Celestica Names New Executive VP of Worldwide Operations
(January 18, 2006) TORONTO, Ontario — Celestica Inc. has appointed James Rowan to its executive vice president of Worldwide Operations position, where he will manage Celestica's global manufacturing network, as well as implement site-to-site consistency in Lean, Six Sigma, organization capability, and customer care.
VOC-free Flux for Lead-free Wave Soldering Improves Wetting
(January 17, 2006) LONDONDERRY, N.H. — 396-FTA VOC-free flux for lead-free wave soldering applications has less than 2% solids, reportedly yielding extremely clean post-solder surfaces on the most difficult solder resists, and is now available from Cobar Solder Products.
RSVI Names Vice President of Operations
(January 16, 2006) HAUPPAUGE, N.Y. — RVSI Inspection LLC has appointed Nellie Quintana to its Vice President of Operations position, in which she will report directly to president Kevin Maddy and focus on making a step function improvement in quality, delivery, and cost.
New Stand-alone Depaneling System Available
(January 16, 2006) VIRKKALA, Finland — Cencorp Corp.'s Cencorp 1000 SR stand-alone depaneling system is a high-precision, modular, and ergonomic solution for electronics manufacturing. The system can be fitted with linear encoders for high-accuracy applications, and the router or saw-cutting devices accommodate V-scored or pre-routed panel designs.
Enthone Appoints New U.S. Director of Sales
(January 16, 2006) WEST HAVEN, Conn. — Enthone Inc., a business of Cookson Electronics, has appointed Jason Maupin as its new U.S. Director of Sales, in which will be responsible for leading the Enthone U.S. sales and technical service team in the electronics and surface-finishing industries.
Henkel Materials Specialist to Speak at SMTA Toronto
(January 13, 2006) MINNEAPOLIS — On January 18th, the Electronics Group of Henkel's Dr. Brian Toleno will speak at the upcoming SMTA Toronto, Canada Chapter meeting, sharing basic information such as the definition of underfills and their function, and more detailed data regarding design rules, reliability, and standards.
Sirenza, Digi-Key Sign Distribution Agreement
(January 13, 2006) BROOMFIELD, Colo., and THIEF RIVER FALLS, Minn. — Sirenza Microdevices, Inc. and Digi-Key Corp. have signed a worldwide distribution agreement. In the agreement, Sirenza's products will be featured in Digi-Key's printed and online catalogs, and will be available for purchase directly from Digi-Key, allowing Digi-Key to fulfill the design and production needs of its customers worldwide.
SMTA, TFI, and The GoodBye Chain Group Sponsor DfE Workshop
(January 12, 2006) MINNEAPOLIS — SMTA, in collaboration with Technology Forecasters Inc. (TFI) and The GoodBye Chain Group will sponsor, "Design for Environment (DfE) — Tools and Techniques for the Electronics Industry," on February 27, 2006, in Fremont, Calif. Additional workshops are scheduled for April 6, 2006, in Phoenix, June 7, 2006, in San Diego, and July 13, 2006, in Boston.
Libra Industries ISO 13485 Certified for Medical Market
(January 11, 2006) MENTOR, Ohio Libra Industries received ISO 13485 certification for its medical electronics engineering and manufacturing operations. This certification gives Libra's customers the assurance of stringent control of business practices, electronic design services, and manufacturing processes used to produce medical electronics devices.
Photo Stencil to Present Papers at APEX
(January 11, 2006) COLORADO SPRINGS, Colo. Photo Stencil will present two papers at the IPC Printed Circuits Expo, APEX, and the Designers Summit in Anaheim, Calif., February 8-10, 2006.
NEDA Highlights Test, Measurement, and the Supply Sectors
(January 10, 2006) ATLANTA NEDA will host its 2006 Electronic and TMC Development Forum, "Redefining Business Fundamentals," at the Loews Ventana Canyon Resort in Tuscon, Ariz., January 29-31, 2006.
Powell-Mucha Consulting Presents EMS Tutorial
(January 9, 2006) ANAHEIM, Calif. — To help EMS providers overcome challenges such as the transition to RoHS compliance and finding an adequate budget in a low-margin industry, Powell-Mucha Consulting, Inc. offers "Creating Competitive Advantage in Today's EMS Market," on February 7, 2006, from 2:00–5:00 p.m. at the APEX conference in Anaheim, Calif.
Wire-wound Chip Coils Reduce Mounting Space
(January 9, 2006) SMYRNA, Ga. — Murata Electronics North America's LQW04A series miniature, high-frequency, wire-wound-type chip coil in the 03015 EIA size (0.8 × 0.4 mm) suits high-frequency circuits used in mobile devices such as cell phones and personal digital assistants (PDAs). Its size is said to reduce the mounting area by 40%.
Advanced Circuits' PCB Prototypes Go Lead-free
(January 9, 2006) AURORA, Colo. — All of Advanced Circuits' prototypes will now be fabricated using lead-free solder as a plating finish. Its lead-free HAL finish provides an enhanced solderable finish for assembly, and meets all legislation requirements for the looming RoHS Directive six months ahead of the July deadline.
Fitch Ratings Notes Celestica's 'Stable Outlook'
(January 6, 2006) NEW YORK — Fitch Ratings, a global rating agency, has given Celestica Inc. a stable outlook rating, reflecting somewhat weak but improved operating performance and concentration to traditional end-markets characterized by more mature growth prospects.
Cookson Group Sells SCS Business
(January 5, 2006) JERSEY CITY, N.J. — On December 30, 2005, Cookson Group plc (Cookson) sold its Specialty Coating Systems (SCS) business, which forms part of the Assembly Materials sector of Cookson's Electronics division, to Bunker Hill Capital for $55.5 million. An immediate cash payment of $54.0 million was made up front, with an additional $1.5 million to be paid upon closing of the sale of the SCS China business in early 2006.
TSS Technologies to Open International Facility
(January 4, 2006) CINCINNATI — TSS Technologies, a manufactured products and equipment supplier serving the aerospace, automotive, medical, automation, and aviation power and marine industries, will open an international facility in Xiamen, China.
Aculight Appoints New Board of Directors Member
(January 4, 2006) BOTHELL, Wash. — Laser technologies developer Aculight Corp. has named Dr. Thomas S. Hartwick to its Board of Directors, who has spent nearly 50 years in high-technology business management and R&D. His technology expertise spans lasers, electro-optics, electronic/microwave devices, and satellite systems.
IPC Posts Book-to-Bill Ratio for November '05
(January 4, 2006) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' monthly PCB Statistical Program for November 2005 showed a rigid PCB industry book-to-bill ratio of 1.12 and a flexible circuit book-to-bill ratio of 1.16, both remaining strong. Combined, the book-to-bill ratio remained at 1.13.
Flextronics Names New CEO
(January 3, 2006) SINGAPORE — Flextronics has appointed Michael McNamara as its new CEO, complementing its previously announced succession plan. McNamara has held various senior positions during his career at Flextronics, most recently as COO, but has also served as president of Americas' Operations and as vice president of North American Operations.
Upcoming Webinar Channels Lead-free SMT Printing Process
(January 3, 2006) FRANKLIN, Mass. — Speedline Technologies' experts will tackle the lead-free printing process, which is one of the industry's most critical manufacturing challenges, in a free, live Webinar on January 19th.
SMT China Moves Headquarters to Hong Kong
(December 29, 2005) HONG KONG Effective January 1, 2006, SMT China magazine will move its headquarters to Hong Kong, where ACT International and PennWell will operate editorial, circulation, publication, Website and advertising services.
Mentor Graphics and QuickLogic Pen FPGA Agreement
(December 29, 2005) WILSONVILLE, Ore. Mentor Graphics Corporation has signed a multi-year OEM agreement with QuickLogic Corporation that offers QuickLogic's customers a new synthesis solution, and enables a smooth transition to a range of Mentor Graphics' advanced FPGA synthesis technology and tools.
Workshop Focuses on Supply Chain Optimization
(December 27, 2005) ALAMEDA, Calif. Technology Forecasters, in collaboration with supply chain consultants, eKNOWtion and Avnet Electronics Marketing Global Supply Chain Services, offers, "Global Supply Chain Design and Optimization Workshop," on February 7, 2006, in Rosemont, Ill.
SMTA Certification Dates Set for 2006
(December 27, 2005) MINNEAPOLIS, Minn. SMTA announces 2006 dates for its Six Sigma Certification programs. Each three-day workshop, one for processes and one for Six Sigma Green Belt certification, feature refresher topics and open and closed book exams.
Solectron Opens Design Services Center in Romania
(December 21, 2005) TIMISOARA, Romania — Solectron Corporation has established a Design and Engineering Services Center in Timisoara, Romania, to focus on providing advanced collaborative design and engineering services to the company's customers worldwide. Core capabilities of the center will include electrical and mechanical design, advanced process technology, test development and failure analysis.
Bliss Announces Promotion, New Staff
(December 21, 2005) MILPITAS, Calif. — Adding to its personnel, Bliss Industries has promoted Mike Prieb to sales manager, and hired Alfredo Grulich as a new account manager.
OEM Reselling Deal Targets RFID Smart Feeders
(December 20, 2005) BROMONT, Canada — Cogiscan has announced a strategic OEM reselling partnership with AGS Pte Ltd (Singapore), in which AGS will integrate and re-sell Cogiscan's RFID smart feeders as a standard on refurbished machines, RFID tags on refurbished feeders and RFID smart feeder retrofit kits to upgrade existing machines at customer sites.
SMTA International 2006 Call for Participation
(December 20, 2005) MINNEAPOLIS — The SMTA invites industry professionals to submit a paper to SMTA International 2006, to be held in conjunction with Assembly Tech Expo (ATExpo), September 24–28, 2006, at the Donald Stephens Convention Center in Rosemont, Ill.
Monthly Webinars to Deal With SMT Manufacturing Challenges
(December 19, 2005) FRANKLIN, Mass. — Speedline Technologies experts will address the SMT industry's manufacturing challenges in free, monthly Webinars. Targeted at OEM and CEM process engineers, each Webinar will focus on challenges specific to a major SMT manufacturing process, ranging from lead-free printing to high-speed underfill to practical DOE and SPC for electronics assembly to 0201 and 01005 component assembly.
Productronica 2005 Draws Record Numbers
(December 19, 2005) MUNICH — Productronica 2005 remains the largest trade show for electronics, attracting more than 44,000 visitors and 1,500 exhibitors from November 15–18, 2005.
Tape Guards Circuits During Fabrication, High-temp Masking
(December 16, 2005) WINDSOR, Conn. — Scapa 650 from Scapa Industrial is a high-temperature masking tape for low-static protection of gold-plated finger tabs, assembly holes and components during flux, preheat and soldering processes. The tape also targets high-temperature industrial masking in clean rooms.
Circular Blade Depanelizer Now Includes XY Table
(December 15, 2005) FRAMINGHAM, Mass. — FKN Systek's K2000 motorized circular blade depanelizer claims to separate pre-scored PCBs without any waste, and now includes an XY table for improved board handling. It singulates PCB panels by passing the scoreline between two circular blades, which include front and back blade guards for safety. An adjustable upper front blade guide assures that only the scoreline can be passed to the cutting area.
Cookson to Sell Polyclad Laminates to Isola
(December 15, 2005) LONDON — Cookson Group plc, Cookson Electronics' parent company, has entered into an agreement to sell Polyclad Laminates, Inc. to Isola Group, Sarl, for US$91 million. Completion of the transaction is conditional on satisfactory clearance from the European anti-trust authorities, and is expected in February 2006.
