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3D Optical Inspection Provides ‘Eyes’ for Process Improvements in Industry 4.0
06/21/2019 | Jenny Yuh, Koh Young Technology, and Brent Fischthal, Koh Young America
What Electronics Companies Need to Know About Environmental Product Requirements
06/12/2019 | Kelly Scanlon, IPC Director of Environment, Health and Safety Policy and Research
Minimizing Voids in Solder Joints
06/07/2019 | Rehm Thermal Systems
Smart Factory Transitions Are Attainable—With a Plan
06/04/2019 | Nolan Johnson, I-Connect007
Whizz Systems on Knowing Your Strengths and Building Customer Relationships
05/24/2019 | Nolan Johnson, I-Connect007
Continuously Configurable Cell Meshes SMT, Microelectronics Manufacturing
(July 25, 2005) ELGIN, Ill. — Panasonic Factory Solutions Company announced the availability of its Integrated Process Assembly Cell (IPAC), a continuously configurable, modular platform that mixes high-volume SMT manufacturing with advanced microelectronics in one machine.
IPC, JEDEC to Host Upcoming Lead-free Conference
(July 25, 2005) BANNOCKBURN, Ill. — IPC – Association Connecting Electronics Industries and JEDEC – the Solid State Technology Association are slated to host the 9th International Conference on Lead-free Electronic Components and Assemblies August 17-19, 2005, in Singapore.
Heraeus CMD to Showcase Lead-free Solutions
(July 22, 2005) WEST CONSHOHOCKEN, Pa. — At the upcoming Assembly Technology Expo exhibition, to be held September 27-29 in Rosemont, Ill., Heraeus' Circuit Materials Division (CMD) will be focusing on its capabilities to help the semiconductor and SMT industries transition to lead-free assembly processes.
Indium, ACI to Present Hands-on Lead-free Seminar
(July 22, 2005) UTICA, N.Y. — Indium Corporation and the American Competitiveness Institute (ACI) have joined forces to present a lead-free training program. The seminar is slated for September 13-15, 2005, at the National Center of Excellence in Electronics Manufacturing Technology in Philadelphia.
Upcoming Seminar to Address PCB Miniaturization
(July 21, 2005) BANNOCKBURN, Ill. — The demand for smaller, thinner and lighter PCBs is becoming quite a challenge, and manufacturers are finding it a daunting task to meet current industry requirements. To help, a one-day seminar on September 22, 2005, in Schaumburg, Ill., sponsored by the IPC PCB Suppliers Council Steering Committee and hosted by Motorola, will bring the supply chain together to trade information on manufacturing the ever-shrinking circuit board.
AOI Standard Completed
(July 21, 2005) LOVELAND, Colo. — Members of the 7-32 Automated Inspections sub-committee of the IPC – Association Connecting Electronics Industries completed the final draft of the AOI Standards Document this week at a meeting in Loveland, Colo.
SMD Trimmers Comply with RoHS Directives
(July 21, 2005) SCHAUMBURG, Ill. — The RoHS-compliant G32 Series 3-mm, single-turn cermet trimmers from TOCOS are said to provide flexibility for circuit boards. They are available in both gold-plated J-hook and gull-wing terminal configurations, and their design meets the EIS, EIAJ, IPS and VRCI standard SMD footprint.
Dynatech Names New Central Regional Sales Manager
(July 21, 2005) HORSHAM, Pa. — Dynatech Technology, Inc., the North American distributor for Samsung Techwin SMT equipment, has appointed Joseph Cumbey as Central regional sales manager. To be based in the Dallas-Ft. Worth, Texas area, he will be responsible for Dynatech United States' manufacturers' representatives and customers in the Midwest, and for reps and customers in Eastern Mexico.
Arrow Expands Critical Environmental Data Online
(July 21, 2005) MELVILLE, N.Y. — Arrow Electronics, Inc. has expanded its Component Information Services, an online toolset that provides engineering, procurement and supply chain professionals with data to research and select electronic components that meet particular product design goals. The new enhancements provide a broader, richer data set for European Union (EU) environmental regulations (RoHS and WEEE) compliance.
Low CTE Die Attach Material Available
(July 20, 2005) IRVINE, Calif. — Henkel Electronics Group's Hysol QMI600 is a silica-filled, low-viscosity, non-conductive die attach paste that provides a low coefficient of thermal expansion (CTE) and high modulus to match existing mold compound properties, enabling wirebonds in same-size die stack packages to survive thermal cycling.
Hover-Davis Appoints New Distributor
(July 20, 2005) ROCHESTER, N.Y. — Hover-Davis Inc. recently has appointed Sincotron Finland Oy as its distributor for the areas of Finland and the Baltic States. Sincotron Finland distributes machines, material and services for manufacturing, and provides SMD placement, inspection, microelectronics, soldering, dispensing, screen printing, testing, software, profiling, tools and consumables services.
UIC Executive Appointment Strengthens Asian Presence
(July 19, 2005) BINGHAMTON, N.Y. — Effective June 27, 2005, Universal Instruments Corp. (UIC) appointed Eric Kan to vice president for Asia, aiming to extend their presence in the expanding Asian marketplace. Asia, particularly China, has been of high strategic importance to UIC's future growth strategy. This appointment will increase the level of local executive authority for the company in Asia, safeguarding and driving its future development.
Conveyor Provides Gentle Handling to Soft Products
(July 19, 2005) ALLENTOWN, Pa. — FlexLink's new conveyor chain reportedly is gentle to soft products and offers increased efficiency and service life in environments containing dust and particulates. The chain features smooth surfaces and link interfaces for improved gentleness and minimum dust generation in product handling, minimizing dust intrusion to the conveyors.
New Blog Creates Forum for Manufacturing, Assembly Issues
(July 18, 2005) FRANKLIN, Mass. — Speedline Technologies now hosts a new blog (
), where knowledge-in-process leaders from Speedline will comment on the top issues of semiconductor manufacturing and PCB assembly with insight, technical know-how, and personal observations.
Resistors with Visible Solder Fillets Facilitate Inspection
(July 18, 2005) PORTSMOUTH, R.I. — IMS' partial wrap termination resistors family offers an exposed solder fillet to facilitate visual inspection of the termination joint of the flip chip resistor. The flip chip resistor delivers high-frequency performance to 40 GHz. Ohmic values range from 10 Ω to 2 KΩ.
Libra, Engent Team to Provide Advanced Manufacturing Solutions
(July 18, 2005) MENTOR, Ohio — Libra Industries (Libra) and Norcross, Ga.-based Engent, Inc. have formed a strategic alliance, allowing Libra to bring Engent's next-generation microelectronics and process development capabilities to market through its well-established sales and marketing channel.
Dage Celebrates SEMICON West Success
(July 15, 2005) FREMONT, Calif. — Dage Precision Industries, the industry leader in bond testing and digital x-ray technology, has successfully introduced the World's First High-Speed Bondtester, the Dage Series 4000HS at the SEMICON West 2005 show in San Francisco, California on July 12-14, 2005.
FocalSpot Debuts X-ray Inspection System in Europe
(July 15, 2005) SAN DIEGO — FocalSpot, Inc. has debuted its Verifier HR X-ray inspection system to the European market. The Verifier HR high-resolution X-ray system reportedly addresses a broad range of failure analysis and manufacturing/rework quality-assurance applications, providing fast, intuitive inspection of PCBs up to 400 x 457 mm.
Indium to Highlight Lead-free Materials at SMTA Shows
(July 13, 2005) UTICA, N.Y. — Indium Corp. of America will be exhibiting their lead-free electronic assembly materials at two SMTA shows — the West Penn show on August 5, 2005, in Pittsburgh, Pa., and the Capital show on September 7, 2005, at Johns Hopkins University in Laurel, Mass.
Machine Capability Testing Helps IPC-9850 Compliance
(July 13, 2005) HUDSON, N.H. — Machine capability analysis (MCA) testing helps pick-and-place equipment manufacturers and users comply with the new IPC-9850 performance standard, according to Michael Sivigny, CeTaQ Americas' general manager. MCA testing, a third-party, objective evaluation methodology, uses special vision algorithms, highly accurate glass plates and components for independently measuring Cp and Cpk indices on production equipment.
SMTA Finalizes International Conference Program
(July 12, 2005) MINNEAPOLIS — SMTA International, to be held September 25-29 in conjunction with the Assembly Technology Expo in Rosemont, Ill., will feature over 135 technical papers, 30 tutorials and workshops, an Emerging Technologies Summit, special symposiums on contract manufacturing and lead-free soldering technology and free daily events.
IPCWorks '05 to Call Las Vegas Home
(July 11, 2005) BANNOCKBURN, Ill. — This year's IPCWorks, including technical conference sessions, professional development courses, a designer certification program and standards development meetings will take place October 20-27, 2005, at a new venue in Las Vegas. This year's theme, "What's in Your Future?" will focus on lead-free, using materials declaration information to improve recycling, embedded technology and new materials.
Power Resistors Withstand Harsh Conditions
(July 11, 2005) BOONE, N.C. — TT electronics' W20 Series wirewound enameled resistors are ideal for applications that require high surge capability. Lead-free vitreous enamel coating allows the resistors to withstand the harsh environments and high temperatures found in industrial applications.
Assembléon Nabs SMT Product of the Year Award
(July 8, 2005) PALO ALTO, Calif. — Frost & Sullivan recently awarded Assembléon with the 2005 SMT Product of the Year Award, recognizing Assembléon's A-series product line, which reportedly can place almost all components in a machine. The end-of-line A-series allows the user to scale up production without taking out the machine or adding new ones, and offers placement speeds up to 150,000 cph.
Flux Tool Facilitates Rework
(July 8, 2005) LONDONDERRY, N.H. — Cobar Solder Products' Flux Pen is a tool for applying different types of liquid flux to tiny chip components and individual solder joints. Its fine tip allows flux application in small areas in densely populated assemblies. It reportedly cuts down on waste, prevents over-fluxing, reduces possible cleaning time and prevents contamination.
IPC to Host Lead-free Legislation Webcasts
(July 8, 2005) BANNOCKBURN, Ill. — With the July 2006 deadline looming less than one year away to meet RoHS compliance, IPC —Association Connecting Electronics Industries is helping the industry to aid the transition in meeting these compliance requirements through a Webcast series.
ASYS Acquires Screen-printer Supplier EKRA
(July 7, 2005) BÖNNIGHEIM, Germany — To strengthen its market position, ASYS has acquired screen-printer supplier EKRA to include EKRA GmbH, EKRA Asia PTE Ltd. and EKRA America, Inc., effective July 1, 2005. EKRA will be integrated as a fifth business unit of ASYS Automatisierungssysteme GmbH. By adding to the existing ASYS screen-printer portfolio, ASYS aims to provide customers with integrated and innovative solutions.
ECD Now Shipping Thermal Profiler Software
(July 5, 2005) MILWAUKIE, Ore. — ECD has introduced profiling for oven recipes with its Xpert 3 AutoM.O.L.E. software, which works with the SuperM.O.L.E. Gold thermal profiler to automate convection reflow oven process development. Xpert3 distills recipe development into three steps: 1. Create signature; 2. Plan target and 3. Set and verify.
IPC's SPVC Determines Best Lead-free Solder
(July 5, 2005) BANNOCKBURN, Ill. — The IPC Solder Products Value Council (SPVC) has created a lead-free testing program to aid in the transition to lead-free by researching which solder is the ideal choice. For three years, the SPVC invested an equivalent of one million dollars in volunteer time, equipment and supplies to create "Final Report — Round-robin Testing and Analysis of Lead-free Solder Pastes with Alloys of Tin, Silver and Copper."
Smart Sonic Restructures with Company Split
(July 5, 2005) CANOGA PARK, Calif. — Effective July 1, 2005, Smart Sonic Corp. created a new company, Westlake Village, Calif.-based SMT Detergent Corp., that is responsible for the manufacture and sales of the 440-R SMT Detergent, a stencil cleaning chemistry that has been verified by the U.S. EPA's Environmental Technology Verification (ETV) Program for environmental safety, user safety and cleaning efficiency.
Geotest Names New Marketing Project Specialist
(July 1, 2005) IRVINE, Calif. — Geotest-Marvin Test Systems, Inc., an electronic test equipment supplier for aerospace, semiconductors, telecom, medical, industrial and military applications, has added Anthony Nardone to its marketing team as marketing project specialist.
Brush Ceramics Augments Manufacturing Capacity
(July 1, 2005) TUCSON, Ariz. — Brush Ceramic Products Inc., a wholly owned subsidiary of Brush Wellman Inc. and a customized beryllium oxide ceramics manufacturer, has increased manufacturing capacity in their Arizona facility to keep up with increasing product demand.
IPC Appoints New Board Member
(July 1, 2005) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries has appointed Shane Whiteside, senior vice president and COO of TTM Technologies, as the IPC Board of Directors' newest addition. He fills the empty spot left by Stan Gentry of Noble Industries, Ltd., who resigned in April 2005. Whiteside will complete the two-year term, covering calendar years 2005 and 2006.
OK International Appoints New President
(June 30, 2005) MENLO PARK, Calif. — OK International's (OK) vice president of engineering, Mark Cowell, has been promoted to president, succeeding Michael Gouldsmith, who will remain as chairman and will assist Cowell in various activities.
BP Microsystems Names New Australia, New Zealand Distributor
(June 30, 2005) HOUSTON — BP Microsystems has appointed Melbourne, Australia-based test and test automation solutions supplier Redback Test Services to represent its full line of device programmers throughout Australia and New Zealand. Redback aims to assist local PCB assembly by improving quality and throughput with the service of commercially available programming solutions tailored to customer requirements.
