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7 Simple Ways to Motivate Your Electronics Manufacturing Staff
01/18/2018 | Neil Sharp, JJS Manufacturing
The Importance of Product Testing for Quality, Reliability and Durability
01/17/2018 | Patty Rasmussen, East West Manufacturing
Assigning IDs Within the Internet of Things
01/16/2018 | Hubertus Grobbel, Swissbit AG
Improving Design, Manufacturing and Assembly Teamwork
01/15/2018 | Syrma Technology
Tips & Tricks: Assembly Panelization
01/12/2018 | Ken Horky, Peterson Manufacturing
7 Simple Ways to Motivate Your Electronics Manufacturing Staff
Your manufacturing staff are the backbone of your electronics manufacturing organization. They are the ones showing up day in. day out to build products for your customers. So, keeping them motivated and engaged should be a priority, right? But too often during peak production periods, surmounting pressure can lead to staff feeling overworked, demoralized, and underappreciated.
The Importance of Product Testing for Quality, Reliability and Durability
One really vital piece of the product development process is product testing for quality, reliability and durability. You need to find out whether your product will do what it's supposed to do—that's quality. You also need to learn whether it will do what it's supposed to do over and over again, even when conditions aren't ideal—that's reliability and durability.
Assigning IDs Within the Internet of Things
Networking devices and machinery is in full swing. However, despite all the Industry 4.0 enthusiasm, there are voices of caution: Secure your communication. For this, identification of the participants is one requirement and special SD cards offer a surprisingly simple and flexible solution.
Improving Design, Manufacturing and Assembly Teamwork
Many electronics manufacturers tend to compartmentalize or "silo" their departments, such as the design team versus assembly-related functions. The relationship between design and manufacturing can too often be disconnected or otherwise poor, which stalls productivity and increases bottom-line costs. By identifying and addressing these gaps, this financial hemorrhage can be reduced, and profitability increased.
Tips & Tricks: Assembly Panelization
Thoughtful PCB array and panel design can reduce line stoppage, improve changeover time and reduce material scrap. Fiducial location and design are good aids to prevent mistakes, but may still result in line stoppage. If you have fiducial recognition issues, making the shape of the mask opening different than the fiducial feature may help the vision system discern the target feature easier.
Is UK Manufacturing Ready for the Fourth Industrial Revolution?
The new fourth Industrial Revolution (4IR) is driving the transformation of manufacturing across the world, encompassing breakthroughs in artificial intelligence, big data, the Internet of Things and 3D printing. And according to the World Economic Forum's Klaus Schwab, when compared with previous industrial revolutions, the fourth is evolving at an exponential rather than a linear pace.
Recent Innovations in DFMA
Software, electronics and sensors are making their way into the world of product design. New composites, plastics and alloys are replacing traditional metals. Designs are even reducing the carbon footprint of manufacturers, and more products can be recycled when they reach the end of their use.
Configure to Order: Different by Design
When considering implementation of Industry 4.0 solutions, following the hype in the market, attention typically is focused on the need for communication between machines on the shop-floor. Knowing what is currently executing and the status of each process in the factory, as well as all the related resources and support operations, provides critical information for Industry 4.0 computerized management systems.
PCB Pad Repair Techniques
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.
Focus on the New
It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.
Why You Want Your EMS Partner to Be Annoying and Boring
Outsourcing part or all of your manufacturing to an electronics manufacturing service (EMS) provider can be daunting. Handing over some of the control of your business can be a scary prospect.
14 Lessons in Diagnostic Instrument Development
With over 40 years of global leadership in the design, development and manufacture of life-saving medical technology, ITL Group offers invaluable experience and industry insight into what influences the success or failure of a product. Here are 14 lessons from ITL’s many years in diagnostic instrument development.
Top 10 Most-Read SMT007 Columns of 2017
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.
What Does Digital Twinning Mean for Manufacturing?
Industry 4.0 brings with it new forms of artificial intelligence that organizations can leverage to improve and streamline their processes. Machine intelligence is driving industrial connectivity and possibilities for optimized productivity and in turn, substantial savings.
Top 10 Most-Read SMT Articles of 2017
Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.
The Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
The ongoing miniaturization trend in the SMT production induces new challenges and highly integrated systems. In passive components, the miniaturization leads to the introduction of the EIA size 01005 or smaller. Despite numerous publications in this field already addressing the printing of such devices, a defined wholly optimized process remains unsolved and inspires further novel research ideas on this topic.
Customers Drive Investment Decisions
In our recent survey on investing in new equipment, one question we asked is what or who influences the research into new equipment to buy for their factories. A majority, 77% of respondents, say that addressing customers’ needs is the primary influence in their research for new equipment, followed by market conditions or trends.
Top Reasons for Investing in New Equipment
In our recent survey, a majority of respondents said they consider increasing capacity and improving their existing manufacturing capability as top reasons for investing in new equipment for their production lines.
Evaluation of Stencil Technology for Miniaturization
SMT stencil printing technology continually evolves to keep pace with device miniaturization technologies. Printed circuit board assemblers have numerous new technology options to choose from, and need to determine the most effective ones to produce the highest quality and most reliable solder interconnections.
Step Stencil Technologies and Their Effect on the SMT Printing Process
Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.
Mirtec Succeeding Through Inspection Innovation
David Bennett, president of Mirtec Europe, speaks with I-Connect007 Technical Editor Pete Starkey about the company's latest inspection technologies, the challenges that miniaturization can bring, and Mirtec's efforts to stay on the leading edge and never be a “me too” company.
Industry 4.0 and the Platform-Based Approach to Testing
Chandran Nair, the vice president for Asia Pacific at National Instruments, explains how the Industry 4.0 vision will change electronics manufacturing. He discusses key technology enablers that would drive the evolution of manufacturing processes, and how a platform-based approach can help improve test and measurement.
Koh Young Europe Ready for Next Year, and Beyond
Harald Eppinger, managing director of Koh Young Europe, speaks with I-Connect007 Managing Editor Andy Shaughnessy about the demands of the European market, the company's long-standing success with its solutions, and the future of Koh Young Europe.
The Year of IoT Digitalization
There is no longer any significant disagreement that having an industry-wide standard for IoT communication is absolutely essential for digitalization of factories if they are going to deliver on Industry 4.0 performance expectations. Digitalization of manufacturing is the key business opportunity of the decade, whoever and wherever you are, so stand-up and be a part of it, and create your opportunities.
Solder Printing Process Inputs Impacting Distribution of Paste Volume
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.
Tips & Tricks: Generating Stencil Tooling
Many engineers are leaving the editing up to the stencil fabricator these days. From the outside, this may appear as a time saver for process engineers, but considering how many stencil redos have been required and how many processes that have run 'sort of OK,' there's a tremendous amount of scrap and rework that could be saved from just a little more attention paid to stencil tooling.
Improving Solder Paste Printing
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.
9 Ways to Keep Up with Changes in Manufacturing Technology
The world of manufacturing technology might not be quite as fast to change as consumer electronics, but it is evolving, and faster than you think. Recent evidence shows that companies are increasingly adopting 'servitized' business models and technology is a key enabler, so falling behind the times is not really an option.
Two Questions to Ask Yourself with PCB Continuous Strips of Parts
Sometimes, you don't want to buy a reel, full or partial, but still want your PCB parts all in one continuous strip. Everyone wants to use up their odds and ends, but once those are gone, it's easier for you if each part is one strip. If you want to save a little money and can use a longer turn-time, you might want to choose a short-run production service with continuous strips.
Insights from productronica
The recently held productronica was a busy exhibition. There were booths that were so crowded that people were standing in the aisle to talk with company representatives. But some booths were nearly empty. Read to find Dieter G. Weiss' comments on this biennial show.
Equipment Matters in Solder Paste Printing
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.
Tips & Tricks: What to Do if You Can't Have Reference Designators on Your Board
Sometimes, you can't have reference designators on your board. Perhaps it's because it's too densely populated and there isn't room. Or maybe, for aesthetic reasons, you've chosen to leave them off. Here's how you can address that issue.
What Matters Most is Communication
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.
DFx on High-Density Assemblies
Use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process, and reliability. The type of end product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end products will look very similar, but specification limits would be different.
Is Your EMS Provider The One for You?
No matter where you are in your outsourcing journey, ensuring that your EMS provider is right for you is one of the most important success factors. The right partner should bring you years of pain-free manufacturing that has the ability to evolve and adapt to your needs as your business grows.
Via-in-Pad Plated over Design Considerations to Mitigate Solder Separation Failure
Under certain conditions, the use of VIPPO with other pad structures within a BGA footprint can result in a unique failure mode in which the BGA solder joint separates between the bulk solder and the intermetallic compound either at the package pad or PCB pad interface, depending on whichever is the weaker interface. It can be either a complete or partial separation and hence, may or may not be detected at ICT/functional test.
Video from productronica 2017: YXLON Moves Away from One-Size-Fits-All Approach
Keith Bryant, global director for electronics sales at YXLON International, speaks with I-Connect007 Technical Editor Pete Starkey about their latest X-ray inspection machines that are designed as a specific fit for its own market sector. He also talks about what's state of the art right now in X-ray inspection systems, as well as updates on the progress of the integration of SMART Group into the SMTA.
Video from productronica 2017: Rehm Discusses Trends Driving Product Development
Michael Hanke, chief customer officer of Rehm Thermal Systems, speaks with I-Connect007 Managing Editor Andy Shaughnessy about the importance of communicating with their customers when it comes to new process and technology trends. He also talks about Industry 4.0 and big data, and process monitoring and transparency.
How to Ensure Good Service from Your EMS Partner
What does good service mean from an EMS provider? Sure, it’s about consistently delivering products, on time, and to a high quality. But there's more to it than that. This article highlights two factors to consider when choosing an EMS provider to ensure good service and a strong, healthy and happy outsourcing partnership.
Video from productronica 2017: Heraeus Highlights Need for Highly Reliable and Compatible Assembly Materials
At the recent productronica 2017 event in Munich, Germany, Stefan Merlau, global product manager of assembly materials for Heraeus Electronics, discusses with I-Connect007 Managing Editor Andy Shaughnessy the biggest pain points of their customers, and how his company’s latest technologies are helping them address these issues. He also speaks about their outlook for the industry going into the new year.
Video from productronica 2017: Koh Young Focuses on Total Inspection Solution
At the show floor of productronica 2017, I-Connect007 Technical Editor Pete Starkey speaks with Managing Director Harald Eppinger of Koh Young Europe GmbH about the principles of Koh Young’s total 3D inspection solution for SMT process optimization and yield improvement.
Video from productronica 2017: Mycronic Discusses Precision Jetting Systems
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.
Blockchain for Manufacturing: What are the Opportunities?
Blockchain is one of the hottest topics in the tech world, and a buzzword that’s been popping up quite a bit over the last year or so. It is said to have the potential to radically simplify many business processes, by reducing risk and boosting transparency. In the manufacturing world, what are its opportunities?
Video from productronica 2017: Nordson ASYMTEK Highlights Bulk Dispensing Technology
At this week’s productronica, Nordson ASYMTEK highlights its the new Helios SD960 bulk and two-component dispensing system. Almar Thewissen, program manager for Industrial Applications, EMEA, at Nordson, discusses its applications with I-Connect007 Technical Editor Pete Starkey.
