ATExpo — Call for Speakers

(December 6, 2006) ROSEMONT, Ill. — Canon Communication's Assembly Technology Expo (ATExpo) — in conjunction with Electronics Assembly Show, National Manufacturing Week, and Quality Expo — is accepting submissions for paper, panel, and half-day workshop speakers through February 1, 2007. The shows take place September 24 – 27, 2007, in Rosemont.

Isola Improves RoHS-compliant Substrate

(December 6, 2006) CHANDLER, ARIZONA — Isola Group s.a.r.l. commercially released an improved generation of IS415, a 200°C T_g product with lead-free compatibility and strong signal integrity. Electrical loss numbers reach 0.009 using the splitpost resonant cavity method. With Bereskin stripline testing loss equals around 0.0135 at 10 GHz.

SMTAI — Call for Papers

(December 6, 2006) MINNEAPOLIS — SMTA International, October 7 – 11, 2007, in Orlando, Fla., is soliciting abstracts for technical papers, as well as potential course descriptions.

Flexible Dual-head Soldering System Intros

(December 6, 2006) PLEASANT PRAIRIE, Wis. — PROMATION Inc. introduced the PRO 6 series of robotic soldering systems, including the 6Td.

Guide Offers Tips on Flex Circuit Design

(December 6, 2006) MINNEAPOLIS — Minco released the "Flex Circuits Design Guide" for use, in conjunction with IPC design standards, in designing and integrating flexible circuits.

TXP's iPhotonics Division Finalizes License Agreement With Siemens for ONT Technologies

TXP Corporation, a global provider of Pre-Manufacturing Services for the electronics and telecommunications industries today announced that it has finalized its license agreement with Siemens Networks Germany granting access to more than 15 patents surrounding its Optical Network Terminal (ONT) technology

Indium Nabs 4^th F&S Honor

(December 5, 2006) CLINTON, N.Y. — Frost & Sullivan awarded Indium Corporation the 2006 Global SMT Solder Paste Customer Value Enhancement Award at a ceremony in San Antonio, Texas. Deepa Mathew, research analyst at Frost & Sullivan, presented the award, citing Indium's select customer group and depth of experience, particularly with lead-free.

Huntsman & UL Partner on RoHS Compliance

(December 5, 2006) THE WOODLANDS, Texas — Huntsman Corporation selected Underwriters Laboratories Inc. (UL) as its RoHS-compliance partner, and will begin the application process to receive the UL RoHS mark. UL created its restricted substances compliance program to help manufacturers demonstrate due diligence when complying with the EU's RoHS Directive. UL provides test services to determine levels of hazardous materials.

Cookson Restructures

(December 4, 2006) JERSEY CITY, N.J. — Cookson Electronics Assembly Materials (CEAM) will reorganize its manufacturing operations in the North America region, incorporating a new manufacturing plant and shifting some production offshore. Implementation will occur over the next 6 – 12 months.

Henkel Acquires Taiwan Solder-sphere Maker

(December 4, 2006) IRVINE, Calif. — The electronics group of Henkel acquired Taiwan-based Accurus Scientific Co. Ltd. The manufacturer produces solder spheres and type 1 – 7 solder powders for electronics packaging and PCB assemblies. By acquiring a company headquartered in Tainan, Taiwan, Henkel expects to gain technical and market support in that region.

Photo Stencil Upholds ISO 9001:2001

(December 4, 2006) COLORADO SPRINGS, Colo. — Photo Stencil completed ISO 9001:2000 recertification, with registration issued by Orion Registrar, Inc. The quality-control standard covers design, manufacture, and sales of stencils, screens, and templates.

IPC — Calling All PCB Designers

(December 4, 2006) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries and its Designers Council will host the Designers Summit, February 15 – 22, 2007, in Los Angeles. The event allows PCB designers to participate in activities and educational sessions, and provides resources on high-speed, advanced technologies, and design for lead-free. The summit occurs in conjunction with APEX and IPC Printed Circuits Expo.

Sarantel and Sanmina-SCI Announce Asian Outsourcing Relationship

Sarantel, a leading manufacturer and supplier of filtering antennas for wireless devices is today pleased to announce that it has signed a memorandum of understanding on outsource manufacturing and distribution with Sanmina-SCI. Sanmina-SCI.

Valor, MYDATA Integrate

(December 1, 2006) YAVNE, Israel — Valor Computerized Systems Ltd., invited by MYDATA, joined the equipment manufacturer's third-party partnership program, further integrating Valor's engineering software with MYDATA hardware. The partnership is expected to optimize MYDATA system usage for parts and panel handling.

Plexus Reorganizes Management

(December 1, 2006) NEENAH, Wis. — Plexus Corp. announced changes to executive management — promoting Paul L. Ehlers and Michael T. Verstegen.

KEMET Releases "Green" Capacitors

(December 1, 2006) GREENVILLE, S.C. — KEMET Corporation introduced RoHS-compliant versions of its commercial-molded radial, and high-voltage radial capacitors, as part of a push for environmentally friendly component lines.

Jabil Plans to Launch Cell Phone Assembly in Ukraine

Jabil, that has been supplying electronic devices in the US and Europe for forty years, is planning to open an assembly line in Ukraine in spring 2007.

Taiwan's Flex Companies Cluster in East China

(November 30, 2006) TAIPEI, Taiwan — A group of specialized Taiwan-based manufacturers and suppliers of flexible copper-clad laminate (CCL) materials formed a flex PCB industry cluster to expand into the China market. Production plants in China could enable Taiwan-based companies to directly ship products to downstream customers.

Isola Revamps IS620

(November 30, 2006) CHANDLER, Ariz. — Isola Group S.a.r.l. used process changes, without adjusting the chemical make-up, to improve dielectric and thermal performance of IS620, a base material for low-loss, high-speed space.

Celestica's Abrupt CEO Departure Raises Questions

Shares of Celestica closed Tuesday's trading session down 4.4% following the abrupt departure of the electronics manufacturing company's chief executive.

Taiwan Industry Intensifies "Green" Manufacturing

The exhibition highlighted Taiwan's eco-friendly material processes, components, products, information management, and implementation services.

Elprint Establishes Flex-circuit Production

(November 29, 2006) BERGEN, Norway — Elprint announced commercial readiness for flex-circuit manufacturing at its Bergen production site. The company estimates that a single-sided flex board will take equivalent time in production as a two-layer rigid board.

US-Based Axiom Electronics Announces Management Buy-Out

Axiom Electronics LLC announced today the completion of a management buy-out of the company from its former parent Ambitech International of Chatsworth, California.

Axiom Finalizes Buyout

(November 28, 2006) BEAVERTON, Ore. — Axiom Electronics LLC completed a management buyout from former parent company Ambitech International (Chatsworth, Calif.). Axiom's transition to an independent operation will generate an entrepreneurial atmosphere, according to Robert Toppel, president.

ZESTRON Releases Russian Site

(November 28, 2006) MANASSAS, Va. — ZESTRON America released its Website in Russian, making the site accessible in a total of six languages.

XXX Enables 3-D Inspection

(November 28, 2006) SAN CLEMENTE, Calif. — YESTech released a CT tomography option, XXX, for all YTX-3000 systems, enhancing analysis of complex interconnects.

Africa Discusses E-waste at COP8

(November 28, 2006) NAIROBI, Kenya — Like the EU's RoHS, China RoHS, and WEEE, the Basel Convention on the Control of Transboundary Movements of Hazardous Wastes and their Disposal classifies electrical and electronic waste and hazardous substances. The convention, and proposed amendments, will be discussed in the World Forum on E-waste, November 30 in Nairobi, as part of COP8. Several African countries see imports of e-waste, for incineration or landfill disposal, increasing rapidly.

Kyzen Appoints Manufacturer's Representative

(November 27, 2006) NASHVILLE, Tenn. — Kyzen Corporation appointed Germany-based Peter Jordan GmbH as manufacturing representative for Germany, Austria, and Switzerland.

Inovaxe Names Midwest Rep.

(November 27, 2006) SARASOTA, Fla. — Inovaxe Corp. named CR Tech, LLC, of Grafton, Wis., as manufacturing representative for the Midwestern U.S.

Event Explores Printed Electronics

(November 27, 2006) PHOENIX — Printed Electronics USA 2006 released its roster of speakers and topics for the conference and technical sessions on December 5 – 6 in Phoenix. Organizers expressed interest in examining technical, financial, and other aspects of printed circuits.

October Book-to-Bill Dips Below Parity

(November 27, 2006) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries announced a North American combined rigid and flex PCB book-to-bill ratio of 0.99 for October. The first drop below parity in about two years can be attributed to increased flex circuit shipments in October and August and September shipment increases for rigid PCBs. The rigid PCB industry ratio decreased from 1.01 in September to 0.99, while flexible circuits remained at about 0.91.

Sanmina-SCI Axe 95 in Sweden

This is the second round of lay-offs at the plant within a short period of time. Sanmina-SCI announced in June that 20 employees had to be removed form the plant.

Jabil to Acquire Taiwan Green Point Enterprises

"We are thrilled to announce this deal with Green Point Enterprises - a market leader in advanced electro-mechanical manufacturing and services for the mobile product and consumer market,"

DEK CEO Joins SMEMA

(November 22, 2006) FLEMINGTON, N.J. — John Hartner, CEO of DEK, was appointed to the steering committee of the IPC's SMEMA Council.

VISION Awards Deadline Approaches

(November 22, 2006) NASHUA, N.H. — The annual SMT VISION Awards program celebrates exceptional services and products introduced between January 1, 2006, and December 31, 2006. The deadline to submit for award consideration is December 1, 2006.

LPKF Promotes Greene

(November 22, 2006) WILSONVILLE, Ore. — LPKF Laser & Electronics announced that the company promoted Jim Greene to vice president of marketing, to help position the company for future growth. Greene will take responsibility for marketing in North America.

EIS Fabrico Hires, Adds Equipment

(November 22, 2006) KENNESAW, Ga. — EIS Fabrico expanded support for customers in Mexico with the addition of specialist Carlos Medrano. Medrano will bring technical, manufacturing service, and engineering knowledge from 25 years experience in flexible materials. As technical marketing specialist, he will manage customer sales and service in the country, and provide technical support to the global sales staff.

Cogiscan Hires Management in Europe

(November 22, 2006) BROMONT, Canada — Cogiscan added Bruno Meier as European sales manager, based near Zurich, Switzerland. Meier will work with direct customers in Europe and support global business partners in that region.

Capacitor Targets Short-circuit Failure

(November 20, 2006) MYRTLE BEACH, S.C. — AVX Corporation released a ceramic capacitor to reduce short-circuit failure, with minimum flexure of up to 5 mm, without internal cracks. Terminated with proprietary FLEXITERM technology, the FLEXISAFE capacitors are designed to absorb shock and prevent internal cracking due to board flexure and temperature cycling damage.

Nordson Acquires Dage Holdings

(November 17, 2006) WESTLAKE, Ohio — Nordson Corp., based in Westlake, Ohio, acquired Dage Holdings Ltd. of the U.K., subject to approval from the German Federal Cartel Office. The companies withheld purchasing terms.

