SMTAI Booth Preview
SMTA International (SMTAI) will take place next week, October 4–8 in San Diego, CA. This exhibitor preview includes products from Austin American Technology, Juki, ACE Production Technologies, Production Solutions Inc., Mirtec, Smart Sonic Corporation, RMD Instruments, Nihon Superior, and Aqueous Technologies Corp.
How Testable Are Your Circuit Board Designs?
In today's electronic design and manufacturing climate, there is increasing emphasis on improved product yield through better quality and streamlined manufacturing processes. The ability to systematically verify that board designs have been developed with adequate design for test (DfT) helps determine a product's overall testability and define the optimum test strategy for maximum fault coverage. DfT also means that design and test people can work more efficiently, as all designs are analyzed in the same manner, using industry-standard and company-specific DfT guidelines. Peter Collins, Aster Technologies, explains.
New Dispensing Equipment
These needles, valves, tips, and related dispensing equipments are available for specialty needs, such as UV block and highly adhesive materials, and for other requirements such as high speed or high precision. Products come from Tridak, MIXPAC, I&J Fisnar, and Techcon.
Have We Learned from the Economic Meltdown?
Recent economic events impact every aspect of the business world, and the outsourced electronics manufacturing industry is no exception. Some have claimed that what the world economy has experienced will change the game completely; things can never go back to the way they were, because the implications of what has occurred are so profound. If the meltdown was a game-changer, what is the new game, and who will play it most skillfully? Eric Miscoll, principal, Charlie Barnhart & Associates LLC, examines the industry.
Consumer Confidence in Technology Rises in September, According to CEA-CNET Index
Consumer confidence in technology and consumer electronics jumped, while confidence in the overall economy fell slightly in September, according to the latest figures from the Consumer Electronics Association (CEA) and CNET.
Laminates: New Products and Technologies
Rogers Corp. introduced a new laminate technology for high-frequency amplifier designs; the Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, presented “Glass as a Substrate for High Density Interconnects,” asserting a new packaging substrate opinion; and IPC — Association Connecting Electronics Industries released revision C of IPC-4101, “Specification for Base Materials for Rigid and Multilayer Printed Boards.”
Products for SMT Assembly Traceability
Traceability in the electronics manufacturing facility generally requires extensive labeling and the associated readers to track components, PCBs, subassemblies, and other parts as they move from inventory to the factory floor and into other processes like final assembly and inspection. These new products from Microscan, Adhesive Applications, Keyence, Taiyo America, and Trumpf increase visibility and tracking at the manufacturer.
Duplicate Exact from the Stencil Perspective
Duplicate exact can help address issues encountered when transferring an assembly from prototype to high-volume manufacturing or from one manufacturing facility to another. Duplicate exact can apply to equipment, materials, tools, and processes in SMT assembly. William E. Coleman, Ph.D, Photo Stencil, examines the stencil tool, though it is easy to see how the concept also transfers throughout the manufacturing operation.
New Products: PCBs, Connectors, and Components
These connectors, ESD protection components, new pulse resistor technologies, capacitors, and other bill of materials (BOM) elements are new from Tyco, Cornell Dubilier, Molex, Hirose, Spectrum Control, Electronic Interconnect, Murata, Phoenix Contact, Printed Circuits Inc., and The Würth Elektronik Group.
IPC Midwest: Exhibits Preview II
IPC Midwest begins next week in Schaumburg, IL, with the exhibit hall open September 23 and 24. Following are many new and highlighted products from a sampling of this year’s exhibitors, including ICT systems from Agilent and Digitaltest; cleaning products from Ascentech, Aqueous, Kyzen, and Zeston, pick-and-place machines from Essemtech, Europlacer, and Juki; and other products like XRF inspection tools and 0% halogen solder pastes.
Applied Research within Universities for SMT Industry Competitiveness
S. Manian Ramkumar, Ph.D., Center for Electronics Manufacturing and Assembly, Rochester Institute of Technology (RIT), discusses recent industry-university collaborative research on PoP, QFN, and mixed lead-free alloy SMT processing.
TFI Calls Manufacturing Downturn Catalyst to Manufacturing Strategy
Pamela Wiseman, TFI senior operations and supply-chain consultant, writes about the manufacturing out- and in-sourcing strategies that are controversial and lively topics these days. Whirlpool will move a portion of its manufacturing from Indiana to Mexico, and that Nokia , NCR, and LeCroy have all decided to reverse their outsourcing trends to bring some manufacturing back in house. The economic downturn has been a catalyst for change and adaptation, prompting executives to reassess and reposition manufacturing strategies.
The Future of Cleaning OA Fluxes
Many companies are shifting away from cleaning with pure de-ionized (DI) water to chemistry-assisted processes. Numerous reasons can be cited supporting the recent trend toward cleaning with chemistry. Results from this experiment, presented by Harald Wack, Ph.D., Zestron, support the hypothesis that cleaning temperature and cleaning chemistry concentration can be manipulated to meet cost and cleanliness requirements for the majority of solder pastes.
Parallel Processes: Simultaneous Lead and Lead-free Soldering with a Single Reflow System
With many electronics manufacturers still running leaded and lead-free assembly jobs, reflow ovens are tasked to run both solder-type profiles. Hans Bell, Ph.D., of Rehm Thermal Systems, shows how implementing both processes simultaneously with a single reflow soldering system can be approached with leaded and lead-free reflow profiles set up next to each other within a thermal system with two conveyor lanes.
With Electronics, You Can Never Be Too Thin
By Craig Hunter, Vishay Intertechnology - Communications, entertainment, and lighting are being revolutionized by low-profile, surface mount components that retain performance characteristics with a reduced package size. Antennas, LEDs, IPDs, and other components prove that SMT can replace more of the through-hole products in the market.
Tailoring Flux Formulations to Enhance Solder Paste Performance
Kevin Gaugler, solder group research and development manager, EFD Inc., a Nordson Company, discusses how component miniaturization, the emergence of complex assembly methods, finer-pitch connections, changes in plating methods, nanometer-scale materials, and the requirements of new electrical generation and distribution technologies, along with environmental directives, have shaped solders and flux formulations. Slight changes to alloy compositions can tailor a soldering process to specific needs.
Solderability Testing Aids Selective Soldering Process Development
Greg Goodell, process development technician, A.C.E. Production Technologies, recounts tests done in the company's Selective Soldering Applications Lab. A component had oxidized leads. During process development, the operator found that no matter which flux was selected, or which profile was used, the solder would not wet to the part. Process development for the application was stalled by the solder dewetting. Solderability tests were performed to analyze the wetting curve and determine the cause of wetting failure.
Exhibitors at Nepcon South China in Shenzhen
Nepcon South China, August 2628 at the Shenzhen Conference & Exhibition Center in Shenzhen, China, will co-locate with EMT South China, Finetech South China, ATE China, and AE South China. The show promises a glimpse at the economic recovery in electronics manufacturing. Here are the highlights of exhibitors at Nepcon Shenzhen.
Tailoring Flux Formulations to Enhance Solder Paste Performance
By Kevin Gaugler, EFD Inc., a Nordson Company - Continued component miniaturization, complex assembly methods, finer-pitch connections, changes in plating methods, nanometer-scale materials, and new electrical generation and distribution technologies now challenge the performance of soldering processes at every level. Environmental initiatives, such as RoHS, have also resulted in fundamental changes to both solder alloys and flux-based carrier systems.
Upcoming Event: Nepcon South China
Nepcon South China, August 2628 at the Shenzhen Conference & Exhibition Center in Shenzhen, China, will co-locate with EMT South China, Finetech South China, ATE China, and AE South China. Nepcon South China promises to focus on prevailing trends in the electronics manufacturing industry, as well as showcase new innovations and technologies. The China EMS environment is reportedly experiencing the first stages of recovery from the global economic downturn.