Video from productronica 2017: Goepel Highlights Updates on X-Line 3D In-line System
At productronica 2017 in Munich, Germany, Goepel electronic's Andreas Turk, head of AXI Systems, explains the latest enhancements to their X-Line 3D in-line system for high-end inspection. He also discusses the benefits of the Stingray Detector option.
Optimal Electronics Sets Sight on Growth
In an interview with SMT Magazine, Dr. Ranko Vujosevic, CEO and CTO of Optimal Electronics, speaks about the latest technology developments at his company, and his plans to sustain growth. He also talks about his paper on lights-out electronics assembly, the technologies that would support this vision, and the ultimate goal of Industry 4.0.
Solder Preforms 101: Ask the Expert
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.
HDI Considerations: Interview with ACDi's Garret Maxson
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.
5 Simple Elements to Guarantee Outsourcing Success
Rather than viewing outsourcing as a way to offload unwanted tasks, OEMs should spend time carefully selecting and then maintaining a properly managed relationship with their chosen EMS partner. Here are five simple elements that you should focus on before, during and after an outsourcing strategy to guarantee it is a success.
Dealing with Vias-in-Pad
Screaming Circuits, a division of EMS firm Milwaukee Electronics, specializes in short-run, one-off, and prototype PCB assembly. In an interview with SMT Magazine, Duane Benson, CTO of Screaming Circuits, talks about the challenges when dealing with microvias and vias-in-pad from an assembly standpoint, and how in-circuit test issues, such as access to test points, can be addressed.
Two Prevalent Rework Heating Methods--Which One is Best?
There are two prevalent heating technologies in use throughout most electronic assembly operations for advanced component rework—the first method employs the use of hot air gas to heat up the component through the package, while the second much-used heating technology relies on infrared energy. This article highlights the pros and cons of the two methods, and discusses which one is the best to use for your application.
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
What Does an OEM Really Gain from Outsourcing their Manufacturing?
But what does an OEM really gain when they make the move from an in-house manufacturing operation to an outsourced one? This article looks at two key benefits OEMs stand to gain once they relinquish control and hand over their production responsibility to an EMS provider.
Creating the Perfect Solder Joint
From a visual standpoint, a good solder joint should be smooth, bright, shiny, clean, and have a nice concave solder fillet. But how do you ensure that inside those joints, good intermetallic bonds are formed? Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint.
Cleaning Trends: The Challenges of Miniaturization and Proximity
At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.
Soldering Tip: Key to Good Solder Joints
In an interview with SMT Magazine, Enrique Moreno, technical support engineer at JBC Soldering, discusses the key parameters to consider during hand soldering to achieve the perfect solder joint. He also talks about the the increasing move towards automation and robotics soldering.
Achieving the Perfect Solder Joint: The Many Perspectives on Soldering
For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.
Surprising European EMS Market Numbers
If you think market analysis is always correct and predict the future exactly, you are mistaken. The latest annual reports from EMS companies with manufacturing sites in Europe have changed the picture on the European EMS industry quite a bit and caught us by surprise. Yes, you read that correctly: SURPRISE.
Should I Involve My EMS Partner in DFM?
OEMs are seeking the support of EMS providers with more than just manufacturing, but with design elements too. One of the main design services EMS providers will be likely to offer is design for manufacture (DFM). This article highlights why engaging your EMS partner in DFM is worthwhile, and will be valuable in securing the longevity of your product.
Choosing Solder Processes: Getting It Right
In an interview with SMT Magazine, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, shares his insights on the topic of achieving the perfect solder joint, from the perspective of a reflow oven supplier. He also talks about the latest developments in reflow ovens aimed at addressing voiding in solder joints.
Moving Toward the Zero-Defect Line
During the recent NEPCON South China exhibition in Shenzhen, Olivier Pirou, chief operating officer of Vi TECHNOLOGY, talks about achieving the perfect solder joint from the point of view of an inspection systems provider, and how manufacturers can strategize to achieve a zero-defect line.
Spreading the Word about SMTA—One Local Show at a Time
Eileen Hibbler of TEK Products, who currently sits on the Board of Directors of SMTA and is the VP of Membership, talks about educating the people in the industry; the importance of the local shows; SMTA's university chapters and their initiatives; and how SMTA is reaching out to millennials.
Test Solutions Your EMS Partner Should Offer
When looking to outsource your manufacturing, you need to know that your chosen EMS partner has good test solutions in place so that they can produce consistent, high-quality products to your customers’ requirements. This article highlights the importance of test, and outlines the different types of test your EMS partner should offer.
Joining Forces: SMTA and the SMART Group in Europe
Tanya Martin, executive director at SMTA, and Keith Bryant, global director of sales for YXLON International and chairman of the SMART Group, speak with I-Connect007 Managing Editor Patty Goldman about the latest initiatives within their associations, and discuss some interesting news about an upcoming merger.
Counterfeit: A Quality Conundrum
The rise in the ingress of counterfeit materials into the supply chain has made them prolific, though yet, the extent is understated. What needs to be faced now is the need for incoming inspection, but at what cost to industry, and does anyone remember how to do it?
Rework and Reball Challenges for Wafer Level Packages
Amid the growing trend in package and PCB miniaturization, wafer-level packages (WLPs) have garnered recent popularity for their affordable cost, small footprint, and thin profile. Component suppliers must be prepared to support failure analysis for PCB-assembled WLPs, including fault isolation, nondestructive screening, as well as destructive analysis techniques.
Eight Factors a CEM Should Know About its Suppliers
Selecting a contract electronics manufacturer (CEM) that fits well with your outsourcing strategy can be a difficult and long process. But, by taking the time to research and investigate potential shortlisted partners, you are much more likely to reap the benefits further down the line.
Three Reasons to Use PCB Panel Routing Techniques
Most PCBs are individually routed—meaning they're not panelized. That doesn't mean that, sometimes, sending them to a PCB assembler in a panel isn't a good idea or even required. Generally, assemblers don't require panels, but there are some cases when they do.
RTW SMTAI: Mentor Eases Programming in Viscom Inspection Systems
Jesper Lykke, engineering manager for USA of Viscom AG, and Zac Elliott, technical marketing engineer at Mentor, speak with I-Connect007 Managing Editor Andy Shaughnessy about Viscom's adoption of the Valor Process Preparation and how it is helping users with their inspection programming.
Top Five BGA Challenges to Overcome
Higher reflow temperatures of lead-free rework increases the pressure for properly shielding the neighboring components. These developments are causing BGA rework challenges. This summary will discuss the most challenging aspects of BGA rework and options for solutions.
RTW SMTAI: EPTAC Discusses Manufacturing Training Trends
During SMTAI International 2017, Leo Lambert, vice president and technical director of EPTAC, discusses with I-Connect007 Managing Editor Andy Shaughnessy his company's recent expansion and the trends he's seeing in manufacturing training.
BTC and SMT Rework Challenges
In the assembly of bottom terminated components (BTC), the formation of voids has become a serious problem in many applications. In the SMT process, the reliability of solder joints becomes more of a concern, as less and less solder is allowed for each joint. The presence of voids can deteriorate the joint strength and eventually lead to joint failure.
RTW SMTAI: How Automation and Government Support Can Help Reshoring Drive
Alex Malek, vice president of sales and service for North America of SAKI, speaks with I-Connect007 Managing Editor Andy Shaughnessy about how automation and government investment can help bring back manufacturing jobs from overseas.
RTW SMTAI: AIM's Dr. Mehran Maalekian Speaks on New Alloys for Harsh Environments
Dr. Mehran Maalekian, R&D Manager at AIM Solder, speaks with I-Connect007 Managing Editor Andy Shaughnessy about new alloys that are targeted for high-temperature and demanding applications, particularly in harsh environments, where standard lead-free alloy such as SAC will not perform as well.
Is Hybrid Technology Gaining Momentum?
Over the past 20 years, ceramic hybrids have changed more and more to a backyard living in the European electronics industry, mainly driven by price pressure, specifically from the automotive electronics industry.
IPC’s David Bergman on Industry Training and Education
David Bergman, vice president of standards and technology at IPC, talks about the biggest issues facing the electronics manufacturing industry now. He also explains how the organization helps elevate the industry through its training, continuous education, and standards development.
How to Prevent Suspect Components from Entering Your Supply Chain
The success of any supply chain relies on quality and stability. If either of these elements are threatened, OEMs or their EMS provider will struggle to ensure supply chain excellence. Unfortunately, with the risk of counterfeit and other suspect components ever present, this can sometimes be difficult to achieve.
The Root Causes & Solutions for Warped PC Boards
There are two primary types of causes of board warping: process related at the fab or assembly shop, and layout related issues. If it's warped before assembly, it's between fab and layout. If it's flat before assembly and warped after, it's most likely between layout and assembly. That said, sometimes a fab problem won't show up until a pass through the reflow oven at your assembly partner.
RTW SMTAI: Alpha Discusses Solder Dross Reclamation
At the recent SMTA International 2017 exhibition in Rosemont, Illinois, Mitch Holtzer, director of Americas Reclaim Business of Alpha Assembly Solutions, talks with Managing Editor Andy Shaughnessy about the solder dross reclamation process, and discusses his new role in leading Alpha’s reclamation business.
Implementing a Capacity Planning Tool
One of the more common challenges we see in the EMS world is that through the outsourcing of their manufacturing, many OEMs have forgotten the fundamentals of supply chain management and expect quick turnaround on orders without taking into consideration the whole supply chain constraints or the impact of not providing accurate forecasts to the EMS partner.
RTW SMTAI: MIRTEC on Staying Ahead of the Curve
Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.
RTW SMTAI: Gary Tanel Discusses How SMTA Helps the Industry Evolve
At the SMTA International 2017 exhibition in Rosemont, Illinois, Gary Tanel, president of the SMTA Dallas Chapter, speaks with I-Connect007 Publisher Barry Matties on a myriad of topics, including the goal of the SMTA as an industry association, and how it is helping the industry evolve. They also discussed challenges and strategies in bringing more young people to the industry.
Drying Boards after Rework Cleaning—To Do or Not to Do?
In cases where water soluble fluxes are being used in the rework process, in cases where the components need to have flux residues washed off, or in cases where the board needs to be cleaned with water for subsequent conformal coating touchup, proper drying and perhaps even bake out procedures need to be performed.
What's Up in Scandinavia's EMS Industry?
Scandinavia, consisting of Denmark, Norway, Sweden, and Finland, is relatively small in regards to the overall European EMS revenues, and counts for less than 6% of the European EMS production value. Nevertheless, more than 160 companies offer EMS services, not to mention companies who only manufacture cable harnesses or just do design work, box building, and after-sales services.
Rework and Reliability: Less is More!
Circuit boards are not always perfect after reflow or wave soldering. Scrapping boards with one or two defects is expensive, so rework happens. A good concept for rework is less is more, especially less flux. Use as little rework flux as possible, as in the old Brylcreem ads, "Just a little dab'll do ya."
