EPA Lessens TRI Requirements
(January 5, 2007) BANNOCKBURN, Ill. The U.S. Environmental Protection Agency (EPA) finalized a legislative decision to lessen the burden of reporting for Toxics Release Inventory (TRI). Qualifying small businesses, those that focus on limiting emissions through recycling, and those that use small amounts of TRI-registered chemicals can use a shorter reporting form, Form A, than in the past.
Web Access Enhances Due Diligence Communication
(January 4, 2007) SAN JOSE, Calif. Papros, Inc., added an AJAX Web client to its MRPRO software, enabling users across the supply chain to access RoHS, China RoHS, WEEE, and other compliance information for a given product. Product data is deployed across intranets and the internet with an obsolescence-management report for components.
Electronic Equipment Market Steady
(January 3, 2007) EL SEGUNDO, Calif. The global market for electronic equipment including wireless, wired, industrial, automotive, consumer, and data-processing devices will maintain current growth rates from 2006 to 2007, according to iSuppli Corp.'s report, "Electronic Equipment and Semiconductor Forecast Q1 2007." Global revenue growth for all electronic equipment should equal 6.7%, up just 0.1% from last year.
Reflow Options Showcased in India
(January 3, 2007) AESCH, Switzerland ESSEMTEC will highlight the capabilities of its RO300FC convection reflow oven with RO-CONTROL software at Componex/ElectronicIndia 2007, February 6 8, in New Delhi, India.
Formatting Program Aids China RoHS Labeling
(January 3, 2007) FORT WALTON BEACH, Fla. Total Parts Plus, Inc., created an environmental-compliance management service specific to China RoHS labeling requirements.
CyberOptics, JUKI Join on Optical Sensor
(January 2, 2007) MINNEAPOLIS, Minn. CyberOptics Corporation partnered with JUKI Corporation of Tokyo to develop LNC 60, a 5th generation version of CyberOptics' LaserAlign optical sensor. The product enables simultaneous alignment of components on the six nozzles of each placement head inside JUKI's pick-and-place machines.
Taiwan PCB Fabs Boost China Capacity
(January 2, 2007) TAIPEI, Taiwan Taiwan's PCB manufacturers are expanding production capacities in regions of mainland China, including the eastern regions around Suzhou, Kunshan, and Changshu, according to the China Economic News Service (CENS).
November Book-to-Bill Continues Downward Slope
(December 22, 2006) BANNOCKBURN, Ill. The November book-to-bill fell to 0.92 for North American rigid- and flex-PCB production, down slightly from 0.99 in October. The rigid segment posted a book-to-bill of 0.92; flex circuit production reached 0.86, both down from the previous month. The current decline indicates a period of slow growth in all segments of electronics, said Denny McGuirk, president of IPC, who predicts a strong year-end.
BiTS 2007 Program Fosters Networking
(December 19, 2006) MESA, Ariz. The 8th annual Burn-in and Test Socket (BiTS) Workshop March 11 14, 2007 in the Hilton Phoenix East of Mesa, Ariz. issued an advance program with details on tutorials, keynotes, and presentations. BiTS EXPO runs concurrent with the workshop. Organizers stress that all activities, including receptions, extended breaks, and sessions, will promote informal discussion and networking.
A.C.E. Offers Nitrogen Generators
(December 19, 2006) SPOKANE, Wash. A.C.E. Production Technologies, in partnership with On-Site Gas Systems, Inc., will offer On-Site nitrogen-generation systems under the A.C.E. brand, incorporating gas generators into the soldering products line.
China OEMs See Modest Revenue Growth
(December 18, 2006) EL SEGUNDO, Calif. China's top 60 OEMs are expected to average revenue-growth at 13% in 2006, lower than the 34% experienced in 2005, due to a slowing market of international mergers and acquisitions. Domestic mergers and acquisitions will occur more frequently in the future, according to the "Market Watch: China" report by Byron Wu of iSuppli Corp.
Hart Marketing Nabs Business Award
(December 18, 2006) WEYMOUTH, U.K. Hart Marketing International (HMI) received the international-business award at the Dorset Business Awards, sponsored by U.K. Trade & Investment. The award recognizes success in accessing overseas markets and increasing international sales.
Quarterly Forum Critiques OEM Strategies
(December 15, 2006) ALAMEDA, Calif. During the Technology Forecasters Incorporated (TFI) Quarterly Forum, OEMs, EMS providers, and suppliers discussed successful approaches to outsourcing, and analyzed challenges facing OEMs and manufacturing partners. Environmental regulations such as China RoHS represented a considerable challenge without clear solutions.
Samsung Adds Reflow Soldering to Turnkey Line
(December 15, 2006) HORSHAM, Pa. Dynatech Technology added the Samsung RF30 series reflow soldering systems to its offering of SM series flexible, turnkey placement systems distributed in North America. Samsung uses the RF30 series globally to assemble its own product.
Nordson Completes Dage Acquisition
(December 15, 2006) WESTLAKE, Ohio Nordson Corporation completed acquisition of Dage Holdings, Ltd., adding the test-and-inspection company to its advanced technology systems segment.
Rockwell Collins, Amkor, Celestica Earn SMTA Best Paper Awards
To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Paper, Best of Proceedings Paper, and the Best International Paper.
SMTA Recognizes Top SMTAI '06 Papers
(December 14, 2006) MINNEAPOLIS, Minn. The SMTA will award winners of best conference, proceedings, and international papers from SMTAI 2006, held in September in Rosemont, Ill. The authors will formally receive honors during the opening ceremony of SMTAI 2007 in Orlando, Fla.
IPC Develops Midwest Show
(December 14, 2006) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries will host the IPC Midwest Conference & Exhibition, September 23 28, 2007, at the Renaissance Schaumburg Hotel and Convention Center, Schaumburg, Ill. The show will focus on electronics manufacturing, announced IPC.
Paste Automates Image Sensor Assembly
(December 13, 2006) IRVINE, Calif. A non-conductive paste (NCP) underfill and encapsulant, Hysol FP5110, from Henkel, adheres flip-chip image sensor modules to two- and three-layer flexible printed circuits. The paste bonds to polyimide and epoxy adhesive materials.
EU Adopts REACH
(December 13, 2006) BRUSSELS, Belgium The European Parliament, regulatory body of the EU, adopted Registration, Evaluation and Authorization of Chemicals (REACH), chemical-regulating legislation requiring producers to register about 30,000 chemical substances produced or imported above a total quantity of 1 ton/year. Producers must submit a substitution plan to replace about 3,000 highly hazardous substances with safer alternatives. Implementation will begin June 1, 2007.
Potting and Encapsulant Epoxy
(December 13, 2006) CRANSTON, R.I. The 20-2620, a two-component polyurethane compound for various electronic assembly applications, features low-viscosity and room-temperature curing.
Celestica Updates Guidance for Fourth Quarter
Celestica Inc. (NYSE, TSX: CLS), a world leader in electronics manufacturing services (EMS), today announced an update to its financial guidance for the fourth quarter ending December 31, 2006.
DEK Recognized for Stencil System
(December 12, 2006) MELBOURNE, Australia DEK, through Australia and New Zealand distributor Hawker Richardson, received the Ed Hale Surface Mount Award for its VectorGuard stencil system at the Manufacturing Technology Infocus trade show,Melbourne, Australia this October.
U.K. Outlines WEEE Implementation
(December 12, 2006) LONDON Science Minister Malcolm Wicks outlined WEEE implementation regulations in the U.K., marking March and July 2007 as dates for readiness and compliance, respectively. Producers will bear the majority of responsibility for proper recycling and disposal of electronics.
Ascentech Distributes Solderability Test Equipment
(December 11, 2006) CHESTER, Conn. Ascentech will distribute testing equipment to determine solderability of component leads and terminations with the MUST System 3, manufactured by Gen3 Systems, Ltd. Ascentech, North American distributor for Gen3 Systems products, will provide sales and service and support for MUST Systems.
