SMT :: Test & Inspection

Latest Articles

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Video from productronica 2017: Goepel Highlights Updates on X-Line 3D In-line System

At productronica 2017 in Munich, Germany, Goepel electronic's Andreas Turk, head of AXI Systems, explains the latest enhancements to their X-Line 3D in-line system for high-end inspection. He also discusses the benefits of the Stingray Detector option.

Dealing with Vias-in-Pad

Screaming Circuits, a division of EMS firm Milwaukee Electronics, specializes in short-run, one-off, and prototype PCB assembly. In an interview with SMT Magazine, Duane Benson, CTO of Screaming Circuits, talks about the challenges when dealing with microvias and vias-in-pad from an assembly standpoint, and how in-circuit test issues, such as access to test points, can be addressed.

Moving Toward the Zero-Defect Line

During the recent NEPCON South China exhibition in Shenzhen, Olivier Pirou, chief operating officer of Vi TECHNOLOGY, talks about achieving the perfect solder joint from the point of view of an inspection systems provider, and how manufacturers can strategize to achieve a zero-defect line.

Test Solutions Your EMS Partner Should Offer

When looking to outsource your manufacturing, you need to know that your chosen EMS partner has good test solutions in place so that they can produce consistent, high-quality products to your customers’ requirements. This article highlights the importance of test, and outlines the different types of test your EMS partner should offer.

Eight Factors a CEM Should Know About its Suppliers

Selecting a contract electronics manufacturer (CEM) that fits well with your outsourcing strategy can be a difficult and long process. But, by taking the time to research and investigate potential shortlisted partners, you are much more likely to reap the benefits further down the line.

RTW SMTAI: Mentor Eases Programming in Viscom Inspection Systems

Jesper Lykke, engineering manager for USA of Viscom AG, and Zac Elliott, technical marketing engineer at Mentor, speak with I-Connect007 Managing Editor Andy Shaughnessy about Viscom's adoption of the Valor Process Preparation and how it is helping users with their inspection programming.

RTW SMTAI: How Automation and Government Support Can Help Reshoring Drive

Alex Malek, vice president of sales and service for North America of SAKI, speaks with I-Connect007 Managing Editor Andy Shaughnessy about how automation and government investment can help bring back manufacturing jobs from overseas.

RTW SMTAI: MIRTEC on Staying Ahead of the Curve

Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.

Verification of Inspection Results: Local, Central, Global?

With the need for flexibility in production processes amid increasing globalized manufacturing strategies, manufacturers should consider powerful inspection tools that not only provide central verification of numerous lines in local and overseas production sites, but also with a comprehensive presentation of inspection results.


X-Ray Inspection of Lead and Lead-Free Solder Joints

As aerospace companies consider the shift to lead-free solder alloys and glues, concerns have been raised about whether their current X-ray inspection and quality-control procedures will still be valid. With lead solder, joints are easily interpreted by the operator or the system imaging software because lead provides excellent image contrasts due to relatively high X-ray absorption compared to that of PCB and component materials. Will this hold true as they shift to lead-free solder compounds?

Assembly Training and Education

Even if your PCB assembly process is optimized, there is always room for improvement. And no matter how successful your company has been in the past, you just can’t rest on your laurels. It is always in your best interest to strive towards a better operations model. We've created a survey to help us gauge the importance of training and education in your workforce, and the benefits that you get in ensuring that your operators and engineers have the most current knowledge and skill sets.

High-Volume Test Strategies

In an interview with I-Connect007 during the recent NEPCON China event in Shanghai, Siegmund Hornig, director of global sales for Europe and Asia, for production board test division at Teradyne discusses the new testing demands from customers, and strategies to help them address their high-volume test requirements.

Koh Young Discusses Latest 3D AOI Innovations

Koh Young Technology's Scott Kim, overseas sales team manager, talks about the latest challenges and developments happening in inspection technologies, the new demands and requirements from customers, as well as the key factors to consider when it comes to buying inspection systems.

