Non-conductive Paste Underfill
A non-conductive paste (NCP) underfill and encapsulant, Hysol FP5110 adheres flip-chip image sensor modules to two- and three-layer flexible printed circuits. The paste bonds to polyimide and epoxy adhesive materials. The product can be dispensed automatically, uses a 10-second cure at 180°C, and can be stored at -15°C.
Adhesives Bond to Thermoplastic Substrates
The ARALDITE series of high-strength epoxy and polyurethane adhesives encapsulate, insulate, and bond electronic components and PCBs. The products suit encapsulation and assembly of electronic automotive components, bonding of miniature high-speed telecom circuitry, bonding PCBs for medical devices, and other applications.
Process Optimization: More Profitable than Outsourcing
Outsourcing electronics manufacturing to the Far East continues unabated. Large, high-volume electronics manufacturers, particularly of popular consumer products, will continue to seek low-labor-cost avenues to realize the highest possible margins.
Process Optimization: More Profitable than Outsourcing
Outsourcing electronics manufacturing to the Far East continues unabated. Large, high-volume electronics manufacturers, particularly of popular consumer products, will continue to seek low-labor-cost avenues to realize the highest possible margins.
QFN Layout Guidelines
By Duane Benson, Screaming Circuits - - While QFN and DFN parts are becoming more common, they aren't getting easier to use. Their form-factor advantages are clear — they allow smaller geometries, better grounding, and improved thermal properties over other types of surface mount packages. Most QFNs have a center metal pad on the underside of the part, typically for grounding or heat conduction. It's this center metal pad that makes this form factor so difficult to use.
The Paperless Supply Chain
SMT Magazine interviewed David Wolff, president and founder of P.D. Circuits in Hampstead, N.H., to learn about his company's "from the ground up" approach to managing supply chain data. As a distributor of bare boards, P.D. Circuits interacts with customers as well as suppliers, and manages domestic and offshore operations. It operates almost entirely without paper records, due to a proprietary software system, PDC2006.
QFN Layout Guidelines
By Duane Benson, Screaming Circuits - - While QFN and DFN parts are becoming more common, they aren't getting easier to use. Their form-factor advantages are clear — they allow smaller geometries, better grounding, and improved thermal properties over other types of surface mount packages. Most QFNs have a center metal pad on the underside of the part, typically for grounding or heat conduction. It's this center metal pad that makes this form factor so difficult to use.
The Paperless Supply Chain
SMT Magazine interviewed David Wolff, president and founder of P.D. Circuits in Hampstead, N.H., to learn about his company's "from the ground up" approach to managing supply chain data. As a distributor of bare boards, P.D. Circuits interacts with customers as well as suppliers, and manages domestic and offshore operations. It operates almost entirely without paper records, due to a proprietary software system, PDC2006.
Vitronics Soltec Appoints Saxton President
(February 14, 2007) STRATHAM, N.H. — Mass soldering equipment manufacturer Vitronics Soltec named Aaron Saxton president, effective March 19. Saxton will work out of the company's Stratham, N.H. facility.
Limitations of ESD Gloves and Finger Cots
By Roger Peirce, Simco and Craig Zufelt, Xerox Corporation - - Personnel in electronics and semiconductor manufacturing environments use ESD-safe gloves, finger cots, and other types of hand coverings to prevent contamination on ESD-sensitive devices. While these provide benefits in the battle against ESD damage, severe risks still exist.
Industry Takes Pulse on Lead-free Medical Electronics
By Meredith Courtemanche, assistant editor - - As exemptions to the EU RoHS approach expiration, and China RoHS legislation is set to take effect in March with no exemptions offered for high-reliability electronics, the electronics assembly industry is taking measures to ensure that lead-free medical equipment meets reliability, cost, and market requirements. The responsibilities of OEMs and design firms, suppliers, and EMS providers vary.
Vitronics Soltec Appoints Saxton President
(February 14, 2007) STRATHAM, N.H. — Mass soldering equipment manufacturer Vitronics Soltec named Aaron Saxton president, effective March 19. Saxton will work out of the company's Stratham, N.H. facility.
