Article Highlights
ASM Assembly Solutions on CFX
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Is There an End in Sight to the Electronic Components Crisis?
07/12/2018 | Neil Sharp, JJS Manufacturing
Conversation with Miraco… Strategies for Successful Flex Circuit Assembly
07/11/2018 | Stephen Las Marias, I-Connect007
Aegis on CFX and Hermes Efforts
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Tackling the Challenges in Flex Assembly
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Latest Articles

Custom PCB Rework System Uses Beam Delivery

(March 8, 2006) ROLLING MEADOWS, Ill. — BEST Inc.'s new C02 LASER PCB rework system has capabilities for precision marking, drilling, scoring, and organic material cleaning of PCB materials. It also defines new pads and traces to etch off solder-mask patterns to a few mils, and can cut polyimide into various shapes for customized wave-solder masking applications.

Indium's Lee to Target Lead-free Reliability

(March 8, 2006) CLINTON, N.Y. — At the upcoming Intel Lead-free Symposium, to take place March 15–16, 2006, in Scottsdale, Ariz., Indium Corp. of America's Dr. Ning-Cheng Lee, vice president of technology, will highlight reliability in a presentation there. Dr. Lee's experience spans the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives.

Asian CEM Market to Hit $191.90B by '09

(March 7, 2006) DUBLIN, Ireland — Since Asia offers low-cost labor and a wide technical workforce, the Asian contract electronics manufacturing (CEM) market is growing, with $73.35 billion in sales in 2004 and projected growth of $161.90 billion by 2009, claims Research and Markets' newest report, titled "Asia CEM and Assembly Capacity by Country."

iNEMI Hi-Rel Group Tackles Lead-free Manufacturing Challenges

(March 7, 2006) HERNDON, Va. — iNEMI's High-Reliability RoHS Task Force has issued recommendations for manufacturing complex, thermally challenging electronic assemblies using lead-free processes. These recommendations target thermal requirements for components, laminate and PWB materials, and equipment, and aim to help ensure product reliability.

Midwest U.S. Independent Testing Lab Serves the Globe

(March 6, 2006) VALLEY VIEW, Ohio — NSL Analytical is an ISO/IEC 17025- and Nadcap-certified Independent Commercial Testing Laboratory that provides materials testing to customers globally. Its Valley View, Ohio office houses its administrative offices, customer service, and elemental chemical analysis and composite materials testing laboratory, while its Independence, Ohio-based metallurgical lab dedicates itself to metallurgical evaluations and microscopy.

Enthone Names New Sales Engineer for PWB Chemistry

(March 6, 2006) WEST HAVEN, Conn. — Enthone Inc., a business of Cookson Electronics, has appointed Kent Lindsay as its new sales engineer for PWB Chemistry, in which he will provide sales and product support to Enthone customers in California and Arizona.

Parallel Test Guarantees Higher Fault Coverage Without Increasing Cycle Time

New technologies and trends in the production of printed circuit boards for the automotive industry present new challenges for the testing of these boards

Enhancing Pb-free Solder Joint Reliability

With certain package types, lead-free assemblies seem to be more vulnerable to failures. To find out why, one must examine why a solder joint fails and then analyze how to amend the problem.

SMTA Toronto Academy Program to Feature Courses, Certification

(March 3, 2006) MINNEAPOLIS — The SMTA Academy Program, to be held in Toronto on March 29–30, 2006, at the International Centre in Mississauga, Ontario, will feature five full- and half-day courses. The event will also feature SMTA certification for SMT processes, and these events will be held in conjunction with the Advanced Manufacturing Expo, Canadian High Tech Show, and Assembly Canada.

DEK Northern Europe Names New Area General Manager

(March 3, 2006) WEYMOUTH, DORSET, U.K. — DEK Northern Europe has appointed Jim Williams to its area general manager position, in which he will be based in the company's Weymouth headquarters. This role entails development of the company's sales, service, and brand management activities across this region.


U.K.-based Lead-free Seminar Covers the Bases

(March 2, 2006) HIGH WYCOMBE, BUCKS, England — The SMART Group's 8th Annual Lead-free Seminar and Exhibition held in February was well-attended with 160 delegates, and included wide-ranging lead-free topics, a lively debate, and surprising results from a survey.

DEK Confirms Lineup for UK Technology Day

(March 2, 2006) WEYMOUTH, DORSET, U.K. — DEK has confirmed its lineup for its 21st Century Line Technology Day, which is scheduled to take place over March 29–30, 2006, at its Weymouth headquarters. Focusing on the concept of the "21st Century Line," the Technology Day will feature a blend of presentations and workshop demonstrations led by prominent industry representatives.

ASSET Launches Boundary Scan Technology Center in China

(March 2, 2006) RICHARDSON, Texas — ASSET InterTech Inc. has opened its own Boundary-Scan Technology Center in Shanghai, China, which will operate all of the company's technical support and sales activities in Asia. The company also aims to use its Asian offices as a research and development center in the future.

Screenless Jet Printer Goes on Tour

(March 1, 2006) STOCKHOLM, Sweden — The MY500 jet printer from MYDATA automation begins its 30-country tour this month — giving manufacturers a closer look at the machine's capabilities. During its "Rock the Process Tour," MYDATA will demonstrate the jet printer in more than 30 cities, in at least ten countries throughout Europe, from March until June 2006.

Valor Integrates Engineering Solution with SIPLACE Pro

(March 1, 2006) YAVNE, Israel — Valor Computerized Systems' Trilogy 5000 assembly line engineering solution integrates seamlessly with all SIPLACE Pro Siemens Placement Systems, speeding the path from data load to optimized machine program generation.

Cirrus Logic, Digi-Key Sign Distribution Agreement

(February 28, 2006) AUSTIN, Texas and THIEF RIVER FALLS, Minn. — Cirrus Logic Inc., an analog and mixed signal integrated circuits (ICs) provider, and Digi-Key Corp. have signed a global distribution agreement, in which Cirrus Logic's products will be featured in Digi-Key's print and online catalogs and will be available for purchase directly from Digi-Key.

Fairchild's Product Offering Now RoHS-compliant

(February 28, 2006) SOUTH PORTLAND, Maine — Fairchild Semiconductor is now shipping its complete portfolio of basic marked components in configurations that conform to the RoHS directive. All may be ordered under the original base part number. This accommodates those customers mandating no part number change, and RoHS-compliant products may also be ordered to a unique Fairchild part number for those desiring a distinct part number delineating RoHS compliance.

Briton EMS Settles on XJTAG Boundary Scan Test Solution

(February 28, 2006) CAMBRIDGE, England — U.K.-based contract electronics manufacturer Briton EMS has selected the XJTAG development system as its boundary scan test solution, which has been implemented at Briton EMS's Bedford, England-based production facility. The XJTAG solution pinpoints faults on PCBs featuring high-pin-count ball grid arrays (BGAs).

iNEMI to Hold Roadmap Workshop at SEMICON Europa

(February 27, 2006) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) has scheduled a workshop for its 2007 Roadmap for April 5, 2006, to be held in conjunction with SEMICON Europa in Munich. Co-sponsored by Fraunhofer IZM, IEEE's Components, Packaging, and Manufacturing Technology (CPMT) Society, and IMAPS Europe, the workshop will give attendees a first look at draft chapters of the Roadmap.

MCA Service Verifies Placement Accuracy

(February 24, 2006) HUDSON, N.H. — CeTaQ Americas' Machine Capability Analysis (MCA) service now verifies feeder and shuttle motion repeatability, using a 'smart' camera that works with CeTaQ's mobile metrology system. A feeder maintenance program ensures continued accuracy once feeder accuracy and repeatability issues have been corrected. The service and methodology also suit die feeders and picked die from cutting.


January Book-to-Bill Ratio Starts '06 Off Right

(February 24, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' North American rigid PCB industry book-to-bill ratio for January 2006 stayed strong at 1.09, and the flexible circuit book-to-bill ratio jumped back up to 1.30. Combined (rigid and flex), the industry book-to-bill ratio also stayed strong at 1.13.

Electroform Beats Laser-cut Stencil in Comparison Study

(February 23, 2006) COLORADO SPRINGS, Colo. — Photo Stencil released results of its Advanced Microfabrication Technology Xerox (AMTX) E-Fab electroform vs. laser-cut electroform nickel foil comparison study.

New RoHS Catalog Offers 40,000 Stocked Compliant Products

(February 23, 2006) CHICAGO — Newark InOne, a subsidiary of global distributor Premier Farnell plc and a small-quantity distributor of electronic components and test equipment in North America, now offers a new, 580-page catalog devoted strictly to electronic products that are RoHS-compliant. The front section of the catalog includes a detailed guide to help engineers in the U.S., Canada, and Mexico to comply with RoHS, which takes effect July 1, 2006.

Support for VSP Devices Available

(February 23, 2006) HOUSTON — BP Microsystems' BP Win 4.58 offers support for very small package (VSP) devices. Offered exclusively on BP Win Automated Programming Systems, support for VSP devices currently includes MSOP8, TSOC6, and the smallest device, SOT23, with dimensions of 1.63 × 2.95 mm. Other VSP devices may be supported by entering a device request through BP Microsystems' Website.

Kyzen Refutes Sale of Company

(February 22, 2006) NASHVILLE, Tenn. — Following Zestron America's announcement of its intent to purchase the cleaning company, Kyzen Corporation, Kyle J. Doyel, CEO and president, refuted the claims stating, "Kyzen's board of directors has not solicited, nor has it directed management to solicit, offers from any party or have discussions regarding a potential sale of the company."

Zestron Looks to Acquire Kyzen

(February 22, 2006) ASHBURN, Va. — Zestron America announced its interest in purchasing Nashville, Tenn.-based Kyzen Corporation, emphasizing the company's desire to complete a negotiated transaction with the support of Kyzen's board of directors. No further details were provided, but Zestron noted the company is prepared to offer Kyzen shareholders a premium. Kyzen is expected to comment later today on this matter.

U.K.-based Exception PCB Predicts Flex-rigid Growth

(February 22, 2006) TEWKESBURY, U.K. — Exception PCB noted growth and development in the flex-rigid market, resulting in predicted revenues of more than a million pounds in 2006. The company focuses on a 20-day turnaround on all products, with a five-day response on quickturn components.

Desoldering Pencil Includes Disposable Solder Trap

(February 22, 2006) APEX, N.C. — The Weller DXV80 in-line desoldering pencil from Weller, which features a disposable solder trap for easy cleaning, is suitable for desoldering thru-hole components on PCBs.

Universal Appoints Director of Corporate Accounts

(February 21, 2006) BINGHAMTON, N.Y. — Universal has named Mark Ragard, former director of Americas operations, as its new director of corporate accounts, in which he will oversee the company's corporate accounts structure. He also will lead the development of Universal's worldwide corporate level activity and supervise the accounts of high-profile OEM and EMS clients.

3-D LED Array Packages Offer Wide Viewing Angle

(February 21, 2006) SAN FRANCISCO — Mixing high-brightness LEDs with 3-D packaging technology, TT electronics OPTEK Technology's Lednium Series 10-W LED array packages offer a full 120° viewing angle for its array of amber, blue, green, red, or white LEDs. The devices achieve an output of up to 330 lumens with nine 1-W LEDs mounted in a 1.3 in2 anodized aluminum package, with a board-mounted profile of less than .5".


Cobar's New Color-coding System Distinguishes Lead-free

(February 17, 2006) BREDA, Holland — The threat of cross-contamination, such as lead-bearing materials that can mix up with new lead-free solders, is a major issue facing the electronics industry. Even small amounts of lead contamination can cause tremendous problems and result in high remediation costs, as well as process downtime if they accidentally mix with lead-free soldering products.

Zuken Unveils Web-downloadable PCB Design Solution

(February 17, 2006) MUNICH and WESTFORD, Mass. — Zuken has launched its latest version of CADSTAR Express, a free Web download of the CADSTAR 8.0 desktop PCB design solution. This fully functional version of CADSTAR 8.0 features tools for design from schematics to manufacture, with a limit of 300 pins and 50 components.

Reworkable CSP/BGA Underfill Performs in Low Temperatures

(February 16, 2006) IRVINE, Calif. — Loctite 3549, a high flow underfill formulated specifically for use with advanced CSP and BGA packages, is now available from the Electronics Group of Henkel. It quickly fills the space beneath the CSP and BGA packages and cures rapidly at low temperature, minimizing thermal stress to other components on the PCB, and allowing for in-line curing to increase device throughput.

High-density Interconnect Arrays Available

(February 15, 2006) NEW ALBANY, Ind. — The SEARAY high-density interconnects (SEAM/SEAF Series) from Samtec Inc. provide a solid grid of contacts on 1.27-mm pitch and up to 500 I/Os. A selection of solder crimps on the tails provide a choice between tin/lead alloy or RoHS-compliant, tin-only alloy for lead-free processing.

SMTA International Call for Papers Opens

(February 15, 2006) MINNEAPOLIS — The SMTA International Technical Committee has opened its Call for Papers for abstract submission for SMTA International 2006, to be held September 24–28, 2006, in Rosemont, Ill. Short course descriptions are also being solicited.