Soft Landing Reduces Nail Test Footprint of Flying Probers
(December 13, 2005) STUTENSEE-BLANKENLOCH, Germany — With continued miniaturization of components in automotive, medical and military applications, manufacturers often are concerned with over test coverage on complex and high-density boards, as well as problems with unwanted damage using conventional probe techniques. To combat this, Digitaltest introduced Soft Landing technology on its Condor flying probe test platform.
D-sub Connectors Now Meet RoHS Directive Requirements
(December 13, 2005) ETTERS, Pa. — FCI's RoHS-compatible D-Sub connector family now meets the European Directive EU 2002/95/EC — the Delta D series straight-solder and press-fit versions are now available without the restricted materials as detailed in the directive, and the right-angle version will be available by the end of the year.
Bench Top Dispenser Enables Hands-free Use
(December 12, 2005) SALEM, N.H. — The DXB bench dispenser from MIXPAC Equipment is a portable, bench top unit capable of dispensing two-component reactive resins of 1:1, 1.5:1, 2:1, 4:1 and 10:1 ratios.
Embedded Capacitor Material Achieves RoHS Compliance
(December 12, 2005) AUSTIN, Texas — 3M Electronics' embedded capacitor material, an advanced laminate, is now RoHS-compliant. The material can be made with a dielectric thickness down to 8 µm and a capacitance density of over 10 nF per sq. in. for embedding planar capacitance in circuit boards. When used as "power" and "ground" layers in a multi-layer PCB, it becomes an internal shared decoupling capacitor, eliminating many discrete surface mount capacitors and vias.
Molex Expands Multi-layer Flex Circuit Assembly Capabilities
(December 8, 2005) LISLE, Ill. — Molex Inc. now develops and delivers high-performance flex circuitry assemblies with up to 18 layers of conductive flex. In addition, Molex now has capabilities in the Americas to stamp flex circuitry and automatically circuit-etch, vacuum-laminate and drill multi-layer flex at the tightest tolerances.
New Substrate Technology Offers High Thermal Conductivity
(December 8, 2005) CORPUS CHRISTI, Texas — TT electronics IRC Advanced Film Division's Anotherm substrate technology consists of a thermally conductive aluminum alloy substrate insulated by a thin, chemically grown, anodized dielectric layer, with solderable screen printed conductors applied to the anodized layer. It is said to offer benefits over conventional, polymer-based insulated metal substrates (IMS).
Panasonic Leads Japan-based Factory Automation Show
(December 7, 2005) BUFFALO GROVE, Ill. — Panasonic Factory Solutions Company is hosting the Panasonic Factory Automation Show 2005, currently happening at Pacifico Yokohama, in Yokohama City, Japan, until December 9th.
'06 Designers Summit Caters to PCB Designers
(December 7, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries' and its Designers Council's fourth annual IPC Designers Summit targets PCB designers, and will take place February 5–11, 2006, in conjunction with IPC Printed Circuits Expo and APEX, in Anaheim, Calif. PCB designers can obtain information on the latest technologies, such as embedded passives, lead-free materials, design-for-manufacture, high-speed design, and bare die.
Indium Grows Global Sales Team
(December 6, 2005) CLINTON, N.Y. — Indium Corp. has recently promoted Tony Howard to global account manager — in this position, he is responsible for promoting Indium's products and services by focusing on several key global accounts. He reports to Dave Preische, global sales manager.
Federal Electronics Debuts RoHS Conversion Services
(December 6, 2005) CRANSTON, R.I. — EMS provider Federal Electronics has debuted a services portfolio to aid OEMs convert and reengineer their products to comply with the European Union's RoHS directive. These regulations prohibit selling new electronic and electrical equipment in Europe if it contains more than trace levels of lead and five other elements by July 1, 2006.
Solectron's Global Sites Are Ready for RoHS Compliance
(December 5, 2005) MILPITAS, Calif. — Solectron Corp.'s global sites, which represent 85% of Solectron manufacturing capacity, have completed a lead-free, RoHS-compliant manufacturing qualification program. Solectron established an Environmental Compliance Leadership Team in January 2004 to develop and implement a lead-free and RoHS-compliant transition program across the company's manufacturing sites worldwide.
IPC Meeting Aims to Create Success Opportunities for Senior-level Leaders
(December 5, 2005) BANNOCKBURN, Ill. — Attendees at IPC's PCB Executive Management Meeting will learn the best practices of making a profit, a common goal that all PCB manufacturers share. The one-day event will be held on February 7, 2006, in Anaheim, Calif., together with the APEX/IPC Printed Circuits Expo/Designers Summit exhibition and conference, to take place February 8–10, 2006, in Anaheim.
Surface Mount LEDs Target Harsh Environments
(December 2, 2005) PALO ALTO, Calif. — Agilent Technologies Inc.'s HSMx-A43xx series high-brightness red, red-orange, orange, amber, green and blue LEDs in the industry-standard Power PLCC-4 SMT form factor incorporate integral lenses to produce a 30° viewing angle.
Advanced Circuits Adds Lead-free Plating Finish to Offering
(December 2, 2005) AURORA, Colo. — Advanced Circuits now offers lead-free solder as a plating finish, providing an enhanced solderable finish for assembly that meets all legislation requirements for the European Union's RoHS Directive deadline of July 1, 2006.
Heat Sink Attachment System Offers Low Profile
(December 1, 2005) NORWOOD, Mass. — The MaxiGRIP heat sink attachment system from Advanced Thermal Solutions, Inc. (ATS) mounts heat sinks to flip chips, BGAs and other PCB components. The system features a plastic frame clip that snaps securely around a component's perimeter. A stainless-steel spring clip runs though the heat sink's fin field and fastens securely to the plastic frame. The spring clip easily removes, allowing a heat sink to be detached and re-attached.
NEDA Targets Supply Chain with RoHS/Lead-free Compliance Summit
(December 1, 2005) ATLANTA — The National Electronic Distributors Association (NEDA) will host "Negotiating the Economic, Legal and Logistic Challenges of RoHS/Lead-free Compliance," on January 19, 2006, in San Jose, Calif.
Chip Inductors Offer Low Rdc and High-current Operation
(November 30, 2005) SCHAUMBURG, Ill. — The LB3218 wire-wound chip inductor from Taiyo Yuden combines the functionality of two 3225-size low-resistance and high-current inductors into a single 3218-size device. The inductor is suitable for use in power supply circuits of digital still cameras, camcorders, VCRs and other commodity-type equipment.
Indium Appoints Asia Pacific Market Development Manager
(November 30, 2005) CLINTON, N.Y. — Bill Brunstedt has joined Indium Corporation as the Asia Pacific market development manager and will oversee business development efforts in that region with a focus on new and existing regional markets, general market strategies and new product requirements.
Cookson Nabs Patent for Stencil Software
(November 29, 2005) JERSEY CITY, N.J. — The U.S. Patent Office awarded patent #6,938,227 B2 to Cookson Electronics Assembly Materials Group for its ALPHA DIMENSIONS stencil configuration, design and ordering software, effective August 30, 2005.
Optical Chamber Delivers VUV Laser Beams
(November 29, 2005) HOLLIS, N.H. — J P Sercel Associates (JPSA) has introduced a large-format vacuum UV (VUV) optical chamber for UV excimer laser beam delivery systems that integrates with JPSA's Microtech MBD2 industrial-grade Beam Delivery System (BDS). Lenses, beam-expanding telescopes, beam homogenizers, spacers and other components can be positioned in the chamber and integrated into the BDS using JPSA's universal dovetail mounting system.
Book-to-Bill Ratio for October '05 Shows Decline
(November 29, 2005) BANNOCKBURN, Ill. — Based on monthly data collected from PCB producers that participate in IPC's monthly PCB Statistical Program, October 2005's North American rigid PCB industry book-to-bill ratio rose to 1.14, while the flexible circuit book-to-bill ratio declined sharply to 1.10.
Combined, October's book-to-bill ratio declined slightly to 1.13.
SOIC Package Qualifies for Lead-free Manufacturing
(November 29, 2005) IRVINE, Calif. — A lead-free SOIC package from the electronics group of Henkel that integrates the company's GR828H mold compound with the Hysol QM1519 die-attach adhesive has received customer qualification. Designed for 16- and 14-lead SOIC packages, the material is said to combine the molding characteristics, high productivity and low-wire-sweep properties of the GR282H with the adhesive strength of the Hysol QM1519.
Planar Heaters Suit Multiple Applications
(November 22, 2005) GLENROTHES, Scotland — TT electronics BI Technologies SMT Division's planar heater products with ratings up to 50 W are suitable for military, computing, telecom, medical and commercial applications in surface mount, thru-hole and custom-profiled versions.
IPC Seeks Technical Papers for 12th Lead-free Conference
(November 22, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and JEDEC–the Solid State Technology Association announce the 12th International Conference on Lead Free Electronic Components and Assemblies, to take place March 6–8, 2006, in Santa Clara, Calif. Both associations are seeking technical papers from environmental menagers and technical staff on relevant subjects.
Indium Engineer Obtains SMTA Certification
(November 21, 2005) CLINTON, N.Y. — Indium Corp.'s Eric Bastow, a technical support engineer, has been awarded SMTA Certified Process Engineer certification, one of the electronics assembly industry's most respected signs of process knowledge and expertise.
New Die Attach Adhesive Combats Substrate Warpage
(November 21, 2005) SAN DIEGO — Advanced Applied Adhesives (AAA)'s AAA3000 Teflon (PTFE)-filled, electrically non-conductive adhesive is said to resolve the substrate warpage problem from attaching large, thin die on thin, organic substrates. Its polymer design offers a 32-MPa modulus, hydrophobic chemistry and hot adhesion. Its 260°C Moisture Sensitivity Level performance has been confirmed by beta-site testing.
Manual Production Components Aid in Lean Manufacturing
(November 21, 2005) BUCHANAN, Mich. — Bosch Rexroth Corp.'s new manual production components reportedly aid in lean manufacturing systems implementation, helping companies to reduce waste and increase productivity. The new Manual Production Systems (MPS) product line delivers configurable products to create production systems. Based on Rexroth's modular aluminum framing components and manual workplace components, the MPS products facilitate following lean production principles.
New Surface Mount EMI Suppression Filter Available
(November 18, 2005) SMYRNA, Ga. — Murata Electronics North America's BNX022 series surface mount EMI suppression filter measures 12 × 9 × 3 mm and weighs 0.8 g as a result of advancements in capacitor materials and terminal formation technology, as well as improved packaging.
DEK Report Details Lead-free Stencil Design Rules
(November 18, 2005) SAN JOSE, Calif. — DEK has published "Understanding Stencil Printing Requirements for a Lead-free Mass Imaging Process," a report detailing findings on screen printing using lead-free pastes that focuses on implications for stencil design rules.
DEK's Micron Class Offering Shows Record Growth
(November 17, 2005) FLEMINGTON, N.J. — DEK's recently launched Micron Class product range, founded on Galaxy and Europa technologies, represented the largest percentage sales increase of any DEK platform during July and August. Galaxy enjoyed an exceptionally solid performance, representing 16% of total sales for August, compared with 6% in July. Meanwhile, for the same period, the company confirmed that Europa sales grew from 1% to 7%.
Masstech Offers Environmental Compliance Information Solutions
(November 17, 2005) WOBURN, Mass. — Masstech EMS' Environmental Compliance Information Solutions are service offerings to help customers comply with changing environmental regulations. The first critical service offering is the Lead Free Conversion Program, designed to help OEMs prepare for and comply with the European Union's Restriction of Hazardous Materials (RoHS) Directive.
