Article Highlights
Reflow Perspectives to Flex Circuit Assemblies
07/13/2018 | Stephen Las Marias, I-Connect007
Is There an End in Sight to the Electronic Components Crisis?
07/12/2018 | Neil Sharp, JJS Manufacturing
Conversation with Miraco… Strategies for Successful Flex Circuit Assembly
07/11/2018 | Stephen Las Marias, I-Connect007
Aegis on CFX and Hermes Efforts
07/10/2018 | Barry Matties, I-Connect007
Tackling the Challenges in Flex Assembly
07/06/2018 | Stephen Las Marias, I-Connect007

Latest Articles

New Products

The DR354-1-2-3-4 series surface mount wirewound chip inductors protect against electromagnetic interference (EMI) for small devices in high-frequency filtering applications.

Challenges and Laws of Lead-free Cleaning

Lead-free soldering implementation is closing in on the July 1, 2006 deadline. Characteristics of lead-free alloys are higher reflow temperatures and poor wetting compared to eutectic tin/lead soldering.

Cost of Ownership for Dispensing Equipment

It’s not news that electronics manufacturers are looking to reduce manufacturing costs.

History of Inner-layer Testing

With the advent of high-speed flying probe testers, prototype PCB manufacturers are finding that with electrically testing inner layers, something old is new again.

Mitigating Whisker Growth on Electroplated Tin Finishes

The potential risk for whisker growth is one of the concerns when using a pure-tin lead finish.

Accuracy Measurements for Modern Dispensing

Modern PCBs require more miniaturization and previously unattainable component densities.

Lead-free: Reduce Joint Cracks in Automotive Electronics

The RoHS Directive comes into force in one month, and many manufacturers have adopted SAC solder alloys for lead-free consumer appliance production.

Post-print Verification Technology

HawkEye post-print verification technology isolates errors through a good/bad verification set against user-defined, pre-set thresholds. Streamed images are analyzed and any defective boards are identified and removed in real time. Throughput and end-of-line yield reportedly increase with 100% post-print verification at the line beat rate.

Digital X-ray Inspection

The XD7500 digital X-ray inspection system features a manipulator design that provides oblique angle views up to 70° for any position 360° around any point of the 18 × 16" inspection area, allowing inspection of all interconnections on PCBs containing ball-grid arrays (BGAs) and chip scale packages (CSPs).

Defluxing System

The SMT1000-LD defluxing system targets SMT and thru-hole defluxing applications, including lead-free flux removal. It provides impact pressure of 15.4 oz. per in.2, enhanced statistical process control (SPC) data recording, programmable maintenance-reminding software, and an automatic chemical management system.


Selective Soldering

The KISS 101 and 102 selective soldering systems feature lead-free-compatible solder pots for assembly, prototyping, rework, post-reflow offline assembly, and other selective soldering applications such as odd-form devices. Both systems are bench-top models with optional carriages for standalone use.

X-ray Inspection

The X1550 enables X-ray inspection for boards up to 18 × 24" with automated motion control, measurement, and analysis, as well as advanced solid-state detector-based inspection for lead-free assembly. The system offers a choice of Image Intensifier and complementary metal-oxide semiconductor (CMOS)-based high-resolution detectors, and a 130-kV X-ray source with a continuously variable field of view (FOV) up to 1.8" with zoom.

Rework System

The Fineplacer CRS 10 compact rework system suits fixed configuration needs, small- to medium-scale series assembly, or highly precise rework of soldered components on medium- to large-size surface mount device (SMD) boards. A plug-and-work design eliminates the need for time-consuming cabling.

Placement Machine

The FLX2010-LCV flexible pick-and-place system for high-mix production is said to offer changeover without downtime. It starts at 5,000 components per hour (cph) with 150 inline feeders, with the option to expand to 310 feeders.

Using Underfill to Enhance Lead-free Drop Test Reliability

With the RoHS deadline just two months away, there are still questions remaining regarding the reliability of Sn/Ag/Cu (SAC) alloys, as compared to tin/lead alloys.

Process Optimization of an 01005

The ever-increasing demand for lighter weight, increasing functionality, and portability has led to size reductions of many component types.

Assessing Tin Whisker Risk in Electronic Products

In response to legislation mandating the manufacture of lead-free electronics, part manufacturers have adopted pure-tin and high-tin lead-free alloy finishes.

Lead-free Process Control Management

In past pursuits of RoHS compliance, manufacturers focused on process changes, solder chemistries, and equipment.

Handset Manufacturing: Not a Simple Endeavor

Convergence in handsets has caused greater product stratification. Along with this comes a new set of design, sourcing, manufacturing, and life-cycle requirements.

STEP 5: Adhesives/Epoxies and Dispensing

Surface mount adhesives (SMAs) can be deposited with high X/Y accuracy, and in finely metered volumes, using dispensing or screen printing equipment and processes.


SMT Celebrates VISION Awards on a Grand Scale

It was a time for black tuxes, laser lights, and glittery gowns when SMT celebrated the VISION Awards on February 8, 2006, at the Anaheim Marriott during the APEX/IPC Printed Circuits Expo.

Winners

ADHESIVES/COATINGS/ENCAPSULANTS/UNDERFILLS

Cost of Ownership Considerations

As the SMT industry matures, containing several well-established vendors, it becomes increasingly difficult to differentiate offerings.

Printing Process Replaces Emulsion Screens

A method for component and ink printing industries, including multilayer chip capacitor (MLCC) or low-temperature co-fired ceramic (LTCC) manufacturers, was developed by Stork Veco, a Netherlands-based electroforming and photoetching company.

NEPCON Shanghai Sees High Attendance

Held April 4–7, 2006, in Shanghai's Everbright Exhibition and Convention Center, and jointly organized by Reed Exhibitions and the CCPIT — Electronics Sub-Council, NEPCON/EMT China 2006 saw 16,363 attendees convened to network and discover the latest technologies from 650 industry players spanning 22 countries.

Standardizing Material Declarations Globally

The RoHS regulations deadline is no longer simply inching up on the electronics assembly industry.

News

Compiled by SMT Staff

Newsmakers

Bob Solomon joined StratEdge (San Diego) as senior account manager. Solomon brings with him engineering, design and development, and sales knowledge in the semiconductor, telecom, medical, aerospace, and defense industries. He will be in charge of the company’s DC to 50+ GHz packages and assembly and test services.

New Products

Shape Memory Tooling

Lead-free Solder and the Rework Process

In three months, the electronics industry will shift from a proven, highly reliable, lead-containing solder alloy to a variety of lead-free alloys - creating extra work and raising concerns regarding long-term reliability.


AOI: A Strategy for Closing the Loop

AOI has been a process-monitoring tool within the SMT industry for several years.

Hand Soldering in a Mixed-alloy Environment

With the RoHS Directive date approaching, the big concern for many companies is compliance.

Using Stencil: Design to Reduce SMT Defects

Solder paste printing is known as the root cause behind assembly defects. Because yield accounts for much of the margin, the greatest opportunity to improve profits can be gleaned by eradicating solder defects.