Newark InOne Names President
(December 8, 2006) CHICAGO Newark InOne, a subsidiary of global distributor Premier Farnell plc, named DeWight Wallace president, effective March 1, 2007. Wallace succeeds Paul Tallentire, who will return to the U.K. to head Newark's sister distributor Farnell InOne.
STI Granted Embedded IC Patent
(December 8, 2006) MADISON, Ala. STI Electronics, Inc. (STI), was awarded a patent for its imbedded component/die technology (IC/DT), which involves the use of integrated circuit (IC) embedded within a laminate substrate disposed on a thermally conductive core, providing a thermal sink. STI applied for the patent on May 23, 2003; it was awarded on October 3, 2006.
Forum Investigates Pros, Cons of Global Business
(December 8, 2006) LOS ANGELES "Asian-developed and Implemented Technologies and Business Practices You May Have Missed: Equipment, Materials, and Manufacturing Processes," a February 21, 2007, forum developed by Weiner & Associates for IPC Printed Circuits Expo/APEX/Designers Summit, offers four perspectives on international business relationships, and advice on assessing Asian relations.
TTM Closes Oregon PCB Facility
(December 8, 2006) SANTA ANA, Calif. TTM Technologies, Inc., plans to close its Dallas, Ore., facility and transfer PCB production to other sites, primarily in Logan, Utah and Redmond, Wash. The Dallas operation primarily produced commercial PCBs.
Work Cells Suit Odd-form, Final Assembly
(December 8, 2006) PLEASANT PRAIRIE, Wis. The AOM-700 work cell from PROMATION, Inc., was introduced for pick-and-place of odd-form components. The system picks from a tube- or bowl-feeder system using gantry robots with X/Y/Z axes and an inline conveyor.
Hon Hai to Open 2nd China Optical Facility
(December 7, 2006) TAIPEI, Taiwan Hon Hai Group will begin mass production of optical components at Jincheng Foxccon Technology Park Shanxi province, China late this month. The company began the expansion necessary to accommodate optical-component production in March 2006.
Dow Epoxy Raises Prices
(December 6, 2006) MIDLAND, Mich. Dow Epoxy, a business unit of The Dow Chemical Company, will increase off-list prices in North America for Allyl Chloride and Epichlorohydrin January 1, 2007, or as contract terms allow.
phoenix|x-ray Boosts U.S. Presence
(December 6, 2006) ST. PETERSBURG, Fla. phoenix|x-ray Systems and Services, Inc., opened a service center in St. Petersburg and increased staff to boost U.S. market presence.
Digi-Key, NDK Form Partnership
(December 6, 2006) THIEF RIVER FALLS, Minn. and TOKYO Digi-Key Corporation and Nihon Dempa Kogyo Co., Ltd., (NDK) signed a global distribution agreement for NDK's surface mount quartz-crystal and oscillator lines.
ATExpo Call for Speakers
(December 6, 2006) ROSEMONT, Ill. Canon Communication's Assembly Technology Expo (ATExpo) in conjunction with Electronics Assembly Show, National Manufacturing Week, and Quality Expo is accepting submissions for paper, panel, and half-day workshop speakers through February 1, 2007. The shows take place September 24 27, 2007, in Rosemont.
Isola Improves RoHS-compliant Substrate
(December 6, 2006) CHANDLER, ARIZONA Isola Group s.a.r.l. commercially released an improved generation of IS415, a 200°C Tg product with lead-free compatibility and strong signal integrity. Electrical loss numbers reach 0.009 using the splitpost resonant cavity method. With Bereskin stripline testing loss equals around 0.0135 at 10 GHz.
SMTAI Call for Papers
(December 6, 2006) MINNEAPOLIS SMTA International, October 7 11, 2007, in Orlando, Fla., is soliciting abstracts for technical papers, as well as potential course descriptions.
Indium Nabs 4th F&S Honor
(December 5, 2006) CLINTON, N.Y. Frost & Sullivan awarded Indium Corporation the 2006 Global SMT Solder Paste Customer Value Enhancement Award at a ceremony in San Antonio, Texas. Deepa Mathew, research analyst at Frost & Sullivan, presented the award, citing Indium's select customer group and depth of experience, particularly with lead-free.
Huntsman & UL Partner on RoHS Compliance
(December 5, 2006) THE WOODLANDS, Texas Huntsman Corporation selected Underwriters Laboratories Inc. (UL) as its RoHS-compliance partner, and will begin the application process to receive the UL RoHS mark. UL created its restricted substances compliance program to help manufacturers demonstrate due diligence when complying with the EU's RoHS Directive. UL provides test services to determine levels of hazardous materials.
Henkel Acquires Taiwan Solder-sphere Maker
(December 4, 2006) IRVINE, Calif. The electronics group of Henkel acquired Taiwan-based Accurus Scientific Co. Ltd. The manufacturer produces solder spheres and type 1 7 solder powders for electronics packaging and PCB assemblies. By acquiring a company headquartered in Tainan, Taiwan, Henkel expects to gain technical and market support in that region.
Photo Stencil Upholds ISO 9001:2001
(December 4, 2006) COLORADO SPRINGS, Colo. Photo Stencil completed ISO 9001:2000 recertification, with registration issued by Orion Registrar, Inc. The quality-control standard covers design, manufacture, and sales of stencils, screens, and templates.
IPC Calling All PCB Designers
(December 4, 2006) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries and its Designers Council will host the Designers Summit, February 15 22, 2007, in Los Angeles. The event allows PCB designers to participate in activities and educational sessions, and provides resources on high-speed, advanced technologies, and design for lead-free. The summit occurs in conjunction with APEX and IPC Printed Circuits Expo.
Valor, MYDATA Integrate
(December 1, 2006) YAVNE, Israel Valor Computerized Systems Ltd., invited by MYDATA, joined the equipment manufacturer's third-party partnership program, further integrating Valor's engineering software with MYDATA hardware. The partnership is expected to optimize MYDATA system usage for parts and panel handling.
KEMET Releases "Green" Capacitors
(December 1, 2006) GREENVILLE, S.C. KEMET Corporation introduced RoHS-compliant versions of its commercial-molded radial, and high-voltage radial capacitors, as part of a push for environmentally friendly component lines.
Isola Revamps IS620
(November 30, 2006) CHANDLER, Ariz. Isola Group S.a.r.l. used process changes, without adjusting the chemical make-up, to improve dielectric and thermal performance of IS620, a base material for low-loss, high-speed space.
XXX Enables 3-D Inspection
(November 28, 2006) SAN CLEMENTE, Calif. YESTech released a CT tomography option, XXX, for all YTX-3000 systems, enhancing analysis of complex interconnects.
Africa Discusses E-waste at COP8
(November 28, 2006) NAIROBI, Kenya Like the EU's RoHS, China RoHS, and WEEE, the Basel Convention on the Control of Transboundary Movements of Hazardous Wastes and their Disposal classifies electrical and electronic waste and hazardous substances. The convention, and proposed amendments, will be discussed in the World Forum on E-waste, November 30 in Nairobi, as part of COP8. Several African countries see imports of e-waste, for incineration or landfill disposal, increasing rapidly.
Kyzen Appoints Manufacturer's Representative
(November 27, 2006) NASHVILLE, Tenn. Kyzen Corporation appointed Germany-based Peter Jordan GmbH as manufacturing representative for Germany, Austria, and Switzerland.
Inovaxe Names Midwest Rep.
(November 27, 2006) SARASOTA, Fla. Inovaxe Corp. named CR Tech, LLC, of Grafton, Wis., as manufacturing representative for the Midwestern U.S.
Event Explores Printed Electronics
(November 27, 2006) PHOENIX Printed Electronics USA 2006 released its roster of speakers and topics for the conference and technical sessions on December 5 6 in Phoenix. Organizers expressed interest in examining technical, financial, and other aspects of printed circuits.
October Book-to-Bill Dips Below Parity
(November 27, 2006) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries announced a North American combined rigid and flex PCB book-to-bill ratio of 0.99 for October. The first drop below parity in about two years can be attributed to increased flex circuit shipments in October and August and September shipment increases for rigid PCBs. The rigid PCB industry ratio decreased from 1.01 in September to 0.99, while flexible circuits remained at about 0.91.
