SMTA China Sponsors Certifications at Nepcon
(March 12, 2008) SHANGHAI, China SMTA China will sponsor the SMTA Certified SMT Engineering Course and Examination, April 810 in Shanghai, in conjunction with NEPCON China 2008. SMTA China and ChinaECNet will organize the first course jointly with support by NEPCON China 2007.
IPC Names APEX's ITC Winners
(March 11, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries chose products to highlight in the Innovative Technology Center (ITC) at the 2008 IPC Printed Circuits Expo/APEX/Designers Summit, April 13 in Las Vegas, showcasing new and emerging technologies from all segments of the electronic interconnect industry.
COTS Manufacturer Chooses XJTAG
(March 10, 2008) CAMBRIDGE, U.K. Commercial off the shelf (COTS) and board-level designer/manufacturer Curtiss-Wright Controls Embedded Computing selected the XJTAG boundary scan development system to improve the process of debugging and testing its range of radar, video, and graphics products.
Nihon Superior, University of Queensland Collaborate
(March 10, 2008) OSAKA, Japan Nihon Superior Co. Ltd. is collaborating with the University of Queensland (Australia) in the investigation of the growth and properties of the intermetallic compounds that form between solder alloys and the soldered substrate. The company sponsors research on lead-free solder at the university.
IPC Releases Board Ballot
(March 10, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries announced nominations for the IPC Board of Directors elections, which will take place at the IPC Annual Meeting luncheon, April 1, 2008, in Las Vegas, during APEX. Three officer and 10 director positions are open for election on IPC's Board for the period of April 2008 through March 2010.
Sono-Tek Creates Strategic Business Units
(March 10, 2008) MILTON, N.Y. Sono-Tek Corporation formed two strategic business units (SBUs) reporting to Joseph Riemer, Ph.D., president. The SBUs comprise electronics and advanced energy, and ultrasonic coating solutions. The company also hired additional sales and applications development staff to complement the realignment.
IPC/JEDEC Plan March Reliability Conference
(March 7, 2008) RALEIGH, N.C. IPC and JEDEC will present the International Conference on Reliability, Rework, and Repair of Lead-free Electronics, March 1112, 2008, in Raleigh. This conference was planned to address the issues faced as a result of implementing a lead-free process, such as alloy choices, component compatibility, and solder concerns.
SMTA Awards PanPac Best of Conference
(March 7, 2008) MINNEAPOLIS The Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition took place January 2224, 2008 in Kauai, Hawaii. Speakers at PanPac promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. As rated by the attendees, "Best of Conference" was awarded to two presenters this year.
Sono-Tek Debuts Enhanced Website
(March 6, 2008) MILTON, N.Y. Sono-Tek Corporation released a new company Website, located at www.SprayFluxing.com and www.Sono-Tek.com. Additional pages were added to the Sono-Tek site, focusing primarily on new ultrasonic spray fluxing products, solder recovery systems, and several new industries of growth into which Sono-Tek is expanding.
Trident Launches Inkjet for Printed Electronics
(March 6, 2008) BROOKFIELD, Conn. Trident introduced the 256Jet-D inkjet print head globally, highlighting a durable, serviceable design and stainless steel construction. The print head enables various direct write, printable electronic applications with up to 5× higher resolution than screen printing, according to the company. The 256Jet-D suits printing traces, contacts, embedded passives, and components on PCBs, as well as flexible photovoltaics, fuel cells, and batteries.
Pre- vs. Post-reflow AOI Debate at APEX
(March 5, 2008) LAS VEGAS Pamela Lipson, Ph.D., CEO, Imagen Inc. (Cambridge, Mass.) and Lyle Sherwood, VP and technical director, Landrex Technologies (Santa Clara, Calif.) will debate the impact of inspection pre- or post-reflow for electronics assemblers at APEX, April 13 in Las Vegas. Resources generally limit facilities to using inspection systems at select stages in manufacturing. Lipson and Sherwood will discuss the merits of deploying AOI prior to reflow or after.
PROMATION Intros High-volume Gate
(March 4, 2008) PLEASANT PRAIRIE, Wis. PROMATION released an enhanced Passageway Gate system, the SCBL-77G, designed for high-volume production. The SCBL-77G offers a small footprint with a vertical buffering station to enable continuous production with the gate in use.
Hwang to Keynote "Women's Art, Women's Vision"
(March 4, 2008) WASHINGTON Jennie Hwang, Ph.D., will keynote the celebration of Women's History Month organized by DoD Defense Supply Center, Federal Women's Program. The program theme is "Women's Art, Women's Vision." The luncheon, in conjunction with the Federal Woman of the Year award presentation, will take place March 26, 2008, at Whitehall Recreation Center.
Cobar Offering Bar Solder, SN100C Alloys in U.S.
(March 4, 2008) LONDONDERRY, N.H. Cobar Solder Products, now part of the Balver Zinn Group, added bar solder and other solder products, including SN100C alloys, to its product offering of solder pastes, fluxes, and cored wire solders to U.S. electronics manufacturers. The additional products suit wave, selective, tinning, and similar applications.
Kyzen to Exhibit at ElectroTech 2008
(February 29, 2008) NASHVILLE Kyzen Corporation will showcase AQUANOX A4625B and AQUANOX A4651US in representative Esman's booth D-120 at the ElectroTech Exhibition, February 28 to March 2, 2008 in Istanbul, Turkey.
January Book-to-Bill Below 1.00
(February 29, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics announced the January book-to-bill ratio for flexible and rigid PCBs fell below parity, ticking down to 0.97. The lower book-to-bill is typical of January, according to IPC, and should not be considered a downward trend.
Siemens E&A Appoints Americas Electronics VP
(February 29, 2008) NORCROSS, Ga. Siemens Energy & Automation Inc. appointed Leonard D. Garrison II (Butch) as VP and GM, Electronics Assembly Systems Division (EA), effective immediately. Garrison was named acting VP in December 2007.
SMTA Opens Hutchins Grant Applications
(February 29, 2008) MINNEAPOLIS The SMTA will accept applications for the $5000 Charles Hutchins Educational Grant through April 14, 2008. The grant is awarded annually to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field. Applicants must hold a student membership in the SMTA.
Electrolube Expands in U.S.
(February 28, 2008) NOVATO, Calif. Electrolube, a division of HK Wentworth Ltd., opened corporate offices in Calif. and an operations center in Chicago as part of its Americas expansion plan. The company will build distribution, sales and marketing, and technical support from these U.S. bases.
SMTA's 1st President Passes
(February 27, 2008) MINNEAPOLIS Norb Socolowski, first president of the SMTA and industry icon, passed away on February 14, 2008. He was 85. Norb is survived by wife Jean, who asks that any donations made in his memory be sent to the SMTA's Hutchins Educational Grant.
Henkel Nabs Prime Source Awards
(February 27, 2008) IRVINE, Calif. The electronics and industrial groups of Henkel have been awarded "Prime Source Awards" from electronics distributor EIS (Atlanta, Ga.) The award ceremony included Jim Sharp, electronics group southeastern territory manager, Henkel; Ken Helfers, industrial group distribution account executive; and Bob Thomas, president and CEO, EIS.
Sono-Tek Assigned MediSonic Patent
(February 27, 2008) MILTON, N.Y. Sono-Tek Corporation received a patent for MediSonic, a system of depositing thin organic films on complicated substrates, by the USPTO.
Nihon Presents on Lead-free at APEX
(February 26, 2008) OSAKA, Japan Nihon Superior Co. Ltd. is contributing a paper, "Properties that are Important in a Lead-free Solder," to the technical conference at IPC Printed Circuit Expo/APEX/Designers Summit, April 13, 2008, in Las Vegas.
