Mentor and Seica Partner for Data Prep and Testing Big Boards
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.
More Than Inspection: It’s Process Improvement
Barry Matties speaks with Brian D’Amico, president of MIRTEC, about the current state of machine-to-machine communication in the industry, and how the inspection company is interfacing with the different manufacturing languages currently available to gather predictive data and feedback from every inspection step to eliminate future defects.
Top 10 Most-Read SMT007 Articles of 2018
Every year, we like to take a look back at the most popular SMT007 news, articles, interviews, and columns. These are the top 10 most-read SMT007 articles from the past year. Check them out.
AOI Programs with a Magic Click
Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.
Tempo Automation's Open House Raises the Curtain in San Francisco
Based in San Francisco, Tempo Automation specializes in rapid PCB assembly and on low volume production for a wide range of board complexities. It recently held an open house at its brand-new facility in the South of Market (SoMa) district—which is normally restricted under customer non-disclosure agreements as well as International Traffic in Arms Regulations (ITAR) regulations—to customers, vendors, local designers, and government officials.
Challenges and Opportunities with CFX
Larry Chen, global marketing supervisor at Taiwan-based Test Research Inc. (TRI), speaks about how the company is supporting IPC’s Connected Factory Exchange (CFX) initiative, the user interest on the standard, the challenges, and his outlook for CFX.
CFX: Building the Foundation for Industry 4.0
IPC has been showcasing the Connected Factory Exchange (CFX) initiative in action at the many industry events this year, providing a technical demonstration operating in real time with standardized machine data delivered from participating exhibitors through the cloud and onto visitors' cellphones. In this interview, Dave Bergman, VP for international relations at IPC, discusses the latest developments with IPC’s CFX standard, including key highlights, impact in the electronics assembly industry, and what’s next.
Meet Goepel electronic's New Managing Director, Alice Göpel
In August 2018, Alice Göpel took over the managing director position of Goepel electronic, replacing her father Holger Göpel who had managed the company since 1991. In this interview with SMT007, Alice discusses her career, what inspires her, and her outlook for the industry.
RTW NEPCON South China: Mycronic Discusses Industry 4.0
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.
Inspection and Design for Testability
In an interview with I-Connect007, Matthias Müller of Goepel electronic talks about about test and inspection technologies, especially in the automotive industry. He discussed design for testing (DFT) and the benefits technologists can gain from DFT. He also mentioned about the increasing need for 3D SPI, as well as why X-ray inspection has become very important now for the automotive, military, and aerospace industries.
Best Practices to Achieve Zero Defects
To ensure that a complex electronics build can be completed on time, on budget and with zero defects, here is a list of checks and balances that will help you with adjustments or corrections real time, instead of discovering them at the end of the build or worse, when it's already arrived at the end user.
Aegis on CFX and Hermes Efforts
The Connected Factory Exchange (CFX) specification is truly revolutionizing the PCB industry. Michael Ford, from Aegis Software, met with I-Connect007's Barry Matties for an interview during the SMT Hybrid Packaging show in Nuremberg, Germany, to discuss the impact of this collaborative effort, and how it differs from the Hermes Standard.
Dave Bergman on IPC and CFX
The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.
5G Requires a New Approach to Testing
The industry will be deploying 5G at millimeter wave frequencies between 28 and 40GHz, with significantly wider bandwidths than the current instrumentation. And the rules about how you design a test fixture, or conduct testing of those products is changing. In this article, National Instrument's David Hall explains.
Conversation with… Keysight: Challenges and Opportunities in Testing 5G
Roger Nichols, 5G program manager at test and measurement provider Keysight Technologies Inc., discusses the opportunities that 5G will enable, the many challenges facing electronics manufacturers when it comes to 5G, and how they are helping the industry address these issues.
Elements to Consider on BGA Assembly Process Capability
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.
