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Improving Design, Manufacturing and Assembly Teamwork
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Color CCD Camera

The TMC-7DSP 0.5" color CCD camera is said to provide color fidelity and full broad-band response in a high-resolution 0.5" CCD format. It outputs VBS (NTSC or PAL), Y/C or S-Video RGB and operates with a high-speed variable shutter (1/60 to 1/10,000 seconds) with through-the-lens auto/manual white balance, AGC on/off switch, and manual gain and hue controls. The DSP circuitry reportedly delivers a stable performance over a variety of conditions. The low-light sensitivity is 2 lux at F 1.4.

Convection Reflow Ovens

The QRS Plus Series of convection reflow ovens reportedly features a new conveyor system designed for reliable operation and low maintenance. The conveyor uses a chain-transfer system with ball bearings in all shafts and drives. An automatic independent pin-chain tensioning system is said to ensure correct tension as the chains expand and contract with changing oven temperatures. Extended rails reportedly allow for easier conveyor interface and ensure alignment between the oven and any SMEMA-com

Hot-bar Bonder

The Model 4000 is a computer-controlled bonding system for ACF, heat-seal and reflow-solder applications. It now includes Windows NT-based software capabilities for set up, user operation and process control across a variety of hot-bar applications. Said to be a configurable system, this model reportedly can drive up to four independent, precision hot-bar temperature controllers and can be configured with a variety of X-Y and/or rotary-motion systems. It is suitable for low- to medium-volume sol

Precision-soldering System

The Pana Point Plus (SB) Precision-soldering system is available in medium and extra-large sizes. This robotic platform reportedly provides automation of manual operations with minimal capital investment. The platform is said to offer conveyor handling and optional in/out dual shuttle for both linear and point-to-point soldering. This platform can be upgraded to the company`s Soft Beam, noncontact light-beam-soldering system.

Desoldering Tips

Endura Desoldering Tips reportedly feature an anti-clogging riser tube to ensure that solder is delivered to the collection chamber in a molten state. This is said to help prevent clogging and allow continuous work flow. The tips come in three configurations: Thermo Drive Tips, which deliver more heat and last longer; Precision Tips, for desoldering fine through-hole leads or leads in tight areas; and Precision Flo-Desoldering Tips, to remove solder from small pads and vias.

CSP and µBGA Test Applications

The 0.010" diameter Fuzz Button for test sockets is said to enable the company`s high-performance test sockets to employ 0.5 mm pitch. These small, cylindrically shaped electrical contacts with a low inductance and 0.100 k actuation performance are suitable for µBGA and CSP applications. Their composition is gold-plated beryllium-copper, molybdenum, tungsten and nickel-chromium. Suitable for electrical conduction for DC-to-microwave frequencies, they come in sizes from 0.010 to 0.50".

The company has combined two essential elements of the automated soldering process-board-touch sensing and the soldering iron-into one, making the soldering iron tip the actual board-touch sensor

The company has combined two essential elements of the automated soldering process-board-touch sensing and the soldering iron-into one, making the soldering iron tip the actual board-touch sensor. This "Sure-touch" technology is designed to simplify the soldering process and reportedly guarantees contact between the soldering iron and the solder joint itself for greater consistency and fewer defects. There is said to be no need for special programming to accommodate variations in height of indiv

Floodlight Curing System

The ELC-4001 is a high-energy, solid-state advanced floodlight curing system that reportedly delivers greater than 100 mW/cm2 of UV energy at a peak wavelength of 365 nm. The visible-light version is peaked at 450 nm and generates greater than 500 mW/cm2 of output. A 400 W lamp, available in either the standard 365 nm or 298 nm wavelength for applications requiring shortwave UV, is available.

Flip Chip Underfill Encapsulants

The ME-525 series of capillary-flow underfill encapsulants for flip chip devices protect the chip/joint interface by redistributing thermal stresses stemming from CTE mismatches between the board and the die. The thermoset materials isolate the solder bumps from forces that might fracture the interconnects, adding to performance and reliability. The series is said to be a high-Tg, low-CTE liquid epoxy formulated for high flow speed under the chip. The rheology reportedly permits such flows to pe

Assembly Service

A PCB assembly and modification service, this company also specializes in cables and harnesses. Its assembly line includes a vision-system-assisted stencil printer, a surface mount placement unit handling 4,000 cph (including testing of passive and discrete devices), IC insertion including DIPs (including lead trimming), and semiaqueous/closed-loop cleaning. Other features of the assembly line include: wave soldering performed under MIL-STD-2000, high-temperature standards; in-circuit tests usin


Sn/Ag/Cu Solders

This range of lead-free solders provides environmental benefits in meeting the WEEE Directive for 2004. Although the alloy (Sn/Ag/Cu) has a higher melting point than conventional tin/lead eutectics, it reportedly has a high resistance to thermal fatigue together with improved joint strength. Available as RMA and RA solder pastes and as RMA cored solder wire, the paste features the company`s Type 3 powder, which has an 11 percent flux content, 0.06 percent halogen and a typical viscosity of 180 P

Large-board Pick-and-Place

The 4796L high-speed placement machine is reportedly able to handle board sizes up to 18 x 20" (457 x 508 mm). It is said to achieve 0.1 second tact time for components ranging from 0201 up to SOP16s. The machine uses direct-drive technology, reportedly allowing theta corrections to occur on the fly for large part placement.

Semiautomatic Benchtop Stencil Printers

The Speedprint SP200 features programmable pressure, speed and stroke print parameters; variable board/stencil separation; flexible system tooling; and a mylar alignment system. It is available with or without vision. The SP100 is a front-loading, semiautomatic benchtop stencil printer that features vertical board/stencil separation, flexible system tooling, and adjustable pressure, speed and stroke print parameters.

Automated Placement/Rework Station

The Pinnacle 500R rework system is an entry-level unit able to handle boards up to 14 x 20" and 2" high components. It is said to be specifically designed to rework µBGAs, BGAs and QFPs. The system aligns, places and reflows surface mount components. It includes an independent heating nozzle and vacuum pickup tube, thermal cycle libraries, and look up/down split-image component placement. Its Windows-based software program allows the user to create a rework profile and store it in memory. A

BGA-to-PGA Adapter

The AB356G-1 BGA-to-PGA adapter reportedly converts a 356-lead BGA with 1.27 mm ball pitch to a standard 20 x 20 footprint. The adapter is routed with a one-to-one interconnect and can be used for prototyping as well as production requirements where a reliable socket solution is required. It is available in single pieces or in pallet form for high-volume applications. The company also offers assembly services.

Photoetched Shielding Components

The company uses photoetching for cost savings to manufacture board-level shielding components, such as custom fences with removable covers. This process is said to improve design flexibility, shorten lead times and eliminate hard tooling costs. Photoetching also reportedly allows the fabrication of board-level shielding components with close tolerances that cannot be duplicated by other methods. Fences, covers, through-holes, slots and mounting pins can be designed in any configuration.

LGA Socket

The cLGA socket system reportedly enables solderless chip-to-board and board-to-board interconnection. This solderless system is said to allow the user to avoid the termination and reliability problems caused by thermal expansion in high-pin-count devices. The socket uses a conventional BeCu contact with 30 µin Au over Ni plating. This low-profile connector design yields a 0.94 nH inductance. When fully mated, it has a total deflection of 0.012" with an average of 50 g normal force per cont

Surface Mount Adapters

The company now offers several new sizes of the PolyPod surface mount adapters for QFP packages. The QFP surface mount base can be soldered to a PCB and connected to emulators or logic analyzers, and can be used as a socket. The surface mount base reportedly has options for receptacles that can be used to interconnect to any test system, or the receptacles can be used to add height to extend the test equipment off the board. A socket cover is available.

Lamps

The company`s improved standard gooseneck design reportedly does not sag or sway for environments requiring a vibration-free light source. The gooseneck is covered by PVC sleeving that is said to resist damage and wear. This new design is said to free operators from the strain and stress of having to physically adjust to their equipment. The lamps are ergonomically designed for ease-of-use and engineered for heavy production schedules.

Pressure-formed Housing

These pressure-formed housings, which are designed to protect PCBs, reportedly are manufactured from a pliable, heavy-gauge plastic called 0.060" Kydex. Each housing is pressure-formed from roll stock, hole punched and routed for air ventilation


Exatron Labels

This company offers a complete line of labels and ribbons for direct purchase for use on Exatron labeling equipment. Both stock and build-to-order labels are manufactured in white polyester, tan and white Kapton. They are reportedly engineered to high performance standards and survive all electronic processes. Providing one ribbon for all materials is said to ensure less changeover and label waste, improving product efficiency levels.

