similar, but specification limits would be different.
Via-in-Pad Plated over Design Considerations to Mitigate Solder Separation Failure
Under certain conditions, the use of VIPPO with other pad structures within a BGA footprint can result in a unique failure mode in which the BGA solder joint separates between the bulk solder and the intermetallic compound either at the package pad or PCB pad interface, depending on whichever is the weaker interface. It can be either a complete or partial separation and hence, may or may not be detected at ICT/functional test.
Video from productronica 2017: Rehm Discusses Trends Driving Product Development
Michael Hanke, chief customer officer of Rehm Thermal Systems, speaks with I-Connect007 Managing Editor Andy Shaughnessy about the importance of communicating with their customers when it comes to new process and technology trends. He also talks about Industry 4.0 and big data, and process monitoring and transparency.
Solder Preforms 101: Ask the Expert
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.
Dealing with Vias-in-Pad
Screaming Circuits, a division of EMS firm Milwaukee Electronics, specializes in short-run, one-off, and prototype PCB assembly. In an interview with SMT Magazine, Duane Benson, CTO of Screaming Circuits, talks about the challenges when dealing with microvias and vias-in-pad from an assembly standpoint, and how in-circuit test issues, such as access to test points, can be addressed.
Creating the Perfect Solder Joint
From a visual standpoint, a good solder joint should be smooth, bright, shiny, clean, and have a nice concave solder fillet. But how do you ensure that inside those joints, good intermetallic bonds are formed? Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint.
Soldering Tip: Key to Good Solder Joints
In an interview with SMT Magazine, Enrique Moreno, technical support engineer at JBC Soldering, discusses the key parameters to consider during hand soldering to achieve the perfect solder joint. He also talks about the the increasing move towards automation and robotics soldering.
Achieving the Perfect Solder Joint: The Many Perspectives on Soldering
For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.
Choosing Solder Processes: Getting It Right
In an interview with SMT Magazine, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, shares his insights on the topic of achieving the perfect solder joint, from the perspective of a reflow oven supplier. He also talks about the latest developments in reflow ovens aimed at addressing voiding in solder joints.
Update on IPC’s Validation Services and Hints of What’s to Come
SMTA International is the perfect time to get updates on IPC happenings. One that I’m always curious about is the Validation Services programs. At the busy show, I managed to find a quiet spot so Randy Cherry, IPC’s director of Validation Services, could fill me in on the latest.
BTC and SMT Rework Challenges
In the assembly of bottom terminated components (BTC), the formation of voids has become a serious problem in many applications. In the SMT process, the reliability of solder joints becomes more of a concern, as less and less solder is allowed for each joint. The presence of voids can deteriorate the joint strength and eventually lead to joint failure.
RTW SMTAI: AIM's Dr. Mehran Maalekian Speaks on New Alloys for Harsh Environments
Dr. Mehran Maalekian, R&D Manager at AIM Solder, speaks with I-Connect007 Managing Editor Andy Shaughnessy about new alloys that are targeted for high-temperature and demanding applications, particularly in harsh environments, where standard lead-free alloy such as SAC will not perform as well.
RTW SMTAI: Alpha Discusses Solder Dross Reclamation
At the recent SMTA International 2017 exhibition in Rosemont, Illinois, Mitch Holtzer, director of Americas Reclaim Business of Alpha Assembly Solutions, talks with Managing Editor Andy Shaughnessy about the solder dross reclamation process, and discusses his new role in leading Alpha’s reclamation business.
Rework and Reliability: Less is More!
Circuit boards are not always perfect after reflow or wave soldering. Scrapping boards with one or two defects is expensive, so rework happens. A good concept for rework is less is more, especially less flux. Use as little rework flux as possible, as in the old Brylcreem ads, "Just a little dab'll do ya."
A Look Into PCBA Rework and Repair
Despite the many technology advances in the SMT process, there will always be a need for rework and repair of PCB assemblies. Most especially as the industry trend continues towards finer pitch and spacing, smaller and smaller components, and increasing high-reliability requirements from customers.
Whose Fault is That Bad Board?
Years ago, I held a position in an EMS company where projects were analysed before manufacturing. We found that even some of the best and most innovative circuits could not be manufactured. Why? Because the PCB designer, an electronic engineer, was not acquainted with the fabrication process. He had no idea about technological requirements necessary for electronic production. I know another designer who learned, finally, the importance of the thermal relief pad for heat restriction during reflow for a good soldering. His response? “Oh, was that what they were for? And to think I worked so much to remove them!”
RTW NEPCON South China: JBC Brings Digital Transformation to Hand Soldering Process
Enrique Moreno, technical support engineer at JBC Soldering SL, and I-Connect007 Managing Editor Stephen Las Marias discuss the latest developments in the hand soldering process, including robotics and automation. Moreno also talks about the opportunities in China, and why their Industry 4.0-enabled solutions are suitable for this market.
Improving the Rework Process
An optimized SMT assembly process typically provides a yield of nearly 100%. Technology advancements—from the solder paste printing process, SPI, and parts placement, to reflow and wave soldering and AOI—have pushed the efficiency and accuracy of these steps in the SMT process such that a board assembly should be perfect at the end of the line. Still, EMS providers continually face the need to rework and repair PCBAs even after dialing in the perfect set-up.
NEPCON South China 2017 Opens Today
NEPCON South China 2017, being held in conjunction with the Shenzhen Circuit Sourcing 2017 and Automotive World China, opens its doors today at the Shenzhen Convention and Exhibition Center to showcase nearly 600 companies catering to the electronics manufacturing industry. This year’s event, the largest ever in the show's 30-year history, features 45,000 square meters of exhibition space.
On the Smart Move: Industry 4.0 in Electronics Production
The industrial world is in motion, as we face a revolution in terms of processes, organizational structures, hardware and software in our companies. Many critics complain that terms like Industry 4.0 and smart factory are rather arbitrary and lack concrete meaning. That is correct. What is also true, however, is that technical progress always starts out with a vision, which is then put into concrete terms as time moves on.