RTW IPC APEX EXPO: Inspection Technology Developments
Brian D'Amico, president of Mirtec Corp., speaks with I-Connect007 Technical Editor Pete Starkey about the challenges of miniaturization, increasing component density, and the shadowing of small components by taller ones, and how Mirtec has developed its inspection technology to ensure they remain at the leading edge.
Vehicle Electrification: Disrupting the Automotive Industry and Beyond
Around the globe, governments are announcing mandates that will bring about the demise of the internal combustion engine. China has led the charge by requiring 8% of new vehicles on the road to be “new energy” or zero emission vehicles in 2018, up from the current 2–3% on the road today. Similar strong government regulations limiting the future of the internal combustion engine have passed around the world, and the importance and growth of the hybrid and fully electric automobile industry can’t be overstated.
What's the Scoop? APEX CFX Showcase
The IPC Connected Factory Exchange (CFX) demo at the recent IPC APEX EXPO 2018 trade show in San Diego, California, is a great example of industry collaboration. The CFX Showcase at APEX had 245,000 CFX website page views; 701,200 CFX messages transmitted; and 664.5 million bytes of data exchanged; and the whole thing was pulled together in a matter of weeks. Here's what the participants in the program have got to say.
Mycronic Announces the Acquisition of Vi TECHNOLOGY
Mycronic recently announced the acquisition of Vi TECHNOLOGY, with the intent of combining VIT’s inspection technology with Mycronic’s jetting capabilities. In an interview with I-Connect007, Olivier Pirou, Managing Director of VIT, discusses more about the merger and how this will help VIT contend in such a competitive environment.
The Importance of Product Testing for Quality, Reliability and Durability
One really vital piece of the product development process is product testing for quality, reliability and durability. You need to find out whether your product will do what it's supposed to do—that's quality. You also need to learn whether it will do what it's supposed to do over and over again, even when conditions aren't ideal—that's reliability and durability.
Mirtec Succeeding Through Inspection Innovation
David Bennett, president of Mirtec Europe, speaks with I-Connect007 Technical Editor Pete Starkey about the company's latest inspection technologies, the challenges that miniaturization can bring, and Mirtec's efforts to stay on the leading edge and never be a “me too” company.
Industry 4.0 and the Platform-Based Approach to Testing
Chandran Nair, the vice president for Asia Pacific at National Instruments, explains how the Industry 4.0 vision will change electronics manufacturing. He discusses key technology enablers that would drive the evolution of manufacturing processes, and how a platform-based approach can help improve test and measurement.
Koh Young Europe Ready for Next Year, and Beyond
Harald Eppinger, managing director of Koh Young Europe, speaks with I-Connect007 Managing Editor Andy Shaughnessy about the demands of the European market, the company's long-standing success with its solutions, and the future of Koh Young Europe.
Solder Printing Process Inputs Impacting Distribution of Paste Volume
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.
Video from productronica 2017: YXLON Moves Away from One-Size-Fits-All Approach
Keith Bryant, global director for electronics sales at YXLON International, speaks with I-Connect007 Technical Editor Pete Starkey about their latest X-ray inspection machines that are designed as a specific fit for its own market sector. He also talks about what's state of the art right now in X-ray inspection systems, as well as updates on the progress of the integration of SMART Group into the SMTA.
Video from productronica 2017: Mycronic Discusses Precision Jetting Systems
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.
Video from productronica 2017: Goepel Highlights Updates on X-Line 3D In-line System
At productronica 2017 in Munich, Germany, Goepel electronic's Andreas Turk, head of AXI Systems, explains the latest enhancements to their X-Line 3D in-line system for high-end inspection. He also discusses the benefits of the Stingray Detector option.
Dealing with Vias-in-Pad
Screaming Circuits, a division of EMS firm Milwaukee Electronics, specializes in short-run, one-off, and prototype PCB assembly. In an interview with SMT Magazine, Duane Benson, CTO of Screaming Circuits, talks about the challenges when dealing with microvias and vias-in-pad from an assembly standpoint, and how in-circuit test issues, such as access to test points, can be addressed.