AOI Capabilities Study with 03015 Components

More EMS companies are implementing AOI into their SMT lines to minimize repair costs and maintain good process and product quality, especially for new component types. This project focuses on the testing of 03015 components, which is challenging for AOI.

3D Inspection is the Way to Go

In an interview with SMT Magazine during NEPCON China, Guido Bornemann, head of sales in Asia for Viscom, discusses how inspection technology is keeping up with the latest requirements and demands from customers. He also explains why 3D technology is the best inspection technology to utilize in electronics assembly.

Saki Discusses Industry 4.0 and True 3D Technology

Quintin Armstrong, general manager for North America Sales and Service at Saki America, speaks to SMT Magazine about the Industry 4.0 strategy for inspection equipment providers. He also talks about why manufacturers are finding it more and more relevant to have an inspection line in their assembly lines now.

3D: Towards Better Inspection Capability

For this month's issue of SMT Magazine, we spoke with Mark McMeen, vice president of engineering at STI Electronics, to know more about the inspection challenges and requirements from an EMS provider's standpoint. We also talked with Jean-Marc Peallat, vice president of global sales at Vi TECHNOLOGY, to find out, from a supplier's perspective, how they are looking at these challenges and addressing them through their product development efforts.

2D X-ray Inspection With Materials and Thickness Identification

The need to inspect electronic components and assemblies non-destructively is the main driver behind the development of X-ray inspection technology. In many cases, X-ray inspection provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through-holes, TSVs, microbumps, and copper pillars.

The Need for 3D AOI

While the coplanarity of height-sensitive devices such as BGA packages and leaded components can be inspected in 2D using multi-angled colored lighting and side-angle cameras, these will be susceptible to an increase in false calls, a need for additional programming and cycle time, and possible escapes. These factors underscore the need for 3D technology in inspection strategies.


RTW NEPCON China: Viscom Talks 3D AOI Developments

Guido Bornemann, head of sales for Asia at Viscom, speaks with I-Connect007 Editor Stephen Las Marias about inspection challenges such as false calls and improving first pass yields. He also talks about the latest developments in 3D AOI to address these issues as well as test strategies to achieve zero defects.

Assembly of Flexible Circuits

No matter the method, the assembly of electronic flexible circuits is tedious because of its inherent flexible nature. Therefore, we must give extra attention to the assembly process. This article details some of the key considerations when assembling flexible circuits.

Successful, Long-Term Growth at Prime Technological Services

Publisher Barry Matties sat down with Prime Technological Services CEO Greg Chesnutt at IPC APEX EXPO, to glean how they continue to find success and have been able to maintain such an impressive growth rate over the last four years.

Goepel electronic Talks Test and Inspection Innovations

Thomas Wenzel, managing director of the Embedded JTAG Solutions Business Development at Goepel electronic, discusses the latest technology innovations happening in the test and inspection segment, and the market trends shaping them.

RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions

Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.

RTW IPC APEX EXPO: Mirtec Discusses Latest Developments in Inspection Technologies

Mirtec President Brian D’Amico talks about the latest in 2D and 3D AOI and SPI, and how to provide smaller users with affordable high-technology systems. He also talks about the sales success of the MV-6 OMNI series in-line full-3D AOI machine, which features advanced features such as 15-megapixel top-down camera and 3D digital multi-frequency Moire.

RTW IPC APEX EXPO: CyberOptics' Subodh Kulkarni Discusses Ultra-High-Resolution AOI

Dr. Subodh Kulkarni discusses the new bleeding-edge AOI technology CyberOptics has developed that will advance vision technology to a level not achievable today. MRS technology combines accuracy with speed, which have been mutually exclusive in the past.

RTW IPC APEX EXPO: 3D AOI Update With MEK

Henk Biemans of MEK Europe discusses with I-Connect007 Editor Andy Shaughnessy their latest developments in 3D AOI, and their efforts to educate their customers about this growing market.