EI Recognizes Patenting Achievements
(February 26, 2008) ENDICOTT, N.Y. Endicott Interconnect Technologies, Inc. (EI) honored 32 employees for patent applications filed, 23 employees for U.S. patents issued, and 16 employees for supplying trade secrets in 2007 at a February 8, 2008, ceremony in Binghamton, N.Y. EI employees contributed a total of 29 U.S. patent application filings, 18 U.S. patents issuances, and five trade secrets in 2007.
Kyzen Exhibits at SMTA Dallas
(February 25, 2008) NASHVILLE Kyzen Corporation will showcase AQUANOX A4625 at the upcoming Dallas SMTA Vendor Show, March 5, 2008, in Dallas, Texas.
IPC, Tsinghua University Partner
(February 25, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries will undertake an initiative with Tsinghua University (Beijing) for a skill development program for electronics assembly. The program is slated to reach about 5,000 students in 500 vocational schools each year.
PDR Launches Flexible BGA/SMT Rework System
(February 25, 2008) WEST SUSSEX, U.K. PDR released its professional hand-held rework system, the PDR IR-SolderLight Professional, targeting flexibility for SMT/BGA rework. The system is tip/nozzle free, gas free, sensitive to controls, clean, and is said to produce high-quality BGA rework without complications.
Enthone Plating Lab Opens
(February 22, 2008) WEST HAVEN, Conn. Enthone Inc., a business of Cookson Electronics, opened its advanced plating applications laboratory at the West Haven facility, inviting local government officials to celebrate with employees and customers. Enthone began construction on the facility in July 2007.
FCT Develops Lead-free No-clean Paste
(February 22, 2008) GREELEY, Colo. FCT Solder, a division of FCT Assembly, developed the NL900 no-clean lead-free solder paste for use in SAC and SN100C alloy systems. FCT is an authorized licensee of Nihon Superior Co. Ltd.'s SN100C product line. The paste offers repeatability and consistency, according to the company.
AAT Intros Low-standoff Cleaning Technology
(February 22, 2008) BURNET, Texas Austin American Technology (AAT) released a calculated cleaning technology, Progressive Energy Dynamics (PED), targeting low-standoff components with spacing down to 1 mil in lead-free assembly environments. The approach incorporates a system of nozzles, manifolds, and pump technology.
Zestron Promotes Parthasarathy
(February 21, 2008) MANASSAS, Va. Zestron promoted Ravi Parthasarathy, M.S.Ch.E., to senior process engineer, responsible for key account management in North America.
Ascentech Provides Henkel's SIR Testing
(February 21, 2008) CHESTER, Conn. Ascentech LLC, North American distributor for GEN3 Systems Ltd. products, provided Henkel Corporation's Electronics Technology Center (Irvine, Calif.) with laboratory equipment for surface insulation resistance (SIR) and solderability testing, including the MUST III solderability tester and AUTO-SIR surface insulation resistance testing systems.
OEM Partnership Enhances MES
(February 21, 2008) BROMONT, Canada Cogiscan Inc. and Kratzer Automation AG (Germany) entered into a OEM reselling agreement and partnership to integrate Cogiscan RFID tracking and traceability technology into Kratzer's EMS-focused products, including the intraFACTORY manufacturing execution system (MES).
Users Unsure on Converged Technologies
(February 20, 2008) SCOTTSDALE, Ariz. In-Stat reports that conventional wisdom within the portable device industry is that consumers have a preference to use converged devices, meaning single devices that combine the functionality of previously separate devices. The research firm has found that wholesale adoption of a device that combines multiple devices is unrealistic, noting that a survey of U.S. businesspeople shows that users tend to remain loyal to older technology.
electronica 2008 Takes Broad View
(February 19, 2008) MUNICH, Germany electronica 2008, November 1114, 2008, in Munich, will present a range of electronics from semiconductors and nanotechnology to automotive safety and EMS, following the motto, "Get the whole picture." The show includes four special focus areas and 15 specific sectors.
Sanmina Sells PC Business to Foxconn
(February 19, 2008) SAN JOSE, Calif. Sanmina-SCI Corporation signed a definitive agreement with Foxteq Holdings Inc., a member of the Foxconn Technology Group, to sell certain assets of its personal computing business, along with associated logistics services in Hungary, Mexico, and the U.S. Beyond this sale to fellow EMS provider Foxconn, Sanmina also plans to transition a Mexico-based personal computing operation to PC-maker Lenovo Group.
SMTA Dallas Combines Conference and Vendor Days
(February 19, 2008) DALLAS The SMTA Dallas Vendor Days and Technical Conference, March 5, 2008, at the Richardson Civic Center outside Dallas, promises a full exhibit hall along with several key technical presentations covering advanced packaging, counterfeit components, and related topics.
AOI System Inspects Multilayer Substrates
(February 15, 2008) MUNICH, Germany EPP delivered several model STRATUS II AOI systems for inspection of electroplated gold, silver, and platinum. The AOI system's main application is inspection of screen-printed multilayers of ceramic thick film or LTCC substrates or LTCC foils.
Jim Raby to Deliver Keynote at Atlanta SMTA Expo
Jim Raby, renowned 50-year industry veteran, and founder, technical director and program manager at STI Electronics, will present the morning keynote, "An Industry Perspective: Past, Present and Future," at the 12th Annual Atlanta SMTA Expo.
Nihon Reviews Lead-free Wave at Flex Conference
(February 14, 2008) OSAKA, Japan Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., showcased its SN100C products with FCT Assembly, a U.S.-based SN100C global partner, at the IPC's "International Conference on Flexible Circuits" in Phoenix, Ariz.
Optimal Focuses on Mexico
(February 13, 2008) AUSTIN, Texas Optimal Electronics Corporation partnered with Test_ing, Tecnologia, Control y Automatizacion Industrial of Chihuhua City, Mexico, for sales and support in Mexico. Test_ing represents and supports Optimal Electronics' Optel MES software suite. Under the agreement, Optimal Electronics will work with the company to extend its MES software suite to communicate with automated test-and-inspection equipment.
WIN Highlights Automation
(February 12, 2008) ISTANBUL The World of Industry (WIN) Electrotech exhibition will take place February 28 through March 2 in Istanbul. WIN Electrotech 2008 is a tradeshow centered on high-growth automation, electro-technology, and hydraulic and pneumatic sectors. Exhibitors will highlight equipment and consumables via regional distributors.
IPTE Releases Universal Scanner/AOI
(February 12, 2008) GENK, Belgium The universal scanner system, EasyView, was introduced by IPTE to supplement its machine portfolio, offering a flexible in-line solution for barcode scans, component checks, and solder joint inspection. It uses an ADOMO camera system.
PROMATION Upgrades Manual Workstation
(February 11, 2008) PLEASANT PRAIRIE, Wis. PROMATION released its latest version of the company's 1M in-line work station. The WT-100-2C XL is a 1000-mm-long workstation that can handle PCBs up to 18" × 18". The station has dual 500-mm drives, each with independent variable-speed control, front work surface, overhead lighting, and a rear parts bin panel.
Blue Thunder Offers ESD Products
(February 8, 2008) EAST WINDSOR, Conn. Blue Thunder Technologies Inc., produced a line of ESD products for cleanroom and electronics assembly facilities. The offering includes worker attire, flooring, wipes and swaps, and other products.
Thales Nederland Selects Valor
(February 7, 2008) YAVNE, Israel Military electronics manufacturer Thales Nederland, a member of the international Thales Group, expanded its use of Valor Computerized Systems, Ltd., process control tools, selecting the Process Engineering Solution.