Limitations of ESD Gloves and Finger Cots
By Roger Peirce, Simco and Craig Zufelt, Xerox Corporation - - Personnel in electronics and semiconductor manufacturing environments use ESD-safe gloves, finger cots, and other types of hand coverings to prevent contamination on ESD-sensitive devices. While these provide benefits in the battle against ESD damage, severe risks still exist.
Industry Takes Pulse on Lead-free Medical Electronics
By Meredith Courtemanche, assistant editor - - As exemptions to the EU RoHS approach expiration, and China RoHS legislation is set to take effect in March with no exemptions offered for high-reliability electronics, the electronics assembly industry is taking measures to ensure that lead-free medical equipment meets reliability, cost, and market requirements. The responsibilities of OEMs and design firms, suppliers, and EMS providers vary.
First Article Inspection: Understanding the Problems
In electronics manufacturing, the first article is built by SMT lines and sent to the inspection department to check the product assembled against its bills of materials (BOM), ensuring that the programs contained in the pick-and-place machine are correct, and that parts are placed into the feeders in the correct locations.
First Article Inspection: Understanding the Problems
In electronics manufacturing, the first article is built by SMT lines and sent to the inspection department to check the product assembled against its bills of materials (BOM), ensuring that the programs contained in the pick-and-place machine are correct, and that parts are placed into the feeders in the correct locations.
APEX Product Highlights
Following is a preview of some products that will be spotlighted at the IPC Printed Circuits Expo, APEX, and the Designers Summit, February 20-22, 2007, in Los Angeles. Look for more APEX reviews in the February issue of SMT, and comprehensive coverage online and in upcoming e-newsletters.
The Evolution of Environmentally Conscious Material Management
By Marjory Craw-Ivanco and Andrew Dreyer, Celestica - - Now that the July 1, 2006, EU RoHS deadline has come and gone, the electronics industry is left looking back — trying to determine the impact that this legislation has had on our industry. At one EMS provider*, through work with a diverse global customer base, it has been noted that this legislation has affected not only OEMs that place product onto the market, but many other companies as well.
ERP and PLM: Addressing Differing Manufacturing Needs
By Chuck Cimalore, Omnify Software - -
There is some confusion in the industry as to what role ERP and PLM systems play in a company's business process. Clarification of the key features of ERP and PLM, where they fit in the product development and manufacturing process, and how integrating these environments can deliver positive results is important for manufacturers to understand why each is critical to success and gain the most from their investment.
Taiwan Maneuvers in the Outsourcing Game
By Meredith Courtemanche, assistant editor - - "Outsourcing" has become a term intrinsically linked with China, but with several expansions, collaborations, and acquisitions, Taiwan is emerging as a diverse, lucrative region for contract manufacturing. What are Taiwanese companies doing? Outsourcing to China, of course.
Recollection: Thoughts on the EMS Industry
This recollection by Brian Throneberry is excerpted from the upcoming book, "From Vacuum Tubes to Nanotubes: An Amazing Half Century — The Emergence of Electronic Circuit Technology 1957-2007," published by IPC and released in conjunction with the IPC's 50th Anniversary, which will be celebrated at APEX 2007 February 18 – 22 in Los Angeles.
Supply-chain Management: Asset Recovery & Disposition
Pulitzer Prize-winning author and Amherst professor Joseph Ellis, in commenting about his book Founding Brothers, made the following observation: If Thomas Jefferson and John Adams were to be resurrected, they would surely be impressed with our scientific and technological advances. But, they would likely be more impressed with the sheer quantity of material goods that we have.
Highlights from Implementing Lead-free: A Hands-on Workshop
By Michelle M. Boisvert, managing editor - - Will the industry still have questions about lead-free process implementation after the July 1st deadline? When planning Implementing Lead-free: A Hands-on Workshop, in conjunction with Rochester Institute of Technology (RIT), we asked industry experts, who noted that the industry was not ready for RoHS; and likely would not be fully compliant after July 1st. Following are some highlights of the workshop.