IPC Posts Book-to-Bill Ratios for May 2005
(June 30, 2005) BANNOCKBURN, Ill. — IPC's North American rigid-PCB industry book-to-bill ratio for May 2005 remained positive at 1.04, while the North American flexible-circuit book-to-bill ratio bounced back to near parity at 0.98. The combined rigid and flex book-to-bill ratio increased to 1.03, but is less relevant to analysts due to divergence between the rigid PCB and flexible-circuit industry segments in growth rates and book-to-bill patterns.
FEINFOCUS Wins Business Development Award
(June 29, 2005) STAMFORD, Conn. — FEINFOCUS, a COMET business unit, was recently awarded the prestigious Frost & Sullivan Award for Business Development Strategy Leadership, awarded since they have successfully created a competitive niche in their industry.
YESTech Opens Singapore Office to Support Growing AOI, X-ray
(June 29, 2005) SAN CLEMENTE, Calif. — YESTech has opened its Singapore office to provide sales, training and technical support to YESTech's growing Southeast Asia customer base. The office also will provide training and sales for the YTV Series AOI systems and YTX Series X-ray inspection systems.
ZESTRON Now Meets RoHS and WEEE Directives
(June 29, 2005) ASHBURN, Va. — ZESTRON is now fully prepared to meet the RoHS and WEEE guidelines. For over 15 years, ZESTRON has actively been avoiding the use of any hazardous or dangerous raw materials that could be deemed harmful, and ZESTRON's cleaning agents are free of all hazardous materials, including lead.
Elcoteq Opens Texas-based Engineering Service Center
(June 28, 2005) IRVING, Texas — Elcoteq Network Corporation, global EMS provider for the dommunications technology industry, has opened its Engineering Service Center (ESC) in Richardson, Texas. The ESC's mission is to provide an ongoing source of assembly and new product introduction (NPI) manufacturing support to strengthen its position in the market.
Lead-free Material Selection Guide Available
(June 28, 2005) FRANKLIN, N.H. — Polyclad Laminates, Inc., a business of Cookson Electronics, has published the Lead-free Material Selection Guide, providing comprehensive solutions for selecting lead-free-capable laminate base materials, while also defining a "best practice" methodology to determine selection criteria for lead-free or Sn/Pb assembly applications.
Multilayer Capacitors Offer Low ESR
(June 27, 2005) MYRTLE BEACH, S.C. — AVX Corp.'s SQ Series multilayer capacitor (MLC) chips are suited for RF/microwave applications that range from 10 MHz to 4.2 GHz. A fine-grained, high-density and high-purity dielectric material keeps moisture out and heavy internal palladium electrodes make them ideal for applications with high-current-carrying capabilities and high quality factors.
Teradyne's HPC Group Earns High PCB Manufacturing Scores
(June 27, 2005) NASHUA, N.H. — Nashua, N.H.-based Teradyne, Inc.'s Connection Systems Division announces that its High Performance Circuits (HPC) group has demonstrated competitive benchmark scores for PCB manufacturing capability, quality and relative reliability.
Indium Employee Earns SMTA Certification
(June 24, 2005) UTICA, N.Y. — Indium Corp. of America technical engineer Adrian Low is the ninth engineer at Indium to receive SMTA certification. To receive SMTA certification, participants must have several years of SMT experience, as well as having completed educational requirements in a technical discipline. The course includes a series of workshops and concludes with two days of competitive testing.
Device Tester Offers Small Footprint
(June 24, 2005) CANTON, Mass. — Designed for testing microelectronic devices, MEMS, photonics and other small components, the 5848 MicroTester from Instron provides precise load and displacement measurement capabilities for semiconductor die shear and pull tests, tensile testing of fine wires and fibers, flex testing of circuit boards and substrates and peel tests of thin films and substrates.
Vectorless Test Tool Available
(June 23, 2005) NORTH READING, Mass. — Teradyne Assembly Test Division's FrameScan FX advanced vectorless test tool detects open pins on components and connectors assembled onto PCBs. It uses an enhanced in-circuit capacitive coupling technique that tests for open pins by applying an AC signal to an un-powered PCB node, and measures the voltage coupled to a plate positioned in close proximity to the component or connector being tested.
HCM Chooses Universal Placement Platform
(June 23, 2005) SALISBURY, Md. — Salisbury, Md.-based Harvard Custom Manufacturing, Inc. (HCM) has selected Universal Instruments' AdVantis placement platform for its high-mix manufacturing requirements. HCM already has installed one complete AdVantis line, with another scheduled for final installation this summer.
Industry Icon Passes Away
(June 22, 2005) ATLANTA — Ron Daniels, Circuitnet editor and principal consultant at ITM Consulting, died suddenly at home during the night of Sunday, June 5, 2005. An industry icon with knowledge and expertise spanning circuit boards, hybrid modules and semiconductor packages, Daniels started 35 years ago at Westinghouse Defense Systems Center in engineering positions, moving on to Atlanta, Ga.-based Proto Systems as the director of quality.
Soldering Materials Ideal for Lead and Lead-free
(June 22, 2005) IRVINE, Calif. — Now available from Henkel Corp., Multicore TTC-LF allows soldering irons to be re-tinned when conventional methods such as sponges, pads or rosin-cored solder wire are not effective. Applicable for both lead and lead-free applications, TTC-LF is a lead-free-grade solder powder and flux formed into the shape of a thick disk for cleaning and de-wetting soldering irons.
Electronic Evolution to Set Up Facility in Mexico
(June 21, 2005) RENO, Nev. — Circuit board assembly manufacturer Electronic Evolution Technologies, Inc. (EET) has signed an agreement for providing outsourced manufacturing support in Mexico by the Tucson, Ariz.-based Offshore Group. EET will occupy 17,000 sq. ft. at the Group's Bellavista Industrial Park, and will eventually employ between 50 to 100 direct-labor workers.
DEK to Showcase Mass Imaging Solutions at SEMICON West
(June 21, 2005) FLEMINGTON, N.J. — DEK will exhibit their mass imaging solutions for semiconductor packaging at SEMICON West 2005, to be held July 12-14, 2005, in San Francisco, Calif. A demonstration of the company's backside wafer coating process, which allows high throughput on a cost-effective mass imaging system, and is capable of exceeding the ±12.5 µm Total Thickness Variation (TTV), will be shown on DEK's Micron-class Galaxy printer platform.
COMET Names X-ray Solutions Business Manager
(June 21, 2005) STAMFORD, Conn. — COMET North America has appointed Jeremy Simon as business manager of the COMET X-ray Solutions division for the Americas. Based out of COMET's newly expanded headquarters in Stamford, Conn., Simon is responsible for key account management, strategic development and customer support in the X-ray solutions business.
Free Webinar to Target Fine-pitch Printing
(June 20, 2005) FRANKLIN, Mass. — As technology continues to move toward smaller components such as 0201 chips, chip scale packages and micro BGAS, it is becoming crucial to meet fine-pitch requirements. To aid the transition, SMT manufacturing experts from Speedline Technologies will address these issues in a free, live Webinar, titled "Fine-pitch Printing," on Thursday, July 21, 2005, from 11:00 a.m. to noon EST.
Next-gen Barcode Software Intros
(June 20, 2005) STOCKHOLM, Sweden — MYDATA automation AB released MYLabel 3.0, the latest version of its barcode and inventory management software. Designed to track individual reel, stick or trays used in SMT production lines, MYLabel stores vital production data, such as tape pitch, orientation, batch code and quantity in a central database.
IPC SMEMA Listserv Facilitates Networking
(June 20, 2005) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries introduced the IPC SMEMA Executive Listserv, offering Surface Mount Equipment Manufacturers Association members an e-mail forum for global networking. The forum allows members to share information, opinions and solutions to common challenges.
Lean Manufacturing Systems Streamline Workspace
(June 17, 2005) WARSAW, N.Y. — Unidex introduced its integrated Lean Manufacturing Assembly Systems, which provide material handling consultation, systems integration design and equipment manufacture of lean manufacturing systems.
DesignAdvance Systems Joins Interoperability Program
(June 17, 2005) PITTSBURGH — DesignAdvance Systems has joined the Cadence Connection program of Cadence Design Systems, which promotes open interoperability between Cadence technologies and other companies' design tools. DesignAdvance's CircuitSpace software integrates with the Allegro PCB Editor, offering interactive PCB component placement to reduce time-to-design.
MVR International Launches RoHS Resource Website
(June 16, 2005) TAMARAC, Fla. — Fla.-based MVR International Inc., an electronic components distributor, has launched
, a Website dedicated to the RoHS Directive and other emerging environmental laws.
Indium to Show Semiconductor Solutions at SEMICON West
(June 16, 2005) UTICA, N.Y. — Indium Corp. of America will be exhibiting their latest semiconductor- and power-semiconductor-based products at the SEMICON West exposition, to be held July 12-14 in San Francisco, Calif., focusing on semiconductor, power semiconductor and specialty solder materials, including their reworkable lead-free no-flow underfill.
Integrated Drive Boosts RF Design, Manufacturing
(June 16, 2005) STAMFORD, Conn. — COMET North America's Integrated Drive is said to precisely align capacitors, motors and couplers for high-precision RF "match-box" network design, eliminating the need to source and integrate components from multiple suppliers.
NEDA Industry Summit Draws Attendee Interest
(June 15, 2005) ATLANTA — On June 9th, representatives from more than 80 companies met in Chicago for the NEDA Industry Summit: Negotiating the Economic, Legal and Logistic Challenges of RoHS and Lead Free Compliance, following up to the one held in January 2005 to keep the industry informed of important issues.
Siemens EA Appoints National Service Manager
(June 14, 2005) NORCROSS, Ga. — Siemens Logistics and Assembly Systems, Inc.'s Electronics Assembly Systems Division (EA) has promoted Nick Bruck to its national service manager for the Americas position, replacing Ryan Bymaster, who has taken a position in Siplace Product Management and will be relocating to Munich, Germany.
Zero-defect Software Eases Placement Machine Setup
(June 14, 2005) EINDHOVEN, The Netherlands — A new version of Assembleon's zero-defect set-up assistance software, SVS-Pro 3.1, is said to further simplify its SMD placement machine setup, particularly in applications where the production line is configured to process smaller production batches.
End-to-end Transfer Conveyor Available
(June 13, 2005) KENOSHA, Wis. — PROMATION, Inc.'s ASC-700 end-to-end transfer conveyor is available in 500- and 800-mm lengths to meet most interconnecting requirements. A retractable hand crank for width adjustment allows this conveyor to handle PCBs from 50- to 450-mm wide.
A Look at the High-speed Interconnect Market
(June 13, 2005) NASHUA, N.H. — The high-speed interconnect market continues to heat up in Asia, notes a recent joint executive briefing meeting of Quantum Performance Group and BPA. Japan's flexible circuit makers can produce a 25-µm line and space single-sided flexible circuitry with a yield of more than 80%, with the majority of these targeting chip-on-flex (COF) applications. By Michelle M. Boisvert
IPC Unveils New Supplier Declaration Standards
(June 13, 2005) BANNOCKBURN, Ill. — For over a year now, global efforts by IPC, iNEMI and RosettaNet have been underway to simplify and standardize how the industry collects, tracks and discloses product material content information. From these efforts has come a family of supplier declaration standards.
DEK Steps Up Production, Expands Capacity to Meet Demand
(June 10, 2005) FLEMINGTON, N.J. — Over the last 18 months, demand for DEK's mass-imaging line has reportedly continued to rise dramatically, together with manufacturing capacity and productivity. Anticipating future market and customer needs, DEK has been able to quickly expand its capacity and enhance its productivity.
New RoHS Manual Gets Down to Details
(June 10, 2005) CHICAGO — Newark InOne, a subsidiary of global Premier Farnell plc, now offers a downloadable RoHS Legislation and Technical Manual on its
Website, which was launched in May 2005 to provide design engineer and component buyers with a continuously updated, in-depth source of RoHS-related information and news.
Libra Industries Commemorates 25 Years
(June 9, 2005) MENTOR, Ohio — What began as a one-man company 25 years ago has grown to employ over 150 people in two Ohio-based manufacturing plants. Libra Industries started in 1980 as a distributor for industrial diamond-cutting tools. At the time, Rod Howell, president, noticed a trend toward outsourcing PCBAs from the local market. Howell concentrated on the EMS industry, becoming the first ISO-certified EMS provider in Ohio.
SMTA International to Present Lead-free Compliance Panel
(June 9, 2005) NASHUA, N.H. — At the annual SMTA International conference to be held September 25-29, 2005, in Rosemont, Ill., a free panel discussion, titled "Lead-free Compliance: Crisis or No Crisis? Everything You Need to Know," will be held on Wednesday, September 28th, from 10:00 - 11:30 a.m.
Inductors Offer COTS Alternative to Mil Spec Products
(June 8, 2005) GOWANDA, N.Y. — Gowanda Electronics introduced the SMRF 1010, a series of surface mount RF inductors said to provide a cost-effective solution to Mil Spec (military specification) products. The SMRF 1010 COTS inductors are designed for applications in military communications, as well as crystal oscillators and wireless networks that used Mil Spec products traditionally.
Aegis Chosen for Plant Development Operations
(June 8, 2005) PHILADELPHIA — Aegis Industrial Software is helping transition four separate facilities of Hamilton-Sundstrand into one high-tech facility in Puerto Rico. Aegis will provide all the software for new product introductions (NPI) and complete MES requirements.
Smart Labels Conference Covers RFID Market
(June 8, 2005) BALTIMORE — The 4th annual Smart Labels USA conference on June 27 through 30, 2005, in Baltimore, Md., will feature the latest on RFID smart label technology. Hosted by IDTechEx and Labels & Labeling, conference attendees will gain knowledge from early RFID adopters using RF tagging in several markets, as well learn how to manufacture RFID smart labels, integrate RFID systems into label and packaging processes and implement RFID systems using case studies.