VISION Awards Deadline Approaches
(November 22, 2006) NASHUA, N.H. The annual SMT VISION Awards program celebrates exceptional services and products introduced between January 1, 2006, and December 31, 2006. The deadline to submit for award consideration is December 1, 2006.
EIS Fabrico Hires, Adds Equipment
(November 22, 2006) KENNESAW, Ga. EIS Fabrico expanded support for customers in Mexico with the addition of specialist Carlos Medrano. Medrano will bring technical, manufacturing service, and engineering knowledge from 25 years experience in flexible materials. As technical marketing specialist, he will manage customer sales and service in the country, and provide technical support to the global sales staff.
Cogiscan Hires Management in Europe
(November 22, 2006) BROMONT, Canada Cogiscan added Bruno Meier as European sales manager, based near Zurich, Switzerland. Meier will work with direct customers in Europe and support global business partners in that region.
Capacitor Targets Short-circuit Failure
(November 20, 2006) MYRTLE BEACH, S.C. AVX Corporation released a ceramic capacitor to reduce short-circuit failure, with minimum flexure of up to 5 mm, without internal cracks. Terminated with proprietary FLEXITERM technology, the FLEXISAFE capacitors are designed to absorb shock and prevent internal cracking due to board flexure and temperature cycling damage.
Nordson Acquires Dage Holdings
(November 17, 2006) WESTLAKE, Ohio Nordson Corp., based in Westlake, Ohio, acquired Dage Holdings Ltd. of the U.K., subject to approval from the German Federal Cartel Office. The companies withheld purchasing terms.
Soldering, Critical Issues Examined at APEX
(November 16, 2006) BANNOCKBURN, Ill. More than 50 full- and half-day courses will provide IPC Printed Circuits Expo/APEX/Designers Summit 2007 attendees with practical information on current and future critical issues. The educational courses will take place February 18-19, 22 in Los Angeles, Calif.
Video Stars RoHS-screening Solution
(November 15, 2006) WOBURN, Mass. Innov-X Systems released an online video demo focused on RoHS screening to help companies learn about handheld, X-ray fluorescence (XRF) RoHS-compliance screening solutions. The product demo features a handheld energy-dispersive XRF (EDXRF) analyzer, specialized RoHS software information, and details about the company's capabilities.
KIC Develops Automatic Profiling System
(November 14, 2006) SAN DIEGO, Calif. KIC introduced KIC Vision, an automatic profiling system, for a low-cost alternative to manual verification profiling for reflow processes. The company claims that the automatic profiling will maintain production quality and process documentation standards achieved by periodic manual profiling, without interrupting production flow or additional equipment.
EVS International Expands
(November 13, 2006) ISLE OF WIGHT, U.K. EVS International moved to a new facility located in the Porchfield Business Park, Porchfield, Newport, Isle of Wight.
SWEPEX, SMTA Co-locate for Technical Talks
(November 13, 2006) PLANO, Texas The SMTA Dallas Chapter will co-locate technical presentations with the Southwest Electronics Production Exposition (SWEPEX), November 14 and 15, 2006 in Plano, Texas.
SMTA Elects Board of Directors
(November 13, 2006) MINNEAPOLIS, Minn. The SMTA announced election results for the Board of Directors term, which began late September 2006, reelecting president David Raby of STI Electronics, Inc.
iNEMI Mobilizes for Tin/lead BGAs
(November 9, 2006) HERNDON, Va. The International Electronics Manufacturing Initiative (iNEMI) consortium organized "Sn/Pb BGA Availability Task Group" to address the needs of OEMs exempt or out-of-scope from the RoHS Directive. The task group scheduled a workshop to bring together OEMs with the BGA supply base on January 24, 2007, in or near San Jose, Calif.
Asymtek Names GM in China
(November 9, 2006) CARLSBAD, Calif. Asymtek named Frank Wang to the position of general manager, China. Wang will direct all facilities, operations, sales, and support services for dispensing products and systems in that region. Asymtek has expanded to three offices and two applications labs in the past two years, and other lab is in construction.
ITW to Acquire Speedline Technologies
(November 8, 2006) FRANKLIN, Mass. Illinois Tool Works (ITW Glenview, Ill.) has signed a definitive agreement to acquire Speedline Technologies, Inc., from KPS Special Situation Funds, according to company press release. Terms of the transaction were not disclosed and are subject to normal regulatory approvals.
Cookson Predicts Corporate and Industry Direction
(November 8, 2006) LONDON Cookson Group plc discussed company standings and statistics on the electronics industry at large during a meeting for analysts and shareholders. The meeting focused on the transition to lead-free products, expansion in China, raw materials, and other factors that could encourage profitable industry growth.
RoHS-compliant Adapter Eases Upgrades
(November 8, 2006) FRENCHTOWN, N.J. Aries Electronics introduced a RoHS-compliant version of its SOWIC-to-DIP Correct-A-Chip adapter, which enables users to upgrade to a small-outline wide integrated circuit (SOWIC) from a dual in-line package (DIP) without changing PCB layout.
SMTC Expands in Western U.S.
(November 6, 2006) TORONTO, ON EMS provider SMTC Corporation expanded operations in the western U.S. with increased presence in San Jose, Calif. Carl Munio and Russ Morrow joined SMTC's western division to guide corporate development. The company also has reconfigured its footprint toward more manufacturing and configure-to-order capacity at the San Jose facility with assembly, testing, box build, final product integration, and global supply-chain logistics.
Foxconn Plans Massive China Investments
Foxconn, the world's largest contract maker of electronics products, including the iPod and PlayStation 2, plans to invest US$1 billion at a new technology industrial park in Huai'an, China, and is looking to further expand to the nation's interior.
Manncorp Expands San Diego Facility
(November 3, 2006) SAN DIEGO, Calif. SMT assembly equipment provider, Manncorp, will add 4,000 square feet of space to its West Coast location to meet growing demands for pick-and-place machines, lead-free wave solder systems, and reflow ovens.
Digi-Key to Distribute Samtec Products
(November 2, 2006) THIEF RIVER FALLS, Minn. And NEW ALBANY, Ind. Digi-Key Corporation and Samtec, Inc. have signed a global distribution agreement, wherein Digi-Key will distribute Samtec's PCB-level interconnects, cable assemblies, high data rate cables, and flex assemblies.
Fawn Electronics Rebuilds
(November 2, 2006) WILSON, N.C. Following a fire in December 2005 that destroyed its Elm City, N.C. site, Fawn Electronics Company announced plans to build a new manufacturing site in the Nashville Business Center in Nash County, N.C.
Assembléon Nabs Long-term Deal with PPEM
(November 2, 2006) VELDHOVEN, The Netherlands Penning an agreement totaling more than 20 million Euro, Zhengjiang Pound Precision Electronics Manufacturing Co. Ltd. (PPEM) has chosen Assembléon as a long-term production technology partner, and will use the company's single-platform, A-series pick-and-place system at its Jurong, China facility.
Hitachi France Installs Valor Pre-production Suite
(November 1, 2006) YAVNE, Israel Valor Computerized Systems installed its Trilogy 5000 pre-production engineering solution and Valor Parts Library (VPL) at Hitachi's Orleans (Loiret), France, manufacturing facility, which specializes in assembling complex boards for Hitachi computer product applications.
Trade Visit Examines China's PCB Market
(November 1, 2006) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries has established a trade visit to China to better understand the direction of the Chinese PCB industry, and how it will affect the global market. The mission will run in conjunction with the 2006 International Printed Circuit and Electronics Assembly Fair in Dongguan, China, December 6-8, 2006.
Lead-free Solder Wire Incorporates Polymers
(October 31, 2006) LONDONDERRY, N.H. Cobar Solder Products, a subsidiary of Cobar Group, will offer CobarCore lead-free cored wire solder for lead-free assembly applications.
