Article Highlights
Solder Printing Process Inputs Impacting Distribution of Paste Volume
12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
Tips & Tricks: Generating Stencil Tooling
12/13/2017 | Ken Horky, Peterson Manufacturing
Improving Solder Paste Printing
12/12/2017 | Stephen Las Marias, I-Connect007
Insights from productronica
12/07/2017 | Dieter G. Weiss, Weiss Engineering
What Matters Most is Communication
12/04/2017 | Stephen Las Marias, I-Connect007

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Foxconn Says it Will Maintain Annual Growth of 30% through 2011

Foxconn Electronics (the registered trade name of Hon Hai Precision Industry) is confident that the company will attain annual revenue growth of 30% over the next five years with consolidation and acquisitions serving as the key growth drivers

Board of Directors Instated

(June 15, 2006) SAN DIEGO, Calif. — Advanced Applied Adhesives (AAA) announced the appointment of its Board of Directors, consisting of five executives from the industry: Ron Benham, John Boruch, William Dawson, Frank Husson, and John Thompson.

Letter Re: "Industry Steps Up to Make the World A Bit Cleaner" or "Who's Responsible for the Lead-Free Mess"?

We are quite concerned about long term reliability of the solder connection, and have only considered this move on products that don't have as stringent an environmental requirement

OEM Software Reaches U.S. Availability

(June 14, 2006) OOSTERHOUT, The Netherlands — Adeon Technologies BV appoints Christopher Associates, Calif., as their North American distributor, extending their global coverage, especially with regard to the CXInsight.

Board Designer Suite Updated

(June 14, 2006) SYDNEY, Australia — The Altium Designer 6.3 from Altium Limited includes updates said to ease transitions from board design, or embedded board design, to super system design.

Harsh Environments Workshop Focuses on End-users

(June 14, 2006) INDIANAPOLIS, Ind.— The SMTA and Auburn University present the Harsh Environment Electronics Workshop, July 19-20, at the Crowne Plaza Hotel.

Vapor Phase System Intros in North America

(June 14, 2006) KONIGSBRUNN, Germany — The vapor phase soldering process enables thermal control and low ΔT's across complex circuits. A-tek will distribute the Asscon Vapor Phase Technology, from Asscon System Technik, Königsbrunn, Germany, to the North American market.

EPIC Technologies' Sammut and Lipp Honored

(June 13, 2006) ROCHESTER HILLS, Mich. — John Sammut, president and CEO, and Jochen Lipp, vice president and COO of EPIC Technologies, received the Ernst and Young Entrepreneur of the Year 2006 Award in the Technology category of the Central Great Lakes region.

Fairchild Launches Brazil Design Center

(June 13, 2006) SOUTH PORTLAND, Maine — With the addition of its São Paulo, Brazil facility, Fairchild Semiconductor reaches nine Global Power Resource design centers worldwide. This Brazil facility will service the growing South American high-tech market, which is predicted to experience 14% growth in 2006 and nearly 10% in 2007, according to one report.

OMRON Production Begins in Shanghai

(June 12, 2006) KYOTO, Japan — OMRON Corporation celebrated the completion of OMRON (Shanghai) Co., Ltd. (OMS), a subsidiary in Shanghai, China, with a ceremony on June 6th, 2006. OMS will serve as the global design and production center for their control components and systems equipment from Shanghai to manufacturing sites around the world, while contributing to the development of the manufacturing industry in China.

APEX Call for Participation Deadline Approaches

(June 9, 2006) BANNOCKBURN, Ill. — The July 17th deadline for abstract submissions to the 2007 IPC Printed Circuits Expo, APEX, and Designers Summit is fast approaching.

Taiwan Chip Makers Hit 266.5B in '05

(June 8, 2006) DUBLIN, Ireland — The growing portable consumer electronics and personal computing sectors have been driving chip component production in the Greater China region. Demand for these devices requires manufacturers to ramp-up production. In China alone, component output is forecast to increase 20% by year's end, shows China Sourcing Report.

LED Technology Developer Moves to Lead-free

(June 7, 2006) ORLANDO, Fla. — Lighthouse Technologies Limited upgraded its manufacturing facility to meet the environmental stipulations of the EU RoHS Directive.

Surface Mount Fuse Intros for Telecom

(June 7, 2006) SANTA ROSA, Calif. — The RoHS-compatible TF 600 Series fuses are designed to assist manufacturers of telecommunications equipment in meeting North American power cross and lighting-surge requirements.

Snap-in Panel-mount LEDs Improve Visibility

(June 7, 2006) TORRANCE, Calif. — The construction of the PP156 Series Daylight Visible Dome Lens Lights can improve a user's range of visibility, even when used in direct sunlight, claims manufacturer LEDtronics.

Downloadable RoHS Certificates of Compliance

(June 6, 2006) CHICAGO — Newark InOne announces the availability of RoHS Certificates of Compliance (C of C) on its Website:

Global Agreement Broadens Connector Distribution

(June 6, 2006) THIEF RIVER FALLS, Minn. and ETTERS, Pa. — Connector and interconnect systems manufacturer FCI and distributor Digi-Key Corporation announced a global distribution agreement.

Laser-cutting System Targets SMT Stencils

(June 6, 2006) GARBSEN, Germany — The MultiCut laser-cutting system from LPKF Laser & Electronics is available for SMT solder paste stencils and other small metal parts.


(June 6, 2006) NUREMBURG, Germany — With 579 exhibitors, 76 represented companies, and 502 conference attendees, SMT/HYBRID/PACKAGING 2006, Nuremburg, closed on June 1st as nearly the largest SMT/HYBRID/PACKAGING show, claims conference officials.

Lead-free Solder Is No-Clean and Water Washable

(June 5, 2006) BRANFORD, Conn. — The LF-4300 from AMTECH Inc. is a RoHS-compliant, lead-free solder paste featuring multi-process capabilities for water-washable and no-clean applications.

VCXOs Offer Low Phase Noise

(June 2, 2006) MIAMI — The expanded family of RoHS-compliant, ultra-high- and high-frequency voltage-controlled crystal oscillators (VCXOs) from Raltron Electronics Corp. features low phase noise with pull up to 1,000 ppm available at some frequencies.

Tomography System Uncovers Ancient Secrets

(June 2, 2006) HERTS, U.K. — X-Tek Systems is using its imaging equipment to uncover the use of a mysterious calculation device discovered in a shipwreck in the Greek islands. The company is using the equivalent of its body scanner to determine the secrets behind the Antikythera Mechanism, a 2,000-year-old astronomical calculation device that is possibly more advanced than any other mechanism for at least a thousand years after its manufacture in about 100 B.C.

Programming Software Raises Throughput

(June 2, 2006) HOUSTON — Featuring increased throughput on 7th-generation automated programming systems, BP Win 4.60 software from BP Microsystems can change site-sequence-prioritization routine, reportedly allowing an autohandler to pick-and-place parts economically.

DENSO Moves Electronic Division, Builds Facility

(June 2, 2006) TOKYO — DENSO Corporation will build a facility on its Agui Plant premises (located in Agui-cho, Chita-gun, Aichi prefecture, Japan), relocating its DENSO ELECS Co., Ltd., headquarters and electronics product manufacturing plant from the DENSO Takatana Plant in Anjo Aichi prefecture.

Conveyors Cool PCBs After Wave Soldering

(June 1, 2006) FALL RIVER, Mass. — Featuring a static-dissipative, snap-link belt with full-surface ribs to increase cooling, the Hump-back conveyor system from SmartMove Conveyors handles hot PCBs exiting a wave solder machine.

SMTAI Summit Addresses Emerging Technologies

(June 1, 2006) MINNEAPOLIS — New technologies are continuously being implemented into the electronics industry. To remain at the forefront of emerging trends, the SMTA organized the Emerging Technologies Summit, which will take place at SMTA International and Assembly Tech Expo (ATExpo), September, 24–28, 2006, in the Donald Stephens Convention Center, Rosemont, Ill.

Machine Neutrality Is Benefit of Lead-free Control Solution

(May 31, 2006) YAVNE, Israel — The TraceXpert solution from Valor Computerized Systems delivers a full lead-free environment control platform said to cover all machine makes and models.

IPC Posts April Book-to-Bill Ratio

(May 30, 2006) BANNOCKBURN, Ill. — The North American rigid PCB book-to-bill ratio for April 2006 remained positive at 1.08, while the flexible circuit book-to-bill ratio fell to 0.87. The IPC reports a combined book-to-bill ratio of 1.07 for April.

Micro-air Dispensers Enable Accuracy and Repeatability

(May 30, 2006) GARDEN GROVE, Calif. — The DX-200 digital dispenser/controller from OK International offers an operating pressure of 0–100 psi for general dispensing applications, while the DX-215 operates at 0–15 psi for low-viscosity fluids.

Shelf-stable Adhesive Withstands Severe Conditions

(May 30, 2006) HACKENSACK, N.J. — The Supreme 10HTFL one-component, flexible, epoxy resin-based adhesive/sealant from Master Bond features extended ambient temperature storage capabilities and an extended shelf life without refrigeration prior to use.

Bench-top Reflow Oven Ensures Even Heating

(May 26, 2006) WILSONVILLE, Ore. — With a maximum process temperature of 320°C, the bench-top LPKF ProtoFlow Oven from LPKF Laser & Electronics is suitable for lead-free reflow soldering.

Technical Forum Addresses RoHS Queries

(May 26, 2006) CHELMSFORD, Mass. — Although the July 1, 2006 RoHS deadline is just weeks away, manufacturers still have questions regarding compliance. To answer questions leading up to the deadline, Intelligent Manufacturing Solutions (IMS), in association with Arrow Electronics, present Time's up! What do we do now? A RoHS Compliance Symposium, on June 13, 2006, at the Radisson Hotel, Chelmsford, Mass.

SWEMCO Achieves International RoHS Compliance

(May 25, 2006) MOORESTOWN, N.J. — Contract manufacturer (CM) SWEMCO has earned QC 080000 certification, an international standard for RoHS compliance.

Surface Mount Inductor Meets High-Q Requirements

(May 25, 2006) GOWANDA, N.Y. — The SMT 2920 encapsulated, surface mount toroidal inductor from Gowanda Electronics is molded for durability and shielded for use around magnetic fields. The first in a series of surface mount inductors, the SMT 2920 can tolerate operating temperature changes within the -55°–105°C range, and targets RF applications, specifically those with high-Q requirements.

Siemens Nabs 'Company of the Year' Award

(May 25, 2006) ORLANDO, Fla. —Frost and Sullivan named Siemens its 2006 Company of the Year for its automation solutions for the automotive industry. Presented on April 26, 2006, at Frost & Sullivan's 2006 Excellence in Industrial Technologies Award Banquet in Orlando, Fla., the award recognizes Siemens for providing its automotive customers with value-added solutions specific to customer needs.

Quick-turn PCB Maker Honored for Green Standards

(May 24, 2006) AURORA, Colo. — For the third year in a row, Advanced Circuits was awarded a Gold Award from the Metro Wastewater Restoration District (MWRD) of Colorado, recognizing the company's efforts to minimize pollution and waste by transporting spent materials to off-site locations for recycling.

Patented Electroformed Stencil Takes Lead in Study

(May 24, 2006) COLORADO SPRINGS, Colo. — Results from a print-process study conducted in February 2006 by Universal SMT Laboratories (Binhamton, N.Y.) show that Photo Stencil's AMTX E-FAB stencil performed best out of 12 stencils tested, provided by five different stencil makers.

ASSET, Firecron Launch JTAG Proof-of-Concept System

(May 23, 2006) RICHARDSON, Texas — ASSET InterTech Inc. and Firecron LTD will demonstrate System-level JTAG (SJTAG) test and programming in a proof-of-concept system at the European Board Test Workshop, May 24–25, 2006, in Chilworth, Southampton, U.K.

SMART Group Recognizes Its Fellows

(May 23, 2006) BIRMINGHAM, U.K. — During NEPCON NEC, Pete Swanson announced the winners of the 2006 SMART Fellow Award, which is bestowed on individuals to thank them for their active participation in advancing the aim of the SMART Group throughout that year.

TFI Names Director of Research and Consulting

(May 23, 2006) ALAMEDA, Calif. — Technology Forecasters Inc. (TFI) appointed Bruce Rayner as head of research and consulting, succeeding Eric Miscoll, who will move to vice president of strategy for TFI client Texas Prototypes (TXP).