VJ Electronix Names Product and Applications Leader
(June 7, 2005) SHIRLEY, Mass. — VJ Electronix, Inc. has recently appointed Al Cabral to lead Product Management and Applications, where he will be responsible for developing new applications and products that meet and exceed global industry demands. He will report directly to Don Naugler, general manager.
Vitronics Soltec Revamps Website as Soldering Resource
(June 7, 2005) OOSTERHOUT, The Netherlands — Vitronics Soltec has re-launched its Website (
) to include a new design and resources with interactive features for soldering knowledge in electronics manufacturing.
CSA Acquires Innovative Test Solutions
(June 6, 2005) ST. LOUIS — Customer Service Associates (CSA), Agilent Technologies' strategic sales and support partner for electronics manufacturing test in the U.S. and Canada has acquired Innovative Test Solutions (ITS) of Colorado.
Linear-motion Miniature Slides Offer Compact Solution
(June 6, 2005) BETHLEHEM, Pa. — SKF Motion Technologies' Type LZM miniature slides are well-suited for linear-motion applications that require short strokes and minimal space for system components. Available in four basic sizes (7, 9, 12 and 15) with widths from 17 to 32 mm and lengths from 26 to 165 mm, their stainless-steel composition resists corrosion.
Dr. Jennie Hwang to Lead Six-part Lead-free Series
(June 6, 2005) SAN JOSE, Calif. — Covering the assembly line from preparation to production to reliability, Dr. Jennie Hwang will present a series of lead-free courses from June 27 through June 29, 2005, in San Jose, Calif.
OK International Names Individual to Head Lead-free Initiatives
(June 3, 2005) MENLO PARK, Calif. — OK International announces that Paul Brackell is their new global product manager for conduction soldering and array package rework. Having initiated a worldwide program to support conduction and convection soldering and rework equipment users, Brackell heads an international team that consists of two market development managers, a product support manager for conduction and convection soldering products and an application engineering specialist.
Slide Switches Conserve Board Space
(June 3, 2005) TORRANCE, Calif. — Copal Electronics' CAS series slide switches allow designers to replace jumper-pin and wire arrangements with a compact, surface mount switch. Measuring 5.4 x 2.5 x 2.5 mm for the SPDT configuration, DPDT and dual-SPDT versions are also available.
Cookson SCS Materials and Services Become RoHS-compliant
(June 2, 2005) INDIANAPOLIS — Specialty Coating Systems (SCS), a business of Cookson Electronics, announces that their Parylene conformal coating services and raw materials, or SCS Parylene dimers, are now RoHS-compliant.
Lead-free Products Portfolio Now Available
(June 2, 2005) FLEMINGTON, N.J. — DEK's new lead-free products and services offering, titled DEK Lead-Free, focuses on maximizing productivity and process capability for customers who screen-print with lead-free solder pastes. Products within the brand include stencils optimized for lead-free solder paste behavior, specially designed squeegees and cleaning materials, lead-free stencil storage, and a dedicated lead-free Printer Caddy.
TXP Expands Opto-electronics Testing Capabilities
(June 1, 2005) RICHARDSON, Texas — Texas Prototypes, Inc. (TXP) announces that its Photonics Division has expanded its opto-electronics testing capabilities to include long-haul/metro/access optical test-bed systems, 40-Gb error-rate test systems, TOSA and ROSA accelerated aging systems, temperature-cycling and thermal-shock chambers, among others.
Dielectric Capacitors Perform in Harsh Environments
(June 1, 2005) MYRTLE BEACH, S.C. — Featuring fused monolithic construction, AVX Corp.'s CYR10 and CYR15 multilayer glass dielectric capacitors provide a high-Q factor and low dissipation that varies little with frequency and temperature excursions.
Fabrinet Acquires Three JDS Uniphase Plants
(June 1, 2005) SAN FRANCISCO — Fabrinet has recently closed its acquisition of three JDS Uniphase manufacturing sites in Mountain Lakes and Ewing, N.J., and Fuzhou, China. This acquisition serves to strengthen Fabrinet's position in the Chinese market with an approximately 225,000-sq.-ft. manufacturing center, as well as enhances its engineering and manufacturing technology base.
OK International to Implement Single-brand Strategy
(June 1, 2005) MENLO PARK, Calif. — OK International plans to consolidate its Metcal, Techcon Systems and Impell product lines under the single OK International corporate brand, spurring workbench-focused new product research and development programs and higher levels of localized application support.
Celestica Names New President for Europe
(May 31, 2005) TORONTO, Ontario, Canada — Celestica has recently appointed James Rowan to president for Celestica Europe. He will be responsible for heading up Celestica's European operations and ensuring that these operations are strategically aligned to meet their OEM customers' changing needs.
OSP Process Ideal for Mixed-metals
(May 31, 2005) WEST HAVEN, Conn. — The ENTEK PLUS HT organic solderability preservative (OSP) process from Enthone, Inc., a business of Cookson Electronics, maintains solderability through nine lead-free reflows, delivering high-reliability BGA solder-joint strengths. It maintains eutectic process capability for mixed metal processing, such as electroless nickel immersion gold (ENIG).
Reputable Placement Equipment Captures Market Share
(May 31, 2005) BINGHAMTON, N.Y. — Universal Instruments has achieved four consecutive quarters of market-share gain in the combined chip-placement sector, according to proprietary figures recently released by an industry market-monitoring organization. Universal's secured market share is due to their high-speed chip placement platform products, having doubled since mid-2004.
Micro Borescopes Offer Video and Digital Capabilities
(May 27, 2005) TREVOSE, Pa. — A series of Micro Borescopes from Lenox Instrument Company, Inc. feature a focusing eyepiece and fiberoptic bundle for hi-resolution viewing of electronic components, medical devices and cast and machine parts, as well as security and covert applications with limited access and a small footprint.
IPC Releases Book-to-Bill Ratios for April 2005
(May 27, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries announces April 2005's findings from its monthly PCB Statistical Program. The North American rigid PCB industry book-to-bill ratio remained positive at 1.03, while the flexible circuit book-to-bill ratio fell to 0.87. The combined (rigid and flex) industry book-to-bill ratio dropped to 1.00.
In-circuit Tester Verifies PCBA Quality
(May 25, 2005) PALO ALTO, Calif. — Agilent Technologies' Medalist i5000 in-circuit tester (ICT) provides test functionality in modular, scalable configurations, allowing operational flexibility for electronic manufacturers looking to verify PCBA quality. The tester is claimed to reduce typical bits-to-production cycle time to five to seven days for a medium-complexity PCBA.
Indium's Dr. Lee to Present at ECTC and IPC Soldertec
(May 25, 2005) UTICA, N.Y. — Indium Corp. of America's Dr. Ning-Cheng Lee, vice president of technology, will present at two upcoming conferences — the Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Fla., to be held May 31, 2005, and IPC Soldertec in Barcelona, Spain, to be held June 7-10, 2005.
Lead-free Solder Paste Reduces Voiding Defects
(May 24, 2005) CITY of INDUSTRY, Calif. — The Multicore WS300 lead-free solder paste from Henkel Technologies offers print definition with long open and abandon time capabilities. The paste resists humidity and slump and can reduce voiding defects. Other benefits include a lack of visible PCB residue for three days after reflow and slump resistance. Available in lead-free alloys 96SC (SAC387) and 97SC (SAC305), the pastes target fine-pitch, high-speed printing applications.
Manz Automation Expands in Response to Growth
(May 24, 2005) NORTH KINGSTOWN, R.I. — Manz Automation AG has moved its manufacturing and engineering operations to a new, 65,000-sq.-ft. facility in Reutlingen, Germany, to provide increased production and administrative capabilities and more room for an additional 80 employees.
Henkel Promotes Semiconductor Materials Specialist
(May 23, 2005) CITY of INDUSTRY, Calif. — Henkel's electronics group has promoted Nigel Hackett to global director of business development for its semiconductor packaging product range. Having been with Henkel for five years, and with Dexter for 15 years prior to its acquisition by Henkel, Hackett will be strategically responsible for identifying, implementing and integrating new development initiatives within the global semiconductor business.
New RF Connectors Address SMT Applications
(May 23, 2005) NEW ALBANY, Ind. — Samtec has added three new RF connector series to its standard product line. The MMCX Series micro-mini connectors are available as jacks and plugs and with a choice of thru-hole, surface mount and edge-mount terminations. For board-stacking applications, the thru-hole option is also offered in a ganged variation for terminating two, four, six or eight connectors to the board simultaneously.
AIM Appoints New Sales Manager for Mexico
(May 23, 2005) CRANSTON, R.I. — AIM has recently named Sergio Medrano as its new sales manager for Mexico, and he will be based out of AIM's Cd. Juarez, Mexico production facility. His responsibilities will include managing the sales efforts for AIM's full line of solder assembly materials throughout Mexico, excluding the Baja territory.
TURI To Host Lead-free Implementation Workshop
(May 20, 2005) LOWELL, Mass. — To help companies better prepare for the July 1 RoHS deadline, the Massachusetts Toxics Use Reduction Institute (TURI) will host "Implementing Lead-free Electronics," on May 26, 2005, from 8:00 a.m. to 2:30 p.m., at General Dynamics in Taunton, Mass.
New Machine-control Software Version Available
(May 20, 2005) STOCKHOLM, Sweden — MYDATA automation AB's new machine-control software, TPSys 2.4.3., is its newest version of TPSys, the company's Linux-based machine control software designed for high-mix production. New features in version 2.4.3 include faster assembly speed and a new, patent-pending calibration method.
EMI Validates Lead-free Assembly Processes
(May 20, 2005) SANTA ANA, Calif. — Express Manufacturing Inc.'s (EMI) SMT assembly processes recently were evaluated and proven to meet all IPC 610 rev. D section 5 requirements for lead-free workmanship standards by CE Analytics, an independent analytical lab of Cookson Electronics.
EMA Design Automation, PartMiner Join Forces
(May 20, 2005) ROCHESTER, N.Y. — EMA Design Automation and PartMiner, Inc. have joined forces to bring together Cadence Design tools and PartMiner's CAPS electronic component database.
Vishay Completes Siliconix Merger Transaction
(May 18, 2005) MALVERN, Pa. — Vishay Intertechnology, Inc. has effected a merger with Siliconix Inc., as a result of which Siliconix has become a wholly owned subsidiary of Vishay. In the merger, each share of Siliconix stock, other than the shares owned by Vishay and its subsidiaries, was converted into 3.075 Vishay shares, subject to the rights of Siliconix's remaining stockholders to seek appraisal under Delaware law. Cash was paid in lieu of Vishay fractional shares.
Digi-Key, Renesas Sign Distribution Agreement
(May 18, 2005) THIEF RIVER FALLS, Minn. — Digi-Key Corp. and Renesas Technology America, Inc. have signed a distribution partnership agreement to carry Renesas' semiconductor products, giving Digi-Key customers access to advanced Renesas solutions for embedded systems. System LSI products, such as microcontrollers (MCUs), microprocessors (MPUs), development kits and development software, are the initial inclusions.
Tin Whiskers Workshop Presents Latest Findings
(May 18, 2005) HERNDON, Va. — iNEMI will conduct a tin whiskers workshop on May 31, 2005, as part of IEEE's Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Fla.
IPC/APEX Survey Reports Attendee Interest
(May 17, 2005) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries released survey results from the 2005 IPC Printed Circuits Expo, APEX, Designers Summit and ECWC 10. Based on responses from 640 attendees, the report shows that 74% had a "high interest" in electronics assembly, manufacturing and test; 47% in bare boards; and 25% in design. Interest in bare boards has grown 20% over 2004 attendee responses, claims IPC.
AOI and X-ray Systems Hit Chinese Market
(May 17, 2005) SAN CLEMENTE, Calif. YESTech introduced a line of automated inspection solutions, including the inline YTV 2050 automated optical inspection system, YTV 1000 benchtop AOI system and the YTX-3000 high-res X-ray inspection system at NEPCON China in Shanghai last month.
Dispensing System Slated for SEMICON Release
(May 16, 2005) FRANKLIN, Mass. — Speedline Technologies will exhibit the XyflexPro+ Dispensing System at SEMICON West 2005 in San Francisco, Calif., July 12-15. The system features advanced composite gantry design structure and a linear drive system that uses motion-control drive technology.
KIC Expands Solder Paste Library
(May 16, 2005) SAN DIEGO, Calif. — KIC has expanded its solder paste process windows library within its KIC 2000 software to 788, which includes reflow and cure specs, and new lead-free solder paste process windows. Scheduled to be updated with new pastes on a quarterly basis, the library is available for download to KIC 2000 platform users at
free of charge.
Tombstoning Reduction Via Phased-reflow Soldering
A drop-in replacement for standard lead alloys, whereby a small amount of Sn62 wets both sides of the termination before the Sn63 melting point is reached. The lower melting point on sn62 tack solders parts to the board and virtually eliminates this common defect.
Summit Unveils New 100% Tin Reflow Process
(May 13, 2005) THOMASTON, Conn. — Summit Corp. of America is providing lead-free plating of strip and wire for connectors, lead frames, and electronic devices for the telecommunications, appliance, automotive, computer, semiconductor, and electronics industries, employing its Reflow Metallization process developed in-house. The company can also plate any metal or combination of metals in continuous strips, while meeting the lead-free legislation international standards.
Alcohol-based Liquid Flux Ideal for Lead-free
(May 13, 2005) DES PLAINES, Ill. — The 959T alcohol-based, no-clean liquid flux for lead-free wave soldering applications is now available from Kester, and is also backward-compatible with tin/lead wave soldering operations.