Sanmina-SCI Fourth Quarter Revenue Slides 2%

Sanmina-SCI Corporation, a leading global electronics manufacturing services ("EMS") company, today issued non-GAAP financial guidance for fiscal year ended September 30, 2006 and its first fiscal quarter 2007.

Micro-dot Valves Dispense Various Viscosities

(November 16, 2006) FAIR LAWN, N.J. — I&J Fisnar released three distinct dispensing heads to suit tasks varying from high-viscosity fluids to dispensing abrasive materials.

DEK Commits to Alternative Energy

(November 16, 2006) Flemington, N.J. — DEK promoted Darren Brown to alternative energy development manager, as part of a global market initiative for alternative-energy technologies.

Soldering, Critical Issues Examined at APEX

(November 16, 2006) BANNOCKBURN, Ill. — More than 50 full- and half-day courses will provide IPC Printed Circuits Expo/APEX/Designers Summit 2007 attendees with practical information on current and future critical issues. The educational courses will take place February 18-19, 22 in Los Angeles, Calif.

Video Stars RoHS-screening Solution

(November 15, 2006) WOBURN, Mass. — Innov-X Systems released an online video demo focused on RoHS screening to help companies learn about handheld, X-ray fluorescence (XRF) RoHS-compliance screening solutions. The product demo features a handheld energy-dispersive XRF (EDXRF) analyzer, specialized RoHS software information, and details about the company's capabilities.

KIC Develops Automatic Profiling System

(November 14, 2006) SAN DIEGO, Calif. — KIC introduced KIC Vision, an automatic profiling system, for a low-cost alternative to manual verification profiling for reflow processes. The company claims that the automatic profiling will maintain production quality and process documentation standards achieved by periodic manual profiling, without interrupting production flow or additional equipment.

iSuppli and Data Garage Merge

(November 13, 2006) EL SEGUNDO, Calif. — U.S.-based market-intelligence firm iSuppli Corp. will merge with Data Garage Inc. of Japan, creating an analysis firm covering electronics industries in Japan and globally.

EVS International Expands

(November 13, 2006) ISLE OF WIGHT, U.K. — EVS International moved to a new facility located in the Porchfield Business Park, Porchfield, Newport, Isle of Wight.

SWEPEX, SMTA Co-locate for Technical Talks

(November 13, 2006) PLANO, Texas — The SMTA Dallas Chapter will co-locate technical presentations with the Southwest Electronics Production Exposition (SWEPEX), November 14 and 15, 2006 in Plano, Texas.

SMTA Elects Board of Directors

(November 13, 2006) MINNEAPOLIS, Minn. — The SMTA announced election results for the Board of Directors term, which began late September 2006, reelecting president David Raby of STI Electronics, Inc.

When Removing Hazardous Substances from Electronic Components Makes Sense Technically and Economically

This interview with Joel Deutsch explains the conversion process and how it can solve the lifetime buy dilemma.

The Birth of Unovis

This new player focused on high-end PCB assembly and semiconductor packaging assembly has big plans for its new, global business.

iNEMI Mobilizes for Tin/lead BGAs

(November 9, 2006) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) consortium organized "Sn/Pb BGA Availability Task Group" to address the needs of OEMs exempt or out-of-scope from the RoHS Directive. The task group scheduled a workshop to bring together OEMs with the BGA supply base on January 24, 2007, in or near San Jose, Calif.

Asymtek Names GM in China

(November 9, 2006) CARLSBAD, Calif. — Asymtek named Frank Wang to the position of general manager, China. Wang will direct all facilities, operations, sales, and support services for dispensing products and systems in that region. Asymtek has expanded to three offices and two applications labs in the past two years, and other lab is in construction.

Illinois Tool Works Inc. To Acquire Speedline Technologies Inc.

ITW is a $12.8 billion in revenues diversified manufacturer of highly engineered components and industrial systems and consumables.

ITW to Acquire Speedline Technologies

(November 8, 2006) FRANKLIN, Mass. — Illinois Tool Works (ITW — Glenview, Ill.) has signed a definitive agreement to acquire Speedline Technologies, Inc., from KPS Special Situation Funds, according to company press release. Terms of the transaction were not disclosed and are subject to normal regulatory approvals.

Cookson Predicts Corporate and Industry Direction

(November 8, 2006) LONDON — Cookson Group plc discussed company standings and statistics on the electronics industry at large during a meeting for analysts and shareholders. The meeting focused on the transition to lead-free products, expansion in China, raw materials, and other factors that could encourage profitable industry growth.

RoHS-compliant Adapter Eases Upgrades

(November 8, 2006) FRENCHTOWN, N.J. — Aries Electronics introduced a RoHS-compliant version of its SOWIC-to-DIP Correct-A-Chip adapter, which enables users to upgrade to a small-outline wide integrated circuit (SOWIC) from a dual in-line package (DIP) without changing PCB layout.

Flextronics Downgraded by Fitch

The ratings downgrade reflects Fitch's expectations that Flextronics will continue to operate near historically low margin levels

Flextronics Inaugurates Facility in Ciudad Juarez, Mexico

Flextronics' Ciudad Juarez operations increase the company's existing operations in Mexico, which include an industrial park in Guadalajara and a manufacturing facility in Aguascalientes.

Solectron Electronics Set for Demerger

The demerger was taken for the company to focus on each of its business, EMS and Electronic Components, independently.

DEK Extends Quality Control Partnership

(November 6, 2006) FLEMINGTON, N.J. — Having completed a solder paste inspection development project, DEK announced it will continue collaborating with vision systems partners for quality control projects.

SMTC Expands in Western U.S.

(November 6, 2006) TORONTO, ON — EMS provider SMTC Corporation expanded operations in the western U.S. with increased presence in San Jose, Calif. Carl Munio and Russ Morrow joined SMTC's western division to guide corporate development. The company also has reconfigured its footprint toward more manufacturing and configure-to-order capacity at the San Jose facility — with assembly, testing, box build, final product integration, and global supply-chain logistics.

Invertible Dust Remover

(November 6, 2006) DERBYSHIRE, England — Electrolube introduced the EADPI invertible Airduster dust and airborne contamination removal for delicate or inaccessible areas of electrical and electronic equipment. The product uses a high-pressure air blast to remove particles.

Foxconn Plans Massive China Investments

Foxconn, the world's largest contract maker of electronics products, including the iPod and PlayStation 2, plans to invest US$1 billion at a new technology industrial park in Huai'an, China, and is looking to further expand to the nation's interior.

Manncorp Expands San Diego Facility

(November 3, 2006) SAN DIEGO, Calif. — SMT assembly equipment provider, Manncorp, will add 4,000 square feet of space to its West Coast location to meet growing demands for pick-and-place machines, lead-free wave solder systems, and reflow ovens.

Digi-Key to Distribute Samtec Products

(November 2, 2006) THIEF RIVER FALLS, Minn. And NEW ALBANY, Ind. — Digi-Key Corporation and Samtec, Inc. have signed a global distribution agreement, wherein Digi-Key will distribute Samtec's PCB-level interconnects, cable assemblies, high data rate cables, and flex assemblies.

Fawn Electronics Rebuilds

(November 2, 2006) WILSON, N.C. — Following a fire in December 2005 that destroyed its Elm City, N.C. site, Fawn Electronics Company announced plans to build a new manufacturing site in the Nashville Business Center in Nash County, N.C.

Assembléon Nabs Long-term Deal with PPEM

(November 2, 2006) VELDHOVEN, The Netherlands — Penning an agreement totaling more than 20 million Euro, Zhengjiang Pound Precision Electronics Manufacturing Co. Ltd. (PPEM) has chosen Assembléon as a long-term production technology partner, and will use the company's single-platform, A-series pick-and-place system at its Jurong, China facility.

Eliminating Microvoid Risk Via An Optimized Surface Finish Process

When a large number of them sit together at the PCB interface, they can pose a reliability concern. There seems to be a connection to the immersion silver PCB surface finish.

Plexus Reports Fourth Quarter and Fiscal 2006 Revenues and Earnings

Revenues for the full year were a record $1.461 billion, a 19% increase over the prior year. Net income for fiscal 2006 was a record $100.0 million.

Hitachi France Installs Valor Pre-production Suite

(November 1, 2006) YAVNE, Israel — Valor Computerized Systems installed its Trilogy 5000 pre-production engineering solution and Valor Parts Library (VPL) at Hitachi's Orleans (Loiret), France, manufacturing facility, which specializes in assembling complex boards for Hitachi computer product applications.

Trade Visit Examines China's PCB Market

(November 1, 2006) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries has established a trade visit to China to better understand the direction of the Chinese PCB industry, and how it will affect the global market. The mission will run in conjunction with the 2006 International Printed Circuit and Electronics Assembly Fair in Dongguan, China, December 6-8, 2006.

Hon Hai's Third-Quarter Profit Rises to Record on Music Players

The company's net income rose 36% to NT$15.1 billion ($454 million) in the third quarter ended Sept. 30.

Lead-free Solder Wire Incorporates Polymers

(October 31, 2006) LONDONDERRY, N.H. — Cobar Solder Products, a subsidiary of Cobar Group, will offer CobarCore lead-free cored wire solder for lead-free assembly applications.

MEPTEC Keynote Predicts End to Moore's Law

(October 30, 2006) SAN JOSE, Calif. — William Bottoms, Ph.D., will keynote the MicroElectronics Packaging and Test Engineering Council (MEPTEC) symposium "IC Packaging and Test Roadmaps: Device Trends Impact on Packaging and Test Technology and Supply Chain," on November 16, 2006, in San Jose, Calif. Bottoms' keynote will accompany four focus sessions on aspects of supply chains and roadmaps.

R.I.T.'s CEMA Receives Solder System

(October 30, 2006) ROCHESTER, N.Y. — A.C.E. Production Technologies donated a KISS 102 selective soldering system to the Center for Electronics Manufacturing and Assembly (CEMA) at the Rochester Institute of Technology (R.I.T.) in Rochester, N.Y.

Handbook Specifies Design Standards

(October 30, 2006) ST. LOUIS — The second edition of Geometrical Dimensioning and Tolerancing for Design, Manufacturing, and Inspection, by Georg Henzold, covers international design standards and revisions for geometrical product specifications.

Classes Shed Light on Vision Systems

(October 30, 2006) NATICK, Mass. — Cognex Corporation will offer "Cognex University," a national, company initiative created to illustrate vision system applications through seminars, workshops, and training sessions.

Celesica Reports $7 Million Mexico Loss in Third Quarter

Celestica's Mexico plant continued to operate at a loss in the third quarter, dampening the company's overall financial results.

MPI Installs Aegis Factory-wide

(October 27, 2006) PHILADELPHIA — Microboard Processing Incorporated (MPI) installed Aegis Industrial Software Corporation's NPI/MES product suite in its factory, upgrading from an Aegis system with new production introduction (NPI) and paperless documentation software.