Concentration Limits, Marking Standards Set for China RoHS

(May 22, 2006) SHANGHAI, China — Two standards within China's RoHS Directive — a standard on 'Concentration Limits' of hazardous substances; and a 'Marking' standard used to indicate hazardous substance content and the safe-to-use period and packaging material, are ready for approval from the Ministry of Information Industry (MII).

Part List Management Tool Option for CADSTAR Available

(May 22, 2006) MUNICH, Germany, and WESTFORD, Mass. — Zuken and U.K.-based Quadra Solutions have teamed to launch starturn, a part list management option for Zuken's CADSTAR desktop PCB design software.

A Collision of Values

While assuming a chemical to be innocent until proven guilty has a powerful resonance with the US sense of justice in human affairs, it is a poor model to use for toxicity

Benchmark Electronics Names Board Member

(May 18, 2006) ANGLETON, Texas — Benchmark Electronics, Inc. named Douglas G. Duncan to its Board of Directors as an independent director, effective immediately.

Adhesive Film Adheres to Multiple Substrates

(May 17, 2006) BILLERICA, Mass. — The T2781 thermally conductive, electrically insulating, high-strength adhesive film from TechFilm Services, Inc. is said to adhere well to gold, copper, and aluminum. Adhesion to copper and aluminum reportedly exceeds 2500 psi, while gold values exceed 1200 psi.

Automated Device Programmer Reduces Human Errors

(May 16, 2006) REDMOND, Wash. — The FLX500 self-contained, automated device programming system from Data I/O Corp. features a language-independent touch-screen user interface, which can eliminate operator training and errors.

Barcode Traceability Added to Reflow Soldering

(May 16, 2006) FRANKLIN, Mass. — A barcode traceability feature is available on the OmniExcel series reflow soldering systems from Speedline Technologies.

Calls to Throw Out RoHS Unnecessary

The author claims definitive scientific evidence of no harm from the burning of plastics and no leaching of lead from solder. This is completely contrary to my understanding

Using the Area Ratio Calculator for Stencil Design

The issue addressed here is what can be done at the stencil design level to minimize printing defects. All too often, a bad aperture design can cause printing defects resulting in opens, insufficients or shorts

iNEMI Takes Roadmap Workshop to Shanghai

(May 15, 2006) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) will hold a 2007 Roadmap workshop in Shanghai, China, in tandem with the High-density Microsystem Design and Packaging and Component Failure Analysis in Electronics Manufacturing (HDP) 2006 conference. The half-day workshop will take place June 27, 2006, on the Yan Chang Campus of Shanghai University.

COMET Boosts X-ray Inspection Services Worldwide

(May 15, 2006) GARBSEN, Germany — COMET is enhancing its X-ray inspection service capabilities to include full on-site service for high-volume inspection and real-time web interface from one of COMET's global test and inspection centers, targeting manufacturers and OEM customers.

Solectron Upgrades Facility

(May 12, 2006) WILMINGTON, Mass. — Solectron Corp. upgraded its Wilmington, Mass., manufacturing facility capabilities to focus on new product introduction (NPI) and low-volume, high-mix (LVHM) manufacturing services. Coined FinePitch Technology, the operations, also located in Solectron's Fremont, Calif., facility, provide prototyping and NPI solutions to ease time-to-market and LVHM manufacturing services.

Aluminum Label Stock Suits Thermal Transfer Printing

(May 12, 2006) WESTMORELAND, N.H. — The XF-803 aluminum label material with permanent pressure-sensitive adhesive and high-opacity, white topcoat designed for thermal transfer printing on aluminum labels is now available from Polyonics Inc.

Tyco, Graphic Solutions Roll Out Joint RFID Solution

(May 10, 2006) HARRISBURG, Pa. — A customized assembly system for radio frequency identification (RFID) inlay is in development by Tyco Electronics' Global Application Tooling Division (GATD) and Burr Ridge, Ill.-based Graphic Solutions International, LLC (GSI). The system will assemble semiconductor chips, surface mount devices (SMDs), and printed batteries onto a continuous web of printed antennas, adding RFID capability to tags and labels.

BGA Socket Accommodates 1.00-mm-pitch Devices

(May 10, 2006) WEST WARWICK, R.I. — The Flip-Top ball grid array (BGA) socket series from Advanced Interconnections Corp. develops, tests, and validates 1.00-mm-pitch BGA and land grid array (LGA) devices at speeds up to 2.6 GHz (single-ended). Its compact design requires no soldering of the integrated circuit (IC) and needs no external hold-downs or tooling holes in the PC board.

Seminar Series Clarifies Lead-free

(May 10, 2006) STRATHAM, N.H. — Three lead-free RoHS seminars co-hosted by Stratham, N.H.-based Vitronics Soltec and Des Plaines, Ill.-based Kester will take place in June, and will be held in three different locations across the U.S. Each one-day seminar aims to help the North American electronics manufacturing industry get answers to lead-free assembly questions, as well as ease the transition to lead-free and RoHS.

TV Program Spotlights DDi PCB Technology

(May 9, 2006) ANAHEIM, Calif. — PCB engineering and manufacturing services provider DDi Corp.'s advanced laser technology will be featured on the History Channel's "Modern Marvels: Drilling" program, to air May 10, 2006, at 10:00 p.m. Eastern/Pacific (9:00 p.m. Central/8:00 p.m. Mountain), which enables some semiconductor, networking, telecommunications, and consumer electronics companies worldwide to bring their products to market.

IPC, HKPCA Join Forces in Conference

(May 8, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and the Hong Kong Printed Circuit Association (HKPCA) are coming together to produce the first Executive Market and Technology Forum conference, June 13–14, 2006, at the Harbour Plaza Hotel in Hong Kong. Both associations expect more than 100 attendees from the PCB, electronics assembly, and other electronics manufacturing industries.

Stencil and Misprint Cleaner Suits Ultrasonic Cleaning

(May 8, 2006) RANCHO CUCAMONGA, Calif. — Simple Green stencil and misprint cleaner from Aqueous Technologies is designed for use in immersion stencil cleaning systems such as ultrasonic stencil cleaners, and is also available in a trigger spray for manual stencil cleaning applications.

Ultra-small Switches Allow Several Mounting Options

(May 5, 2006) HARRISBURG, Pa. — The SPDT switches, part of the ALCOSWITCH brand ultra-miniature microswitches from Tyco Electronics, offer life-cycle ratings up to 1 million cycles, and are available in two current ratings for power switching up to 3 A.

iNEMI U.S. Roadmap Workshop Nears

(May 5, 2006) HERNDON, Va. — The International Electronics Manufacturing Initiative's (iNEMI's) 2007 Roadmap workshop is scheduled for May 17, 2006, at iNEMI's Herndon, Va., headquarters. Open to members and non-members, the registration deadline is May 12th.

EAS Adds Lead-free Wave Soldering

(May 4, 2006) ELK GROVE VILLAGE, Ill. — Electronic Assembly Services, Inc. (EAS) purchased Technical Devices' NU/ERA 16MP lead-free, computer-controlled, dual-wave soldering system, adding to its lineup of lead-free-capable assembly equipment.

Reciprocating Platform Runs Automatically

(May 3, 2006) ASTON, Pa. — A reciprocating linear motion platform from Amacoil, Inc., uses a rolling ring drive that reciprocates automatically without requiring motor reversal.

Placement Verification Tool Uses Laser-cut Process

(May 3, 2006) COLORADO SPRINGS, Colo. — The AccuCheck ESD inspection template from Photo Stencil uses a laser-cut process for component verification and pin placement, reportedly providing a cost-effective alternative to automated optical inspection (AOI) equipment.

Hover-Davis Launches Direct Products Division, Co-founder Retires

(May 2, 2006) ROCHESTER, N.Y. — Hover-Davis Inc. established a Direct Products Division, led by Roland Heitmann, to provide feeding products and services to its OEM partners and direct customers.

Henkel Names Product Manager for Die Attach Line

(May 2, 2006) IRVINE, Calif. — The electronics group of Henkel promoted Michael Buckley to Global Product Manager for Die Attach.

Irresistible Force Meets Immovable Object - A Lead Free Essay

The enforcement agencies of the twenty-five EU Member States appear to be on the horns of a dilemma - whatever they do, there will be an indescribable collision

RoHS-compliant Adapter Allows SOIC Upgrade

(May 1, 2006) FRENCHTOWN, N.J. — A RoHS-compliant, small-outline integrated circuit (SOIC) to dual in-line package (DIP) Correct-A-Chip adapter from Aries Electronics is said to ease upgrading from an SOIC without requiring PCB layout adaptations. The top of the adapter accepts SOIC D or L packages, while the bottom is available in 8–24 DIP pin counts.

March Book-to-Bill Remains Steady

(May 1, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' March 2006 North American rigid PCB industry book-to-bill ratio continued its positive trend at 1.14, while the flexible circuit book-to-bill ratio declined slightly to 0.94, for a combined industry book-to-bill ratio of 1.13.

IPC Issues Air Moving Device Standard

(April 28, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries published the first in a series of standards on critical components for the computer and telecom industries.

Flextronics Releases Q4, Year-end Earnings

(April 28, 2006) SINGAPORE — Flextronics released the results of its fourth quarter and fiscal year, ending March 31, 2006, noting focused efforts on potential growth opportunities in its core EMS business.

A-Tek Distributes Controlled Humidity Storage Systems

(April 27, 2006) FORT COLLINS, Colo. — A-Tek added Drytech's (Taipei, Taiwan) range of controlled humidity storage systems for electronics packages and sensitive devices to its portfolio. These electrostatic discharge (ESD) compatible systems, which meet IPC/JEDEC Standard J-STD-033A, range in size from from 100 to over 1700 L.

Measurement Platform Configures for Broad Application Range

(April 26, 2006) BEAVERTON, Ore. — The flexible M150 device measurement platform from Cascade Microtech measures DC to 220 GHz for 150-mm semiconductor wafers, ICs, PCBs, microelectromechanical systems (MEMS), and bioscience devices on one platform.

IPC Issues APEX '07 Call for Participation

(April 26, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries invites abstract submissions for the 2007 IPC Printed Circuits Expo, APEX, and the Designers Summit, slated for February 20–22, 2007, in Los Angeles.

Cookson Completes Polyclad Sale

(April 25, 2006) LONDON — Cookson Group plc completed its previously announced sale of its materials science business, Polyclad Laminates, Inc., to Isola Group, Sarl, for US$91 million, on April 21, 2006.

Capitol Hill Day Supports Electronics Manufacturing

(April 25, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' annual Capitol Hill Day will be held June 14, 2006, in Washington, D.C., allowing attendees to meet with members of Congress to discuss critical industry issues and promote growth and manufacturing.

Solectron Facility Earns QA Certification

(April 24, 2006) MILPITAS, Calif. — Solectron Corp. certified its Bordeaux, France, plant to EN 9100:2003 standards, targeting the aerospace industry, with a specific focus on product safety and reliability. Solectron received the certification, which is equivalent to AS 9100 Revision B standards, for its design, new product introduction (NPI), manufacturing, and test activities.

Method Enables Temperature-sensitive Component Mounting

(April 20, 2006) RISHON LE-ZION, Israel — A proprietary packaging method allows temperature-sensitive components such as memory ICs and relays to be surface mounted using reflow soldering — despite being sensitive to exposure to high temperatures for long periods.

Celmer Named Multisorb CEO

(April 20, 2006) BUFFALO, N.Y. — Multisorb Technologies International appointed Mark E. Celmer to chief executive officer (CEO), a role he assumes in addition to that of president.

Advanced Applied Adhesives Selects COO

(April 20, 2006) SAN DIEGO — Advanced Applied Adhesives (AAA) appointed Stephen W. Munson to chief operating officer (COO).

Workshop Assists with Tin Whisker Prevention

(April 19, 2006) HERNDON, Va., and PISCATAWAY, N.J. — The International Electronics Manufacturing Initiative (iNEMI), together with the IEEE Components, Packaging, and Manufacturing Technology Society (CPMT), will sponsor the 3rd Annual Tin Whisker Workshop and the 56th Electronic Components and Technology Conference (ECTC), May 30, 2006, in San Diego, Calif.

Southwest Electronics Production Expo Debuts

(April 19, 2006) DALLAS — The Southwest Electronics Production Exposition (SWEPEX), which demonstrates electronics production equipment and services, is scheduled for November 14–15, 2006, in Plano, Texas — targeting the southwestern U.S. components and assembly market.

