A Drone's-eye View of the IPC APEX EXPO Show Floor
If you couldn't make it to IPC APEX EXPO in San Diego, don't worry. We have full coverage of this annual must-attend event, from the opening ceremony to the close of the final day. To get a sense of the size of this year's show, check out our drone's-eye view of the show floor. Can we name our drone Air007?
TUM Hyperloop Team Learns PCB Design on Way to Setting World Speed Record
At AltiumLive Munich, I met with Tobias Bobrzik, a Technical University of Munich student and member of the TUM Hyperloop team. In 2018, the TUM Hyperloop team’s prototype pod set the world speed record of 290 miles per hour, which lead to their meeting with Musk. Tobias designed some of the PCBs used in that vehicle, so I asked him to tell us more about this experience, and what he hopes to do after graduation.
RTW IPC APEX EXPO 2019: Panasonic Highlights New Products, IPC STEM Student Outreach Program
Sean M. Murray, GM of North American Sales EAG Group for Panasonic, and Nolan Johnson, I-Connect007 Managing Editor, discuss two new product announcements at the show—PanaCIM process tracker software and MPM-WX—and being a sponsor for the IPC STEM Student Outreach Program.
Super Dry Storage Options to Manage Intermetallic Growth
Guest Editor Kelly Dack speaks with Richard Heimsch, director of Super Dry, about some of the differences between storing components and other materials for assembly floor storage versus long-term storage, and how Super Dry can help combat intermetallic growth.
RTW IPC APEX EXPO 2019: New IPC Technical Education Program Manager
Brook Sandy-Smith discusses her new role as IPC technical education program manager, which is also a brand-new IPC position. She further explains the benefits of membership, when a member should contact her, the IPC STEM Outreach Program, and upcoming events.
RTW IPC APEX EXPO: Zentech on the Fourth Pillar of DoD Acquisitions, and NIST
Steve Williams speaks with John Vaughan, VP of sales and marketing for Zentech, about their dominance in the military/aerospace market sector, the new "fourth pillar of DoD acquisitions," and how companies that do not take the NIST initiative seriously will be quickly left behind.
Supply Chain in Crisis
In a traditional design flow, the project team tends to use the parts they already know and have footprints for—maybe a little long in the tooth, but known quantities, after all. Except these are not traditional times. Component supplies, prices, and lead times are in a great deal of turmoil. The automotive, IoT, and telecommunications sectors are vacuuming components out of the supply chain at a record pace, exerting influences like early obsolescence of older components and more.
Joe Clark Discusses DownStream’s Updated Tool Lineup and IPC-2581
DownStream Technologies recently revamped their entire product line, from CAM350 through BluePrint-PCB. DownStream co-founder Joseph Clark and Guest Editor Kelly Dack discuss some of these updates, including a new GUI and capabilities such as 3D analysis, as well as news about IPC-2581.
RTW IPC APEX EXPO 2019: KYZEN Intros New Aquanox Aqueous Cleaner
In an interview with I-Connect007 Technical Editor Pete Starkey, KYZEN Executive VP Thomas M. Forsythe introduces the latest member of the Aquanox family of aqueous cleaners and comments on issues of compatibility, rinsability, and consistency of operation.
CES 2019: More Show Floor Favorites
In my final piece covering CES 2019, I will review more automotive technology, updates on 3D printing, and some trending devices such as smartwatches and new computer components for those that either need or just want to have extremely powerful and impressive-looking computers.
RTW IPC APEX EXPO 2019: KIC Speaks on Data, Voiding and Traceability
Bjorn Dahle, president of KIC, talks with I-Connect007 Technical Editor Pete Starkey about how the industry has shifted its focus from the machine to data; the issue on voiding and how manufacturers can address this process challenge; and traceability.
IPC APEX EXPO 2019: It's a Wrap!
The IPC APEX EXPO 2019 show floor closed yesterday with applause. After three days of meetings, networking, and tire kicking, if you will, exhibitors head back to their offices with a list of leads, to-do lists, and stories to share. Meanwhile, attendees now head home with important decisions to make about what they learned and who they want to do business with.
RTW IPC APEX EXPO: OK International Soldering Robot Integrates CV Technology
Bryan Gass, vice president at OK International, talks with I-Connect007 Managing Editor Nolan Johnson about their new soldering robot that integrates their Connection Validation (CV) technology. Launched at the IPC APEX EXPO last year, the CV technology provided the company a springboard to have a good start into 2018, and to achieve growth throughout the year.
Day One, Nothing but Fun: The Show Warms Up
The first official day of the IPC APEX EXPO 2019 was full of excitement, activity and business getting done. From the exuberant crowd at the ribbon cutting ceremony, to the closing moments of day number one, the show floor was bustling. Spirits were high from both attendees and exhibitors, sending the signal that optimism and business strength are still the industry mood.
RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.
The Designers Council: A Chapter Primer From the Ground Up
Thinking it might be a way to make new contacts with PCB designers in Orange County, I attended a couple of Designers Council meetings. The chapter president at that time was Paul Fleming, who asked me to be part of his steering committee because he learned that I had spent decades in fabrication. Within a few months, he had gotten a job transfer to Arizona, so he twisted my arm to take over as the chapter president. I agreed, but little did I know that this would become a major turning point in my PCB career.
IPC Conferences Set the Tone for Innovation During IPC APEX EXPO 2019
Monday's docket of sessions at IPC APEX EXPO 2019 presented a wide-ranging array of topics, including the Automotive Executive Forum, the Connected Factory Initiative Workgroup mapping out the future of CFX, the DFX committee celebrating the release of the IPC 2231 Guidelines document, and the Critical Components Traceability Workgroup addressing the creation of a secure supply chain.
Happy Anniversary, Gerber Format: Looking Ahead to Digital Innovation
This year, we celebrate the 55th anniversary of the introduction of the Gerber machine language format. We can thank H. Joseph Gerber, the man who took manual PCB design to the next level with the automated photoplotter, for giving us this format in 1964. Gerber immigrated to the United States in 1940 with his mother following the death of his father during the Holocaust. Gerber started Gerber Scientific Instrument Company in 1948 to commercialize his first patented invention—the variable scale.
