Organizational and Team Management in Times of Change
Ross Berntson, president and COO of Indium Corporation, shares his perspective, thoughts, and lessons learned on managing his global organization as Indium Corporation responds to health issues, market demand shifts, and organizational change. This interview was conducted in May 2020.
Burak Aksoy: An Update on DOWSIL EA-3838 Fast Adhesive
On June 10, Nolan Johnson spoke with Burak Aksoy, technical service and development scientist for Dow Silicones. Aksoy updated Johnson on the recent introduction of DOWSIL™ EA-3838, a fast-curing adhesive formulated for use in industrial manufacturing and assembly applications.
Ross Berntson: Indium Corporation’s Pledge for Safe Resumption Post-COVID
On May 20, Nolan Johnson spoke with Ross Berntson, Indium Corporation’s president and COO, about the company’s response to the COVID-19 outbreak. Berntson details the company's work with a consortium of manufacturing businesses in central New York state, developing a manufacturing pledge to keep people safe and keep factories running. Indium Corporation has been one of the frontrunners in formalizing such procedures and in sharing lessons learned among all the participating companies.
This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.
SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come
SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.
Panasonic: From Hardware to Solutions and Data
In this video interview from the show, Managing Editor Nolan Johnson speaks with Sean Murray—director of sales, service, operations, and logistics process automation at Panasonic—about the company's focus on software and information management on top of their long history in hardware and equipment.
Siemens and Valor: Two Complementary DFM Technologies
Before IPC APEX EXPO kicked off, Andy Shaughnessy attended a Siemens seminar in San Diego on smart manufacturing for electronics and the integration of technologies from Siemens’ digital industry software and Valor. Afterward, Andy spoke with Andy Farrington, director of portfolio development for the Americas, about the event, as well as some of the hot topics and solutions that the speakers addressed.
EPTAC Preparing Young People for Future in Industry
In this video interview from the show, Guest Editor Kelly Dack and Leo Lambert, VP/technical director of EPTAC Corporation, describe the impact of internships and apprenticeships, the importance of IPC specifications, the effectiveness of certification.
MacDermid Alpha Electronics: Stronger With Kester Acquisition
In this video interview from the show, Technical Editor Pete Starkey and Tim Williams, VP of assembly solutions, discuss the structure and strategy of MacDermid Alpha Electronics Solutions, and how the company benefits from the Kester acquisition.
The Success of IPC’s STEM Student Outreach Program
The IPC Education Foundation (IPCEF) hosted its STEM Student Outreach Event on February 6 at IPC APEX EXPO in San Diego. Nine local high schools attended bringing 193 students and 30 educators from Mission Hills High School, Morse High School, North County Trade Tech High School, Saint Marcos High School, E3 Civic High School, Point Loma High School, Otay Ranch High School, Mount Miguel High School, Otay Ranch High School—Girls in STEM. Twice as many students were able to participate this year, and each participating high school received a $1,000 grant and soldering station to enhance STEM-related learning at their school.
CES: The Main Halls
CES 2020 is now over, and the next round of shows is underway (NAMM is also over now, IPC APEX EXPO is next week, followed by AWE and others). CES displayed electronics related to gaming, monitors, computers, smartwatches, TVs, vehicles, cellphones, etc. However, the effect on the industry and the way we live will be felt until the next CES. The largest and most influential participants are usually found at the Las Vegas Convention Center.
Foundations of the Future: Get More Engaged in 2020
Since the inception of the IPC Education Foundation in January 2019, the mission remains to create connections between electronics manufacturers and supply chain companies, academia and the emerging workforce. In this debut column, Charlene Gunter du Plessis describes plans for engaging in 2020, including scholarships and more, and the IPC APEX EXPO 2020 STEM Student Outreach event.
UV-curable Materials and Conformal Coatings
Pete Starkey and Phil Kinner, global business and technical director, coatings division, Electrolube, discuss the characteristics and benefits of the company’s new UV-cured conformal coatings. Phil also describes the development of coatings for critical avionics applications and Electrolube’s collaboration with the U.K. National Physical Laboratory to establish a new condensation test.
A Walking Tour of Mycronic Equipment at productronica 2019
I-Connect007 pays a visit to the Mycronic booth at productronica 2019 in Munich, and Jeff Leal, product manager for Mysmart, takes us on a walking tour of just one of the lines on display at the show. Jeff takes us through a series of dispensing and conformal coating machines.
The Future of the World Is Truly in the Hands of Our Youth
At I-Connect007, we are proud to once again sponsor the STEM Outreach Program at the upcoming IPC APEX EXPO 2020. Another way we support our youth is by sharing the stories of young people who are doing amazing things. Dylan Nguyen is a great student, musician, and creative thinker. Recently, he shared with me the details of his school science fair project, “Kite: Powering the Future,” which solved a problem that he faced. Dylan is a leader with a bright future, and the world is lucky to have kids like him.
Indium Discusses New Materials and Plans for 2020
Editor Nolan Johnson sits down with Nash and Mackie to discuss Indium’s focus on creating innovative products for the 5G, automotive, semiconductor, and high-reliability segments. Mackie offers a preview of Indium’s plans for 2020 and beyond, including lead-free drop-in sintering materials that can be dispensed and printed more quickly than ever before.
Mirtec's Approach to Raw Data: The 'Sushi Principle'
Editor Pete Starkey and Brian D’Amico discuss the company’s new Alpha system, designed for the automotive market. D’Amico explains why Mirtec is focusing on providing customers with raw data instead of “cooked” data, what he terms the “sushi principle.” He says that the system is able to pick up tiny defects that would otherwise be filtered away if the system were not using raw data. D’Amico also discusses their use of artificial intelligence, and some of the possible benefits from using AI going forward.
Rehm Thermal Systems’ Three-mode Oven
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Michael Hanke, Chief Sales Officer for Rehm.