Flextronics to Sell Software Business

(April 18, 2006) SINGAPORE — Flextronics International Ltd. announced the sale of its software development and solutions business to an affiliate of Kohlberg Kravis Roberts & Co. (KKR). The deal, which is worth about $900 million, is also expected to bring Flextronics a gain of more than $600 million in cash consideration upon closing.

RoHS-compliant SMDs Geared to Auto Market

(April 17, 2006) MENLO PARK, Calif. — A series of compact RoHS-compliant PolySwitch surface mount DC-DC converters (SMDCs), surface mount device (SMD) terminals, and polymeric positive temperature coefficient (PPTC) devices from Raychem Circuit Protection, a business unit of Tyco Electronics, provide resettable overcurrent protection in space-critical applications.

Inline Laser Marker Available

(April 14, 2006) OULUNSALO, Finland — The inline J502-22 Laser Marker from Elektrobit Group Plc prints barcodes, 2-D codes, text, and graphics using various materials automatically at 400 characters/second. A 1064-nm, 5-W YAG laser with an 80-µm laser spot size delivers 400 dots per inch (dpi) marking resolution. Pneumatic cylinders and side clamps are said to precisely position PCBs.

RoHS-compliance Workshop Answers Assembly Questions

(April 13, 2006) HANOVER, N.H. — Ron Lasky, Ph.D., PE, senior technologist at Indium Corp., and visiting professor at Dartmouth College, presented a workshop titled, "Rapid Implementation of RoHS Compliant Assembly" for area OEMs, EMS providers, and suppliers.

IR Tool Eases Thermal Profiling

(April 13, 2006) WEST SUSSEX, England — Thermal profiling for rework can often be a time-consuming and risky venture. To help alleviate this, Focused Infrared (Focused IR) technology from PDR, uses infrared light energy to bring a board and components to a temperature that melts the solder, but does not damage parts.

Henkel Asia-Pacific Operations Undergo Personnel Changes

(April 12, 2006) IRVINE, Calif. — Some strategic organizational appointments at the electronics group of Henkel's Asia-Pacific operations aim to propel the company's growth in that region, particularly in delivering advanced technology solutions for high-volume production applications.

Mobile Services Allow Capability Testing On-site

(April 12, 2006) HUDSON, N.H. — Mobile metrology service from CeTaQ Americas brings machine capability analysis (MCA) testing and verification services to the manufacturer's facility, and performs equipment verification services and analysis on-site. This portability is said to bring accuracy and immediate solutions to an out-of-control process or an out-of-calibration production machine.

IPC Prepares Industry for RoHS Compliance

(April 12, 2006) BANNOCKBURN, Ill. — In a dash to comply with the July 1, 2006, RoHS Directives deadline, IPC–Association Connecting Electronics Industries, in conjunction with ERA Technology Ltd. and eco3, offers a few tools to ease the transition, such as a materials declaration management document, RoHS audit forms, and a CD that walks through the RoHS Directives.

Shimadzu Scientific Publishes White Paper Outlining RoHS Compliance Requirements s

The paper offers guidance and tips for the many organizations that have yet to properly comply with the European Union's Restriction of Hazardous Substances (RoHS) regulations

Photo Stencil, Novatec Enter Distribution Partnership

(April 11, 2006) COLORADO SPRINGS, Colo. — Photo Stencil and Montauban, France-based Novatec, a research laboratory that develops technologies for the electronics assembly industry, have teamed to distribute Novatec's VacuNest underboard support product throughout North America.

AOI System Suits High-volume Production

(April 11, 2006) SAN CLEMENTE, Calif. — The M1 automated optical inspection (AOI) system from YESTech features a small footprint and board handling system that adapts quickly to pre- or post-reflow inspection and various rework and data tracking scenarios.

Pick-and-Place Upgrade Boosts Throughput

(April 10, 2006) EINDHOVEN, The Netherlands — The Speedpack upgrade package from Assembléon reportedly increases output of the company's surface mount device (SMD) pick-and-place machines by up to 15%, and improves line balancing — increasing AX5 system speeds from 94,300 to 110,000 components per hour (cph).

Aegis Wins Company of the Year Award in SMT Software

(April 7, 2006) PALO ALTO, Calif. — Aegis Industrial Software Corporation recently nabbed the Company of the Year Award in SMT software from Frost & Sullivan for its part in aiding clients through the challenges of the lead-free manufacturing transition.

SMTA Workshops Abound in May

(April 7, 2006) MINNEAPOLIS — May is a busy month for the SMTA with two upcoming events: the Medical Electronics Symposium, slated for May 15–17 in Bloomington, Minn., and the "Rapid Implementation of WEEE and RoHS Compliant Assembly Workshop," May 18th, in St. Paul, Minn.

Richard Heimsch Joins Protean Marketing

(April 6, 2006) WEYMOUTH, DORSET, U.K. — Richard Heimsch, DEK International president, and a marketing communications and brand strategy veteran, joins Protean Marketing Communications Ltd. team.

SAW Filters, Resonators Available as SMDs

(April 6, 2006) ISELIN, N.J. — These SAW filters and two-port resonators from EPCOS are now available as SMDs in ceramic packages on quartz substrate with a 3 × 3-mm footprint. Insertion height in both measures 1.0 mm.

Test Solution Handles Multiple Board Designs

(April 6, 2006) STEVENSVILLE, Md. — The JTAG ProVision tool from JTAG Technologies is said to speed and facilitate developing boundary-scan applications based on the IEEE 1149.x standards, enabling engineers to achieve test coverage and in-system programming objectives. JTAG ProVision handles all complexity levels, from single boards with one or more Test Access Ports (TAPs) through complex, multi-board configurations.

IPC Elects Technical Volunteer Chairman

(April 5, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries elected Don Dupriest to chairman of the IPC Technical Activities Executive Committee (TAEC), a technical body within the organization focused on technical policy and procedure matters. He succeeds Bob Neves of Microtek Laboratories. All TAEC leaders are industry volunteers, and TAEC members vote to select the TAEC chairperson for a two-year term.

Valor Names President of Asia Operations

(April 5, 2006) SHANGHAI, China — Valor Computerized Systems appointed Ong Kay Huat as president of Valor Far East, its Asia subsidiary. In this position, Ong will head Valor's operations in Asia, aiming to drive the company's penetration in the region, develop sales channels, and build professional relationships with customers and partners.

Investing in Engineering Students

(April 4, 2006) AURORA, Colo. — North American university students are using Advanced Circuits' FreeDFM for school projects. Professors at several engineering schools are requiring students to upload Gerber files to the service to help with design flaws and to check on manufacturability. FreeDFM checks to make certain that all files and data are in place before building a PCB.

Translators Ease Move to PCB Design Solution

(April 4, 2006) WILSONVILLE, Ore. — A series of translators that facilitate the transition from Protel, P-CAD, and OrCAD designs and libraries to PADS PCB design solutions are available from Mentor Graphics Corp. The translators are said to transfer current libraries, databases, and other existing legacy data over to PADS easily with minimal data and time loss. PADS is a Windows-based standard for PCB design solutions.

China RoHS Compliance Services Available

(April 3, 2006) OTTAWA, Ontario — Ageus Solutions' China RoHS compliance services provide guidance and services to meet the pending material restrictions and declaration requirements for electrical and electronic products being sold into China. A detailed process analyzes the requirements for each company, aiming to provide a detailed, comprehensive path going forward.

DEK to Spotlight Portfolio at SMT/Hybrid/Packaging

(April 3, 2006) FLEMINGTON, N.J. —DEK will showcase its products and processes at the SMT/Hybrid/Packaging exhibition, May 30–June 1, 2006, in Nuremberg, Germany. DEK's booth (7-205) will highlight solutions designed to improve productivity and performance in electronics manufacturing, as well as lead-free solutions to aid the transition to RoHS compliance.

WEEE, RoHS, and a Trail of Breadcrumbs

(April 3, 2006) BOSTON — You can't go very far in the electronics manufacturing industry without hearing discussion about the European Union's (EU) Restrictions of the use of certain Hazardous Substances in Electronic Equipment (RoHS) and the Waste Electrical and Electronic Equipment (WEEE) regulations.

Electronic Interconnections No. 9 - Wire bonding - Still First Choice for Integrated Circuit Die Interconnection

Wire shorting was once a concern, however, a new company, Microbonds, Inc. has developed a method for bonding insulated wires

SMT/Thru-hole Receptacle Offering is RoHS-compliant

(March 31, 2006) HARRISBURG, Pa. — The RoHS-compliant AMPMODU 0.100-centerline horizontal and vertical receptacles from Tyco Electronics mate with unshrouded and breakaway-style headers. Comprised of single- and double-row configurations, the portfolio meets most mother/daughterboard applications, including board-to-board applications for industrial and commercial electronics, aerospace, computers, communications, and other electronic devices.

iNEMI Hosts May Roadmap Workshop

(March 30, 2006) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) will hold its full-day, 2007 Roadmap workshop at iNEMI headquarters, May 17, 2006, to give the industry a sneak peak at key findings, as well as presentations from 19 Technology Working Groups (TWGs). The workshop is open to non-members.

Dow Corning Develops Green Materials in China

(March 30, 2006) MIDLAND, Mich. — Dow Corning's ongoing initiative to produce environmentally friendly, silicon-based materials for electronics manufacturers in China has enabled one Chinese company to meet looming environmental laws, such as the EU's RoHS, WEEE, and China's RoHS initiative.

Electroformed Squeegee Blade Exhibits Low Pressure

(March 30, 2006) COLORADO SPRINGS, Colo. — Photo Stencil's AMTX E-Blade electroformed squeegee blade is said to boost print deposition, quality, uniformity, and consistency. A rigid, low-friction, hard-nickel edge blade reportedly provides clean prints, reduced stencil wear, and less material waste.

Solectron Beta Site Earns IPC Certification

(March 29, 2006) MILPITAS, Calif. — After months as a beta test site for IPC's RoHS Lead-free Electronics Assembly Process Capability program, Charlotte, N.C.-based Solectron Corp. has earned certification, reportedly becoming the first Tier 1 EMS company to receive such certification.

IPC Supply Chain Tracker Available to All

(March 28, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' Supply Chain Tracker, a quarterly business report targeting the electronic interconnection industry, is available by subscription.

Nexlogic Expands to Larger Facility

(March 27, 2006) SAN JOSE, Calif. — Nexlogic Technologies has moved PCB design, assembly, fabrication, and procurement operations from a 11,000-square foot building to a 30,000-square-foot facility featuring new equipment and services, noting growth in servicing the medical, military/aerospace, semiconductor, and industrial markets.

Lead Removal System Exhibits Low Toxicity

(March 27, 2006) FRANKLIN, Mass. — A low-toxicity Lead Eliminator from JNJ Industries combines chelating agents and other ingredients to remove traces of lead and other heavy metals from work surfaces. When transitioning to lead-free electronics assembly, these traces of lead and other heavy metals may remain on workbenches and other surfaces after cleaning in and around SMT lines, creating a potential for cross contamination.

In-line Router Enables High-volume Production

(March 24, 2006) OULUNSALO, Finland — The High-Speed Router from Elektrobit Group Plc separates PCB modules from the panel in high-volume production of small PCB panels. The system completes the process in grippers, ensuring short cycle times for high-volume production requirements. The router suits high-mix production due to fast set-up features and new product teaching with product drawings.

ESSEMTEC Hires Technical Manager

(March 23, 2006) GLASSBORO, N.J. — ESSEMTEC USA recently hired Jeffrey J. Stong as its new Technical Manager, who brings more than 22 years of experience in the electronics industry.

Panasonic Factory Solutions Appoints Director of Solutions

(March 23, 2006) BUFFALO GROVE, Ill. — Panasonic Factory Solutions Company of America (PFSA) has named M. Faisal Pandit as Director of Solutions to oversee all software and engineering solutions. Pandit reports directly to PFSA president Tom Gebhardt.

iNEMI Roadmap Workshop: One Week to Register

(March 22, 2006) HERNDON, Va. — Registration for the International Electronics Manufacturing Initiative (iNEMI)'s 2007 Roadmap workshop, to be held together with SEMICON Europa in Munich, Germany, on April 5th, closes on March 28, 2006, barring full capacity prior to the date. The full-day meeting will give attendees a first-look at draft chapters of the 2007 Roadmap, including two key market segments and eight technology and infrastructure areas the Roadmap covers.

Products Aid Lead-free Transition

(March 22, 2006) AMARILLO, Texas — Techspray's LeadCheck (2515-N) swabs test components and solder joints for leaded solder in both existing and incoming inventories. The company's Lead-free/RoHS Guide covers issues related to defluxers, wicks, masks, soldering tips, and solder pots.