PROMATION Bolsters Wave, Buffer Lines
(February 7, 2008) PLEASANT PRAIRIE, Wis. PROMATION added features to its assembly tools, enhancing the OUC-500 wave conveyor with fan banks and the SCBL-99 buffer station with upgraded software. The additions suit better process control and lead-free line management.
Grieve Releases 650°F Soldering Oven
(February 5, 2008) ROUND LAKE, Ill. The Grieve Corporation released No. 851, a 650°F electrically heated belt conveyor oven for soldering. The oven includes two 4-ft. insulated heat zones with independent recirculated airflow and temperature controls, a 12-ft. cooling zone with tube-axial fans moving air through it, and a variable speed conveyor that operates between 1.3 and 15.3 inch/min.
Plexus Chooses AXI System
(February 5, 2008) SANTA CLARA, Calif. Agilent Technologies Inc. supplied EMS provider Plexus with a 3D automatic X-ray inspection (AXI) system. Plexus added the Medalist ×6000 to its test-and-inspection equipment, using the system to detect defects and screen new products.
Oxford Instruments Debuts Trace Analyzer
(January 31, 2008) OXON, U.K. Oxford Instruments Analytical Limited, a subsidiary of Oxford Instruments plc, released the X-Strata980 X-ray fluorescence (XRF) analyzer. The tool uses a high-power X-ray tube and large LN2 detector to measure small areas on complex samples. Empirical and fundamental parameter calibration options enable set data analysis or element identification.
ASTM Seeks Award Nominees
(January 31, 2008) WEST CONSHOHOCKEN, Pa. Standards developing organization ASTM International is seeking nominations for the William T. Cavanaugh memorial award, an annual recognition of an individual with eminence and broad contributions to the field of national and international voluntary standards.
IPC Releases Long-Term Business Report
(January 30, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries put out "Geographic Strategies for Global Expansion in the Electronic Interconnect Industry: Where to Invest for Long-term Business Growth," commissioned on behalf of its Executive Market and Technology Forum members. The report is a comprehensive resource for companies making long-range plans for global and local expansion.
IEC Reports Strong First Quarter Results
"Continuing our look forward, we do not see at this time any slowdown in our orders. Our backlog has actually grown modestly during the quarter and, overall, we do not seem to be encountering recession sentiment in our markets as suggested by the securities markets and the media."
December Book-to-Bill Stays Positive
(January 29, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries released the December 2007 book-to-bill ratios for rigid and flex PCB production in North America. The book-to-bill slipped in rigid and flex segments, hitting 1.01 for combined markets.
EFD Releases PicoDot Jet Dispense
(January 29, 2008) EAST PROVIDENCE, R.I. EFD Inc., a subsidiary of Nordson Corporation, debuted the next-generation PicoDot jetting dispense system, targeting high precision for a range of fluid viscosities. The dispense system suits miniaturized assemblies and 3D or uneven substrates for adhesive, coating, and other fluid applications.
Zestron Asia/Pacific Expands
(January 28, 2008) MANASSAS, Va. ZESTRON Asia/Pacific relocated to a larger facility, in the Zun Xuan Industrial Park of Shanghai, China. The location features the company's largest Asia/Pacific Application Technology Center.
Vitronics Soltec Upgrades XPM2 Reflow
(January 28, 2008) STRATHAM, N.H. Vitronics Soltec introduced an enhanced XPM2 reflow platform, XPM2+, featuring upgraded conveyor, cooling, electrical controls, software, and user interface, as well as a leaner external body.
Professional Development at APEX
(January 28, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries will promote reliability in lead-free, high-density interconnects (HDIs), design for reliability (DfR), and other topics for more than 60 professional development courses March 3031 and April 3 at IPC Printed Circuits Expo/APEX/Designers Summit in Las Vegas. Courses are half- and full-day classes with expert speakers.
Master Bond Debuts Harsh-environment Adhesive
(January 28, 2008) HACKENSACK, N.J. Master Bond released the EP11SIC silver-filled one-component conductive adhesive. It suits applications requiring electrical connections for sensitive components in severe operating conditions, resisting mechanical and thermal stresses.
TechSearch Lauds Embedded Components
(January 25, 2008) AUSTIN, Texas TechSearch International released "Embedded Active Components and Integrated Passive: Technologies and Markets," a report detailing the technologies, processes, and infrastructure for embedded components. TechSearch expects embedded components to see double-digit growth across market segments in coming years.
IPC Calls for Midwest 2008 Papers
(January 24, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries issued a call for participation for the IPC Midwest Conference & Exhibition, September 2328, 2008, in Schaumburg, Ill. Researchers, academics, technical experts, and industry leaders are invited to submit an abstract for the technical conference on any aspect of electronics manufacturing.
Sanmina-SCI Announces Earnings for Q1: Outlook Improving
"Our second quarter has historically been seasonally down, but we are cautiously optimistic about our outlook based on what we currently have in the pipeline from new and existing customers. We expect to continue to strengthen our results, improve profitability and generate free cash flow throughout fiscal 2008," continued Sola.
SOMACIS Opening Advanced PCB Plant
(January 23, 2008) MANFREDONIA, Italy SOMACIS pcb industries will start production of a next-generation of PCBs at two R&D facilities in Italy, Castelfidardo and Manfredonia. The Manfredonia plant is under construction and will begin producing the high-technology PCBs in the first half of the year.
Zetex Unveils Current Monitor
(January 22, 2008) HAUPPAUGE, N.Y. Zetex Semiconductors released the ZXCT1080 current monitor, boasting an extended common-mode-sensing voltage range of 3 to 60 V. The component reduces errors in translating actual measured current into input sense current required, as well as overall power consumption. An automotive AEC-Q100-qualified version also is in development.
IPC Issues Reports, Recommendations
(January 22, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries commissioned a report on miniaturization and electronics manufacturing, conducted by Prismark Partners (Cold Spring Harbor, N.Y.). The association also weighed in on the European Commission's review of RoHS, suggesting that the EU consider technical, environmental, and resource impacts of additional RoHS action.
ProtoDesign Chooses DEK Horizon 03i
(January 21, 2008) UTICA, Mich. and FLEMINGTON, N.J. ProtoDesign, Inc., a design and electronics services firm targeting medical, industrial, security and public service sectors, partnered with DEK to use the Horizon 03i platform. ProtoDesign will implement the printing system on its automated production line, and expects to double throughput over the coming year.
The Morey Corp. Adds Management
(January 18, 2008) WOODRIDGE, Ill. Matt W. Williams joined The Morey Corporation's sales and marketing team as business development manager, focused on the commercial telematics market. He will concentrate on wireless, GPS, vehicle data-bus technologies, and other telematics hardware nearing full-scale commercial adoption.
Sunburst Appoints Western Rep
(January 18, 2008) WEST BRIDGEWATER, Mass. Silver Mountain Design will represent Sunburst EMS's line of manufacturing and design services in the western U.S. Silver Mountain operates offices in Nev., Ariz., N.M., and southern Calif.
Rockwell Intros Linear Stages
(January 18, 2008) MILWAUKEE Rockwell Automation released the Allen-Bradley MP-Series line of integrated linear stages for OEMs and machine builders, targeting a range of load-carrying applications. The products are designed to be off-the-shelf replacements for proprietary designs, reportedly reducing time and costs of design, programming, and commissioning.
EI Develops High-complexity PCB
(January 17, 2008) ENDICOTT, N.Y. Endicott Interconnect Technologies Inc. (EI) created a large, high-complexity PCB controller board that functions as the intelligence of a powerful and advanced optical packet switch. The PCB was fabricated for IBM Zurich Research Lab, and required deep blind vias joined with a proprietary EI process technology.