Open vs. Sealed Tubes in X-ray Inspection

A topic often discussed when assessing X-ray equipment capability is the configuration of an X-ray source characterized by open vs. sealed tube.

Keeping Lead Away from Lead-free During Cleaning

While the deadline for conversion is fast approaching, it does not mean that everyone will become lead-free all at once.

STEP 4: Printing

Consumer need for electronic devices is driving the industry to products that are smarter, more portable, highly functional, and cost-effective.

EMA Targets RoHS Compliance in Design Process

(March 29, 2006) ROCHESTER, N.Y. — Adding to its recent RoHS/WEEE compliance technologies, EMA Design Automation integrated Omnify software, a data management system, into its engineering data management (EDM) solution. After having used Omnify's software internally to manage RoHS data for customers, EMA Design Automation realized it could also benefit their customers, giving them the ability to design-in RoHS complexities and issues from the beginning.

Conference Focuses on Green Manufacturing, Recycling

(March 29, 2006) MINNEAPOLIS — Some believe that China may be nearly five years ahead of the U.S. in WEEE/RoHS compliance. With the China RoHS law slated to go into effect March 1, 2007, the Third International Conference and Exhibition on Green Manufacturing, May 13-14, 2006, in Tianjin, China, may offer attendees additional compliance information.

SPECIAL FEATURE: Remote Diagnostics Offer Benefits Without IP Loss

This article focuses on a twist to remote-diagnostic maintenance technology, and the unyielding push to comfort PCB makers who have historically been concerned that sharing maintenance data with suppliers using Internet portals drilled into their fab will expose precious trade secrets. By Chakrapani "Chuck" Vallurupalli

Analyzing the Debate of Clean vs. No-clean

Most consumer-based products have adapted a true no-clean strategy, primarily due to rapid technological changes within the market.


Identifying Stencils for Lead-free Solder Paste

July 1, 2006 marks the era of lead-free electronics in Europe. The influence of RoHS and WEEE will result in better environmental quality, protection of human health, and more rational use of natural resources.

Matte-finish Solder Joints after Lead-free Wave Soldering

Most joints soldered using lead-free alloys exhibit a dull or frosty appearance, which differs from the smooth, bright, shiny surfaces of tin/lead solders.

Due Diligence Verification - Ensuring RoHS Compliance

ROHS compliance will require manufacturers to incorporate measures to ensure all electronic components meet the EU’s directive.

STEP 3: Solder Materials

Greater than 60% of end-of-line defects in SMT assembly can be traced to solder paste and the printing process.

Nano Golf Balls Straighten Drives

Get ready for nanotechnology to move from the lab to the marketplace. Though there is still too much hype surrounding nanotechnology, a few practical products from sportswear, to sensors, and even golf balls are available now.

News

Compiled by SMT Staff

New Products

Stencil Cleaner

Traceability Data Integrity - Challenges and Solutions

The electronics manufacturing industry is seeing increased demands for material traceability.

Jetting: Dispense Technology of Choice for Adhesives

Many manufacturers choose jetting technology to meet the demands of automated adhesive application processes.

SPECIAL FEATURE: Choosing the Proper Workbench or Workstation

On the surface, you might think that purchasing a workbench or workstation is a relatively simple proposition. Your employees have work to do, and they need an efficient, comfortable, and practical place in which to do it. But before you can be sure that you are getting the correct workbench, you need to perform some upfront work yourself. There are, in fact, many variables to consider. - By James Anderson and Ron Santoro, product managers, Lista International


SMT Magazine Honors 2005 VISION Awards Winners

ANAHEIM, Calif. — SMT Magazine announced recipients of its 2005 VISION Awards during the 14th Annual VISION Awards ceremony and celebration, held February 8, 2006, at the Marriott Hotel in Anaheim, Calif. Nearly 300 people attended the awards ceremony and celebration.

Solectron, Raven Beta Test IPC RoHS Lead-free Certification Program

When the IPC approached technical content experts with the idea of developing a lead-free process certification program, all were eager to join, said John D. Kania, director of government relations/industry programs.

AOI Systems Target Low-cost/High-volume Markets

Landrex debuted the cost-effective Optima II 7301 Express and high-speed Optima II 7310 Extreme at booth 1201 at APEX.

Materials Science Program Addresses Reliability Concerns

When speaking with electronics assemblers, Indium Corporation of America discovered there are many challenges to overcome, including thermal management issues resulting from increased power demands and component miniaturization. Solder joint reliability was the #1 concern for assemblers, said Ross Berntson, director of solder products. In response, Indium Corporation developed its Materials Science Program for Reliability.

Lead-free, No-clean Solder Paste Boosts Wetting

Heraeus' newly formed Contact Materials Division (CMD) announced the F640 series of lead-free, no-clean solder paste to promote wetting and minimize defects with tin/silver/copper alloy soldering.

Sola Notes Customer-centric Model Key to Survival

By Michelle M. Boisvert - Listening to your customer was just one of the strategies that keynote speaker Jure Sola, CEO and chairman of the board at Sanmina-SCI, shared with attendees on Wednesday, February 8. Sola noted that the customer-focused strategy is one way to compete in the global world of electronics manufacturing.

SMT Awards Celebrate VISION

During an awards ceremony at the Anaheim Marriott on Wednesday, February 8, 2006, SMT Magazine honored winners of the 2005 VISION Awards, recognizing innovative and visionary products and services within the surface mount industry.

MS2 Eliminates Dross in Wave Soldering

Dross build up in wave solder pots can contribute to additional soldering costs, reduced efficiency, and defects. On a recent visit with Los Angeles-based P. Kay Metal (Booth 2635), president Larry Kay introduced us to the MS2 100 dross elimination surfactant for lead-based wave solder pots, and the MS2 200 LF for dross removal in lead-free solder wave solder pots.

Cogiscan Demos Smart Feeder Cart System

The RFID Smart Feeder Cart expands the concept of intelligent feeders from SMT placement machines and feeder banks to storage carts.

Benchtop AOI Offers Low-cost Solution

The B2 Benchtop automated inspection system (AOI) for post-reflow PCBs from YESTech offers faster throughput and improved board handling. While visiting the company's San Clemente, Calif., facility, Don Miller, YESTech president, explained how the company's adaptive and flexible approach to inspection has disrupted the North American market.


IPC Roadmap Notes Changes, Challenges

The industry is changing, and the IPC’s 2004-2005 International Technology Roadmap for Electronic Connections also has changed.

News

Compiled by SMT Staff

Speed Enhancements for Screen Printing

Upgrading capital equipment to accelerate assembly processes is a cost-down technique, particularly in the EMS sector.

Pastes, Stencils, and Process Control

Concern for process defects is one reason for the growth in SMT. Paste and the printing process account for most process defects.

Managing Engineering Information: The PLM Landscape

Product lifecycle management is a broad concept that encompasses the management of product-related information from inception through end-of-life.

Tin/lead vs. Lead-free: A Question of Print Accuracy

The entire supply industry is feeling the impact of WEEE and RoHS regulations. While much progress has been made in preparation for this transition, one question lingers: Does the lead-free solder paste printing process need to be more accurate than the tin/lead process? This article aims to answer that question.

Lead-free Rework: Are You Ready?

