Article Highlights
3D Printing and Medical Electronics: A Disruptive Beneficial Technology
12/11/2018 | Dan Feinberg, Technology Editor, I-Connect007
What is ESD and Why Should We Worry About It?
12/10/2018 | Pete Starkey, I-Connect007
Greg Vance on SMTA Ohio Chapter Updates
12/05/2018 | I-Connect007 Editorial Team
Electrolube on Managing Thermal Interfaces and Conformal Coatings
12/03/2018 | Pete Starkey, I-Connect007
Understanding the Benefits of CFX
11/30/2018 | Stephen Las Marias, I-Connect007
SMT :: New Technology

Latest Articles

3D Printing and Medical Electronics: A Disruptive Beneficial Technology

We are seeing significant advances and increased uses for 3D manufacturing in medicine—many more than 3D-printed and conductive circuits on device structural components. There is enough movement in this area that 3D additive fabrication in medicine—including but not limited to 3D-printed circuits—has become its own topic, and one that we will be watching and continuing to cover.

Is This a Golden Age for Medical Devices?

Just as the telecommunications golden age launched 30 years ago—which led to wireless phones, electronic data terminals, and technology that allows us to watch our favorite shows on our own time and not the TV stations' schedule—it seems that medical device technology is gearing up to do something similar. The Internet of Things (IoT), Internet of the Body (IoB), and printed electronics technologies are emerging, and they're converging with medical devices in a big way.

Understanding the Benefits of CFX

In an interview with SMT007 Magazine, David Fenton, group customer support manager for Blakell Europlacer, discusses the technical challenges and the impact of the IPC Connected Factory Exchange (CFX) initiative on the PCB assembly industry, and what manufacturers can expect from this electronics assembly connectivity standard.

Managing Cyber-Threats Within Electronics Manufacturing

The rise of the 4th Industrial Revolution (4IR) has brought with it digital interconnectivity that offers unprecedented opportunities for original equipment manufacturers (OEMs). But with that openness there also comes risk—the threat of the loss of data, the theft of capital or intellectual property, and the disruption of access to systems or operational technology—all of which can impede businesses and impact on trade.

RTW SMTAI: KIC's MB Allen on Smart Factory, CFX

Marybeth (MB) Allen, product manager at KIC, speaks with I-Connect007 Managing Editor Nolan Johnson about the smart factory, KIC's new RPI i4.0 software release, and as well as her company's leadership in IPC's Connected Factory Exchange (CFX) initiative.

CFX: Building the Foundation for Industry 4.0

IPC has been showcasing the Connected Factory Exchange (CFX) initiative in action at the many industry events this year, providing a technical demonstration operating in real time with standardized machine data delivered from participating exhibitors through the cloud and onto visitors' cellphones. In this interview, Dave Bergman, VP for international relations at IPC, discusses the latest developments with IPC’s CFX standard, including key highlights, impact in the electronics assembly industry, and what’s next.

Real Time with...SMTAI 2018 Coverage Now Available

The I-Connect007 team traveled to Rosemont, Illinois this week to cover the SMTA International 2018 conference and exhibition. Video interviews of key executives and leaders of our industry are now available for viewing. Also check out the photo gallery for snapshots of the exhibition floor and the conference as well as the after-hours festivities.

AI-Powered Inspection

Viscom AG COO Peter Krippner discusses artificial intelligence (AI) and its impact in the electronics manufacturing industry. He speaks about how AI will change the industry, the challenges in adopting AI, and the state of implementation of AI in electronics manufacturing right now.

IoT: Driving Change in Manufacturing

In the manufacturing world, the Internet of Things (IoT) can be seen as an element of Industry 4.0. The idea behind it is that factories would evolve to become smarter, to become a lot more flexible—to be able to make the products that customers want, basically at any time that they need.

How CIM and IoT Can Make Your Factory Smart

As business needs challenge the electronics assembly industry to support increased flexibility, lower overhead, and stricter quality standards, the industry is rapidly adopting improvements in automation and analytics to meet the challenge. This article explores the changes in culture between the past, where data was simply sent point to point, and today’s multi-layered IoT technology-based solutions, as well as the effects and opportunities that are here now for the taking.


The Megadrivers

Henry Ford's innovation in manufacturing—the moving assembly line—helped reduce the time it took to build a car from more than 12 hours to just two hours and 30 minutes. It was a revolutionary advancement in production. Through continuous improvements over decades, the assembly line has become the highly efficient primary mode of manufacturing in a wide range of industries and it has changed the way we live and work forever.

RTW NEPCON South China: Viscom Increases 3D AXI Throughput

Guido Bornemann, head of sales for Asia at Viscom, speaks with Editor Edy Yu about the innovations in in-line 3D AXI systems that help manufacturers reduce handling time by about 40–50% and improve their throughputs.

Interview with a High School Robotics Team Mentor

On the floor of the recent Wisconsin SMTA Annual Tech Forum, I-Connect007 Technical Editor Happy Holden sat down with Aaron Denk, representing the local Cedarburg High School’s robotics team.

RTW NEPCON South China: Mycronic Discusses Industry 4.0

At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.

3D Printing: Enabling a New Manufacturing Landscape

At the recent Michigan SMTA Tech Forum, Scott Schwarz, senior sales representative for rapid technology at Fisher Unitech, discusses with I-Connect007 Technical Editor Happy Holden the latest developments in 3D printing, and the advanced applications that have made significant impacts in the automotive manufacturing industry.

How DFA Converts Complexity into Freedom for Medical Device Development

The assembly of medical devices comprising electronic and mechanical components has become an increasing challenge as devices grow more complex, functional and compact, and as they undergo increasingly frequent product refresh cycles. Read on to find assembly techniques that will help manufacturers to deliver highly engineered and integrated products.

ASM Assembly Solutions on CFX

ASM Assembly Solutions was one of the 30+ companies participating in IPC's CFX (Connected Factory Exchange) showcase at the recent SMT Hybrid Packaging show in Nuremberg, Germany. In this interview, ASM's Thomas Marktscheffel shared his perspective on CFX and its current challenges, and dispelled the notion that CFX might be a cookie-cutter approach to the smart factory.

Aegis on CFX and Hermes Efforts

The Connected Factory Exchange (CFX) specification is truly revolutionizing the PCB industry. Michael Ford, from Aegis Software, met with I-Connect007's Barry Matties for an interview during the SMT Hybrid Packaging show in Nuremberg, Germany, to discuss the impact of this collaborative effort, and how it differs from the Hermes Standard.