Intel, Honeywell Sensing and Automation Nab NEDA Manufacturer Awards
(November 17, 2005) ATLANTA — Intel Corp. and Honeywell's Sensing and Automation Division have each been awarded with the NEDA Manufacturer of the Year Award at its annual awards ceremony during the 2005 NEDA Executive Conference, held November 6–8, 2005, at the Renaissance Chicago Hotel.
Indium Lead-free Experts to Speak at SMTA Forums
(November 16, 2005) CLINTON, N.Y. — Indium Corp.'s senior technologist, Ronald C. Lasky, Ph.D., PE, and Tim Jensen, Pb-free programs manager, are scheduled to speak at several educational forums for the SMTA's regional North American chapters. Their goal is to help prepare members for the European Union's directives for WEEE/RoHS compliance.
iNEMI Issues 2005 Research Priorities
(November 16, 2005) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) announces the release of its 2005 Research Priorities, a document that presents the consensus on R&D needs identified in the 2004 iNEMI Roadmap. It intends to help the electronics manufacturing industry focus efforts on those areas and issues that are critical to future competitiveness.
Cell Phones Near Market Saturation
(November 15, 2005) LOS ALTOS, Calif. — Mobile phone markets in developed economies are approaching saturation, shows the recent Henderson Forecast Summary. With market penetration for these devices at 120% in Luxembourg (with 120 subscribers for every 100 inhabitants), the saturation point has been exceeded, shows OECD data. While this trend may not be reflective of other countries, penetration rates for most developed countries inch up beyond 80%.
A Closer Look at Lead-free Solder
By Michelle M. Boisvert, SMT Managing Editor -
(November 15, 2005) — I can no longer consider myself a newbie in the SMT industry. Last week, I got my feet wet in the soldering side of things. At the recent "Lead-free Technology Forum and Workshop," presented by Dage Precision Industries and hosted at the Circuit Technology Center in Haverhill, Mass., I had the chance to hand-solder thru-hole components onto a board using lead-free solder.
Tyco Sets Up New Automation Technology Center
(November 15, 2005) HARRISBURG, Pa. — Tyco Electronics' Global Application Tooling Division (GATD) has established a new Automation Technology Center, which targets lead-free PC board assembly technologies and RFID inlay assembly processes and systems development. George Szekely, Tyco's general manager, will oversee the new Willow Grove, Pa.-based center.
Rohm and Haas' Circuit Board Technologies Division Ups Prices in Europe
(November 14, 2005) COVENTRY, England — Rohm and Haas Electronic Materials Circuit Board Technologies in Europe is increasing prices by 3% across its circuit board fabrication materials range to help offset the impact of unprecedented increases in the costs of raw materials, metals, energy and freight over the past 18 months. The increase will take effect from January 1, 2006, or as contracts allow.
Seica SPA Broadens Automation Solutions
(November 14, 2005) STRAMBINO, Italy — Seica SPA introduced several products within its VIVA Integrated Platform, including the Strategy.sl, a full automated in-circuit/functional bed-of-nails tester; the Pilot VIP system, an automated flying probe tester for loaded boards; the S24 BBT flying probe tester for board boards; and the Firefly laser selective soldering system.
Focusing on Lead-free Cleaning
By Michelle M. Boisvert, SMT Managing Editor -
(November 11, 2005) There are several issues weighing on the minds of those in the industry regarding lead-free. Cleaning is one factor that often presents itself in discussions. ZESTRON has conducted several experiments concluding that silver-containing alloys have a tendency to form dendrites, affecting the long-term climatic reliability of electronic assemblies.
Valor Computerized Systems Notes Strong Growth
(November 11, 2005) YAVNE, Israel Valor Computerized Systems announced continued growth during the nine-month period ending September 30, 2005, with revenues for the third quarter reaching $9.2 million, an increase of 17.5% from the same period last year.
Indium Names New Process Engineer
(November 10, 2005) CLINTON, N.Y. — Robert (Bob) Jarrett has joined Indium Corp. as a Manufacturing Process Engineer, and is based at Indium's Robinson Road facility in Clinton, N.Y. He will report directly to the Vice President of Operations.
ECD Unveils RoHS-compliant Thermal Profiler at Productronica '05
(November 10, 2005) PORTLAND, Ore. — At the Productronica show, to take place November 15–18, 2005, in Munich, visitors to ECD's booth (A4.240) will be amongst the first to see ECD's new RoHS-compliant SuperM.O.L.E. Gold thermal profiler. In terms of higher process temperatures, this thermal profiler is lead-free-compatible, containing no lead or the other banned substances in the board finish, components or hardware.
U.S. Fighter Pilot Team to Deliver Closing Keynote at APEX '06
(November 9, 2005) BANNOCKBURN, Ill. — The Afterburner team of fighter pilots will deliver the closing keynote at APEX/IPC Printed Circuits Expo/Designers Summit 2006, to take place February 8–10, 2006, in Anaheim, Calif. During the keynote, attendees will discover how to execute strategies critical to their success and survival with the Flawless Execution Model, a process used by fighter pilots around the world to execute missions.
Translators Support Varying Voltage Levels of Next-gen Applications
(November 9, 2005) SAN JOSE, Calif. — Pericom Semiconductor has broadened its translator line with advanced Universal Level Shifter (ULS) technology, allowing customers to use a bi-directional automatic direction sensor to support the different voltage levels of next-generation systems.
Speedprint, Tecan to Host Lead-free Clinics at Productronica '05
(November 8, 2005) DORSET, U.K. — Speedprint Technology Ltd., a division of Blakell Europlacer Group, will co-host lead-free clinics with Tecan Stencils in booth A4.121 at the upcoming Productronica trade show and exhibition, to take place November 15–18, 2005, in Munich. Presentations will cover lead-free considerations for materials, stencils, soldering and printing. Tecan's Tony Welton will give the presentations, which will run at periodic intervals during the show.
VJ Electronix Displays X-ray System at Productronica
(November 8, 2005) SHIRLEY, Mass. — VJ Electronix will display the X130D X-ray inspection system at the company's booth (A1.339) at Productronica, November 15–18, 2005, at the New Munich Trade Fair Center in Munich, Germany.
Made2Manage Systems to Acquire Capri Corp.
(November 7, 2005) DOWNERS GROVE, Ill., and INDIANAPOLIS — Capri Corp., a supplier of enterprise resource planning (ERP) software and services to the PCB industry through its operating subsidiary Cimnet Systems Inc., has entered into a definitive merger agreement that will result in an acquisition by Made2Manage Systems Inc.
IBM Signs On as Outsourcing Webinar Sponsor
(November 7, 2005) SAN JOSE, Calif. — IBM will sponsor Venture Outsource Group's upcoming Webinar, "Global EMS Providers — strengths, challenges, competitive tactics and value propositions," scheduled for December 8, 2005, at 10:00 a.m. PDT. Companies that will be profiled at the seminar include Benchmark Electronics, Celestica, Elcoteq, Flextronics, Foxconn, Jabil Circuit, Nam Tai Electronics, Plexus, Sanmina SCI and Solectron.
New Power Cube Inductors Offer No Thermal Aging
(November 7, 2005) SAN DIEGO — The new PG0322NL series thru-hole, shielded, shaped-core power inductors are ideal for use in voltage regulator modules (VRMs), DC/DC converters, and point-of-load applications in the motherboard and server markets, and are now available from Pulse, a Technitrol Company.
AER Worldwide Opens E-waste Recycling Center in Malaysia
(November 4, 2005) FREMONT, Calif. — AER Worldwide has opened AER Worldwide Sdn. Berhad in Penang, Malaysia, an electronics de-manufacture and sorting center. The center will provide Asia-based OEMs and contract manufacturers with close-to-source material sorting and destruction services.
IPC Opens APEX '06 Award Nominations
(November 4, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries is now accepting nominations for the awards program taking place at APEX/IPC Printed Circuits Expo/Designers Summit 2006, to be held February 8–10, 2006, in Anaheim, Calif.
DEK Signs Print-head Technology Agreement
(November 4, 2005) WEYMOUTH, DORSET, U.K. — DEK has signed an agreement to license its ProFlow enclosed print head technology to EKRA, permitting ProFlow integration into new machines. The agreement, which also covers printers sold under the ASYS name, will last for five years initially, and is subject to review at the end of that time.
China Telecom Supplier Selects Mentor Graphics Design Software
(November 3, 2005) WILSONVILLE, Ore. — ZTE, Ltd., a Chinese communication device maker and national wireless supplier, has purchased Mentor Graphics Corp.'s XtremePCB software. Available as part of Mentor's Expedition Enterprise flow, XtremePCB facilitates a team design environment, allowing multiple members of a PCB design team to work simultaneously on a design from a single database on a global network.
Indium Appoints New Central American Reps
(November 3, 2005) CLINTON, N.Y. — Blackberry & Cross has become Indium Corp.'s newest representative in Central America, and will be responsible for selling Indium's solder pastes; rework fluxes; wave solder fluxes; flip chip and liquid fluxes; underfills; conductive epoxies; solder spheres; and fabricated solder products.
APEX '06 to Feature Custer Consulting's Business Outlook
(November 2, 2005) BANNOCKBURN, Ill. — Walt Custer, president of Custer Consulting Group, will deliver a keynote presentation at APEX/IPC Printed Circuits Expo/Designers Summit 2006, to be held February 8–10, 2006, on February 9th.
Surface Mount Capacitors Offer COTS Option
(November 2, 2005) GREENVILLE, S.C. — KEMET Corp.'s T497 Series High Grade Commercial Off-the-Shelf (COTS) tantalum capacitors are available in non-standard case sizes corresponding to the Military CWR09, 19 and 29 styles. The capacitors range from 0.10 to 150 µF and 4 to 25 V to fit demand for extended safety considerations.
COMET Names New Sales and Marketing Manager for FEINFOCUS
(November 1, 2005) GARBSEN, Germany — COMET, who supplies FEINFOCUS X-ray inspection systems, has appointed Axel Bermeitinger as sales and marketing manager for the FEINFOCUS Business Unit. Bermeitinger has an extensive sales and marketing background in such industries as materials, electronics and medical devices. Previously, he held management positions at a specialty laser application machines supplier and a Swiss Holderbank AG subsidiary.
iNEMI, IPC to Host Meeting on MCD Exchange Implementation
(November 1, 2005) HERNDON, Va. and BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and the International Electronics Manufacturing Initiative (iNEMI) will host a session at Productronica 2005, to be held November 15–18 in Munich, to discuss implementation and industry adoption of material composition data (MCD) exchange standards. The meeting is scheduled for Wednesday, November 16th, from 9:00 a.m. to noon in Conference Room A 61.
Micro Contacts Suit Rugged Interface Applications
(October 31, 2005) NEW ALBANY, Ind. — Samtec's Tiger Eye contacts are multi-finger, precision stamped and formed, beryllium-copper contacts that are heat-treated to optimize spring properties for maximum cycles in high-reliability applications. Available in 1.27- and 2-mm pitch connector sets and in IDC cable systems, the contacts have been tested at up to 10,000 cycles with optional palladium-nickel plating.
RSVI Appoints New President
(October 28, 2005) HAUPPAUGE, N.Y. — RVSI Inspection LLC has recently appointed Kevin Maddy as its new president, where he will be responsible for managing products and applications sales that meet and exceed the demands of the global industry, while cultivating customer relationships. With his 25 years of manufacturing experience, he spent the past 14 years as a general management executive with P&L responsibility.
Productronica '05 to Feature 'EMS Village'
(October 28, 2005) MUNICH — Productronica 2005, to take place from November 15–18 in Munich, will feature the "EMS Village" — an information and discussion platform for EMS providers and users. It will be located in Hall A6 and will be at its second Productronica show, reflecting the immense significance of the growing industry.