What’s Driving the Rapidly Changing Electronics Assembly Industry

Since the EMS landscape has become so competitive, staying on top of new advances in technology and being able to rapidly adapt to changing customer needs, market demands, trends and technological advances is critical. This article highlights some examples of how electronics assembly technology developments have impacted the EMS industry in recent years and will likely continue shaping the industry in the future.

Continuous Improvement in Electronics Manufacturing

With so many variables and "opportunities" to create waste, electronics manufacturing services (EMS) companies have an on-going challenge to identify, address and then eliminate inefficient processes. This is where a continuous improvement approach can help.


Reflections on 40 Years of Test and Measurement and What Lies Ahead

Dr. James Truchard, President, CEO, and Cofounder of National Instruments, has penned his reflections on the last 40 years driving and leading some of the greatest progress and innovations the test and measurement industry has seen. In the article, he also leaves us with his thoughts on how he envisions the future to be.

Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability

Lead free solder joint reliability in drop shock loading has been a recurring issue in mobile and handheld consumer electronics. Changing solder composition may offer an opportunity to improve joint drop reliability. This study focuses on different failure modes in circuit board assemblies as observed based on solder composition, board surface finish, and solder joint volume.

Successful Sales Strategies

At the recent NIDays 2016 event in Singapore, Matej Krajnc of National Instruments speaks with I-Connect007's Stephen Las Marias about the challenges for sales and marketing executives in the electronics manufacturing industry, effective sales strategies, and key attributes of a sales person. He also shares his outlook on some of the key technology trends for next year.

Boundary Scan Meets Functional Test

This article discusses some fundamental aspects of the combination of boundary scan and functional test, as well as new technological solutions for embedded functional tests and their practical implementation.

The Impact of Vias on PCB Assembly

Via technology has been one of the solutions to address the miniaturization and component density challenges in current electronic assemblies. However, vias are not without their own set of challenges. As per our recent survey, these include impedance matching, routing, placement of vias, minimum size limitations, aspect ratio, and the limitations for the PCB manufacturer.

Increasing Reliability through Predictive Analysis

At SMTA International 2016, Joe Russeau of Precision Analytical Laboratory discusses with I-Connect007's Patty Goldman the paper he was presented, which was co-authored by Mark Northrup and Tim Estes. The paper presents early data comparing the results of two different analytical test methods to determine how well they correlate with each other as predictors of PC board cleanliness and reliability.

Koh Young Talks AOI Landscape and Trends

During the recent NEPCON South China tradeshow in Shenzhen, Thomas Lau, sales manager for Southeast Asia at Koh Young Technology Inc., speaks with I-Connect007's Stephen Las Marias about the challenges and developments happening in the AOI sector.

Real Time with… SMTAI: Merger Puts Libra Industries in Driver's Seat

W. Scott Fillebrown, CTO of EMS firm Libra Industries, talks with I-Connect007’s Andy Shaughnessy about Libra’s acquisition of ACD last year, their migration to common platforms and systems, and how their latest equipment installations have helped improved efficiency and throughput in their manufacturing lines.

Real Time with... SMTAI: Mirtec’s Brian D’Amico Discusses Benefits of 3D Inspection Technologies

Brian D'Amico, president of Mirtec, discusses with I-Connect007’s Andy Shaughnessy why more and more manufacturers are adopting 3D inspection technologies, such as 3D AOI and 3D SPI systems. He also mentions the increasing use of very small components—such as the 0201s and 01005s—and the advent of the 03015s.

Digital X-Ray—For More Than Inspection

At the recent SMTA Ohio Expo, Sheri Martin, sales manager at YXLON, spoke with I-Connect007's Patty Goldman about her company, their digital X-ray system, and the value of joining such trade events, and the benefits of using X-ray when it comes to failure analysis.