David Meyers on Digital Twin and ‘Cobots’
With over 30+ years in the industry, David Meyers recently took on a new role at Siemens as a global solutions director in the Electronics Industry team of Siemens Digital Industries Software, working on improving communications between CMs and their OEM partners. In a conversation with Nolan Johnson and Happy Holden, David speaks on the digital twin and virtual environment software that should help establish that communication early in the process.
Koh Young Europe Celebrates 16,000 Installed Systems
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. In this video interview, Editor Nolan Johnson and Harald Eppinger, managing director at Koh Young Europe, discuss the company’s milestone of 16,000 installed systems, the Zenith Alpha, and market trends in AOI systems.
Juan Arango on Koh Young’s New U.S. Headquarters
At a recent open house, Managing Director Juan Arango talks about his role in the company’s transition from their Arizona facility to a new headquarters located outside of Atlanta, Georgia. Juan details many of the benefits customers can expect, including brand new spaces dedicated to customer demos as well as training.
SMTAI 2019: KIC's New, Smart Factory Products
MB Allen, manager of applications and sales for KIC, and Karl Pfluke, regional sales manager, update Nolan Johnson on their new product announcement from earlier this year. They also address the company's ongoing work on smart factory products.
SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.
Real Time with... SMTAI 2019 Video Interviews
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!
SMTAI 2019: Juan Arango Discusses Koh Young America's New Headquarters
Andy Shaughnessy speaks with Juan Arango, managing director of Koh Young America, about their new corporate headquarters in Atlanta, Georgia, which is located near most of their U.S. customer base.
SMTAI 2019: Nir Benson Discusses Mentor's Challenges and Solutions
Nir Benson, business development manager at Mentor, a Siemens Business, talks with Andy Shaughnessy about his work to integrate the two companies' solutions, some of the challenges he sees, and his efforts to optimize their cloud-based systems.
Real Time with… SMTAI 2019 Slideshow
The SMTA International 2019 Conference and Exhibition closed last week on a high note. For those who were not able to attend the event, held at Stephens Convention Center in Rosemont, Illinois, the slideshow contains a selection of photos from the exhibition show floor as well as the conference.
SMTAI 2019: Lenora Clark Discusses Company Changes and Her New Role
Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Electronics Solutions (and co-organizer for the upcoming SMTA Additive Electronics Conference), and Nolan Johnson discuss her new role, recent company reorganization, and the synergies customers are seeing.
SMTA 2019 International Awards
The SMTA International conference—held September 22–29, 2019, at the Stephens Convention Center in Rosemont, Illinois—honored industry members with awards for their contributions to the industry. I-Connect007 has compiled an unofficial list of award recipients. The official list from SMTA will be released shortly, and I-Connect007 will publish it as soon as it is available.
To Improve the Standards Process, Get Involved
Jan Pedersen, senior technical advisor at Elmatica, and Ray Prasad, president of Ray Prasad Consultancy Group, spoke with the I-Connect007 team about the current state of PCB standards and where the process might need improvements, including the many difficulties around transparency, slow updates, limitless numbers of variations, and a variety of other topics.
Solder Mask Evolves into a Truly Additive Process
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.
Selecting the Proper Flex Coverlayer Material
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.
eSMART Factory Conference 2019, Day 2
Happy Holden continues his report on the the eSMART Factory Conference Dearborn, Michigan, with highlights from the event's second day, which includes a keynote from Brian Toleno titled "Augmented Reality: Next-Generation Computing for Front-Line Workers."
Meet Our Newest Columnists From NCAB Group
Meet our newest I-Connect007 columnists from NCAB Group! Jeff Beauchamp, Ruben Contreras, and Harry Kennedy are field application engineers from NCAB Group's technical team. In their columns, they will explore fresh PCB concepts, including medical and telecommunications applications, topics related to RoHS, and much more.
Conformal Coating Processes and Trends
The I-Connect007 editorial team spoke with one of Nordson ASYMTEK’s conformal coating experts, Camille Sybert, to discuss where the coating industry is trending and, with the rise of Industry 4.0 and automation, how it is much less about providing the right applicator and more about addressing the entire conformal coating process.
Dispensing EMI Shielding Materials: An Alternative to Sputtering
Shielding electronic systems against EMI has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and SiP adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a PVD process of sputtering, leveraging front-end packaging technologies to back-end packaging applications.
The Role of Parylene Conformal Coatings in Next-gen Electronics
Designers and manufacturers of electronics are under pressure to make packages smaller, lighter, and more environmentally friendly, while ensuring that their new technologies perform reliably in their operating environments. This article takes a closer look at Parylene conformal coatings and the role they can play in helping manufacturers address current and future challenges in the electronics industry.
Conformal Coating Selection: Conventional vs. Two-part
As assemblies become more densely populated, and housing/casing designs become more permeable to save weight, the use of conformal coatings is essential to protect the assembly from its operating environment and ensure acceptable reliability for the application intended, especially when operating in hostile environments.
Recent Advances in X-ray Technology: SMTA Webinar Recap
Technical Editor Pete Starkey recently attended a webinar on advances in X-ray technology and its applications in the electronics industry, as presented by Keith Bryant, Chair of SMTA Europe, on behalf of SMTA India. Here are the highlights of the webinar.
How Do I Get Smart With IPC CFX? (Part 1)
Today's assembly factories are seeing the biggest challenge to face the industry in a generation, called by many the next industrial revolution. However, in essence, the challenge is a simple extrapolation of trends that have been occurring and increasing in assembly manufacturing for decades. In Part 1 of this two-part article, Michael Ford writes about the history behind the drive for automation in the SMT assembly industry and where CFX fits in.
Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.
Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.
