Article Highlights
We Have the Best Practice for That
08/13/2018 | Stephen Las Marias, I-Connect007
Strategies for Choosing Solder Paste for Successful Electronics Assembly
08/10/2018 | Jason Fullerton, Alpha Assembly Solutions
How Investment in Staff Well-Being Impacts Manufacturing Productivity
08/09/2018 | Sue Poole, JJS Manufacturing
Alpha's Revolutionary Approach to Low-Temp Soldering
08/07/2018 | Patty Goldman, I-Connect007
Factronix on Cleaning, the Market and More
08/06/2018 | Barry Matties, I-Connect007
SMT :: Suppliers

Latest Articles

We Have the Best Practice for That

Most best practices have been developed over time, based on the many different experiences that people encounter in the manufacturing line. And it is important to institute these best practices to make sure that your processes will result in outstanding job at the end of the day.

Strategies for Choosing Solder Paste for Successful Electronics Assembly

One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

Alpha's Revolutionary Approach to Low-Temp Soldering

In an interview with I-Connect007, Morgana Ribas discusses the new technology on low-temperature solder that she has developed at Alpha Assembly Solutions. She also talks about why there is a need for a low-temperature process and the benefits it offers.

Factronix on Cleaning, the Market and More

Stefan Theil, product manager at Factronix, discusses the growing need for cleaning in European electronics manufacturing and the demands he's facing from customers when it comes to finer pitches, automation, and environmental concerns.

AXI 4.0 in a Smart Factory Environment

Outstanding quality is vital to be able to survive the fierce competition between contract manufacturers. Here's how one EMS provider address inspection challenges and board complexities to ensure the quality and reliability of their PCB assemblies.

IMPACT Washington D.C., 2018 with Juki Automation’s Bill Astle

I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.

Novel Approach to Void Reduction Using Microflux Coated Solder Preforms

Shrinking QFN package sizes and power requirements are driving new developments in micro-fluxed preform. Learn what factors contribute to an optimal solution.

Addressing Temperature Challenges in Flex Circuit Rework

Zen Lee and Michael Gouldsmith of Thermaltronics discuss the challenges of flex circuit assemblies during the rework process, the power-on-demand feature of smarter hand soldering systems, as well as how Curie Point helps operators avoid temperature overshoots during rework.


I-Connect007 Survey Shows Rising Use of Flex and Rigid-Flex

In our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.

Plasmatreat on Atmospheric Pressure Plasma

At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.

Tackling Reliability Challenges in Low-Temperature Soldering

William Yu, senior technical services manager for Alpha Assembly Solutions, recently shared with I-Connect007 the challenges when it comes to the reliability of low-temperature solder pastes, and soldering strategies to overcome these issues.

Nearing Retirement, Juki's Bob Black Reflects on a Long Career

After more than 40 years in the electronics manufacturing industry, Juki's Bob Black is nearing retirement. Bob sat down with Barry Matties at the recent SMT Hybrid Packaging show in Nuremberg to reflect on his career and talk about the importance of strategic partnerships, even if that means playing nice with your competitors.

ASM Assembly Solutions on CFX

ASM Assembly Solutions was one of the 30+ companies participating in IPC's CFX (Connected Factory Exchange) showcase at the recent SMT Hybrid Packaging show in Nuremberg, Germany. In this interview, ASM's Thomas Marktscheffel shared his perspective on CFX and its current challenges, and dispelled the notion that CFX might be a cookie-cutter approach to the smart factory.

Reflow Perspectives to Flex Circuit Assemblies

At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.

Is There an End in Sight to the Electronic Components Crisis?

As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.

Conversation with Miraco… Strategies for Successful Flex Circuit Assembly

Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.

Aegis on CFX and Hermes Efforts

The Connected Factory Exchange (CFX) specification is truly revolutionizing the PCB industry. Michael Ford, from Aegis Software, met with I-Connect007's Barry Matties for an interview during the SMT Hybrid Packaging show in Nuremberg, Germany, to discuss the impact of this collaborative effort, and how it differs from the Hermes Standard.

DFM: Top Ten PCB Concerns

DFM—design for manufacturability—is a critically important but often ignored aspect of the PCB design process that directly impacts product quality and reliability. This article will discuss the top 10 DFM concerns that should be part of any design review process.


Tackling the Challenges in Flex Assembly

Apart from the design and manufacturing of flex printed circuits, a critical challenge that needs attention is assembly. Their flexible nature requires specific strategies for paste printing, chip mounting, soldering—whether reflow, wave, or hand—and rework/repair processes. Which is why the June 2018 issue of SMT007 Magazine looks into the many challenges in flex circuit assembly and highlight some of the strategies, techniques and best practices to help assemblers deal with flex circuit issues.

High School Team's Robotics Entry on Spotlight at Wisconsin Expo & Tech Forum

In May, I took the opportunity to drive around Lake Michigan and visit the SMTA Milwaukee Chapter’s Wisconsin Expo & Tech Forum. Held at the Crowne Plaza Milwaukee Airport Hotel, this was a well-organized and attended table-top expo and technical forum, with over 60 exhibitors, and a high school team with their FIRST Robotics entry.

Dave Bergman on IPC and CFX

The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.

West Penn SMTA: New Leadership, Same Commitment

SMTA's new chapter president, Jason Emes, a quality engineer with Pennatronics Corporation enthusiastically discussed with I-Connect007's Patty Goldman the latest goings-on with this Keystone State chapter. He also spoke about his plans and initiatives for the SMTA West Penn Chapter.

It’s Time to Retire ROSE Testing

Over the last two to three years, there has been considerable discussion within various IPC committees about the role of the ROSE test in today's assembly environment. The transition from predominantly water wash processes to "no clean" has meant the advent of very different flux compositions. The question has been posed as to whether the ROSE test is still a viable option for evaluating PCB and PCBA cleanliness.

Seeing Clearly: XR Headsets and Flex’s Reference Design at AWE

At this year’s CES, they announced the launch of an extended reality (XR) reference design for the next generation of XR headsets. As the “sketch-to-scale” solutions provider, as they describe themselves, that designs and builds “intelligent products for a connected world,” they have now introduced an augmented reality (AR or, as we now call it, XR) reference design to reduce time to market for companies wishing to make and market XR devices.

The Michigan SMTA Expo & Tech Forum 2018: A Review

In May, I had the adventure of driving across Michigan to visit the SMTA Michigan Expo & Tech Forum. This well-organized and attended expo and technical forum featured over 75 exhibitors and two interesting presentations. Read on.

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Why Cleaning Still Matters

Paco Solis, lead investigator at Foresite Inc., speaks with I-Connect007 about why cleaning is more important now, the common pitfalls and misconceptions in cleaning, and strategies to consider to ensure reliable PCB assemblies.

The Value of a Global Sourcing Partner

In today's highly competitive environment, global sourcing is no longer a competitive strategy; it is a standard practice. But the challenges of developing a robust domestic PCB supply chain is daunting enough that moving onto the international stage presents a whole new degree of difficulty that most companies are not equipped to manage.


Conversation with… Keysight: Challenges and Opportunities in Testing 5G

Roger Nichols, 5G program manager at test and measurement provider Keysight Technologies Inc., discusses the opportunities that 5G will enable, the many challenges facing electronics manufacturers when it comes to 5G, and how they are helping the industry address these issues.

Elements to Consider on BGA Assembly Process Capability

As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.

8 Terms Commonly Used When Buying Electronic Components

As a buyer of electronic components, I've taken for granted just how many terms are used on a daily basis during the procurement process. Here's a quick guide explaining what some of the more common terms used when buying electronic components actually mean.

LPKF Sees Increasing Use of UV Lasers

Julian Rose, product manager for the UV and stencil laser machines of LPKF, discusses with I-Connect007 Managing Editor Stephen Las Marias the challenges in laser stencils and strategies and techniques to address them, and the increasing use of UV lasers.

RTW NEPCON China: Christian Koenen Stencil Technologies Ensure First Pass Yields

At the recent NEPCON China 2018 event in Shanghai, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve the solder paste printing process and ensure first pass yields.

The Survey Said: Industry Optimistic After Strong 2017

During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.

RTW IPC APEX EXPO: Indium's Brook Sandy-Smith on PMI-Squared

Indium Corporation's Brook Sandy-Smith discusses ionic process residues on PCB assemblies and introduces the concept of "PMI-squared" (process material interaction investigation), the topic of an IPC Technical Buzz Session at IPC APEX EXPO 2018.

RTW IPC APEX EXPO: Inspection Technology Developments

Brian D'Amico, president of Mirtec Corp., speaks with I-Connect007 Technical Editor Pete Starkey about the challenges of miniaturization, increasing component density, and the shadowing of small components by taller ones, and how Mirtec has developed its inspection technology to ensure they remain at the leading edge.

Under the Hood: Solder Joint Reliability

It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.


RTW IPC APEX EXPO: Koh Young Discusses New Equipment and Data Challenges

Joel Scutchfield, Americas Sales Manager for Koh Young, discusses the company's latest inspection equipment and some of the challenges of providing customers the data they need for the real achievement of smart factory realization.

Zestron Opens Technical Center in Taiwan

Zestron on Wednesday, May 16, launched a new technical center in Hsinchu, Taiwan. With the opening of this new technical center, the company now owns a total of eight globally linked technical support facilities throughout the world.

RTW NEPCON CHINA: Mycronic Discusses Recent Acquisitions

At the recent NEPCON China 2018 event, Thomas Stetter, senior vice president for assembly solutions at Mycronic AB, speaks about the company's recent acquisitions and how it helped the company expand into different areas in the electronics assembly industry.

RTW NEPCON CHINA: OK International Highlights Need for Smarter Systems

At the recent NEPCON China 2018 tradeshow in Shanghai, Steven Fang, director of sales for Asia at OK International, speaks about the challenges their customers face when it comes to hiring skilled operators, which warrants the need for smarter systems and tools.

RTW NEPCON CHINA: Rehm Discusses Reflow Strategies to Reduce Voiding

At the recent NEPCON China 2018 event in Shanghai, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems in China, speaks with I-Connect007’s Stephen Las Marias about their latest advancements in reflow oven technology, as well as on strategies to reduce voiding.