Asymtek Signs OSTEC Enterprise to Distributor Network
(May 13, 2005) CARLSBAD, Calif. — Asymtek has recently signed Moscow, Russia-based OSTEC Enterprise Ltd., a sales representatives team, to market their automated fluid dispensing systems in Russia, Belarus, Ukraine and Kazakhstan.
Libra Industries, SMT Hong Kong Sign Agreement
(May 12, 2005) MENTOR, Ohio — Libra Industries has signed an agreement with SMT Hong Kong, calling for Libra to act as a North American distributor and sales representative of SMT Hong Kong's China-based electronics manufacturing services.
Hover-Davis, Cogiscan Form RFID Smart Feeder Partnership
(May 12, 2005) ROCHESTER, N.Y. and BROMONT, Quebec, Canada — Hover-Davis and Cogiscan announce that through their long-term strategic partnership, they are introducing a new generation of smart feeders. The feeders are said to enable customers to perform machine setup validation for feeders and components; eliminate human errors and reduce changeover time; track feeders and components on and off placement machines; and enable inventory control and traceability in real-time.
Jurong High Tech Employs Thermal Process Management
(May 11, 2005) SAN DIEGO, Calif. — Singapore-based EMS provider Jurong High Tech has implemented KIC's thermal process tool line in hopes to exceed customer requests for lead-free manufacturing and full thermal process traceability.
Tape Feeders Compatible with Siplace Machines
(May 11, 2005) ROCHESTER, N.Y. — Hover-Davis, Inc. has released a series of Siemens Siplace-compatible tape feeders with 12/16-, 24/32-, 44- and 56-mm feeder ranges. Each feeder is compatible with Siemens' Siplace placement machines and touts a reversible index drive and capabilities aimed at reducing changeover time.
IPC Technical Conference Call for Papers Open
(May 11, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries is officially announcing its call for papers for its IPCWorks 2005 technical conference, to be held October 27, 2005, in Las Vegas, Nev. The theme this year is, "What's in Your Future?" and conference topics will center around lead-free, using materials declaration information to improve recycling, embedded technology and materials.
Valor Notes 22% Revenue Increase for First Quarter
(May 10, 2005) YAVNE, Israel — Marking continued growth for the first quarter of 2005, Valor Computerized Systems exceeded its expectations with a 22% increase in revenues compared to the same quarter last year. Sales increased by 27% and maintenance revenues rose by 13% in the first quarter of 2005, reports the company.
DEK Appoints New Americas General Manager
(May 10, 2005) FLEMINGTON, N.J. — DEK has recently appointed Neil MacRaild to the position of Americas general manager. Having already served in various roles in his previous ten years at DEK, he most recently was the Americas general manager for DEK's line of recurring revenue products, which includes stencils, screens, tooling and consumables.
COMET Marks 40th Anniversary in Vacuum Capacitors
(May 10, 2005) FLAMATT, Switzerland — COMET, an X-ray, RF and Dosimetry solutions supplier, is celebrating 40 years in vacuum capacitors, serving the vacuum-capacitor market from its global headquarters in Flamatt, Switzerland, since 1965.
Cobar BV Achieves ISO/TS 16949 Certification
(May 10, 2005) BREDA, The Netherlands — Cobar BV, a global supplier of fluxes, solder pastes and soldering materials, announces that the company has been certified to ISO/TS 16949, a milestone important to the company's automotive electronics manufacturers.
Via Plating Solution Cuts Time-to-Market
(May 9, 2005) GARBSEN, Germany — The ProConduct via plating system from LPKF Laser & Electronics plates PCB thru-holes without chemical plating baths. Using conductive polymer paste, the system plates vias from 0.4 mm for double-sided and multilayer boards.
Lead-free Pastes Combat Voids
(May 9, 2005) TOKYO, Japan — Nihon Almit Co. has introduced two lead-free solder pastes aimed at eliminating voids. Manufactured according to IPC TM-650 and IPC J-STD 005 standards, the pastes are available in Ag3.0/Cu0.5, Ag3.9/Cu0.6 and Ag3.5/Cu0.7 chemistries.
Partnership Targets Mexican Market
(May 9, 2005) CLACTON-ON-SEA, U.K. — Pickering Interfaces has appointed LogicBus as its distribution partner in Mexico to serve existing electronics manufacturing sites, as well as companies moving into the region. LogicBus will provide sales and service representation for the company's entire product line.
New Machine Design Components Catalog Available
(May 6, 2005) CHICAGO — Industrial Motion Control LLC (IMC) has published a comprehensive, 260-page color catalog, featuring more than 1,000 products under its Camco and Ferguson brands, including index drives, overload clutches, parts handlers, walking beam drives, precision link conveyors, servo-mechanical drives and accessories.
Indium's Dr. Lasky to Present Lead-free Assembly Workshops
(May 6, 2005) CLINTON, N.Y. — Ronald C. Lasky, Ph.D., Indium Corp. of America's senior technologist, is slated to present two IPC Professional Development Seminars, or workshops, this summer. His workshop, "Best Practices in Implementing Pb-Free Assembly," has been well-received throughout the world, having presented it throughout Europe, Asia and the U.S. Two upcoming dates for his workshop are June 13 in Toronto, Ontario, Canada, and June 15 in Boston, Mass.
Heraeus Acquires Ultra-fine-pitch Solder-powder Technology
(May 6, 2005) WEST CONSHOHOCKEN, Pa. — Heraeus' Circuit Materials Division has acquired the ultra-fine-pitch solder powder technology and business from Potsdam, Germany-based Welco GmbH. With this acquisition, Heraeus is continuing to offer special high-quality materials for the joining technology in the semiconductor and SMT industries.
Private Equity Provider Acquires FlexLink AB
(May 5, 2005) GÖTEBERG, Sweden — FlexLink AB has been acquired by ABN AMRO Capital, a private equity provider in Europe. FlexLink was acquired by a management buy-out from EQT, a private equity funds group that had originally acquired a 90% interest in FlexLink from AB SKF in 1997.
iNEMI Members Back RoHS Parts Numbering
(May 5, 2005) HERNDON, Va. — iNEMI, the International Electronics Manufacturing Initiative, announced that most of its OEM and EMS members support the use of unique part numbers for RoHS-compliant components. The consortium took the position that demonstrating and certifying compliance will be complicated further by the industry's design and manufacturing supply chains, as well as the incompatibility between current tin/lead and RoHS-compliant lead-free manufacturing processes.
Advanced Manufacturing Solutions on Display at NEPCON East
(May 5, 2005) BOSTON, Mass. — Concord, Calif.-based Digitaltest is exhibiting their latest advanced manufacturing solutions at the NEPCON East exhibition, currently being held May 4-5 in Boston, Mass., at booth #3043. Along with these solutions, Digitaltest offers a worldwide field service, parts service, applications support and training network.
Guide to Help OEMs Needing an EMS Provider Available
(May 3, 2005) BANNOCKBURN, Ill. — As a way of helping OEMs with their strategic outsourcing decisions, IPC—Association Connecting Electronics Industries is offering a "how-to" guide, titled, "How to Begin the Process of Selecting an EMS Provider."
Enthone Opens Shanghai Technical Service Centre
(May 3, 2005) KOWLOON, Hong Kong — Enthone Inc., a business of Cookson Electronics, has opened its Technical Service Centre in Shanghai, China, with the plan to reinforce and accelerate its existing market presence throughout China. Also, the Centre hopes to enhance the Company's overall capabilities to provide immediate technical support, applications engineering, analytical services, sales and product warehousing throughout Northern China.
Certification Label Introduced for Machine Performance Verification
(May 3, 2005) HUDSON, N.H. — CeTaQ Americas has introduced a new label certification system to verify machine performance specifications. The new labels will be affixed to every machine that undergoes CeTaQ's Machine Capability Analysis (MCA) testing.
Kimball Electronics to Purchase Aegis Software Modules
(May 2, 2005) PHILADELPHIA — Kimball Electronics Group, an EMS company with divisions worldwide, will procure Aegis NPI and MES software modules for all of its divisions, with the goal of integrating all operations at their headquarters in Jasper, Indiana. Another goal is to expand the software interface to their divisions worldwide, creating a seamless, Web-centric platform for all operations control, programming and data interface.
Cookson, Speedline Partner on Lead-free 'Checklist'
(April 29, 2005) JERSEY CITY, N.J. — Cookson Electronics Assembly Materials Group and Speedline Technologies are collaborating on the development of a comprehensive "Lead-free Implementation Checklist" to assist electronic assemblers in gearing up for the lead-free transition. The list provides important details that should be confirmed for assembly equipment, materials, shop-floor segregation, training of personnel, process validation, process refinement and yield enhancement.
Dual-axis Averager Ideal for Rotary Applications
(April 29, 2005) NATICK, Mass. — MicroE Systems' Mercury 3000Si dual-axis averager is comprised of two 8.4-mm-tall, high-performance Mercury encoder sensors, a SmartSignal dual-interpolator module and a rotary glass scale. The system eliminates eccentricity errors through an advanced signal-averaging algorithm. Processing and programmable interpolation to x1024 occur within the unit's FPGA.
IPC Releases March 2005 Book-to-Bill Ratio, Business Report
(April 29, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries announces the March 2005 findings from its monthly PCB Statistical Program. The North American rigid PCB industry book-to-bill ratio for March 2005 continued at 1.04, while the flexible-circuit ratio fell to 1.07. These ratios are based on monthly data collected from PCB producers that participate in the PCB Statistical Program. The combined industry book-to-bill ratio in March 2005 was 1.05.
Premier Acquires New Semiconductor Test Operations
(April 28, 2005) TEMPE, Ariz. — Premier Semiconductor Services, LLC/LP has acquired Cirrus Logic's Austin, Texas-based semiconductor test operation, where Cirrus Logic's employees will become Premier employees and form the basis for the new Premier test facility. Also included in the transfer will be equipment such as testers, handlers and probers.
New Software Enables Barcode Traceability
(April 28, 2005) SAN CLEMENTE, Calif. — YESTraX barcode traceability software from YESTech, Inc. enables traceability from AOI systems to offline review/rework stations, creating a serialized barcode that can be assigned to rework images, as well as SPC data. The SPC software will generate quality reports, archive data and reportedly improve quality control.
Indium to Exhibit at IMAPS Garden State
(April 28, 2005) CLINTON, N.Y. — Indium Corp. of America will be exhibiting at the International Microelectronics and Packaging Society (IMAPS) Garden State Chapter's Spring Packaging Symposium, to be held May 11, 2005, at the Bell Laboratories in Murray Hill, N.J.
SMTA Opens Call for Papers for 2006 Pan Pacific Symposium
(April 27, 2005) MINNEAPOLIS — The SMTA-sponsored 2006 Pan Pacific Microelectronics Symposium, to be held January 17-19, 2006, in Hawaii, is announcing that the Call for Papers is now open. This annual event focuses on critical business markets and technologies of microelectronics packaging, interconnection, microsystems, nanotechnology and assembly.
Online Guide Helps with Achieving EMC with Thermal Design
(April 27, 2005) MARLBOROUGH, Mass. — A new step-by-step guide from Flomerics integrates thermal and EMC design to help designers identify and resolve system-level electromagnetic compatibility (EMC) issues, and may be found at
. Most new electronic products reportedly fail first-time EMC testing because manufacturers do not typically evaluate system-level EMC performance prior to prototyping.
Reports Spotlight EMS, Environmental Directives
(April 26, 2005) ALAMEDA, Calif. — Technology Forecasters Inc. (TFI) released three reports from their Q1 event in Guadalajara, Mexico. The reports tackled issues such as the future of the EMS industry, the role of the original design manufacturer (ODM) in the computer industry and environmental compliance.
CeTaQ Unveils New Informational Website
(April 26, 2005) HUDSON, N.H. — CeTaQ Americas, CeTaQ GmbH and CeTaQ Asia have launched a new Website (
) to provide information about their own measurement technology for equipment and process capability analysis.
Scan Modules Expand Boundary-scan Application Areas
(April 25, 2005) EINDHOVEN, The Netherlands — The new DIMM 2128 family of digital I/O scan modules (DIOS) from JTAG Technologies reportedly enhances testability of complex PCBs. Covering all standard DIMM connector pinouts and a wide range of operating voltages, the DIOS modules contain programmable logic and a built-in, 10-MHz oscillator, allowing implementation of embedded test instruments such as counters, function generators and timers.
Speedline Enhances Distribution in Pacific Northwest U.S., Canada
(April 25, 2005) FRANKLIN, Mass. — Speedline Technologies announces a business partnership agreement with Issaquah, Wash.-based Powell Industries, hoping to enhance Speedline's solutions and services network in the Pacific Northwest region of the U.S., and British Columbia, Canada.
Controllable Wind Tunnel for PCB Testing Available
(April 25, 2005) NORWOOD, Mass. — The CWT-PCB controlled wind tunnel from Advanced Thermal Solutions, Inc. (ATS) is for laboratory testing of heat and air flow on multiple PCBs. Its test chamber can accommodate up to six PCBs with 0.5" card-to-card spacing, or three PCBs with 1" spacing. It can fit with various fan trays for a broad airflow range, or with heating elements to allow for elevated air temperature testing.
FKI Logistex Updates Horizontal Carousel Line
(April 22, 2005) KENILWORTH, N.J. — FKI Logistex has upgraded its horizontal carousel line with new software and hardware improvements, offering increased flexibility in the design, specification and maintenance of the systems, and providing an enhanced set of operating controls. These carousels are typically used for product picking in warehouse- and distribution-center operations, and in buffering applications for manufacturing operations.
IPC Names New CFO and VP of Administration
(April 21, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries has appointed Tom McCabe as its new CFO and vice president of administration. He will be responsible for the general management of IPC's financial, human resources, information technology (IT) and customer-service functions.
