Kester Receives Patent for Encapsulant Technology
(January 5, 2005) DES PLAINES, Ill. — Kester announces that on November 16, 2004, it was awarded with a patent for its Reflow Encapsulant technology, including material and method of use.
DEK and Kester to Present Latest Findings on Lead-free
(January 5, 2005) FLEMINGTON, N.J. — DEK and Kester have teamed up to present a full-day lead-free seminar in Costa Rica on January 19, 2005. Throughout the event, several lead-free manufacturing issues will be discussed, including the latest lead-free alloys, lead-free wave soldering, the reliability of lead-free and the global impact of lead-free compliance.
Visualization Component Added to PCB Repair Software
(January 5, 2005) NEWPORT BEACH, Calif. — Router Solutions Inc. (RSI) will integrate CAMCAD OCX as a visualization component in EO Tech's ProgressIt software for PCB repair applications. When embedded into the EO Tech application program, the OCX module provides visualization of intelligent PCB data using Application Programming Interface (API) calls to display information.
Design Software Saves Design Time
(January 5, 2005) BUCHANAN, Mich. — FMSsoft design software version 7.0 from Bosch Rexroth Corp. works with existing installations of AutoCAD 2000 and later versions, letting customers design factory structures and equipment in 3-D using current aluminum framing, ergonomic workstation or conveyor products from Bosch Rexroth.
Lead-free Seminar Coming Soon
(January 4, 2005) CLINTON, N.Y. — Indium Corporation of America will sponsor another lead-free seminar in their lead-free QuickStart series. Right around the corner, the seminar is scheduled for February 9-10, 2005, in Ft. Lauderdale, Fla.
High-resolution Vision Sensor Available
(January 4, 2005) ORLANDO, Fla. and NATICK, Mass. — In-Sight 5100C high-resolution (1024 x 768) vision sensor from Cognex performs a wide range of color inspection tasks, such as use in the automotive industry to identify motor camshafts by color, and in the electronics industry to verify the correct position of color LEDs at electrical test stations.
Agilent Ships One Millionth FBAR Filter
(January 3, 2005) PALO ALTO, Calif. — Agilent Technologies announces that it has shipped its 100 millionth FBAR (film bulk acoustic resonator) filter since its release in December 2001. Demand has been so strong that Agilent has increased its shipments to six million per month. FBAR filters are used in mobile phones, data cards and other wireless products operating in the U.S. PCS frequency band.
Universal is Named a "Most Influential Enterprise" in China
(December 30, 2004) BINGHAMTON, N.Y. — To celebrate its 20th anniversary this year, China's flagship information technology publication, China Electronic News, jointly organized an awards event to identify "The Most Influential Enterprises in China's Information Technology in 20 Years." On December 15th, 2004, Universal Instruments was named one of the top 40 businesses at a ceremony hosted by the Ministry of Information Industry - People's Republic of China.
SMT China Applies for BPA Worldwide Business Publication Membership
(December 16, 2004) SHELTON, Conn. — SMT China has applied for membership in BPA Worldwide.
SMT China is published by SMT Publishing China (Beijing, China). BPA Worldwide will track circulation for SMT China, based on business/distribution, demographics and geographic coverage. The magazines will have 12 months to complete their initial circulation audit.
Microtek Standardizes on BP Microsystems Programming Equipment
(December 16, 2004) Houston, Texas — BP Microsystems, announces that Microtek Inc., a programming center in Japan, has chosen its programming equipment for a new programming services facility in Isehara, Kanagawa, Japan.
InterLatin to Provide Local Service and Support for Vitronics Soltec in Mexico
(December 15, 2004) Stratham, N.H. — Vitronics Soltec announces a partnership agreement with InterLatin, a manufacturer's representative and service organization to the electronics manufacturing industry in Mexico. As of January 1, 2005, InterLatin will offer local service and support for all Vitronics Soltec soldering systems installed in Mexico. Vitronics Soltec and InterLatin have been working together successfully for two years.
Placement Machines to Debut at APEX
(December 14, 2004) Binghamton, N.Y. — At APEX 2005, to be held February 22-24, 2005, in Anaheim, Calif., Universal Instruments will demonstrate its AdVantis and GSM Genesis platform placement machines. In addition, the Polaris Assembly Cell, Dimensions software and Optima Plus planning and process support services will also be shown.
Packaging Technologies Challenge Inspection Market
(December 14, 2004) Palo Alto, Calif. — The widespread use of packaging technologies, such as CSP and BGAs in electronics manufacturing, makes it vital for inspection system companies to realign their product development strategy to keep pace with such sophisticated technology.
DEK Improves Website to Boost Customer Experience
(December 13, 2004) Flemington, N.J. — DEK has launched its new Website, designed to provide improved navigation, easy access to the latest production-enhancing technical data, online machine management and the ability to interact with other DEK users. All of this is accomplished from a single interface, simplifying informational access for visitors.
Chip Designers Face New Challenges
By Julia Goldstein, Ph.D., SMT Technical Editor — Much of the information presented at the Mentor Graphics' Editors and Analysts Day, centered on chip design. Chip designers are facing interesting challenges at the 90-nm node, including ensuring that their designs can be manufactured and how to verify that a design that can be manufactured actually functions as it is supposed to.
Teradyne Joins LXI Consortium
(December 10, 2004) North Reading, Mass. — Teradyne has joined the LXI Consortium, the recently formed standards organization. The LXI Consortium is a not-for-profit corporation made up of leading test and measurement companies. The group's goals are to develop, support and promote the LXI standard.
Embedded Passive NPL Masterclass Well Received
(December 9, 2004) Teddington, Middlesex, U.K. — At the recent National Physical Laboratory (NPL) Masterclass, part of the ongoing series inviting world-class presenters to Teddington, Dr. Richard Ulrich, author of the book, "Integrated Passive Component Technology," gave a comprehensive discourse on the current and future benefits of embedded passives.
RF Micro Devices Ships One Million Transceiver Chipsets
(December 9, 2004) Greensboro, N.C. — RF Micro Devices Inc. (RFMD), a provider of radio frequency integrated circuits (RFICs) for wireless communications applications, announces that it has shipped one million EDGE cellular transceiver chipsets.
ECA Monthly Order Index Bounces Again in November
(December 8, 2004) Arlington, Va. — The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA) took another monthly bounce in November, this time dipping after a rise in October. The index's 12-month moving average has come down a bit over the last three months, but is still several percentage points ahead of this time last year.
2004 International Wafer-Level Packaging Congress Announces Best Paper
(December 8, 2004) Minneapolis, Minn. — Speakers at the first International Wafer-Level Packaging Congress (IWLPC), held October 10-12, 2004, in San Jose, Calif., addressed leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging. As rated by the attendees, the Best Paper Award was presented to Dr. Udo E. Frank of FEINFOCUS GmbH (Garbsen, Germany).
SCS Expands Presence in China with Parylene Coating Facility
(December 7, 2004) Indianapolis, Ind. — Specialty Coating Systems (SCS), a business unit of Cookson Electronics, has announced the recent opening of SCS Shanghai, a full-service Parylene conformal coating facility in China. The facility will allow SCS to better serve its customers, respond to the growing demand for its specialized Parylene coating services in Asia and bring its technology to the region.
DEK and Stork Join to Develop Electroform Stencils
(December 6, 2004) Flemington, N.J. — DEK has signed an exclusive OEM partner agreement with Stork Veco, a European manufacturer of electroform stencils. The companies have joined forces to develop electroformed stencils for the SMT industry and the semiconductor market.
Speedline Appoints New VP of Marketing and Business Development
(December 6, 2004) Franklin, Mass. — Speedline Technologies announces the appointment of Keith Favre as the VP of marketing and business development. As business has improved in 2004, the company is increasing its focus on business development initiatives to support existing and new markets and optimize the overall marketing strategy.