Vehicle Electrification: Disrupting the Automotive Industry and Beyond

Around the globe, governments are announcing mandates that will bring about the demise of the internal combustion engine. China has led the charge by requiring 8% of new vehicles on the road to be “new energy” or zero emission vehicles in 2018, up from the current 2–3% on the road today. Similar strong government regulations limiting the future of the internal combustion engine have passed around the world, and the importance and growth of the hybrid and fully electric automobile industry can’t be overstated.

RTW IPC APEX EXPO: Heraeus Discusses Developments at New Lab

Jim Wertin, technical sales manager at Heraeus Electronics, shares news about the company's latest product offerings, as well as its newly established application laboratory, which helps customers and potential customers resolve production issues and improve the quality of their products.

CFX: The Next Step Toward the Future of Factories

For the past two to three years, almost every exhibitor in almost every trade show focused on the electronics manufacturing industry has an "Industry 4.0 Compatible" sign in their booth. As of today, the best question to ask is, "Compatible with what?" There has really been no standard yet developed toward this goal, and Industry 4.0 has been just a buzz word.

Electronic Component Shortages are Real

The electronic component market is in poor shape (again) and the sooner you face this fact, the sooner you can put plans in place to mitigate the risk to your business. Electronic component shortages are once again causing OEMs and EMS providers a real headache. Here's a look at the current state of the market, and seven ways in which you can work closely with your EMS provider to make the best out of a bad situation.

How the Factory Ecosystem Positively Drives Exponential Value

In today's factories, the output must far exceed the accumulative performance of each machine to stay competitive. No machine or process is an island—they must form ecosystems. The trend towards extreme automation and the smart factory leads to ever more connectivity and interdependence.


What's the Scoop? APEX CFX Showcase

The IPC Connected Factory Exchange (CFX) demo at the recent IPC APEX EXPO 2018 trade show in San Diego, California, is a great example of industry collaboration. The CFX Showcase at APEX had 245,000 CFX website page views; 701,200 CFX messages transmitted; and 664.5 million bytes of data exchanged; and the whole thing was pulled together in a matter of weeks. Here's what the participants in the program have got to say.

SMT Renting: A Trend for the Future?

You may have heard the name Martin Ziehbrunner before: he cofounded the equipment company Essemtec AG in 1992. He left the company in 2013, and soon he'd cofounded another SMT company, but with a twist. SMT Renting specializes in renting SMT equipment with an operational lease, primarily for the European market. In this interview, he explains how his latest company is challenging the normal way of acquiring SMT capital equipment.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

RTW IPC APEX EXPO: Mycronic Broadens Product Portfolio

Thomas Stetter, senior vice president of assembly at Mycronic, discussed with I-Connect007's Pete Starkey how their company continues to broaden their product portfolio towards a full-line SMT solution and the Industry 4.0 automated factory.

RTW IPC APEX EXPO: MEK on Increasing Demand for THT AOI Systems

Henk Biemans, managing director of MEK Marantz Electronics Ltd, speaks with I-Connect007 Managing Editor Stephen Las Marias about what's driving the increasing demand for THT AOI systems. Other topics discussed include reliability issues, articifial intelligence, and machine learning in inspection systems.

RTW IPC APEX EXPO: Nordson SELECT's Acquisition Update

Carlos E. Bouras, general manager of Nordson SELECT, discusses the acquisition of ACE Production Technologies and InterSelect GmbH one year later, along with the synergies between the two companies, and how they have strengthened Nordson SELECT's capabilities.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Interview with Yusaku Kono: Rising Star Award Recipient

The IPC Rising Star Award is given to IPC members who have taken leadership roles and provided support to IPC standards, education, advocacy and solutions to industry challenges. Their contributions have made significant impact upon IPC and industry within the past five years and will continue to have a lasting impact for many years to come.

Succeeding at the Velocity of Technology: An IPC APEX EXPO 2018 Wrap-Up

After many months of planning, IPC APEX EXPO 2018 proved to be a success. From revolutionary advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO provided the learning and connections that helped 4,574 attendees from 43 countries prepare for the future.

Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications

A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.


RTW IPC APEX EXPO: Super Dry Tackles International Moisture Management Differences and Floor-Life-Reset Techniques

Rich Heimsch comments on the differences in attitude regarding moisture management between Europe and the U.S., and the increasing awareness of floor-life-reset techniques.

Conversations on the Floor: IPC APEX EXPO 2018

This year’s show was one of the best in recent history, both in attendance and enthusiasm. The exhibit floor was sold out, and every single person I talked to was extremely optimistic about business in 2018. What follows are a series of observations and excerpts from conversations I had with some of the most interesting people I met.

Automotive Electronics Still in the Driver’s Seat

The past year was one of the strongest years that the PCB supply chain and the rest of the electronics manufacturing industry in general, has seen. Everyone we talked to at the shows were optimistic that the strong growth in the industry in 2017 will continue through 2018. And most industry players point to one thing when it comes to what’s driving this strong growth—automotive electronics.

Creative Electron's Bill Cardoso on the iPhone 10 Teardown and Much More

At the recent West Penn SMTA Expo, Creative Electron CEO Bill Cardoso speaks with Patty Goldman about his presentation on the iPhone 10 teardown, and how this reflects the direction where contract manufacturers are headed. He also highlights what sets Creative Electron apart in the market.

IPC APEX EXPO Takeaways

The IPC Connected Factory Exchange (CFX) live demo at this year's IPC APEX EXPO show in San Diego, California highlighted how the CFX standard will enable manufacturers to track their efficiencies better, prevent issues even before they happen, and make adjustments wherever needed.

RTW IPC APEX EXPO: Miraco Company and Services Introduction

Miraco's current quality manager, William Pfingston, fills Guest Editor Steve Williams in on the company's contract manufacturing capabilities and services, including strengths in design and flex circuits. He also talks about the company's expansion and organizational changes.

RTW IPC APEX EXPO: New Electrolube Developments and Improved Coatings

Electrolube's Phil Kinner discusses new developments in two-component polyurethane conformal coatings, and improved silicone coatings for high-temperature applications.

RTW IPC APEX EXPO: Kyzen’s Tom Forsythe Talks Tips for Better Cleaning

Tom Forsythe, executive VP of KYZEN, offers his advice on designing for better cleaning. Forsythe also discusses customers' continuing demand for data and KYZEN's data management efforts.

RTW IPC APEX EXPO: Blackfox—Training Program for Transitioning Military Personnel

Al Dill, president and CEO, discusses a training program for transitioning military personnel provided by Blackfox, who is a certified IPC training organization around the world.

Industry 4.0 Technologies: If Only I Had Known

What is coming in 2018 is not a single master Industry 4.0 solution as people may expect, but rather the opportunity for everyone in the industry to play their part, re-evaluating what can be done in their processes or products to take maximum advantage of the new CFX-fueled Industrial IoT environment.


RTW IPC APEX EXPO: Saki—The Smart Factory Concept

Alex Malek, VP of sales and service for Saki, explains how the company's software and hardware provide a common platform for machine-to-machine interconnectivity.

RTW IPC APEX EXPO: Manncorp Expands With New Learning Center

Ed Stone, sales manager of Manncorp, discusses the company's expansion, specifically their new application and learning center, their new equipment in the pipeline, and his outlook for this year.

Cleaning with Data

Tom Forsythe, vice president of KYZEN, spoke to Barry Matties about KYZEN’s new process control monitoring and data service. They discussed the drivers behind these developments, the company's focus on managing data, and how KYZEN plans to support an industry embracing more cleaning and Industry 4.0.

5 Techniques Used to Detect Counterfeit Electronic Components

Although government pressure and private resources have helped minimize the risk of counterfeit components from entering the supply chain, there is still and will most likely continue to be, a prominent threat. So, what can you do to minimize this risk? Read on.

Electronics Manufacturing (R)evolution

2018 is going to be the year of Industry 4.0, where we will see how enabling technologies including sensors, big data, analytics, and the Internet of Things (IoT), will transform the electronics manufacturing landscape.

RTW IPC APEX EXPO: How Smart Factories Will Revolutionize Electronics Manufacturing

KIC president Bjorn Dahle discusses the smart manufacturing trend in the electronics assembly industry, and how KIC can help their customers with smart manufacturing transitions.

RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids

Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.

RTW IPC APEX EXPO: Addressing Challenges in Automotive Electronics

Paul Salerno explains how Alpha Assembly Solutions have addressed the challenges of the exponential growth in automotive electronics, with specific reference to soldering in power train, ADAS, and infotainment applications

RTW IPC APEX EXPO: Asteelflash Expansion Plans and Industry Challenges

Mathieu Kury, business development manager at EMS firm Asteelflash, discusses the company's expansion plans and activities amid the growing demand in the automotive electronics space.

RTW IPC APEX EXPO: Developments and Reliability Improvements in Solder Alloys

Tim O'Neill explains developments in solder alloys for cost-sensitive applications, and improvements in the reliability of alloys subjected to sustained high temperatures.


Exceeding Customer Expectations

Aculon Inc. commercializes unique surface coatings leveraging nanotechnology and other surface modification techniques. The company’s original focus was the optical industry, developing treatments of prescription eyewear, sunglasses and other optics.

Dr. Bill Cardoso of Creative Electron Talks About IPC’s CFX Standard

Creative Electron's Dr. Bill Cardoso is a member of the CFX committee and has equipment in the CFX showcase at APEX in San Diego from February 27 to March 1. In an interview, he talks about the standard and the group that has delivered such a successful collaboration.

Mycronic Announces the Acquisition of Vi TECHNOLOGY

Mycronic recently announced the acquisition of Vi TECHNOLOGY, with the intent of combining VIT’s inspection technology with Mycronic’s jetting capabilities. In an interview with I-Connect007, Olivier Pirou, Managing Director of VIT, discusses more about the merger and how this will help VIT contend in such a competitive environment.

9 Essentials of an Electronics Contract Manufacturer

Differentiating between the best contract electronics manufacturing providers and those that are sub-par can initially seem tricky. In order to help you make the best and most educated decision possible, here are nine essentials to look for when hiring an electronics manufacturing service.