Understanding Your Soldering Choices
By Ray Prasad, Prasad Consultancy Group - - There are various soldering methods such as hand soldering, wave soldering, reflow soldering (vapor phase, convection reflow), and selective soldering that are used to join two similar or dissimilar metals or alloys at different temperatures. Some of these processes have been around for many years, while others were introduced more recently. This article outlines some things to consider when selecting the most appropriate soldering solution.
Process Verification: Cleaning Inspection
By Tom Forsythe, Kyzen Corporation - - Process cleaning inspection is an inherent part of the electronic assembly verification process. The importance of inspection amplifies as new lead-free designs gain global market acceptance. Gaining an understanding of inspection options, and the information each provides, gives technicians knowledge of how these inspection techniques build on each other to enable statistical process control (SPC). This article reviews common techniques.
Realizing the Expectations of AOI
By Matthew Holzmann, Christopher Associates - - With the resurgence of the electronics interconnect manufacturing industry there is renewed emphasis on AOI. Long-time users are in the market for new and improved technology, while other companies are ready to implement AOI on a wider scale. Price competition has thinned profit margins for both users and vendors, and yet AOI has still not achieved its original performance goals.
More ATExpo Product Highlights
Following is a highlight of products to be featured at the 2006 Assembly Technology Expo, co-located with SMTA International in Rosemont, Ill., September 26 – 28. Check out SMT's September issue for more products, and look for more previews on our Website, leading up to the show.
SMTA ToolBox
Lead-free Is Here. Where Are You?
By Peter Biocca - - The European Union's (EU's) RoHS Directive is here, and the Chinese version is coming soon — bringing with it another deadline, more confusion, and additional changes. RoHS has been the main topic at conferences in the last four years. Where do we stand today?
Joe Fjelstad Releases Flexible Circuit Technology, 3rd Edition
The third edition of Flexible Circuit Technology features new technologies and applications that have developed over the eight years since the second edition was published. This updated version on interconnection technology will be available from BR Publishing of Seaside, Ore., as a full-color PDF e-book, or in a traditional printed format.
Outsourcing Practices and Ethics Scrutinized
By Meredith Courtemanche, assistant editor - - Outsourcing is commonly perceived as a de-facto practice among consumer electronics manufacturers. Despite this, there is actually no de-facto standard across the various electronics manufacturing markets. In "Apples to Pomegranates, Outsourcing Across the Mobile Phone and PC Industries," Jeffrey Wu found that the two sectors do not behave similarly in the outsourcing realm.
High-speed Placement of Wafer-level Devices
Advanced chip packages leverage the design advantages of bare die. Suppliers and manufacturers facing the challenge of placing more die at higher speeds, eliminating intermediate packaging, and feeding flip-chip devices at high speeds from wafer format, will meet the demands by combining SMT and semiconductor placement processes into one high-speed workflow.
AIM Opens Shenzhen Campus
SHENZHEN, China - Responding to an expanding customer base throughout China, AIM has opened a campus, including manufacturing and office buildings, two warehouses, and a dormitory, in Shenzhen, China, for its full range of tin/lead and lead-free solder pastes, bar and wire solders, and liquid fluxes.
Benchtop Robots – Making Their Mark on the Assembly Line
By Deepa Mathew, Frost & Sullivan analyst - - Benchtop robots for low-volume, high-mix production are becoming more important to European and North American assemblers. Mathew argues that a shift of high-volume, low-mix manufacturing from these regions to China — and other regions offering low wages and large raw material sources — has prompted more NPIs/R&D to be done in low-volume, high-mix regions. For traceablity, robots detect missing, skewed, or mismatched components.
SMTAI — Investing in Training
By David Raby - -
As a valued industry colleague, you will be interested in the details of our 2006 SMTA International conference program. Your colleagues on the SMTAI Technical Committee have built on this success as they developed the comprehensive program of tutorials, paper sessions, and symposiums being offered this fall.