COMET Hires New FEINFOCUS Business Manager
(April 21, 2005) STAMFORD, Conn. — COMET North America has recently promoted Jon Dupree to FEINFOCUS business manager, where he will be responsible for sales and strategic planning for the FEINFOCUS microfocus and nanofocus X-ray inspection systems in the Americas. He is located in the company's newly expanded COMET North America headquarters in Stamford, Conn.
IPC, Soldertec Global to Present Lead-free Conference
(April 20, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries and Soldertec Global, a division of Tin Technology, will be sponsoring the 3rd International Conference on Lead Free Electronics, to be held June 7-10, 2005, in Barcelona, Spain.
DEK, Gemido Sign Licensing Agreement
(April 20, 2005) FLEMINGTON, N.J. — DEK has signed a supply and license agreement for its VectorGuard stencil technology with France-based Gemido, a designer and manufacturer of machines for the electronics industry. Under the agreement, Gemido will manufacture VectorGuard stencils from foil blanks supplied by DEK, and will also provide VectorGuard frames.
Organic Bronzing Process System Available
(April 19, 2005) WEST HAVEN, Conn. — Enthone, Inc., a business of Cookson Electronics, has introduced BRONZEX SW, an organically brightened white bronze process for barrel electroplating that does not use heavy metal brighteners in the coating process, leaving surfaces bright and free of toxic additives. Ammonia-free, it may be used as either a topcoat or undercoat for palladium, nickel/palladium, silver or gold products.
Cobar Solder Products Commemorates First Anniversary
(April 19, 2005) LONDONDERRY, N.H. — March 2005 marked one year in business for Cobar Solder Products (CSP), the first North American division of Cobar B.V., and in the 12 months since the company opened its sales office and warehouse in Londonderry, N.H., business has grown. CSP has contracted a number of local manufacturer's reps throughout the country to carry its product lines, and has shipped its fluxes throughout the continental U.S., as well as to Canada and Mexico.
New DMM Fulfills Advanced Test Systems
(April 18, 2005) SEATTLE — Signametrics' SMX2064 7½-digit PXI/cPCI digital multimeter (DMM) offers high measurement rates up to 20,000 readings/sec and low DC current measurement ranges down to 50 pA. With its advanced, scope-like triggering, and extended DC and resistance measurement range, this new DMM reportedly can satisfy advanced test systems' needs in avionics, automotive, semiconductors, storage, industrial and components and sensor manufacturing.
Website Revamped for Adhesives Education
(April 18, 2005) BILLERICA, Mass. — TechFilm Corp.'s redesigned Website, (
), serves a purpose as an educational resource on B-staged adhesive films and preforms. Partially cured, these 100% solid adhesives are said to be an alternative to liquid adhesives and solders.
ESI, Universal Collaborate on Placement Systems
(April 18, 2005) BINGHAMTON, N.Y., and PORTLAND, Ore. — Electro Scientific Industries (ESI), Inc.'s optical and sensor solutions reportedly facilitate Universal Instruments' Lightning placement head's functionality, so ESI and Universal have released into production a complete imaging station that includes a Lightning, optics and sensor solution to work with ESI's CorrectPlace software architecture for SMT applications.
Micro-machine Lenses Target Machine Vision
(April 15, 2005) SAN JOSE, Calif. — SOD-10X micro-machine lenses (MMLs) from Moritex reportedly incorporate 1.5-µm spatial resolution, high numerical aperture and long working distance, providing a machine-vision lens for semiconductor or LCD alignment and inspection applications.
New Software Suite to Demo at NEPCON East
(April 15, 2005) PHILADELPHIA — Aegis Industrial Software Corp. is slated to demonstrate their new Version 6.0 (V6) software suite at booth #5047 at the upcoming NEPCON East/Electro/SMTA Boston show, to be held May 3-5, in Boston, Mass. V6 software reportedly provides comprehensive NPI, materials management and MES functionality for manufacturing control and visibility.
Fume Extraction System Offers HEPA Filtration
(April 14, 2005) MENLO PARK, Calif. — OK International's Metcal BTX-208 fume extraction system reportedly provides fume extraction for up to eight tip-extraction stations when using 5.6-mm tubes. Based on Metcal's BVX-200 portable two-arm system technology, BTX-208 provides a high vacuum required to draw air through narrow tip-extraction tubes in soldering applications.
IPC SMEMA Committee Announces New Members
(April 14, 2005) BANNOCKBURN, Ill. — Four new committee members have been elected to the IPC—Association Connecting Electronics Industries Surface Mount Equipment Manufacturers Association (SMEMA) Council steering committee.
StratEdge Recertified for ISO 9001:2000
(April 13, 2005) SAN DIEGO — StratEdge has been recertified for ISO 9001:2000 by Det Norske Veritas (DNV) with no non-conformances, indicating that StratEdge meets specific requirements for a quality management system. ISO 9001:2000 is the latest 9000 family standard defined by the International Organization for Standards that demonstrates the ability to consistently provide products that meet customer and applicable regulatory requirements and aims to enhance customer satisfaction.
Lead-free Products Focus at NEPCON
(April 13, 2005) WEST CONSHOHOCKEN, Pa. — The Circuit Materials Division (CMD) of Heraeus will introduce its F10B Series of no-clean solder pastes at NEPCON East in Boston, Mass., May 4-5, 2005. The F10B Series offers print-to-print consistency with high wetting capabilities. It complements the company's line of tack fluxes aimed at rework and solder ball attachment for no-clean and water-soluble applications.
Siemens L&A Opens Training Facility in Brazil
(April 13, 2005) NUREMBERG, Germany — Siemens Logistics and Assembly Systems (L&A) has opened a new training facility on the campus of Senai University in Manaus, Brazil to conduct SMT technology training for both Senai University students and Siplace customers in the Manaus region. With this facility, Siemens L&A hopes to promote education and training for electronics manufacturing specialists in Brazil.
Xilinx K.K. Appoints New President
(April 12, 2005) SAN JOSE, Calif. — Xilinx, Inc. has promoted Hitoshi Yoshizawa to president of the company's Shinjuku-ku, Tokyo, Japan subsidiary, Xilinx, K.K., from his current position as director of sales for the consumer- and industrial-market segments. He succeeds Motihiro Kitajima, who will continue as chairman of the board for Xilinx, K.K. The appointment will become official when the annual Xilinx, K.K. board meeting and general meeting of stockholders takes place on May 27.
UV Curing Station Features Touch Screen
(April 12, 2005) KENOSHA, Wis. — The EUV-700 conveyorized UV curing station from PRO-MATION, Inc. incorporates Fusion F300 version "D" lamps. The station has a standard focal distance of 2.1" above the product, which produces a 1" wide curing zone. To accommodate various component heights, the lamp housings may be indexed in the Z direction (2.1" to 5") to prevent possible overexposure for taller components.
Indium to Host Lead-free Seminar in Chicago Area
(April 12, 2005) CLINTON, N.Y. — Indium Corp. of America's "Pb-Free QuickStart Seminar" series is coming to Libertyville, Ill., and scheduled to be held May 17-18, 2005. Developed in partnership with Motorola, this workshop offers lead-free assembly solutions with a series of presentations by industry experts, and includes a visit to the Motorola plant, also in Libertyville, Ill.
Fabrinet Receives ISO/TS 16949:2002 Certification
(April 11, 2005) SAN FRANCISCO — Fabrinet has obtained ISO/TS 16949:2002 International Automotive Quality Management System certification for their new Pinehurst facility, located in the Bangkok, Thailand metropolitan area. The Pinehurst factory joins Fabrinet's Chokchai, Thailand manufacturing campus, which received ISO/TS 16949:2002 certification in 2003. TUV Rheinland, an independent testing and assessment services company, certified both factory sites.
Quadrature Hybrid Coupler Available
(April 11, 2005) PORTSMOUTH, R.I. — The IMD 2297 Quadrature 3-dB hybrid coupler from IMS is suitable for RF/microwave and telecom applications. Compact, low-profile and surface-mountable, this thick-film product on an aluminum nitride substrate operates at 6 GHz with a bandwidth of 10%.
Elcoteq Establishes New India Plant
(April 11, 2005) IRVING, Texas — Elcoteq Network Corp. has introduced a new plant in Bangalore, India, while also becoming the first global EMS company to manufacture telecommunications equipment there. Once it is fully operational, the Bangalore facility will employ approximately 1,000 people and manufacture products for global customers operating in India and the Asia-Pacific region.
Pick-and-Place Machine Boosts Throughput
(April 8, 2005) STOCKHOLM, Sweden — The HYDRA Speedmount 21k ER, which handles component sizes from 0201 up to 15x15 mm large ICs, is now available from MYDATA automation AB. A Linescan vision system enables on-the-fly vision centering. The mounthead is compatible with a wide range of tools, as well as the automatic tool exchanger (ATE).
COMET North America Appoints Technical Services Manager
(April 8, 2005) STAMFORD, Conn. — COMET North America announces the appointment of Paul Lukaniec as technical services manager, where he is responsible for the management of all COMET service programs, including the X-ray testing and repair facility in Stamford, Conn., field service and training for FEINFOCUS microfocus X-ray systems and inspection services.
Data I/O Allies with Intel for Flash Memory Customer Support
(April 7, 2005) REDMOND, Wash. — Data I/O Corp. is expanding its strategic alliance with Intel Corp. Wireless handset manufacturing companies are Data I/O's largest customer group, consuming significant volumes of high-density flash memory devices. Many of those customers are multi-national in structure and require fast, concurrent support in many different geographies—Intel offers support in these geographies with its flash memory Programmer Evaluation Labs (PEL).
DEK to Exhibit Printing Platform at NEPCON East
(April 7, 2005) FLEMINGTON, N.J. — DEK is slated to display its latest equipment, consumables and stencil technology at the NEPCON East/Electro/SMTA Boston show, to be held May 4 and 5 in Boston, Mass. Among their products to be shown at booth #1010 is their Horizon printing platform, equipped with the Instinctiv user interface and the VectorGuard frame-mounted stencil system.
IPC Releases February Book-to-Bill Ratio, Business Report
(April 7, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries announces the findings from its monthly PCB Statistical Program. The North American PCB Industry Book-to-Bill Ratio for February 2005 continued at 1.08, based on monthly data collected from both rigid PCB and flexible circuit producers that participate in the PCB Statistical Program. Separately, the book-to-bill ratios in February 2005 were 1.04 for rigid PCBs and 1.23 for flexible circuits.
Temperature Monitoring System Ideal for Reflow Ovens
(April 6, 2005) FRANKLIN, Mass. — The OmniCheck monitoring system, now available from Speedline Technologies, delivers a redundant check on process temperatures and conveyor-belt speed for reflow ovens. The system also provides data tracking and monitoring capabilities of process parameters.
JPSA, UMass Dartmouth's Advanced Technology and Manufacturing Center Form Partnership
(April 6, 2005) HOLLIS, N.H. — J P Sercel Associates (JPSA) has entered into a partnering arrangement with the Advanced Technology and Manufacturing Center (ATMC) of the University of Massachusetts, Dartmouth (UMass Dartmouth). Through the Commonwealth of Massachusetts, the ATMC's industrial research section recently acquired an IX-300 UV laser micromachining system from JPSA.
Patriot Scientific Declares First Quarterly Profit in 18-year History
(April 6, 2005) SAN DIEGO — Patriot Scientific Corp. (PTSC), in its first quarterly Webcast on March 31, announced its first quarterly profit, which they reportedly attribute to having recently signed a major licensing agreement with AMD. Also, the Embedded Microprocessor Benchmark Consortium (EEMBC), an independent microprocessor testing, benchmarking and evaluation organization, has awarded PTSC a high ConsumerMark performance rating on its IGNITE microprocessor.
Names Group Publisher
(April 5, 2005) NASHUA, N.H. — SMT Magazine, along with sister publications Advanced Packaging and Connector Specifier Magazines, announce the appointment of Jay Regan to group publisher.
Speedline Launches Lead-free SMT Manufacturing Website
(April 5, 2005) FRANKLIN, Mass. — Speedline Technologies has launched a new Website for resource purposes in the worldwide move to lead-free SMT manufacturing. The new Website, titled, "Are you ready for the transition to lead-free manufacturing?" may be accessed by
Resistor Arrays Ideal for Many Applications
(April 5, 2005) MALVERN, Pa. — Targeting applications with high-component density demands and accurate stable performance, the ACAC 0612 precision- and professional-series resistor arrays from Vishay Intertechnology, Inc. feature 25 ppm/K absolute TCR and 15 ppm/K tracking TCR, with tracking TCR of 10 ppm/K available.
Temperature-control System Available
(April 4, 2005) EAST PROVIDENCE, R.I. — A temperature-control system from EFD, Inc. designed for use in air-powered benchtop dispensers and automated dispense valves, eliminates temperature fluctuations that cause variations in shot size, viscosity and pot life when dispensing solder pastes, adhesives and other assembly fluids.
Universal to Exhibit Placement Platforms at NEPCON East
(April 4, 2005) BINGHAMTON, N.Y. — Universal Instruments will be showing two of their AdVantis placement platform models at the NEPCON East show, to be held May 3-5 in Boston, at booth #3001. The AdVantis AC-30L model, a high-speed modular system featuring Universal's Lightning head, and the AX-72 model—a modular, multi-function system featuring a choice of placement and dispense head options along with odd-form placement capability, are the two machines to be shown.
AIM, Nihon Superior Sign Lead-free License Agreement
(April 1, 2005) MONTREAL — AIM and Nihon Superior have signed a license agreement that enables AIM to manufacture and sell the Sn100C lead-free solder alloy throughout the U.S., Canada and Mexico. SN100C is a lead-free solder alloy comprised of tin, copper, and a small amount of nickel.