Working with Customers: A Consultant's Perspective

Industry veteran and expert Chrys Shea is in a unique position when it comes to her work for the electronics assembly industry. As president of consulting firm Shea Engineering Services, she helps suppliers test and bring new products to the market, and helps assemblers bring new processes or skills to their assembly lines.

Improving SMT Yield and Reducing Defects: A Rauland Case Study

Ever-increasing demand for more complex boards that have higher densities of components means more challenges for SMT assembly operations and yields. Smaller component sizes and more densely packed PCBs lead to more powerful designs in much smaller product packages. These advancements have spurred a new set of challenges in building smaller and more complex assemblies.

Growing with the Customer

Greg Hebson, global director for strategic accounts at EMS firm Vexos Inc., speaks with I-Connect007's Stephen Las Marias about working closely and growing with customers, as well as ensuring total customer satisfaction.

Super Dry’s Novel Approach to the Drying Process

Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.

Why You Should Invest In Package Testing

Have you ever thought about why you should invest in package testing? Packaged products often take multiple modes of transportation in various conditions before they ever reach the customer. The best way to ensure the product makes it to the customer, intact and in working order, is to test the package before it ever leaves the manufacturing facility.

Tips & Tricks: Machine Assist Time

Assist time is the human intervention required to keep a machine producing during normal operation. It does not include errors, maintenance, setup, and prototyping. There are many reasons for a machine to require assistance. PCB loading, stencil wiping, paste addition, feeder replenishment, and PCBA unloading—some require labor, some can be automated, but all will require some amount of time to complete.


The Importance of Feedback in the Electronics Assembly Supply Chain

Any customer feedback is a good feedback, whether it is good or bad, because it often pushes the supplier or manufacturer to improve. However, the problem in the electronics assembly supply chain is that customers often do not give feedback, unless it is negative.

Working with Your Customers

Even though you have trusted supplier partners, working closely with them will ensure seamless manufacture and high-quality output. In our recent survey, most of our respondents agree, with more than a third or 40% closely working with at least 50% of their customers.

Making the Right Equipment Selection

For the January 2018 issue of SMT007 Magazine, we invited Kathy Nargi-Toth, president of Eltek USA, and Matt Turpin, president and CEO of Zentech Manufacturing to a discussion on the decision-making process for new equipment, and the key considerations for choosing the best machine solution for a process.

Indium's Karthik Vijay Talks Engineering for Automotive Applications

Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.

Creating a Healthy Work Environment

In an interview with SMT007 Magazine, Wolfgang Koehler, CEO of the North America branch of ULT, discusses how their business has been over the past year, their challenges and opportunities, and how they are helping their customers. Another topic of discussion is investing in new equipment—the key parameters to consider, and what’s driving customers to buy their systems.

The Importance of Product Testing for Quality, Reliability and Durability

One really vital piece of the product development process is product testing for quality, reliability and durability. You need to find out whether your product will do what it's supposed to do—that's quality. You also need to learn whether it will do what it's supposed to do over and over again, even when conditions aren't ideal—that's reliability and durability.

Assigning IDs Within the Internet of Things

Networking devices and machinery is in full swing. However, despite all the Industry 4.0 enthusiasm, there are voices of caution: Secure your communication. For this, identification of the participants is one requirement and special SD cards offer a surprisingly simple and flexible solution.

Improving Design, Manufacturing and Assembly Teamwork

Many electronics manufacturers tend to compartmentalize or "silo" their departments, such as the design team versus assembly-related functions. The relationship between design and manufacturing can too often be disconnected or otherwise poor, which stalls productivity and increases bottom-line costs. By identifying and addressing these gaps, this financial hemorrhage can be reduced, and profitability increased.

Is UK Manufacturing Ready for the Fourth Industrial Revolution?

The new fourth Industrial Revolution (4IR) is driving the transformation of manufacturing across the world, encompassing breakthroughs in artificial intelligence, big data, the Internet of Things and 3D printing. And according to the World Economic Forum's Klaus Schwab, when compared with previous industrial revolutions, the fourth is evolving at an exponential rather than a linear pace.

Recent Innovations in DFMA

Software, electronics and sensors are making their way into the world of product design. New composites, plastics and alloys are replacing traditional metals. Designs are even reducing the carbon footprint of manufacturers, and more products can be recycled when they reach the end of their use.


Configure to Order: Different by Design

When considering implementation of Industry 4.0 solutions, following the hype in the market, attention typically is focused on the need for communication between machines on the shop-floor. Knowing what is currently executing and the status of each process in the factory, as well as all the related resources and support operations, provides critical information for Industry 4.0 computerized management systems.

Focus on the New

It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.

Top 10 Most-Read SMT007 Columns of 2017

Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.

Top 10 Most-Read SMT Articles of 2017

Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.

The Effect of Area Shape and Area Ratio on Solder Paste Printing Performance

The ongoing miniaturization trend in the SMT production induces new challenges and highly integrated systems. In passive components, the miniaturization leads to the introduction of the EIA size 01005 or smaller. Despite numerous publications in this field already addressing the printing of such devices, a defined wholly optimized process remains unsolved and inspires further novel research ideas on this topic.

Customers Drive Investment Decisions

In our recent survey on investing in new equipment, one question we asked is what or who influences the research into new equipment to buy for their factories. A majority, 77% of respondents, say that addressing customers’ needs is the primary influence in their research for new equipment, followed by market conditions or trends.

Top Reasons for Investing in New Equipment

In our recent survey, a majority of respondents said they consider increasing capacity and improving their existing manufacturing capability as top reasons for investing in new equipment for their production lines.

Evaluation of Stencil Technology for Miniaturization

SMT stencil printing technology continually evolves to keep pace with device miniaturization technologies. Printed circuit board assemblers have numerous new technology options to choose from, and need to determine the most effective ones to produce the highest quality and most reliable solder interconnections.

Step Stencil Technologies and Their Effect on the SMT Printing Process

Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.

Mirtec Succeeding Through Inspection Innovation

David Bennett, president of Mirtec Europe, speaks with I-Connect007 Technical Editor Pete Starkey about the company's latest inspection technologies, the challenges that miniaturization can bring, and Mirtec's efforts to stay on the leading edge and never be a “me too” company.


Industry 4.0 and the Platform-Based Approach to Testing

Chandran Nair, the vice president for Asia Pacific at National Instruments, explains how the Industry 4.0 vision will change electronics manufacturing. He discusses key technology enablers that would drive the evolution of manufacturing processes, and how a platform-based approach can help improve test and measurement.

Koh Young Europe Ready for Next Year, and Beyond

Harald Eppinger, managing director of Koh Young Europe, speaks with I-Connect007 Managing Editor Andy Shaughnessy about the demands of the European market, the company's long-standing success with its solutions, and the future of Koh Young Europe.

The Year of IoT Digitalization

There is no longer any significant disagreement that having an industry-wide standard for IoT communication is absolutely essential for digitalization of factories if they are going to deliver on Industry 4.0 performance expectations. Digitalization of manufacturing is the key business opportunity of the decade, whoever and wherever you are, so stand-up and be a part of it, and create your opportunities.

Solder Printing Process Inputs Impacting Distribution of Paste Volume

The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Tips & Tricks: Generating Stencil Tooling

Many engineers are leaving the editing up to the stencil fabricator these days. From the outside, this may appear as a time saver for process engineers, but considering how many stencil redos have been required and how many processes that have run 'sort of OK,' there's a tremendous amount of scrap and rework that could be saved from just a little more attention paid to stencil tooling.

Improving Solder Paste Printing

Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

9 Ways to Keep Up with Changes in Manufacturing Technology

The world of manufacturing technology might not be quite as fast to change as consumer electronics, but it is evolving, and faster than you think. Recent evidence shows that companies are increasingly adopting 'servitized' business models and technology is a key enabler, so falling behind the times is not really an option.

Two Questions to Ask Yourself with PCB Continuous Strips of Parts

Sometimes, you don't want to buy a reel, full or partial, but still want your PCB parts all in one continuous strip. Everyone wants to use up their odds and ends, but once those are gone, it's easier for you if each part is one strip. If you want to save a little money and can use a longer turn-time, you might want to choose a short-run production service with continuous strips.

Insights from productronica

The recently held productronica was a busy exhibition. There were booths that were so crowded that people were standing in the aisle to talk with company representatives. But some booths were nearly empty. Read to find Dieter G. Weiss' comments on this biennial show.

Equipment Matters in Solder Paste Printing

The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.


What Matters Most is Communication

While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.

DFx on High-Density Assemblies

Use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process, and reliability. The type of end product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end products will look very similar, but specification limits would be different.

Video from productronica 2017: YXLON Moves Away from One-Size-Fits-All Approach

Keith Bryant, global director for electronics sales at YXLON International, speaks with I-Connect007 Technical Editor Pete Starkey about their latest X-ray inspection machines that are designed as a specific fit for its own market sector. He also talks about what's state of the art right now in X-ray inspection systems, as well as updates on the progress of the integration of SMART Group into the SMTA.

Video from productronica 2017: Rehm Discusses Trends Driving Product Development

Michael Hanke, chief customer officer of Rehm Thermal Systems, speaks with I-Connect007 Managing Editor Andy Shaughnessy about the importance of communicating with their customers when it comes to new process and technology trends. He also talks about Industry 4.0 and big data, and process monitoring and transparency.

Video from productronica 2017: Heraeus Highlights Need for Highly Reliable and Compatible Assembly Materials

At the recent productronica 2017 event in Munich, Germany, Stefan Merlau, global product manager of assembly materials for Heraeus Electronics, discusses with I-Connect007 Managing Editor Andy Shaughnessy the biggest pain points of their customers, and how his company’s latest technologies are helping them address these issues. He also speaks about their outlook for the industry going into the new year.

Video from productronica 2017: Koh Young Focuses on Total Inspection Solution

At the show floor of productronica 2017, I-Connect007 Technical Editor Pete Starkey speaks with Managing Director Harald Eppinger of Koh Young Europe GmbH about the principles of Koh Young’s total 3D inspection solution for SMT process optimization and yield improvement.