2-D Code Reader

Quadrus 2.0 is an upgraded, fully integrated 2-D code reader that is said to make it easier and more affordable for electronics manufacturers to use Data Matrix in their lot-tracking systems. It reportedly combines the CCD technology of a vision system with the ease of use and functionality of a bar-code scanner. By using a single setting, the product reportedly is capable of reading high-contrast printed black-on-white labels as well as low-contrast, laser-etched labels. The 2.0 version reporte

Automatic Label Placer

The DataPlace Model 100LP automatic label placer features placement rates of 3,600 pph, a dual-nozzle head, up to three 600 dpi printers and integration into existing manufacturing processes, reportedly without compromising standards for process integration and throughput. Its machine design is said to capitalize on the company`s experience with pick-and-place machines and vision systems.

Label Placer

The Model 8330 Label Placer is a high-speed, flexible label placement system that is said to be capable of applying a range of labels on PCBs at speeds up to 900 labels per hour. It can be used as part of an off-line or in-line process and is available in single- or dual-lane configurations for maximum throughput. As each PCB is fed into the system, adjustable tooling pins orient each board for label placement. An overhead gantry-style X-Y positioning system moves a placement head to the feeders

Conference

The NEPCON West conference offerings are separated into several types of classes: Tutorials, Professional Advancement Courses, Workshops and Technical Sessions.

Interconnection Seminar

Held Wednesday, March 1, 9:00 a.m. to 4:00 p.m., this seminar, sponsored by the International Institute of Connector and Interconnection Technology, focuses on the basic connector areas needed for the everyday challenges of interconnection design, selection, evaluation and procurement. Taught by industry-recognized experts, it presents practical knowledge that will cover material selection through functionality, testing and performance criteria.

Contract Manufacturing Symposium

Presented by Sharon Mecum and Dr. Charles Mullen of Technology Forecasters Inc., "The Contract Manufacturing Game: Skills, Tools, and Insights for OEMs and Contract Electronics Manufacturers," will be held Tuesday, February 29, from 8:30 a.m. to 2:30 p.m.

Advanced Packaging Symposium

Held on Monday, February 28, from 9:00 a.m. to 4:00 p.m. and chaired by John Lau, Express Packaging Systems, the symposium will address wafer-level packaging and interconnection.

Contract Manufacturing Senior Executive Forum

Presented by Technology Forecasters Inc. on Monday, February 28, from 7:30 a.m. to 7:00 p.m., this forum will be chaired by Pamela Gordon, certified management consultant and president of Technology Forecasters Inc.

Packaging Session

The packaging session, Component Packaging for the 21st Century, will be held Tuesday, February 29, from 1:00 to 3:00 p.m. Packaging experts address the issues PCB assemblers need to understand to build the next generation of electronics products, including the impact of area-array packaging on the assembly floor, thermal management concerns, the effects of lead-free solder on component packages, and more.


Keynote Addresses

Tuesday, February 29, at 8:00 a.m., John Madden, sportscaster/analyst, author and football coach, will kickoff NEPCON West 2000 with a keynote speech.

Pick-and-place Evaluation Center

The Pick-and-place Evaluation Center, located in Hall B, provides a strategic approach to evaluating assembly pick-and-place equipment. Four high-speed placement machines are on display, set up side-by-side, with third-party technical experts providing in-use feedback and interpretation of manufacturers` published machine specifications.

Contract Manufacturing Demonstration Line

Located in the Contract Manufacturing Demonstration Area in Hall C, the Contract Manufacturing Demonstration Line is a complete SMT line that produces live products for one of the participating contract manufacturer`s customers.

Low-volume Batch Assembly Line

The low-volume batch line demonstrates the processing of flip chips, CSPs and PBGAs in a low-volume production line using low-volume production and prototyping equipment.

Lead-free PBGA Assembly Line

The PBGA line features the full population and assembly of a BGA lead-frame strip containing the circuitry and bonding pads for four PBGA devices. The die-attach process demonstrates the population of a laminate strip containing four PBGA packages containing gold bonding pads for gold-to-gold interconnect COB wire-bond die and the BGA package. The wire bondable die is attached with a silver-filled adhesive, followed by thermal cure, plasma clean and die wire bonding to the pad sites for each dev

Area-array Assembly Line

The Area-array line features the assembly processes, materials and methods necessary for forming CSPs. The die-attach process shows the population of an organic strip containing multiple package interconnects with chip-on-board (COB) wire-bond die for the formation of CSPs. Processes featured include dispensing die attach and subsequent device placement with a single machine, curing the die-attach adhesive, plasma cleaning the wire-bond pad sites, ball-wedge gold capillary wire-bonding, dispensi

PCMCIA Assembly Line

The PCMCIA line highlights the assembly of a high-volume consumer electronics product that incorporates many high-technology facets, including advanced design techniques, a variety of high- pin-count component packages and die, along with cutting edge PCB fabrication technology. The assembly equipment is outfitted for processing the thin laminate that is typically used in PCMCIA panels.

Lead-free HDI Assembly Line

The evaluation and use of lead-free process materials has gained a lot of interest throughout the industry because of legislation that would ban lead use in the electronics industry. The lead-free HDI assembly line demonstrates the attachment of SMDs, BGAs, QFPs, and CSPs using a lead-free solder, lead-free component metallizations and a lead-free PCB pad finish for the top- and bottomside attachment processes.

Y2K Assembly Line

The Y2K assembly line is designed to allow attendees to witness a component attachment process at very low temperatures using a solder alternative. The line features bottomside in-line placement of bar-code labels, as well as the deposition of a solder alternative for the mechanical attachment of quad flat packs (QFP), BGAs, a flip chip and standard surface mount devices (SMD). The devices are cemented in place with a low-temperature heating process, and the flip chip device is underfilled with

New Silicon Chip

The QRC 1284X2 chip is designed to be the single-chip solution to IEEE 1284 parallel port line filtering and termination. The 28-pin QSOP package uses thin film (tantalum nitride) on silicon technology. In each chip, there are 17 capacitors, 17 pull-up resistors and nine termination resistors, and for each of the 17 signal lines, a diode structure provides 8 kV of ESD protection.


AOI System Introduces Synthetic Component Library

A universal component library of synthetic images was introduced as a standard feature on ViTechnology`s automated optical inspection (AOI) systems. This inspection and analysis capability reportedly allows for 100 percent component inspection at maximum throughput speeds. It is accomplished by analyzing key geometric features of runtime component images, as opposed to comparing gray-scale values to reference images or "golden boards."

IRC Expands Capabilities

Resistor manufacturer IRC expanded its series of integrated passive networks to include chip scale packaging (CSP). These integrated passive networks can be configured for a wide range of line termination and electromagnetic interference (EMI)/radio-frequency interference (RFI) filtering functions that are designed to meet the demands of wireless voice and data communications applications where high-density and high-frequency performance are critical.

Single Piece Board-to-board Connector

The new Series HO connectors have surface mount contacts on one side and pressure-actuated pad mating contacts on the other. Pads on the mating board do not have to be gold plated for further cost effectiveness, and they may be sized to absorb board misalignment. These low-profile connectors permit adjacent board spacing of only 3.9 mm (0.154"). Contact pitch is 1.25 mm (0.049") with 22 dual-row circuits provided. Current rating is 1.0 A AC/DC (250 V AC/DC). Contact material is copper alloy, cop

Resettable Circuit Protection Device

The new 2.6A 1812 Series surface mount, positive temperature coefficient resettable circuit protection device has been designed to protect multiple USB ports. It offers 0.050 W maximum on-board resistance, and protects electrical circuits against over-current conditions in a wide range of computer and peripheral applications, including USB ports, PC cards, modems, keyboard and mouse ports, printers, and network cards. The device conforms with USB standard voltage drop and safety requirements for

Subminiature TCXO

This subminiature TCXO is designed for portable, telecommunication, data and test equipment applications. The 312BE TCXO, which measures 7 x 5 x 2 mm, is said to be ideal for surface mount applications and has low-profile packaging with a ceramic base and a metal cover. The 312BE has a frequency range of 12,600 to 19,800 MHz. Frequency tolerance at 25∞C is -0.5 to 0.5 ppm, and frequency stability is -2.5 to 2.5 ppm over the operating temperature range of -20∞ to 75∞C. Storage t

Aluminum-electrolytic Capacitors

The new EYX snap-in aluminum-electrolytic capacitors were designed for use at high ambient temperatures and with high alternating currents. The capacitors are intended mainly for use in automotive and consumer electronics, as well as in telecommunications, where they are said to withstand temperatures of up to 125∞C and loads of up to 400 V. The capacitors are available in capacitance values from 47 to 33,000 µF with (nominal) voltage ratings of 10 to 400 V. They come in industry stan