Failures and Reliability in Soldering
The definition of failure is "the lack of success in doing or achieving something, especially in relation to a particular activity." If the activity is concerning a soldering process, such a failure can have a downstream impact far beyond the actual solder joint. In this regard, it is first necessary to understand what constitutes a good solder joint because appearance is too often deemed a success.
The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.
Laserssel Brings High-speed Soldering to New Application Areas
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.
Synergy Between Smart Manufacturing and the Secure Supply Chain (Part 2)
With the trend of shortening lead-times within the material ordering process, and the frequency with which urgent orders for materials from the grey market are made, there is increased opportunity for the ingress of counterfeit materials. The situation is made far worse when a genuine shortage of materials in the supply chain occurs. The consequences of not being able to eliminate the risk of defects getting through into the market will be disastrous for individuals as well as for the company brand image, not to mention the associated costs of recovery. It is only a matter of time, unless something very significant changes.
Smart Factory Transitions Are Attainable—With a Plan
In a white paper, Zac Elliott, technical marketing engineer at Mentor, a Siemens company, outlines a structured organization for smart factory implementation. While there can be one set of challenges to overcome when building a smart factory on a greenfield site, firms restricted to pre-existing facilities face a different set of hurdles. In this interview, Elliott discusses how things have proceeded since the paper was published, and talks about strategies for smaller firms and brownfield companies.
Synergy Between Smart Manufacturing and the Secure Supply Chain (Part 1)
As MRP and ERP functions follow computing trends and start to migrate into the cloud, a fundamental question is being raised as to whether these are still the right tools to use in today’s modern Industry 4.0 driven factory, or whether these need to evolve, be enhanced, or even replaced in order to meet the more extreme requirements of operational flexibility, as well as cope with volatile material availability in the market.
Co-owner Philip Kazmierowicz on New Role as KIC President
KIC is one of the leaders in reflow and thermal process control and smart oven technologies. On March 25, 2019, KIC announced that Philip Kazmierowicz, company co-owner, would take on the position of president. Nolan Johnson took that opportunity to sit down with Kazmierowicz in his Oregon-based R&D lab to discuss KIC's history and his plans for the future of the company.
Five Key Questions Your EMS Partner Should Be Asking in the Supplier Selection Process
As we've continued to observe the impact of the ongoing global electronics components shortage, any challenge to the supply chain has the potential to cause major disruption. Whether you currently manage your own end-to-end electronics manufacturing, or you have opted to outsource to an EMS provider, there are five essential issues (and potential risks) to bear in mind when assessing the value and reliability of any proposed new supplier.
Cadence Design Systems Takes Tensilica to CES Show Floor
While roaming the aisles of CES, I happened across a suite hosted by Cadence Design Systems. It wasn’t a booth—just a quiet presence behind walls with demonstration hardware inside. Vic Markarian, senior group director for worldwide IP licensing and sales, explains why Cadence was at CES.
Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser-cut SMT Stencils (Part 1)
As innovation and demand continue to drive miniaturization in electronics, manufacturers face the constant challenge of assembling smaller and smaller components with repeatable processes and high yields. Stencil printing is the first step in the PWB assembly process, and improvements to the SMT stencil can significantly improve yields, especially for more challenging miniaturized products.
Lionrock Delivers Bendable, Industrial-grade Battery Tech
David Yeung, co-founder and CEO of Lionrock Batteries, discusses previous projects—including smartwatch straps—and his collaboration with the Nano and Advanced Materials Institute (NAMI) in Hong Kong on wearable, flexible battery technology at CES 2019.
Eileen Hibbler and Jason Emes on Improving the West Penn SMTA Chapter
At the recent West Penn SMTA Expo, Eileen Hibbler, a chapter support specialist at SMTA, and Jason Emes, the current president of the West Penn SMTA Chapter, discuss ways to improve meeting attendance and develop a new slate of chapter officers.
A Working Definition of Automation
Automation in a working context means more than just automatic machinery. Machinery implies mechanization. Automation also means the system information directs and controls people, materials, and machines. This concept is also known as systemization. Therefore, automation is made up of two components: mechanization (material flow) and systemization (information flow). Find out more.
A Young Engineer’s Perspective
Jeffrey Diament, a recent Princeton University graduate and an engineering associate from sensor manufacturer Instrumems, talks about the company’s nanowire sensing platform that can measure velocity, temperature, and humidity. Being his first career job out of college, Diament discusses his experience on the hardware and manufacturing side of things and offers advice to other young professionals.
Building a Smart Factory Supply Line
I-Connect007 recently toured Victory Giant Technology (VGT) Co. Ltd. in Huizhou, China—one of China’s largest PCB producers. Currently, VGT generates about US$500 million in annual sales, and have plans to reach $1.5 billion in the coming years. Read more to find out VGT's expansion plans and strategies for growth.
Industrial Cybersecurity Needs to Be in Front of Regulators
Chris Humphreys, principal at Anfield Group, a cybersecurity firm consulting with numerous industrial and infrastructure clients, discusses cybersecurity, the dynamics of regulation, and the responsibilities that manufacturers have to the greater good above and beyond simply adhering to regulation.
Top 10 Most-Read SMT007 Articles for March
Starting this month, we will take a look back at the most popular SMT007 news, articles, interviews, and columns over the past 30 days. For the month of March, these are the top 10 most-read SMT007 articles. Check them out.
Jennie Hwang: Get Ready for Disruptive Technologies
At IPC APEX EXPO 2019, Dr. Jennie S. Hwang, a columnist, author, and all-around an expert in PCB assembly, discusses some of the changes she has seen since joining the industry, and disruptive technologies that technologists we are going to have to face in the near future. Are you ready for the future?
CPCA Show and productronica China 2019 Review
It was a busy week in China for the electronics industry. With multiple trade shows and conferences going on simultaneously in Shanghai, including the CPCA Show 2019, productronica China, SEMICON China, electronica China, and FPD China, it appears from the crowds that the market is strong in the region.