Solderability Testing Aids Selective Soldering Process Development
By Greg Goodell, A.C.E. Production Technologies - The Selective Soldering Applications Lab processed a group of samples for a customer; in the parts mix was a component that had oxidized leads. During process development, the operator found that no matter which flux or profile was selected, the solder would not wet to the part. Solderability tests were performed to analyze the wetting curve and determine the cause of wetting failure.
iNEMI Roadmap Identifies R&D Priorities for Dispense
By Dongkai Shangguan, Flextronics and Ravi Bhatkal, Cookson Electronics - Component technology advances continue to provide challenges in the PCB assembly environment. Given the challenges facing board assembly technology, the iNEMI Roadmap identifies R&D priorities to develop and optimize jettable pastes and inks as well as jetting/dispensing technology.
EMS Contracts in the U.S.: Focused Equipment Strategies for Jobs and Profits
By Greg Biesiadecki, Alpha Electronics International Inc. - U.S.-based EMS providers can win back OEM business from overseas with higher quality and lower costs. Automated manufacturing and inspection equipment, along with a solid OEM relationship strategy, can bring business to U.S. firms. This article covers AOI, selective soldering, and business strategy.
Overcoming Bead Probe Contact Challenges
Part II: Enhancing First Pass Yield With Better Spring Probe Tip Geometries
By Michael Farrell Sr., Agilent Technologies and Brian Crisp and Ken Snyder, Everett Charles Technologies - Part I of this two-part article discussed the use of bead probe technology and factors that impact probing, such as spring force and biasing. This section covers contact integrity, from the importance of probe head design to probe materials.
So, You Need to Clean? A Defluxing Process Roadmap, Part II
By Michael Konrad, Aqueous Technologies - Our roadmap consists of several key factors: type of flux, type of assembly, product flow, volume, staff competency, facility restrictions, environmental restrictions, and budget. In Part II, I discuss volume, staff competency, facility restrictions, environmental restrictions, and budget.
Low-volume/High-mix: EMS Jobs in North America
By John Buckley, Zurvahn - OEMs creating mid- to low-volume products and new product introductions (NPI) require flexibility, design skills, and cost-effective manufacturing from their EMS providers. Lower inventory requirements and time-to-market priorities also come into play. Modern high-mix production requires a balance of development in North America and volume production available in low-labor-cost regions, with seamless transitions.
Vapor Phase vs. Convection Reflow in Package-on-Package Technology
By Ryan Wooten, EPIC Technologies - The trend toward smaller, more densely populated electronic assemblies is driving increased use of package-on-package (PoP) technology and electronics manufacturing services (EMS) providers are developing viable manufacturing solutions. Here, I review reliability laboratory analysis on the effectiveness of vapor phase (VP) and convection reflow processing of PoP technology.
New Facility Improvement Products: Carts, Conveyors, Gas Control, and More
These new products from Bliss Industries, Matheson Tri-Gas, Terra Universal, Seika, Virtual Industries, and other companies provide component and PCB storage and transportation around the electronics manufacturing facility. Products include chassis carts, MSD storage, barcode labels and readers, stencil frames, and more.
Board-level Thermal Management: 3D Heat Removal
By Paul A. Magill, Ph.D., Nextreme Thermal Solutions - The paradigm driving PCB-level design has always been cost. However, IC-generated heat on these boards has increased in modern designs. Frequently, the heat generated by these die leads to hot spot formation on the circuit boards. As board designs progress, a combination of active and passive and bottom, top, and lateral thermal management is needed.
Getting a Handle on Global Sourcing
By Jorina Fontelera, ThomasNet Industrial Market Trends - Theoretically, sourcing globally for inexpensive materials may seem easy. In practice, though, the process and execution is much more complicated. Companies report that sourcing is now driven by product quality as well as cost, and that Asia is not the main source of materials for U.S. manufacturers.
Testing the Reliability of BGAs
By Ching-Mai Ko, Ming-Kun Chen, Yu-Jung Huang, and Shen-Li Fu, I-Shou University - In BGA socket test, avoiding damage to the solder balls while maintaining a high compression force and a stable contact resistance is key. Contact resistance distribution plays a vital role in device reliability. Socket contact degradation can degrade first test yield and increase retest time. Contact degradation can be used as a contact clean guideline.
Thermal Management: The New Generation of CFD
By Meredith Courtemanche, managing editor - Major design companies have released new thermal management solutions recently, prompting a look at the various technologies that can keep complex electronics functioning properly, regardless of their workload. Computational fluid dynamics (CFD) simulations are getting faster and more accurate.
Preventing Board-level Defects with Moisture Control
By Russell McCarten, XDRY Corporation - At test and inspection, defects mean lost revenue through scrap or rework. Defects can occur due the board, component, materials, or other factors. One controllable defect-causing aspect of assembly is moisture.
Revised RoHS Directive, and an Erroneous Name in RoHS 2
By Lev Shapiro, Component Master - The European Commission (EC) proposes several changes to its RoHS Directive. Medical devices and other exempted end products will be affected, product labeling will change, and the character of the RoHS legislation will be reinvented. However, calling this revision "RoHS2" is a misstep, based on the informal but generally accepted RoHS5/6 terminology.
New Products in Component Placement: Pick-and-Place Systems, Heads, and Tooling
Following is a product preview for the new MultiStar pick-and-place head, as well as new placement system SIPLACE SX and software, from SIPLACE Electronics Assembly Systems (SEAS). Also highlighted is the feeder and inspection conveyor package for Manncorp's MC-391 in-line dual-head pick-and-place system.
So, You Need to Clean? A Defluxing Process Roadmap
Our roadmap consists of several key factors: type of flux, type of assembly, product flow, volume, staff competency, facility restrictions, environmental restrictions, and budget.
Upcoming Webinars on Advanced Packages: BGAs, BTCs
KIC's Brian O'Leary will present "How to Profile BGAs," a 30-minute webinar on designing reflow profiles for the components, on June 26. SMTA will host two webinar tutorials on design and assembly of BGAs and BTCs with SMT Editorial Advisory Board member Ray Prasad, on July 7 and July 14.
Thermal Management Issues Resolved by Optimizing Airflow in Chassis
By Chris Heard, Amphenol - This case study examines a leading-edge chassis design from the thermal management perspective. Through increasingly detailed simulation environments, the system designer was able to optimize airflow, verify the design's feasibility, and circumvent possible thermal problems as the design progressed.
Troubleshooting Solder Bridging: Causes and Recommendations
Compiled by Cookson Electronics - Bridges, defects where excess or misprinted solder creates an undesired connection, can be caused by problems at various points in the assembly process. This article examines root causes and solutions at stencil manufacture, screen print, component placement, reflow, PCB manufacture, and solder paste.
IPA-Water (75/25): Ineffective for Cleanliness Test with Modern Contaminations
Harald Wack, Ph.D., ZESTRON America - Numerous test methods are used to determine cleanliness. IPA water has poor solvency, and limits ionic contamination and ion chromatography testing. To quantify contamination, one has to remove all residues (ionic and non-ionic) from around and under the components. The modern, alternative mix that replaces IPA-water has to be able to fully solubilize all remaining residues on assemblies, even lead-free, after cleaning.
New Products: Placement Systems, Feeders, and Carriers
Following are the new pick-and-place machines, substrate handlers, components, and feeders for SMT and through hole component placement from Juki, Bliss Industries, Leader Tech, Assembleon, Panasonic Factory Solutions of America, Siemens, and MYDATA.