IPC Designers Summit Focuses on Learning
(January 17, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries will present its 2008 Designers Summit, in conjunction with APEX, March 31 through April 3 in Las Vegas. The program includes workshops and exams for certifications, Designers Day, technical presentations, and networking.
iNEMI Begins 2009 Roadmap
(January 17, 2008) HERNDON, Va. The International Electronics Manufacturing Initiative (iNEMI) is requesting input from industry experts to develop its 2009 Roadmap. Hewlett-Packard (HP) will host the North American kick-off meeting February 2021, 2008, at its Cupertino, Calif., facility. The meeting is open to any interested in participating in iNEMI's next roadmap.
IPC Issues Annual PCB Studies
(January 14, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries released three annual PCB studies: "20062007 Industry Analysis and Forecast for Flexible Circuits in North America," "20062007 Industry Analysis and Forecast for Rigid PCBs and Laminates in North America," and "Technology Trends for Printed Circuit Boards for the Year 2006." Growth in the PCB industry worldwide over the next two years is expected to be modest but steady.
KIC Upgrades Automatic Thermal Profiler
(January 14, 2008) SAN DIEGO KIC's KIC Vision thermal profiling system is upgraded to include additional automatic capabilities. The Vision product is designed to replace manual periodic reflow profiling with automatic measurement of product profiles. The upgrades target increased automation, documentation, and traceability.
Mentor Begins 20th PCB Technology Awards
(January 11, 2008) WILSONVILLE, Ore. Mentor Graphics Corporation opened its 20th annual Technology Leadership Awards competition, calling for entries in six categories for complex PCB designs. The awards recognize engineers and designers that use Mentor products to address design challenges and produce leading products.
Advisory Board Update: Hwang Joins U.S. Export Council
(January 11, 2008) WASHINGTON The U.S. Secretary of Commerce appointed Jennie Hwang, Ph.D., SMT Editorial Advisory Board member, to a four-year term with the U.S. Department of Commerce's District Export Council.
APEX Hosts iRobot Founder
(January 10, 2008) BANNOCKBURN, Ill. Rodney Brooks, Ph.D., director of the Massachusetts Institute of Technology's (MIT's) computer science and artificial intelligence laboratory, founder of iRobot, and leader in robotics and artificial intelligence, will present the opening keynote of IPC Printed Circuits Expo/APEX/Designers Summit, April 1 in Las Vegas.
Asymtek, YESTech Partner for Medical Apps
(January 8, 2008) CARLSBAD, Calif. Asymtek and YESTech, both Nordson companies, co-developed a dispensing process that uses automatic optical inspection (AOI) technology to verify precision, accuracy, and reliability. The dispensing process targets medical-device manufacturers requiring traceability and validation.
2006 PCB Production Outpaced 2000
(January 8, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries issued its "World PCB Production and Laminate Market Report for the Year 2006," showing that the world PCB market expanded in 2006, for the third year in a row, to $47.6 billion.
Aqueous Names Accelonix as Distributor
(January 7, 2008) RANCHO CUCAMONGA, Calif. Aqueous Technologies Corporation appointed Accelonix, a member of the Accelonix Group, as its distributor in France and the North African countries Tunisia, Algeria, and Morocco.
Indium's Ning-Cheng Lee Presents Globally
(January 7, 2008) CLINTON, N.Y. Ning-Cheng Lee, Ph.D., VP of technology at Indium Corporation, will present diverse workshops in Thailand, Malaysia, and India throughout January 2008. Topics range from environmental impacts to high reliability, and center around lead-free soldering.
Cimnet Upgrades PCB-specific Software
(January 7, 2008) INDIANAPOLIS Cimnet Systems, a Consona business unit, released new versions of three PCB-specific engineering and business software products: Paradigm v.3.5, iQuote v.3.2, and Engenix v.2.2.
Lab Management Provider Opens
(January 3, 2008) AUBURN, Mass. Labman One, LLC began business as a contract service company dedicated to improving the efficiency and productivity of high-tech laboratories. It aims to assist in laboratory management for small companies in advanced technology fields, managing debug and repair services, and reportedly adding to productivity and efficiency.
Taiyo Promotes Hole-plugging Ink
(January 2, 2008) CARSON CITY, Nev. Taiyo America will allow customers to try its THP-100DX1 hole-plugging ink, on up to 12 PCB panels, at Applied Circuit Services (Exeter, N.H.) or HDI Via Fill Services (Santa Ana, Calif.). The hole fill is said to resist attack in over-plate applications, providing a planar copper surface without dishdowns from desmear.
Aqueous Releases Trident E-Learning Topic
(January 2, 2008) RANCHO CUCAMONGA, Calif. Aqueous Technologies Corp. announced the "Trident Automatic Defluxing and Cleanliness Testing System" E-Learning presentation, available on the company's Website. The presentation introduces control, cleaning, test, drying, and configuration technologies for the Aqueous Trident system.
Elcoteq Reorganizing in 2008
(December 26, 2007) ESPOO, Finland; RICHARDSON, Texas; and HONG KONG Elcoteq SE will streamline and simplify its organization, effective January 1, 2008. The reorganization is part of the EMS provider's action plan announced in October 2007. The resulting structure should improve the company's ability to respond to customer needs, clarify responsibilities, speed up decision making, and improve Elcoteq's cost structure.
Master Bond Debuts Anti-Static Latex Coating
(December 26, 2007) HACKENSACK, N.J. Master Bond Inc. released LTX-117G, a lower cost, electrically conductive, water-based adhesive, sealant, and coating. It is a one-part, UV-stable latex adhesive that incorporates non-metallic graphite filler to add conductivity.
Puritan Releases ESD-safe Swabs
(December 24, 2007) GUILFORD, Maine Puritan Medical Products LLC created a line of ESD-safe swabs with primary applications in microelectronics induustry. The ESD Safe Swabs protect electronic circuitry and devices from the negative effects of ESD. An ESD event can cause an immediate product failure, or cause a product to fail later, affecting product lifespan as well as customer safety and satisfaction.
Optimal Uses Calavista for Software Development
(December 20, 2007) AUSTIN, Texas Optimal Electronics Corporation partnered with Calavista Software, a software development resources and tools company, to expand and improve the Optel manufacturing execution system (MES) suite.
Nihon Aids World Solar Challenge
(December 20, 2007) OSAKA, JAPAN Nihon Superior Co. Ltd. sponsored the UltraCommuter vehicle in the Panasonic World Solar Challenge eco-car race, held this October. UltraCommuter was jointly developed by Nihon Superior, the University of Waikato (New Zealand), and HybridAuto.
Zuken, LogicSwap Launch Design Migration Tool
(December 19, 2007) MUNICH, Germany and WESTFORD, Mass. LogicSwap, migration software provider for Zuken's CADSTAR, launched a migration toolset for schematics, libraries, and PCB designs moving to CADSTAR from Cadence Allegro and Orcad, Mentor Graphics PADS PCB designer, and Altium Protel and P-CAD.
Valor, Digitaltest Partner
(December 19, 2007) YAVNE, Israel Valor Computerized Systems Ltd. and Germany-based Digitaltest GmbH partnered to integrate their respective design-for-test and process engineering products for improved new product introduction (NPI), assembly, and test. Digitaltest's C-LINK will work with Valor's vPlan software on a common data model.
