Video from productronica 2017: Mycronic Discusses Precision Jetting Systems
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.
Video from productronica 2017: Nordson ASYMTEK Highlights Bulk Dispensing Technology
At this week’s productronica, Nordson ASYMTEK highlights its the new Helios SD960 bulk and two-component dispensing system. Almar Thewissen, program manager for Industrial Applications, EMEA, at Nordson, discusses its applications with I-Connect007 Technical Editor Pete Starkey.
Video from productronica 2017: Goepel Highlights Updates on X-Line 3D In-line System
At productronica 2017 in Munich, Germany, Goepel electronic's Andreas Turk, head of AXI Systems, explains the latest enhancements to their X-Line 3D in-line system for high-end inspection. He also discusses the benefits of the Stingray Detector option.
Optimal Electronics Sets Sight on Growth
In an interview with SMT Magazine, Dr. Ranko Vujosevic, CEO and CTO of Optimal Electronics, speaks about the latest technology developments at his company, and his plans to sustain growth. He also talks about his paper on lights-out electronics assembly, the technologies that would support this vision, and the ultimate goal of Industry 4.0.
Solder Preforms 101: Ask the Expert
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.
Creating the Perfect Solder Joint
From a visual standpoint, a good solder joint should be smooth, bright, shiny, clean, and have a nice concave solder fillet. But how do you ensure that inside those joints, good intermetallic bonds are formed? Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint.
Cleaning Trends: The Challenges of Miniaturization and Proximity
At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.
Soldering Tip: Key to Good Solder Joints
In an interview with SMT Magazine, Enrique Moreno, technical support engineer at JBC Soldering, discusses the key parameters to consider during hand soldering to achieve the perfect solder joint. He also talks about the the increasing move towards automation and robotics soldering.
Achieving the Perfect Solder Joint: The Many Perspectives on Soldering
For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.
Choosing Solder Processes: Getting It Right
In an interview with SMT Magazine, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, shares his insights on the topic of achieving the perfect solder joint, from the perspective of a reflow oven supplier. He also talks about the latest developments in reflow ovens aimed at addressing voiding in solder joints.
Moving Toward the Zero-Defect Line
During the recent NEPCON South China exhibition in Shenzhen, Olivier Pirou, chief operating officer of Vi TECHNOLOGY, talks about achieving the perfect solder joint from the point of view of an inspection systems provider, and how manufacturers can strategize to achieve a zero-defect line.
Test Solutions Your EMS Partner Should Offer
When looking to outsource your manufacturing, you need to know that your chosen EMS partner has good test solutions in place so that they can produce consistent, high-quality products to your customers’ requirements. This article highlights the importance of test, and outlines the different types of test your EMS partner should offer.
Counterfeit: A Quality Conundrum
The rise in the ingress of counterfeit materials into the supply chain has made them prolific, though yet, the extent is understated. What needs to be faced now is the need for incoming inspection, but at what cost to industry, and does anyone remember how to do it?
RTW SMTAI: Mentor Eases Programming in Viscom Inspection Systems
Jesper Lykke, engineering manager for USA of Viscom AG, and Zac Elliott, technical marketing engineer at Mentor, speak with I-Connect007 Managing Editor Andy Shaughnessy about Viscom's adoption of the Valor Process Preparation and how it is helping users with their inspection programming.
BTC and SMT Rework Challenges
In the assembly of bottom terminated components (BTC), the formation of voids has become a serious problem in many applications. In the SMT process, the reliability of solder joints becomes more of a concern, as less and less solder is allowed for each joint. The presence of voids can deteriorate the joint strength and eventually lead to joint failure.
RTW SMTAI: AIM's Dr. Mehran Maalekian Speaks on New Alloys for Harsh Environments
Dr. Mehran Maalekian, R&D Manager at AIM Solder, speaks with I-Connect007 Managing Editor Andy Shaughnessy about new alloys that are targeted for high-temperature and demanding applications, particularly in harsh environments, where standard lead-free alloy such as SAC will not perform as well.
How to Prevent Suspect Components from Entering Your Supply Chain
The success of any supply chain relies on quality and stability. If either of these elements are threatened, OEMs or their EMS provider will struggle to ensure supply chain excellence. Unfortunately, with the risk of counterfeit and other suspect components ever present, this can sometimes be difficult to achieve.
RTW SMTAI: Alpha Discusses Solder Dross Reclamation
At the recent SMTA International 2017 exhibition in Rosemont, Illinois, Mitch Holtzer, director of Americas Reclaim Business of Alpha Assembly Solutions, talks with Managing Editor Andy Shaughnessy about the solder dross reclamation process, and discusses his new role in leading Alpha’s reclamation business.
RTW SMTAI: MIRTEC on Staying Ahead of the Curve
Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.
Rework and Reliability: Less is More!
Circuit boards are not always perfect after reflow or wave soldering. Scrapping boards with one or two defects is expensive, so rework happens. A good concept for rework is less is more, especially less flux. Use as little rework flux as possible, as in the old Brylcreem ads, "Just a little dab'll do ya."
RTW NEPCON South China: Vermes Discusses Piezo Technology in Microdispensing
During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Microdispensing GmbH, discusses their latest innovations in microdispensing, and how their piezo technology is addressing the trend towards miniaturization in PCB assemblies.
RTW NEPCON South China: JBC Brings Digital Transformation to Hand Soldering Process
Enrique Moreno, technical support engineer at JBC Soldering SL, and I-Connect007 Managing Editor Stephen Las Marias discuss the latest developments in the hand soldering process, including robotics and automation. Moreno also talks about the opportunities in China, and why their Industry 4.0-enabled solutions are suitable for this market.
Improving the Rework Process
An optimized SMT assembly process typically provides a yield of nearly 100%. Technology advancements—from the solder paste printing process, SPI, and parts placement, to reflow and wave soldering and AOI—have pushed the efficiency and accuracy of these steps in the SMT process such that a board assembly should be perfect at the end of the line. Still, EMS providers continually face the need to rework and repair PCBAs even after dialing in the perfect set-up.
RTW NEPCON South China: KYZEN on Optimizing the Cleaning Process
At the NEPCON South China event happening this week in Shenzhen, China, Thomas Forsythe, executive vice president at KYZEN Corp., discusses the current cleaning challenges in the PCB assembly industry, and how manufacturers can optimize their cleaning process.
NEPCON South China 2017 Opens Today
NEPCON South China 2017, being held in conjunction with the Shenzhen Circuit Sourcing 2017 and Automotive World China, opens its doors today at the Shenzhen Convention and Exhibition Center to showcase nearly 600 companies catering to the electronics manufacturing industry. This year’s event, the largest ever in the show's 30-year history, features 45,000 square meters of exhibition space.
It was Acceptable in the Noughties
In many software products for manufacturing, the common approach previously was to show as many as possible, if not all, of the various data elements about products, machines and processes to engineers, who liked to feel totally in control of what they were doing. The need, however, to manage complex databases, to have detailed views of values and attributes of anything in the digital domain, rapidly became a major distraction to people performing their designated roles.