Dave Bergman on IPC and CFX

The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.

Seeing Clearly: XR Headsets and Flex’s Reference Design at AWE

At this year’s CES, they announced the launch of an extended reality (XR) reference design for the next generation of XR headsets. As the “sketch-to-scale” solutions provider, as they describe themselves, that designs and builds “intelligent products for a connected world,” they have now introduced an augmented reality (AR or, as we now call it, XR) reference design to reduce time to market for companies wishing to make and market XR devices.


The Michigan SMTA Expo & Tech Forum 2018: A Review

In May, I had the adventure of driving across Michigan to visit the SMTA Michigan Expo & Tech Forum. This well-organized and attended expo and technical forum featured over 75 exhibitors and two interesting presentations. Read on.

DFT Strategy Needed for 5G Assembly

Mathieu Kury of Asteelflash USA Corp. provides an overview of 5G, the opportunities in the market, and how it will impact the electronics manufacturing industry. He also discusses the key challenges from an EMS standpoint and how to become successful when 5G really arrives.

5G: Testing the Future Impact

The impending arrival of 5G is not without its entourage of challenges that will require a different approach in the electronics manufacturing process. One that is already impacting the electronics manufacturers and assemblers is the testing of the devices. Industry analyst firm Occams Business Research Consulting expects the global 5G network infrastructure market to register a 70% CAGR from 2016 to 2023 and reach up to $28 billion by the end of the forecast period. North America is the leading market for 5G network.

5G Requires a New Approach to Testing

The industry will be deploying 5G at millimeter wave frequencies between 28 and 40GHz, with significantly wider bandwidths than the current instrumentation. And the rules about how you design a test fixture, or conduct testing of those products is changing. In this article, National Instrument's David Hall explains.

Conversation with… Keysight: Challenges and Opportunities in Testing 5G

Roger Nichols, 5G program manager at test and measurement provider Keysight Technologies Inc., discusses the opportunities that 5G will enable, the many challenges facing electronics manufacturers when it comes to 5G, and how they are helping the industry address these issues.

The Survey Said: Industry Optimistic After Strong 2017

During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.

3D Printing and Additive Manufacturing in PCBA

There are several materials that are available for 3D printing for various engineering uses. Various vendors offer over hundreds of different materials that are either specific to an application or to a specific desired characteristic. For this study, eight materials that are regularly used for engineering applications were evaluated and characterized to determine which can be used in PCB processes.

RTW IPC APEX EXPO: Michael Ford Speaks About Aegis' Role in CFX

At the recent IPC APEX EXPO 2018 trade show in San Diego, California, Michael Ford, European marketing director, discusses his work with Aegis Software and the reaction of attendees who witnessed the Connected Factory Exchange (CFX) demo.

CFX: The Next Step Toward the Future of Factories

For the past two to three years, almost every exhibitor in almost every trade show focused on the electronics manufacturing industry has an "Industry 4.0 Compatible" sign in their booth. As of today, the best question to ask is, "Compatible with what?" There has really been no standard yet developed toward this goal, and Industry 4.0 has been just a buzz word.

How the Factory Ecosystem Positively Drives Exponential Value

In today's factories, the output must far exceed the accumulative performance of each machine to stay competitive. No machine or process is an island—they must form ecosystems. The trend towards extreme automation and the smart factory leads to ever more connectivity and interdependence.


What's the Scoop? APEX CFX Showcase

The IPC Connected Factory Exchange (CFX) demo at the recent IPC APEX EXPO 2018 trade show in San Diego, California, is a great example of industry collaboration. The CFX Showcase at APEX had 245,000 CFX website page views; 701,200 CFX messages transmitted; and 664.5 million bytes of data exchanged; and the whole thing was pulled together in a matter of weeks. Here's what the participants in the program have got to say.

The Climate Change of Data

From a typical manufacturing standpoint, cloud storage is simply another way or place in which to put data. From a usage perspective, many see it as being no different from an on-site server or even the external hard disk on your laptop. Off-site cloud storage is vast and can easily be cost effective, requiring no maintenance or fixed overhead other than paying the service bills. There are, however, a couple of very important things to consider with cloud storage.

Industry 4.0 Concerns

The fastest way for manufacturers to achieve growth in a new world of industrial connectivity is to leverage new technologies. A transition to automated data and process management is irrefutable. But, while this heralds smart supply chains that bring enhanced agility, productivity and profitability, many are adopting a "wait and see" approach.

RTW IPC APEX EXPO: CFX - The IPC Connected Factory Initiative

David Bergman from the IPC speaks with I-Connect007's Pete Starkey about how the CFX format has been developed, and the excited response to the CFX Visitor Experience at the IPC APEX EXPO 2018.

Succeeding at the Velocity of Technology: An IPC APEX EXPO 2018 Wrap-Up

After many months of planning, IPC APEX EXPO 2018 proved to be a success. From revolutionary advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO provided the learning and connections that helped 4,574 attendees from 43 countries prepare for the future.

Automotive Electronics Still in the Driver’s Seat

The past year was one of the strongest years that the PCB supply chain and the rest of the electronics manufacturing industry in general, has seen. Everyone we talked to at the shows were optimistic that the strong growth in the industry in 2017 will continue through 2018. And most industry players point to one thing when it comes to what’s driving this strong growth—automotive electronics.

IPC APEX EXPO Takeaways

The IPC Connected Factory Exchange (CFX) live demo at this year's IPC APEX EXPO show in San Diego, California highlighted how the CFX standard will enable manufacturers to track their efficiencies better, prevent issues even before they happen, and make adjustments wherever needed.

Industry 4.0 Technologies: If Only I Had Known

What is coming in 2018 is not a single master Industry 4.0 solution as people may expect, but rather the opportunity for everyone in the industry to play their part, re-evaluating what can be done in their processes or products to take maximum advantage of the new CFX-fueled Industrial IoT environment.

Electronics Manufacturing (R)evolution

2018 is going to be the year of Industry 4.0, where we will see how enabling technologies including sensors, big data, analytics, and the Internet of Things (IoT), will transform the electronics manufacturing landscape.

The IoT Event of The Decade

The IPC APEX EXPO tradeshow at the end of this month is set to rock the manufacturing world in a way that has not been seen for many years. This is not just a tech-fest, it is the introduction of some serious business growth opportunities for manufacturers, machines vendors and solution providers based on the successful implementation of their Industry 4.0 solutions and enhancements.