Adoption of lead-free will have a major effect on rework and repair. Operators will encounter new component and board finishes with soldering characteristics unlike those of typical tin/lead finishes.

Lead-free: VOC-free Flux Deposition Reduces Defects

As the global push toward lead-free manufacturing gains momentum, much attention has been focused on its effect on assembly processes.

EMS Providers: The Design Partners

A trend among OEM providers is the desire for more help in the design area; and they’re looking for this on a number of different fronts.

APEX Product Showcase

Following are just some of the many innovative products to be showcased this month at IPC Printed Circuits Expo, APEX, and the Designers Summit in Anaheim, Calif.


STEP 2: Process Control

Cost and quality optimization in surface mount device (SMD) production requires a holistic manufacturing approach.

Non-contact Surface Profiling Improves Board Quality

Confocal 3-D profiling systems can be used at any step in the fabrication or assembly process to inspect and analyze visible features on outer layers of PCBs. Unlike inline machines dedicated to post-solder and post-component placement inspection, these systems feature versatile 3-D measurement, visualization, and analysis tools used for off-line quality control and defect diagnosis. - By Ciaran Murphy, Taylor Hobson Ltd.

Register Now for the Lead-free Success Stories Webcast

NASHUA, N.H. — SMT, in collaboration with Advanced Packaging and Connector Specifier Magazines, will host a "Lead-free Success Stories" Webcast on February 15, 2006, at 1:00 p.m. EST.

News

Compiled by SMT Staff

CEMA Offers Industry Trainings, Lead-free Resources

The Center for Electronics Manufacturing and Assembly (CEMA) at the Rochester Institute of Technology (RIT) is an academic research lab offering the Electronics Packaging industry research services, failure analysis, process training and development, consulting, and laboratory rental.

Expanding Role of Machine Capability Analysis

When considering the purchase of an expensive piece of manufacturing equipment, it is important to know that the equipment will perform to spec.

Flip-chip Assembly Using Ultra-fine-pitch Solder Pastes

In electronics manufacturing, keeping pace with technology is not enough to ensure long-term viability.

View of Chip Placement Head Technologies

Modern manufacturers, regardless of location or business model, have always valued the ability to reconfigure platform-type machines quickly during changeovers - optimizing placement capabilities for the incoming product.

To Void or Not to Void?

During its three-year, multi-million-dollar reliability study on lead-free solder, the IPC Solder Products Value Council (SPVC) found that solder voiding has no impact on solder joint reliability.

Lead-free: AOI in High-volume Production Assemblies

In accordance with the EU Guideline 2002/95/EG, PCB assemblies must comply with a lead-free process beginning July 1, 2006.


STEP 1: Board Design

Programmable device manufacturers often tout the ability to program a device after it has been mounted onto the board.

APEX Product Preview

ASSEMBLY TOOLS & EQUIPMENTProcess Control Tool

2006 Industry Vision Forecast

Overall, 2005 has been a profitable year for surface mount technology. Judging by the experts quoted in this forecast, continued and more robust growth is predicted for companies in 2006.

PCBs Constrained? Try Flexing Your Circuits

Consumers demand smaller and faster products that deliver more bang for the buck while still expecting reliability and long battery life.

Integrating New Business with an EMS Provider

Starting a new customer with an EMS provider has always been challenging for both parties.

Lead-free: Screen Printing - Where to from Here?

The deadline for lead-free electronic assembly is less than 12 months away. Time is running out to get “production-wise.

2005 Product Review

ASSEMBLY TOOLS & EQUIPMENTProcess Development Tool

Siemens Establishes Singapore Hub for Asia Manufacturing

In September 2005, I had a chance to observe Siemens Electronics Assembly Systems’ first high-speed Siplace placement machine, which was produced at the company’s SMT manufacturing plant in Singapore.

News

Compiled by SMT Staff

Newsmakers

Gary Shi was promoted to technical manager of research and development of Liquid Epoxy products at the electronics group of Henkel, reporting directly to Henkel’s global director of research, Development and Engineering for Semiconductor Materials, Larry Crane.


New Products

Thermal Profiler

Trends in the Stencil Printing Process

What trends will drive solder paste printing process technology over the next several years? This article examines two major trends to influence and drive the stencil printing process - lead-free and component miniaturization.

Thermal Materials Improve Automotive Laminate Reliability

You only have to look as far as the local dealership showroom to know that sleek, small and fast are the trends in the automotive industry.

Lead-free Stencil and Misprint Cleaning

The emergence of lead-free products in the North American market and more innovative cleaning technologies have contributed to the growing attention toward stencil and misprinted circuit board cleaning.

Process Control Methods for Conformal Coating

Conformal coating applications present a range of challenges to contract manufacturers and OEMs.

Attaining Lead-free Solder Joint Reliability

With the lead-free deadline approaching, EMS providers must offer OEMs transitional know-how to resolve several impending lead-free concerns, such as lead-free solder joint reliability.

Lead-free: PCB Test and Inspection

Much has been written regarding the Effects of lead-free solder on the assembly process.

STEP 10: Rework and Repair

The higher temperatures required for lead-free manufacturing pose challenges for electronic assemblies.

Conferences Abound — But One Stands Out

By Gene Weiner - Fall and spring used to be known as the meeting and show seasons. Now with the addition of many new shows around the globe, Webinars and the "flattened world," we have an overload of oft-repeated data and technology. Much is old news, yet there are a few gems still out there.

End-of-Life Leaching of Lead and Other Elements

There is much concern about what will happen when consumer electronics being stored in basements, garages, and attics reach municipal landfills.


STEP 9: Test and Inspection

Shipping high-quality products that are free of defects is a challenge that will not disappear.

Pb-free Design and Process Optimization for PIH

This article examines results of the board design and process optimization for paste-in-hole (PIH) using lead-free solder.

Predicting Brittle Fracture Failures

With expanded use of printed circuit board assemblies (PCBAs) containing lead-free BGA components, the challenge remains: how to predict and detect brittle fracture failures.

WEEE Registration Logistics

WEEE should have been adopted in the EU by August 2005; however, the UK, France, Italy, Poland, Estonia, Finland, Greece, and Malta have yet to enforce the legislation.

TechTips Toolbox

When we consider the transition to lead-free soldering, with all of its metallurgical complexities, it’s easy to understand how people might forget the basics.

News

Compiled by SMT Staff

iNEMI Heads Hi-Rel RoHS Task Force

The International Electronics Manufacturing Initiative (iNEMI) created the High-Reliability (Hi-Rel) RoHS Task Force and announced publication of recommendations to protect the dependability of high-reliability products as the supply chain moves to lead-free components.

Productronica Products

The following is a variety of products offered from just a few of the exhibiting companies slated to be at Productronica 2005, November 15-18, in Munich, Germany.

Solutions for Advanced Rework Challenges

The electronic world is getting smaller, more crowded and vertically integrated.

Protecting Board Integrity in Harsh Environments

Conducting failure test analysis and quality control evaluations of circuits that have been protected with conformal coatings can be difficult.


RoHS: Y2K for OEMs?

Determining RoHS-compliance preparedness and redesigning products to satisfy the Directive is the main discussion topic between EMS providers and OEMs.