Moving Toward the Zero-Defect Line
During the recent NEPCON South China exhibition in Shenzhen, Olivier Pirou, chief operating officer of Vi TECHNOLOGY, talks about achieving the perfect solder joint from the point of view of an inspection systems provider, and how manufacturers can strategize to achieve a zero-defect line.
Test Solutions Your EMS Partner Should Offer
When looking to outsource your manufacturing, you need to know that your chosen EMS partner has good test solutions in place so that they can produce consistent, high-quality products to your customers’ requirements. This article highlights the importance of test, and outlines the different types of test your EMS partner should offer.
RTW SMTAI: Mentor Eases Programming in Viscom Inspection Systems
Jesper Lykke, engineering manager for USA of Viscom AG, and Zac Elliott, technical marketing engineer at Mentor, speak with I-Connect007 Managing Editor Andy Shaughnessy about Viscom's adoption of the Valor Process Preparation and how it is helping users with their inspection programming.
RTW SMTAI: MIRTEC on Staying Ahead of the Curve
Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.
Verification of Inspection Results: Local, Central, Global?
With the need for flexibility in production processes amid increasing globalized manufacturing strategies, manufacturers should consider powerful inspection tools that not only provide central verification of numerous lines in local and overseas production sites, but also with a comprehensive presentation of inspection results.
Assembly Training and Education
Even if your PCB assembly process is optimized, there is always room for improvement. And no matter how successful your company has been in the past, you just can’t rest on your laurels. It is always in your best interest to strive towards a better operations model. We've created a survey to help us gauge the importance of training and education in your workforce, and the benefits that you get in ensuring that your operators and engineers have the most current knowledge and skill sets.
High-Volume Test Strategies
In an interview with I-Connect007 during the recent NEPCON China event in Shanghai, Siegmund Hornig, director of global sales for Europe and Asia, for production board test division at Teradyne discusses the new testing demands from customers, and strategies to help them address their high-volume test requirements.
Koh Young Discusses Latest 3D AOI Innovations
Koh Young Technology's Scott Kim, overseas sales team manager, talks about the latest challenges and developments happening in inspection technologies, the new demands and requirements from customers, as well as the key factors to consider when it comes to buying inspection systems.
3D Inspection is the Way to Go
In an interview with SMT Magazine during NEPCON China, Guido Bornemann, head of sales in Asia for Viscom, discusses how inspection technology is keeping up with the latest requirements and demands from customers. He also explains why 3D technology is the best inspection technology to utilize in electronics assembly.
3D: Towards Better Inspection Capability
For this month's issue of SMT Magazine, we spoke with Mark McMeen, vice president of engineering at STI Electronics, to know more about the inspection challenges and requirements from an EMS provider's standpoint. We also talked with Jean-Marc Peallat, vice president of global sales at Vi TECHNOLOGY, to find out, from a supplier's perspective, how they are looking at these challenges and addressing them through their product development efforts.
2D X-ray Inspection With Materials and Thickness Identification
The need to inspect electronic components and assemblies non-destructively is the main driver behind the development of X-ray inspection technology. In many cases, X-ray inspection provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through-holes, TSVs, microbumps, and copper pillars.
RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
What’s Driving the Rapidly Changing Electronics Assembly Industry
Since the EMS landscape has become so competitive, staying on top of new advances in technology and being able to rapidly adapt to changing customer needs, market demands, trends and technological advances is critical. This article highlights some examples of how electronics assembly technology developments have impacted the EMS industry in recent years and will likely continue shaping the industry in the future.
Reflections on 40 Years of Test and Measurement and What Lies Ahead
Dr. James Truchard, President, CEO, and Cofounder of National Instruments, has penned his reflections on the last 40 years driving and leading some of the greatest progress and innovations the test and measurement industry has seen. In the article, he also leaves us with his thoughts on how he envisions the future to be.
Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability
Lead free solder joint reliability in drop shock loading has been a recurring issue in mobile and handheld consumer electronics. Changing solder composition may offer an opportunity to improve joint drop reliability. This study focuses on different failure modes in circuit board assemblies as observed based on solder composition, board surface finish, and solder joint volume.
Successful Sales Strategies
At the recent NIDays 2016 event in Singapore, Matej Krajnc of National Instruments speaks with I-Connect007's Stephen Las Marias about the challenges for sales and marketing executives in the electronics manufacturing industry, effective sales strategies, and key attributes of a sales person. He also shares his outlook on some of the key technology trends for next year.
The Impact of Vias on PCB Assembly
Via technology has been one of the solutions to address the miniaturization and component density challenges in current electronic assemblies. However, vias are not without their own set of challenges. As per our recent survey, these include impedance matching, routing, placement of vias, minimum size limitations, aspect ratio, and the limitations for the PCB manufacturer.
Real Time with… SMTAI: Merger Puts Libra Industries in Driver's Seat
W. Scott Fillebrown, CTO of EMS firm Libra Industries, talks with I-Connect007’s Andy Shaughnessy about Libra’s acquisition of ACD last year, their migration to common platforms and systems, and how their latest equipment installations have helped improved efficiency and throughput in their manufacturing lines.
Real Time with... SMTAI: Mirtec’s Brian D’Amico Discusses Benefits of 3D Inspection Technologies
Brian D'Amico, president of Mirtec, discusses with I-Connect007’s Andy Shaughnessy why more and more manufacturers are adopting 3D inspection technologies, such as 3D AOI and 3D SPI systems. He also mentions the increasing use of very small components—such as the 0201s and 01005s—and the advent of the 03015s.
Digital X-Ray—For More Than Inspection
At the recent SMTA Ohio Expo, Sheri Martin, sales manager at YXLON, spoke with I-Connect007's Patty Goldman about her company, their digital X-ray system, and the value of joining such trade events, and the benefits of using X-ray when it comes to failure analysis.
Case Study: Flex Smart Factory at Fuyong
This paper discusses Flex's experience with their current project called Smart Factory, which is being implemented at their Fuyong facility in Shenzhen, China. It also highlights some of the benefits they have achieved, including traceability, improved productivity and quality, and minimized defects through process predictability.
The Industry Speaks
In the latest issue of SMT Magazine, we take a pause from covering the latest technology trends, challenges, and solutions in the electronics manufacturing and assembly industry. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points when it comes to their respective specialties.
Perfect Placement of Connectors and Pins: 3D Measurement of Swash Circumference and Embedment Depth
Manufacturers are faced with steadily increasing miniaturization and higher packing density in PCB assemblies. Packing densities, in particular, repeatedly create challenges in terms of testability, especially when high components such as connectors are fitted in close proximity to other components. This article looks at different handling and testing requirements for connectors.
Addressing New Testing & Inspection Challenges
NK Chari, marketing director for manufacturing technologies at the Electronic Industrial Solutions Group of Keysight Technologies, talked about the challenges in PCBA testing and inspection, tougher requirements for testing, and the need for functional testing. He also mentioned some best practices to consider to improve the PCBA testing and inspection process.
I-Connect Survey: Automation or Reducing Process Steps?
In our recent survey, we asked what is more important: automating a process or eliminating process steps. Interestingly, the results are 50-50: half of our respondents say automating a process is more important, while the remaining 50 percent consider eliminating a process step a key strategy.
Improving Test and Inspection
In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.
3D Solder Joint Reconstruction on SMD Based on 2D Images
Solder joint inspection has been a critical issue for quality control, mainly due to their specular reflections. AOI systems have been faced with the same difficulty for solder inspection. This paper presents an algorithm for 3D solder joint reconstruction, which gives 3D analysis capability to the traditional 2D AOI equipment, practically without increasing the financial cost and with no cycle time impact, bringing 2D AOI equipment back into the game of SMT technology.