Developing ATExpo's EASi Line
Around January each year, Rick James of Electronics Manufacturing Solutions, Inc. starts to think about the assembly line. But he's not thinking of ways to make the line at his Mooresville, Ind.-based contract manufacturing facility leaner, faster, or more productive. He's thinking simple and inexpensive — and to September. James coordinates the Electronics Assembly Line (EASi Line), located in the Electronics Assembly Pavilion of the ATExpo, September 26-28, 2006, in Rosemont, Ill.
Shea Keynote Looks Ahead
NASHUA, N.H. — Attentive to the electronics industry's burgeoning environmental responsibility, and the challenges associated with multiple, global legislative initiatives, Dan Shea, chief technology officer (CTO), Celestica, will offer knowledge and insight in his keynote address "Cradle to Rebirth — The Electronics Industry Goes Green," on October 17, 2006, at Implementing Lead-free: A Hands-on Workshop.
Conductive Inks Rework the Board
By Meredith Courtemanche, assistant editor - - Electrically-conductive inks challenge traditional etched or plated copper traces in circuit boards. Fast-drying and highly stable at room temperature, inks enable high-speed assembly with reduced product waste. Additional concerns, such as hazardous waste management and restrictions, as well as thermal management and cure time, determine the viability of conductive inks vs. copper traces on boards.
Celestica's Dan Shea Keynotes Implementing Lead-free: A Hands-on Workshop
NASHUA, N.H. — Sharing his extensive knowledge of the electronics industry's shift toward environmental responsibility, Dan Shea, chief technology officer (CTO), Celestica, will present the keynote address "Cradle to Rebirth — The Electronics Industry Goes Green," on October 17, 2006, at Implementing Lead-free: A Hands-on Workshop, at the Rochester Institute of Technology's (RIT) Center for Manufacturing and Assembly (CEMA) in Rochester, N.Y.
PennWell's SMT Magazine and the Rochester Institute of Technology Center for Electronics Manufacturing and Assembly Announce Implementing Lead-free: A Hands-on Workshop
Nashua, NH?PennWell Corporation's SMT Magazine and Rochester Institute of Technology's (RIT) Center for Electronics Manufacturing and Assembly (CEMA) together announce Implementing Lead-free: A Hands-on Workshop, October 16-19, 2006, at the RIT campus in Rochester, N.Y.
PCB Designer's Notebook: Improving Industry-developed Standards
By Vern Solberg - -
There are a number of standards that have been developed within our industry domestically and internationally. Some standards are created as guidance documents, while others specify materials, product requirements, and qualification criteria. Keeping these standards current and up-to-date is a daunting challenge; we often are asked to comply with a document that is several years old.
7/1/2006: Gone But Not Forgotten
By Meredith Courtemanche, assistant editor - -
With the scramble to the RoHS deadline past, many companies must now look further down the road to determine their long-term viability. The July 1st implementation date represented a milestone for conversion to lead-free, but the future for businesses interested in the world marketplace will require meticulous record keeping for every product sold. Audits can be anticipated for any company exporting to the EU.
Snap, Print, & Flip: Paste Printing for QFN Rework
As the industry looks to implement smaller components, MLFs such as QFNs that enable higher PCB component densities, are being incorporated into space-constrained products.
NEPCON NEC -- SMT Across the Pond
By Michelle M. Boisvert, Managing Editor -
With 415 exhibiting companies and 3,340 visitors, NEPCON NEC, May 9-11, 2006, in Birmingham, U.K. was a productive show for those involved — generating several qualified leads and interest.
Technological Aspects of the RoHS Directive
Exempt Industries: RoHS-5 Compliance and Mixed Technology -
By Lev Shapiro -
It is well known that the European Union's (EU's) RoHS Directive, which takes effect on July 1, 2006, limits the use of six materials, of which the removal of lead is causing the heaviest burden on the electronics industry — forcing a number of process, raw materials, components, PCB, and equipment changes.
