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BOM: The Path to Managing Parts
09/24/2021 | Nolan Johnson, I-Connect007
Siemens Global Webinar: Data-Driven Manufacturing in the Electronics Industry
09/22/2021 | Pete Starkey, I-Connect007
BOMs and the Supply Chain from an Assembler's Point of View
09/22/2021 | Nolan Johnson, I-Connect007
A Multi-Tenant PLM Software Solution
09/20/2021 | Nolan Johnson, I-Connect007
Review: Emerging Opportunities for Additive Electronics
09/15/2021 | Pete Starkey, I-Connect007
SMT :: Suppliers
Leveraging Data Analytics in Recall Scenarios
Minimize the impact of product recalls by using smart data to uncover the root cause. One of the most effective ways to minimize the impact of a recall is to define the root cause of the defect quickly and accurately, thereby minimizing the number of products that need to be recalled. For example, if a defect is related to a specific spike in temperature on the production line, only products that were produced during the spike need to be recalled: the rest of the products are not impacted.
NovaCentrix Expands Solder Capabilities
Stan Farnsworth of NovaCentrix discusses how the company has expanded into electronics manufacturing in the past year with its photonic curing and soldering tools.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Last week was “APEX Week” and, unsurprisingly, the most popular news this week was APEX related (with one outlier, of course!) This week, the top five items you should follow lean strongly toward APEX interviews focusing on future trends. Remember, this year APEX offers on-demand access to the papers, presentations, events, keynotes, and forums. You can even register for post-show access.
Solder Paste Innovations and Low-Temperature Assembly
Paul Salerno, MacDermid Alpha's Global Portfolio Manager SMT Assembly Solutions, discusses no-clean pastes designed to maximize electrochemical reliability with fine-pitch, low-standoff components and describes latest innovations in ultra-low-temperature soldering technology.
The Laser World is Rapidly Developing
Stephan Schmidt, LPKF president, discusses the LPKF laser 14x20” depaneling system. The company is also introducing automatic handling solutions, helping to fill the gap in automated SMT manufacturing lines.
Balver Zinn Group Mourns Loss of Managing Director Gregor Jost
It is with deep sorrow that Balver Zinn Josef Jost GmbH & Co. KG says goodbye to its managing director, Dipl.-ing. Gregor Jost.
Real Time With… Premium Sponsors Share ‘Top 5 Things You Need to Know’
As part of I-Connect007’s coverage of the IPC APEX EXPO 2021, four premium sponsors share their knowledge and expertise in the following categories.
Top 10 Most-Read SMT Articles of 2020
As 2020 comes to a close, the I-Connect007 Editorial Team takes a look back at its most read articles. Here are the top 10 reads in SMT from the past year.
The Test Connection’s Bill Horner Remembered
Bill Horner, the founder of The Test Connection Inc. and a well-respected engineer, passed away on September 21, 2020. He was 81 years old.
electronica Virtual 2020: Automotive Conference Keynotes
While not the same as battling with the traffic to catch the early flight to Munich, followed by an S-Bahn into the city and a crowded U-Bahn to the Messe, electronica 2020 went virtual. Pete Starkey details the Automotive Conference—an event he was particularly keen to attend.
Just Ask Paul: Automotive and Lead-Free Solders
We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Greg Smith in our “Just Ask” series. Now, MacDermid Alpha Electronics Solutions’ Paul Salerno gets a chance to answer a question. Paul Salerno is a global portfolio manager for SMT applications focused on the automotive and consumer market segments. He holds a bachelor’s degree in materials engineering as well as an MBA in finance and marketing from Rutgers University.
Real Time with… SMTAI 2020: Full List of Interviews With Industry Leaders
The virtual SMTA International Electronics Exhibition took place on September 28–30, and I-Connect007 is here to provide you with comprehensive coverage of the event. We’ve assembled the full list of show-related interviews from before, during, and after SMTAI 2020 with the industry’s top executives, engineers, and managers—all without leaving your office. Visit Real Time with… SMTAI 2020 to view our video series, photo gallery, and more.
Real Time with… SMTAI 2020: Reflections on the Technical Conference
This year’s SMTA International Conference and Exposition went virtual! Pete Starkey explains how the SMTA team did a fine job in difficult circumstances to present an interactive show and technical conference. Here, he highlights four of the papers that particularly caught his interest.
Real Time with… SMTAI 2020: Technical Conference Review
SMTAI 2020, which was converted to a virtual event, took place from September 28–30. I attend every year, but since there was no keynote in the virtual format, I went straight to the technical conference. This event covered a broad range of topics related to everything in assembly. Over 90 technical presentations are available, but this report covers just some of the sessions I attended.
Real Time with...SMTAI 2020: MacDermid Alpha’s Single-Step Metalization Paper
Nolan Johnson talks with MacDermid Alpha Electronics Solutions about a new process for filling through-holes with copper in a single step. Carmichael Gugliotti, the primary author and an applications specialist, and Richard Bellemare, director of electrolytic metalization, address why this new process matters and what’s in Gugliotti’s technical paper presentation for SMTAI.
Real Time with...SMTAI 2020: MacDermid Alpha’s Flash Etching Electroplating Paper
I-Connect007’s Nolan Johnson catches up with Sean Fleuriel, a chemist for MacDermid Alpha Electronics Solutions, and Richard Bellemare, director of electrolytic metalization, to discuss the SMTAI technical paper presented by Fleuriel, titled, “Pit Resistant Acid Copper Electroplating Process for Flash Etching.” Fleuriel and Bellemare highlight the challenges, processes, and conclusions from the paper, as well as which PCB fabricators are most likely to benefit from this new process.
Organizational and Team Management in Times of Change
Ross Berntson, president and COO of Indium Corporation, shares his perspective, thoughts, and lessons learned on managing his global organization as Indium Corporation responds to health issues, market demand shifts, and organizational change. This interview was conducted in May 2020.
Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview
The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.
Burak Aksoy: An Update on DOWSIL EA-3838 Fast Adhesive
On June 10, Nolan Johnson spoke with Burak Aksoy, technical service and development scientist for Dow Silicones. Aksoy updated Johnson on the recent introduction of DOWSIL™ EA-3838, a fast-curing adhesive formulated for use in industrial manufacturing and assembly applications.
TQM: The Tyranny of the Urgent
The I-Connect007 editorial team recently spoke with Dr. Ron Lasky about what’s stopping companies from improving their processes, especially regarding productivity.
Ross Berntson: Indium Corporation’s Pledge for Safe Resumption Post-COVID
On May 20, Nolan Johnson spoke with Ross Berntson, Indium Corporation’s president and COO, about the company’s response to the COVID-19 outbreak. Berntson details the company's work with a consortium of manufacturing businesses in central New York state, developing a manufacturing pledge to keep people safe and keep factories running. Indium Corporation has been one of the frontrunners in formalizing such procedures and in sharing lessons learned among all the participating companies.
This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.
This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.
The Foundation of Industry 4.0
When adopting IoT solutions, start with three main considerations. First, assess which parts of the production cycle can be automated and/or monitored most effectively with IoT devices connected to an analytics platform. IoT technology should be matched to the production cycle of your operation.
SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come
SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.
Panasonic: From Hardware to Solutions and Data
In this video interview from the show, Managing Editor Nolan Johnson speaks with Sean Murray—director of sales, service, operations, and logistics process automation at Panasonic—about the company's focus on software and information management on top of their long history in hardware and equipment.
The Direction of MacDermid Alpha’s Automotive Initiative
Nolan Johnson speaks with Lenora Clark about MacDermid Alpha’s automotive initiative, where her role fits into the company’s focus on supporting carmakers in various business areas, and where the future of automotive is heading.
Siemens and Valor: Two Complementary DFM Technologies
Before IPC APEX EXPO kicked off, Andy Shaughnessy attended a Siemens seminar in San Diego on smart manufacturing for electronics and the integration of technologies from Siemens’ digital industry software and Valor. Afterward, Andy spoke with Andy Farrington, director of portfolio development for the Americas, about the event, as well as some of the hot topics and solutions that the speakers addressed.
EPTAC Preparing Young People for Future in Industry
In this video interview from the show, Guest Editor Kelly Dack and Leo Lambert, VP/technical director of EPTAC Corporation, describe the impact of internships and apprenticeships, the importance of IPC specifications, the effectiveness of certification.
MacDermid Alpha Electronics: Stronger With Kester Acquisition
In this video interview from the show, Technical Editor Pete Starkey and Tim Williams, VP of assembly solutions, discuss the structure and strategy of MacDermid Alpha Electronics Solutions, and how the company benefits from the Kester acquisition.
The Success of IPC’s STEM Student Outreach Program
The IPC Education Foundation (IPCEF) hosted its STEM Student Outreach Event on February 6 at IPC APEX EXPO in San Diego. Nine local high schools attended bringing 193 students and 30 educators from Mission Hills High School, Morse High School, North County Trade Tech High School, Saint Marcos High School, E3 Civic High School, Point Loma High School, Otay Ranch High School, Mount Miguel High School, Otay Ranch High School—Girls in STEM. Twice as many students were able to participate this year, and each participating high school received a $1,000 grant and soldering station to enhance STEM-related learning at their school.
Will Moisture Management Expand to the U.S. Market?
Rich Heimsch, Super Dry director, chats with Nolan Johnson about the growing demand for moisture management in North America versus its earlier adoption in Europe, and how moisture management fits into Industry 4.0 and the smart factory.
IPC: Automotive Electronics Segment Exploding
Electronics are increasingly being used in the design of new vehicles, driving IPC activities in standards development to help the industry adapt to building electronics better for the automotive industry. At IPC APEX EXPO 2020 we saw an increase in automotive content throughout the show which also provided opportunities for automotive OEMs and Tier1 suppliers to network.
IPC APEX EXPO 2020 Show Week Time-lapse Video
It was a busy week at IPC APEX EXPO in San Diego, and I-Connect007 was there to cover it all. From set-up to tear down, I-Connect007 captured a four-day time-lapse video of the show floor. We’d like to thank our good friends at MacDermid Alpha for letting us set up our camera in their booth.