NEPCON China Summit Touts Lead-free

(March 21, 2006) SHANGHAI, China — NEPCON/EMT China, to take place April 4–7, 2006, in Shanghai, is an SMT-focused event that offers networking opportunities and the latest information on the newest products. Held annually, this year's show will target the lead-free transition since the looming July 1, 2006 deadline is right around the corner, giving attendees plenty of options in implementing lead-free in time.

March Plasma Launches Shanghai-based Lab

(March 21, 2006) CONCORD, Calif. — March Plasma Systems opened an advanced plasma applications and demonstration laboratory in Shanghai, China, and named Michael Zhang as Applications Field Service Engineer to oversee product training, customer demonstrations, applications development, and lab-related activities.

Automatic In-line Printer Accepts 29" Frames

(March 20, 2006) DORSET, U.K. — Using proprietary camera alignment technology, Speedprint's SPRINTavi automatic in-line printer accepts industry-standard 29" stencil frames, and is said to facilitate paste-on-stencil inspection. The camera alignment system is said to ensure Six Sigma repeatability.

One-part Epoxy Adhesive Available

(March 20, 2006) HACKENSACK, N.J. — The Supreme 3HT-80 one-component, heat-curing epoxy adhesive from Master Bond, Inc., reportedly exhibits high shear and high peel strength; and resists impact, thermal shock, vibration, and stress-fatigue cracking. This no-mix compound cures within 30 minutes at 175°F.

SMTA Workshop to Spotlight 'Due Diligence'

(March 17, 2006) MINNEAPOLIS — The SMTA's upcoming "Building Your Due Diligence Defense" workshop will cover "due diligence," a legal concept concerning lead-free compliance, with up-to-date definitions; case studies of what companies are doing; and recommended steps. A Q&A session will follow.

Indium's Dr. Lasky to Head Lead-free Seminar Series

(March 17, 2006) CLINTON, N.Y. — Indium Corp.'s Dr. Ronald C. Lasky, Ph.D., senior technologist, will lead the upcoming series of SMTA workshops, titled "Rapid Implementation of RoHS Compliant Assembly," to kick off on March 23, 2006, at the Oak Pointe Country Club in Brighton, Mich.

PCB Transport Racks Accomodate Varying Board Sizes

(March 17, 2006) FRAMINGHAM, Mass. — Now available from FKN Systek, Inc., these stackable PCB transport and storage racks are said to safely handle PCBs during assembly. These racks will hold up to 50 PCBs from 2–9.8" wide, and are made of conductive plastic temperature rated to 176°F. Surface resistance is <106.

Benchmark Declares 3-For-2 Stock Split

(March 16, 2006) ANGLETON, Texas — Contract manufacturer (CM) Benchmark Electronics announced a 3-for-2 stock split in the form of a stock dividend, effective at end-of-business day, March 27, 2006. At that time, recorded shareholders will receive one additional share for every two shares owned.

Vision Systems Measure Multiple Surface Levels

(March 16, 2006) AURORA, Ill. — The QUICK IMAGE QI-2017RL and QI-3017RL Series 2-D vision measuring systems from Mitutoyo America Corp. include a bilateral telecentric lens train, which can focus on multiple surface levels simultaneously, enabling error suppression and increased speed for higher measuring throughput.

IPC 175X Enables Uniform RoHS Declarations

1751 gives a good overview of the problem being solved, the supporting standards and the organizing principles applied

Harsh Environment Electronics Abstracts Due March 22nd

(March 15, 2006) EDINA, Minn. — The SMTA and Auburn University have teamed to offer the third-annual Harsh Environment Electronics Workshop, July 19–20, 2006, in Indianapolis, Ind. John Evans, Ph.D., conference chairman; and Ken Gilleo, Ph.D., SMTA vice president for technical programs, invite industry experts to submit abstracts providing information on the latest developments within the harsh environment electronics market.

Agile Revamps RoHS Compliance with IPC-1752 Support

(March 15, 2006) SAN JOSE, Calif. — Agile Software Corp.'s Product Governance and Compliance (PG&C) now supports the IPC-1752 materials declaration management standard, which establishes electronic data formats and supports standardized forms to facilitate the exchange of materials declaration information across manufacturers' extended supply networks. With this support, Agile PG&C will allow customers to streamline their product compliance tracking per RoHS.

New Land-pattern Generator Complies with IPC-7351

(March 15, 2006) MUNICH, Germany, and WESTFORD, Mass. — Zuken, together with PCB Libraries Inc., has launched the CADSTAR-compatible LP Wizard land-pattern generator, which is said to reduce the time it takes to build library parts, and ensure compatibility with the IPC-7351 standard for SMT design.

Stencil Printing Workshops Available

(March 14, 2006) COLORADO SPRINGS, Colo. — Photo Stencil's upcoming 2006 workshops will provide information on stencil printing performance and how stencil technology and stencil design each impact this performance. Data generated by independent test laboratories during print performance studies, along with Photo Stencil's Dr. Bill Coleman, vice president of technology, and Mike Burgess, stencil product manager, will come together to offer pertinent information.

Dual-head Fluxer Allows Quick Changeover

(March 14, 2006) SPOKANE, Wash. — A.C.E. Production Technologies' new dual-head fluxer option facilitates quick changeover between leaded and no-lead flux types for selective soldering applications. The new feature complements A.C.E.'s KISS 102 programmable selective soldering system.

Device Programming Software Offers NAND Flash Options

(March 14, 2006) HOUSTON — BP Microsystems' latest BPWin software release, version 4.58, features NAND Flash options for customizing multiple partitions using a single algorithm when programming NAND devices. Special Spare Area calculations can be added as needed without having to change the algorithm. Also, partitions with an arbitrary number of required addresses and how they align to the buffer may be specified.

Practical Components Carries AIM Print Test Board and Kit

(March 13, 2006) LOS ALAMITOS, Calif. — Practical Components, an international distributor of mechanical IC samples and components and SMD production tools and equipment, now supplies AIM's print test board and kit that includes many common printing challenges. Both have circular and square pad designs to test paste release, along with BGA and microBGA pads.

Small-footprint System Mixes Bare PCB, Magazine Loading

(March 13, 2006) KENOSHA, Wis. — A new, small-footprint line loading station mixes a bare PCB loader and a magazine line loader into the same work cell, and is now available from PRO-MATION Inc. The combo station may be built to handle the four most common magazine sizes (CAB 601/701, CAB 704, CAB 706, and CAB 707).

Single-Step Swabs Test Electronics for RoHS Compliance

This new product and resource guide help printed circuit board (PCB) manufacturers and assemblers maintain RoHS (Restriction of Hazardous Substances) compliance.

New RoHS Packing Slip Aids Compliant Parts Tracking

(March 10, 2006) CHICAGO — Newark InOne's new packing slip is designed to help customers track and segregate RoHS-compliant parts within their company's inventory systems. The packing slip indicates the RoHS status of each part, as well as the manufacturer part number, manufacturer name, country of origin, and English description.

White Paper Underscores Insert Molding in Component Production

(March 10, 2006) ST. CHARLES, Ill. — A white paper focusing on the insert molding process as a highly efficient and reliable solution for producing electromechanical components and interconnections is now available from Microplastics, Inc. The paper also offers valuable solutions for reducing size, weight, and costs of components such as connectors, electromechanical parts, filters, housings, lighting, sensors, and switches, while increasing quality.

Asymtek Grows China Presence

(March 9, 2006) CARLSBAD, Calif. — Asymtek has launched two new facilities in China — a customer applications lab in Guangzhou and a new office in Beijing, joining the existing facility in Shanghai.

Speedline Updates Screen Printer Software

(March 9, 2006) FRANKLIN, Mass. — Speedline Technologies has upgraded its Benchmark Operating Software to version 1.6 for the MPM Accela printer, providing new options and enhanced functionality.

Custom PCB Rework System Uses Beam Delivery

(March 8, 2006) ROLLING MEADOWS, Ill. — BEST Inc.'s new C02 LASER PCB rework system has capabilities for precision marking, drilling, scoring, and organic material cleaning of PCB materials. It also defines new pads and traces to etch off solder-mask patterns to a few mils, and can cut polyimide into various shapes for customized wave-solder masking applications.

Indium's Lee to Target Lead-free Reliability

(March 8, 2006) CLINTON, N.Y. — At the upcoming Intel Lead-free Symposium, to take place March 15–16, 2006, in Scottsdale, Ariz., Indium Corp. of America's Dr. Ning-Cheng Lee, vice president of technology, will highlight reliability in a presentation there. Dr. Lee's experience spans the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives.

Asian CEM Market to Hit $191.90B by '09

(March 7, 2006) DUBLIN, Ireland — Since Asia offers low-cost labor and a wide technical workforce, the Asian contract electronics manufacturing (CEM) market is growing, with $73.35 billion in sales in 2004 and projected growth of $161.90 billion by 2009, claims Research and Markets' newest report, titled "Asia CEM and Assembly Capacity by Country."

iNEMI Hi-Rel Group Tackles Lead-free Manufacturing Challenges

(March 7, 2006) HERNDON, Va. — iNEMI's High-Reliability RoHS Task Force has issued recommendations for manufacturing complex, thermally challenging electronic assemblies using lead-free processes. These recommendations target thermal requirements for components, laminate and PWB materials, and equipment, and aim to help ensure product reliability.

Midwest U.S. Independent Testing Lab Serves the Globe

(March 6, 2006) VALLEY VIEW, Ohio — NSL Analytical is an ISO/IEC 17025- and Nadcap-certified Independent Commercial Testing Laboratory that provides materials testing to customers globally. Its Valley View, Ohio office houses its administrative offices, customer service, and elemental chemical analysis and composite materials testing laboratory, while its Independence, Ohio-based metallurgical lab dedicates itself to metallurgical evaluations and microscopy.

Enthone Names New Sales Engineer for PWB Chemistry

(March 6, 2006) WEST HAVEN, Conn. — Enthone Inc., a business of Cookson Electronics, has appointed Kent Lindsay as its new sales engineer for PWB Chemistry, in which he will provide sales and product support to Enthone customers in California and Arizona.

Parallel Test Guarantees Higher Fault Coverage Without Increasing Cycle Time

New technologies and trends in the production of printed circuit boards for the automotive industry present new challenges for the testing of these boards

Enhancing Pb-free Solder Joint Reliability

With certain package types, lead-free assemblies seem to be more vulnerable to failures. To find out why, one must examine why a solder joint fails and then analyze how to amend the problem.

SMTA Toronto Academy Program to Feature Courses, Certification

(March 3, 2006) MINNEAPOLIS — The SMTA Academy Program, to be held in Toronto on March 29–30, 2006, at the International Centre in Mississauga, Ontario, will feature five full- and half-day courses. The event will also feature SMTA certification for SMT processes, and these events will be held in conjunction with the Advanced Manufacturing Expo, Canadian High Tech Show, and Assembly Canada.

DEK Northern Europe Names New Area General Manager

(March 3, 2006) WEYMOUTH, DORSET, U.K. — DEK Northern Europe has appointed Jim Williams to its area general manager position, in which he will be based in the company's Weymouth headquarters. This role entails development of the company's sales, service, and brand management activities across this region.

U.K.-based Lead-free Seminar Covers the Bases

(March 2, 2006) HIGH WYCOMBE, BUCKS, England — The SMART Group's 8th Annual Lead-free Seminar and Exhibition held in February was well-attended with 160 delegates, and included wide-ranging lead-free topics, a lively debate, and surprising results from a survey.

DEK Confirms Lineup for UK Technology Day

(March 2, 2006) WEYMOUTH, DORSET, U.K. — DEK has confirmed its lineup for its 21st Century Line Technology Day, which is scheduled to take place over March 29–30, 2006, at its Weymouth headquarters. Focusing on the concept of the "21st Century Line," the Technology Day will feature a blend of presentations and workshop demonstrations led by prominent industry representatives.

ASSET Launches Boundary Scan Technology Center in China

(March 2, 2006) RICHARDSON, Texas — ASSET InterTech Inc. has opened its own Boundary-Scan Technology Center in Shanghai, China, which will operate all of the company's technical support and sales activities in Asia. The company also aims to use its Asian offices as a research and development center in the future.

Screenless Jet Printer Goes on Tour

(March 1, 2006) STOCKHOLM, Sweden — The MY500 jet printer from MYDATA automation begins its 30-country tour this month — giving manufacturers a closer look at the machine's capabilities. During its "Rock the Process Tour," MYDATA will demonstrate the jet printer in more than 30 cities, in at least ten countries throughout Europe, from March until June 2006.