Sourcing PCBA: Can Your EMS Supplier Do More?
You're in the market for some PCB assemblies for your new product and you need to find the right supplier. You've looked online, gotten recommendations from friends, and the choices are dizzying. Should you look domestically or overseas? What do you do now? Sourcing PCBA doesn't have to be difficult, but there are questions you need to answer.
Soldering Fumes in Electronics Manufacturing: Damaging Effects and Solutions for Removal
No matter which soldering process you analyze, all of them have one aspect in common: They produce airborne pollutants, which may have a negative impact on employees, plants and products as well. This article discusses the damaging effects of soldering fumes, and solutions for their removal.
Verification of Inspection Results: Local, Central, Global?
With the need for flexibility in production processes amid increasing globalized manufacturing strategies, manufacturers should consider powerful inspection tools that not only provide central verification of numerous lines in local and overseas production sites, but also with a comprehensive presentation of inspection results.
Process Step Elimination: Driven by Cost and Efficiency, Enabled by Process and Materials Innovation
Electronics manufacturing has evolved from the early days of hand soldering and wave soldering to the more modern SMT process. But while most modern electronics are produced using the SMT process, there are still some mixed technology applications that need both the SMT process and the wave soldering process. This article looks into the pin-in-paste (PiP) process, which enables the soldering of through-hole components during SMT processing, and eliminates the need for the wave process.
The Need for Assembly Training and Education
While investing in the latest technologies and having a systems-based approach in your assembly processes are important, the key factors that will make you successful in your continuous improvement goal are the skills, training, and education of your workforce. However you look at it, the human factor remains a critical issue when it comes to your overall efficiency.
Pillarhouse International's Allan Jiang Discusses Selective Soldering Developments
At the recent NEPCON China event in Shanghai, Allan Jiang, sales manager at Pillarhouse International, discusses with I-Connect007 Managing Editor Stephen Las Marias some of the challenges in selective soldering, and technology developments to address these issues.
4 Ways Your EMS Partner Can Respond to Supply Chain Disruption
When disruptions to the electronic component supply chain occur, they are painful. Lead-times can extend overnight, prices can treble, and in some cases, parts are placed on allocation or discontinued altogether. These concerns amplify the need for EMS firms to have practices in place for dealing with supply chain disruption. This article discusses four ways your EMS partner can mitigate risks to your supply chain.
The Role of Industry Associations in Training and Education
Industry associations, such as the IPC and the SMTA, help advance the electronics manufacturing industry through standardization, training, education, advocacy, and interaction through trade events, exhibitions and symposiums. They help members to become aware of the latest technology developments happening in their industry verticals, and of the market trends shaping the direction of the industry.
Today’s Mil/Aero Enemies: Counterfeits, Obsolescence and Failure
The need for high-reliability electronics, components and assemblies that can perform in harsh operating conditions involving extreme temperatures, vibration, and moisture continue to challenge electronics assembly providers catering to the military and aerospace markets. These are on top of current manufacturing issues such as the miniaturization of products, shrinking component sizes, higher density board assemblies, and the obsolescence of electronic components.
The Importance of Conformal Coating, Now and in the Future
At the SMTA Michigan Expo and Tech Forum, held in Grand Rapids on May 11, Technical Editor Happy Holden spent a few minutes with AIM Solder’s Technical Marketing Manager Tim O’Neill to discuss O’Neill’s presentation on the topic of conformal coating over no-clean fluxes.
EMS Firm Tsukiden Electronics Seeing More Business in Prototypes
At the recent Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) held in Manila, Karen Flordiles, marketing supervisor at EMS firm Tsukiden Electronics Philippines Inc., talks about their customers' changing requirements and their manufacturing challenges. She also discussed new opportunities they are seeing in the EMS sector.
Assembly Training and Education
Even if your PCB assembly process is optimized, there is always room for improvement. And no matter how successful your company has been in the past, you just can’t rest on your laurels. It is always in your best interest to strive towards a better operations model. We've created a survey to help us gauge the importance of training and education in your workforce, and the benefits that you get in ensuring that your operators and engineers have the most current knowledge and skill sets.
High-Volume Test Strategies
In an interview with I-Connect007 during the recent NEPCON China event in Shanghai, Siegmund Hornig, director of global sales for Europe and Asia, for production board test division at Teradyne discusses the new testing demands from customers, and strategies to help them address their high-volume test requirements.
Koh Young Discusses Latest 3D AOI Innovations
Koh Young Technology's Scott Kim, overseas sales team manager, talks about the latest challenges and developments happening in inspection technologies, the new demands and requirements from customers, as well as the key factors to consider when it comes to buying inspection systems.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
3D Inspection is the Way to Go
In an interview with SMT Magazine during NEPCON China, Guido Bornemann, head of sales in Asia for Viscom, discusses how inspection technology is keeping up with the latest requirements and demands from customers. He also explains why 3D technology is the best inspection technology to utilize in electronics assembly.
3D: Towards Better Inspection Capability
For this month's issue of SMT Magazine, we spoke with Mark McMeen, vice president of engineering at STI Electronics, to know more about the inspection challenges and requirements from an EMS provider's standpoint. We also talked with Jean-Marc Peallat, vice president of global sales at Vi TECHNOLOGY, to find out, from a supplier's perspective, how they are looking at these challenges and addressing them through their product development efforts.
2D X-ray Inspection With Materials and Thickness Identification
The need to inspect electronic components and assemblies non-destructively is the main driver behind the development of X-ray inspection technology. In many cases, X-ray inspection provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through-holes, TSVs, microbumps, and copper pillars.
Shenzhen Axxon Discusses Acquisition and Dispensing Market Trends
Ivan Li, general manager at Shenzhen Axxon Automation Co. Ltd (China), discusses their recent acquisition by Mycronic, as well as the latest developments in the dispensing market. Also discussed is the China market, and how the company is staying ahead of the increasing competition in the dispensing industry.
RTW NEPCON CHINA: Teknek Discusses Contact Cleaning Technology Trends
Stephen Mitchell, managing director of Teknek, a contact cleaning solutions provider, discusses the latest trends in contact cleaning technology. He provides his outlook on China’s electronics manufacturing industry and intelligent manufacturing, and talks about how Teknek's contact cleaning systems are helping customers address their defects and productivity issues.
RTW NEPCON CHINA: Interflux to Revolutionize Solder Industry
At the recent NEPCON China event in Shanghai, Daniel Werkhoven, CEO of Belgium-based soldering chemistry provider Interflux Electronics N.V., talks with I-Connect007 Managing Editor Stephen Las Marias about how their new bismuth-based solder alloy will help improve the soldering process.
Tape and Reel Solder Preforms: A Success Story for the UD00 X86 SECO Board
SECO's latest product innovation, UDOO X86, is a real computer with an integrated Arduino 101 compatible board that is capable of running games and videos in 4K. But while the success of the UDOO X86 is impressive, so is SECO's ability to develop this game-changing product with low-cost technology for mass appeal and affordability.