Endicott Interconnect Technology Receives Second Issued Patent
(December 3, 2004) Endicott, N.Y. — Engineers at Endicott Interconnect Technology didn't skip a beat when the company formed in 2002. The flow of innovative ideas and patent applications continued unabated. Because of this, Endicott has recently received its second issued patent.
DEK Reveals Findings from U.K. Stencils Technology Day
(December 2, 2004) Weymouth, U.K. — DEK held a Stencils Technology Day at its Weymouth, U.K. office on November 25 to share the findings from its recent lead-free print trials, and provide hands-on experience of stencil technologies and their applications.
electronica 2004 Boosts Industry Optimism
(December 1, 2004) Munich, Germany — electronica 2004, a trade show for components, assemblies and high-growth applications, signalled increased momentum in the global electronics industry as international visitors and exhibitors once again flocked to the New Munich Trade Fair Centre.
Siemens and RIT Partner to Offer New Lean Manufacturing Training
(December 1, 2004) Norcross, Ga. — The Electronics Assembly Systems Division of Siemens Logistics and Assembly Systems (EA) is providing a Lean Manufacturing Course for the Americas. The first two-day course is scheduled for January 26 and 27, 2005, in partnership with the Center for Electronics Manufacturing & Assembly (CEMA) at the Rochester Institute of Technology (RIT), Rochester, N.Y.
Cookson and ALC Launch Suite of Lead-free Electronic Assembly Training Courses
(November 30, 2004) Jersey City, N.J.—Cookson Electronics Assembly Materials and its partner Automated Learning Corp. (ALC) announce the launch of their suite of lead-free assembly training courses. This suite of technical training courses is part of ALC's Learntech series. Its modular interactive multimedia learning approach is designed for process engineers, managers and senior operators involved in the implementation and management of lead-free electronic assembly processes.
Indium Announces New Distributor in Europe
(November 29, 2004) Clinton, N.Y.—Indium Corporation of America has announced that GPS is their newest distributor in Europe, covering Germany, Croatia and Slovenia. The GPS team has many years of experience in the electronic assembly industry, and will be responsible for selling Indium's line of solder pastes and wave solder fluxes.
Universal Extends Price Reductions to Generation 8 Machines
(November 29, 2004) Binghamton, N.Y.—Universal Instruments has announced price cuts for its Generation 8 insertion machines, having recently announced similar reductions for surface-mount placement platforms. The most popular insertion machine configurations will reduce in price from between 8 and 20%.
Dage Appoints New Eastern Regional Sales Manager
(November 24, 2004) Fremont, Calif.—Dage Precision Industries, an X-ray and bondtester technology company, announces the appointment of John Travis as Eastern regional sales manager for Dage's suite of X-ray systems.
N.H.-based Company Resells Electronics Assembly/Test Equipment
(November 23, 2004) Nashua, N.H.—In the pre-owned electronics manufacturing equipment market, most vendors sell assembly/test systems "as is," with little or no after-sales support. Nashua, N.H.-based Lewis and Clark Inc. (LCI) offers the same services expected when purchasing the equipment new from an OEM vendor.
FEINFOCUS Partners with IslandTek in Taiwan
(November 22, 2004) Stamford, Conn.—FEINFOCUS, a manufacturer of high-resolution X-ray inspection systems and tubes, announces their new partnership with IslandTek International, a PCBA equipment sales company headquartered in Taiwan. IslandTek represents the entire line of FEINFOCUS X-ray inspection systems for the PCBA industry in Taiwan.
DEK Machines Add New Interface to Aegis Software Tools
(November 22, 2004) Flemington, N.J.—DEK has completed development of machine interfaces to NPI and MES software tools from Aegis Industrial Software Corp., allowing manufacturing and process engineers using DEK screen printing platforms to maximize machine uptime, improve process monitoring and reduce operator mean-time-to-assist (MTTA) from within the Aegis system.
DEK Signs First North American VectorGuard Licensee
(November 19, 2004) Flemington, N.J.—DEK announces that SolderMask Inc. of Huntington Beach, Calif. has been signed as the first North American licensee of DEK's VectorGuard stencil technology. Under the terms of the agreement, SolderMask will manufacture VectorGuard stencils from foil blanks supplied by DEK and will also provide customers with VectorGuard frames.
SMTA Announces Call for Papers for SMTAI 2005
(November 19, 2004) Minneapolis, Minn.—The SMTA Technical Committee is announcing the Call for Papers for SMTA International 2005, to be held September 25-29, 2005, at the Donald E. Stephens Convention Center in Rosemont, Ill.
Parvus and Eurotech SpA Sponsor PC/104 Design Contest
(November 18, 2004) Salt Lake City, Utah & Amaro, Udine, Italy—Parvus Corp. and Eurotech SpA now sponsor the PC/104 Design Contest hosted by the PC/104 Embedded Consortium. Customers of both companies are encouraged to submit their entries for the contest to the Consortium by December 10, 2004.
IPC's EMS Management Council Meeting to Address Lead-free
(November 18, 2004) Bannockburn, Ill.—What does lead-free mean to an EMS executive? And, what do market predictions forecast? These are just a couple of the questions that will be addressed during a day-long IPC EMS Management Council Meeting, to be held Monday, February 21, 2005, in Anaheim, Calif., in conjunction with the IPC Printed Circuits Expo, APEX, Designers Summit and the Electronic Circuits World Convention 10.
Nexlogic Technologies Receives ISO 9001:2000 Certification
(November 16, 2004) San Jose, Calif.—Nexlogic Technologies Inc., a PCB service provider, announces that it has been awarded ISO 9001:2000 certification as part of its business strategy for continuous improvement of its services and products.
IPC Honors Individual for Work on IPC-9194 Guideline
(November 15, 2004) Hudson, N.H.—Michael Sivigny of CeTaQ Americas was recently among 13 individuals honored by IPC (Association Connecting Electronics Industries) for their leadership and significant contributions in the development of IPC-9194, Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline. The awards were presented at IPCWorks 2004, held October 24-28 in Minneapolis, Minn.
Asymtek Signs New Distributor Agreement
(November 12, 2004) Carlsbad, Calif.—Asymtek has recently added a new team of sales representatives, Fuji Do Brasil MÃ¡quinas Industriais LTDA, to market their automated fluid dispensing systems throughout South America and Brazil. Fuji Do Brasil is headquartered in Sao Paulo, with branches in Manaus and Campinas. All facilities have show rooms that feature demo equipment and offer customer training, on-site equipment service and spare parts.
Siemens Strengthens Logistics Division
(November 11, 2004) Grand Rapids, Mich.—Siemens announces that it has finalized the integration of Siemens Dematic Corp. of Grand Rapids, Mich., Siemens Dematic Postal Automation L.P. of Arlington, Texas and Siemens Dematic Electronic Assembly Systems of Norcross, Ga. The combined organization is called Siemens Logistics and Assembly Systems Inc. (Siemens L&A).
Solectron to Manufacture the Personal Internet Communicator Introduced by AMD
(November 11, 2004) Mumbai, India—Solectron Corp. announces that it has been chosen to manufacture the Personal Internet Communicator (PIC), a new consumer device that was developed and designed by AMD. The PIC was developed to provide affordable computing and Internet access in high-growth markets, with the goal of providing 50 percent of the world's population with Internet access and computing capabilities by the year 2015.
10th Pan Pacific Symposium & Exhibit Program Announced
(November 11, 2004) Minneapolis, Minn.—The 10th Annual Pan Pacific Microelectronics Symposium & Exhibit, to be held January 25-27, 2005 at the Sheraton Kauai Resort in Kauai, Hawaii, promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the Pacific Basin.