DEK Fine-tunes Americas Operations

(October 27, 2006) FLEMINGTON, N.J. — DEK USA has reformed corporate focus onto four core printer support products — understencil paper rolls, PRO and PRO EF understencil cleaning chemistries, replacement stencil blades, and pre-saturated cleaning wipes.

PennWell Launches Online Job Service

(October 27, 2006) TULSA, Okla. — PennWell Corporation will operate PennTechJOBS, an online employment service meeting the recruitment needs of engineers in electronics, optoelectronics, nanotechnology, semiconductors, and other high-tech industries.

Flextronics: Developing in Emerging Markets (India and Ukraine)

Flextronics' Vice President of Global Procurement details his company's expansion strategy in developing markets using India and the Ukraine as examples.

X-ray System Inspects Hidden Features

(October 26, 2006) SAN CLEMENTE, Calif. — YESTech released its YTX-6000 inline automated X-ray inspection (AXI) system, said to fully inspect hidden features such as solder joints or components under radio frequency (RF) shields. Algorithms are used to perform PCB, package, and other electronic assembly inspections.

Agilent Rearranges Financial Team

(October 26, 2006) SANTA CLARA, Calif. — David Cooper, senior vice president finance and treasurer, will leave Agilent Technologies, Inc., effective Nov. 3, 2006, to join Art.com, Inc., as its chief financial officer (CFO).

Agilent Licenses Test Target Technology

(October 26, 2006) SANTA CLARA, Calif. — Agilent Technologies will license Medalist bead-probe technology, a methodology for placing solder beads directly onto PCB signal traces, to Medalist 3070 and i5000 in-circuit test (ICT) customers, as well as to vendors of other ICT equipment.

Flextronics Announces Record Sales and Earnings

Net sales from continuing operations for the second quarter ended September 30, 2006 were a record high $4.7 billion, which represents an increase of $894 million, or 23%, over the year ago quarter.

Thermal Material Suits Silicone-sensitive Apps.

(October 25, 2006) ELKTON, Md. — W.L. Gore & Associates introduced the GORE POLARCHIP thermal interface material (TIM) family dedicated to silicone-sensitive applications. The family includes soft silicone-free thermal gap pads and reportedly eliminates outgassing and oil migration (bleeding) problems associated with silicone.

Partners Release Fiber Laser Marking System

(October 25, 2006) BRANFORD, Conn. — Lasercut, Inc., with partners El.En. Group and Lasit, released a 20-W pulsed fiber laser marking system that is said to etch metals and plastics to a reliability rating of 100,000 hours. The companies have collaborated since 2003.

Optimal Electronics and B-Global Team

(October 25, 2006) AUSTIN, Texas — Optimal Electronics Corporation of Austin, Texas, formed a strategic partnership with B-Global Technology of Penang, Malaysia. The companies are collaborating for support, business development, and future product development.

SMT Welcomes Advisory Board Members

SMT Magazine welcomes Laura J. Turbini, Ph.D., and Harald Wack, Ph.D., to its Editorial Advisory Board. The Board offers insight on the industry, future trends, and market technology; members write columns such as "Speaking of Process Optimization," "Speaking of Cleaning," and more. Turbini and Wack will join 10 other industry experts that analyze the SMT industry from every possible angle.

Celestica's Eighth Annual "Partners In Performance" Awards Honour Supplier Excellence In 2005

"Celestica's responsive global supply chain helps our customers to quickly meet changing market demands," said John Boucher, Chief Supply Chain and Procurement Officer, Celestica.

Drop-in Cleaner Removes Flux

(October 24, 2006) MANASSAS, Va. — As a drop-in replacement for high- and medium-pressure batch or inline systems, the ATRON AC 205 acts as a mild cleaner to remove flux residues. The monothanolamine-free, alkaline, aqueous-based cleaning agent from ZESTRON AMERICA reportedly leaves solder joints and pads bright, and is compatible with aluminum and epoxy surfaces.

Boundary-scan Solution Addresses Faults

(October 23, 2006) SANTA CLARA, Calif. — With the introduction of IEEE 1149.6 for advanced digital networks, JTAG Technologies has created a support program to run "dot6" testing. The 1149.6 standard updates 1149.1 ("dot1") specifications, which allowed a certain amount of erroneous pass-fail indications.

Workstation Enables Post-AOI Sorting

(October 23, 2006) KENOSHA, Wisc. — PROMATION added a workstation to its family of post-AOI sorting and rework equipment. The ENC-700F aids in inspection and touch-up on failed boards post-AOI.

Swedish EMS Eyes Russia

The Swedish EMS provider EDC is now looking at the Russian market to possibly cover the losses from the shrinking order books for the Swedish market.

Indium Hosts Global Tech. Summit

(October 20, 2006) CLINTON, N.Y. — The 4^th annual Global Technology Summit at Indium Corporation was held September 11 – 15, in Clinton, N.Y., bringing together more than 40 technical support and applications engineers from Asia, Europe, Mexico, and the U.S.

Sunburst J-STD-001 Certified

(October 20, 2006) ERIE, Pa. — Contract manufacturer (CM) Sunburst Electronics fulfilled requirements to become a J-STD-001 facility, expanding operations into military and other high-reliability electronic markets.

Nan Ya Orders Camtek AOI

(October 20, 2006) Migdal Ha'Emek, Israel — Taiwan-based Nan Ya PCB ordered nine Camtek automated optical inspection (AOI) systems, delivered Q'03 and Q'04 2006.

Hwang Lectures on Lead-free

(October 20, 2006) LAS VEGAS — SMT Editorial Advisory Board member Jennie Hwang, Ph.D., will share lead-free development knowledge and real-world production know-how in seven half-day tutorials to take place in Las Vegas, November 6 – 9.

Jabil Mexico is Working Hard to Climb the Value Chain

As a result of the increase in the skills and capabilities of its Mexican workforce Jabil is seeing higher value work return to Mexico from Asia, as they meet the demands of their NAFTA Customers

MATELEC 2006 Promotes International Industry

(October 19, 2006) MADRID, Spain — MATELEC, Salón Internacional de Material Eléctrico y Electrónico, will promote commercial development, industry evolution and consolidation, and sustained growth and demand, at the 13^th meeting of the exhibition in Madrid, Spain, October 24 – 28, 2006. MATELEC acts as a forum for technology and service introductions, and trends analysis.

Software Upgrade for Verification Service

(October 19, 2006) HUDSON, N.H. — CeTaQ Americas introduced a software upgrade for the company's mobile testing unit and its CmController5 Compact, a universal measuring and analysis tool for machine capability analysis (MCA) testing.

Taiwan PCB, SMT Industries Focus on IC Substrate Manufacturing

TPCA Chairman T.J. Tseng says the island's PCB sales continue to be strong--of mainland China's total turnover for this year, Taiwan-invested PCB makers in the region comprise 35 percent of mainland China's industry.

Digi-Key Expands with Winbond America, CR Magnetics

(October 18, 2006) THIEF RIVER FALLS, Minn.; SAN JOSE, Calif.; and ST. LOUIS, Mo. — Digi-Key Corporation will expand an existing distribution agreement with Winbond Electronics Corporation America to include Europe. The distributor will also begin selling CR Magnetics Inc. globally.

ODMs: Chip Spending 2006

(October 18, 2006) EL SEGUNDO, Calif. — Taiwanese original design manufacturers (ODMs) will dominate purchasing in semiconductor chips in 2006, primarily for PC manufacturing, says iSuppli report "ODM Semiconductor Spending Analysis." Quanta, Asustek, and Wistron — the top three spenders worldwide — are all based in Taiwan. All three also reportedly use the majority of chips purchased to make PCs, notably laptops.

Design Software Revision to Launch at Z-DAC

(October 18, 2006) MUNICH, Germany and WESTFORD, Mass. — Zuken's version 9.0 of PCB and packaging design suite CR-5000 includes the integrated high-speed design and analysis environment Lightning. It will launch at Z-DAC '06, the European Annual Customer-to-Customer Technology Conference, October 24 – 26, 2006, in Ulm, Germany.

Benchmark Electronics Signs Definitive Agreement to Acquire Pemstar

Based on Benchmark's closing price of $28.93 on October 16, 2006, the transaction values Pemstar at $4.63 per common share, or approximately $300 million including the assumption of Pemstar net debt. The merger is expected to be a tax-free exchange of common shares.

Benchmark to Acquire Pemstar

(October 17, 2006) ANGLETON, Texas — Benchmark Electronics, Inc., and Pemstar Inc. signed a definitive merger agreement, expected to be a tax-free exchange of common shares. The transaction puts Pemstar's value at $300 million, including assumption of the company's net debt. Pemstar reported fiscal year 2006 revenues at $871 million.

KEMET Cuts Costs, Reduces Staff

(October 17, 2006) GREENVILLE, S.C. — KEMET Corporation will cut costs in its Monterrey, Mexico, facilities by reducing employment by about 400 people. The company states that a combination of normal attrition, release of temporary employees, and a reduction-in-force of roughly 120 workers, will comprise the cost-cutting initiative. Severance and related costs will total approximately $800,000

Cobrush Applies Flux in Tight Spaces

(October 16, 2006) LONDONDERRY, N.H. — The Cobrush flux applicator from Cobar Solder Products comprises a compact polypropylene body with a transparent cartridge, a bristle applicator tip similar to a paint brush, as well as a cap to prevent flux evaporation.

Paste Improves Stacked-die Assembly

(October 16, 2006) SAN DIEGO — A family of self-filleting die attach adhesives, AAA3300 from Advanced Applied Adhesives (AAA), offers properties comparable to die-attach film, in a paste. The self-filleting die attach adhesive is said to enable thin-die assembly at improved yields with conventional assembly techniques.

It's a Wrap: Mexitronica--Best Show in Years!

The Mexican electronics industry is back on its feet. PCB007's Steve Gold provides some closing comments.

TFI EMS Forecast Notes Narrow Profits

(October 13, 2006) ALAMEDA, Calif. — Technology Forecasters, Inc. (TFI), projects healthy growth with narrow profits for the EMS industry in the "Five Year Forecast of EMS and ODM Industries by Market Sector and Geography." Average annual growth should top 6% per year in global electronics production. Average net profitability showed no rise in the past year. Markets expansion should induce OEMs to outsource a greater percent of their total production.

Indium's French Connection

(October 12, 2006) UTICA, N.Y. — Indium Corporation added Accelonix Group as a distributor for France — expanding sales efforts for the European region. Accelonix will sell semiconductor packaging assembly materials, engineered solder, wafer- and chip-bump materials, solder pastes, fluxes, underfills, and other materials.

ESSEMTEC Places 4^th in Regional Award

(October 12, 2006) AESCH, Switzerland — The semi-annual Swiss Venture Club (SVC) Award Ceremony recognizes companies presenting essential and sustainable economic success and notable performance. ESSSEMTEC was rated 4^th out of more than 100 regionally-anchored companies in central Switzerland. As one of six finalists, the company received an award at the KKL Luzern ceremony late September.