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Video from productronica 2017: Nordson ASYMTEK Highlights Bulk Dispensing Technology

At this week’s productronica, Nordson ASYMTEK highlights its the new Helios SD960 bulk and two-component dispensing system. Almar Thewissen, program manager for Industrial Applications, EMEA, at Nordson, discusses its applications with I-Connect007 Technical Editor Pete Starkey.

Video from productronica 2017: Goepel Highlights Updates on X-Line 3D In-line System

At productronica 2017 in Munich, Germany, Goepel electronic's Andreas Turk, head of AXI Systems, explains the latest enhancements to their X-Line 3D in-line system for high-end inspection. He also discusses the benefits of the Stingray Detector option.

Optimal Electronics Sets Sight on Growth

In an interview with SMT Magazine, Dr. Ranko Vujosevic, CEO and CTO of Optimal Electronics, speaks about the latest technology developments at his company, and his plans to sustain growth. He also talks about his paper on lights-out electronics assembly, the technologies that would support this vision, and the ultimate goal of Industry 4.0.


Solder Preforms 101: Ask the Expert

At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

Two Prevalent Rework Heating Methods--Which One is Best?

There are two prevalent heating technologies in use throughout most electronic assembly operations for advanced component rework—the first method employs the use of hot air gas to heat up the component through the package, while the second much-used heating technology relies on infrared energy. This article highlights the pros and cons of the two methods, and discusses which one is the best to use for your application.

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Creating the Perfect Solder Joint

From a visual standpoint, a good solder joint should be smooth, bright, shiny, clean, and have a nice concave solder fillet. But how do you ensure that inside those joints, good intermetallic bonds are formed? Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint.

Cleaning Trends: The Challenges of Miniaturization and Proximity

At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.

Soldering Tip: Key to Good Solder Joints

In an interview with SMT Magazine, Enrique Moreno, technical support engineer at JBC Soldering, discusses the key parameters to consider during hand soldering to achieve the perfect solder joint. He also talks about the the increasing move towards automation and robotics soldering.

Achieving the Perfect Solder Joint: The Many Perspectives on Soldering

For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.

Choosing Solder Processes: Getting It Right

In an interview with SMT Magazine, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, shares his insights on the topic of achieving the perfect solder joint, from the perspective of a reflow oven supplier. He also talks about the latest developments in reflow ovens aimed at addressing voiding in solder joints.

Moving Toward the Zero-Defect Line

During the recent NEPCON South China exhibition in Shenzhen, Olivier Pirou, chief operating officer of Vi TECHNOLOGY, talks about achieving the perfect solder joint from the point of view of an inspection systems provider, and how manufacturers can strategize to achieve a zero-defect line.

Spreading the Word about SMTA—One Local Show at a Time

Eileen Hibbler of TEK Products, who currently sits on the Board of Directors of SMTA and is the VP of Membership, talks about educating the people in the industry; the importance of the local shows; SMTA's university chapters and their initiatives; and how SMTA is reaching out to millennials.


Test Solutions Your EMS Partner Should Offer

When looking to outsource your manufacturing, you need to know that your chosen EMS partner has good test solutions in place so that they can produce consistent, high-quality products to your customers’ requirements. This article highlights the importance of test, and outlines the different types of test your EMS partner should offer.

Counterfeit: A Quality Conundrum

The rise in the ingress of counterfeit materials into the supply chain has made them prolific, though yet, the extent is understated. What needs to be faced now is the need for incoming inspection, but at what cost to industry, and does anyone remember how to do it?

Eight Factors a CEM Should Know About its Suppliers

Selecting a contract electronics manufacturer (CEM) that fits well with your outsourcing strategy can be a difficult and long process. But, by taking the time to research and investigate potential shortlisted partners, you are much more likely to reap the benefits further down the line.

RTW SMTAI: Mentor Eases Programming in Viscom Inspection Systems

Jesper Lykke, engineering manager for USA of Viscom AG, and Zac Elliott, technical marketing engineer at Mentor, speak with I-Connect007 Managing Editor Andy Shaughnessy about Viscom's adoption of the Valor Process Preparation and how it is helping users with their inspection programming.

Top Five BGA Challenges to Overcome

Higher reflow temperatures of lead-free rework increases the pressure for properly shielding the neighboring components. These developments are causing BGA rework challenges. This summary will discuss the most challenging aspects of BGA rework and options for solutions.

BTC and SMT Rework Challenges

In the assembly of bottom terminated components (BTC), the formation of voids has become a serious problem in many applications. In the SMT process, the reliability of solder joints becomes more of a concern, as less and less solder is allowed for each joint. The presence of voids can deteriorate the joint strength and eventually lead to joint failure.

RTW SMTAI: How Automation and Government Support Can Help Reshoring Drive

Alex Malek, vice president of sales and service for North America of SAKI, speaks with I-Connect007 Managing Editor Andy Shaughnessy about how automation and government investment can help bring back manufacturing jobs from overseas.

RTW SMTAI: AIM's Dr. Mehran Maalekian Speaks on New Alloys for Harsh Environments

Dr. Mehran Maalekian, R&D Manager at AIM Solder, speaks with I-Connect007 Managing Editor Andy Shaughnessy about new alloys that are targeted for high-temperature and demanding applications, particularly in harsh environments, where standard lead-free alloy such as SAC will not perform as well.

How to Prevent Suspect Components from Entering Your Supply Chain

The success of any supply chain relies on quality and stability. If either of these elements are threatened, OEMs or their EMS provider will struggle to ensure supply chain excellence. Unfortunately, with the risk of counterfeit and other suspect components ever present, this can sometimes be difficult to achieve.

RTW SMTAI: Alpha Discusses Solder Dross Reclamation

At the recent SMTA International 2017 exhibition in Rosemont, Illinois, Mitch Holtzer, director of Americas Reclaim Business of Alpha Assembly Solutions, talks with Managing Editor Andy Shaughnessy about the solder dross reclamation process, and discusses his new role in leading Alpha’s reclamation business.


RTW SMTAI: MIRTEC on Staying Ahead of the Curve

Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.

Rework and Reliability: Less is More!

Circuit boards are not always perfect after reflow or wave soldering. Scrapping boards with one or two defects is expensive, so rework happens. A good concept for rework is less is more, especially less flux. Use as little rework flux as possible, as in the old Brylcreem ads, "Just a little dab'll do ya."

RTW NEPCON South China: Vermes Discusses Piezo Technology in Microdispensing

During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Microdispensing GmbH, discusses their latest innovations in microdispensing, and how their piezo technology is addressing the trend towards miniaturization in PCB assemblies.

RTW NEPCON South China: JBC Brings Digital Transformation to Hand Soldering Process

Enrique Moreno, technical support engineer at JBC Soldering SL, and I-Connect007 Managing Editor Stephen Las Marias discuss the latest developments in the hand soldering process, including robotics and automation. Moreno also talks about the opportunities in China, and why their Industry 4.0-enabled solutions are suitable for this market.

Improving the Rework Process

An optimized SMT assembly process typically provides a yield of nearly 100%. Technology advancements—from the solder paste printing process, SPI, and parts placement, to reflow and wave soldering and AOI—have pushed the efficiency and accuracy of these steps in the SMT process such that a board assembly should be perfect at the end of the line. Still, EMS providers continually face the need to rework and repair PCBAs even after dialing in the perfect set-up.

RTW NEPCON South China: Keith Bryant Discusses New Role and Goals at YXLON

Keith Bryant, the newly appointed Global Director of Electronics Sales at YXLON International, talks about his new role and goals at the company.

RTW NEPCON South China: KYZEN on Optimizing the Cleaning Process

At the NEPCON South China event happening this week in Shenzhen, China, Thomas Forsythe, executive vice president at KYZEN Corp., discusses the current cleaning challenges in the PCB assembly industry, and how manufacturers can optimize their cleaning process.

NEPCON South China 2017 Opens Today

NEPCON South China 2017, being held in conjunction with the Shenzhen Circuit Sourcing 2017 and Automotive World China, opens its doors today at the Shenzhen Convention and Exhibition Center to showcase nearly 600 companies catering to the electronics manufacturing industry. This year’s event, the largest ever in the show's 30-year history, features 45,000 square meters of exhibition space.

It was Acceptable in the Noughties

In many software products for manufacturing, the common approach previously was to show as many as possible, if not all, of the various data elements about products, machines and processes to engineers, who liked to feel totally in control of what they were doing. The need, however, to manage complex databases, to have detailed views of values and attributes of anything in the digital domain, rapidly became a major distraction to people performing their designated roles.

Sourcing PCBA: Can Your EMS Supplier Do More?

You're in the market for some PCB assemblies for your new product and you need to find the right supplier. You've looked online, gotten recommendations from friends, and the choices are dizzying. Should you look domestically or overseas? What do you do now? Sourcing PCBA doesn't have to be difficult, but there are questions you need to answer.


The Ever Greener Grass

What we think we know is a less dynamic concept than actual reality. So many things progress so quickly, that we either as individuals or organizations, simply cannot keep up any longer. How then do we know whether the grass is really greener on the other side if we are not able to see clearly what is happening?

Cleaning that Matters

James Yeoh, executive director of Zestron Precision Cleaning Sdn Bhd, discusses the challenges in the cleaning industry, and strategies that can help manufacturers address those issues. He also covers the need for continuous education when it comes to cleaning, and how automation can ensure the stability of cleaning systems.

Soldering Fumes in Electronics Manufacturing: Damaging Effects and Solutions for Removal

No matter which soldering process you analyze, all of them have one aspect in common: They produce airborne pollutants, which may have a negative impact on employees, plants and products as well. This article discusses the damaging effects of soldering fumes, and solutions for their removal.

Verification of Inspection Results: Local, Central, Global?

With the need for flexibility in production processes amid increasing globalized manufacturing strategies, manufacturers should consider powerful inspection tools that not only provide central verification of numerous lines in local and overseas production sites, but also with a comprehensive presentation of inspection results.

Process Step Elimination: Driven by Cost and Efficiency, Enabled by Process and Materials Innovation

Electronics manufacturing has evolved from the early days of hand soldering and wave soldering to the more modern SMT process. But while most modern electronics are produced using the SMT process, there are still some mixed technology applications that need both the SMT process and the wave soldering process. This article looks into the pin-in-paste (PiP) process, which enables the soldering of through-hole components during SMT processing, and eliminates the need for the wave process.