Upcoming IPC APEX EXPO Offers Sessions on 5G
Dave Hoover of TTM discusses the Sessions @ the Intersection set for IPC APEX EXPO 2020—specifically, the two-part session he will host around the topic of 5G and materials.
CES: The Main Halls
CES 2020 is now over, and the next round of shows is underway (NAMM is also over now, IPC APEX EXPO is next week, followed by AWE and others). CES displayed electronics related to gaming, monitors, computers, smartwatches, TVs, vehicles, cellphones, etc. However, the effect on the industry and the way we live will be felt until the next CES. The largest and most influential participants are usually found at the Las Vegas Convention Center.
The IPC Education Foundation’s New Column
The IPC Education Foundation’s new column with I-Connect007 will feature Charlene Gunter du Plessis, Aaron Birney, and Corey Lynn. These IPC Education Foundation members will share updates on programs and activities here. Find out more about the authors below and read "Foundations of the Future" in the SMT007 Week Newsletter.
Foundations of the Future: Get More Engaged in 2020
Since the inception of the IPC Education Foundation in January 2019, the mission remains to create connections between electronics manufacturers and supply chain companies, academia and the emerging workforce. In this debut column, Charlene Gunter du Plessis describes plans for engaging in 2020, including scholarships and more, and the IPC APEX EXPO 2020 STEM Student Outreach event.
The Convergence of 5G and Automotive
Karthik Vijay is head of the applications engineering team for customers in Europe at Indium Corporation. He spoke with Barry Matties about what EMS or assemblers for automotive should consider, as well as how he thinks 5G will affect the marketplace and manufacturing.
UV-curable Materials and Conformal Coatings
Pete Starkey and Phil Kinner, global business and technical director, coatings division, Electrolube, discuss the characteristics and benefits of the company’s new UV-cured conformal coatings. Phil also describes the development of coatings for critical avionics applications and Electrolube’s collaboration with the U.K. National Physical Laboratory to establish a new condensation test.
A Walking Tour of Mycronic Equipment at productronica 2019
I-Connect007 pays a visit to the Mycronic booth at productronica 2019 in Munich, and Jeff Leal, product manager for Mysmart, takes us on a walking tour of just one of the lines on display at the show. Jeff takes us through a series of dispensing and conformal coating machines.
The Future of the World Is Truly in the Hands of Our Youth
At I-Connect007, we are proud to once again sponsor the STEM Outreach Program at the upcoming IPC APEX EXPO 2020. Another way we support our youth is by sharing the stories of young people who are doing amazing things. Dylan Nguyen is a great student, musician, and creative thinker. Recently, he shared with me the details of his school science fair project, “Kite: Powering the Future,” which solved a problem that he faced. Dylan is a leader with a bright future, and the world is lucky to have kids like him.
Reliability Testing in Automotive and Digital Factories
Barry Matties spoke with Gen3’s Andrew Naisbitt about what readers should know about SIR and CAF testing, what to consider if you’re thinking of bringing it in-house, and how reliability testing fits into automotive and the digital factory.
Indium Discusses New Materials and Plans for 2020
Editor Nolan Johnson sits down with Nash and Mackie to discuss Indium’s focus on creating innovative products for the 5G, automotive, semiconductor, and high-reliability segments. Mackie offers a preview of Indium’s plans for 2020 and beyond, including lead-free drop-in sintering materials that can be dispensed and printed more quickly than ever before.
Mirtec's Approach to Raw Data: The 'Sushi Principle'
Editor Pete Starkey and Brian D’Amico discuss the company’s new Alpha system, designed for the automotive market. D’Amico explains why Mirtec is focusing on providing customers with raw data instead of “cooked” data, what he terms the “sushi principle.” He says that the system is able to pick up tiny defects that would otherwise be filtered away if the system were not using raw data. D’Amico also discusses their use of artificial intelligence, and some of the possible benefits from using AI going forward.
LA/Orange County SMTA Expo and Tech Forum Review
Dan Feinberg recently attended the LA/Orange County SMTA Expo and Tech Forum, which was held in Long Beach, California. He provides an overview of the activities, from the show floor to the presentations.
Rehm Thermal Systems’ Three-mode Oven
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Michael Hanke, Chief Sales Officer for Rehm.
David Meyers on Digital Twin and ‘Cobots’
With over 30+ years in the industry, David Meyers recently took on a new role at Siemens as a global solutions director in the Electronics Industry team of Siemens Digital Industries Software, working on improving communications between CMs and their OEM partners. In a conversation with Nolan Johnson and Happy Holden, David speaks on the digital twin and virtual environment software that should help establish that communication early in the process.
Koh Young Europe Celebrates 16,000 Installed Systems
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. In this video interview, Editor Nolan Johnson and Harald Eppinger, managing director at Koh Young Europe, discuss the company’s milestone of 16,000 installed systems, the Zenith Alpha, and market trends in AOI systems.
Juan Arango on Koh Young’s New U.S. Headquarters
At a recent open house, Managing Director Juan Arango talks about his role in the company’s transition from their Arizona facility to a new headquarters located outside of Atlanta, Georgia. Juan details many of the benefits customers can expect, including brand new spaces dedicated to customer demos as well as training.
Discover the Benefits of a Technology Center
Nico Fahrner, application engineer at Rehm Thermal Systems, talks with Barry Matties about the benefits prospective customers get from being able to fully test their systems in-line at Rehm’s technology centers before purchasing.
Breaking the Stereotype: Millennials in Manufacturing
Goodwinds Composites is a company that I have watched grow from a small distributor serving the hobby industry to a full-fledged manufacturer serving many industries. Leland Holeman and his sister, Amelia Cook have worked together for the past 12 years to transform this company into a healthy business.
SMTAI 2019: Carmichael Gugliotti Discusses His First SMTAI Paper
Carmichael Gugliotti, process specialist at MacDermid Alpha Electronics Solutions, discusses his first STMAI paper presentation with Andy Shaughnessy. Gugliotti's paper focuses on periodic pulse plating of mid-aspect ratio PCBs.
SMTAI 2019: SAFI-Tech's No-Heat SAC305—A Possible Gamechanger
Ian Tevis is CTO and founder of SAFI-Tech, a startup focusing on SMT solutions. He explains how he founded SAFI-Tech right after college and details the benefits of the company's first product, No-Heat SAC305.
SMTAI 2019: MIRTEC's Newest Product Introduced at SMTAI
Brian D'Amico, MIRTEC president, updates Nolan Johnson on the healthy business environment on the show floor and the company's new product that was introduced at SMTAI. D'Amico also shares his view on industry challenges providing connectivity for smart factory productivity.
SMTAI 2019: KIC's New, Smart Factory Products
MB Allen, manager of applications and sales for KIC, and Karl Pfluke, regional sales manager, update Nolan Johnson on their new product announcement from earlier this year. They also address the company's ongoing work on smart factory products.
SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.
SMTAI 2019: Creative Electron's Mobile X-ray Van and LED-specialized Equipment
Nolan Johnson and CEO Bill Cardoso discuss Creative Electron's new equipment that specializes in LED applications and the company's X-ray van—the "mobile trade show" and demo platform.
Real Time with... SMTAI 2019 Video Interviews
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!
SMTAI 2019: Michael Ford on IPC-CFX and the Effects of Industry 4.0
Michael Ford, senior director of emerging industry strategy at Aegis Software, and Nolan Johnson discuss some of the long-term, global effects of Industry 4.0 and life beyond IPC-CFX.
SMTAI 2019: Juan Arango Discusses Koh Young America's New Headquarters
Andy Shaughnessy speaks with Juan Arango, managing director of Koh Young America, about their new corporate headquarters in Atlanta, Georgia, which is located near most of their U.S. customer base.
SMTAI 2019: Nir Benson Discusses Mentor's Challenges and Solutions
Nir Benson, business development manager at Mentor, a Siemens Business, talks with Andy Shaughnessy about his work to integrate the two companies' solutions, some of the challenges he sees, and his efforts to optimize their cloud-based systems.
SMTAI 2019: Kristen Mattson on the SMTAI Vacuum Reflow Systems Demo
Kristen Mattson, marketing principal at BTU International Inc., and Nolan Johnson discuss the vacuum reflow demo that's running on the show floor and the program with the American Competitiveness Institute where they have PYRAMAX vacuum reflow systems available for customer process evaluation.
SMTAI 2019: Happy Holden’s On-the-Scene Report
Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.
SMTAI 2019: Tom Forsythe on Cleaning Challenges and Solutions
Andy Shaughnessy speaks with Tom Forsythe, KYZEN executive VP, about the challenges created by continually increasing densities as well as some of the company's newest cleaning solutions.
Real Time with… SMTAI 2019 Slideshow
The SMTA International 2019 Conference and Exhibition closed last week on a high note. For those who were not able to attend the event, held at Stephens Convention Center in Rosemont, Illinois, the slideshow contains a selection of photos from the exhibition show floor as well as the conference.
SMTAI 2019: Lenora Clark Discusses Company Changes and Her New Role
Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Electronics Solutions (and co-organizer for the upcoming SMTA Additive Electronics Conference), and Nolan Johnson discuss her new role, recent company reorganization, and the synergies customers are seeing.
SMTA 2019 International Awards
The SMTA International conference—held September 22–29, 2019, at the Stephens Convention Center in Rosemont, Illinois—honored industry members with awards for their contributions to the industry. I-Connect007 has compiled an unofficial list of award recipients. The official list from SMTA will be released shortly, and I-Connect007 will publish it as soon as it is available.
Real Time with... SMTAI 2019 Videos Now Live
If you couldn't make it to SMTAI 2019, be sure to catch I-Connect007’s video interviews with the movers and shakers of the electronics industry. We’ve updated our video presentation for a better experience for our users, so check it out!
To Improve the Standards Process, Get Involved
Jan Pedersen, senior technical advisor at Elmatica, and Ray Prasad, president of Ray Prasad Consultancy Group, spoke with the I-Connect007 team about the current state of PCB standards and where the process might need improvements, including the many difficulties around transparency, slow updates, limitless numbers of variations, and a variety of other topics.
Solder Mask Evolves into a Truly Additive Process
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.