Standardizing Platforms from Characterization to Production

Over the past decade, the intense focus to reduce the cost of testing has produced a significant shift from using turnkey automated test equipment to building in-house and cost-optimized testers based on off-the-shelf instrumentation. This shift to a custom tester approach has been a large factor in the success of modular instrumentation platforms in the electronics manufacturing industry. This article explains why.

Case Study: Flex Smart Factory at Fuyong

This paper discusses Flex's experience with their current project called Smart Factory, which is being implemented at their Fuyong facility in Shenzhen, China. It also highlights some of the benefits they have achieved, including traceability, improved productivity and quality, and minimized defects through process predictability.

The Industry Speaks

In the latest issue of SMT Magazine, we take a pause from covering the latest technology trends, challenges, and solutions in the electronics manufacturing and assembly industry. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points when it comes to their respective specialties.

Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with SAT

Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. This article reports a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.

Event Review: 7th Electronic Materials and Processes for Space Workshop

This year's Electronic Materials and Processes for Space Workshop discussed a wide range of technology issues and developments when it comes to PCB fabrication and assembly for space applications. From addressing reliability issues to dealing with cracks that may form during thermal cycling, to REACH regulations and their impact on space hardware, and tin whisker growths. Barrie Dunn provides the highlights.

Condensation Testing—A New Approach

While the characterization of coating performance under high humidity conditions is detailed in well accepted IPC and IEC standards, the performance and testing under condensing conditions is not so well developed. This article talks about a new approach that has been developed where the test board is mounted on a substrate whose temperature can be independently controlled without changing the ambient condition.

Perfect Placement of Connectors and Pins: 3D Measurement of Swash Circumference and Embedment Depth

Manufacturers are faced with steadily increasing miniaturization and higher packing density in PCB assemblies. Packing densities, in particular, repeatedly create challenges in terms of testability, especially when high components such as connectors are fitted in close proximity to other components. This article looks at different handling and testing requirements for connectors.

Addressing New Testing & Inspection Challenges

NK Chari, marketing director for manufacturing technologies at the Electronic Industrial Solutions Group of Keysight Technologies, talked about the challenges in PCBA testing and inspection, tougher requirements for testing, and the need for functional testing. He also mentioned some best practices to consider to improve the PCBA testing and inspection process.

Case Study: Achieving Near-Perfect Reads of Data Matrix Codes in PCB Assemblies

The range of Data Matrix marking techniques and PCB materials means that the appearance of marks in PCB assemblies can vary dramatically from one situation to the next. In this case study, each PCB needs to be read at the time of solder inspection so the inspection results can be stored in a database. An integrated solution was developed to reduce the downtime required for opening the inspection machine and manually entering the labels of the PCB assemblies.

I-Connect Survey: Automation or Reducing Process Steps?

In our recent survey, we asked what is more important: automating a process or eliminating process steps. Interestingly, the results are 50-50: half of our respondents say automating a process is more important, while the remaining 50 percent consider eliminating a process step a key strategy.


Improving Test and Inspection

In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.

SPI Parameter Considerations for Tighter Tolerances

In an interview with SMT Magazine, Vi Technology’s Jean-Marc Peallat and Chong Choon Hee speak about the solder paste inspection challenges when it comes to tighter tolerances and finer lines and pitches in board assemblies, and the latest innovations happening in the SPI space to help customers address these issues.

3D Solder Joint Reconstruction on SMD Based on 2D Images

Solder joint inspection has been a critical issue for quality control, mainly due to their specular reflections. AOI systems have been faced with the same difficulty for solder inspection. This paper presents an algorithm for 3D solder joint reconstruction, which gives 3D analysis capability to the traditional 2D AOI equipment, practically without increasing the financial cost and with no cycle time impact, bringing 2D AOI equipment back into the game of SMT technology.

Solder Paste Exploration

From the manufacturers of solder pastes, to equipment makers, all the way to the solder paste inspection guys, and the electronics assemblers who are using their products, I talked to the supply chain to find out what’s going on in the solder paste printing process, what factors impact the process, the challenges, and the best practices to consider to be able to address those challenges and improve efficiencies and yield in the SMT line.