AltiumLive Munich Draws Designers from Around Europe
I’m finally unpacked after last week’s AltiumLive PCB design summit in Munich. Much like the AltiumLive event I attended in San Diego last October, the conference drew hundreds of PCB designers. This marked the second AltiumLive PCB design summit held in Munich, and Altium seems to have it down to a science. I spoke with designers from Germany, Austria, the Netherlands, and Belgium, just to name a few countries. Many of them were involved in the automotive segment but some were in medical and industrial controls as well. It’s great to be at an event that is full of PCB designers, because designers are few and far between at most PCB industry events.
Mark Friedman on IPC Membership
Mark Friedman, a member success advocate at IPC, recently spoke with I-Connect007's Barry Matties about the current status of IPC's membership programs, the recent growth they've seen, and some hidden benefits of IPC membership that potential members might not be considering.
STEM: The Future of Our Industry
Facing a growing shortage of talented labor with which to fill the employment positions in America, IPC is working to help solve this problem. Colette Buscemi, senior director of IPC’s education programs, is encouraging IPC members to better engage pre-college and post-secondary college students at the local level. Barry Matties spoke with Colette about the educational programs IPC has put in place to invest in future generations, including the STEM program at this year’s IPC APEX EXPO.
The Quest for Perfect Design Data Packages
There’s an ongoing problem in the PCB industry: fabrication shops are receiving incomplete or inadequate design data packages, leaving manufacturers scrambling to fill in the blanks. For a quick-turn prototype shop like Washington-based Prototron, with over 5,000 customers and up to 60% of orders coming from new customers each month, that can add up to a lot of wasted time and effort just in the quoting stage. Dave Ryder, Prototron president, and Mark Thompson, engineering support, delve into this continuing issue and more.
Mentor and Seica Partner for Data Prep and Testing Big Boards
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.
The Future of the Customer Experience in Mobility
Based on the protocol stack that starts with 5G, moves up to AI, and continues to layer integrations and user interfaces and experiences on top of those lower-level technologies, how does this all apply to the current mobile experience? A panel on the future of mobility with representatives from several major companies covered this and more at CES.
Dispatches from CES 2019: The Future in the Kickoff
Press kickoff briefings at the Consumer Electronics Show (CES) are no stranger to big claims and hyperboles. At the “CES 2019 Trends to Watch” presentation on Monday morning, Steve Koenig, Consumer Technology Association’s (CTA’s) VP of market research, made some pretty big claims about what we should expect to see at the show, but those claims don't seem at all to be hyperbolized.
Who’s the Best of the Best in Hand Soldering?
IPC APEX EXPO 2019 will include the new IPC World Championship Hand Soldering and Rework Competition on the expo floor on January 29 and 30. Twelve competitors from Britain, China, France, Germany, India, Indonesia, Japan, South Korea, and Thailand will compete for the crown and the title of the first-ever IPC World Hand Soldering and Rework Champion.
More Than Inspection: It’s Process Improvement
Barry Matties speaks with Brian D’Amico, president of MIRTEC, about the current state of machine-to-machine communication in the industry, and how the inspection company is interfacing with the different manufacturing languages currently available to gather predictive data and feedback from every inspection step to eliminate future defects.
Welcome to the BIG Show!
This month, we celebrate the impact and reach of the IPC APEX EXPO slated for January 26--31, 2019, in San Diego, California. Have something truly new? It needs to be seen here at IPC APEX EXPO with long-standing products and evolutionary advances from industry stalwarts will grow their installed base here, too. There are other industry shows, but the must-go show for our industry is IPC APEX EXPO.
Susy Webb: The History and Future of the Designers Council
When we started planning this issue on the IPC Designers Council, I knew I’d have to speak with design instructor Susy Webb, a longtime DC member and currently an executive board officer. I asked Susy to discuss how she first got involved with the DC, why designers should join their local chapter, and what the future holds for this group.
Top 10 Most-Read SMT007 Articles of 2018
Every year, we like to take a look back at the most popular SMT007 news, articles, interviews, and columns. These are the top 10 most-read SMT007 articles from the past year. Check them out.
Dock Brown on Succeeding at Failure Analysis
Dock Brown of DfR Solutions gave a keynote speech at SMTAI, “Requirements for Both Cleaning and Coating to Building Medical Hardware.” Barry Matties and Happy Holden sat down with Dock to discuss the current trends he sees in failure analysis, the concept of “rules versus tools,” and how predictive engineering software used early in the design cycle can help predict failures in components and microvias and drive cost down.
What Electronics Manufacturers Need to Know About RoHS 3 Compliance
On July 22, 2019, the latest incarnation of RoHS will come into full effect across the European Union. So, what’s changed? And what exactly are the implications for UK electronics manufacturers? This article provides a recap of what RoHS is, why it matters, and the steps that OEMs will need to take to ensure compliance.
A Look at Medical Electronics Design and Assembly Challenges
We recently spoke with Dr. Despina Moschou, lecturer at the University of Bath, as well as Kaspars Fricbergs, VP of global quality, and Tom Reilly, director of marketing and sales operations, of EMS firm Vexos Corp., to learn more about the challenges and opportunities in medical electronics design and assembly, as well as the relevant regulatory and supply chain issues.
Randy Burcham Discusses New Techniques for BOM, Daughterboards
During AltiumLive, I spoke with IOTA Engineering's Randy Burcham, who taught several classes during the event. He explained his methodology for filtering BOM data as well as his new approach to working with daughterboards and how he was up and running on Altium tools after only three days.
Defense Speak Interpreted: PERM—Pb-free Electronics Risk Management
In this column, we explore PERM—the Pb-free Electronics Risk Management Consortium. No, the group members do not all have curly hair! The name was chosen around 2008 by a group of engineers from aerospace, defense, and harsh environment (ADHE) organizations.
Internet of Body: The Next Big Thing for Medical
Titu Botos, Ph.D., the VP of engineering at NeuronicWorks, discusses with I-Connect007 Managing Editor Nolan Johnson the next big thing to come after the Internet of Things (IoT)—the Internet of Body (IoB), which could include implantables and ingestible medical devices to monitor your body better.
Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.
Mentor Discusses New DFT, DFM, and Design Verification Tools
At electronica 2018, John McMillan, digital marketing program manager-Electronic Board Systems, and Mark Laing, business development manager-Valor Division of Mentor, a Siemens business, discuss new tools for PCB design verification, as well as design for manufacturing (DFM) and design for testing (DFT).