Soldering Fumes in Electronics Manufacturing: Damaging Effects and Solutions for Removal
No matter which soldering process you analyze, all of them have one aspect in common: They produce airborne pollutants, which may have a negative impact on employees, plants and products as well. This article discusses the damaging effects of soldering fumes, and solutions for their removal.
Process Step Elimination: Driven by Cost and Efficiency, Enabled by Process and Materials Innovation
Electronics manufacturing has evolved from the early days of hand soldering and wave soldering to the more modern SMT process. But while most modern electronics are produced using the SMT process, there are still some mixed technology applications that need both the SMT process and the wave soldering process. This article looks into the pin-in-paste (PiP) process, which enables the soldering of through-hole components during SMT processing, and eliminates the need for the wave process.
Pillarhouse International's Allan Jiang Discusses Selective Soldering Developments
At the recent NEPCON China event in Shanghai, Allan Jiang, sales manager at Pillarhouse International, discusses with I-Connect007 Managing Editor Stephen Las Marias some of the challenges in selective soldering, and technology developments to address these issues.
Using Lead-Free BGAs in a Tin/Lead Soldering Process
Several electronic market segments, such as those electronics used in harsh environments or that have life/system critical functionality, remain exempt from lead-free material restrictions such as the RoHS legislation. While these market segments can use solder containing lead, it is increasingly difficult to procure advanced components in non-ROHS compliant configurations. This article discusses several aspects of having lead-free BGA components in a tin/lead soldering process.
Using Paste Flux for Rework
When using a hot air or IR rework system where the reflow cycle is mimicking the original SMT reflow profile, and when using flux for re-attachment, paste flux otherwise known as gel or tacky flux is the correct type of flux to use. Due to its high viscosity and tack properties, paste flux prevents components from being moved during hot-air reflow while being able to remain active for the complete time-temperature period.
Today’s Mil/Aero Enemies: Counterfeits, Obsolescence and Failure
The need for high-reliability electronics, components and assemblies that can perform in harsh operating conditions involving extreme temperatures, vibration, and moisture continue to challenge electronics assembly providers catering to the military and aerospace markets. These are on top of current manufacturing issues such as the miniaturization of products, shrinking component sizes, higher density board assemblies, and the obsolescence of electronic components.
The Importance of Conformal Coating, Now and in the Future
At the SMTA Michigan Expo and Tech Forum, held in Grand Rapids on May 11, Technical Editor Happy Holden spent a few minutes with AIM Solder’s Technical Marketing Manager Tim O’Neill to discuss O’Neill’s presentation on the topic of conformal coating over no-clean fluxes.
Assembly Training and Education
Even if your PCB assembly process is optimized, there is always room for improvement. And no matter how successful your company has been in the past, you just can’t rest on your laurels. It is always in your best interest to strive towards a better operations model. We've created a survey to help us gauge the importance of training and education in your workforce, and the benefits that you get in ensuring that your operators and engineers have the most current knowledge and skill sets.
Shenzhen Axxon Discusses Acquisition and Dispensing Market Trends
Ivan Li, general manager at Shenzhen Axxon Automation Co. Ltd (China), discusses their recent acquisition by Mycronic, as well as the latest developments in the dispensing market. Also discussed is the China market, and how the company is staying ahead of the increasing competition in the dispensing industry.
RTW NEPCON CHINA: Interflux to Revolutionize Solder Industry
At the recent NEPCON China event in Shanghai, Daniel Werkhoven, CEO of Belgium-based soldering chemistry provider Interflux Electronics N.V., talks with I-Connect007 Managing Editor Stephen Las Marias about how their new bismuth-based solder alloy will help improve the soldering process.
Tape and Reel Solder Preforms: A Success Story for the UD00 X86 SECO Board
SECO's latest product innovation, UDOO X86, is a real computer with an integrated Arduino 101 compatible board that is capable of running games and videos in 4K. But while the success of the UDOO X86 is impressive, so is SECO's ability to develop this game-changing product with low-cost technology for mass appeal and affordability.
Voiding Control at High-Power Die-Attach Preform Soldering
Voiding in the solder joint is a concern for high-reliability and high-performance devices. This paper discusses a study on voiding behavior of large pad high-power devices simulated with Cu coupon to Cu coupon sandwiches. A flux-coated preform was studied in this assembly, with variation in solder alloy type, quantity of solid flux coated on solder preform, Cu coupon pre-oxidation extent, reflow temperature, and pressure exerted onto the sandwich during reflow.
The Benefits of Applying Flux Directly to a Micro BGA
Technology trends continue to drive miniaturization in electronic components. As a result, product designers are often forced into specifying smaller and smaller devices on their bill of materials. Sometimes, miniature devices offer OEMs cost savings, which is seen as a good thing; other times, there is simply no choice.
Keeping an Eye on the Next Generation
Why should a company in our industry dedicate hours to providing professional development to a group of temporary student interns? Why should they open their doors to kids, some of whom haven’t even entered high school? For Indium, the short answer is, it makes them better. Read on to find out why.
The Challenge of Filling PCB Assembly Positions
U.S. manufacturers are having a difficult time filling open positions. They cannot find workers with the necessary skills to fill the openings. If we look specifically at the PCB assembly industry, the rhetoric is similar. There are more openings than people to fill them. The discussions reveal that lower wages, lack of skills, and sometimes the reported low unemployment rate in the United States is part of the problem.
Achieving Successful Flex Circuit Assemblies
In this article, Yousef Heidari, vice president of engineering at EMS firm SigmaTron International, talks about the varying challenges in flex-circuit assembly. Chief among these are the solder paste printing process, especially for designs that have multiple areas with fine-pitch components, as well as the subsequent handling of the assembly before final product integration.
JJS Stresses Need for Baking Prior to Flex Circuit Assembly
From an assembly perspective, baking the flex circuits prior to manufacturing assembly is crucial as they can be susceptible to delamination. In this interview, Russell Poppe, director of technology at JJS Manufacturing explains why, as well as discusses other challenges in flex circuit assembly and strategies to address them.
RTW IPC APEX EXPO: Metcal Brings Disruptive Technology in Hand Soldering
Christopher Larocca, president and CEO of OK International (of which Metcal is a division), tells I-Connect007 Publisher Barry Matties their strategy for improving the hand solder process. He describes a lack of process feedback to the operator as a core problem inherent in the hand soldering process, and discusses how OK International has developed an innovative solution to address the issue.