RTW IPC APEX EXPO: Introbotix Highlights HF Tech for Nondestructive Testing

Brian Butler, president and CEO of Introbotix, speaks with I-Connect007 guest editor Bob Neves about using high-frequency test technology for insertion loss testing. He also talks about the HDP User Group and its current activities and initiatives.

Enabling Process Innovation through Test and Measurement Solutions

In an interview with I-Connect007, National Instruments Managing Director Matej Kranjc discussed how their platforms are enabling the development of intelligent systems of systems that help users make smarter business decisions, and how big data analysis is enabling process innovation in the electronics assembly line.

Taking the Gremlins Out of Your Process

Every step in your assembly line is supposed to be designed to perform optimally for you to have an efficient, reliable, robust and reproducible process. However, and as isolated as they may seem, "gremlins" sometimes appear and mess up the results of a batch. The latest issue of SMT Magazine features strategies that can help you address these issues.

IPC APEX EXPO: Mirtec's D'Amico Speaks on How 3D AOI Tackles SMT Inspection Challenges

Brian D'Amico, president of Mirtec, speaks with I-Connect007 guest editor Bob Neves about the inspection challenges in the SMT industry amid the continuing trend towards smaller devices and components, and how 3D AOI is helping manufacturers address these issues.

Design for Test in the U.S. Market

With most high-volume printed circuit assembly being sent outside the United States, we have a unique challenge for testing the lower volume/high turnover assemblies domestically. However, with a little planning and the right contract manufacturer (CM), test does not need to be an issue.

Evaluating the Tripod as an Alternative Cross-Sectioning Method

One alternative method for cross-sectioning SMT and PCB-related architectures is using a tripod fixture. In this article, Steve Ring of Foresite Inc.discusses the advantages of using this method in analyzing SMT and PCB sections.


The Road Less Traveled (Part 3): Why Process Controls and Pride Matter

In the last piece of this three-part article series, Zentech Manufacturing Inc.'s Judy Warner writes about the importance of SMT process controls and pride of ownership, and how having them as part of the company culture can lead to manufacturing and service excellence and success.

Medical EMS: Opportunities Abound

Megatrends such as the increasingly ageing population and growing demand in emerging economies worldwide bode well for the medical electronics assembly industry. However, challenges such as margin pressures, compliance costs and risks, supply chain instability, and new product introduction headaches are hindering a more aggressive prognosis of the industry. But, with innovation, medical manufacturers can churn out more.

Top 10 Factors to Consider When Selecting a Medical EMS Company

Once the decision has been made to use an EMS company, selecting the right one involves several steps. Although most EMS companies perform the same basic services, every EMS company is different. In this article, Mo Ohady and David Estes of Digicom Electronics write the 10 key factors to consider when selecting your medical EMS company.

Medical Electronics: Manufacturing Vitals

With the rapidly growing aging population, rising healthcare costs and increasing health awareness, opportunities abound in consumer medical devices, diagnostics, imaging, and instrumentation. However, the medical electronics industry is not without its own set of challenges. The January 2016 issue of SMT Magazine highlights the manufacturing challenges and opportunities in this growing sector.

Saki Takes 3D Inspection to the Next Level

Eddie Ichiyama, general manager of Saki Europe GmbH and Saki Prague, discusses Saki's new 3D AOI and X-ray inspection equipment, the global inspection marketplace, and the move to reduce or eliminate the human interface. He also talked about their R&D center in the Czech Republic and its activities in the region.

Saki America Wants to Dominate the Inspection Marketplace

At SMTAI, I-Connect007's Andy Shaughnessy spoke with Quintin Armstrong, general manager for North American sales and service with Saki America. Quintin discussed Saki’s 3D and X-ray inspection equipment and the company’s expansion around the globe, as well as the inspection challenges his customers face every day.