2008 IC Market Drivers Report
(December 18, 2007) PHOENIX Electronics system shipments worldwide grew about 5% in 2007, hitting $1.21 trillion. The market is driven by demand for mobile communications devices, consumer products, notebook PCs, wireless, and automotive electronics, according to IC Insights' 2008 edition of its "IC Market Drivers" report. IC Insights finds that IC sales grew 5% to $220.3 billion this year.
November 2007 Book-to-Bill Remains Positive
(December 17, 2007) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries announced today the November findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio for rigid and flex PCB production continued its positive trend, hitting 1.06.
APEX 2008 Preview: Technical Sessions
(December 12, 2007) LAS VEGAS IPC Association Connecting Electronics Industries released highlights for its IPC Printed Circuits Expo/APEX/Designers Summit, April 13, 2008, in Las Vegas. The show includes a conference, free forums, standards development meetings, professional development courses, and exhibit floor.
Henkel Intros Quick-dry Toluene-free Conformal Coating
(December 12, 2007) IRVINE, Calif. Henkel Corporation launched the next generation of its Hysol conformal coating material, a toluene-free, one-component, solvent-based acrylic conformal coating, PC62.
Palomar Partners with Vision for PWB and SMT
(December 11, 2007) CARLSBAD, Calif. Palomar Technologies partnered with Vision Manufacturing, Inc. (VMI Vista, Calif.), to add printed wiring board (PWB) and SMT services to its Palomar Microelectronics process development, prototyping, and low-volume assembly services.
NanoMarkets Sees Disposable Electronics at $26.2B by 2015
(December 11, 2007) GLEN ALLEN, Va. NanoMarkets LLC expects the disposable electronics market paper substrates, printed RFID tags, organic embedded devices to grow to a $26.2 billion market by 2015. The analyst firm published its projections broken out by applications and device type, as well as corporate profiles of market leaders, in "Disposable Electronics: The First Wave for Printed and Organic Electronics."
Frost & Sullivan Reports on SMD Placement
(December 10, 2007) PALO ALTO, Calif. Frost & Sullivan released an analysis of pick-and-place, "Emerging Trends in SMD Placement," highlighting accuracy and modularity as key to next-generation pick-and-place systems. The report is part of the "Surface Mount Technology Technical Insights Growth Partnership" program.
Quadris-3 Pick-and-place System Launches
(December 7, 2007) BINGHAMTON, N.Y. Universal Instruments expanded the Quadris platform with Quadris-3, which uses a quad-gantry layout and is said to achieve high throughput and place a range of components. The system is based on Universal's Quadris-S, enabling compatible operation on SMT lines.
SMTA Requests Abstracts
(December 7, 2007) ORLANDO, Fla. and SHANGHAI, China The SMTA is requesting abstracts for technical papers and presentations at its 2008 tradeshows, including SMTA International (SMTAI) in Orlando and three SMTA China shows in Shanghai, Shenzhen, and Tianjin.
Additive to Limit Tin Whiskers
(December 6, 2007) OSAKA, Japan C. Uyemura & Co., an Osaka-based supplier of metal plating chemicals, has developed an additive that reportedly prevents formation of tin whiskers on circuit boards and other electronic components, according to the Nikkei Business Daily.
Tantalum Capacitors for Embedded Apps
(December 4, 2007) MYRTLE BEACH, S.C. AVX Corporation developed a range of tantalum capacitors targeting embedded control systems used in electronic control units (ECUs) for industrial, telecommunication, and other applications.
ASSET Acquires ITT
(December 4, 2007) RICHARDSON, Texas ASSET InterTech Inc. acquired International Test Technologies (ITT), based in County Donegal, Ireland. ITT supplies processor-emulation test technology to electronics manufacturers. The company's core test applications will merge well with ASSET's boundary scan systems for test, in-system programming (ISP), design-for-test (DfT), and advanced embedded instrumentation applications, according to representatives.
Astronics AES Implements Omnify PLM
(December 4, 2007) ANDOVER, Mass. Astronics AES streamlined product development and improved production using Omnify product life-cycle management (PLM) software. Astronics produces more than 100 electronic products for commercial, military, and aerospace platforms.
PCB Industry Steady in October
(December 3, 2007) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries October book-to-bill findings reveal that shipments and orders were generally slightly depressed throughout the month, in flexible and rigid PCB sectors. However, the book-to-bill ratio remained at 1.08.
CADParts Partners for EMS
(December 3, 2007) MORGANVILLE and NEPTUNE, N.J. CADParts & Consulting LLC formed a strategic alliance with EMS provider EdmondMarks Technologies for long-term, quality products for customers. The companies report that the partnership will help streamline R&D investments from their customers.
Vulcan Adds Real-time X-ray Inspection
(December 3, 2007) HUDSON, N.H. Vulcan Flex Circuit Corporation, a wholly owned subsidiary of Vulcan Electric Company, acquired an XRI-1 real-time X-ray inspection unit for its flex and flex-rigid production facility.
Nihon Opens in San Diego
(November 29, 2007) SAN DIEGO, Calif. Nihon Superior Co. Ltd., based in Osaka, Japan, opened a Nihon Superior USA, LLC office in San Diego to manage solder products distribution throughout the Americas. Nihon licenses its SN100C lead-free alloy through AIM Solder and FCT Assembly in North America.
SMTA International 2007 Best Papers Announced
To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Paper, Best of Proceedings Paper, and the Best International Paper.
Lockheed, Sanmina Team for Army Contract
(November 27, 2007) OWEGO, N.Y. Lockheed Martin and Sanmina-SCI signed a teaming agreement, allowing them to collaborate in a bid for the U.S. Army's next-generation digital intercommunications system contract. The job is worth $3.5 billion over about five years. The companies plan to offer an enhanced tactical vehicle version of Sanmina's TOCNET intercommunication system.
Toray to Sell Flex Exposure System in West
(November 27, 2007) TOKYO Toray Engineering Co., Ltd., will open sales opportunities of its double-sided, close-proximity exposure system, TE2538W, to flex substrate manufacturers in the U.S. and Europe.
TFI Releases December Forum Agenda
(November 26, 2007) ALAMEDA, Calif. Technology Forecasters Inc. will hold its Quarterly Forum in San Jose, Calif., December 56, 2007. The event includes presentations on Eastern/Central Europe's EMS climate, green electronics, DfX as a growth tool, and other topics.
Outsourcing Advice for Medical OEMs
(November 26, 2007) CRANSTON, R.I. EMS provider Federal Electronics released a white paper for medical OEMs looking to outsource to EMS providers. Author Ed Evangelista, VP of Federal Electronics, believes EMS providers versed in the regulatory environment of medical electronics can bring OEMs higher profits, more flexibility, and faster time-to-market.
AOI Line Highlights Upgradeability
(November 26, 2007) EINDHOVEN, the Netherlands Marantz Business Electronics premiered its iSpector 350 AOI system at Productronica this November in Munich, Germany, part of its upgradeable AOI platform. The AOI line can go from benchtop to in-line inspection, with various lighting configurations.
Post-show Numbers: Productronica Expands International Draw
(November 26, 2007) MUNICH, Germany Despite transportation strikes and snow storms, attendance at the 2007 Productronica conference hovered around 40,000, with visitors and exhibitors hailing from outside Germany both on the rise.
OK International Debuts Tweezers
(November 26, 2007) GARDEN GROVE, Calif. OK International released MX-PTZ precision tweezer tooling for its Metcal MX-500 soldering and rework system. The tweezers are designed to eliminate thermal overshoot, PCB stress, and package damage during manual rework. They are reportedly lightweight and ergonomically designed.
Step-by-Step - Step 10: Rework & Repair
Modern PCBs, with higher component density and shrinking component and trace/space dimensions, can be successfully modified, reworked, and repaired even while being processed in today’s lead-free and mixed-alloy rework-and-repair environments.