Cleaning and Lead-free Topics at SMTA Chapter Meeting
(November 10, 2004) Nashville, Tenn.—The SMTA Intermountain Chapter will hold its next meeting focusing on cleaning and lead-free on Thursday, November 11, 2004, at Computrol, Meridian, Idaho.
Valor Announces Version 7.3 of Trilogy 5000 Assembly and Enterprise 300 DFM Solution
(November 10, 2004) Munich, Germany—Valor Computerized Systems announces that it has released version 7.3 of its Trilogy 5000 solution for PCB process preparation and assembly programming operations, and its Enterprise 3000 premium DFM solution for virtual manufacturability and physical design verification of CAD data. Version 7.3 is now shipping and available through Valor sales offices and integration partners worldwide.
First International WLP Congress Successful
(November 10, 2004) Minneapolis, Minn.—The first International Wafer-Level Packaging Congress
(IWLPC) that was held October 10-12, 2004 at the Doubletree Hotel in San Jose, Calif. was a great success. Co-sponsored by the SMTA and Chip Scale Review Magazine, it included two days of exhibits and a three-day technical program that focused on leading-edge IC packaging and test technologies with special emphasis on 3D stacked packaging.
Raw Materials Prices Now Available on IPC Website
(November 10, 2004) Bannockburn, Ill.—Raw materials prices, especially metals, have a direct impact on the cost of producing electronics and affect the entire electronics supply chain. To increase awareness of metals prices, the IPC (Association Connecting Electronics Industries) is providing a new addition to its Website.
Agilent Develops In-Circuit Test Methodology for High-Density Board Designs
(November 9, 2004) Palo Alto, Calif.—Agilent Technologies announces that it has developed bead probe methodology for in-circuit test of high-speed and high-density PCBs. Bead probe technology addresses the needs of electronics contract manufacturers for accurate testing of increasingly complex PCBs, such as those used in communications and computing.
V.J. Electronix Opens New Office in Georgia
(November 9, 2004) Bohemia, N.Y.— V.J. Electronix, an X-ray inspection technology and rework systems company, announces the opening of its newest office in Georgia.
Ion Publishes Paper on Getting Accurate Measurement Picture for AC Ionizers
(November 8, 2004) Berkeley, Calif.—Ion Systems Inc. announces that it has published the newest addition to its line of Technology Solution technical papers, titled "Getting the Full Picture from Your Charge Plate Monitor." The paper describes the limitations of measuring AC ionizers with only a charge plate monitor (CPM), and recommends how to see previously invisible maximum offset voltages produced by AC ionizers.
NEMI Summit Focuses on RoHS/WEEE Compliance Concerns
(November 8, 2004) Herndon, Va.—Nearly 190 people discussed concerns with the quickly approaching deadlines for the European Union's (EU) RoHS (Restriction on use of certain Hazardous Substances) and WEEE (Waste from Electrical and Electronic Equipment) directives at the recent NEMI RoHS/Lead-free Summit in Louisville, Colo. on October 18-20, 2004.
SchmartBOARD Announces November 2004 Contest Winners
(November 5, 2004) Fremont, Calif.—SchmartBOARD is giving away six combination packs a month in the U.S. and Canada. Two will be given to professional engineers, two to engineering students and two to electronics hobbyists each month. Similar contests are running in other countries in partnership with SchmartBOARD distributors. One only has to sign up once to be entered automatically every month.
DEK Announces Appointment of Americas Operations Manager for Process Support Products
(November 5, 2004) San Jose, Calif.—DEK has appointed Steve Hunter to the position of Americas Operations Manager for Process Support Products, supporting the company's logistics infrastructure and manufacturing operations for DEK's stencil, tooling and consumables products.
BPA Issues New FPC Report
(November 4, 2004) Surrey, U.K.—In their new report, BPA shows the key growth areas for flexible printed circuits (FPC) over the next five years will be in mobile phones, display interconnects, digital cameras and PDAs. New applications using flex and flex-rigid substrates in the medical, aerospace and military markets will also emerge; however, BPA predicts that these markets will remain relatively small in comparison to the mobile phone, display and camera markets.
IPC's SPVC Releases Data on Lead-free Alloy Comparison
(November 4, 2004) Bannockburn, Ill.—The IPC and its Solder Products Value Council (SPVC) announce the release of a white paper, summarizing Phase 2 of a three-phase, million-dollar research and testing program on tin/silver/copper lead-free alloys.
DEK Central Europe Technological Conference Provides Opportunities, Establishes Communication Platform
(November 4, 2004) Berkshire, U.K.—Companies involved in the Romanian and Bulgarian SMT industries came together at DEK Central Europe's Technological Conference on October 1, 2004, held in Poiana Brasov, Romania.
Three-Five Systems Expands E-business Initiatives with Future Electronics
(November 3, 2004) Tempe, Ariz.—Three-Five Systems (TFS) announces that it has extended its electronic purchase order transaction system to include Future Electronics. The two companies are interfacing via RosettaNet standard Partner Interface Process (PIP). RosettaNet is a non-profit consortium of more than 500 technology organizations working to create, implement, and promote open e-business standards and services.
Mainland China Semiconductor Fab Building Not Making Dent in Internal Needs
(November 3, 2004) New Tripoli, Pa.—Skyrocketing consumption of ICs in Mainland China is outpacing growth in domestically made ICs, despite huge expansion programs, according to the report, "Mainland China's Semiconductor and Equipment Markets: A Complete Analysis Of The Technical, Economic and Political Issues," recently published by the Information Network, a market research company.
Solectron Receives Teradata's 2004 Supplier Excellence Award
(November 3, 2004) Milpitas, Calif.—Solectron Corporation, a provider of electronics manufacturing and supply chain services, announces that it has been awarded Teradata's 2004 Supplier Excellence Award for superior execution and supply chain service. Teradata is a division of NCR Corp.
SMTA Announces Call for Participation for Medical Electronics Symposium
(November 2, 2004) Minneapolis, Minn.—The SMTA announces plans for the 2005 Medical Electronics Symposium to be held April 26-27, 2005, in Minneapolis, Minn. The conference chairman is Jeff Kennedy of Celestica Inc., and the call for papers is now open through December 3, 2004.
SMTA Announces Board of Directors Election Results
(November 1, 2004) Minneapolis, Minn.—The SMTA announces its election results for the Board of Directors for the term that began at SMTA International, which occurred September 26-30, 2004.
GlobalSpec Announces Expanded Partnership with PennWell
(November 1, 2004) Troy, N.Y.—GlobalSpec, a search engine and online resource for engineers and technical buyers, announces an expanded partnership with PennWell Corporation, a business-to-business media company providing print and online publications across multiple industries.
HumiSeal VP/GM Retires after 44 Years of Service
(October 29, 2004) Pittsburgh, Pa.—HumiSeal announces that John Waryold, after 44 years of contribution, retired on August 31, 2004. He began his career in 1960 in the lab and progressed in responsibility through lab management, technical service and sales, and most recently served as the VP and GM for 20 years.
IPC Releases Book-to-Bill Ratios and IMS/PCB Business Report for September 2004
(October 29, 2004) Bannockburn, Ill.—IPC, the Association Connecting Electronics Industries, announces the findings from its monthly PCB Statistical Program.
U.S. Digital Purchases Siemens Siplace CF Machine
(October 28, 2004) Norcross, Ga.—After winning a contract for one year of free use of a Siemens Siplace placement machine, U.S. Digital Corporation, based in Washington, has purchased the equipment. This decision came as a result of the Siplace CF's performance and the entire relationship with Siemens.
Cookson Electronics Assembly Materials Group Appoints New Regional Marketing Manager
(October 27, 2004) Jersey City, N.J.—Mike Murphy was recently appointed regional marketing manager for Cookson Electronics Assembly Materials Group (CEAMG). In this role, he will be responsible for all aspects of marketing new and existing products, as well as identifying opportunities for new product development in the Americas region.