MEPTEC Keynote Predicts End to Moore's Law
(October 30, 2006) SAN JOSE, Calif. William Bottoms, Ph.D., will keynote the MicroElectronics Packaging and Test Engineering Council (MEPTEC) symposium "IC Packaging and Test Roadmaps: Device Trends Impact on Packaging and Test Technology and Supply Chain," on November 16, 2006, in San Jose, Calif. Bottoms' keynote will accompany four focus sessions on aspects of supply chains and roadmaps.
Handbook Specifies Design Standards
(October 30, 2006) ST. LOUIS The second edition of Geometrical Dimensioning and Tolerancing for Design, Manufacturing, and Inspection, by Georg Henzold, covers international design standards and revisions for geometrical product specifications.
Classes Shed Light on Vision Systems
(October 30, 2006) NATICK, Mass. Cognex Corporation will offer "Cognex University," a national, company initiative created to illustrate vision system applications through seminars, workshops, and training sessions.
DEK Fine-tunes Americas Operations
(October 27, 2006) FLEMINGTON, N.J. DEK USA has reformed corporate focus onto four core printer support products understencil paper rolls, PRO and PRO EF understencil cleaning chemistries, replacement stencil blades, and pre-saturated cleaning wipes.
PennWell Launches Online Job Service
(October 27, 2006) TULSA, Okla. PennWell Corporation will operate PennTechJOBS, an online employment service meeting the recruitment needs of engineers in electronics, optoelectronics, nanotechnology, semiconductors, and other high-tech industries.
X-ray System Inspects Hidden Features
(October 26, 2006) SAN CLEMENTE, Calif. YESTech released its YTX-6000 inline automated X-ray inspection (AXI) system, said to fully inspect hidden features such as solder joints or components under radio frequency (RF) shields. Algorithms are used to perform PCB, package, and other electronic assembly inspections.
Agilent Rearranges Financial Team
(October 26, 2006) SANTA CLARA, Calif. David Cooper, senior vice president finance and treasurer, will leave Agilent Technologies, Inc., effective Nov. 3, 2006, to join Art.com, Inc., as its chief financial officer (CFO).
Agilent Licenses Test Target Technology
(October 26, 2006) SANTA CLARA, Calif. Agilent Technologies will license Medalist bead-probe technology, a methodology for placing solder beads directly onto PCB signal traces, to Medalist 3070 and i5000 in-circuit test (ICT) customers, as well as to vendors of other ICT equipment.
Flextronics Announces Record Sales and Earnings
Net sales from continuing operations for the second quarter ended September 30, 2006 were a record high $4.7 billion, which represents an increase of $894 million, or 23%, over the year ago quarter.
Partners Release Fiber Laser Marking System
(October 25, 2006) BRANFORD, Conn. Lasercut, Inc., with partners El.En. Group and Lasit, released a 20-W pulsed fiber laser marking system that is said to etch metals and plastics to a reliability rating of 100,000 hours. The companies have collaborated since 2003.
Optimal Electronics and B-Global Team
(October 25, 2006) AUSTIN, Texas Optimal Electronics Corporation of Austin, Texas, formed a strategic partnership with B-Global Technology of Penang, Malaysia. The companies are collaborating for support, business development, and future product development.
SMT Welcomes Advisory Board Members
SMT Magazine welcomes Laura J. Turbini, Ph.D., and Harald Wack, Ph.D., to its Editorial Advisory Board. The Board offers insight on the industry, future trends, and market technology; members write columns such as "Speaking of Process Optimization," "Speaking of Cleaning," and more. Turbini and Wack will join 10 other industry experts that analyze the SMT industry from every possible angle.
Drop-in Cleaner Removes Flux
(October 24, 2006) MANASSAS, Va. As a drop-in replacement for high- and medium-pressure batch or inline systems, the ATRON AC 205 acts as a mild cleaner to remove flux residues. The monothanolamine-free, alkaline, aqueous-based cleaning agent from ZESTRON AMERICA reportedly leaves solder joints and pads bright, and is compatible with aluminum and epoxy surfaces.
Boundary-scan Solution Addresses Faults
(October 23, 2006) SANTA CLARA, Calif. With the introduction of IEEE 1149.6 for advanced digital networks, JTAG Technologies has created a support program to run "dot6" testing. The 1149.6 standard updates 1149.1 ("dot1") specifications, which allowed a certain amount of erroneous pass-fail indications.
Indium Hosts Global Tech. Summit
(October 20, 2006) CLINTON, N.Y. The 4th annual Global Technology Summit at Indium Corporation was held September 11 15, in Clinton, N.Y., bringing together more than 40 technical support and applications engineers from Asia, Europe, Mexico, and the U.S.
Hwang Lectures on Lead-free
(October 20, 2006) LAS VEGAS SMT Editorial Advisory Board member Jennie Hwang, Ph.D., will share lead-free development knowledge and real-world production know-how in seven half-day tutorials to take place in Las Vegas, November 6 9.
MATELEC 2006 Promotes International Industry
(October 19, 2006) MADRID, Spain MATELEC, Salón Internacional de Material Eléctrico y Electrónico, will promote commercial development, industry evolution and consolidation, and sustained growth and demand, at the 13th meeting of the exhibition in Madrid, Spain, October 24 28, 2006. MATELEC acts as a forum for technology and service introductions, and trends analysis.
Digi-Key Expands with Winbond America, CR Magnetics
(October 18, 2006) THIEF RIVER FALLS, Minn.; SAN JOSE, Calif.; and ST. LOUIS, Mo. Digi-Key Corporation will expand an existing distribution agreement with Winbond Electronics Corporation America to include Europe. The distributor will also begin selling CR Magnetics Inc. globally.
ODMs: Chip Spending 2006
(October 18, 2006) EL SEGUNDO, Calif. Taiwanese original design manufacturers (ODMs) will dominate purchasing in semiconductor chips in 2006, primarily for PC manufacturing, says iSuppli report "ODM Semiconductor Spending Analysis." Quanta, Asustek, and Wistron the top three spenders worldwide are all based in Taiwan. All three also reportedly use the majority of chips purchased to make PCs, notably laptops.
Design Software Revision to Launch at Z-DAC
(October 18, 2006) MUNICH, Germany and WESTFORD, Mass. Zuken's version 9.0 of PCB and packaging design suite CR-5000 includes the integrated high-speed design and analysis environment Lightning. It will launch at Z-DAC '06, the European Annual Customer-to-Customer Technology Conference, October 24 26, 2006, in Ulm, Germany.
Benchmark Electronics Signs Definitive Agreement to Acquire Pemstar
Based on Benchmark's closing price of $28.93 on October 16, 2006, the transaction values Pemstar at $4.63 per common share, or approximately $300 million including the assumption of Pemstar net debt. The merger is expected to be a tax-free exchange of common shares.
Benchmark to Acquire Pemstar
(October 17, 2006) ANGLETON, Texas Benchmark Electronics, Inc., and Pemstar Inc. signed a definitive merger agreement, expected to be a tax-free exchange of common shares. The transaction puts Pemstar's value at $300 million, including assumption of the company's net debt. Pemstar reported fiscal year 2006 revenues at $871 million.
KEMET Cuts Costs, Reduces Staff
(October 17, 2006) GREENVILLE, S.C. KEMET Corporation will cut costs in its Monterrey, Mexico, facilities by reducing employment by about 400 people. The company states that a combination of normal attrition, release of temporary employees, and a reduction-in-force of roughly 120 workers, will comprise the cost-cutting initiative. Severance and related costs will total approximately $800,000
Cobrush Applies Flux in Tight Spaces
(October 16, 2006) LONDONDERRY, N.H. The Cobrush flux applicator from Cobar Solder Products comprises a compact polypropylene body with a transparent cartridge, a bristle applicator tip similar to a paint brush, as well as a cap to prevent flux evaporation.
Paste Improves Stacked-die Assembly
(October 16, 2006) SAN DIEGO A family of self-filleting die attach adhesives, AAA3300 from Advanced Applied Adhesives (AAA), offers properties comparable to die-attach film, in a paste. The self-filleting die attach adhesive is said to enable thin-die assembly at improved yields with conventional assembly techniques.