Does My Outsourcing Project Fit with the EMS Provider's Strategy?
Once a decision has been made to outsource your electronics manufacturing, the next step is to find a suitable partner. This article highlights some of the questions, checks and balances a good EMS company will carry out before deciding to quote or partner with an OEM. Hopefully, by providing this insight, you will be better placed to find the right supplier for your outsourcing project.
RTW NEPCON South China: Rehm on Machine Communications and Vacuum Technology in Reflow
Ralf Wagenfuehr of Rehm Thermal Systems speaks about the need for a common communications platform as the industry moves toward Industry 4.0. He also talks about how their new ViCON software can help manufacturers achieve the smart factory vision.
RTW NEPCON South China: Vermes Discusses Piezo Technology in Microdispensing
During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Microdispensing GmbH, discusses their latest innovations in microdispensing, and how their piezo technology is addressing the trend towards miniaturization in PCB assemblies.
A Look Into PCBA Rework and Repair
Despite the many technology advances in the SMT process, there will always be a need for rework and repair of PCB assemblies. Most especially as the industry trend continues towards finer pitch and spacing, smaller and smaller components, and increasing high-reliability requirements from customers.
RTW NEPCON South China: JBC Brings Digital Transformation to Hand Soldering Process
Enrique Moreno, technical support engineer at JBC Soldering SL, and I-Connect007 Managing Editor Stephen Las Marias discuss the latest developments in the hand soldering process, including robotics and automation. Moreno also talks about the opportunities in China, and why their Industry 4.0-enabled solutions are suitable for this market.
Should You Entrust Your EMS Provider With Your Supply Chain?
Managing your supply chain can be time consuming and expensive and, more importantly, it can distract you away from other key activities such as sales, marketing and product design. As an OEM, however, it's unlikely that your supply chain is a 'core' activity, that is, something that adds real value to your customers. So, what are your options?
Improving the Rework Process
An optimized SMT assembly process typically provides a yield of nearly 100%. Technology advancements—from the solder paste printing process, SPI, and parts placement, to reflow and wave soldering and AOI—have pushed the efficiency and accuracy of these steps in the SMT process such that a board assembly should be perfect at the end of the line. Still, EMS providers continually face the need to rework and repair PCBAs even after dialing in the perfect set-up.
The Past and the Future of the European EMS Industry
The EMS industry in Europe is still in a growth stage of its life cycle. This does not mean that there is enough space for everybody. Looking back over the past 10 years, we have seen tremendous changes in the number of companies, counting every separate legal entity.
House of Cards
With challenges like Industry 4.0 turning the manufacturing world upside down, we see solutions that are being quite brutally put together, through acquisition or partnership, which are expected to be perceived as being the solutions of tomorrow.
Cybersecurity: 4 Things OEMs Should Do to Protect Themselves
Manufacturing has been declared one of the top three most targeted industries for cyber attacks. While Industry 4.0 and expansion into cyber-physical systems will have a positive impact on the industry in terms of increasing efficiency, they open the door to even more security risks such as a hacker taking over production, or changing the output of the manufacturing process.
RTW NEPCON South China: Keith Bryant Discusses New Role and Goals at YXLON
Keith Bryant, the newly appointed Global Director of Electronics Sales at YXLON International, talks about his new role and goals at the company.
RTW NEPCON South China: KYZEN on Optimizing the Cleaning Process
At the NEPCON South China event happening this week in Shenzhen, China, Thomas Forsythe, executive vice president at KYZEN Corp., discusses the current cleaning challenges in the PCB assembly industry, and how manufacturers can optimize their cleaning process.
NEPCON South China 2017 Opens Today
NEPCON South China 2017, being held in conjunction with the Shenzhen Circuit Sourcing 2017 and Automotive World China, opens its doors today at the Shenzhen Convention and Exhibition Center to showcase nearly 600 companies catering to the electronics manufacturing industry. This year’s event, the largest ever in the show's 30-year history, features 45,000 square meters of exhibition space.
It was Acceptable in the Noughties
In many software products for manufacturing, the common approach previously was to show as many as possible, if not all, of the various data elements about products, machines and processes to engineers, who liked to feel totally in control of what they were doing. The need, however, to manage complex databases, to have detailed views of values and attributes of anything in the digital domain, rapidly became a major distraction to people performing their designated roles.
On the Smart Move: Industry 4.0 in Electronics Production
The industrial world is in motion, as we face a revolution in terms of processes, organizational structures, hardware and software in our companies. Many critics complain that terms like Industry 4.0 and smart factory are rather arbitrary and lack concrete meaning. That is correct. What is also true, however, is that technical progress always starts out with a vision, which is then put into concrete terms as time moves on.
Your 6-Point Guide to Finding the Right EMS Provider
If you have already outsourced part or all of your electronics manufacturing operation, then you'll already have a good understanding of what's expected. But, if you're looking to move EMS providers, then chances are something didn't go according to plan the first time. To avoid making the same mistake twice, or if you are considering outsourcing for the very first time, here are six points we recommend you consider to help find the right assembly partner for you.
Sourcing PCBA: Can Your EMS Supplier Do More?
You're in the market for some PCB assemblies for your new product and you need to find the right supplier. You've looked online, gotten recommendations from friends, and the choices are dizzying. Should you look domestically or overseas? What do you do now? Sourcing PCBA doesn't have to be difficult, but there are questions you need to answer.
The Ever Greener Grass
What we think we know is a less dynamic concept than actual reality. So many things progress so quickly, that we either as individuals or organizations, simply cannot keep up any longer. How then do we know whether the grass is really greener on the other side if we are not able to see clearly what is happening?
Empowering the Workforce Through Training: An Investment Return
Electronics manufacturers should take training seriously at all levels. To remain viable and competitive, it’s vital that they keep up with the latest technologies and practices in the electronics field. Perhaps more importantly, investment in employees keeps them engaged and excited in the performance of their daily work. Learning new methods and being exposed to new ideas is pivotal to personal growth.
What to Expect During the First Months of Trading with an EMS Provider
The start of an outsourcing partnership is an exciting time for an OEM, but it's also one that can be daunting. However much you've prepared for that big moment when you hand over responsibility for part or all of your manufacturing operation to your chosen EMS provider, it's still normal to question if you are making the right decision. This article explores five key areas that you and your chosen EMS partner should focus on during the initial months.
The EMS Skills Gap Epidemic
The manufacturing skills gap is real. Interviews with EMS industry executives across the country are united in their top concern for their businesses: finding new talent. Manufacturers can no longer afford to wait. It is time to educate and train the next generation of manufacturing.
6 Tips to Secure New Talent in Electronics Manufacturing
Closing the skills gap in engineering and electronics manufacturing is a topic that comes up for discussion time and time again. And many SMEs and large international companies within the industry have already taken positive steps to meet the demand for attracting and securing highly-skilled new talent.
Training and Education: Key to Improving Electronics Assembly
For this month's issue of SMT Magazine, we spoke with Luis Ramirez and Dan Prina of EMS firm MC Assembly to discuss the challenges of and strategies in improving the PCB assembly process from an EMS provider’s perspective. We also spoke with Manncorp's Tom Beck and Chris Ellis to get their viewpoints on the subject as an equipment provider.
Cleaning that Matters
James Yeoh, executive director of Zestron Precision Cleaning Sdn Bhd, discusses the challenges in the cleaning industry, and strategies that can help manufacturers address those issues. He also covers the need for continuous education when it comes to cleaning, and how automation can ensure the stability of cleaning systems.
Soldering Fumes in Electronics Manufacturing: Damaging Effects and Solutions for Removal
No matter which soldering process you analyze, all of them have one aspect in common: They produce airborne pollutants, which may have a negative impact on employees, plants and products as well. This article discusses the damaging effects of soldering fumes, and solutions for their removal.
Verification of Inspection Results: Local, Central, Global?
With the need for flexibility in production processes amid increasing globalized manufacturing strategies, manufacturers should consider powerful inspection tools that not only provide central verification of numerous lines in local and overseas production sites, but also with a comprehensive presentation of inspection results.
QFN Center Pads on PCBs
Not all QFNs come with an exposed metal pad underneath, but most do, and that can still cause problems with reflow solder. The pad itself isn't the problem, but improper solder paste stencil layer design can be.
Process Step Elimination: Driven by Cost and Efficiency, Enabled by Process and Materials Innovation
Electronics manufacturing has evolved from the early days of hand soldering and wave soldering to the more modern SMT process. But while most modern electronics are produced using the SMT process, there are still some mixed technology applications that need both the SMT process and the wave soldering process. This article looks into the pin-in-paste (PiP) process, which enables the soldering of through-hole components during SMT processing, and eliminates the need for the wave process.
How Much of My Electronics Manufacturing Should I Outsource?
Once you have decided to outsource to an EMS partner, you need to think about how much of your existing operation you plan to relinquish. This article looks at four distinct areas OEMs outsource—procurement, assembly, test and logistics—explores the benefits associated with relinquishing each of these, and highlights a number of questions that must be considered before any final decision is made.
The Need for Assembly Training and Education
While investing in the latest technologies and having a systems-based approach in your assembly processes are important, the key factors that will make you successful in your continuous improvement goal are the skills, training, and education of your workforce. However you look at it, the human factor remains a critical issue when it comes to your overall efficiency.
X-Ray Inspection of Lead and Lead-Free Solder Joints
As aerospace companies consider the shift to lead-free solder alloys and glues, concerns have been raised about whether their current X-ray inspection and quality-control procedures will still be valid. With lead solder, joints are easily interpreted by the operator or the system imaging software because lead provides excellent image contrasts due to relatively high X-ray absorption compared to that of PCB and component materials. Will this hold true as they shift to lead-free solder compounds?
Pillarhouse International's Allan Jiang Discusses Selective Soldering Developments
At the recent NEPCON China event in Shanghai, Allan Jiang, sales manager at Pillarhouse International, discusses with I-Connect007 Managing Editor Stephen Las Marias some of the challenges in selective soldering, and technology developments to address these issues.
4 Ways Your EMS Partner Can Respond to Supply Chain Disruption
When disruptions to the electronic component supply chain occur, they are painful. Lead-times can extend overnight, prices can treble, and in some cases, parts are placed on allocation or discontinued altogether. These concerns amplify the need for EMS firms to have practices in place for dealing with supply chain disruption. This article discusses four ways your EMS partner can mitigate risks to your supply chain.
Counterfeit Electronic Components Identification: A Case Study
Counterfeit electronic components are finding their way into today's defense electronics. The problem gets even more complex when procuring diminishing manufacturing source parts. This article provides a brief introduction to counterfeit prevention and detection standards, particularly as they relate to the aerospace and defense sector.
Perspectives from a First-Timer
Brad Heath, president and CEO of EMS company VirTex, is a first-time attendee of IMPACT Washington D.C. In an interview with I-Connect007 Managing Editor Patty Goldman, he talks about his impressions of the recent IMPACT Washington D.C. event, and how he thinks the industry benefits from such meetings with the policy makers in the government.