Fixturing: Key to Accurate Flex Circuit Assembly
Adrian Nishimoto, operation manager at Spectrum Assembly Inc., talks about the critical factors to consider during flex circuit assembly, such as fixturing and accurate thermal profiling. He also mentions why jet printers are suitable for use in assembling flex circuits.
Strategies for Addressing Flex Circuit Assembly Pain Points
In an interview with SMT Magazine, Steve Fraser, VP of Operations at Firstronic, discusses the key factors that have the greatest impact on the quality of flex circuit assemblies, the challenges they face during assembly, and their strategies to ensure the reliability of the products.
How to Solder SMT Components with Varying Solder Paste Heights
While miniaturized components offer product designers some benefits, such as energy efficiency and the ability to build in greater functionality, mixing "old and new" technology together on the same PCB design can add complexity at the build stage. As a result, it is sometimes necessary to change the way solder paste is applied to the PCB during production.
Supportive Tooling: The Magic Ingredient for Flex Circuit Assembly
Flex circuits have changed the way product development engineers can design and package their electronic products. Flex applications have opened the doors for PCBAs to move out of square, box enclosures and fit into small, tight, even oddly shaped three-dimensional spaces that can withstand harsh vibration and multiple flex uses. While these flex assemblies may perform in the same way a traditional rigid PCBA does, they have their own set of assembly rules and manufacturing nuances.
Navigating the Complex World of Flex Circuit Assembly
We recently conducted a survey on flexible printed circuits to know more about the challenges that designers, fabricators, and assemblers face when dealing with flex circuits. We asked what steps in their processes have the biggest effect on yields; the challenge they face when dealing with flex circuit materials; as well as the factors that have the greatest impact on the quality of their flex circuit design, fabrication and assembly.
Alpha Papers Investigate High-Reliability Solder Alloys
During SMTA International, Morgana Ribas, manager of Metals Technology Group at Alpha Assembly Solutions, presented a pair of papers that focus on the company’s reliability testing of solder alloys. I-Connect007 Managing Editor Andy Shaughnessy sat down with Morgana to discuss these papers, and some of the surprising results that the testing yielded.
Alpha on New Technologies to Tackle Voiding
Tom Hunsinger, vice president of marketing at Alpha Assembly Solutions, discusses with SMT Magazine how their company is addressing voiding—one of the greatest challenges in soldering. He talks about the latest market development trends that are shaping product innovation strategies at Alpha. Hunsinger also details some of their latest solder technologies, and how they are helping their customers address their soldering challenges.
RTW IPC APEX EXPO: Ray Prasad Discusses Revised IPC-7530 Reflow Profile Guidelines
IPC Hall of Famer Ray Prasad, chairman of the IPC-7530 committee, provides an overview of the newly revised IPC-7530, which provides users with guidelines on how to successfully profile and characterize PCB assemblies with high levels of efficiency.
RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
RTW IPC APEX EXPO: KIC on Smart Factory Technology Approach in Thermal Ovens
Bjorn Dahle, president of KIC Thermal, discusses with I-Connect007 Guest Editor Dick Crowe their approach to measuring temperatures in thermal ovens and networking the information to a main frame, to enable the process engineer to statistically monitor a specific process.
RTW IPC APEX EXPO: Alpha Highlights Solder Reclaim Technology
Mitch Holtzer, director of Americas Reclaim Business for Alpha Assembly Solutions, discusses the company’s reclamation technology, which takes solder dross, used solder paste, and solder paste debris and converts it into reusable soldering materials. He also talks about how solder reclamation can help sustainability efforts, and how it helps customers when it comes to their waste materials.
RTW IPC APEX EXPO: Rehm Highlights Reflow Improvements for Reliable Solder Results
Michael Hanke, CCO of Rehm Thermal Systems, highlights the latest developments in their reflow solutions, which are targeted at improving the reliability of the soldering process. He also discusses their complete solution, which is inline with the Industry 4.0 trend.
Real Time with...IPC: Alpha Discusses Improving LED Reliability Issues
At this week's IPC APEX EXPO 2017 in San Diego, California, Steve Godber, LED Commercial Manager at Alpha Assembly Solutions, discusses with I-Connect007's Stephen Las Marias the reliability and voiding challenges in the LED market, and how the company is helping their customers address these issues through their solder technologies.
What’s Driving the Rapidly Changing Electronics Assembly Industry
Since the EMS landscape has become so competitive, staying on top of new advances in technology and being able to rapidly adapt to changing customer needs, market demands, trends and technological advances is critical. This article highlights some examples of how electronics assembly technology developments have impacted the EMS industry in recent years and will likely continue shaping the industry in the future.
Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability
Lead free solder joint reliability in drop shock loading has been a recurring issue in mobile and handheld consumer electronics. Changing solder composition may offer an opportunity to improve joint drop reliability. This study focuses on different failure modes in circuit board assemblies as observed based on solder composition, board surface finish, and solder joint volume.
A New Organizational Model Using Logic, Cost-Effectiveness and Customer Service, Part 2
In previous articles, Tom Borkes talked extensively about one of the controllable components of labor cost: the counterweight to competing against low labor rates—using automation to reduce labor content. Over the next few months he will drill down into the other controllable component of labor cost: indirect labor.
Choosing the Correct Flux—Advantages/Disadvantages
While often overlooked, the flux chosen for the selective soldering process has a great impact on solder joint quality, long term reliability and overall selective soldering performance. This article outlines the critical factors of commonly available selective soldering fluxes and how they impact the soldering quality, reliability and equipment performance.
The Influence of Clean Air on the Value-Added Chain in Electronics Production
A multitude of different processes in modern electronics production—from connection and separation technologies, surface processing such as marking and drilling, the utilisation of fluxes, up to production processes such as soldering, welding and gluing—generate harmful substances that might have extreme health impacts and affect production plants and products.