SMT Components Toughen Up for Rugged Applications
By Craig Hunter, Vishay Intertechnology - It's not surprising that surface mount technology is continually branching out into new applications. Even a few years ago, however, not everyone could have anticipated the extent to which SMT components have penetrated some of the more rugged applications for electronics. Manufacturers are using novel approaches to upgrade device capability and provide higher performance and higher reliability for these more demanding environments.
Upcoming Tradeshows: Attend, Present, Network
SMTAI, IPC Midwest, APEX 2010, and Pan Pac will host exciting technical conferences as well as special events. SMTAI celebrates the 25th anniversary of the SMTA; IPC Midwest is expanding its free forums, and APEX and Pan Pac 2010 are recruiting presenters.
Overcoming Bead Probe Contact Challenges
Part I: Bead Probe Compression
By Michael Farrell Sr., Agilent Technologies and Brian Crisp and Ken Snyder, Everett Charles Technologies - Test access on modern PCB assemblies is a major challenge. Bead probe technology resolves many of the issues test engineers face. This two-part article provides best practice recommendations for bead probe implementation, PCB design for test (DfT), and product selection.
Problems and Promises of BTCs: Bottom Termination Components
Ray Prasad, Ray Prasad Consultancy Group - What are bottom termination components (BTCs)? You may not know the term BTC, but expect to hear about them. IPC coined the term BTC for industry-descriptive package names such as QFN, DFN, SON, LGA, MLP, etc. They are similar to BGAs, which also have hidden terminations. Differences abound, as they do not have balls but just metalized terminations or pads under the package.
New Products for Cleaning Stencils, PCBs, and Labs
These are the new cleaning materials, wipes, and equipment used to remove flux residues from reflowed boards, solder paste from stencils, contaminants from the manufacturing area, and other unwanted materials from electronics assemblies and associated tooling.
A Guide to Infrared (IR) Rework on BGAs
By Roger Gibbs, PDR - BGAs, now mainstream for manufacturers seeking better device functionality and quality, present some problems for rework-and-repair processes. Infrared soldering/desoldering technology is safer, more repeatable, and easier to operate than prior technologies for reworking BGAs.
Thermal Profiling: Sensitive Component Degradation
By Paul Austen, ECD - Solder joints that pass inspection can hide functional degradation of temperature-sensitive devices during the soldering process. From circuit design on, users must account for the thermal sensitivity of passive devices as well as active ones. When factored into the design, and thermal behavior characterized in the NPI phases of the project, the effort is simplified in manufacturing to verification that the thermal profile is met.
ESD Risks and Management in SMT Manufacturing: Part I
By Vladimir Kraz, 3M - Sensitivity to electrostatic discharge (ESD) and electrical overstress (EOS) is becoming increasingly important in PCB assembly (PCBA) manufacturing. This first article in a two-part series discusses the occurrences of ESD exposure in the assembly process. These include PCB loading, component handling, soldering, and operator interventions.
Photovoltaic Module Assembly Using SMT Materials and Processes
By Karl Pfluke, Indium - EMS providers specializing in SMT are seeking to diversify and fill capacity. Photovoltaic module assembly is a popular choice. PV cell stringing in solar module assembly is achieved using many common SMT materials and processes. Solders, fluxes, and reflow technologies produce electrical interconnects in a-Si and c-Si photovoltaic assembly technology.
Avoiding Counterfeit Electronics: The Role of Component Manufacturers, OEMs, and CEMs
By Lev Shapiro, Component Master Counterfeit electronics have rapidly become a serious issue for electronics manufacturers. Supply chain management is crucial to counterfeit prevention. Collaboration with parts makers can help identify counterfeits. End-of-life electronics disposal also can prevent reuse. This article covers the statistics on counterfeits, detection and prevention, and the global supply market.
PCB Designer's Notebook: Overcoming Imaging Challenges for High-density Circuits
By Vern Solberg Designers often face increasing product functionality without the luxury of increasing board size. One option is implementation of a higher-density circuit interconnect solution. Laser direct imaging (LDI) efficiently transfers the circuit pattern directly onto a photoresist-coated panel, eliminating traditional photo tools. Benefits include time and costs savings, quality, and better registration than traditional contact printing fabrication methods.
BOM Products: Components, Circuits, and Associated Services
Following are the bill of materials (BOM) products recently released by component manufacturers, PCB suppliers, connector companies, and other industry suppliers, including Wall Industries, Vishay, Hirose, Premo, Aimtec, and Screaming Circuits.
Large-area Flexible Electronics Promise High-Volume, Low-Cost Production
By Daniel Gamota, iNEMI - The term large-area flexible electronics encompasses a wide array of devices and applications manufactured on flexible substrates. These products can be fabricated using a full range of materials and processes. One of the most compelling aspects of large-area flexible electronics is that they can be produced using high-volume, low-cost, and R2R processes. This article touches on functional inks, processing platforms, and in-line characterization tools.
Step 5: Adhesives/Epoxies & Dispensing
Derrick Moyer, Steve Ratner, John McMaster, , Martin Lopez, and Frank Murch, Heraeus Materials Technology LLC. In modern electronics assembly, wave soldering continues to prosper, and innovations in adhesives and dispensers continue to advance the state of SMT. Adhesives manufacturing, packaging, and dispensing methods each affect the quality and effectiveness of this step.
New Products in Soldering
These are the new solder ovens, reflow profilers, hand rework tools, dross management chemistries, solder alloys, and other products, including a white paper with solder paste deposition information, developed to improve the soldering process in electronics manufacturing.
New Distribution Agreements for Equipment, Materials, and More
Suppliers are adding distributors from New England to Shenzhen. Check out this list of new and expanded distributor agreements for the most up-to-date supply chain information from Data I/O, A.C.E., Balver Zinn, Nextreme, IMS, Essemtec, Koh Young, and more.
Quality Assurance: Planning is Valuable
By Zulki Khan, NexLogic Technologies Inc. - There are two ways to perform quality assurance (QA). One is to move a PCB through design, fabrication, and assembly focusing on expediting the project, but leaving QA at the end of the process. Time is definitely saved by placing QA as an afterthought, but too much of the process is left questionable.
Determining and Influencing Your Marketing Status
By Ted T Turner, CoGen Marketing Inc. - Marketing creates preference and awareness for your company and products. These generate leads. Marketing has four key responsibilities: generate products and services, generate demand for these products and services, generate orders, and generate loyalty. Evaluating the status of each of these four responsibilities as a dashboard can direct your marketing resources.
Manufacturing and Reliability Challenges With QFNs: Part II
By Craig Hillman and Cheryl Tulkoff, DfR Solutions - One of the fastest growing package types in the electronics industry today is the QFN, also known as a bottom-termination SMT component. While the advantages of QFNs are well documented, concerns arise with manufacturability, compatibility with other OEM processes, and reliability. In Part I, we covered DfM and introducing QFNs. In this section, we'll cover reliability of QFN components.
New Reports: Connector Tech; Mass-market, Auto, and I&I Sectors; EMS Shares
Electronics.ca Publications, Henderson Ventures, and Reportlinker share up-to-date analysis and data on various electronics assembly products and end-use sectors, as well as a vendor market-share report on EMS providers. Reports include: Evolving High-speed Mezzanine Connectors, World Electronic Industry Mass-market and Automotive Products, I&I Production to Fall 10%, and Worldwide Electronics Manufacturing Services Vendor Shares.
TFI Blog: Overreacting to Economic Downturn?
By Kathleen Geraghty, TFI Quarterly Forum - Here is a priority topic for almost everyone (even optimists). Following TFI's recent webinar, "Managing through the Downturn," we had an exchange with participants about signs indicating that a company is overreacting in a downturn-economic environment. We also talked about best practices that can be leveraged to overcome these adverse overreactions.