Remote Monitor Links PDA, Thermal Info

(October 12, 2006) SAN DIEGO — KIC will run test marketing of a PDA process monitor that transfers real-time thermal process data from any KIC 24/7 on a reflow oven to an authorized PDA. The company believes PDA-based monitoring will improve data and process management, and reaction times associated with thermal issues.

Mexitronica Gets Off to a Strong Start

Several of the speakers we spoke with championed the need for education in Mexican electronics producing regions.

Simclar Announces Results for Second Quarter 2006

The company expects to report revenue for the quarter ended June 30, 2006 of $30,520,000, net income of $790,000, and earnings per share (basic and diluted) of $0.12.

Dynatech, Samsung Sign Agreement

(October 11, 2006) HORSHAM, Pa. — Dynatech Technology, Inc., will add sales and services for Samsung Techwin's SMT placement system lines in North America. The agreement is part of a steady progression since the companies first partnered in SMT assembly.

Implementing Lead-free Workshop Tackles Assembly Problems

(October 11, 2006) NASHUA, N.H. — Manufacturers facing challenges with lead-free assembly and a host of associated system changes — certification, failure analysis, traceability — can attend Implementing Lead-free: A Hands-on Workshop, October 16 – 19, hosted by SMT Magazine and the Rochester Institute of Technology (RIT) Center for Electronics Manufacturing and Assembly (CEMA) in Rochester, N.Y.

Horizon 02i Leads DEK Family

(October 11, 2006) FLEMINGTON, N.J. — DEK's next-generation Instinctiv printers combine options from established platforms to reportedly enhance cycle time, flexibility, and yield. The company released the Horizon 02i as the first in the Instinctiv family.

Reflow System Controls Temperatures

(October 11, 2006) NORTH BILLERICA, Mass. — BTU International, Inc. created the Pyramax 125 Air reflow system, which features forced impingement technology, 24" process capability, and operating temperatures which reach 350°C for a range of electronics manufacturing applications, notably lead-free.

The EASi Line Message

(October 11, 2006) ROSEMONT, Ill. — The Electronic Assembly Suppliers' Initiative, known as the EASi Line, at the Assembly Technology Expo, September 24 – 28, 2006, at the Donald E. Stephens Convention Center in Rosemont, Ill., is an exciting way to learn about the SMT process, because not only do engineers on the line explain each step as it happens, but you also get to leave the line with a prize.

Omron, Scientific Technologies Merge

(October 10, 2006) FREMONT, Calif. — Japanese automation provider Omron Corporation and North American Scientific Technologies (STI), which produces automation safe-guarding products, merged with shareholder approval. Omron acquired Scientific Technologies' safety products group (SPG); STI sold its automation products group (APG). The transaction value equaled $110.8 million.

Enthone Acquires Chinese Electroplating Entities

(October 10, 2006) WEST HAVEN, Conn. — Enthone, Inc., a business of Cookson Electronics, acquired Shenzhen Hua-Mei Electroplating Technology Co., Ltd.; and Hua-Mei Tianjin Electroplating Technology Co., Ltd. in China. The entity created by the acquisition will conduct business as Guangzhou Cookson Trading Company, Co., Ltd.; the October 1, 2006, sale brought Enthone from 51% ownership of the companies to 100%.

KEMET Honored at CARTS Europe

(October 9, 2006) GREENVILLE, S.C. — In recognition of a technical paper presented at the 2005 Capacitor and Resistor Technology Symposium (CARTS) Europe, three KEMET Corporation employees received honors from the 2005 CARTS delegates and program committee. Winning papers from 2005's symposium — held in Prague, Czech Republic, in October 2005 — were presented at CARTS Europe held September 25 – 28, 2006, in Bad Homburg, Germany.

MEM Ventures Acquires Artetch

(October 9, 2006) WEST SUSSEX, U.K. — Martin Morrell of MEM Ventures Limited acquired all share capital in Artetch Circuits. Artetch's Richard Wood-Roe, managing director; and Richard Evans, financial director, will support the handover in consultant roles.

Flextronics Details Global Expansion Strategy at European Supply Chain Convention

When deciding where to add manufacturing infrastructure, Flextronics' largest concern, O'Kelley said, is materials supply and pricing.

APEX Keynotes Look to Space, Future

(October 6, 2006) BANNOCKBURN, Ill. — Buzz Aldrin, Ph.D. and American astronaut, and three PCB industry guides will give their interpretations of the future at the IPC Printed Circuits Expo, APEX, and Designers Summit, February 20 – 22, 2007 in Los Angeles, Calif.

Photo Stencil Promotes Two Members

(October 6, 2006) COLORADO SPRINGS, Colo. — Photo Stencil, a company of Eagle Electronics, LLC, promoted Mike Burgess to vice president of sales and Val Quinones to director of sales. Both will continue to focus on customer service in these positions.

Gail Flower to Keynote SWEPEX

(October 6, 2006) PLANO, Texas — SMT Magazine editor-in-chief Gail Flower will provide a keynote address at the Southwest Electronics Production Exposition (SWEPEX), November 14 – 15, 2006, in Plano, Texas. At the November 15^th luncheon, Flower will interpret the progression of the SMT industry as a "dance," spinning "upside down and round."

GlobalTRONICS 2006 Notes RoHS Importance

(October 5, 2006) SINGAPORE — GlobalTRONICS, October 10 – 13 in Singapore, will emphasize the effect of the RoHS Directive on electronics manufacturing. Pooling design service, technology, and manufacturing service providers, the show will allow all aspects of SMT assembly to be represented and educated on environmentally friendly electronics manufacturing.

Pick-and-Place Head Targets High-throughput

(October 4, 2006) Hampton, N.J. — Ultra-low-mass, two-axis, and compact, IntellePro, Inc.'s IPROBE is a pick-and-place head targeted for high-throughput manufacturing that uses multiple, ganged heads. The product requires a 20-mm center and has a mass of 300 gms.

Zuken, Rio Partner on Chip to PCB Design

(October 4, 2006) MUNICH, Germany; WESTFORD, Mass.; and YOKOHAMA, Japan — Zuken and Rio Design Automation, with some collaboration from Magma Design Automation, will work in a cooperative sales and technical development program to generate an optimized design environment from chip to package to PCB.

Submicron X-ray Detects Below 1 µm

(October 4, 2006) WUNSTORF, Germany — The microme|x submicron, high-resolution system from phoenix|x-ray Systems and Services enables manual and semi-automated solder joint inspection of BGAs, CSPs, MLFs, and QFPs. The X-ray inspection machine offers detail-detection below 1µm, with a total magnification of up to 13.300×.

Transition Automation Hires VP

(October 4, 2006) NORTH BILLERICA, Mass. — Alden D. Lewis joined Transition Automation, Inc., as vice president of sales. Lewis will expand the squeegee systems company's sales department and help to integrate R&D developments into large-scale SMT production operations.

MW Associates Expands Team

(October 3, 2006) NAPLES, Fla. — MW Associations, a marketing agency serving the electronics industry has added Susan Woods to its management team.

Service Notifies of Part Changes

(October 3, 2006) ROCHESTER, NY — EMA Design Automation announced the availability of products and services for component event management. Provided by PCNAlert, the offering brings end-of-life and other supply chain related notices to PCB designers.

Book-to-Bill Strong, Should Continue

(October 2, 2006) BANNOCKBURN, Ill. — The North American rigid circuit book-to-bill ratio for August 2006 rose to 1.06, while the flexible book-to-bill ratio grew to 1.05, shows a recent release from IPC — Association Connecting Electronics Industries. The combined industry book-to-bill, encompassing rigid and flex circuits, was 1.05.

Awards Recognize Industry Products

(October 2, 2006) CHICAGO — In a September 27^th ceremony during SMTA International, 19 Global Technology awards were presented to companies within the electronics manufacturing industry. Attentiveness to lead-free manufacturing and assembly automation garnered specific praise.

ATExpo Concludes Three-Day Rosemont Run

One of the major announcements was the decision by the SMTA to split from ATExpo and start their own event next year.

Morey Corporation Invests in Innovation

Titan Optimizes PCB Plant

(September 28, 2006) AMESBURY, Mass. — Titan Global Holdings, Inc., will implement an optimization plan in its Mass.-based Titan East PCB plant. The process criteria will be based on a similar program implemented in the Titan West advanced circuit board production facility, located in Fremont, Calif.

Henkel Names Global Product Manager

(September 28, 2006) IRVINE, Calif. — Jason Brandi was appointed to global product manager for phase change and thermal adhesives within the electronics group of Henkel. The company noted the increasing importance of thermal management as part of the promotion.

Valor Introduces Lifecycle Management Toolset

(September 27, 2006) Israel — Valor Computerized Systems Ltd. announced vShare as a product life cycle management toolset that supports design for manufacture (DfM) collaboration between PCB design and engineering teams across global supply chains.

SMTAI Panel Summarizes Future Technologies

(September 27, 2006) CHICAGO — The lure of free beer and pretzels rarely fails to invoke a crowd. The Emerging Technologies panel at SMTAI drew attendees to explore trends in packaging, nanotechnology, lead-free, the EMS industry, RFID, and wireless technologies. The panel was an opportunity to discuss the various, and sometimes disparate, rapidly developing technologies that affect the surface mount industry.

Future Directions in Packaging at SMTAI

(September 27, 2006) CHICAGO — SMT's panel at SMTAI focused on the possibilities and trends opening up in the packaging realm, and the relevant surface mount technologies that accompany them. SMT editor-in-chief Gail Flower moderated the panel, with managing editor Michelle Boisvert to co-chair. The main point that could not be emphasized enough was the effect of 3-D packaging on the industry.

Siemens, Factory Logic Team for Lean Integration

(September 27, 2006) AUSTIN, Texas — As part of an OEM agreement, Siemens Automation & Drives (A&D) will integrate Factory Logic's Lean Operations Suite into its SIPLACE manufacturing solutions. This venture targets manufacturers and OEM suppliers looking to integrate lean capabilities on the factory floor.

Jabil Reports Record Fourth Quarter & Fiscal Year 2006 Revenues

We expect to open fiscal 2007 with another record quarter of revenue in the range of $3.1 to $3.3 billion and expect fiscal 2007 revenue growth of approximately 20 percent.

SMTAI Heads for Warmer Shores

(September 26, 2006) CHICAGO — The SMTA International Conference, currently taking place in Chicago, Ill., will move from the windy shores of the Great Lakes to the warm and breezy peninsular state of Florida.

Prices on Raw Materials Rise

(September 25, 2006) CHANDLER, Ariz. — Isola Group, S.a.r.l., announced prices in North America will increase in Q'04 2006, a measure used to cover rising costs for raw materials.

Plexus to Expand Capacity and Capabilities in Malaysia

The new facility will be Plexus' third plant in Malaysia and will provide an additional 364,000 square feet of manufacturing space for the company.

EMS Provider Adds Test Machines

(September 22, 2006) MONCHENGLADBACH, Germany — Schlafhorst Electronics expanded its test field by adding a SPEA-made flying-probe tester, type 4040 Hi-line. Schlafhorst operates manufacturing sites in Mönchengladbach, Germany and Lubsko, Poland.