TFI EMS Forecast Notes Narrow Profits
(October 13, 2006) ALAMEDA, Calif. Technology Forecasters, Inc. (TFI), projects healthy growth with narrow profits for the EMS industry in the "Five Year Forecast of EMS and ODM Industries by Market Sector and Geography." Average annual growth should top 6% per year in global electronics production. Average net profitability showed no rise in the past year. Markets expansion should induce OEMs to outsource a greater percent of their total production.
Indium's French Connection
(October 12, 2006) UTICA, N.Y. Indium Corporation added Accelonix Group as a distributor for France expanding sales efforts for the European region. Accelonix will sell semiconductor packaging assembly materials, engineered solder, wafer- and chip-bump materials, solder pastes, fluxes, underfills, and other materials.
ESSEMTEC Places 4th in Regional Award
(October 12, 2006) AESCH, Switzerland The semi-annual Swiss Venture Club (SVC) Award Ceremony recognizes companies presenting essential and sustainable economic success and notable performance. ESSSEMTEC was rated 4th out of more than 100 regionally-anchored companies in central Switzerland. As one of six finalists, the company received an award at the KKL Luzern ceremony late September.
Remote Monitor Links PDA, Thermal Info
(October 12, 2006) SAN DIEGO KIC will run test marketing of a PDA process monitor that transfers real-time thermal process data from any KIC 24/7 on a reflow oven to an authorized PDA. The company believes PDA-based monitoring will improve data and process management, and reaction times associated with thermal issues.
Simclar Announces Results for Second Quarter 2006
The company expects to report revenue for the quarter ended June 30, 2006 of $30,520,000, net income of $790,000, and earnings per share (basic and diluted) of $0.12.
Dynatech, Samsung Sign Agreement
(October 11, 2006) HORSHAM, Pa. Dynatech Technology, Inc., will add sales and services for Samsung Techwin's SMT placement system lines in North America. The agreement is part of a steady progression since the companies first partnered in SMT assembly.
Implementing Lead-free Workshop Tackles Assembly Problems
(October 11, 2006) NASHUA, N.H. Manufacturers facing challenges with lead-free assembly and a host of associated system changes certification, failure analysis, traceability can attend Implementing Lead-free: A Hands-on Workshop, October 16 19, hosted by SMT Magazine and the Rochester Institute of Technology (RIT) Center for Electronics Manufacturing and Assembly (CEMA) in Rochester, N.Y.
Horizon 02i Leads DEK Family
(October 11, 2006) FLEMINGTON, N.J. DEK's next-generation Instinctiv printers combine options from established platforms to reportedly enhance cycle time, flexibility, and yield. The company released the Horizon 02i as the first in the Instinctiv family.
Reflow System Controls Temperatures
(October 11, 2006) NORTH BILLERICA, Mass. BTU International, Inc. created the Pyramax 125 Air reflow system, which features forced impingement technology, 24" process capability, and operating temperatures which reach 350°C for a range of electronics manufacturing applications, notably lead-free.
The EASi Line Message
(October 11, 2006) ROSEMONT, Ill. The Electronic Assembly Suppliers' Initiative, known as the EASi Line, at the Assembly Technology Expo, September 24 28, 2006, at the Donald E. Stephens Convention Center in Rosemont, Ill., is an exciting way to learn about the SMT process, because not only do engineers on the line explain each step as it happens, but you also get to leave the line with a prize.
Omron, Scientific Technologies Merge
(October 10, 2006) FREMONT, Calif. Japanese automation provider Omron Corporation and North American Scientific Technologies (STI), which produces automation safe-guarding products, merged with shareholder approval. Omron acquired Scientific Technologies' safety products group (SPG); STI sold its automation products group (APG). The transaction value equaled $110.8 million.
Enthone Acquires Chinese Electroplating Entities
(October 10, 2006) WEST HAVEN, Conn. Enthone, Inc., a business of Cookson Electronics, acquired Shenzhen Hua-Mei Electroplating Technology Co., Ltd.; and Hua-Mei Tianjin Electroplating Technology Co., Ltd. in China. The entity created by the acquisition will conduct business as Guangzhou Cookson Trading Company, Co., Ltd.; the October 1, 2006, sale brought Enthone from 51% ownership of the companies to 100%.
KEMET Honored at CARTS Europe
(October 9, 2006) GREENVILLE, S.C. In recognition of a technical paper presented at the 2005 Capacitor and Resistor Technology Symposium (CARTS) Europe, three KEMET Corporation employees received honors from the 2005 CARTS delegates and program committee. Winning papers from 2005's symposium held in Prague, Czech Republic, in October 2005 were presented at CARTS Europe held September 25 28, 2006, in Bad Homburg, Germany.
MEM Ventures Acquires Artetch
(October 9, 2006) WEST SUSSEX, U.K. Martin Morrell of MEM Ventures Limited acquired all share capital in Artetch Circuits. Artetch's Richard Wood-Roe, managing director; and Richard Evans, financial director, will support the handover in consultant roles.
APEX Keynotes Look to Space, Future
(October 6, 2006) BANNOCKBURN, Ill. Buzz Aldrin, Ph.D. and American astronaut, and three PCB industry guides will give their interpretations of the future at the IPC Printed Circuits Expo, APEX, and Designers Summit, February 20 22, 2007 in Los Angeles, Calif.
Photo Stencil Promotes Two Members
(October 6, 2006) COLORADO SPRINGS, Colo. Photo Stencil, a company of Eagle Electronics, LLC, promoted Mike Burgess to vice president of sales and Val Quinones to director of sales. Both will continue to focus on customer service in these positions.
Gail Flower to Keynote SWEPEX
(October 6, 2006) PLANO, Texas SMT Magazine editor-in-chief Gail Flower will provide a keynote address at the Southwest Electronics Production Exposition (SWEPEX), November 14 15, 2006, in Plano, Texas. At the November 15th luncheon, Flower will interpret the progression of the SMT industry as a "dance," spinning "upside down and round."
GlobalTRONICS 2006 Notes RoHS Importance
(October 5, 2006) SINGAPORE GlobalTRONICS, October 10 13 in Singapore, will emphasize the effect of the RoHS Directive on electronics manufacturing. Pooling design service, technology, and manufacturing service providers, the show will allow all aspects of SMT assembly to be represented and educated on environmentally friendly electronics manufacturing.
Pick-and-Place Head Targets High-throughput
(October 4, 2006) Hampton, N.J. Ultra-low-mass, two-axis, and compact, IntellePro, Inc.'s IPROBE is a pick-and-place head targeted for high-throughput manufacturing that uses multiple, ganged heads. The product requires a 20-mm center and has a mass of 300 gms.
Zuken, Rio Partner on Chip to PCB Design
(October 4, 2006) MUNICH, Germany; WESTFORD, Mass.; and YOKOHAMA, Japan Zuken and Rio Design Automation, with some collaboration from Magma Design Automation, will work in a cooperative sales and technical development program to generate an optimized design environment from chip to package to PCB.
Submicron X-ray Detects Below 1 µm
(October 4, 2006) WUNSTORF, Germany The microme|x submicron, high-resolution system from phoenix|x-ray Systems and Services enables manual and semi-automated solder joint inspection of BGAs, CSPs, MLFs, and QFPs. The X-ray inspection machine offers detail-detection below 1µm, with a total magnification of up to 13.300×.
Transition Automation Hires VP
(October 4, 2006) NORTH BILLERICA, Mass. Alden D. Lewis joined Transition Automation, Inc., as vice president of sales. Lewis will expand the squeegee systems company's sales department and help to integrate R&D developments into large-scale SMT production operations.
Book-to-Bill Strong, Should Continue
(October 2, 2006) BANNOCKBURN, Ill. The North American rigid circuit book-to-bill ratio for August 2006 rose to 1.06, while the flexible book-to-bill ratio grew to 1.05, shows a recent release from IPC Association Connecting Electronics Industries. The combined industry book-to-bill, encompassing rigid and flex circuits, was 1.05.