Valor Integrates Engineering Solution with SIPLACE Pro

(March 1, 2006) YAVNE, Israel — Valor Computerized Systems' Trilogy 5000 assembly line engineering solution integrates seamlessly with all SIPLACE Pro Siemens Placement Systems, speeding the path from data load to optimized machine program generation.

Cirrus Logic, Digi-Key Sign Distribution Agreement

(February 28, 2006) AUSTIN, Texas and THIEF RIVER FALLS, Minn. — Cirrus Logic Inc., an analog and mixed signal integrated circuits (ICs) provider, and Digi-Key Corp. have signed a global distribution agreement, in which Cirrus Logic's products will be featured in Digi-Key's print and online catalogs and will be available for purchase directly from Digi-Key.

Fairchild's Product Offering Now RoHS-compliant

(February 28, 2006) SOUTH PORTLAND, Maine — Fairchild Semiconductor is now shipping its complete portfolio of basic marked components in configurations that conform to the RoHS directive. All may be ordered under the original base part number. This accommodates those customers mandating no part number change, and RoHS-compliant products may also be ordered to a unique Fairchild part number for those desiring a distinct part number delineating RoHS compliance.

Briton EMS Settles on XJTAG Boundary Scan Test Solution

(February 28, 2006) CAMBRIDGE, England — U.K.-based contract electronics manufacturer Briton EMS has selected the XJTAG development system as its boundary scan test solution, which has been implemented at Briton EMS's Bedford, England-based production facility. The XJTAG solution pinpoints faults on PCBs featuring high-pin-count ball grid arrays (BGAs).

iNEMI to Hold Roadmap Workshop at SEMICON Europa

(February 27, 2006) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) has scheduled a workshop for its 2007 Roadmap for April 5, 2006, to be held in conjunction with SEMICON Europa in Munich. Co-sponsored by Fraunhofer IZM, IEEE's Components, Packaging, and Manufacturing Technology (CPMT) Society, and IMAPS Europe, the workshop will give attendees a first look at draft chapters of the Roadmap.

MCA Service Verifies Placement Accuracy

(February 24, 2006) HUDSON, N.H. — CeTaQ Americas' Machine Capability Analysis (MCA) service now verifies feeder and shuttle motion repeatability, using a 'smart' camera that works with CeTaQ's mobile metrology system. A feeder maintenance program ensures continued accuracy once feeder accuracy and repeatability issues have been corrected. The service and methodology also suit die feeders and picked die from cutting.

January Book-to-Bill Ratio Starts '06 Off Right

(February 24, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' North American rigid PCB industry book-to-bill ratio for January 2006 stayed strong at 1.09, and the flexible circuit book-to-bill ratio jumped back up to 1.30. Combined (rigid and flex), the industry book-to-bill ratio also stayed strong at 1.13.

Electroform Beats Laser-cut Stencil in Comparison Study

(February 23, 2006) COLORADO SPRINGS, Colo. — Photo Stencil released results of its Advanced Microfabrication Technology Xerox (AMTX) E-Fab electroform vs. laser-cut electroform nickel foil comparison study.

New RoHS Catalog Offers 40,000 Stocked Compliant Products

(February 23, 2006) CHICAGO — Newark InOne, a subsidiary of global distributor Premier Farnell plc and a small-quantity distributor of electronic components and test equipment in North America, now offers a new, 580-page catalog devoted strictly to electronic products that are RoHS-compliant. The front section of the catalog includes a detailed guide to help engineers in the U.S., Canada, and Mexico to comply with RoHS, which takes effect July 1, 2006.

Support for VSP Devices Available

(February 23, 2006) HOUSTON — BP Microsystems' BP Win 4.58 offers support for very small package (VSP) devices. Offered exclusively on BP Win Automated Programming Systems, support for VSP devices currently includes MSOP8, TSOC6, and the smallest device, SOT23, with dimensions of 1.63 × 2.95 mm. Other VSP devices may be supported by entering a device request through BP Microsystems' Website.

Kyzen Refutes Sale of Company

(February 22, 2006) NASHVILLE, Tenn. — Following Zestron America's announcement of its intent to purchase the cleaning company, Kyzen Corporation, Kyle J. Doyel, CEO and president, refuted the claims stating, "Kyzen's board of directors has not solicited, nor has it directed management to solicit, offers from any party or have discussions regarding a potential sale of the company."

Zestron Looks to Acquire Kyzen

(February 22, 2006) ASHBURN, Va. — Zestron America announced its interest in purchasing Nashville, Tenn.-based Kyzen Corporation, emphasizing the company's desire to complete a negotiated transaction with the support of Kyzen's board of directors. No further details were provided, but Zestron noted the company is prepared to offer Kyzen shareholders a premium. Kyzen is expected to comment later today on this matter.

U.K.-based Exception PCB Predicts Flex-rigid Growth

(February 22, 2006) TEWKESBURY, U.K. — Exception PCB noted growth and development in the flex-rigid market, resulting in predicted revenues of more than a million pounds in 2006. The company focuses on a 20-day turnaround on all products, with a five-day response on quickturn components.

Desoldering Pencil Includes Disposable Solder Trap

(February 22, 2006) APEX, N.C. — The Weller DXV80 in-line desoldering pencil from Weller, which features a disposable solder trap for easy cleaning, is suitable for desoldering thru-hole components on PCBs.

Universal Appoints Director of Corporate Accounts

(February 21, 2006) BINGHAMTON, N.Y. — Universal has named Mark Ragard, former director of Americas operations, as its new director of corporate accounts, in which he will oversee the company's corporate accounts structure. He also will lead the development of Universal's worldwide corporate level activity and supervise the accounts of high-profile OEM and EMS clients.

3-D LED Array Packages Offer Wide Viewing Angle

(February 21, 2006) SAN FRANCISCO — Mixing high-brightness LEDs with 3-D packaging technology, TT electronics OPTEK Technology's Lednium Series 10-W LED array packages offer a full 120° viewing angle for its array of amber, blue, green, red, or white LEDs. The devices achieve an output of up to 330 lumens with nine 1-W LEDs mounted in a 1.3 in2 anodized aluminum package, with a board-mounted profile of less than .5".

Cobar's New Color-coding System Distinguishes Lead-free

(February 17, 2006) BREDA, Holland — The threat of cross-contamination, such as lead-bearing materials that can mix up with new lead-free solders, is a major issue facing the electronics industry. Even small amounts of lead contamination can cause tremendous problems and result in high remediation costs, as well as process downtime if they accidentally mix with lead-free soldering products.

Zuken Unveils Web-downloadable PCB Design Solution

(February 17, 2006) MUNICH and WESTFORD, Mass. — Zuken has launched its latest version of CADSTAR Express, a free Web download of the CADSTAR 8.0 desktop PCB design solution. This fully functional version of CADSTAR 8.0 features tools for design from schematics to manufacture, with a limit of 300 pins and 50 components.

Reworkable CSP/BGA Underfill Performs in Low Temperatures

(February 16, 2006) IRVINE, Calif. — Loctite 3549, a high flow underfill formulated specifically for use with advanced CSP and BGA packages, is now available from the Electronics Group of Henkel. It quickly fills the space beneath the CSP and BGA packages and cures rapidly at low temperature, minimizing thermal stress to other components on the PCB, and allowing for in-line curing to increase device throughput.

High-density Interconnect Arrays Available

(February 15, 2006) NEW ALBANY, Ind. — The SEARAY high-density interconnects (SEAM/SEAF Series) from Samtec Inc. provide a solid grid of contacts on 1.27-mm pitch and up to 500 I/Os. A selection of solder crimps on the tails provide a choice between tin/lead alloy or RoHS-compliant, tin-only alloy for lead-free processing.

SMTA International Call for Papers Opens

(February 15, 2006) MINNEAPOLIS — The SMTA International Technical Committee has opened its Call for Papers for abstract submission for SMTA International 2006, to be held September 24–28, 2006, in Rosemont, Ill. Short course descriptions are also being solicited.

Cobar CEO Honored with IPC Service Award

(February 14, 2006) ANAHEIM, Calif. — Eli Westerlaken, CEO of Cobar Europe, has nabbed a Distinguished Committee Service Award by the IPC–Association Connecting Electronics Industries for his contribution to the development of the IPC standard J-STD-006B, "Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders."

DEK's Shekou Facility Becomes ISO-certified

(February 14, 2006) SAN JOSE, Calif. — DEK's Shekou, China manufacturing facility has obtained the ISO 9001 quality management system certification, following an independent assessment by accreditation body BSI.

IPC Honors Industry Icons with '05 Hall of Fame Award

(February 13, 2006) BANNOCKBURN, Ill. — At the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference, held February 8–10, 2006, in Anaheim, Calif., IPC–Association Connecting Electronics Industries awarded Gene Weiner, Weiner & Associates; and Vern Solberg, Micro Electronic Engineering Services; with the 2005 Raymond E. Pritchard IPC Hall of Fame Award.

EPIC Technologies Names VP of Business Development

(February 10, 2006) ROCHESTER HILLS, Mich. — EPIC Technologies has promoted Todd Baggett to vice president of business development and an officer of the Company, having previously served as director of business development.

UV Cure Unit Integrates or Operates Stand-alone

(February 10, 2006) INDIANAPOLIS — Specialty Coating Systems' (SCS) Precision UVC ultraviolet (UV) cure unit offers tubular, full-spectrum UV curing in tandem with the Precisioncoat or as a stand-alone system. When coupled with the Precisioncoat or Precisioncoat EL, components move from the spray coating system to the cure unit automatically, with the coating system PC controlling the cure cycle.

iNEMI Members Laud Material Declarations Standard

(February 9, 2006) ANAHEIM, Calif. — A large number of the International Electronics Manufacturing Initiative (iNEMI)'s members, mainly OEMs, EMS providers, and suppliers, are committed to implementing the IPC-1752 Materials Declaration Management standard. Slated to be published by IPC this quarter, the standard establishes uniform electronic data formats and standardized forms to simplify the way industry collects, tracks, and discloses material content information.

Indium Corp. Presents Silver Quill Award

(February 8, 2006) CLINTON, N.Y. — Indium Corp. recently awarded its annual Silver Quill Award for best paper/presentation of 2005 to Jim Hisert, a technical support engineer based at Indium's Clinton, N.Y. global headquarters. The Silver Quill award encourages and gives incentive to individuals for authoring technical reports, presentations, articles, and books.

Valor Computerized Systems Names New President

(February 8, 2006) ANAHEIM, Calif. — Valor Computerized Systems (VCR) has appointed Ori Braun as its new president, and he will be based at Valor's U.S. headquarters in Foothill Ranch, Calif. He comes to Valor from medical electronics company Life Watch, Inc., where he also served as president.

CAP-XX Wins Award for Prismatic Supercapacitors

(February 8, 2006) SYDNEY, Australia — CAP-XX Inc. has received Frost & Sullivan's 2005 Technology Innovation of the Year Award in nanotechnology-enabled supercapacitors for research that led to a breakthrough nanotechnology process for producing thin and flat, or prismatic, supercapacitors to meet the pulse-power requirements of portable devices.

Universal Expands Global Network with Danish Distributor

(February 7, 2006) BINGHAMTON, N.Y. — Universal Instruments has named Danish distributor PC Trading A/S, hoping to further strengthen its European infrastructure and extend its global distributor network. Arhus, Denmark-based PC Trading A/S serves markets spanning OEMs and contract manufacturers, and supplies the electronics industry with consumables, machinery, and laser stencils.

Valor's '05 Revenues Poise for Further '06 Growth

(February 7, 2006) YAVNE, Israel — Valor Computerized Systems (VCR) has finished its 2005 fiscal year with revenues of $36.3 million — its highest annual revenues to date, and a 19% increase over 2004. The fourth quarter of 2005 marks 11 consecutive quarters of sequential growth with revenues of $9.5 million, a 15% increase compared to $8.3 million in 2004's fourth quarter.

Schmidt RFID, Cogiscan Team to Offer RFID Solutions in Asia

(February 6, 2006) HONG KONG and BROMONT, Canada — Schmidt Electronics Group and Cogiscan have formed a long-term strategic partnership, in which SchmidtRFID, a division of Schmidt Electronics Group, will offer the complete range of Cogiscan RFID solutions in Asia.