Process Control Tool Helps to Kick Off Production
(October 28, 2005) MORRISON, Colo. — ScanINSPECT VPI from ScanCAD International qualifies each step of the assembly and fabrication process before production. This stand-alone system mixes a high-resolution, color flatbed scanner with a dual lighting system to provide a platform that verifies all of the process components before they reach the manufacturing floor.
Ironwood Releases Latest Short-form Catalog
(October 27, 2005) EAGAN, Minn. — Ironwood Electronics recently released its latest short-form catalog, version 19, which contains such products as Ironwood's 0.4-mm-pitch BGA and QFN sockets with 10+ GHz bandwidth and 500,000 insertions.
PCB Systems Design Suite Targets Global Manufacturing
(October 27, 2005) WILSONVILLE, Ore. — Mentor Graphics Corp. introduced its Expedition Enterprise flow for PCB systems design, enabling large companies to leverage multi-disciplined design team resources while providing global access to intellectual property (IP). The solution also gives companies the ability to integrate design data with corporate PLM, as well as supply chain and manufacturing systems.
Solectron Expands Guadalajara Plant with New Capabilities
(October 27, 2005) GUADALAJARA, Mexico — Solectron Corp. has recently expanded its capabilities in Guadalajara by creating an Enclosure Center and a Technology Excellence Center. The facility will focus on providing PCB assembly manufacturing and enclosures, system integration and design and engineering services to Solectron's customers worldwide.
IPC's Book-to-Bill Ratio Reaches Positive Heights in September '05
(October 26, 2005) BANNOCKBURN, Ill. — IPC's North American rigid PCB industry book-to-bill ratio for September 2005 rose to 1.07, while the North American flexible circuit book-to-bill ratio continued high at 1.52. Also, the combined (rigid and flex) book-to-bill ratio in September continued its climb to 1.18. These ratios are based on monthly data collected from PCB producers that participate in IPC's monthly PCB Statistical Program.
IPC Honors Members, Company at IPCWorks '05
(October 25, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries is honoring 28 individuals and one company at IPCWorks 2005, currently happening from October 24 in Las Vegas, for their contributions to IPC and the electronics interconnect industry.
Free Webinar to Target Tin Whisker Challenges
(October 24, 2005) FRANKLIN, Mass. — Speedline Technologies' experts will address tin whisker challenges and their issues in SMT manufacturing in a free, live Webinar, titled "Tin Whiskers," on November 17th, from 11:00 a.m. to noon EST. Tin whiskers, or the small protrusions of tin that can "grow" from tin-plated surfaces that can cause electrical short circuits, have cause for concern due to the industry's movement to lead-free manufacturing.
Atlanta-based Workshop to Focus on Conformal Coating, Dispensing
(October 24, 2005) CARLSBAD, Calif. — Asymtek, Dow Corning, Emerson & Cuming, Henkel Technologies and Humiseal will hold a conformal coating and dispensing workshop on November 8, 2005, at the Center for Board Assembly Research/Manufacturing Research Center (MARC) at Georgia Tech University in Atlanta. New information on conformal coating and best practices for jetting and other electronic assembly dispensing from both material and equipment perspectives is the aim of the workshop.
Elektrobit to Display Automation Line at Productronica '05
(October 21, 2005) OULUNSALO, Finland — Elektrobit Group plc will exhibit its complete JOT Automation line, featuring a bare board unstacker, laser marker, segment conveyor, high-speed router and a single flat-belt conveyor at Productronica, to be held November 15–18, 2005, in Munich. The functioning line will demonstrate boards being routed into several straight-edged pieces to showcase the high-speed router's capabilities, for example.
Upcoming Pan Pacific Symposium to Present Latest R&D Findings
(October 21, 2005) MINNEAPOLIS — The SMTA's 11th Annual Pan Pacific Microelectronics Symposium, to be held January 17–19, 2006, at the Hapuna Prince Hotel on the Big Island of Hawaii, will feature a vendor display and technical conference that shares the latest findings in R&D and provides a means for sharing business ideas to improve collaboration globally.
Indium to Show WEEE/RoHS-compliant Offering at Productronica '05
(October 20, 2005) UTICA, N.Y. — Indium Corp. will display its lead-free electronics assembly materials for WEEE and RoHS compliance at the Productronica show in Munich on November 15–18, 2005, and Indium's booth will be located in A3-550.
NEDA and ERA Host Electronics Industry Sales and Marketing Conference
(October 20, 2005) ALPHARETTA, Ga. — The Electronics Representatives Association (ERA) and the National Electronic Distributors Association (NEDA) have teamed to sponsor the 2006 Electronics Industry Sales and Marketing Conference on March 28–31, 2006, in Tampa, Fla. The conference is designed specifically for representatives, distributors and manufacturers to focus on sales and marketing efforts.
New PU and PVA Materials Suit CMP Machinery
(October 20, 2005) CHANDLER, Ariz. — Ceiba Technologies' polyurethane (PU) and polyvinyl alcohol (PVA) sponge materials are produced in roller and sheet forms for absorbing fluids and particulate wastes; scrubbing surfaces; and applying uniform coatings. Manufactured to exacting specifications and tolerances that provide lot-to-lot consistency, the PU material is formulated for softness in both wet and dry conditions, combined with abrasion and chemical resistance.
Video Inspection Tool Meshes Optics and Components
(October 20, 2005) CAMBRIDGE, U.K. — The MS500C Micro-Scopeman is a high-resolution integrated video inspection tool for real-time inspection and QA tasks, and is now available from Moritex Europe Ltd. Integrating advanced optics, fiberoptics and CCD components into a CCD microscope system, the MS500C provides a magnified image on a TV or video monitor by pointing at the target.
iNEMI to Debut European '07 Roadmap Efforts at Productronica '05
(October 20, 2005) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) will hold the first regional meeting to kick off its latest industry roadmap at Productronica 2005, to be held November 15–18 in Munich. - Co-sponsored by Fraunhofer IZM, IEEE's Components, Packaging, and Manufacturing Technology (CPMT) Society and IMAPS Europe, the meeting is scheduled for November 16th at the New Munich Trade Fair Center.
Content Management Toolset Enables Collaboration at Multiple Sites
(October 19, 2005) OOSTERHOUT, The Netherlands — Adeon Technologies BV launched the CXInsight for Electronics, a project content management system that allows internal and external collaboration between project members across OEM and manufacturing sites.
Boundary-scan Tester Validates Features Prior to Prototype
(October 18, 2005) RICHARDSON, Texas — ASSET InterTech Inc.'s DFT Analyzer is said to reduce manufacturing and test costs by validating the boundary-scan design-for-test (DFT) features in a circuit-board design before prototype assembly. It also determines the extent of a design's boundary-scan test coverage, recommending changes that would increase coverage.
In-line Multi-head Dispenser Handles Six Heads
(October 18, 2005) IRVINE, Calif. — MIMOT released an in-line dispenser based on its accurate, positive displacement auger valve. The unite features an overall dispense capacity of 40,000 d/h and can be equipped with up to six dispense heads.
IPC/JEDEC Lead-free Conference to Target Components and Assemblies
(October 17, 2005) BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and JEDEC will host the 11th International Conference on Lead-free Electronic Components and Assemblies on December 6–8, 2005, in Boston. To help prepare for such issues as new alloys and materials evaluations, inspection changes, tin whiskers, reliability and increased assembly costs, top experts will come together to deliver an educational program and technical conference.
Compact Connectors Provide Mini Docking Capabilities
(October 17, 2005) LISLE, Ill. — The CradleCon connector system from Molex Inc. offers a compact solution for applications using a cradle-docking function, such as digital cameras, audio players, mobile phones and other portable consumer items. The dual-row, 0.50-mm-pitch system is available in various SMT board-to-board options and custom cable versions.
MYDATA to Unveil 'Extended' Placement Machine Version in Europe
(October 17, 2005) STOCKHOLM, Sweden — MYDATA automation AB introduced its MY-Series Extended (E) model to the European market. The model, which initially launched at APEX 2005 in Anaheim, Calif., reportedly handles a range of components at high speed on a variety of board sizes.
Productronica '05 to Aid the Industry's Lead-free Transition
(October 14, 2005) CHICAGO — Productronica 2005, to be held November 15–18, 2005, in Munich, Germany, will aim to help electronics production experts and professionals in their transition to environmentally friendly practices and products. Show attendees will be able to gain firsthand information on the status of lead-free technologies and the latest processes in compliance with the new regulations.
Speedline Receives Patent for Bridge Detection Method
(October 14, 2005) FRANKLIN, Mass. — Speedline Technologies has received U.S. Patent #6,891,967 for its MPM BridgeVision inspection method. Awarded for its innovative analysis technique used to quantify both the amount and geometry of solder paste between printed deposits, the technique uses the solder paste's texture to identify its position relative to the smooth pad and solder mask. This method shows the difference between the gray solder paste and
the dark solder mask.
Scalable Handling Solution Targets Servo Gantry Applications
(October 13, 2005) CHARLOTTE, N.C. — A complete, scalable gantry solution for handling applications, Bosch Rexroth Corp.'s IndraMotion includes necessary hardware and software components with predefined motion function blocks to run pick-and-place and loading/unloading machinery. Powered by an IndraControl L40 Motion Logic controller, IndraMotion controls Cartesian gantries with up to three linear axes (X, Y and Z) and three rotary axes (A, B and C) of motion.
Recent Lead-free Technology Workshop Delivers
(October 12, 2005) FLEMINGTON, N.J. and IRVINE, Calif. — DEK and Henkel's collaboration on their Hands-on, Lead-free Technology Workshop proved successful, and was held September 22–23, 2005, in Chicago, prior to the Assembly Technology Expo/SMTA International exhibition and conference held September 27–29.
Kester's Chemical Line Sees Price Increases
(October 12, 2005) DES PLAINES, Ill. — Effective October 15, 2005, many of Kester's fluxes, thinners and associated chemical products will see price increases. Several of the raw materials used in Kester's chemical products have risen 64% in the past year and 100% since the beginning of 2004. Chemicals linked to the petroleum industry, such as alcohol solvents and oils have reached a point where Kester must pass these costs along to customers.
Universal Instruments Restructures in Binghamton and Bangalore
(October 11, 2005) BINGHAMTON, N.Y. Universal Instruments Corp. announced infrastructure and staffing changes aimed at increasing product quality, sales growth and customer satisfaction in its Binghamton and Bangalore, India facilities.
Teradyne Sells Connection Systems Division
(October 11, 2005) BOSTON Teradyne has reached an agreement to sell its Nashua, N.H.-based Connection Systems division to Amphenol Corporation for $390 million cash. Connection Systems is a supplier of high-speed, high-density connectors, as well as high-performance PCBs and backplane interconnect systems.
Indium's Weiping Liu Joins International Scientific Advisory Board
(October 11, 2005) CLINTON, N.Y. The American Welding Society, ASM International and the International Brazing and Soldering 2006 organizing committee have invited Indium's Weiping Liu, Ph.D., a research metallurgist, to join the conference's International Scientific Advisory Board.
Siemens Establishes Singapore Hub for Asia Manufacturing
By Gail Flower, Editor-in-Chief -
(October 10, 2005) SINGAPORE In September 2005, Siemens Electronics Assembly Systems delivered its first high-speed Siplace placement machine produced at the company's new SMT manufacturing plant in Singapore
Pb- and N2-free Solder Uses Extended Heat Profiles
(October 10, 2005) LONDONDERRY, N.H. Cobar introduced the SAC4-XM7S solder paste for lead-free and nitrogen-free processing. The paste, which remains stable and active during extended heating at elevated temperatures, does not require a nitrogen blanket and is said to offer a robust printing window.