SMT/HYBRID/PACKAGING Calls for Tutorials

(September 21, 2006) NUREMBURG, Germany — SMT/HYBRID/PACKAGING 2007, an exhibition and conference on system integration in microelectronics, is accepting applications for tutorial presentations in several packaging and assembly fields.

Industry Voices Call for U.S. RoHS

(September 21, 2006) CHICAGO — While EU member states adjust to RoHS guidelines, many members of the SMT industry in the U.S. are calling for similar standards domestically. Whether influenced by environmental concerns, component availability issues, global trends, or simply a desire to see laws on manufacturing and disposal standardized across all 50 states, several government, consumer, and industry groups have put forth proposals for RoHS- and WEEE-based documents in the U.S.

ESD Flooring Company Covers Shanghai

(September 20, 2006) Cleveland, Ohio — ICS Garland Inc. opened an office in Shanghai, China, which will be under the direction of Nina Tan, COO, ICS Garland. The company will operate manufacturing and marketing for electrostatic discharge- (ESD-) control flooring systems for the Asian region. The high number of electronics facilities manufacturing in China makes the area lucrative for an ESD flooring company, said Tan.

Lithium-ion Battery Woes Continue

By Meredith Courtemanche, assistant editor - - (September 20, 2006) TOKYO — A World Travel news release came into the Pennwell offices today, warning that both Korean Air and Australian Quantas Air have banned Dell and Apple laptops on flights. While this might be difficult for business travelers married to their portable offices, it raises more concerns for manufacturer reputation and marketability. Since the Dell recall was announced last month, ramifications have spread.

"Federal RoHS Legislation Is Imperative", Warns Newark InOne, As EU Law Takes Hold

"Increasing and varying state-by-state rules are already causing unnecessary complexity for electronic manufacturers and distributors who must try to track and meet them all."

Cadence Design-in Targets Memory

(September 19, 2006) SAN JOSE, CA — Cadence Design Systems, Inc., created the Allegro double data rate 2 (DDR2) design-in intellectual property (IP) portfolio with Altera of San Jose, Calif., and Micron, based in Boise, Idaho, to optimize DDR2 interfaces on PCBs.

Wire Dots Replace Glue on PCBs

(September 19, 2006) Haverhill, Mass. — Flextac Wire Dots create a wire-tacking system that replaces quick-set glues to attach jumper wires or pads for engineering change orders (ECOs) to PCBs. The CircuitMedic product consists of precut, thin, flexible polymer film membranes with an electronics-grade, permanent, pressure-sensitive adhesive coating on one side.

Synova Opens 2^nd U.S. Micromachining Center

(September 18, 2006) LAUSANNE, Switzerland — Synova will open its second U.S.-based micromachining center (MMC) in Boston, Mass., for high-precision electronics manufacturing. Set to open in January 2007, the center will operate in tandem with a West Coast site, under construction in Silicon Valley. Synova will use the facility as a competence center for demonstrations, sample tests, and application development.

Protean's Heimsch to Chair EMS Session

(September 18, 2006) READING, U.K. — The director and brand strategy specialist of Protean Marketing, Rich Heimsch, will participate as an industry expert at the 2006 European Supply Chain Convention (ESCC), October 4 – 5 in Cologne, Germany.

PROMATION Opens Texas Facilities

(September 15, 2006) KENOSHA, Wis. — To expand capacity of its automation segment, PROMATION, Inc., completed a move into two production buildings.

PartnerTech Acquires Hansatech Group

Aiming to further strengthen its presence in Europe, PartnerTech AB has acquired a 100 percent stake in The Hansatech Group in UK.

Elcoteq and Andrew Broaden Partnership

(September 14, 2006) IRVING, Texas — Elcoteq SE and Andrew Corporation signed a global, long-term manufacturing supply agreement that is expected to increase Elcoteq's 2007 net sales by about 80 million euros. Elcoteq will consolidate and manage the supply chain of Andrew's European filter business. The company will also facilitate Andrew's manufacturing and assembly in Mexico, on a turnkey basis.

Prototype PCB Reaches 16 Layers

(September 14, 2006) BERGEN, Norway — Elprint released the results of a test development to create a 16-layer board in its facility. Additional tests will be run to determine design rules for production.

AAA Names Reps

(September 14, 2006) SAN DIEGO — CAPLINQ Nederland became Advanced Applied Adhesives' (AAA's) representative in the Middle East, North Africa (MENA), and Europe, replacing the now-defunct Norel. Located in Amsterdam, the Netherlands, CAPLINQ was founded by Christopher Perabo, who previously held a field applications engineer post with Henkel's Semiconductor Materials division.

Tyco's Rhythm Solders Odd Forms

(September 14, 2006) HARRISBURG, Pa. — The Rhythm selective soldering system from Tyco Electronics presents solder from the underside of the board without additional tooling or accessories. This system is said to provide an effective entry point to solder thru-hole and odd-form components into surface mount and mixed-technology PCBs.

Zuken Updates Programs

(September 12, 2006) MUNICH, Germany and WESTFORD, Mass. — Zuken released its latest version of CADSTAR 9.0, a desktop PCB-design solution, along with updates to CADSTAR 3D, a version that enables 3-D design.

Valor Acquires Software from EO Tech

(September 12, 2006) YAVNE, Israel — Valor Computerized Systems Ltd. acquired numerous technologies from EO Tech GmbH (Switzerland), including software technologies that apply to inspection and test, workflow management, and quality control. EO Tech engineers will also join Valor's operations.

Kester Finalizes EasySpheres Agreement

(September 11, 2006) DES PLAINES, Ill. — Kester and EasySpheres have finalized a marketing and distribution agreement for Ultra-Spheres and TSF interconnect fluxes. Kester products will be inventoried and sold through the distributor.

Partnership Generates Board Manufacture Interface

(September 8, 2006) LAKE FOREST, CA and LAS VEGAS — Direct Logix and PROMS, Inc., announced a technology partnership that led to the creation of a fully developed, bi-directional interface between applications from the information management and manufacturing solutions suppliers.

MicroFETs Conserve Space, Energy

(September 8, 2006) SOUTH PORTLAND, Maine — Fairchild Semiconductor created 11 MicroFET MOSFETs for high-volume portable products. Thermally enhanced, compact, and low-profile, the power switches integrate proprietary Power Trench technology into a 2- × 2- × 0.8-mm molded leadless package (MLP). The line was designed to conserve space in compact, dense end-products.

Solectron Wins Multi-Year Manufacturing Contract from Sun Microsystems for StorageTek Products

"Over the years, Solectron has become a valued partner in helping to deliver on attributes that differentiate Sun from the competition, which is among the key reasons we chose Solectron for this contract."

SAW Oscillator Meets Jitter Requirements

(September 7, 2006) FORT MYERS, Fla. — The Model CVS575 622.08-MHz voltage-controlled SAW oscillator (VCSO) meets low-jitter-generation requirements for telecommunications applications. Crystek Corporation designed the surface mount VCSO for high-performance PLLs.

Intel Restructures

(September 7, 2006) SANTA CLARA, Calif. — Intel provided an overview of its restructuring plan for the long-term future, detailing reductions in workforce, merchandising expenses, capital, and materials to stay competitive in new markets and applications. Intel warns against focusing solely on the competition with AMD, which is "only a piece of this," according to Chuck Mulloy, corporate spokesman for Intel.

Richard L. Appleby Joins Elcoteq as Director of Americas Operations

Appleby's expertise includes management of operations, including manufacturing of desktop, workstation, and notebook computers, original design manufacturing (ODM), New Product Introduction, and supply chain.

IPC, CPCA to Hold Symposium

(September 6, 2006) BANNOCKBURN, Ill. — IPC?Association Connecting Electronics Industries, and the China Printed Circuits Association (CPCA) co-announced the third annual Global Board Technology Symposium, "Working Together to Advance Industry Capability," October 13 – 14, 2006, in Shenzhen, China.

EMA Listed on Inc. 500

(September 6, 2006) ROCHESTER, N.Y. — EMA Design Automation received the number 97 slot in the 2006 Inc. Magazine list of the 500 fastest growing privately held American businesses. This marks EMA's second consecutive ranking in the annual list, said Manny Marcano, president and CEO of EMA.

Traceability Solution Aids Automotive Industry

(September 6, 2006) YAVNE, Israel — Valor Computerized Systems, in response to rapid growth in technology-integration into vehicles, will target automotive manufacturers with its TraceXpert traceability software. The costs and dangers associated with vehicle recalls can be minimized with implementation of a full traceability system, said Henning Maerkedahl, executive vice president at Valor Denmark R&D.

Isola Group to Reduce Gas Consumption

(September 5, 2006) CHANDLER, Ariz. — Isola Group, SARL, a base materials designer, developer, and manufacturer, will soon complete a new energy-self-generation station at its Dueren, Germany, facility.

Eltek Awarded PCB Orders for Medical Equipment

(September 5, 2006) PETACH-TIKVA, Israel — Eltek Ltd. received two orders, valued at $1.2 million, for flex-rigid PCBs to be used in advanced medical equipment. The company will deliver the PCBs in Q'04 2006. Eltek has courted high-reliability PCB users in medical, aerospace, and military fields throughout 2006, stating U.S. and European market penetration as part of its corporate roadmap.

DENSO Robotics Selects AMT for Support

(September 5, 2006) ORION, Mich. — Applied Manufacturing Technologies, Inc., entered into an agreement with DENSO Robotics of Kariya, Aichi prefecture, Japan, to provide engineering and support services for the company's robots. Midwestern U.S. manufacturers, using DENSO robots, which need immediate service and training, will have access to AMT's 200 engineers.

Foxconn to Invest US$19.5M in China Subsidiary

The investment is targeted at the manufacturing and marketing of handsets and components, according to the company filing with the Taiwan Stock Exchange.

MicroStencil Names DEK Asia and Americas Distributor

(September 1, 2006) Flemington, N.J. — MicroStencil named DEK its sole distributor throughout Asia and the Americas for its fine-pitch stenciling product range, under DEK's Platinum brand. DEK will incorporate the products into its existing stencil technology.

July Book-to-Bill Remains Steady

(August 31, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries book-to-bill results for the North American PCB industry remained positive at 1.02. The rigid PCB sector held at 1.02, while the flexible circuit industry's ratio was 1.01. A ratio of more than 1.00 signals probable near-term growth, as demand is ahead of supply. The 1.02 ratio suggests modest growth in sales in the coming months, said Denny McGuirk, IPC president.

US Energy's AEC Enters Manufacturing Agreement with EdgeAccess

The Agreement has resulted in Purchase Orders exceeding $125,000 for 2006 and is expected to reach $3 million for 2007.

KIC Updates Thermal Software

(August 30, 2006) SAN DIEGO, Calif. — KIC has created version 2.3.0.0 for its KIC 24/7 thermal process monitoring system. The updated version includes bug fixes, improved printing capabilities, oven communication with SEHO reflow ovens, and improved alarm functionality.