Vapor Degreasing Chemistries to Remove Difficult Lead-Free and No-Clean Fluxes from PCBs
In line with increasing regulations on electronics manufacturing, many changes have been made to the electronics world, and thus the circuit board manufacturing process. Lead-free, no-clean and halide-free flux formulations have introduced new cleaning obstacles, especially on ever-shrinking component sizes. To maintain high cleanliness standards for modern circuitry, new sophisticated cleaning chemistries are required.
Business and Technical Developments at Super Dry Totech
At the recent SMT Hybrid Packaging show in Nuremberg, Germany, I-Connect007 Technical Editor Pete Starkey visits Super Dry Totech and spends a few minutes with CEO Jos Brehler and Sales Manager Terry Morgan to talk about the rationale behind ASYS Group's acquisition of stake in Super Dry Totech, as well as the latest technology developments happening at the company.
Mentor Graphics: Connecting the Manufacturing Environment
Oren Manor serves as the director of business development for Mentor Graphics Valor Division. In this interview with SMT Magazine, Manor discusses the latest updates in their OML community, their case study regarding Phoenix Contact’s implementation of their IoT solution in its facilities, and what’s new in ODB++.
Voiding Control at High-Power Die-Attach Preform Soldering
Voiding in the solder joint is a concern for high-reliability and high-performance devices. This paper discusses a study on voiding behavior of large pad high-power devices simulated with Cu coupon to Cu coupon sandwiches. A flux-coated preform was studied in this assembly, with variation in solder alloy type, quantity of solid flux coated on solder preform, Cu coupon pre-oxidation extent, reflow temperature, and pressure exerted onto the sandwich during reflow.
Keeping an Eye on the Next Generation
Why should a company in our industry dedicate hours to providing professional development to a group of temporary student interns? Why should they open their doors to kids, some of whom haven’t even entered high school? For Indium, the short answer is, it makes them better. Read on to find out why.
Blackfox Program Trains Vets for Manufacturing Jobs
It's harder than ever for managers in the PCB manufacturing industry to find qualified staff, with some reporting that positions are remaining open for months at a time. On the other hand, there are thousands of soldiers, sailors, airmen and marines transitioning out of the service each year and seeking good jobs. In this interview, Allen Dill, president of Blackfox, discusses their program that offers manufacturing training to veterans, even while they are still in the military.
The Building Blocks of Industry 4.0
At the recent IPC APEX EXPO, Kevin Decker-Weiss, director of sales at CircuitByte, joins panellist from Mentor Graphics and EMS firm Saline Lectronics in a roundtable on the building blocks of Industry 4.0 hosted by Scoop. Here is his take on that panel and the show.
RTW IPC APEX EXPO: Metcal Brings Disruptive Technology in Hand Soldering
Christopher Larocca, president and CEO of OK International (of which Metcal is a division), tells I-Connect007 Publisher Barry Matties their strategy for improving the hand solder process. He describes a lack of process feedback to the operator as a core problem inherent in the hand soldering process, and discusses how OK International has developed an innovative solution to address the issue.
Dry Storage Cabinets' Role in Industry 4.0
At IPC APEX EXPO 2017, Rich Heimsch, Super Dry’s Director of the Americas, discusses the electronics manufacturing industry’s different versions of Industry 4.0, and his company's strategies in dealing with all of them. He also talks about Super Dry's latest storage developments.
Navigating the Complex World of Flex Circuit Assembly
We recently conducted a survey on flexible printed circuits to know more about the challenges that designers, fabricators, and assemblers face when dealing with flex circuits. We asked what steps in their processes have the biggest effect on yields; the challenge they face when dealing with flex circuit materials; as well as the factors that have the greatest impact on the quality of their flex circuit design, fabrication and assembly.
Alpha Papers Investigate High-Reliability Solder Alloys
During SMTA International, Morgana Ribas, manager of Metals Technology Group at Alpha Assembly Solutions, presented a pair of papers that focus on the company’s reliability testing of solder alloys. I-Connect007 Managing Editor Andy Shaughnessy sat down with Morgana to discuss these papers, and some of the surprising results that the testing yielded.
Electrolube Talks Technologies Targeted at Automotive and LED Applications
Electrolube's Phil Kinner, global head for the conformal coatings business, talks about the trends shaping the company’s product innovation strategies, and their latest solutions and technologies to help address their customers’ greatest challenges.
Alpha on New Technologies to Tackle Voiding
Tom Hunsinger, vice president of marketing at Alpha Assembly Solutions, discusses with SMT Magazine how their company is addressing voiding—one of the greatest challenges in soldering. He talks about the latest market development trends that are shaping product innovation strategies at Alpha. Hunsinger also details some of their latest solder technologies, and how they are helping their customers address their soldering challenges.
SMT Xtra Discusses Expansion Plans in the US
At the IPC APEX EXPO 2017 event in San Diego, SMT Xtra's Alexandra Stovin, marketing and public relations manager, and Paul Pittman, sales manager for the United States and Canada, speaks with I-Connect007 Technical Editor Pete Starkey about their company’s expansion plans in the U.S. and the benefits they offer their customers.
RTW IPC APEX EXPO: Nordson Highlights Improvements in Dispensing and Conformal Coating Systems
Roberta J. Foster-Smith, global marketing communications manager for Nordson ASYMTEK, discusses the continued improvements in Nordson's dispensing and conformal coating equipment, especially when it comes to automation, precision and consistency in delivering ever-finer deposits to meet industry demands and customer needs.
RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
RTW IPC APEX EXPO: KIC on Smart Factory Technology Approach in Thermal Ovens
Bjorn Dahle, president of KIC Thermal, discusses with I-Connect007 Guest Editor Dick Crowe their approach to measuring temperatures in thermal ovens and networking the information to a main frame, to enable the process engineer to statistically monitor a specific process.
RTW IPC APEX EXPO: Alpha Highlights Solder Reclaim Technology
Mitch Holtzer, director of Americas Reclaim Business for Alpha Assembly Solutions, discusses the company’s reclamation technology, which takes solder dross, used solder paste, and solder paste debris and converts it into reusable soldering materials. He also talks about how solder reclamation can help sustainability efforts, and how it helps customers when it comes to their waste materials.
RTW IPC APEX EXPO: Electrolube Discusses New Conformal Coating Technologies
Phil Kinner, technical director of the coatings division at Electrolube, discusses with I-Connect007 Guest Editor Dick Crowe the latest trends happening in the coatings industry, and how their solutions help customers enhance the reliability of their electronics assemblies.
RTW IPC APEX EXPO: Rehm Highlights Reflow Improvements for Reliable Solder Results
Michael Hanke, CCO of Rehm Thermal Systems, highlights the latest developments in their reflow solutions, which are targeted at improving the reliability of the soldering process. He also discusses their complete solution, which is inline with the Industry 4.0 trend.
Real Time with...IPC: Cogiscan Discusses Connectivity Solutions to Enable Industry 4.0
Francois Monette, VP Sales and Marketing at Cogiscan Inc., talks about how the industry can meet the challenge of connecting different machines, software and enterprise systems to enable Industry 4.0 for the electronics assembly industry.