Flat-top Inductor

The Model DR332 Dataline Series inductors provide filtering of RFI in a surface mount package that is compatible with automated assembly equipment, high-temperature soldering and immersion cleaning processes. The inductors are said to provide a cost-effective means for filtering RFI in high-speed data transmission lines. These data line chokes filter common-mode interference induced on the data transmission lines at frequencies of 10 kHz and higher while allowing data signals of up to almost 100

Ultra-thin Inductors

This new line of Power Wafer inductors is designed to meet the height restrictions of PC cards and other low-profile applications. The LPO2506 surface mount power inductor series has an above-board height of 1.19 mm and a footprint of 7.87 x 9.14 mm. Custom designs can reduce the height to as low as 0.9 mm, depending on board thickness. An on-board version with an overall height of 1.65 mm is also available. The series can handle currents up to 1.9 A rms. There are 15 inductance values ranging f

EMI Gaskets

GORE-SHIELD SMT gaskets can be installed with standard pick-and-place equipment. The gaskets are said to decrease the total cost of EMI shielding in cell phones and other wireless infrastructure. Rather than a continuous bead, the gaskets are a series of small GS 5200 pads that have a solderable shim attached and are packaged in EIA-standard tape-and-reel format. Using high-speed chipshooting SMT equipment, these pads are placed on the ground trace of the PCB, at typical rates of nine per second

Thin-film Chip Resistors

There are three different chip resistors in this line. The first are the rectangular thin-film chip resistors, designed for high precision with stability and reliability. They are said to be suitable for reflow soldering. Second in the line are ultra-precision thin-film chip resistors, designed to offer minimized aging with low TCR and tolerance values of ±5 ppm per ∞C and ±0.05 percent, respectively. Third in the line are MELF thin-film chip resistors, made of a tantalum alloy.


Extended Temperature VCXOs

Two variations of the K1526 VCXO Series, the K1526 EAMX and the K1526 AQB, are now available. They are identical in most respects to other units in the series, having a four J-lead SOJ-20 industry-standard footprint with frequency performance from 2 to 80 MHz. Both versions provide temperature stability (±13 ppm maximum) over broad industrial temperature ranges. The products were originally developed for a telecommunications company. The primary application for both devices is to provide ph

Electromechanical Supercapacitors

The new BestCap electromechanical supercapacitors are based on an aqueous chemistry known as rechargeable hydrogen ion solid state (RHISS). This technology is said to be ideal for high-power pulsing and is designed for use in hand-held and mobile communications equipment to extend battery life. RHISS reportedly also results in an environmentally friendly nonhazardous material, designed to provide an advantage over other lithium- or nickel-based power sources. The capacitor provides a combination

TCXO Custom Chip

The Model RTVY-174 TCXO is for use in pagers, cell phones, two-way radios, GSM, PDC, and other wireless and telecom systems. It incorporates a custom IC chip and has a footprint of 6 x 3.5 mm. It has a ±2.5 ppm stability over the temperature range of -30∞ to 80∞C as a standard feature. The component is powered by a single 3.0 V supply; current drain is 2 mA maximum. Output voltage is 0.9 Vp-p minimum. It is capable of driving a 10 kW load shunted by 10 pF. The unit is available

TCXO

The CFPT-635 is an ultra-compact TCXO with frequency stability to within ±2.5 ppm over a temperature range from -30∞ to 80∞C. The device package measures 6.0 x 3.5 x 1.7 mm and weighs 115 mg. Its current consumption is less than 2 mA from a 3 V supply, reportedly suitable for mobile telecommunications devices. It is available in ex-stock with output frequencies of 12.8, 13.0, 14.4 and 16.8 MHz. Ageing is specified to within 1 ppm per year, and devices can be trimmed to nominal f

BGA MOSFET

The 30 V PowerTrench MOSFET BGA, FDZ5047N, offers a RDS(ON) of 2.5 mW typical (3.5 mW max), reportedly less than half the RDS(ON) of the industry`s highest performance SO-8 and in a smaller package size at less than 28 mm2. The BGA has a thickness of 0.8 mm. The component reportedly lowers heat dissipation, which boosts the efficiency and power density of DC/DC converters in notebook computers and voltage regulation modules. The device is offered in 5 x 6 mm and 5 x 5.5 mm package versions.

Calibration Software

This product is a new release of the Calibration Manager software. Designed to meet ISO 9000, QS 9000 and other standards, this software combines a database and report writing capabilities to assist users in maintaining the full cycle of calibration management. The latest release, Version 3.0, is said to offer many new features, including electronic-signature tracking, auto-reminder, satellite module, Crystal Reports 7.0, easier to use select/sort capabilities, tag ID system and more.

Placement Conversion

SMS Linecontrol is an industry-approved software package that is tailored for SMT manufacturers seeking stable CAD-conversion software for SMT placement files. It reportedly is designed to enable operators to communicate freely with individual placement machines, minimize programming time and eliminate downloading complexities. The software also is said to offer seamless communication across different brands of equipment and is an integrated, multitasking product.

Solder Wires

The W300, W400 and W500 series of cored, high-purity solder wires include no-clean, water-soluble and rosin-based wires for use in rework and attachment of thermally sensitive components. The W300 Series no-clean wires consist of a blend of rosins designed for user flexibility and a high level of protection against corrosion. The W500 Series water-soluble wires are reportedly designed for a high level of wetting and ease of cleaning. The W400 Series is available with a rosin-based flux core.

Colorless Residue Paste

A no-clean, colorless residue solder paste, DSP 691 reportedly supports print speeds of 1 to 8" per second. It has a 24-hour stencil life, up to 48-hour tack time and 72-hour open time. The paste is said to be 100 percent ICT pin probable and leave clear, minimal post-solder residue. It will reflow with or without nitrogen, and is said to be tested and approved for the DEK ProFlow cassette package.

Static Control

The Minimeg is designed for accurate measurement of surface resistivity and surface-to-ground resistance of work surfaces. The unit is reportedly suitable for spot-checking dissipative and conductive surfaces. It operates on a 9 V battery and measures surface resistivity up to less than 1010 W/square or surface-to-ground resistance up to less than 109 W. Both NIST and non-NIST models are available.


EMI Shielding Gasket

Gore-Shield SMT gaskets are said to be high-performance EMI shielding gaskets that can be installed with standard pick-and-place equipment. The gaskets reportedly decrease the total cost of EMI shielding in cell phones and other wireless infrastructure. They employ a form factor and the company`s GS5200 material, a nickel filled expanded polytetrafluoroethylene that is said to be suitable for wireless applications. Rather than a continuous bead, these gaskets are a series of small pads that have

ESD Simulator

The Model 930D "gun-style" ESD simulator is designed for use in a variety of applications, including electronic, automotive, military and medical. Its design is said to allow for quick change of resistor and capacitor networks, polarity modules, probe tip configuration and firing requirements. Designed for both air and contact discharges, the unit incorporates auto and manual modes and reportedly is adjustable from ±500 to ±26 kV.

Component Protection

Partfolio is a portable kitting system designed to securely store a range of small parts and protect sensitive components against damage from ESD at all stages of production. It is designed as an alternative to the "plastic bags in tote boxes" parts management approach still in common use. Advantages are said to include portability, quick setup and parts migration prevention when closed. Other advantages reportedly include improved quality control, increased productivity and decreased costs. To

ESD-compliant Lighting

The Imagelite Model 20 quartz-halogen fiber optic illuminator is an ESD-compliant product developed to provide shadow-free, glare-free, cold illumination for use in industrial and electronics manufacturing. Designed to meet the increasingly stringent demands of static-sensitive applications such as magneto-resistive head assembly and inspection in the semiconductor industry, the illuminator is also designed to work in virtually all microscopy, industrial and machine vision system applications.

ESD-compliant Bar-code Scanner

The IR-2000 ESD 2D scans 1-D and 2-D symbologies and is available in standard or high-density versions. It is rated and tested to discharge less than 20 V maximum, the average discharge time from 1,000 to less than 20 V does not exceed 15 seconds, and it has a surface resistivity greater than or equal to 105 W2 to less than 107 W2.

Heel Grounder

The MG-7010 series heel grounders are based on the company`s D-ring design. Features of the heel grounders reportedly include: a two-part heel cut with smudge-free interior, tab design ensuring effective contact, elastic relief band, and 1 or 2 MW value resistors.

Dual Continuous Monitor

Model 41137 monitors the ground integrity of two operators and a work surface with an RTT of less than 5 x 108. Red and green LEDs indicate grounding status. It monitors industry standard single-wire wrist straps. Other features include a data output signal, an audio alarm timeout, a mounting bracket, power supply and two remote jacks.