Selecting the Proper Flex Coverlayer Material
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.
eSMART Factory Conference 2019, Day 2
Happy Holden continues his report on the the eSMART Factory Conference Dearborn, Michigan, with highlights from the event's second day, which includes a keynote from Brian Toleno titled "Augmented Reality: Next-Generation Computing for Front-Line Workers."
Meet Our Newest Columnists From NCAB Group
Meet our newest I-Connect007 columnists from NCAB Group! Jeff Beauchamp, Ruben Contreras, and Harry Kennedy are field application engineers from NCAB Group's technical team. In their columns, they will explore fresh PCB concepts, including medical and telecommunications applications, topics related to RoHS, and much more.
Automated Conformal Coating of CCAs Using Polyurethane
The development of an automated circuit card assembly (CCA) conformal coating process using a low-outgassing polyurethane material was essential for meeting the increase in customer demand from 3,000 to 60,000 units per year.
Conformal Coating Processes and Trends
The I-Connect007 editorial team spoke with one of Nordson ASYMTEK’s conformal coating experts, Camille Sybert, to discuss where the coating industry is trending and, with the rise of Industry 4.0 and automation, how it is much less about providing the right applicator and more about addressing the entire conformal coating process.
Dispensing EMI Shielding Materials: An Alternative to Sputtering
Shielding electronic systems against EMI has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and SiP adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a PVD process of sputtering, leveraging front-end packaging technologies to back-end packaging applications.
Nano Dimension Details New DragonFly LDM
Dan Feinberg talks with Nano Dimension CEO Amit Dror about the new DragonFly LDM 3D printer technology announced by the Israeli company on July 24, 2019, aimed at increasing machine uptime and moving forward from prototyping to higher production volumes.
The Role of Parylene Conformal Coatings in Next-gen Electronics
Designers and manufacturers of electronics are under pressure to make packages smaller, lighter, and more environmentally friendly, while ensuring that their new technologies perform reliably in their operating environments. This article takes a closer look at Parylene conformal coatings and the role they can play in helping manufacturers address current and future challenges in the electronics industry.
Seven Key Steps to Selecting a New EMS Partner
Choosing to outsource your electronics manufacturing to an EMS provider requires careful planning and consideration. And even once you’ve made your decision, there may still be things that test you or that don’t go quite to plan. An experienced EMS partner has been there before; they understand the challenges, and they’ll be able to support you through the process to ensure you achieve your goals.
Conformal Coating Selection: Conventional vs. Two-part
As assemblies become more densely populated, and housing/casing designs become more permeable to save weight, the use of conformal coatings is essential to protect the assembly from its operating environment and ensure acceptable reliability for the application intended, especially when operating in hostile environments.
Recent Advances in X-ray Technology: SMTA Webinar Recap
Technical Editor Pete Starkey recently attended a webinar on advances in X-ray technology and its applications in the electronics industry, as presented by Keith Bryant, Chair of SMTA Europe, on behalf of SMTA India. Here are the highlights of the webinar.
The Exciting Details Behind IPC’s Pledge to America’s Workers
In the nine months since IPC joined in President Trump’s “Pledge to America’s Workers” and committed to creating 1 million new skilled workforce opportunities over the next five years – a fair question has been asked: Are we taking credit for actions we would have done anyway? Was this motivated by politics?
Advancement of SPI Tools to Support Industry 4.0 and Package Scaling
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.
While conformal coatings may have been something of an afterthought at the front of the design process, that can no longer be the case. Conformal coatings are now a critical part of any board assembly that might be subjected to challenging conditions. But coatings can also contribute to increased mean time between failure in any conditions, even environmentally controlled environments.
Words of Advice: Making Life Easier for Fabrication and Assembly
In a recent survey, we asked the following question: What steps do you take to make the job easier for your fabrication and assembly providers? Here are a few of the answers, edited slightly for clarity.
How Do I Get Smart With IPC CFX? (Part 1)
Today's assembly factories are seeing the biggest challenge to face the industry in a generation, called by many the next industrial revolution. However, in essence, the challenge is a simple extrapolation of trends that have been occurring and increasing in assembly manufacturing for decades. In Part 1 of this two-part article, Michael Ford writes about the history behind the drive for automation in the SMT assembly industry and where CFX fits in.
Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.
Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages
In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.
Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.
ICT or Flying Probe: Which Test Is Best for Your Assembly?
In-circuit test (ICT) and flying probe are two of the most popular types of automated test equipment (ATE) used in electronic printed circuit board assembly (PCBA).
Failures and Reliability in Soldering
The definition of failure is "the lack of success in doing or achieving something, especially in relation to a particular activity." If the activity is concerning a soldering process, such a failure can have a downstream impact far beyond the actual solder joint. In this regard, it is first necessary to understand what constitutes a good solder joint because appearance is too often deemed a success.
Size Matters: The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. And the question commonly asked is, "When should we switch from Type 3 to a smaller solder powder?" Read more to find out.
Low-Temperature SMT Solder Evaluation
Until recently, the use of Sn/Bi-based SMT solder materials has been investigated with negative consequences for high strain rate (drop-shock) applications; thus, these alloys have been avoided. Recent advances in alloy 'doping' have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.
Cavity Board SMT Assembly Challenges (Part 2)
This article describes the details of a study of assembling SiP BGA packages into a cavity. It points out the challenges involved in the board cavity design and assembly of components in a cavity. The authors discussed the board design challenge of having a cavity and defining the proper depth of the cavity to accommodate the board fabricator, the product design, and the SMT assembly.
Cavity Board SMT Assembly Challenges (Part 1)
The concept behind Component-in-Cavity (CiC) is straightforward. If the tallest component(s) on the motherboard can be placed into a recession created in the motherboard, their thickness relative to the components on the surface of the PCB will thus effectively be reduced. While this concept may be straightforward, its implementation is not. That implementation is the focus of this paper. Read on.
3D Optical Inspection Provides ‘Eyes’ for Process Improvements in Industry 4.0
Automated 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems have become an integral part of the printed circuit board assembly (PCBA) process because they help ensure high-quality production. As today’s board complexity is increasing, inspection technology has become even more critical.
Goepel electronic Solutions, Webinar Series, and Trends
Barry Matties catches up with Matthias Müller to chat about the wide range of test and inspection solutions currently being offered by Goepel electronic as well as the informative webinar series produced by the company to help further educate their customer base and promote technical discussion on a number of topics.
The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.
Reflow Your Solder and Your Data for Industry 4.0
I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned to the current dynamics in the industry, particularly Industry 4.0 and streamlining processes.
Laserssel Brings High-speed Soldering to New Application Areas
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.
4 Key Considerations When Auditing a New EMS Partner
Choosing whether (or not) to outsource your electronics manufacturing is likely to bring with it a multitude of questions—and some understandable doubts. Outsourcing is a critical decision—and it’s one that will rely on thorough research, close examination and the asking of some tough questions. This article summarizes four key areas that you'll want to scrutinize as you embark on your supplier selection process.
Minimizing Voids in Solder Joints
Dr. Hans Bell of Rehm Thermal Systems, Henryk Maschotta of Thales Deutschland GmbH, and Dr. Heinz Wohlrabe of TU Dresden presented the results of their project on reducing void content in the solder joints of land grid arrays (LGAs) at a soldering seminar during the Technology Days of the recent SMTconnect show in Nuremberg.
Synergy Between Smart Manufacturing and the Secure Supply Chain (Part 2)
With the trend of shortening lead-times within the material ordering process, and the frequency with which urgent orders for materials from the grey market are made, there is increased opportunity for the ingress of counterfeit materials. The situation is made far worse when a genuine shortage of materials in the supply chain occurs. The consequences of not being able to eliminate the risk of defects getting through into the market will be disastrous for individuals as well as for the company brand image, not to mention the associated costs of recovery. It is only a matter of time, unless something very significant changes.
Smart Factory Transitions Are Attainable—With a Plan
In a white paper, Zac Elliott, technical marketing engineer at Mentor, a Siemens company, outlines a structured organization for smart factory implementation. While there can be one set of challenges to overcome when building a smart factory on a greenfield site, firms restricted to pre-existing facilities face a different set of hurdles. In this interview, Elliott discusses how things have proceeded since the paper was published, and talks about strategies for smaller firms and brownfield companies.
Synergy Between Smart Manufacturing and the Secure Supply Chain (Part 1)
As MRP and ERP functions follow computing trends and start to migrate into the cloud, a fundamental question is being raised as to whether these are still the right tools to use in today’s modern Industry 4.0 driven factory, or whether these need to evolve, be enhanced, or even replaced in order to meet the more extreme requirements of operational flexibility, as well as cope with volatile material availability in the market.
Collaboratively Creating Wearable Medical Products
Patty Goldman, Barry Matties, and Happy Holden recently spoke with David Moody and Rich Clemente of Lenthor Engineering along with Anthony Flattery and Amit Rushi—their customers at GraftWorx. They discussed a recent project and how they worked together to solve a difficult problem by designing a rigidized flex circuit for their product.
Co-owner Philip Kazmierowicz on New Role as KIC President
KIC is one of the leaders in reflow and thermal process control and smart oven technologies. On March 25, 2019, KIC announced that Philip Kazmierowicz, company co-owner, would take on the position of president. Nolan Johnson took that opportunity to sit down with Kazmierowicz in his Oregon-based R&D lab to discuss KIC's history and his plans for the future of the company.
Five Key Questions Your EMS Partner Should Be Asking in the Supplier Selection Process
As we've continued to observe the impact of the ongoing global electronics components shortage, any challenge to the supply chain has the potential to cause major disruption. Whether you currently manage your own end-to-end electronics manufacturing, or you have opted to outsource to an EMS provider, there are five essential issues (and potential risks) to bear in mind when assessing the value and reliability of any proposed new supplier.
The Perfect Job
After all the days and weeks invested into developing the schematic, the PCB design, poring over the data sheets and online libraries for component parts, and running the calculations for mechanical clearances inside the enclosure, you—designers—are ready to be done. You're ready for the next design challenge—not for a week or so perfecting the bill of materials and the design notes. And there's the rub. Find out why.