Real Time with...IPC: CalcuQuote on Risk Assessment and RFQ Management
Chintan Sutaria, president of CalcuQuote, discusses how their RFQ management system, with its risk assessment feature, helps EMS customers improve their supply chain. He also talks about their new BidCQ solution is improving the bidding process.
Real Time with...IPC: Alpha Discusses Improving LED Reliability Issues
At this week's IPC APEX EXPO 2017 in San Diego, California, Steve Godber, LED Commercial Manager at Alpha Assembly Solutions, discusses with I-Connect007's Stephen Las Marias the reliability and voiding challenges in the LED market, and how the company is helping their customers address these issues through their solder technologies.
Investing in New Technologies
Electronics manufacturers are beginning to consider investing in new systems to take their processes to the next level. In our recent survey on the topic of new technology, the top reasons cited by manufacturers to invest in new technologies are to increase efficiency, improve yield, reduce cycle time, and the advance capability of the process.
Reflections on 40 Years of Test and Measurement and What Lies Ahead
Dr. James Truchard, President, CEO, and Cofounder of National Instruments, has penned his reflections on the last 40 years driving and leading some of the greatest progress and innovations the test and measurement industry has seen. In the article, he also leaves us with his thoughts on how he envisions the future to be.
The Time Has Come for Jet Printing
At the recent NEPCON South China 2016 trade show in Shenzhen, Thomas Bredin, area sales manager at Mycronic, discusses with I-Connect007's Stephen Las Marias the latest developments in jet printing technology, and their recent acquisition of Shenzhen Axxon Automation.
Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability
Lead free solder joint reliability in drop shock loading has been a recurring issue in mobile and handheld consumer electronics. Changing solder composition may offer an opportunity to improve joint drop reliability. This study focuses on different failure modes in circuit board assemblies as observed based on solder composition, board surface finish, and solder joint volume.
The Influence of Clean Air on the Value-Added Chain in Electronics Production
A multitude of different processes in modern electronics production—from connection and separation technologies, surface processing such as marking and drilling, the utilisation of fluxes, up to production processes such as soldering, welding and gluing—generate harmful substances that might have extreme health impacts and affect production plants and products.
CES 2017: Press Day, Launch.It and Showstoppers
Before the show opens, CES provides two days and evenings not open to the general attendees, to enable companies, large and small, an opportunity to present their new offerings to the press. These opportunities range from small meetings with individual members of the trade press to huge events such as those presented by Samsung, Asus, Sony, Intel, Panasonic and others, with literally several hundred in attendance.
Editor's Note: Understanding Plating and Surface Finishing
This month’s issue of SMT Magazine focuses on the impact of plating and surface finishing in electronics assembly. True, plating and surface finishing may be more directly significant in PCB fabrication, but surely they are important issues as well when it comes to the assembly side. In fact, according to our recent survey, 82% of the respondents said surface finishing impacts their assembly process.
Successful Sales Strategies
At the recent NIDays 2016 event in Singapore, Matej Krajnc of National Instruments speaks with I-Connect007's Stephen Las Marias about the challenges for sales and marketing executives in the electronics manufacturing industry, effective sales strategies, and key attributes of a sales person. He also shares his outlook on some of the key technology trends for next year.
The Hunt for the Best Pre-Owned SMT Equipment Supplier
There are many SMT equipment resellers out there, some with many years of experience and others that are merely intermediaries between a company that’s trying to sell their surplus equipment and you. With that in mind, think of what you can afford not only in terms of the cost of equipment, but also regarding installation, training and support.
Sales and Marketing in a Digital Transformation Reality
While many of the common sales and marketing best practices apply to the PCB assembly industry, however, deep manufacturing and electronics design expertise is required to truly drive customer interactions from one-off transactions into long and sustaining relationships as the industry goes through rapid change such as the larger involvement of a younger generation in the workforce, and the move to digital transformation and smart manufacturing.
Meeting Current and Future Requirements of the Automotive Industry
Phil Kinner, technical director of Electrolube's Coatings Division, speaks with I-Connect007's Pete Starkey about the role of conformal coatings in various applications of the automotive industry. He talks about thermal shock testing, and provides updates on their collaboration with the National Physical Lab on condensation testing.
Tin Whisker Mitigation Methodologies Report from SMART Group, Part 2
Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In the second part of this two-part article series, Editor Pete Starkey concludes his review of the SMART Group's recent seminar, which is focused on tin whisker mitigation methodologies and strategies.
Solder Voiding, Autonomous Autos, and Statistics—So Much to Learn from Dr. Ron
While at the 2016 SMTA International conference and show, I had the lucky opportunity to talk with Indium Corporation’s Dr. Ron Lasky. He gave a great synopsis of the extensive testing done by Indium Corporation’s Chris Nash on solder voids, outlined in a paper co-authored by the two, which was being presented by Ron at the conference.
Living Up to Their Name at Alpha Assembly Solutions
At SMTAI in October, I-Connect007's Judy Warner spent some quality time with Alpha Assembly Solutions' Jason Fullerton, to discuss Alpha's innovative new products. Fullerton also discussed a paper he was presenting, which compares two lead-free, silver-free alloys in a selective soldering application.
electronica 2016 Impressions
Germany’s third-largest city, and capital of the southeastern state of Bavaria, Munich was once more host to electronica, which can justifiably claim to be the world’s leading trade fair for electronic components, systems and applications.
The Impact of Vias on PCB Assembly
Via technology has been one of the solutions to address the miniaturization and component density challenges in current electronic assemblies. However, vias are not without their own set of challenges. As per our recent survey, these include impedance matching, routing, placement of vias, minimum size limitations, aspect ratio, and the limitations for the PCB manufacturer.
Electrolube on Addressing Thermal Management Issues in LEDs
At the recent electronica 2016 trade show in Munich, Germany, Jade Bridges, global technical support manager of Electrolube, speaks with I-Connect007’s Pete Starkey about how they are helping customers address the thermal management challenges in electronics assemblies, including LEDs and LED assemblies.
Electrolube’s Alistair Little on Thermal Management in Automotive Electronics
At electronica 2016, Alistair Little, technical director of Electrolube’s Resins Division, sits down with Editor Pete Starkey to discuss thermal management challenges in the automotive industry, and how their resin solutions are helping customers address those high-temperature requirements.
Chintan Sutaria: CalcuQuote Aims to Disrupt EMS Quoting Status Quo
Chintan Sutaria of CalcuQuote speaks with I-Connect007's Judy Warner about what inspired him to develop CalcuQuote. He also explains how CalcuQuote supports capturing customers' requirements to coming up with labor and material costs, allocating overhead, markups, and following up with the customer.
How to Improve PCB Reliability
Component failure rates have steadily declined over the years to the point where non-component failure sources have become the dominant cause of failures for a PCB. If the reliability of the components is becoming a non-issue, then the only way to improve electronics further—for this article, automotive electronics—is to look at the non-component aspects of the electronics, and a significant one is the PCB.