17th Annual SMT VISION Awards
SMT VISION Awards recognize products that display innovation, solve an industry challenge, save money, promote environmental friendliness, and otherwise enhance electronics manufacturing.
Fixed SMT Stencils: Sewing Technology for Stencil Mounting
By T. Sasson, Suron A.C.A Ltd. - Many SMT assemblers use both fixed-frame and universal SMT stencils in the paste printing process. Conventional methods for adhering stencil to frame can introduce hazardous materials, offset errors, time waste, and other negative impacts to flexibility and line productivity. One process borrows technology from sewing to attach stencils onto frames without adhesives.
SMT/HYBRID/PACKAGING: Event Showcase
The SMT/Hybrid/Packaging tradeshow and conference takes place May 5 through 7 in Nuremburg, Germany. The show encompasses back-end semiconductor packaging and test, PCB assembly, and various end-market sectors. In addition to the exhibits, 14 tutorials, and full-day technical conference, an EMS comparison service, job fair, and vendor forum are resources for attendees. Following are some of the highlights to take place on the show floor at SMT/HYBRID/PACKAGING.
Latest Reports: Mobile Handsets, European Electronics, and Tech Financials
Electronics.ca Publications released the European Electronic Market Forecast; iSuppli examines the outsourcing trend in mobile handsets, while ABI Research tracks 2009 cell phone shipments from major OEMs; and Reuters reports on Apple, Google, IBM, Intel, and Microsoft beating expectations in the financial markets.
Lead-free Solder Update
By Mitch Holtzer, Cookson Electronics - SAC alloys became the industry-standard lead-free solders after RoHS went into effect. Technical and economic factors are reducing the silver content in SAC compositions, with disadvantages like slower wetting speeds, and advantages like minimized BGA voids. Solder choices are influenced by the desired results, cost, BOM, and other factors.
Tech Still Down: Inventory, Consumer Spending to Blame
By Jim McGregor, In-Stat - After a disastrous Q'04 to end 2008, it would seem that the high-tech industry had nowhere to go but up. However, the release of Q'01 results from several market leaders has revealed that up wasn't a direction we were headed. An inventory surplus affects semiconductor through PC companies, and consumer spending is still the critical driver for electronics demand.
Zero Mistakes: Inspecting Complex Automotive Electronics
By Gene Fujita, Omron Electronics - Auto manufacturers demand that the incoming electronics boards have zero defects. Many Tier 1 suppliers inspect boards for defects in printing, placement, and reflow, but cannot easily inspect odd forms. The most reliable AOI used directed light to simulate 3D views, and new algorithms are increasing automation for odd forms.
Avoiding Mistakes in SMT Manufacturing Via MOS
Jason Spera, Aegis Software - Quality management in electronics assembly often means data collection, repair and test management, and mining the results of these activities. To improve quality, avoid mistakes that result in nonconformances, maximizing yield and minimizing waste. A total quality system should provide controls to eliminate as many mistakes as possible, as well as capture and analyze those nonconformances that do arise. Control and visibility are required.
New Products in Dispensing, Printing, and Dispensable Materials
Following are the new solder-dispensing print heads, jet dispensers, dispense valves, curing technologies, materials mixers, and various materials such as conductive inks and epoxy adhesive/sealants.
By William E. Coleman, Ph.D., Photo Stencil - It is generally stated that over 70% of defects in surface mount assembly are related to the printing process. There are many factors involved with print, including the printer, squeegee blades, solder paste, printer set-up, and the stencil. All of these factors have a major influence, but I will confine this discussion to an analysis of stencil controls.
Design, Manufacturing, and Reliability Challenges With QFNs
By Craig Hillman and Cheryl Tulkoff, DfR Solutions, Inc. - While the advantages of QFNs are well documented, they can be considered as a next-generation technology for non-consumer-sector OEMs. This article is designed to review specific concerns in relation to design and manufacturability by CMs and OEMs and provide possible mitigations or solutions to allow the reliable introduction of QFN components into products.
BOM Products: Components, PCBs, and Associated Tooling
Following are the new connectors, components, PCB materials, and tooling options such as lead trimmers and wire crimpers available to increase assembly density, improve reliability, and deal with challenges such as harsh environments and high frequencies.
Alkalinity, Defluxing, and Materials Compatibility
By Harald Wack, Ph.D., ZESTRON - From solvent replacements to modern chemistries, materials compatibility is the key for cleaned parts to perform better than uncleaned assemblies and better than assemblies cleaned with prior-generation chemistries. Defluxing under low standoff components, non-corrosive cleaning, and other challenges are met by materials compatibility. Now, neutral neither base nor acidic product technologies are bringing cleaning chemistries new capabilities.
Step 4: Solder Print: 3D SPI and Process Control
By Jean-Marc Peallat, Vi Technology - Solder paste inspection (SPI) becomes necessary to the SMT line as a process control tool, especially with small components' landing pads, such as the pads for microBGAs and 01005s. This article reviews the available SPI technologies (laser triangulation, Moiré methodology, flying absolute height profilometry), usefulness of SPI on the line, and the cost/benefit equation of adding solder paste inspection post-print.
Setup Parallelization Enables Flexible SMT Production
By Adrian Schärli, Essemtec - Constant changeover is the norm in today's SMT production. In such an assembly environment, the largest costs are accrued by machine set up, set-up change, and product changeover. These costs can be minimized through set-up optimization and parallelization. It is a concept that saves costs and increases productivity. It also puts high demands on personnel, your organization, and placement machines.
Getting Direction at APEX: Roadmaps from IPC and iNEMI
Trade organizations IPC and iNEMI both revealed their industry roadmaps at IPC APEX in Las Vegas this week, structuring the short- and long-term goals of the electronics industry. These include challenges to overcome, new plateaus of technology to achieve, and likely areas of growth or decline in the years to come. Highlights from both roadmaps are reported here.
Pre-show Preview: IPC APEX Expo
These new and legacy products include modular pick-and-place systems, factory-level software, PCB handling trays, and more tooling, equipment, and materials for electronics assembly that will be displayed at the IPC APEX Expo, March 31 through April 2 in Las Vegas.
Military and Aerospace XRF Verification: Keep the Lead In?
By Scott Mazur, Benchmark Electronics Inc. - Various industries such as military and aerospace sectors continue to be exempt or not covered by RoHS. These industries require leaded assembly, given the risk of growth of tin whiskers and lack of field reliability data for lead-free components and subassemblies. Military and aerospace companies are searching the supply chain for COTS leaded components. Tin whiskers can grow unpredictably, and are mitigated by leaded materials.
New Installations: ACI Adds Selective Soldering, USR Implements Factory Traceability, and More
EMS providers, centers of excellence, OEMs, and others are adding equipment, materials, and software to improve their operations. The American Competitiveness Institute installed an RPS selective soldering system; Ascentech sold solderability testing equipment to Continental Automotive; USR Electronic Systems implemented Valor's vCheck quality management system; Sennheiser New Mexico LLC added a barcode labeling system from PROMATION; Nortec Group approved Zestron's cleaning materials.
New Distributors for Industry Products
Multiple distribution contracts have been signed recently, leading to better service and expanded service ranges for electronics assembly materials and equipment. Following are the new distributors and their territories, serving KIC, L3 Electrodynamics, Taiyo America, RPS Selective Soldering Systems, Indium Corporation, SMH Technologies, and Austin American Technology.
Thermal Profiling: A Practical Approach to Reflow Profiling
By Liyakathali Koorithodi, Indium Corporation - In the lead-free era, thermal profiling has a critical role. We discuss profiling, tools, practical issues, and inspection methods. As the process window narrows, profiling equipment and/or thermocouple errors must be taken into consideration. In addition, the accuracy and method of TC attach will impact critical assemblies.