Dr. Bill Cardoso of Creative Electron Talks About IPC’s CFX Standard

Creative Electron's Dr. Bill Cardoso is a member of the CFX committee and has equipment in the CFX showcase at APEX in San Diego from February 27 to March 1. In an interview, he talks about the standard and the group that has delivered such a successful collaboration.

6 Questions to Assess Your Company's IoT Readiness

Small-to-medium sized companies shouldn't assume that Industrial Internet of Things (IIoT or Industrial Internet) is for the 'big boys' only. Innovations coming out of the IIoT have the potential to significantly level the playing field among companies of all sizes.

What's Driving Manufacturing Investment in 4IR?

The use of automation is transforming global manufacturing, with initiatives such as robot technology, big data and 3D printing, providing manufacturers with the ability to create smarter products, more streamlined processes and better solutions for their customers.

Assigning IDs Within the Internet of Things

Networking devices and machinery is in full swing. However, despite all the Industry 4.0 enthusiasm, there are voices of caution: Secure your communication. For this, identification of the participants is one requirement and special SD cards offer a surprisingly simple and flexible solution.

Is UK Manufacturing Ready for the Fourth Industrial Revolution?

The new fourth Industrial Revolution (4IR) is driving the transformation of manufacturing across the world, encompassing breakthroughs in artificial intelligence, big data, the Internet of Things and 3D printing. And according to the World Economic Forum's Klaus Schwab, when compared with previous industrial revolutions, the fourth is evolving at an exponential rather than a linear pace.

Recent Innovations in DFMA

Software, electronics and sensors are making their way into the world of product design. New composites, plastics and alloys are replacing traditional metals. Designs are even reducing the carbon footprint of manufacturers, and more products can be recycled when they reach the end of their use.

Configure to Order: Different by Design

When considering implementation of Industry 4.0 solutions, following the hype in the market, attention typically is focused on the need for communication between machines on the shop-floor. Knowing what is currently executing and the status of each process in the factory, as well as all the related resources and support operations, provides critical information for Industry 4.0 computerized management systems.

Focus on the New

It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.

Top 10 Most-Read SMT007 Columns of 2017

Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.

What Does Digital Twinning Mean for Manufacturing?

Industry 4.0 brings with it new forms of artificial intelligence that organizations can leverage to improve and streamline their processes. Machine intelligence is driving industrial connectivity and possibilities for optimized productivity and in turn, substantial savings.


Top 10 Most-Read SMT Articles of 2017

Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.

Industry 4.0 and the Platform-Based Approach to Testing

Chandran Nair, the vice president for Asia Pacific at National Instruments, explains how the Industry 4.0 vision will change electronics manufacturing. He discusses key technology enablers that would drive the evolution of manufacturing processes, and how a platform-based approach can help improve test and measurement.

The Year of IoT Digitalization

There is no longer any significant disagreement that having an industry-wide standard for IoT communication is absolutely essential for digitalization of factories if they are going to deliver on Industry 4.0 performance expectations. Digitalization of manufacturing is the key business opportunity of the decade, whoever and wherever you are, so stand-up and be a part of it, and create your opportunities.

9 Ways to Keep Up with Changes in Manufacturing Technology

The world of manufacturing technology might not be quite as fast to change as consumer electronics, but it is evolving, and faster than you think. Recent evidence shows that companies are increasingly adopting 'servitized' business models and technology is a key enabler, so falling behind the times is not really an option.

Blockchain for Manufacturing: What are the Opportunities?

Blockchain is one of the hottest topics in the tech world, and a buzzword that’s been popping up quite a bit over the last year or so. It is said to have the potential to radically simplify many business processes, by reducing risk and boosting transparency. In the manufacturing world, what are its opportunities?

House of Cards

With challenges like Industry 4.0 turning the manufacturing world upside down, we see solutions that are being quite brutally put together, through acquisition or partnership, which are expected to be perceived as being the solutions of tomorrow.

Cybersecurity: 4 Things OEMs Should Do to Protect Themselves

Manufacturing has been declared one of the top three most targeted industries for cyber attacks. While Industry 4.0 and expansion into cyber-physical systems will have a positive impact on the industry in terms of increasing efficiency, they open the door to even more security risks such as a hacker taking over production, or changing the output of the manufacturing process.

NEPCON South China 2017 Opens Today

NEPCON South China 2017, being held in conjunction with the Shenzhen Circuit Sourcing 2017 and Automotive World China, opens its doors today at the Shenzhen Convention and Exhibition Center to showcase nearly 600 companies catering to the electronics manufacturing industry. This year’s event, the largest ever in the show's 30-year history, features 45,000 square meters of exhibition space.

On the Smart Move: Industry 4.0 in Electronics Production

The industrial world is in motion, as we face a revolution in terms of processes, organizational structures, hardware and software in our companies. Many critics complain that terms like Industry 4.0 and smart factory are rather arbitrary and lack concrete meaning. That is correct. What is also true, however, is that technical progress always starts out with a vision, which is then put into concrete terms as time moves on.

New Challenges Facing Mil/Aero Segment

For this month's issue, we invited a sampling of professionals whose experience centers on the electronics industry in the military and aerospace world, including experts from design, PCB manufacturing, and the assembly arena to sit down with us for a frank discussion. Our discussion centered on the challenges associated with military work, including the new regulatory requirements for cybersecurity, dealing with leaded vs. lead-free components, and the differences and similarities with the commercial world.


Does Your EMS Provider Have an Industry 4.0 Roadmap?

At its simplest level, the Fourth Industrial Revolution or Industry 4.0, is about automation and connectivity. This should lead to faster, more efficient manufacturing--and therefore advantageous pricing. Additionally, it might also mean that products can be made in a different way. For example, new processes might allow late customization or configuration, faster delivery, or enhanced quality.

Today’s Mil/Aero Enemies: Counterfeits, Obsolescence and Failure

The need for high-reliability electronics, components and assemblies that can perform in harsh operating conditions involving extreme temperatures, vibration, and moisture continue to challenge electronics assembly providers catering to the military and aerospace markets. These are on top of current manufacturing issues such as the miniaturization of products, shrinking component sizes, higher density board assemblies, and the obsolescence of electronic components.

Assembly Training and Education

Even if your PCB assembly process is optimized, there is always room for improvement. And no matter how successful your company has been in the past, you just can’t rest on your laurels. It is always in your best interest to strive towards a better operations model. We've created a survey to help us gauge the importance of training and education in your workforce, and the benefits that you get in ensuring that your operators and engineers have the most current knowledge and skill sets.