Moisture-barrier Bags

The 3300 Moisture-barrier Bag was reportedly designed to meet the moisture-protection needs of the electronics market. It is said to offer long-term protection from moisture, high-frequency protection and static shielding to protect sensitive electronic components or parts. The bag is constructed of a multilayer 0.0036" film that provides puncture- and tear-resistance. The clean, opaque barrier film reportedly meets the requirements of EIA-583 Class I and contains no amines, amides or N-Octanoic

Aerosol Coating

Staticide ESD is a permanent ESD acrylic coating that can reportedly be applied to most any insulative material or surface. It comes in a 16 oz aerosol spray can containing 12 oz of ESD coating. It is said to use a mixed-metal-oxide semiconductor as the static-dissipative agent in a clear acrylic-polymer coating. It does not contain carbon black, which can slough and leave black marks when rubbed. It also does not contain amines, quaternary ammonium salts or organic acid salt anti-stats. The pro

Static-dissipative Vinyl Upholstery

Microcon white is a static-dissipative vinyl for the company`s chair models. With this vinyl seating upholstery, the chairs are said to offer critical environments (including cleanrooms) static-dissipative protection in three colors: white, blue and black. Average component resistance to the ground is 1.2 x 107 W. The surface resistivity is 5.3 x 106 to 108 W per square surface at 500 V. Reportedly, the decay time from 5,000 V to technical zero is 0.44 seconds.


ESD Protection

New is this 11-member family of electrostatic discharge (ESD) protection devices, also known as transient voltage suppressors, which includes SOT, TSSOP, QSOP and MSOP packages. This family is said to bring three different approaches-low-capacitance diodes, zener diodes and a combination diode/zener-to the market, covering a range of configurations and surface mount packages. The products also reportedly meet and exceed ESD requirements of the International Standard IEC 61000-4-2. They provide p

Scaleable Test Solutions

The GR Versa Automotive Test (AT) is part of a family of scaleable functional test solutions based on the PXI standard. It reportedly is designed to meet the global manufacturing requirements of the automotive industry. The system combines the GPX621 (a 21 slot PXI/CompactPCI chassis) with PXIScan switching architecture that is said to enable virtually any instrument or resource to be routed to any test point on the unit under test (UUT). It also combines the TestStand multi-threaded test engine

14-slot Chassis

Reportedly the only 14-slot PXI chassis available, the PX2000-514 is a 19" rack-mountable unit that complies with the PXI and Compact PCI standards. All slots are said to have full PXI functionality. Separate forced-air cooling is provided for the power supply and PXI slots. Fan noise is said to be minimized by varying fan speed according to system temperature. Optional features include temperature and PSU monitoring, auxiliary I/O and user power supplies.

Burn-in Test Sockets

This family of burn-in test sockets for Direct Rambus (DR) memory devices will enable DRAM manufacturers to test devices that incorporate the memory management architecture developed by Rambus Inc., ensuring that they are fully tested and burned-in. The test sockets provide DR DRAM manufacturers a way to identify functional defects in singulated packages before assembly. They feature an open-top design for ease of use and are designed to accommodate the most popular IC package formats, including

Functional Tester

The Fas-Test in-line functional tester is said to include a buffer before and after the test procedure, a compression weight of up to 1,000 lb during the testing process, fixture change-out of less than three minutes, direct connect to a variety of fixtures, and System Monitor software designed to optimize and monitor production flow. The standard cycle time for each board application is reportedly 6 seconds plus the test time. A bar-code scanner works in conjunction with the test system to ensu

PCB Index Cycle Time Technology

This new technology reportedly allows the company to reduce by more than 50 percent the PCB index cycle time of the TCIL test handler used in the company`s automated in-line systems for ICT and functional testing. The technology makes use of a servo-driven PCB pusher mechanism in the TCIL that is equipped with extend-retract fingers for gripping the board for downstream movement after test completion. At the same time, it introduces the next board on the system`s DC motor-driven conveyor belt in

Recorder

The KIC Recorder is a portable, self-contained thermal recorder with an internal memory for datalogging. The system can be connected to any PC or laptop for real-time profiling. It is designed for use in rework stations, high-temperature furnaces and similar applications in which the electronics cannot or need not be directly exposed to process temperatures. The recorder is said to provide a computerized display, high-capacity data storage and analysis capabilities. It is compatible with the com

Prototype Board/Parallel Port Interface

The PROTOPort parallel port interface is designed for use with the company`s prototype boards, which were designed for testing a user`s application circuits. In addition to the prototype boards, the new interface will work with any of the company`s application boards (such as the eight-channel 8/12 bit A/D or D/A boards, the six-channel counter-timer board or the 48-channel digital I/O board), and can be stacked one on top of the other (mezzanine up to 16 boards per addresses).

Solder Materials

The need for lead-free solders has reached critical mass, leading to global commitment to implementing lead-free solders. This is after a decade of concerted efforts in research in search of lead-free alloys that are suitable for electronics/microelectronics applications. Today, the industry has a menu of choices; however, there are still a wide range of opinions and emotions on the lead-free issue. In this article, the "design rules" and the technology behind lead-free solder development are ex

About the Site

SMT, the magazine for electronics assembly, is the only industry publication whose editorial is devoted exclusively to surface mount assembly of printed circuit boards. This focus allows SMT to cover in depth the technology developments and applications engineers are looking for.


Multi-lane Belt Feeder

Designed to meet the needs of low-volume, high-mix applications, this multi-lane belt feeder for SMDs provides for a large number of components while reportedly using the smallest amount of feeder space possible. The refresh time is said to be less than 0.5 seconds for most components. Any pressure on the components at the pickup point is relieved as soon as the belts stop running. The feeders service various Fuji, Panasonic, Siemens, Universal and Quad placement machine models.

Dual-beam Gantry Placement

A compact and flexible placement machine, the C7d reportedly handles a full range of components at a projected placement rate of 20,000 cph. Features include dual-beam-gantry design with three spindles per head, "fly by" vision centering on every component, 120 8 mm feeder capacity, a 3,000 lb quartz composite base for vibration dampening, linear motors and non-contact linear encoders, and independent servo-controlled theta on each spindle.

Off-line/in-circuit Programming

The BP-6500 machine picks, programs and places devices, reportedly combining the benefits of off-line and in-circuit programming. It is said to reduce cost and simplify SMT production lines by eliminating the need for programming during test. The machine allows programming and testing of almost all device types, as well as programming of different patterns simultaneously. Production line changeovers are said to be completed in minutes.

Fume Extraction/Purification

These filter units extract and purify fumes from hand soldering, wave soldering, reflow soldering and curing, soft-beam soldering, and laser applications. All units reportedly feature low noise levels, filter monitors and various filter options. The company also manufactures exhaust hoods, filter units and downdraft tables for the removal of dross dust during wavesoldering maintenance. Also available are explosion-rated filter units for filtration of flammable gases and a wide range of exhaust a

BGA/CSP Rework System

The Sniper II, an extension of the Sniper Split-vision BGA, CSP and QFP rework system, includes a multiple-profile storage system, said to be necessary for data-logging and automatic loading and storage of rework temperature profiles. Low-temperature convection rework technology is said to be enhanced with 16 multiple-segment profiles on the control system, which can be operated without a computer. Once connected to a Pentium processor, any number of profiles may be created and retrieved.

High-speed Chip Mounter

The MSF-SuperFlex high-speed, multifunctional chip mounter reportedly provides accurate component mounting at speeds up to 0.09 seconds per piece using a two-head, 10-nozzle system. It can handle components from 0603 to 55 mm QFPs, CSPs, BGAs and semiconductor chips.

Manufacturability/Testability Software

By automatically recovering board design data from CAD and BOMs, CIM Automation Software checks manufacturability and testability of the boards. The package then generates surface mount and through-hole placement equipment optimized programs, as well as in-circuit and flying-probe test data. Also generated are X-ray and optical-inspection system programs, paperless repair graphical displays, history and statistics, and shop-floor documentation.

Custom Material-handling Designs

This company recently opened a new, state-of-the-art facility in Lake Barrington, Ill., and also began operations in Europe with an Ireland office. At APEX, they will be demonstrating enhanced and new-generation machines, stressing the ability to provide flexible solutions to customers` material-handling requirements.

No-clean Paste

Easy Profile 256 is a no-clean, air or nitrogen reflowable solder paste designed to exhibit stable wetting behavior over a range of reflow profiles. The key characteristic of the paste is said to be its overall robustness and operator friendliness. It is reportedly suitable for CMs and other electronics assembly companies running low-volume, high-mix product lines requiring tolerance for various oven settings and board sizes.