Titan Optimizes PCB Plant
(September 28, 2006) AMESBURY, Mass. Titan Global Holdings, Inc., will implement an optimization plan in its Mass.-based Titan East PCB plant. The process criteria will be based on a similar program implemented in the Titan West advanced circuit board production facility, located in Fremont, Calif.
SMTAI Panel Summarizes Future Technologies
(September 27, 2006) CHICAGO The lure of free beer and pretzels rarely fails to invoke a crowd. The Emerging Technologies panel at SMTAI drew attendees to explore trends in packaging, nanotechnology, lead-free, the EMS industry, RFID, and wireless technologies. The panel was an opportunity to discuss the various, and sometimes disparate, rapidly developing technologies that affect the surface mount industry.
Future Directions in Packaging at SMTAI
(September 27, 2006) CHICAGO SMT's panel at SMTAI focused on the possibilities and trends opening up in the packaging realm, and the relevant surface mount technologies that accompany them. SMT editor-in-chief Gail Flower moderated the panel, with managing editor Michelle Boisvert to co-chair. The main point that could not be emphasized enough was the effect of 3-D packaging on the industry.
Siemens, Factory Logic Team for Lean Integration
(September 27, 2006) AUSTIN, Texas As part of an OEM agreement, Siemens Automation & Drives (A&D) will integrate Factory Logic's Lean Operations Suite into its SIPLACE manufacturing solutions. This venture targets manufacturers and OEM suppliers looking to integrate lean capabilities on the factory floor.
SMTAI Heads for Warmer Shores
(September 26, 2006) CHICAGO The SMTA International Conference, currently taking place in Chicago, Ill., will move from the windy shores of the Great Lakes to the warm and breezy peninsular state of Florida.
Prices on Raw Materials Rise
(September 25, 2006) CHANDLER, Ariz. Isola Group, S.a.r.l., announced prices in North America will increase in Q'04 2006, a measure used to cover rising costs for raw materials.
EMS Provider Adds Test Machines
(September 22, 2006) MONCHENGLADBACH, Germany Schlafhorst Electronics expanded its test field by adding a SPEA-made flying-probe tester, type 4040 Hi-line. Schlafhorst operates manufacturing sites in Mönchengladbach, Germany and Lubsko, Poland.
SMT/HYBRID/PACKAGING Calls for Tutorials
(September 21, 2006) NUREMBURG, Germany SMT/HYBRID/PACKAGING 2007, an exhibition and conference on system integration in microelectronics, is accepting applications for tutorial presentations in several packaging and assembly fields.
Industry Voices Call for U.S. RoHS
(September 21, 2006) CHICAGO While EU member states adjust to RoHS guidelines, many members of the SMT industry in the U.S. are calling for similar standards domestically. Whether influenced by environmental concerns, component availability issues, global trends, or simply a desire to see laws on manufacturing and disposal standardized across all 50 states, several government, consumer, and industry groups have put forth proposals for RoHS- and WEEE-based documents in the U.S.
ESD Flooring Company Covers Shanghai
(September 20, 2006) Cleveland, Ohio ICS Garland Inc. opened an office in Shanghai, China, which will be under the direction of Nina Tan, COO, ICS Garland. The company will operate manufacturing and marketing for electrostatic discharge- (ESD-) control flooring systems for the Asian region. The high number of electronics facilities manufacturing in China makes the area lucrative for an ESD flooring company, said Tan.
Lithium-ion Battery Woes Continue
By Meredith Courtemanche, assistant editor - - (September 20, 2006) TOKYO A World Travel news release came into the Pennwell offices today, warning that both Korean Air and Australian Quantas Air have banned Dell and Apple laptops on flights. While this might be difficult for business travelers married to their portable offices, it raises more concerns for manufacturer reputation and marketability. Since the Dell recall was announced last month, ramifications have spread.
Cadence Design-in Targets Memory
(September 19, 2006) SAN JOSE, CA Cadence Design Systems, Inc., created the Allegro double data rate 2 (DDR2) design-in intellectual property (IP) portfolio with Altera of San Jose, Calif., and Micron, based in Boise, Idaho, to optimize DDR2 interfaces on PCBs.
Wire Dots Replace Glue on PCBs
(September 19, 2006) Haverhill, Mass. Flextac Wire Dots create a wire-tacking system that replaces quick-set glues to attach jumper wires or pads for engineering change orders (ECOs) to PCBs. The CircuitMedic product consists of precut, thin, flexible polymer film membranes with an electronics-grade, permanent, pressure-sensitive adhesive coating on one side.
Synova Opens 2nd U.S. Micromachining Center
(September 18, 2006) LAUSANNE, Switzerland Synova will open its second U.S.-based micromachining center (MMC) in Boston, Mass., for high-precision electronics manufacturing. Set to open in January 2007, the center will operate in tandem with a West Coast site, under construction in Silicon Valley. Synova will use the facility as a competence center for demonstrations, sample tests, and application development.
Protean's Heimsch to Chair EMS Session
(September 18, 2006) READING, U.K. The director and brand strategy specialist of Protean Marketing, Rich Heimsch, will participate as an industry expert at the 2006 European Supply Chain Convention (ESCC), October 4 5 in Cologne, Germany.
PROMATION Opens Texas Facilities
(September 15, 2006) KENOSHA, Wis. To expand capacity of its automation segment, PROMATION, Inc., completed a move into two production buildings.
Elcoteq and Andrew Broaden Partnership
(September 14, 2006) IRVING, Texas Elcoteq SE and Andrew Corporation signed a global, long-term manufacturing supply agreement that is expected to increase Elcoteq's 2007 net sales by about 80 million euros. Elcoteq will consolidate and manage the supply chain of Andrew's European filter business. The company will also facilitate Andrew's manufacturing and assembly in Mexico, on a turnkey basis.
AAA Names Reps
(September 14, 2006) SAN DIEGO CAPLINQ Nederland became Advanced Applied Adhesives' (AAA's) representative in the Middle East, North Africa (MENA), and Europe, replacing the now-defunct Norel. Located in Amsterdam, the Netherlands, CAPLINQ was founded by Christopher Perabo, who previously held a field applications engineer post with Henkel's Semiconductor Materials division.
Zuken Updates Programs
(September 12, 2006) MUNICH, Germany and WESTFORD, Mass. Zuken released its latest version of CADSTAR 9.0, a desktop PCB-design solution, along with updates to CADSTAR 3D, a version that enables 3-D design.
Valor Acquires Software from EO Tech
(September 12, 2006) YAVNE, Israel Valor Computerized Systems Ltd. acquired numerous technologies from EO Tech GmbH (Switzerland), including software technologies that apply to inspection and test, workflow management, and quality control. EO Tech engineers will also join Valor's operations.
Partnership Generates Board Manufacture Interface
(September 8, 2006) LAKE FOREST, CA and LAS VEGAS Direct Logix and PROMS, Inc., announced a technology partnership that led to the creation of a fully developed, bi-directional interface between applications from the information management and manufacturing solutions suppliers.
MicroFETs Conserve Space, Energy
(September 8, 2006) SOUTH PORTLAND, Maine Fairchild Semiconductor created 11 MicroFET MOSFETs for high-volume portable products. Thermally enhanced, compact, and low-profile, the power switches integrate proprietary Power Trench technology into a 2- × 2- × 0.8-mm molded leadless package (MLP). The line was designed to conserve space in compact, dense end-products.
(September 7, 2006) SANTA CLARA, Calif. Intel provided an overview of its restructuring plan for the long-term future, detailing reductions in workforce, merchandising expenses, capital, and materials to stay competitive in new markets and applications. Intel warns against focusing solely on the competition with AMD, which is "only a piece of this," according to Chuck Mulloy, corporate spokesman for Intel.
Richard L. Appleby Joins Elcoteq as Director of Americas Operations
Appleby's expertise includes management of operations, including manufacturing of desktop, workstation, and notebook computers, original design manufacturing (ODM), New Product Introduction, and supply chain.
IPC, CPCA to Hold Symposium
(September 6, 2006) BANNOCKBURN, Ill. IPC?Association Connecting Electronics Industries, and the China Printed Circuits Association (CPCA) co-announced the third annual Global Board Technology Symposium, "Working Together to Advance Industry Capability," October 13 14, 2006, in Shenzhen, China.