Platform Software Applies Various Test Strategies
(April 1, 2005) STRAMBINO, Italy — The VIVA integrated platform, which is based on software and hardware architecture that can implement multiple test strategies throughout the entire development chain, has been implemented into the PILOT flying prober, and is now available from Seica S.p.A.
Chromalox, Ohmcraft Form Alliance for Thick Film Capability
(March 31, 2005) PITTSBURGH — Chromalox, a manufacturer of precision heat and control products, is partnering with Ohmcraft to provide advanced thick film heating capability. The agreement provides Chromalox as the exclusive seller and Ohmcraft as the exclusive manufacturer of thick film heating products and solutions.
Immersion Silver Process Cuts Rework
(March 31, 2005) WEST HAVEN, Conn. — The AlphaSTAR immersion silver process from Enthone, Inc., a business of Cookson Electronics, selectively deposits silver coating and is said to maintain high first-pass yields without exposed copper—eliminating rework.
X-ray System Combines AOI and AXI Inspection
(March 31, 2005) SAN CLEMENTE, Calif. — YESTech, Inc.'s YTX-5000 dual-technology inspection system combines AOI and AXI inspections for both visible and hidden defects on BGAs, flip chips and other area-array devices. Other typical inspections include solder joints, leads, component presence and position, correct part, polarity, color and thru-hole parts.
Rework Station Targets Lead-free
(March 30, 2005) RALEIGH, N.C. — A soldering station for fine-pitch, high-density SMT soldering and rework includes a 120-V micro-soldering station, a micro-soldering pencil with one tip and a pencil stand with an adjustable tip angle.
Sullair Launches Revamped Website
(March 30, 2005) MICHIGAN CITY, Ind. — Sullair Corp.'s fully redesigned, comprehensive Website focuses on their Air Metrix program, a systems approach to compressed air technology to help users reduce energy costs and improve productivity by analyzing, managing and controlling total compressed air systems.
Indium to Exhibit at SMT/Hybrid/Packaging
(March 30, 2005) CLINTON, N.Y. — Indium Corp. of America is slated to exhibit at SMT/Hybrid/Packaging 2005 conference in Nuremberg, Germany on April 19-20, 2005. Their exhibit will feature advanced technology lead-free electronics assembly materials, spanning solder pastes, wave solder fluxes, rework materials and solder fabrications, such as solder preforms, solder ribbon and wire, and solder spheres.
COMET North America Moves to New Headquarters
(March 30, 2005) STAMFORD, Conn. — COMET North America, a supplier of X-ray, RF and dosimetry solutions, has relocated to its newly expanded headquarters in Stamford, Conn. The new 12,000-sq.-ft. facility serves as its center of excellence for COMET's vacuum capacitor, dosimetry, industrial X-ray products, and FEINFOCUS microfocus X-ray inspection systems and services.
Henkel Promotes Individual to Product Manager for Europe
(March 29, 2005) CITY of INDUSTRY, Calif. The electronics group of Henkel has announced the promotion of Giuseppe Caramella to the position of European product manager for solder materials. This new role for Caramella will be to develop the solder materials family of products throughout Europe, especially in the fast-growing Eastern European marketplaces, serving as a front-line customer interface while communicating sales, marketing and R&D agendas.
Network Survey Reports on European Lead-free Soldering Status
(March 29, 2005) ST. ALBANS, HERTFORDSHIRE, U.K. — With 16 months left until the July 2006 RoHS Directive deadline for full implementation of lead-free soldering in electronics equipment, Europe's lead-free technology network has reported results of an implementation status survey, available on the network portal. Conclusions show that while the degree of uncertainty is now small, 30% of concerned organizations are still not actively preparing for lead-free soldering.
Siemens Brings Logistics Automation to Direct Marketing Company
(March 29, 2005) GRAND RAPIDS, Mich. — Siemens Logistics and Assembly Systems (Siemens L&A) has recently re-tooled Blair Corp.'s sizable distribution logistics system—increased waving capacity for handling multi-piece orders from 40,000 to 182,000 units daily, doubling the rate of first-day-ship orders, and increasing units shipped per labor hour. By Jim McMahon
Thermal Interface Pads Enhance Heat Dissipation
(March 28, 2005) ST. PAUL, Minn. — 5505S and 5536S non-silicone, thermally conductive interface pads from 3M's Electronic Markets Materials Division are designed to augment the heat-dissipation effect of conventional heat sinks and other passive devices.
Integrated Constraint Entry System Aids PCB System Design
(March 28, 2005) WILSONVILLE, Ore. — Mentor Graphics has released its next-generation constraint editor system (CES) into its Expedition Series and Board Station RE PCB design flows. This system enables definition, adherence and verification of physical constraints throughout the whole design process for complex designs. CES integrates with the entire system's design flow—from schematic entry through physical layout.
Speedline to Unveil New Stencil Printer at NEPCON China
(March 25, 2005) FRANKLIN, Mass. — Speedline Technologies will introduce its new MPM Accela stencil printer for the first time in Asia at NEPCON China 2005, to be held April 12-15 in Shanghai, China. The new printer will be featured among a host of solutions in lead-free assembly, reflow and wave soldering, and stencil printing solutions that the company will feature at its booth throughout the show.
Self-lubricating Slide Guides Resist Contamination
(March 24, 2005) BETHEL, Conn. — Tusk Direct's self-lubricating slide guides do not use ball or roller bearings, making them inert, washable and resistant to corrosive chemicals; and providing long life in dusty and dirty environments. Teflon pads bonded to the inside of the carriage minimize friction while providing sliding linear motion. 45° rail geometry ensures maximum bearing contact area, while providing smooth, quiet operation.
E-mail Forum Broadens Access for IMS and PCB Executives
(March 24, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries has found a way to provide IMS and PCB executives with a free means to connect with one another through its new IMS/PCB Executive Listserv, an e-mail forum. This forum allows PCB executives from IPC member companies to trade information, exchange opinions and explore solutions to common challenges.
DEK Assembly Solutions to Debut at SMT 2005
(March 23, 2005) FLEMINGTON, N.J. — High-speed, continuous screen printing in the lead-free era will be DEK's focus at SMT 2005, to be held April 19-21, 2005, in Nuremberg, Germany. DEK sees the Internet as a key tool in delivering information and services to support these objectives, and will be displaying its latest Internet platforms at its exhibition booth at the show.
New Electronics Industry Award Named After Company Founder
Vishay Intertechnology, Inc. announces that Dr. Felix Zandman, founder, chairman, CTO and business development officer, has had a new award named after him by the Electronic Components, Assemblies & Materials Association (ECA). The Dr. Felix Zandman Award was officially presented on March 20 at the CARTS (Capacitor and Resistor Technology Symposium) event in Palm Springs, Calif., in conjunction with the 25th anniversary of CARTS USA.
Curing Light Features Soldering Station Design
(March 15, 2005) BETHEL, Conn. — The SpotCure-B benchtop UV adhesive curing light from Kinetic Instruments, Inc. uses LED technology that turns on and off automatically when the probe is removed and placed back into its holder. The unit, which can be used as a soldering station, features a footswitch for hands-free operation. Available with 375- and 395-nm probes, the light provides wavelengths for curing UV adhesives.
Telecom Firm Deploys Test System
(March 14, 2005) RICHARDSON, Texas — AETA.COM will use ASSET InterTech's ScanWorks boundary scan test system in its design and manufacturing facilities, located in Paris and Aix en Provence, France.
Synchronized Selects Aegis for Quick-turn Capabilities
(March 14, 2005) PHILADELPHIA — Aegis Industrial Software announces that Synchronized Manufacturing has implemented Aegis' NPI software to further accelerate their quick-turn capabilities. Synchronized uses Aegis software to expedite the introduction of new products, deliver machine programs to the factory floor, and electronically manage and control data for their automotive, medical and telecom customers.
Co-op Program Helps with Marketing, Sales
(March 11, 2005) CLINTON TOWNSHIP, Mich. — Share the Success, a marketing co-op program from KUKA Robotics Corp., gives select system partners and integrators the ability to re-invest their business. The program offers a full range of benefits, such as co-op funds for marketing campaigns.
New Connector Ideal for Multi-level Board Stacking
(March 11, 2005) NEW ALBANY, Ind. — Samtec's SAL1 Series low-profile, micro-card socket interface provides a card-to-board interface for serial ATA and other high-speed daughtercard applications.
10,000+ Industry Professionals Come Together at APEX
(March 11, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries announces that this year's APEX/IPC Printed Circuits Expo/Designers Summit/ECWC 10 event in Anaheim, Calif., attracted 6,000 attendees. The combined shows, held last month, experienced 5% growth in attendee participation, attracting a total of 10,900 exhibitor personnel and attendee professionals.
Indium Executive to Present Two Papers at NEPCON Shanghai
(March 11, 2005) CLINTON, N.Y. — Dr. Ning-Cheng Lee, Indium Corp. of America's vice president of technology, will present, "The Transition to Lead-free Production: From iNEMI Roadmap to Production," at the SMTA Technology Summit, to be held concurrently with NEPCON Shanghai on April 10-11. His presentation, made on behalf of iNEMI, demonstrates ideas on lead-free alloy selection and manufacturability assessment, and lead-free supply chain management.
BP Microsystems Announces Distribution Agreement
(March 10, 2005) HOUSTON — BP Microsystems announces that WKK Distribution Ltd. will represent BP Microsystems throughout China, in the Beijing, Chengdu, Chong Qing, Hong Kong, Shanghai, Shenzhen, Suzhou and Xian territories.
Research and Markets Releases New Electronics Recycling Report
(March 10, 2005) DUBLIN, Ireland —
Research and Markets
has announced the addition of Electronics Recycling: What to Expect from Global Mandates - 2005 Edition to their current offering.
Aegis Software Facilitates BAE Systems' Lean Manufacturing Program
(March 9, 2005) PHILADELPHIA — Aegis Industrial Software announces that BAE Systems in Fort Wayne, Ind., has implemented Aegis Manufacturing Information Management Software to create a complete link among all business and factory processes within one seamless system for optimum lean manufacturing. The suite includes CheckPoint, CircuitCAM and Fusion iView software modules.
Pulse Announces Plan to Increase Component Prices
(March 9, 2005) SAN DIEGO — Pulse announces plans to increase prices of magnetic components for local area network (LAN), telecommunications and power-conversion applications due to rising costs of sub-components, consumables, energy and labor. Unless set by contract, prices for certain catalog and custom products will increase between 3% and 10%, depending upon product type and quantities purchased, on orders placed after March 31, 2005.
IPC Releases Book-to-Bill Ratio for January 2005
(March 8, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries announces the findings from its monthly PCB Statistical Program. The ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from the companies in IPC's survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which indicates probable near-term growth.
Multi-user Fume Extraction Systems Introduced
(March 8, 2005) MENLO PARK, Calif. — OK International's Metcal MFX-2200 fume extraction systems are designed to support manual electronics assembly workstations for up to eight users, and can also be used to remove particulates and gases from exhaust cabinets and small benchtop wave- and reflow-soldering ovens.
FEINFOCUS Names New European Regional Sales Manager
(March 8, 2005) GARBSEN, Germany — FEINFOCUS announces the appointment of Anja Weber as its new regional sales manager for Europe. Based at FEINFOCUS' global headquarters in Garbsen, Germany, Weber manages their complete line of X-ray inspection systems in Europe and Israel.
Hansatech Becomes First DEK Interactiv User
(March 7, 2005) FLEMINGTON, N.J. — DEK announces its first customer for its Interactiv online support services, which use Internet-based communications to enable predictive maintenance, allow software upgrades to be downloaded instantly and permit rich online technical support and customer training.
Cleanroom-grade Wipes Available
(March 7, 2005) FRANKLIN, Mass. — Tough, lint-free UltraClean #810B SmartWipes from JNJ Industries reportedly offer cleanroom-grade quality and cleaning performance. These Class-100-grade polyester wipes deliver cleaning performance with low particle generation and soluble extractables. They clean aggressively, but will not scratch the surface being cleaned.
IPC Elects New Members to the Board of Directors
(March 4, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries has announced the election of six new members to the Board of Directors at the IPC Annual Meeting, held during APEX/IPC Printed Circuits Expo/Designers Summit/ECWC 10, in Anaheim, Calif., last month. Board members will serve a two-year term, covering calendar years 2005 and 2006.
SMTA Boston Program to Feature Mini-conference on RoHS
(March 4, 2005) MINNEAPOLIS — The SMTA announces plans for the 2005 SMTA Boston event, to be held May 3-5 at the Boston Convention and Exhibition Center in Boston, Mass., in conjunction with NEPCON East/Electro. This program will feature full- and half-day courses, a new mini-conference on complying with RoHS, and a keynote address, as well as co-located certification programs for SMT Processes and Six Sigma Green Belt.
Soft Termination System Guards Against Crack Failures
(March 3, 2005) MYRTLE BEACH, S.C. — Driven by demands from the automotive industry for more reliable components, AVX Corp. has developed FlexiTerm, a soft termination system that adds a flexible termination layer to the component to ensure maintained electrical integrity when external forces are applied.
Mentor Graphics, VIA Collaborate to Deliver PCB Reference Designs
(March 3, 2005) WILSONVILLE, Ore. — Mentor Graphics is collaborating with VIA Technologies to provide reference designs for use with the Expedition Series design flow for VIA's next-generation chipsets. These reference designs, only available through VIA, accelerate the creation of computer motherboard designs using VIA devices with the Expedition design flow, and enable Expedition users to reuse design data for high-speed or complex designs.