Smart Factories: A Shift in Thinking
The components that make up the smart factory foundation are not new, at least not at a basic technological level. Factory automation still uses PLCs, sensors, robotics, etc. But two things are quite different today: governments and key industry players across the globe are striving for cleaner, greener factories for the sake of the environment; and the 21st century allows for interconnected, multifaceted use of the data available through all these sensors and robotics.
SMTA Europe Electronics in Harsh Environments Conference 2019: A Preview
As a prelude to this year's Electronics in Harsh Environments conference, which will be held on April 2–4, 2019 in Amsterdam, Netherlands, SMTA Europe chairman Keith Bryant, supported by technical specialist Bob Willis, showcased the challenges and key issues faced by design and process engineers worldwide, in a webinar entitled "Harsh Environment Failures—Causes & Cures."
2019 IPC EMS Management Meeting Wrap-up
At the recent EMS Management Meeting during IPC APEX EXPO 2019, EMS leaders gathered to discuss issues critical to EMS providers today, including supply chain issues, customer contracts, labor optimization and talent shortages. The highlight of the day was a supply chain challenges panel and discussion featuring supplier, distributor, and end-user perspectives on addressing component supply and lead time challenges.
RTW IPC APEX EXPO 2019: Standards Updates—IPC-7093 & IPC-7530
Ray Prasad, IPC Hall of Famer and chairman for multiple committees, gives Guest Editor Joe Fjelstad an update on two IPC standards: IPC-7093 on bottom-termination components (BTCs), and IPC-7530 progress with reflow characterization. Prasad talks about the many challenges in dealing with BTCs, including circuit/board design, manufacturing, voiding, connections (or lack thereof), warpage, and reliability. He also addresses no-clean flux and its challenges.
Nate Ramanathan on Choosing a Prototype Partner and Production Supplier
AEye, a developer of perception systems for autonomous vehicles, has transitioned from initial engineering development into the final design for production and manufacturing of very large quantities. In an interview with I-Connect007, Nate Ramanathan, VP of operations at AEye, speaks about the criteria and his perspective on selecting vendors.
RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering
Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical. He talks about challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.
Two Full CFX Demo Lines at IPC APEX EXPO 2019
During IPC APEX EXPO, Editor Dan Feinberg spoke with David Bergman, IPC VP of standards and technology, about CFX, IPC’s Connected Factory Exchange software for machine-to-machine communication. With more than companies now supporting CFX, IPC set up two full lines for demonstration at the show.
RTW IPC APEX EXPO 2019: MIRTEC Discusses Automation, CFX, and Sales Success
MIRTEC President Brian D'Amico speaks with I-Connect007 Guest Editor Dan Beaulieu about automation, the Connected Factory Exchange (CFX) standard, and their banner year last year. He speaks about Industry 4.0, automating the inspection process, and collecting more data to help refine the manufacturing process.
RTW IPC APEX EXPO 2019: Advanced 3D Solder Paste Inspection Technology
Olivier Pirou, managing director of Vi TECHNOLOGY, provides Joe Fjelstad with an overview of the company's advanced 3D solder paste inspection technology, featuring the ability to make corrections in real time. Pirou also talks about their efforts in strengthening their inspection systems.
RTW IPC APEX EXPO 2019: BTU Discusses New Solder Flux Reclamation Solutions
Bob Bouchard, corporate marketing manager at BTU International Inc., updates I-Connect007 Managing Editor Nolan Johnson on new solder flux reclamation solutions and details the new aqueous scrub methodologies, their increased ROI and efficiencies, and reduced maintenance.
Executive Forum on Advancing Automotive Electronics
Presented by IPC Hall of Fame Council, the Executive Form on Advancing Automotive Electronics, which aims to provide information on the complete supply chain for automotive electronics, featured 10 presentations on all facets of automotive electronics from materials, fabrication, and reliability testing to market information and future needs.
RTW IPC APEX EXPO 2019: Making Components Count
VJ Electronix is filling the void in pre-build component count verification challenges. Don Naugler, president and general manager, sits down with Guest Editor Kelly Dack to explain details of the machine, how it works, and who benefits from it.
RTW IPC APEX EXPO 2019: LPKF on Benefits of Laser Depaneling
Laser technology marches on, and marching along with it is LPKF's new line of laser depaneling equipment. Stephan Schmidt, president, talks with I-Connect007 Guest Editor Kelly Dack about the many benefits of using lasers including cleanliness and higher yields through increased array density.
RTW IPC APEX EXPO 2019: Lenthor Discusses Facility Expansion and New Equipment
Rich Clemente, general manager of Lenthor Engineering, discusses with Dan Feinberg, I-Connect007 Guest Editor, the company’s expansion and new facility and equipment. He also talks about his outlook for the electronics manufacturing industry in North America.
RTW IPC APEX EXPO 2019: MacDermid Alpha Highlights Solutions to Combat Voids in Solder
Joe Fjelstad speaks with Paul Salerno, global portfolio manager at MacDermid Alpha Electronics Solutions, about their latest product and process solutions to combat voids in solder including modifications in pastes, preforms, and vacuum assist soldering.
RTW IPC APEX EXPO 2019: Comet Group's Lab One Facility in Silicon Valley
Joe Fjelstad speaks with Ken Burden, senior director of North American field service, and Craig Arcuri, business development, about Comet Group’s Silicon Valley-based Lab One customer center, which is a key resource for a variety of testing and inspection services, and also offers opportunities to collaborate with Comet Group's industry experts.
Award-winning Koh Young Process Optimizer
Joel Scutchfield, sales director with Koh Young America, discusses the company's outlook and new product offerings for 2019, including their Koh Young Process Optimizer (KPO), which won an award at IPC APEX EXPO 2019 for the process control software category.