Ralf Wagenfuehr on Developing Rehm Thermal Systems' RDS Semico Oven
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems, describes Rehm's new oven—the RDS Semico—and gives an in-depth analysis about how it was designed specifically with the semiconductor industry in mind. Ralf also discusses the semiconductor industry as a whole and outlines the company’s desire to gain market share in Taiwan and Korea in the upcoming year.
Cadence Design Systems Takes Tensilica to CES Show Floor
While roaming the aisles of CES, I happened across a suite hosted by Cadence Design Systems. It wasn’t a booth—just a quiet presence behind walls with demonstration hardware inside. Vic Markarian, senior group director for worldwide IP licensing and sales, explains why Cadence was at CES.
Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser-cut SMT Stencils (Part 1)
As innovation and demand continue to drive miniaturization in electronics, manufacturers face the constant challenge of assembling smaller and smaller components with repeatable processes and high yields. Stencil printing is the first step in the PWB assembly process, and improvements to the SMT stencil can significantly improve yields, especially for more challenging miniaturized products.
Lionrock Delivers Bendable, Industrial-grade Battery Tech
David Yeung, co-founder and CEO of Lionrock Batteries, discusses previous projects—including smartwatch straps—and his collaboration with the Nano and Advanced Materials Institute (NAMI) in Hong Kong on wearable, flexible battery technology at CES 2019.
Eileen Hibbler and Jason Emes on Improving the West Penn SMTA Chapter
At the recent West Penn SMTA Expo, Eileen Hibbler, a chapter support specialist at SMTA, and Jason Emes, the current president of the West Penn SMTA Chapter, discuss ways to improve meeting attendance and develop a new slate of chapter officers.
Innovative Battery and Pressure Sensor Technologies
Tracy Liu is the director of R&D of the Nano and Advanced Materials Institute (NAMI) in Hong Kong. In an interview with I-Connect007, Liu talked about NAMI and discussed a number of battery and pressure sensor technologies being developed by the institute for licensing.
Tips & Tricks: Water Contamination and Flux Expiry
Solder joints that form properly are not expected to exhibit reduced reliability. However, a higher number of defects created tends to lead to a higher chance that defective connections escape detection through inspection and functional testing, and that’s not a risk to be taken lightly.
DSG: Breaking Ground on the Smart Factory Revolution
Mauro Dallora leads the I-Connect007 team through the Dongguan Somacis Graphic (DSG) PCB Co. Ltd. facility in China, lays out the company’s strategy for becoming an Industry 4.0 smart factory, and explains the current ongoing major expansion. Read about various topics in this factory tour and interview.
A Working Definition of Automation
Automation in a working context means more than just automatic machinery. Machinery implies mechanization. Automation also means the system information directs and controls people, materials, and machines. This concept is also known as systemization. Therefore, automation is made up of two components: mechanization (material flow) and systemization (information flow). Find out more.
A Young Engineer’s Perspective
Jeffrey Diament, a recent Princeton University graduate and an engineering associate from sensor manufacturer Instrumems, talks about the company’s nanowire sensing platform that can measure velocity, temperature, and humidity. Being his first career job out of college, Diament discusses his experience on the hardware and manufacturing side of things and offers advice to other young professionals.
Tips & Tricks: Humidity Level for Electronics Assembly
Low relative humidity (RH) can allow for higher static charges to build on objects. It can also affect solder pastes, especially OR-class pastes, and this can reduce print performance and stencil life. Read on to find out what level of RH you need for your assembly facility.
Building a Smart Factory Supply Line
I-Connect007 recently toured Victory Giant Technology (VGT) Co. Ltd. in Huizhou, China—one of China’s largest PCB producers. Currently, VGT generates about US$500 million in annual sales, and have plans to reach $1.5 billion in the coming years. Read more to find out VGT's expansion plans and strategies for growth.
WPC's Standardized Cordless Power Solutions
Phoebe Francis, a Wireless Power Consortium (WPC) representative who works as a senior manager in the Dallas offices for Golin, a PR firm, provides a rundown on WPC and what it means for printed circuit manufacturing.
Tips & Tricks: Wave Solder Bridging
Wave solder bridging is the most difficult defect to troubleshoot because it has a number of potential causes. The key is to understand the role of flux during wave contact—thus reducing the surface tension of the solder to reduce the tendency to bridge between pins as the board leaves the wave.
Industrial Cybersecurity Needs to Be in Front of Regulators
Chris Humphreys, principal at Anfield Group, a cybersecurity firm consulting with numerous industrial and infrastructure clients, discusses cybersecurity, the dynamics of regulation, and the responsibilities that manufacturers have to the greater good above and beyond simply adhering to regulation.
Octane Open Concept Solution: Innovative Analytics and Floor-control Software
Octane Open Concept targets the contract manufacturer and is well along in the development process for a pair of software tools designed to optimize assembly and testing results tracking on the manufacturing floor. In an interview, CEO Craig Reiselt discusses the company and the products and opportunities in front of Octane.
Top 10 Most-Read SMT007 Articles for March
Starting this month, we will take a look back at the most popular SMT007 news, articles, interviews, and columns over the past 30 days. For the month of March, these are the top 10 most-read SMT007 articles. Check them out.
No Rest for the Weary: Supply Chain Pressures Are Here to Stay!
As we leave 2018 behind, it should be noted that the challenges faced by all consumers of electronic components in our industry this year have stretched teams both physically and mentally. We will continue to see pressures across the supply chain through 2019 and beyond, so there is no rest for the weary.
Impact of 5G
In our recent I-Connect007 survey on 5G, we asked the following question: "How do you think 5G will impact the electronics manufacturing industry?" Below are some of the replies, edited slightly for clarity.
Jennie Hwang: Get Ready for Disruptive Technologies
At IPC APEX EXPO 2019, Dr. Jennie S. Hwang, a columnist, author, and all-around an expert in PCB assembly, discusses some of the changes she has seen since joining the industry, and disruptive technologies that technologists we are going to have to face in the near future. Are you ready for the future?
CPCA Show and productronica China 2019 Review
It was a busy week in China for the electronics industry. With multiple trade shows and conferences going on simultaneously in Shanghai, including the CPCA Show 2019, productronica China, SEMICON China, electronica China, and FPD China, it appears from the crowds that the market is strong in the region.
Smart Factories: A Shift in Thinking
The components that make up the smart factory foundation are not new, at least not at a basic technological level. Factory automation still uses PLCs, sensors, robotics, etc. But two things are quite different today: governments and key industry players across the globe are striving for cleaner, greener factories for the sake of the environment; and the 21st century allows for interconnected, multifaceted use of the data available through all these sensors and robotics.
SMTA Europe Electronics in Harsh Environments Conference 2019: A Preview
As a prelude to this year's Electronics in Harsh Environments conference, which will be held on April 2–4, 2019 in Amsterdam, Netherlands, SMTA Europe chairman Keith Bryant, supported by technical specialist Bob Willis, showcased the challenges and key issues faced by design and process engineers worldwide, in a webinar entitled "Harsh Environment Failures—Causes & Cures."
Current Megatrends You Pay the Most Attention To
In our recent survey, we asked the following question: "What current megatrends do you pay the most attention to?" Below are some of the replies, edited slightly for clarity.
RTW IPC APEX EXPO 2019: Joining Materials with Laser Energy
Kelly Dack and General Manager Denis Barbini discuss Laserssel's laser soldering equipment. Laser soldering is presented as a solution to mitigate the effects of high heat processing on printed board substrates and components by pinpointing energy where it's needed to join the metals. He talks about the challenges that their customers usually face, and how they are helping them address those by optimizing their processes. He also mentioned their device that eliminate any type of warpage.
2019 IPC EMS Management Meeting Wrap-up
At the recent EMS Management Meeting during IPC APEX EXPO 2019, EMS leaders gathered to discuss issues critical to EMS providers today, including supply chain issues, customer contracts, labor optimization and talent shortages. The highlight of the day was a supply chain challenges panel and discussion featuring supplier, distributor, and end-user perspectives on addressing component supply and lead time challenges.
Rehm Focuses on International Hiring
Rehm Thermal Systems has been successfully recruiting skilled workers from abroad for some time now.
Blackfox on IPC Training and Certification and Mexico Expansion
Joel Sainz, sales manager for Blackfox Training Institute in Mexico, speaks with Guest Editor Osvaldo Targon about his company’s IPC training and certification services during IPC APEX EXPO 2019. Sainz also discusses their plans for expanding their reach in Mexico.
What Drives Your Optimism?
In our previous I-Connect007 survey, we asked the following question: "What drives your optimism?" Here are just a few of the replies, slightly edited for clarity.
RTW IPC APEX EXPO 2019: Standards Updates—IPC-7093 & IPC-7530
Ray Prasad, IPC Hall of Famer and chairman for multiple committees, gives Guest Editor Joe Fjelstad an update on two IPC standards: IPC-7093 on bottom-termination components (BTCs), and IPC-7530 progress with reflow characterization. Prasad talks about the many challenges in dealing with BTCs, including circuit/board design, manufacturing, voiding, connections (or lack thereof), warpage, and reliability. He also addresses no-clean flux and its challenges.
RTW IPC APEX EXPO 2019: iNEMI on Next-generation Soldering
Grace O’Malley, VP of technical operations at iNEMI, and Editor Nolan Johnson discuss the next-generation soldering buzz session workshop hosted by iNEMI at IPC APEX EXPO 2019 and the upcoming bi-annual technology roadmap that will be released this spring.
Nate Ramanathan on Choosing a Prototype Partner and Production Supplier
AEye, a developer of perception systems for autonomous vehicles, has transitioned from initial engineering development into the final design for production and manufacturing of very large quantities. In an interview with I-Connect007, Nate Ramanathan, VP of operations at AEye, speaks about the criteria and his perspective on selecting vendors.
RTW IPC APEX EXPO 2019: Aculon on Technology Developments and Partnership with Henkel
Aculon CEO Edward Hughes and Editor Pete Starkey discuss surface modification technologies based on nanochemistry. Of particular interest to electronics technologists are recent developments in waterproofing treatments for assemblies, and how Aculon's strategic partnership with Henkel opens up new opportunities.