Real Time with... SMTAI: Mirtec’s Brian D’Amico Discusses Benefits of 3D Inspection Technologies
Brian D'Amico, president of Mirtec, discusses with I-Connect007’s Andy Shaughnessy why more and more manufacturers are adopting 3D inspection technologies, such as 3D AOI and 3D SPI systems. He also mentions the increasing use of very small components—such as the 0201s and 01005s—and the advent of the 03015s.
How to Specify a Custom Machine
Let’s say you have an unusual product configuration, a unique space requirement, an unorthodox handling system, or an application totally unrelated to the PCB or SMT assembly business, and you can’t find a standard machine provider that can handle your requirements. What then? This article highlights key points to consider when going the custom machine way for your project.
Being More than a Manufacturer’s Rep
Matt Bonweg, process support specialist at manufacturers' rep firm Murray Percival Company, speaks with I-Connect007's Patty Goldman during the recent SMTA Ohio Expo about the company's history and philosophy, as well as their strategies for success in this industry.
Silicon Valley SMTA Chapter President Kevin McClay on Evolution and Current Status of SMTA
Kevin McClay, president of Silicon Valley SMTA Chapter, speaks with I-Connect007’s Judy Warner on the activities of the SMTA in the Valley, and the challenge of attracting young talent to join the manufacturing engineering industry.
Digital X-Ray—For More Than Inspection
At the recent SMTA Ohio Expo, Sheri Martin, sales manager at YXLON, spoke with I-Connect007's Patty Goldman about her company, their digital X-ray system, and the value of joining such trade events, and the benefits of using X-ray when it comes to failure analysis.
Real Time with NEPCON South China: Mentor Graphics Discusses Control on the Shop Floor
Ofer Lavi Ben David, director of shop floor manufacturing solutions at Mentor Graphics Valor Division, talks with I-Connect007’s Stephen Las Marias about how the smart factory should look, their Open Manufacturing Language, and their solution to provide end-to-end visibility and control in the shop floor.
Real Time with NEPCON South China: BTU Talks Voiding in Automotive Electronics, Industry 4.0 Strategies
At NEPCON South China 2016, Bob Bouchard of BTU International Inc. discusses with I-Connect007’s Stephen Las Marias the challenges and opportunities in the China market, how BTU is helping address voiding issues in automotive electronics assemblies, and their Industry 4.0 strategies.
Real Time with NEPCON South China: WKK on Automation, China Outlook, Challenges and Opportunities
Victor J.S. Chang, director and general manager of WKK Distribution Ltd, discusses with I-Connect007's Stephen Las Marias the increasing automation trend in the region; the efforts of the Chinese government to support the growth of advanced manufacturing; and the latest initiatives at WKK.
Real Time with NEPCON South China: Rehm Thermal Systems Highlights Industry 4.0 Benefits
In Shenzhen, China, Ralf Wagenfuehr, plant manager for Rehm Thermal Systems, speaks with I-Connect007’s Stephen Las Marias about Industry 4.0 and the benefits of this automation trend.
Real Time with NEPCON South China: P. Kay Metal Discusses New Markets for MS2
James Goyne, the newly appointed global business development director at P. Kay Metal Inc., speaks with I-Connect007's Stephen Las Marias about what he aims to achieve in his new role, as well as the new markets and opportunities for their MS2 solder dross eliminator.
Will The “Internet of Manufacturing” Really Impact Business?
Supporting legacy, new, and future automated processes, as well as the vast number of manual processes in use today, is the key to being able to successfully introduce the Internet of Manufacturing into SMT production.
The Industry Speaks
In the latest issue of SMT Magazine, we take a pause from covering the latest technology trends, challenges, and solutions in the electronics manufacturing and assembly industry. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points when it comes to their respective specialties.
EPC’s Michael de Rooij Discusses Strategic Partnership with Wurth Electronik
Michael de Rooij, PhD, of Efficient Power Conversion Corp. (EPC) talks to I-Connect007 guest editor Kim Sauer about their strategic alliance with Wurth Electronik, how their cooperation works, and how the technology solution they are co-developing can address the wireless power challenge as a whole.
An Integrated PCB Producer’s Approach to the Market
NCAB Group is one of the biggest PCB suppliers in the world. Barry Matties and Stephen Las Marias recently met with Andy Liu of NCAB to discuss an integrated producer’s approach to the market, new design tools, the current state of the Chinese market, and the future of 3D printed electronics.
Designers Notebook: Specifying Lead-Free Compatible Surface Finish and Coating for Solderability and Surface Protection
A majority of the components furnished for electronic assembly are designed for solder attachment to metalized land patterns specifically designed for each device type. Providing a solder process-compatible surface finish on these land patterns is vital; however, selection of the surface finish on the circuit structure, whether plated or coated, can be greatly influenced by the components’ terminal metalization and the specific alloy composition used for the assembly process.
Improving Test and Inspection
In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.
Hand Soldering: The Move Toward Automation
At the recent NEPCON event in Shanghai, JBC's Domingo Taberner discussed with I-Connect007's Barry Matties the hand soldering market in China, the move towards automation, the greatest challenges their customers have in soldering, and what to know about choosing the right temperature and tip.
A First-Timer's Perspective on IMPACT Washington, D.C. 2016
I-Connect007 editor Patty Goldman speaks with Faisal Pandit, president of Panasonic Factory Solutions Company, during the recent IMPACT Washington D.C. 2016 event. They discuss his experience as a first-time attendee, and his reasons for attending the event this year.
Solder Paste Dispensing: Breaking the Limits of Printing
In an interview with SMT Magazine, Eric Gu, application manager at Nordson Asymtek China, talks about the greatest challenges and innovations in solder paste dispensing, and factors to consider when using solder paste dispensers.
Solder Jet Printing: Keeping Up with the Challenges
In an interview with SMT Magazine, Thomas Bredin, area sales manager at Mycronic, discusses solder paste printing, and how the jet printers are getting up to speed with the challenges such as tighter tolerances and finer lines and pitches. He also talks about key factors to consider when selecting a solder paste printer, and what Mycronic 4.0 is all about.
RTW IPC APEX EXPO: ACE's Alan Cable Discusses Benefits of Selective Soldering, and Need for Lead Tinning
Alan Cable, president of ACE Production Technologies, talks to I-Connect007 guest editor Mark Thompson about selective soldering and how it helps electronics assemblers overcome the high cost of labor.
Selecting a Selective Soldering System, Part 3
The previous two articles on selective soldering covered the different applications well-suited to this technology, and the various types of fluxing methods available. In this article, Robert Voigt discusses the common types of soldering technologies available, as well as nitrogen inerting systems.
Improving the Solder Paste Printing Cycle Times
At the recent NEPCON China show in Shanghai, I interviewed Adam Sim, senior sales manager at Speedline ITW EAE, about the challenges in solder stencil printing, how printing cycle times may be improved, and the key factors to consider when selecting a solder paste printing solution.
Solder Paste Printing: Challenges and Best Practices
In an interview with SMT Magazine, Watson Tseng, General Manager of Shenmao America Inc., talks about the challenges in solder paste printing, key parameters and best practices to consider, and variables involved when it comes to selecting the appropriate solder paste for the printing process.