RTW IPC APEX EXPO 2019: Panasonic Highlights New Products, IPC STEM Student Outreach Program
Sean M. Murray, GM of North American Sales EAG Group for Panasonic, and Nolan Johnson, I-Connect007 Managing Editor, discuss two new product announcements at the show—PanaCIM process tracker software and MPM-WX—and being a sponsor for the IPC STEM Student Outreach Program.
Super Dry Storage Options to Manage Intermetallic Growth
Guest Editor Kelly Dack speaks with Richard Heimsch, director of Super Dry, about some of the differences between storing components and other materials for assembly floor storage versus long-term storage, and how Super Dry can help combat intermetallic growth.
Supply Chain in Crisis
In a traditional design flow, the project team tends to use the parts they already know and have footprints for—maybe a little long in the tooth, but known quantities, after all. Except these are not traditional times. Component supplies, prices, and lead times are in a great deal of turmoil. The automotive, IoT, and telecommunications sectors are vacuuming components out of the supply chain at a record pace, exerting influences like early obsolescence of older components and more.
RTW IPC APEX EXPO 2019: KYZEN Intros New Aquanox Aqueous Cleaner
In an interview with I-Connect007 Technical Editor Pete Starkey, KYZEN Executive VP Thomas M. Forsythe introduces the latest member of the Aquanox family of aqueous cleaners and comments on issues of compatibility, rinsability, and consistency of operation.
RTW IPC APEX EXPO 2019: KIC Speaks on Data, Voiding and Traceability
Bjorn Dahle, president of KIC, talks with I-Connect007 Technical Editor Pete Starkey about how the industry has shifted its focus from the machine to data; the issue on voiding and how manufacturers can address this process challenge; and traceability.
RTW IPC APEX EXPO: OK International Soldering Robot Integrates CV Technology
Bryan Gass, vice president at OK International, talks with I-Connect007 Managing Editor Nolan Johnson about their new soldering robot that integrates their Connection Validation (CV) technology. Launched at the IPC APEX EXPO last year, the CV technology provided the company a springboard to have a good start into 2018, and to achieve growth throughout the year.
RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.
Mark Friedman on IPC Membership
Mark Friedman, a member success advocate at IPC, recently spoke with I-Connect007's Barry Matties about the current status of IPC's membership programs, the recent growth they've seen, and some hidden benefits of IPC membership that potential members might not be considering.
STEM: The Future of Our Industry
Facing a growing shortage of talented labor with which to fill the employment positions in America, IPC is working to help solve this problem. Colette Buscemi, senior director of IPC’s education programs, is encouraging IPC members to better engage pre-college and post-secondary college students at the local level. Barry Matties spoke with Colette about the educational programs IPC has put in place to invest in future generations, including the STEM program at this year’s IPC APEX EXPO.
Mentor and Seica Partner for Data Prep and Testing Big Boards
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.
The Future of the Customer Experience in Mobility
Based on the protocol stack that starts with 5G, moves up to AI, and continues to layer integrations and user interfaces and experiences on top of those lower-level technologies, how does this all apply to the current mobile experience? A panel on the future of mobility with representatives from several major companies covered this and more at CES.
More Than Inspection: It’s Process Improvement
Barry Matties speaks with Brian D’Amico, president of MIRTEC, about the current state of machine-to-machine communication in the industry, and how the inspection company is interfacing with the different manufacturing languages currently available to gather predictive data and feedback from every inspection step to eliminate future defects.
Welcome to the BIG Show!
This month, we celebrate the impact and reach of the IPC APEX EXPO slated for January 26--31, 2019, in San Diego, California. Have something truly new? It needs to be seen here at IPC APEX EXPO with long-standing products and evolutionary advances from industry stalwarts will grow their installed base here, too. There are other industry shows, but the must-go show for our industry is IPC APEX EXPO.
Top 10 Most-Read SMT007 Articles of 2018
Every year, we like to take a look back at the most popular SMT007 news, articles, interviews, and columns. These are the top 10 most-read SMT007 articles from the past year. Check them out.
Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.
AOI Programs with a Magic Click
Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.
What is ESD and Why Should We Worry About It?
The realities of ESD, how static charges are generated, how they can be transferred to electronic components and the damage they can do, and what practical controls are required to protect components, assemblies and equipment from damage—these topics were explored and clearly explained in a webinar presented by SMTA Europe Technical Committee members Dr. Jeremy Smallwood of Electrostatic Solutions and Charles Cawthorne of MBDA.
Greg Vance on SMTA Ohio Chapter Updates
This summer, Patty Goldman interviewed Greg Vance, senior project engineer at Rockwell Automation and president of the Ohio chapter, at the SMTA Ohio Valley Expo and Tech Forum in Independence, Ohio. Vance discusses the show, young professionals in the industry, and other events, such as solder paste roundtables.
Is This a Golden Age for Medical Devices?
Just as the telecommunications golden age launched 30 years ago—which led to wireless phones, electronic data terminals, and technology that allows us to watch our favorite shows on our own time and not the TV stations' schedule—it seems that medical device technology is gearing up to do something similar. The Internet of Things (IoT), Internet of the Body (IoB), and printed electronics technologies are emerging, and they're converging with medical devices in a big way.
Understanding the Benefits of CFX
In an interview with SMT007 Magazine, David Fenton, group customer support manager for Blakell Europlacer, discusses the technical challenges and the impact of the IPC Connected Factory Exchange (CFX) initiative on the PCB assembly industry, and what manufacturers can expect from this electronics assembly connectivity standard.
RTW SMTAI: Inventec Discusses the 'Green Way'
At SMTA International 2018, Dan Walker, North American sales manager at Inventec Performance Chemicals USA, provides Editor Nolan Johnson an overview and update on Inventec’s environment-friendly cleaning, soldering and coatings products. He also discusses how they are addressing the latest manufacturing issues, including solder voiding.