IPC Releases New Revisions through Dynamix Technology
(October 27, 2004) Kidlington, Oxfordshire, U.K.—The IPC has released Revision B to IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, and Revision G to IPC-A-600, Acceptability of Printed Boards, both available through Dynamix Technology.
YESTech Announces Sale of 100th System to Apsco
(October 27, 2004) San Clemente, Calif.—YESTech Inc. has announced the shipment of its 100th YTV automated optical inspection (AOI) system to Apsco International, a Cleveland-based provider of electronics manufacturing services (EMS). The system is one of two
that were purchased by Apsco and incorporates YESTech's side-viewing Thin Camera technology for maximum defect coverage.
4th Dimension PCB Moves Offices to Florida
(October 26, 2004) Sunrise, Fla.—The move stems from 4th Dimension PCB's growth in the last year. 4th Dimension PCB is an engineering service and PCB design center, with expertise in Mentor Graphic Expedition and PADS software and services through on-site support with contractors or outsourcing to their design center.
Elcoteq to Manufacture Vitelcom's Mobile Phones in Manaus, Brazil
(October 26, 2004) Irving, Texas—Elcoteq Network Corporation, global provider of EMS for the communications technology industry, has signed an agreement with Vitelcom Mobile Technology to manufacture CDMA phones on a turnkey, assemble-to-order basis, ready for distribution to end-users. Manufacturing will begin in Manaus, Brazil in late October 2004.
Sherwood Technology Opens New Applications Laboratory
(October 26, 2004) Widnes, Cheshire, U.K.—Sherwood Technology Ltd. announces the launch of its Applications Laboratory. This facility demonstrates the future possibilities of laser marking, enabling current and potential licensees and end users to test the final results of using Sherwood's color-change technologies to mark their products using a wide range of lasers.
Cookson Electronics Appoints New Global Director of Product Management
(October 25, 2004) Jersey City, N.J.—Bruce Moloznik was recently appointed global director of product management for Cookson Electronics Assembly Materials Group (CEAMG). He will direct the global product management team that is responsible for all ALPHA branded products and for the execution of all product line strategies, including Product Technology Road Mapping, New Product Development and the Global Lead-Free Knowledge Network initiative.
Solectron Appoints Matti Virtanen President of EMEA
(October 25, 2004) Milpitas, Calif.—Solectron Corporation, a provider of electronics manufacturing and integrated supply chain services, has appointed Matti Virtanen to the newly created position of senior VP and president of Europe, the Middle East and Africa. He joined the company on October 4, 2004.
International Rectifier's iPOWIR Building Block Wins Award in China
(October 25, 2004) Los Angeles, Calif.—International Rectifier (IR) announces its iP1201 iPOWIR power building block has won the "Top 10 DC-DC Award" from Electronic Products China (EPC) magazine. The iP1201 is the industry's first dual-output, two-phase DC-DC power block in a single BGA package for synchronous buck applications.
FEINFOCUS Forms Alliance with Unicraft in Japan
(October 22, 2004) Stamford, Conn.—FEINFOCUS announces their new alliance with Unicraft Co., a technical sales company headquartered in Tokyo, Japan. Unicraft represents the entire line of FEINFOCUS X-ray inspection systems for the electronics and semiconductor industry in Japan.
ZESTRON to Host Precision Cleaning, Lead-Free and Climatic Reliability Workshop
(October 22, 2004) Ashburn, Va.—In association with Kester, Heller Industries and Trek Industries, ZESTRON is hosting a one-day workshop on November 9, 2004, in Tampa, Florida. Topics will range from cleaning, lead-free and potential long-term risks associated with lead-free.
Dow Announces Epoxy Resin Price Increases for North America
(October 21, 2004) Midland, Mich.—Effective November 15, 2004, or as contract terms allow, Epoxy Products and Intermediates (EP&I) of the Dow Chemical Company will be increasing its prices for epoxy resins in North America.
SchmartBOARD to Give Free Samples of Prototyping Boards
(October 21, 2004) Fremont, Calif.—SchmartBOARD, a company that manufactures a new type of prototyping board, has announced a program to give out free samples.
Indium Announces New Agent in Arizona
(October 21, 2004) Clinton, N.Y.— Indium Corporation of America is now represented in the Arizona area by Bobet Corporation. Founded in 1997, Bobet will service and sell Indium's complete line of assembly products. Bob Bracher, president of Bobet, has over 25 years of national and international sales and marketing experience in the electronics industry.
Nepcon 2005's New Exhibition Director Praises Strong Formula
(October 20, 2004) Surrey, U.K.—Nepcon 2005 will return to the Hilton Metropole in Brighton, on May 11-12, 2005, Reed Exhibitions has confirmed. Retaining the successful format of Nepcon 2004, the 2005 event will allow visitors to get to grips with advanced assembly methods in the Nepcon Lead-Free Experience, and to benefit from Nepcon's traditional comprehensive program of topical seminars. These are presented by key figures who are recognized as experts in their respective fields.
QC Industries Releases Fall 2004 Catalog
(October 20, 2004) Cincinnati, Ohio—QC Industries introduces a new catalog featuring a complete selection of their 125 Series conveyors, including cleated belt, corrosion-resistant, magnetic conveyors, 125 Z Series and 250 Series low-profile conveyors and accessories.
KIC Forms Partnership with Tamura Corporation
(October 19, 2004) San Diego, Calif.—Tamura H. A., known for its reflow ovens and wave solder machines with small footprints, has established a partnership with KIC. This new cooperation enables Tamura H.A. to sell KIC products together with its lead-free ready reflow ovens and wave solder machines.
Adept Technology Announces i-Series Robot Advantage Promotion
(October 19, 2004) Livermore, Calif.—Adept Technology Inc., a leading manufacturer of robotic systems, motion control and machine vision technology, announces its i-Series Robot Advantage Promotion for the Adept Cobra i600 and i800 robots. The promotion is designed to offer customers the competitive advantage of robotic automation over dedicated production lines or offshore manufacturing.
Solectron Completes Microtechnology Divestiture
(October 19, 2004) Milpitas, Calif.—Solectron Corporation, a leading provider of electronics manufacturing and integrated supply chain services, says that it has completed the sale of its Microtechnology business to Francisco Partners.
MW Associates Announces Lead-free Series of Seminars in China
(October 18, 2004) Naples, Fla.—Megan Wendling, president of MW Associates, publisher of Lead-Free Magazine.com and a global, all-electronics marketing agency has recognized a need within the electronics industry and has introduced of a series of lead-free seminars to be held throughout China in 2004 and 2005.
Milara Unveils Updated Web Site
(October 18, 2004) Medfield, Mass.—Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and wafer printing applications, offers users a thorough and information-rich resource at www.milarasmt.com.
WEEE services introduced by Ageus Solutions
(October 15, 2004) Ottawa, Ontario, Canada—Ageus Solutions announces the launch of a complete, end-to-end WEEE compliance package. Ageus is now ready to provide full-service logistical, operational, financial and engineering solutions for issues related to WEEE fulfillment.
DEK's Micron-class Platform Nets EID's Assembly Solution of the Year Award
(October 14, 2004) Flemington, N.J.—DEK's new Micron-class high accuracy mass imaging platform is the Assembly Solution of the Year, judges at the Electronic Industry Design (EID) Awards decide. The important technologies designed into the Micron-class, which includes the Europa and Galaxy configurations, caught the panel's imagination over strong entries by other equipment and material developers.
Pro-Mation to Attend Upcoming SMTA Waukesha, WI Event
(October 13, 2004) Kenosha, Wis.—Pro-Mation Inc. announces that president Gary Goldberg will be present at the SMTA's upcoming Electronics Assembly Technology Forum and Vendor Expo, on Tuesday, October 19, 2004.