The Need for Assembly Training and Education

While investing in the latest technologies and having a systems-based approach in your assembly processes are important, the key factors that will make you successful in your continuous improvement goal are the skills, training, and education of your workforce. However you look at it, the human factor remains a critical issue when it comes to your overall efficiency.

Pillarhouse International's Allan Jiang Discusses Selective Soldering Developments

At the recent NEPCON China event in Shanghai, Allan Jiang, sales manager at Pillarhouse International, discusses with I-Connect007 Managing Editor Stephen Las Marias some of the challenges in selective soldering, and technology developments to address these issues.

4 Ways Your EMS Partner Can Respond to Supply Chain Disruption

When disruptions to the electronic component supply chain occur, they are painful. Lead-times can extend overnight, prices can treble, and in some cases, parts are placed on allocation or discontinued altogether. These concerns amplify the need for EMS firms to have practices in place for dealing with supply chain disruption. This article discusses four ways your EMS partner can mitigate risks to your supply chain.

Counterfeit Electronic Components Identification: A Case Study

Counterfeit electronic components are finding their way into today's defense electronics. The problem gets even more complex when procuring diminishing manufacturing source parts. This article provides a brief introduction to counterfeit prevention and detection standards, particularly as they relate to the aerospace and defense sector.

The Role of Industry Associations in Training and Education

Industry associations, such as the IPC and the SMTA, help advance the electronics manufacturing industry through standardization, training, education, advocacy, and interaction through trade events, exhibitions and symposiums. They help members to become aware of the latest technology developments happening in their industry verticals, and of the market trends shaping the direction of the industry.


Thermal Indicator Technology for Aerospace Wire Harness Assemblies

Thermal indicator technology was developed into solder sleeves many years ago and has proven to be an effective means of providing visual indication of a reliable solder joint. This article talks about the two types of thermal indicators used in aerospace applications today, and the many benefits that this type of technology.

Four Ways to Buy Electronic Components and the Pros and Cons of Each

When you buy electronic components, there are a number of different supplier types available to you or your EMS partner. From dealing direct with an electronic manufacturer through to using brokers, there are benefits and pitfalls associated with each.

The Importance of Training for your Organization

In our recent survey on assembly training and education, another question we asked is about the importance of training to your organization. Around 85% of our respondents consider training really important to their workforce. In fact, the majority of respondents—47%—say it is very important.

The Importance of Supplier Training

The human factor remains a critical issue when it comes to the overall efficiency of your PCB assembly lines. But how do you make sure your operators, engineers and supervisors have the proper knowledge and skill sets to perform at their peak levels, day in and day out?

Today’s Mil/Aero Enemies: Counterfeits, Obsolescence and Failure

The need for high-reliability electronics, components and assemblies that can perform in harsh operating conditions involving extreme temperatures, vibration, and moisture continue to challenge electronics assembly providers catering to the military and aerospace markets. These are on top of current manufacturing issues such as the miniaturization of products, shrinking component sizes, higher density board assemblies, and the obsolescence of electronic components.

The Importance of Conformal Coating, Now and in the Future

At the SMTA Michigan Expo and Tech Forum, held in Grand Rapids on May 11, Technical Editor Happy Holden spent a few minutes with AIM Solder’s Technical Marketing Manager Tim O’Neill to discuss O’Neill’s presentation on the topic of conformal coating over no-clean fluxes.

EMS Firm Tsukiden Electronics Seeing More Business in Prototypes

At the recent Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) held in Manila, Karen Flordiles, marketing supervisor at EMS firm Tsukiden Electronics Philippines Inc., talks about their customers' changing requirements and their manufacturing challenges. She also discussed new opportunities they are seeing in the EMS sector.

Better Together: How HDP User Group Showcases the Industry’s Best Side

HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.

Assembly Training and Education

Even if your PCB assembly process is optimized, there is always room for improvement. And no matter how successful your company has been in the past, you just can’t rest on your laurels. It is always in your best interest to strive towards a better operations model. We've created a survey to help us gauge the importance of training and education in your workforce, and the benefits that you get in ensuring that your operators and engineers have the most current knowledge and skill sets.

Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating – Influence of Electroless Pd Plating Film Thickness

This paper investigated the influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability. It was found out that the shape and thickness of the intermetallic compounds (IMCs) are among the key factors that affect solder joint reliability after multiple reflow cycles and thermal aging, respectively.


High-Volume Test Strategies

In an interview with I-Connect007 during the recent NEPCON China event in Shanghai, Siegmund Hornig, director of global sales for Europe and Asia, for production board test division at Teradyne discusses the new testing demands from customers, and strategies to help them address their high-volume test requirements.

Koh Young Discusses Latest 3D AOI Innovations

Koh Young Technology's Scott Kim, overseas sales team manager, talks about the latest challenges and developments happening in inspection technologies, the new demands and requirements from customers, as well as the key factors to consider when it comes to buying inspection systems.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2

The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1

Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.

3D Inspection is the Way to Go

In an interview with SMT Magazine during NEPCON China, Guido Bornemann, head of sales in Asia for Viscom, discusses how inspection technology is keeping up with the latest requirements and demands from customers. He also explains why 3D technology is the best inspection technology to utilize in electronics assembly.

Saki Discusses Industry 4.0 and True 3D Technology

Quintin Armstrong, general manager for North America Sales and Service at Saki America, speaks to SMT Magazine about the Industry 4.0 strategy for inspection equipment providers. He also talks about why manufacturers are finding it more and more relevant to have an inspection line in their assembly lines now.

3D: Towards Better Inspection Capability

For this month's issue of SMT Magazine, we spoke with Mark McMeen, vice president of engineering at STI Electronics, to know more about the inspection challenges and requirements from an EMS provider's standpoint. We also talked with Jean-Marc Peallat, vice president of global sales at Vi TECHNOLOGY, to find out, from a supplier's perspective, how they are looking at these challenges and addressing them through their product development efforts.

2D X-ray Inspection With Materials and Thickness Identification

The need to inspect electronic components and assemblies non-destructively is the main driver behind the development of X-ray inspection technology. In many cases, X-ray inspection provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through-holes, TSVs, microbumps, and copper pillars.

The Need for 3D AOI

While the coplanarity of height-sensitive devices such as BGA packages and leaded components can be inspected in 2D using multi-angled colored lighting and side-angle cameras, these will be susceptible to an increase in false calls, a need for additional programming and cycle time, and possible escapes. These factors underscore the need for 3D technology in inspection strategies.

Shenzhen Axxon Discusses Acquisition and Dispensing Market Trends

Ivan Li, general manager at Shenzhen Axxon Automation Co. Ltd (China), discusses their recent acquisition by Mycronic, as well as the latest developments in the dispensing market. Also discussed is the China market, and how the company is staying ahead of the increasing competition in the dispensing industry.


RTW NEPCON CHINA: Teknek Discusses Contact Cleaning Technology Trends

Stephen Mitchell, managing director of Teknek, a contact cleaning solutions provider, discusses the latest trends in contact cleaning technology. He provides his outlook on China’s electronics manufacturing industry and intelligent manufacturing, and talks about how Teknek's contact cleaning systems are helping customers address their defects and productivity issues.

RTW NEPCON CHINA: Interflux to Revolutionize Solder Industry

At the recent NEPCON China event in Shanghai, Daniel Werkhoven, CEO of Belgium-based soldering chemistry provider Interflux Electronics N.V., talks with I-Connect007 Managing Editor Stephen Las Marias about how their new bismuth-based solder alloy will help improve the soldering process.

Tape and Reel Solder Preforms: A Success Story for the UD00 X86 SECO Board

SECO's latest product innovation, UDOO X86, is a real computer with an integrated Arduino 101 compatible board that is capable of running games and videos in 4K. But while the success of the UDOO X86 is impressive, so is SECO's ability to develop this game-changing product with low-cost technology for mass appeal and affordability.

Vapor Degreasing Chemistries to Remove Difficult Lead-Free and No-Clean Fluxes from PCBs

In line with increasing regulations on electronics manufacturing, many changes have been made to the electronics world, and thus the circuit board manufacturing process. Lead-free, no-clean and halide-free flux formulations have introduced new cleaning obstacles, especially on ever-shrinking component sizes. To maintain high cleanliness standards for modern circuitry, new sophisticated cleaning chemistries are required.

RTW NEPCON CHINA: Mycronic Meets High-volume Demand with Solder Jet Printing

Mycronic VP for Global Dispensing and Managing Director Clemens Jargon discusses how the flexibility of solder jet printing helps reduce downtime in the line, thus increasing total line speed and enabling it to keep up with high-volume demand.

Business and Technical Developments at Super Dry Totech

At the recent SMT Hybrid Packaging show in Nuremberg, Germany, I-Connect007 Technical Editor Pete Starkey visits Super Dry Totech and spends a few minutes with CEO Jos Brehler and Sales Manager Terry Morgan to talk about the rationale behind ASYS Group's acquisition of stake in Super Dry Totech, as well as the latest technology developments happening at the company.

Zestron Technical Workshop Tackles Next Generation of Cleaning

Zestron recently held a technical workshop in Alabang, Muntinlupa City in the Philippines to help users address their cleaning challenges amid advancements in semiconductor device packaging.

Mentor Graphics: Connecting the Manufacturing Environment

Oren Manor serves as the director of business development for Mentor Graphics Valor Division. In this interview with SMT Magazine, Manor discusses the latest updates in their OML community, their case study regarding Phoenix Contact’s implementation of their IoT solution in its facilities, and what’s new in ODB++.

Voiding Control at High-Power Die-Attach Preform Soldering

Voiding in the solder joint is a concern for high-reliability and high-performance devices. This paper discusses a study on voiding behavior of large pad high-power devices simulated with Cu coupon to Cu coupon sandwiches. A flux-coated preform was studied in this assembly, with variation in solder alloy type, quantity of solid flux coated on solder preform, Cu coupon pre-oxidation extent, reflow temperature, and pressure exerted onto the sandwich during reflow.