Cobar CEO Honored with IPC Service Award

(February 14, 2006) ANAHEIM, Calif. — Eli Westerlaken, CEO of Cobar Europe, has nabbed a Distinguished Committee Service Award by the IPC–Association Connecting Electronics Industries for his contribution to the development of the IPC standard J-STD-006B, "Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders."

DEK's Shekou Facility Becomes ISO-certified

(February 14, 2006) SAN JOSE, Calif. — DEK's Shekou, China manufacturing facility has obtained the ISO 9001 quality management system certification, following an independent assessment by accreditation body BSI.

IPC Honors Industry Icons with '05 Hall of Fame Award

(February 13, 2006) BANNOCKBURN, Ill. — At the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference, held February 8–10, 2006, in Anaheim, Calif., IPC–Association Connecting Electronics Industries awarded Gene Weiner, Weiner & Associates; and Vern Solberg, Micro Electronic Engineering Services; with the 2005 Raymond E. Pritchard IPC Hall of Fame Award.

EPIC Technologies Names VP of Business Development

(February 10, 2006) ROCHESTER HILLS, Mich. — EPIC Technologies has promoted Todd Baggett to vice president of business development and an officer of the Company, having previously served as director of business development.

UV Cure Unit Integrates or Operates Stand-alone

(February 10, 2006) INDIANAPOLIS — Specialty Coating Systems' (SCS) Precision UVC ultraviolet (UV) cure unit offers tubular, full-spectrum UV curing in tandem with the Precisioncoat or as a stand-alone system. When coupled with the Precisioncoat or Precisioncoat EL, components move from the spray coating system to the cure unit automatically, with the coating system PC controlling the cure cycle.


iNEMI Members Laud Material Declarations Standard

(February 9, 2006) ANAHEIM, Calif. — A large number of the International Electronics Manufacturing Initiative (iNEMI)'s members, mainly OEMs, EMS providers, and suppliers, are committed to implementing the IPC-1752 Materials Declaration Management standard. Slated to be published by IPC this quarter, the standard establishes uniform electronic data formats and standardized forms to simplify the way industry collects, tracks, and discloses material content information.

Indium Corp. Presents Silver Quill Award

(February 8, 2006) CLINTON, N.Y. — Indium Corp. recently awarded its annual Silver Quill Award for best paper/presentation of 2005 to Jim Hisert, a technical support engineer based at Indium's Clinton, N.Y. global headquarters. The Silver Quill award encourages and gives incentive to individuals for authoring technical reports, presentations, articles, and books.

Valor Computerized Systems Names New President

(February 8, 2006) ANAHEIM, Calif. — Valor Computerized Systems (VCR) has appointed Ori Braun as its new president, and he will be based at Valor's U.S. headquarters in Foothill Ranch, Calif. He comes to Valor from medical electronics company Life Watch, Inc., where he also served as president.

CAP-XX Wins Award for Prismatic Supercapacitors

(February 8, 2006) SYDNEY, Australia — CAP-XX Inc. has received Frost & Sullivan's 2005 Technology Innovation of the Year Award in nanotechnology-enabled supercapacitors for research that led to a breakthrough nanotechnology process for producing thin and flat, or prismatic, supercapacitors to meet the pulse-power requirements of portable devices.

Universal Expands Global Network with Danish Distributor

(February 7, 2006) BINGHAMTON, N.Y. — Universal Instruments has named Danish distributor PC Trading A/S, hoping to further strengthen its European infrastructure and extend its global distributor network. Arhus, Denmark-based PC Trading A/S serves markets spanning OEMs and contract manufacturers, and supplies the electronics industry with consumables, machinery, and laser stencils.

Valor's '05 Revenues Poise for Further '06 Growth

(February 7, 2006) YAVNE, Israel — Valor Computerized Systems (VCR) has finished its 2005 fiscal year with revenues of $36.3 million — its highest annual revenues to date, and a 19% increase over 2004. The fourth quarter of 2005 marks 11 consecutive quarters of sequential growth with revenues of $9.5 million, a 15% increase compared to $8.3 million in 2004's fourth quarter.

Schmidt RFID, Cogiscan Team to Offer RFID Solutions in Asia

(February 6, 2006) HONG KONG and BROMONT, Canada — Schmidt Electronics Group and Cogiscan have formed a long-term strategic partnership, in which SchmidtRFID, a division of Schmidt Electronics Group, will offer the complete range of Cogiscan RFID solutions in Asia.

Cookson's Singapore Facility Earns ISO 14001:2004 Certification

(February 6, 2006) JERSEY CITY, N.J. — Cookson Electronics Assembly Materials' (CEAM) Singapore facility earned the Environmental Management System (EMS) standard ISO 14001:2004 certification on January 25, 2006, through the British Standards Institution (BSI). The Singapore site joins other CEAM manufacturing facilities worldwide that are already certified to this standard.

So You Want a RoHS Exemption

The current consultation contains several examples of how not to request an exemption. The worst tend to be lengthy essays penned by lawyers (solicitors) on the virtues of a single company and their products

Sager Electronics Promotes Kopp

(February 3, 2006) WEYMOUTH, Mass. — Electronic component distributor, Sager Electronics, promoted Paul Kopp to director of distribution and logistics to manage and develop operational resources to improve customer service and production efficiencies within the company's distribution center third-party logistic warehouses.


Henkel Names Fischer VP of Sales, Marketing, and Technical Services

(February 3, 2006) IRVINE, Calif. — Henkel Corporation's electronics group appointed Gordon Fischer, Ph.D., to vice president of sales, marketing, and technical services for the Americas. In this position, Fischer will lead the Americas sales team, manage the company's marketing plan, and direct the technical service infrastructure for Henkel's semiconductor and PCBA products.

Bare Board Tester Suits Large-size PCBs

(February 3, 2006) STRAMBINO, Italy — The S24BBT bare board tester from Seica can test boards up to 24 × 40". The tester will be demonstrated at APEX in Anaheim, Calif., February 8–10, 2006, with the company's Multi-board Handler, which can handle different part number PCBs in various quantities for operator-free test cycles.

DEK, Assembléon Join Forces in Latest Products

(February 2, 2006) SAN JOSE, Calif. — DEK's San Jose office provided the venue for Assembléon's recent San Jose Roadshow, held November 1–3, 2005, and formed part of Assembléon's U.S.-wide tour with its AX and MG machine lines. The event also showcased a range of DEK products, including VectorGuard stencil systems, ProFlow enclosed print head technology, custom tooling options, and cleaning wipes.

Indium Adds Ariz.-based Sales Rep to Network

(February 2, 2006) CLINTON, N.Y. — Phoenix-based Santec Marketing has joined Indium Corp. as a sales representative in Sonora, Mexico. Santec will handle sales and support of Indium's solder paste, rework flux, wave solder flux, flip chip and liquid flux, underfill, conductive epoxy, solder sphere, solder preform, solder wire, solder ribbon, and SnPb and lead-free foil and bar solder product offerings in the Sonora region.

FocalSpot Grows Management Team to Meet Demands

(February 2, 2006) SAN DIEGO — FocalSpot, Inc. has added two industry veterans to its management team — David Phillips as Operations Manager and Rolando Asuncion as Production Manager. Phillips brings over 10 years of electronics manufacturing experience in field service, applications engineering, technical training, and sales support. Asuncion joins as X-Ray Production Lead, bringing over 20 years of electronics manufacturing experience in fabrication, assembly, and test.

GAC Acquires Lead-free Selective Soldering Systems

(February 1, 2006) SPOKANE, Wash. — A.C.E Production Technologies announces the sale and installation of dual KISS-101 selective soldering systems to Agawam, Mass.-based Governors America Corporation (GAC), a global supplier of electronic engine controls. The installation is part of GAC's lead-free conversion program to meet RoHS compliance. The KISS-101 selective soldering systems are compatible with new lead-free soldering alloys.

Next-gen Handheld Readers Identify DPM Codes

(February 1, 2006) NATICK, Mass. — Cognex Corp.'s next-generation DataMan 7500 series handheld direct part mark (DPM) readers identify and read all printed and DPM codes for manufacturers implementing part traceability programs in the automotive, aerospace, electronics, healthcare, and defense industries.

Sanmina-SCI to Show PCB, Backplane Technology at DesignCon '06

(February 1, 2006) SAN JOSE, Calif. — Sanmina-SCI Corp. will exhibit new PCB and backplane technology developments at DesignCon 2006, to be held February 6–9, 2006, at the Santa Clara Convention Center in Santa Clara, Calif. Sanmina-SCI will be located in the PCB Technology Pavilion at booth #819.

New Lead-free Verification System Available

(January 31, 2006) SUNNYVALE, Calif. — Slated for introduction at Booth 1396 at the APEX/IPC Printed Circuits Expo/Designers Summit 2006 exhibition and conference on February 8–10, 2006, in Anaheim, Calif., HEPCO, Inc.'s LeadHound system reportedly verifies lead-free or leaded components, sub-assemblies, PCBs, and other items in as little as 15 seconds.

Newark InOne Upgrades RoHS Compliance Website

(January 31, 2006) CHICAGO — Newark InOne, a subsidiary of global distributor Premier Farnell plc, now offers new compliance help on its RoHS Express site for U.S. and Canadian manufacturers. With this site update, Newark InOne has identified four basic steps that an OEM will typically consider on its way towards compliance with the RoHS directive.


IPC Posts December '05 Book-to-bill Ratio

(January 30, 2006) BANNOCKBURN, Ill. — In December 2005, IPC–Association Connecting Electronics Industries' North American rigid PCB industry book-to-bill ratio stayed strong at 1.09, but the North American flexible circuit book-to-bill ratio dropped to 0.95. Based on monthly data collected from PCB producers that participate in IPC's monthly PCB Statistical Program, the combined (rigid and flex) industry book-to-bill ratio remained positive at 1.06.

SMT's Goldstein Chairs Thermal Management Conference Session

(January 30, 2006) SAN JOSE, Calif. — Julia Goldstein, Ph.D., contributing editor for SMT and Advanced Packaging Magazines, is on the docket to chair Session One: Material Challenges and Solutions, at MEPTEC's 2nd Annual "The Heat is On: Thermal Management Solutions in Semiconductor Packaging," February 16, 2006, in San Jose, Calif.

Distributor to Premier Lead-free Products at APEX '06

(January 30, 2006) LOS ANGELES — Distributor all4-PCB (North America) will introduce new lead-free products at the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference, to take place February 8–10, 2006, in Anaheim, Calif. These products are said to be making their first North American trade show appearance.

TURI Hosts RoHS Compliance Planning and Strategies Workshop

(January 27, 2006) LOWELL, Mass. — The Massachusetts Toxics Reduction Institute (TURI) will host "RoHS Compliance Planning and Strategies," on February 28, 2006, from 8:00 a.m. to 2:15 p.m., at the Wyndham Hotel in Westborough, Mass.

Aerosol Cleaners Provide Alternative to Solvents

(January 27, 2006) ST. PAUL, Minn. — 3M Electronics' Novec aerosol cleaners are a viable alternative to solvent-based cleaners for removing dust, grease, oil, and other contaminants from sensitive electronics. The new line includes three low-toxicity, fast-drying cleaners that are ideal for challenging manufacturing applications, and are effective on various soils and contaminants.

Distinct Part Numbers Major Request at RoHS Summit

(January 26, 2006) SAN JOSE, Calif. — Last week, a group of authorized distributors, customers, component manufacturers, EMS providers, and OEMs gathered at NEDA's RoHS Summit to discuss the status of the industry six months before the July 1, 2006, RoHS deadline. One topic of concern that came up continuously was the call for distinct part numbers to ease confusion and increase accuracy.

Software Touts Real-time Process Monitoring for AOI

(January 26, 2006) SAN CLEMENTE, Calif. — The YESPC Software from YESTech is an enhancement from the company's automatic optical inspection (AOI) technology — providing real-time process monitoring.

Image Processor Software Optimized with SMT/BGA Capabilities

(January 26, 2006) SAN DIEGO — Adding to the Verifier Image Processor (VIP) Application Software series, FocalSpot introduced the VIPx, featuring an extended set of advanced SMT/BGA inspection capabilities and image enhancement tools.

IPC Picks Ten Companies for Innovative Technology Showcase

(January 26, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries announces the companies launching revolutionary technologies at this year's Innovative Technology Showcase (ITS), which will be held February 8–10, 2006, at the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference in Anaheim, Calif.

Arrow Electronics Names President for North America, Asia-Pacific Components

(January 25, 2006) MELVILLE, N.Y. — Arrow Electronics, Inc. has named Michael J. Long as president of North America and Asia-Pacific Components; a promotion from his previous position as president of the company's North American businesses. The presidents of both the company's North American and Asia-Pacific components businesses will report to Long, who has 25 years of experience in electronic components and computer products distribution.