Speedline Technologies Schedules Free Monthly Technical Webcast Seminars
(October 13, 2004) Franklin, Mass.—Speedline Technologies has scheduled a series of free monthly technical webcast seminars exploring the major challenges facing engineers in the semiconductor manufacturing process. Each of the seminars, to be hosted by industry experts, will include the sharing of "knowledge-in-process" expertise, how-to insights and a Q&A session.
Kester to hold Lead-free Mini-Clinic at MexitrÃ³nica 2004
(October 12, 2004) Des Plaines, Ill.—As the WEEE and RoHS directives take effect in Europe, and with the increased production of lead-free products in Asia, lead-free assembly in North America is gaining momentum.
Kester, Metcal, BTU International and STI Will Present Upcoming Lead-free Assembly Seminar
(October 12, 2004) Des Plaines, Ill.—Kester, Metcal, BTU International and Soldering Technology Inc. (STI) will present a series of Lead-free Technology Seminars scheduled to take place throughout 2004. The next seminar will take place Tuesday, November 9 through Wednesday, November 10, 2004, in Atlanta, Ga.
SMTA Releases Industry's First Cost Estimating Guidelines
(October 12, 2004) Minneapolis, Minn.—Featuring ProfitPro, an Excel-based software application that calculates the cost and profit related to PWB assembly, the SMTA Cost Estimating Guidelines are intended to systematically model real-time cost estimating (RTCE) in the electronics industry.
Four Free Keynoters Announced for APEX, IPC Printed Circuits Expo and the Designers Summit 2005
(October 8, 2004) Bannockburn, Ill.—IPC announces its four keynote speakers for APEX, IPC Printed Circuits Expo and the Designers Summit, to be held on February 22-24 at the Anaheim Convention Center in Anaheim, California. Each keynote address is free to all attendees.
phoenix|x-ray Establishes East Coast Headquarters, Maintains Offices on West Coast, Enhances Sales and Support Network
(October 8, 2004) St. Petersburg, Fla.—phoenix|x-ray Systems + Services, innovator of the first commercially available nanofocus x-ray system and first fully automated failure analysis system, announced it has completed the movement of its U.S. headquarters from Camarillo, Calif. to St. Petersburg, Fla.
New Global Platform Price Reductions from Universal
(October 8, 2004) Binghamton, N.Y.—Placement equipment specialist and line solution provider, Universal Instruments, has announced a significant price reduction across its best-in-class platform product ranges in all geographic regions, effective immediately. The objective is to offer customers highly competitive and identical prices around the world.
Kester Expands Into Mexico
(October 7, 2004) Des Plaines, Ill.—Kester has announced that it will open a facility in Nogales, Mexico to meet unprecedented industry demand for its interconnect solder materials. These include solder paste, wire and flux product lines.
Pro-mation to Attend Upcoming SMTA Long Island Event
(October 7, 2004) Kenosha, Wis.—Pro-mation Inc. announces that president Gary Goldberg will be exhibiting at the SMTA's upcoming Long Island, N.Y. Chapter Tabletop Trade Show and Technical Sessions on Thursday, October 14, 2004.
Industry Analysts Join MEPTEC as Co-Keynote Speakers and Session Chairs for November Conference
(October 7, 2004) Mountain View, Calif.—MEPTEC announces that industry analysts Mark Stromberg and Dan Tracy will act as session chairs and moderators for its one-day technical symposium, titled "Innovations in Equipment and Materials for Microelectronic Packaging: Complexity Drives Collaboration," to be held on November 11, 2004 at the Hyatt San Jose (San Jose, Calif.) and deliver a co-keynote presentation to kick things off.
BP Microsystems to Participate in Upcoming CEMEX Events
(October 6, 2004) Houston, Texas—BP Microsystems, a leading supplier of device programming systems worldwide, announces that it will participate in the Contract Electronics Manufacturers Conference and Exhibition (CEMCEX) that is scheduled to take place at the Bara Hotel in Budapest on October 14, 2004, and at the Czech event that will take place at the Holiday Inn in Prague on October 12, 2004.
Indium Corporation Opens China Facility
(October 6, 2004) Clinton, N.Y.—Indium Corporation of America announced the opening of their newest facility. Located in the Suzhou Industrial Park in Jiangsu, China, the facility houses solder-paste manufacturing and quality operations as well as fully integrated sales and technical support teams. This new facility offers prompt responses to customer needs to ensure world-class service throughout China.
SEMICON Japan 2004 Set For December
(October 4, 2004) Tokyo, Japan — SEMICON Japan, the world's largest exposition for semiconductor manufacturing, returns to the Makuhari Messe, Chiba, Japan, December 1 through 3, 2004. This annual exposition is organized by SEMI. More than 1,600 exhibiting companies will occupy about 4,100 booths.
Solectron Reports Improved Fourth Quarter Results
(October 1, 2004) Milpitas, Calif. — Solectron Corp., a provider of electronics manufacturing and integrated supply chain services, reported sales of $3.01 billion in the fourth quarter of fiscal 2004, up 23.4 percent from $2.44 billion in the fourth quarter of last year. Sales in the third quarter of 2004 were $3.04 billion.
SMTC Corp. Appoints Top-level Management
(October 1, 2004) Toronto, Ontario — SMTC Corp.'s board of directors announced the appointment of John E. Caldwell as the company's new president and CEO, effective immediately. Caldwell has served as interim president and CEO since October 2003, and also has been chairman of the SMTC board of directors since March 2004.
Vishay Acquires Thin-film Business from Aeroflex
(September 30, 2004) Malvern, Pa. — Vishay Intertechnology Inc. acquired the Aeroflex Pearl River Thin Film Interconnect operations, previously known as MIC Technology, from Aeroflex for $8,800,000.
Indium Corp. to Exhibit at Regional SMTA Shows
(September 29, 2004) Utica, N.Y. — Indium Corp. of America will exhibit at several regional SMTA trade shows during the month of October 2004, including:
SMTA International Wafer Level Packaging Congress (IWLPC)
in San Jose (October 10-12)
SMTA in Philadelphia (October 12)
SMTA in Long Island (October 14)
Dow Corning, INVINT Sign Joint Development Contract
(September 28, 2004) Midland, Mich. — Dow Corning Corp. signed a joint development contract with Scotland's INVINT Limited, specialists in conductive polymer interconnect technology. The agreement is expected to lead to the development of a variety of new interconnect technologies for the global electronics industry.
Air2U Uses RFMD's UltimateBlue Single-Chip Bluetooth Component
(September 28, 2004) Greensboro, N.C. — RF Micro Devices, Inc., a provider of proprietary radio frequency integrated circuits (RFICs) for wireless communications applications, announced that Air2U, a Taiwanese designer and manufacturer of wireless consumer electronics products, is using RFMD's SiW3000 UltimateBlue single-chip Bluetooth component in its USB adapter.
MEPTEC Symposium to Focus on Industry Advancements
(September 28, 2004) Mountain View, Calif. — The MicroElectronics Packaging and Test Engineering Council (MEPTEC) will host a technical symposium titled "Innovations in Equipment and Materials for Microelectronics Packaging: Complexity Drives Collaboration" on November 11, 2004 at the Hyatt San Jose in San Jose, California.
SolidWorks Gives Aspiring Engineers an Affordable Technical Education
(September 27, 2004) Concord, Mass. — Twenty-four government polytechnic institutes in India will use SolidWorks 3D mechanical design software to prepare aspiring engineers for high-paying, skilled jobs in the competitive Indian economy, SolidWorks Corporation announced.
Preco Awards Six Sigma Blackbelt, Announces New Test Engineer Manager
(September 27, 2004) Morton, Ill. — Preco Electronics, an electronics manufacturing services provider serving middle market OEMs, announces the graduation of Jason Janssen, being awarded a Six Sigma Black Belt, and the appointment of Thomas Goehl as test engineer manager at the corporate headquarters in Morton, Illinois.