Managing Big Data from an Analog World

In the age of big data, hardware is evidently no longer the limiting factor in acquisition applications. How do we store and make sense of data? How do we keep them secured? How do we future proof them? These questions become compounded when systems evolve to become more complex, and the amount of data required to describe those systems grow beyond comprehension. More advanced tools will be essential to managing this explosion of data and help engineers make informed decisions faster.

The New Industrial Era

Key transformative technologies such as big data, analytics, and IoT are ushering in a new industrial era, where new technology forces and innovations are changing the dynamics, risks, and success factors for global manufacturing companies. To be successful in this environment, a mindset shift is required when it comes to deciding what to do and how to take your manufacturing operations to the next level.

Inspection Innovations to Reduce Cycle Time

Viscom's Guido Bornemann discusses with I-Connect007's Stephen Las Marias the impact of AOI on cycle time, as well as the latest technologies in AOI—such as combining different types of inspection, as well as having integrated communications between different inspection points in a line—that can help customers reduce their inspection time.

Cycle Time Reduction in the Eye of AOI

In our survey for this month’s topic for SMT Magazine—cycle time reduction—inspection was identified as one of the key issues highlighted by respondents as a bottleneck in their manufacturing process when it comes to cycle times. I spoke with Norihiko Koike, COO of Saki Co. Ltd, to get his insights on this, and how his company is helping their customers address the issue. He also talked about the future technology developments that we can expect in the AOI industry.


Surface Mount Technology Association—a New Milestone

With a grand mission, SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. The organization delivers the right information at the right time to empower the workforce, who collectively advances technology, innovates new products, and serves the global industry.

The Need for Speed

I was recently invited to judge the editor’s choice award at National Instrument’s 2015 NI Engineering Impact Awards—ASEAN Regional Contest, and there was one project that I found relevant to our topic for this month’s issue of SMT Magazine. Developed by Gatepacific Circuits Inc., the project improved the process of dispensing paste compared to the manual process done by human operators, and increased the throughput from 500 units to more than 1,000 units.

Automotive Electronics Driving Innovations in Test

Boon Khim Tan, general manager of the Measurement Systems Division at Keysight Technologies, discusses with I-Connect007’s Stephen Las Marias the increasingly challenging test requirements in the automotive electronics space and the latest trends driving innovation in the sector.

Addressing the Need for Reliable, Accurate Inspection Results

Nori Koike of Saki Corp. discusses with I-Connect007’s Stephen Las Marias how the latest trends in the automotive electronics space is driving the developments in AOI technology, and the biggest challenges when it comes to providing solutions targeted at the automotive electronics industry.

Technica’s Annual Tech Forum a Success

Co-sponsored by ASM Assembly Systems, with active participation from Koh Young Technology and Rehm Thermal Systems, Technica USA's Annual Technology Forum Event held last July 22–23 in San Jose, California, was again a success. The event featured technical presentations and demonstrations on stencil printing, SPI, SMT placement defects, as well as the challenge in complex boards with 03015 parts up to large components.

How Automotive Electronics are Driving AOI Developments

Jens Kokott, head of AOI systems at GOEPEL Electronic, discussed with I-Connect007's Stephen Las Marias the increasing need for continuous development of testing technologies to cater to the innovations happening at breakneck speed in the automotive electronics industry.

A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing

Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. This article will illustrate the use of strain gauge testing and finite element analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods.

Material Considerations for Advanced Driver Assistance Systems Assembly

Added complexity in material selection comes from the ever-increasing array of applications in automotive electronics, and one of the newer applications is the deployment of an array of vision and detection systems for driver assistance, collectively known as advanced driver assistance systems (ADAS).

Saki Discusses AOI Innovations

Norihiko Koike, COO at Saki Co. Ltd, discussed with I-Connect007's Stephen Las Marias some of the latest 3D AOI technologies at the company, and how these are providing their customers easier programming and more reliable inspection.

What’s Driving Automotive Electronics?