Aegis Introduces End-to-end NPI/MES Solution

(January 25, 2006) PHILADELPHIA — Aegis Industrial Software's MCAD system caters to increasing customer demand for an end-to-end NPI through MES solution supporting electronics assembly, system integration, and box build. An integral part of the greater Aegis factory information system, it supports box and mechanical product documentation, tracking, quality, and materials management. Aegis customers may now support any discrete assembly processes in a single information system.

Excess Inventory Solution for Components Available

(January 24, 2006) DALLAS — A new excess inventory solution for electronic components is now available from BCD Electro, which combats surplus inventory reasons such as inaccurate forecasting, changes in business direction, end-of-life, product aging, or environmental directives (RoHS and WEEE).

Speedline Appoints Development Group Leader

(January 24, 2006) FRANKLIN, Mass. — Speedline Technologies has named Dr. Rita Mohanty to lead its Advanced Development Group (ADG), a team of engineers and resources dedicated to the research and development of technological and process innovations in SMT manufacturing and PCB assembly.

Universal Grows Genesis Platform Team with New Appointments

(January 24, 2006) BINGHAMTON, N.Y. — Universal Instruments has appointed a new Business Development Manager and Product Marketing Manager to the Genesis Platform Product Team, further boosting its position to compete in the evolving high-speed chip placement and flexible fine-pitch global marketplace.

Systems Focus on PCB/BGA Inspection

(January 23, 2006) RANDOLPH, N.J. — Two compact X-ray systems from Glenbrook Technologies, the RTX series for production monitoring and Jewel Box series for process development and failure analysis, are said to reduce manufacturing costs.

Palomar Names New Company President

(January 23, 2006) CARLSBAD, Calif. — Palomar Technologies has named Bruce W. Hueners as its new president, having most recently held the position of COO. Since joining the company in 1981 when it was Hughes Aircraft, he has played significant roles in elevating Palomar to its market position in the optoelectronics industry, bringing about a series of acquisitions and partnerships, and in expanding the company's business in the U.S., Europe, and Asia.

Free Webinar to Tackle 0201 and 01005 Assembly Hurdles

(January 23, 2006) FRANKLIN, Mass. — Speedline Technologies will discuss the issues involved in the 0201 and 01005 component assembly process in a free, live, hour-long Webinar, to take place February 16, 2006, at two different times: 2:00–3:00 a.m. EST, and 11:00 a.m.–noon EST.

iNEMI to Debut '07 Roadmap, Halogen-free Efforts at APEX '06

(January 23, 2006) HERNDON, Va. — In conjunction with the APEX/IPC Printed Circuits Expo/Designers Summit 2006 exhibition and conference, to take place February 8–10, 2006, in Anaheim, Calif., the International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, will kick off its 2007 Roadmap meeting on February 6–7. Several iNEMI project activities and results also will be discussed in conference forums and technical sessions.

Sanmina-SCI's Singapore Facility Earns AS9100 Certification

(January 20, 2006) SAN JOSE, Calif. — Global EMS provider Sanmina-SCI Corp's Singapore facility has earned the AS9100, Rev B aerospace standard certification, since the facility complies with all the requirements of the AS9100 quality management system.

Voltage-controlled Saw Oscillator Features True SineWave Output

(January 20, 2006) FORT MYERS, Fla. — The CVCSO-914-1000 1-GHz voltage-controlled saw oscillator (VCSO) from Crystek Crystals Corp. uses FR5 PCB and SAW crystal technology to provide a low-noise, low-jitter VCSO with true SineWave output, resulting in -135 dBc/Hz phase noise at 10-KHz offset.


Universal Names Director of European Operations

(January 19, 2006) BINGHAMTON, N.Y. — Universal Instruments appointed Peter Bollinger as Director of European Operations, operating from the company's offices in Bad Vilbel, near Frankfurt, Germany.

De-soldering Pump Can Extend Tip Life

(January 19, 2006) BARCELONA, Spain — Driven by compressed air from a Venturi valve, the MS 9005 de-soldering pump from JBC Tools is said to provide a powerful vacuum for on-site air pressure systems.

Indium Suzhou Nabs ISO-9001:2000 Certification

(January 18, 2006) CLINTON, N.Y. — Indium Corp. (Suzhou) Co., Ltd. recently passed its ISO-9001:2000 certification audit, joining the company's U.S., European, and Asia-Pacific Operations in achieving this certification, which focuses primarily on quality management.

Celestica Names New Executive VP of Worldwide Operations

(January 18, 2006) TORONTO, Ontario — Celestica Inc. has appointed James Rowan to its executive vice president of Worldwide Operations position, where he will manage Celestica's global manufacturing network, as well as implement site-to-site consistency in Lean, Six Sigma, organization capability, and customer care.

Newark InOne Publishes Quality Assurance Policy for RoHS

(January 17, 2006) CHICAGO — Small-quantity electronic components and test equipment distributor Newark InOne is implementing a comprehensive quality assurance policy to help its customers mitigate compliance risks associated with the European Union's Restriction of Hazardous Substances (RoHS) directive.

VOC-free Flux for Lead-free Wave Soldering Improves Wetting

(January 17, 2006) LONDONDERRY, N.H. — 396-FTA VOC-free flux for lead-free wave soldering applications has less than 2% solids, reportedly yielding extremely clean post-solder surfaces on the most difficult solder resists, and is now available from Cobar Solder Products.

RSVI Names Vice President of Operations

(January 16, 2006) HAUPPAUGE, N.Y. — RVSI Inspection LLC has appointed Nellie Quintana to its Vice President of Operations position, in which she will report directly to president Kevin Maddy and focus on making a step function improvement in quality, delivery, and cost.

New Stand-alone Depaneling System Available

(January 16, 2006) VIRKKALA, Finland — Cencorp Corp.'s Cencorp 1000 SR stand-alone depaneling system is a high-precision, modular, and ergonomic solution for electronics manufacturing. The system can be fitted with linear encoders for high-accuracy applications, and the router or saw-cutting devices accommodate V-scored or pre-routed panel designs.

Enthone Appoints New U.S. Director of Sales

(January 16, 2006) WEST HAVEN, Conn. — Enthone Inc., a business of Cookson Electronics, has appointed Jason Maupin as its new U.S. Director of Sales, in which will be responsible for leading the Enthone U.S. sales and technical service team in the electronics and surface-finishing industries.

Henkel Materials Specialist to Speak at SMTA Toronto

(January 13, 2006) MINNEAPOLIS — On January 18th, the Electronics Group of Henkel's Dr. Brian Toleno will speak at the upcoming SMTA Toronto, Canada Chapter meeting, sharing basic information such as the definition of underfills and their function, and more detailed data regarding design rules, reliability, and standards.


Sirenza, Digi-Key Sign Distribution Agreement

(January 13, 2006) BROOMFIELD, Colo., and THIEF RIVER FALLS, Minn. — Sirenza Microdevices, Inc. and Digi-Key Corp. have signed a worldwide distribution agreement. In the agreement, Sirenza's products will be featured in Digi-Key's printed and online catalogs, and will be available for purchase directly from Digi-Key, allowing Digi-Key to fulfill the design and production needs of its customers worldwide.

FocalSpot Expands Facilities

(January 12, 2006) SAN DIEGO — Due to global use of its inspection and rework solutions, FocalSpot has expanded its corporate office and manufacturing facilities. Facility construction began in early December 2005 and is scheduled for completion in mid-January 2006.

SMTA, TFI, and The GoodBye Chain Group Sponsor DfE Workshop

(January 12, 2006) MINNEAPOLIS — SMTA, in collaboration with Technology Forecasters Inc. (TFI) and The GoodBye Chain Group will sponsor, "Design for Environment (DfE) — Tools and Techniques for the Electronics Industry," on February 27, 2006, in Fremont, Calif. Additional workshops are scheduled for April 6, 2006, in Phoenix, June 7, 2006, in San Diego, and July 13, 2006, in Boston.

Libra Industries ISO 13485 Certified for Medical Market

(January 11, 2006) MENTOR, Ohio — Libra Industries received ISO 13485 certification for its medical electronics engineering and manufacturing operations. This certification gives Libra's customers the assurance of stringent control of business practices, electronic design services, and manufacturing processes used to produce medical electronics devices.

Compact Selective Soldering Line Targets Lead-free

(January 11, 2006) SPOKANE, Wash. — A.C.E. Production Technologies introduces its KISS line of selective soldering systems targeting lead-free solders.

Photo Stencil to Present Papers at APEX

(January 11, 2006) COLORADO SPRINGS, Colo. — Photo Stencil will present two papers at the IPC Printed Circuits Expo, APEX, and the Designers Summit in Anaheim, Calif., February 8-10, 2006.

CeTaQ Expands MCA Testing to Medical Market

(January 10, 2006) HUDSON, N.H. — CeTaQ Americas has made Machine Capability Analysis (MCA) testing application to laser systems used in precision micromachining and manufacturing of medical devices such as stents, and biomedical products.

NEDA Highlights Test, Measurement, and the Supply Sectors

(January 10, 2006) ATLANTA — NEDA will host its 2006 Electronic and TMC Development Forum, "Redefining Business Fundamentals," at the Loews Ventana Canyon Resort in Tuscon, Ariz., January 29-31, 2006.

Powell-Mucha Consulting Presents EMS Tutorial

(January 9, 2006) ANAHEIM, Calif. — To help EMS providers overcome challenges such as the transition to RoHS compliance and finding an adequate budget in a low-margin industry, Powell-Mucha Consulting, Inc. offers "Creating Competitive Advantage in Today's EMS Market," on February 7, 2006, from 2:00–5:00 p.m. at the APEX conference in Anaheim, Calif.

Wire-wound Chip Coils Reduce Mounting Space

(January 9, 2006) SMYRNA, Ga. — Murata Electronics North America's LQW04A series miniature, high-frequency, wire-wound-type chip coil in the 03015 EIA size (0.8 × 0.4 mm) suits high-frequency circuits used in mobile devices such as cell phones and personal digital assistants (PDAs). Its size is said to reduce the mounting area by 40%.


Advanced Circuits' PCB Prototypes Go Lead-free

(January 9, 2006) AURORA, Colo. — All of Advanced Circuits' prototypes will now be fabricated using lead-free solder as a plating finish. Its lead-free HAL finish provides an enhanced solderable finish for assembly, and meets all legislation requirements for the looming RoHS Directive six months ahead of the July deadline.

Fitch Ratings Notes Celestica's 'Stable Outlook'

(January 6, 2006) NEW YORK — Fitch Ratings, a global rating agency, has given Celestica Inc. a stable outlook rating, reflecting somewhat weak but improved operating performance and concentration to traditional end-markets characterized by more mature growth prospects.

Micron Products Forms New Division

(January 6, 2006) FITCHBURG, Mass. — Micron Products, a wholly owned subsidiary of Arrhythmia Research Technology has formed Micron Integrate Technologies (MIT) to specialize in the production of metal and plastic components for the medical and defense industries.

Cookson Group Sells SCS Business

(January 5, 2006) JERSEY CITY, N.J. — On December 30, 2005, Cookson Group plc (Cookson) sold its Specialty Coating Systems (SCS) business, which forms part of the Assembly Materials sector of Cookson's Electronics division, to Bunker Hill Capital for $55.5 million. An immediate cash payment of $54.0 million was made up front, with an additional $1.5 million to be paid upon closing of the sale of the SCS China business in early 2006.

Thin, Flexible Heaters Enable Precise Placement

(January 5, 2006) ST. LOUIS — A series of polyimide and etched-foil silicone rubber flexible heaters and hybrid heaters from Watlow are said to allow heat to be placed precisely where required, while the heater circuit meets customer specifications.

TSS Technologies to Open International Facility

(January 4, 2006) CINCINNATI — TSS Technologies, a manufactured products and equipment supplier serving the aerospace, automotive, medical, automation, and aviation power and marine industries, will open an international facility in Xiamen, China.

Aculight Appoints New Board of Directors Member

(January 4, 2006) BOTHELL, Wash. — Laser technologies developer Aculight Corp. has named Dr. Thomas S. Hartwick to its Board of Directors, who has spent nearly 50 years in high-technology business management and R&D. His technology expertise spans lasers, electro-optics, electronic/microwave devices, and satellite systems.

IPC Posts Book-to-Bill Ratio for November '05

(January 4, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' monthly PCB Statistical Program for November 2005 showed a rigid PCB industry book-to-bill ratio of 1.12 and a flexible circuit book-to-bill ratio of 1.16, both remaining strong. Combined, the book-to-bill ratio remained at 1.13.

PROMATION Boosts Post-AOI PCB Sorting Station

(January 4, 2006) KENOSHA, Wis. — PROMATION has enhanced its ENB-700 post-AOI sorting station, targeting customers who require a small footprint solution that can sort pass/fail products after AOI.

Flextronics Names New CEO

(January 3, 2006) SINGAPORE — Flextronics has appointed Michael McNamara as its new CEO, complementing its previously announced succession plan. McNamara has held various senior positions during his career at Flextronics, most recently as COO, but has also served as president of Americas' Operations and as vice president of North American Operations.