Editor's Note: Understanding Plating and Surface Finishing
This month’s issue of SMT Magazine focuses on the impact of plating and surface finishing in electronics assembly. True, plating and surface finishing may be more directly significant in PCB fabrication, but surely they are important issues as well when it comes to the assembly side. In fact, according to our recent survey, 82% of the respondents said surface finishing impacts their assembly process.
How to Create the Perfect SMT Reflow Oven Profile
While EMS providers will have their own preference when it comes to machine type and brand, broadly speaking, the process steps they go through to produce PCBAs are the same. However, one step that can make all of the difference when it comes to quality and consistency is reflow. This article details how EMS companies can go about creating the perfect SMT reflow oven profile.
LA/Orange County SMTA Tech Expo a Success
On November 3, I had the pleasure of attending the LA/OC SMTA Tech Expo in Long Beach, California, and meet with chapter President Kathy Palumbo and Vice President Scott Penin, to learn more about this annual event and the chapter’s ongoing activities.
Tin Whisker Mitigation Methodologies Report from SMART Group, Part 2
Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In the second part of this two-part article series, Editor Pete Starkey concludes his review of the SMART Group's recent seminar, which is focused on tin whisker mitigation methodologies and strategies.
Solder Voiding, Autonomous Autos, and Statistics—So Much to Learn from Dr. Ron
While at the 2016 SMTA International conference and show, I had the lucky opportunity to talk with Indium Corporation’s Dr. Ron Lasky. He gave a great synopsis of the extensive testing done by Indium Corporation’s Chris Nash on solder voids, outlined in a paper co-authored by the two, which was being presented by Ron at the conference.
HKPCA & IPC Bring Hand-Soldering Competition World Championships to China
Helen Guo, member services director at IPC Greater China, discusses with I-Connect007's Edy Yu IPC’s activities and initiatives in China. She also discusses the upcoming International Printed Circuit and APEX South China Fair 2016, which will feature the hand-soldering competition world championship for the first time in China.
Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1
Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In this article, Editor Pete Starkey reviews a recent seminar by the SMART Group to discuss tin whisker mitigation methodologies and strategies.
Living Up to Their Name at Alpha Assembly Solutions
At SMTAI in October, I-Connect007's Judy Warner spent some quality time with Alpha Assembly Solutions' Jason Fullerton, to discuss Alpha's innovative new products. Fullerton also discussed a paper he was presenting, which compares two lead-free, silver-free alloys in a selective soldering application.
The Impact of Vias on PCB Assembly
Via technology has been one of the solutions to address the miniaturization and component density challenges in current electronic assemblies. However, vias are not without their own set of challenges. As per our recent survey, these include impedance matching, routing, placement of vias, minimum size limitations, aspect ratio, and the limitations for the PCB manufacturer.
To Bake or Not to Bake: Examining the Impact of Waiving PCB Pre-Baking Prior to Assembly
Moisture plays a critical role in lead-free PCB assembly—and one process that aims to drive moisture out of the PCB is baking. In this article, Yash Sutariya explains the results of his study on the impact of waiving PCB pre-baking prior to assembly. His study includes via integrity, via life impact, via failure, and overall reliability failures.
How to Improve PCB Reliability
Component failure rates have steadily declined over the years to the point where non-component failure sources have become the dominant cause of failures for a PCB. If the reliability of the components is becoming a non-issue, then the only way to improve electronics further—for this article, automotive electronics—is to look at the non-component aspects of the electronics, and a significant one is the PCB.
IPC Certification Program's 'Space Hardware Addendums' Training and Certification
In this article, Sharon Montana-Beard of Blackfox discusses the IPC Certification Program's Space Hardware Addendums training and certification, the topics covered in the training course, and the benefits of the program.
The Theory Behind Tin Whisker Phenomena, Part 4
In this fourth installment of the series on the theory behind tin whiskers, Dr. Jennie S. Hwang continues on her discussion of the likely key processes engaged in tin whisker growth—lattice vs. grain boundary diffusion, and reaction and dynamic of intermetallic compounds.
How to Specify a Custom Machine
Let’s say you have an unusual product configuration, a unique space requirement, an unorthodox handling system, or an application totally unrelated to the PCB or SMT assembly business, and you can’t find a standard machine provider that can handle your requirements. What then? This article highlights key points to consider when going the custom machine way for your project.
Is Your Electronics Manufacturing Factory 'Smart'?
Despite the amount of content being produced around big data, Industry 4.0, digital manufacturing, mass customization and various other subjects, a large number of electronics manufacturing companies still don't fully understand this question. This article looks to provide guidance on how you can assess your manufacturing facility without investing huge amounts of time and money upfront.
Being More than a Manufacturer’s Rep
Matt Bonweg, process support specialist at manufacturers' rep firm Murray Percival Company, speaks with I-Connect007's Patty Goldman during the recent SMTA Ohio Expo about the company's history and philosophy, as well as their strategies for success in this industry.
Silicon Valley SMTA Chapter President Kevin McClay on Evolution and Current Status of SMTA
Kevin McClay, president of Silicon Valley SMTA Chapter, speaks with I-Connect007’s Judy Warner on the activities of the SMTA in the Valley, and the challenge of attracting young talent to join the manufacturing engineering industry.
Real Time with NEPCON South China: BTU Talks Voiding in Automotive Electronics, Industry 4.0 Strategies
At NEPCON South China 2016, Bob Bouchard of BTU International Inc. discusses with I-Connect007’s Stephen Las Marias the challenges and opportunities in the China market, how BTU is helping address voiding issues in automotive electronics assemblies, and their Industry 4.0 strategies.
Case Study: Flex Smart Factory at Fuyong
This paper discusses Flex's experience with their current project called Smart Factory, which is being implemented at their Fuyong facility in Shenzhen, China. It also highlights some of the benefits they have achieved, including traceability, improved productivity and quality, and minimized defects through process predictability.
The Industry Speaks
In the latest issue of SMT Magazine, we take a pause from covering the latest technology trends, challenges, and solutions in the electronics manufacturing and assembly industry. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points when it comes to their respective specialties.
ITRI’s Wang Talks Future of Soldering and Paste Printing
In an interview with SMT Magazine, Wang Chao, technology manager at UK-based ITRI Ltd, discusses the biggest challenges in solder paste printing, how the solder paste material impacts the process, and the future for soldering and paste printing.