Call for Papers: SMTA Medical Electronics Symposium
(September 27, 2004) Edina, Minn. — The SMTA is pleased to announce its Medical Electronics Symposium will be held April 26 through 27, 2005 in
Minneapolis, Minnesota. Jeff Kennedy, Celestica, conference chairman and Dr. Ken Gilleo, ET Trends LLC and SMTA vice president for technical programs invite you to submit an abstract to participate in this dynamic program.
PCB East 2004 to Showcase Latest Products, Services and Technologies
(September 27, 2004) Atlanta, Ga. — The ninth annual PCB Design Conference East 2004, scheduled for October 4 through 8 at the Radisson Hotel in Manchester, New Hampshire, will feature more than 50 exhibiting companies, each displaying and demonstrating its products, services and technologies for the printed circuit board (PCB) design industry.
KIC to Exhibit SlimKIC Software for Rework and Batch Ovens at ATE
(September 24, 2004) San Diego — KIC will introduce profiling for rework and other applications at the upcoming Assembly Technology Expo, scheduled for September 26 through 30, 2004, at the Donald Stephens Convention Center in Rosemont, Ill.
Cookson Electronics Assembly Materials Announces Price Increase for Flux Product Line
(September 23, 2004) Jersey City, N.J. — Based on a 78 percent increase in isopropyl alcohol (IPA) prices since June 2003, Cookson Electronics Assembly Materials has announced a price increase limited to its IPA-based flux product line.
Solectron Names Neese Executive Vice President, Worldwide Sales and Account Management
(September 23, 2004) Milpitas, Calif. — Solectron Corp. has appointed Marty Neese as executive vice president, Worldwide Sales and Account Management.
Tyco Electronics Names Tam Marketing Manager for Asia-Pacific
(September 23, 2004) Willow Grove, Pa. — Tyco Electronics Automation Group, a business segment of Tyco International Ltd., has added Mike Tam to its team.
Cadence Sponsors Renovation of EDA Laboratory at Czech Technical University in Prague
(September 22, 2004) San Jose, Calif. and Prague, Czech Republic — Cadence Design Systems Inc. has completed major renovations of the electronic design automation laboratory at Czech Technical University in Prague, Czech Republic, as part of the company's extensive University Partner Program.
Lightspeed Marks First-Year Anniversary
(September 22, 2004) Methuen, Mass. — Lightspeed Manufacturing has marked its first anniversary in business, and is seeing a rapid increase in orders in recent months, after surviving the crippling downturn in U.S. electronics manufacturing that began in early 2001.
Siemens to Exhibit at ATE
(September 21, 2004) Norcross, Ga. — Siemens Dematic AG announces that the SIPLACE HF/3 will be on display at the Assembly Technology Expo (ATE) exhibition and conference in Rosemont, Ill., from September 28 to 30 in booth number 5609.
Nam Tai Electronics Appoints New CFO and Assistant CFO
(September 21, 2004) Vancouver, British Columbia — Nam Tai Electronics Inc. announces that Wong Chi Chung (Charles C. Wong) has been appointed chief financial officer (CFO) and Joseph Edward Silva, assistant chief financial officer (ACFO) of the company.
Speedline Receives Patents for Enhanced System of Post-Print 2-D Inspection of Circuit Boards
(September 21, 2004) Franklin, Mass. — Speedline Technologies Inc. has been awarded U.S. patent #6,738,505 for its invention of the texture-based method of analyzing potential bridge defects on circuit boards during the post-print inspection process.
JPSA Seeks Reps for Global Sales Network
(September 20, 2004) Hollis, N.H. — JP Sercel Associates (JPSA) is seeking manufacturer's representatives in the U. S. and Europe to sell its UV excimer and DPSS laser micromachining, wafer processing and LED liftoff systems, as well as its wide range of contract laser processing services.
SMTA Electronics Assembly Technology Forum to be Held in Wisconsin
(September 20, 2004) Cedarburg, Wis. — An Electronics Assembly Technology Forum will be held on October 19, 2004, in conjunction with the First Annual Wisconsin Chapter Vendor Show, featuring exhibits from more than 24 industry suppliers.
COMET Completes Capital Increase, Gains Immediate Benefit for FEINFOCUS
(September 17, 2004) Flamatt, Switzerland — COMET Holding AG has completed the sale of 100,000 new shares to existing shareholders and as a public offering.
Indium's Lee to Present Workshop at CEMCEX
(September 17, 2004) Utica, N.Y. — Indium Corp. of America Vice President of Technology Ning-Cheng Lee, Ph.D. will present a workshop entitled, "Lead-free Soldering — Metallurgical Fundamentals, Reflow Application and Challenges" at the CEMCEX Conference in the Czech Republic on October 12 and in Hungary on October 14.
SMT Resource Aligns with Encore Capital Leasing to Offer Financial Solutions
(September 17, 2004) Temple, Texas and Dallas — SMT Resource Group LLC is working with Encore Capital Leasing to introduce a leasing program designed to provide financial solutions that complete the circle of equipment procurement, management and final disposal.
ATS Receives Follow-on Automation Systems Orders for Flat Panel Display Manufacturing
(September 16, 2004) Cambridge, Ontario, Canada — ATS Automation Tooling Systems Inc. has received an additional US $12.7 million (CDN $16.6 million) in follow-on automation systems orders from a major supplier of flat panel display materials.
IPC Headquarters, List Serves, Web Sites Unavailable September 17
(September 16, 2004) Northbrook, Ill. — IPC — Association Connecting Electronics Industries will be closed on Friday, September 17 while the office is moved to Bannockburn, Ill.
Teleconference to Address RoHS Data Collection
(September 16, 2004) College Park, Md. — Electronics makers will have an exclusive opportunity to find out how the world's top electronics component suppliers and manufacturers are dealing with gathering data on thousands of parts at "RoHS: Coping with Data Collection and Reporting Nightmares," another Take it Back! Teleconference on September 28 at 1:30 pm.
Asymtek Expands Distributor Network in China
(September 15, 2004) Carlsbad, Calif. — Asymtek has added four new teams of sales distributors to represent their line of automated fluid dispensing systems in China: D-TEK, Leeport, Antais Electronics Technology Co. Ltd. (ATS) and Samurai Spirits Inc. (SSI).
IPC, FED Sponsor Embedded Passives Conference in Munich, Germany
(September 15, 2004) Northbrook, Ill. — To address the growing interest in embedded passive component technology, IPC has teamed with the Fachverband Elecktronik Design e.V. (FED) to create a conference on the subject.
Vianco Joins S-Bond Technologies Advisory Board
(September 15, 2004) Lansdale, Pa. — Paul Vianco, Ph.D., an expert in the formulation, testing and uses of solder materials, has joined the Advisory Board of S-Bond Technologies LLC (SBT).
NEPCON Texas 2004 to Feature Six Free Educational Sessions and SMTA Texas Conference
(September 14, 2004) Norwalk, Conn. — The NEPCON Texas electronics manufacturing trade show will feature suppliers displaying the full range of electronics manufacturing solutions including adhesives, advance microelectronics, test equipment, rework, wire and cable assembly, and active components.
Reptron Electronics Receives New Production Contract with Hunt Technologies
(September 14, 2004) Tampa, Fla. — Reptron Electronics Inc. announces that its Hibbing, Minn. facility has been awarded a multi-million dollar production contract from Hunt Technologies Inc., a leading global provider of automatic meter reading products.
YESTech to Highlight Cost-Effective AOI Solutions at ATE
(September 14, 2004) San Clemente, Calif. — YESTech will exhibit cost-effective automated optical inspection (AOI) systems at Assembly Technology Expo, the world's largest "all assembly" trade event, taking place September 28 through 30 at the Donald E. Stephens Convention Center in Rosemont, Ill.