Part 10: Lead-free System Reliability Power of Metallurgy
By Jennie S. Hwang, Ph.D. - On this global lead-free electronics manufacturing's tenth anniversary (plus and minus a year or so), it is timely to reflect what have progressed and what is on the horizon. If I have to mention one thing that stands out, that is the power of metallurgy. How so?
High-Performance Polymers for Environmentally Friendly Electronic Components
By Edson Ito, Ticona Engineering Polymers - The time is right for green electronics. With higher energy costs, consumer awareness of carbon consumption, e-waste laws, and plans to invest in renewable energy projects, computer and electronic gadget manufacturers are starting to leverage green credentials. Material suppliers are developing new materials to help manufacturers produce eco-friendly system components without hazardous chemicals such as antimony, beryllium, and phthalates.
Top Companies in Printed Electronics
Printed electronics change everything from medical end products to product packaging. Two recent reports from Electronics.ca Publications and IDTechEx discuss the companies developing and commercializing printed electronics for consumer products, e-displays, solar cells, and other electronics.
Studies and Associations Focus on Manufacturing Business Management
Prime Advantage released its first "Group CFO Survey," representing financial executives of U.S.-based manufacturers in more than 25 industries; AMT The Association for Manufacturing Technology will pursue new leadership following the resignation of president Robert K. Simpson; and IBM's supply chain management study found that managing risk is now as important as faster, better, cheaper in regards to an effective supply chain strategy.
Cooling Needs to Start at the Chip Level
By Paul Magill, Ph.D., Nextreme Thermal Solutions - Energy consumption is rampant in the U.S., and theories vary on curtailing its impact. Electronics thermal management can cool electronics from the first level, exponentially improving operating temperatures throughout the server farm.
Material Compatibility Worldwide
By Harald Wack, Ph.D., ZESTRON - For decades, despite research and trials, chemicals have continued interacting with the cleaned surfaces in question. Cleaning materials are researched and changed based on the root cause of the observed problem. Are there issues with all cleaned parts or only with selected ones? The answer will give you an idea whether the problem is related to chemistry or not.
Optical Interconnects for Silicon Circuit Boards
By Daniel Stevenson, siXis - A silicon circuit board (SiCB) is designed for components interconnection, targeting a higher degree of integration than is practical with current VLSI technology. SiCBs are manufactured using standard silicon electronics fabrication methods. In contrast to traditional PCBs, they use unpackaged integrated circuits (ICs) extensively and feature the finer-pitch signal trace geometries available with photolithographic fabrication.
Improve Time to Market with Freeze Gate Development
By James Scholler, MEC - In compressed product development cycles, traditional checks and balances become insurmountable constraints, driving non-value-added activity. A "freeze gate" lean concept leverages existing resources to meet a tight schedule without adding risk or impairing quality.
February New Products: Soldering Materials, Processes, and Equipment
Following are the selective and wave soldering equipments and tools, new high-reliability lead-free solder alloys and fluxes, and vapor phase reflow technology. Companies presenting new products and processes include Manncorp, Rehm Thermal Systems, Vitronics Soltec, Cookson Electronics, and Nihon Superior.
Micro SMT Connector Combines Old and New Technology
By Mark Leach and Ann Cibelli, Advanced Interconnections Corp. - In this case study, a 1.0-mm-pitch SMT connector is replaced by a new connector with the same footprint that surpassed shock/vibration, thermal shock, cyclic humidity, high-temperature life, and MFG tests. The connector had to be low-profile and lead-free for a telecom application.
New Products: Cleaning Materials, Equipment, Tests, and Processes
Following are the new cleaning products introduced by MicroCare, Aqueous Technologies, Rehm Thermal Systems, and Practical Components. The products range from cleaners to a flux residue management system within reflow ovens to cleanliness and residue evaluation testers, and a stencil cleaning system.
Step-by-Step: Process Control Eco Lifecycle Assessment and Improvement
By Jim Dills, Green EcoSystems Group In the new green business climate, global manufacturing companies must continually assess and improve their products and processes to retain customers; gain competitive advantage; and comply with environmental legislation like RoHS, REACH, WEEE, and EuP. Eco lifecycle assessment and improvement processes are required for the management of the critical environmental aspects and impacts of product toxicity, waste stream management, and energy use.
Integrated Test and Inspection: Inspection Strategies and X-ray Techniques for Identifying Manufacturing Defects
By David Bernard, Ph.D., Dage Precision Industries, a Nordson Company With PCB assemblies increasing in complexity, test access for ICT and functional test is reduced. Along with AOI, 2D and 3D X-ray is moving beyond hidden-joint inspection into the high-density PCBA inspection area, including ASICs, memory, thru-hole joints, and more. X-ray inspection needs vary with each application, but a combination approach with 2D and 3D systems provides comprehensive coverage.
New Products: Connectors, Programming Scripts, Pastes, and More
Following are recently introduced products from power semiconductor lead-free solder paste to flex-to-PCB connectors, to hot bar or pulse soldering systems, and more.
New Products in SMT Electronics Assembly
Following are the newly released prototyping lines, LXI interfaces, solar cell production tools, feeder/component storage, epoxy materials, XRF testing tools, component handling accessories, and PCB-mount components from around the SMT supply chain.
The State of the EMS Industry
By Sharon Starr, IPC - A recently published study, 20072008 Analysis & Forecast for the EMS Industry, from IPC shows that the market for EMS continues to grow, although growth rates are slowing with the current economic downturn. EMS continues to outpace other segments of the electronics industry due to expanded outsourcing.
EMS Business Update
By Susan Mucha, Powell-Mucha Consulting Inc. - Any time the words "global economic downturn" become headlines, the EMS industry will be impacted. Assessing that impact can be difficult, because the EMS industry is a collection of subgroups that cluster around revenue, geographic focus, OEM industry niches, technologies, and services. This article focuses on economic; political-legal; technology; and behavior trends.
Consistent PCB Traceability with Data Matrix Symbols
By Laura Hoffman, Microscan - To improve quality control, traceability, and throughput on their test adapters, an electronic components and modules manufacturer implemented miniature data readers inside inspection systems. These vision systems have to read barcodes and cope with challenges posed by shiny PCB materials, limited space, and zero-defect/high-reliability end-product standards.
New Year, New Headquarters
In 2009, several electronics manufacturers and supplier to the EMS industry will move into expanded facilities and relocated headquarters. Following are the announcements from Dynatech Technology, Adept Technology, KIC, and STI Electronics.
New Products in Electronics Assembly
Following are products designed to improve selective soldering, ESD control, kitting and box build, hand soldering, boundary scan tests, and other steps in the electronics assembly processes.
New Components, Modules, and Subassemblies: January 2009
Following are the new products, reports, and software tools in the component sector, including power splitters, capacitors, sensors, connectors, varistors, oscillators, and more. Products come from AVX, IMS, Molex, Fox Electronics, EPCOS, and other companies in the component manufacturing industry.
TFI: Streamlining Supply Chain and Logistics
By Jonathan Gilbert, TFI logistics consultant - With all of the recent bad economic news, it's sometimes hard to think of positive effects from all the disruption we're seeing. Tough times bring challenges as well as opportunities. We need to be focused on what's coming up and prepare. For supply chain managers, the current worldwide slowdown presents some unique opportunities.
Part 9: Lead-free System Reliability Avoid Likely Failures
By Jennie S. Hwang, Ph.D. - In this ninth discourse on the subject of lead-free reliability, let's look at what it takes to maximize system reliability, achieving a product's ultimate performance and reliability. Ultimate reliability can only be achieved by planning for reliability at the outset, followed by sound design, material selection, parts selection, and executing manufacturing for reliability.