Vapor-phase Reflow Ovens

This company manufacturers vapor-phase reflow ovens. Applications for such ovens include SMT reflow, lead-free solder reflow, curing, drying, mechanical attachment and plastic package testing. The advantages offered by these ovens reportedly include uniform temperatures; low-oxygen environment; fast, even heat transfer regardless of product size; minimum liquidus times; absolute limits to maximum temperatures; ease of use; short setup times; and high repeatability. In-line, batch and custom oven


Probes for Test Sockets

The Micro Pitch Probe is for device testing of 1 mm pitch and below. It is said to offer excellent electrical properties, long cycle life and reliable contact geometry. The probe features a short signal path of 4.75 mm (0.187"), its self-inductance is reportedly less than 1 nH, and the contact resistance is less than 70 mW.

Test Handler

The J411-03 test handler is designed for flexibility, reportedly allowing manufacturers to test several different products using the same platform. If integrated into the company`s robotic test handlers, PCBs and final products can be automatically loaded into the handler. It is said to be easily configured for various test systems, as well as handshaking with the controlling system using standard RS-232 protocol. The handler is CE-compliant and has a 9.8 x 31.1" footprint.

Solder Paste Inspection

The SE 300 high-speed, high-resolution, 3-D solder paste inspection system is said to be capable of performing 100 percent inspection at production line speeds. It automatically measures height, volume, area and bridging, and notifies the operator if any parameters begin trending outside the user-specified limits. There is a choice of two operating modes: high-speed mode, designed for fine-pitch QFPs and other traditional components, reportedly inspects 4 sq. inches per second; high-resolution m

Electronic Commerce and the Electronics Industry

Hyper-competition has shifted business models across virtually all markets, but perhaps none as dramatically as the electronics industry. A decade ago, product innovation itself was enough to support sustainable competitive advantage. But innovation creates opportunity, which spawns competition, forcing companies to either keep pace or wither on the vine.

High-strength and High-fatigue-resistant Lead-free Solder

Sn/Cu/In/Ga proves to be an interesting solution for high-strength and high-fatigue-resistant electronics applications.

DFM: Is the Industry There Yet?

Because DFM is still a relatively new concept, assemblers, designers and fabricators are often working on a different page when it comes to putting DFM to use.

Following the Money

IPC plans to head to Washington, D.C. for its 8th Annual Capitol Hill Day to garner support for the Printed Circuit Investment Act.

Lead-free Solder Alloy

The TAC 5 solder alloy (95.5Sn/4.0Ag/ 0.5Cu) has been incorporated into pastes, bars, wire and spheres. For surface mount assembly, it can work with existing equipment to produce solder joints with stability said to be equal to or greater than lead-bearing solder joints. In hybrid circuits, the alloy reportedly enhances thermal fatigue resistance. The company`s lead-free line also includes a no-clean flux that reportedly minimizes defects and improves wetting.

Ultrasonic Cleaner

The newest addition to the CYBERCLEAN line, the Series 4000 Model 24U ultrasonic cleaning system, is intended to clean hard-to-remove soils, such as baked-on fluxes from production fixturing, in a batch cleaning format. All systems in the line are PLC controlled, and all operations - cleaning, rinsing and drying - are said to be automatic. This specific model has a standard envelope of 16 × 24 × 20" and is configured to process five 18 × 24" fixtures per cycle. Customized baskets

Modular Chip Mounter

The CM201/202-D modular chip mounters reportedly offer unlimited expansion capabilities, flexibility and high productivity for component placement. Productivity is said to be enhanced with a 208-feeder capacity using double feeders and throughput that reportedly ranges from 13,850 to 27,700 chips per hour. The units handle component sizes from 0201 to 24 mm.


Stencil Inspection Workstation

Designed to increase verification speed and accuracy, ScanSTENCIL is a fully integrated, off-line stencil inspection workstation that combines a Windows-based software package with a high-resolution calibrated flatbed scanner to produce verification files for laser- or chemical-etched stencils. Using its calibrated scanner, the unit inputs stencils or screens and compares them to a known perfect Gerber file for accuracy and blockage.

BOM Software

CheckPoint BOM Manager is designed for processing data at the front end of the PCB assembly process. It imports, parses, analyzes, and archives BOMs and approved vendor lists under electronic revision control. The software reportedly imports customer BOM data from a variety of sources, such as collimated ASCII files, CIM project files, Microsoft Excel spreadsheets and ODBC databases. It operates on Access or SQL Server to provide enterprise-wide PCB information control.

Stopping ESD

Staticide #2500, an electrostatic-dissipative clear coating, combines acrylic polymers with a semiconductor technology to provide permanent static dissipation, reportedly even under zero-humidity conditions. The semi-transparent coating is said to be usable on all nonporous insulated surfaces such as keyboards, computers, mice, oscilloscopes and workstations. In an aerosol spray can, it is suitable for cleanroom use and dries to the touch in minutes. It also meets Federal Standard E209 for zero

Printing and Inspection Machines

The Ultraprint 1500 can be configured with options that address demands of flexbility or performance, or both. It is capable of printing boards up to 22 × 20", and includes standard features such as automatic board-to-stencil alignment, a self-leveling dual- squeegee print head and programmable hard board stops. The Ultraprint 3000 Ultraflex is designed for double-sided products and can reportedly handle fine-pitch and µBGA technologies. It includes synchronized motion control, automat

Selective Soldering and Rework

The LS-100 is designed for selective soldering and rework of all types of components, from µBGAs to large QFPs and odd-shaped and hybrid devices. It is said to be ideal for soldering and desoldering RF shielding and various paste-in-hole and solder-paste-on-through-hole applications. This semiautomatic off-line rework system reportedly prevents overheating and thermal stress of components, the board and adjacent components, while enabling the programming of precise reflow profiles. It also

Thermal Profiling Software

The Navigator is a high-speed enhancement for the company`s Auto-Predict software option. It reportedly identifies the optimal reflow profile for lead-bearing or lead-free solder paste automatically. The software draws on a built-in database to determine the process window automatically, once the solder paste is selected. It is said to function as an expert system, eliminating the need for operator decision-making.

Flip Chip Bonding Service

To complement its turnkey electronics manufacturing, this company introduced a flip chip bonding service, featuring a fully automated Fuji flip chip bonder with a bonding force of up to 50 kg. The system`s high placement accuracy and units per hour are said to create an initial capacity of 200,000 pieces per month with a two-shift, five-day work week operation. This capacity can be expanded to 300,000 pieces per month by adding a third shift and additional equipment. As many flip chip substrates

In-line Functional PCB Tester

The Fas-Test in-line functional tester is designed to handle high-rate production requirements and serve as a quick, efficient PCB tester. Features include a buffer before and after the test procedure, a compression weight of up to 1,000 lb during the testing process, fixture changeout of less than three minutes, direct connect to a variety of fixtures, and a software package designed to optimize and monitor production flow lines. The standard cycle time for each board application is six seconds

Copper-protective Coating

The ENTEK CU-77 copper-protective coating system is an alternative to HASL and other metallic PCB finishes. It is designed for coating single-sided PCBs that require one soldering step (glue cure followed by wave soldering). The material delivers a thin coating (200 to 400 Å) and reportedly provides improved storage and handling capabilities compared to anti-tarnishes. PCBs coated with this are said to have up to a 12-month shelf life. The aqueous-based system is composed of a pre-clean cyc

Depanelization Router

The 105DP is an in-line, fully automated depanelization router for populated PCBs that is said to provide hands-off operation. The system receives a populated PCB panel, places it on the worktable, depanelizes the individual PCB assemblies, then transfers them to standard or customized output conveyor systems. The head can rotate 90° or 180° for off-loading routed circuits, reportedly in any orientation. The system is designed to interface with conveyors and is said to provide a stable


Flip Chip Wafer Bumper

This low-alpha-count flip chip bumping process is for both eutectic (Sn63/Pb37) and high-lead (Sn5/Pb95) solder bumps. The solder is processed with a measured alpha emission rate of 0.01 alphas per hour per cm2, said to be the lowest offered in the industry by a merchant wafer bumping provider. The process reportedly minimizes the potential for "soft errors" in ASIC and other microprocessor ICs with small gate dimensions (0.18 µm and below).

Six-vision System

The CP45FV uses a "six-head, six-vision" system that incorporates an on-the-fly vertical imaging system for component recognition. Using vertical imaging, the system aligns components using features on the bottom of the part without traveling to an optical centering station. This concept reportedly allows the machine to place components at speeds down to 0.19 seconds per placement. Components from 0201 to more than 2" square QFPs with 0.019" pitch, as well as CSPs, can be placed on the same plat

Aqueous Cleaning System

The CBW-218 OmniJet aqueous cleaning system features all stainless-steel (polished) construction, sustained high-solution heat capability, and a high-volume spray bar said to have great GPM concentration per sq. inch to clean even highly dense PCBs. A convection dryer features adjustable blow-off knives that produce high-velocity water-strip action.