Business and Technical Developments at Super Dry Totech

At the recent SMT Hybrid Packaging show in Nuremberg, Germany, I-Connect007 Technical Editor Pete Starkey visits Super Dry Totech and spends a few minutes with CEO Jos Brehler and Sales Manager Terry Morgan to talk about the rationale behind ASYS Group's acquisition of stake in Super Dry Totech, as well as the latest technology developments happening at the company.

RTW NEPCON China: Data I/O on Securing the Supply Chain

At the recent NEPCON China show in Shanghai, Anthony Ambrose, president and CEO of Data I/O Corp., discusses the cybersecurity challenges facing the electronics manufacturing industry today amid the proliferation of connected devices and the Internet of Things.

Mentor Graphics: Connecting the Manufacturing Environment

Oren Manor serves as the director of business development for Mentor Graphics Valor Division. In this interview with SMT Magazine, Manor discusses the latest updates in their OML community, their case study regarding Phoenix Contact’s implementation of their IoT solution in its facilities, and what’s new in ODB++.

RTW NEPCON China: Metcal Highlights Innovation in Hand Soldering Technology

At NEPCON China, Bryan Gass, vice president of Metcal, discusses how their Connection Validation soldering station will revolutionize the hand soldering technology industry.

The Building Blocks of Industry 4.0

At the recent IPC APEX EXPO, Kevin Decker-Weiss, director of sales at CircuitByte, joins panellist from Mentor Graphics and EMS firm Saline Lectronics in a roundtable on the building blocks of Industry 4.0 hosted by Scoop. Here is his take on that panel and the show.

RTW IPC APEX EXPO: Metcal Brings Disruptive Technology in Hand Soldering

Christopher Larocca, president and CEO of OK International (of which Metcal is a division), tells I-Connect007 Publisher Barry Matties their strategy for improving the hand solder process. He describes a lack of process feedback to the operator as a core problem inherent in the hand soldering process, and discusses how OK International has developed an innovative solution to address the issue.

Dry Storage Cabinets' Role in Industry 4.0

At IPC APEX EXPO 2017, Rich Heimsch, Super Dry’s Director of the Americas, discusses the electronics manufacturing industry’s different versions of Industry 4.0, and his company's strategies in dealing with all of them. He also talks about Super Dry's latest storage developments.


Navigating the Complex World of Flex Circuit Assembly

We recently conducted a survey on flexible printed circuits to know more about the challenges that designers, fabricators, and assemblers face when dealing with flex circuits. We asked what steps in their processes have the biggest effect on yields; the challenge they face when dealing with flex circuit materials; as well as the factors that have the greatest impact on the quality of their flex circuit design, fabrication and assembly.

Goepel electronic Talks Test and Inspection Innovations

Thomas Wenzel, managing director of the Embedded JTAG Solutions Business Development at Goepel electronic, discusses the latest technology innovations happening in the test and inspection segment, and the market trends shaping them.

RTW IPC APEX EXPO: Indium’s Eric Slezak Talks Project 99

Indium Corporation's Eric Slezak talks with I-Connect007 Guest Editor Steve Williams about the launch of their new Project 99 wave solder process flux system. Indium has created an exciting new spin on this technology by using a comic book theme, with "villains" representing common wave solder defects and "superheroes" representing their flux solutions to combat the problems.

Industry 4.0: Nine Key Points Electronics Manufacturers Must Not Ignore

The Fourth Industrial Revolution is nothing if not massive and complicated. There is a huge amount of information out there, some useful and some perhaps less so. But, among the hype, there are a few consistent themes that really must not be ignored by manufacturers wishing to remain competitive in the future.

Real Time with...IPC: Cogiscan Discusses Connectivity Solutions to Enable Industry 4.0

Francois Monette, VP Sales and Marketing at Cogiscan Inc., talks about how the industry can meet the challenge of connecting different machines, software and enterprise systems to enable Industry 4.0 for the electronics assembly industry.

Bringing SMT Assembly In-House: Case Studies of the Effects on Lead Time, Inventory, Quality, and Overall Cost

A growing number of low- to medium-volume manufacturers of specialized electronic products are reaping the rewards of bringing their SMT assembly in-house. How have some of these companies justified the cost of their endeavors? In this article, three OEM companies share their experiences.

What’s Driving the Rapidly Changing Electronics Assembly Industry

Since the EMS landscape has become so competitive, staying on top of new advances in technology and being able to rapidly adapt to changing customer needs, market demands, trends and technological advances is critical. This article highlights some examples of how electronics assembly technology developments have impacted the EMS industry in recent years and will likely continue shaping the industry in the future.

The Shape of Things to Come

Where is our industry going? The beginning of a new year provides a good opportunity to look into the crystal ball and foretell what we think will be. So what are the general drivers of change in the high tech electronic product assembly business, and what specific new product and process types do we see that are a result of those drivers?

Investing in New Technologies

Electronics manufacturers are beginning to consider investing in new systems to take their processes to the next level. In our recent survey on the topic of new technology, the top reasons cited by manufacturers to invest in new technologies are to increase efficiency, improve yield, reduce cycle time, and the advance capability of the process.

Reflections on 40 Years of Test and Measurement and What Lies Ahead

Dr. James Truchard, President, CEO, and Cofounder of National Instruments, has penned his reflections on the last 40 years driving and leading some of the greatest progress and innovations the test and measurement industry has seen. In the article, he also leaves us with his thoughts on how he envisions the future to be.


Boundary Scan Meets Functional Test

This article discusses some fundamental aspects of the combination of boundary scan and functional test, as well as new technological solutions for embedded functional tests and their practical implementation.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In this article, Editor Pete Starkey reviews a recent seminar by the SMART Group to discuss tin whisker mitigation methodologies and strategies.

Achieving the Smart Factory Vision

James Liu, director of Standardization and Electronics Manufacturing at the Smart Factory Institute of the China Science and Technology Automation Alliance, talks about helping small- and medium-sized companies transform their production into smart factories. He explains the challenges these companies face, and the need for a free, open interface to connect disparate electronics manufacturing equipment and systems on the factory floor.

Industry 4.0 and the Circular Economy

There has been much written recently about Industry 4.0, and rightly so as it's a huge and far-reaching concept that will have an enormous impact on our design and manufacturing industries in the coming years. Even so, Industry 4.0 is just part of an idea that is much, much bigger; something known as the "circular economy".