RTW SMTAI: KIC's MB Allen on Smart Factory, CFX
Marybeth (MB) Allen, product manager at KIC, speaks with I-Connect007 Managing Editor Nolan Johnson about the smart factory, KIC's new RPI i4.0 software release, and as well as her company's leadership in IPC's Connected Factory Exchange (CFX) initiative.
Challenges and Opportunities with CFX
Larry Chen, global marketing supervisor at Taiwan-based Test Research Inc. (TRI), speaks about how the company is supporting IPC’s Connected Factory Exchange (CFX) initiative, the user interest on the standard, the challenges, and his outlook for CFX.
Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.
CFX: Building the Foundation for Industry 4.0
IPC has been showcasing the Connected Factory Exchange (CFX) initiative in action at the many industry events this year, providing a technical demonstration operating in real time with standardized machine data delivered from participating exhibitors through the cloud and onto visitors' cellphones. In this interview, Dave Bergman, VP for international relations at IPC, discusses the latest developments with IPC’s CFX standard, including key highlights, impact in the electronics assembly industry, and what’s next.
Meet Goepel electronic's New Managing Director, Alice Göpel
In August 2018, Alice Göpel took over the managing director position of Goepel electronic, replacing her father Holger Göpel who had managed the company since 1991. In this interview with SMT007, Alice discusses her career, what inspires her, and her outlook for the industry.
RTW SMTAI: PalPilot on Adding Value to Design and Assembly
Tim Sullivan, vice president of sales at PalPilot International Corp., speaks with I-Connect007 Managing Editor Nolan Johnson about their services, and how they add value to their customers from design to assembly/manufacturing. He also talks about their online platform called FootPrintKu, which help designers when it comes to footprints of their design.
Karl-Heinz Fritz on Cicor’s DenciTec Technology
In a recent interview, Karl-Heinz Fritz, VP of technology at Cicor, discusses the business, DenciTec technology, the impact of tariffs on trade, and applications for 3D printing and additive manufacturing, including potential new opportunities for PCB designers.
RTW SMTAI: KYZEN's Forsythe Discusses Gap in Cleaning Knowledge
Tom Forsythe, executive vice president of KYZEN Corp., busts myths around "how-clean-is-clean." He discusses the increasing cleaning challenges as devices get more dense and form factors become even smaller, and how these trends are driving the need for cleaning and causing a gap in cleaning knowledge. He also speaks about their new products in data collection and monitoring software for cleaning equipment.
RTW SMTAI: Harold Sneath Highlights Alpha’s Reclaims Business
Reclamation can be a profit center, not a cost of doing business. At the recent SMTA International 2018 conference and exhibition, Harold Sneath, Eastern Regional Reclaim Manager at Alpha Assembly Solutions, lays out the reclamation services available through Alpha.
IoT: Driving Change in Manufacturing
In the manufacturing world, the Internet of Things (IoT) can be seen as an element of Industry 4.0. The idea behind it is that factories would evolve to become smarter, to become a lot more flexible—to be able to make the products that customers want, basically at any time that they need.
How CIM and IoT Can Make Your Factory Smart
As business needs challenge the electronics assembly industry to support increased flexibility, lower overhead, and stricter quality standards, the industry is rapidly adopting improvements in automation and analytics to meet the challenge. This article explores the changes in culture between the past, where data was simply sent point to point, and today’s multi-layered IoT technology-based solutions, as well as the effects and opportunities that are here now for the taking.
Tips to Improve Soldering Tip Life and Reduce Cost
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.
The Smart Robot Revolution is Here
The distance between imagination and reality has reduced considerably. Thanks to advanced technologies such as artificial intelligence (AI), data processing, and machine vision, the science fiction writers' vision of smarter robots is becoming a reality. These more intelligent machines are also making a big impact in manufacturing.
Indium on Voiding and Auto Electronics Test Standard
In this interview with I-Connect007, Indium Corporation Technical Manager Jonas Sjoberg discusses voiding and other key challenges in soldering, as well as an automotive electronics testing standard based out of South Korea that is seeing increased utilization all over Asia. He also talks about the increasing trend in manufacturers moving to Type 5 and Type 6 solder powders, and how this is causing its own set of challenges in printing.
Electronic Components Market Update
Unfortunately, there is still no end in sight to the electronic component shortage, and some lead-times are being quoted with 2019 and even 2020 delivery dates! So if you are working with an EMS provider, it remains vital that you communicate and share forecast information with them. You may also want to start looking at the option of fitting, or designing in, smaller components to your PCB assemblies.
RTW NEPCON South China: SEHO Discusses New Production Facility in South Korea
Andreas Reinhardt, R&D director at SEHO Systems GmbH, speaks about their new production facility in South Korea, which aims to address the growing lead times in their supply chain. He also talks about how emerging technologies such as more and more sensors and connections, big data, and cloud computing are impacting the electronics assembly industry.
XR Update: Emerging Realities
The rate of advance in the use of XR—the term now being used to cover AR (augmented reality), VR (virtual reality), and MR (mixed reality)—in many areas, along with advances in the hardware and network capability supporting the use of XR, is accelerating. And because things are moving so quickly, here's a quick review and an update on recent developments in this field.
RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.
Mexico: A New Hub for Electronics Manufacturing
With its competitive production costs, good logistical access, a skilled and deep talent pool and state-of-the-art technology, Mexico now produces everything from flat-screen televisions to smartphones and other consumer devices employing surface-mount technologies. Here's how Mexico’s strengths in electronics manufacturing services (EMS) evolved, and why more and more electronics manufacturers are moving to the country.
Towards a Data-Driven Cleaning Environment
Tom Forsythe, executive vice president at KYZEN, discusses the most critical challenges of the cleaning process, a new approach to testing the cleanliness of PCB assemblies, and how KYZEN is helping customers develop a more data-driven approach to cleaning.