Upcoming Webinar Channels Lead-free SMT Printing Process

(January 3, 2006) FRANKLIN, Mass. — Speedline Technologies' experts will tackle the lead-free printing process, which is one of the industry's most critical manufacturing challenges, in a free, live Webinar on January 19th.

Design for Manufacture

As more companies embrace design for manufacture (DFM) as a method to increase both profits and throughput, a concept known as design for excellence (DFX) has come to the forefront. When properly implemented, DFX will ensure that a product can be manufactured and tested.

SMT China Moves Headquarters to Hong Kong

(December 29, 2005) HONG KONG — Effective January 1, 2006, SMT China magazine will move its headquarters to Hong Kong, where ACT International and PennWell will operate editorial, circulation, publication, Website and advertising services.

Speedprint Platforms Feature VacuNest Tooling Solution

(December 29, 2005) DORSET, U.K. — As part of an OEM agreement, Speedprint Technology will offer Novatec's VacuNest Shape Memory tool solution on its printer platforms.

Mentor Graphics and QuickLogic Pen FPGA Agreement

(December 29, 2005) WILSONVILLE, Ore. — Mentor Graphics Corporation has signed a multi-year OEM agreement with QuickLogic Corporation that offers QuickLogic's customers a new synthesis solution, and enables a smooth transition to a range of Mentor Graphics' advanced FPGA synthesis technology and tools.

Workshop Focuses on Supply Chain Optimization

(December 27, 2005) ALAMEDA, Calif. — Technology Forecasters, in collaboration with supply chain consultants, eKNOWtion and Avnet Electronics Marketing Global Supply Chain Services, offers, "Global Supply Chain Design and Optimization Workshop," on February 7, 2006, in Rosemont, Ill.

EDA Industry Reports 6% Growth in Q3'05

(December 27, 2005) SAN JOSE — The EDA Consortium's Market Statistics Service (MSS) announced that the electronic design automation (EDA) industry revenue for the third quarter of 2005 was up 6% to just over $1.1 million from $1.06 million in the third quarter of 2004.

SMTA Certification Dates Set for 2006

(December 27, 2005) MINNEAPOLIS, Minn. — SMTA announces 2006 dates for its Six Sigma Certification programs. Each three-day workshop, one for processes and one for Six Sigma Green Belt certification, feature refresher topics and open and closed book exams.

Kyzen Names Creyr Innovation as New England Rep

(December 27, 2005) NASHVILLE— Kyzen Corporation has named Rhode Island-based Creyr Innovation LLC as its manufacturing representative for New England.

Solectron Opens Design Services Center in Romania

(December 21, 2005) TIMISOARA, Romania — Solectron Corporation has established a Design and Engineering Services Center in Timisoara, Romania, to focus on providing advanced collaborative design and engineering services to the company's customers worldwide. Core capabilities of the center will include electrical and mechanical design, advanced process technology, test development and failure analysis.


Bliss Announces Promotion, New Staff

(December 21, 2005) MILPITAS, Calif. — Adding to its personnel, Bliss Industries has promoted Mike Prieb to sales manager, and hired Alfredo Grulich as a new account manager.

OEM Reselling Deal Targets RFID Smart Feeders

(December 20, 2005) BROMONT, Canada — Cogiscan has announced a strategic OEM reselling partnership with AGS Pte Ltd (Singapore), in which AGS will integrate and re-sell Cogiscan's RFID smart feeders as a standard on refurbished machines, RFID tags on refurbished feeders and RFID smart feeder retrofit kits to upgrade existing machines at customer sites.

SMTA International 2006 Call for Participation

(December 20, 2005) MINNEAPOLIS — The SMTA invites industry professionals to submit a paper to SMTA International 2006, to be held in conjunction with Assembly Tech Expo (ATExpo), September 24–28, 2006, at the Donald Stephens Convention Center in Rosemont, Ill.

Monthly Webinars to Deal With SMT Manufacturing Challenges

(December 19, 2005) FRANKLIN, Mass. — Speedline Technologies experts will address the SMT industry's manufacturing challenges in free, monthly Webinars. Targeted at OEM and CEM process engineers, each Webinar will focus on challenges specific to a major SMT manufacturing process, ranging from lead-free printing to high-speed underfill to practical DOE and SPC for electronics assembly to 0201 and 01005 component assembly.

Productronica 2005 Draws Record Numbers

(December 19, 2005) MUNICH — Productronica 2005 remains the largest trade show for electronics, attracting more than 44,000 visitors and 1,500 exhibitors from November 15–18, 2005.

Tape Guards Circuits During Fabrication, High-temp Masking

(December 16, 2005) WINDSOR, Conn. — Scapa 650 from Scapa Industrial is a high-temperature masking tape for low-static protection of gold-plated finger tabs, assembly holes and components during flux, preheat and soldering processes. The tape also targets high-temperature industrial masking in clean rooms.

Indium Adds to Asia-based Sales and Support Team

(December 16, 2005) CLINTON, N.Y. — Further strengthening its Asian operations, Indium Corporation has promoted Tom Lan to sales manager for Northeast China and hired Chia Yong Kwang as the technical manager for Asia.

Circular Blade Depanelizer Now Includes XY Table

(December 15, 2005) FRAMINGHAM, Mass. — FKN Systek's K2000 motorized circular blade depanelizer claims to separate pre-scored PCBs without any waste, and now includes an XY table for improved board handling. It singulates PCB panels by passing the scoreline between two circular blades, which include front and back blade guards for safety. An adjustable upper front blade guide assures that only the scoreline can be passed to the cutting area.

Cookson to Sell Polyclad Laminates to Isola

(December 15, 2005) LONDON — Cookson Group plc, Cookson Electronics' parent company, has entered into an agreement to sell Polyclad Laminates, Inc. to Isola Group, Sarl, for US$91 million. Completion of the transaction is conditional on satisfactory clearance from the European anti-trust authorities, and is expected in February 2006.

Soft Landing Reduces Nail Test Footprint of Flying Probers

(December 13, 2005) STUTENSEE-BLANKENLOCH, Germany — With continued miniaturization of components in automotive, medical and military applications, manufacturers often are concerned with over test coverage on complex and high-density boards, as well as problems with unwanted damage using conventional probe techniques. To combat this, Digitaltest introduced Soft Landing technology on its Condor flying probe test platform.


D-sub Connectors Now Meet RoHS Directive Requirements

(December 13, 2005) ETTERS, Pa. — FCI's RoHS-compatible D-Sub connector family now meets the European Directive EU 2002/95/EC — the Delta D series straight-solder and press-fit versions are now available without the restricted materials as detailed in the directive, and the right-angle version will be available by the end of the year.

Bench Top Dispenser Enables Hands-free Use

(December 12, 2005) SALEM, N.H. — The DXB bench dispenser from MIXPAC Equipment is a portable, bench top unit capable of dispensing two-component reactive resins of 1:1, 1.5:1, 2:1, 4:1 and 10:1 ratios.

Embedded Capacitor Material Achieves RoHS Compliance

(December 12, 2005) AUSTIN, Texas — 3M Electronics' embedded capacitor material, an advanced laminate, is now RoHS-compliant. The material can be made with a dielectric thickness down to 8 µm and a capacitance density of over 10 nF per sq. in. for embedding planar capacitance in circuit boards. When used as "power" and "ground" layers in a multi-layer PCB, it becomes an internal shared decoupling capacitor, eliminating many discrete surface mount capacitors and vias.

Molex Expands Multi-layer Flex Circuit Assembly Capabilities

(December 8, 2005) LISLE, Ill. — Molex Inc. now develops and delivers high-performance flex circuitry assemblies with up to 18 layers of conductive flex. In addition, Molex now has capabilities in the Americas to stamp flex circuitry and automatically circuit-etch, vacuum-laminate and drill multi-layer flex at the tightest tolerances.

New Substrate Technology Offers High Thermal Conductivity

(December 8, 2005) CORPUS CHRISTI, Texas — TT electronics IRC Advanced Film Division's Anotherm substrate technology consists of a thermally conductive aluminum alloy substrate insulated by a thin, chemically grown, anodized dielectric layer, with solderable screen printed conductors applied to the anodized layer. It is said to offer benefits over conventional, polymer-based insulated metal substrates (IMS).

Panasonic Leads Japan-based Factory Automation Show

(December 7, 2005) BUFFALO GROVE, Ill. — Panasonic Factory Solutions Company is hosting the Panasonic Factory Automation Show 2005, currently happening at Pacifico Yokohama, in Yokohama City, Japan, until December 9th.

'06 Designers Summit Caters to PCB Designers

(December 7, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' and its Designers Council's fourth annual IPC Designers Summit targets PCB designers, and will take place February 5–11, 2006, in conjunction with IPC Printed Circuits Expo and APEX, in Anaheim, Calif. PCB designers can obtain information on the latest technologies, such as embedded passives, lead-free materials, design-for-manufacture, high-speed design, and bare die.

Indium Grows Global Sales Team

(December 6, 2005) CLINTON, N.Y. — Indium Corp. has recently promoted Tony Howard to global account manager — in this position, he is responsible for promoting Indium's products and services by focusing on several key global accounts. He reports to Dave Preische, global sales manager.

Federal Electronics Debuts RoHS Conversion Services

(December 6, 2005) CRANSTON, R.I. — EMS provider Federal Electronics has debuted a services portfolio to aid OEMs convert and reengineer their products to comply with the European Union's RoHS directive. These regulations prohibit selling new electronic and electrical equipment in Europe if it contains more than trace levels of lead and five other elements by July 1, 2006.

Solectron's Global Sites Are Ready for RoHS Compliance

(December 5, 2005) MILPITAS, Calif. — Solectron Corp.'s global sites, which represent 85% of Solectron manufacturing capacity, have completed a lead-free, RoHS-compliant manufacturing qualification program. Solectron established an Environmental Compliance Leadership Team in January 2004 to develop and implement a lead-free and RoHS-compliant transition program across the company's manufacturing sites worldwide.


IPC Meeting Aims to Create Success Opportunities for Senior-level Leaders

(December 5, 2005) BANNOCKBURN, Ill. — Attendees at IPC's PCB Executive Management Meeting will learn the best practices of making a profit, a common goal that all PCB manufacturers share. The one-day event will be held on February 7, 2006, in Anaheim, Calif., together with the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference, to take place February 8–10, 2006, in Anaheim.

Lead-free Solder Wire Reduces Iron Tip Erosion

(December 5, 2005) EAST SUSSEX, England — The SR37-LFM-48S from Almit Technology is a lead-free wire designed to reduce the leaching of soldering iron tips and minimize the cost of tip degradation found at higher lead-free processing temperatures.

Surface Mount LEDs Target Harsh Environments

(December 2, 2005) PALO ALTO, Calif. — Agilent Technologies Inc.'s HSMx-A43xx series high-brightness red, red-orange, orange, amber, green and blue LEDs in the industry-standard Power PLCC-4 SMT form factor incorporate integral lenses to produce a 30° viewing angle.

Advanced Circuits Adds Lead-free Plating Finish to Offering

(December 2, 2005) AURORA, Colo. — Advanced Circuits now offers lead-free solder as a plating finish, providing an enhanced solderable finish for assembly that meets all legislation requirements for the European Union's RoHS Directive deadline of July 1, 2006.

Heat Sink Attachment System Offers Low Profile

(December 1, 2005) NORWOOD, Mass. — The MaxiGRIP heat sink attachment system from Advanced Thermal Solutions, Inc. (ATS) mounts heat sinks to flip chips, BGAs and other PCB components. The system features a plastic frame clip that snaps securely around a component's perimeter. A stainless-steel spring clip runs though the heat sink's fin field and fastens securely to the plastic frame. The spring clip easily removes, allowing a heat sink to be detached and re-attached.

NEDA Targets Supply Chain with RoHS/Lead-free Compliance Summit

(December 1, 2005) ATLANTA — The National Electronic Distributors Association (NEDA) will host "Negotiating the Economic, Legal and Logistic Challenges of RoHS/Lead-free Compliance," on January 19, 2006, in San Jose, Calif.

Chip Inductors Offer Low Rdc and High-current Operation

(November 30, 2005) SCHAUMBURG, Ill. — The LB3218 wire-wound chip inductor from Taiyo Yuden combines the functionality of two 3225-size low-resistance and high-current inductors into a single 3218-size device. The inductor is suitable for use in power supply circuits of digital still cameras, camcorders, VCRs and other commodity-type equipment.

Indium Appoints Asia Pacific Market Development Manager

(November 30, 2005) CLINTON, N.Y. — Bill Brunstedt has joined Indium Corporation as the Asia Pacific market development manager and will oversee business development efforts in that region with a focus on new and existing regional markets, general market strategies and new product requirements.

Cookson Nabs Patent for Stencil Software

(November 29, 2005) JERSEY CITY, N.J. — The U.S. Patent Office awarded patent #6,938,227 B2 to Cookson Electronics Assembly Materials Group for its ALPHA DIMENSIONS stencil configuration, design and ordering software, effective August 30, 2005.