Wafer-bump Reflow System

This multi-belt, continuous-conduction, wafer-bump reflow system reportedly provides highly controlled and repeatable reflow profiles. The wafers are heated by conduction from a conveyor belt in the heating zones, with subsequent transfer to an independent cool belt in the cooling zones. Its low-particulate environment reportedly maintains an atmosphere at less than 5 ppm O2.

The Total Cost of Ownership Equation

Automated selective conformal coating systems can increase production throughput and reduce wasted materials, which are factors that need to be considered when determining total cost of ownership.

Global Trends in Assembly Equipment Strategy

With CMs acquiring more and more OEM facilities, there is a plethora of two- to four-year-old equipment on the global market that is available for leasing.

Inspection Methodology

Frankly, I dislike the term inspection because it is a constant reminder that my assembly process still has too much variation. However, until my manufacturing process is capable of consistently producing zero defects, some form of inspection or monitoring is necessary to ensure the desired quality level. Surface mount assembly is a very complex sequence of events with a large number of individual activities. The trick is creating a balanced inspection and monitoring strategy without performing

Conference Breakdown

The APEX conference program is divided into six categories: SMT and Electronics Assembly, Assembly Equipment, Materials, Management & Business Issues, Quality and Process Control, and Advanced Technology. There are 30 sessions and more than 100 presentations, as well as three free keynotes and nine free forums. Highlights include a focus on lead-free alternatives, electronic data interchange (EDI) issues, design vs. manufacturability trade-offs for advanced packages, developments in wafer techno

Tutorials/Workshops

APEX is offering more than 50 tutorials and workshops that will answer questions on SMT and related assembly technology, including advanced component packaging, assembly equipment, materials and processes, and quality assurance and process control.

1999 VISION Awards

For the eighth consecutive year, SMT Magazine rewards 14 worthy companies with its 1999 VISION Awards. This year marks a change in venue for the ceremony, as it takes place at APEX. Awards are presented in the following categories: Adhesives/Coatings/ Encapsulants, Assembly Tools, Cleaning, Components, Contract Services, Dispensing Equipment, Inspection, Pick-and-Place, Printing, Rework & Repair, Software, Soldering Equipment, Soldering Materials, and Testing.


IPC EMS Management Council Meeting

This meeting focuses on trends that critically affect the contract manufacturing (CM) business, including:

IPC SMEMA Management Council Meeting

The inaugural meeting of the IPC SMEMA Management Council promises to make as big a splash as APEX itself. For the first time, presidents, owners and senior officers of companies that supply the electronics assembly industry will work together to solve supply issues.

IPC Standards Development Meetings

One of the reasons APEX exists is to support standards development activities. IPC standards development and committee meetings are among the most important and unique activities taking place at APEX. What could be more important than seeing how decisions are made that affect the specifications customers and suppliers use? What could be more beneficial than having an impact on that process? Connect with the industry leaders who are writing these standards.

Free Forums

Make the most of your time at APEX 2000. All APEX attendees are invited to free forums. These educational sessions offer timely information in a relaxed and open environment. Because there are no written proceedings, panelists are often more candid in their remarks. Hear from expert panelists on a number of critical topics at no charge.

Special Events

Kick-off reception. Enjoy a free reception on the show floor Tuesday, March 14. Meet with colleagues and suppliers to review APEX`s opening day and to make plans to make the most of your time at APEX.

Wall Street Speaks on the CM Industry

A decade ago there was a handful of publicly traded CMs; today there are more than 20 publicly traded CM company stocks. Wall Street`s view and understanding of the CM industry have a profound effect on all companies. This free Wednesday morning keynote features three veteran analysts sharing their views on the dramatic changes occurring in the CM industry: Keith Dunne, managing director, BancBoston Robertson Stephens; Bill Cage, partner, J.C. Bradford and Co.; and David Enzer, managing director

Free Environmental Forums

Lead-free Solders: Implementation Issues. The adoption of lead-free solders by the electronics industry will not be a simple matter. It affects all parts of the supply chain from the component and board manufacturers, to the solder materials and soldering equipment suppliers, to the assemblers and their customers. This panel forum will discuss which technology options are being pursued and their implications. It is also a chance to ask questions of some of the leading experts in the field.

Modular Placement

With its SP2 placement system and three different placement modes, the KE-2030 SMT placement machine is said to offer a high degree of flexibility and speed in a modular machine. The machine reportedly features a placement rate of more than 20,000 components per hour. Two multi-nozzle laser heads with eight nozzles can pick and place components as small as 0201s and as large as 26.5 × 11 mm and 20 mm2. Three placement modes are possible. In parallel placement mode, the machine places up to

Dispensing Equipment

The Continuous-Flow piston pump for encapsulation materials is a high-throughput, positive-displacement pump with a repeatability said to be less than 1 percent. Its multi-piston design continuously feeds material with no recharge time. The Xyflex consists of four independently programmable heads that can reportedly dispense up to 140,000 dots per hour, depending on the application. This surface mount system dispenses solder paste, adhesives and conductive epoxies. The Pulse-Jet non-contact pump

Software/Scanner

PanaPRO/PanaCIM software reportedly provides the unique ability of component-to-panel traceability. In addition to providing complete setup verification, this software/bar-code scanner package records and verifies use of all components and PCBs. Defective parts can reportedly be quickly traced back to the assembler and part number.


Upgraded AOI Systems

The AIMS G5 AOI system has received a new board-handling system that can handle very thin boards and employs full rail-board holding. It is said to employ a custom-engineered telecentric optic for inspection of 0201- and 0.012"-pitch components. The G4 system has been redesigned to improve ergonomics, sustainability and repeatability. Both systems reportedly received a new, patent-pending illumination system.

Real-time X-ray Inspection

The Jewel Box provides real-time X-ray inspection with a high-resolution camera and 10 µm X-ray source for magnification up to 500X. The unit inspects PCBs with µBGAs, flip chips, ICs and other advanced packages. It reportedly allows the imaging of materials, such as aluminum, that conventional high-voltage systems cannot image. The patented X-ray camera technology is said to maintain void-size consistency in relation to solder bond area as voltage increases.

Reworkable Flip Chip Underfills

An epoxy-based liquid underfill, 3567 is compatible with polyimid-passivated flip chip, BGA and CSP assemblies. It is said to be the first commercially available reworkable underfill - it reportedly permits an area-array device to be replaced after testing determines it is defective, minimizing the discarding of entire boards. The epoxy-based liquid cures in five to 15 minutes when exposed to temperatures of 150° to 165°C and penetrates gaps as small as 0.001". Defective flip chip pack

Internet-access Screen Printer

The 265 Infinity screen printer reportedly combines faster handling and printing with documented 2.0 Cpk levels. For high-throughput operation, the printer incorporates patented on-the-fly fiducial capture, a 2Di stencil and post-print inspection package, as well as ProFlow direct imaging. Networking capability supports machine-to-machine file transfer, network integration and remote Internet access, reportedly without interrupting production.

Combination X-ray/Vision Inspection

The XRV is an automated in-line PCB inspection unit that combines visual inspection with the advantages of X-ray. It uses CCD cameras to check for missing or wrong components, misplacement, polarity, and other visually evident defects. The integrated X-ray capability checks for BGA, µBGA, flip chip, J-leads and other hidden solder connections that cannot be seen by the naked eye. A typical PCB with 500 components is said to take less than 30 minutes to program. The system self-learns a PCB

Laser-light Guidance Assembly

The Guidemaster is a complete in-line component-placement system designed to integrate into existing manual assembly lines. Equipped with an in-line motorized conveyor and laser-light guidance system, the assembler is said to provide seamless in-line board flow and facilitate accurate manual part insertion. It comes with a PCB positioning and clamp mechanism to secure the board in a repeatable location, a PC configured with Windows NT, an intuitive operator interface, and a foot switch to trigge

Real-time Failure Analysis

The NXR-20HR real-time failure analysis system features an 8 µ microfocus X-ray source and 300X magnification for verification and inspection of SMT PCBs using BGAs, flip chips, µBGAs and other high-density packages. As a semiautomated system, it is designed to quickly and repeatedly identify hidden defects such as shorted or open solder joints, component misregistration, and voiding or unacceptable size variations in solder bumps. The system uses 5-axis sample manipulation (rotate and

Water-soluble Solder Paste and No-clean Wire Solder

Delta Elite 788 is a halogen-free, water-soluble solder paste with a tack time longer than 12 hours. The formulation is non-hygroscopic (moisture resistant). A low-volatility solvent, the paste reportedly provides long stencil life and high tack force, making it suitable for high-speed component placement. NC-601 no-clean wire solder is said to promote excellent activity and wetting, leaving virtually no post-soldering residue. Bellcore compliant, it comes in all standard diameters and at 1.1 pe

Component Placement Systems

There are seven models in the Meridian Series of SMT placement systems. All are said to offer high quality and productivity, low setup and operating costs, and effective line optimization and operation monitoring tools. The machines have a maximum placement rate of more than 28,000 cph, and can place chip and IC components. A Windows NT operating environment is used, and the machines feature a three-stage, soft-stop conveyor. They also reportedly meet the IPC-9850 standard.