Selecting a Selective Soldering System, Part 4
In the previous three chapters on selective soldering, Robert Voigt covered the different applications well-suited to this technology, the various types of fluxing and soldering methods available, and nitrogen inerting. In this chapter, he discusses programming software, and how you can figure out the best sequence to optimize production speed.
Hand Soldering: The Move Toward Automation
At the recent NEPCON event in Shanghai, JBC's Domingo Taberner discussed with I-Connect007's Barry Matties the hand soldering market in China, the move towards automation, the greatest challenges their customers have in soldering, and what to know about choosing the right temperature and tip.
Solder Paste Dispensing: Breaking the Limits of Printing
In an interview with SMT Magazine, Eric Gu, application manager at Nordson Asymtek China, talks about the greatest challenges and innovations in solder paste dispensing, and factors to consider when using solder paste dispensers.
Solder Paste Printing: A User’s Perspective
Integrated Micro-Electronics' Joemar Apolinario, Aurelio Bantigue, and Rodney Bebe, discuss the challenges and key considerations to make when dealing with tighter tolerances and finer pitches in line with the continuing miniaturization trend in the electronics manufacturing industry. They also talked about the impact of solder pastes in the printing process, and the criteria for their selection and qualification.
EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry
Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.
Solder Jet Printing: Keeping Up with the Challenges
In an interview with SMT Magazine, Thomas Bredin, area sales manager at Mycronic, discusses solder paste printing, and how the jet printers are getting up to speed with the challenges such as tighter tolerances and finer lines and pitches. He also talks about key factors to consider when selecting a solder paste printer, and what Mycronic 4.0 is all about.
RTW IPC APEX EXPO: ACE's Alan Cable Discusses Benefits of Selective Soldering, and Need for Lead Tinning
Alan Cable, president of ACE Production Technologies, talks to I-Connect007 guest editor Mark Thompson about selective soldering and how it helps electronics assemblers overcome the high cost of labor.
Selecting a Selective Soldering System, Part 3
The previous two articles on selective soldering covered the different applications well-suited to this technology, and the various types of fluxing methods available. In this article, Robert Voigt discusses the common types of soldering technologies available, as well as nitrogen inerting systems.
Improving the Solder Paste Printing Cycle Times
At the recent NEPCON China show in Shanghai, I interviewed Adam Sim, senior sales manager at Speedline ITW EAE, about the challenges in solder stencil printing, how printing cycle times may be improved, and the key factors to consider when selecting a solder paste printing solution.
Solder Paste Printing: Challenges and Best Practices
In an interview with SMT Magazine, Watson Tseng, General Manager of Shenmao America Inc., talks about the challenges in solder paste printing, key parameters and best practices to consider, and variables involved when it comes to selecting the appropriate solder paste for the printing process.
The Solder Paste Factor in Printing
Mitch Holtzer, Alpha Assembly Solutions’ global director of customer technical support, and expert columnist at SMT Magazine, talks about the challenges that customers face when it comes to solder paste printing, the impact of solder pastes on the printing process, and the variables involved when selecting the type of solder to use for specific applications.
3D Solder Joint Reconstruction on SMD Based on 2D Images
Solder joint inspection has been a critical issue for quality control, mainly due to their specular reflections. AOI systems have been faced with the same difficulty for solder inspection. This paper presents an algorithm for 3D solder joint reconstruction, which gives 3D analysis capability to the traditional 2D AOI equipment, practically without increasing the financial cost and with no cycle time impact, bringing 2D AOI equipment back into the game of SMT technology.
Solder Paste Exploration
From the manufacturers of solder pastes, to equipment makers, all the way to the solder paste inspection guys, and the electronics assemblers who are using their products, I talked to the supply chain to find out what’s going on in the solder paste printing process, what factors impact the process, the challenges, and the best practices to consider to be able to address those challenges and improve efficiencies and yield in the SMT line.
Selecting a Selective Soldering System, Part 2
In Part 1, Robert Voigt began a discussion of selective soldering, including how it works, some pros and cons, and several fluxing and soldering options to choose from. This chapter dives a little deeper into the mechanics of fluxing systems.
Soldering Experts on Hand at SMTA’s West Penn Chapter Expo & Tech Forum
At the recent SMTA West Penn Chapter Expo & Tech Forum, Marilyn Lawrence, founder and president of Conformance Technologies Inc., speaks with I-Connect007's Patty Goldman about the importance of solder training, and how far it has come through the years.
Making Systems Smarter to Gain Visibility, Traceability, and Reduce Handling Errors
At the recent IPC APEX EXPO event in Las Vegas, Bjorn Dahle, president of KIC, talks about his views on automation, the technology improvements being made in reflow ovens, and some of the strategies to reduce handling errors in assembly lines.
Reducing Setup Time to Provide More Uptime in Production
In an interview with I-Connect007 at the recent IPC APEX EXPO event in Las Vegas, Bob Bouchard, corporate marketing manager at BTU, talks about the latest developments in their products, how their technology is helping users reduce their setup times, and the impact of Industry 4.0 in the electronics assembly industry.
Benefits of Improving Reflow and Screen Printing Processes
With a level playing field in terms of access to talent, technology, knowhow, infrastructure, and financial resources, how can an EMS company build a successful business year after year, decade after decade? Read this article to find out how one EMS player—through process improvements—manages to remain strong in this industry.
Selective Soldering: Design, Process Challenges and Practical Solutions
A SMART Group workshop at the Bromsgrove, UK, premises of equipment and process materials distributor APP Electronics, set out to provide the answers, with a programme combining technical presentations, live demonstrations and hands-on sessions, introduced and moderated by Nigel Burtt, senior electronics manufacturing engineer at Renishaw and SMART Technical Committee Chairman.
Selecting a Selective Soldering System, Part 1
So far in this series, we’ve covered stencil printers, pick and place machines, reflow ovens and multiple types of through-hole soldering. In this and the next couple of chapters, we’ll discuss selective soldering machines. It’s useful to start by understanding why and when selective soldering is used.