IDEA Establishes Non-conforming Parts Board
(September 14, 2004) Princeton Junction, N.J. — As part of an ongoing effort to fight the war on non-conforming parts, which continue to plague the independent distribution channel, the Independent Distributors of Electronics Association (IDEA) has established a "Non-Conforming Parts Board" now accessible via the Internet.
Kester to Hold Lead-free Mini-Clinic at ATE
(September 13, 2004) Rosemont, Ill. — In its continued efforts to assist the North American industry with the lead-free issue, Kester will hold a Lead-free Mini-Clinic at the Assembly Technology Expo (ATE) show here, September 28 through 30.
PFA Software Development Group Earns CMMI Level 3 Rating
(September 13, 2004) Elgin, Ill. — On July 23, 2004, Carnegie Mellon's Software Engineering Institute (SEI) awarded Panasonic Factory Automation's (PFA) Software Development Group with a CMMI Level 3 (Capability Maturity Model Integration) rating.
SMTA Toronto Chapter to Focus on Six Sigma
(September 10, 2004) Minneapolis — "The Use of Six Sigma to Design, Manage, Test and Quality Control the Surface Mount Manufacturing Line" will be presented on November 5 by Sammy G. Shina, Ph.D., from the University of Massachusetts Lowell.
IPC Releases Revised Key PCB Qualification and Acceptability Standards
(September 10, 2004) Northbrook, Ill. — IPC — Association Connecting Electronics Industries has released IPC-A-600G, Acceptability of Printed Boards, and IPC-6012B, Qualification and Performance Specification for Rigid Printed Boards.
Aqueous Technologies to Exhibit at ATE
(September 9, 2004) Rancho Cucamonga, Calif. — Aqueous Technologies will exhibit its Model SMT1000-LF aqueous cleaning/defluxing system as well as SonicOne at the upcoming Assembly Technology Expo, scheduled for September 26 through 30, 2004, at the Donald Stephens Convention Center in Rosemont, Ill.
Kester to Exhibit Wafer Bumping Paste at IMAPS
(September 9, 2004) Des Plaines, Ill. — Kester will exhibit SE-CURE 7501 at Booth 235 during the upcoming IMAPS exhibition and conference, scheduled for November 14 through 18, 2004, at the Long Beach Convention Center in Long Beach, Calif.
Electronics Experts Weigh In on Economic Future of PCB Industry at Regional SMTA Exhibition
(September 9, 2004) St. Paul, Minn. — Attitudes were upbeat at the annual SMTA/IMAPS Upper Midwest Industry Appreciation Day as attendees and exhibitors looked to network with customers and gather sales leads during the small, intimate exhibition.
ECA Monthly Order Index Rebounds Heartily
(September 8, 2004) Arlington, Va. — The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA) saw a large upturn in August, rebounding from a flat July.
Creation Technologies Receives $10 Million Canadian Investment from CIBC Capital Partners
(September 7, 2004) Vancouver, British Columbia, Canada — Creation Technologies Inc. has received a $10 million investment from CIBC Capital Partners, a division of Canadian Imperial Bank of Commerce.
IPC Offers Lower Prices on Standards in Electronic Format
(September 3, 2004) Northbrook, Ill. — To increase demand and accessibility of its standards, IPC — Association Connecting Electronics Industries announces significantly lower prices on single-user standards and specifications purchased on CD or through electronic download.
Production Solutions' Farlow to Present at SMTA International
(September 3, 2004) Poway, Calif. — Production Solutions Inc. announces that Doug Farlow, president and CEO, will present a paper on efficient line changeover at the upcoming SMTA International conference.
U.S. ESD Market to Reach $1.5 Billion by 2009, Says BCC
(September 2, 2004) Norwalk, Conn. — According to a soon-to-be-released updated report from Business Communications Co. Inc., RP-099U The Maturing ESD Market: Challenges and Opportunities for the Future, the U.S. market for ESD products, worth an estimated $881.7 million in 2003, is projected to reach $986.1 million in 2004 and $1.5 billion by 2009, an average annual growth rate (AAGR) of 8.3 percent between 2004 and 2009.
SMT/HYBRID/PACKAGING 2005 Issues Call for Tutorials
(September 2, 2004) Stuttgart, Germany — The Call for Tutorials for SMT/HYBRID/PACKAGING 2005, taking place April 19 through 25, 2005, in Nuremberg, Germany has been published.
Speedline Technologies Ships 3,000th MPM UltraPrint 2000 Stencil Printer
(September 1, 2004) Franklin, Mass. — Speedline Technologies Inc. has shipped its 3,000th MPM UltraPrint 2000 stencil printer, marking a major industry milestone and underscoring Speedline's position as a leader for single-source process solutions for the PCB assembly and semiconductor packaging industries.
NPL's SSTC Summer Meeting Concentrates on Lead-free Solder Reliability
(August 31, 2004) Teddington, UK — National Physical Laboratory's (NPL) summer Soldering Science & Technology Club meeting was held on July 15, 2004, with 10 papers covering aspects relating to lead-free reliability.
Speedline Technologies to Feature Dispensing and Stencil Printer Systems at SEMICON Taiwan 2004
(August 31, 2004) Franklin, Mass. — Speedline Technologies Inc. will showcase its dispensing and stencil printing systems — featuring the newest industry technology — during SEMICON Taiwan 2004 at the Taipei World Trade Center, September 13 through 15, 2004.
Elcoteq Expands Tallinn, Estonia Plant
(August 30, 2004) Espoo, Finland — Elcoteq Network Corp. has expanded its second manufacturing plant, Tallinn 2, in Tallinn, Estonia.
IPC Printed Circuits Expo, APEX and Designers Summit Strong in 2005
(August 30, 2004) Northbrook, Ill. — Despite recent high-profile technology event cancellations, IPC — Association Connecting Electronics Industries reports that its February trade shows will take place as scheduled with enhanced technical offerings.
KEMET Names Lessner Vice President, Tantalum Technology and Technical Marketing
(August 30, 2004) Greenville, S.C. — KEMET Corp. announced today that Philip Lessner, Ph.D. has been named vice president, tantalum technology and technical marketing, reporting directly to KEMET President and COO James McClintock.
ATS Secures CDN $20.3 Million in Automation Systems Orders for Use in Flat Panel Display Manufacturing
(August 27, 2004) Cambridge, Ontario, Canada — ATS Automation Tooling Systems Inc. has received US $15.5 million (CDN $20.3 million) in orders to design and build a number of fully integrated, automated manufacturing lines for a major supplier of flat panel display materials.
ElectronicAmericas 2005 Grows by 20 Percent
(August 27, 2004) São Paulo, Brazil — In South America, the electronics industry is already getting ready for electronicAmericas 2005, the region's leading trade show for electronic components and assemblies, electronics production, and photonics.
Smartphones to Break Out in Next 12 to 18 Months, Says In-Stat/MDR
(August 27, 2004) Scottsdale, Ariz. — As better devices and lower prices combine with other factors to fuel growth and meet demand, smartphone shipments are set to rise dramatically over the next five years, reports In-Stat/MDR.
Small Businesses to Use $2 Billion in Federal Funding for Advanced R&D
(August 27, 2004) Washington, D.C. — WIFT V (SBIR/STTR — Where Innovation Focuses Technology), an eight-day multi-state, multi-agency federal outreach effort, travels to the Midwest September 9 through 16.
Tyco Electronics Premiers New Products at ATExpo
(August 24, 2004) Willow Grove, Pa. — Tyco Electronics, a business segment of Tyco International Ltd., will be premiering Mirae's MX-Series assembly platform solution at Assembly Technology Expo (ATExpo), held September 26 through 30, 2004, in Rosemont, Ill.