AOI Programs with a Magic Click
Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.
What is ESD and Why Should We Worry About It?
The realities of ESD, how static charges are generated, how they can be transferred to electronic components and the damage they can do, and what practical controls are required to protect components, assemblies and equipment from damage—these topics were explored and clearly explained in a webinar presented by SMTA Europe Technical Committee members Dr. Jeremy Smallwood of Electrostatic Solutions and Charles Cawthorne of MBDA.
Greg Vance on SMTA Ohio Chapter Updates
This summer, Patty Goldman interviewed Greg Vance, senior project engineer at Rockwell Automation and president of the Ohio chapter, at the SMTA Ohio Valley Expo and Tech Forum in Independence, Ohio. Vance discusses the show, young professionals in the industry, and other events, such as solder paste roundtables.
New Designers Council Column: The Digital Layout
The IPC Designers Council is launching a new column in Design007 Magazine: “The Digital Layout.” I recently asked two IPC Designers Council (DC) Executive Board members, Mike Creeden and Stephen Chavez, to discuss the content and objective of their new column, and how this all ties in with the DC.
Is This a Golden Age for Medical Devices?
Just as the telecommunications golden age launched 30 years ago—which led to wireless phones, electronic data terminals, and technology that allows us to watch our favorite shows on our own time and not the TV stations' schedule—it seems that medical device technology is gearing up to do something similar. The Internet of Things (IoT), Internet of the Body (IoB), and printed electronics technologies are emerging, and they're converging with medical devices in a big way.
Stephen Chavez: Breaking the Design Data Bottleneck
When we started planning this issue on design data, I knew we’d have to speak with PCB designer and EPTAC design instructor Steph Chavez. In this interview, he explains some of the biggest issues related to good design data handoff, and he offers some ways forward.
Understanding the Benefits of CFX
In an interview with SMT007 Magazine, David Fenton, group customer support manager for Blakell Europlacer, discusses the technical challenges and the impact of the IPC Connected Factory Exchange (CFX) initiative on the PCB assembly industry, and what manufacturers can expect from this electronics assembly connectivity standard.
Tempo Automation's Open House Raises the Curtain in San Francisco
Based in San Francisco, Tempo Automation specializes in rapid PCB assembly and on low volume production for a wide range of board complexities. It recently held an open house at its brand-new facility in the South of Market (SoMa) district—which is normally restricted under customer non-disclosure agreements as well as International Traffic in Arms Regulations (ITAR) regulations—to customers, vendors, local designers, and government officials.
RTW SMTAI: Inventec Discusses the 'Green Way'
At SMTA International 2018, Dan Walker, North American sales manager at Inventec Performance Chemicals USA, provides Editor Nolan Johnson an overview and update on Inventec’s environment-friendly cleaning, soldering and coatings products. He also discusses how they are addressing the latest manufacturing issues, including solder voiding.
150+ Years of Experience: Reflections with Three Industry Icons
You would be hard-pressed to find a more knowledgeable and experienced group than that of Gary Ferrari, Gene Weiner, and Happy Holden. In a brief interview with Barry Matties, these three industry icons consider the past, present, and future state of electronics manufacturing while also offering advice to the newest generation of manufacturers.
Christine Pearsall on Tempo Automation and PCB West
Christine Pearsall, senior director of marketing for Tempo Automation, discusses with Consulting Technical Editor Tim Haag what services Tempo Automation provides, what attracts engineers and designers most to the company, and what events they plan to attend in the upcoming year.
Strategies to Manage Your China Business Through Turbulence
While the United States may be the world’s most open market, China remains the most competitive, and is still viewed by most U.S. and EU companies as the "last great opportunity for growth.” Many companies want to gain entry to the Chinese market share for their products or services. Thus, the competition for sales of products or services is correspondingly intense. Here's how to succeed in the world's second largest economy.
RTW SMTAI: KIC's MB Allen on Smart Factory, CFX
Marybeth (MB) Allen, product manager at KIC, speaks with I-Connect007 Managing Editor Nolan Johnson about the smart factory, KIC's new RPI i4.0 software release, and as well as her company's leadership in IPC's Connected Factory Exchange (CFX) initiative.
Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.
Green Circuits' Joe O'Neil and Joe Garcia on the Best Kept Secret
Joe O'Neil, CEO, and Joe Garcia, VP of sales and marketing, at Green Circuits discuss with I-Connect007 Managing Editor Nolan Johnson about recruiting new employees, new training and certification requirements, tariffs, and more.
Challenges and Opportunities with CFX
Larry Chen, global marketing supervisor at Taiwan-based Test Research Inc. (TRI), speaks about how the company is supporting IPC’s Connected Factory Exchange (CFX) initiative, the user interest on the standard, the challenges, and his outlook for CFX.
4 Questions OEMs Typically Ask When Outsourcing
The decision to transfer your electronics manufacturing to an EMS company is a complex process, with the potential to impact your business, your staff, your customers and your suppliers in a multitude of ways. This article highlights four questions OEMs typically ask prospective contract manufacturing partners when they first start engaging with them—and our take on the answers.
I-Connect007 Survey Sees Bright Prospects for Low-Temperature Soldering
There has been an increasing amount of discussion on low-temperature soldering, and solder pastes. And why not? There are several advantages of using low temperature solders—from a technical standpoint and economic perspectives. A recent survey by I-Connect007 saw majority, or 67%, of the respondents saying they will consider using low-temperature solders in their assembly process.
Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.
CFX: Building the Foundation for Industry 4.0
IPC has been showcasing the Connected Factory Exchange (CFX) initiative in action at the many industry events this year, providing a technical demonstration operating in real time with standardized machine data delivered from participating exhibitors through the cloud and onto visitors' cellphones. In this interview, Dave Bergman, VP for international relations at IPC, discusses the latest developments with IPC’s CFX standard, including key highlights, impact in the electronics assembly industry, and what’s next.
Pros and Cons of Dual Sourcing
Now, more than ever, there's a need for responsive and flexible supply chains. For OEMs, one solution to mitigate the risk of supply chain disruption is to maintain relationships with more than one supplier through dual sourcing—the practice of purchasing a chosen raw material, product, or service from two (or sometimes multiple) sources. Here are it's pros and cons.