VirTex Adds VP, Manufacturing Operation
(November 19, 2007) AUSTIN, Texas VirTex Assembly Inc. created the position of VP, manufacturing operations, to develop and enhance manufacturing efficiency and implement lean manufacturing practices. Cathy Armstrong Chamseddine will take up the position.
IPC Looks for APEX Presenters
(November 19, 2007) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries is calling for researchers, academics, technical experts, and others in the industry to submit abstracts for poster papers for IPC Printed Circuits Expo, APEX and the Designers Summit, March 30April 3, 2008, in Las Vegas.
Smartphones Eroding Laptop and Cell Markets
(November 19, 2007) SCOTTSDALE, Ariz. and EL SEGUNDO, Calif. Smartphones are on pace to grow at a more than 30% compound annual growth rate (CAGR) over the next five years, according to research firm In-Stat. Computing companies from Google to Apple likely will succeed in making the leap from PC-based products to smartphone integration, add analysts at iSuppli.
Fume Extraction for Benchtop Soldering
(November 19, 2007) APEX, N.C. Cooper Hand Tools introduced the Weller volume fume extraction system WFE2ES with 99.5% filtration efficiency. It targets solder baths, micro soldering, and other applications where workers can be exposed to fumes and pollutants from assembly processes.
IMS Supplies Non-magnetic SMDs
(November 19, 2007) PORTSMOUTH, R.I. Targeting medical and MRI equipment and related industries, International Manufacturing Services (IMS) developed a group of non-magnetic resistors, RF dividers, and other components. The surface mountable devices feature nickel-free terminations and suit leaded or lead-free soldering.
NEE Expands to U.S., Europe
(November 19, 2007) PHOENIX, Ariz. New Era Electronics, Ltd. (NEE), along with business consultant EastBridge Partners LLC, established NEE International Ltd. as a microwave PCB sales and support force outside of Asia. The business unit will be based in Phoenix, and cater primarily to microwave PCB customers in the U.S. and Europe.
Another Look into the European Electronics Industry
Reporting for Real Time with Productronica, Philip Stoten talks with Michael Brianda, DEK's Sales & Marketing Director, about his views on the European market and in particular, Productronica's place on the global stage.
MYDATA Licenses Asymtek's Jetting
(November 12, 2007) STOCKHOLM, Sweden and CARLSBAD, Calif. MYDATA Automation AB signed a license agreement with Nordson Corporation involving patents for jetting processes developed by Asymtek, a Nordson subsidiary. MYDATA will incorporate Asymtek's jetting in their jet printer products for SMT applications.
TTSG Installs Ansoft PCB Design Suite
(November 9, 2007) PENANG, Malaysia Test Tooling Solutions Group (TTSG), a global manufacturer of automated test equipment (ATE) for the semiconductor industry, adopted Ansoft Corporation's PCB design suite. The tooling provider will use Ansoft products on design flows that link process-accurate models of board-level structures to advanced circuit and system simulations.
DDi Enters Broader Licensing With Stablcor
(November 9, 2007) COSTA MESA and ANAHEIM, Calif. Stablcor Incorporated signed a licensing agreement with PCB manufacturer DDi Corp., enabling DDi to ship to users without end-product royalties. The licensing policy is geared to bring STABLCOR materials from specialty use to incorporation as a general build-up material in PCBs.
Nextreme Names Director, Manufacturing
(November 7, 2007) RESEARCH TRIANGLE PARK, N.C. Nextreme appointed Stephen Brooks as director of manufacturing, citing prior experience with ramping technologies from introduction to volume manufacturing.
SMTR Adds Legacy Services
(November 7, 2007) WAKE FOREST, N.C. SMT Resource Group LLC (SMTR) introduced a service program to support legacy SMT equipment and lines, typically 5 to 10 years old. The service includes line moves, in-factory training, and emergency and preventative maintenance.
Titan Acquiring Nexus Nano
(November 6, 2007) AMESBURY, Mass. and FREMONT, Calif. Titan Global Holdings, through subsidiary Titan Electronics Group, will acquire the assets of Nexus Nano Electronics Inc. in an equity-based transaction valued at just over $11 million. Titan anticipates that the custom PCB manufacturer will increase market share in defense, aerospace, and related electronics segments by 2008.
Mouser to Distribute ROHM Electronics
(November 6, 2007) MANSFIELD, Texas Mouser Electronics, Inc., will distribute ICs and other components from ROHM Electronics USA to its engineering-based customers.
Dage Promotes Sealed X-ray for High-volume
(November 6, 2007) AYLESBURY, U.K. Dage Precision Industries released an X-ray inspection system, XiDAT XD7500NT, with a sealed X-ray tube to minimize maintenance requirements in busy production environments. The machine includes submicron resolution and digital imaging as well.
MYDATA Updates Jet Printer
(November 5, 2007) STOCKHOLM, Sweden MYDATA automation AB released the second generation of its jet printing system MY500, with complete off-line setup and programming and increased PCB design flexibility. The system will debut at Productronica, November 1316 in Munich, Germany.
Europlacer Appoints General Sales Manager
(November 2, 2007) DORSET, U.K. Blakell Europlacer will make Andy Jones its U.K. general sales manager on January 2, 2008. Jones has served in senior roles at Quad, Europlacer, and Mydata.
Vision System for PCB Machining
(November 2, 2007) MILFORD, N.H. Datron Dynamics Inc. released the Datron IVS integrated vision system for high-speed machining applications. The product mounts to a machining system's Z axis to locate fiducials and compensate for irregularities, reportedly enhancing parts uniformity and minimizing waste.
Manncorp Intros Small-footprint Reflow
(November 2, 2007) SAN DIEGO, Calif. and WILLOW GROVE, Pa. Manncorp released a lead-free reflow oven, CR5000F, that boasts 2030% smaller footprint than comparable machines and ±1°C accuracy in its five upper and lower zones.
Cogiscan Develops Reel-based Traceability
(November 2, 2007) BROMONT, ON, Canada Cogiscan Inc. and partners Fuji, Juki, and Siemens introduced the first version of their RFID Smart Reel Detection system, which uses RFID technology on component reels to improve traceability and eliminate manual barcode scanning. Cogiscan and its partners will highlight the tooling at Productronica, November 1316 in Munich, Germany, Booth A5.249.
Cobar Europe Adds Rep, Management
(November 2, 2007) BREDA, Holland Cobar Europe BV, part of the Balver Zinn Group, named Gerjan Diepstraten, Ing., as process support manager, and appointed PEM Technology as its representative in South Africa.
IPC Names Heller President to Board
(November 2, 2007) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries appointed Marc Peo, president, Heller Industries, to its Board of Directors, following the resignation and retirement of Pierre de Villeméjane of Speedline. Peo will serve out Villeméjane's unexpired term, through April 2009.
Burn-in QFN Socket for Fine Pitch
(November 1, 2007) VANCOUVER, Wash. Antares Advanced Test Technologies released the 880 series of clamshell burn-in sockets that accommodate standard QFN packages down to 0.35-mm pitch. The finer-pitch socket comprises a beryllium/copper alloy contact with gold contact plating, compression mount, and a cantilever contact.
Bookings Rise in September, Book-to-Bill Hits 1.08
(October 31, 2007) BANNOCKBURN, Ill. Shipments in September fell 7.1% from last year, and orders booked jumped 15.2% for rigid and flex PCBs, according to IPC's monthly statistical report. September's book-to-bill ratio climbed to 1.08, maintaining a steady positive streak that began early in 2007.