Cookson's Singapore Facility Earns ISO 14001:2004 Certification

(February 6, 2006) JERSEY CITY, N.J. — Cookson Electronics Assembly Materials' (CEAM) Singapore facility earned the Environmental Management System (EMS) standard ISO 14001:2004 certification on January 25, 2006, through the British Standards Institution (BSI). The Singapore site joins other CEAM manufacturing facilities worldwide that are already certified to this standard.

So You Want a RoHS Exemption

The current consultation contains several examples of how not to request an exemption. The worst tend to be lengthy essays penned by lawyers (solicitors) on the virtues of a single company and their products

Sager Electronics Promotes Kopp

(February 3, 2006) WEYMOUTH, Mass. — Electronic component distributor, Sager Electronics, promoted Paul Kopp to director of distribution and logistics to manage and develop operational resources to improve customer service and production efficiencies within the company's distribution center third-party logistic warehouses.

Henkel Names Fischer VP of Sales, Marketing, and Technical Services

(February 3, 2006) IRVINE, Calif. — Henkel Corporation's electronics group appointed Gordon Fischer, Ph.D., to vice president of sales, marketing, and technical services for the Americas. In this position, Fischer will lead the Americas sales team, manage the company's marketing plan, and direct the technical service infrastructure for Henkel's semiconductor and PCBA products.

Bare Board Tester Suits Large-size PCBs

(February 3, 2006) STRAMBINO, Italy — The S24BBT bare board tester from Seica can test boards up to 24 × 40". The tester will be demonstrated at APEX in Anaheim, Calif., February 8–10, 2006, with the company's Multi-board Handler, which can handle different part number PCBs in various quantities for operator-free test cycles.

DEK, Assembléon Join Forces in Latest Products

(February 2, 2006) SAN JOSE, Calif. — DEK's San Jose office provided the venue for Assembléon's recent San Jose Roadshow, held November 1–3, 2005, and formed part of Assembléon's U.S.-wide tour with its AX and MG machine lines. The event also showcased a range of DEK products, including VectorGuard stencil systems, ProFlow enclosed print head technology, custom tooling options, and cleaning wipes.

Indium Adds Ariz.-based Sales Rep to Network

(February 2, 2006) CLINTON, N.Y. — Phoenix-based Santec Marketing has joined Indium Corp. as a sales representative in Sonora, Mexico. Santec will handle sales and support of Indium's solder paste, rework flux, wave solder flux, flip chip and liquid flux, underfill, conductive epoxy, solder sphere, solder preform, solder wire, solder ribbon, and SnPb and lead-free foil and bar solder product offerings in the Sonora region.

FocalSpot Grows Management Team to Meet Demands

(February 2, 2006) SAN DIEGO — FocalSpot, Inc. has added two industry veterans to its management team — David Phillips as Operations Manager and Rolando Asuncion as Production Manager. Phillips brings over 10 years of electronics manufacturing experience in field service, applications engineering, technical training, and sales support. Asuncion joins as X-Ray Production Lead, bringing over 20 years of electronics manufacturing experience in fabrication, assembly, and test.

GAC Acquires Lead-free Selective Soldering Systems

(February 1, 2006) SPOKANE, Wash. — A.C.E Production Technologies announces the sale and installation of dual KISS-101 selective soldering systems to Agawam, Mass.-based Governors America Corporation (GAC), a global supplier of electronic engine controls. The installation is part of GAC's lead-free conversion program to meet RoHS compliance. The KISS-101 selective soldering systems are compatible with new lead-free soldering alloys.

Next-gen Handheld Readers Identify DPM Codes

(February 1, 2006) NATICK, Mass. — Cognex Corp.'s next-generation DataMan 7500 series handheld direct part mark (DPM) readers identify and read all printed and DPM codes for manufacturers implementing part traceability programs in the automotive, aerospace, electronics, healthcare, and defense industries.

Sanmina-SCI to Show PCB, Backplane Technology at DesignCon '06

(February 1, 2006) SAN JOSE, Calif. — Sanmina-SCI Corp. will exhibit new PCB and backplane technology developments at DesignCon 2006, to be held February 6–9, 2006, at the Santa Clara Convention Center in Santa Clara, Calif. Sanmina-SCI will be located in the PCB Technology Pavilion at booth #819.

New Lead-free Verification System Available

(January 31, 2006) SUNNYVALE, Calif. — Slated for introduction at Booth 1396 at the APEX/IPC Printed Circuits Expo/Designers Summit 2006 exhibition and conference on February 8–10, 2006, in Anaheim, Calif., HEPCO, Inc.'s LeadHound system reportedly verifies lead-free or leaded components, sub-assemblies, PCBs, and other items in as little as 15 seconds.

Newark InOne Upgrades RoHS Compliance Website

(January 31, 2006) CHICAGO — Newark InOne, a subsidiary of global distributor Premier Farnell plc, now offers new compliance help on its RoHS Express site for U.S. and Canadian manufacturers. With this site update, Newark InOne has identified four basic steps that an OEM will typically consider on its way towards compliance with the RoHS directive.

IPC Posts December '05 Book-to-bill Ratio

(January 30, 2006) BANNOCKBURN, Ill. — In December 2005, IPC–Association Connecting Electronics Industries' North American rigid PCB industry book-to-bill ratio stayed strong at 1.09, but the North American flexible circuit book-to-bill ratio dropped to 0.95. Based on monthly data collected from PCB producers that participate in IPC's monthly PCB Statistical Program, the combined (rigid and flex) industry book-to-bill ratio remained positive at 1.06.

SMT's Goldstein Chairs Thermal Management Conference Session

(January 30, 2006) SAN JOSE, Calif. — Julia Goldstein, Ph.D., contributing editor for SMT and Advanced Packaging Magazines, is on the docket to chair Session One: Material Challenges and Solutions, at MEPTEC's 2nd Annual "The Heat is On: Thermal Management Solutions in Semiconductor Packaging," February 16, 2006, in San Jose, Calif.

Distributor to Premier Lead-free Products at APEX '06

(January 30, 2006) LOS ANGELES — Distributor all4-PCB (North America) will introduce new lead-free products at the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference, to take place February 8–10, 2006, in Anaheim, Calif. These products are said to be making their first North American trade show appearance.

TURI Hosts RoHS Compliance Planning and Strategies Workshop

(January 27, 2006) LOWELL, Mass. — The Massachusetts Toxics Reduction Institute (TURI) will host "RoHS Compliance Planning and Strategies," on February 28, 2006, from 8:00 a.m. to 2:15 p.m., at the Wyndham Hotel in Westborough, Mass.

Aerosol Cleaners Provide Alternative to Solvents

(January 27, 2006) ST. PAUL, Minn. — 3M Electronics' Novec aerosol cleaners are a viable alternative to solvent-based cleaners for removing dust, grease, oil, and other contaminants from sensitive electronics. The new line includes three low-toxicity, fast-drying cleaners that are ideal for challenging manufacturing applications, and are effective on various soils and contaminants.

Distinct Part Numbers Major Request at RoHS Summit

(January 26, 2006) SAN JOSE, Calif. — Last week, a group of authorized distributors, customers, component manufacturers, EMS providers, and OEMs gathered at NEDA's RoHS Summit to discuss the status of the industry six months before the July 1, 2006, RoHS deadline. One topic of concern that came up continuously was the call for distinct part numbers to ease confusion and increase accuracy.

Software Touts Real-time Process Monitoring for AOI

(January 26, 2006) SAN CLEMENTE, Calif. — The YESPC Software from YESTech is an enhancement from the company's automatic optical inspection (AOI) technology — providing real-time process monitoring.

Image Processor Software Optimized with SMT/BGA Capabilities

(January 26, 2006) SAN DIEGO — Adding to the Verifier Image Processor (VIP) Application Software series, FocalSpot introduced the VIPx, featuring an extended set of advanced SMT/BGA inspection capabilities and image enhancement tools.

IPC Picks Ten Companies for Innovative Technology Showcase

(January 26, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries announces the companies launching revolutionary technologies at this year's Innovative Technology Showcase (ITS), which will be held February 8–10, 2006, at the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference in Anaheim, Calif.

Arrow Electronics Names President for North America, Asia-Pacific Components

(January 25, 2006) MELVILLE, N.Y. — Arrow Electronics, Inc. has named Michael J. Long as president of North America and Asia-Pacific Components; a promotion from his previous position as president of the company's North American businesses. The presidents of both the company's North American and Asia-Pacific components businesses will report to Long, who has 25 years of experience in electronic components and computer products distribution.

Aegis Introduces End-to-end NPI/MES Solution

(January 25, 2006) PHILADELPHIA — Aegis Industrial Software's MCAD system caters to increasing customer demand for an end-to-end NPI through MES solution supporting electronics assembly, system integration, and box build. An integral part of the greater Aegis factory information system, it supports box and mechanical product documentation, tracking, quality, and materials management. Aegis customers may now support any discrete assembly processes in a single information system.

Excess Inventory Solution for Components Available

(January 24, 2006) DALLAS — A new excess inventory solution for electronic components is now available from BCD Electro, which combats surplus inventory reasons such as inaccurate forecasting, changes in business direction, end-of-life, product aging, or environmental directives (RoHS and WEEE).

Speedline Appoints Development Group Leader

(January 24, 2006) FRANKLIN, Mass. — Speedline Technologies has named Dr. Rita Mohanty to lead its Advanced Development Group (ADG), a team of engineers and resources dedicated to the research and development of technological and process innovations in SMT manufacturing and PCB assembly.

Universal Grows Genesis Platform Team with New Appointments

(January 24, 2006) BINGHAMTON, N.Y. — Universal Instruments has appointed a new Business Development Manager and Product Marketing Manager to the Genesis Platform Product Team, further boosting its position to compete in the evolving high-speed chip placement and flexible fine-pitch global marketplace.

Systems Focus on PCB/BGA Inspection

(January 23, 2006) RANDOLPH, N.J. — Two compact X-ray systems from Glenbrook Technologies, the RTX series for production monitoring and Jewel Box series for process development and failure analysis, are said to reduce manufacturing costs.

Palomar Names New Company President

(January 23, 2006) CARLSBAD, Calif. — Palomar Technologies has named Bruce W. Hueners as its new president, having most recently held the position of COO. Since joining the company in 1981 when it was Hughes Aircraft, he has played significant roles in elevating Palomar to its market position in the optoelectronics industry, bringing about a series of acquisitions and partnerships, and in expanding the company's business in the U.S., Europe, and Asia.

Free Webinar to Tackle 0201 and 01005 Assembly Hurdles

(January 23, 2006) FRANKLIN, Mass. — Speedline Technologies will discuss the issues involved in the 0201 and 01005 component assembly process in a free, live, hour-long Webinar, to take place February 16, 2006, at two different times: 2:00–3:00 a.m. EST, and 11:00 a.m.–noon EST.

iNEMI to Debut '07 Roadmap, Halogen-free Efforts at APEX '06

(January 23, 2006) HERNDON, Va. — In conjunction with the APEX/IPC Printed Circuits Expo/Designers Summit 2006 exhibition and conference, to take place February 8–10, 2006, in Anaheim, Calif., the International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, will kick off its 2007 Roadmap meeting on February 6–7. Several iNEMI project activities and results also will be discussed in conference forums and technical sessions.

Sanmina-SCI's Singapore Facility Earns AS9100 Certification

(January 20, 2006) SAN JOSE, Calif. — Global EMS provider Sanmina-SCI Corp's Singapore facility has earned the AS9100, Rev B aerospace standard certification, since the facility complies with all the requirements of the AS9100 quality management system.

Voltage-controlled Saw Oscillator Features True SineWave Output

(January 20, 2006) FORT MYERS, Fla. — The CVCSO-914-1000 1-GHz voltage-controlled saw oscillator (VCSO) from Crystek Crystals Corp. uses FR5 PCB and SAW crystal technology to provide a low-noise, low-jitter VCSO with true SineWave output, resulting in -135 dBc/Hz phase noise at 10-KHz offset.

Universal Names Director of European Operations

(January 19, 2006) BINGHAMTON, N.Y. — Universal Instruments appointed Peter Bollinger as Director of European Operations, operating from the company's offices in Bad Vilbel, near Frankfurt, Germany.

De-soldering Pump Can Extend Tip Life

(January 19, 2006) BARCELONA, Spain — Driven by compressed air from a Venturi valve, the MS 9005 de-soldering pump from JBC Tools is said to provide a powerful vacuum for on-site air pressure systems.