Catching up With Scott McCurdy and Freedom CAD
During PCB West, Scott McCurdy of Freedom CAD Services sat down with Technical Editor Tim Haag for an interview. We discussed Freedom CAD’s latest news, some trends in PCB design software tools, and the continuing need to draw more young people into a career in PCB design.
Rick Hartley is Bullish on PCB Design, 3D Printing
At the recent PCB West in Silicon Valley, Consulting Technical Editor Tim Haag met with long-time design industry veteran Rick Hartley to discuss the changing landscape of circuit board design, the layout designers of the future, and how designers can benefit from 3D printing of circuit boards.
Meet Goepel electronic's New Managing Director, Alice Göpel
In August 2018, Alice Göpel took over the managing director position of Goepel electronic, replacing her father Holger Göpel who had managed the company since 1991. In this interview with SMT007, Alice discusses her career, what inspires her, and her outlook for the industry.
RTW SMTAI: Steve Greathouse Discusses Award, Highlights Need for New Engineers
Steve Greathouse, senior staff engineer at Plexus Corp., and recipient of SMTA’s Excellence in Leadership Award this year, speaks about the magic of the SMTA as a collaborative and supportive professional organization. He also discusses the need for “new blood” to join the manufacturing workforce as more senior engineers leave the industry.
RTW SMTAI: PalPilot on Adding Value to Design and Assembly
Tim Sullivan, vice president of sales at PalPilot International Corp., speaks with I-Connect007 Managing Editor Nolan Johnson about their services, and how they add value to their customers from design to assembly/manufacturing. He also talks about their online platform called FootPrintKu, which help designers when it comes to footprints of their design.
RTW SMTAI: Libra's Rod Howell Discusses Tariffs Issue
Rod Howell, CEO of EMS firm Libra Industries, speaks with I-Connect007 Managing Editor Nolan Johnson about the ongoing tariffs issue, how it impacts the global electronics manufacturing supply chain, and their strategic response to address the issue.
Karl-Heinz Fritz on Cicor’s DenciTec Technology
In a recent interview, Karl-Heinz Fritz, VP of technology at Cicor, discusses the business, DenciTec technology, the impact of tariffs on trade, and applications for 3D printing and additive manufacturing, including potential new opportunities for PCB designers.
RTW SMTAI: KYZEN's Forsythe Discusses Gap in Cleaning Knowledge
Tom Forsythe, executive vice president of KYZEN Corp., busts myths around "how-clean-is-clean." He discusses the increasing cleaning challenges as devices get more dense and form factors become even smaller, and how these trends are driving the need for cleaning and causing a gap in cleaning knowledge. He also speaks about their new products in data collection and monitoring software for cleaning equipment.
RTW SMTAI: Harold Sneath Highlights Alpha’s Reclaims Business
Reclamation can be a profit center, not a cost of doing business. At the recent SMTA International 2018 conference and exhibition, Harold Sneath, Eastern Regional Reclaim Manager at Alpha Assembly Solutions, lays out the reclamation services available through Alpha.
SMTAI 2018 Closes on a High Note
SMTA International 2018, which took place in Rosemont, Illinois is now in the history books. This multi-day event, held October 14-18, at the Donald E. Stephens Convention Center, was packed with keynotes, conferences, lively discussions, committee meetings and a two-day exhibition.
IoT: Driving Change in Manufacturing
In the manufacturing world, the Internet of Things (IoT) can be seen as an element of Industry 4.0. The idea behind it is that factories would evolve to become smarter, to become a lot more flexible—to be able to make the products that customers want, basically at any time that they need.
How CIM and IoT Can Make Your Factory Smart
As business needs challenge the electronics assembly industry to support increased flexibility, lower overhead, and stricter quality standards, the industry is rapidly adopting improvements in automation and analytics to meet the challenge. This article explores the changes in culture between the past, where data was simply sent point to point, and today’s multi-layered IoT technology-based solutions, as well as the effects and opportunities that are here now for the taking.
GP Ventures’ Tom Kastner on PCB Mergers and Acquisitions
Tom Kastner, president of GP Ventures, he has his finger on the pulse of the industry's mergers and acquisitions (M&A) more than anyone. In this interview, Kastner provides insights on the right time to buy, how to evaluate your company's worth, and when it is too late.
Tips to Improve Soldering Tip Life and Reduce Cost
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.
The Smart Robot Revolution is Here
The distance between imagination and reality has reduced considerably. Thanks to advanced technologies such as artificial intelligence (AI), data processing, and machine vision, the science fiction writers' vision of smarter robots is becoming a reality. These more intelligent machines are also making a big impact in manufacturing.
Indium on Voiding and Auto Electronics Test Standard
In this interview with I-Connect007, Indium Corporation Technical Manager Jonas Sjoberg discusses voiding and other key challenges in soldering, as well as an automotive electronics testing standard based out of South Korea that is seeing increased utilization all over Asia. He also talks about the increasing trend in manufacturers moving to Type 5 and Type 6 solder powders, and how this is causing its own set of challenges in printing.
AltiumLive 2018 a Mecca for PCB Designers
AltiumLive 2018 San Diego is now in the history books. This is the second annual AltiumLive (North America), and it was even better than the first. With nearly 300 hundred participants, from all parts of the country and industry, the event was a huge success.
Electronic Components Market Update
Unfortunately, there is still no end in sight to the electronic component shortage, and some lead-times are being quoted with 2019 and even 2020 delivery dates! So if you are working with an EMS provider, it remains vital that you communicate and share forecast information with them. You may also want to start looking at the option of fitting, or designing in, smaller components to your PCB assemblies.
RTW NEPCON South China: SEHO Discusses New Production Facility in South Korea
Andreas Reinhardt, R&D director at SEHO Systems GmbH, speaks about their new production facility in South Korea, which aims to address the growing lead times in their supply chain. He also talks about how emerging technologies such as more and more sensors and connections, big data, and cloud computing are impacting the electronics assembly industry.
XR Update: Emerging Realities
The rate of advance in the use of XR—the term now being used to cover AR (augmented reality), VR (virtual reality), and MR (mixed reality)—in many areas, along with advances in the hardware and network capability supporting the use of XR, is accelerating. And because things are moving so quickly, here's a quick review and an update on recent developments in this field.
RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.