New Column: Millennials in Manufacturing

New columnist Davina McDonnell will be writing on the challenges millennials face in the workplace, and the unique dynamic between millennials and the industry veterans who manage them.

Real Time with... SMTAI: Mentor and Kulicke and Soffa Discuss Partnership

Michael Ford of Mentor Graphics and Tom Kramer of Kulicke and Soffa speak with I-Connect007’s Andy Shaughnessy about their partnership and synergy, and how they enable customers to become flexible and productive even with high-mix operations.

Smart for Smart’s Sake, Part 1

In his previous article, Michael Ford wrote about the various historical methods of collecting data from shop-floor processes, and how it compares to the fully normalized approach of OML, where data from any machine operation can be expressed in a single interoperable language. This article discusses the next layer of activity—how the data collected is to be used for asset utilization and productivity.

Real Time with… SMTAI: Making Your Shop Floor More Intelligent

Mitch DeCaire, channel sales manager at Cogiscan, speaks with I-Connect007’s Andy Shaughnessy about how real-time data collection from the factory floor can help customers improve their quality and overall productivity.

Real Time with... SMTAI: KYZEN Pushes Cleaning Data to the Cloud

At the recent SMTA International exhibition, Tom Forsythe, executive vice president of Kyzen, discusses with I-Connect007’s Andy Shaughnessy their latest system that helps customers have a better handle on their cleaning process.

Ionics EMS Talks Industry 4.0, Mil/Aero Opportunities, and Supply Chain

In an interview with SMT Magazine, Dr. Jay Sabido, president and COO of Ionics EMS Inc., discusses a wide range of topics, including Industry 4.0, automation, and the challenges in the military and aerospace industry, including lead-free, counterfeit components, and traceability.


Is Your Electronics Manufacturing Factory 'Smart'?

Despite the amount of content being produced around big data, Industry 4.0, digital manufacturing, mass customization and various other subjects, a large number of electronics manufacturing companies still don't fully understand this question. This article looks to provide guidance on how you can assess your manufacturing facility without investing huge amounts of time and money upfront.

Real Time with NEPCON South China: Mentor Graphics Discusses Control on the Shop Floor

Ofer Lavi Ben David, director of shop floor manufacturing solutions at Mentor Graphics Valor Division, talks with I-Connect007’s Stephen Las Marias about how the smart factory should look, their Open Manufacturing Language, and their solution to provide end-to-end visibility and control in the shop floor.

Real Time with NEPCON South China: WKK on Automation, China Outlook, Challenges and Opportunities

Victor J.S. Chang, director and general manager of WKK Distribution Ltd, discusses with I-Connect007's Stephen Las Marias the increasing automation trend in the region; the efforts of the Chinese government to support the growth of advanced manufacturing; and the latest initiatives at WKK.

Will The “Internet of Manufacturing” Really Impact Business?

Supporting legacy, new, and future automated processes, as well as the vast number of manual processes in use today, is the key to being able to successfully introduce the Internet of Manufacturing into SMT production.

4 Benefits of Industrial Automation in Electronics Manufacturing

In a nutshell, industrial automation is a step beyond mechanization; it is about using control systems and technology to replace human physical and mental labor in the manufacturing and engineering sector. This article talks about four of the resulting benefits of automation for electronics manufacturers.

Case Study: Flex Smart Factory at Fuyong

This paper discusses Flex's experience with their current project called Smart Factory, which is being implemented at their Fuyong facility in Shenzhen, China. It also highlights some of the benefits they have achieved, including traceability, improved productivity and quality, and minimized defects through process predictability.

The Industry Speaks

In the latest issue of SMT Magazine, we take a pause from covering the latest technology trends, challenges, and solutions in the electronics manufacturing and assembly industry. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points when it comes to their respective specialties.

Integrated Manufacturing Solutions: an EMS, ODM, CM, and OEM!

Robbin Thompson, VP Business Development at San Diego-based contract manufacturer Integrated Manufacturing Solutions (IMS), speaks with I-Connect007's Barry Matties and Judy Warner about her company's expansion, production capabilities and product lineup, as well as the culture at IMS.

The Benefits of 3D Printing within Contract Electronics Manufacturing

The buzz around 3D printing, or additive manufacturing as it also known, continues to grow day-by-day, and it is regularly hailed as a revolutionary "new" process. This article discusses the basics of 3D printing and the different types of printing processes that exist, along with the benefits these bring to contract electronics manufacturers and the customers they serve.

Industry 4.0: Making the First Move

Many companies now have active Industry 4.0, Internet of Manufacturing, or smart factory projects. In each case, different approaches were taken that appeared to best fit the project requirements and that would deliver the intended benefits versus the cost and effort investment needed. However, there is no best solution. This article explains why.


Package-on-Package Warpage Characteristics and Requirements

iNEMI organized the Warpage Characteristics of Organic Packages Project to identify primary factors that can contribute to the warpage performance of selected components during typical SMT processes, to better understand package warpage characteristics across different package types and attributes. This article focuses on the work related to package-on-package.

EPC’s Michael de Rooij Discusses Strategic Partnership with Wurth Electronik

Michael de Rooij, PhD, of Efficient Power Conversion Corp. (EPC) talks to I-Connect007 guest editor Kim Sauer about their strategic alliance with Wurth Electronik, how their cooperation works, and how the technology solution they are co-developing can address the wireless power challenge as a whole.

The Fourth Industrial Revolution (Industry 4.0): Intelligent Manufacturing

The last industrial revolution was driven by striking advances in electronics and information technology having achieved enormous economic prosperity and manufacturing automation. So what is the fourth industrial revolution and what does it encompass? This article talks about the genesis of the term and the vision for Industry 4.0.

Improving Test and Inspection

In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.

Solder Paste Dispensing: Breaking the Limits of Printing

In an interview with SMT Magazine, Eric Gu, application manager at Nordson Asymtek China, talks about the greatest challenges and innovations in solder paste dispensing, and factors to consider when using solder paste dispensers.

Solder Paste Exploration

From the manufacturers of solder pastes, to equipment makers, all the way to the solder paste inspection guys, and the electronics assemblers who are using their products, I talked to the supply chain to find out what’s going on in the solder paste printing process, what factors impact the process, the challenges, and the best practices to consider to be able to address those challenges and improve efficiencies and yield in the SMT line.