Lead-free: Making the Adjustments

The EU’s RoHS Directive, as well as similar global legislation, is fostering change in the fabrication and assembly of PCBs.

Speaking of Contract Manufacturing: Virtual Resources Play a Role in EMS

Internal EMS resources have been stretched in the U.S. domestic market. Competitive pricing pressures and low profit margins in our industry have placed a strain on people by reducing the depth of in-house resources EMS companies can afford to retain on a permanent basis. We are finding ways to leverage the capabilities of related companies in this industry as we offer the customer a single point of contact in providing manufacturing services.

Inspex, Inc. Offers X-ray Inspection Services

(September 6, 2005) ORANGE, Calif. — Inspex, Inc. introduced quick-turn X-ray inspection services for PCB and semiconductor electronics packaging and assembly, including BGA, QFP and PLCC components on all types of assemblies, semiconductor components, active and passive devices, multiplayer PCBs, PCB fabrication and molded and encapsulated components.

IMS Names Rep in Canada

(September 2, 2005) PORTSMOUTH, R.I. — International Manufacturing Services (IMS) appointed Zully Alidina and Markham, Ontario-based RF Spectrum as its representative in Canada. RF Spectrum is an established representative in the Canadian wireless market.

Dispensing Adhesives and Epoxies: Trends and Developments

Surface mount adhesives (SMAs) have been around long enough that they are expected to perform consistently and reliably as part of the background process of electronics assembly.

AOI and AXI: One Powerful Combination

In the past, AOI has been pitted against AXI when a company implements automated inspection throughout its SMT line.

Aqueous Cleaning Today and Tomorrow

Much like the electronics industry as a whole, the PCB cleaning market continues to change.

Beyond AOI - SMT Quality Control

The automatic inspection machine in SMT came about in the early 1990s. Now there is a range of processes that AOI can accomplish in this field.

STEP 8 : Cleaning

What does low cost of ownership mean? Too many define it as outsourcing production to China.


News

SMTA International 2005 Packed with Opportunities

SMT China International Call for Papers

PennWell and China Electronics Appliance Corporation (CEAC) will sponsor the 2005 SMT China International Conference on “Emerging Technologies and Lead-free Challenges,” November 21-22, 2005.

2005 SMTA International Products

Following is a variety of products offered from just a few of the exhibiting companies slated to be at SMTA International/ATExpo.

Lead-free Wave Solder Alloy Selection: Reliability Is Key

The Eu’s RoHS Directive is driving major changes in the manufacture of electrical and electronics equipment.

SMT, SMT China Announce Call for Papers for Upcoming Conference

SHANGHAI — SMT, SMT China and China Electronics Appliance Corporation (CEAC) announce the Call for Papers for the 2005 SMT China International Conference on Emerging Technologies & Lead-free Challenges. Held annually, SMT and SMT China Magazines will focus on SMT, emerging technologies and hot topics for modern assembly methods.

The Inside LIne

SMT Nabs Best Cover Award for Second Year; SAC 305 Alloy of Choice in IPC Study

News

Fabrinet Named 2004’s Best Manufacturer

New Products

Photo-sensitive Epoxy Material

The SMT Assembly Process

The Electronic Assembly Suppliers’ Initiative (EASi) Line, featured at ATExpo, in conjunction with the SMTAI, September 26-29, 2005, at the Donald Stevens Convention Center in Rosemont, Ill., and coordinated by Electronics Manufacturing Solutions, Inc., demonstrates a fully functional manufacturing line from start to finish.

Enhancing the Imaging Chain in X-ray Inspection

To meet the challenge of inspecting smaller components, tougher-to-view interconnects and geometries measured in microns and sub-microns, X-ray image quality is becoming paramount in PCB assembly.


Placement Accuracy Management: Key to Better Profits

The importance of quality control in PCB assembly operations has never been greater than it is now due to shrinking component and assembly sizes.

Minimizing Tin Whiskers

The iNEMI Tin Whisker User Group was formed to minimize the risk of failures from tin whiskers.

BGA Socket Considerations: Prototype to Reality

BGA socketing systems are essential during the design, testing and production phases of products containing high-performance ICs.

STEP 7: Soldering

There are several important decisions to make when converting to lead-free wave soldering.

Understanding EMS Pricing Strategies

While pricing pressures continue to strain developers and manufacturers, the business model is in need of repair.

Productronica '05 Granted Trade Fair Certification

(July 6, 2005) CHICAGO — The U.S. Department of Commerce has granted Productronica 2005 Trade Fair Certification. The show is slated to take place November 15-18, 2005, in Munich, Germany.

16-bit Imaging Chain Captures Hi-res Images

(July 6, 2005) GARBSEN, Germany — The HDX-ray 16-bit Imaging Chain from FEINFOCUS is said to capture high-resolution images with qualities similar to film, in real time. HDX-ray provides digital images for inspecting applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects, hybrids and encapsulants.

Process Considerations for Optimizing a Reflow Profile

Implementing a lead-free reflow process with alloys that have higher melting points is challenging.

Strain Gage Testing: Standardization

As the electronics industry shifts toward finer-pitch BGA components, thinner PCBs and lead-free interconnects, the robustness of second-level interconnects (SLIs) may be affected adversely.

Parallel Processing: Build It Right the First Time

As the electronics industry moves to smaller and more complex components, and the transition to lead-free materials is evident, the requirement to build it right the first time will be even more crucial to help achieve company financial goals.


The Fundamental Reality of an AOI Seal

The trend toward smaller components in consumer and medical devices is creating a concern for accuracy and reliability.

Lead-free: Controlling Tombstoning Behavior

Tombstoning has plagued the surface mount assembly industry for decades. While the problem seemed under control, it has begun creeping in again due to the miniaturization of discretes such as 0402s and 0201s.

Industry Ethics - Live by Example

Imagine that you are walking down a sidewalk and see a quarter on the ground. Do you pick it up and keep it?

News

Compiled by SMT Staff

New Products

COMPONENTSRF Connectors

Lean Manufacturing with Six Sigma Implementation

To remain competitive in the electronics manufacturing arena, it is essential to implement a lean manufacturing mindset - reacting and conducting business from the top down.

PRODUCT SPOTLIGHT: Automated High-volume Rework

The Fineplacer Micro HVR system is designed to address the high-volume rework market, where hundreds of boards must be repaired due to high value, component scarcity or in situations where manual rework is illogical. This tool allows hands-free, automated sequencing of repair steps: component de-solder and discard, residual solder removal and component re-solder.

Eliminate Lead-free Wave Soldering

The advent of lead-free soldering presents many manufacturers with the need to wave solder using lead-free alloys.

AlSiC Microprocessor Lids Handle the Heat

Microprocessor clock speeds operate at 2 GHz with power levels up to 130 W. This calls for materials, heatsinks and lids that can dissipate heat and reduce thermally induced stresses.

IP Addressable Device Programming

Recent changes in computing technology have provided much-needed capability for multi-site/multi-national companies to pursue the strategies of developing a global presence.


Lead-Free Cleaning: Moving from Eutectic to Lead-free

As of July 1, 2006, the WEEE Directive will eliminate the use of lead in solder paste.