Keeping an Eye on the Next Generation

Why should a company in our industry dedicate hours to providing professional development to a group of temporary student interns? Why should they open their doors to kids, some of whom haven’t even entered high school? For Indium, the short answer is, it makes them better. Read on to find out why.


Blackfox Program Trains Vets for Manufacturing Jobs

It's harder than ever for managers in the PCB manufacturing industry to find qualified staff, with some reporting that positions are remaining open for months at a time. On the other hand, there are thousands of soldiers, sailors, airmen and marines transitioning out of the service each year and seeking good jobs. In this interview, Allen Dill, president of Blackfox, discusses their program that offers manufacturing training to veterans, even while they are still in the military.

Predicting Solder Paste Transfer Efficiency and Print Volume

Being able to predict the transfer efficiency and print volume reproducibility of solder paste are valuable data points for any circuit assembly process. Knowing how many good boards that can be expected from a jar of solder paste is critical for a contract manufacturer working on paper thin margins.

The Complex World of Soldering

Industry veteran Happy Holden and Saline Lectronics Senior Process Engineer Cathy Cox discuss the various challenges and issues that users face in soldering, including the lack of a "one-size-fits-all" approach in the process, and some key factors that the PCB assembly industry should consider when it comes to different applications and markets.

RTW NEPCON China: Viscom Talks 3D AOI Developments

Guido Bornemann, head of sales for Asia at Viscom, speaks with I-Connect007 Editor Stephen Las Marias about inspection challenges such as false calls and improving first pass yields. He also talks about the latest developments in 3D AOI to address these issues as well as test strategies to achieve zero defects.

RTW NEPCON China: Metcal Highlights Innovation in Hand Soldering Technology

At NEPCON China, Bryan Gass, vice president of Metcal, discusses how their Connection Validation soldering station will revolutionize the hand soldering technology industry.

The Building Blocks of Industry 4.0

At the recent IPC APEX EXPO, Kevin Decker-Weiss, director of sales at CircuitByte, joins panellist from Mentor Graphics and EMS firm Saline Lectronics in a roundtable on the building blocks of Industry 4.0 hosted by Scoop. Here is his take on that panel and the show.

RTW IPC APEX EXPO: Metcal Brings Disruptive Technology in Hand Soldering

Christopher Larocca, president and CEO of OK International (of which Metcal is a division), tells I-Connect007 Publisher Barry Matties their strategy for improving the hand solder process. He describes a lack of process feedback to the operator as a core problem inherent in the hand soldering process, and discusses how OK International has developed an innovative solution to address the issue.

Dry Storage Cabinets' Role in Industry 4.0

At IPC APEX EXPO 2017, Rich Heimsch, Super Dry’s Director of the Americas, discusses the electronics manufacturing industry’s different versions of Industry 4.0, and his company's strategies in dealing with all of them. He also talks about Super Dry's latest storage developments.

Miniature Components on PCBs Requires Flexible Cleaning Methods

Smaller, more densely populated circuit boards make the issue of managing faults, quality and product longevity highly challenging. This is why so many companies consider their PCB cleaning as a mission-critical process. If the cleaning is not effective the device simply will not function reliably for the required life of the product.

Navigating the Complex World of Flex Circuit Assembly

We recently conducted a survey on flexible printed circuits to know more about the challenges that designers, fabricators, and assemblers face when dealing with flex circuits. We asked what steps in their processes have the biggest effect on yields; the challenge they face when dealing with flex circuit materials; as well as the factors that have the greatest impact on the quality of their flex circuit design, fabrication and assembly.


Alpha Papers Investigate High-Reliability Solder Alloys

During SMTA International, Morgana Ribas, manager of Metals Technology Group at Alpha Assembly Solutions, presented a pair of papers that focus on the company’s reliability testing of solder alloys. I-Connect007 Managing Editor Andy Shaughnessy sat down with Morgana to discuss these papers, and some of the surprising results that the testing yielded.

Evaluating a PCB Assembler

When it comes to technology and quality, an SMT assembler's capabilities will be reflected when you go through the key elements in the SMT process. This article provides key points to consider in evaluating a PCB assembler, which allows you to test whether your circuit boards assembled in that factory conform to your required standard.

Electrolube Talks Technologies Targeted at Automotive and LED Applications

Electrolube's Phil Kinner, global head for the conformal coatings business, talks about the trends shaping the company’s product innovation strategies, and their latest solutions and technologies to help address their customers’ greatest challenges.

Alpha on New Technologies to Tackle Voiding

Tom Hunsinger, vice president of marketing at Alpha Assembly Solutions, discusses with SMT Magazine how their company is addressing voiding—one of the greatest challenges in soldering. He talks about the latest market development trends that are shaping product innovation strategies at Alpha. Hunsinger also details some of their latest solder technologies, and how they are helping their customers address their soldering challenges.

Goepel electronic Talks Test and Inspection Innovations

Thomas Wenzel, managing director of the Embedded JTAG Solutions Business Development at Goepel electronic, discusses the latest technology innovations happening in the test and inspection segment, and the market trends shaping them.

SMT Xtra Discusses Expansion Plans in the US

At the IPC APEX EXPO 2017 event in San Diego, SMT Xtra's Alexandra Stovin, marketing and public relations manager, and Paul Pittman, sales manager for the United States and Canada, speaks with I-Connect007 Technical Editor Pete Starkey about their company’s expansion plans in the U.S. and the benefits they offer their customers.

RTW IPC APEX EXPO: Alpha Highlights Technologies Dedicated to Eliminating Solder Voids

Robert Wallace, marketing manager for the Americas at Alpha Assembly Solutions, discusses their new product introductions for this year and their level of customer support as these products are rolled out. He also talks about how these technologies are helping address the issue on solder voiding.

RTW IPC APEX EXPO: Nordson Highlights Improvements in Dispensing and Conformal Coating Systems

Roberta J. Foster-Smith, global marketing communications manager for Nordson ASYMTEK, discusses the continued improvements in Nordson's dispensing and conformal coating equipment, especially when it comes to automation, precision and consistency in delivering ever-finer deposits to meet industry demands and customer needs.

RTW IPC APEX EXPO: Indium Discusses Industry Trends and Reliability Issues

Indium Corp. Product Manager Chris Nash talks with I-Connect007 Technical Editor Pete Starkey about how they are helping customers address their reliability issues, and discusses the success of their "Avoid the Void" campaign.

RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions

Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.


RTW IPC APEX EXPO: KIC on Smart Factory Technology Approach in Thermal Ovens

Bjorn Dahle, president of KIC Thermal, discusses with I-Connect007 Guest Editor Dick Crowe their approach to measuring temperatures in thermal ovens and networking the information to a main frame, to enable the process engineer to statistically monitor a specific process.

RTW IPC APEX EXPO: Alpha Highlights Solder Reclaim Technology

Mitch Holtzer, director of Americas Reclaim Business for Alpha Assembly Solutions, discusses the company’s reclamation technology, which takes solder dross, used solder paste, and solder paste debris and converts it into reusable soldering materials. He also talks about how solder reclamation can help sustainability efforts, and how it helps customers when it comes to their waste materials.

RTW IPC APEX EXPO: Manncorp on Having a Solutions-centric Approach

Manncorp father-son team Henry Mann and Kyle Mann talk with I-Connect007 Guest Editor Kelly Dack about providing excellent guidance, service, training and support for companies who may be unsure of the best route to take in selecting the right SMT equipment.

RTW IPC APEX EXPO: Mentor Graphics Finishes Traceability Standard in Record Time

Michael Ford of Mentor Graphics and Editor Andy Shaughnessy discuss Mentor's work with traceability processes, including the new IPC traceability standard that was finished in record time.

RTW IPC APEX EXPO: Mirtec Discusses Latest Developments in Inspection Technologies

Mirtec President Brian D’Amico talks about the latest in 2D and 3D AOI and SPI, and how to provide smaller users with affordable high-technology systems. He also talks about the sales success of the MV-6 OMNI series in-line full-3D AOI machine, which features advanced features such as 15-megapixel top-down camera and 3D digital multi-frequency Moire.

RTW IPC APEX EXPO: CyberOptics' Subodh Kulkarni Discusses Ultra-High-Resolution AOI

Dr. Subodh Kulkarni discusses the new bleeding-edge AOI technology CyberOptics has developed that will advance vision technology to a level not achievable today. MRS technology combines accuracy with speed, which have been mutually exclusive in the past.

RTW IPC APEX EXPO: 3D AOI Update With MEK

Henk Biemans of MEK Europe discusses with I-Connect007 Editor Andy Shaughnessy their latest developments in 3D AOI, and their efforts to educate their customers about this growing market.

RTW IPC APEX EXPO: Indium’s Eric Slezak Talks Project 99

Indium Corporation's Eric Slezak talks with I-Connect007 Guest Editor Steve Williams about the launch of their new Project 99 wave solder process flux system. Indium has created an exciting new spin on this technology by using a comic book theme, with "villains" representing common wave solder defects and "superheroes" representing their flux solutions to combat the problems.

RTW IPC APEX EXPO: Electrolube Discusses New Conformal Coating Technologies

Phil Kinner, technical director of the coatings division at Electrolube, discusses with I-Connect007 Guest Editor Dick Crowe the latest trends happening in the coatings industry, and how their solutions help customers enhance the reliability of their electronics assemblies.

RTW IPC APEX EXPO: Kyzen’s Thomas Forsythe Talks Latest Developments in Aqueous Cleaning

Thomas Forsythe, executive vice president of Kyzen Corp., talks about the advantages of real-time concentration monitoring, data management and access to data as aqueous cleaning moves towards Industry 4.0.


Metcal Brings Big Science and High Reliability to Hand Soldering

Recently, Judy Warner visited the Metcal facility in Southern California and meet with Product Support Engineer Robert Roush. They talked about Metcal's patented hand-soldering technology, which promises to bring a new level of science and control to the world of hand-soldering.

RTW IPC APEX EXPO: Rehm Highlights Reflow Improvements for Reliable Solder Results

Michael Hanke, CCO of Rehm Thermal Systems, highlights the latest developments in their reflow solutions, which are targeted at improving the reliability of the soldering process. He also discusses their complete solution, which is inline with the Industry 4.0 trend.