Mini Fume Extractor

The Miniarm FX-32 has a reach of more than 3 ft, and consists of flexible, self-articulating plastic tube with a built-in damper and swivel function. It can be mounted to a wall, ceiling or directly to the workbench. The extractor is available in three models: standard gray for soldering smoke or small chemical and fume extraction; black for the ESD requirements of the electronics industry; and the gray Hygienic Arm for applications where there are high demands for cleanliness. The latter is pro


Vertical Reflow Oven

TOWER is said to be the first vertical reflow oven capable of high-volume PCB production. It is capable of performing eight unique board profiles simultaneously, meaning multiple pick-and-place lines can be fed into a single unit for box-build assembly. Typical applications include reflow, curing, and other thermal processes associated with conveyorized reflow ovens. The oven reportedly delivers the board-production throughput of 20` ovens in 7` of linear floor space.

Reflow Oven

The 1800EXL-SS oven is said to optimize reflow for boards with lead-bearing or lead-free solder paste. It is ISO 14000 certified for minimal environmental impact. The oven incorporates nine heating zones and two internal cooling zones within a 150" length, with throughput reportedly identical to conventional 183" ovens. An air-flux separation system is said to maintain the internal cleanliness of the oven chamber, extend maintenance intervals and minimize maintenance downtime.

The 10 Most Dreaded Questions For CMs

Electronics outsourcing continues to grow at about 25 percent per year; this trend is expected to continue into the foreseeable future. Traditional manufacturers recognize the prohibitive costs of electronics technology, capital and other resources. Many have set strategies in place to allow their companies to focus on particular core competencies, such as engineering or marketing, vs. hands-on manufacturing. They have recognized that this function can be best served by an outsourcing partnershi

Flexible Test Strategy Improves Efficiency

In the contract manufacturing sector, a pay-per-use test strategy is a proven testing solution for generating high-quality manufacturing services at low cost.

Flextronics Continues to Acquire

ROCHESTER, N.H. and SAN JOSE, Calif. - Cabletron Systems and Flextronics International announced they have entered into a definitive agreement in which Cabletron will divest manufacturing and repair services operations in Rochester, N.H. and Limerick, Ireland, to Flextronics. Under terms of the agreement, Flextronics will acquire manufacturing-related assets and inventories, and will also hire Cabletron`s worldwide manufacturing workforce of approximately 1,000.

Celestica Expands Relationship with IBM

TORONTO and ARMONK, N.Y. - Celestica Inc. entered into an agreement to significantly expand its existing relationship with IBM, specifically the Enterprise Systems Group and Microelectronics Div. The agreement provides for the sale and transfer of operations and assets in Rochester, Minn., and Vimercate and Santa Palomba, Italy.

Dii Expands to Switzerland

NIWOT, Colo. - The Dii Group Inc. and Ascom Business Systems AG signed a memorandum of understanding in which Dovatron International, a wholly owned subsidiary of the Dii Group, will purchase Ascom`s manufacturing facility and related assets in Solothurn, Switzerland. The 400,000 sq. ft. Solothurn plant employs approximately 550 people and is responsible for the production of private branch exchanges (PBX) equipment and phone terminals, including DECT, ISDN and GSM satellite telephones. A long-t

CM Agreement Reached

SAN JOSE, Calif. - Sanmina Corp. and Harris Corp. signed a three-year strategic manufacturing agreement. Under its terms, Harris will outsource its commercial PCB assembly manufacturing to Sanmina. In addition, Sanmina is acquiring Harris` PCB assembly manufacturing assets and inventory and will lease the company`s ISO 9002-certified, state-of-the-art manufacturing facility in San Antonio.

Florida Facility Acquired

HAUPPAUGE, N.Y. - Boundless Manufacturing Services Inc. (BMS) acquired Boca Research Inc.`s 70,000 sq. ft. manufacturing facility in Boca Raton, Fla. BMS will assume manufacturing services, leasing and other support services, and also plans to staff the facility from Boca Research`s current team of manufacturing and supply chain associates.

CM Team to Serve Northeastern U.S.

MILFORD, N.H. - Citronics Corp., a New Hampshire-based CM, linked its resources with Sparton Corp. to develop joint business opportunities for Northeastern United States and international markets. With the addition of Citronics as its sixth alliance partner, Sparton is expanding its regional market coverage to 15 facilities throughout North America and Europe.


Two Sypris Subsidiaries Active in the Market

LOUISVILLE, Ky. - Sypris Solutions Inc. announced that its subsidiary, Group Technologies Inc., signed a subcontract with Raytheon Command Control & Communications Segment for the production of circuit card assemblies valued at $7.0 million. Initial funding of $4.7 million has been issued to begin the first year of this potentially multi-year program. Raytheon will use the delivered assemblies in support of the Navy`s cooperative engagement capabilities.

Canadian CM Expands Facilities

EDMONTON, Alberta, Canada - Mitronix Inc. announced the completion of the most recent expansion of the company`s facilities. Reportedly done because of a large increase in customer orders in 1999, the company expanded its facility to 13,000 sq. ft. and acquired additional assembly machines.

Resource-constrained CM Acquired

NORWALK, Ohio - EPIC Technologies Inc. was acquired by TMW Enterprises and Crawford-Greene LLC. EPIC will join an affiliate network of regional CMs, with approximately 900 employees in the United States and Europe and targeted sales in the $130 million range for 1999.

Solectron Is in the Zhone

MILPITAS, Calif. - Zhone Technologies Inc. and Solectron Corp. announced the signing of a letter of intent for Solectron to become Zhone`s virtual supply-chain partner. The proposed transaction is designed to allow Zhone to focus resources on the design and development of new products by having Solectron provide product life cycle and supply chain management.

Express Manufacturing Inc., Santa Ana, Calif., installed CR Technologys CRX-2000 automated X-ray inspection system to inspect BGAs and microBGAs on PCBs.

Express Manufacturing Inc., Santa Ana, Calif., installed CR Technology`s CRX-2000 automated X-ray inspection system to inspect BGAs and microBGAs on PCBs. The system will reportedly increase time-to-market requirements of the company`s customers by enhancing its inspection capabilities for higher end packaging techniques.

Flux and Cleaning

The selection of flux and cleaning processes plays a critical role in the manufacturing yield and product reliability of electronic assemblies. The subjects of flux and cleaning are interrelated - one cannot be discussed without the other. The function of flux is to remove oxides and other nonmetallic impurities from the soldering surface and prepare a clean surface for joining. After soldering, cleaning may be required to remove flux residues.

BGA Reballing

When working with ball grid arrays (BGA), two of the most commonly asked questions are, "Can I reuse components?" and "How do I reball the components?" While these are obviously relevant concerns, there are very few companies that are currently reballing. The following areas should be considered before starting.

NCMS Lead-free Solder Project

This article summarizes the results, conclusions and recommendations of a four-year-long study of alternative solder materials.

How to Profile a PCB

An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.

SMT Material Handling Support Systems

Modular storage and transport equipment can maximize production line efficiency and provide flexibility to support future work-flow changes.


Optimizing Performance in Reflow Soldering

A new method of managing process gases in reflow ovens offers precise control over the thermal process, effective removal of flux and good solder joint quality.

Preventive Maintenance for ATE Fixtures

This article describes one company`s technique performed as preventive probe maintenance (e.g., replacement of degraded probes) of HP3070 automated test equipment (ATE) fixtures. The general concept can be applied to other ATE systems/fixtures, as well.

APEX 2000

The IPC SMEMA Council`s Electronics Assembly Process Exhibition and Conference (APEX), taking place March 12 to 16, 2000, in Long Beach, Calif., was organized in response to an industry need for a trade show that is cost-effective and fair for exhibitors, and highly focused on the products and technology of the electronics assembly industry. APEX will feature all segments of the industry, from bare boards to tested assemblies, and is said to be the only show in North America that will showcase m

Contest Winners

The IPC recently announced the first six winners of its APEX Trivia Challenge, a contest run through the APEX Web site, www.apex2000.org. The winners were the first to correctly answer three questions pertaining to IPC and the electronics manufacturing services industry. Each received a Palm V Connected Organizer.

Tutorials

Sixteen day-long tutorial sessions are planned to address the spectrum of electronics assembly, from the basics of SMT to advanced packaging materials. They will be held March 12 from 8:30 a.m. to 4:00 p.m.