RTW IPC APEX EXPO: Kurtz Ersa Talks Latest Innovations
Ernie Grice of Kurtz Ersa North America speaks with I-Connect007 guest editor Mark Thompson about their latest innovations, including voidless reflow machines, selective soldering machines and rework systems, as well as a new paste printer that incorporates a 3D inspection system.
Taking the Gremlins Out of Your Process
Every step in your assembly line is supposed to be designed to perform optimally for you to have an efficient, reliable, robust and reproducible process. However, and as isolated as they may seem, "gremlins" sometimes appear and mess up the results of a batch. The latest issue of SMT Magazine features strategies that can help you address these issues.
IPC APEX EXPO: Manncorp Talks 50 Years in Business
Henry Mann, founder and CEO of Manncorp, discusses with I-Connect007’s Stephen Las Marias the highlights of their 50 years in this industry, and the changes he had seen over the past five decades. He also provides his outlook on where the industry is headed.
Reflow Oven Changeover in a World of Short Production Runs
When drilling down to the individual machines, you may find that the biggest drag on your productivity is the reflow oven. The use of more effective production planning and scheduling as well as modern data mining software to identify one or a few oven recipes may provide dramatic improvements to line changeover time and, consequently, profits.
3D Assembly Processes: A Look at Today and Tomorrow
One of the ways to increase density of a product is to utilize more of the three-dimensional spaces available. This article explores the evolution of 3D assembly techniques, and takes a glimpse into the future, based on technologies available now, to examine potential assembly methods on the horizon for 3D assemblies.
The Jefferson Project, Part 2: Automation as a Counterweight to Low Labor-Rate Assembly
In Part 1 of this interview, Tom Borkes, founder of The Jefferson Project and the forthcoming Jefferson Institute of Technology, provided his well-researched plan to introduce students to tech manufacturing, as well as discussed the paper he presented at SMTAI. In Part 2, Tom expands on the example set forth in his SMTAI paper, and describes another important tool in reducing labor cost through the reduction of labor content: designing for automation.
Selecting a Wave Soldering System, Part 3
In my last column, we discussed the attributes of the various types of wave solder systems, the most common through-hole assembly system for small- to mid-volume operations. In this chapter, we will dive a little deeper and address board handling techniques; in particular, the three common methods of running boards in wave soldering.
Vapor Phase Technology is a Viable Solution, but Carries a Learning Curve
Vapor phase reflow solder technology is a technology that has come of age in an era where its efficiency in reflowing densely packed printed circuit board assemblies is highly valued, since the vapor blanket immersion process ensures perfect wetting and void-free, high-quality solder joints. The challenge is properly sizing the machine to likely workloads and optimizing the necessary profiles. The end result is improved quality, better line flexibility and lower energy consumption.
Medical EMS: Opportunities Abound
Megatrends such as the increasingly ageing population and growing demand in emerging economies worldwide bode well for the medical electronics assembly industry. However, challenges such as margin pressures, compliance costs and risks, supply chain instability, and new product introduction headaches are hindering a more aggressive prognosis of the industry. But, with innovation, medical manufacturers can churn out more.
Top 10 Factors to Consider When Selecting a Medical EMS Company
Once the decision has been made to use an EMS company, selecting the right one involves several steps. Although most EMS companies perform the same basic services, every EMS company is different. In this article, Mo Ohady and David Estes of Digicom Electronics write the 10 key factors to consider when selecting your medical EMS company.
Medical Electronics: Manufacturing Vitals
With the rapidly growing aging population, rising healthcare costs and increasing health awareness, opportunities abound in consumer medical devices, diagnostics, imaging, and instrumentation. However, the medical electronics industry is not without its own set of challenges. The January 2016 issue of SMT Magazine highlights the manufacturing challenges and opportunities in this growing sector.
Nordson EFD Discusses Dispensing Technologies, Solder Reliability and Innovation
Philippe Mysson, business development manager for solder paste at Nordson EFD, discusses a host of solder-related issues, including reliability, the benefits of solder paste dispensing systems, challenges facing their customers and how Nordson EFD is helping to address those issues, and finally, latest trends driving innovation in solder alloys.
Selecting a Wave Soldering System, Part 2
In his last column, Robert Voigt introduced the various types of through-hole soldering techniques, which include: manual, dip, drag, wave, and selective. In the continuation of his new article series, he talks about wave soldering—the most common and efficient form of through-hole soldering available—and the steps in selecting a wave system depending on your needs.
iNEMI: Leading the Way to Successful Electronics Manufacturing
iNEMI CEO Bill Bader talks about the consortium’s goals and mission, its collaborative projects, as well as its roadmap for the electronics manufacturing industry. Bader also highlights iNEMI’s milestones in line with the major trends that have happened in the electronics industry, including the transition to lead-free, addressing tin whisker growth, and the move towards HFR-free PCB materials.
Kester Highlights Strategies to Address High-Reliability Issues
Lynnette Colby, global product manager at Kester, discusses the biggest challenge their customers are facing—high reliability—and how using materials other than halogen can help address this issue. She also talks about how a complete solder solution—including the paste, flux and wire—help ensure the reliability of the electronics assembly.
Alpha Talks Challenges of Solder Recycling
Jason Fullerton, customer technical support engineer with Alpha, talked with I-Connect007's Patty Goldman about his presentation on recycling solder and why doing this in-house is not a good idea. He also discussed about the new, smaller particle solder pastes and about Alpha’s recycling program that is really beneficial to their customers.
Honeywell Paper Investigates Avionics Vibration Durability
Dr. Joseph Juarez, principal mechanical engineer at Honeywell International, discusses with I-Connect007's Andy Shaughnessy his SMTA paper, which addresses avionics vibration durability between tin-lead and lead-free solder, the years of testing he conducted, the importance of doing a good soldering job, and some of the surprising findings of his research.
Alpha's Morgana Ribas on Advances in Lead-Free, High-Reliability Alloys
Morgana Ribas, manager of Alpha's Metals Technology Group in India, presented a paper at the recent SMTA International show in Chicago. She sat down with I-Connect007's Andy Shaughnessy to discuss the paper's focus on high thermal reliability, and some of the new high-reliability lead-free alloys hitting the market.