In our conversations, many assemblers said that cleaning is not a value add, that their customers are getting nothing out of it. It also means an added process, and as such, an additional production cost. On top of that, no-clean fluxes have been in the industry for over 20 years now. But still, why clean?
Looking Under the Hood of MLCCs
The multilayer ceramic capacitor (MLCC) is one of the most widely used, and the most highly produced, passive devices in modern electronics manufacturing—with more than a thousand billion devices being produced worldwide every year. This article explores the evolution, applications and current state of the MLCC industry and what this means for electronics manufacturers.
RTW NEPCON South China: Mycronic Discusses Industry 4.0
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.
Strengthening the Joint with a Revolutionary New Low-Temp Solder Paste
I-Connect007 Editor Patty Goldman interviews one of Alpha Assembly Solution’s solder process experts, Traian Cucu, who is based at Alpha’s R&D center in New Jersey. Traian, along with Morgana Ribas, have played key roles in the development of Alpha’s innovation new low-temperature solder paste process. He also talks about how this solves many of the defects issues that one would see on a SAC assembly process.
Newly Re-Branded Optel Software Lays Down China Strategy
Optimal Electronics Corp., a provider of smart software solutions for electronics assembly, recently rebranded globally as Optel Software, as it starts its venture in China. In an interview with SMT007 Magazine, Dr. Ranko Vujosevic, CEO and CTO, updates on the latest developments from the company and discusses their plans in China and Asia this year.
3D Printing: Enabling a New Manufacturing Landscape
At the recent Michigan SMTA Tech Forum, Scott Schwarz, senior sales representative for rapid technology at Fisher Unitech, discusses with I-Connect007 Technical Editor Happy Holden the latest developments in 3D printing, and the advanced applications that have made significant impacts in the automotive manufacturing industry.
Inspection and Design for Testability
In an interview with I-Connect007, Matthias Müller of Goepel electronic talks about about test and inspection technologies, especially in the automotive industry. He discussed design for testing (DFT) and the benefits technologists can gain from DFT. He also mentioned about the increasing need for 3D SPI, as well as why X-ray inspection has become very important now for the automotive, military, and aerospace industries.
KYZEN: Cleaning with Data
With the ability to monitor the temperature and concentration of the bath, and automatically adjust either if needed, the KYZEN Analyst system has caught the attention of the electronics assembly industry. In this interview with I-Connect007, Tom Forsythe, executive vice president for KYZEN, provides an update on KYZEN Analyst and describes how it has evolved into an Internet 4.0 solution with the ability to increase performance and life of the chemistry.
Strategies for Choosing Solder Paste for Successful Electronics Assembly
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.
Factronix on Cleaning, the Market and More
Stefan Theil, product manager at Factronix, discusses the growing need for cleaning in European electronics manufacturing and the demands he's facing from customers when it comes to finer pitches, automation, and environmental concerns.
IMPACT Washington D.C., 2018 with Juki Automation’s Bill Astle
I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.
Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.
Plasmatreat on Atmospheric Pressure Plasma
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.
Tackling Reliability Challenges in Low-Temperature Soldering
William Yu, senior technical services manager for Alpha Assembly Solutions, recently shared with I-Connect007 the challenges when it comes to the reliability of low-temperature solder pastes, and soldering strategies to overcome these issues.
Nearing Retirement, Juki's Bob Black Reflects on a Long Career
After more than 40 years in the electronics manufacturing industry, Juki's Bob Black is nearing retirement. Bob sat down with Barry Matties at the recent SMT Hybrid Packaging show in Nuremberg to reflect on his career and talk about the importance of strategic partnerships, even if that means playing nice with your competitors.
ASM Assembly Solutions on CFX
ASM Assembly Solutions was one of the 30+ companies participating in IPC's CFX (Connected Factory Exchange) showcase at the recent SMT Hybrid Packaging show in Nuremberg, Germany. In this interview, ASM's Thomas Marktscheffel shared his perspective on CFX and its current challenges, and dispelled the notion that CFX might be a cookie-cutter approach to the smart factory.
Reflow Perspectives to Flex Circuit Assemblies
At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.
Conversation with Miraco… Strategies for Successful Flex Circuit Assembly
Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.
Aegis on CFX and Hermes Efforts
The Connected Factory Exchange (CFX) specification is truly revolutionizing the PCB industry. Michael Ford, from Aegis Software, met with I-Connect007's Barry Matties for an interview during the SMT Hybrid Packaging show in Nuremberg, Germany, to discuss the impact of this collaborative effort, and how it differs from the Hermes Standard.
Tackling the Challenges in Flex Assembly
Apart from the design and manufacturing of flex printed circuits, a critical challenge that needs attention is assembly. Their flexible nature requires specific strategies for paste printing, chip mounting, soldering—whether reflow, wave, or hand—and rework/repair processes. Which is why the June 2018 issue of SMT007 Magazine looks into the many challenges in flex circuit assembly and highlight some of the strategies, techniques and best practices to help assemblers deal with flex circuit issues.
High School Team's Robotics Entry on Spotlight at Wisconsin Expo & Tech Forum
In May, I took the opportunity to drive around Lake Michigan and visit the SMTA Milwaukee Chapter’s Wisconsin Expo & Tech Forum. Held at the Crowne Plaza Milwaukee Airport Hotel, this was a well-organized and attended table-top expo and technical forum, with over 60 exhibitors, and a high school team with their FIRST Robotics entry.
Dave Bergman on IPC and CFX
The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.
West Penn SMTA: New Leadership, Same Commitment
SMTA's new chapter president, Jason Emes, a quality engineer with Pennatronics Corporation enthusiastically discussed with I-Connect007's Patty Goldman the latest goings-on with this Keystone State chapter. He also spoke about his plans and initiatives for the SMTA West Penn Chapter.