Kyzen to Showcase Cleaning Solutions at Medical Design Show
(October 7, 2005) NASHVILLE Kyzen Corporation will showcase its Metalnox M6440, Metalnox M6434 and Aquanox 4630 cleaning solutions at the MD&M Medical Design and Manufacturing show scheduled for November 2-3, 2005, at the Minneapolis Convention Center.
Bench Top CNC Terminal Inserter Intros
(October 6, 2005) MOUNT KISCO, N.Y. Zierick Manufacturing introduced a fully automatic CNC insertion system. Measuring 3' x 3' x 2' high, the bench top Model 9700 XY Positioning System is suitable for production lines and the needs of contract manufacturers. Its modular tooling is said to reduce downtime between terminal changeovers.
SMART Group Publishes Lead-free Experience Report
(October 6, 2005) BUCKS, England The SMART Group, with support from LEADOUT, a European-wide lead-free projects, developed the Lead-free Experience3 to assist small- and medium-volume producers. The third-annual Lead-free Experience offered engineers a hands-on experience with all aspects of lead-free materials and production equipment.
EMS/ODM Growth Slow Compared to 2004
(October 5, 2005) ALAMEDA, Calif. Growth within the electronics and outsourcing markets is slowing, but top-line growth should continue in most segments, claimed Technology Forecasters Inc (TFI) analyst Matt Chanoff, during TFI's annual Five Year Forecast at the Quarterly Forum in Toronto.
OK to Launch Lead-free Solutions at Productronica '05
(October 4, 2005) MENLO PARK, Calif. — In response to ever-increasing global demand for lead-free hand soldering, rework and fume extraction systems ahead of the WEEE and RoHS deadlines, OK International will launch a new range developed under the single OK International brand specifically for lead-free processes. Through the on-stand "Lead-Free Kiosk," customers will be able to meet OK's lead-free process experts to help resolve any hand soldering and rework application issues.
High-volume Selective Solder System Highlighted
(October 4, 2005) WILLOW GROVE, Pa. — The Automation Group of Tyco Electronics showcased its Harmony-SPX, a multi-axis Cartesian Robot designed to selectively solder thru-hole and odd-form components into surface mount and mixed-technology PCBs at last week's Assembly Technology Expo in Rosemont, Ill.
PROMATION to Display Select Offerings at SMTA/IMAPS Dallas
(October 3, 2005) KENOSHA, Wis. — PROMATION will have a mini display booth at this year's SMTA/IMAPS Vendor Days, to be held October 11, 2005, at the Richardson Civic Center in Dallas. At the exhibit, DG Marketing's Kent Donaldson, Bob Powledge, Dan Greaves and John Van Meter will be available to offer advice on PROMATION's automated solutions.
ZESTRON Appoints New Southern States Sales Rep
(October 3, 2005) ASHBURN, Va. — ZESTRON America has signed Dallas-based EMI Systems to be the sole provider of ZESTRON's products and services in Texas, Oklahoma, Arkansas, Louisiana and Mexico. This appointment aims to meet increased customer demand and continued market growth.
Stencil-free Jet Printer Reduces Production Errors
(October 3, 2005) STOCKHOLM, Sweden — MYDATA automation AB's MY500 stencil-free jet printer uses Jet Printing Technology to shoot volumes of solder paste at 500 dots/s, or 1.8 million dots/h. Because the MY500 does not require stencils, operators can change the print program in seconds and control the volume of solder paste deposits for each pad.
Schoch Named VP Sales for Elcoteq Americas
(September 30, 2005) IRVING, TX Elcoteq Network Corporation appointed Mitchell Schoch to vice president sales and marketing, Elcoteq Americas. Schoch's appointment is part of the company's focus on implementation strategy to continue profitable growth, diversification of Elcoteq's customer base and expansion of its service offering.
Automated Device Programming System Featured at ATExpo
(September 29, 2005) REDMOND, Wash. Data I/O showcased its PS588 high-speed offline production programming system for high-volume, high-mix device programming at ATExpo, September 27-29, 2005, in Rosemont, Ill.
Kester Opens Facility in China
(September 29, 2005) DES PLAINES, Ill. Kester announced the opening of a new manufacturing and technical center in Suzhou, China, outside of Shanghai. The China facility will meet the demands of China's growing electronics assembly market.
Flextronics to Build New Facility in Ciudad Juarez, Mexico
The service offering at this facility will include product Configure-to- Order (CTO)/Build-to-Order (BTO), product completion and pack-out, mechanical services and logistics, such as repair and distribution
Technology and Business Consulting Firm Debuts
(September 23, 2005) DALLAS — TechBiz Consulting LLC assists companies with technical problems encountered in electronic design and manufacturing, as well as small business challenges that may arise. The company plans to launch its official opening at SMTA International Conference and ATExpo in Rosemont, Ill., September 27, 2005.
Hover-Davis to Offer Cogiscan-based Intelligent Feeding Solutions
(September 23, 2005) ROCHESTER, N.Y. and BROMONT, Quebec — Hover-Davis and Cogiscan announce the second phase of their long-term strategic partnership. Under a global OEM reselling agreement, Hover-Davis will offer Cogiscan RFID hardware and software applications that mix with their tape feeders, label feeders, and Direct Die feeders. Hover-Davis will now be able to provide intelligent feeding solutions that can seamlessly integrate with existing equipment and information systems.
Vitronics Soltec Names New President
(September 23, 2005) STRATHAM, N.H. — Effective September 20, 2005, Vitronics Soltec has appointed Erik Tobiason as its new president, following five years of serving as president of Graphics Microsystems Inc. (GMI), a Dover Diversified Company. Tobiason began his career with Dover as vice president of engineering and R&D of GMI. Prior to joining GMI, he held positions in engineering and technology management with front-end semiconductor companies in the Silicon Valley.
Outsourcing in Europe is Focus of TFI Forum in Munich
(September 22, 2005) ALAMEDA, Calif. — Technology Forecasters Inc. (TFI) will hold a special Quarterly Forum for Outsourced Manufacturing and Supply Chain event on November 2–4, 2005, in Munich, Germany. To be hosted by Avnet Electronics Marketing, the event will include a new report based on TFI's extensive European interviews and research on the EMS industry based in that region.
Color Polyimide Labels Suit Lead-free and Standard Processes
(September 22, 2005) WESTMORELAND, N.H. — Polyonics Inc.'s 1- and 2-mil color polyimide labels are coated with a permanent, pressure-sensitive acrylic adhesive and a high-opacity, medium-gloss topcoat available in six tinted colors — pink, yellow, orange, blue, green and violet. They are thermal-transfer-printable and scan with both visible and IR scanners.
YESTech to Debut New AOI System Series at ATExpo '05
(September 21, 2005) SAN CLEMENTE, Calif. — YESTech will introduce its new F1 series automated optical inspection (AOI) systems at the upcoming Assembly Technology Expo (ATExpo), to be held September 27–29 in Rosemont, Ill. The new F1 provides advanced automated inspection of solder and lead defects, component presence and position, correct part, polarity and thru-hole parts.
Henkel to Display Environmental Product Suite at Productronica '05
(September 21, 2005) IRVINE, Calif. — The global transition to lead-free is propelling the electronics group of Henkel to exhibit its comprehensive lead-free product range at Productronica 2005, to be held November 15–18, in Munich. Henkel's lead-free offering will include a range of product and material sets, to be shown at booth A3.153 in Hall A3.
Praxair to Feature Panasonic Robotic Welding at Upcoming Show
(September 20, 2005) BUFFALO GROVE, Ill. — Praxair Distribution, Inc. will feature a robotic welding system from Panasonic Factory Solutions Company of America at the National Factory Automation Show, to be held October 17–20, 2005, at the National Trade Center in Toronto. There, Praxair will display its gas- and wire-delivery systems for cutting and welding applications using Panasonic robotic welding systems.
MYDATA to Show 01005 Component Handling at Productronica '05
(September 20, 2005) STOCKHOLM, Sweden — MYDATA Automation AB will demonstrate high-speed 01005 component placement at the approaching Productronica trade show in Munich on November 15–18, 2005. The latest version of the Agilis 3.7 feeder and new high-precision tools grant MYDATA's placement machines with the ability to handle 01005 chips at high speeds.
Indium Names New French Distributor
(September 19, 2005) UTICA, N.Y. — Indium Corp. of America has appointed CHIMIE TECH SERVICES SA (CTS) as its newest European distributor, covering France. CTS is responsible for sales and service of Indium's solder pastes, wave solder fluxes, solder wire and solder preforms portfolio, and has experience in supplying consumable materials and equipment for the manufacture of active and passive components.
Cooled Industrial Camera Available
(September 19, 2005) SAN DIEGO — The MegaPlus II EC11000, an actively cooled industrial camera, is now available from Redlake MASD LLC. It separates and isolates the camera's primary electronics from the sensors cooling path. A fan-optional design allows it to operate in cooling modes with or without a fan accessory attached.
RoHS Compliance Course Demos IPC-1752 Implementation
(September 16, 2005) BANNOCKBURN, Ill. — To help companies through the RoHS transition, IPC–Association Connecting Electronics Industries will host "Ensuring RoHS Compliance Through Materials Declaration Tools: Implementing IPC-1752," on November 9, 2005, in Northbrook, Ill.
Technology Forecasters Hosts Outsourcing Workshop
(September 15, 2005) ALAMEDA, Calif. — Technology Forecasters Inc. (TFI) will host a TFI Global Pricing Workshop titled, "Mitigate the Risk of Global Manufacturing Outsourcing and Protect Your Margins," on October 5, 2005, in San Jose, Calif.
Samsung Certifies Zetex for RoHS Compliancy
(September 14, 2005) HAUPPAUGE, N.Y. — Samsung Electronics recently certified Zetex Semiconductors as an Eco-Partner Affiliate Company, meaning that Zetex's environmental management system has met Samsung's Green Procurement Program requirements in full. Aiming to create a completely green supply network, the Program requires that suppliers fully comply with the looming RoHS Directive.
Conformal Coating Workshops Head to Canada
(September 14, 2005) CARLSBAD, Calif. — Asymtek, Dow Corning, Dymax, EMI and Humiseal collectively will offer conformal coating workshops in Montreal and Toronto, Canada on October 11 and 13, 2005, respectively. Each one-day training program will teach attendees about the various types of available coatings, including silicone, acrylics, urethanes, UV-curable coatings and adhesives. The most recent automated equipment options for mask-free conformal coating will also be covered.
New Optimization Software to Debut at Productronica '05
(September 14, 2005) STOCKHOLM, Sweden — MYDATA Automation AB will debut its new MYPlan optimization and scheduling software, which is said to reduce production and changeover times, at Productronica 2005 in Munich, Germany from November 15–18, 2005. Features include an intuitive user interface, a built-in TPSys Editor and an integrated Web interface.
ANSYS, CoCreate Integrate 3-D CAD and Digital Simulation
(September 13, 2005) SOUTHPOINTE, Pa. — ANSYS, Inc. announces the availability of a direct connection between its ANSYS Workbench simulation environment and CoCreate's 3-D CAD software, where solid models created in CoCreate's Designer Modeling can be transferred directly to ANSYS' simulation environment. The integration also establishes an association with the 3-D CAD model so that changes made within Designer Modeling are updated within ANSYS Workbench.