Despite optimistic forecasts surrounding the automotive electronics industry, challenges remain, driven by the high level of complexity of devices and electronics being built into cars and the harsh operating conditions that these products are expected to operate in. Find out how equipment suppliers and automotive OEMs and EMS providers are addressing these issues in the September 2015 issue of SMT Magazine.


Acceptance Testing Of Low-Ag Reflow Solder Alloys (Part 2)

In Part 2 of this two-part article series, the authors discussed the test results for low-silver alloys using these solder paste alloy assessment protocols for BGAs and leaded components, and the impact of the alloys on printed circuit assembly process windows.

NEPCON Shenzhen 2015 Puts Spotlight on China's EMS Industry

From ODM and OEM to EMS, the Chinese electronics manufacturing industry is transforming from single, passive processing to active, intelligent manufacturing—in line with the "Made in China 2025" plan, as well as the latest trends happening in the electronics industry.

ROSE – What Does the Data Mean and When Is It Useful?

Profound changes in the processes and materials used in the electronic assembly industry have a significant impact on the usefulness of ROSE testing. This article will discuss what ROSE test results really mean and when they are—and more importantly, are not—useful.

Pad Cratering Susceptibility Testing with Acoustic Emission

Pad cratering is difficult to detect by monitoring electric resistance since it initiates before an electrical failure occurs. This article presents the results of pad cratering susceptibility of laminates using the acoustic emission method under four-point bend and compares the AE results to the pad-solder level testing results.

Color Logical Analysis Approach for LED Testing in Manufacturing

The complexity of test development for LED test and long LED test execution times in production are big challenges faced by the PCB manufacturing industry. This paper introduces a color logical analysis methodology to achieve zero additional test development and no extra test execution time.

EIPC Summer Conference, Berlin: Day 1

Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.

Characterization of Solder Defects in Package-on-Package with AXI Systems for Inspection Quality Improvement (Part 2)

In Part 2 of this two-part article series, the authors discuss the highlights of AXI with planar computer tomography (pCT), as well as present the results of their experiments on AXI 5.

Characterization of Solder Defects in Package-on-Package with AXI Systems for Inspection Quality Improvement (Part 1)

As solder joints in a PoP device cannot be inspected by optical means, X-ray inspection mostly is the only way to assure their quality nondestructively. The first installation of this two-part article series describes a series of studies on automated X-ray inspection (AXI) technology to quantify solder defects in a three-level Package-on-Package (PoP) device.

Inspection: The Last Line of Defense

Traditionally a non-value-added step, inspection is still the best, last line of defense against defects and a bad reputation. In this interview by I-Connect007 Publisher Barry Matties, Viscom’s Guido Bornemann discusses the true value of inspection and how to best use the tools to prevent defects, including head-in-pillow, from being shipped to customers.

In-Circuit Pin Testing: An Excellent Potential Source of Value Creation

In-circuit pin testing (ICT) is a common method of inspecting electronic assemblies to measure the effectiveness of the assembly process and to predict electrical functionality. In this article, Mitch Holtzer talks about ICT and how its accuracy can bring significant competitive advantage to assemblers. He also provides an example of doing ICT in an assembly.


Acoustic Surface Flatness of Components and Boards

Plastic packaged ICs, including BGAs, may experience warping as a result of processing. This article talks about using acoustic micro-imaging tools to measure and map the flatness of the top surface of a BGA package where warping may occur.

In-line Solder Penetration Testing with 3D X-ray Inspection

Although through-hole technology can be considered the oldest assembly technology in the field of PCB manufacturing, it still has its place even in this modern age of surface-mounted technology. To this end, through-hole components were devised for automatic assembly and for high thermal loads in the furnace, which led to the birth of through-hole reflow.

Test Match: Partnering Specialist Boundary-Scan with ICT

Devices like BGAs with inaccessible pins restrict the coverage possible using ordinary flying probe testing. Augmenting flying probe with boundary-scan can help overcome this problem, as well as deliver additional valuable benefits.

In 3D Inspection, Can 'Length = Height' Mean No Escapes?