STI Electronics' Dave Raby Shares His Insights on IMPACT Washington DC 2017
During the recent IMPACT Washington D.C. 2017 event, I-Connect007 Managing Editor Patty Goldman caught up with Dave Raby, president and CEO of EMS firm STI Electronics, to discuss about the event and their meetings with representatives of the government that came over to hear what the collective electronics manufacturing industry has to say.
The Role of Industry Associations in Training and Education
Industry associations, such as the IPC and the SMTA, help advance the electronics manufacturing industry through standardization, training, education, advocacy, and interaction through trade events, exhibitions and symposiums. They help members to become aware of the latest technology developments happening in their industry verticals, and of the market trends shaping the direction of the industry.
Using Lead-Free BGAs in a Tin/Lead Soldering Process
Several electronic market segments, such as those electronics used in harsh environments or that have life/system critical functionality, remain exempt from lead-free material restrictions such as the RoHS legislation. While these market segments can use solder containing lead, it is increasingly difficult to procure advanced components in non-ROHS compliant configurations. This article discusses several aspects of having lead-free BGA components in a tin/lead soldering process.
Thermal Indicator Technology for Aerospace Wire Harness Assemblies
Thermal indicator technology was developed into solder sleeves many years ago and has proven to be an effective means of providing visual indication of a reliable solder joint. This article talks about the two types of thermal indicators used in aerospace applications today, and the many benefits that this type of technology.
Mil/Aero Assembly Success
Davina McDonnell, director of marketing at Michigan-based EMS firm Saline Lectronics, discusses the latest technology and business trends driving the military and aerospace industries, the challenges in these markets—including supply chain issues such as obsolete parts and counterfeit components—and their strategies to stay ahead of the competition.
Field Failure is Not an Option
Audra Gavelis of IEC Electronics Corp. discusses the current challenges in electronics assembly for the military and aerospace markets and the new requirements they are getting from their customers. She also talks about strategies in dealing with component obsolescence and lifecycle issues, and new compliance issues that contract manufacturers are facing.
Four Ways to Buy Electronic Components and the Pros and Cons of Each
When you buy electronic components, there are a number of different supplier types available to you or your EMS partner. From dealing direct with an electronic manufacturer through to using brokers, there are benefits and pitfalls associated with each.
An Alternative Approach to Vertical Integration in Manufacturing
The days of OEMs owning large vertically integrated manufacturing assets are gone and will probably never return. Oddly, the large vertically integrated manufacturing capability of the OEMs started to be dismantled by the emergence of the EMS companies. Now, some of these same EMS companies are adopting the same, vertically integrated solutions themselves.
The Importance of Training for your Organization
In our recent survey on assembly training and education, another question we asked is about the importance of training to your organization. Around 85% of our respondents consider training really important to their workforce. In fact, the majority of respondents—47%—say it is very important.
Using Paste Flux for Rework
When using a hot air or IR rework system where the reflow cycle is mimicking the original SMT reflow profile, and when using flux for re-attachment, paste flux otherwise known as gel or tacky flux is the correct type of flux to use. Due to its high viscosity and tack properties, paste flux prevents components from being moved during hot-air reflow while being able to remain active for the complete time-temperature period.
Does Your EMS Provider Have an Industry 4.0 Roadmap?
At its simplest level, the Fourth Industrial Revolution or Industry 4.0, is about automation and connectivity. This should lead to faster, more efficient manufacturing--and therefore advantageous pricing. Additionally, it might also mean that products can be made in a different way. For example, new processes might allow late customization or configuration, faster delivery, or enhanced quality.
The Importance of Supplier Training
The human factor remains a critical issue when it comes to the overall efficiency of your PCB assembly lines. But how do you make sure your operators, engineers and supervisors have the proper knowledge and skill sets to perform at their peak levels, day in and day out?
Today’s Mil/Aero Enemies: Counterfeits, Obsolescence and Failure
The need for high-reliability electronics, components and assemblies that can perform in harsh operating conditions involving extreme temperatures, vibration, and moisture continue to challenge electronics assembly providers catering to the military and aerospace markets. These are on top of current manufacturing issues such as the miniaturization of products, shrinking component sizes, higher density board assemblies, and the obsolescence of electronic components.
Is Configure to Order Manufacturing the Right Strategy for Me?
This article looks at what the term Configure to Order (CTO) means, the importance of supply chain management, where responsibilities lie when setting up new agreements with an EMS provider, and some of the benefits OEMs can expect to see when adopting a CTO strategy.
The Importance of Conformal Coating, Now and in the Future
At the SMTA Michigan Expo and Tech Forum, held in Grand Rapids on May 11, Technical Editor Happy Holden spent a few minutes with AIM Solder’s Technical Marketing Manager Tim O’Neill to discuss O’Neill’s presentation on the topic of conformal coating over no-clean fluxes.
EMS Firm Tsukiden Electronics Seeing More Business in Prototypes
At the recent Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) held in Manila, Karen Flordiles, marketing supervisor at EMS firm Tsukiden Electronics Philippines Inc., talks about their customers' changing requirements and their manufacturing challenges. She also discussed new opportunities they are seeing in the EMS sector.
Technology Enabler Highlights Benefits of Having Design Services for an EMS Firm
At the 14th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) held last week in Manila, Robin Ramiso, design and development manager at Technology Enabler, discusses their activities, and the benefits of having a design services team for an EMS company with I-Connect007 Managing Editor Stephen Las Marias.
A New Player in the Philippine EMS Industry
There's a new EMS player in town. Come August 2017, Artem Global, a startup EMS firm in the Philippines, will start manufacturing operations, with services ranging from PCB assembly to box build, and even turnkey services. I-Connect007 Managing Editor Stephen Las Marias caught up with Artem Managing Director Art Ledonio at last week's PSECE event in Manila.
How Important DFM is for Your Electronics Assembly Partner
Each OEM will have their own set of criteria when it comes to selecting an appropriate EMS provider. But where does design for manufacture (DFM) support come into play? Is it a priority? Should it be? And what benefits does this service have to offer the OEM? This article explores some of the benefits DFM offers OEMs and how this service can help realize elements of an outsourcing strategy.
Assembly Training and Education
Even if your PCB assembly process is optimized, there is always room for improvement. And no matter how successful your company has been in the past, you just can’t rest on your laurels. It is always in your best interest to strive towards a better operations model. We've created a survey to help us gauge the importance of training and education in your workforce, and the benefits that you get in ensuring that your operators and engineers have the most current knowledge and skill sets.
Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating – Influence of Electroless Pd Plating Film Thickness
This paper investigated the influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability. It was found out that the shape and thickness of the intermetallic compounds (IMCs) are among the key factors that affect solder joint reliability after multiple reflow cycles and thermal aging, respectively.
High-Volume Test Strategies
In an interview with I-Connect007 during the recent NEPCON China event in Shanghai, Siegmund Hornig, director of global sales for Europe and Asia, for production board test division at Teradyne discusses the new testing demands from customers, and strategies to help them address their high-volume test requirements.
Koh Young Discusses Latest 3D AOI Innovations
Koh Young Technology's Scott Kim, overseas sales team manager, talks about the latest challenges and developments happening in inspection technologies, the new demands and requirements from customers, as well as the key factors to consider when it comes to buying inspection systems.
How to Make a Bad First Impression with an EMS Provider
Like any relationship, starting off on the wrong foot when finding an EMS provider can quickly trip you up and become painful in the long term. Regardless of the 'why', here are some good examples of what not to do when first approaching a potential EMS provider. This way, you can make sure that you don't end up wasting valuable time and effort finding the wrong EMS provider for your business.
AOI Capabilities Study with 03015 Components
More EMS companies are implementing AOI into their SMT lines to minimize repair costs and maintain good process and product quality, especially for new component types. This project focuses on the testing of 03015 components, which is challenging for AOI.
3D Inspection is the Way to Go
In an interview with SMT Magazine during NEPCON China, Guido Bornemann, head of sales in Asia for Viscom, discusses how inspection technology is keeping up with the latest requirements and demands from customers. He also explains why 3D technology is the best inspection technology to utilize in electronics assembly.
Saki Discusses Industry 4.0 and True 3D Technology
Quintin Armstrong, general manager for North America Sales and Service at Saki America, speaks to SMT Magazine about the Industry 4.0 strategy for inspection equipment providers. He also talks about why manufacturers are finding it more and more relevant to have an inspection line in their assembly lines now.
Why You Should Have Formal Business Reviews with Your EMS Provider
Your working relationship with your EMS provider is fundamentally a partnership. Therefore, it's important to ensure that you carve out time to meet with your EMS provider on a frequent basis – even if you are feeling particularly pleased about having handed over responsibility to them.
3D: Towards Better Inspection Capability
For this month's issue of SMT Magazine, we spoke with Mark McMeen, vice president of engineering at STI Electronics, to know more about the inspection challenges and requirements from an EMS provider's standpoint. We also talked with Jean-Marc Peallat, vice president of global sales at Vi TECHNOLOGY, to find out, from a supplier's perspective, how they are looking at these challenges and addressing them through their product development efforts.
2D X-ray Inspection With Materials and Thickness Identification
The need to inspect electronic components and assemblies non-destructively is the main driver behind the development of X-ray inspection technology. In many cases, X-ray inspection provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through-holes, TSVs, microbumps, and copper pillars.
The Need for 3D AOI
While the coplanarity of height-sensitive devices such as BGA packages and leaded components can be inspected in 2D using multi-angled colored lighting and side-angle cameras, these will be susceptible to an increase in false calls, a need for additional programming and cycle time, and possible escapes. These factors underscore the need for 3D technology in inspection strategies.
Will You Be RoHS 2-Compliant by 22 July 2017?
The year 2011 saw the legal initiation of the RoHS 2 recast and an update of the RoHS Directive 2011/65/EU, subsequently transpiring into UK law. The initiative granted transition periods of varying time scales to different categories of electrical and electronic equipment products. Now, 2017 sees the end of the transition period for EEE products that fall into one of the subsections of category nine – industrial monitoring and control instruments.
Shenzhen Axxon Discusses Acquisition and Dispensing Market Trends
Ivan Li, general manager at Shenzhen Axxon Automation Co. Ltd (China), discusses their recent acquisition by Mycronic, as well as the latest developments in the dispensing market. Also discussed is the China market, and how the company is staying ahead of the increasing competition in the dispensing industry.
RTW NEPCON CHINA: Teknek Discusses Contact Cleaning Technology Trends
Stephen Mitchell, managing director of Teknek, a contact cleaning solutions provider, discusses the latest trends in contact cleaning technology. He provides his outlook on China’s electronics manufacturing industry and intelligent manufacturing, and talks about how Teknek's contact cleaning systems are helping customers address their defects and productivity issues.
RTW NEPCON CHINA: Interflux to Revolutionize Solder Industry
At the recent NEPCON China event in Shanghai, Daniel Werkhoven, CEO of Belgium-based soldering chemistry provider Interflux Electronics N.V., talks with I-Connect007 Managing Editor Stephen Las Marias about how their new bismuth-based solder alloy will help improve the soldering process.
Tape and Reel Solder Preforms: A Success Story for the UD00 X86 SECO Board
SECO's latest product innovation, UDOO X86, is a real computer with an integrated Arduino 101 compatible board that is capable of running games and videos in 4K. But while the success of the UDOO X86 is impressive, so is SECO's ability to develop this game-changing product with low-cost technology for mass appeal and affordability.