The Solder Paste Factor in Printing
Mitch Holtzer, Alpha Assembly Solutions’ global director of customer technical support, and expert columnist at SMT Magazine, talks about the challenges that customers face when it comes to solder paste printing, the impact of solder pastes on the printing process, and the variables involved when selecting the type of solder to use for specific applications.
3D Solder Joint Reconstruction on SMD Based on 2D Images
Solder joint inspection has been a critical issue for quality control, mainly due to their specular reflections. AOI systems have been faced with the same difficulty for solder inspection. This paper presents an algorithm for 3D solder joint reconstruction, which gives 3D analysis capability to the traditional 2D AOI equipment, practically without increasing the financial cost and with no cycle time impact, bringing 2D AOI equipment back into the game of SMT technology.
Solder Paste Exploration
From the manufacturers of solder pastes, to equipment makers, all the way to the solder paste inspection guys, and the electronics assemblers who are using their products, I talked to the supply chain to find out what’s going on in the solder paste printing process, what factors impact the process, the challenges, and the best practices to consider to be able to address those challenges and improve efficiencies and yield in the SMT line.
Selecting a Selective Soldering System, Part 2
In Part 1, Robert Voigt began a discussion of selective soldering, including how it works, some pros and cons, and several fluxing and soldering options to choose from. This chapter dives a little deeper into the mechanics of fluxing systems.
What’s in a Name? ICAPE Group’s Glenn Colescott Explains
Glenn Colescott, director of ICAPE USA, speaks with I-Connect007's Patty Goldman about his company, their expansion plans, why they attend regional shows like the SMTA West Penn Chapter Expo & Tech Forum, and how they make customers get over the phobia over a trading company.
Electrolube: We Like Problems (Chinese Style)
In a follow-up interview, Ron Jakeman, group managing director of Electrolube, discusses with I-Connect007's Pete Starkey his company's strategy in China and the opportunities they are seeing in the region. They also discussed the company's two new products that will complement their European range.
China, Trump, and the Future
At NEPCON China, Hamed El-Abd of WKK and I-Connect007's Barry Matties discussed China’s fluctuating economy, the impact of the U.S. presidential election, the current state of electronics manufacturing in the region, and the overall craziness of doing business in modern day China.
Making Systems Smarter to Gain Visibility, Traceability, and Reduce Handling Errors
At the recent IPC APEX EXPO event in Las Vegas, Bjorn Dahle, president of KIC, talks about his views on automation, the technology improvements being made in reflow ovens, and some of the strategies to reduce handling errors in assembly lines.
Strategies to Reduce Handling Errors in Your Rework Process
In this interview during the recent IPC APEX EXPO in Las Vegas, Donald Naugler, president and general manager of VJ Electronix, discusses rework challenges and strategies to help customers reduce handling errors in their processes. He also talks about automation, and the impact of Industry 4.0 in the electronics assembly industry.
Selective Soldering: Design, Process Challenges and Practical Solutions
A SMART Group workshop at the Bromsgrove, UK, premises of equipment and process materials distributor APP Electronics, set out to provide the answers, with a programme combining technical presentations, live demonstrations and hands-on sessions, introduced and moderated by Nigel Burtt, senior electronics manufacturing engineer at Renishaw and SMART Technical Committee Chairman.
Selecting a Selective Soldering System, Part 1
So far in this series, we’ve covered stencil printers, pick and place machines, reflow ovens and multiple types of through-hole soldering. In this and the next couple of chapters, we’ll discuss selective soldering machines. It’s useful to start by understanding why and when selective soldering is used.
RTW IPC APEX EXPO: Kurtz Ersa Talks Latest Innovations
Ernie Grice of Kurtz Ersa North America speaks with I-Connect007 guest editor Mark Thompson about their latest innovations, including voidless reflow machines, selective soldering machines and rework systems, as well as a new paste printer that incorporates a 3D inspection system.
Taking the Gremlins Out of Your Process
Every step in your assembly line is supposed to be designed to perform optimally for you to have an efficient, reliable, robust and reproducible process. However, and as isolated as they may seem, "gremlins" sometimes appear and mess up the results of a batch. The latest issue of SMT Magazine features strategies that can help you address these issues.
IPC APEX EXPO: Mirtec's D'Amico Speaks on How 3D AOI Tackles SMT Inspection Challenges
Brian D'Amico, president of Mirtec, speaks with I-Connect007 guest editor Bob Neves about the inspection challenges in the SMT industry amid the continuing trend towards smaller devices and components, and how 3D AOI is helping manufacturers address these issues.
IPC APEX EXPO: Technica USA and ASM Americas Highlight Expanded Partnership
In this interview with I-Connect007’s Andy Shaughnessy, Jeff Timms, Managing Director, ASM Assembly Systems Americas, and Frank Medina, president of Technica, discuss their expanded cooperation.
IPC APEX EXPO: Manncorp Talks 50 Years in Business
Henry Mann, founder and CEO of Manncorp, discusses with I-Connect007’s Stephen Las Marias the highlights of their 50 years in this industry, and the changes he had seen over the past five decades. He also provides his outlook on where the industry is headed.
IPC APEX EXPO: Rethink Robotics Provides a Glimpse into the Future of Electronics Assembly Industry
Carl Palme, applications product manager at Rethink Robotics, discusses with I-Connect007's Stephen Las Marias the impact of robotics, and its future, in the electronics assembly industry.
IPC APEX EXPO: AIM's O'Neill Highlights M8 Solder Paste
Timothy O'Neill, technical marketing manager at AIM Solder, updates I-Connect007 Guest Editor Mark Thompson about the company's M8 solder paste, which they launched at last year's APEX. O'Neill discusses how the product improves print quality and reduces voiding on bottom-terminated devices.
Reflow Oven Changeover in a World of Short Production Runs
When drilling down to the individual machines, you may find that the biggest drag on your productivity is the reflow oven. The use of more effective production planning and scheduling as well as modern data mining software to identify one or a few oven recipes may provide dramatic improvements to line changeover time and, consequently, profits.
A Practical Guide to Managing Material Cost Impact
More SMT lines, faster machines, or new ERP software are not the only, or even the best, answers to achieve business goals in the electronics manufacturing and assembly industry. To win the race for survival, growth and profitability, companies must give the highest priority to the material operation and material handling tools.
According to our recent survey, the key challenges impacting profitablility of electronics manufacturers and assemblers are cost, process improvement, changing customer demand, design, training, and Lean manufacturing. The March 2016 issue of SMT Magazine highlights strategies that will help electronics manufacturers address those issues and achieve profitability in their operations.
While other electronic assembly processes measure performance in "more" – more feeders, more zones, more magnification, more capacity – cleaning equipment and chemicals measure progress in "less" – less water, less chemicals, less VOCs, less discharge, and less contamination. In this article, Aqueous Technologies' Mike Konrad writes why less is more in the cleaning world.