Digi-Key’s Dave Doherty: Tweaking the Supply Chain
In an interview with I-Connect007, Digi-Key COO Dave Doherty discusses supply chain disruptions and shortages and shares a number of ways in which Digi-Key is helping to smooth out the delivery of components even with the current turmoil.
Advice to OEM System Designers
In our previous survey, we asked the following question: "What advice would you give an OEM system designer?" Here are just a few of the replies, slightly edited for clarity.
RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering
Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical. He talks about challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.
RTW IPC APEX EXPO 2019: Thermaltronics Discusses New Soldering Robot
Michael Gouldsmith, director of Thermaltronics, speaks with Editor Dan Feinberg about their new TMT-9800S robotic soldering unit. He also talks about an inline robotic soldering system—the next stage of their product development—which is scheduled to be released in the middle of the year.
Two Full CFX Demo Lines at IPC APEX EXPO 2019
During IPC APEX EXPO, Editor Dan Feinberg spoke with David Bergman, IPC VP of standards and technology, about CFX, IPC’s Connected Factory Exchange software for machine-to-machine communication. With more than companies now supporting CFX, IPC set up two full lines for demonstration at the show.
RTW IPC APEX EXPO 2019: MIRTEC Discusses Automation, CFX, and Sales Success
MIRTEC President Brian D'Amico speaks with I-Connect007 Guest Editor Dan Beaulieu about automation, the Connected Factory Exchange (CFX) standard, and their banner year last year. He speaks about Industry 4.0, automating the inspection process, and collecting more data to help refine the manufacturing process.
Stephanie Martin: Component Supply Challenges from the Catbird Seat
Vexos Senior Vice President for Global Supply Stephanie Martin gives the I-Connect007 editorial team a wide-ranging and insightful overview of the current parts supply situation from the perspective of procurement at a contract manufacturer.
How Inspection Improved the Manufacturing Process
In our previous survey, we asked how inspection has helped improve the manufacturing process. Here are just a few of the replies, slightly edited for clarity.
RTW IPC APEX EXPO 2019: Advanced 3D Solder Paste Inspection Technology
Olivier Pirou, managing director of Vi TECHNOLOGY, provides Joe Fjelstad with an overview of the company's advanced 3D solder paste inspection technology, featuring the ability to make corrections in real time. Pirou also talks about their efforts in strengthening their inspection systems.
RTW IPC APEX EXPO 2019: BTU Discusses New Solder Flux Reclamation Solutions
Bob Bouchard, corporate marketing manager at BTU International Inc., updates I-Connect007 Managing Editor Nolan Johnson on new solder flux reclamation solutions and details the new aqueous scrub methodologies, their increased ROI and efficiencies, and reduced maintenance.
Executive Forum on Advancing Automotive Electronics
Presented by IPC Hall of Fame Council, the Executive Form on Advancing Automotive Electronics, which aims to provide information on the complete supply chain for automotive electronics, featured 10 presentations on all facets of automotive electronics from materials, fabrication, and reliability testing to market information and future needs.
RTW IPC APEX EXPO 2019: Making Components Count
VJ Electronix is filling the void in pre-build component count verification challenges. Don Naugler, president and general manager, sits down with Guest Editor Kelly Dack to explain details of the machine, how it works, and who benefits from it.
RTW IPC APEX EXPO 2019: Manncorp Highlights Custom SMT Lines
Ed Stone, sales manager for Manncorp Inc., sits down with I-Connect007 Guest Editor Dan Beaulieu and discusses how they are helping customers with low- to medium-volume type production needs by installing custom SMT lines within 48 hours.
RTW IPC APEX EXPO 2019: LPKF on Benefits of Laser Depaneling
Laser technology marches on, and marching along with it is LPKF's new line of laser depaneling equipment. Stephan Schmidt, president, talks with I-Connect007 Guest Editor Kelly Dack about the many benefits of using lasers including cleanliness and higher yields through increased array density.
RTW IPC APEX EXPO 2019: Lenthor Discusses Facility Expansion and New Equipment
Rich Clemente, general manager of Lenthor Engineering, discusses with Dan Feinberg, I-Connect007 Guest Editor, the company’s expansion and new facility and equipment. He also talks about his outlook for the electronics manufacturing industry in North America.
RTW IPC APEX EXPO 2019: MacDermid Alpha Highlights Solutions to Combat Voids in Solder
Joe Fjelstad speaks with Paul Salerno, global portfolio manager at MacDermid Alpha Electronics Solutions, about their latest product and process solutions to combat voids in solder including modifications in pastes, preforms, and vacuum assist soldering.
RTW IPC APEX EXPO 2019: Comet Group's Lab One Facility in Silicon Valley
Joe Fjelstad speaks with Ken Burden, senior director of North American field service, and Craig Arcuri, business development, about Comet Group’s Silicon Valley-based Lab One customer center, which is a key resource for a variety of testing and inspection services, and also offers opportunities to collaborate with Comet Group's industry experts.
Award-winning Koh Young Process Optimizer
Joel Scutchfield, sales director with Koh Young America, discusses the company's outlook and new product offerings for 2019, including their Koh Young Process Optimizer (KPO), which won an award at IPC APEX EXPO 2019 for the process control software category.
Dan Schoenfelder: Searching for Parts in Real Time
The I-Connect007 editors recently sat down with Dan Schoenfelder, vice president of business development at Octopart. We discussed online parts libraries and the impact they can have on choosing parts based on availability data during the design process.
Improving the Efficiency of Your PCBA Production
Ensuring you're hitting your build times is always a major priority in surface mount production. The challenge for many OEMs, however, is that the processes involved with PCBA can be numerous and complex. And the smallest of details can make the biggest of differences.
RTW IPC APEX EXPO 2019: Electrolube Discusses Overcoming Secondary Cure Issues
Phil Kinner, technical director of Electrolube's coatings division, speaks with I-Connect007 Technical Editor Pete Starkey about how secondary cure issues with UV conformal coatings have been overcome and shows some typical examples.
RTW IPC APEX EXPO 2019: Enabling Complete Automation for Customers
Steve Williams and Saki CEO Norihiro Koike discuss Saki's AOI equipment and complete solution for electronic manufacturers, the industry-leading accuracy of their 3D equipment, and their recent Panasonic IoT certification to provide process data back to the pick-and-place equipment.
RTW IPC APEX EXPO 2019: Panasonic Highlights New Products, IPC STEM Student Outreach Program
Sean M. Murray, GM of North American Sales EAG Group for Panasonic, and Nolan Johnson, I-Connect007 Managing Editor, discuss two new product announcements at the show—PanaCIM process tracker software and MPM-WX—and being a sponsor for the IPC STEM Student Outreach Program.
Super Dry Storage Options to Manage Intermetallic Growth
Guest Editor Kelly Dack speaks with Richard Heimsch, director of Super Dry, about some of the differences between storing components and other materials for assembly floor storage versus long-term storage, and how Super Dry can help combat intermetallic growth.
Supply Chain in Crisis
In a traditional design flow, the project team tends to use the parts they already know and have footprints for—maybe a little long in the tooth, but known quantities, after all. Except these are not traditional times. Component supplies, prices, and lead times are in a great deal of turmoil. The automotive, IoT, and telecommunications sectors are vacuuming components out of the supply chain at a record pace, exerting influences like early obsolescence of older components and more.
RTW IPC APEX EXPO 2019: ASM Updates Mid-Level Machines
ASM CEO Americas Jeffery L. Timms and Technica President and CEO Frank Medina give Nolan Johnson a product update on ASM's mid-speed machines—EbySIPLACE and EbyDEK. By bringing key features from ASM's high-end products to their new mid-level models, ASM's new machines are gaining attention Timms and Medina discuss the how and why.
RTW IPC APEX EXPO 2019: KYZEN Intros New Aquanox Aqueous Cleaner
In an interview with I-Connect007 Technical Editor Pete Starkey, KYZEN Executive VP Thomas M. Forsythe introduces the latest member of the Aquanox family of aqueous cleaners and comments on issues of compatibility, rinsability, and consistency of operation.
RTW IPC APEX EXPO 2019: KIC Speaks on Data, Voiding and Traceability
Bjorn Dahle, president of KIC, talks with I-Connect007 Technical Editor Pete Starkey about how the industry has shifted its focus from the machine to data; the issue on voiding and how manufacturers can address this process challenge; and traceability.
RTW IPC APEX EXPO: OK International Soldering Robot Integrates CV Technology
Bryan Gass, vice president at OK International, talks with I-Connect007 Managing Editor Nolan Johnson about their new soldering robot that integrates their Connection Validation (CV) technology. Launched at the IPC APEX EXPO last year, the CV technology provided the company a springboard to have a good start into 2018, and to achieve growth throughout the year.
Benefits of Jet Printing Solder Pastes
In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.
RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.
The Sun Rises on IPC APEX EXPO 2019
It's sunrise on Monday in San Diego, and IPC APEX EXPO at the San Diego Convention Center is already abuzz with activity. The exhibition hall setup is on schedule to open for business tomorrow morning, January 29th, 2019.
Most Important Attributes of Customer Service
In a recent I-Connect007 survey, we asked what the most important attributes of customer service are. Understanding and meeting the customer's needs and expectations top the list, followed by quality of service, and on-time delivery.
Electrolube Overcomes Secondary Cure Issues with New UV-cured Conformal Coatings
Electrolube Managing Director Ron Jakeman and Marketing Manager Julia Vorley speak with I-Connect007 Technical Editor Pete Starkey about the successful outcome of the international collaboration between the company's R&D teams in the UK and China, which resulted in a brand-new range of solvent-free UV-cured conformal coatings about to be launched at the upcoming IPC APEX EXPO 2019.
Mark Friedman on IPC Membership
Mark Friedman, a member success advocate at IPC, recently spoke with I-Connect007's Barry Matties about the current status of IPC's membership programs, the recent growth they've seen, and some hidden benefits of IPC membership that potential members might not be considering.
STEM: The Future of Our Industry
Facing a growing shortage of talented labor with which to fill the employment positions in America, IPC is working to help solve this problem. Colette Buscemi, senior director of IPC’s education programs, is encouraging IPC members to better engage pre-college and post-secondary college students at the local level. Barry Matties spoke with Colette about the educational programs IPC has put in place to invest in future generations, including the STEM program at this year’s IPC APEX EXPO.