Indium Suzhou Nabs ISO-9001:2000 Certification

(January 18, 2006) CLINTON, N.Y. — Indium Corp. (Suzhou) Co., Ltd. recently passed its ISO-9001:2000 certification audit, joining the company's U.S., European, and Asia-Pacific Operations in achieving this certification, which focuses primarily on quality management.

Celestica Names New Executive VP of Worldwide Operations

(January 18, 2006) TORONTO, Ontario — Celestica Inc. has appointed James Rowan to its executive vice president of Worldwide Operations position, where he will manage Celestica's global manufacturing network, as well as implement site-to-site consistency in Lean, Six Sigma, organization capability, and customer care.

Newark InOne Publishes Quality Assurance Policy for RoHS

(January 17, 2006) CHICAGO — Small-quantity electronic components and test equipment distributor Newark InOne is implementing a comprehensive quality assurance policy to help its customers mitigate compliance risks associated with the European Union's Restriction of Hazardous Substances (RoHS) directive.

VOC-free Flux for Lead-free Wave Soldering Improves Wetting

(January 17, 2006) LONDONDERRY, N.H. — 396-FTA VOC-free flux for lead-free wave soldering applications has less than 2% solids, reportedly yielding extremely clean post-solder surfaces on the most difficult solder resists, and is now available from Cobar Solder Products.

RSVI Names Vice President of Operations

(January 16, 2006) HAUPPAUGE, N.Y. — RVSI Inspection LLC has appointed Nellie Quintana to its Vice President of Operations position, in which she will report directly to president Kevin Maddy and focus on making a step function improvement in quality, delivery, and cost.

New Stand-alone Depaneling System Available

(January 16, 2006) VIRKKALA, Finland — Cencorp Corp.'s Cencorp 1000 SR stand-alone depaneling system is a high-precision, modular, and ergonomic solution for electronics manufacturing. The system can be fitted with linear encoders for high-accuracy applications, and the router or saw-cutting devices accommodate V-scored or pre-routed panel designs.

Enthone Appoints New U.S. Director of Sales

(January 16, 2006) WEST HAVEN, Conn. — Enthone Inc., a business of Cookson Electronics, has appointed Jason Maupin as its new U.S. Director of Sales, in which will be responsible for leading the Enthone U.S. sales and technical service team in the electronics and surface-finishing industries.

Henkel Materials Specialist to Speak at SMTA Toronto

(January 13, 2006) MINNEAPOLIS — On January 18th, the Electronics Group of Henkel's Dr. Brian Toleno will speak at the upcoming SMTA Toronto, Canada Chapter meeting, sharing basic information such as the definition of underfills and their function, and more detailed data regarding design rules, reliability, and standards.

Sirenza, Digi-Key Sign Distribution Agreement

(January 13, 2006) BROOMFIELD, Colo., and THIEF RIVER FALLS, Minn. — Sirenza Microdevices, Inc. and Digi-Key Corp. have signed a worldwide distribution agreement. In the agreement, Sirenza's products will be featured in Digi-Key's printed and online catalogs, and will be available for purchase directly from Digi-Key, allowing Digi-Key to fulfill the design and production needs of its customers worldwide.

FocalSpot Expands Facilities

(January 12, 2006) SAN DIEGO — Due to global use of its inspection and rework solutions, FocalSpot has expanded its corporate office and manufacturing facilities. Facility construction began in early December 2005 and is scheduled for completion in mid-January 2006.

SMTA, TFI, and The GoodBye Chain Group Sponsor DfE Workshop

(January 12, 2006) MINNEAPOLIS — SMTA, in collaboration with Technology Forecasters Inc. (TFI) and The GoodBye Chain Group will sponsor, "Design for Environment (DfE) — Tools and Techniques for the Electronics Industry," on February 27, 2006, in Fremont, Calif. Additional workshops are scheduled for April 6, 2006, in Phoenix, June 7, 2006, in San Diego, and July 13, 2006, in Boston.

Libra Industries ISO 13485 Certified for Medical Market

(January 11, 2006) MENTOR, Ohio — Libra Industries received ISO 13485 certification for its medical electronics engineering and manufacturing operations. This certification gives Libra's customers the assurance of stringent control of business practices, electronic design services, and manufacturing processes used to produce medical electronics devices.

Compact Selective Soldering Line Targets Lead-free

(January 11, 2006) SPOKANE, Wash. — A.C.E. Production Technologies introduces its KISS line of selective soldering systems targeting lead-free solders.

Photo Stencil to Present Papers at APEX

(January 11, 2006) COLORADO SPRINGS, Colo. — Photo Stencil will present two papers at the IPC Printed Circuits Expo, APEX, and the Designers Summit in Anaheim, Calif., February 8-10, 2006.

CeTaQ Expands MCA Testing to Medical Market

(January 10, 2006) HUDSON, N.H. — CeTaQ Americas has made Machine Capability Analysis (MCA) testing application to laser systems used in precision micromachining and manufacturing of medical devices such as stents, and biomedical products.

NEDA Highlights Test, Measurement, and the Supply Sectors

(January 10, 2006) ATLANTA — NEDA will host its 2006 Electronic and TMC Development Forum, "Redefining Business Fundamentals," at the Loews Ventana Canyon Resort in Tuscon, Ariz., January 29-31, 2006.

Powell-Mucha Consulting Presents EMS Tutorial

(January 9, 2006) ANAHEIM, Calif. — To help EMS providers overcome challenges such as the transition to RoHS compliance and finding an adequate budget in a low-margin industry, Powell-Mucha Consulting, Inc. offers "Creating Competitive Advantage in Today's EMS Market," on February 7, 2006, from 2:00–5:00 p.m. at the APEX conference in Anaheim, Calif.

Wire-wound Chip Coils Reduce Mounting Space

(January 9, 2006) SMYRNA, Ga. — Murata Electronics North America's LQW04A series miniature, high-frequency, wire-wound-type chip coil in the 03015 EIA size (0.8 × 0.4 mm) suits high-frequency circuits used in mobile devices such as cell phones and personal digital assistants (PDAs). Its size is said to reduce the mounting area by 40%.

Advanced Circuits' PCB Prototypes Go Lead-free

(January 9, 2006) AURORA, Colo. — All of Advanced Circuits' prototypes will now be fabricated using lead-free solder as a plating finish. Its lead-free HAL finish provides an enhanced solderable finish for assembly, and meets all legislation requirements for the looming RoHS Directive six months ahead of the July deadline.

Fitch Ratings Notes Celestica's 'Stable Outlook'

(January 6, 2006) NEW YORK — Fitch Ratings, a global rating agency, has given Celestica Inc. a stable outlook rating, reflecting somewhat weak but improved operating performance and concentration to traditional end-markets characterized by more mature growth prospects.

Micron Products Forms New Division

(January 6, 2006) FITCHBURG, Mass. — Micron Products, a wholly owned subsidiary of Arrhythmia Research Technology has formed Micron Integrate Technologies (MIT) to specialize in the production of metal and plastic components for the medical and defense industries.

Cookson Group Sells SCS Business

(January 5, 2006) JERSEY CITY, N.J. — On December 30, 2005, Cookson Group plc (Cookson) sold its Specialty Coating Systems (SCS) business, which forms part of the Assembly Materials sector of Cookson's Electronics division, to Bunker Hill Capital for $55.5 million. An immediate cash payment of $54.0 million was made up front, with an additional $1.5 million to be paid upon closing of the sale of the SCS China business in early 2006.

Thin, Flexible Heaters Enable Precise Placement

(January 5, 2006) ST. LOUIS — A series of polyimide and etched-foil silicone rubber flexible heaters and hybrid heaters from Watlow are said to allow heat to be placed precisely where required, while the heater circuit meets customer specifications.

TSS Technologies to Open International Facility

(January 4, 2006) CINCINNATI — TSS Technologies, a manufactured products and equipment supplier serving the aerospace, automotive, medical, automation, and aviation power and marine industries, will open an international facility in Xiamen, China.

Aculight Appoints New Board of Directors Member

(January 4, 2006) BOTHELL, Wash. — Laser technologies developer Aculight Corp. has named Dr. Thomas S. Hartwick to its Board of Directors, who has spent nearly 50 years in high-technology business management and R&D. His technology expertise spans lasers, electro-optics, electronic/microwave devices, and satellite systems.

IPC Posts Book-to-Bill Ratio for November '05

(January 4, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' monthly PCB Statistical Program for November 2005 showed a rigid PCB industry book-to-bill ratio of 1.12 and a flexible circuit book-to-bill ratio of 1.16, both remaining strong. Combined, the book-to-bill ratio remained at 1.13.

PROMATION Boosts Post-AOI PCB Sorting Station

(January 4, 2006) KENOSHA, Wis. — PROMATION has enhanced its ENB-700 post-AOI sorting station, targeting customers who require a small footprint solution that can sort pass/fail products after AOI.

Flextronics Names New CEO

(January 3, 2006) SINGAPORE — Flextronics has appointed Michael McNamara as its new CEO, complementing its previously announced succession plan. McNamara has held various senior positions during his career at Flextronics, most recently as COO, but has also served as president of Americas' Operations and as vice president of North American Operations.

Upcoming Webinar Channels Lead-free SMT Printing Process

(January 3, 2006) FRANKLIN, Mass. — Speedline Technologies' experts will tackle the lead-free printing process, which is one of the industry's most critical manufacturing challenges, in a free, live Webinar on January 19th.

Design for Manufacture

As more companies embrace design for manufacture (DFM) as a method to increase both profits and throughput, a concept known as design for excellence (DFX) has come to the forefront. When properly implemented, DFX will ensure that a product can be manufactured and tested.

SMT China Moves Headquarters to Hong Kong

(December 29, 2005) HONG KONG — Effective January 1, 2006, SMT China magazine will move its headquarters to Hong Kong, where ACT International and PennWell will operate editorial, circulation, publication, Website and advertising services.

Speedprint Platforms Feature VacuNest Tooling Solution

(December 29, 2005) DORSET, U.K. — As part of an OEM agreement, Speedprint Technology will offer Novatec's VacuNest Shape Memory tool solution on its printer platforms.

Mentor Graphics and QuickLogic Pen FPGA Agreement

(December 29, 2005) WILSONVILLE, Ore. — Mentor Graphics Corporation has signed a multi-year OEM agreement with QuickLogic Corporation that offers QuickLogic's customers a new synthesis solution, and enables a smooth transition to a range of Mentor Graphics' advanced FPGA synthesis technology and tools.

Workshop Focuses on Supply Chain Optimization

(December 27, 2005) ALAMEDA, Calif. — Technology Forecasters, in collaboration with supply chain consultants, eKNOWtion and Avnet Electronics Marketing Global Supply Chain Services, offers, "Global Supply Chain Design and Optimization Workshop," on February 7, 2006, in Rosemont, Ill.

EDA Industry Reports 6% Growth in Q3'05

(December 27, 2005) SAN JOSE — The EDA Consortium's Market Statistics Service (MSS) announced that the electronic design automation (EDA) industry revenue for the third quarter of 2005 was up 6% to just over $1.1 million from $1.06 million in the third quarter of 2004.

SMTA Certification Dates Set for 2006

(December 27, 2005) MINNEAPOLIS, Minn. — SMTA announces 2006 dates for its Six Sigma Certification programs. Each three-day workshop, one for processes and one for Six Sigma Green Belt certification, feature refresher topics and open and closed book exams.

Kyzen Names Creyr Innovation as New England Rep

(December 27, 2005) NASHVILLE— Kyzen Corporation has named Rhode Island-based Creyr Innovation LLC as its manufacturing representative for New England.

Solectron Opens Design Services Center in Romania

(December 21, 2005) TIMISOARA, Romania — Solectron Corporation has established a Design and Engineering Services Center in Timisoara, Romania, to focus on providing advanced collaborative design and engineering services to the company's customers worldwide. Core capabilities of the center will include electrical and mechanical design, advanced process technology, test development and failure analysis.

Bliss Announces Promotion, New Staff

(December 21, 2005) MILPITAS, Calif. — Adding to its personnel, Bliss Industries has promoted Mike Prieb to sales manager, and hired Alfredo Grulich as a new account manager.

OEM Reselling Deal Targets RFID Smart Feeders

(December 20, 2005) BROMONT, Canada — Cogiscan has announced a strategic OEM reselling partnership with AGS Pte Ltd (Singapore), in which AGS will integrate and re-sell Cogiscan's RFID smart feeders as a standard on refurbished machines, RFID tags on refurbished feeders and RFID smart feeder retrofit kits to upgrade existing machines at customer sites.