Efficiency, Energy and Convenience: Driving New Solutions and Markets
Craig Hunter, senior director for global marketing communications at Vishay Intertechnology and a member of the SMT Magazine Editorial Advisory Board, discusses significant changes in the electronics manufacturing industry during the past decade, persistent challenges, and new technologies that will provide opportunities and growth.
High-Reliability Interconnects for High-Power LED Assembly
New super-high and ultra-high-power LED package designs provide high lumen density that can enable significant system cost reductions through fewer LEDs, smaller PCBs, and smaller heat sink size requirements. This, however, puts significant performance demands on interconnects (solder joints in particular). This article talks about the role of high-reliability interconnects and where they fit in the LED lighting supply chain.
Selecting a Wave Soldering System, Part 3
In my last column, we discussed the attributes of the various types of wave solder systems, the most common through-hole assembly system for small- to mid-volume operations. In this chapter, we will dive a little deeper and address board handling techniques; in particular, the three common methods of running boards in wave soldering.
What You Need to Know About Dispensing
In an interview with I-Connect007, Garrett Wong, technical product manager at Nordson ASYMTEK, discusses the latest innovations in dispensing technology as well as important considerations when it comes to reliability, quality and speed.
Medical EMS: Opportunities Abound
Megatrends such as the increasingly ageing population and growing demand in emerging economies worldwide bode well for the medical electronics assembly industry. However, challenges such as margin pressures, compliance costs and risks, supply chain instability, and new product introduction headaches are hindering a more aggressive prognosis of the industry. But, with innovation, medical manufacturers can churn out more.
Top 10 Factors to Consider When Selecting a Medical EMS Company
Once the decision has been made to use an EMS company, selecting the right one involves several steps. Although most EMS companies perform the same basic services, every EMS company is different. In this article, Mo Ohady and David Estes of Digicom Electronics write the 10 key factors to consider when selecting your medical EMS company.
Why Medtech Manufacturers Should Automate Fluid Dispensing Operations
The fluids used to manufacture medical devices applications must be dispensed according to scientific principles—especially as devices shrink, parts are closer together, and substrates become more fragile and more prone to contamination. This article discusses how fluids can be dispensed most precisely, reliably, and repeatedly to help manufacturers save materials, time, labor, and resources.
Medical Electronics: Manufacturing Vitals
With the rapidly growing aging population, rising healthcare costs and increasing health awareness, opportunities abound in consumer medical devices, diagnostics, imaging, and instrumentation. However, the medical electronics industry is not without its own set of challenges. The January 2016 issue of SMT Magazine highlights the manufacturing challenges and opportunities in this growing sector.
OEM Applications: MacDermid’s OEM Director Embraces Renewed Focus
Lenora Toscano, OEM director for MacDermid’s electronics solutions division, discusses the needs of the end-user market of PCBs, her own role at the company, which involves much interaction with OEMs, and the benefits that both she and MacDermid bring to SMTA and IPC meetings.
Industry 4.0: Creating a Standard
Mentor Graphics Valor Division's Dan Hoz, general manager, and Ofer Lavi Ben David, product line director, discuss where Industry 4.0 is taking the industry, and the changes it will bring to both large and small companies, customers, and the supply chain, including how Mentor connects different machines on the shop floor to provide universal Industry 4.0 visibility.
2015's Most Read SMT Interviews
For 2015, we have interviewed a lot of industry experts and technologists to get their insights on the SMT, PCB assembly and EMS industries. In these interviews, they've talked about the latest developments happening in the industry—from a technology, manufacturing process, or business standpoints. Before we close this year, here's a look at the top 10 most-read interviews on SMT007.
VDMA Productronics: Pushing Forward the German Electronics Manufacturing Industry
VDMA Electronics, Micro and Nano Technologies is one of the 40 Sector Associations within VDMA. Its sector group Productronics covers the whole semiconductor front and backend processes, packaging, all the way to PCB manufacturing and assembly. Dr. Eric Maiser, managing director of Productronics, discusses the group, its activities, member services, and the electronics manufacturing industry.
Kester Highlights Strategies to Address High-Reliability Issues
Lynnette Colby, global product manager at Kester, discusses the biggest challenge their customers are facing—high reliability—and how using materials other than halogen can help address this issue. She also talks about how a complete solder solution—including the paste, flux and wire—help ensure the reliability of the electronics assembly.
Alpha Talks Challenges of Solder Recycling
Jason Fullerton, customer technical support engineer with Alpha, talked with I-Connect007's Patty Goldman about his presentation on recycling solder and why doing this in-house is not a good idea. He also discussed about the new, smaller particle solder pastes and about Alpha’s recycling program that is really beneficial to their customers.
Mentor Graphics: The Past, Present and Future of Analytics
Farid Anani, consulting manager with Mentor Graphics' Valor Division, discusses with I-Connect007's Andy Shaughnessy a paper he presented at SMTAI that focused on analytics and how it can be used to increase business revenue. He also talks about how far analytics has come in the last 20 years and where it may be headed in the future.
Saki Takes 3D Inspection to the Next Level
Eddie Ichiyama, general manager of Saki Europe GmbH and Saki Prague, discusses Saki's new 3D AOI and X-ray inspection equipment, the global inspection marketplace, and the move to reduce or eliminate the human interface. He also talked about their R&D center in the Czech Republic and its activities in the region.
SMART Group: The Guiding Influence in the Electronics Industry
Founded in 1984, the SMART Group promotes advanced manufacturing technologies and helps companies cope with the challenges of surface mount technology. In an interview with I-Connect007, Keith Bryant, chairman of SMART Group, discusses the association, its activities, and how it is supporting the electronics manufacturing and SMT industries.
Alpha's Morgana Ribas on Advances in Lead-Free, High-Reliability Alloys
Morgana Ribas, manager of Alpha's Metals Technology Group in India, presented a paper at the recent SMTA International show in Chicago. She sat down with I-Connect007's Andy Shaughnessy to discuss the paper's focus on high thermal reliability, and some of the new high-reliability lead-free alloys hitting the market.
AIM Solder Talks Innovations to Address Assembly, Reliability Issues
David Suraski, executive vice president at AIM Solder's assembly materials division, sat down with us at productronica 2015 to discuss the latest industry trends and customer challenges facing the solder industry, and innovations that are helping customers address their issues. Suraski also talked about reliability issues, and how the company is addressing them.
Saki America Wants to Dominate the Inspection Marketplace
At SMTAI, I-Connect007's Andy Shaughnessy spoke with Quintin Armstrong, general manager for North American sales and service with Saki America. Quintin discussed Saki’s 3D and X-ray inspection equipment and the company’s expansion around the globe, as well as the inspection challenges his customers face every day.
Making Connections with Associations
To provide our readers more information about their associations, this month's issue of SMT Magazine features articles and interviews with SMTA, IPC, iNEMI, SMART Group, and VDMA Productronics, to help understand more their activities, goals, and missions, and how they are helping push forward the electronics manufacturing industry.
Electrolube Discusses Conformal Coating Innovations
At productronica 2015, SMT007 editor, Stephen Las Marias, interviewed Phil Kinner, technical director of Electrolube's Coatings Division, about the latest conformal coating challenges being faced by their customers, and how they are addressing these issues. He also talked about the trends driving product innovation strategies at Electrolube, and some of the new solutions they are offering the market.