Taking Cue from CES, Window-shop Your Work
With Macworld and CES generating a modest amount of excitement in the midst of depressing economic indicators, sorting through the new product releases has become a mixture of electronics news and online shopping. Interesting products all make good use of LEDs, flex circuits, advanced electro-mechanical design, etc. The most hyped new products are the thinnest, most mobile PCs and Macs. And while we're talking hype, let's take a lot at the new crop of green electronics.
Lead-free for High-reliability, High-temperature Applications
By Hector Steen, Ph.D. and Brian Toleno, Ph.D., Henkel Corporation - Though the electronics industry is nearing RoHS's three-year anniversary, several challenges remain with lead-free materials. Automotive and military/aerospace products require a lead-free material that can withstand under-the-hood conditions, offer vibration resistance not commonly associated with traditional SAC alloys, and deliver high-temperature thermal cycling reliability levels beyond those currently available.
Selection Criteria for SMT Placement Equipment
By Ray Prasad, Ray Prasad Consultancy Group - Typically, surface mount pick and place equipment, including a full complement of feeders, constitute about 50% of the total capital investment required for a medium-volume surface mount manufacturing line. Since no one type of placement equipment is best for all applications, the effort required in selecting equipment with an appropriate feeder system should constitute a major part of the effort spent in selecting capital equipment.
Halogen-free Guidelines, Databases, and Future Projects
By Scott O'Connell, Ruben Bergman, and Marshall Andrews, HDPUG - The High Density Packaging User Group International (HDPUG) has been evaluating halogen-free material properties and the feasibility of using them in electronic products since information about the first halogen-free materials was introduced some 12 years ago. HDPUG recognized the market need for halogen-free materials in electronic equipment and developed programs to assistant in this transition.
New Products in Electronics Manufacturing: January 2009
Following are the new components, factory automation elements, screen printing tools, thermoelectric power generation kits, dispensing systems, product data management software, test boards, ESD control products, soldering systems, and other products for design, assembly, and test of PCBs released recently.
Double-sided Flying Probe Solves PCB Test Challenges
By Ray Rattey, Texmac Inc. - Flying probe technology has been used to verify bare-board opens and short and as an alternative to in-circuit test (ICT) on populated PCBs for more than 20 years. Test issues caused by complex, dense, or otherwise challenging PCB designs are resolved by double-sided test probe system technology.
Automating Nondestructive Analysis of Underfill in Flip Chips
By Tom Adams, Sonoscan Inc. - Flip chip failure under operating conditions often stems from a root cause in the solder bumps or underfill materials supporting the bumps. Voids, delaminations, and cracks can lead to failures. Individual flip chip inspection can be difficult at production speeds without specialized software tools.
BBC: Smartphones Drive Mobile Markets
By Mark Ward, technology correspondent, BBC - There is no doubt that 2008 was the year of the smartphone. The last 12 months saw the launch of iconic devices such as the iPhone 3G, Google G1, Blackberry Storm, and Nokia N97. It also saw the emergence of the electronic ecosystems needed to get the most out of such handsets. The popularity of these devices has brought to light several problems that look set to become acute in 2009.
Most Popular Articles on SMTonline.com
Each year, SMT publishes hundreds of tutorials, opinion columns, expert analyses, tech solutions, editorials, and other features on our homepage, in addition to the latest news and new products. Here is a collection, in no particular order, of the most read articles published on our Website in 2008, including solutions for rework, PCB design, tin whiskers, lead-free soldering, the current business environment, and many other challenges and emerging technologies of the SMT industry.
Inside EFD's Solder and Dispense Equipment Manufacturing Operations
EFD hosted an open house at its new, larger East Providence, R.I., facility. SMT toured the solder paste development, manufacturing, and testing areas; dispenser manufacturing; shipping; and other operations at the facility.
Dross: Waste, Revenue Source, or Just Another Process to Optimize?
Dross is often thought of as waste, a residue that forms on the surface of a metal from oxidation that looks bubbly, filled with metal impurities. This mass of solid impurities floating on molten metal in wave solder machines can be removed from the process, and recycled by shipping to the recycling site of an outsourced processor or in-house using specialized equipment. With lead-free alloys, recycling now has a monetary consideration. There are a lot of companies that provide help with dross.
New Products in December
Following are the new soldering systems, cleaning materials, training resources, software programs, testers, and other electronics manufacturing products introduced by Zestron, STI Electronics, Lumex, AVX, Corelis, and other companies in the electronics manufacturing supply chain.
Turn Environmental Awareness into Gain
By Simon G. Norman, EVS International - The impact mankind has on our planet makes for uncomfortable reading. Changes put in place now will undoubtedly pay our children back tenfold, but what if being environmentally responsible could pay you back in a year, rather than decades? We follow one electronics company's commitment to the environment through the installation of two solder dross recovery systems.
Reducing and Preventing Tin Corrosion Whiskers
By Olaf Kurtz, Ph.D.; Peter Kühlkamp; Jürgen Barthelmes; and Robert Rüther, Atotech Deutschland GmbH - For the connector and IC/leadframe industries, corrosion can occur on metalized components and products, resulting in malfunctions. This article presents the work done on an effective anti-corrosion treatment* that can mitigate corrosion whisker formation effectively. Process benefits to tin solderability are highlighted.
New Components, Connectors, and Subassemblies
Following are the new surface mount and insertion components, as well as off-the-shelf subassemblies, and various connectors available from companies such as Laird, AVX, Amphenol, FDK, and others. The products suit harsh environments, consumer applications, and other target markets.
New Products of SMT Assembly
Following are the new equipment, solder and materials, and software products released for high-changeover, high-reliability, high-mix, and other challenging SMT assembly environments.
Supplier Quality Doesn't Just Happen
By Robert Rowland, RadiSys - Supplier quality management is a critical success factor, especially when commodities are procured globally and manufacturing is outsourced. Selection, qualification and approval, and monitoring require well-defined processes to ensure quality expectations are achieved consistently. Focus on preventive actions rather than waiting for problems to occur.
The Restructuring Supply Chain
The reorganization effort is underway across the supply chain lately, as the home loan collapse snowballed into the credit crunch, then into the global financial crisis. Respondents to our 2009 forecast question, "How can PCB assemblers cut costs in 2009?" pointed to smart management and lean manufacturing. Companies from Camtek to Rockwell Collins announced cost-cutting plans of late.
From the Show: IMAPS 2008
Conferences abound in the electronics industry. After a while, attendees have to choose between local shows where drayage and employee travel times do not require hotel stays and the larger shows where travel and coverage prove costly. Fortunately, IMAPS 2008 had great international participation, good attendance, and excellent presentations. From keynoters to the technologically educational papers, the show was sound. And it was close to home for SMT editors.
New Products Online
We're featuring the debuts of next-generation sockets, dry boxes, thermal profiling software, laser inspection systems, cleanroom wipes, a 10 Gbit/sec. assembly, pick-and-place systems, vacuum tables, and soldering machines.
Names in News
Following are the outreach initiatives, industry recognitions, new hires and promotions, and more announcements from suppliers like Zestron America, Cognex, Allied, Kraydenmex, Fine Line Stencil, The Morey Corp., DEK Solar, Electronic Interconnect Technology, IPC, Balver Zinn, iNEMI, and Seica.
DfM Navigation Tools for PCB Success
By Nolan Johnson, Sunstone Circuits - Of the key decisions that can improve design for manufacture (DfM) and design for yield (DfY), 75% of the impact of those decisions will be made before the design leaves the CAD tool environment. With the realization that designers influence ultimate yield, it makes sense to give designers as much useable information as possible to improve the assembly. The role of DfM/DfY is to provide a feedback loop for the engineering and design team.