STEP 6: Component Placement

Leaders in the design and manufacture of metal-dome switch contacts and complementary equipment for membrane switches and related mechanical-switch industries are seeing higher demand.

The Move to Lean: Inventory Management at the Foundation

Managing and maintaining accurate inventory levels is one of the most challenging, yet critical, aspects of an EMS/OEM relationship.

The Inside Line

SMTA 2006 Pan Pacific Call for Papers

News

Compiled by the SMT Staff

New Products

ASSEMBLY TOOLS & EQUIPMENTVertical Lift Module

The Inside Line

Jay Regan Named Publisher of SMT, AP and CS Magazines

SMT Salutes the Visionaries

During APEX on February 22, 2005, in the Pulse Room of the Anaheim, Hilton, SMT magazine announced the winners of the 2004 VISION Awards.

2004 SMT Vision Products

ADHESIVES/COATINGS/ENCAPSULANTSConductive Film Adhesive

On-site Capability Measurement

The use of fine-pitch components, accompanied by the transition to lead-free, will force PCB manufacturers to learn more about their pick-and-place machines’ capabilities.


Flip Chip Assembly on PCB

This article focuses on using different assembly options such as dip fluxing, flux jetting and reflow encapsulate for 200- to 250-µm pitch lead-free (SnAgCu) flip chips on FR-4 substrates.

Lead-free: Soldering at the End of the Line

The end of the line is where rework and repair technicians ply their trade. To prevent this hallowed area from becoming the “bitter end” during the lead-free transition, we should consider proactive tactics to prepare technicians to phase into the lead-free zone.

STEP 5: Adhesives/Epoxies and Dispensing

In recent years, three disciplines of fluid formulation: manual, semi-automatic and automatic benchtop dispensing systems, can be found in a range of applications that have converged in the electronics manufacturing industry.

Lean Manufacturing - A Case Study

Since its inception, Celestica has been building a commitment for lean manufacturing operations by raising the level of awareness surrounding its benefits.

IPC Capitol Hill Day - May 18

Software Control Extends Beyond the Line

This article focuses on the use of software to achieve factory wide automation. with new regulatory requirements and increasing cost and quality demands, manufacturers will benefit from a complete automation model, such as those used in semiconductor processing.

Passive Component Rework - Giving Small New Meaning

The prevalence of small passive components in electronic products creates a challenge when adapting rework systems for selective removal and replacement.

Cooling Rates in Lead-free and Tin/lead Reflow

The impact of a fully controlled and robust reflow process on solder-joint quality has been the topic of many studies, and is well understood for processes using eutectic tin/lead as the interconnect alloy.

Obtaining Fully Automated, High-volume Optoelectronics Assembly

Successfully automating the microelectronics assembly process reduced costs and optimized for high-volume manufacturing.

Understencil Wiping: An SMT Blind Spot

The complex stencil-printing process is at the heart of SMT production. With more than 39 variables to optimize in the printing process, it’s no surprise that 50-90% of all defects originate on the stencil printer.


Lead-free: Using Vapor Phase Reflow in Lead-free Processing

During lead-free processing, vapor phase reflow offers the option to eliminate the variable of higher temperature processing.

Step 4: Printing

The solder paste printing process is simple - place the correct amount of solder paste in the correct location at an acceptable rate.

De-fluxing Eases ‘Sticky Situations’

Using a contract assembler offers several benefits. However, when outsourcing a no-clean process, the challenge for contract assemblers lies with the multiple applications, processes, materials and expatiations that customers set.

IPC Revises IPC-A-610D and J-STD-001D Standards

Updating industry assembly standards often is a long process.

News

Celestica Helps Ease Strain of RoHS Compliance

New Products

ASSEMBLY TOOLS & EQUIPMENTMachine Mounts

News

Executive Briefings Focus on Interconnects

New Products

Two-pair Connector

Mass Imaging Advances for Next-generation Assemblies

High-accuracy mass imaging of electronics materials continues to advance in response to manufacturing challenges brought about by advanced packaging, next-generation SMT assembly and approaching lead-free deadlines.

Material Control for Lead-free Manufacturing

Managing the transition to lead-free electronics assembly requires a significant effort in many areas.


Boundary Scan Benefits Lead-free Assembly

OEMs and EMS providers are realizing the benefits of using boundary scan in the face of initiatives such as the move toward lead-free board assembly.

Lead-free: Component Compatibility Takes Center Stage

The role of a solder joint in the quality and reliability of electronics circuits has evolved.

Managing the Environmental Life Cycle of Electronics

Two years ago, I organized a panel discussion at APEX on “Electronics Recycling and End-of-Life Management.”

STEP 3: Solder Materials

While many solder material topics could be addressed, an overview of no-clean pastes deserves attention.

Contract Manufacturing: Efficient Line Changeover

Optimizing line-changeover efficiency is a necessity to implement lean manufacturing in high-mix, low-volume (HMLV) electronics assembly environments.

Dartmouth and SMT Unite for Six Sigma Program

When Sylvanus Thayer, often called “The Father of Technology in the U.S.” founded and endowed the Thayer School of Engineering at Dartmouth College in 1871, I doubt he imagined it would be held in such high esteem more than a century later.

SMT Congratulates Recipients of This Year's VISION Awards

NASHUA, N.H. — On the evening of February 22, 2005, SMT Magazine presented its 2004 VISION Awards at the Hilton Anaheim's Pulse Room. Held annually in conjunction with the APEX/IPC Printed Circuits Expo/Designers Summit show, in Anaheim, Calif., the awards were presented in 15 categories.

Dartmouth and SMT Unite in Six Sigma Effort

(February 8, 2005) NASHUA, N.H. — The Thayer School of Engineering was the first professional engineering institution in the U.S., when it opened its doors in 1871. Something new is afoot there in Hanover, N.H., that is another milestone in technical education. The Thayer School's Cook Engineering Design Center, working with SMT, has established what we believe is industry's most rigorous Six Sigma program. The Workshops are scheduled to start in June 2005.

Thermal Management for Hot Products

(February 8, 2005) Everyone wants to know what will be the next "hot" semiconductor product. On February 16, 2005, MEPTEC, the Microelectronics Packaging and Test Engineering Council, will hold The Heat Is On: Thermal Management Issues in Semiconductor Packaging, in San Jose, Calif., to discuss how to manage the heat generated by high-watt devices.

APEX Product Preview

The following are some of the many innovative new products that can be seen this month at the combined APEX/IPC Printed Circuits Expo conference and show in Anaheim, Calif.


Automating Odd-form Component Assembly

With continued use of thru-hole components in mixed-technology assemblies, the challenge remains how to automate the assembly of odd-form components effectively.

AXI Conquers Hidden Joint Defects

Lamniographic automated X-ray inspection (AXI) allows for solder-joint inspection, including those hidden under area array packages.

Reliability Effects of Unfilled Underfill Encapsulants

This article explores the effect of an underfill encapsulant that contains no filler on board-level reliability of area array packages.

Detachable Tape-and-Reel

Low-volume/high-mix manufacturers face an increase in tape-and-reel splitting. In LVHM, it is estimated that 20 to 30% of these reels need to be split into two or more reels.