IPC APEX EXPO 2019 to Demo Operating CFX Line
A year on from their first demonstration, IPC’s Connected Factory Exchange (CFX) now nears the release of version 1.0 at this year’s upcoming IPC APEX EXPO. The I-Connect007 team spoke with CFX specialists Michael Ford and Dave Bergman about how far the program has come from the first initial public demo all the way through now becoming a published standard, and what users can expect from the demonstrations planned for the 2019 show.
Mentor and Seica Partner for Data Prep and Testing Big Boards
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.
The Future of the Customer Experience in Mobility
Based on the protocol stack that starts with 5G, moves up to AI, and continues to layer integrations and user interfaces and experiences on top of those lower-level technologies, how does this all apply to the current mobile experience? A panel on the future of mobility with representatives from several major companies covered this and more at CES.
Solder Paste Selection/Qualification
In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.
Shopping at IPC APEX EXPO: Evolutionary or Revolutionary Products?
As you're finalizing your shopping list, take a second to consider this: Are you in the market for products that are evolutionary or revolutionary? And what do those terms even mean for someone looking for new DFM software or a new pick-and-place machine?
Executive Forum at IPC APEX EXPO 2019 Focuses on Advancing Automotive Electronics
Senior-level executives from across the global electronics supply chain will gather to discuss opportunities and challenges facing the rapidly changing automotive electronics industry. With five expert speakers and a powerful keynote from GreenSource VP Alex Stepinski, registration will fill fast.
More Than Inspection: It’s Process Improvement
Barry Matties speaks with Brian D’Amico, president of MIRTEC, about the current state of machine-to-machine communication in the industry, and how the inspection company is interfacing with the different manufacturing languages currently available to gather predictive data and feedback from every inspection step to eliminate future defects.
MacDermid Enthone Discusses Consolidation Benefits
At the 2018 electronica exhibition in Munich, Frando van der Pas, director of marketing and sales for MacDermid Enthone—Europe, and Technical Editor Pete Starkey discussed the consolidation benefits and the vision and future of the company.
Welcome to the BIG Show!
This month, we celebrate the impact and reach of the IPC APEX EXPO slated for January 26--31, 2019, in San Diego, California. Have something truly new? It needs to be seen here at IPC APEX EXPO with long-standing products and evolutionary advances from industry stalwarts will grow their installed base here, too. There are other industry shows, but the must-go show for our industry is IPC APEX EXPO.
Top 10 Most-Read SMT Interviews of 2018
We continue our top 10 lists, this time with the most-read SMT interviews in 2018. Topping the list is an interview with Joe O’Neil and Matthew Becker of Power Design Services (PDS), along with Ted Park of Green Circuits, who announced their merger last year.
Words of Advice
In our recent designer survey, we asked the following question: “What advice would you give an OEM system designer?” Here’s what our EMS experts said.
Top 10 Most-Read SMT007 Columns of 2018
Each year, we compile the lists of most-read news, articles and columns. Here are the top 10 most-read SMT007 columns from the past year.
Top 10 Most-Read SMT007 Articles of 2018
Every year, we like to take a look back at the most popular SMT007 news, articles, interviews, and columns. These are the top 10 most-read SMT007 articles from the past year. Check them out.
SMT Electrolytic Capacitor Solder Joint Criteria and Integrity Investigation
The body configuration of SMT electrolytic capacitors results in the solder joints being only partially visible for optical inspection purposes. Therefore, the use of adequate reflow soldering processes is critical for producing solder joints that are acceptable for their end-product use environment.
Challenges in Flex Circuit Assembly
In a recent I-Connect007 survey on flex circuits, we asked the following question: What are some of the challenges that you face utilizing flex circuits? Here are just a few of the replies, edited slightly for clarity.
Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.
How to Avoid Supply Chain Disruption this Chinese New Year
To avoid any negative impact on deliveries or lead-times during the Chinese New Year, the best tactic is to start planning early. And while there's no need to panic buy, you'll definitely want to think ahead when communicating with your PCB suppliers.
Greatest Challenges in Soldering
In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.
AOI Programs with a Magic Click
Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.
Rick Almeida Discusses DownStream's Latest News
At the 2018 electronica exhibition in Munich, Rick Almeida, founder of DownStream Technologies, brings Editor Pete Starkey up to speed with the company’s latest news.
What is ESD and Why Should We Worry About It?
The realities of ESD, how static charges are generated, how they can be transferred to electronic components and the damage they can do, and what practical controls are required to protect components, assemblies and equipment from damage—these topics were explored and clearly explained in a webinar presented by SMTA Europe Technical Committee members Dr. Jeremy Smallwood of Electrostatic Solutions and Charles Cawthorne of MBDA.
In a recent SMT007 survey, we asked our readers how inspection has helped them improve their manufacturing process. Here are just a few of the answers, edited slightly for clarity.
Greg Vance on SMTA Ohio Chapter Updates
This summer, Patty Goldman interviewed Greg Vance, senior project engineer at Rockwell Automation and president of the Ohio chapter, at the SMTA Ohio Valley Expo and Tech Forum in Independence, Ohio. Vance discusses the show, young professionals in the industry, and other events, such as solder paste roundtables.
Is This a Golden Age for Medical Devices?
Just as the telecommunications golden age launched 30 years ago—which led to wireless phones, electronic data terminals, and technology that allows us to watch our favorite shows on our own time and not the TV stations' schedule—it seems that medical device technology is gearing up to do something similar. The Internet of Things (IoT), Internet of the Body (IoB), and printed electronics technologies are emerging, and they're converging with medical devices in a big way.
Electrolube on Managing Thermal Interfaces and Conformal Coatings
Electrolube's Jade Bridges, global technical support manager, speaks with I-Connect007 Technical Editor Pete Starkey about how to manage thermal interfaces for maximum heat transfer efficiency. She also provides an update on conformal coatings.
Understanding the Benefits of CFX
In an interview with SMT007 Magazine, David Fenton, group customer support manager for Blakell Europlacer, discusses the technical challenges and the impact of the IPC Connected Factory Exchange (CFX) initiative on the PCB assembly industry, and what manufacturers can expect from this electronics assembly connectivity standard.
RTW SMTAI: Inventec Discusses the 'Green Way'
At SMTA International 2018, Dan Walker, North American sales manager at Inventec Performance Chemicals USA, provides Editor Nolan Johnson an overview and update on Inventec’s environment-friendly cleaning, soldering and coatings products. He also discusses how they are addressing the latest manufacturing issues, including solder voiding.
U.S. Career Opportunities with Electrolube
In a recent interview, Julia Vorley, group marketing manager for Electrolube, discusses a career opportunity Electrolube is seeking in the U.S. Read on to hear what they’re looking for in a technical account manager.
Training: One of The Best Investments You Can Make
Dan Patten, general manager at BEST Inc., speaks with I-Connect007's Barry Matties about the drivers behind the recent uptick in training from U.S. companies—from contract-driven training for certification levels to newfound demands from quality departments—and why reinvesting in the workforce is beneficial to all parties involved.
Solder Paste Jetting: An Integral Approach
Solder paste jetting is a technique that differs greatly from traditional solder paste deposition methods. In this article, solder paste jetting is compared with the other solder paste deposition methods—solder paste dispensing and solder paste printing and solder paste jetting—and highlights why it is becoming a viable option and how it increases the flexibility of a single production system.
Koh Young's Joel Scutchfield on Smart Factory Connectivity
Joel Scutchfield of Koh Young speaks with I-Connect007's Barry Matties about the struggles system providers currently face in implementing the machine-to-machine connectivity needed for a smart factory with no common platform or protocol in place yet.
RTW SMTAI: KIC's MB Allen on Smart Factory, CFX
Marybeth (MB) Allen, product manager at KIC, speaks with I-Connect007 Managing Editor Nolan Johnson about the smart factory, KIC's new RPI i4.0 software release, and as well as her company's leadership in IPC's Connected Factory Exchange (CFX) initiative.
How to Avoid Common Wave Soldering Issues
Wave soldering involves using waves of molten solder that act as glue to attach electrical components to the PCB. While this process is expedient and efficient in producing high-quality products, it sometimes experiences glitches that can be prevented or corrected. This article explores some of the main issues and how to remedy them.
Challenges and Opportunities with CFX
Larry Chen, global marketing supervisor at Taiwan-based Test Research Inc. (TRI), speaks about how the company is supporting IPC’s Connected Factory Exchange (CFX) initiative, the user interest on the standard, the challenges, and his outlook for CFX.
Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.
Process, Design and Material Factors for Voiding Control for Thermally Demanding Applications
Solder voiding is a common phenomenon across all semiconductor packaging and electronic board assemblies. There are many factors that influence void frequency and size. This article focuses on several process, design and materials selection considerations which control or potentially reduce voiding to meet industry and end-market acceptance criteria.
CFX: Building the Foundation for Industry 4.0
IPC has been showcasing the Connected Factory Exchange (CFX) initiative in action at the many industry events this year, providing a technical demonstration operating in real time with standardized machine data delivered from participating exhibitors through the cloud and onto visitors' cellphones. In this interview, Dave Bergman, VP for international relations at IPC, discusses the latest developments with IPC’s CFX standard, including key highlights, impact in the electronics assembly industry, and what’s next.
Low-temperature Solder Paste Process Advantages
This article examines the performance of two low melting point SnBi alloys used in solder paste when assembling BGA components with SAC alloy spheres, and the advantages of a low-temperature process over the regular SAC assembly process. It will also evaluate solder paste capability regarding the process and the performance of a joint formed with a low melting point alloy solder paste and SAC305 spheres, including process advantages and material capabilities.
Meet Goepel electronic's New Managing Director, Alice Göpel
In August 2018, Alice Göpel took over the managing director position of Goepel electronic, replacing her father Holger Göpel who had managed the company since 1991. In this interview with SMT007, Alice discusses her career, what inspires her, and her outlook for the industry.