Mexico: A New Hub for Electronics Manufacturing
With its competitive production costs, good logistical access, a skilled and deep talent pool and state-of-the-art technology, Mexico now produces everything from flat-screen televisions to smartphones and other consumer devices employing surface-mount technologies. Here's how Mexico’s strengths in electronics manufacturing services (EMS) evolved, and why more and more electronics manufacturers are moving to the country.
Towards a Data-Driven Cleaning Environment
Tom Forsythe, executive vice president at KYZEN, discusses the most critical challenges of the cleaning process, a new approach to testing the cleanliness of PCB assemblies, and how KYZEN is helping customers develop a more data-driven approach to cleaning.
In our conversations, many assemblers said that cleaning is not a value add, that their customers are getting nothing out of it. It also means an added process, and as such, an additional production cost. On top of that, no-clean fluxes have been in the industry for over 20 years now. But still, why clean?
Looking Under the Hood of MLCCs
The multilayer ceramic capacitor (MLCC) is one of the most widely used, and the most highly produced, passive devices in modern electronics manufacturing—with more than a thousand billion devices being produced worldwide every year. This article explores the evolution, applications and current state of the MLCC industry and what this means for electronics manufacturers.
RTW NEPCON South China: Mycronic Discusses Industry 4.0
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.
Getting More with Cleaning
The continuing growth of the electronics industry, driven by the rapid expansion of electronics into areas such as automotive and medical, is creating a new mindset with regard to cleaning, mainly due to quality and reliability issues. Read more to find out what our experts have to say when it comes to cleaning challenges in PCBAs and possible solutions.
Strengthening the Joint with a Revolutionary New Low-Temp Solder Paste
I-Connect007 Editor Patty Goldman interviews one of Alpha Assembly Solution’s solder process experts, Traian Cucu, who is based at Alpha’s R&D center in New Jersey. Traian, along with Morgana Ribas, have played key roles in the development of Alpha’s innovation new low-temperature solder paste process. He also talks about how this solves many of the defects issues that one would see on a SAC assembly process.
Newly Re-Branded Optel Software Lays Down China Strategy
Optimal Electronics Corp., a provider of smart software solutions for electronics assembly, recently rebranded globally as Optel Software, as it starts its venture in China. In an interview with SMT007 Magazine, Dr. Ranko Vujosevic, CEO and CTO, updates on the latest developments from the company and discusses their plans in China and Asia this year.
3D Printing: Enabling a New Manufacturing Landscape
At the recent Michigan SMTA Tech Forum, Scott Schwarz, senior sales representative for rapid technology at Fisher Unitech, discusses with I-Connect007 Technical Editor Happy Holden the latest developments in 3D printing, and the advanced applications that have made significant impacts in the automotive manufacturing industry.
Inspection and Design for Testability
In an interview with I-Connect007, Matthias Müller of Goepel electronic talks about about test and inspection technologies, especially in the automotive industry. He discussed design for testing (DFT) and the benefits technologists can gain from DFT. He also mentioned about the increasing need for 3D SPI, as well as why X-ray inspection has become very important now for the automotive, military, and aerospace industries.
Practicing Best Practices
Recently, we looked into electronics assembly best practices that help optimize your manufacturing processes. To provide you more insights on this, here's an interview with two assembly experts: Jason Keeping of EMS firm Celestica, and Bob Willis, a renowned EMS consultant and trainer.
Use of Lean Manufacturing Principles Enhances Quality and Productivity
Using work-cell-based batch assembly processes will enable EMS firms to provide greater flexibility and responsiveness to their box build customers. Here's an example of why this flexibility is important, and find out how regional EMS providers, often thought of as companies primarily focused on PCBA assembly and cellular box builds, who are skilled in mechanical assembly can easily shift to higher-volume work.
KYZEN: Cleaning with Data
With the ability to monitor the temperature and concentration of the bath, and automatically adjust either if needed, the KYZEN Analyst system has caught the attention of the electronics assembly industry. In this interview with I-Connect007, Tom Forsythe, executive vice president for KYZEN, provides an update on KYZEN Analyst and describes how it has evolved into an Internet 4.0 solution with the ability to increase performance and life of the chemistry.
Demand Forecasting: The Art of Knowing What You Need Before You Need It
Forecasting is a skill born out of experience, intuition, and most of all, knowledge. But what do you need to know when you’re creating an accurate demand forecast? What data is needed? Are there tools you can use? Where do you start? Find out here.
Cross Functional Teams Drive Strong Focus on Risk Mitigation and Quality
Having a traditional cross-functional team (CFT) approach, with a much larger CFT group that includes a tactically focused program manager, a strategically focused account director, a buyer, a product engineer, a process engineer, a test engineer, a quality engineer, a production supervisor or lead person, and a customer service representative focused on materials and scheduling, will help EMS firms govern all the necessary outputs associated with each customer.
Best Practices to Achieve Zero Defects
To ensure that a complex electronics build can be completed on time, on budget and with zero defects, here is a list of checks and balances that will help you with adjustments or corrections real time, instead of discovering them at the end of the build or worse, when it's already arrived at the end user.
Strategies for Choosing Solder Paste for Successful Electronics Assembly
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.
Factronix on Cleaning, the Market and More
Stefan Theil, product manager at Factronix, discusses the growing need for cleaning in European electronics manufacturing and the demands he's facing from customers when it comes to finer pitches, automation, and environmental concerns.
IMPACT Washington D.C., 2018 with Juki Automation’s Bill Astle
I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.
Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.
Conversation with… Vexos: Doing It Right the First Time
Harry Chan, Deputy GM and VP Manufacturing for EMS firm Vexos Shenzhen, is responsible for all aspects of manufacturing through continuous process improvement, production management, and development of manufacturing talent and teams. In an interview with SMT007 Magazine, he shared the challenges when dealing with flexible circuit assemblies, and strategies and techniques to address them.
Plasmatreat on Atmospheric Pressure Plasma
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.
Overcoming Growth Challenges
Growth is usually seen by manufacturers as a good thing—a sign of success and a result of hard work. But if this growth isn’t planned for, or the manufacturer can’t react in time, growth can cause the same devastating results as if the business was in decline. This article looks at seven common areas that can cause manufacturers a headache when their business is growing, along with solutions to help ease the pain.