Solder Paste Exploration
From the manufacturers of solder pastes, to equipment makers, all the way to the solder paste inspection guys, and the electronics assemblers who are using their products, I talked to the supply chain to find out what’s going on in the solder paste printing process, what factors impact the process, the challenges, and the best practices to consider to be able to address those challenges and improve efficiencies and yield in the SMT line.
Taking the Gremlins Out of Your Process
Every step in your assembly line is supposed to be designed to perform optimally for you to have an efficient, reliable, robust and reproducible process. However, and as isolated as they may seem, "gremlins" sometimes appear and mess up the results of a batch. The latest issue of SMT Magazine features strategies that can help you address these issues.
IPC APEX EXPO: Mirtec's D'Amico Speaks on How 3D AOI Tackles SMT Inspection Challenges
Brian D'Amico, president of Mirtec, speaks with I-Connect007 guest editor Bob Neves about the inspection challenges in the SMT industry amid the continuing trend towards smaller devices and components, and how 3D AOI is helping manufacturers address these issues.
Design for Test in the U.S. Market
With most high-volume printed circuit assembly being sent outside the United States, we have a unique challenge for testing the lower volume/high turnover assemblies domestically. However, with a little planning and the right contract manufacturer (CM), test does not need to be an issue.
Medical EMS: Opportunities Abound
Megatrends such as the increasingly ageing population and growing demand in emerging economies worldwide bode well for the medical electronics assembly industry. However, challenges such as margin pressures, compliance costs and risks, supply chain instability, and new product introduction headaches are hindering a more aggressive prognosis of the industry. But, with innovation, medical manufacturers can churn out more.
Top 10 Factors to Consider When Selecting a Medical EMS Company
Once the decision has been made to use an EMS company, selecting the right one involves several steps. Although most EMS companies perform the same basic services, every EMS company is different. In this article, Mo Ohady and David Estes of Digicom Electronics write the 10 key factors to consider when selecting your medical EMS company.
Medical Electronics: Manufacturing Vitals
With the rapidly growing aging population, rising healthcare costs and increasing health awareness, opportunities abound in consumer medical devices, diagnostics, imaging, and instrumentation. However, the medical electronics industry is not without its own set of challenges. The January 2016 issue of SMT Magazine highlights the manufacturing challenges and opportunities in this growing sector.
Saki Takes 3D Inspection to the Next Level
Eddie Ichiyama, general manager of Saki Europe GmbH and Saki Prague, discusses Saki's new 3D AOI and X-ray inspection equipment, the global inspection marketplace, and the move to reduce or eliminate the human interface. He also talked about their R&D center in the Czech Republic and its activities in the region.
Saki America Wants to Dominate the Inspection Marketplace
At SMTAI, I-Connect007's Andy Shaughnessy spoke with Quintin Armstrong, general manager for North American sales and service with Saki America. Quintin discussed Saki’s 3D and X-ray inspection equipment and the company’s expansion around the globe, as well as the inspection challenges his customers face every day.
The New Industrial Era
Key transformative technologies such as big data, analytics, and IoT are ushering in a new industrial era, where new technology forces and innovations are changing the dynamics, risks, and success factors for global manufacturing companies. To be successful in this environment, a mindset shift is required when it comes to deciding what to do and how to take your manufacturing operations to the next level.
Cycle Time Reduction in the Eye of AOI
In our survey for this month’s topic for SMT Magazine—cycle time reduction—inspection was identified as one of the key issues highlighted by respondents as a bottleneck in their manufacturing process when it comes to cycle times. I spoke with Norihiko Koike, COO of Saki Co. Ltd, to get his insights on this, and how his company is helping their customers address the issue. He also talked about the future technology developments that we can expect in the AOI industry.
Surface Mount Technology Association—a New Milestone
With a grand mission, SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. The organization delivers the right information at the right time to empower the workforce, who collectively advances technology, innovates new products, and serves the global industry.