Low-Temperature Thick Film Pastes Permit Lead-Free Soldering
There has been an increased interest in low-temperature polymer thick film products that perform at the same level as their high-temperature counterparts, including high reliability, strong adhesion, and solderability with lead-free solders. This article talks about a new, easy-to-process polymer thick film paste compatible with a variety of substrates, features low temperature curing, and offers excellent solderability with SAC305 solder.
AIM Solder Talks Innovations to Address Assembly, Reliability Issues
David Suraski, executive vice president at AIM Solder's assembly materials division, sat down with us at productronica 2015 to discuss the latest industry trends and customer challenges facing the solder industry, and innovations that are helping customers address their issues. Suraski also talked about reliability issues, and how the company is addressing them.
Printed Circuit Board Failures – Causes and Cures
PCBs can fail for a multitude of reasons. And the ability to detect and identify failures during assembly and final test is preferable to having to accept the consequences of field returns. This article details Bob Willis' recent webinar, which described failure mechanisms, demonstrated the use of standard test methods and tricks of the trade, and explained how to eliminate many of the common causes of PCB defects.
A Look at the Theory Behind Tin Whisker Phenomena, Part 3
The third installation in Jennie Hwang's five-part series on tin whisker phenomena continues the discussion on key processes engaged in tin whisker growth. She discusses the energy of free surface, recrystallization, and the impact of solubility and external temperature on grain growth.
The New Industrial Era
Key transformative technologies such as big data, analytics, and IoT are ushering in a new industrial era, where new technology forces and innovations are changing the dynamics, risks, and success factors for global manufacturing companies. To be successful in this environment, a mindset shift is required when it comes to deciding what to do and how to take your manufacturing operations to the next level.
Selecting a Reflow Oven, Part 3
In this conclusion of a three-part series on selecting and evaluating a basic reflow oven configuration for a circuit board assembly environment, methods of control and profiling techniques--such as on-board and PC-based control, and on-board, PC-driven and third-party profiling--are discussed and evaluated.
Surface Mount Technology Association—a New Milestone
With a grand mission, SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. The organization delivers the right information at the right time to empower the workforce, who collectively advances technology, innovates new products, and serves the global industry.
BTU Talks Challenges and Trends Driving Product Development Strategies
Coco Zhang, product manager at BTU Ltd, discusses with I-Connect007's Stephen Las Marias some of the technology trends and customer challenges and requirements that are driving innovations in their reflow ovens. She talks about energy efficiency, the challenges of complex boards used in the telecom and server industry, and the advanced technology requirements from the semiconductor packaging industry.
ELCOSINT - The Future of High Temperature Interconnect
The increasing need for electronic assemblies to endure high-temperature operating conditions in aerospace, automotive, oil and gas drilling, power management and renewable energy applications, whether those conditions involve high ambient temperatures, high cycle temperatures or high junction temperatures, is driving the development of high temperature interconnection technologies.
Faster, More Precise Jet-dispensing in Microsystems Technology
As miniaturization advances relentlessly, the components that need to be connected are becoming ever smaller and more delicate. At the same time, quality standards and the functionality of the materials are increasing. This development requires joining processes that can reliably fix the smallest of components.
Mycronic Jet Printer Technology Addresses Board Challenges
Thomas Bredin, area manager and market support and sales for Mycronic, highlighted the unique characteristics of their jet printer, and how this technology helps customers in maintaining the volume distribution of the solder paste over the pad amid today's trends of high mix of small and big components on the same board.
OK International Talks Trends Driving Product Innovation Strategies
Bryan Gass, vice president for global sales and marketing at OK International, discussed with I-Connect007's Stephen Las Marias how trends such as automation, wearables, and Industry 4.0 are driving his company's product innovation strategies.
Collaboration between OEM and EMS to Combat Head-on-Pillowing Defects (Part 2)
There have been many publications, industry workshops, and symposia that describe process mitigation techniques for minimizing the occurrence of head-on-pillow defects during surface mount assembly. In this article, the authors address the root cause of the HoP defect—specifically the link between HoP defects and component warpage.
Detecting Process Defects
In many cases, the same process problems in soldering, PCB manufacture, and component failures just go round and round and will return if the true cause of failure is not detected. The causes can be highly complex or very simple, but they are available if you care to search. In this article, Bob Willis talks about typical failures of boards and solder joints, process problems and their root causes, and their solutions.
Declaring War on Failure in Electronics
Failure, in electronics, while not necessarily desired by either manufacturer or consumer, is expected. This is not to say that the industry has not attempted to improve reliability. In this article, Verdant Electronics' Joseph Fjelstad writes that much is being done in an effort to improve reliability with new solder alloys, new fluxes, new materials, new equipment and process parameters.
Acceptance Testing Of Low-Ag Reflow Solder Alloys (Part 1)
The electronics industry has seen an expansion of available low-silver Pb-free alloys for wave soldering, miniwave rework, BGA and CSP solder balls, and, more recently, solder pastes for mass reflow. In Part 1 of this two-part article series, the authors discussed test protocols that can be used for assessing new Sn-Ag-Cu(SAC), Sn-Ag, and Sn-Cu alloys for general use in electronics.
NEPCON Shenzhen 2015 Puts Spotlight on China's EMS Industry
From ODM and OEM to EMS, the Chinese electronics manufacturing industry is transforming from single, passive processing to active, intelligent manufacturing—in line with the "Made in China 2025" plan, as well as the latest trends happening in the electronics industry.
Selecting a Reflow Oven, Part 1
Finding out the size of oven you need is related to the number of zones you can afford. There will be tradeoffs between cost and capabilities, and more zones will always give you better flexibility and more control over your profile—but at a cost. Therefore, decision has to be qualified primarily on your anticipated throughput; that is, how many boards you process in a day or a week.
SMT Magazine August Issue Tackles War on Process Failure
Based on our survey, there are four major issues when it comes to quality and process failure: poor process control, poor training of employees around quality, inability to quickly identify where and how waste is being created, and poor technical support from suppliers. The August issue of SMT Magazine features several though-provoking articles tackling the war on process failure in manufacturing electronics assemblies.