How Surface Finish and Solder Paste Affect Lead-free Conversions

The Massachusetts Lead-free Consortium wanted to create a database of lead-free conversion knowledge through separate and limited scope projects.

Evolving Profile Requirements

Reflow soldering process developments for lead-free assembly will be more challenging and more time consuming than that for tin/lead.

Optimizing Lead-free Reflow Processes

Lead-free SMT assembly can be achieved reliably, however, several variables should be taken into consideration.

STEP 2: Process Control

This article discusses how lead-free material characteristics affect the process engineers responsible for implementing and optimizing the lead-free assembly process.

The Power of Partnership

How One CEM Met the Multi-vendor Challenge Head-on

The Inside Line

European SMT Conference Answers Tough Questions


Point/Counterpoint

Industry experts voice differing opinions on wave soldering vs. laser diode soldering

News

Grants Fund Chip Manufacturing Campus

Lead-Free WEEE and RoHS Issues to Consider

There are many unresolved issues associated with the WEEE and RoHs Directives. Companies throughout the EEE supply chain must understand their obligations under these Directives and develop a strategic action plan for compliance to ensure long-term market competitiveness and business success in the EU and the global economy.

Halide- and VOC-free Wave Solder Flux Introduced

(December 29, 2004) CLINTON, N.Y. — 1072 wave solder flux from Indium Corporation of America is a rosin flux that contains a unique formulation, making it both halide- and VOC-free. This new advancement in chemistry combines the benefits of rosin with the environmental friendliness of a water-based product.

Power-shielded Inductors Offer Small Footprint Package

(December 29, 2004) SAN DIEGO, Calif. — Pulse has introduced a series of power-shielded surface-mount inductors with a small, 6.2 x 6.2 x 2-mm maximum footprint package for DC/DC applications in consumer electronics products such as MP3 players, digital cameras, gaming consoles and in local, low-power DC/DC conversion applications. All parts are RoHS-compliant.

Speedline to Present Papers, Programs and Seminars at APEX 2005

(December 29, 2004) FRANKLIN, Mass. — Speedline Technologies will present several important technical papers and training programs, as well as host a series of informative seminars at APEX 2005, to be held February 22-24, 2005, in Anaheim, Calif.

DEK 2004 Stencil Shipments Approach 75,000

(December 29, 2004) FLEMINGTON, N.J. — DEK has reached a record number of stencil shipments for 2004, supplying nearly 75,000 stencil products to customers around the world with manufacturing sites throughout Europe, North America and Asia.

NPL Seeks Lead-free Reliability Project Partners

(December 28, 2004) MIDDLESEX, U.K.— The National Physical Laboratory (NPL) will begin a project to investigate the reliability of existing substrates manufactured using a lead-free process.

Caster and Leveler Combo Available

(December 26, 2004) NATICK, Mass. — An all-in-one leveler and caster solution from Sunnex, Inc. offers the flexibility of a caster and the leveling capability of a mount.

Right-angle Miniature Pushbutton

(December 22, 2004) HARWOOD HEIGHTS, Ill.— A low-cost right-angle miniature pushbutton switch for PCB mount is available from ITW Switches.


Image Sensor Sockets Protect in Board Assembly

(December 22, 2004) WEST WARWICK, R.I. — A line of image sensor sockets designed to cut costs by protecting against damage during board assembly and processing is available from Advanced Interconnections.

Deal Delivers Manufacturing Execution and Management Solutions

(December 22, 2004) CHELMSFORD, Mass.— Brooks Software and AssurX announced a joint development agreement to deliver an integrated manufacturing execution and quality management solution targeting discrete manufacturers.

Aerosol Maintenance Cleaners Available

(December 20, 2004) NASHVILLE, Tenn. — A low VOC water-based aerosol maintenance cleaner that removes dirt, oil, grease, wax, flux, paste and other particles from copper, aluminum, iron, brass stainless, ceramic, cement, glass, plastic, rubber and cloth surfaces is available from Kyzen.

Inspection Companies Form Alliance

(December 20, 2004) STAMFORD, Conn. — An alliance was established between FEINFOCUS and Tokyo, Japan-based Unicraft Co.

MPM Stencil Printer Verified

(December 20, 2004) FRANKLIN, Mass. — Speedline Technologies announced that CeTaQ Americas has verified the alignment and print performance specifications for the next-generation MPM Accela stencil printer.

News

China Sets Prices, Manufacturing Trends

The Inside Line

PB-free: How Close Are You?

The Evolving EMS Industry

The landscape of the EMS industry is both competitive and changing. The challenge is to develop products beyond the traditional business model.

SMTA Toolbox: No Free Lunch, But Everyone Wins

It?s a dream come true. You no longer have an unreasonable boss to harass you every day.

Improving Solder-Paste Processes Through Experimentation

Proper application of solder paste onto a PCb is essential in surface mount assemblies.


2004 Product Review

ASSEMBLY TOOLS/EQUIPMENT

Making the Move to Lead-free Requires Teamwork

(November 23, 2004) The reality of the reduction of hazardous substances (RoHS) regulations has many manufacturers in the United States seeking alternative materials for their products. Manufacturers who compete in the global marketplace must be prepared to with the regulations. Regardless of the debates over the science justifying the regulations, manufacturers need to explore alternative products and processes to enable compliance. by Brian Bauer

The Inside Line

Source Electronics Standardizes Global Facilities

News

Compiled By SMT Staff

New Products

Hand Cleaning System

Mass Imaging Performance with Lead-free Solder

Manufacturers face the rapid approach of the European Waste in Electrical Equipment (WEEE) Directive.

Solid Shape Modeling — Working Toward 3-D AOI

With ever-increasing complexity and component density on circuit boards, automated inspection of printed circuit boards (PCB) during manufacturing becomes a critical step necessary for high quality and yield.

Trends in the SMT Software Market

Increasing customers' preference toward integrating SMT software with the manufacturing execution systems (MES), enterprise resource planning (ERP) systems and other factory automation systems is likely to be observed in the forecast period.

The Invisible Enemy

Fumes and vapors released during hand soldering with lead-free solder may pose a greater risk to employees than ever before. Installing an effective fume filtration system is the way to lessen the risks.

Step 10: Rework and Repair

Given the higher temperature requirements for lead-free soldering and the more delicate nature of array package components, rework stations must now feature excellent profiling and tolerance, as well as offer easy calibration if optimum results are to be achieved and thermal damage avoided.


Contract Managing: Helping EMS Providers Stay Competitive

For EMS providers, global diversity of the end consumer drives the need for flexibility, speed, agility, visibility and regulatory compliance.

Round Up: Test and Inspection

This article is based on responses received to a questionnaire sent to test and inspection equipment suppliers.

The Relationship between Reflow Soldering Processes and Power Consumption

Differences in the melting point of lead-free alloys compared to that of eutectic tin-lead typically result in soldering processes characterized by changes in the operating temperature of the forced convection oven's heating zones.