Technica’s Annual Tech Forum a Success
Co-sponsored by ASM Assembly Systems, with active participation from Koh Young Technology and Rehm Thermal Systems, Technica USA's Annual Technology Forum Event held last July 22–23 in San Jose, California, was again a success. The event featured technical presentations and demonstrations on stencil printing, SPI, SMT placement defects, as well as the challenge in complex boards with 03015 parts up to large components.
NEPCON Shenzhen 2015 Puts Spotlight on China's EMS Industry
From ODM and OEM to EMS, the Chinese electronics manufacturing industry is transforming from single, passive processing to active, intelligent manufacturing—in line with the "Made in China 2025" plan, as well as the latest trends happening in the electronics industry.
EIPC Summer Conference, Berlin: Day 1
Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.
Inspection: The Last Line of Defense
Traditionally a non-value-added step, inspection is still the best, last line of defense against defects and a bad reputation. In this interview by I-Connect007 Publisher Barry Matties, Viscom’s Guido Bornemann discusses the true value of inspection and how to best use the tools to prevent defects, including head-in-pillow, from being shipped to customers.
In-line Solder Penetration Testing with 3D X-ray Inspection
Although through-hole technology can be considered the oldest assembly technology in the field of PCB manufacturing, it still has its place even in this modern age of surface-mounted technology. To this end, through-hole components were devised for automatic assembly and for high thermal loads in the furnace, which led to the birth of through-hole reflow.
In 3D Inspection, Can 'Length = Height' Mean No Escapes?
During the recent NEPCON China show in Shanghai, I interviewed Kobi Ventura of ALeader Europe, an Israeli-Chinese joint venture with ALeader Vision Technology Ltd., which focuses on SPI and AOI inspection equipment. All of the machines are built in a state-of-the-art factory in Guangdong, China. Utilizing a unique length-equals-height modeling approach to inspection, Kobi states that they offer 100% escape-free technology, and it comes with a guarantee.
High-Density Interconnect and Embedded Board Test
Consumers’ insatiable demand for feature-packed, thin, lightweight, and energy-efficient devices is spurring the need for HDI technology. With new electronic functions constantly being integrated into a SoC encapsulated in a less than 0.5 mm pitch array package, the future looks bright for embedded board test (EBT).
Final Test Solution of WLCSP Devices
The common back-end process flow for mobile WLCSP devices is a single- or dual-insertion test at wafer probe. Since there is no final test prior to tape and reel, this equipment typically needs to provide a 5-side device inspection to identify potential device damage from sawing. The inspection efforts are quite demanding, with defect recognition requirements in the range of only 10 to only 20 microns, resulting in frequent time and cost intense human interaction and support requirements.
A Look at Saki’s Approach to 2D, 3D and X-ray Technology
At NEPCON 2015, I-Connect007 Publisher Barry Matties sat down with Nori Koike, COO of Saki Japan, to discuss the latest demands for 3D and their approach to inspection. With more than 20 years of experience, they have built a line-up of tools that covers the inspection spectrum. Koike also stresses the importance of using inspection data as a tool to improve and automate the process.
CyberOptics: Honing in on the High-Reliability Market with 3D AOI and SPI Platforms
I-Connect007 Publisher Barry Matties and CyberOptics’ Sean Langbridge spent time together in China recently, where they discussed, among other things, the company’s newest product launch, a 3D AOI and SPI platform. Langbridge also discusses the latest requirements for inspection.
SJIT, Solder Joint Integrity Test, To Find Latent Defects in Printed Wiring Board Assembly
Capacitance method and IEEE 1149.1 or boundary scan method are often used to find opens between component leads and pads on a printed wiring board. These methods, however, can find complete opens or complete shorts only; and latent defects that can be complete defect after several years have not been found by the conversational method. This article talks about a method to find such latent defects by using 4-wire small resistance measurement technique.