RealTimewith...IPC: Mycronic Highlights Latest Capabilities of Jet Printing

Nico Coenen, global sales director of jet printing at Mycronic, discusses the latest developments in their jet printing technology. He also highlights how these advances align with their Mycronic 4.0 strategy.

Real Time with...IPC: Cogiscan Discusses Connectivity Solutions to Enable Industry 4.0

Francois Monette, VP Sales and Marketing at Cogiscan Inc., talks about how the industry can meet the challenge of connecting different machines, software and enterprise systems to enable Industry 4.0 for the electronics assembly industry.

Real Time with...IPC: CalcuQuote on Risk Assessment and RFQ Management

Chintan Sutaria, president of CalcuQuote, discusses how their RFQ management system, with its risk assessment feature, helps EMS customers improve their supply chain. He also talks about their new BidCQ solution is improving the bidding process.

Real Time with...IPC: Tim O'Neill Discusses Latest Developments in Lead-Free Soldering Market

With RoHS requirements in full swing, companies must adapt and adapt quickly as lead based soldering will be completely phased out by 2019 in Europe.

Real Time with...IPC: BEST Talks Rework Challenges and Opportunities

Bob Wettermann, president of BEST Inc., talks about the challenges in rework, and how his company is helping their customers address these problems. He also discusses his paper presentation at this week's technical conference.

Real Time with...IPC: Alpha Discusses Improving LED Reliability Issues

At this week's IPC APEX EXPO 2017 in San Diego, California, Steve Godber, LED Commercial Manager at Alpha Assembly Solutions, discusses with I-Connect007's Stephen Las Marias the reliability and voiding challenges in the LED market, and how the company is helping their customers address these issues through their solder technologies.

11 Points to Consider When Buying Selective Soldering Equipment

Although there are clear benefits from investing in a selective soldering equipment, there are also a number of considerations to make prior to purchase. This article looks at 11 points that require further thought, to ensure you select the right piece of selective soldering equipment for your products.

Taking the "Process Approach" to RFQs in Electronics Contract Manufacturing

The ISO 9001:2015 standard can be applied to any organization, any management system and any process. While it is generic in its application, the specific implementation can be the difference between lagging and leading results. This article reviews how the process approach applies specifically to the request for quote process in the EMS industry.


Achieving Repeatable, Consistent Control over the Selective Soldering Production Process

Selective soldering is a process with more than 100 different parameters that may impact soldering performance. A robust selective soldering process should have a wide process window that is able to handle variations in material quality. In this paper, critical process parameters are discussed as well as methods that can be used to widen the process window.

Investing in New Technologies

Electronics manufacturers are beginning to consider investing in new systems to take their processes to the next level. In our recent survey on the topic of new technology, the top reasons cited by manufacturers to invest in new technologies are to increase efficiency, improve yield, reduce cycle time, and the advance capability of the process.

Reflections on 40 Years of Test and Measurement and What Lies Ahead

Dr. James Truchard, President, CEO, and Cofounder of National Instruments, has penned his reflections on the last 40 years driving and leading some of the greatest progress and innovations the test and measurement industry has seen. In the article, he also leaves us with his thoughts on how he envisions the future to be.

The Time Has Come for Jet Printing

At the recent NEPCON South China 2016 trade show in Shenzhen, Thomas Bredin, area sales manager at Mycronic, discusses with I-Connect007's Stephen Las Marias the latest developments in jet printing technology, and their recent acquisition of Shenzhen Axxon Automation.

Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability

Lead free solder joint reliability in drop shock loading has been a recurring issue in mobile and handheld consumer electronics. Changing solder composition may offer an opportunity to improve joint drop reliability. This study focuses on different failure modes in circuit board assemblies as observed based on solder composition, board surface finish, and solder joint volume.

More Than Just Dry Air: Controlling Oxidation and Intermetallics in Moisture-Sensitive Devices

Our new columnist Richard Heimsch will be focusing on the management of moisture sensitivity in his column “More Than Just Dry Air.” His inaugural article talks about controlling oxidation and intermetallics in moisture-sensitive devices.

The Influence of Clean Air on the Value-Added Chain in Electronics Production

A multitude of different processes in modern electronics production—from connection and separation technologies, surface processing such as marking and drilling, the utilisation of fluxes, up to production processes such as soldering, welding and gluing—generate harmful substances that might have extreme health impacts and affect production plants and products.

CES 2017: Press Day, LaunchIt and Showstoppers

Before the show opens, CES provides two days and evenings not open to the general attendees, to enable companies, large and small, an opportunity to present their new offerings to the press. These opportunities range from small meetings with individual members of the trade press to huge events such as those presented by Samsung, Asus, Sony, Intel, Panasonic and others, with literally several hundred in attendance.

Editor's Note: Understanding Plating and Surface Finishing

This month’s issue of SMT Magazine focuses on the impact of plating and surface finishing in electronics assembly. True, plating and surface finishing may be more directly significant in PCB fabrication, but surely they are important issues as well when it comes to the assembly side. In fact, according to our recent survey, 82% of the respondents said surface finishing impacts their assembly process.

Successful Sales Strategies

At the recent NIDays 2016 event in Singapore, Matej Krajnc of National Instruments speaks with I-Connect007's Stephen Las Marias about the challenges for sales and marketing executives in the electronics manufacturing industry, effective sales strategies, and key attributes of a sales person. He also shares his outlook on some of the key technology trends for next year.


The Hunt for the Best Pre-Owned SMT Equipment Supplier

There are many SMT equipment resellers out there, some with many years of experience and others that are merely intermediaries between a company that’s trying to sell their surplus equipment and you. With that in mind, think of what you can afford not only in terms of the cost of equipment, but also regarding installation, training and support.

Sales and Marketing in a Digital Transformation Reality

While many of the common sales and marketing best practices apply to the PCB assembly industry, however, deep manufacturing and electronics design expertise is required to truly drive customer interactions from one-off transactions into long and sustaining relationships as the industry goes through rapid change such as the larger involvement of a younger generation in the workforce, and the move to digital transformation and smart manufacturing.

Meeting Current and Future Requirements of the Automotive Industry

Phil Kinner, technical director of Electrolube's Coatings Division, speaks with I-Connect007's Pete Starkey about the role of conformal coatings in various applications of the automotive industry. He talks about thermal shock testing, and provides updates on their collaboration with the National Physical Lab on condensation testing.

Boundary Scan Meets Functional Test

This article discusses some fundamental aspects of the combination of boundary scan and functional test, as well as new technological solutions for embedded functional tests and their practical implementation.

Rework and Repair Standard Getting Updated

The IPC-7711/21 Rework of Electronic Assemblies/Repair and Modification of Printed Boards and Electronic Assemblies is being “upreved” from version “B” to version “C” and will soon be released to the industry. This article talks about a couple of notable changes that strengthened, modernized and brought together changes from the previous “B” version, which was approved in 2007.

Tin Whisker Mitigation Methodologies Report from SMART Group, Part 2

Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In the second part of this two-part article series, Editor Pete Starkey concludes his review of the SMART Group's recent seminar, which is focused on tin whisker mitigation methodologies and strategies.

Solder Voiding, Autonomous Autos, and Statistics—So Much to Learn from Dr. Ron

While at the 2016 SMTA International conference and show, I had the lucky opportunity to talk with Indium Corporation’s Dr. Ron Lasky. He gave a great synopsis of the extensive testing done by Indium Corporation’s Chris Nash on solder voids, outlined in a paper co-authored by the two, which was being presented by Ron at the conference.

SMTA Tech Expo Panel Session: It Takes a Village to Discuss Proper Cleaning Solutions

An expert in cleaning processes, Barbara Kanegsberg is known as “The Cleaning Lady.” She moderated the technical session “Ask the Experts: Meeting the Challenges of Effective Cleaning, Defluxing in Southern California.” Here Barbara discusses the myriad of challenges regarding cleaning PCBs (particularly in heavily regulated California) and what transpired during the open forum technical session.

KIC Shows Solutions to Voiding Problems via Optimized Reflow Profiling

At the recent SMTAI event, MB (Marybeth) Allen of KIC speaks with I-Connect007's Patty Goldman about her company, and discusses some of the details of her presentation titled "Optimized Reflow Profiling to Minimize Voiding".

Living Up to Their Name at Alpha Assembly Solutions

At SMTAI in October, I-Connect007's Judy Warner spent some quality time with Alpha Assembly Solutions' Jason Fullerton, to discuss Alpha's innovative new products. Fullerton also discussed a paper he was presenting, which compares two lead-free, silver-free alloys in a selective soldering application.


electronica 2016 Impressions

Germany’s third-largest city, and capital of the southeastern state of Bavaria, Munich was once more host to electronica, which can justifiably claim to be the world’s leading trade fair for electronic components, systems and applications.

The Impact of Vias on PCB Assembly

Via technology has been one of the solutions to address the miniaturization and component density challenges in current electronic assemblies. However, vias are not without their own set of challenges. As per our recent survey, these include impedance matching, routing, placement of vias, minimum size limitations, aspect ratio, and the limitations for the PCB manufacturer.

Electrolube on Addressing Thermal Management Issues in LEDs

At the recent electronica 2016 trade show in Munich, Germany, Jade Bridges, global technical support manager of Electrolube, speaks with I-Connect007’s Pete Starkey about how they are helping customers address the thermal management challenges in electronics assemblies, including LEDs and LED assemblies.

Electrolube’s Alistair Little on Thermal Management in Automotive Electronics

At electronica 2016, Alistair Little, technical director of Electrolube’s Resins Division, sits down with Editor Pete Starkey to discuss thermal management challenges in the automotive industry, and how their resin solutions are helping customers address those high-temperature requirements.

Chintan Sutaria: CalcuQuote Aims to Disrupt EMS Quoting Status Quo

Chintan Sutaria of CalcuQuote speaks with I-Connect007's Judy Warner about what inspired him to develop CalcuQuote. He also explains how CalcuQuote supports capturing customers' requirements to coming up with labor and material costs, allocating overhead, markups, and following up with the customer.