Vapor Degreasing Chemistries to Remove Difficult Lead-Free and No-Clean Fluxes from PCBs
In line with increasing regulations on electronics manufacturing, many changes have been made to the electronics world, and thus the circuit board manufacturing process. Lead-free, no-clean and halide-free flux formulations have introduced new cleaning obstacles, especially on ever-shrinking component sizes. To maintain high cleanliness standards for modern circuitry, new sophisticated cleaning chemistries are required.
The Benefits of Postponement Manufacturing When Outsourcing
With the world changing at an incredible pace, OEMs agile enough to respond rapidly to customer demand stand a greater chance of survival compared to those that are not. This article looks into the late stage configuration technique and some of the benefits an OEM can expect to gain when outsourcing to an EMS provider that offers this service.
RTW NEPCON CHINA: Mycronic Meets High-volume Demand with Solder Jet Printing
Mycronic VP for Global Dispensing and Managing Director Clemens Jargon discusses how the flexibility of solder jet printing helps reduce downtime in the line, thus increasing total line speed and enabling it to keep up with high-volume demand.
Business and Technical Developments at Super Dry Totech
At the recent SMT Hybrid Packaging show in Nuremberg, Germany, I-Connect007 Technical Editor Pete Starkey visits Super Dry Totech and spends a few minutes with CEO Jos Brehler and Sales Manager Terry Morgan to talk about the rationale behind ASYS Group's acquisition of stake in Super Dry Totech, as well as the latest technology developments happening at the company.
RTW NEPCON China: Data I/O on Securing the Supply Chain
At the recent NEPCON China show in Shanghai, Anthony Ambrose, president and CEO of Data I/O Corp., discusses the cybersecurity challenges facing the electronics manufacturing industry today amid the proliferation of connected devices and the Internet of Things.
Grow Your Own Training Programs
Negative connotations about manufacturing jobs as dirty, repetitive, and boring have plagued the industry for the last 20 years. Manufacturing lacks the sex appeal that jobs in tech use to entice potential employees. Due to the great shortage of skilled workers and the lackluster image of the industry, manufacturing companies have had to re-evaluate and re-design their HR strategies to recruit, hire and train new employees.
The Role of an Account Manager Within an EMS Provider
How do you start to compare EMS providers when it comes to their account management team? Does it really matter what role they play? And how crucial do you believe they are in helping you achieve your outsourcing objectives? This article looks in-depth at some of the common activities an account manager typically carries out on your behalf when you decide to partner with an EMS provider.
Zestron Technical Workshop Tackles Next Generation of Cleaning
Zestron recently held a technical workshop in Alabang, Muntinlupa City in the Philippines to help users address their cleaning challenges amid advancements in semiconductor device packaging.
Mentor Graphics: Connecting the Manufacturing Environment
Oren Manor serves as the director of business development for Mentor Graphics Valor Division. In this interview with SMT Magazine, Manor discusses the latest updates in their OML community, their case study regarding Phoenix Contact’s implementation of their IoT solution in its facilities, and what’s new in ODB++.
Why You Shouldn't Hide Your Supply Chain Issues
From a natural or man-made disaster that is completely out of your control to a breakdown in communication, there are many reasons why an OEM might find themselves faced with a problem in their supply chain. Whatever the reason for the disruption, one thing is certain: if you are planning to work with, or are already working with, an EMS provider, you shouldn't hide your supply chain issues.
Voiding Control at High-Power Die-Attach Preform Soldering
Voiding in the solder joint is a concern for high-reliability and high-performance devices. This paper discusses a study on voiding behavior of large pad high-power devices simulated with Cu coupon to Cu coupon sandwiches. A flux-coated preform was studied in this assembly, with variation in solder alloy type, quantity of solid flux coated on solder preform, Cu coupon pre-oxidation extent, reflow temperature, and pressure exerted onto the sandwich during reflow.
Enhancing Recruitment Efforts with Public-Private Partnerships
After nearly two decades of the dominance of the service economy, manufacturers in all industries have a challenge: recruiting and training the next generation of manufacturing employees. This article details how one EMS company has been addressing that challenge through collaborative efforts with educational institutions, other businesses and regional support networks.
SMTA West Penn Expo: Who Says There’s No Such Thing as a Free Lunch!
Bill Capen of DRS Technologies, the president of the SMTA West Pennsylvania Chapter, speaks with I-Connect007's Patty Goldman about the recent West Penn Expo & Tech Forum. He also talks about the group's upcoming chapter meetings this year, and the latest developments happening in the military segment.
The Benefits of Applying Flux Directly to a Micro BGA
Technology trends continue to drive miniaturization in electronic components. As a result, product designers are often forced into specifying smaller and smaller devices on their bill of materials. Sometimes, miniature devices offer OEMs cost savings, which is seen as a good thing; other times, there is simply no choice.
Manufacturing Through the Eyes of Human Resources, Recruitment and New Hire Training
Perhaps more important than the technology and tools a manufacturing company has are its people. People are what make a company truly great and the process of recruiting talented, skilled, dedicated employees and training them properly for success is an important aspect of any manufacturing company.
Keeping an Eye on the Next Generation
Why should a company in our industry dedicate hours to providing professional development to a group of temporary student interns? Why should they open their doors to kids, some of whom haven’t even entered high school? For Indium, the short answer is, it makes them better. Read on to find out why.
IMPACT 2017: Electronics Industry Leaders Meet with Members of Congress and Trump Administration on Capitol Hill
IPC places a high priority on making our presence known in the halls of government to educate our government officials on the policies that will strengthen the advanced manufacturing industry.
Blackfox Program Trains Vets for Manufacturing Jobs
It's harder than ever for managers in the PCB manufacturing industry to find qualified staff, with some reporting that positions are remaining open for months at a time. On the other hand, there are thousands of soldiers, sailors, airmen and marines transitioning out of the service each year and seeking good jobs. In this interview, Allen Dill, president of Blackfox, discusses their program that offers manufacturing training to veterans, even while they are still in the military.
The Challenge of Filling PCB Assembly Positions
U.S. manufacturers are having a difficult time filling open positions. They cannot find workers with the necessary skills to fill the openings. If we look specifically at the PCB assembly industry, the rhetoric is similar. There are more openings than people to fill them. The discussions reveal that lower wages, lack of skills, and sometimes the reported low unemployment rate in the United States is part of the problem.
Predicting Solder Paste Transfer Efficiency and Print Volume
Being able to predict the transfer efficiency and print volume reproducibility of solder paste are valuable data points for any circuit assembly process. Knowing how many good boards that can be expected from a jar of solder paste is critical for a contract manufacturer working on paper thin margins.
The Complex World of Soldering
Industry veteran Happy Holden and Saline Lectronics Senior Process Engineer Cathy Cox discuss the various challenges and issues that users face in soldering, including the lack of a "one-size-fits-all" approach in the process, and some key factors that the PCB assembly industry should consider when it comes to different applications and markets.
RTW NEPCON China: Viscom Talks 3D AOI Developments
Guido Bornemann, head of sales for Asia at Viscom, speaks with I-Connect007 Editor Stephen Las Marias about inspection challenges such as false calls and improving first pass yields. He also talks about the latest developments in 3D AOI to address these issues as well as test strategies to achieve zero defects.
RTW NEPCON China: Metcal Highlights Innovation in Hand Soldering Technology
At NEPCON China, Bryan Gass, vice president of Metcal, discusses how their Connection Validation soldering station will revolutionize the hand soldering technology industry.
Virtex on Military and Aerospace Requirements
Brad Heath, VirTex CEO, and Upinder Singh, Vice President and General Manager at VirTex MTI, discuss their company's military and aerospace business, and how they are addressing the latest demands and requirements from their customers.
What a Tangled (Soldering) Web We Weave!
Soldering remains one of the most critical processes in the PCB assembly industry. Which is why it is of the utmost importance that the soldering process should be perfect. But soldering is just too complex a process, and further complicating the situation, the requirements and technologies vary between our industry’s market segments. There are just a lot of factors to consider before you put your boards into the reflow and let them run.
Your In-depth Guide to Reducing Electronics Manufacturing Waste
Waste is a common problem within the electronics manufacturing industry. Whether large volumes of faulty smartphones need recalling or small batches of complex PCB assemblies need reworking, waste can be time consuming and costly to rectify. This article discusses principles such as DMAIC, Six Sigma and Lean manufacturing to help you implement strategies to minimize your waste output.
Achieving Successful Flex Circuit Assemblies
In this article, Yousef Heidari, vice president of engineering at EMS firm SigmaTron International, talks about the varying challenges in flex-circuit assembly. Chief among these are the solder paste printing process, especially for designs that have multiple areas with fine-pitch components, as well as the subsequent handling of the assembly before final product integration.
The Building Blocks of Industry 4.0
At the recent IPC APEX EXPO, Kevin Decker-Weiss, director of sales at CircuitByte, joins panellist from Mentor Graphics and EMS firm Saline Lectronics in a roundtable on the building blocks of Industry 4.0 hosted by Scoop. Here is his take on that panel and the show.
JJS Stresses Need for Baking Prior to Flex Circuit Assembly
From an assembly perspective, baking the flex circuits prior to manufacturing assembly is crucial as they can be susceptible to delamination. In this interview, Russell Poppe, director of technology at JJS Manufacturing explains why, as well as discusses other challenges in flex circuit assembly and strategies to address them.
RTW IPC APEX EXPO: Metcal Brings Disruptive Technology in Hand Soldering
Christopher Larocca, president and CEO of OK International (of which Metcal is a division), tells I-Connect007 Publisher Barry Matties their strategy for improving the hand solder process. He describes a lack of process feedback to the operator as a core problem inherent in the hand soldering process, and discusses how OK International has developed an innovative solution to address the issue.
Fixturing: Key to Accurate Flex Circuit Assembly
Adrian Nishimoto, operation manager at Spectrum Assembly Inc., talks about the critical factors to consider during flex circuit assembly, such as fixturing and accurate thermal profiling. He also mentions why jet printers are suitable for use in assembling flex circuits.
Rework and Repair on Flex Circuits
With this surge in usage of flex, the standards for rework—replacing devices while still meeting the initial specification and functionality—and repair—repairing the physical damage on a flex circuit—of flex circuits has not kept pace.
Strategies for Addressing Flex Circuit Assembly Pain Points
In an interview with SMT Magazine, Steve Fraser, VP of Operations at Firstronic, discusses the key factors that have the greatest impact on the quality of flex circuit assemblies, the challenges they face during assembly, and their strategies to ensure the reliability of the products.
How to Solder SMT Components with Varying Solder Paste Heights
While miniaturized components offer product designers some benefits, such as energy efficiency and the ability to build in greater functionality, mixing "old and new" technology together on the same PCB design can add complexity at the build stage. As a result, it is sometimes necessary to change the way solder paste is applied to the PCB during production.