SMT Celebrates VISION Awards on a Grand Scale
It was a time for black tuxes, laser lights, and glittery gowns when SMT celebrated the VISION Awards on February 8, 2006, at the Anaheim Marriott during the APEX/IPC Printed Circuits Expo.
NEPCON Shanghai Sees High Attendance
Held April 4–7, 2006, in Shanghai's Everbright Exhibition and Convention Center, and jointly organized by Reed Exhibitions and the CCPIT — Electronics Sub-Council, NEPCON/EMT China 2006 saw 16,363 attendees convened to network and discover the latest technologies from 650 industry players spanning 22 countries.
Newsmakers
Bob Solomon joined StratEdge (San Diego) as senior account manager. Solomon brings with him engineering, design and development, and sales knowledge in the semiconductor, telecom, medical, aerospace, and defense industries. He will be in charge of the company’s DC to 50+ GHz packages and assembly and test services.
EMA Targets RoHS Compliance in Design Process
(March 29, 2006) ROCHESTER, N.Y. — Adding to its recent RoHS/WEEE compliance technologies, EMA Design Automation integrated Omnify software, a data management system, into its engineering data management (EDM) solution. After having used Omnify's software internally to manage RoHS data for customers, EMA Design Automation realized it could also benefit their customers, giving them the ability to design-in RoHS complexities and issues from the beginning.
Conference Focuses on Green Manufacturing, Recycling
(March 29, 2006) MINNEAPOLIS — Some believe that China may be nearly five years ahead of the U.S. in WEEE/RoHS compliance. With the China RoHS law slated to go into effect March 1, 2007, the Third International Conference and Exhibition on Green Manufacturing, May 13-14, 2006, in Tianjin, China, may offer attendees additional compliance information.
SPECIAL FEATURE: Choosing the Proper Workbench or Workstation
On the surface, you might think that purchasing a workbench or workstation is a relatively simple proposition. Your employees have work to do, and they need an efficient, comfortable, and practical place in which to do it. But before you can be sure that you are getting the correct workbench, you need to perform some upfront work yourself. There are, in fact, many variables to consider. -
By James Anderson and Ron Santoro, product managers, Lista International
SMT Magazine Honors 2005 VISION Awards Winners
ANAHEIM, Calif. — SMT Magazine announced recipients of its 2005 VISION Awards during the 14th Annual VISION Awards ceremony and celebration, held February 8, 2006, at the Marriott Hotel in Anaheim, Calif. Nearly 300 people attended the awards ceremony and celebration.
Solectron, Raven Beta Test IPC RoHS Lead-free Certification Program
When the IPC approached technical content experts with the idea of developing a lead-free process certification program, all were eager to join, said John D. Kania, director of government relations/industry programs.
Materials Science Program Addresses Reliability Concerns
When speaking with electronics assemblers, Indium Corporation of America discovered there are many challenges to overcome, including thermal management issues resulting from increased power demands and component miniaturization. Solder joint reliability was the #1 concern for assemblers, said Ross Berntson, director of solder products. In response, Indium Corporation developed its Materials Science Program for Reliability.
Sola Notes Customer-centric Model Key to Survival
By Michelle M. Boisvert -
Listening to your customer was just one of the strategies that keynote speaker Jure Sola, CEO and chairman of the board at Sanmina-SCI, shared with attendees on Wednesday, February 8. Sola noted that the customer-focused strategy is one way to compete in the global world of electronics manufacturing.
SMT Awards Celebrate VISION
During an awards ceremony at the Anaheim Marriott on Wednesday, February 8, 2006, SMT Magazine honored winners of the 2005 VISION Awards, recognizing innovative and visionary products and services within the surface mount industry.
MS2 Eliminates Dross in Wave Soldering
Dross build up in wave solder pots can contribute to additional soldering costs, reduced efficiency, and defects. On a recent visit with Los Angeles-based P. Kay Metal (Booth 2635), president Larry Kay introduced us to the MS2 100 dross elimination surfactant for lead-based wave solder pots, and the MS2 200 LF for dross removal in lead-free solder wave solder pots.