IPC PDX Standards, RosettaNet PIPs Support Flexible Supply Chain Relationships

In today's distributed manufacturing environment, efficient exchange of product data — from design through manufacturing, and even end of life disposition — is increasingly important to a cost-effective supply chain.

Improving Quality and Productivity: Insights Into Two Companies

Exact traceability is emerging as a mainstream demand for quality in volume manufacturing, and is expected to be a key element in manufacturing execution systems (MES) investment in the future. With increasing pressure from electronics companies further up in the supply chain, manufacturers will risk losing business if they do not comply.

Lead-free and Lead Contamination

Concerns exist about lead contamination in lead-free soldering. Although more components are available in a lead-free finish, some are not yet available or not easily obtained.

Step 9: Test & Inspection

As BGA usage increases on printed circuit board (PCB) assemblies, more contract manufacturers are implementing X-ray inspection into their test methodology. This inspection method can non-destructively check not only the quality of the optically hidden BGA solder joints, but also can be used to confirm overall production process quality, such as the level of voiding within solder joints.

Mexico vs. China: What Does the Future Hold?

This article will analyze electronics manufacturing trends in China and Mexico for North American-based electronics companies.

The Inside Line

December SMT Cover Wins Award

News

Frost & Sullivan Report Evaluates Prospects of Lead-free Electronics Assemblies


Newsmakers

Companies

New Products

ASSEMBLY TOOLS & EQUIPMENT

ATS Receives $11.4 Million in Repeat Automation Systems Orders

(September 28, 2004) Cambridge, Ontario — ATS Automation Tooling Systems Inc. announced it has received an additional follow-on automation systems order valued at US $11.4 million (CDN $14.8 million) from a leading manufacturer of self-use medical diagnostic products.

Speaking of this Week — September 24, 2004

News this week is split pretty evenly between progress and personnel news. There are also announcements regarding upcoming shows and financial news.

Speaking of this Week — September 24, 2004

News this week is split pretty evenly between progress and personnel news. There are also announcements regarding upcoming shows and financial news.

Speaking of this Week — September 17, 2004

Progress dominates the news this week, with news of upcoming trade shows (including more about SMTA International/ATE) following close behind. There's also more teamwork, a bit of financial news and a personnel announcement.

Speaking of this Week — September 17, 2004

Progress dominates the news this week, with news of upcoming trade shows (including more about SMTA International/ATE) following close behind. There's also more teamwork, a bit of financial news and a personnel announcement.

Speaking of this Week — September 10, 2004

In this short week, the amount of news exploded. With Assembly Technology Expo (ATE) coming up at the end of the month in Rosemont, Ill., it seemed everyone wanted to tell us that they'd be there and what they would be exhibiting. There's also news of other trade shows, progress, alliances, personnel and financial news, and some good overall news for August.

Speaking of this Week — September 10, 2004

In this short week, the amount of news exploded. With Assembly Technology Expo (ATE) coming up at the end of the month in Rosemont, Ill., it seemed everyone wanted to tell us that they'd be there and what they would be exhibiting. There's also news of other trade shows, progress, alliances, personnel and financial news, and some good overall news for August.

Speaking of this Week — September 3, 2004

There's a lot going on this week before Labor Day. IPC released its new book-to-bill ratio, and there's tons of positive progress news. Trade show news past and present, as well as personnel and financial news, was on the radar as well. Finally, there's a look at the oft-neglected ESD market.


Speaking of this Week — September 3, 2004

There's a lot going on this week before Labor Day. IPC released its new book-to-bill ratio, and there's tons of positive progress news. Trade show news past and present, as well as personnel and financial news, was on the radar as well. Finally, there's a look at the oft-neglected ESD market.

SMTA International 2004 Show Preview

Co-located with Assembly Technology Expo (ATExpo), SMTA International is organized by the Surface Mount Technology Association (SMTA), and features more than 120 technical papers, 32 tutorials and workshops, an Emerging Technologies Summit, and special symposiums on contract manufacturing and lead-free soldering technology.

SMTA International 2004 Products

Following is a variety of products offered from just a few of the exhibiting companies slated to be at SMTA International/ATExpo. Be sure to visit each exhibiting company for more complete product offerings.

Auto Teaching for Component Programming

As component technology and surface mount equipment have advanced, the challenge remains: how to handle the latest and most complex components quickly and effectively

Minimizing Effects of Lead-free SMT Assembly on Connector Housing Resins

Many connector suppliers are eliminating, or have already eliminated, lead from their contact plating process. The next phase will be lead-free solder compliance for board assembly.

RMS Enable Modular Manufacture

Reconfigurable manufacturing solutions (RMS) are more than a concept or collection of modules and machines; however, because the reconfigurable manufacturing solution for any assembly or manufacturing challenge will be unique, the concept can be difficult to convey and understand.

Diode Laser Soldering Technology: The Next Generation in Non-Contact Soldering

With development of newer reduced cost, high-power diode lasers, selective soldering with laser now is gaining wider acceptance for production of miniaturized interconnects.

Lead-Free Reflow Process Control

The changeover to lead-free solders due to environmental concerns and legislation presents new challenges for the solder reflow process.

Step 8: Cleaning

Printed circuit board (PCB) cleaning ? the value-added process of removing surface contaminants that have accumulated during various manufacturing processes and handling ? is critical on several fronts.

Impact of Lead-free on the SMT Soldering Equipment Market

This article will evaluate trends in the SMT soldering equipment market, as well as the impact of lead-free.


Speaking of this Week — August 27, 2004

As summer prepares to join with fall, it's the week of alliances. Trade show news follows close behind, and there are also personnel and progress news, financial announcements, and a look at a consumer electronics end market growing in importance.

Speaking of this Week — August 27, 2004

As summer prepares to join with fall, it's the week of alliances. Trade show news follows close behind, and there are also personnel and progress news, financial announcements, and a look at a consumer electronics end market growing in importance.

Speaking of this Week — August 20, 2004

With the fall trade show season drawing closer, it's no surprise that news of upcoming shows and events (many of them having to do with lead-free) dominated the news this week. There's also some progress news, alliances and sales, personnel and financial news, and some looks at the future of two different segments of the industry.

Speaking of this Week — August 20, 2004

With the fall trade show season drawing closer, it's no surprise that news of upcoming shows and events (many of them having to do with lead-free) dominated the news this week. There's also some progress news, alliances and sales, personnel and financial news, and some looks at the future of two different segments of the industry.

Speaking of this Week — August 13, 2004

Progress news, especially having to do with the industry hot topic right now, lead-free, was in wide abundance this week. We've also got news on trade shows to come as we look toward the busy fall show season. And just for good measure, quarterly financial news, partnerships, legislative news and a look at the components market are thrown in as well.

Speaking of this Week — August 13, 2004

Progress news, especially having to do with the industry hot topic right now, lead-free, was in wide abundance this week. We've also got news on trade shows to come as we look toward the busy fall show season. And just for good measure, quarterly financial news, partnerships, legislative news and a look at the components market are thrown in as well.

Download your 2004 SMT VISION Awards Call for Entry Form Today!

The 2004 SMT VISION Awards recognize the people and products within the surface mount industry that serve as benchmarks of excellence. Download your official Call for Entry Form here. The deadline is November 3, 2004. The awards, presented in 15 critical areas, will be awarded at the co-located IPC Printed Circuits Expo/APEX show in Anaheim, Calif., February 22, 2005.