DEK Dual Lane Ups Throughput
(October 31, 2007) WEYMOUTH, U.K. DEK launched its Dual Lane handling solution, which is said to double throughput by replacing single-lane lines. Dual Lane will debut at Productronica, November 1316 in Munich, Germany, Hall A4 Booth 205.
Sony Rolls Out AOI System
(October 30, 2007) LAKE FOREST, Calif. Sony Manufacturing Systems America Inc. (SMSA) released the SI-V200 automatic optical inspection (AOI) system for high-speed, accurate, and flexible inspection post-print and pre- and post-reflow. The machine is capable of inspecting 01005s and boasts an increased field of view (FOV).
Newark Names Live Edge Judges
(October 29, 2007) CHICAGO Newark and parent company Premier Farnell plc released the panel of judges selected for the companies' Live Edge Electronic Design for the Global Environment competition, which challenges designers to incorporate electronic components into a product that benefits the environment. Judges include university, government, and business representatives.
GE Completes phoenix X-ray Buy
(October 29, 2007) BILLERICA, Mass. GE Inspection Technologies received the required regulatory approvals to merger phoenix X-ray into its non-destructive test business, for undisclosed fiscal terms. The acquisition will broaden GE's 3D, computerized tomography (CT), and micro- and nanotechnology inspection capabilities across industries, said Caroline Reda, president and CEO, GE Inspection Technologies.
National Electronics Week Launches
(October 26, 2007) LONDON Covering design through production and distribution of components, the National Electronics Week (NEW) tradeshow will debut June 1719, 2008, in London.
Benchmark Electronics' 3Q Earnings Drop
"We are clearly disappointed with our revenue performance for the third quarter," said Cary T. Fu, the Company's Chief Executive Officer. "However, as our fourth quarter guidance reflects, we continue to believe that Benchmark is well positioned for the future based on our operating focus and execution, new program bookings and continued strong cash flows from operations."
MYDATA Names Broman President
(October 25, 2007) STOCKHOLM, Sweden Bengt Broman, previously president of Teracom and of LGP-Allgon, assumed the responsibility of president of MYDATA Automation. Broman has been a member of the MYDATA board for two years, and joined the company early in 2007.
Manncorp Adds Soldering/Rework Products
(October 24, 2007) SAN DIEGO, Calif. and WILLOW GROVE, Pa. Manncorp released six soldering/desoldering products on a "Specialty Soldering Equipment" section of its Website, adding the series for low- to mid-volume assemblers.
Flextronics' Income Up 25%; Company Reports Record Results
Mike McNamara, chief executive officer of Flextronics, stated, "We continue to maintain a strong financial position with over $1 billion in cash, no short term debt maturities, and a record low debt to capital leverage ratio of 19%."
Rogers Appoints VP of Sales
(October 23, 2007) ROGERS, Conn. Rogers Corporation promoted Jeffrey M. Grudzien to VP of sales, responsible for managing the materials supplier's global sales team. He will report to Robert Wachob, president and CEO, Rogers.
Universal, Valor Partner for Software Integration
(October 23, 2007) BINGHAMTON, N.Y. and YAVNE, Israel Universal Instruments Corporation (UIC) and Valor Computerized Systems Ltd. collaborated to develop Dimensions Data Prep Studio, a new product introduction (NPI) and assembly software control package for UIC equipment users. The software integrates UIC's Dimensions Programming and Optimization (DPO) tooling with Valor's vPlan production planning product.
Acquisition Bolsters Intertek's RoHS Offering
(October 23, 2007) KANATA, ON, Canada and HOUSTON Intertek Group plc quality and safety service provider added Ageus Solutions to its restricted substances consulting services group. Ageus boasts global environmental compliance consulting, technology services, and product stewardship to the electronics and related industries. Financial terms of the purchase were not disclosed.
Equipment Suppliers Expand Eastern Europe Distribution
(October 22, 2007) GALWAY, Ireland QUIPTECH capital equipment distributor added YESTech and expanded its partnership with Smart Sonic to bring both companies into Eastern Europe. QUIPTECH will represent YESTech's AOI and X-ray inspection systems for in- and off-line operation, and Smart Sonic's ultrasonic stencil cleaners and chemistries.
E&C Takes on Printed Circuit Materials
(October 22, 2007) BILLERICA, Mass. Emerson & Cuming added polymer thick films, conductive inks, and coatings to its circuit assembly materials portfolio, taking over the product lines and future development from sister company Acheson Electronic Materials, both part of National Starch and Chemical Company's electronic materials division.
Suppliers Ready for Mexitrónica
(October 19, 2007) GUADALAJARA, Mexico As Mexico reemerges as a lower-labor-cost region close to home for U.S. companies outsourcing electronics assembly, Mexitrónica, October 2325 in Guadalajara, promises to attract international EMS providers and OEMs investigating available equipment and consumables, and checking out opportunities in the local industry.
iNEMI Opens Shanghai Office
(October 19, 2007) HERNDON, Va. The International Electronics Manufacturing Initiative (iNEMI) opened a representative office in Pudong, Shanghai, China, naming Haley Fu, Ph.D., manager of operations in the region. The Shanghai office is iNEMI's first outside of North America; it was approved by the board of directors in 2006.
Inovaxe Staff Join SMTA's MSD Council
(October 18, 2007) SARASOTA, Fla. Forrest Briggs, director of technical services, and Carl Schneider, principal software engineer of Inovaxe Corp., joined the SMTA Council on MSD. The MSD Council concentrates on advancing the practice of moisture control for sensitive devices.
IPC Names VP, Standards and Technology
(October 18, 2007) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries appointed David Torp as vice president of standards and technology. David Bergman, former VP of standards, technology, and international relations, will focus solely on IPC's global initiatives as IPC's VP, international relations.
AT&S Specifies Enthone Dry Film Resist
(October 18, 2007) LANGENFELD, Germany AT&S Austria Technologie & Systemtechnik AG selected the PHOTEC H-9825 dry film resist, manufactured by Hitachi Chemical and custom slit and distributed by Enthone, for volume PCB manufacturing at its Hinterberg, Austria, facility. The PCB maker will continue implementing the dry film resist at its Asia-Pacific facilities in 2008.
NEPCON Manufacturing Enters Romania
(October 17, 2007) YAVNE, Israel NEPCON Manufacturing Technologies, an EMS provider to electronics, electro-optics, and defense OEMs, invested $1 million in an electronics packaging and assembly facility, NEPROM TECHNOLOGY, in Alexandria, Romania. The site will head NEPCON's European manufacturing, and is a joint venture with Romania-based Electortel.
Japan's OEMs Look to Outsource
(October 17, 2007) EL SEGUNDO, Calif. Japanese OEMs, though still reluctant to use CMs for electronics, LCD, and related assembly, are being forced to focus more on product design and marketing to maintain leadership in certain markets, according to iSuppli. EMS providers and ODMs could benefit from Japan's major OEMs divesting manufacturing operations to attain cost and time-to-market efficiencies, said Adam Pick, principal analyst for EMS and ODM, iSuppli.
Valor Bolsters R&D, Distribution
(October 16, 2007) YAVNE, Israel Valor Computerized Systems Ltd. appointed as VP of R&D Meir Zelzer, formerly of SAP. The company also named GATEline AB as its distribution representative to the Nordic region.
Henkel Names Technical Manager
(October 16, 2007) IRVINE, Calif. Henkel Corporation promoted Renzhe Zhao, Ph.D., to technical manager of applications engineering, responsible for defining and supervising product development in stacked-die, underfill, and small molded package applications at the company's Calif. Technical Center. He will also oversee materials development in die-attach liquids, solder spheres, and tacky fluxes.