SMTA Ohio Valley Chapter to Focus on Lead-free Solutions
(August 24, 2004) Minneapolis — "Materials, Processing, and Reliability of Lead-free Solder Solutions" will be presented by Dan Baldwin, Ph.D. of Engent Inc./Georgia Institute of Technology on October 26.
FEINFOCUS Announces New Managing Director for Germany Headquarters
(August 23, 2004) Stamford, Conn. — FEINFOCUS has appointed Frank Gitmans, Ph.D. as managing director of the company's global headquarters in Garbsen, Germany.
Delphi, Parlex Enter into Strategic Alliance to Grow Military/Aerospace Market Presence
(August 23, 2004) Methuen, Mass. and Troy, Mich. — Delphi Corp. and Parlex Corp. have entered into a strategic alliance that is expected to benefit both companies' current sales and future growth prospects in the military/aerospace interconnect market.
Speedline Technologies Products to be Featured in Live EASi Electronics Assembly Line at ATExpo 2004
(August 20, 2004) Franklin, Mass. — Speedline Technologies' MPM AccuFlex stencil printer and Electrovert OmniExcel reflow soldering system will be showcased as part of the live, working electronics assembly line at the center of this year's Assembly Technology Expo (ATExpo), September 27 through 30, in Chicago.
M-FLEX Provides Earnings Guidance for Fourth Quarter Fiscal 2004, Outlines New Policy for Providing Guidance to Investors
(August 19, 2004) Anaheim, Calif. — Multi-Fineline Electronix Inc. (M-FLEX) expects net sales for the fourth quarter of fiscal 2004 to range between $66 and $71 million and net income for the same period of between $7.5 and $9.1 million.
MEMS Making Their Mark in Consumer Electronics, Says In-Stat/MDR
(August 18, 2004) Scottsdale, Ariz. — MEMS (microelectromechanical systems) are growing up fast when it comes to their integration into all kinds of consumer electronics (CE), reports In-Stat/MDR.
Automation South to Represent Cobar Solder Products in U.S. Southeast
(August 17, 2004) Londonderry, N.H. — Cobar Solder Products has signed Automation South to represent its line of solder pastes, fluxes and other electronics soldering materials in the U.S. southeastern states, including Alabama, Mississippi, Tennessee and Georgia.
KIC Announces Hands-on Lead-free Workshop in October
(August 17, 2004) San Diego — KIC will co-sponsor a lead-free workshop from Wednesday, October 13 to Thursday, October 14, 2004 at Engent's facility in Norcross, Ga.
Manufacturing CFOs to Explore Risk Management, Sales Finance Opportunities in Asia-Pacific, Europe and Latin America
(August 16, 2004) Chicago — Equipment finance experts will explore opportunities for growth-oriented manufacturers in Latin American, Asia-Pacific and Europe at a conference here from September 20 through 21.
Growing Adoption of Lead-free Electronic Assemblies Challenged by Materials and Process Considerations, Says Frost & Sullivan
(August 16, 2004) Palo Alto, Calif. — New analysis from Frost & Sullivan, "World Surface Mount Technology (SMT) Roadmap," reveals that lead-free solder paste consumption is the highest in Japan, with consumer electronics being the most notable driver for the adoption.
Indium Offers Pb-free Readiness Assessment Tool
(August 12, 2004) Utica, N.Y. — Indium Corp. of America has launched its Pb-Free Readiness Assessment, an online, interactive tool developed to help manufacturers prepare for a Pb-free work environment.
IPCWorks 2004 Program Announced
(August 12, 2004) Northbrook, Ill. — IPC — Association Connecting Electronics Industries announces its technical conference and professional development courses for IPCWorks 2004, to be held October 24 through 28 at the Minneapolis Convention Center in Minneapolis, Minn.
EMI, California State University to Host Telecom Training Programs for Vietnamese Government
(August 11, 2004) Santa Ana and Los Angeles, Calif. — Express Manufacturing Inc. (EMI) announces that it has partnered with California State University, Los Angeles to host an Executive Training Program for the top ranking officials of Vietnam Post and Telecommunication Corp. (VNPT), the government-owned and operated provider of telecommunications, postal and IT services in Vietnam.
Introbotics Awarded Patent, Delivers Second Automated Unit to Merix
(August 11, 2004) Albuquerque — Introbotics Corp. announces that the U.S. Patent & Trademark Office has issued the company US Patent Nos. 6,759,853.
SMTA Announces Workshop on Implementing Lead-free
(August 11, 2004) Minneapolis — In a new full-day SMTA workshop, "Implementing Lead-free Assembly at Your Facility," noted process expert, holder of the prestigious SMTA Founder's Award and SMT Editorial Advisory Board Member Ronald C. Lasky, Ph.D., PE, Indium Corp. senior technologist and Dartmouth College visiting professor, will deliver information, experience and knowledge on establishing a lead-free process.
Cobar Signs Torenko & Associates as Representative for Texas, U.S. Southwest
(August 10, 2004) Londonderry, N.H. — Cobar Solder Products has signed Torenko and Associates to represent its line of solder pastes, fluxes and other electronics soldering materials in Texas and the U.S. Southwest.
Wafer-level Processing: Whose Job Is It, Anyway?
(August 10, 2004) Santa Clara, Calif. — One of the hottest topics at SEMICON West in San Jose this year was wafer-level processing. Walking around the show floor, it was hard to find a wire bonder, but wafer bumping equipment and materials were everywhere.
Valor Computerized Systems Reports Q2 2004 Results
(August 9, 2004) Lake Forest, Calif. and Yavne, Israel — Valor Computerized Systems reports financial results for the six-month period ending June 30, 2004.
ATS Receives Orders of US $10 Million from One of the World's Largest Medical Device Companies
(August 6, 2004) Cambridge, Ontario, Canada — ATS Automation Tooling Systems Inc. recently received a total of US $10.7 million (CDN $14.2 million) in orders from one of the world's largest manufacturers of self-use medical diagnostic systems.
Solectron Announces Remarketing of Debentures Underlying Equity Security Units
(August 6, 2004) Milpitas, Calif. — Solectron Corp. intends to remarket up to $64,269,950 aggregate principal amount of its 7.25 percent subordinated debentures, due 2006.
M-Wave Closes $3 Million Private Placement with Mercator Advisory Group
(August 5, 2004) West Chicago, Ill. — M-Wave Inc. has concluded the previously announced sale of 30,000 shares of the company's Series A, convertible preferred stock to Mercator Momentum Fund LP, Mercator Momentum Fund III LP and Monarch Pointe Ltd. through Mercator Advisory Group LLC for aggregate proceeds after estimated expenses of $2.65 million.
Tyco Electronics' Wang to Present at NEPCON Shenzhen
(August 4, 2004) Willow Grove, PA. — Tyco Electronics, a business segment of Tyco International Ltd., announces that David Wang will present a lead-free seminar during NEPCON Shenzhen in Beijing.
Solectron Announces Strategic Divestitures
(August 3, 2004) Milpitas, Calif. — Solectron Corp. announces a new divestiture, as well as the completion of a previously announced one, both in line with the company's plan to sell certain assets not central to its future strategy.
DEK Announces First VectorGuard Licensee
(August 3, 2004) Flemington, N.J. and Munich, Germany — DEK has licensed its VectorGuard stencil technology to Christian Koenen GmbH, which will provide DEK customers with a second source for VectorGuard stencils and allow Christian Koenen to increase its offering in Germany, Austria and Switzerland.
Entrada Group Announces Strategic Contract with MC Assembly, Tricon Systems
(August 3, 2004) San Antonio, Texas — MC Assembly and Tricon Industries have contracted with the Entrada Group to provide integrated outsourcing services to assist in the transition, start-up and management of their new operations in Mexico.