A Preview of the 2016 International Microwave Symposium

The 2016 International Microwave Symposium (IMS) is taking place May 22–27 in San Francisco. I-Connect007's Barry Matties spoke with IMS’s Amanda Scacchitti about the upcoming show, the keynote speakers, and how IMS continues to put an emphasis on STEM education with their own STEM program for kids.

Reducing Setup Time to Provide More Uptime in Production

In an interview with I-Connect007 at the recent IPC APEX EXPO event in Las Vegas, Bob Bouchard, corporate marketing manager at BTU, talks about the latest developments in their products, how their technology is helping users reduce their setup times, and the impact of Industry 4.0 in the electronics assembly industry.

How Far Does It Make Sense to Automate?

There are often many advantages to automating the final assembly process, but how far does it make sense to automate? Is a fully automated process better than a semi-automated, or partially manual process? This article tells you more about the challenges and advantages of automation, and the right approach to adopt based on your operations.

EMS Rules of Automation & ROI

Are smaller EMS companies effectively dependent on manual labor and excluded from the innovation that automation and the computerization of the factory operation can bring? The answer is no because IoT is coming to the rescue. This article explains the cost of automation, how much to invest in automation, and the latest technology developments that will provide you manufacturing flexibility.


Working Smarter Through a Proprietary Systems Strategy

From an IT perspective, EMS companies have two choices: select off-the-shelf systems and deal with support gaps if the systems don’t provide all the tools needed to manage the business, or buy an off-the-shelf core system and create highly customized solutions to address any support gaps. This article talks about the benefits of having the latter approach.

The Importance of Being Earnest (Educated)

This new column in SMT Magazine, titled "Jumping Off the Bandwagon," is dedicated to the continued development and improvement of the high-tech electronic product assembly industry, and the human component of that industry. For his first article, Tom Borkes talks about issues that, unless addressed, will continue to put product assembly at a disadvantage in high labor rate areas of the world.

Best-Practice Process Preparation for PCB Assembly

In this high-pressure environment, process preparation systems need to be able to cope with every aspect and production, all machines and processes, without mistakes and without confusion, to scale the flexibility and responsiveness of the production operation in line with customer and market expectations.

RTW IPC APEX EXPO: Mentor Graphics Takes Manufacturing Operations to the Next Level

Dan Hoz, general manager of Mentor Graphics Valor Division, discusses with I-Connect007's Andy Shaughnessy how they are helping electronics manufacturers take their operations to the next level through their Valor IoT Manufacturing solutions. He talks about the OML and the Valor IoT Device, and how these solutions will help the electronics manufacturing industry to move to Industry 4.0.

The Buyer’s Guide to Automation

Back in the 1990s when high-volume production was still enjoyed by most operations, the idea of replacing remaining manual operations with automated processes seemed like a great idea, but the technology at the time did not quite deliver on expectations. Today, the same goals for automation are once again in play; but this time, although technical capabilities have vastly improved, little high-volume is left.

Enabling Process Innovation through Test and Measurement Solutions

In an interview with I-Connect007, National Instruments Managing Director Matej Kranjc discussed how their platforms are enabling the development of intelligent systems of systems that help users make smarter business decisions, and how big data analysis is enabling process innovation in the electronics assembly line.

RTW IPC APEX EXPO: Mentor Graphics Makes Internet of Manufacturing Affordable

Michael Ford, marketing development manager at Mentor Graphics, and I-Connect007 editor Andy Shaughnessy discuss the Open Manufacturing Language (OML), the challenges in supporting the hundreds of thousands of machines that are out there at shopfloors already, and how Mentor is making the Internet of Manufacturing affordable for everyone in the PCB assembly supply chain.

IPC APEX EXPO: Cogiscan Explains Benefits of Having Real-Time Factory Intelligence

Francois Monette, VP of sales and marketing at Cogiscan, speaks to I-Connect007 guest editor Mark Thompson about modern factory intelligence, and the the benefits of having this capability in assembly lines.

IPC APEX EXPO: Rethink Robotics Provides a Glimpse into the Future of Electronics Assembly Industry

Carl Palme, applications product manager at Rethink Robotics, discusses with I-Connect007's Stephen Las Marias the impact of robotics, and its future, in the electronics assembly industry.

Ensuring Profitability

According to our recent survey, the key challenges impacting profitablility of electronics manufacturers and assemblers are cost, process improvement, changing customer demand, design, training, and Lean manufacturing. The March 2016 issue of SMT Magazine highlights strategies that will help electronics manufacturers address those issues and achieve profitability in their operations.


New Paradigms

While the latest technology innovations bode well for the electronics industry, they also offer many challenges in terms of the way products are being manufactured. The latest issue of SMT Magazine features "what's new" in the electronics assembly industry, and discusses how they are addressing current manufacturing challenges.

Magnetically Aligned Novel ACA Revolutionizes 3D Chip Stacking

The use of anisotropic conductive adhesive (ACA) is not new within the electronics industry; however, drop-in replacements don't exist for lead-based and lead-free solder assemblies. Also, current ACAs require pressure and sequential assembly of components. In this article, Rochester Institute of Technology's Dr. S. Manian Ramkumar writes about a novel ACA that will help revolutionize the packaging industry.

EMS: Quo Vadis? (Where are You Going?)

In an industry that is constantly changing, EMS providers have reinvented themselves to stay relevant and fuel profitable growth. In this article, Integrated Micro-Electronics Inc.'s Frederick Blancas talks about five of the many transformation trends happening in the EMS industry, and how they are pushing the industry to continue to evolve, progress and advance.

New Year Outlook: Electronics Hardware

Industry veteran Dr. Jennie S. Hwang writes about how "smartness," mobility, connectivity and wearability will drive innovation in end markets and electronics manufacturing process and technologies this year. She also mentions new developments that will make footprints on the advanced technology map.

New Year Outlook: China’s Five Year Plan

In this article, Dr. Jennie Hwang writes about the latest developments in the current global economic landscape, as well as mega-technological trends, which include: the highlights of macro-economy outlook, China factor, oil dynamics, cyber security, and grand challenges in technology and the path forward.

Medical EMS: Opportunities Abound

Megatrends such as the increasingly ageing population and growing demand in emerging economies worldwide bode well for the medical electronics assembly industry. However, challenges such as margin pressures, compliance costs and risks, supply chain instability, and new product introduction headaches are hindering a more aggressive prognosis of the industry. But, with innovation, medical manufacturers can churn out more.