Benefits of Soldering with Vacuum Profiles, Part 2
Part 1 of this article series explained the continuously increasing requirements for void-free solder joints in electronics manufacturing, amid the relentless introduction of new variants of bottom-terminated components. This article takes a closer look at the soldering process with a focus on vacuum profiles, as well as an evaluation project and the obtained soldering results.
Reliability Study of Bottom Terminated Components (Part 2)
In the finale of this two-part article series, the authors discussed their thermal cycle tests, as well as the impact of solder voids in the thermal pad of the BTC. They also touched on BTC thermal modeling, as well as determined the acceptable amount of solder voiding in a thermal pad for devices with power dissipation greater than 3W.
EIPC Summer Conference: Day 2
Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.
EIPC Summer Conference, Berlin: Day 1
Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.
NEPCON China 2015 a Resounding Success in Shanghai
The three-day event was a complete success, bringing together nearly 22,000 trade visitors and high-quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide. NEPCON China keeps up with market trends and gathers resources from all stakeholders to present a comprehensive event that covers SMT, new electronics materials, soldering, dispensing, electronics automation, measurement and other innovative technologies and products across the world.
A Look at Saki’s Approach to 2D, 3D and X-ray Technology
At NEPCON 2015, I-Connect007 Publisher Barry Matties sat down with Nori Koike, COO of Saki Japan, to discuss the latest demands for 3D and their approach to inspection. With more than 20 years of experience, they have built a line-up of tools that covers the inspection spectrum. Koike also stresses the importance of using inspection data as a tool to improve and automate the process.
Material Witness: How About that Technical Roadmap!
You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.
CyberOptics: Honing in on the High-Reliability Market with 3D AOI and SPI Platforms
I-Connect007 Publisher Barry Matties and CyberOptics’ Sean Langbridge spent time together in China recently, where they discussed, among other things, the company’s newest product launch, a 3D AOI and SPI platform. Langbridge also discusses the latest requirements for inspection.
Jetting Strategies for mBGAs: A Question of Give and Take
Among the alternatives for the deposition of solder paste and other fluids on a PCB is jetting, which offers advantages concerning precise volume repeatability, software control and local volume control. The goal of this study is to examine the effect of piezo actuation profile on deposit quality with respect to positioning, shape and satellite levels in order to achieve adequate deposition quality for applications such as 0.4 mm BGA.
Reliability Assessment of No-clean and Water-soluble Solder Pastes, Part II
Twenty-five years ago, solder paste residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were available, either with solvent or by using water, with or without detergent. Now, the assembly world is mainly no-clean: paste formulation is safer in terms of chemical reliability and process costs are reduced without cleaning.
Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
Optimization of a reflow profile often focuses on mitigating defects such as voiding, tombstoning, graping, and slumping/bridging. But little thought is given to the reflow profile’s effect on the electrical reliability of the no-clean flux residue. Because of the wide variation in size and thermal density of SMT components and PCBs, achieving a reflow profile that equally heats the entire assembly can be challenging and often impossible.
A Conversation (and Day) with Joe Fjelstad, Part 2
In Part 2 of this multi-part interview series, Verdant Electronics Founder and CEO Joe Fjelstad, and I-Connect007 Publisher Barry Matties discuss the future of what’s to come for the electronics industry, which, according to Fjelstad, has a lot to do with where we’ve just been in our quest for lead-free manufacturing. He also offers his view on the natural order of the evolution of personal political persuasions.
A Conversation (and Day) with Joe Fjelstad, Part 1
I-Connect007 Publisher Barry Matties and industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met recently to spend a day together enjoying the Evergreen Aviation & Space Museum (home of the Spruce Goose), located in the Oregon community of McMinnville. Their conversation ebbed and flowed between a wide variety of topics, from the electronics industry, to political shenanigans and the “war against failure.” In Part 1 of this multi-part series, Fjelstad introduces his “war against failure” idea, and what went terribly wrong in the advent of lead-free manufacturing.
Product Line Philosophy: Start Small...End Big
Ralph Savage, CEO of EasyBraid, talks to Kelly Dack about his company started their business, as well as some of the activites and technologies they are doing now, such as desoldering, stencil cleaning and a soldering technology based on the Curie principle. He also discussed the company's strategy in bringing world-class technology into the United States.
Tin Whiskers: Why Testing Temperature Can Change the Outcome
Tin whisker phenomena have been observed and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. In this article, Dr. Jennie Hwang discusses why temperature is one of the key variables that drive the tin whisker phenomenon, mechanism and how the underlying science operates.
Minimizing the Risk of Tin Whisker Formation in Lead-Free Assemblies
Although tin whiskers are very small crystalline fibers, they have reportedly caused multiple NASA satellites to become inoperable, automotive accelerator pedals to become unusable and a nuclear reactor to malfunction. The risk, however, can be minimized by specifying material sets that are less likely to produce tin whiskers.
2015 EIPC Winter Conference, Munich: Day 1 Review
Ninety delegates, eleven countries represented and a thought-provoking two-day programme on themes of reliability in PCB fabrication and assembly, copper cleaning and advanced material solutions, advanced imaging and soldermask, and how to make PCBs smart and ready for Industry 4.0. Add the further attractions of a keynote by Walt Custer and the chance to visit a military aircraft assembly plant: the formula for another highly successful EIPC Conference, this time close to Munich Airport.
Assembly and the Quest for Solder Alloy-Free Electronics (SAFE)
"As first brush, the title's suggestion that solder can be eliminated from the assembly process may appear absurd. Everyone related in any way to this industry knows solder is the universally accepted way of connecting components to printed circuits in electronic assemblies. Thus, the fact that many knowledgeable people in the industry might scoff at the notion solder can be eliminated comes both without surprise and a certain amount of resignation," writes Joe Fjelstad.
Assembly with Solder - An Unblinking Look at
While soldering holds many benefits in terms of offering a means of mass assembly of components to PCBs and is fundamentally simple, its application is much more complex and fraught with opportunity for defects to be generated, but it is also the demon we have elected to live with, for as the old saying suggests: "Better is the devil we know."