Francisco Partners Acquires Universal, Hover Davis

(August 30, 2006) BINGHAMTON, N.Y. — Francisco Partners, a technology-focused private equity firm, has signed an agreement with Dover Technologies International to purchase Universal Instruments. The deal also includes the acquisition of Vitronics-Soltec (Stratham, N.H.) and Rochester, N.Y.-based Hover-Davis, Inc., which will be run as separate entities.

VJ's Cabral to Present on Rework

(August 30, 2006) LITTLETON, Mass. — Al Cabral of VJ Electronix will present during the "Lead-free Rework Basics" session of the SMTA International Conference in Rosemont, Ill., on September 27, 2006.

PCB Production Up, Shows METI

(August 29, 2006) TOKYO — The Ministry of Economy, Trade, and Industry (METI) of Japan released PCB production data for the country's first half of 2006, indicating growth in all areas except flex circuit boards.

BP Microsystems Adds an M

(August 29, 2006) HOUSTON — BP Microsystems, a device programming systems supplier, will change its name to BPM Microsystems. After 21 years, the company has decided to change its name, citing confusion with a Houston-based oil company BP Amoco.

Isola Notes Rise in Laminates

(August 29, 2006) CHANDLER, Ariz. — Isola Group, designer, developer, and manufacturer of base materials, reported notable growth in lead-free-capable laminates.

Electronics Industry Survey Studies OEMs

(August 28, 2006) SAN JOSE, Calif. — Venture Outsource, an electronics outsourcing strategy firm, announced key findings from its online survey, "Eyes on Electronics Outsourcing Industry 2006," noting fast-growing electronics market segments. The survey also found that the majority of OEMs outsource, which helps them reach cycle-time requirements. EMS providers and ODMs find engaging new business areas challenging.

CyberOptics Gathers Products for NEPCON

(August 25, 2006) MINNEAPOLIS — CyberOptics Corp. will highlight several products at NEPCON South China — taking place in Shenzhen, China, from August 29 through September 1, 2006 — including its SE 300 Ultra, EPV 5, and Process Insight.

Pico Demonstrates Rework and Assembly

(August 25, 2006) BERLIN — FINETECH will exhibit the FINEPLACER Pico system at NEPCON South China 2006, from August 29 to September 1, 2006, in Shenzhen, China. The Pico on display will be capable of flip chip bonding, rework, and assembly.

Prototyping Station Debuts at NEPCON

(August 24, 2006) SHENZHEN, China — ESSEMTEC AG will showcase its EXPERT-SAFP universal prototyping station at NEPCON South China, August 29 through September 1, 2006, in Shenzhen, China.

Test System Highlighted at NEPCON

(August 24, 2006) SHENZHEN, China — Seica SpA of Strambino, Italy, will showcase upgrades to its Strategy test system with the Strategy VL at NEPCON South China, August 29 through September 1, 2006, in Shenzhen, China. Seica will promote use of its products for high-reliability industries, particularly automotives.

DEK Expands Online Support

(August 24, 2006) WEYMOUTH, U.K. — DEK machine owners can download 3-D engineering models for all company printer subassemblies over broadband Internet, allowing operators to examine components in detail without taking a machine offline, or verify and order parts or upgrades.

Laminating Resins Withstand Lead-free Temperatures

(August 24, 2006) THE WOODLANDS, Texas — Huntsman Advanced Materials introduced two halogen-free laminating resins to comply with current regulatory requirements for PCB manufacturing. AZYRAL one- and two-component laminating systems produce a low dielectric constant, low dissipation factor, and volume and surface resistivity.

Henkel Malaysia Recognized for Productivity

(August 23, 2006) IPOH, Malaysia — The National Productivity Corporation (NPC) awarded Henkel's Malaysian operations with the country's 2006 Productivity Award.

Adhesives Research Names Market Manager

(August 23, 2006) GLEN ROCK, Pa. — Adhesives Research, Inc., an adhesives developer and manufacturer, hired Kirk Lawrence to manage its ARcare division.

Catalog Offers Unified Products

(August 23, 2006) DANVERS, Mass. — ITW Devcon merged Devcon and Permatex brands in its catalog to form a unified product offering for OEM assembly and plant maintenance/repair.

SMTAI Hosts Industry-focused Job Fair

(August 23, 2006) ROSEMONT, Ill. — The SMTA will host a Job Center at SMTAI — bringing local and national companies' information about electronics manufacturing and supply job openings to conference attendees. The SMTA will provide booth space and job listings at the event. Those interested will receive copies of job descriptions that suit them, as well as company contact information.

SMTAI Papers Cover Diverse Topics

(August 23, 2006) HAVERHILL, Mass. and FREEMONT, Calif. — SMTAI 2006 will features numerous paper presentations covering diverse and innovative topics within the electronics manufacturing market. Two papers, presented by Stuart Erickson and David Bernard, respectively, include information from dispensing control for conformal coating to detecting popcorning in lead-free BGAs.

SMT Panel Highlights Packaging

(August 23, 2006) NASHUA, N.H. — The mantra of faster, smaller, cheaper has never been so relevant as in today's advanced packaging area. University professors, OEMs, and contract assemblers (EMS providers) will discuss methods used for increasing densities (stacking, building more into a chip-scale package, mega-package with many technologies) in a lively and informative panel hosted by SMT Magazine at SMTAI.

Dilbert Creator Keynotes ATExpo

(August 23, 2006) NORWALK, Conn. — The Assembly Technology Expo (ATExpo) will feature a keynote address delivered by syndicated cartoonist Scott Adams, creator of Dilbert. Introduced in 1989, the Dilbert cartoon reaches 65 countries through 2,000 news outlets. Adams will open the event with his address at 9p.m., September 26, 2006, at the Donald E. Stephens Convention Center in Rosemont, Ill.

Kimball Electronics China Celebrates Grand Opening; Nanjing Facility Now Operational

"We are excited to move into our new facility and we have already installed a new state-of-the-art surface mount technology printed circuit board assembly line," stated Roger Chang, Vice President, Asian Operations.

RoHS Troubles Affect Taiwan Industry

(August 22, 2006) TAIPEI, Taiwan — Integrated Service Technology (IST), a test and analysis lab in Taiwan, estimates four or five of Taiwan's electronics companies have been disqualified for business within the European Union (EU) for failure to meet RoHS Directive guidelines. The company also stated that the disqualified businesses were fined for failed products. Taiwan's Ministry of Economic Affairs stated that it had received no information regarding RoHS disqualification cases.

IPC Will Move on Battery Standards

(August 22, 2006) BANNOCKBURN, Ill. — The IPC – Association Connecting Electronics Industries announced that the OEM Critical Components Committee will hold a technical summit meeting to develop standards for lithium-ion batteries. The committee was scheduled to meet about power conversion standards prior to batteries, but will give lithium-ion standards top priority in light of Dell's major consumer recall.

Taiwan's Foxconn, Toyota to Team Up, Report Says

Foxconn Electronics (the registered trade name of Hon Hai Precision Industry Co.), the world's largest electronics manufacturer, plans to enter into a partnership with Asia's largest carmaker, Toyota Motor Corp.

PCB Experts to Visit Taiwan

(August 21, 2006) The Netherlands — To promote relations with PCB and packaging fabricators in Taiwan, the European Institute of Printed Circuits (EIPC) will organize a trip to visit Taiwan-based companies in October 2006. The EIPC promotes the Taiwan trip as a method for opening communications with Taiwanese manufactures and for developing business collaborations between Taiwanese and European companies.

Valor Gains U.S. Personnel

(August 21, 2006) RANCHO SANTA MARGARITA, Calif. — Valor Computerized Systems appointed two members to its developing U.S. team. Dan Weitzman became vice president of sales, North America, for the company. Howard Rupprecht was appointed director of marketing.

Foxconn to Cooperate with China Car Industry

Foxconn Electronics and its subsidiary, AnTec Electric System, expressed their interest to establish a company in Beijing, China in cooperation with the China Association of Automobile Manufacturers

ACS Moves to U.S. Manufacturing

(August 18, 2006) FARMINGTON, Ark. — ACS Technologies, a curing systems manufacturer, will use newly-expanded Lantronic, Inc. to produce its TruCure System line of conveyorized infrared PCB curing systems. Farmington, Ark.-based Lantronic will begin manufacturing Q'01 2007. The company purchased a facility neighboring ACS headquarters. ACS will assist in the transition. Moving our equipment manufacturing to the U.S. for this line is exciting, said David Dye, vice president at ACS.

Eltek Signs U.S. Agreements

(August 18, 2006) PETACH TIKVA, Israel — Eltek Ltd., an Iraeli PCB producer, has announced several agreements with high-reliability companies in the U.S. These include a three-year framework agreement with a medical equipment manufacturer, initial orders with a defense company, and positive evaluations by an aerospace manufacturer.

Foxconn Seeking to Become Apple Notebook Manufacturer

Apple Computer is said to be looking for a third contract manufacturer in Taiwan for its MacBooks, with Foxconn Electronics (the registered trade name of Hon Hai Precision Industry) standing a good chance of becoming the new partner

Six RoHS Exemptions Added

(August 17, 2006) BRUSSELS, Belgium — The European Union's Technical Adaption Committee (TAC) voted to approve six new RoHS exemptions. Three main requirements must apply for a banned substance to be exempted in an application. The six exemptions relate to lead and cadmium applications.

Software Suite Tracks RoHS Compliance

(August 17, 2006) SANTA CLARA, Calif. — SigmaQuest, Inc., a product quality management software provider, announced availability of a software suite that aids in conversion, compliance, and due diligence records for OEMs following the European Union's (E.U.'s) RoHS Directive.

PalPilot Opens on East Coast

(August 16, 2006) NASHUA, N.H. — PalPilot, a global PCB solutions provider, appointed Marc "Deac" Descoteaux its director of business development for the company's East Coast office. Deac will bring our West Coast offices' experience into opening this location, said Eddy Niu, president of PalPilot.

Universal Creates Software Product Team

(August 16, 2006) BINGHAMTON, N.Y. — Universal Instruments, as part of a realigned corporate roadmap, formed a product team dedicated to software products. Greg Benoit will assume the responsibilities of product manager for Universal software products. The company states that increased activity in their software products division led to the creation of a product team.

Subminiature SMT Accelerometers Introduced

(August 16, 2006) SAN JUAN CAPISTRANO, Calif. — Endevco Corporation introduced the model 71 series surface mount piezoresistive accelerometer as a subminiature addition to their existing line of high shock sensors for aerospace and test-and-measurement applications. The model 71 was created by the company's transducer engineering and MEMS manufacturing teams.

Flextronics to Challenge Foxconn in Motherboards

Flextronics, which recently acquired the Taiwan-based server motherboard specialist Iwill, will not officially announce the acquisition, remaining reserved about the takeover process, according to sources familiar with the acquisition plan.