Solectron's CFO Resigns; Senior VP to Assume Interim Role
(September 13, 2005) MILPITAS, Calif. — Solectron Corp.'s executive vice president and CFO, Kiran Patel, is leaving Solectron to become the CFO for Intuit Inc. Warren Ligan, Solectron's current senior vice president and corporate controller, will be assuming Patel's role on an interim basis while a search of internal and external candidates is conducted.
Aegis, FUJI Sign Software Integration Protocols Agreement
(September 13, 2005) PHILADELPHIA — Aegis Industrial Software Corp. has finalized an agreement with FUJI to share integration protocols to FUJI's FujiTrax software, enabling FujiTrax to seamlessly integrate to the Aegis MES systems for line monitoring, feeder setup and verification and traceability. Aegis now can offer FUJI and multivendor customers a singular Total Traceability and MES solution involving FUJI NXT and other FujiTrax-compliant lines.
SMTA's Boston Chapter Schedules September Meeting
(September 12, 2005) FRANKLIN, Mass. — The SMTA Boston Chapter has scheduled its monthly meeting for Tuesday, September 20, 2005, at Speedline Technologies in Franklin, Mass. Topics include lead-free solder paste printing process accuracy requirements and an SMT stencil printer and dispenser manufacturing overview.
High-speed Photocouplers Help Reduce Component Count
(September 12, 2005) CAMAS, Wash. — Sharp Microelectronics of the Americas' S08 photocouplers line includes 1-, 15- and 25-Mbps devices in single-channel models, and 10-Mbps devices in both single- and dual-channel models. Each reportedly uses the industry-standard footprint and incorporates optimal noise immunity, high heat resistance and improved isolation characteristics.
Indium to Showcase Lead-free Offering at ATExpo '05
(September 9, 2005) UTICA, N.Y. — Indium Corp. of America will be exhibiting their lead-free materials portfolio at the Assembly Technology Expo (ATExpo) on September 26–28, 2005, in Rosemont, Ill. Indium's exhibit at booth #5631 will feature Indium5.1, a lead-free, no-clean solder paste with "response-to-pause" printing, and NF260, a reworkable, lead-free, no-flow underfill.
ZESTRON to Take Part in New England Lead-free Seminar
(September 9, 2005) ASHBURN, Va. — ZESTRON America is slated to take part in a lead-free seminar to be held on November 2, 2005, and hosted by MPS Associates in Westford, Mass. In collaboration with Speedline Technologies, REsys Inc., Specialty Coating Systems (SCS) and Alpha Metals, ZESTRON will deliver its knowledge on lead-free-related cleaning issues.
Four-in-One EMS Solution Targets HMLV Production
(September 8, 2005) CRANSTON, R.I. — A fully integrated manufacturing solution that combines four key electronics production processes: fiber interconnect, copper interconnect, mixed-technology PCBA and high-level assembly and test is available from Federal Electronics. The solution targets OEMs seeking high-mix, high-complexity, low-volume production of electronics components and assemblies.
iNEMI to Sponsor Upcoming RFID Forum
(September 8, 2005) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) consortium will sponsor a forum targeting RFID technology on October 4, 2005, at the Sun Microsystems facility in Newark, Calif. Some organizations are making investments to implement RFID; however, others argue that RFID is equivalent to an expensive barcode and may never reach the promised return on investment.
ATExpo to Feature Cleaning Optimization Paper Presentation
(September 7, 2005) AUSTIN, Texas — Austin American Technology's Steve Stach and Kyzen Corp.'s Mike Bixenman will co-present a paper entitled, "Optimizing Cleaning Energy in Batch and In-line Cleaning Systems — Phase Two" in technical session SMT2 at the Assembly Technology Expo (ATExpo) on Tuesday, September 27, from 1:30 p.m. – 3:00 p.m. in Room 5.
Controller Automates Wind Tunnel Testing
(September 7, 2005) NORWOOD, Mass. — WTC-100 from Advanced Thermal Solutions, Inc. (ATS) is a fully automatic controller for laboratory wind tunnels that are used to thermally characterize PCB components, heat sinks and card racks. Two independent sensors simultaneously measure air velocity and temperature to provide a wide range of wind-tunnel test conditions.
Indium Names New Applications Engineers
(September 1, 2005) UTICA, N.Y. — Indium Corp. of America has appointed three new applications engineers, Jim Hisert, Dan McCall and Ed Briggs, each to be located at Indium's Clinton, N.Y.-based corporate headquarters.
DEK Adds New Technology to Tooling Options Portfolio
(August 31, 2005) FLEMINGTON, N.J. — DEK has expanded its advanced tooling options range, signalled by the introduction of smaller, cost-effective Grid-Lok technology, and extending the choices available to customers sourcing tooling for DEK printer platforms. The new Grid-Lok tooling system features reduced dimensions, moving to 4 × 12" tooling modules.
Surface Mount Power Resistors Handle up to 12 W
(August 30, 2005) RALEIGH, N.C. — The HPC series surface mount power resistors reportedly can handle up to 12 W at 85°C. Available in 5-, 10- and 12-W ratings, the resistors range from 0.1 Ω to 100 KΩ in a 0.5 × 0.5 × 0.5" package size in tape-and-reel and bulk packaging from Stackpole Electronics, Inc. (SEI).
Kester Takes Lead-free Seminar Series to Texas
(August 29, 2005) DES PLAINES, Ill. — Kester's lead-free seminar series, titled "Project 2005: Achieving Lead-free RoHS Assembly," is heading to Dallas, Texas, and will be held on September 13, 2005.
Designed to assist the electronics industry in transitioning to lead-free soldering and RoHS compliancy successfully, the seminars address key lead-free assembly issues and give technical, practical information to transition in a timely fashion.
IPC Posts July '05 Book-to-Bill Ratio, Business Report
(August 29, 2005) BANNOCKBURN, Ill. —
July 2005's North American rigid PCB industry book-to-bill ratio declined to 0.99, while the North American flexible circuit book-to-bill ratio continued to climb to 1.71, according to IPC–Association Connecting Electronics Industries' monthly PCB Statistical Program. Combined, the industry book-to-bill ratio increased to 1.16.
Speedline Posts Highest Bookings Since '00
(August 26, 2005) FRANKLIN, Mass. — Speedline Technologies' second-quarter 2005 bookings rose 44% over the first quarter, reaching their highest level since 2000. At the end of July, the backlog had climbed 68% vs. the end of the first quarter.
iNEMI Task Force Addresses Lead-free Issues
(August 25, 2005) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) has published recommendations for safeguarding high-reliability products' dependability as the supply chain converts to lead-free components and materials. iNEMI's High-reliability RoHS Task Force is calling for continued SnPb-compatible components availability for exempted products, and for standardized mitigation practices and testing methods to minimize tin whiskers.
Designers to Join Up in Texas-based Event
(August 25, 2005) BANNOCKBURN, Ill. — Through a full week of learning and networking opportunities to enhance professional skills and credibility, PCB and assembly designers can attend the "IPC Lead-free Initiative for Electronic Assembly" training on November 14–15; Designers Learning Symposium on November 16 and IPC Designers Certification on November 17–19, all to be held in Dallas.
CheckSum Opens Shanghai Facility
(August 24, 2005) ARLINGTON, Wash. — In-circuit test (ICT) systems supplier CheckSum has opened a new office in Shanghai, China, where sales and technical support staff will serve OEMs and contract manufacturers using CheckSum test systems throughout Greater China.
Shielded SMD Inductors Provide EMI Protection in Filtering
(August 23, 2005) ROMOLAND, Calif. — The low-profile DR363 and DR364 Series surface mount inductors from Datatronic Distribution, Inc., provide protection against challenging EMI problems in high-current applications. Available in a wide range of inductance values, they feature a seated profile as low as 3.0 mm above the board, making them ideal for high-density circuit board designs.
Traceability Labels Aid Board Clean-up
(August 22, 2005) BEVERLY, Mass. — Computer Imprintable Label Systems' (CILS) labels allow manufacturers to track products through solder baths and cleaning for long-term traceability. For lead-free components, the labels fully comply with the Directives, and withstand the chemicals used in the new cleaning processes, retaining valuable data contained either in the barcode or serial numbers.
Upcoming Webinar to Target Lead-free Wave Soldering
(August 22, 2005) FRANKLIN, Mass. — To address misconceptions about equipment requirements for lead-free wave soldering, Speedline Technologies' SMT manufacturing experts will talk about such issues in a free, live Webinar, titled "Lead-Free Wave Soldering," on September 15th, 2005, from 11:00 a.m. to noon EST.
iNEMI to Hold First Meeting for 2007 Roadmap Following SMTAI
(August 19, 2005) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) will begin preliminary work on its next industry roadmap in Chicago, where the Product Emulator Groups (PEGs) will hold their first industry-wide meeting on September 30th, immediately following the SMTA International (SMTAI) conference. Several iNEMI initiatives also will be presenting papers at the conference.
Productronica '05 to Acknowledge Growing Interest for Shrinking Components
(August 19, 2005) CHICAGO — Productronica 2005, to be held November 15-18 in Munich, Germany, will inaugurate MicroNanoWorld, an industry platform for microtechnical production to address the central role played by nanotechnology. During the past two years, global market demand for such technology has more than doubled to $68 billion, still representing a market with further potential growth.
Surface Copper Probe Enhances Benchtop Coating System
(August 19, 2005) ELK GROVE VILLAGE, Ill. — Oxford Instruments Coating Measurement (OICM)'s SRP-4 surface copper probe integrates with the CMI701M benchtop system, reportedly adding functionality and cost savings to the CMI701M's coating thickness measurement performance. The SRP-4 features replaceable, interchangeable tips, eliminating the expense of replacement probes, and allowing for quick adjustment for new measurement applications.
Indium Names Global Account Specialist for Inside Sales
(August 17, 2005) UTICA, N.Y. — Indium Corp. of America announces that Kevin Collins has joined their inside sales department as the global account specialist. To be based at Indium's Clinton, N.Y. headquarters, Collins will be responsible for assuring that customer needs are identified and addressed using specific account strategies.
IPC, CCA to Sponsor Lead-free 'Boot Camp'
(August 17, 2005) BANNOCKBURN, Ill. — On July 1, 2006, the RoHS Directive will go into effect, banning several substances including lead and lead-bearing solder. California's mirroring laws take effect in early 2007, and China passed similar legislation last month. Lead-free is significantly impacting the supply chain — keeping track of the evolving regulations, customer requirements and compliance documentation is a lot of work for any company.
Agilent, Speedline to Team on Lead-free Research Experiments
(August 16, 2005) PALO ALTO, Calif. — Agilent Technologies and Speedline Technologies are collaborating in the lead-free process development and characterization of printed circuit board assemblies (PCBAs). With this, Speedline will use Agilent's lead-free-ready inspection systems in a series of experiments to document best practices associated with the transition to lead-free manufacturing.
Universal Appoints New President
(August 15, 2005) STRATHAM, N.H. — Vitronics Soltec's president since 1999, Jeroen L. Schmits, will leave his position to assume the recently vacated Universal Instuments (UIC) presidency, effective August 23, 2005. A replacement for Schmits at Vitronics Soltec has yet to be named.
JPSA's Sercel, von Dadelszen Publish Chapter in New Laser-beam Shaping Book
(August 15, 2005) HOLLIS, N.H. — Jeffrey P. Sercel, president of J. P. Sercel Associates, and co-author Michael von Dadelszen, Ph.D., have authored a chapter in the recently published book, Laser Beam Shaping Applications, edited by Fred M. Dickey, Scott C. Holswade and David Shealy. The chapter authored by Sercel and von Dadelszen, Chapter 3, is titled "Practical UV Excimer Laser Image System Illuminators," pp. 113-155.