Super Dry Technology Helps Expand Market Share
Rich Heimsch, director of the Americas for Super Dry-Totech, discusses with I-Connect007's Andy Shaughnessy the specialized moisture management technology that Super Dry has developed, as well as how both the European and American markets are evolving with regard to use of the technology.
The New Industrial Era
Key transformative technologies such as big data, analytics, and IoT are ushering in a new industrial era, where new technology forces and innovations are changing the dynamics, risks, and success factors for global manufacturing companies. To be successful in this environment, a mindset shift is required when it comes to deciding what to do and how to take your manufacturing operations to the next level.
Is Automation the Answer to Cycle Time Reduction?
George Liu, sales manager of Finland-based Cencorp Automation, sat for an interview with I-Connect007 to discuss the benefits of automating the backend process to the overall manufacturing line, and why manufacturers need automated solutions now more than ever.
Rehm's Handler Discusses Latest Conformal Coating Machine
Paul Handler, general manager of Rehm Thermal Systems, discusses with I-Connect007's Andy Shaughnessy their latest conformal coating machine, which complements their IR or UV curing ovens. He also talks about the activities being done by the SMTA to provide technical knowledge and information to the industry as a whole.
Reducing Cycle Times with Innovative Bonding Solutions
In an interview with I-Connect007, Gudrun Weigel, head of engineering and a member of the board at Delo, discusses the importance of cycle time reduction, and how the company is helping its customers address this issue through its innovative bonding solutions.
Surface Mount Technology Association—a New Milestone
With a grand mission, SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. The organization delivers the right information at the right time to empower the workforce, who collectively advances technology, innovates new products, and serves the global industry.
BTU Talks Challenges and Trends Driving Product Development Strategies
Coco Zhang, product manager at BTU Ltd, discusses with I-Connect007's Stephen Las Marias some of the technology trends and customer challenges and requirements that are driving innovations in their reflow ovens. She talks about energy efficiency, the challenges of complex boards used in the telecom and server industry, and the advanced technology requirements from the semiconductor packaging industry.
Zestron Highlights Benefits of pH-neutral Cleaning Solutions
I-Connect007's Andy Shaughnessy talks with Zestron's Sal Sparacino, marketing and product manager, and Umut Tosun, application technology manager, about the benefits of the company's pH-neutral cleaning agents for defluxing applications, and their advantages over alkaline-based cleaning solutions.
Kyzen Discusses Cleaning On the Stencil Printer
Thomas Forsythe, executive vice president of Kyzen, talks with I-Connect007's Andy Shaughnessy about the latest trends happening at his company and their focus on green cleaning solutions. He also explained the technical paper they presented at the SMTAI 2015 conference, which tackles cleaning on the stencil printer.
NEPCON Shenzhen 2015 Puts Spotlight on China's EMS Industry
From ODM and OEM to EMS, the Chinese electronics manufacturing industry is transforming from single, passive processing to active, intelligent manufacturing—in line with the "Made in China 2025" plan, as well as the latest trends happening in the electronics industry.
A Greener, Money-saving Approach to Dealing with Waste
EMS firm Sanmina has a high technology manufacturing facility in Huntsville, Alabama, where it produces state of the art PCBAs on several advanced SMT lines, for some of the world’s leading medical and defense companies. Here's how the company was able to manage its hazardous waste disposal and be certified by ADEM, one of the strictest state regulatory agencies in the country.
SMT Magazine August Issue Tackles War on Process Failure
Based on our survey, there are four major issues when it comes to quality and process failure: poor process control, poor training of employees around quality, inability to quickly identify where and how waste is being created, and poor technical support from suppliers. The August issue of SMT Magazine features several though-provoking articles tackling the war on process failure in manufacturing electronics assemblies.
American Standard Circuits’ Unique Offerings Contribute to Long-term Success
At the recent IMS RF and microwave show in Phoenix, Arizona, Anaya Vardya, CEO of American Standard Circuits, sat down with I-Connect007's Barry Matties to discuss the current market trends, the company's recent equipment investments, and where American Standard Circuits' growth will likely come from.
NEPCON China 2015 a Resounding Success in Shanghai
The three-day event was a complete success, bringing together nearly 22,000 trade visitors and high-quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide. NEPCON China keeps up with market trends and gathers resources from all stakeholders to present a comprehensive event that covers SMT, new electronics materials, soldering, dispensing, electronics automation, measurement and other innovative technologies and products across the world.
0.3% Humidity, That's Super Dry!
Sitting down with Guest Editor Mark Thompson, Super Dry's Richard Heimsch describes their powerful new dry unit which is capable of 0.3 % relative humidity. Recovery after doors have been opened is lowered super fast in the storage cabinet, able to reach the "safe zone" within three minutes.
Enhancements in Consolidating Data Prep
Valor's principle of consolidating data once then using it in multiple areas downstream, for example stencil design, pick and place programming and test machine programming, has now been extended to include X-ray inspection programming. Mark Laing explains how.
NEPCON China Showcases Latest Manufacturing Tech in Asia
Considered Asia's biggest, most influential SMT and electronics manufacturing event, NEPCON China 2015 attracted over 450 leading brands from 22 countries, who are showcasing this week the latest electronics manufacturing technologies and products across an exhibition area of 25,000 sqm. I-Connect007 is on hand again this year covering this event with exclusive interviews and photos from the show floor.
Product Line Philosophy: Start Small...End Big
Ralph Savage, CEO of EasyBraid, talks to Kelly Dack about his company started their business, as well as some of the activites and technologies they are doing now, such as desoldering, stencil cleaning and a soldering technology based on the Curie principle. He also discussed the company's strategy in bringing world-class technology into the United States.
Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans
I-Connect007 Publisher Barry Matties caught up with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox's expansion plans for North America (Tempe, Arizona and Guadalajara, Mexico) and Malaysia (Penang). Dill also describes the highly successful veteran’s training program, which is being spearheaded at the Blackfox headquarters in Longmont, Colorado.
2015 EIPC Winter Conference, Munich: Day 1 Review
Ninety delegates, eleven countries represented and a thought-provoking two-day programme on themes of reliability in PCB fabrication and assembly, copper cleaning and advanced material solutions, advanced imaging and soldermask, and how to make PCBs smart and ready for Industry 4.0. Add the further attractions of a keynote by Walt Custer and the chance to visit a military aircraft assembly plant: the formula for another highly successful EIPC Conference, this time close to Munich Airport.
Essemtec Features Paraquda at Automaticon
At the upcoming AUTOMATICON 2015 exhibition, taking place March 17 - 20 in Warsaw, Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its award-winning Paraquda in booth B28, hall 1.
Supplier Selection Key to Assembly Reliability
As with any electronic assembly, or electronic device for that matter, the quality of the raw printed circuit board is the most critical link in the product reliability chain. According to Steve Williams, the key to managing this risk is the supplier selection and qualification process.