The Importance of Global Technical Support
Harald Wack, Ph.D., ZESTRON America - Numerous companies have shifted their main production facilities from service-driven economies to lower wage, developing countries. It is clear that to take advantage of technological advancements, we must continue to use our competitive, educational edge. Customers expect a global mindset with excellent service.
November New Product Showcase
New products released to the SMT assembly market include pressure-indicating films for adhesive applications, components and off-the-shelf modules, MSD moisture-control cabinets, final assembly components, XRF systems, programming software for automated tools, soldering system controls, automated programmers, rework systems, and test analysis systems.
How to Use Machine Calibration Techniques
Information provided by CeTaQ - Machine calibration can increase the efficiency of a production line, reduce rework, improve manufacturing accuracy, and enable use of more advanced components and board designs. Knowing the many possibilities available for machine calibration is key to maximizing its benefits for your assembly and inspection lines.
The Evolution of Start-ups: Nextreme Meets Its Market
Start-ups face an uphill battle, with strong competition, limited access to resources, and a market that often isn't ready. We spoke with Nextreme's Paul Magill, Ph.D., about Voxtel's addition of Nextreme's thermoelectric cooler into its VDHAX APD receivers. This marks a new phase in our evolution, says Magill, asserting that the market is ready for their thermal management advances.
Reballing Rework: The Bright New Future
By Kris Roberson, MIT, BEST Inc. -
Components are always evolving, which brought us the BGA. Add in RoHS and WEEE, and BGA rework becomes an exciting topic. To rework or install a BGA on a lead-free assembly, reballing is necessary. Here, we look at the history and the why and how of reballing, examining a reballing technique that could increase operator ease and assembly reliability.
Analysts on Flexible, Organic, and Printable Electronics
NanoMarkets and IDTechEx both released reports on flexible, printed, and organic electronics (FPOE), including data on dielectric materials for next-generation thin-film, organic, and printable electronics assemblies; applications for these technologies; end products in the market now; and an upcoming printed electronics show.
New Electronics Assembly Products
New products coming into the supply chain range from flexible test platforms to surface mount connectors, selective soldering systems, conductive epoxies, pick-and-place vision systems, and strain gauge simulation. Suppliers include CheckSum, Bliss Industries, CeTaQ, Zierick, Conductive Compounds, RPS Automation, Pickering Interfaces, Epson Toyocom, and APS Novastar.
Changing Times: Where to Find Cleaning Today
By Tom Forsythe - Beginning in the 1990s, soldering technology advances, ever-shortening product lifecycles, the global ban on CFC-113, and other technology advances together brought on the era of no-clean soldering. While cleaning never truly disappeared, significant segments of the industry moved away from cleaning, far away. At the time, they did not need a cleaning process. But those times are changing.
It's What's Inside That Counts: Embedded Components
Recently, PCB fabricator Ibiden Co. Ltd., with more than 12,000 employees and about $4 billion in consolidated annual sales, announced that they would be licensing Finland-based Imbera's embedded packaging technology. We knew that this had to be a solid way to embed components into the PCB. When you think about creating a functionally dense system, the directions seem to be building up a stacked package or down into the board material in an embedded active or passive device.
Facility Tour: NBS Design
SMT visited NBS Design’s new Santa Clara, Calif., facility, touring the EMS provider’s assembly lines and inspection systems, soon to include the first Agilent Ã—6000 on the West Coast.
Competitive Differentiation: The Battle for Customer Perception, Part I
By Ted Turner, CoGen Marketing
This two part series will discuss competitive differentiation why it's important, market segmentation, competitive comparisons, and how to take action to win business. Competitive differentiation is the life blood of every company. All too often, competitive differentiation slides into complacency as the company and its products mature, leaving the company vulnerable to competitive attack.
Focus on the Present, Plan for the Future
By Ajit Utagikar, Core Capital ESG - For the past decade or so, we have seen vigorous consolidation in the SMT world driven by mergers and acquisitions. At the same time, electronics companies have shifted to the outsourcing model, where the components and products are manufactured by subcontractors. The drive is for SMT companies to transform themselves, increase volumes, and recession-proof their portfolios through diversification.
From the Show: SMT's Packaging Panel at IPC Midwest
SMT editor-in-chief Gail Flower chaired a panel comprising equipment supplier, laboratory, EMS provider, and consultant voices at IPC Midwest in Schaumburg, Ill. David Geiger, Flextronics International; Jacques Coderre, Unovis Solutions; Vern Solberg, STI ? Madison; and Gene Dunn, Panasonic Factory Solutions of America spoke about emerging packaging technologies. We gathered some key points to share with our online audience.
Surface Mount Components Show Their Hidden Benefits
By Craig Hunter, Vishay - Surface mount components usually are marketed with their most apparent benefits in view. But a look at some recently introduced surface mount components, both passive and semiconductor devices, shows some benefits enabled by this technology that are nearly as important without being quite so obvious.
New Products of September
Following are some of the new testing, component handling and parts, defluxing, photovoltaics manufacturing, soldermasking, cleaning, X-ray inspection, and printing products on the SMT assembly market. These products are introduced by Agilent, Virtual Industries, Stackpole Electroncs, Scapa, Manncorp, and more.
Inside ACI: RoHS and Lead-free Update
The American Competitiveness Institute (ACI) hosted a day with Ron Lasky, Ph.D., Indium, as a free workshop focusing on critical areas of lead-free assembly. Indium Corporation and SMT co-sponsored this educational program, which reviewed recent activity in RoHS, especially as related to medical exemptions.
Combating Component Obsolescence A Visit to Rochester Electronics
"In a perfect world." This is a phrase uttered by many a project leader or product designer compiling a bill of materials (BOM) for a new product or modified design. In the real world, something like 70% of the components specified for a long-design-cycle assembly will be obsolesced by the time the assembly hits the manufacturing floor. We visited one components supplier, Rochester Electronics, to see how they keep phased-out components at the ready in an imperfect world.
Design, Fabrication, Assembly What Changes for Harsh-environment Electronics?
By Zulki Khan, NexLogic Technologies Inc. - Manufacturing harsh environment electronics takes into consideration a number of key aspects dealing with PCB design layout, fabrication, and assembly. The EMS provider that goes beyond an OEM's minimum engineering requirements and implements additional safety ensures that the board and end product maintain high performance and optimum reliability, regardless of environment, terrain, or temperature conditions.
We Need to Talk. And So Do Our Machines
By Dieter Bergman, IPC - IPC is an organization that serves the electronics industry in many ways, but when people think of IPC, one word probably comes to mind: standards. The work of developing standards involves thousands of people, and only a few of them are IPC staff members. Most of the work is done by engineers and managers from the approximately 2,700 member companies, people who offer their time and expertise to enable the industry to function more efficiently and effectively.
From the Editor: IPC Midwest Covers Package to Board
A tradeshow like IPC Midwest conference & exhibition at the Renaissance Schaumburg Hotel in Schaumburg, Ill., is a wonderful excuse to eat hot dogs with celery salt and wear a Cubbies cap with pride. Beyond the location, this year really means much more to me. For one thing, we set up the A-Line to view SMT assembly in action, and I'll chair "Emerging Advanced Packages: Stacked, 3D, CSP, Embedded Surviving the Board Assembly Process."
SMT Hosts EMS Panel at IPC Midwest
SCHAUMBURG, Ill. SMT managing editor Meredith Courtemanche will host a panel Wednesday, September 24, at IPC Midwest in Schaumburg, Ill. The panel, "A-Line and EMS Trends," tracks the journey of electronic products from product development, through project launch, manufacturing, and customer service with program management.
New Products in SMT
Following are the upgrades, replacement parts, new cleaning materials, thermal interface products, board handling systems, sockets, assembly lines, and other next-generation products from Manncorp, Aries, Essemtec, Zestron, Novatec, and more.