SP003-V Stencil Printer Adds Vision

(August 15, 2006) GLASSBORO, NJ — ESSEMTEC AG, an SMT production equipment manufacturer, updated its SP003 semi-automatic stencil printer to the SP003-V with vision. The available vision system supports faster control and alignment correction, according to the company. Print alignment is accomplished by clearance-free, fine-pitch thread screws. Other print parameters are adjustable as well.

Battery Cell Causes Recall

(August 15, 2006) ROUND ROCK, Texas — In cooperation with the U.S. Consumer Product Safety Commission, along with other global regulatory agencies, Dell Inc. will voluntarily recall approximately 4.1 million Dell-branded lithium-ion batteries. The lithium-ion cells, manufactured by Sony, can potentially start a fire within the computer's circuitry. Affected batteries were distributed over two years, from April 1, 2004 – July 18, 2006.

Foxconn International Likely to Assemble Motofone Handsets for Motorola

Foxconn International Holdings (FIH) is expected to receive orders from Motorola to manufacture the vendor's ultra low-priced Motofone-series handsets

Shenzhen Office Services Offshore Customers

(August 14, 2006) WESTMORELAND, N.H. — Polyonics Inc, which manufactures harsh-environment labels and industrial product markings, opened an office in Shenzhen, China. The company operates a U.S. facility in New Hampshire, and Asian offices in Shanghai, China; and Singapore.

ZESTRON Expands in Asia/Pacific

(August 14, 2006) ASHBURN, Va. — ZESTRON's Asia/Pacific office, opened in 2004, has relocated to a 3,000 sq. ft. building.

Epoxy Company Expands in China

(August 14, 2006) HONG KONG — Dow Epoxy, a business unit of the Dow Chemical Company, plans to invest more than $200 million in manufacturing and R&D facilities in China over the next five years. Four facilities will be either constructed or expanded in a targeted local market investment. Dow Epoxy currently operates 10 manufacturing facilities, including its Zhangjiagang, Jiangsu Province, China location.

Cookson Electronics' New Technology Group Delivers Advanced Process Engineering Expertise

This effort formally integrates the extensive knowledge base of the company's field engineer network into its vast internal applications structure.

Henkel Expands in India

(August 11, 2006) IRVINE, Calif. — The electronics group of Henkel will broaden its representation in India, increasing sales and technical personnel, as well as manufacturing capabilities. The company appointed Bhavesh Muni global director of business development in the region to manage and direct the expansion.

Cookson Technology Group Solves Assembly Issues

(August 11, 2006) JERSEY CITY, N.J. — Cookson Electronics Assembly Materials announced it has established a global applications technology and engineering group, which joins its global R&D group. This effort formally integrates the company's field engineer network knowledge base into its internal applications structure. The global technology group will help Cookson's customers in solving assembly technology, yield, and reliability problems.

Foxconn Revenues in July Up 51.5% Year-on-Year

Driven mainly by the consumer electronics products, PCs and network equipment, Foxconn's revenues in July reached US$2.12 billion.

DDi Invests in Core PCB Operations

(August 10, 2006) ANAHEIM, CA — DDi Corp. announced two transactions designed to boost its PCB engineering and manufacturing services — sale of their assembly business and acquisition of Sovereign Circuits, Inc., from North Jackson, Ohio. The company has also implemented a series of related changes in 2006 to improve capital structure, divest certain European operations, and refocus management.

iNEMI Considers Medical Electronic Standards

(August 10, 2006) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) will develop test and usage condition guidelines to assess reliability in medical devices. The Medical Components Reliability Specifications Project, organized by the consortium's Medical Technology Integration Group (TIG), is being presented to the iNEMI technical council today, August 10, 2006.

Companies Create Laser Reflow System

(August 10, 2006) LINCOLN, R.I. — The Solder Paste business group of EFD, Inc., and Leister Technologies, LLC, will cooperatively promote their automated solder paste reflow system, said to cut soldering times by nearly 80% over traditional wire and iron soldering methods.

Heatsinks Cool Freescale Processors

(August 9, 2006) NORWOOD, Mass. — Two heatsink solutions, developed over the course of a year by Advanced Thermal Solutions (ATS), feature aluminum fins that exploit all available air. "Although they were originally developed for Freescale MPC 8641D dual-core processors, both are available to the open market for applications with similar thermal management requirements," said Ray Santos of ATS. The Juneau and Anchorage heatsinks are members of the Alaska line.

Mild Cleaner Extends Contact Times

(August 9, 2006) ASHBURN, Va. — ZESTRON America introduced the VIGON A 200+, an updated VIGON product based on the company's MPC technology. The cleaning agent — specifically developed for low- and medium-pressure spray-in-air processes — allows for long exposure times without detrimental effects on materials or solder joints.

Northstar Electronics Forms Strategic Partnership with Datalis Solutions

This agreement enables both companies to work synergistically to grow the business base of each other by soliciting new business and using each company's core competency to present one complete and attractive package to clients

BGA-to-BGA Adapter Protects Boards

(August 8, 2006) FRENCHTOWN, N.J. — To resolve BGA soldering issues — common when lead-free solder balls reflow on a board with tin/lead BGAs — Aries Electronics produced a BGA-to-BGA adapter. The ARI-A-7277 eliminates incomplete wetting at tin/lead reflow temperatures.

Proxy Appoints Operations Manager

(August 8, 2006) METHEUN, Mass. — Proxy Manufacturing, a contract manufacturer (CM), named Steve Cahalane operations manager. Cahalane's responsibilities will include supervising plant activities and managing company expansion.

Qualitek Chooses Midwest Representative

(August 8, 2006) ADDISON, Ill. — Terry Jeglum and Electronic Technology Corporation (ETC), of St. Charles, Ill., will represent Qualitek in Wisconsin and Illinois.

Conveyor System Cools Post-reflow

(August 8, 2006) SAN DIEGO — Eunil H.A. Americas Inc. introduced the ECV-100 Coolveyor, a cooling conveyor system for post-reflow. A cooling rate of 2°C/sec. is anticipated.

IPC Workshop Examines Lead-free Finishes

(August 8, 2006) BANNOCKBURN, Ill. — The IPC workshop, "Lead-free Surface Finishes and Compatibility to Lead Free Soldering: The Road to RoHS Compliance," will give attendees insights into the effect of lead-free surface finishes on solderability and reliability. Topics will include co-planarity, solder paste spreadability, thru-holes, and more. Higher solder melting points that cause heat stress and aging will also be examined.

EMS Companies Boost DSC Market Competition in Taiwan

Flextronics and Hon Hai are going after the segment's higher profit margins, putting more pressure on Taiwanese DSC contract manufacturers

Solder Alloy Meets Mil/Aero Requirements

(August 7, 2006) EAST SUSSEX, U.K. — SJ7 solder alloy from Almit Technology Ltd. is characterized by mechanical capabilities typical for use in military and aerospace applications. The paste offers improvements in tensile- and creep-strength properties over traditional tin/lead solders at room and elevated temperatures.

Spliceable Feeders Support High-speed Placement

(August 7, 2006) BINGHAMTON, N.Y. — The Gold spliceable tape feeders from Universal Instruments offer continuous splice capability. The feeders support high-speed chip placement machines, line-level reporting, and traceability functions.

Eunil H.A. Adds 3-D Paste Inspection System

(August 4, 2006) SAN DIEGO — The PARMI SPI HS30 3-D inline paste inspection system from Eunil H.A. Americas inspects several types of solder paste defects after screen printing by measuring height, area, and volume. Its 3-D data is said to back-up system performance for reliability and accuracy.

YESTech Promotes Kevin Garcia to Applications Manager

(August 4, 2006) SAN CLEMENTE, Calif. — YESTech has promoted Kevin Garcia to applications manager. In this position, Garcia will be responsible for system installation scheduling for all systems and providing support and troubleshooting backup for the company's onsite application engineers.

SMTC Notes Revenue Growth in Second Quarter

(August 4, 2006) TORONTO — SMTC Corporation released its second-quarter results, with revenue of $61.1 million and net income of $1.3 million reported, for the quarter ending July 2, 2006. This shows a rise from $57 million and a net income of $0.3 million for this quarter last year.

Adaptable Soldering/Desoldering Series Expands

(August 4, 2006) HAMPSHIRE, U.K. — Four soldering/desoldering equipment packages have been added to OK International's MFR Series for rework.

Tyco Sells Printed Circuit Group

(August 3, 2006) PEMBROKE, Bermuda — Tyco International Ltd. has entered into a definitive agreement to sell the Tyco Printed Circuit Group (TPCG) business to Santa Ana, Calif.-based TTM Technologies for $226 million in cash. The transaction was approved by Tyco's Board of Directors, and is slated to close in the fall of 2006.

Sanmina-SCI Granted High-level Military Certification

(August 3, 2006) SAN JOSE, Calif. — The Defense Supply Center, Columbus (DSCC) has granted Sanmina-SCI Corporation's San Jose facility MIL-PRF-31032 certification, enabling the EMS provider to manufacture products in compliance with these strict military requirements.

Endicott Picks Accela for Packaging Advancements

(August 3, 2006) FRANKLIN, Mass. and ENDICOTT, N.Y. — Endicott Interconnect (EI) Technologies has selected Speedline Technologies' MPM Accela printer for its SMT and semiconductor back-end assembly processes.

Winland Electronics Announces Record Second Quarter Revenue for Fiscal 2006

Revenues Up 50% to $10.7 Million vs. Q2 2005 and Up 31% vs. Q1 2006

Flextronics Signs Deal with Kodak

(August 2, 2006) ROCHESTER, N.Y and SINGAPORE — Eastman Kodak Company has entered into an agreement with Flextronics International Ltd., to manufacture and distribute Kodak consumer digital cameras. Flextronics will also manage certain design and development processes. Kodak will retain its intellectual property (IP), and will continue to conduct R&D.

Digi-Key Adds to Portfolio

(August 1, 2006) THIEF RIVER FALLS, Minn. — Digi-Key, electronic component distributor, has signed agreements with Elna America and Conec to distribute products globally in print and online catalogs.

Asymtek Undertakes Company Realignment

(August 1, 2006) CARLSBAD, CA — Asymtek, a Nordson company, announced a series of corporate rearrangements related to Robert Ciardella's leaving the position of company president. Ciardella, who co-founded Asymtek in 1983, will move to an advisory position. A company representative stated that Ciardella will pursue other interests, while remaining an integral part of Asymtek.

Inductor Needs No Internal Soldering

(July 31, 2006) SAN DIEGO — Pulse, a Technitrol company, added the PG0426NL series to its flat-coil power inductor family. Made of rectangular-copper wire wound helically, the inductor is said to provide a larger surface area than those using round wire, with a lower profile volume. These flat-coil inductor windings also create self-terminating leads, circumventing internal solder work. Inductance values in the series range from 1.5 to 0.1 µH.

IPC Certifies Axiom's Assembly Process

(July 28, 2006) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries — awarded Axiom Manufacturing Services Ltd. certification for RoHS Lead-free Electronics Assembly Process Capability Program. Axiom, a Newport, South Wales-based contract electronics manufacturing (CEM) provider, also has obtained a Kitemark, from BSI Product Services, for IPC standard IPC-A-610.