Seeing Clearly: XR Headsets and Flex’s Reference Design at AWE
At this year’s CES, they announced the launch of an extended reality (XR) reference design for the next generation of XR headsets. As the “sketch-to-scale” solutions provider, as they describe themselves, that designs and builds “intelligent products for a connected world,” they have now introduced an augmented reality (AR or, as we now call it, XR) reference design to reduce time to market for companies wishing to make and market XR devices.
Why Cleaning Still Matters
Paco Solis, lead investigator at Foresite Inc., speaks with I-Connect007 about why cleaning is more important now, the common pitfalls and misconceptions in cleaning, and strategies to consider to ensure reliable PCB assemblies.
Conversation with… Keysight: Challenges and Opportunities in Testing 5G
Roger Nichols, 5G program manager at test and measurement provider Keysight Technologies Inc., discusses the opportunities that 5G will enable, the many challenges facing electronics manufacturers when it comes to 5G, and how they are helping the industry address these issues.
Elements to Consider on BGA Assembly Process Capability
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.
RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.
RTW NEPCON China: Christian Koenen Stencil Technologies Ensure First Pass Yields
At the recent NEPCON China 2018 event in Shanghai, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve the solder paste printing process and ensure first pass yields.
The Survey Said: Industry Optimistic After Strong 2017
During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.
RTW IPC APEX EXPO: Inspection Technology Developments
Brian D'Amico, president of Mirtec Corp., speaks with I-Connect007 Technical Editor Pete Starkey about the challenges of miniaturization, increasing component density, and the shadowing of small components by taller ones, and how Mirtec has developed its inspection technology to ensure they remain at the leading edge.
Zestron Opens Technical Center in Taiwan
Zestron on Wednesday, May 16, launched a new technical center in Hsinchu, Taiwan. With the opening of this new technical center, the company now owns a total of eight globally linked technical support facilities throughout the world.
RTW NEPCON CHINA: Mycronic Discusses Recent Acquisitions
At the recent NEPCON China 2018 event, Thomas Stetter, senior vice president for assembly solutions at Mycronic AB, speaks about the company's recent acquisitions and how it helped the company expand into different areas in the electronics assembly industry.
RTW NEPCON CHINA: OK International Highlights Need for Smarter Systems
At the recent NEPCON China 2018 tradeshow in Shanghai, Steven Fang, director of sales for Asia at OK International, speaks about the challenges their customers face when it comes to hiring skilled operators, which warrants the need for smarter systems and tools.
RTW NEPCON CHINA: Rehm Discusses Reflow Strategies to Reduce Voiding
At the recent NEPCON China 2018 event in Shanghai, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems in China, speaks with I-Connect007’s Stephen Las Marias about their latest advancements in reflow oven technology, as well as on strategies to reduce voiding.
Vehicle Electrification: Disrupting the Automotive Industry and Beyond
Around the globe, governments are announcing mandates that will bring about the demise of the internal combustion engine. China has led the charge by requiring 8% of new vehicles on the road to be “new energy” or zero emission vehicles in 2018, up from the current 2–3% on the road today. Similar strong government regulations limiting the future of the internal combustion engine have passed around the world, and the importance and growth of the hybrid and fully electric automobile industry can’t be overstated.
RTW IPC APEX EXPO: Heraeus Discusses Developments at New Lab
Jim Wertin, technical sales manager at Heraeus Electronics, shares news about the company's latest product offerings, as well as its newly established application laboratory, which helps customers and potential customers resolve production issues and improve the quality of their products.
CFX: The Next Step Toward the Future of Factories
For the past two to three years, almost every exhibitor in almost every trade show focused on the electronics manufacturing industry has an "Industry 4.0 Compatible" sign in their booth. As of today, the best question to ask is, "Compatible with what?" There has really been no standard yet developed toward this goal, and Industry 4.0 has been just a buzz word.
What's the Scoop? APEX CFX Showcase
The IPC Connected Factory Exchange (CFX) demo at the recent IPC APEX EXPO 2018 trade show in San Diego, California, is a great example of industry collaboration. The CFX Showcase at APEX had 245,000 CFX website page views; 701,200 CFX messages transmitted; and 664.5 million bytes of data exchanged; and the whole thing was pulled together in a matter of weeks. Here's what the participants in the program have got to say.
SMT Renting: A Trend for the Future?
You may have heard the name Martin Ziehbrunner before: he cofounded the equipment company Essemtec AG in 1992. He left the company in 2013, and soon he'd cofounded another SMT company, but with a twist. SMT Renting specializes in renting SMT equipment with an operational lease, primarily for the European market. In this interview, he explains how his latest company is challenging the normal way of acquiring SMT capital equipment.
Solving Reliability and Thermal Management Challenges in Automotive Electronics
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.
RTW IPC APEX EXPO: MEK on Increasing Demand for THT AOI Systems
Henk Biemans, managing director of MEK Marantz Electronics Ltd, speaks with I-Connect007 Managing Editor Stephen Las Marias about what's driving the increasing demand for THT AOI systems. Other topics discussed include reliability issues, articifial intelligence, and machine learning in inspection systems.
RTW IPC APEX EXPO: Nordson SELECT's Acquisition Update
Carlos E. Bouras, general manager of Nordson SELECT, discusses the acquisition of ACE Production Technologies and InterSelect GmbH one year later, along with the synergies between the two companies, and how they have strengthened Nordson SELECT's capabilities.
Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.
Succeeding at the Velocity of Technology: An IPC APEX EXPO 2018 Wrap-Up
After many months of planning, IPC APEX EXPO 2018 proved to be a success. From revolutionary advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO provided the learning and connections that helped 4,574 attendees from 43 countries prepare for the future.
Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.