Tackling Reliability Challenges in Low-Temperature Soldering
William Yu, senior technical services manager for Alpha Assembly Solutions, recently shared with I-Connect007 the challenges when it comes to the reliability of low-temperature solder pastes, and soldering strategies to overcome these issues.
Nearing Retirement, Juki's Bob Black Reflects on a Long Career
After more than 40 years in the electronics manufacturing industry, Juki's Bob Black is nearing retirement. Bob sat down with Barry Matties at the recent SMT Hybrid Packaging show in Nuremberg to reflect on his career and talk about the importance of strategic partnerships, even if that means playing nice with your competitors.
ASM Assembly Solutions on CFX
ASM Assembly Solutions was one of the 30+ companies participating in IPC's CFX (Connected Factory Exchange) showcase at the recent SMT Hybrid Packaging show in Nuremberg, Germany. In this interview, ASM's Thomas Marktscheffel shared his perspective on CFX and its current challenges, and dispelled the notion that CFX might be a cookie-cutter approach to the smart factory.
Reflow Perspectives to Flex Circuit Assemblies
At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.
Conversation with Miraco… Strategies for Successful Flex Circuit Assembly
Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.
Aegis on CFX and Hermes Efforts
The Connected Factory Exchange (CFX) specification is truly revolutionizing the PCB industry. Michael Ford, from Aegis Software, met with I-Connect007's Barry Matties for an interview during the SMT Hybrid Packaging show in Nuremberg, Germany, to discuss the impact of this collaborative effort, and how it differs from the Hermes Standard.
Tackling the Challenges in Flex Assembly
Apart from the design and manufacturing of flex printed circuits, a critical challenge that needs attention is assembly. Their flexible nature requires specific strategies for paste printing, chip mounting, soldering—whether reflow, wave, or hand—and rework/repair processes. Which is why the June 2018 issue of SMT007 Magazine looks into the many challenges in flex circuit assembly and highlight some of the strategies, techniques and best practices to help assemblers deal with flex circuit issues.
High School Team's Robotics Entry on Spotlight at Wisconsin Expo & Tech Forum
In May, I took the opportunity to drive around Lake Michigan and visit the SMTA Milwaukee Chapter’s Wisconsin Expo & Tech Forum. Held at the Crowne Plaza Milwaukee Airport Hotel, this was a well-organized and attended table-top expo and technical forum, with over 60 exhibitors, and a high school team with their FIRST Robotics entry.
Dave Bergman on IPC and CFX
The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.
West Penn SMTA: New Leadership, Same Commitment
SMTA's new chapter president, Jason Emes, a quality engineer with Pennatronics Corporation enthusiastically discussed with I-Connect007's Patty Goldman the latest goings-on with this Keystone State chapter. He also spoke about his plans and initiatives for the SMTA West Penn Chapter.
Seeing Clearly: XR Headsets and Flex’s Reference Design at AWE
At this year’s CES, they announced the launch of an extended reality (XR) reference design for the next generation of XR headsets. As the “sketch-to-scale” solutions provider, as they describe themselves, that designs and builds “intelligent products for a connected world,” they have now introduced an augmented reality (AR or, as we now call it, XR) reference design to reduce time to market for companies wishing to make and market XR devices.
Enabling an Intelligent Supply Chain for Electronics Manufacturing
The first three industrial revolutions came about because of mechanization, electricity and IT. Now, with the advent of the Industrial Internet of Things (IIoT) and services making their way into the manufacturing environment, we are seeing the arrival of a fourth industrial revolution, Industry 4.0.
5G Requires a New Approach to Testing
The industry will be deploying 5G at millimeter wave frequencies between 28 and 40GHz, with significantly wider bandwidths than the current instrumentation. And the rules about how you design a test fixture, or conduct testing of those products is changing. In this article, National Instrument's David Hall explains.
Why Cleaning Still Matters
Paco Solis, lead investigator at Foresite Inc., speaks with I-Connect007 about why cleaning is more important now, the common pitfalls and misconceptions in cleaning, and strategies to consider to ensure reliable PCB assemblies.
Conversation with… Keysight: Challenges and Opportunities in Testing 5G
Roger Nichols, 5G program manager at test and measurement provider Keysight Technologies Inc., discusses the opportunities that 5G will enable, the many challenges facing electronics manufacturers when it comes to 5G, and how they are helping the industry address these issues.
The Key to Boosting Numbers of Women in Manufacturing
According to latest figures by the Office for National Statistics (ONS), the split between male and female employees in UK's manufacturing industry is significant—with men accounting for 76% of the total manufacturing workforce and women making up just 24%. So, what exactly is being done to encourage the recruitment, and retention, of more women within the UK manufacturing environment?
Field Trip: CID Class Sees How Flex is Made at Streamline Circuits
While I was teaching my CID class for EPTAC in Santa Clara, I learned that we were only a block away from Streamline Circuits. Streamline does a lot of military and aerospace work, as well as communications and industrial electronics. The company manufactures quite a bit of multilayer flex and rigid-flex circuits, in addition to rigid boards. This would make a great field trip for my CID class!
Modeling an SMT Line to Improve Throughput
One of the major challenges for an electronics assembly manufacturing engineer is determining how an SMT machine will impact throughput. Typically, an SMT equipment supplier will ask for a few products to simulate the throughput capability of their machine. Unfortunately, if the engineer works in a high-mix, low-volume environment, he may need to know the impact of a new machine on 1,000 or more products.
Elements to Consider on BGA Assembly Process Capability
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.
RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.
Design and Manufacturing Perspectives from DISH Technology’s Les Beller
I recently interviewed Les Beller, a long-time PCB designer who is now a manufacturing engineer for DISH Technology. We discussed his company’s business shift towards 5G and streaming, and the stresses that puts on a design team. He also explains the greatest challenges that he’s facing with HDI and higher frequencies, and the added importance for designers to understand the manufacturing process and DFM tools.
Launching a Manufacturing Career Via an Apprenticeship
Deciding on the right career path within manufacturing, and the best route to take to make those dreams a reality, can sometimes seem a daunting prospect for young people considering their options. Joining apprenticeships combine the opportunity for on-the-job training with classroom learning, but exactly what you learn depends on the role you're training for.