Supportive Tooling: The Magic Ingredient for Flex Circuit Assembly
Flex circuits have changed the way product development engineers can design and package their electronic products. Flex applications have opened the doors for PCBAs to move out of square, box enclosures and fit into small, tight, even oddly shaped three-dimensional spaces that can withstand harsh vibration and multiple flex uses. While these flex assemblies may perform in the same way a traditional rigid PCBA does, they have their own set of assembly rules and manufacturing nuances.
Dry Storage Cabinets' Role in Industry 4.0
At IPC APEX EXPO 2017, Rich Heimsch, Super Dry’s Director of the Americas, discusses the electronics manufacturing industry’s different versions of Industry 4.0, and his company's strategies in dealing with all of them. He also talks about Super Dry's latest storage developments.
Miniature Components on PCBs Requires Flexible Cleaning Methods
Smaller, more densely populated circuit boards make the issue of managing faults, quality and product longevity highly challenging. This is why so many companies consider their PCB cleaning as a mission-critical process. If the cleaning is not effective the device simply will not function reliably for the required life of the product.
Navigating the Complex World of Flex Circuit Assembly
We recently conducted a survey on flexible printed circuits to know more about the challenges that designers, fabricators, and assemblers face when dealing with flex circuits. We asked what steps in their processes have the biggest effect on yields; the challenge they face when dealing with flex circuit materials; as well as the factors that have the greatest impact on the quality of their flex circuit design, fabrication and assembly.
Assembly of Flexible Circuits
No matter the method, the assembly of electronic flexible circuits is tedious because of its inherent flexible nature. Therefore, we must give extra attention to the assembly process. This article details some of the key considerations when assembling flexible circuits.
What are the Most Important Principles of Lean Manufacturing?
Lean manufacturing is nothing new, but it remains an important philosophy for manufacturers seeking to grow and effectively contend in a competitive, global environment. Essentially, it provides you with the tools to successfully identify and eliminate waste within your operation.
Alpha Papers Investigate High-Reliability Solder Alloys
During SMTA International, Morgana Ribas, manager of Metals Technology Group at Alpha Assembly Solutions, presented a pair of papers that focus on the company’s reliability testing of solder alloys. I-Connect007 Managing Editor Andy Shaughnessy sat down with Morgana to discuss these papers, and some of the surprising results that the testing yielded.
Evaluating a PCB Assembler
When it comes to technology and quality, an SMT assembler's capabilities will be reflected when you go through the key elements in the SMT process. This article provides key points to consider in evaluating a PCB assembler, which allows you to test whether your circuit boards assembled in that factory conform to your required standard.
Electrolube Talks Technologies Targeted at Automotive and LED Applications
Electrolube's Phil Kinner, global head for the conformal coatings business, talks about the trends shaping the company’s product innovation strategies, and their latest solutions and technologies to help address their customers’ greatest challenges.
Should You Use Your CEM Partner's Direct Ship Fulfillment Services?
Gone are the days when OEMs simply outsourced their printed circuit board assemblies to contract electronic manufacturers (CEMs). Today, many CEMs offer a much broader range of services, including an end-to-end outsourcing solution – the end point of which is direct ship fulfillment, whereby the CEM sends fully manufactured and tested products directly to the end customer.
Alpha on New Technologies to Tackle Voiding
Tom Hunsinger, vice president of marketing at Alpha Assembly Solutions, discusses with SMT Magazine how their company is addressing voiding—one of the greatest challenges in soldering. He talks about the latest market development trends that are shaping product innovation strategies at Alpha. Hunsinger also details some of their latest solder technologies, and how they are helping their customers address their soldering challenges.
Successful, Long-Term Growth at Prime Technological Services
Publisher Barry Matties sat down with Prime Technological Services CEO Greg Chesnutt at IPC APEX EXPO, to glean how they continue to find success and have been able to maintain such an impressive growth rate over the last four years.
Goepel electronic Talks Test and Inspection Innovations
Thomas Wenzel, managing director of the Embedded JTAG Solutions Business Development at Goepel electronic, discusses the latest technology innovations happening in the test and inspection segment, and the market trends shaping them.
RTW IPC APEX EXPO: Ray Prasad Discusses Revised IPC-7530 Reflow Profile Guidelines
IPC Hall of Famer Ray Prasad, chairman of the IPC-7530 committee, provides an overview of the newly revised IPC-7530, which provides users with guidelines on how to successfully profile and characterize PCB assemblies with high levels of efficiency.
Conflict Minerals – A Mixed Message?
While the EU is taking a more considered but arguably progressive approach towards banning conflict minerals, the US, in contrast, looks to be heading towards a relaxation or even abandonment of its rules.
SMT Xtra Discusses Expansion Plans in the US
At the IPC APEX EXPO 2017 event in San Diego, SMT Xtra's Alexandra Stovin, marketing and public relations manager, and Paul Pittman, sales manager for the United States and Canada, speaks with I-Connect007 Technical Editor Pete Starkey about their company’s expansion plans in the U.S. and the benefits they offer their customers.
RTW IPC APEX EXPO: Alpha Highlights Technologies Dedicated to Eliminating Solder Voids
Robert Wallace, marketing manager for the Americas at Alpha Assembly Solutions, discusses their new product introductions for this year and their level of customer support as these products are rolled out. He also talks about how these technologies are helping address the issue on solder voiding.
How Servitisation Can Enable Manufacturing Sales Growth
OEMs and EMS providers must implement strategies that enable sales growth – and one such strategy is servitisation, which is about putting the needs of your customers first.
RTW IPC APEX EXPO: Nordson Highlights Improvements in Dispensing and Conformal Coating Systems
Roberta J. Foster-Smith, global marketing communications manager for Nordson ASYMTEK, discusses the continued improvements in Nordson's dispensing and conformal coating equipment, especially when it comes to automation, precision and consistency in delivering ever-finer deposits to meet industry demands and customer needs.
RTW IPC APEX EXPO: Indium Discusses Industry Trends and Reliability Issues
Indium Corp. Product Manager Chris Nash talks with I-Connect007 Technical Editor Pete Starkey about how they are helping customers address their reliability issues, and discusses the success of their "Avoid the Void" campaign.
RTW IPC APEX EXPO: KIC on Smart Factory Technology Approach in Thermal Ovens
Bjorn Dahle, president of KIC Thermal, discusses with I-Connect007 Guest Editor Dick Crowe their approach to measuring temperatures in thermal ovens and networking the information to a main frame, to enable the process engineer to statistically monitor a specific process.
RTW IPC APEX EXPO: Alpha Highlights Solder Reclaim Technology
Mitch Holtzer, director of Americas Reclaim Business for Alpha Assembly Solutions, discusses the company’s reclamation technology, which takes solder dross, used solder paste, and solder paste debris and converts it into reusable soldering materials. He also talks about how solder reclamation can help sustainability efforts, and how it helps customers when it comes to their waste materials.
RTW IPC APEX EXPO: Manncorp on Having a Solutions-centric Approach
Manncorp father-son team Henry Mann and Kyle Mann talk with I-Connect007 Guest Editor Kelly Dack about providing excellent guidance, service, training and support for companies who may be unsure of the best route to take in selecting the right SMT equipment.
How Can I Compare EMS Providers and Create My Shortlist?
Finding the right EMS provider for your business can be a challenge. And trying to compare EMS suppliers and create a shortlist is hard work. Unfortunately, there is no ultimate cheat sheet to help you find the perfect partner. But here's 15 or so questions that you may ask, in order to start collating meaningful data to be able to starting making informed comparisons between EMS providers you are considering partnering with.
RTW IPC APEX EXPO: Mentor Graphics Finishes Traceability Standard in Record Time
Michael Ford of Mentor Graphics and Editor Andy Shaughnessy discuss Mentor's work with traceability processes, including the new IPC traceability standard that was finished in record time.
RTW IPC APEX EXPO: Thomas Scales of Saline Lectronics Discusses Internet of Things
Thomas Scales of Saline Lectronics speaks with Guest Editor Dick Crowe about their company's approach to offering networking and process control solutions in the automated factory.
RTW IPC APEX EXPO: Mirtec Discusses Latest Developments in Inspection Technologies
Mirtec President Brian D’Amico talks about the latest in 2D and 3D AOI and SPI, and how to provide smaller users with affordable high-technology systems. He also talks about the sales success of the MV-6 OMNI series in-line full-3D AOI machine, which features advanced features such as 15-megapixel top-down camera and 3D digital multi-frequency Moire.
RTW IPC APEX EXPO: CyberOptics' Subodh Kulkarni Discusses Ultra-High-Resolution AOI
Dr. Subodh Kulkarni discusses the new bleeding-edge AOI technology CyberOptics has developed that will advance vision technology to a level not achievable today. MRS technology combines accuracy with speed, which have been mutually exclusive in the past.
RTW IPC APEX EXPO: 3D AOI Update With MEK
Henk Biemans of MEK Europe discusses with I-Connect007 Editor Andy Shaughnessy their latest developments in 3D AOI, and their efforts to educate their customers about this growing market.
RTW IPC APEX EXPO: Indium’s Eric Slezak Talks Project 99
Indium Corporation's Eric Slezak talks with I-Connect007 Guest Editor Steve Williams about the launch of their new Project 99 wave solder process flux system. Indium has created an exciting new spin on this technology by using a comic book theme, with "villains" representing common wave solder defects and "superheroes" representing their flux solutions to combat the problems.
Industry 4.0: Nine Key Points Electronics Manufacturers Must Not Ignore
The Fourth Industrial Revolution is nothing if not massive and complicated. There is a huge amount of information out there, some useful and some perhaps less so. But, among the hype, there are a few consistent themes that really must not be ignored by manufacturers wishing to remain competitive in the future.
RTW IPC APEX EXPO: Electrolube Discusses New Conformal Coating Technologies
Phil Kinner, technical director of the coatings division at Electrolube, discusses with I-Connect007 Guest Editor Dick Crowe the latest trends happening in the coatings industry, and how their solutions help customers enhance the reliability of their electronics assemblies.
RTW IPC APEX EXPO: Kyzen’s Thomas Forsythe Talks Latest Developments in Aqueous Cleaning
Thomas Forsythe, executive vice president of Kyzen Corp., talks about the advantages of real-time concentration monitoring, data management and access to data as aqueous cleaning moves towards Industry 4.0.
Metcal Brings Big Science and High Reliability to Hand Soldering
Recently, Judy Warner visited the Metcal facility in Southern California and meet with Product Support Engineer Robert Roush. They talked about Metcal's patented hand-soldering technology, which promises to bring a new level of science and control to the world of hand-soldering.
RTW IPC APEX EXPO: Rehm Highlights Reflow Improvements for Reliable Solder Results
Michael Hanke, CCO of Rehm Thermal Systems, highlights the latest developments in their reflow solutions, which are targeted at improving the reliability of the soldering process. He also discusses their complete solution, which is inline with the Industry 4.0 trend.
RealTimewith...IPC: Mycronic Highlights Latest Capabilities of Jet Printing
Nico Coenen, global sales director of jet printing at Mycronic, discusses the latest developments in their jet printing technology. He also highlights how these advances align with their Mycronic 4.0 strategy.