Agilent to Divest Semi-related Businesses, Boost Shareholder Value
(August 15, 2005) PALO ALTO, Calif. — Agilent Technologies Inc. announces actions to enhance its company focus and to create value for its shareholders. Such actions include divesting the semiconductor products segment to Kohlberg Kravis Roberts (KKR) and Silver Lake Partners for $2.66 billion; to sell its stake in Lumileds to Royal Philips Electronics for $950 million, plus Lumileds' repayment of $50 million of debt; and spinning off its SOC and memory test businesses in 2006.
New Simulation Solution Software Version Available
(August 15, 2005) SOUTHPOINTE, Pa. — ANSYS, Inc. has launched version 10.0 of its complete ANSYS software suite, which offers coupled physics technology, such as fluid structure interaction (FSI). ANSYS 10.0 builds upon and is compatible with the existing ANSYS 9.0 software suite.
Solder-pallet Material Withstands High Temperatures
(August 12, 2005) POSTVILLE, Iowa — WaveMax 5000, a thermoset composite material for durable, high-temperature solder pallets, is now available from Norplex-Micarta. It provides mechanical strength continuously at 260°C, and easily withstands exposures to temperatures approaching 360°C, such as those produced during wave soldering and IR reflow. It may also be used for long-term, high-temperature lines running 24 hours/day.
Kester to Offer Lead-free Assembly Technology Courses
(August 12, 2005) DES PLAINES, Ill. — Kester University will host two new courses on RoHS/Lead-free training on August 30–31, 2005, at Kester's Des Plaines, Ill. facility, giving attendees the latest updated information and practical experience to effectively implement RoHS/lead-free assembly. Practical demonstrations of lead-free SMT assembly technology also will give attendees the essential knowledge to transition to lead-free and ensure their products' reliability.
Asymtek Signs on New Chinese Distributor
(August 11, 2005) CARLSBAD, Calif. — Asymtek has added Shanghai-based sales rep team, Shanghai Kankun Trading Co., to market their automated fluid dispensing systems throughout China. Kankun provides Asymtek's customers with on-site equipment service, training, applications support and spare parts. They also offer lab resources, including equipment demonstrations and the latest technical data on dispensing.
FEINFOCUS, INNOV-X Systems Form Alliance
(August 11, 2005) STAMFORD, Conn. — FEINFOCUS, a COMET North America business unit, announces a technology alliance with INNOV-X Systems, a high-performance portable X-ray Fluorescence (XRF) analyzers manufacturer, where the two companies will join forces to introduce products to the markets worldwide.
Kester to Offer Lead-free Wave Soldering, Rework Training
(August 10, 2005) DES PLAINES, Ill. — Kester will host a Kester University course on RoHS/Lead-free training on August 25–26, 2005, at the Des Plaines, Ill. facility. Together with lead-free wave solder and rework process assembly practical demonstrations, attendees will leave with the knowledge required to transition to lead-free while ensuring their products' reliability.
Dage Opens East Coast Demonstration Center, Applications Lab
(August 10, 2005) HAVERHILL, Mass. — Dage Precision Industries has opened its new East Coast demonstration center and application lab through its alliance with Circuit Technology Center, allowing Dage to showcase its digital X-ray inspection technology in Circuit Technology Center's Haverhill, Mass.-based facility.
Surface Mount Ferrite Beads Ideal for Wireless Products
(August 10, 2005) SMYRNA, Ga. — Murata Electronics North America's BLM03BB series 0201 surface mount ferrite beads meet FCC EMI regulations, minimize attenuation in high-speed signals and are ideal for Bluetooth and WLAN modules, power amplifier modules for cell phones, PDAs, laptops and other applications with limited board space.
IPC Announces Keynote Speaker for Management Council Meeting
(August 9, 2005) BANNOCKBURN, Ill. — Grant Aldonas, formerly undersecretary of commerce for international trade for the Bush administration, will deliver the keynote address, "The Dynamics of U.S. and China Trade Relations: A View from the Front Lines," at the IPC Management Council Meetings on October 18, 2005 in St. Petersburg, Fla.
Universal, Selettra Plan to Prolong Partnership
(August 8, 2005) BINGHAMTON, N.Y. and ARESE, Italy — Universal Instruments (UIC) and Selettra have extended their distribution partnership, further uniting sales and service expertise and products for the Italian electronics market. Based around UIC's AdVantis platform, the companies are now developing this relationship to incorporate the UIC product portfolio.
Test Points Offer Loop Design to Connect Test Probes
(August 8, 2005) DENVILLE, N.J. — Components Corp.'s 100% RoHS-compliant TP-107 Series low-profile, surface mount PCB test points easily, quickly and accurately identify faults via a forming process. This process consists of forming the flat wire design in a spiral wrap at the mounting base, doubling the mounting base's surface area to enable a rugged connection when adhered to the solder pad.
Seminar Addresses Handheld and Computing Devices Manufacturing
(August 8, 2005) CARLSBAD, Calif. Asymtek and Emerson & Cuming (Billerica, Mass.) will host a seminar for handheld and computing devices manufacturing on August 19, 2005, in Taoyuan, Taiwan. The workshop will address how technology evolutions affect material selection and processing for handheld and computing devices manufacturing.
iNEMI Innovation Leadership Forum Tackles Industry's Future
(August 5, 2005) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) will assemble the iNEMI Innovative Leadership Forum at its Herndon, Va., headquarters, September 15-16, 2005, to launch an initiative aimed at stimulating innovation and manufacturing research for the electronics industry.
Henkel Names New Material Sets Executive
(August 4, 2005) IRVINE, Calif. — Henkel Electronics Group has appointed Dr. Michael Todd as technical director of research, development and engineering for material sets, a position designed to enhance the material set development of Henkel's next-generation products. Dr. Todd's leadership will help to further streamline development and testing, enable customers to accelerate product cycles and meet increasing time-to-market demands.
75-ml Cartridges Fit Existing Manual Dispensing System
(August 4, 2005) SALEM, N.H. — ConProTec Inc.'s new 75-ml cartridges fit the MIXPAC handheld cartridge dispensing system for two-component adhesives. The MIXPAC system consists of a manual or pneumatic dispensing gun, a cartridge and a static mixer to dispense two-component adhesives in a 1:1 volumetric ratio.
IPC Announces Fall Management Council Meetings
(August 3, 2005) BANNOCKBURN, Ill. — IPC – Association Connecting Electronics Industries' upcoming Management Council Meetings, to be held October 18, 2005, in St. Petersburg, Fla., are forums where industry leaders can meet with peers, customers and suppliers to solve common challenges and hear the latest industry information.
Measurement Gauges Provide Readings for Difficult Surfaces, Textures
(August 3, 2005) ELK GROVE VILLAGE, Ill. — Oxford Instruments Coating Measurement's (OICM's) 200 Series coating thickness measurement gauges incorporate a scanning option, allowing for continuous measurement over large areas with one measurement. This feature calculates an average measurement, giving an accurate reading for thickness over uneven or textured substrates and eliminating the need to take multiple readings.
SMTA Online Workshop Offers Compliance Blueprint
(August 1, 2005) MINNEAPOLIS — The SMTA offers "Developing a Plan for WEEE/RoHS Compliance," an online overview for companies to develop a WEEE/RoHS Compliance protocol. The workshop, scheduled for Wednesday, August 10, 2005, at 1:00 p.m. EST, will also present examples to help companies better understand the Directives.
COMET Opens New North American Service Center
(August 1, 2005) STAMFORD, Conn. — COMET North America recently opened its new Service and Repair Center at its Stamford, Conn. headquarters. The new facility aims to ensure high-quality test, repair and maintenance for all COMET X-ray tubes, RF products and FEINFOCUS microfocus X-ray systems, with 24-hour turnaround time for the initial evaluation and analysis of a damaged X-ray tube or module.
Connectors Save PCB Space in Sensor Applications
(July 29, 2005) LISLE, Ill. — The EZ-Conn connectors from Molex Inc. on 1.50-mm pitch are ideal for industrial sensor applications, such as air and water pressure sensors used in pick-and-place assembly machines, base press controls and other automation equipment.
IPC Posts June 2005 Book-to-Bill Ratio
(July 29, 2005) BANNOCKBURN, Ill. — Based on monthly data collected from PCB producers that participate in IPC – Association Connecting Electronics Industries' monthly PCB Statistical Program, the June 2005 North American rigid PCB industry book-to-bill ratio declined, yet remained positive at 1.01, while the flexible circuit book-to-bill ratio increased to 1.51. Combined, the industry book-to-bill ratio increased to 1.13, reflecting the flexible circuit bookings increase.
Omron Reports Q1 Consolidated Financial Results
(July 28, 2005) TOKYO — Omron Corp. has reported earnings for the first quarter, which began on April 1, 2005 and ended on June 30, 2005. Net sales totaled JPY 138.4 billion, operating income was JPY 9.0 billion, gross income totaled JPY 5.1 billion and net income totaled JPY 5.1 billion.
ZESTRON Cleaning Agent Passes SIR-Testing
(July 28, 2005) ASHBURN, Va. — ZESTRON's water-based cleaning agent to remove all types of flux residues, VIGON A 200, recently passed extensive Surface Insulation Resistance (SIR) Testing, conducted in accordance with J-STD 001. This test involved cleaning an IPC B24 test comb structure with VIGON A 200 in a spray-in-air process.
Adhesive Transfer Film for Electronic Bonding Available
(July 28, 2005) WINDSOR, Conn. — Scapa North America's Unifilm U800B is an unsupported acrylic adhesive transfer film for end-use applications requiring high temperature resistance. It offers tack and peel balance, and is said to maintain shear properties at temperatures over 200°C.
Indium Appoints Sales Rep for Northwest U.S.
(July 27, 2005) UTICA, N.Y. — Indium Corp. of America has appointed Lusher Electronic Technology Sales (L.E.T.S.) NW as its newest representative for sales and service in the Northwest U.S., including Oregon, Washington and Idaho. In that region, L.E.T.S. will sell Indium's line of solder pastes, rework fluxes, wave solder fluxes, flip chip and liquid fluxes, underfills, conductive epoxies, solder spheres, solder preforms, solder wire, solder ribbon and bar solder.
CPS Names New VP of Marketing, Technical Sales
(July 27, 2005) CHARTLEY, Mass. — CPS Corp. has promoted research and development senior scientist, Mark Occhionero, Ph.D., to vice president of marketing and technical sales. In his new position, he will coordinate sales activities, press opportunities and the development of new products and applications.
IPC RoHS Directive Webcast Guides Attendees
(July 26, 2005) NASHUA, N.H. — "Only 246 working days to 1, July 2006!" a slide informed attendees during the IPC – Association Connecting Electronics Industries' Webcast, The RoHS Directive on the Restriction of Hazardous Substances, presented by Steve Andrews of the UK Department of Trade and Industry. Andrews gave attendees an overview of the RoHS Directive and an update on RoHS maximum concentration values. By Michelle M. Boisvert, SMT Managing Editor
Continuously Configurable Cell Meshes SMT, Microelectronics Manufacturing
(July 25, 2005) ELGIN, Ill. — Panasonic Factory Solutions Company announced the availability of its Integrated Process Assembly Cell (IPAC), a continuously configurable, modular platform that mixes high-volume SMT manufacturing with advanced microelectronics in one machine.
IPC, JEDEC to Host Upcoming Lead-free Conference
(July 25, 2005) BANNOCKBURN, Ill. — IPC – Association Connecting Electronics Industries and JEDEC – the Solid State Technology Association are slated to host the 9th International Conference on Lead-free Electronic Components and Assemblies August 17-19, 2005, in Singapore.