Universal Adds Knowledge-based White Papers to Website
(March 2, 2005) BINGHAMTON, N.Y. — Universal Instruments has added seven new white papers to its global Website (
), as well as enhanced the site's white paper section with two new subject areas: thermal management and medical electronics.
New Solder Flux Provides Maximum Process Window
(March 2, 2005) CITY of INDUSTRY, Calif. — Multicore MF210 from Henkel Technologies is designed specifically for surfaces with poor solderability, and is compatible with all solder alloys. This no-clean, halide-free sustained activity flux has been formulated to work over a wide range of solder resists, and is compatible with rosin- and OSP-based surface preservatives.
First Industry Blog Launched
(March 2, 2005) CLINTON, N.Y. — Indium Corp. of America has launched a web log, or a "blog," that focuses on the electronics assembly industry. This new blog may be accessed at
. Officially announced at APEX, the blog, authored by Dr. Ronald C. Lasky, presents comments, insights and observations on activities and events related to the industry.
EADS Test & Services Selects SEICA for Test Solution
(March 1, 2005) PARIS — SEICA SpA announces the signing of a licensing agreement with EADS Test & Services to add a third-level optional testing capability to the EADS line of second-level systems, ATEC Series 6 and derived products. The main objective is to offer end users the ability, after LRU testing, to confirm the SRU to be diagnosed faulty and be sent back for repair on the same test equipment and with a comprehensive test process.
SMTA Announces 2005 Pan Pacific Symposium Best Paper Award
(March 1, 2005) MINNEAPOLIS — As speakers at SMTA's Tenth Annual Pan Pacific Microelectronics Symposium (held January 25-27, 2005, in Kauai, Hawaii), individuals promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. As rated by the attendees, the Best Paper award was presented to Alan Rae of NanoDynamics, Inc.
Digital Multimeters Ideal for Advanced Test Systems
(March 1, 2005) SEATTLE — Signametrics' 7½-digit PXI/cPCI digital multimeters (DMMs) offer advanced functionality and measurement speeds. The SMX2064 has high measurement rates up to 20,000 readings/sec. and low DC-current measurement ranges down to 50 pA. With true 7½-digit accuracies, advanced, scope-like triggering and extended DC and resistance measurement ranges, the two DMMs are aimed at the needs of advanced test systems in components and sensor manufacturing.
Henkel Lead-free Workshops to Continue in 2005
(February 28, 2005) CITY of INDUSTRY, Calif. — The workshops during spring 2005 will focus on lead-free reflow and wave soldering, use of adhesives, and hand soldering. The events will take place at various locations throughout Europe, including workshops and seminars in partnership with Henkel distributors and equipment partners on March 16, March 22 and May 25, with further production-oriented presentations in Sweden on April 13 and 14.
Universal's Research Investment Tops $10 Million
(February 25, 2005) BINGHAMTON, N.Y. — Universal Instruments' SMT Laboratory has committed over $10 million in research grants and stipends, as well as mentoring research projects and providing access to equipment and facilities.
Indium Completes ISO Audit
(February 24, 2005) CLINTON, N.Y. — Indium Corporation of America has completed their third surveillance audit since transitioning to ISO9001:2000. The process involved over 20 individuals at both the Utica and Clinton, N.Y. manufacturing facilities, and resulted in no minor or major findings.
Global E-waste Market to Cross $11 Billion by 2009
(February 23, 2005) NORWALK, Conn. — The worldwide market for electronic waste will rise at an average annual growth rate (AAGR) of 8.8% from $7.2 billion in 2004 to $11 billion in 2009, according to a soon-to-be-released report, titled, "RE-128 Electronic Waste Recovery Business," from Business Communications Company, Inc. (
DEK Licenses Stencil Technology to Cookson
(February 23, 2005) FLEMINGTON, N.J. — DEK has licensed its VectorGuard stencil technology to Cookson Electronics, allowing Cookson to supply VectorGuard stencils globally under the Tetra-VG name. The agreement will enhance the availability of VectorGuard stencils for new and existing surface mount assemblers on a global basis, enabling VectorGuard to develop as an industry standard.
Kyzen Names New Southcentral Regional Manager
(February 23, 2005) NASHVILLE — Kyzen Corp. announces that Ron Wrable has recently joined Kyzen as Southcentral regional manager. He will be responsible for customer support and market development for all Kyzen products and services throughout Southcentral North America.
Pulse Announces RoHS Compliance Initiatives
(February 22, 2005) SAN DIEGO — Pulse announces its plan for compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive. Pulse has started implementing the requirements of the legislation in the products it develops and manufactures. New products are being designed to be RoHS-compliant, and existing products are being evaluated and upgraded to be compliant with both the material and production process requirements of RoHS.
Nitrogen Nozzles Deliver Lead-free Soldering Solution
(February 22, 2005) FRANKLIN, Mass. — Speedline Technologies has introduced its new UltraFill lead-free nozzles, which are designed to enable electronic manufacturers to overcome a variety of process challenges inherent in lead-free wave soldering.
Universal Steps Up Investment in China
(February 22, 2005) BINGHAMTON, N.Y. — Universal Instruments has strengthened its research and development in China to provide support for its customers in the region by opening its expanded Suzhou Technology Excellence Center (TEC).
Indium Announces New Distributor in Denmark
(February 18, 2005) CLINTON, N.Y. — Indium Corporation of America has announced that PC Trading has become its newest distributor in Europe, covering Denmark. PC Trading, founded in 1986, will be responsible for selling Indium's line of solder pastes, wave solder fluxes, solder wire and solder preforms.
Solectron Expands Facility, Appoints Two Executives
(February 17, 2005) MILPITAS, Calif. — Solectron Corp. announces that the company has expanded its enclosures and sheet-metal facility in Milpitas, Calif. This expansion is part of the company's strategy to offer systems-integration solutions and commit to interacting and collaborating with customers in the most critical development stages, improving their time-to-market capabilities.
Placement Machine Handles Multiple Components
(February 17, 2005) STOCKHOLM, Sweden — MYDATA's MY-Series Extended placement machine is available in four machine sizes. A new, high-speed Hydra Extended Range (ER) mount head, which is equipped with an extended range of tools, can place components down to 0201 and up to 15 x 15 mm.
SMTA Mini-conference to Focus on RoHS Compliance
(February 17, 2005) MINNEAPOLIS — The SMTA announces a new mini-conference, entitled, "Complying with RoHS: Real-World Examples of What Companies Are Doing Today." This one-day program will be held April 5, 2005, in San Jose, Calif., and May 4, 2005, in Boston, Mass., in conjunction with SMTA Boston/NEPCON East/Electro.
Universal Receives Award for Customer Service
(February 16, 2005) PALO ALTO, Calif. — Frost & Sullivan's recent analysis program, "Growth Opportunities in the SMT Placement Equipment Markets," selected Universal Instruments as the recipient of the 2004 Award for Customer Service Leadership. Universal received this award for its proactive service partnership approach that meets both the stated and unstated requirements of its customers globally.
YESTech Opens China Office
(February 16, 2005) SAN CLEMENTE, Calif. — YESTech announces the opening of its Shanghai, China office. The new office will provide sales and technical support to YESTech's growing China customer base.
Aegis to Unveil New Test Software at APEX
(February 16, 2005) PHILADELPHIA — Aegis Industrial Software will introduce the latest addition to their NPI software suite at APEX/Printed Circuits Expo/Designers Summit, to be held February 22-24, in Anaheim, Calif., at booth #659. TestXcell, Aegis' comprehensive circuit-assembly test solution, provides ATE programming, DFT analysis, fixture design output and schematic viewing.
Indium Hires New Market Development Specialist in Europe
(February 15, 2005) CLINTON, N.Y. — Indium Corp. of America announces that Alan Fairbairn has been hired as a market development specialist for fabricated product at Indium Corp. of Europe. He will be responsible for the sales of fabricated solder products throughout the European continent. His duties include direct sales and the identification of key market growth drivers, as well as training and education.
New Barrier Strips Have Safety Cover
(February 15, 2005) HARRISBURG, Pa. — Tyco Electronics' BUCHANAN .325" centerline tri-barrier strips come equipped with a safety cover. Designed for PCB power I/O applications, including industrial controls, power supplies, HVAC, test equipment and telecom, the clear-plastic safety cover allows the terminal contact screw to be loosened and tightened through an access hole. The cover also is hinged to the barrier-strip base, providing access to the wire entry of the contact clamp.
iNEMI to Reveal Roadmap at APEX
(February 14, 2005) HERNDON, Va. — iNEMI will premiere findings of its 2004 roadmap at the APEX/IPC Printed Circuits Expo/Designers Summit, to be held February 22-24, in Anaheim, Calif. Several gap analysis meetings also are planned at that time to discuss roadmap findings and prioritize industry needs in the areas of system-in-package (SiP), board assembly and substrates, environmentally friendly electronics and product lifecycle information management.
Kester to Host Lead-free RoHS Assembly Clinic at APEX
(February 14, 2005) DES PLAINES, Ill. — Kester announces that it will hold its lead-free RoHS assembly clinic throughout APEX/IPC Printed Circuits Expo/Designers Summit, to be held February 22-24, in Anaheim, Calif., with the goal of assisting industry companies to transition reliably to lead-free and RoHS compliancy.
DEK Updates Online Maintenance Features
(February 11, 2005) FLEMINGTON, N.J. — DEK has enhanced the machine maintenance and monitoring features of Interactiv, its Internet-based support, to allow remedial actions to be planned during scheduled maintenance visits, maximizing uptime and productivity. Machine owners can now call up the service history of each machine in the enterprise by accessing the DEK Merlin database, as well as using ProEngineer remotely, to identify and check availability of spare parts and upgrades.
SMTA Announces Hutchins Grant Application Deadline
(February 11, 2005) MINNEAPOLIS — The SMTA Hutchins Educational Grant was established in memory of past SMTA president and industry colleague Dr. Charles Hutchins. The $5000 grant is awarded annually to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging or a related field.
SMD Socket Adapter for MLF ICs Available
(February 11, 2005) EAGAN, Minn. — LS-MLF32A-01 SMD socket adapter from Ironwood Electronics allows the user to socket an MLF chip, having only the SMT pads on the target PCB without any additional space.
KIC Appoints New National U.S. Sales Manager
(February 10, 2005) SAN DIEGO — KIC announces that it has hired Gregory Fall to be the new National Sales Manager for the United States. In his new role, he will be responsible for the thermal-management and process-control portion of the electronics assembly and packaging processes.
Lead-free Workshop to Provide Hands-on Training
(February 9, 2005) SAN DIEGO — KIC will co-sponsor a lead-free workshop, to be held March 16-17, at the Engent facility in Norcross, Ga. The workshop also involves experts from Engent, Henkel Technologies, Siemens Dematic, Cogiscan and Speedline Technologies.
Profile Rail Guides Promote Accurate Linear Positioning
(February 9, 2005) BETHLEHEM, Pa. — In addition to precise linear positioning, these profile rail guides provide smooth operation, high load-carrying capacity, high stiffness, and unlimited stroke for a variety of linear motion applications, and are now available from SKF Motion Technologies.
FEINFOCUS Opens New Office in China
(February 7, 2005) STAMFORD, Conn. — FEINFOCUS announces the opening of FEINFOCUS Asia/Pacific, a new office in Shanghai, China. The office, located in the Zhangjiang Semiconductor Industry Park in Pudong, Shanghai, provides sales and technical support to the growing FEINFOCUS customer base in the Asian market.
SMT Box Receptacles Offer Dual-end Entry
(February 7, 2005) MOUNT KISCO, N.Y. — Zierick Manufacturing Corp. has expanded its receptacle line to include the 1263 and 1265 SMT box receptacles. The 1263 receptacle is a horizontal terminal, whereas the 1265 is a vertical terminal. Both offer a small footprint, high current rating, high locational tolerance, low insertion force and a connection by way of a high-pressure contact area.
CeTaQ Americas, Universal Join to Demonstrate at APEX
(February 7, 2005) HUDSON, N.H. — CeTaQ Americas will test and verify the accuracy of Universal Instrument's GSMxs high-accuracy placement machine, to be displayed in CeTaQ's booth (#257) at APEX, Printed Circuits Expo, and the Designers Summit, February 22-24 in Anaheim, Calif., using CeTaQ's CmController system.
Integrated Process Assembly Cell Increases Productivity
(February 4, 2005) ELGIN, Ill. — The Integrated Process Assembly Cell (IPAC) from Panasonic Factory Solutions Company of America combines high-volume manufacturing and microelectronics into one cell. Primarily comprised of die attach/flip chip, chip shooter, odd form and dispenser modules, IPAC is designed to build smaller packages and circuits, such as SiPs, with mixed technology and high density.
NVision Appoints New Director of Business Development
(February 3, 2005) SOUTHLAKE, Texas — NVision, supplier of laser scanners used for reverse engineering and quality control, has appointed Giles Gaskell as director of business development. Gaskell will be responsible for expanding the company's business beyond its traditional base in the automotive, aerospace and industrial design sectors to new industries such as oil and gas, electric power generation, gas turbines, industrial machinery, and others.
Retrofit Kit Scans in Real Time
(February 3, 2005) BROMONT, QUEBEC, Canada — RFID Smart feeder system from Cogiscan Inc. can be retrofitted to existing placement machines. The system enables closed-loop feeder and component setup validation, eliminates human errors and reduces changeover time, provides real-time material inventory and traceability, and proactively scans all feeder slots in real time.
Dispense Valve Ideal for Air-dry or Cure Materials
(February 2, 2005) PLYMOUTH, Mich. — Model 2600-035 Tip-Seal high-volume dispense valve from Sealant Equipment & Engineering Inc. is designed for precision dispensing of medium- to high-viscosity adhesive and sealant materials. The valve opens and closes the material passage at the tip of the nozzle to start and stop material flow. Combined with positive-displacement meters, the valve delivers precise shot volumes and exact bead profiles.