RTW SMTAI: PalPilot on Adding Value to Design and Assembly
Tim Sullivan, vice president of sales at PalPilot International Corp., speaks with I-Connect007 Managing Editor Nolan Johnson about their services, and how they add value to their customers from design to assembly/manufacturing. He also talks about their online platform called FootPrintKu, which help designers when it comes to footprints of their design.
Taking an Independent Path: Strategies for Low Risk Sourcing of Components in a Constrained Market
Today, the challenges of a highly stressed supply chain are forcing many OEMs and EMS providers to rethink the way they source components. With parts such as multilayer ceramic capacitors (MLCCs) and other low-cost components in chronic shortage with extended lead times for delivery, manufacturers must be able to get these parts on-time at the lowest possible cost without assuming additional risk.
Karl-Heinz Fritz on Cicor’s DenciTec Technology
In a recent interview, Karl-Heinz Fritz, VP of technology at Cicor, discusses the business, DenciTec technology, the impact of tariffs on trade, and applications for 3D printing and additive manufacturing, including potential new opportunities for PCB designers.
RTW SMTAI: KYZEN's Forsythe Discusses Gap in Cleaning Knowledge
Tom Forsythe, executive vice president of KYZEN Corp., busts myths around "how-clean-is-clean." He discusses the increasing cleaning challenges as devices get more dense and form factors become even smaller, and how these trends are driving the need for cleaning and causing a gap in cleaning knowledge. He also speaks about their new products in data collection and monitoring software for cleaning equipment.
RTW SMTAI: Harold Sneath Highlights Alpha’s Reclaims Business
Reclamation can be a profit center, not a cost of doing business. At the recent SMTA International 2018 conference and exhibition, Harold Sneath, Eastern Regional Reclaim Manager at Alpha Assembly Solutions, lays out the reclamation services available through Alpha.
Real Time with...SMTAI 2018 Coverage Now Available
The I-Connect007 team traveled to Rosemont, Illinois this week to cover the SMTA International 2018 conference and exhibition. Video interviews of key executives and leaders of our industry are now available for viewing. Also check out the photo gallery for snapshots of the exhibition floor and the conference as well as the after-hours festivities.
Do's and Don'ts of Thermal Management Materials
Selecting a thermal management material that is broadly applicable to a particular electronic assembly and its predicted operating conditions is a good starting point; however, as with many of these things, the devil is very much in the details! Find out the key considerations in choosing your materials.
Viscom AG COO Peter Krippner discusses artificial intelligence (AI) and its impact in the electronics manufacturing industry. He speaks about how AI will change the industry, the challenges in adopting AI, and the state of implementation of AI in electronics manufacturing right now.
IoT: Driving Change in Manufacturing
In the manufacturing world, the Internet of Things (IoT) can be seen as an element of Industry 4.0. The idea behind it is that factories would evolve to become smarter, to become a lot more flexible—to be able to make the products that customers want, basically at any time that they need.
How CIM and IoT Can Make Your Factory Smart
As business needs challenge the electronics assembly industry to support increased flexibility, lower overhead, and stricter quality standards, the industry is rapidly adopting improvements in automation and analytics to meet the challenge. This article explores the changes in culture between the past, where data was simply sent point to point, and today’s multi-layered IoT technology-based solutions, as well as the effects and opportunities that are here now for the taking.
Tips to Improve Soldering Tip Life and Reduce Cost
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.
The Smart Robot Revolution is Here
The distance between imagination and reality has reduced considerably. Thanks to advanced technologies such as artificial intelligence (AI), data processing, and machine vision, the science fiction writers' vision of smarter robots is becoming a reality. These more intelligent machines are also making a big impact in manufacturing.
Indium on Voiding and Auto Electronics Test Standard
In this interview with I-Connect007, Indium Corporation Technical Manager Jonas Sjoberg discusses voiding and other key challenges in soldering, as well as an automotive electronics testing standard based out of South Korea that is seeing increased utilization all over Asia. He also talks about the increasing trend in manufacturers moving to Type 5 and Type 6 solder powders, and how this is causing its own set of challenges in printing.
Henry Ford's innovation in manufacturing—the moving assembly line—helped reduce the time it took to build a car from more than 12 hours to just two hours and 30 minutes. It was a revolutionary advancement in production. Through continuous improvements over decades, the assembly line has become the highly efficient primary mode of manufacturing in a wide range of industries and it has changed the way we live and work forever.
Electronic Components Market Update
Unfortunately, there is still no end in sight to the electronic component shortage, and some lead-times are being quoted with 2019 and even 2020 delivery dates! So if you are working with an EMS provider, it remains vital that you communicate and share forecast information with them. You may also want to start looking at the option of fitting, or designing in, smaller components to your PCB assemblies.
RTW NEPCON South China: SEHO Discusses New Production Facility in South Korea
Andreas Reinhardt, R&D director at SEHO Systems GmbH, speaks about their new production facility in South Korea, which aims to address the growing lead times in their supply chain. He also talks about how emerging technologies such as more and more sensors and connections, big data, and cloud computing are impacting the electronics assembly industry.
XR Update: Emerging Realities
The rate of advance in the use of XR—the term now being used to cover AR (augmented reality), VR (virtual reality), and MR (mixed reality)—in many areas, along with advances in the hardware and network capability supporting the use of XR, is accelerating. And because things are moving so quickly, here's a quick review and an update on recent developments in this field.
RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.
RTW NEPCON South China: Viscom Increases 3D AXI Throughput
Guido Bornemann, head of sales for Asia at Viscom, speaks with Editor Edy Yu about the innovations in in-line 3D AXI systems that help manufacturers reduce handling time by about 40–50% and improve their throughputs.
Mexico: A New Hub for Electronics Manufacturing
With its competitive production costs, good logistical access, a skilled and deep talent pool and state-of-the-art technology, Mexico now produces everything from flat-screen televisions to smartphones and other consumer devices employing surface-mount technologies. Here's how Mexico’s strengths in electronics manufacturing services (EMS) evolved, and why more and more electronics manufacturers are moving to the country.
Mark Curtin on Large-Board Stencil Printing and Metal Squeegees
Transition Automation Inc. recently developed a large-area benchtop stencil printer targeted for high-mix low- or medium-volume production. In an interview with I-Connect007, Mark Curtin talks about the new system, and why metal squeegees are the way to go when it comes to solder paste printing.
Should You Send Your PCB Assembler Loose Parts?
Everybody has a few loose PCB components lying around. Sometimes, it's a few chip caps left over from a hand-rework task, or maybe it's a tiny QFN or big old BGA. But, should you send your PCB assembler those loose parts? Read on.
Towards a Data-Driven Cleaning Environment
Tom Forsythe, executive vice president at KYZEN, discusses the most critical challenges of the cleaning process, a new approach to testing the cleanliness of PCB assemblies, and how KYZEN is helping customers develop a more data-driven approach to cleaning.
In our conversations, many assemblers said that cleaning is not a value add, that their customers are getting nothing out of it. It also means an added process, and as such, an additional production cost. On top of that, no-clean fluxes have been in the industry for over 20 years now. But still, why clean?
What SMT Component Shortages Mean for Design and Manufacturing Engineers
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.
Looking Under the Hood of MLCCs
The multilayer ceramic capacitor (MLCC) is one of the most widely used, and the most highly produced, passive devices in modern electronics manufacturing—with more than a thousand billion devices being produced worldwide every year. This article explores the evolution, applications and current state of the MLCC industry and what this means for electronics manufacturers.
RTW NEPCON South China: Mycronic Discusses Industry 4.0
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.
Whitepaper: Electronics Cleanliness Testing
This paper investigates and compares the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system, and surface insulation resistance (SIR) testing. Find out which test is suitable for your processes.
A New Standard for Standards – From Data to Information
The main challenge we have today with our manufacturing standards is that they are deterministic, such as the 30% maximum void per ball for X-ray inspection of BGAs—which determines if a BGA assembly passes or fails. This article proposes a new perspective on setting pass and fail thresholds in the manufacturing line.
Is Component Testing Using ROSE Practical?
Industry experts are saying that Resistivity of Solvent Extract (ROSE) testing should be retired as a cleanliness or process control test in the PCB assembly industry. This article emphasizes that position by highlighting some work by the authors comparing component cleanliness results from the ROSE against Ion Chromatography (IC) results.
Strengthening the Joint with a Revolutionary New Low-Temp Solder Paste
I-Connect007 Editor Patty Goldman interviews one of Alpha Assembly Solution’s solder process experts, Traian Cucu, who is based at Alpha’s R&D center in New Jersey. Traian, along with Morgana Ribas, have played key roles in the development of Alpha’s innovation new low-temperature solder paste process. He also talks about how this solves many of the defects issues that one would see on a SAC assembly process.
Newly Re-Branded Optel Software Lays Down China Strategy
Optimal Electronics Corp., a provider of smart software solutions for electronics assembly, recently rebranded globally as Optel Software, as it starts its venture in China. In an interview with SMT007 Magazine, Dr. Ranko Vujosevic, CEO and CTO, updates on the latest developments from the company and discusses their plans in China and Asia this year.
3D Printing: Enabling a New Manufacturing Landscape
At the recent Michigan SMTA Tech Forum, Scott Schwarz, senior sales representative for rapid technology at Fisher Unitech, discusses with I-Connect007 Technical Editor Happy Holden the latest developments in 3D printing, and the advanced applications that have made significant impacts in the automotive manufacturing industry.
Riding Out the Electronic Components Crisis is No Longer an Option
The electronic components shortage is continuing to take its toll on the electronics manufacturing sector. As market demand outstrips manufacturing capacity, the fallout from the components crisis is now predicted to extend well into 2020, and beyond. And it’s a problem which OEMs can no longer hope to simply ride out. Find out what you can do to address this issue.
Inspection and Design for Testability
In an interview with I-Connect007, Matthias Müller of Goepel electronic talks about about test and inspection technologies, especially in the automotive industry. He discussed design for testing (DFT) and the benefits technologists can gain from DFT. He also mentioned about the increasing need for 3D SPI, as well as why X-ray inspection has become very important now for the automotive, military, and aerospace industries.