Benchtop AOI Offers Low-cost Solution
The B2 Benchtop automated inspection system (AOI) for post-reflow PCBs from YESTech offers faster throughput and improved board handling. While visiting the company's San Clemente, Calif., facility, Don Miller, YESTech president, explained how the company's adaptive and flexible approach to inspection has disrupted the North American market.
Non-contact Surface Profiling Improves Board Quality
Confocal 3-D profiling systems can be used at any step in the fabrication or assembly process to inspect and analyze visible features on outer layers of PCBs. Unlike inline machines dedicated to post-solder and post-component placement inspection, these systems feature versatile 3-D measurement, visualization, and analysis tools used for off-line quality control and defect diagnosis. -
By Ciaran Murphy, Taylor Hobson Ltd.
Register Now for the Lead-free Success Stories Webcast
NASHUA, N.H. — SMT, in collaboration with Advanced Packaging and Connector Specifier Magazines, will host a "Lead-free Success Stories" Webcast on February 15, 2006, at 1:00 p.m. EST.
CEMA Offers Industry Trainings, Lead-free Resources
The Center for Electronics Manufacturing and Assembly (CEMA) at the Rochester Institute of Technology (RIT) is an academic research lab offering the Electronics Packaging industry research services, failure analysis, process training and development, consulting, and laboratory rental.
Conferences Abound — But One Stands Out
By Gene Weiner -
Fall and spring used to be known as the meeting and show seasons. Now with the addition of many new shows around the globe, Webinars and the "flattened world," we have an overload of oft-repeated data and technology. Much is old news, yet there are a few gems still out there.
WEEE Registration Logistics
WEEE should have been adopted in the EU by August 2005; however, the UK, France, Italy, Poland, Estonia, Finland, Greece, and Malta have yet to enforce the legislation.
Inspex, Inc. Offers X-ray Inspection Services
(September 6, 2005) ORANGE, Calif. — Inspex, Inc. introduced quick-turn X-ray inspection services for PCB and semiconductor electronics packaging and assembly, including BGA, QFP and PLCC components on all types of assemblies, semiconductor components, active and passive devices, multiplayer PCBs, PCB fabrication and molded and encapsulated components.
SMT, SMT China Announce Call for Papers for Upcoming Conference
SHANGHAI — SMT, SMT China and China Electronics Appliance Corporation (CEAC) announce the Call for Papers for the 2005 SMT China International Conference on Emerging Technologies & Lead-free Challenges. Held annually, SMT and SMT China Magazines will focus on SMT, emerging technologies and hot topics for modern assembly methods.
The SMT Assembly Process
The Electronic Assembly Suppliers’ Initiative (EASi) Line, featured at ATExpo, in conjunction with the SMTAI, September 26-29, 2005, at the Donald Stevens Convention Center in Rosemont, Ill., and coordinated by Electronics Manufacturing Solutions, Inc., demonstrates a fully functional manufacturing line from start to finish.
Productronica '05 Granted Trade Fair Certification
(July 6, 2005) CHICAGO — The U.S. Department of Commerce has granted Productronica 2005 Trade Fair Certification. The show is slated to take place November 15-18, 2005, in Munich, Germany.
16-bit Imaging Chain Captures Hi-res Images
(July 6, 2005) GARBSEN, Germany — The HDX-ray 16-bit Imaging Chain from FEINFOCUS is said to capture high-resolution images with qualities similar to film, in real time. HDX-ray provides digital images for inspecting applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects, hybrids and encapsulants.
PRODUCT SPOTLIGHT: Automated High-volume Rework
The Fineplacer Micro HVR system is designed to address the high-volume rework market, where hundreds of boards must be repaired due to high value, component scarcity or in situations where manual rework is illogical. This tool allows hands-free, automated sequencing of repair steps: component de-solder and discard, residual solder removal and component re-solder.