Real Time with...IPC: Cogiscan Discusses Connectivity Solutions to Enable Industry 4.0
Francois Monette, VP Sales and Marketing at Cogiscan Inc., talks about how the industry can meet the challenge of connecting different machines, software and enterprise systems to enable Industry 4.0 for the electronics assembly industry.
Real Time with...IPC: CalcuQuote on Risk Assessment and RFQ Management
Chintan Sutaria, president of CalcuQuote, discusses how their RFQ management system, with its risk assessment feature, helps EMS customers improve their supply chain. He also talks about their new BidCQ solution is improving the bidding process.
Real Time with...IPC: Tim O'Neill Discusses Latest Developments in Lead-Free Soldering Market
With RoHS requirements in full swing, companies must adapt and adapt quickly as lead based soldering will be completely phased out by 2019 in Europe.
Real Time with...IPC: BEST Talks Rework Challenges and Opportunities
Bob Wettermann, president of BEST Inc., talks about the challenges in rework, and how his company is helping their customers address these problems. He also discusses his paper presentation at this week's technical conference.
Real Time with...IPC: Alpha Discusses Improving LED Reliability Issues
At this week's IPC APEX EXPO 2017 in San Diego, California, Steve Godber, LED Commercial Manager at Alpha Assembly Solutions, discusses with I-Connect007's Stephen Las Marias the reliability and voiding challenges in the LED market, and how the company is helping their customers address these issues through their solder technologies.
Bringing SMT Assembly In-House: Case Studies of the Effects on Lead Time, Inventory, Quality, and Overall Cost
A growing number of low- to medium-volume manufacturers of specialized electronic products are reaping the rewards of bringing their SMT assembly in-house. How have some of these companies justified the cost of their endeavors? In this article, three OEM companies share their experiences.
11 Points to Consider When Buying Selective Soldering Equipment
Although there are clear benefits from investing in a selective soldering equipment, there are also a number of considerations to make prior to purchase. This article looks at 11 points that require further thought, to ensure you select the right piece of selective soldering equipment for your products.
Taking the "Process Approach" to RFQs in Electronics Contract Manufacturing
The ISO 9001:2015 standard can be applied to any organization, any management system and any process. While it is generic in its application, the specific implementation can be the difference between lagging and leading results. This article reviews how the process approach applies specifically to the request for quote process in the EMS industry.
Applying the New IPC Standard for Traceability Makes Compliance and Reporting Easier
IPC has created IPC-1782, a new standard and specification for traceability practices across all levels of electronics manufacturing, and specifically for electronics assembly. With this new standard, companies that are practicing basic levels of traceability can evolve to higher levels, and will be able to clearly define the expectations of what is required for compliance and conformance to customer needs.
What’s Driving the Rapidly Changing Electronics Assembly Industry
Since the EMS landscape has become so competitive, staying on top of new advances in technology and being able to rapidly adapt to changing customer needs, market demands, trends and technological advances is critical. This article highlights some examples of how electronics assembly technology developments have impacted the EMS industry in recent years and will likely continue shaping the industry in the future.
Continuous Improvement in Electronics Manufacturing
With so many variables and "opportunities" to create waste, electronics manufacturing services (EMS) companies have an on-going challenge to identify, address and then eliminate inefficient processes. This is where a continuous improvement approach can help.
The Shape of Things to Come
Where is our industry going? The beginning of a new year provides a good opportunity to look into the crystal ball and foretell what we think will be. So what are the general drivers of change in the high tech electronic product assembly business, and what specific new product and process types do we see that are a result of those drivers?
Achieving Repeatable, Consistent Control over the Selective Soldering Production Process
Selective soldering is a process with more than 100 different parameters that may impact soldering performance. A robust selective soldering process should have a wide process window that is able to handle variations in material quality. In this paper, critical process parameters are discussed as well as methods that can be used to widen the process window.
Investing in New Technologies
Electronics manufacturers are beginning to consider investing in new systems to take their processes to the next level. In our recent survey on the topic of new technology, the top reasons cited by manufacturers to invest in new technologies are to increase efficiency, improve yield, reduce cycle time, and the advance capability of the process.
Turning the Relationship Between the Electronic Product Assembly Employer and Recent Graduates Upside Down
The post-secondary educational system must change from being reactive to our industry’s (high tech electronic product assembly business) needs to being proactive. Students that graduate should act as change agents, challenging a company’s status quo by bringing the latest design, production equipment and process techniques to their new employers from their academic experience.
What to Look for When Auditing an Electronics Manufacturing Facility
Although a large amount of research can be carried out online when selecting an EMS partner, the only real way to satisfy an OEM whether an EMS provider will be a good fit or not is to meet the team and audit their processes. This article lists the approach many OEMs take and highlight some of the key questions they ask.
The Impact of Via and Pad Design on QFN Assembly
Thermal via arrays under QFN components are used to conduct heat away from the device. However, thermal vias can create more voids or result in solder protrusion onto the secondary side. This paper discusses a study on the impact of via size and via design on QFN voiding and solder protrusion.
Reflections on 40 Years of Test and Measurement and What Lies Ahead
Dr. James Truchard, President, CEO, and Cofounder of National Instruments, has penned his reflections on the last 40 years driving and leading some of the greatest progress and innovations the test and measurement industry has seen. In the article, he also leaves us with his thoughts on how he envisions the future to be.
The Time Has Come for Jet Printing
At the recent NEPCON South China 2016 trade show in Shenzhen, Thomas Bredin, area sales manager at Mycronic, discusses with I-Connect007's Stephen Las Marias the latest developments in jet printing technology, and their recent acquisition of Shenzhen Axxon Automation.
Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability
Lead free solder joint reliability in drop shock loading has been a recurring issue in mobile and handheld consumer electronics. Changing solder composition may offer an opportunity to improve joint drop reliability. This study focuses on different failure modes in circuit board assemblies as observed based on solder composition, board surface finish, and solder joint volume.
Evaluation of the Use of ENEPIG in Small Solder Joints
When soldering to ENEPIG, all of the palladium is dissolved into the solder joint, and creates a palladium-rich region at the base of the solder joint. The shrinking solder joint sizes due to the ever decreasing size of parts cause the relative size of this palladium-rich microstructure to grow relative to the overall joint thickness. This study evaluates the impact of industry standard Pd thicknesses on thin solder joints through shear testing.
Six Sigma: What is it and How is it Used in Electronics Manufacturing?
Six Sigma is a defined, data-driven methodology aimed at process improvement and consistent output in manufacturing. This article discusses how it is used in electronics manufacturing, and the benefits it offers companies that have implemented it.
A New Organizational Model Using Logic, Cost-Effectiveness and Customer Service, Part 2
In previous articles, Tom Borkes talked extensively about one of the controllable components of labor cost: the counterweight to competing against low labor rates—using automation to reduce labor content. Over the next few months he will drill down into the other controllable component of labor cost: indirect labor.
More Than Just Dry Air: Controlling Oxidation and Intermetallics in Moisture-Sensitive Devices
Our new columnist Richard Heimsch will be focusing on the management of moisture sensitivity in his column “More Than Just Dry Air.” His inaugural article talks about controlling oxidation and intermetallics in moisture-sensitive devices.
Plating and Surface Finish: Assemblers' POV
Joemar Apolinario and Dnichols Dulang of EMS firm Integrated Micro-Electronics Inc. discuss with SMT Magazine the impact of plating and surface finishes on electronics assemblies. They highlight the impact on solderability, the problems with complex components and packages, as well as parameters to consider when it comes to surface finish selection.
How to Choose Your Outsourcing Project Team
When you decide to outsource your manufacturing operation to an EMS provider, you not only have to choose the right partner – you also have to select your in-house outsourcing project team. With so many important decisions to make, it's easy to feel overwhelmed at times. But with the right people in situ, you will be perfectly placed to achieve success. Here's how you should go about assembling your outsourcing project team.
Choosing the Correct Flux—Advantages/Disadvantages
While often overlooked, the flux chosen for the selective soldering process has a great impact on solder joint quality, long term reliability and overall selective soldering performance. This article outlines the critical factors of commonly available selective soldering fluxes and how they impact the soldering quality, reliability and equipment performance.
The Influence of Clean Air on the Value-Added Chain in Electronics Production
A multitude of different processes in modern electronics production—from connection and separation technologies, surface processing such as marking and drilling, the utilisation of fluxes, up to production processes such as soldering, welding and gluing—generate harmful substances that might have extreme health impacts and affect production plants and products.
5 Reasons Why OEMs Outsource to EMS Providers
Why do original equipment manufacturers (OEMs) outsource to electronics manufacturing services (EMS) providers? This article provides five reasons why OEMs venture down an outsourcing path, and the benefits they gain along the way.
Reducing Warpage on BGAs During Rework
This article highlights one of the challenges associated with BGA rework--the effect of device warpage. To address this, Bob Wettermann writes about strategies to reduce device warpage on BGAs to avoid shorts and open circuits post rework.
Editor's Note: Understanding Plating and Surface Finishing
This month’s issue of SMT Magazine focuses on the impact of plating and surface finishing in electronics assembly. True, plating and surface finishing may be more directly significant in PCB fabrication, but surely they are important issues as well when it comes to the assembly side. In fact, according to our recent survey, 82% of the respondents said surface finishing impacts their assembly process.
Breaking Down the Long, Complex Sales Cycle in the EMS Industry
The EMS industry is still considered a young industry, with roots based in the early contract manufacturing days of small harness and PCBA shops. This article discusses how the demand creation process has morphed since the EMS industry's birth around 30 or so years ago into what we might consider as typical in the contract electronics manufacturing industry today.
Successful Sales Strategies
At the recent NIDays 2016 event in Singapore, Matej Krajnc of National Instruments speaks with I-Connect007's Stephen Las Marias about the challenges for sales and marketing executives in the electronics manufacturing industry, effective sales strategies, and key attributes of a sales person. He also shares his outlook on some of the key technology trends for next year.
How to Build Up Trust in a Manufacturing Outsourcing Relationship
When you, as an OEM, entrust part or all of your manufacturing operation to an EMS provider, you want to know that this fundamental aspect of your business is in safe and capable hands. It takes time to establish trust. So how can you build it up into a strong and permanent structure? Read on.
Front Lines: Sales—a.k.a., Trench Warfare!
In his inaugural article for his column Front Lines, Craig Arcuri writes about sales—real sales—not pop sales ideas, not sales jargon of the day, not flavor of the month tactics. He talks about sales in the trenches, and provides simple steps to build a sales foundation that will help your company generate more sales.
Real Time With...HKPCA & IPC Show 2016: IPC Hand Soldering World Championship in China
IPC President John Mitchell speaks with Editor Stephen Las Marias about the highlights of this year’s IPC Hand Soldering World Championship, which was held in China for the first time. He discusses how IPC has managed to keep the event so popular and successful for such a long time.
The Hunt for the Best Pre-Owned SMT Equipment Supplier
There are many SMT equipment resellers out there, some with many years of experience and others that are merely intermediaries between a company that’s trying to sell their surplus equipment and you. With that in mind, think of what you can afford not only in terms of the cost of equipment, but also regarding installation, training and support.