Speaking of this Week — August 6, 2004

Partnership, merger and acquisition news came to the forefront again this week. Lots of progress news in a variety of categories, financial news of all stripes, as well as trade show and personnel news appeared as well.

Speaking of this Week — August 6, 2004

Partnership, merger and acquisition news came to the forefront again this week. Lots of progress news in a variety of categories, financial news of all stripes, as well as trade show and personnel news appeared as well.

The Inside Line

Tyco and Remploy Provide Jobs for the Disabled


News

Compiled By SMT Staff

New Products

ASSEMBLY TOOLS & EQUIPMENT

Through-hole Assembly Options for Mixed-Technology Boards

This article describes three methods currently used for through-hole connector attachment on double-sided SMT PCBs: selective wave solder, pin-in-paste (PIP) reflow and solder preforms. A case study illustrates how the last method is an alternative when PIP provides insufficient solder

Aspects of Microdispensing

Microdispensing has become the primary focus of liquid dispensing research and development (R&D) over the last few years, with the prime motivator the pursuit of small deposits.

Video Microscopes Meet Inspection Requirements

Acquiring information from video images is a common phenomenon. It is a natural progression to extend video imaging to magnification of small objects, such as electronic components on a printed circuit board (PCB) with video microscopes that display images on monitors or flat panel displays.

What Can Go Wrong with Lead-free Soldering

With worldwide lead-free legislation such as the Restriction of Certain Hazardous Substances (RoHS) Directive on the horizon, much research has been conducted to identify the best alternative to tin-lead (SnPb) solder.

Step 7: Soldering

With lead-free compliance becoming a reality in the electronics manufacturing industry, lead-free solder processing has been a major topic of discussion, and is the cause of some apprehension in the industry.

Electronic Component Market Trends

Growth in the world electronic components and packaging market depends on the growth of end-user industries, such as computers, telecommunications, consumer electronics and automotive markets.

Speaking of this Week — July 30, 2004

What a week! IPC released its new book-to-bill format for June's numbers, which splits rigid and flexible PCBs into two segments. High-profile progress news came to light, as did personnel news, financial results, partnerships and acquisitions, a trade show tidbit, and a look at the worldwide handheld device market.

Speaking of this Week — July 30, 2004

What a week! IPC released its new book-to-bill format for June's numbers, which splits rigid and flexible PCBs into two segments. High-profile progress news came to light, as did personnel news, financial results, partnerships and acquisitions, a trade show tidbit, and a look at the worldwide handheld device market.


Speaking of this Week — July 23, 2004

This week, progress news, especially that of awards given and received, dominates the news. There's also lots of (good) financial news, huge personnel announcements, important agreements and partnerships between companies, tradeshow news, and looks at the industry.

Speaking of this Week — July 23, 2004

This week, progress news, especially that of awards given and received, dominates the news. There's also lots of (good) financial news, huge personnel announcements, important agreements and partnerships between companies, tradeshow news, and looks at the industry.

Speaking of this Week — July 16, 2004

This week was a bit slow, with everyone off at the two halves of SEMICON West in California. But there's still plenty of progress and personnel news, as well as financial results and expectations, partnerships, and trade show news.

Speaking of this Week — July 16, 2004

This week was a bit slow, with everyone off at the two halves of SEMICON West in California. But there's still plenty of progress and personnel news, as well as financial results and expectations, partnerships, and trade show news.

Speaking of this Week — July 9, 2004

In this short week, the news is all over the place. Progress dominates, with awards being handed out willy-nilly and orders on the rise. Coming industry events stretch into the fall, while personnel and partnership news is on the radar screen as well. Finally, one tooling system company reported markedly improved results for the second quarter.

Speaking of this Week — July 9, 2004

In this short week, the news is all over the place. Progress dominates, with awards being handed out willy-nilly and orders on the rise. Coming industry events stretch into the fall, while personnel and partnership news is on the radar screen as well. Finally, one tooling system company reported markedly improved results for the second quarter.

Speaking of this Week — July 2, 2004

Even though this was a relatively quiet week, what with everyone's mind on the red, white and blue, some pretty big news came our way. IPC announced its book-to-bill ratio for May, showing a leveling off in growth. There's also lots of big-name progress news, alliances and acquisitions, personnel moving and shaking, and financial announcements. The MEMS marketplace also got a good, hard look.

Speaking of this Week — July 2, 2004

Even though this was a relatively quiet week, what with everyone's mind on the red, white and blue, some pretty big news came our way. IPC announced its book-to-bill ratio for May, showing a leveling off in growth. There's also lots of big-name progress news, alliances and acquisitions, personnel moving and shaking, and financial announcements. The MEMS marketplace also got a good, hard look.

Intelligent Fastening for Automotive Electronics

Automotive OEMs and suppliers share a drive to enhance assembly efficiency and productivity, reduce time-to-market, produce higher-quality products at competitive prices, and meet regulatory standards for mileage, safety and the environment.

Streamlining SMT Production Through an Open Interface

To streamline production, modern manufacturing must move toward total integration of every key process in the enterprise.


X-ray Inspection of Lead-free Solder Joints

As lead-free solder increasingly becomes a reality, inspecting lead-free solder joints must be investigated.

Process Benefits of Underfill Encapsulants for CSPs and BGAs

Underfill encapsulants were originally developed to encapsulate flip chip ICs. A silicon flip chip has a much lower coefficient of thermal expansion (CTE) than the substrate it is assembled on.

Lead-Free Series: Considerations for Printing Lead-free Solder Pastes

SMT printing will require reexamination and process adjustment when lead-free soldering is implemented. If a high quality solder paste is used and standard rules for SMT printing are followed, consistent stencil life, aperture release, print definition, high-speed print capabilities and print repeatability may be expected.

Growth Potential in the SMT Screen Printer Market

During fourth quarter 2003, SMT equipment vendors began to see positive signs of growth after a few tough years in the market. The question still remains: What type of growth is expected to take place over the next five years in the SMT industry? This article takes a snapshot of the screen printer market.

The Inside Line

Indium President Reflects on 23 Years in Solder

News

Asia Key to Assembléon Business Strategy

New Products

Reworkable Underfill Encapsulant

Speaking of this Week — June 25, 2004

More big trade show news this week — this time focusing largely on Assembly Technology Expo and SMTA International in the fall. Progress news of various kinds came to the surface this week as well, as did personnel announcements and partnerships. Finally, an EMS giant released encouraging financial news.

Speaking of this Week — June 25, 2004

More big trade show news this week — this time focusing largely on Assembly Technology Expo and SMTA International in the fall. Progress news of various kinds came to the surface this week as well, as did personnel announcements and partnerships. Finally, an EMS giant released encouraging financial news.

Speaking of this Week — June 18, 2004

There's so much going on this week that I can barely keep up with it all. Progress news came fast and furious, and with some important industry events right around the corner, the organizations sponsoring them want everyone to know more about them. Companies and associations continue to cross geographical lines and come together, and there's personnel and financial news, too.


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