Valtronic Highlights Vital Components in Medical Electronics Manufacturing

Jay Wimer, executive vice president of the Valtronic Group, and president and CEO of Valtronic USA, discusses the impact of the medical market on the electronics manufacturing industry, the challenges facing medical electronics manufacturers and technology providers, and how the trends happening in the medical electronics segment are driving innovation in electronics manufacturing.

Top 10 Factors to Consider When Selecting a Medical EMS Company

Once the decision has been made to use an EMS company, selecting the right one involves several steps. Although most EMS companies perform the same basic services, every EMS company is different. In this article, Mo Ohady and David Estes of Digicom Electronics write the 10 key factors to consider when selecting your medical EMS company.

Medical Electronics: Manufacturing Vitals

With the rapidly growing aging population, rising healthcare costs and increasing health awareness, opportunities abound in consumer medical devices, diagnostics, imaging, and instrumentation. However, the medical electronics industry is not without its own set of challenges. The January 2016 issue of SMT Magazine highlights the manufacturing challenges and opportunities in this growing sector.

Industry 4.0: Creating a Standard

Mentor Graphics Valor Division's Dan Hoz, general manager, and Ofer Lavi Ben David, product line director, discuss where Industry 4.0 is taking the industry, and the changes it will bring to both large and small companies, customers, and the supply chain, including how Mentor connects different machines on the shop floor to provide universal Industry 4.0 visibility.


iNEMI: Leading the Way to Successful Electronics Manufacturing

iNEMI CEO Bill Bader talks about the consortium’s goals and mission, its collaborative projects, as well as its roadmap for the electronics manufacturing industry. Bader also highlights iNEMI’s milestones in line with the major trends that have happened in the electronics industry, including the transition to lead-free, addressing tin whisker growth, and the move towards HFR-free PCB materials.

The Key to Understanding Industry 4.0: Show, Don’t Tell!

At the recent productronica event in Germany, Mentor Graphics set up a racecar track in their booth. In an interview with I-Connect007, Michael Ford, senior marketing development manager at Mentor's Valor Division, explains why it's a perfect analogy for understanding Industry 4.0.

SMART Group: The Guiding Influence in the Electronics Industry

Founded in 1984, the SMART Group promotes advanced manufacturing technologies and helps companies cope with the challenges of surface mount technology. In an interview with I-Connect007, Keith Bryant, chairman of SMART Group, discusses the association, its activities, and how it is supporting the electronics manufacturing and SMT industries.

Digitalization on the Horizon

In the evolution towards the smart manufacturing paradigm, end-user requirements are set to evolve and become more complex than ever before. But the current scenario will also provide the biggest opportunity to realign one's existing business approach and forge alliances and partnerships with market participants. As manufacturers look to the future, they need to examine how advanced information and communication technologies can boost their value creation.

Low-Temperature Thick Film Pastes Permit Lead-Free Soldering

There has been an increased interest in low-temperature polymer thick film products that perform at the same level as their high-temperature counterparts, including high reliability, strong adhesion, and solderability with lead-free solders. This article talks about a new, easy-to-process polymer thick film paste compatible with a variety of substrates, features low temperature curing, and offers excellent solderability with SAC305 solder.

Making Connections with Associations

To provide our readers more information about their associations, this month's issue of SMT Magazine features articles and interviews with SMTA, IPC, iNEMI, SMART Group, and VDMA Productronics, to help understand more their activities, goals, and missions, and how they are helping push forward the electronics manufacturing industry.

Electrolube Discusses Conformal Coating Innovations

At productronica 2015, SMT007 editor, Stephen Las Marias, interviewed Phil Kinner, technical director of Electrolube's Coatings Division, about the latest conformal coating challenges being faced by their customers, and how they are addressing these issues. He also talked about the trends driving product innovation strategies at Electrolube, and some of the new solutions they are offering the market.

Managing Big Data from an Analog World

In the age of big data, hardware is evidently no longer the limiting factor in acquisition applications. How do we store and make sense of data? How do we keep them secured? How do we future proof them? These questions become compounded when systems evolve to become more complex, and the amount of data required to describe those systems grow beyond comprehension. More advanced tools will be essential to managing this explosion of data and help engineers make informed decisions faster.

Connecting the Enterprise

The growing Industrial IoT trend is going to further fuel the explosion of data as more devices and systems on the factory floor get connected. To bring this manufacturing data into the enterprise where it can be used to generate value, investments in technology and equipment and a mindset shift are necessary.

The New Industrial Era

Key transformative technologies such as big data, analytics, and IoT are ushering in a new industrial era, where new technology forces and innovations are changing the dynamics, risks, and success factors for global manufacturing companies. To be successful in this environment, a mindset shift is required when it comes to deciding what to do and how to take your manufacturing operations to the next level.


Surface Mount Technology Association—a New Milestone

With a grand mission, SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. The organization delivers the right information at the right time to empower the workforce, who collectively advances technology, innovates new products, and serves the global industry.

The Need for Speed

I was recently invited to judge the editor’s choice award at National Instrument’s 2015 NI Engineering Impact Awards—ASEAN Regional Contest, and there was one project that I found relevant to our topic for this month’s issue of SMT Magazine. Developed by Gatepacific Circuits Inc., the project improved the process of dispensing paste compared to the manual process done by human operators, and increased the throughput from 500 units to more than 1,000 units.

Faster, More Precise Jet-dispensing in Microsystems Technology

As miniaturization advances relentlessly, the components that need to be connected are becoming ever smaller and more delicate. At the same time, quality standards and the functionality of the materials are increasing. This development requires joining processes that can reliably fix the smallest of components.

Saki Discusses AOI Innovations

Norihiko Koike, COO at Saki Co. Ltd, discussed with I-Connect007's Stephen Las Marias some of the latest 3D AOI technologies at the company, and how these are providing their customers easier programming and more reliable inspection.

OK International Talks Trends Driving Product Innovation Strategies

Bryan Gass, vice president for global sales and marketing at OK International, discussed with I-Connect007's Stephen Las Marias how trends such as automation, wearables, and Industry 4.0 are driving his company's product innovation strategies.

What’s Driving Automotive Electronics?

Despite optimistic forecasts surrounding the automotive electronics industry, challenges remain, driven by the high level of complexity of devices and electronics being built into cars and the harsh operating conditions that these products are expected to operate in. Find out how equipment suppliers and automotive OEMs and EMS providers are addressing these issues in the September 2015 issue of SMT Magazine.