How to Create the Perfect SMT Reflow Oven Profile
While EMS providers will have their own preference when it comes to machine type and brand, broadly speaking, the process steps they go through to produce PCBAs are the same. However, one step that can make all of the difference when it comes to quality and consistency is reflow. This article details how EMS companies can go about creating the perfect SMT reflow oven profile.
Sales and Marketing in a Digital Transformation Reality
While many of the common sales and marketing best practices apply to the PCB assembly industry, however, deep manufacturing and electronics design expertise is required to truly drive customer interactions from one-off transactions into long and sustaining relationships as the industry goes through rapid change such as the larger involvement of a younger generation in the workforce, and the move to digital transformation and smart manufacturing.
Meeting Current and Future Requirements of the Automotive Industry
Phil Kinner, technical director of Electrolube's Coatings Division, speaks with I-Connect007's Pete Starkey about the role of conformal coatings in various applications of the automotive industry. He talks about thermal shock testing, and provides updates on their collaboration with the National Physical Lab on condensation testing.
EMS Industry Sales and Marketing: Why Strategies Vary Widely
In this article, Susan Mucha of Powell-Mucha Consulting explains why sales and marketing strategies vary widely in the EMS industry. She provides a case study of four EMS firms and their approach to the sales and marketing process.
The Business of Doing Good
This is the time of year when many people look back to what they have done so far to get a handle on goals for the coming year. Businesses also engage in the same year-end assessment, this time with greater focus on the things they have been doing right and how to improve on aspects that need more work.
Disaster Recovery Planning: What to Look for in an EMS Partner
While you're unlikely to encounter a catastrophic event in your electronics manufacturing outsourcing venture, it's nevertheless prudent to ensure that you work with an EMS partner who has the capabilities to deal with such a scenario if it should occur. So what should you look for in an EMS provider's disaster recovery policy, to ensure you're covered?
Boundary Scan Meets Functional Test
This article discusses some fundamental aspects of the combination of boundary scan and functional test, as well as new technological solutions for embedded functional tests and their practical implementation.
Rework and Repair Standard Getting Updated
The IPC-7711/21 Rework of Electronic Assemblies/Repair and Modification of Printed Boards and Electronic Assemblies is being “upreved” from version “B” to version “C” and will soon be released to the industry. This article talks about a couple of notable changes that strengthened, modernized and brought together changes from the previous “B” version, which was approved in 2007.
How to Avoid a PCB Supply Shortage During Chinese New Year
The post-Christmas blues are bad enough, but getting caught out by a PCB supply shortage due to the week-long Chinese New Year is likely to cause both you and your EMS partner significant pain. By assessing both your current and future demand, and then working closely with your PCB suppliers, EMS provider and end users, you can take a number of steps to minimize the risk to your business.
Digi ConnectCore 6UL Creates a Big Buzz at electronica
Guy Volckaerts, director for EMEA embedded sales at Digi, speaks with I-Connect007's Judy Warner about Digi’s star-of-the-show at the recent electronica event in Germany—the Digi ConnectCore 6UL—a quick, simple, feature-rich, yet very flexible system-on-module solution for OEMS and developers.
Editor's Note: Selling Success in the PCBA Industry
I am neither a salesperson nor a marketing person, but over the course of my editorial work, and through speaking to technology and systems providers in the electronics manufacturing industry, I have learned a few things when it comes to sales and marketing, namely, the importance of collaboration, positive relationships, and technical knowledge. For example, sales and marketing teams must work together to make sure deals get closed and contracts are awarded.
LA/Orange County SMTA Tech Expo a Success
On November 3, I had the pleasure of attending the LA/OC SMTA Tech Expo in Long Beach, California, and meet with chapter President Kathy Palumbo and Vice President Scott Penin, to learn more about this annual event and the chapter’s ongoing activities.
Real Time with...HKPCA & IPC Show 2016 Slideshow - Day 2
The 2016 IPC Hand Soldering World Championship was held concurrently for the first time at the International Printed Circuit & APEX South China Fair (HKPCA and IPC Show 2016) in Shenzhen, China. View the slideshow here.
My Product is Too Large and Complex to Outsource to an EMS Provider
A number of projects that struggle to get off the ground over concerns relating to size, shape or complexity can easily be outsourced – providing the project is approached in the right way. This article explains how.
Tin Whisker Mitigation Methodologies Report from SMART Group, Part 2
Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In the second part of this two-part article series, Editor Pete Starkey concludes his review of the SMART Group's recent seminar, which is focused on tin whisker mitigation methodologies and strategies.
Solder Voiding, Autonomous Autos, and Statistics—So Much to Learn from Dr. Ron
While at the 2016 SMTA International conference and show, I had the lucky opportunity to talk with Indium Corporation’s Dr. Ron Lasky. He gave a great synopsis of the extensive testing done by Indium Corporation’s Chris Nash on solder voids, outlined in a paper co-authored by the two, which was being presented by Ron at the conference.
SMTA Tech Expo Panel Session: It Takes a Village to Discuss Proper Cleaning Solutions
An expert in cleaning processes, Barbara Kanegsberg is known as “The Cleaning Lady.” She moderated the technical session “Ask the Experts: Meeting the Challenges of Effective Cleaning, Defluxing in Southern California.” Here Barbara discusses the myriad of challenges regarding cleaning PCBs (particularly in heavily regulated California) and what transpired during the open forum technical session.
HKPCA & IPC Bring Hand-Soldering Competition World Championships to China
Helen Guo, member services director at IPC Greater China, discusses with I-Connect007's Edy Yu IPC’s activities and initiatives in China. She also discusses the upcoming International Printed Circuit and APEX South China Fair 2016, which will feature the hand-soldering competition world championship for the first time in China.
Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1
Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In this article, Editor Pete Starkey reviews a recent seminar by the SMART Group to discuss tin whisker mitigation methodologies and strategies.
3 Reasons Why Outsourcing to an EMS Provider Can Go Wrong
A true outsourcing partnership should deliver benefits to both the OEM and the EMS provider. However, there are always risks, and sometimes outsourcing can go wrong. This article highlights three reasons why the OEM/EMS provider partnership might turn sour.
Leadership in Your Company: Something to Worry About?
Leadership is an ingredient that most feel is important, even though many find it is hard to define. Some say that you will know good leadership when you see it. In this article, Tom Borkes of The Jefferson Project discusses the role of leadership, and how it can be taught in the academia.
The Fine Art of Providing a Single Source for Fab, Assembly
Jay Rupani, president of Precision Technologies, speaks with I-Connect007's Patty Goldman about what exactly his company does, what differentiates them and why. He also talks about why having a single source for bare board manufacturing and assembly saves customers time, money and much angst.
KIC Shows Solutions to Voiding Problems via Optimized Reflow Profiling
At the recent SMTAI event, MB (Marybeth) Allen of KIC speaks with I-Connect007's Patty Goldman about her company, and discusses some of the details of her presentation titled "Optimized Reflow Profiling to Minimize Voiding".
The Hidden Costs when Outsourcing your Electronics Manufacturing
There's a lot of truth in the saying, "You get what you pay for" – so it's important not to skimp on price when selecting a partner. Equally, you need to remain competitive. So, when you're comparing quotes from EMS suppliers, how do you find the right fit for you? This article tells you how.
An EMS with a Nimble Global Footprint Makes a Big Splash at electronica
At the recent electronica trade show in Munich, Alwyn Rea, director of business development for non-automotive products at ALL CIRCUITS, a French-based EMS company, speaks with I-Connect007's Judy Warner about his company, their capabilities, and what makes them different from their competitors.
Living Up to Their Name at Alpha Assembly Solutions
At SMTAI in October, I-Connect007's Judy Warner spent some quality time with Alpha Assembly Solutions' Jason Fullerton, to discuss Alpha's innovative new products. Fullerton also discussed a paper he was presenting, which compares two lead-free, silver-free alloys in a selective soldering application.
The Impact of Vias on PCB Assembly
Via technology has been one of the solutions to address the miniaturization and component density challenges in current electronic assemblies. However, vias are not without their own set of challenges. As per our recent survey, these include impedance matching, routing, placement of vias, minimum size limitations, aspect ratio, and the limitations for the PCB manufacturer.
Why an SLA is Central to Meeting Customer Demand
How do EMS providers overcome supply chain challenges in order to successfully meet the challenge of consistently delivering product to fluctuating customer demand? Through service level agreements (SLAs). This article explains why.
To Bake or Not to Bake: Examining the Impact of Waiving PCB Pre-Baking Prior to Assembly
Moisture plays a critical role in lead-free PCB assembly—and one process that aims to drive moisture out of the PCB is baking. In this article, Yash Sutariya explains the results of his study on the impact of waiving PCB pre-baking prior to assembly. His study includes via integrity, via life impact, via failure, and overall reliability failures.
Electrolube on Addressing Thermal Management Issues in LEDs
At the recent electronica 2016 trade show in Munich, Germany, Jade Bridges, global technical support manager of Electrolube, speaks with I-Connect007’s Pete Starkey about how they are helping customers address the thermal management challenges in electronics assemblies, including LEDs and LED assemblies.
Electrolube’s Alistair Little on Thermal Management in Automotive Electronics
At electronica 2016, Alistair Little, technical director of Electrolube’s Resins Division, sits down with Editor Pete Starkey to discuss thermal management challenges in the automotive industry, and how their resin solutions are helping customers address those high-temperature requirements.
Chintan Sutaria: CalcuQuote Aims to Disrupt EMS Quoting Status Quo
Chintan Sutaria of CalcuQuote speaks with I-Connect007's Judy Warner about what inspired him to develop CalcuQuote. He also explains how CalcuQuote supports capturing customers' requirements to coming up with labor and material costs, allocating overhead, markups, and following up with the customer.
Why Takt Time is Important, and How to Calculate It
A common misconception is that takt time relates to the overall build time, i.e., the number of man-hours put in to building a product. It doesn't; it relates to the time span required to build a product from start to finish to ensure the continual flow of finished products needed to satisfy customer demand.
How to Improve PCB Reliability
Component failure rates have steadily declined over the years to the point where non-component failure sources have become the dominant cause of failures for a PCB. If the reliability of the components is becoming a non-issue, then the only way to improve electronics further—for this article, automotive electronics—is to look at the non-component aspects of the electronics, and a significant one is the PCB.
A Long-term Career Prospect
The next millennial in this series is Alex Johnson, an associate engineer at Saline Lectronics and who has been with the company for over two years. Even though Alex received a lot of negative information about manufacturing throughout his lifetime, his work experience in engineering has directly challenged those preconceived notions.
The Taken-for-granted Via
Vias are so simple, yet they can be so complex at the same time. Designed properly, they complete a circuit. However, a poorly designed via can be a reliability nightmare. The bottom line is that, in many ways, they are the unsung hero to a circuit board, much like an offensive line is to a football team.
Increasing Reliability through Predictive Analysis
At SMTA International 2016, Joe Russeau of Precision Analytical Laboratory discusses with I-Connect007's Patty Goldman the paper he was presented, which was co-authored by Mark Northrup and Tim Estes. The paper presents early data comparing the results of two different analytical test methods to determine how well they correlate with each other as predictors of PC board cleanliness and reliability.
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