Traceability Solution Aids Automotive Industry
(September 6, 2006) YAVNE, Israel Valor Computerized Systems, in response to rapid growth in technology-integration into vehicles, will target automotive manufacturers with its TraceXpert traceability software. The costs and dangers associated with vehicle recalls can be minimized with implementation of a full traceability system, said Henning Maerkedahl, executive vice president at Valor Denmark R&D.
Isola Group to Reduce Gas Consumption
(September 5, 2006) CHANDLER, Ariz. Isola Group, SARL, a base materials designer, developer, and manufacturer, will soon complete a new energy-self-generation station at its Dueren, Germany, facility.
Eltek Awarded PCB Orders for Medical Equipment
(September 5, 2006) PETACH-TIKVA, Israel Eltek Ltd. received two orders, valued at $1.2 million, for flex-rigid PCBs to be used in advanced medical equipment. The company will deliver the PCBs in Q'04 2006. Eltek has courted high-reliability PCB users in medical, aerospace, and military fields throughout 2006, stating U.S. and European market penetration as part of its corporate roadmap.
DENSO Robotics Selects AMT for Support
(September 5, 2006) ORION, Mich. Applied Manufacturing Technologies, Inc., entered into an agreement with DENSO Robotics of Kariya, Aichi prefecture, Japan, to provide engineering and support services for the company's robots. Midwestern U.S. manufacturers, using DENSO robots, which need immediate service and training, will have access to AMT's 200 engineers.
MicroStencil Names DEK Asia and Americas Distributor
(September 1, 2006) Flemington, N.J. MicroStencil named DEK its sole distributor throughout Asia and the Americas for its fine-pitch stenciling product range, under DEK's Platinum brand. DEK will incorporate the products into its existing stencil technology.
July Book-to-Bill Remains Steady
(August 31, 2006) BANNOCKBURN, Ill. IPCAssociation Connecting Electronics Industries book-to-bill results for the North American PCB industry remained positive at 1.02. The rigid PCB sector held at 1.02, while the flexible circuit industry's ratio was 1.01. A ratio of more than 1.00 signals probable near-term growth, as demand is ahead of supply. The 1.02 ratio suggests modest growth in sales in the coming months, said Denny McGuirk, IPC president.
KIC Updates Thermal Software
(August 30, 2006) SAN DIEGO, Calif. KIC has created version 126.96.36.199 for its KIC 24/7 thermal process monitoring system. The updated version includes bug fixes, improved printing capabilities, oven communication with SEHO reflow ovens, and improved alarm functionality.
Francisco Partners Acquires Universal, Hover Davis
(August 30, 2006) BINGHAMTON, N.Y. Francisco Partners, a technology-focused private equity firm, has signed an agreement with Dover Technologies International to purchase Universal Instruments. The deal also includes the acquisition of Vitronics-Soltec (Stratham, N.H.) and Rochester, N.Y.-based Hover-Davis, Inc., which will be run as separate entities.
VJ's Cabral to Present on Rework
(August 30, 2006) LITTLETON, Mass. Al Cabral of VJ Electronix will present during the "Lead-free Rework Basics" session of the SMTA International Conference in Rosemont, Ill., on September 27, 2006.
PCB Production Up, Shows METI
(August 29, 2006) TOKYO The Ministry of Economy, Trade, and Industry (METI) of Japan released PCB production data for the country's first half of 2006, indicating growth in all areas except flex circuit boards.
BP Microsystems Adds an M
(August 29, 2006) HOUSTON BP Microsystems, a device programming systems supplier, will change its name to BPM Microsystems. After 21 years, the company has decided to change its name, citing confusion with a Houston-based oil company BP Amoco.
Isola Notes Rise in Laminates
(August 29, 2006) CHANDLER, Ariz. Isola Group, designer, developer, and manufacturer of base materials, reported notable growth in lead-free-capable laminates.
Electronics Industry Survey Studies OEMs
(August 28, 2006) SAN JOSE, Calif. Venture Outsource, an electronics outsourcing strategy firm, announced key findings from its online survey, "Eyes on Electronics Outsourcing Industry 2006," noting fast-growing electronics market segments. The survey also found that the majority of OEMs outsource, which helps them reach cycle-time requirements. EMS providers and ODMs find engaging new business areas challenging.
CyberOptics Gathers Products for NEPCON
(August 25, 2006) MINNEAPOLIS CyberOptics Corp. will highlight several products at NEPCON South China taking place in Shenzhen, China, from August 29 through September 1, 2006 including its SE 300 Ultra, EPV 5, and Process Insight.
Pico Demonstrates Rework and Assembly
(August 25, 2006) BERLIN FINETECH will exhibit the FINEPLACER Pico system at NEPCON South China 2006, from August 29 to September 1, 2006, in Shenzhen, China. The Pico on display will be capable of flip chip bonding, rework, and assembly.
Prototyping Station Debuts at NEPCON
(August 24, 2006) SHENZHEN, China ESSEMTEC AG will showcase its EXPERT-SAFP universal prototyping station at NEPCON South China, August 29 through September 1, 2006, in Shenzhen, China.
Test System Highlighted at NEPCON
(August 24, 2006) SHENZHEN, China Seica SpA of Strambino, Italy, will showcase upgrades to its Strategy test system with the Strategy VL at NEPCON South China, August 29 through September 1, 2006, in Shenzhen, China. Seica will promote use of its products for high-reliability industries, particularly automotives.
DEK Expands Online Support
(August 24, 2006) WEYMOUTH, U.K. DEK machine owners can download 3-D engineering models for all company printer subassemblies over broadband Internet, allowing operators to examine components in detail without taking a machine offline, or verify and order parts or upgrades.
Laminating Resins Withstand Lead-free Temperatures
(August 24, 2006) THE WOODLANDS, Texas Huntsman Advanced Materials introduced two halogen-free laminating resins to comply with current regulatory requirements for PCB manufacturing. AZYRAL one- and two-component laminating systems produce a low dielectric constant, low dissipation factor, and volume and surface resistivity.
Adhesives Research Names Market Manager
(August 23, 2006) GLEN ROCK, Pa. Adhesives Research, Inc., an adhesives developer and manufacturer, hired Kirk Lawrence to manage its ARcare division.
SMTAI Hosts Industry-focused Job Fair
(August 23, 2006) ROSEMONT, Ill. The SMTA will host a Job Center at SMTAI bringing local and national companies' information about electronics manufacturing and supply job openings to conference attendees. The SMTA will provide booth space and job listings at the event. Those interested will receive copies of job descriptions that suit them, as well as company contact information.
SMTAI Papers Cover Diverse Topics
(August 23, 2006) HAVERHILL, Mass. and FREEMONT, Calif. SMTAI 2006 will features numerous paper presentations covering diverse and innovative topics within the electronics manufacturing market. Two papers, presented by Stuart Erickson and David Bernard, respectively, include information from dispensing control for conformal coating to detecting popcorning in lead-free BGAs.
SMT Panel Highlights Packaging
(August 23, 2006) NASHUA, N.H. The mantra of faster, smaller, cheaper has never been so relevant as in today's advanced packaging area. University professors, OEMs, and contract assemblers (EMS providers) will discuss methods used for increasing densities (stacking, building more into a chip-scale package, mega-package with many technologies) in a lively and informative panel hosted by SMT Magazine at SMTAI.
Dilbert Creator Keynotes ATExpo
(August 23, 2006) NORWALK, Conn. The Assembly Technology Expo (ATExpo) will feature a keynote address delivered by syndicated cartoonist Scott Adams, creator of Dilbert. Introduced in 1989, the Dilbert cartoon reaches 65 countries through 2,000 news outlets. Adams will open the event with his address at 9p.m., September 26, 2006, at the Donald E. Stephens Convention Center in Rosemont, Ill.