Process Control and Visual Management for Lead-free Hand and Wave Soldering
By Scott Mazur, Benchmark Electronics - Manufacturing facilities continue to produce leaded and lead-free assemblies, given the various RoHS exemptions. Facilities that manufacture a variety of products using both alloys require controls and identification of specific lead-free processes and equipment. These are critical, given the past use of leaded solders in every electronics manufacturing facility and the potential legal and financial consequences of shipping noncompliant material.
Intelligent GPS on the Autobahn
By Bjorn Dahle, KIC - Last year, I prepared myself thoroughly for driving in Germany. Everything worked beautifully until I was stuck on the Autobahn due to roadwork. This year, the GPS system in my rental car was receiving real-time traffic updates constantly, enabling it to navigate around congested areas. This is the perfect analogy for a modern thermal profiler and real-time process management system.
From the Editor: Celebrating U.S. Labor
Labor Day is one of those strange holidays that evolved without a concrete birthday or significant historical event as a kick-off point, and even the U.S. Department of Labor is unsure about exactly who started the holiday. The celebration of the strength and capabilities of American labor began in New York City in 1882. Now, 126 years after that first demonstration, we should have a look at how the American electronics manufacturer is faring.
Review: BGA Breakouts & Routing
BGA Breakouts & Routing, Effective Design Methods for Very Large BGAs, by Charles Pfeil, engineering director of Mentor Graphics’ Systems Design Division, tackles demonstrating design technology on a written page with abundant illustrations.
People of Electronics Assembly
Following are the new hires, promotions, and personnel announcements from industry suppliers and PCB assemblers, from FINETECH, Indium, and Krayden to Endicott Interconnect, Prototron Circuits, Canadian Circuits, and others.
Mixed-system RF Design: Problems and Solutions
By Per Viklund, Mentor Graphics and How-SiangYap, Agilent - RF design used to be performed on a specialized RF design system with loose integration to design tools for other technologies. In recent years, we have seen a trend shift in system design towards advanced multi-technology systems having an extreme function-to-area ratio. RF, analog, and ultra-high-speed digital share board space as a single integrated system.
Protecting Brand Reputation
By Carsten Barth, Elcoteq - At this time of economic downturn and with reduced consumer confidence, the equity of a brand can be one critical factor in ensuring that sales and margins are maintained while lesser brands get squeezed. Brand equity can be a function of many things image, price, innovation, tradition. At the end of the day, they all boil down to reputation.
From the Show: SMTAI News
Exhibits opened today at SMTA International (SMTAI) in Orlando, Fla. While the dubious weather dominated a lot of the booth chatter, many attendees braved the storms to absorbed rich technical content in the sessions and at the exhibit hall. Following is a gathering of news and impressions from materials suppliers, distributors, equipment manufacturers, and the Association itself.
Shrink the iPhone: Miniaturizing Passive Packages
By Jim Stratigos, Jacket Micro Devices - Apple's recently introduced 3G iPhone is a marvel of engineering from just about any perspective; compact, feature rich, cool touch screen, and a plethora of wireless functions. It's also an indication of how far the electronics industry has yet to achieve in terms of miniaturization of complex analog circuits.
Cost-effective Replacement for Production Hand Soldering
By Alan Cable, A.C.E. Production Technologies - Selective soldering is an automated, robust method of soldering individual components that could not be hand soldered, and a way to automate individual component soldering processes that could not be wave soldered properly in pallets or assembled with solder fountains. Selective soldering has become an integral part of most PCB assembly lines.
Computed Tomography (CT) for Reverse Engineering
By Jon Dupree, YXLON International - Reverse engineering is a powerful tool for generating a CAD model from the data of a physical part that lacks documentation or has changed from the original design. The range of uses includes analyzing a sample to determine how it works, identifying potential patent infringement, etc. The non-destructive reverse engineering process involves measuring an object without taking it apart and then reconstructing it as a 3D model.
Summer Reading: Hedy Lamarr's CDMA Story
August is recognized internationally as a month to relax and appreciate summer. For a great combination of electronics industry history and entertainment, pick up Spread Spectrum: Hedy Lamarr and the Mobile Phone, chronicling movie star Hedy Lamarr and musician George Antheil's collaboration on a 1942 patent for mobile communications in naval weaponry. The technology became the basis of a computer chip synchronization technology, "frequency hopping," or CDMA.
Rework Challenges, Rework Solutions
By William E. Coleman, Ph.D., Photo Stencil - Although the goal of every process is zero defects, the reality is that rework-and-repair is necessary sometimes, especially given the cost of scrapping high-dollar assemblies. A variety of tools and methods are available for reworking defective PCBAs, even those with dense layouts and fine-pitch components.
From the Show: Happenings at SEMICON West
SEMICON West, taking place this week in San Francisco, gathers industry experts, analysts, suppliers across the industry, and semiconductor and packaging manufacturers together to discuss the state of the industry, future opportunities and challenges, and advances in technology.
Solder Dross Recycling: A Case Study
By Simon Norman, EVS International - The world price of solder is at an all-time high, so reducing solder consumption therefore reducing incurred costs should be at the top of every electronics manufacturer's priorities list. On average, EMS companies throw away 75% of their solder as dross. One company worked with their equipment supplier to automate the solder dross recovery process in-house.
From the Editor:
Tradeshow Participation Anticipation
Time seems to be speeding up lately, as I can't help but spend a lot of time looking ahead. What's down the road? SEMICON West is just around the bend, then SMTA International next month, and IPC Midwest in September. We at the magazine have unique opportunities to participate in each of these major shows.
The Environmental Cost of Green
By Michael Konrad, Aqueous Technologies Corporation - Being involved in the electronics assembly industry for more than 23 years, specifically in the field of defluxing and cleanliness testing, I have seen my share of environmental regulations. Today, governments have focused their attention on effluent discharge, a byproduct of defluxing.
How Does Cleaning Affect Conformal Coating?
By Sini Aleksic Ph.D.; Helmut Schweigart, Ph.D.; and Harald Wack, Ph.D., Zestron - Providing electronic assemblies with protective coatings is an important and necessary measure to ensure their reliability. To ensure optimum adhesion of the protective coating, it is important to provide the highest cleanliness of the assemblies before coating. Perform analysis beyond traditional cleanliness tests.
July Featured Products
Following are the new components, software packages, thermal interface materials, and production accessories for electronics manufacturing from Blue Thunder, Laird, AVX, Aegis, and more.
Regarding RoHS: Two Years In
The two-year anniversary of the EU's RoHS legislation is right around the corner, July 1, and much still is left to debate. No surprise then that RoHS, in its regional and global implications, remains a hotly contested, oft-discussed topic in the industry. With exemptions running out and new materials facing the ax, RoHS is just as much "beginning" today as it was in July 2006.
June Featured Products
Following are new components, thermal interface materials, connectors, test systems, software products, and other launches from Agilent, Mill-Max, PROMATION, Aegis, HumiSeal, HALT&HASS Systems, and more.
Hot Topics: Solving an Industry Dilemma with Emerging Technologies
"There are practical limits to both tin/lead and lead-free solder," says Joe Fjelstad, Verdant Electronics, in his argument for solderless assembly, "Dealing with the Lead-free Challenge." Arthur Chait, EoPlex Technologies, says "today's devices demand increasingly complex components, smaller," in his exploration of emerging deposition technologies, "Keeping Pace with Miniaturization."
Don't Leave Succession Planning to Luck
By Gary A. Tanel, Associate Equity - When an entrepreneur starts an EMS company, the last thing on their mind might be how they plan to exit the business. Successful businessmen and investors know, however, that you never get into a business without knowing how to exit. All private business ownership is transitioned one way or the other.