SMTA International 2006 Call for Participation

(December 20, 2005) MINNEAPOLIS — The SMTA invites industry professionals to submit a paper to SMTA International 2006, to be held in conjunction with Assembly Tech Expo (ATExpo), September 24–28, 2006, at the Donald Stephens Convention Center in Rosemont, Ill.

Monthly Webinars to Deal With SMT Manufacturing Challenges

(December 19, 2005) FRANKLIN, Mass. — Speedline Technologies experts will address the SMT industry's manufacturing challenges in free, monthly Webinars. Targeted at OEM and CEM process engineers, each Webinar will focus on challenges specific to a major SMT manufacturing process, ranging from lead-free printing to high-speed underfill to practical DOE and SPC for electronics assembly to 0201 and 01005 component assembly.

Productronica 2005 Draws Record Numbers

(December 19, 2005) MUNICH — Productronica 2005 remains the largest trade show for electronics, attracting more than 44,000 visitors and 1,500 exhibitors from November 15–18, 2005.

Tape Guards Circuits During Fabrication, High-temp Masking

(December 16, 2005) WINDSOR, Conn. — Scapa 650 from Scapa Industrial is a high-temperature masking tape for low-static protection of gold-plated finger tabs, assembly holes and components during flux, preheat and soldering processes. The tape also targets high-temperature industrial masking in clean rooms.

Indium Adds to Asia-based Sales and Support Team

(December 16, 2005) CLINTON, N.Y. — Further strengthening its Asian operations, Indium Corporation has promoted Tom Lan to sales manager for Northeast China and hired Chia Yong Kwang as the technical manager for Asia.

Circular Blade Depanelizer Now Includes XY Table

(December 15, 2005) FRAMINGHAM, Mass. — FKN Systek's K2000 motorized circular blade depanelizer claims to separate pre-scored PCBs without any waste, and now includes an XY table for improved board handling. It singulates PCB panels by passing the scoreline between two circular blades, which include front and back blade guards for safety. An adjustable upper front blade guide assures that only the scoreline can be passed to the cutting area.

Cookson to Sell Polyclad Laminates to Isola

(December 15, 2005) LONDON — Cookson Group plc, Cookson Electronics' parent company, has entered into an agreement to sell Polyclad Laminates, Inc. to Isola Group, Sarl, for US$91 million. Completion of the transaction is conditional on satisfactory clearance from the European anti-trust authorities, and is expected in February 2006.

Soft Landing Reduces Nail Test Footprint of Flying Probers

(December 13, 2005) STUTENSEE-BLANKENLOCH, Germany — With continued miniaturization of components in automotive, medical and military applications, manufacturers often are concerned with over test coverage on complex and high-density boards, as well as problems with unwanted damage using conventional probe techniques. To combat this, Digitaltest introduced Soft Landing technology on its Condor flying probe test platform.

D-sub Connectors Now Meet RoHS Directive Requirements

(December 13, 2005) ETTERS, Pa. — FCI's RoHS-compatible D-Sub connector family now meets the European Directive EU 2002/95/EC — the Delta D series straight-solder and press-fit versions are now available without the restricted materials as detailed in the directive, and the right-angle version will be available by the end of the year.

Bench Top Dispenser Enables Hands-free Use

(December 12, 2005) SALEM, N.H. — The DXB bench dispenser from MIXPAC Equipment is a portable, bench top unit capable of dispensing two-component reactive resins of 1:1, 1.5:1, 2:1, 4:1 and 10:1 ratios.

Embedded Capacitor Material Achieves RoHS Compliance

(December 12, 2005) AUSTIN, Texas — 3M Electronics' embedded capacitor material, an advanced laminate, is now RoHS-compliant. The material can be made with a dielectric thickness down to 8 µm and a capacitance density of over 10 nF per sq. in. for embedding planar capacitance in circuit boards. When used as "power" and "ground" layers in a multi-layer PCB, it becomes an internal shared decoupling capacitor, eliminating many discrete surface mount capacitors and vias.

Molex Expands Multi-layer Flex Circuit Assembly Capabilities

(December 8, 2005) LISLE, Ill. — Molex Inc. now develops and delivers high-performance flex circuitry assemblies with up to 18 layers of conductive flex. In addition, Molex now has capabilities in the Americas to stamp flex circuitry and automatically circuit-etch, vacuum-laminate and drill multi-layer flex at the tightest tolerances.

New Substrate Technology Offers High Thermal Conductivity

(December 8, 2005) CORPUS CHRISTI, Texas — TT electronics IRC Advanced Film Division's Anotherm substrate technology consists of a thermally conductive aluminum alloy substrate insulated by a thin, chemically grown, anodized dielectric layer, with solderable screen printed conductors applied to the anodized layer. It is said to offer benefits over conventional, polymer-based insulated metal substrates (IMS).

Panasonic Leads Japan-based Factory Automation Show

(December 7, 2005) BUFFALO GROVE, Ill. — Panasonic Factory Solutions Company is hosting the Panasonic Factory Automation Show 2005, currently happening at Pacifico Yokohama, in Yokohama City, Japan, until December 9th.

'06 Designers Summit Caters to PCB Designers

(December 7, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' and its Designers Council's fourth annual IPC Designers Summit targets PCB designers, and will take place February 5–11, 2006, in conjunction with IPC Printed Circuits Expo and APEX, in Anaheim, Calif. PCB designers can obtain information on the latest technologies, such as embedded passives, lead-free materials, design-for-manufacture, high-speed design, and bare die.

Indium Grows Global Sales Team

(December 6, 2005) CLINTON, N.Y. — Indium Corp. has recently promoted Tony Howard to global account manager — in this position, he is responsible for promoting Indium's products and services by focusing on several key global accounts. He reports to Dave Preische, global sales manager.

Federal Electronics Debuts RoHS Conversion Services

(December 6, 2005) CRANSTON, R.I. — EMS provider Federal Electronics has debuted a services portfolio to aid OEMs convert and reengineer their products to comply with the European Union's RoHS directive. These regulations prohibit selling new electronic and electrical equipment in Europe if it contains more than trace levels of lead and five other elements by July 1, 2006.

Solectron's Global Sites Are Ready for RoHS Compliance

(December 5, 2005) MILPITAS, Calif. — Solectron Corp.'s global sites, which represent 85% of Solectron manufacturing capacity, have completed a lead-free, RoHS-compliant manufacturing qualification program. Solectron established an Environmental Compliance Leadership Team in January 2004 to develop and implement a lead-free and RoHS-compliant transition program across the company's manufacturing sites worldwide.

IPC Meeting Aims to Create Success Opportunities for Senior-level Leaders

(December 5, 2005) BANNOCKBURN, Ill. — Attendees at IPC's PCB Executive Management Meeting will learn the best practices of making a profit, a common goal that all PCB manufacturers share. The one-day event will be held on February 7, 2006, in Anaheim, Calif., together with the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference, to take place February 8–10, 2006, in Anaheim.

Lead-free Solder Wire Reduces Iron Tip Erosion

(December 5, 2005) EAST SUSSEX, England — The SR37-LFM-48S from Almit Technology is a lead-free wire designed to reduce the leaching of soldering iron tips and minimize the cost of tip degradation found at higher lead-free processing temperatures.

Surface Mount LEDs Target Harsh Environments

(December 2, 2005) PALO ALTO, Calif. — Agilent Technologies Inc.'s HSMx-A43xx series high-brightness red, red-orange, orange, amber, green and blue LEDs in the industry-standard Power PLCC-4 SMT form factor incorporate integral lenses to produce a 30° viewing angle.

Advanced Circuits Adds Lead-free Plating Finish to Offering

(December 2, 2005) AURORA, Colo. — Advanced Circuits now offers lead-free solder as a plating finish, providing an enhanced solderable finish for assembly that meets all legislation requirements for the European Union's RoHS Directive deadline of July 1, 2006.

Heat Sink Attachment System Offers Low Profile

(December 1, 2005) NORWOOD, Mass. — The MaxiGRIP heat sink attachment system from Advanced Thermal Solutions, Inc. (ATS) mounts heat sinks to flip chips, BGAs and other PCB components. The system features a plastic frame clip that snaps securely around a component's perimeter. A stainless-steel spring clip runs though the heat sink's fin field and fastens securely to the plastic frame. The spring clip easily removes, allowing a heat sink to be detached and re-attached.

NEDA Targets Supply Chain with RoHS/Lead-free Compliance Summit

(December 1, 2005) ATLANTA — The National Electronic Distributors Association (NEDA) will host "Negotiating the Economic, Legal and Logistic Challenges of RoHS/Lead-free Compliance," on January 19, 2006, in San Jose, Calif.

Chip Inductors Offer Low Rdc and High-current Operation

(November 30, 2005) SCHAUMBURG, Ill. — The LB3218 wire-wound chip inductor from Taiyo Yuden combines the functionality of two 3225-size low-resistance and high-current inductors into a single 3218-size device. The inductor is suitable for use in power supply circuits of digital still cameras, camcorders, VCRs and other commodity-type equipment.

Indium Appoints Asia Pacific Market Development Manager

(November 30, 2005) CLINTON, N.Y. — Bill Brunstedt has joined Indium Corporation as the Asia Pacific market development manager and will oversee business development efforts in that region with a focus on new and existing regional markets, general market strategies and new product requirements.

Cookson Nabs Patent for Stencil Software

(November 29, 2005) JERSEY CITY, N.J. — The U.S. Patent Office awarded patent #6,938,227 B2 to Cookson Electronics Assembly Materials Group for its ALPHA DIMENSIONS stencil configuration, design and ordering software, effective August 30, 2005.

Optical Chamber Delivers VUV Laser Beams

(November 29, 2005) HOLLIS, N.H. — J P Sercel Associates (JPSA) has introduced a large-format vacuum UV (VUV) optical chamber for UV excimer laser beam delivery systems that integrates with JPSA's Microtech MBD2 industrial-grade Beam Delivery System (BDS). Lenses, beam-expanding telescopes, beam homogenizers, spacers and other components can be positioned in the chamber and integrated into the BDS using JPSA's universal dovetail mounting system.

Book-to-Bill Ratio for October '05 Shows Decline

(November 29, 2005) BANNOCKBURN, Ill. — Based on monthly data collected from PCB producers that participate in IPC's monthly PCB Statistical Program, October 2005's North American rigid PCB industry book-to-bill ratio rose to 1.14, while the flexible circuit book-to-bill ratio declined sharply to 1.10. Combined, October's book-to-bill ratio declined slightly to 1.13.

SOIC Package Qualifies for Lead-free Manufacturing

(November 29, 2005) IRVINE, Calif. — A lead-free SOIC package from the electronics group of Henkel that integrates the company's GR828H mold compound with the Hysol QM1519 die-attach adhesive has received customer qualification. Designed for 16- and 14-lead SOIC packages, the material is said to combine the molding characteristics, high productivity and low-wire-sweep properties of the GR282H with the adhesive strength of the Hysol QM1519.

Planar Heaters Suit Multiple Applications

(November 22, 2005) GLENROTHES, Scotland — TT electronics BI Technologies SMT Division's planar heater products with ratings up to 50 W are suitable for military, computing, telecom, medical and commercial applications in surface mount, thru-hole and custom-profiled versions.

IPC Seeks Technical Papers for 12th Lead-free Conference

(November 22, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and JEDEC–the Solid State Technology Association announce the 12th International Conference on Lead Free Electronic Components and Assemblies, to take place March 6–8, 2006, in Santa Clara, Calif. Both associations are seeking technical papers from environmental menagers and technical staff on relevant subjects.

The Formation of Whiskers on Electroplated Tin Containing Copper

The probability of whisker growth on as-grown tin(Sn) electrodeposits has been measured as a function of copper(Cu) addition to a commercial bright methanesulfonate electrolyte

Indium Engineer Obtains SMTA Certification

(November 21, 2005) CLINTON, N.Y. — Indium Corp.'s Eric Bastow, a technical support engineer, has been awarded SMTA Certified Process Engineer certification, one of the electronics assembly industry's most respected signs of process knowledge and expertise.

New Die Attach Adhesive Combats Substrate Warpage

(November 21, 2005) SAN DIEGO — Advanced Applied Adhesives (AAA)'s AAA3000 Teflon (PTFE)-filled, electrically non-conductive adhesive is said to resolve the substrate warpage problem from attaching large, thin die on thin, organic substrates. Its polymer design offers a 32-MPa modulus, hydrophobic chemistry and hot adhesion. Its 260°C Moisture Sensitivity Level performance has been confirmed by beta-site testing.

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