RoHS Troubles Affect Taiwan Industry
(August 22, 2006) TAIPEI, Taiwan Integrated Service Technology (IST), a test and analysis lab in Taiwan, estimates four or five of Taiwan's electronics companies have been disqualified for business within the European Union (EU) for failure to meet RoHS Directive guidelines. The company also stated that the disqualified businesses were fined for failed products. Taiwan's Ministry of Economic Affairs stated that it had received no information regarding RoHS disqualification cases.
IPC Will Move on Battery Standards
(August 22, 2006) BANNOCKBURN, Ill. The IPC Association Connecting Electronics Industries announced that the OEM Critical Components Committee will hold a technical summit meeting to develop standards for lithium-ion batteries. The committee was scheduled to meet about power conversion standards prior to batteries, but will give lithium-ion standards top priority in light of Dell's major consumer recall.
Taiwan's Foxconn, Toyota to Team Up, Report Says
Foxconn Electronics (the registered trade name of Hon Hai Precision Industry Co.), the world's largest electronics manufacturer, plans to enter into a partnership with Asia's largest carmaker, Toyota Motor Corp.
Valor Gains U.S. Personnel
(August 21, 2006) RANCHO SANTA MARGARITA, Calif. Valor Computerized Systems appointed two members to its developing U.S. team. Dan Weitzman became vice president of sales, North America, for the company. Howard Rupprecht was appointed director of marketing.
ACS Moves to U.S. Manufacturing
(August 18, 2006) FARMINGTON, Ark. ACS Technologies, a curing systems manufacturer, will use newly-expanded Lantronic, Inc. to produce its TruCure System line of conveyorized infrared PCB curing systems. Farmington, Ark.-based Lantronic will begin manufacturing Q'01 2007. The company purchased a facility neighboring ACS headquarters. ACS will assist in the transition. Moving our equipment manufacturing to the U.S. for this line is exciting, said David Dye, vice president at ACS.
Eltek Signs U.S. Agreements
(August 18, 2006) PETACH TIKVA, Israel Eltek Ltd., an Iraeli PCB producer, has announced several agreements with high-reliability companies in the U.S. These include a three-year framework agreement with a medical equipment manufacturer, initial orders with a defense company, and positive evaluations by an aerospace manufacturer.
Software Suite Tracks RoHS Compliance
(August 17, 2006) SANTA CLARA, Calif. SigmaQuest, Inc., a product quality management software provider, announced availability of a software suite that aids in conversion, compliance, and due diligence records for OEMs following the European Union's (E.U.'s) RoHS Directive.
PalPilot Opens on East Coast
(August 16, 2006) NASHUA, N.H. PalPilot, a global PCB solutions provider, appointed Marc "Deac" Descoteaux its director of business development for the company's East Coast office. Deac will bring our West Coast offices' experience into opening this location, said Eddy Niu, president of PalPilot.
Universal Creates Software Product Team
(August 16, 2006) BINGHAMTON, N.Y. Universal Instruments, as part of a realigned corporate roadmap, formed a product team dedicated to software products. Greg Benoit will assume the responsibilities of product manager for Universal software products. The company states that increased activity in their software products division led to the creation of a product team.
Flextronics to Challenge Foxconn in Motherboards
Flextronics, which recently acquired the Taiwan-based server motherboard specialist Iwill, will not officially announce the acquisition, remaining reserved about the takeover process, according to sources familiar with the acquisition plan.
SP003-V Stencil Printer Adds Vision
(August 15, 2006) GLASSBORO, NJ ESSEMTEC AG, an SMT production equipment manufacturer, updated its SP003 semi-automatic stencil printer to the SP003-V with vision. The available vision system supports faster control and alignment correction, according to the company. Print alignment is accomplished by clearance-free, fine-pitch thread screws. Other print parameters are adjustable as well.
Battery Cell Causes Recall
(August 15, 2006) ROUND ROCK, Texas In cooperation with the U.S. Consumer Product Safety Commission, along with other global regulatory agencies, Dell Inc. will voluntarily recall approximately 4.1 million Dell-branded lithium-ion batteries. The lithium-ion cells, manufactured by Sony, can potentially start a fire within the computer's circuitry. Affected batteries were distributed over two years, from April 1, 2004 July 18, 2006.
Shenzhen Office Services Offshore Customers
(August 14, 2006) WESTMORELAND, N.H. Polyonics Inc, which manufactures harsh-environment labels and industrial product markings, opened an office in Shenzhen, China. The company operates a U.S. facility in New Hampshire, and Asian offices in Shanghai, China; and Singapore.
ZESTRON Expands in Asia/Pacific
(August 14, 2006) ASHBURN, Va. ZESTRON's Asia/Pacific office, opened in 2004, has relocated to a 3,000 sq. ft. building.
Epoxy Company Expands in China
(August 14, 2006) HONG KONG Dow Epoxy, a business unit of the Dow Chemical Company, plans to invest more than $200 million in manufacturing and R&D facilities in China over the next five years. Four facilities will be either constructed or expanded in a targeted local market investment. Dow Epoxy currently operates 10 manufacturing facilities, including its Zhangjiagang, Jiangsu Province, China location.
Cookson Technology Group Solves Assembly Issues
(August 11, 2006) JERSEY CITY, N.J. Cookson Electronics Assembly Materials announced it has established a global applications technology and engineering group, which joins its global R&D group. This effort formally integrates the company's field engineer network knowledge base into its internal applications structure. The global technology group will help Cookson's customers in solving assembly technology, yield, and reliability problems.
DDi Invests in Core PCB Operations
(August 10, 2006) ANAHEIM, CA DDi Corp. announced two transactions designed to boost its PCB engineering and manufacturing services sale of their assembly business and acquisition of Sovereign Circuits, Inc., from North Jackson, Ohio. The company has also implemented a series of related changes in 2006 to improve capital structure, divest certain European operations, and refocus management.
iNEMI Considers Medical Electronic Standards
(August 10, 2006) HERNDON, Va. The International Electronics Manufacturing Initiative (iNEMI) will develop test and usage condition guidelines to assess reliability in medical devices. The Medical Components Reliability Specifications Project, organized by the consortium's Medical Technology Integration Group (TIG), is being presented to the iNEMI technical council today, August 10, 2006.
Companies Create Laser Reflow System
(August 10, 2006) LINCOLN, R.I. The Solder Paste business group of EFD, Inc., and Leister Technologies, LLC, will cooperatively promote their automated solder paste reflow system, said to cut soldering times by nearly 80% over traditional wire and iron soldering methods.
Heatsinks Cool Freescale Processors
(August 9, 2006) NORWOOD, Mass. Two heatsink solutions, developed over the course of a year by Advanced Thermal Solutions (ATS), feature aluminum fins that exploit all available air. "Although they were originally developed for Freescale MPC 8641D dual-core processors, both are available to the open market for applications with similar thermal management requirements," said Ray Santos of ATS. The Juneau and Anchorage heatsinks are members of the Alaska line.
Mild Cleaner Extends Contact Times
(August 9, 2006) ASHBURN, Va. ZESTRON America introduced the VIGON A 200+, an updated VIGON product based on the company's MPC technology. The cleaning agent specifically developed for low- and medium-pressure spray-in-air processes allows for long exposure times without detrimental effects on materials or solder joints.
Proxy Appoints Operations Manager
(August 8, 2006) METHEUN, Mass. Proxy Manufacturing, a contract manufacturer (CM), named Steve Cahalane operations manager. Cahalane's responsibilities will include supervising plant activities and managing company expansion.
Qualitek Chooses Midwest Representative
(August 8, 2006) ADDISON, Ill. Terry Jeglum and Electronic Technology Corporation (ETC), of St. Charles, Ill., will represent Qualitek in Wisconsin and Illinois.
IPC Workshop Examines Lead-free Finishes
(August 8, 2006) BANNOCKBURN, Ill. The IPC workshop, "Lead-free Surface Finishes and Compatibility to Lead Free Soldering: The Road to RoHS Compliance," will give attendees insights into the effect of lead-free surface finishes on solderability and reliability. Topics will include co-planarity, solder paste spreadability, thru-holes, and more. Higher solder melting points that cause heat stress and aging will also be examined.