Declaring War on Failure in Electronics

Failure, in electronics, while not necessarily desired by either manufacturer or consumer, is expected. This is not to say that the industry has not attempted to improve reliability. In this article, Verdant Electronics' Joseph Fjelstad writes that much is being done in an effort to improve reliability with new solder alloys, new fluxes, new materials, new equipment and process parameters.

Mechatronics Innovations and Applications

In an interview with I-Connect007, Edward Neff, President of SMAC Moving Coil Actuators, discusses some of the latest mechatronics innovations happening in his company, and how these developments are being applied in different industries including electronics assembly and robotics.

Meeting High-Speed Demand with Optical Circuits

In an interview with I-Connect007 Publisher Barry Matties, Felix Betschon of vario-optics discusses the advancements in optical circuit boards, and explains the core advantage of this technology and what circuit designers must do to add optical circuits into their design disciplines. He also talks about the opportunities for this new technology, and what's driving customers to consider adopting it.

A Review of the Opportunities and Processes for Printed Electronics (Part 5): The Future of PE

In the final part of this article series, Happy Holden writes that whether one of the technologies mentioned or technologies yet to be developed will dominate the future of printed electronics is an open question. What is a bit more certain is that flexible base materials printed using printed electronics solutions and processed in roll-to-roll fashion will be an element of successful future technologies.


A Review of the Opportunities and Processes for Printed Electronics (Part 4): Applications

In Part 4 of this five-part article series, Happy Holden talks about the market applications for printed electronics. He writes that while there are several areas for application of PE solutions, such as in sensing, identification and security, and power, it is the display segment that is considered to be the most interesting potential application.

A Review of the Opportunities and Processes for Printed Electronics (Part 2): Printing Technologies

In Part 2 of this article series, Happy Holden explains that the selection of printing method to use is determined by requirements concerning printed layers and properties of printed materials, as well as economic and technical considerations for printed products.

A Review of the Opportunities and Processes for Printed Electronics (Part 3): Materials, Process Developments

In Part 3 of this article series, Happy Holden highlights the different material and process developments for printed electronics. He also notes how some suppliers have addressed the conductivity problems by using new binder formulations for the ink.

A Review of the Opportunities and Processes for Printed Electronics (Part 1)

As microsystems continue to move towards higher speed and microminiaturization, the demands for interconnection are opening up new opportunities for "innovative" interconnects. In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.

iNEMI Managing Director: New, Disruptive Technology on the Horizon

Dr. Haley Fu, managing director of Asia Pacific for iNEMI, and Publisher Barry Matties spoke recently. Fu gave her overview of the last eight years with iNEMI along with her opinion of what the most significant changes have been, globally and for the Asia market in particular. She predicts that in the future, the PCB will probably adopt optical architectures instead of copper, because using copper for the trace means that the land space and the property will not satisfy the future high-speed data transport rate.

A Conversation (and Day) with Joe Fjelstad Part 4

We continue the conversation as it turns to the more technically focused area of disruptive technology. The method Joe has been demonstrating for years now is one which is poised to offer dramatic increases in electronic reliability while decreasing overall cost through the elimination of solder--a cornerstone concept of what has been coined as Occam technology.

A Conversation (and Day) with Joe Fjelstad, Part 2

In Part 2 of this multi-part interview series, Verdant Electronics Founder and CEO Joe Fjelstad, and I-Connect007 Publisher Barry Matties discuss the future of what’s to come for the electronics industry, which, according to Fjelstad, has a lot to do with where we’ve just been in our quest for lead-free manufacturing. He also offers his view on the natural order of the evolution of personal political persuasions.

NEPCON China Showcases Latest Manufacturing Tech in Asia

Considered Asia's biggest, most influential SMT and electronics manufacturing event, NEPCON China 2015 attracted over 450 leading brands from 22 countries, who are showcasing this week the latest electronics manufacturing technologies and products across an exhibition area of 25,000 sqm. I-Connect007 is on hand again this year covering this event with exclusive interviews and photos from the show floor.

An Optical Update with TTM

Barry Matties recently met with Marika Immonen, manager of R&D optical interconnects at TTM Technologies. They last spoke one year ago. This time, they discussed the optical project that she’s been leading, as well as the future of optical technology in the PCB industry.

Are the Robots Taking Over?

Some have a fear that robots are taking over, but the founders of Universal Robots have a different view. They have focused on producing a versatile robotic arm that frees humans from doing the repetitive tasks. Their journey has not been an easy one. From a startup with just a couple of employees their future was questionable at best, but they never gave up.


Time to Ditch Heavy Metal for Soft Rock?

Yash Sutariya and Thomas S. Tarter shine a light on the often overlooked topic when it comes to PCBs for LEDs: reliability. They wrote that composite materials can provide both a thermal management solution and a dimensional stability solution that has not yet been presented through conventional materials.

Advanced Printing for Microelectronic Packaging

The concept of dispensing a wide range of materials in three dimensions presents a potential change in electronic packaging. This article will cover the concept of combining dispensing technologies on a single platform to build integrated and monolithic electronic structural circuits.

Data I/O to Showcase PSV7000 at APEX

“The PSV7000 is our fastest ramping automated system and has become the preferred programming solution for leading automotive electronics manufacturers worldwide, with 8 of the top 9 automotive electronics companies purchasing at least one PSV7000 since its introduction.” states Anthony Ambrose, President and CEO of Data I/O Corporation.

Opportunities for 3D Printed Structural Electronics

Today's 3D printers have many limitations, but the boundaries are being pushed and exciting developments are continuously being made. One of the most promising recent developments in the world of 3D printing is multimaterial printing, which holds the key to the emergence of 3D printed electronics.

The Rise of Structural Electronics

Structural electronics is one of the most important technological developments of this century. It forms a key part of the dream, first formulated 30 years ago, of computing disappearing into the fabric of society. It also addresses, in a particularly elegant manner, the dream of Edison in 1880 that electricity should be made where it is needed.

CES 2015: Preview and Predictions

Looking back over the last five years of CES and analyzing predictions and items featured by the large exhibitors, you'd likely assume the 2015 show would feature more advanced 3D TVs, as they were predicted to take over the market...wrong!

Sanmina: Automation in Production Lines

With so much discussion about the increasing amount of automation in the world of electronics assembly Editor Richard Ayes asked Gelston Howell, senior VP at Sanmina, to provide perspective on the state of manufacturing automation. Howell discusses the current state of automated electronics assembly systems, the inherent risks and challenges, and the future of robotics in manufacturing.
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