How to Improve PCB Reliability

Component failure rates have steadily declined over the years to the point where non-component failure sources have become the dominant cause of failures for a PCB. If the reliability of the components is becoming a non-issue, then the only way to improve electronics further—for this article, automotive electronics—is to look at the non-component aspects of the electronics, and a significant one is the PCB.

Increasing Reliability through Predictive Analysis

At SMTA International 2016, Joe Russeau of Precision Analytical Laboratory discusses with I-Connect007's Patty Goldman the paper he was presented, which was co-authored by Mark Northrup and Tim Estes. The paper presents early data comparing the results of two different analytical test methods to determine how well they correlate with each other as predictors of PC board cleanliness and reliability.

New Column: Millennials in Manufacturing

New columnist Davina McDonnell will be writing on the challenges millennials face in the workplace, and the unique dynamic between millennials and the industry veterans who manage them.

Koh Young Talks AOI Landscape and Trends

During the recent NEPCON South China tradeshow in Shenzhen, Thomas Lau, sales manager for Southeast Asia at Koh Young Technology Inc., speaks with I-Connect007's Stephen Las Marias about the challenges and developments happening in the AOI sector.

How to Evaluate a Used Machine

There are some cases where you can get a good deal on used SMT assembly equipment and save some money over a new machine. This article will help guide you in your search and give you some tips to avoid getting a raw deal or actually spending more than new by the time you get that bargain acquisition in good working order.


Real Time with... SMTAI: Mentor and Kulicke and Soffa Discuss Partnership

Michael Ford of Mentor Graphics and Tom Kramer of Kulicke and Soffa speak with I-Connect007’s Andy Shaughnessy about their partnership and synergy, and how they enable customers to become flexible and productive even with high-mix operations.

Real Time with… SMTAI: Making Your Shop Floor More Intelligent

Mitch DeCaire, channel sales manager at Cogiscan, speaks with I-Connect007’s Andy Shaughnessy about how real-time data collection from the factory floor can help customers improve their quality and overall productivity.

Real Time with... SMTAI: Mirtec’s Brian D’Amico Discusses Benefits of 3D Inspection Technologies

Brian D'Amico, president of Mirtec, discusses with I-Connect007’s Andy Shaughnessy why more and more manufacturers are adopting 3D inspection technologies, such as 3D AOI and 3D SPI systems. He also mentions the increasing use of very small components—such as the 0201s and 01005s—and the advent of the 03015s.

Real Time with… SMTAI: Alpha's Strategies to Ensure Reliability of Assemblies

I-Connect007’s Judy Warner and Robert Wallace, regional marketing manager and channel partner manager for the Americas for Alpha Assembly Solutions, discuss how Alpha helps ensure reliability of their customers’ assemblies by providing soldering material set combinations that had been fully tested together for the J-STD-004B.

Real Time with… SMTAI: Metcal Updates Scavenging with the Scarab

Paul Wood, applications manager at Metcal, discusses with I-Connect007’s Andy Shaughnessy how their standalone, contactless Scarab site cleaning system is helping manufacturers optimize their pad cleaning process.

Real Time with... SMTAI: KYZEN Pushes Cleaning Data to the Cloud

At the recent SMTA International exhibition, Tom Forsythe, executive vice president of Kyzen, discusses with I-Connect007’s Andy Shaughnessy their latest system that helps customers have a better handle on their cleaning process.

IPC-1782 Standard for Traceability Supporting Counterfeit Components

Traceability has grown from being a specialized need for certain safety critical segments of the industry, to now being a recognized value-add tool for the industry as a whole. This article discusses the IPC-1782 project, which aims to create a single flexible data structure that can be adopted for all levels of traceability that are required across the industry.

Recycling Substrates and Components in Mil/Aero Assemblies: Secure Metals Recovery

In this article, Mitch Holtzer of Alpha Assembly Solutions writes about reworking defective military and aerospace electronics assemblies, and recovering the value of the substrate and components without compromising the top secret design of the circuit.

How to Specify a Custom Machine

Let’s say you have an unusual product configuration, a unique space requirement, an unorthodox handling system, or an application totally unrelated to the PCB or SMT assembly business, and you can’t find a standard machine provider that can handle your requirements. What then? This article highlights key points to consider when going the custom machine way for your project.

Being More than a Manufacturer’s Rep

Matt Bonweg, process support specialist at manufacturers' rep firm Murray Percival Company, speaks with I-Connect007's Patty Goldman during the recent SMTA Ohio Expo about the company's history and philosophy, as well as their strategies for success in this industry.


Silicon Valley SMTA Chapter President Kevin McClay on Evolution and Current Status of SMTA

Kevin McClay, president of Silicon Valley SMTA Chapter, speaks with I-Connect007’s Judy Warner on the activities of the SMTA in the Valley, and the challenge of attracting young talent to join the manufacturing engineering industry.

Digital X-Ray—For More Than Inspection

At the recent SMTA Ohio Expo, Sheri Martin, sales manager at YXLON, spoke with I-Connect007's Patty Goldman about her company, their digital X-ray system, and the value of joining such trade events, and the benefits of using X-ray when it comes to failure analysis.

Real Time with NEPCON South China: Mentor Graphics Discusses Control on the Shop Floor

Ofer Lavi Ben David, director of shop floor manufacturing solutions at Mentor Graphics Valor Division, talks with I-Connect007’s Stephen Las Marias about how the smart factory should look, their Open Manufacturing Language, and their solution to provide end-to-end visibility and control in the shop floor.

Real Time with NEPCON South China: BTU Talks Voiding in Automotive Electronics, Industry 4.0 Strategies

At NEPCON South China 2016, Bob Bouchard of BTU International Inc. discusses with I-Connect007’s Stephen Las Marias the challenges and opportunities in the China market, how BTU is helping address voiding issues in automotive electronics assemblies, and their Industry 4.0 strategies.

Real Time with NEPCON South China: WKK on Automation, China Outlook, Challenges and Opportunities

Victor J.S. Chang, director and general manager of WKK Distribution Ltd, discusses with I-Connect007's Stephen Las Marias the increasing automation trend in the region; the efforts of the Chinese government to support the growth of advanced manufacturing; and the latest initiatives at WKK.

Real Time with NEPCON South China: Rehm Thermal Systems Highlights Industry 4.0 Benefits

In Shenzhen, China, Ralf Wagenfuehr, plant manager for Rehm Thermal Systems, speaks with I-Connect007’s Stephen Las Marias about Industry 4.0 and the benefits of this automation trend.

Real Time with NEPCON South China: P. Kay Metal Discusses New Markets for MS2

James Goyne, the newly appointed global business development director at P. Kay Metal Inc., speaks with I-Connect007's Stephen Las Marias about what he aims to achieve in his new role, as well as the new markets and opportunities for their MS2 solder dross eliminator.

Will The “Internet of Manufacturing” Really Impact Business?

Supporting legacy, new, and future automated processes, as well as the vast number of manual processes in use today, is the key to being able to successfully introduce the Internet of Manufacturing into SMT production.

The Industry Speaks

In the latest issue of SMT Magazine, we take a pause from covering the latest technology trends, challenges, and solutions in the electronics manufacturing and assembly industry. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points when it comes to their respective specialties.

Local SMTA Expos Are Where It’s Happening!

At the recent SMTA chapter expos, Greg Vance with Rockwell Automation and Brett Crane with Bird Electronic Corporation speak with I-Connect007's Patty Goldman about the event, and the trends happening in the electronics manufacturing industry.


Event Review: 7th Electronic Materials and Processes for Space Workshop

This year's Electronic Materials and Processes for Space Workshop discussed a wide range of technology issues and developments when it comes to PCB fabrication and assembly for space applications. From addressing reliability issues to dealing with cracks that may form during thermal cycling, to REACH regulations and their impact on space hardware, and tin whisker growths. Barrie Dunn provides the highlights.

Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements

This study will compare the results from testing two solder pastes using the IPC-J-STD-004B IPC TM-650 2.6.3.7 surface insulation resistance test and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.

Material Effects of Laser Energy When Processing Circuit Board Substrates During Depaneling

Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Understanding the effects of the laser energy to the substrate material properly is essential in order to take advantage of the technology without creating unintended side effects.

EPC’s Michael de Rooij Discusses Strategic Partnership with Wurth Electronik

Michael de Rooij, PhD, of Efficient Power Conversion Corp. (EPC) talks to I-Connect007 guest editor Kim Sauer about their strategic alliance with Wurth Electronik, how their cooperation works, and how the technology solution they are co-developing can address the wireless power challenge as a whole.

A New Dispensing Solder Paste for Laser Soldering Technology

A new solder paste of alloy composition of Sn-3.0Ag-0.5Cu in a dispensing way is developed for the automatic laser soldering processes. This paper presents the results of soldering BGA spheres on circuit boards with minimal voiding and no splash or solder balling issues.

The Pasternack Story

John Farley, director of marketing for Pasternack Enterprises, speaks with I-Connect007's Judy Warner during the recent International Microwave Symposium event about their experience at this year's show. John also discusses the multiple layers of Pasternack's RF products and services and the unique way they do business.

An Integrated PCB Producer’s Approach to the Market

NCAB Group is one of the biggest PCB suppliers in the world. Barry Matties and Stephen Las Marias recently met with Andy Liu of NCAB to discuss an integrated producer’s approach to the market, new design tools, the current state of the Chinese market, and the future of 3D printed electronics.

Designers Notebook: Specifying Lead-Free Compatible Surface Finish and Coating for Solderability and Surface Protection

A majority of the components furnished for electronic assembly are designed for solder attachment to metalized land patterns specifically designed for each device type. Providing a solder process-compatible surface finish on these land patterns is vital; however, selection of the surface finish on the circuit structure, whether plated or coated, can be greatly influenced by the components’ terminal metalization and the specific alloy composition used for the assembly process.

Improving Test and Inspection

In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.

Hand Soldering: The Move Toward Automation

At the recent NEPCON event in Shanghai, JBC's Domingo Taberner discussed with I-Connect007's Barry Matties the hand soldering market in China, the move towards automation, the greatest challenges their customers have in soldering, and what to know about choosing the right temperature and tip.


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