Optical Chamber Delivers VUV Laser Beams

(November 29, 2005) HOLLIS, N.H. — J P Sercel Associates (JPSA) has introduced a large-format vacuum UV (VUV) optical chamber for UV excimer laser beam delivery systems that integrates with JPSA's Microtech MBD2 industrial-grade Beam Delivery System (BDS). Lenses, beam-expanding telescopes, beam homogenizers, spacers and other components can be positioned in the chamber and integrated into the BDS using JPSA's universal dovetail mounting system.


Book-to-Bill Ratio for October '05 Shows Decline

(November 29, 2005) BANNOCKBURN, Ill. — Based on monthly data collected from PCB producers that participate in IPC's monthly PCB Statistical Program, October 2005's North American rigid PCB industry book-to-bill ratio rose to 1.14, while the flexible circuit book-to-bill ratio declined sharply to 1.10. Combined, October's book-to-bill ratio declined slightly to 1.13.

SOIC Package Qualifies for Lead-free Manufacturing

(November 29, 2005) IRVINE, Calif. — A lead-free SOIC package from the electronics group of Henkel that integrates the company's GR828H mold compound with the Hysol QM1519 die-attach adhesive has received customer qualification. Designed for 16- and 14-lead SOIC packages, the material is said to combine the molding characteristics, high productivity and low-wire-sweep properties of the GR282H with the adhesive strength of the Hysol QM1519.

Planar Heaters Suit Multiple Applications

(November 22, 2005) GLENROTHES, Scotland — TT electronics BI Technologies SMT Division's planar heater products with ratings up to 50 W are suitable for military, computing, telecom, medical and commercial applications in surface mount, thru-hole and custom-profiled versions.

IPC Seeks Technical Papers for 12th Lead-free Conference

(November 22, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and JEDEC–the Solid State Technology Association announce the 12th International Conference on Lead Free Electronic Components and Assemblies, to take place March 6–8, 2006, in Santa Clara, Calif. Both associations are seeking technical papers from environmental menagers and technical staff on relevant subjects.

The Formation of Whiskers on Electroplated Tin Containing Copper

The probability of whisker growth on as-grown tin(Sn) electrodeposits has been measured as a function of copper(Cu) addition to a commercial bright methanesulfonate electrolyte

Indium Engineer Obtains SMTA Certification

(November 21, 2005) CLINTON, N.Y. — Indium Corp.'s Eric Bastow, a technical support engineer, has been awarded SMTA Certified Process Engineer certification, one of the electronics assembly industry's most respected signs of process knowledge and expertise.

New Die Attach Adhesive Combats Substrate Warpage

(November 21, 2005) SAN DIEGO — Advanced Applied Adhesives (AAA)'s AAA3000 Teflon (PTFE)-filled, electrically non-conductive adhesive is said to resolve the substrate warpage problem from attaching large, thin die on thin, organic substrates. Its polymer design offers a 32-MPa modulus, hydrophobic chemistry and hot adhesion. Its 260°C Moisture Sensitivity Level performance has been confirmed by beta-site testing.

Manual Production Components Aid in Lean Manufacturing

(November 21, 2005) BUCHANAN, Mich. — Bosch Rexroth Corp.'s new manual production components reportedly aid in lean manufacturing systems implementation, helping companies to reduce waste and increase productivity. The new Manual Production Systems (MPS) product line delivers configurable products to create production systems. Based on Rexroth's modular aluminum framing components and manual workplace components, the MPS products facilitate following lean production principles.

New Surface Mount EMI Suppression Filter Available

(November 18, 2005) SMYRNA, Ga. — Murata Electronics North America's BNX022 series surface mount EMI suppression filter measures 12 × 9 × 3 mm and weighs 0.8 g as a result of advancements in capacitor materials and terminal formation technology, as well as improved packaging.

DEK Report Details Lead-free Stencil Design Rules

(November 18, 2005) SAN JOSE, Calif. — DEK has published "Understanding Stencil Printing Requirements for a Lead-free Mass Imaging Process," a report detailing findings on screen printing using lead-free pastes that focuses on implications for stencil design rules.


DEK's Micron Class Offering Shows Record Growth

(November 17, 2005) FLEMINGTON, N.J. — DEK's recently launched Micron Class product range, founded on Galaxy and Europa technologies, represented the largest percentage sales increase of any DEK platform during July and August. Galaxy enjoyed an exceptionally solid performance, representing 16% of total sales for August, compared with 6% in July. Meanwhile, for the same period, the company confirmed that Europa sales grew from 1% to 7%.

Masstech Offers Environmental Compliance Information Solutions

(November 17, 2005) WOBURN, Mass. — Masstech EMS' Environmental Compliance Information Solutions are service offerings to help customers comply with changing environmental regulations. The first critical service offering is the Lead Free Conversion Program, designed to help OEMs prepare for and comply with the European Union's Restriction of Hazardous Materials (RoHS) Directive.

Intel, Honeywell Sensing and Automation Nab NEDA Manufacturer Awards

(November 17, 2005) ATLANTA — Intel Corp. and Honeywell's Sensing and Automation Division have each been awarded with the NEDA Manufacturer of the Year Award at its annual awards ceremony during the 2005 NEDA Executive Conference, held November 6–8, 2005, at the Renaissance Chicago Hotel.

Indium Lead-free Experts to Speak at SMTA Forums

(November 16, 2005) CLINTON, N.Y. — Indium Corp.'s senior technologist, Ronald C. Lasky, Ph.D., PE, and Tim Jensen, Pb-free programs manager, are scheduled to speak at several educational forums for the SMTA's regional North American chapters. Their goal is to help prepare members for the European Union's directives for WEEE/RoHS compliance.

iNEMI Issues 2005 Research Priorities

(November 16, 2005) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) announces the release of its 2005 Research Priorities, a document that presents the consensus on R&D needs identified in the 2004 iNEMI Roadmap. It intends to help the electronics manufacturing industry focus efforts on those areas and issues that are critical to future competitiveness.

Cell Phones Near Market Saturation

(November 15, 2005) LOS ALTOS, Calif. — Mobile phone markets in developed economies are approaching saturation, shows the recent Henderson Forecast Summary. With market penetration for these devices at 120% in Luxembourg (with 120 subscribers for every 100 inhabitants), the saturation point has been exceeded, shows OECD data. While this trend may not be reflective of other countries, penetration rates for most developed countries inch up beyond 80%.

A Closer Look at Lead-free Solder

By Michelle M. Boisvert, SMT Managing Editor - (November 15, 2005) — I can no longer consider myself a newbie in the SMT industry. Last week, I got my feet wet in the soldering side of things. At the recent "Lead-free Technology Forum and Workshop," presented by Dage Precision Industries and hosted at the Circuit Technology Center in Haverhill, Mass., I had the chance to hand-solder thru-hole components onto a board using lead-free solder.

Tyco Sets Up New Automation Technology Center

(November 15, 2005) HARRISBURG, Pa. — Tyco Electronics' Global Application Tooling Division (GATD) has established a new Automation Technology Center, which targets lead-free PC board assembly technologies and RFID inlay assembly processes and systems development. George Szekely, Tyco's general manager, will oversee the new Willow Grove, Pa.-based center.

The Electronic Interconnection Files - 5 - Volumetric System Miniaturization and Interconnection Technology

Even without the doubling of the transistor effect, there have already been developed a significant number of interconnection solutions over the last few years to improve the density of semiconductors in ways that boarder on legerdemain

Rohm and Haas' Circuit Board Technologies Division Ups Prices in Europe

(November 14, 2005) COVENTRY, England — Rohm and Haas Electronic Materials Circuit Board Technologies in Europe is increasing prices by 3% across its circuit board fabrication materials range to help offset the impact of unprecedented increases in the costs of raw materials, metals, energy and freight over the past 18 months. The increase will take effect from January 1, 2006, or as contracts allow.


Celestica Acquires Flat-panel Display Repair Company

(November 14, 2005) TORONTO — Celestica has acquired Displaytronix, a flat-panel display repair services company, enabling Celestica to expand its service offerings in the growing flat-panel display market.

Seica SPA Broadens Automation Solutions

(November 14, 2005) STRAMBINO, Italy — Seica SPA introduced several products within its VIVA Integrated Platform, including the Strategy.sl, a full automated in-circuit/functional bed-of-nails tester; the Pilot VIP system, an automated flying probe tester for loaded boards; the S24 BBT flying probe tester for board boards; and the Firefly laser selective soldering system.

Focusing on Lead-free Cleaning

By Michelle M. Boisvert, SMT Managing Editor - (November 11, 2005) — There are several issues weighing on the minds of those in the industry regarding lead-free. Cleaning is one factor that often presents itself in discussions. ZESTRON has conducted several experiments concluding that silver-containing alloys have a tendency to form dendrites, affecting the long-term climatic reliability of electronic assemblies.

Valor Computerized Systems Notes Strong Growth

(November 11, 2005) YAVNE, Israel — Valor Computerized Systems announced continued growth during the nine-month period ending September 30, 2005, with revenues for the third quarter reaching $9.2 million, an increase of 17.5% from the same period last year.

Single Lane Tube Feeder & Loader Peripherals Intro

(November 11, 2005) HOUSTON — BP Microsystems announced its Single Lane Tube Feeder and Loader peripherals are available, expanding automated programming capabilities for small devices.

Indium Names New Process Engineer

(November 10, 2005) CLINTON, N.Y. — Robert (Bob) Jarrett has joined Indium Corp. as a Manufacturing Process Engineer, and is based at Indium's Robinson Road facility in Clinton, N.Y. He will report directly to the Vice President of Operations.

ECD Unveils RoHS-compliant Thermal Profiler at Productronica '05

(November 10, 2005) PORTLAND, Ore. — At the Productronica show, to take place November 15–18, 2005, in Munich, visitors to ECD's booth (A4.240) will be amongst the first to see ECD's new RoHS-compliant SuperM.O.L.E. Gold thermal profiler. In terms of higher process temperatures, this thermal profiler is lead-free-compatible, containing no lead or the other banned substances in the board finish, components or hardware.

U.S. Fighter Pilot Team to Deliver Closing Keynote at APEX '06

(November 9, 2005) BANNOCKBURN, Ill. — The Afterburner team of fighter pilots will deliver the closing keynote at APEX/IPC Printed Circuits Expo/Designers Summit 2006, to take place February 8–10, 2006, in Anaheim, Calif. During the keynote, attendees will discover how to execute strategies critical to their success and survival with the Flawless Execution Model, a process used by fighter pilots around the world to execute missions.

Translators Support Varying Voltage Levels of Next-gen Applications

(November 9, 2005) SAN JOSE, Calif. — Pericom Semiconductor has broadened its translator line with advanced Universal Level Shifter (ULS) technology, allowing customers to use a bi-directional automatic direction sensor to support the different voltage levels of next-generation systems.

Speedprint, Tecan to Host Lead-free Clinics at Productronica '05

(November 8, 2005) DORSET, U.K. — Speedprint Technology Ltd., a division of Blakell Europlacer Group, will co-host lead-free clinics with Tecan Stencils in booth A4.121 at the upcoming Productronica trade show and exhibition, to take place November 15–18, 2005, in Munich. Presentations will cover lead-free considerations for materials, stencils, soldering and printing. Tecan's Tony Welton will give the presentations, which will run at periodic intervals during the show.


VJ Electronix Displays X-ray System at Productronica

(November 8, 2005) SHIRLEY, Mass. — VJ Electronix will display the X130D X-ray inspection system at the company's booth (A1.339) at Productronica, November 15–18, 2005, at the New Munich Trade Fair Center in Munich, Germany.

SMTA Adds to Online Knowledge Base

(November 8, 2005) MINNEAPOLIS — The SMTA Knowledge Base is a searchable archive of all technical papers presented at SMTA conferences and featured in the SMTA Journal. It currently consists of nearly 2000 full-length technical articles from such conferences as SMTA International and the Pan Pacific Microelectronics Symposium. This year, 77 papers have been added from the 2005 Pan Pacific Microelectronics Symposium and from the SMTA Medical Electronics Symposium.

Made2Manage Systems to Acquire Capri Corp.

(November 7, 2005) DOWNERS GROVE, Ill., and INDIANAPOLIS — Capri Corp., a supplier of enterprise resource planning (ERP) software and services to the PCB industry through its operating subsidiary Cimnet Systems Inc., has entered into a definitive merger agreement that will result in an acquisition by Made2Manage Systems Inc.

IBM Signs On as Outsourcing Webinar Sponsor

(November 7, 2005) SAN JOSE, Calif. — IBM will sponsor Venture Outsource Group's upcoming Webinar, "Global EMS Providers — strengths, challenges, competitive tactics and value propositions," scheduled for December 8, 2005, at 10:00 a.m. PDT. Companies that will be profiled at the seminar include Benchmark Electronics, Celestica, Elcoteq, Flextronics, Foxconn, Jabil Circuit, Nam Tai Electronics, Plexus, Sanmina SCI and Solectron.