RTW NEPCON China: Christian Koenen Stencil Technologies Ensure First Pass Yields
At the recent NEPCON China 2018 event in Shanghai, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve the solder paste printing process and ensure first pass yields.
The Survey Said: Industry Optimistic After Strong 2017
During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.
RTW IPC APEX EXPO: Inspection Technology Developments
Brian D'Amico, president of Mirtec Corp., speaks with I-Connect007 Technical Editor Pete Starkey about the challenges of miniaturization, increasing component density, and the shadowing of small components by taller ones, and how Mirtec has developed its inspection technology to ensure they remain at the leading edge.
EDADOC: A Driving Force in China's Automotive Electronics Design
EDADOC is one of the biggest providers of PCB design and manufacturing services in China, with a long history in automotive electronics design and manufacturing. China Editor Edy Yu recently conducted an email interview with EDADOC R&D Technical Research Manager William Zhou and Brand Planning Specialist Wen Ling, who collaborated on their answers. We discussed the challenges related to designing and fabricating automotive PCBs, the opportunities in this segment, and the trends they see in the market for autonomous and electric vehicles.
Zestron Opens Technical Center in Taiwan
Zestron on Wednesday, May 16, launched a new technical center in Hsinchu, Taiwan. With the opening of this new technical center, the company now owns a total of eight globally linked technical support facilities throughout the world.
RTW IPC APEX EXPO: Michael Ford Speaks About Aegis' Role in CFX
At the recent IPC APEX EXPO 2018 trade show in San Diego, California, Michael Ford, European marketing director, discusses his work with Aegis Software and the reaction of attendees who witnessed the Connected Factory Exchange (CFX) demo.
RTW NEPCON CHINA: Mycronic Discusses Recent Acquisitions
At the recent NEPCON China 2018 event, Thomas Stetter, senior vice president for assembly solutions at Mycronic AB, speaks about the company's recent acquisitions and how it helped the company expand into different areas in the electronics assembly industry.
RTW NEPCON CHINA: OK International Highlights Need for Smarter Systems
At the recent NEPCON China 2018 tradeshow in Shanghai, Steven Fang, director of sales for Asia at OK International, speaks about the challenges their customers face when it comes to hiring skilled operators, which warrants the need for smarter systems and tools.
System-Driven Approach Ensures Automotive Electronics Assembly Success
In an interview with SMT007 Magazine, Mathieu Kury, business development manager at Asteelflash USA Corp., talks about the new challenges and customer requirements when it comes to automotive electronics assembly, trends driving the growth of the market, and where the industry is headed.
On Globalization and Standards
Like a language—English, Chinese, Hindi, German, Spanish, French—a standard builds a bridge between people. "If I make this sound, we both understand that it means this. If I write this symbol, we both understand that means that. If I perform this action, we both understand the gesture."
RTW NEPCON CHINA: Rehm Discusses Reflow Strategies to Reduce Voiding
At the recent NEPCON China 2018 event in Shanghai, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems in China, speaks with I-Connect007’s Stephen Las Marias about their latest advancements in reflow oven technology, as well as on strategies to reduce voiding.
Vehicle Electrification: Disrupting the Automotive Industry and Beyond
Around the globe, governments are announcing mandates that will bring about the demise of the internal combustion engine. China has led the charge by requiring 8% of new vehicles on the road to be “new energy” or zero emission vehicles in 2018, up from the current 2–3% on the road today. Similar strong government regulations limiting the future of the internal combustion engine have passed around the world, and the importance and growth of the hybrid and fully electric automobile industry can’t be overstated.
RTW IPC APEX EXPO: Heraeus Discusses Developments at New Lab
Jim Wertin, technical sales manager at Heraeus Electronics, shares news about the company's latest product offerings, as well as its newly established application laboratory, which helps customers and potential customers resolve production issues and improve the quality of their products.
CFX: The Next Step Toward the Future of Factories
For the past two to three years, almost every exhibitor in almost every trade show focused on the electronics manufacturing industry has an "Industry 4.0 Compatible" sign in their booth. As of today, the best question to ask is, "Compatible with what?" There has really been no standard yet developed toward this goal, and Industry 4.0 has been just a buzz word.
What's the Scoop? APEX CFX Showcase
The IPC Connected Factory Exchange (CFX) demo at the recent IPC APEX EXPO 2018 trade show in San Diego, California, is a great example of industry collaboration. The CFX Showcase at APEX had 245,000 CFX website page views; 701,200 CFX messages transmitted; and 664.5 million bytes of data exchanged; and the whole thing was pulled together in a matter of weeks. Here's what the participants in the program have got to say.
SMT Renting: A Trend for the Future?
You may have heard the name Martin Ziehbrunner before: he cofounded the equipment company Essemtec AG in 1992. He left the company in 2013, and soon he'd cofounded another SMT company, but with a twist. SMT Renting specializes in renting SMT equipment with an operational lease, primarily for the European market. In this interview, he explains how his latest company is challenging the normal way of acquiring SMT capital equipment.
Solving Reliability and Thermal Management Challenges in Automotive Electronics
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.
The Climate Change of Data
From a typical manufacturing standpoint, cloud storage is simply another way or place in which to put data. From a usage perspective, many see it as being no different from an on-site server or even the external hard disk on your laptop. Off-site cloud storage is vast and can easily be cost effective, requiring no maintenance or fixed overhead other than paying the service bills. There are, however, a couple of very important things to consider with cloud storage.
Poor Supply Chain Management Will Cost You Money
Supply chain management goes far beyond merely keeping track of all the SKUs currently on sale. It also means tracking the parts going into the products, since those parts are also potentially going to be used for post-sale support if necessary. If you can't trust your components to be legitimate and trustworthy, backed by a solid chain-of-possession, then every aspect of your electronics operation may be in jeopardy.
SHOW & TELL: Bringing STEM Students to IPC APEX EXPO for a View of the Industry
On the last morning of IPC APEX EXPO 2018, we met with Nancy Jaster, IPC design programs manager and one of the driving forces behind IPC’s STEM Outreach program for high school students. We spoke about the students who were arriving on site at IPC APEX EXPO, and what the industry, and IPC, hoped to achieve with this valuable program.