Heraeus CMD to Showcase Lead-free Solutions
(July 22, 2005) WEST CONSHOHOCKEN, Pa. — At the upcoming Assembly Technology Expo exhibition, to be held September 27-29 in Rosemont, Ill., Heraeus' Circuit Materials Division (CMD) will be focusing on its capabilities to help the semiconductor and SMT industries transition to lead-free assembly processes.
Indium, ACI to Present Hands-on Lead-free Seminar
(July 22, 2005) UTICA, N.Y. — Indium Corporation and the American Competitiveness Institute (ACI) have joined forces to present a lead-free training program. The seminar is slated for September 13-15, 2005, at the National Center of Excellence in Electronics Manufacturing Technology in Philadelphia.
Upcoming Seminar to Address PCB Miniaturization
(July 21, 2005) BANNOCKBURN, Ill. — The demand for smaller, thinner and lighter PCBs is becoming quite a challenge, and manufacturers are finding it a daunting task to meet current industry requirements. To help, a one-day seminar on September 22, 2005, in Schaumburg, Ill., sponsored by the IPC PCB Suppliers Council Steering Committee and hosted by Motorola, will bring the supply chain together to trade information on manufacturing the ever-shrinking circuit board.
SMD Trimmers Comply with RoHS Directives
(July 21, 2005) SCHAUMBURG, Ill. — The RoHS-compliant G32 Series 3-mm, single-turn cermet trimmers from TOCOS are said to provide flexibility for circuit boards. They are available in both gold-plated J-hook and gull-wing terminal configurations, and their design meets the EIS, EIAJ, IPS and VRCI standard SMD footprint.
Dynatech Names New Central Regional Sales Manager
(July 21, 2005) HORSHAM, Pa. — Dynatech Technology, Inc., the North American distributor for Samsung Techwin SMT equipment, has appointed Joseph Cumbey as Central regional sales manager. To be based in the Dallas-Ft. Worth, Texas area, he will be responsible for Dynatech United States' manufacturers' representatives and customers in the Midwest, and for reps and customers in Eastern Mexico.
Arrow Expands Critical Environmental Data Online
(July 21, 2005) MELVILLE, N.Y. — Arrow Electronics, Inc. has expanded its Component Information Services, an online toolset that provides engineering, procurement and supply chain professionals with data to research and select electronic components that meet particular product design goals. The new enhancements provide a broader, richer data set for European Union (EU) environmental regulations (RoHS and WEEE) compliance.
Low CTE Die Attach Material Available
(July 20, 2005) IRVINE, Calif. — Henkel Electronics Group's Hysol QMI600 is a silica-filled, low-viscosity, non-conductive die attach paste that provides a low coefficient of thermal expansion (CTE) and high modulus to match existing mold compound properties, enabling wirebonds in same-size die stack packages to survive thermal cycling.
Hover-Davis Appoints New Distributor
(July 20, 2005) ROCHESTER, N.Y. — Hover-Davis Inc. recently has appointed Sincotron Finland Oy as its distributor for the areas of Finland and the Baltic States. Sincotron Finland distributes machines, material and services for manufacturing, and provides SMD placement, inspection, microelectronics, soldering, dispensing, screen printing, testing, software, profiling, tools and consumables services.
UIC Executive Appointment Strengthens Asian Presence
(July 19, 2005) BINGHAMTON, N.Y. — Effective June 27, 2005, Universal Instruments Corp. (UIC) appointed Eric Kan to vice president for Asia, aiming to extend their presence in the expanding Asian marketplace. Asia, particularly China, has been of high strategic importance to UIC's future growth strategy. This appointment will increase the level of local executive authority for the company in Asia, safeguarding and driving its future development.
Conveyor Provides Gentle Handling to Soft Products
(July 19, 2005) ALLENTOWN, Pa. — FlexLink's new conveyor chain reportedly is gentle to soft products and offers increased efficiency and service life in environments containing dust and particulates. The chain features smooth surfaces and link interfaces for improved gentleness and minimum dust generation in product handling, minimizing dust intrusion to the conveyors.
Libra, Engent Team to Provide Advanced Manufacturing Solutions
(July 18, 2005) MENTOR, Ohio — Libra Industries (Libra) and Norcross, Ga.-based Engent, Inc. have formed a strategic alliance, allowing Libra to bring Engent's next-generation microelectronics and process development capabilities to market through its well-established sales and marketing channel.
Dage Celebrates SEMICON West Success
(July 15, 2005) FREMONT, Calif. — Dage Precision Industries, the industry leader in bond testing and digital x-ray technology, has successfully introduced the World's First High-Speed Bondtester, the Dage Series 4000HS at the SEMICON West 2005 show in San Francisco, California on July 12-14, 2005.
FocalSpot Debuts X-ray Inspection System in Europe
(July 15, 2005) SAN DIEGO — FocalSpot, Inc. has debuted its Verifier HR X-ray inspection system to the European market. The Verifier HR high-resolution X-ray system reportedly addresses a broad range of failure analysis and manufacturing/rework quality-assurance applications, providing fast, intuitive inspection of PCBs up to 400 x 457 mm.
Indium to Highlight Lead-free Materials at SMTA Shows
(July 13, 2005) UTICA, N.Y. — Indium Corp. of America will be exhibiting their lead-free electronic assembly materials at two SMTA shows — the West Penn show on August 5, 2005, in Pittsburgh, Pa., and the Capital show on September 7, 2005, at Johns Hopkins University in Laurel, Mass.
Machine Capability Testing Helps IPC-9850 Compliance
(July 13, 2005) HUDSON, N.H. — Machine capability analysis (MCA) testing helps pick-and-place equipment manufacturers and users comply with the new IPC-9850 performance standard, according to Michael Sivigny, CeTaQ Americas' general manager. MCA testing, a third-party, objective evaluation methodology, uses special vision algorithms, highly accurate glass plates and components for independently measuring Cp and Cpk indices on production equipment.
SMTA Finalizes International Conference Program
(July 12, 2005) MINNEAPOLIS — SMTA International, to be held September 25-29 in conjunction with the Assembly Technology Expo in Rosemont, Ill., will feature over 135 technical papers, 30 tutorials and workshops, an Emerging Technologies Summit, special symposiums on contract manufacturing and lead-free soldering technology and free daily events.
IPCWorks '05 to Call Las Vegas Home
(July 11, 2005) BANNOCKBURN, Ill. — This year's IPCWorks, including technical conference sessions, professional development courses, a designer certification program and standards development meetings will take place October 20-27, 2005, at a new venue in Las Vegas. This year's theme, "What's in Your Future?" will focus on lead-free, using materials declaration information to improve recycling, embedded technology and new materials.
Assembléon Nabs SMT Product of the Year Award
(July 8, 2005) PALO ALTO, Calif. — Frost & Sullivan recently awarded Assembléon with the 2005 SMT Product of the Year Award, recognizing Assembléon's A-series product line, which reportedly can place almost all components in a machine. The end-of-line A-series allows the user to scale up production without taking out the machine or adding new ones, and offers placement speeds up to 150,000 cph.
Flux Tool Facilitates Rework
(July 8, 2005) LONDONDERRY, N.H. — Cobar Solder Products' Flux Pen is a tool for applying different types of liquid flux to tiny chip components and individual solder joints. Its fine tip allows flux application in small areas in densely populated assemblies. It reportedly cuts down on waste, prevents over-fluxing, reduces possible cleaning time and prevents contamination.
IPC to Host Lead-free Legislation Webcasts
(July 8, 2005) BANNOCKBURN, Ill. — With the July 2006 deadline looming less than one year away to meet RoHS compliance, IPC —Association Connecting Electronics Industries is helping the industry to aid the transition in meeting these compliance requirements through a Webcast series.
ASYS Acquires Screen-printer Supplier EKRA
(July 7, 2005) BÖNNIGHEIM, Germany — To strengthen its market position, ASYS has acquired screen-printer supplier EKRA to include EKRA GmbH, EKRA Asia PTE Ltd. and EKRA America, Inc., effective July 1, 2005. EKRA will be integrated as a fifth business unit of ASYS Automatisierungssysteme GmbH. By adding to the existing ASYS screen-printer portfolio, ASYS aims to provide customers with integrated and innovative solutions.
ECD Now Shipping Thermal Profiler Software
(July 5, 2005) MILWAUKIE, Ore. — ECD has introduced profiling for oven recipes with its Xpert 3 AutoM.O.L.E. software, which works with the SuperM.O.L.E. Gold thermal profiler to automate convection reflow oven process development. Xpert3 distills recipe development into three steps: 1. Create signature; 2. Plan target and 3. Set and verify.
IPC's SPVC Determines Best Lead-free Solder
(July 5, 2005) BANNOCKBURN, Ill. — The IPC Solder Products Value Council (SPVC) has created a lead-free testing program to aid in the transition to lead-free by researching which solder is the ideal choice. For three years, the SPVC invested an equivalent of one million dollars in volunteer time, equipment and supplies to create "Final Report — Round-robin Testing and Analysis of Lead-free Solder Pastes with Alloys of Tin, Silver and Copper."
Smart Sonic Restructures with Company Split
(July 5, 2005) CANOGA PARK, Calif. — Effective July 1, 2005, Smart Sonic Corp. created a new company, Westlake Village, Calif.-based SMT Detergent Corp., that is responsible for the manufacture and sales of the 440-R SMT Detergent, a stencil cleaning chemistry that has been verified by the U.S. EPA's Environmental Technology Verification (ETV) Program for environmental safety, user safety and cleaning efficiency.
Geotest Names New Marketing Project Specialist
(July 1, 2005) IRVINE, Calif. — Geotest-Marvin Test Systems, Inc., an electronic test equipment supplier for aerospace, semiconductors, telecom, medical, industrial and military applications, has added Anthony Nardone to its marketing team as marketing project specialist.
Brush Ceramics Augments Manufacturing Capacity
(July 1, 2005) TUCSON, Ariz. — Brush Ceramic Products Inc., a wholly owned subsidiary of Brush Wellman Inc. and a customized beryllium oxide ceramics manufacturer, has increased manufacturing capacity in their Arizona facility to keep up with increasing product demand.
IPC Appoints New Board Member
(July 1, 2005) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries has appointed Shane Whiteside, senior vice president and COO of TTM Technologies, as the IPC Board of Directors' newest addition. He fills the empty spot left by Stan Gentry of Noble Industries, Ltd., who resigned in April 2005. Whiteside will complete the two-year term, covering calendar years 2005 and 2006.
OK International Appoints New President
(June 30, 2005) MENLO PARK, Calif. — OK International's (OK) vice president of engineering, Mark Cowell, has been promoted to president, succeeding Michael Gouldsmith, who will remain as chairman and will assist Cowell in various activities.
BP Microsystems Names New Australia, New Zealand Distributor
(June 30, 2005) HOUSTON — BP Microsystems has appointed Melbourne, Australia-based test and test automation solutions supplier Redback Test Services to represent its full line of device programmers throughout Australia and New Zealand. Redback aims to assist local PCB assembly by improving quality and throughput with the service of commercially available programming solutions tailored to customer requirements.
IPC Posts Book-to-Bill Ratios for May 2005
(June 30, 2005) BANNOCKBURN, Ill. — IPC's North American rigid-PCB industry book-to-bill ratio for May 2005 remained positive at 1.04, while the North American flexible-circuit book-to-bill ratio bounced back to near parity at 0.98. The combined rigid and flex book-to-bill ratio increased to 1.03, but is less relevant to analysts due to divergence between the rigid PCB and flexible-circuit industry segments in growth rates and book-to-bill patterns.