During the recent NEPCON China show in Shanghai, I interviewed Kobi Ventura of ALeader Europe, an Israeli-Chinese joint venture with ALeader Vision Technology Ltd., which focuses on SPI and AOI inspection equipment. All of the machines are built in a state-of-the-art factory in Guangdong, China. Utilizing a unique length-equals-height modeling approach to inspection, Kobi states that they offer 100% escape-free technology, and it comes with a guarantee.

High-Density Interconnect and Embedded Board Test

Consumers’ insatiable demand for feature-packed, thin, lightweight, and energy-efficient devices is spurring the need for HDI technology. With new electronic functions constantly being integrated into a SoC encapsulated in a less than 0.5 mm pitch array package, the future looks bright for embedded board test (EBT).

Final Test Solution of WLCSP Devices

The common back-end process flow for mobile WLCSP devices is a single- or dual-insertion test at wafer probe. Since there is no final test prior to tape and reel, this equipment typically needs to provide a 5-side device inspection to identify potential device damage from sawing. The inspection efforts are quite demanding, with defect recognition requirements in the range of only 10 to only 20 microns, resulting in frequent time and cost intense human interaction and support requirements.

A Look at Saki’s Approach to 2D, 3D and X-ray Technology

At NEPCON 2015, I-Connect007 Publisher Barry Matties sat down with Nori Koike, COO of Saki Japan, to discuss the latest demands for 3D and their approach to inspection. With more than 20 years of experience, they have built a line-up of tools that covers the inspection spectrum. Koike also stresses the importance of using inspection data as a tool to improve and automate the process.

A Look at the Latest Demands for Flying Probe Testing

Publisher Barry Matties sat down with Seica GM Barbara Duval at the recent NEPCON China show to discuss Seica’s approach to the flying probe markets. Duval also shared some of the latest customer demands on test companies and the test market outlook in Europe and North America, in addition to China, which looks like it will see growth in 2016.

CyberOptics: Honing in on the High-Reliability Market with 3D AOI and SPI Platforms

I-Connect007 Publisher Barry Matties and CyberOptics’ Sean Langbridge spent time together in China recently, where they discussed, among other things, the company’s newest product launch, a 3D AOI and SPI platform. Langbridge also discusses the latest requirements for inspection.

Solving Inspection Problems with True 3D in AOI, AXI and SPI Systems

SAKI America's family of true-3D inspection systems cover the whole spectrum of SPI, AOI and AXI tasks. Quintin Armstrong explains how the unique resolution capability of their AXI achieves 100% detection of head-in-pillow defects.


SJIT, Solder Joint Integrity Test, To Find Latent Defects in Printed Wiring Board Assembly

Capacitance method and IEEE 1149.1 or boundary scan method are often used to find opens between component leads and pads on a printed wiring board. These methods, however, can find complete opens or complete shorts only; and latent defects that can be complete defect after several years have not been found by the conversational method. This article talks about a method to find such latent defects by using 4-wire small resistance measurement technique.

JOT Automates Final Testing of Smart Wearables

JOT Automation automates the final testing of smart wearables for an enriched end-user experience and shortens the time-to-market in the highly competitive market. JOT G3, known as an all-in-one final tester for smartphones, also enables fully automatic tests on wearables like smartwatches in a repeatable and reliable environment.

Rework Challenges for Smartphones and Tablets

The implementation of surface-mount devices is crucial for smartphone manufacturers, offering increased component density and improved performance. Mobile products generally use an epoxy underfill to adhere components to the PCB to meet the mechanical strength requirements of a drop test. Reworking glued components is the most difficult application in the electronics industry, and must be addressed as a process.

Forensics Uncovers Elusive Defects & Saves PCB Designs

Products and their supporting PCBs and packages have shrunk so much that it is considerably challenging to detect extremely small problems. But a forensic approach can help you uncover defects that traditional methods may miss says NexLogic's Zulki Khan.
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