KYZEN: Cleaning with Data
With the ability to monitor the temperature and concentration of the bath, and automatically adjust either if needed, the KYZEN Analyst system has caught the attention of the electronics assembly industry. In this interview with I-Connect007, Tom Forsythe, executive vice president for KYZEN, provides an update on KYZEN Analyst and describes how it has evolved into an Internet 4.0 solution with the ability to increase performance and life of the chemistry.
Full Material Declarations: Removing Barriers to Environmental Data Reporting
Full material declaration of product content in electronics and other industries continues to be a challenge for both suppliers and customers alike. This article focuses on requirements for tools that enable rapid and accurate reporting of Class D FMDs that can be used by suppliers primarily in the base of the supply chain.
We Have the Best Practice for That
Most best practices have been developed over time, based on the many different experiences that people encounter in the manufacturing line. And it is important to institute these best practices to make sure that your processes will result in outstanding job at the end of the day.
Strategies for Choosing Solder Paste for Successful Electronics Assembly
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.
Alpha's Revolutionary Approach to Low-Temp Soldering
In an interview with I-Connect007, Morgana Ribas discusses the new technology on low-temperature solder that she has developed at Alpha Assembly Solutions. She also talks about why there is a need for a low-temperature process and the benefits it offers.
Factronix on Cleaning, the Market and More
Stefan Theil, product manager at Factronix, discusses the growing need for cleaning in European electronics manufacturing and the demands he's facing from customers when it comes to finer pitches, automation, and environmental concerns.
AXI 4.0 in a Smart Factory Environment
Outstanding quality is vital to be able to survive the fierce competition between contract manufacturers. Here's how one EMS provider address inspection challenges and board complexities to ensure the quality and reliability of their PCB assemblies.
IMPACT Washington D.C., 2018 with Juki Automation’s Bill Astle
I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.
Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.
Flex Circuit Assembly: Challenges and Strategies for Success
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.
Novel Approach to Void Reduction Using Microflux Coated Solder Preforms
Shrinking QFN package sizes and power requirements are driving new developments in micro-fluxed preform. Learn what factors contribute to an optimal solution.
Addressing Temperature Challenges in Flex Circuit Rework
Zen Lee and Michael Gouldsmith of Thermaltronics discuss the challenges of flex circuit assemblies during the rework process, the power-on-demand feature of smarter hand soldering systems, as well as how Curie Point helps operators avoid temperature overshoots during rework.
I-Connect007 Survey Shows Rising Use of Flex and Rigid-Flex
In our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.
Plasmatreat on Atmospheric Pressure Plasma
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.
Tackling Reliability Challenges in Low-Temperature Soldering
William Yu, senior technical services manager for Alpha Assembly Solutions, recently shared with I-Connect007 the challenges when it comes to the reliability of low-temperature solder pastes, and soldering strategies to overcome these issues.
Nearing Retirement, Juki's Bob Black Reflects on a Long Career
After more than 40 years in the electronics manufacturing industry, Juki's Bob Black is nearing retirement. Bob sat down with Barry Matties at the recent SMT Hybrid Packaging show in Nuremberg to reflect on his career and talk about the importance of strategic partnerships, even if that means playing nice with your competitors.
ASM Assembly Solutions on CFX
ASM Assembly Solutions was one of the 30+ companies participating in IPC's CFX (Connected Factory Exchange) showcase at the recent SMT Hybrid Packaging show in Nuremberg, Germany. In this interview, ASM's Thomas Marktscheffel shared his perspective on CFX and its current challenges, and dispelled the notion that CFX might be a cookie-cutter approach to the smart factory.
Reflow Perspectives to Flex Circuit Assemblies
At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.
Is There an End in Sight to the Electronic Components Crisis?
As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.
Conversation with Miraco… Strategies for Successful Flex Circuit Assembly
Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.
Aegis on CFX and Hermes Efforts
The Connected Factory Exchange (CFX) specification is truly revolutionizing the PCB industry. Michael Ford, from Aegis Software, met with I-Connect007's Barry Matties for an interview during the SMT Hybrid Packaging show in Nuremberg, Germany, to discuss the impact of this collaborative effort, and how it differs from the Hermes Standard.
DFM: Top Ten PCB Concerns
DFM—design for manufacturability—is a critically important but often ignored aspect of the PCB design process that directly impacts product quality and reliability. This article will discuss the top 10 DFM concerns that should be part of any design review process.
Tackling the Challenges in Flex Assembly
Apart from the design and manufacturing of flex printed circuits, a critical challenge that needs attention is assembly. Their flexible nature requires specific strategies for paste printing, chip mounting, soldering—whether reflow, wave, or hand—and rework/repair processes. Which is why the June 2018 issue of SMT007 Magazine looks into the many challenges in flex circuit assembly and highlight some of the strategies, techniques and best practices to help assemblers deal with flex circuit issues.
High School Team's Robotics Entry on Spotlight at Wisconsin Expo & Tech Forum
In May, I took the opportunity to drive around Lake Michigan and visit the SMTA Milwaukee Chapter’s Wisconsin Expo & Tech Forum. Held at the Crowne Plaza Milwaukee Airport Hotel, this was a well-organized and attended table-top expo and technical forum, with over 60 exhibitors, and a high school team with their FIRST Robotics entry.
Dave Bergman on IPC and CFX
The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.
West Penn SMTA: New Leadership, Same Commitment
SMTA's new chapter president, Jason Emes, a quality engineer with Pennatronics Corporation enthusiastically discussed with I-Connect007's Patty Goldman the latest goings-on with this Keystone State chapter. He also spoke about his plans and initiatives for the SMTA West Penn Chapter.
It’s Time to Retire ROSE Testing
Over the last two to three years, there has been considerable discussion within various IPC committees about the role of the ROSE test in today's assembly environment. The transition from predominantly water wash processes to "no clean" has meant the advent of very different flux compositions. The question has been posed as to whether the ROSE test is still a viable option for evaluating PCB and PCBA cleanliness.
Seeing Clearly: XR Headsets and Flex’s Reference Design at AWE
At this year’s CES, they announced the launch of an extended reality (XR) reference design for the next generation of XR headsets. As the “sketch-to-scale” solutions provider, as they describe themselves, that designs and builds “intelligent products for a connected world,” they have now introduced an augmented reality (AR or, as we now call it, XR) reference design to reduce time to market for companies wishing to make and market XR devices.
The Michigan SMTA Expo & Tech Forum 2018: A Review
In May, I had the adventure of driving across Michigan to visit the SMTA Michigan Expo & Tech Forum. This well-organized and attended expo and technical forum featured over 75 exhibitors and two interesting presentations. Read on.
Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.
Why Cleaning Still Matters
Paco Solis, lead investigator at Foresite Inc., speaks with I-Connect007 about why cleaning is more important now, the common pitfalls and misconceptions in cleaning, and strategies to consider to ensure reliable PCB assemblies.
The Value of a Global Sourcing Partner
In today's highly competitive environment, global sourcing is no longer a competitive strategy; it is a standard practice. But the challenges of developing a robust domestic PCB supply chain is daunting enough that moving onto the international stage presents a whole new degree of difficulty that most companies are not equipped to manage.
Conversation with… Keysight: Challenges and Opportunities in Testing 5G
Roger Nichols, 5G program manager at test and measurement provider Keysight Technologies Inc., discusses the opportunities that 5G will enable, the many challenges facing electronics manufacturers when it comes to 5G, and how they are helping the industry address these issues.
Elements to Consider on BGA Assembly Process Capability
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.
RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.
8 Terms Commonly Used When Buying Electronic Components
As a buyer of electronic components, I've taken for granted just how many terms are used on a daily basis during the procurement process. Here's a quick guide explaining what some of the more common terms used when buying electronic components actually mean.
LPKF Sees Increasing Use of UV Lasers
Julian Rose, product manager for the UV and stencil laser machines of LPKF, discusses with I-Connect007 Managing Editor Stephen Las Marias the challenges in laser stencils and strategies and techniques to address them, and the increasing use of UV lasers.
RTW NEPCON China: Christian Koenen Stencil Technologies Ensure First Pass Yields
At the recent NEPCON China 2018 event in Shanghai, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve the solder paste printing process and ensure first pass yields.
The Survey Said: Industry Optimistic After Strong 2017
During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.
RTW IPC APEX EXPO: Indium's Brook Sandy-Smith on PMI-Squared
Indium Corporation's Brook Sandy-Smith discusses ionic process residues on PCB assemblies and introduces the concept of "PMI-squared" (process material interaction investigation), the topic of an IPC Technical Buzz Session at IPC APEX EXPO 2018.
RTW IPC APEX EXPO: Inspection Technology Developments
Brian D'Amico, president of Mirtec Corp., speaks with I-Connect007 Technical Editor Pete Starkey about the challenges of miniaturization, increasing component density, and the shadowing of small components by taller ones, and how Mirtec has developed its inspection technology to ensure they remain at the leading edge.
Under the Hood: Solder Joint Reliability
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.
RTW IPC APEX EXPO: Koh Young Discusses New Equipment and Data Challenges
Joel Scutchfield, Americas Sales Manager for Koh Young, discusses the company's latest inspection equipment and some of the challenges of providing customers the data they need for the real achievement of smart factory realization.
Zestron Opens Technical Center in Taiwan
Zestron on Wednesday, May 16, launched a new technical center in Hsinchu, Taiwan. With the opening of this new technical center, the company now owns a total of eight globally linked technical support facilities throughout the world.
RTW NEPCON CHINA: Mycronic Discusses Recent Acquisitions
At the recent NEPCON China 2018 event, Thomas Stetter, senior vice president for assembly solutions at Mycronic AB, speaks about the company's recent acquisitions and how it helped the company expand into different areas in the electronics assembly industry.
RTW NEPCON CHINA: OK International Highlights Need for Smarter Systems
At the recent NEPCON China 2018 tradeshow in Shanghai, Steven Fang, director of sales for Asia at OK International, speaks about the challenges their customers face when it comes to hiring skilled operators, which warrants the need for smarter systems and tools.
RTW NEPCON CHINA: Rehm Discusses Reflow Strategies to Reduce Voiding
At the recent NEPCON China 2018 event in Shanghai, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems in China, speaks with I-Connect007’s Stephen Las Marias about their latest advancements in reflow oven technology, as well as on strategies to reduce voiding.
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