IPC Releases Book-to-Bill Ratio for December 2004
(February 2, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries announces the findings from its monthly PCB Statistical Program. The North American PCB Industry Book-to-Bill Ratio for December 2004 bounced back up to 1.04 after a one-month dip below parity (1.00). Separately, the book-to-bill ratios in December 2004 were 0.93 for rigid PCBs and 1.41 for flexible circuits.
GSI Lumonics Receives Award from Samsung Electronics
(February 1, 2005) WILMINGTON, Mass. — GSI Lumonics Inc. has been recognized by Samsung Electronics as one of its top 20 worldwide equipment suppliers. This award was presented at Samsung's recent 2004 supplier appreciation day. The award was presented by Chang-Gyu Hwang, Ph.D., president and CEO of the Semiconductor Business at Samsung.
SMTA Announces Certification Program Dates and Locations
(February 1, 2005) MINNEAPOLIS — The SMTA has announced the dates and locations for its Certification program. Each program, one for SMT Processes and one for Six Sigma Green Belt, is a three-day workshop consisting of refresher topics and both open and closed book examinations.
Laser Marking System Meets Demands for PCB Marking
(February 1, 2005) HUNTINGTON BEACH, Calif. — Nortek Automation's SOL850 laser marking system lases a compact, machine-readable code directly on the circuit board, eliminating the recurring consumables cost of labels and ink solutions.
PCB Handling System Programs Multiple Functions
(January 31, 2005) KENOSHA, Wis. — PRO-MATION's EMB-700 is designed to create an in-line PCB handling solution that offers high production flexibility. Its one-touch button system allows programming of line loading and unloading, magazine rack buffer (LIFO or FIFO modes) or pass-through conveyor capabilities.
IPC to Release New Quarterly Report this Spring
(January 28, 2005) BANNOCKBURN, Ill. — IPC—Association Connecting Electronics Industries announces the launch of a new quarterly business data report, the IPC Supply Chain Tracker, due out this spring. The inaugural edition of the report will be published in May, and will make its official debut at the Technology Market Research Council (TMRC) spring conference in Baltimore, Md.
Machine Simultaneously Picks up to Five Components
(January 28, 2005) IRVINE, Calif. — With up to 324 single feeders and the ability to change feeders on the fly without interrupting production, Advantage 3 from MIMOT North America reduces or eliminates production-crippling changeover times.
Kester to Hold Lead-free Seminar in March
(January 27, 2005) DES PLAINES, Ill. — Kester announces that it will hold seminars throughout 2005, titled, "Project 2005: Achieving Lead-free RoHS Assembly." The fourth seminar in the series will be held March 15, in Rosemont, Ill., and the fifth seminar will be held March 17, in Bloomington, Minn.
Panasonic Factory Automation Announces Name Change
(January 27, 2005) ELGIN, Ill. — As of January 1, 2005, Panasonic Factory Automation has been renamed Panasonic Factory Solutions Company of America (PFSA). This change unifies the company's capital equipment business globally under the Panasonic name, while reinforcing the greater consultancy role that PFSA has taken on for its customers. In coming months, similar name changes will be rolled out to other Panasonic operations in Europe, Asia and China.
Filters for Switching Cabinets Available
(January 27, 2005) ISELIN, N.J. — R105 EMC filters from EPCOS Inc. are rated to UL1283, CSA 22.2 No. 8 1986 (cUL) and EN 133200 standards. Optimized for operation with long motor leads and under full load, these power line filters can be used in a wide variety of applications, such as machine tools and conveyor systems.
SMTA Announces Call for Papers for IWLPC 2005
(January 26, 2005) MINNEAPOLIS, Minn. — The SMTA announces plans for the Second Annual International Wafer-Level Packaging Congress and Exhibition (IWLPC), to be held November 3-4, 2005, in San Jose, Calif. The IWLPC will track IC packaging and test technologies, with special emphasis on 3-D stacked packaging. The dual-track program will address package design concerns, package assembly, fabrication technologies, board design for chip scale packages and test/reliability.
Digitaltest to Focus on Strategic Manufacturing at Nepcon Shanghai
(January 26, 2005) STUTENSEE, Germany — Digitaltest GmbH will present a clear vision to electronics manufacturers for maximizing return on test investment at the Nepcon Shanghai show, to be held April 12-15, 2005.
Solectron CEO to Emphasize Benefits of Outsourcing at Forum
(January 25, 2005) MILPITAS, Calif. — Solectron Corp. president and CEO, Mike Cannon, will address manufacturing industry business leaders gathering at the World Economic Forum in Davos, Switzerland, about the positives of outsourcing, focusing on the point that achieving the maximum benefits requires a long-term view and real collaboration by both partners.
Agilent Ships Real-time Oscilloscope and Probing System
(January 25, 2005) PALO ALTO, Calif. — Agilent Technologies announces that it has begun customer shipments of their real-time oscilloscope and high-bandwidth active probing system. The Agilent Infiniium 80000 series 10-, 12- and 13-GHz oscilloscopes offer more than 8-GHz bandwidth, a 40-GSa/s sample rate and full bandwidth performance to the high-impedance probe tip.
Flex Feeder Handles Wider, Longer and Deeper Pockets
(January 25, 2005) STOCKHOLM, Sweden — MYDATA automation AB's new 32-136 adjustable Flex feeder handles component tapes up to 136-mm wide, and can also be used to handle deep and long tape pockets.
SMTA and Auburn University Announce Electronics Workshop Call for Participation
(January 25, 2005) MINNEAPOLIS, Minn. — The SMTA and Auburn University CAVE are organizing the Third Annual Harsh Environment Electronics Workshop, to be held June 28-29, 2005, in Indianapolis, Ind. Industry professionals are invited to submit an abstract to participate in this program.
Experts to Explore Lead-free Challenges in Free Webinar
(January 25, 2005) FRANKLIN, Mass. — SMT manufacturing experts will explore lead-free SMT manufacturing process challenges in a free, live Webinar set for Thursday, February 17, 2005, at 11:00 a.m. (EST).
Compliant Interconnects Meet SAE/USCAR Requirements
(January 24, 2005) SAN DIEGO, Calif. — AutoPliant 0.64- and 0.81-mm thick compliant interconnects are developed specifically for high-amperage requirements, such as automotive applications. The rugged environment in automotive designs place stringent demands on solder-less type interconnections to consistently maintain optimal retention force, and high current-carrying capacity.
IPC Holds First Standards Meeting in Dongguan
(January 24, 2005) BANNOCKBURN, Ill. — More than 15 companies gathered for the first IPC standards meeting in China sponsored by IPC—Association Connecting Electronics Industries. The meeting, held in conjunction with the IPC and Hong Kong Printed Circuit Association (HKPCA) trade show, took place on December 10, 2004 in Dongguan.
NPL Conference Concentrates on Lead-free Solder Reliability
(January 21, 2005) TEDDINGTON, MIDDLESEX, U.K. — At their Winter Conference, NPL's Soldering Science & Technology Club included an update on RoHS from the Department of Trade and Industry (DTI), plus invited presentations on the latest research from the Swedish Institute of Metals Research, Loughborough and Greenwich University. In addition, the most recent research from DTI-funded projects at NPL was presented.
ESD Association Appoints New Senior VP
(January 21, 2005) ROME, N.Y. — During the December board meetings, the ESD Association Board of Directors elected Kay Adams as the senior VP for 2005.
Speedline Expands Distribution Network in Asia
(January 21, 2005) FRANKLIN, Mass. — Speedline Technologies has announced a business partnership agreement with Schmidt & Co. (H.K.) Ltd. that will expand Speedline's growing business network in Asia.
Twin PTC Thermistors Reduce Assembly Time
(January 20, 2005) MALVERN, Pa. — 2322 673 xxxxx twin vertical SMD PTC devices from Vishay Intertechnology Inc. are constructed from a ceramic disc and reflow-soldered to a lead frame, resulting in a flat pick-up area of 30 mm² to facilitate automated assembly.
China Eyes European Environmental Directives
(January 20, 2005) COLLEGE PARK, Md. — China's government authorities are increasingly looking to not just Europe's electronics takeback directives, WEEE and RoHS, but are also eyeing a total of six other environmental directives, according to Richard Ferris. Ferris is a China legal expert and partner at the international law firm of Holland & Knight LLP, and will speak at a Raymond Communications China teleconference on February 7.
IHS and GlobalSpec Form Alliance
(January 20, 2005) ENGLEWOOD, Colo., and TROY, N.Y. — IHS Inc. (
) has announced the immediate availability of the newest addition to the comprehensive IHS lineup of Engineering Content products, GlobalSpec Enterprise.
New Low-VOC Flux Technology Ideal for Lead-free
(January 19, 2005) LONDONDERRY, N.H. — 94QMB9 low-VOC soldering flux from Cobar Solder Products is suited for lead-free soldering in wave and selective soldering systems. It evaporates more readily than VOC-free formulations, reducing preheating time and the potential for oxidation and splatter.
Indium Announces Silver Quill Award Winners
(January 19, 2005) CLINTON, N.Y. — Indium Corporation of America's Silver Quill Award was developed to encourage and incentivize individuals for authoring technical reports, presentations, articles and books. Eligible individuals are awarded points throughout the year based on the number and quality of their written material or presentations, and the importance of the venue (regional vs. international).
BEST and its Partners Launch Suite of Lead-free Training Courses
(January 19, 2005) ROLLING MEADOWS, Ill. — Business Electronic Soldering Technologies (BEST) Inc., Cookson Electronics Assembly Materials and Automated Learning Corp. (ALC) announce the launch of their suite of lead-free assembly training courses. This suite of technical training courses, available on CD-ROM, via the Internet or installed on large customer intranets, is part of Automated Learning's Learntech series.
New TVS Diodes Offer Voltage and Energy Protection
(January 18, 2005) DES PLAINES, Ill. — Littelfuse Inc. has announced the expansion of its TVS Diode product lines to include the new 400- and 1500-W products. The 400-W parts are available in both the P4KE series axial leaded package (DO-41), and the SMA series surface-mount package (DO-214AC). The SMC series 1500-W surface-mount package (DO-214AB) is also available.
Teradyne Makes Technology Investments in PCB Capabilities
(January 18, 2005) NASHUA, N.H. — Teradyne Inc.'s Connection Systems Division announces the formation of a focused PCB Technology Team that will develop and introduce new products and processes to meet PCB technology requirements for the future. The team is comprised of veteran PCB engineers who will be committed full-time to the project.
IPC Expo/APEX/Designers Summit Exhibit Space 99% Sold
(January 17, 2005) BANNOCKBURN, Ill. — With more than 465 exhibitors signed on to participate in the 2005 IPC Printed Circuits Expo/APEX/Designers Summit exhibition and conference, only 1,200 sq. ft. of a total of 158,500 sq. ft. of booth space is currently available. In addition, more than 50 new exhibitors have signed on, eager to take their places amongst the other exhibitors and more than 10,000 visitors expected to attend.
DEK Names New Product Manager for European Distributed Products
(January 17, 2005) FLEMINGTON, N.J. — DEK has appointed Guler Basol as the new product manager for its European Distributed Products (Consumables) division, based in Germany. Basol brings substantial sales and product management experience to the role, gained within the automotive industry.
MLCC Capacitors Offer a Smaller Alternative to SMDs
(January 17, 2005) SCHAUMBURG, Ill. — TAIYO YUDEN (U.S.A.) Inc.'s ultra-small EIA 0402 case size (1.0 x 0.5 x 0.5 mm) has been added to its CFCAP line of low-distortion surface-mount multilayer ceramic capacitors (MLCC).
Laser Structuring System for PCB Prototyping Available
(January 14, 2005) WILSONVILLE, Ore. — LPKF Laser & Electronics announces the new ProtoLaser 100, a high-performance laser structuring system for PCB prototyping. It is ideal for producing high-quality RF and microwave boards on a variety of materials, from FR4 to PTFE-based substrates, as well as for structuring, cutting and drilling.
Integrated Dual Inductor Introduced
(January 13, 2005) SAN DIEGO, Calif. — PA0766NLT Power Bead inductor from Pulse contains two independent inductors integrated into a single core structure, with no magnetic coupling between the two inductors. Although typically used for double-data-rate (DDR) memory, multi-phase CPU power and other desktop, portable and server computing applications, it can also be used in two- and four-phase telecom power systems.
UV-cure Encapsulants for Smart Card ICs Released
(January 13, 2005) CITY of INDUSTRY, Calif. — Hysol 3323, Hysol 3327 and Hysol 3329 UV-cure encapsulants for use in Smart Card IC module manufacturing are now available from Henkel Technologies. Hysol 3323 has high viscosity and a thixotropic nature, and is used to form the dam, while Hysol 3327 and 3329 are both low-viscosity materials used for the fill process.
Adapter Provides Pin-for-Pin Replacement for Aromat Relay
(January 12, 2005) FRENCHTOWN, N.J. — Aries Electronics has introduced the Correct-A-Chip 08-305984-11 adapter, which features the old Aromat footprint on the bottom of the adapter and a new TX2SA-1V solid-state relay on the top. The new relay has the same operating characteristics and specifications as the Aromat part.
Assembleon Installs Placement Machine at Auburn University
(January 12, 2005) AUBURN, Ala. — The Laboratory for Electronics Assembly and Packaging (LEAP) at Auburn University has announced the installation of an Assembleon ACM Micro into its advanced SMT and flip chip line. The ACM provides fine-pitch and high placement accuracy capability for 01005 chip components, advanced flip chip devices and 3-D modules.
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