Lead-free to Spur Equipment Industry

(July 28, 2006) SAN ANTONIO — Market research from Frost & Sullivan asserts that the move to lead-free — taking place globally in response to the European Union's (EU's) RoHS Directive — will stimulate the SMT equipment industry. The research firm also found that OEMs and EMS providers will be willing to increase their investments in screen printers and glue dispensers, providing the equipment can reduce cycle times and increase throughput.

NEA Installs 4,500^th System

(July 27, 2006) LONDONDERRY, N.H. — NEA, a remanufactured PCB assembly and automated test systems supplier, marked the installation of their 4,500^th system.

Helix Units Ship

(July 27, 2006) HOUSTON — BP Microsystems has shipped the first two units of Helix, an automated device programmer.

Universal and Tsinghua University Sign Agreement

(July 27, 2006) BEIJING — Tsinghua University and Universal Instruments have signed a mutual agreement to promote the development of SMT training and education within the country. At the university's Beijing campus, Jia Huibo and Jeroen Schmits agreed to participate in future decisions on subject set-ups, teaching material, and course sponsorship. They plan to cultivate industry experts and broadening the national technical knowledge base.

Material Set Launched for Ultra-thin SMDs

(July 26, 2006) DUSSELDORF, Germany — The electronics group of Henkel launched the Hysol QMI529LS and GR828A, a multi-level material set that includes die attach and mold compounds for thin and ultra-thin surface mount device (SMD) applications.

Modular Fuses

(July 26, 2006) SANTA ROSA, Calif. — The USI chip fuse series from Schurter features a range of universal modular fuses (UMFs) approved by the IEC, cURus, METI, and CCC. The series' 1206 package measures 3.2 × 1.6 × 0.6 mm. The fuses support lead-free reflow soldering or vapor-phase processes. Manufactured on tape with individual markings, the fuses incorporate a thin-film technology to produce predictable and stable yields.

DEK Develops Solution for High Throughput Singulated Substrate Processing

DEK's SinguLign enables the high accuracy mass imaging of multiple materials such as solder paste, solder spheres, flux and adhesive onto singulated substrates or components

U.K. Prepares WEEE Roadmap

(July 25, 2006) LONDON — The U.K.'s Department of Trade and Industry has devised a timetable for implementing the WEEE directive in a consultation document. The government's implementation team aims to enforce regulations that reduce waste from electronics, said Malcolm Wicks, energy minister. He added that electronic equipment contributes the fastest-growing waste category in the U.K and therefore ought to be addressed meaningfully.

Nortech Systems Has Been Chosen for This Week's Knobias "SPOT Feature"

Electronics manufacturing services (EMS) provider Nortech Systems, Inc. has been chosen for this week's "SPOT Feature" in the Knobias Small-Cap ClipReport

Case Study Probes Thermal Issues

(July 24, 2006) SAN DIEGO — Thermal process development company KIC posted a case study on energy consumption to its website, stating that the study revealed significant information about thermal management. The study, "The Effect on Energy Use from an Optimized Reflow Oven Recipe in Lead-free Applications," discusses rises in energy consumption for reflow ovens based on temperature increases needed for lead-free soldering.

Lenses Prohibit TV Distortion

(July 24, 2006) SAN JOSE, Calif. — Moritex added TV macro zoom lenses to its macro zoom lens offering to provide a range of lenses that control TV distortion, or the distortion of the edge of the image to the center margin of said image. The company released the product range for use with ¹/₂ or ¹/₃" charge-coupled device (CCD) cameras to surface-inspect PCBs, electronic components production, and alignments.

Engineers Volunteer Cleaning Trials

(July 24, 2006) ASBURN, Va. — ZESTRON America will offer custom cleaning trials for PCBs and SMT stencils at their American, as well as European and Asian, global application technical centers. The company uses 35 different pieces of cleaning process equipment to outline, execute, analyze, and document the trials for individual customers.

EU Certifications Available in U.S.

(July 21, 2006) NEWTOWN, Conn. — TUV Rheinland of North America, a compliance-testing and certification provider, will offer European certifications to North American component manufacturers.

Benchmark Electronics Reports Second Quarter Results; Raises Full Year 2006 Guidance

Benchmark Electronics, Inc., a leading contract manufacturing provider, announced sales of $749 million for the quarter ended June 30, 2006, compared to $561 million for the same quarter last year

Beyond ROHS: The Greening of Global Markets

US and Asian governments are about to impose their own versions of the EU's ROHS directive

Prototyping Goes Non-profit

(July 20, 2006) CANBY, Ore. — To support technology advancements and next-generation prototyping, Screaming Circuits, an online contract manufacturer (CM), will offer a sponsorship program to university groups. The Internet-based company designed a discount program for universities and non-profits that develop sophisticated circuits, PCBs, and microcontrollers.

U.S. Guidelines Tout National E-recycling

(July 20, 2006) WASHINGTON — The U.S. Department of Commerce, Technology Administration, has released its "Recycling Technology Products: an Overview of E-waste Policy Issues" report outlining the management of electronic waste. Although the European Union's (EU's) RoHS and WEEE regulations affect American manufacturers selling product into the EU, the U.S. does not currently require domestic adherence to the Directives.

Kits Remedy PCB Issues

(July 20, 2006) HAVERHILL, Mass. — CircuitMedic, a grouping of products and materials developed at the Haverhill, Mass.-based Circuit Technology Center, are materials to rectify issues with circuits, surface mount and BGA pads, gold edge contacts, and other board-related problems, grouped into kits.

Coating Facility Opens in Costa Rica

(July 19, 2006) INDIANAPOLIS — Specialty Coating Systems, Inc., opened a Parylene coating facility in Heredia, Costa Rica. The 8,000-square-foot facility, located within the Global Park Free Zone, is their 10th global location.

VJ Electronix Expands

(July 19, 2006) LITTLETON, Mass. — An expanded facility in Littleton, Mass. nearly doubles VJ Electronix's x-ray inspection and rework capacities. The company moved from a Shirley, Mass., location into the 30,000-square-foot facility.

Siemens A&D Gains AOI Systems

(July 19, 2006) ATLANTA, Ga. — Siemens Automation and Drives (A&D) acquired Opto-Control Electronik Prüfsysteme GmbH (Bochum, Germany) — adding automatic optical inspection (AOI) machines to its Siplace surface mount business. This expanded line combines AOI systems from Opto-Control with Siemens' Siplace placement machines. The acquisition was effective on July 5, 2006.

Compliance Library Stores RoHS Data

(July 19, 2006) ROCHESTER, N.Y. — EMA Design Automation developed the RoHS CIS Library to store critical RoHS data from core component vendors — supporting due diligence requirements by listing a part's compliance status.

Plexus Doubles Manufacturing Footprint in China

With a new operating lease, Plexus will be able to double the size of its manufacturing facility in the Xiamen Xiangyu Free Trade Zone in China

Transfer Adhesive Reacts to Heat & Pressure

(July 18, 2006) WINDSOR, Conn. — Thermofilm H194U, a nitrile phenolic thermosetting transfer adhesive from Scapa North America, activates and cures when exposed to heat and pressure — bonding polyimide to copper foil on flexible printed circuits. The material also adheres to polycarbonate and ABS for electronic case and cover assembly applications.

ITW Acquires Kester

(July 18, 2006) GLENVIEW, Ill. — Illinois Tool Works Inc. (ITW) has acquired all shares of solder supplier Kester, Inc. (Des Plaines, Ill.). Terms of the transaction were not disclosed.

Solectron Names Marty Neese as Executive Vice President of Operations

"Driving customer satisfaction and achieving performance objectives are the foundations of Solectron's operations, and Marty is ideally suited to lead the next phase in our operational evolution."

Semicon West - A Packaging Perspective

Last week in San Francisco, Semicon West showed off its stuff. Packed to the gills, the Moscone Center played host to this global event.

Seica Doubles Production Capacity

(July 17, 2006) STRAMBINO, Italy — Italian electronics test solutions OEM Seica SpA completed construction of additional production buildings — increasing capacity and allowing space for seminars and workshops. The buildings, located at Seica headquarters outside of Turin, Italy, will serve military and aerospace as well as commercial applications.

ZESTRON Adds Rep in the Rockies

(July 14, 2006) ASHBURN, Va. — Automation Supply, Inc. joined ZESTRON America as a sales representative for the Rocky Mountain region — encompassing Colorado, Utah, and southern Idaho.

Board Supplier Purchases Process-planning System

(July 14, 2006) ODENSE, Denmark — PCB supplier Printline purchased Control Center automated manufacturing process-planning software from Direct Logix, Inc. in Las Vegas, for the Mania UCAM engineering group. Commented Leigh Eichel, vice president of marketing, Direct Logix, "Design Release Manager was first to be implemented with interfaces to related software. Next will be Automatic Traveler, Stack-up, and Impedance."

Software and Equipment Duo Intros

(July 14, 2006) COCONUT CREEK, Fla. — A software program and corresponding material-handling equipment from Inovaxe is designed to kit and reload SMT lines. Inovaxe built the interactive set to reduce labor costs and improve inventory accuracy.

Eltek Receives Flex-rigid PCB Order

(July 13, 2006) PETACH TIKVA, Israel — Israeli PCB manufacturer Eltek received an initial order from an undisclosed U.S.-based industrial manufacturer for $320,000 in flex-rigid PCBs.

TI Plans R & D Center in India

(July 13, 2006) NEW DELHI, India — Texas Instruments, Incorporated, and Thiru Dayanidhi Maran, Honorable Minister of Communications & IT for India, jointly announced TI's plans to open a R & D facility in Chennai, India.

3M Broadens Static Control Offerings

(July 13, 2006) ST. PAUL, Minn. — The Electronic Solutions Division of 3M acquired two companies that engineer and manufacture static-control packaging. SCC Products, sister company of Static Control Components, Inc., and JJ Converting LLC will be integrated into 3M, expand its product range for static shielding and moisture barriers.

Benchmark Electronics Expects to Exceed Second Quarter 2006 Guidance

The Company provided second quarter revenue guidance of $630 million to $660 million

Lead-free Solder Tips Aid Heat Transfer

(July 12, 2006) GARDEN GROVE, Calif. — SmartHeat PowerTips for the Metcal MX-500 system are designed specifically for lead-free applications, and will allow an operator to solder difficult joints without heat damage. The tips improve thermal performance, maintaining constant source temperatures during lead-free processes.

Surface Mount Battery Retainer

The 11.6 coin-cell retainer is a top-loaded, low-profile retainer designed for automated SMT placement. Keystone Electronics Corporation states that the lightweight surface mount battery retainer suits high-density PCB packaging.

Core Metallization and Imaging Take Center Stage

By Meredith Courtemanche, assistant editor - - (July 12, 2006) MALBOROUGH, Mass. — A metallization and imaging materials supplier recently divested their heavy copper filler range to redistribute resources into electroless and electrolytic copper, final finishes, and innerlayer bonding products.