RTW IPC APEX EXPO: MEK on Increasing Demand for THT AOI Systems
Henk Biemans, managing director of MEK Marantz Electronics Ltd, speaks with I-Connect007 Managing Editor Stephen Las Marias about what's driving the increasing demand for THT AOI systems. Other topics discussed include reliability issues, articifial intelligence, and machine learning in inspection systems.
RTW IPC APEX EXPO: Nordson SELECT's Acquisition Update
Carlos E. Bouras, general manager of Nordson SELECT, discusses the acquisition of ACE Production Technologies and InterSelect GmbH one year later, along with the synergies between the two companies, and how they have strengthened Nordson SELECT's capabilities.
Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.
Succeeding at the Velocity of Technology: An IPC APEX EXPO 2018 Wrap-Up
After many months of planning, IPC APEX EXPO 2018 proved to be a success. From revolutionary advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO provided the learning and connections that helped 4,574 attendees from 43 countries prepare for the future.
Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.
How to Assess Top Talent when Recruiting for Key Manufacturing Roles
As your business continues to grow and evolve, gaps in talent can start to appear. And while growth is often seen as a sign of success, if you fail to manage growth correctly, it can quickly turn and bite you in a similar way to a business in decline.
The Direction of Autonomous Driving
Flex (formerly Flextronics) is a company that I've worked with for decades, both as a customer and as a supplier. Recently, they were honored with Frost & Sullivan’s Manufacturing Leadership Award. I sat down with Eric Hoarau, the senior director managing automotive innovation at Flex, to discuss his company’s views on where autonomous driving technology is heading in the next 10 - 15 years.
Jan Pedersen: CircuitData Enhances Current Data Formats
During the Design Forum at IPC APEX EXPO 2018, Jan Pedersen, senior technical advisor for the PCB broker Elmatica, gave a presentation on CircuitData. The language is designed to help facilitate other design data transfer formats such as Gerber, ODB++, and IPC-2581. Jan spoke with Managing Editor Andy Shaughnessy and Contributing Technical Editor Happy Holden about how this open language works with the existing data formats, as well as the need to eliminate paper documents from design process, and how the industry can help shape this open-source language.
The Evolution of Camtek Manufacturing
Chris Davis, president and founder of EMS firm Camtek Manufacturing, in Bloomington, Illinois, discusses with Dan Beaulieu what led her to not only start Camtek from the ground up, but also what it means for her business to be a certified women's business enterprise (WBE).
Interview with Linda Woody: Dieter Bergman IPC Fellowship Award Recipient
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. This year, Linda Woody is one of the two recipients of the award. Here's what she has to say.
Interview with Dave Hillman: IPC’s 2018 Raymond E. Pritchard Hall of Fame Award Winner
A self-described "dinosaur" of the industry, Dave Hillman has been a steady force in all things solder-related at Rockwell Collins for 30 years. And just to keep things fresh, he has spent years mentoring both college-age and younger children. In this interview, I-Connect007’s Patty Goldman gives Hillman a chance to tell his story.
RTW IPC APEX EXPO: Miraco Company and Services Introduction
Miraco's current quality manager, William Pfingston, fills Guest Editor Steve Williams in on the company's contract manufacturing capabilities and services, including strengths in design and flex circuits. He also talks about the company's expansion and organizational changes.
Should You Outsource Your Outbound Logistics to Your EMS Partner?
Shipping your products to their end destination is the final stage in your manufacturing process and one which is crucial to the ongoing success of your entire manufacturing operation. After all, getting your product delivered on time, in the correct quantities, to the right people and in pristine condition all contributes to your customer’s first impression.
RTW IPC APEX EXPO: Manncorp Expands With New Learning Center
Ed Stone, sales manager of Manncorp, discusses the company's expansion, specifically their new application and learning center, their new equipment in the pipeline, and his outlook for this year.
5 Techniques Used to Detect Counterfeit Electronic Components
Although government pressure and private resources have helped minimize the risk of counterfeit components from entering the supply chain, there is still and will most likely continue to be, a prominent threat. So, what can you do to minimize this risk? Read on.
A Not So Surprising Focus for Flex in the XR Realm
Dan Feinberg has been covering augmented, virtual, and mixed-reality for I-Connect007 for the last few years. He recently met with Eric Braddom, VP of Extended Reality (XR) Product Management for Flex, a company that is involved in this disruptive technology. In this interview, Dan and Eric discuss the future of augmented, mixed and/or virtual reality, or as Flex calls it, "extended reality."
Electronics Manufacturing (R)evolution
2018 is going to be the year of Industry 4.0, where we will see how enabling technologies including sensors, big data, analytics, and the Internet of Things (IoT), will transform the electronics manufacturing landscape.
Still Using 1980s Formats for Design Data Handoff?
The IPC-2581 format was created in the early 2000s with the merger of two competing formats: ODB++ and GENCAM. The new format, the brainchild of the late Dieter Bergman, languished with no adoption until 2011, when a small group of companies created the IPC-2581 Consortium with the goal of getting this open, neutral and intelligent format adopted. The consortium has been growing steadily in recent years. Its membership now includes more than 100 associate members in addition to its more than 90 corporate members.
Your Competitors are Outsourcing Their Manufacturing; Shouldn’t You?
As an OEM, you will be focused on increasing sales and maximizing profits. But you can only sell what you can produce, and manufacturing complex industrial electronic products day in, day out can be a headache. As your sales start to climb, you move closer to hitting your internal capacity limits. Here's how EMS providers can help you become successful in your manufacturing.
RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.
Setting Clear Boundaries with Your EMS Provider
A common area for confusion, particularly during the early stages of an outsourcing partnership, relates to 'boundaries', and agreeing who is responsible for what. If clear lines are not discussed and agreed between you and your EMS provider, it can be easy to fall into an assumption trap, and we all know what happens then.
RTW IPC APEX EXPO: IPC Highlights Latest Developments in EDGE
David Hernandez, senior director of learning and professional development at IPC, speaks with editor Stephen Las Marias about talent recruitment and retention, skills gap challenges facing the industry, and how IPC is addressing these issue through its IPC EDGE platform. Hernandez also discusses the latest developments in EDGE and how IPC is expanding the program.
The Vital Role of Solder Paste Printing in New Product Introduction
The high degree of automation within the SMT methodology offers a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labor costs. In this first in a series of articles exploring SMT assembly, we highlight the specific attributes, and the vital importance, of the solder paste printing process for your NPI.