New Power Cube Inductors Offer No Thermal Aging

(November 7, 2005) SAN DIEGO — The new PG0322NL series thru-hole, shielded, shaped-core power inductors are ideal for use in voltage regulator modules (VRMs), DC/DC converters, and point-of-load applications in the motherboard and server markets, and are now available from Pulse, a Technitrol Company.

AER Worldwide Opens E-waste Recycling Center in Malaysia

(November 4, 2005) FREMONT, Calif. — AER Worldwide has opened AER Worldwide Sdn. Berhad in Penang, Malaysia, an electronics de-manufacture and sorting center. The center will provide Asia-based OEMs and contract manufacturers with close-to-source material sorting and destruction services.

IPC Opens APEX '06 Award Nominations

(November 4, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries is now accepting nominations for the awards program taking place at APEX/IPC Printed Circuits Expo/Designers Summit 2006, to be held February 8–10, 2006, in Anaheim, Calif.

DEK Signs Print-head Technology Agreement

(November 4, 2005) WEYMOUTH, DORSET, U.K. — DEK has signed an agreement to license its ProFlow enclosed print head technology to EKRA, permitting ProFlow integration into new machines. The agreement, which also covers printers sold under the ASYS name, will last for five years initially, and is subject to review at the end of that time.

China Telecom Supplier Selects Mentor Graphics Design Software

(November 3, 2005) WILSONVILLE, Ore. — ZTE, Ltd., a Chinese communication device maker and national wireless supplier, has purchased Mentor Graphics Corp.'s XtremePCB software. Available as part of Mentor's Expedition Enterprise flow, XtremePCB facilitates a team design environment, allowing multiple members of a PCB design team to work simultaneously on a design from a single database on a global network.

Indium Appoints New Central American Reps

(November 3, 2005) CLINTON, N.Y. — Blackberry & Cross has become Indium Corp.'s newest representative in Central America, and will be responsible for selling Indium's solder pastes; rework fluxes; wave solder fluxes; flip chip and liquid fluxes; underfills; conductive epoxies; solder spheres; and fabricated solder products.


APEX '06 to Feature Custer Consulting's Business Outlook

(November 2, 2005) BANNOCKBURN, Ill. — Walt Custer, president of Custer Consulting Group, will deliver a keynote presentation at APEX/IPC Printed Circuits Expo/Designers Summit 2006, to be held February 8–10, 2006, on February 9th.

Surface Mount Capacitors Offer COTS Option

(November 2, 2005) GREENVILLE, S.C. — KEMET Corp.'s T497 Series High Grade Commercial Off-the-Shelf (COTS) tantalum capacitors are available in non-standard case sizes corresponding to the Military CWR09, 19 and 29 styles. The capacitors range from 0.10 to 150 µF and 4 to 25 V to fit demand for extended safety considerations.

COMET Names New Sales and Marketing Manager for FEINFOCUS

(November 1, 2005) GARBSEN, Germany — COMET, who supplies FEINFOCUS X-ray inspection systems, has appointed Axel Bermeitinger as sales and marketing manager for the FEINFOCUS Business Unit. Bermeitinger has an extensive sales and marketing background in such industries as materials, electronics and medical devices. Previously, he held management positions at a specialty laser application machines supplier and a Swiss Holderbank AG subsidiary.

iNEMI, IPC to Host Meeting on MCD Exchange Implementation

(November 1, 2005) HERNDON, Va. and BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and the International Electronics Manufacturing Initiative (iNEMI) will host a session at Productronica 2005, to be held November 15–18 in Munich, to discuss implementation and industry adoption of material composition data (MCD) exchange standards. The meeting is scheduled for Wednesday, November 16th, from 9:00 a.m. to noon in Conference Room A 61.

Micro Contacts Suit Rugged Interface Applications

(October 31, 2005) NEW ALBANY, Ind. — Samtec's Tiger Eye contacts are multi-finger, precision stamped and formed, beryllium-copper contacts that are heat-treated to optimize spring properties for maximum cycles in high-reliability applications. Available in 1.27- and 2-mm pitch connector sets and in IDC cable systems, the contacts have been tested at up to 10,000 cycles with optional palladium-nickel plating.

RSVI Appoints New President

(October 28, 2005) HAUPPAUGE, N.Y. — RVSI Inspection LLC has recently appointed Kevin Maddy as its new president, where he will be responsible for managing products and applications sales that meet and exceed the demands of the global industry, while cultivating customer relationships. With his 25 years of manufacturing experience, he spent the past 14 years as a general management executive with P&L responsibility.

Productronica '05 to Feature 'EMS Village'

(October 28, 2005) MUNICH — Productronica 2005, to take place from November 15–18 in Munich, will feature the "EMS Village" — an information and discussion platform for EMS providers and users. It will be located in Hall A6 and will be at its second Productronica show, reflecting the immense significance of the growing industry.

Process Control Tool Helps to Kick Off Production

(October 28, 2005) MORRISON, Colo. — ScanINSPECT VPI from ScanCAD International qualifies each step of the assembly and fabrication process before production. This stand-alone system mixes a high-resolution, color flatbed scanner with a dual lighting system to provide a platform that verifies all of the process components before they reach the manufacturing floor.

Ironwood Releases Latest Short-form Catalog

(October 27, 2005) EAGAN, Minn. — Ironwood Electronics recently released its latest short-form catalog, version 19, which contains such products as Ironwood's 0.4-mm-pitch BGA and QFN sockets with 10+ GHz bandwidth and 500,000 insertions.

PCB Systems Design Suite Targets Global Manufacturing

(October 27, 2005) WILSONVILLE, Ore. — Mentor Graphics Corp. introduced its Expedition Enterprise flow for PCB systems design, enabling large companies to leverage multi-disciplined design team resources while providing global access to intellectual property (IP). The solution also gives companies the ability to integrate design data with corporate PLM, as well as supply chain and manufacturing systems.


Solectron Expands Guadalajara Plant with New Capabilities

(October 27, 2005) GUADALAJARA, Mexico — Solectron Corp. has recently expanded its capabilities in Guadalajara by creating an Enclosure Center and a Technology Excellence Center. The facility will focus on providing PCB assembly manufacturing and enclosures, system integration and design and engineering services to Solectron's customers worldwide.

Die Attach Adhesive Self-fillets During Ramp-up

(October 26, 2005) SAN DIEGO — Advanced Applied Adhesives' AAA1002A self-filleting die attach adhesive exhibits capillary flow during a programmed temperature ramp-up. It is said to achieve 100% area coverage under the die without producing a bulky fillet that can overflow onto the top of thin die before it reaches the cure onset temperature.

IPC's Book-to-Bill Ratio Reaches Positive Heights in September '05

(October 26, 2005) BANNOCKBURN, Ill. — IPC's North American rigid PCB industry book-to-bill ratio for September 2005 rose to 1.07, while the North American flexible circuit book-to-bill ratio continued high at 1.52. Also, the combined (rigid and flex) book-to-bill ratio in September continued its climb to 1.18. These ratios are based on monthly data collected from PCB producers that participate in IPC's monthly PCB Statistical Program.

Lead-Free Solder: A Train Wreck In The Making

Everyone seems powerless to do anything to head off the catastrophe, yet no one can tear his eyes away from the impending crash

Flextronics Reports a Loss

Net sales for the second quarter ended September 30, 2005 were $3.9 billion compared to $4.1 billion in the year ago quarter

Edge Cards Facilitate Board-to-board Interconnection

(October 25, 2005) SAN MARCOS, Calif. — Sullins Electronics has expanded its existing high-temperature edge card series to now include staggered dip solder and card extender/SMT parts, as well as those featuring right-angle bend terminations.

IPC Honors Members, Company at IPCWorks '05

(October 25, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries is honoring 28 individuals and one company at IPCWorks 2005, currently happening from October 24� in Las Vegas, for their contributions to IPC and the electronics interconnect industry.

Free Webinar to Target Tin Whisker Challenges

(October 24, 2005) FRANKLIN, Mass. — Speedline Technologies' experts will address tin whisker challenges and their issues in SMT manufacturing in a free, live Webinar, titled "Tin Whiskers," on November 17th, from 11:00 a.m. to noon EST. Tin whiskers, or the small protrusions of tin that can "grow" from tin-plated surfaces that can cause electrical short circuits, have cause for concern due to the industry's movement to lead-free manufacturing.

Atlanta-based Workshop to Focus on Conformal Coating, Dispensing

(October 24, 2005) CARLSBAD, Calif. — Asymtek, Dow Corning, Emerson & Cuming, Henkel Technologies and Humiseal will hold a conformal coating and dispensing workshop on November 8, 2005, at the Center for Board Assembly Research/Manufacturing Research Center (MARC) at Georgia Tech University in Atlanta. New information on conformal coating and best practices for jetting and other electronic assembly dispensing from both material and equipment perspectives is the aim of the workshop.

Elektrobit to Display Automation Line at Productronica '05

(October 21, 2005) OULUNSALO, Finland — Elektrobit Group plc will exhibit its complete JOT Automation line, featuring a bare board unstacker, laser marker, segment conveyor, high-speed router and a single flat-belt conveyor at Productronica, to be held November 15–18, 2005, in Munich. The functioning line will demonstrate boards being routed into several straight-edged pieces to showcase the high-speed router's capabilities, for example.


Upcoming Pan Pacific Symposium to Present Latest R&D Findings

(October 21, 2005) MINNEAPOLIS — The SMTA's 11th Annual Pan Pacific Microelectronics Symposium, to be held January 17–19, 2006, at the Hapuna Prince Hotel on the Big Island of Hawaii, will feature a vendor display and technical conference that shares the latest findings in R&D and provides a means for sharing business ideas to improve collaboration globally.

Indium to Show WEEE/RoHS-compliant Offering at Productronica '05

(October 20, 2005) UTICA, N.Y. — Indium Corp. will display its lead-free electronics assembly materials for WEEE and RoHS compliance at the Productronica show in Munich on November 15–18, 2005, and Indium's booth will be located in A3-550.

NEDA and ERA Host Electronics Industry Sales and Marketing Conference

(October 20, 2005) ALPHARETTA, Ga. — The Electronics Representatives Association (ERA) and the National Electronic Distributors Association (NEDA) have teamed to sponsor the 2006 Electronics Industry Sales and Marketing Conference on March 28–31, 2006, in Tampa, Fla. The conference is designed specifically for representatives, distributors and manufacturers to focus on sales and marketing efforts.

New PU and PVA Materials Suit CMP Machinery

(October 20, 2005) CHANDLER, Ariz. — Ceiba Technologies' polyurethane (PU) and polyvinyl alcohol (PVA) sponge materials are produced in roller and sheet forms for absorbing fluids and particulate wastes; scrubbing surfaces; and applying uniform coatings. Manufactured to exacting specifications and tolerances that provide lot-to-lot consistency, the PU material is formulated for softness in both wet and dry conditions, combined with abrasion and chemical resistance.

Video Inspection Tool Meshes Optics and Components

(October 20, 2005) CAMBRIDGE, U.K. — The MS500C Micro-Scopeman is a high-resolution integrated video inspection tool for real-time inspection and QA tasks, and is now available from Moritex Europe Ltd. Integrating advanced optics, fiberoptics and CCD components into a CCD microscope system, the MS500C provides a magnified image on a TV or video monitor by pointing at the target.

iNEMI to Debut European '07 Roadmap Efforts at Productronica '05

(October 20, 2005) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) will hold the first regional meeting to kick off its latest industry roadmap at Productronica 2005, to be held November 15–18 in Munich. - Co-sponsored by Fraunhofer IZM, IEEE's Components, Packaging, and Manufacturing Technology (CPMT) Society and IMAPS Europe, the meeting is scheduled for November 16th at the New Munich Trade Fair Center.

Content Management Toolset Enables Collaboration at Multiple Sites

(October 19, 2005) OOSTERHOUT, The Netherlands — Adeon Technologies BV launched the CXInsight for Electronics, a project content management system that allows internal and external collaboration between project members across OEM and manufacturing sites.

KIC Announces Homepage Redesign

(October 19, 2005) SAN DIEGO — KIC has redesigned its Website's homepage to provide a straightforward layout where visitors can learn about KIC's solutions. The redesign aims to aid the transition to lead-free production and includes such lead-free highlights as KIC's Lead-free Seminar Series and the KIC Advantage, which provides an overview of KIC and its technologies.

Boundary-scan Tester Validates Features Prior to Prototype

(October 18, 2005) RICHARDSON, Texas — ASSET InterTech Inc.'s DFT Analyzer is said to reduce manufacturing and test costs by validating the boundary-scan design-for-test (DFT) features in a circuit-board design before prototype assembly. It also determines the extent of a design's boundary-scan test coverage, recommending changes that would increase coverage.

In-line Multi-head Dispenser Handles Six Heads

(October 18, 2005) IRVINE, Calif. — MIMOT released an in-line dispenser based on its accurate, positive displacement auger valve. The unite features an overall dispense capacity of 40,000 d/h and can be equipped with up to six dispense heads.