Dow Debuts Encapsulants for HB-LEDs
(October 16, 2007) MIDLAND, Mich. Dow Corning Corp. introduced a range of silicone encapsulants for high-brightness LEDs (HB-LEDs), featuring low moisture absorption, improved heat dissipation, and high transparency with a refractive index of 1.53. The three formulas target various hardness and viscosity needs.
Enthone Licenses Catalytic Inks
(October 15, 2007) WEST HAVEN, Conn. Enthone Inc., a business of Cookson Electronics, acquired exclusive global licensing rights to a line of catalytic inks for plating plastics from TECSEN SA (Brussels, Belgium). Enthone will manufacture, market, and sell the inks for use in inductive phone cards, flexible PCBs, RFIDs, and other application sectors, primarily under the EnTRACE brand.
SCS Curing System Combines Heat Sources
(October 15, 2007) INDIANAPOLIS Specialty Coating Systems (SCS) introduced the SCS Precision IRT cure system, which uses convection and long-wave infrared (IR) heat sources. The system reportedly cures a variety of coatings and adhesives efficiently, in less time and with lower costs than other models.
Indium Adds Sales in Eastern N.A.
(October 12, 2007) CLINTON, N.Y. Indium Corporation named Simcona Electronics Corporation to distribute solder bar, flux-coated wire, and wave solder fluxes on the eastern coast of North America.
Panasonic Batteries Specified RoHS-compliant
(October 12, 2007) ELGIN, Ill. Panasonic OEM Battery Group (Matsushita Battery Industrial MBI) reports that it has voluntarily committed to eliminate RoHS-prohibited substances (lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers) from its OEM batteries.
Cookson Expands India R&D Center
(October 12, 2007) BANGALORE, India Cookson Electronics added personnel and equipment to its India Research Center, moving to a 32,000-sq.ft. facility in Bangalore this month. The company, which originally opened its India R&D on the Indian Institute of Science (IISc) campus, will continue its strategic partnership with the school.
Cobar Adds R&D Scientist
(October 11, 2007) BREDA, the Netherlands Cobar Europe BV, a business of Balver Zinn, appointed Di Wu, Ph.D., as R&D scientist. Wu holds degrees in chemistry, chemicals, and materials and interface chemistry.
SCS Acquires Japanese Coatings JV
(October 11, 2007) INDIANAPOLIS Specialty Coating Systems, Inc. (SCS) acquired full ownership of its joint venture (JV) Parylene Japan K.K. (PJKK), established with Three Bond Co. Ltd. in 1990. The former JV will continue to provide Parylene conformal coating services and technologies in Japan under president Eddie Narita, and will operate as Parylene Japan, Inc.
SMTAI Show Highlights
(October 10, 2007) ORLANDO, Fla SMTA International, October 711 in Orlando, enjoys its first year with an SMTA exhibition, selling out booth space. The show offers new products, the Lead-free Symposium, live chat rooms at the exhibits, and a roster of technical speakers, tutorials, and certification instructors. Following are highlights from the show floor from Indium, Austin American, ACE, Asymtek, Cooper Hand Tools, Henkel, EFD, Kyzen, Seica, PROMATION, and other exhibitors.
Victrex Opens Second Polymer Plant
(October 9, 2007) THORNTON CLEVELEYS, U.K. Victrex plc opened a polymer manufacturing plant, designed to use minimal energy and water, at its main production facility in Lancashire, U.K. The plant increased production capacity for Victrex PEEK polymers by about 50%, and establishes a second, stand-alone source for the products.
Medical Market Lucrative for OEMs, CMs
(October 9, 2007) ROCKVILLE, Md. The materials processing area of contract manufacturing for device manufacture will grow from $13.9 billion globally to $25.41 billion by 2011, according to "OEM Contract Manufacturing in Medical Devices, Volume I: Materials Processing," released by Kalorama Information, a division of MarketResearch.com.
Printed Electronics Analysts Move to U.S.
(October 9, 2007) BOSTON IDTechEx relocated its global headquarters to Boston, Mass., from Cambridge, U.K. The analyst firm also appointed Susann Reuter to its board of directors, charged with expanding activities in Europe's printed electronics and RFID industries.
Nam Tai to Restructure
(October 8, 2007) MACAO, China Nam Tai Electronics, Inc., will seek to reorganize the group structure of its subsidiaries in an effort to realize several benefits similar to Nam Tai's proposed privatization of two subsidiaries in 2005. The proposed reorganization requires a series of transactions, involving capital shares and asset transfers, among Nam Tai, Nam Tai Electronic & Electrical Products Limited (NTEEP), J.I.C. Technology, Zastron Precision Tech, and various subsidiaries.
SMTA Congratulates 2007 Awards Winners
(October 8, 2007) MINNEAPOLIS The SMTA named recipients of its Founder's Award and other recognitions during its annual meeting at SMTA International (SMTAI), October 711 in Orlando, Fla. The awards celebrate service to the SMTA and the industry in technical, corporate, leadership, and other roles.
VJ Electronix Upgrades Asia Base
(October 5, 2007) LITTLETON, Mass. VJ Electronix, a VJ Technologies company, will enhance its spare parts, refurbishing, and customer demo center in Suzhou, China. Investments include expanded services, additional equipment, and relocating global sales manager Doug Robinson to the facility.
Unitemp Mini Reflow for R&D, NPI
(October 5, 2007) PFAFFENHOFEN, Germany Unitemp released the RSS series of mini reflow soldering systems, with optional vacuum or gas atmospheres for R&D, prototyping, and small-series production. The machines feature controlled ramp and cool-down rates, and heat up to 450°C.
IPC Credits Members with Awards Series
(October 5, 2007) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries introduced the Founders Awards at its 50-year anniversary and first IPC Midwest Conference and Exhibition. Fifteen companies were recognized for continuous IPC membership for 40 or more years. IPC also announced recipients of the organization's Distinguished Committee Leadership, Special Recognition, and Committee Service awards.
Samsung Increases Throughput on Flexible Platform
(October 4, 2007) HORSHAM, Pa. Dynatech Technology, Samsung's SMT Assembly Solutions distributor, will debut the SM411 and SM421 pick-and-place systems at Mexitrónica, October 2325, 2007 in Guadalajara, Mexico. The placement systems are based on the company's SM400-series Smart platform.
Five Star Releases Silver-bearing Pastes
(October 4, 2007) CLEVELAND Five Star Technologies introduced ElectroSperse silver-based conductive pastes for low-firing applications, as low as 380°C. The X-120, X-122, and X-126 are silver based, with uniform dispersion and low- to sub-micron particles.
Aqueous Names Eastern Europe Distributor
(October 4, 2007) RANCHO CUCAMONGA, Calif. Aqueous Technologies Corporation appointed ETek Europe Ltd. to distribute its cleaning products throughout the Czech Republic, Hungary, Romania, and Bulgaria.
KAL Celebrates 15 Years
(October 4, 2007) SHENZHEN, China Kasion Automation Limited (KAL), founded in 1992, celebrated its 15-year anniversary in Shenzhen, China, coinciding with week-long "China National Day" festivities. More than 150 industry members were present, including all KAL employees from various offices in Beijing, Tianjin, Shanghai, Nanjing, Shenzhen, Hong Kong headquarters, and subsidiary colleagues.
Advanced Innovations Wins UNICOR Contract
(October 3, 2007) HUNTSVILLE, Ala. and LIMERICK, Ireland InfoPro Corporation, U.S. subsidiary of Advanced Innovations, won a $5,000,000 contract from UNICOR, Federal Prison Industries' trade group, to supply electronic components to UNICOR's electronics group.