IPC/JEDEC Lead-free Conference to Target Components and Assemblies

(October 17, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and JEDEC will host the 11th International Conference on Lead-free Electronic Components and Assemblies on December 6–8, 2005, in Boston. To help prepare for such issues as new alloys and materials evaluations, inspection changes, tin whiskers, reliability and increased assembly costs, top experts will come together to deliver an educational program and technical conference.

Compact Connectors Provide Mini Docking Capabilities

(October 17, 2005) LISLE, Ill. — The CradleCon connector system from Molex Inc. offers a compact solution for applications using a cradle-docking function, such as digital cameras, audio players, mobile phones and other portable consumer items. The dual-row, 0.50-mm-pitch system is available in various SMT board-to-board options and custom cable versions.

MYDATA to Unveil 'Extended' Placement Machine Version in Europe

(October 17, 2005) STOCKHOLM, Sweden — MYDATA automation AB introduced its MY-Series Extended (E) model to the European market. The model, which initially launched at APEX 2005 in Anaheim, Calif., reportedly handles a range of components at high speed on a variety of board sizes.

Productronica '05 to Aid the Industry's Lead-free Transition

(October 14, 2005) CHICAGO — Productronica 2005, to be held November 15–18, 2005, in Munich, Germany, will aim to help electronics production experts and professionals in their transition to environmentally friendly practices and products. Show attendees will be able to gain firsthand information on the status of lead-free technologies and the latest processes in compliance with the new regulations.

Speedline Receives Patent for Bridge Detection Method

(October 14, 2005) FRANKLIN, Mass. — Speedline Technologies has received U.S. Patent #6,891,967 for its MPM BridgeVision inspection method. Awarded for its innovative analysis technique used to quantify both the amount and geometry of solder paste between printed deposits, the technique uses the solder paste's texture to identify its position relative to the smooth pad and solder mask. This method shows the difference between the gray solder paste and the dark solder mask.

Scalable Handling Solution Targets Servo Gantry Applications

(October 13, 2005) CHARLOTTE, N.C. — A complete, scalable gantry solution for handling applications, Bosch Rexroth Corp.'s IndraMotion includes necessary hardware and software components with predefined motion function blocks to run pick-and-place and loading/unloading machinery. Powered by an IndraControl L40 Motion Logic controller, IndraMotion controls Cartesian gantries with up to three linear axes (X, Y and Z) and three rotary axes (A, B and C) of motion.

Delphi Corp. Files Voluntary Chapter 11

(October 13, 2005) TROY, Mich. — Delphi Corp. announced the company and 38 of its domestic subsidies filed voluntary petitions for business reorganization under Chapter 11 of the U.S. Bankruptcy Code in an effort to preserve the value of the company and complete its transformation plan to resolve existing legacy issues and the high cost of U.S. operations.

Recent Lead-free Technology Workshop Delivers

(October 12, 2005) FLEMINGTON, N.J. and IRVINE, Calif. — DEK and Henkel's collaboration on their Hands-on, Lead-free Technology Workshop proved successful, and was held September 22–23, 2005, in Chicago, prior to the Assembly Technology Expo/SMTA International exhibition and conference held September 27–29.

Kester's Chemical Line Sees Price Increases

(October 12, 2005) DES PLAINES, Ill. — Effective October 15, 2005, many of Kester's fluxes, thinners and associated chemical products will see price increases. Several of the raw materials used in Kester's chemical products have risen 64% in the past year and 100% since the beginning of 2004. Chemicals linked to the petroleum industry, such as alcohol solvents and oils have reached a point where Kester must pass these costs along to customers.

Universal Instruments Restructures in Binghamton and Bangalore

(October 11, 2005) BINGHAMTON, N.Y. — Universal Instruments Corp. announced infrastructure and staffing changes aimed at increasing product quality, sales growth and customer satisfaction in its Binghamton and Bangalore, India facilities.


Teradyne Sells Connection Systems Division

(October 11, 2005) BOSTON — Teradyne has reached an agreement to sell its Nashua, N.H.-based Connection Systems division to Amphenol Corporation for $390 million cash. Connection Systems is a supplier of high-speed, high-density connectors, as well as high-performance PCBs and backplane interconnect systems.

Indium's Weiping Liu Joins International Scientific Advisory Board

(October 11, 2005) CLINTON, N.Y. — The American Welding Society, ASM International and the International Brazing and Soldering 2006 organizing committee have invited Indium's Weiping Liu, Ph.D., a research metallurgist, to join the conference's International Scientific Advisory Board.

Wohler Technologies Policy on RoHS & WEEE

Will Wohler, President & Founder of Wohler Technologies, Inc., speaks out against the RoHS & WEEE Directives...

Siemens Establishes Singapore Hub for Asia Manufacturing

By Gail Flower, Editor-in-Chief - (October 10, 2005) SINGAPORE — In September 2005, Siemens Electronics Assembly Systems delivered its first high-speed Siplace placement machine produced at the company's new SMT manufacturing plant in Singapore

Pb- and N2-free Solder Uses Extended Heat Profiles

(October 10, 2005) LONDONDERRY, N.H. — Cobar introduced the SAC4-XM7S solder paste for lead-free and nitrogen-free processing. The paste, which remains stable and active during extended heating at elevated temperatures, does not require a nitrogen blanket and is said to offer a robust printing window.

Geotest Expands Regional Sales Team

(October 10, 2005) IRVINE, Calif. — Geotest-Marvin Test Systems has added Bob Szpila to its sales team as western regional sales manager, overseeing the company's sales force in the western and Rocky Mountain states.

SMTA Honors Members at SMTA International

(October 7, 2005) MINNEAPOLIS — During the annual SMTA meeting at SMTA International, the association honored members who have shown exceptional service to the SMTA and the industry.

PennWell Acquires Small Times Magazine

(October 7, 2005) TULSA — PennWell Corporation has acquired Small Times Magazine, which covers the nanotechnology, MEMs and microsystems markets.

Kyzen to Showcase Cleaning Solutions at Medical Design Show

(October 7, 2005) NASHVILLE — Kyzen Corporation will showcase its Metalnox M6440, Metalnox M6434 and Aquanox 4630 cleaning solutions at the MD&M Medical Design and Manufacturing show scheduled for November 2-3, 2005, at the Minneapolis Convention Center.

Neal Bender Joins IPC as Membership Director

(October 7, 2005) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries has named Neal Bender membership director responsible for developing, implementing and directing IPC's membership recruitment and retention programs.


SMART Group Publishes Lead-free Experience Report

The report, produced by Bob Willis, SMART Group technical director, is available free-of-charge...

Bench Top CNC Terminal Inserter Intros

(October 6, 2005) MOUNT KISCO, N.Y. — Zierick Manufacturing introduced a fully automatic CNC insertion system. Measuring 3' x 3' x 2' high, the bench top Model 9700 XY Positioning System is suitable for production lines and the needs of contract manufacturers. Its modular tooling is said to reduce downtime between terminal changeovers.

SMART Group Publishes Lead-free Experience Report

(October 6, 2005) BUCKS, England — The SMART Group, with support from LEADOUT, a European-wide lead-free projects, developed the Lead-free Experience3 to assist small- and medium-volume producers. The third-annual Lead-free Experience offered engineers a hands-on experience with all aspects of lead-free materials and production equipment.

EMS/ODM Growth Slow Compared to 2004

(October 5, 2005) ALAMEDA, Calif. — Growth within the electronics and outsourcing markets is slowing, but top-line growth should continue in most segments, claimed Technology Forecasters Inc (TFI) analyst Matt Chanoff, during TFI's annual Five Year Forecast at the Quarterly Forum in Toronto.

OK to Launch Lead-free Solutions at Productronica '05

(October 4, 2005) MENLO PARK, Calif. — In response to ever-increasing global demand for lead-free hand soldering, rework and fume extraction systems ahead of the WEEE and RoHS deadlines, OK International will launch a new range developed under the single OK International brand specifically for lead-free processes. Through the on-stand "Lead-Free Kiosk," customers will be able to meet OK's lead-free process experts to help resolve any hand soldering and rework application issues.

High-volume Selective Solder System Highlighted

(October 4, 2005) WILLOW GROVE, Pa. — The Automation Group of Tyco Electronics showcased its Harmony-SPX, a multi-axis Cartesian Robot designed to selectively solder thru-hole and odd-form components into surface mount and mixed-technology PCBs at last week's Assembly Technology Expo in Rosemont, Ill.

IPC Works with IT and Computer Industries to Develop Quality and Manufacturing Process Standards

"IPC is a perfect match for our efforts as they represent all levels of the electronics supply chain. Because of its long history of standards-setting activities

PROMATION to Display Select Offerings at SMTA/IMAPS Dallas

(October 3, 2005) KENOSHA, Wis. — PROMATION will have a mini display booth at this year's SMTA/IMAPS Vendor Days, to be held October 11, 2005, at the Richardson Civic Center in Dallas. At the exhibit, DG Marketing's Kent Donaldson, Bob Powledge, Dan Greaves and John Van Meter will be available to offer advice on PROMATION's automated solutions.

ZESTRON Appoints New Southern States Sales Rep

(October 3, 2005) ASHBURN, Va. — ZESTRON America has signed Dallas-based EMI Systems to be the sole provider of ZESTRON's products and services in Texas, Oklahoma, Arkansas, Louisiana and Mexico. This appointment aims to meet increased customer demand and continued market growth.

Stencil-free Jet Printer Reduces Production Errors

(October 3, 2005) STOCKHOLM, Sweden — MYDATA automation AB's MY500 stencil-free jet printer uses Jet Printing Technology to shoot volumes of solder paste at 500 dots/s, or 1.8 million dots/h. Because the MY500 does not require stencils, operators can change the print program in seconds and control the volume of solder paste deposits for each pad.


Solectron Drives Lean Six Sigma Manufacturing to its Suppliers

First Annual Award Judges Include Lean author, Jim Womack and Toyota Production System Expert Chichiro Nakao-San

Advanced SCARA Robots Offer High-speed Operations

(September 30, 2005) ELK GROVE, Ill. — Toshiba Machine's TH550 and TH850 SCARA robots are said to offer high-speed operations, high payload capacities and low-profile form factors.

Schoch Named VP Sales for Elcoteq Americas

(September 30, 2005) IRVING, TX — Elcoteq Network Corporation appointed Mitchell Schoch to vice president sales and marketing, Elcoteq Americas. Schoch's appointment is part of the company's focus on implementation strategy to continue profitable growth, diversification of Elcoteq's customer base and expansion of its service offering.

IPC Releases New Book-to-Bill Ratios and IMS/PCB Business Report for August 2005

The North American rigid PCB industry book-to-bill ratio for August 2005 returned to the positive range at 1.01

Tombstone Troubleshooting

The issue of tombstoning has risen to prominence because, while components and assemblies have become much smaller over the last decade

Automated Device Programming System Featured at ATExpo

(September 29, 2005) REDMOND, Wash. — Data I/O showcased its PS588 high-speed offline production programming system for high-volume, high-mix device programming at ATExpo, September 27-29, 2005, in Rosemont, Ill.

Kester Opens Facility in China

(September 29, 2005) DES PLAINES, Ill. — Kester announced the opening of a new manufacturing and technical center in Suzhou, China, outside of Shanghai. The China facility will meet the demands of China's growing electronics assembly market.

Ionic Contamination Test System Features Bluetooth

(September 29, 2005) INDIANAPOLIS — Specialty Coating Systems (SCS) introduced the SCS lonograph SMD IV ionic contamination test system. The SMD IV uses an ultra-pure alcohol/water extraction media and a dynamic testing method to test components quickly and without destruction.

IPC Supports EPA's Efforts to Streamline TRI Reporting

"IPC certainly appreciates EPA's efforts, but we're a bit disheartened that the EPA's proposals will not provide the manufacturing sector, including the electronics industry with

Flextronics to Build New Facility in Ciudad Juarez, Mexico

The service offering at this facility will include product Configure-to- Order (CTO)/Build-to-Order (BTO), product completion and pack-out, mechanical services and logistics, such as repair and distribution


Jabil Revenue Increases 20%

Net revenue for the fiscal year increased 20 percent to $7.5 billion compared to $6.3 billion for fiscal 2004

Technology and Business Consulting Firm Debuts

(September 23, 2005) DALLAS — TechBiz Consulting LLC assists companies with technical problems encountered in electronic design and manufacturing, as well as small business challenges that may arise. The company plans to launch its official opening at SMTA International Conference and ATExpo in Rosemont, Ill., September 27, 2005.

PROMATION Enhances Corporate Website

Hover-Davis to Offer Cogiscan-based Intelligent Feeding Solutions

(September 23, 2005) ROCHESTER, N.Y. and BROMONT, Quebec — Hover-Davis and Cogiscan announce the second phase of their long-term strategic partnership. Under a global OEM reselling agreement, Hover-Davis will offer Cogiscan RFID hardware and software applications that mix with their tape feeders, label feeders, and Direct Die feeders. Hover-Davis will now be able to provide intelligent feeding solutions that can seamlessly integrate with existing equipment and information systems.

Vitronics Soltec Names New President

(September 23, 2005) STRATHAM, N.H. — Effective September 20, 2005, Vitronics Soltec has appointed Erik Tobiason as its new president, following five years of serving as president of Graphics Microsystems Inc. (GMI), a Dover Diversified Company. Tobiason began his career with Dover as vice president of engineering and R&D of GMI. Prior to joining GMI, he held positions in engineering and technology management with front-end semiconductor companies in the Silicon Valley.

Outsourcing in Europe is Focus of TFI Forum in Munich

(September 22, 2005) ALAMEDA, Calif. — Technology Forecasters Inc. (TFI) will hold a special Quarterly Forum for Outsourced Manufacturing and Supply Chain event on November 2–4, 2005, in Munich, Germany. To be hosted by Avnet Electronics Marketing, the event will include a new report based on TFI's extensive European interviews and research on the EMS industry based in that region.

Color Polyimide Labels Suit Lead-free and Standard Processes

(September 22, 2005) WESTMORELAND, N.H. — Polyonics Inc.'s 1- and 2-mil color polyimide labels are coated with a permanent, pressure-sensitive acrylic adhesive and a high-opacity, medium-gloss topcoat available in six tinted colors — pink, yellow, orange, blue, green and violet. They are thermal-transfer-printable and scan with both visible and IR scanners.

YESTech to Debut New AOI System Series at ATExpo '05

(September 21, 2005) SAN CLEMENTE, Calif. — YESTech will introduce its new F1 series automated optical inspection (AOI) systems at the upcoming Assembly Technology Expo (ATExpo), to be held September 27–29 in Rosemont, Ill. The new F1 provides advanced automated inspection of solder and lead defects, component presence and position, correct part, polarity and thru-hole parts.

Henkel to Display Environmental Product Suite at Productronica '05

(September 21, 2005) IRVINE, Calif. — The global transition to lead-free is propelling the electronics group of Henkel to exhibit its comprehensive lead-free product range at Productronica 2005, to be held November 15–18, in Munich. Henkel's lead-free offering will include a range of product and material sets, to be shown at booth A3.153 in Hall A3.

Praxair to Feature Panasonic Robotic Welding at Upcoming Show

(September 20, 2005) BUFFALO GROVE, Ill. — Praxair Distribution, Inc. will feature a robotic welding system from Panasonic Factory Solutions Company of America at the National Factory Automation Show, to be held October 17–20, 2005, at the National Trade Center in Toronto. There, Praxair will display its gas- and wire-delivery systems for cutting and welding applications using Panasonic robotic welding systems.


MYDATA to Show 01005 Component Handling at Productronica '05

(September 20, 2005) STOCKHOLM, Sweden — MYDATA Automation AB will demonstrate high-speed 01005 component placement at the approaching Productronica trade show in Munich on November 15–18, 2005. The latest version of the Agilis 3.7 feeder and new high-precision tools grant MYDATA's placement machines with the ability to handle 01005 chips at high speeds.

Indium Names New French Distributor

(September 19, 2005) UTICA, N.Y. — Indium Corp. of America has appointed CHIMIE TECH SERVICES SA (CTS) as its newest European distributor, covering France. CTS is responsible for sales and service of Indium's solder pastes, wave solder fluxes, solder wire and solder preforms portfolio, and has experience in supplying consumable materials and equipment for the manufacture of active and passive components.

Cooled Industrial Camera Available

(September 19, 2005) SAN DIEGO — The MegaPlus II EC11000, an actively cooled industrial camera, is now available from Redlake MASD LLC. It separates and isolates the camera's primary electronics from the sensors cooling path. A fan-optional design allows it to operate in cooling modes with or without a fan accessory attached.

RoHS Compliance Course Demos IPC-1752 Implementation

(September 16, 2005) BANNOCKBURN, Ill. — To help companies through the RoHS transition, IPC–Association Connecting Electronics Industries will host "Ensuring RoHS Compliance Through Materials Declaration Tools: Implementing IPC-1752," on November 9, 2005, in Northbrook, Ill.

Technology Forecasters Hosts Outsourcing Workshop

(September 15, 2005) ALAMEDA, Calif. — Technology Forecasters Inc. (TFI) will host a TFI Global Pricing Workshop titled, "Mitigate the Risk of Global Manufacturing Outsourcing and Protect Your Margins," on October 5, 2005, in San Jose, Calif.

Samsung Certifies Zetex for RoHS Compliancy

(September 14, 2005) HAUPPAUGE, N.Y. — Samsung Electronics recently certified Zetex Semiconductors as an Eco-Partner Affiliate Company, meaning that Zetex's environmental management system has met Samsung's Green Procurement Program requirements in full. Aiming to create a completely green supply network, the Program requires that suppliers fully comply with the looming RoHS Directive.

Conformal Coating Workshops Head to Canada

(September 14, 2005) CARLSBAD, Calif. — Asymtek, Dow Corning, Dymax, EMI and Humiseal collectively will offer conformal coating workshops in Montreal and Toronto, Canada on October 11 and 13, 2005, respectively. Each one-day training program will teach attendees about the various types of available coatings, including silicone, acrylics, urethanes, UV-curable coatings and adhesives. The most recent automated equipment options for mask-free conformal coating will also be covered.

New Optimization Software to Debut at Productronica '05

(September 14, 2005) STOCKHOLM, Sweden — MYDATA Automation AB will debut its new MYPlan optimization and scheduling software, which is said to reduce production and changeover times, at Productronica 2005 in Munich, Germany from November 15–18, 2005. Features include an intuitive user interface, a built-in TPSys Editor and an integrated Web interface.

VoIP Subscriber Rush Spurs Equipment Boom

The number of residential VoIP subscribers worldwide will rise to 197.2 million in 2010, up more than 40-fold from 4.8 million in 2004

ANSYS, CoCreate Integrate 3-D CAD and Digital Simulation

(September 13, 2005) SOUTHPOINTE, Pa. — ANSYS, Inc. announces the availability of a direct connection between its ANSYS Workbench simulation environment and CoCreate's 3-D CAD software, where solid models created in CoCreate's Designer Modeling can be transferred directly to ANSYS' simulation environment. The integration also establishes an association with the 3-D CAD model so that changes made within Designer Modeling are updated within ANSYS Workbench.


Solectron's CFO Resigns; Senior VP to Assume Interim Role

(September 13, 2005) MILPITAS, Calif. — Solectron Corp.'s executive vice president and CFO, Kiran Patel, is leaving Solectron to become the CFO for Intuit Inc. Warren Ligan, Solectron's current senior vice president and corporate controller, will be assuming Patel's role on an interim basis while a search of internal and external candidates is conducted.

Aegis, FUJI Sign Software Integration Protocols Agreement

(September 13, 2005) PHILADELPHIA — Aegis Industrial Software Corp. has finalized an agreement with FUJI to share integration protocols to FUJI's FujiTrax software, enabling FujiTrax to seamlessly integrate to the Aegis MES systems for line monitoring, feeder setup and verification and traceability. Aegis now can offer FUJI and multivendor customers a singular Total Traceability and MES solution involving FUJI NXT and other FujiTrax-compliant lines.

Electronic Interconnection Files from SiliconPipe - No. 3

Performance per Unit Power ... Entering the era of the GHz/W metric

SMTA's Boston Chapter Schedules September Meeting

(September 12, 2005) FRANKLIN, Mass. — The SMTA Boston Chapter has scheduled its monthly meeting for Tuesday, September 20, 2005, at Speedline Technologies in Franklin, Mass. Topics include lead-free solder paste printing process accuracy requirements and an SMT stencil printer and dispenser manufacturing overview.

High-speed Photocouplers Help Reduce Component Count

(September 12, 2005) CAMAS, Wash. — Sharp Microelectronics of the Americas' S08 photocouplers line includes 1-, 15- and 25-Mbps devices in single-channel models, and 10-Mbps devices in both single- and dual-channel models. Each reportedly uses the industry-standard footprint and incorporates optimal noise immunity, high heat resistance and improved isolation characteristics.

Indium to Showcase Lead-free Offering at ATExpo '05

(September 9, 2005) UTICA, N.Y. — Indium Corp. of America will be exhibiting their lead-free materials portfolio at the Assembly Technology Expo (ATExpo) on September 26–28, 2005, in Rosemont, Ill. Indium's exhibit at booth #5631 will feature Indium5.1, a lead-free, no-clean solder paste with "response-to-pause" printing, and NF260, a reworkable, lead-free, no-flow underfill.

ZESTRON to Take Part in New England Lead-free Seminar

(September 9, 2005) ASHBURN, Va. — ZESTRON America is slated to take part in a lead-free seminar to be held on November 2, 2005, and hosted by MPS Associates in Westford, Mass. In collaboration with Speedline Technologies, REsys Inc., Specialty Coating Systems (SCS) and Alpha Metals, ZESTRON will deliver its knowledge on lead-free-related cleaning issues.

Four-in-One EMS Solution Targets HMLV Production

(September 8, 2005) CRANSTON, R.I. — A fully integrated manufacturing solution that combines four key electronics production processes: fiber interconnect, copper interconnect, mixed-technology PCBA and high-level assembly and test is available from Federal Electronics. The solution targets OEMs seeking high-mix, high-complexity, low-volume production of electronics components and assemblies.

iNEMI to Sponsor Upcoming RFID Forum

(September 8, 2005) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) consortium will sponsor a forum targeting RFID technology on October 4, 2005, at the Sun Microsystems facility in Newark, Calif. Some organizations are making investments to implement RFID; however, others argue that RFID is equivalent to an expensive barcode and may never reach the promised return on investment.

ATExpo to Feature Cleaning Optimization Paper Presentation

(September 7, 2005) AUSTIN, Texas — Austin American Technology's Steve Stach and Kyzen Corp.'s Mike Bixenman will co-present a paper entitled, "Optimizing Cleaning Energy in Batch and In-line Cleaning Systems — Phase Two" in technical session SMT2 at the Assembly Technology Expo (ATExpo) on Tuesday, September 27, from 1:30 p.m. – 3:00 p.m. in Room 5.


Controller Automates Wind Tunnel Testing

(September 7, 2005) NORWOOD, Mass. — WTC-100 from Advanced Thermal Solutions, Inc. (ATS) is a fully automatic controller for laboratory wind tunnels that are used to thermally characterize PCB components, heat sinks and card racks. Two independent sensors simultaneously measure air velocity and temperature to provide a wide range of wind-tunnel test conditions.

Indium Names New Applications Engineers

(September 1, 2005) UTICA, N.Y. — Indium Corp. of America has appointed three new applications engineers, Jim Hisert, Dan McCall and Ed Briggs, each to be located at Indium's Clinton, N.Y.-based corporate headquarters.

DEK Adds New Technology to Tooling Options Portfolio

(August 31, 2005) FLEMINGTON, N.J. — DEK has expanded its advanced tooling options range, signalled by the introduction of smaller, cost-effective Grid-Lok technology, and extending the choices available to customers sourcing tooling for DEK printer platforms. The new Grid-Lok tooling system features reduced dimensions, moving to 4 × 12" tooling modules.

Newark InOne Posts Website-based WEEE Guide

Surface Mount Power Resistors Handle up to 12 W

(August 30, 2005) RALEIGH, N.C. — The HPC series surface mount power resistors reportedly can handle up to 12 W at 85°C. Available in 5-, 10- and 12-W ratings, the resistors range from 0.1 Ω to 100 KΩ in a 0.5 × 0.5 × 0.5" package size in tape-and-reel and bulk packaging from Stackpole Electronics, Inc. (SEI).

Kester Takes Lead-free Seminar Series to Texas

(August 29, 2005) DES PLAINES, Ill. — Kester's lead-free seminar series, titled "Project 2005: Achieving Lead-free RoHS Assembly," is heading to Dallas, Texas, and will be held on September 13, 2005. Designed to assist the electronics industry in transitioning to lead-free soldering and RoHS compliancy successfully, the seminars address key lead-free assembly issues and give technical, practical information to transition in a timely fashion.

IPC Posts July '05 Book-to-Bill Ratio, Business Report

(August 29, 2005) BANNOCKBURN, Ill. — July 2005's North American rigid PCB industry book-to-bill ratio declined to 0.99, while the North American flexible circuit book-to-bill ratio continued to climb to 1.71, according to IPC–Association Connecting Electronics Industries' monthly PCB Statistical Program. Combined, the industry book-to-bill ratio increased to 1.16.

The Need for Speed - Electronic Interconnection Files from SiliconPipe - No. 2

Faster electronics have been the circuit designer's objective for many years

Finetech Germany Unveils Website in Chinese

(August 26, 2005) PHOENIX — Finetech GmbH and Co. KG has launched a new Chinese version of its Website, located at www.rework.cn. The Website aims to serve as resource of updated information on Finetech's rework technologies and products, and the site is available in both Chinese and English.

Speedline Posts Highest Bookings Since '00

(August 26, 2005) FRANKLIN, Mass. — Speedline Technologies' second-quarter 2005 bookings rose 44% over the first quarter, reaching their highest level since 2000. At the end of July, the backlog had climbed 68% vs. the end of the first quarter.


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