Paper Awards

Two technical paper awards will be given at APEX. One award will be given to the author(s) of the best overall paper at the conference, while the second will be awarded

Lead-free

The push toward lead-free electronics assemblies is a main focus of APEX. At the center of the IPC`s efforts to educate the industry about the lead-free issue is the development of the IPC Roadmap for Lead-free Electronics Assemblies. Begun at IPCWorks, the roadmap provides guidelines for implementing lead-free soldering processes. Industry representatives will have an opportunity to provide input during APEX at a roadmap meeting taking place March 16.

Workshops

Of the more than 50 workshops and tutorials taking place at APEX, nearly 25 are being offered by the IPC for the first time. Every aspect of electronics assembly processes is to be covered by these workshops. "Given its importance in the industry, process control measures and quality assurance are two topics highly represented in this program," said IPC vice president of professional development John Riley.

Telecom Technology Challenges Manufacturers

The intense growth of high-tech industries such as telecommunications has forced many equipment manufacturers to rethink their business strategies to meet the increased demands placed upon them by rapidly changing technology.

Fume-purification System

The company has added a vacuum control capability to its Purex 8000 series fume extraction systems. By automatically keeping airflow constant, this reportedly allows accurate temperature profiles to be


Air-sampling Units

The Model 2000B and 2100B air samplers allow quality engineers to simultaneously and independently sample air and monitor environmental conditions around their fabrication facilities at one to four separate locations for a specified time period automatically. The products are capable of providing four different samples, simultaneously, that can be analyzed for trace inorganic and

Lamps

The company`s improved standard gooseneck design reportedly does not sag or sway for environments requiring a vibration-free light source. The gooseneck is covered by a PVC sleeving that is said to resist damage and wear. This new design is said to free operators of the strain and stress of having to physically adjust to their equipment. The lamps are ergonomically designed for ease-of-use and engineered for heavy production schedules.

Photoetched Shielding Components

The company uses photoetching for cost savings to manufacture board-level shielding components, such as custom fences with removable covers. This process is said to improve design flexibility, shorten lead times and eliminate hard tooling costs. Photoetching also reportedly allows the fabrication of board-level shielding components with close tolerances that cannot be duplicated by other methods. Fences, covers and mounting pins can be designed in any configuration, as can through holes and slot

Pressure-formed Housing

These pressure-formed housings, which are designed to protect PCBs, reportedly are manufactured from a pliable, heavy-gauge plastic called 0.060" Kydex. Each housing is pressure-formed from roll stock, hole punched and routed for air ventilation holes, line-bent to ensure a 360∞ enclosure, fitted with "canoe-clip" fasteners and final packed in a custom package.

LGA Socket

The cLGA socket system reportedly enables solderless chip-to-board and board-to-board interconnection. This solderless system is said to allow the user to avoid the termination and reliability problems caused by thermal expansion in high-pin-count devices. The socket uses a conventional BeCu contact with 30 µin Au over Ni plating. This low-profile connector design yields a 0.94 nH inductance. When fully mated, it has a total deflection of 0.012" with an average of 50 g normal force per cont

Surface Mount Adapters

The company now offers several new sizes of the PolyPod surface mount adapters for QFP packages. The QFP surface mount base can be soldered to a PCB and connected to emulators or logic analyzers, and can be used as a socket. The surface mount base reportedly has options for receptacles that can be used to interconnect to any test system, or the receptacles can be used to add height to extend the test equipment off the board. A socket cover also is available.

Reflow Process Control

Profile Wizard is designed to simplify process control by recording optimized thermal processing profiles, then comparing them minutes, hours or days later to oven performance. Its array of three dual sensors is width adjustable from 3 to 26" to match the board width. The product rides on a belt or edge-rail conveyor to profile the edges and center of the oven, providing a complete thermal picture. Features include repeatable, reliable temperature sensors that reportedly will not degrade with ti

Reflow Ovens

The first in a series of high-performance reflow ovens designed for the semiconductor market is the Bravo, which is said to feature several new design innovations that provide the performance required for high-production manufacturing environments. The system reportedly provides operators with full control over the reflow system through a user-friendly operator interface, and it is the air-only version of this series of reflow ovens. A new convection heating technology preheats air at the intake

Squeegee Blades/Holders

Owners of deHaart Technologies screen and stencil printing machines can obtain squeegee blades and holders from this company. These blades and holders are said to meet or exceed the company`s OEM specifications and are "drop-in" replacements. The OEM squeegee blade line includes polyurethane blades, flat metal blades, adjustable-angle metal blades and squeegee blade holders for deHaart as well as other industry manufacturers, including DEK, Fuji, MPM, Panasonic and SMTech. The polyurethane squee

Mini Fume Extractor

The Miniarm FX-32 is a small fume extractor arm that is said to have a reach of more than 3`. It features a flexible, self-articulating plastic tube with a built-in damper and swivel function. The product can be mounted to the wall, ceiling or directly to the workbench for a variety of applications in the workspace or laboratory. Various fume hoods and nozzles reportedly make this arm a solution for a workspace that has problems with smokes, fumes or chemicals. Also available is a light package


Solvent

Dynasolve 2000 Plus is a solvent designed for the removal of photoresist used during photolithography. It removes the photoresist and hinders the redeposition of the material. It is suitable for use in the production of ICs, semiconductor components, PCBs and other electronic components. This product is said to be safer than many currently used.

Digital Microscope

Micro-COMBICON ultra-high-density pluggable PCB terminal blocks use a spring-cage connection for fast and reliable termination with a 2.5 mm (0.098") pin spacing. The header, which mounts to the PCB, is available in a horizontal (MC 0.5/...-G-2.5) or vertical (0.5/...-G-2.5) configuration. The plug has front-entry terminations with individual test probes. The blocks are polarized and keyable to ensure a proper connection. The series accepts a #20 AWG wire and is available from 2 to 12 positions.

Process Control

Continuous quality improvement is a process control system that utilizes in-line inspection to help lower PCB assembly costs.

Publishers Executive Council Interview

SMT Magazine`s Publisher`s Executive Council consists of 38 electronic industry executives hand-picked by our publisher. They share their expertise and insights with our editorial staff and act as a sounding board for new ideas and concepts. These individuals also contribute much to the industry in general, working as leaders within their companies. This month`s Publisher`s Executive Council Interview features one of the industry`s leading innovators Surface Mount Equipment Manufacturers, Associ

Bonding System

The multi-use Model 860 Omni bonding system can be configured to bond flip chips as well as laser diodes and eutectic bonded die. The joystick-controlled system aligns and attaches die sizes from 0.006" square to 1" square at a throughput rate of up to 200 placements per hour with placement accuracy of ±5 µ. The basic platform is loaded with standard features such as an extend-retract cube beam splitter viewing system with illuminators and precision servo-motor- driven Z-motion with cl

Coordinate Measuring System

The YP20 is a 3-D coordinate measuring machine for close-tolerance parts applications. The system combines non-contact, auto-focusing optical/laser sensing technology and PC-based numerical control to provide 3-D inspection, measurement and analysis of microscopic surface features on ICs, PCBs, computer hard disks and machined materials. Operation within a Z-axis measurement range of 20 mm, it uses a semiconductor laser with reflective-activated focusing techniques to read and measure the workpi

Counters/Scales

The County counters and scales line counts all types of components. It is a microcomputer-based instrument that counts taped radial, axial and SMD components with added options. Accessories such as reel supports and handles are available. The S series is a motorized counter for taped SMD components. Motion control preset and memory functions can be operated by an interactive display while the system status is monitored by LEDs. The W series of electronic counting scales comes with digital displa

Convection Oven

The SMRO-0405 full-convection reflow system includes Windows 95/98 Oven Manager software to permit unlimited, real-time temperature profiling; continuous process status updates; historical overlay comparisons; program storage; and remote operations. The software also allows users to meet ISO 9000 and end-user documentation requirements. The oven has a 16" wide stainless-steel mesh belt, eight heating zones and dual cooling zones.

Gap-filler Pads

These conformable, high-heat-conducting gel pads are said to fit and adhere to most shapes and sizes of components, including protrusions and recessed areas. Thermal impedance of devices mounted on substrates or at heat-sink junctions is said to be eliminated, yielding higher temperature transfer gradients. Four series, each with a different construction, include a hardened-top surface or mesh reinforcement for demanding applications.

Fluid Dispenser

Model 1500DV is an air-powered dispenser that reportedly combines precise, repeatable fluid deposits with a vacuum pickup pen that simplifies placement of small, hard-to-handle components. Adhesive, solder paste or other assembly fluid is contained in a disposable barrel that the operator holds like a pen. A "teach" function allows the size of the first deposit to be set. With shot size stored in memory, the operator places the dispensing tip in position and presses an electric foot pedal to mak


Micro Fume Extractor

The Micro Arm Kit removes fumes from small solder pots and soldering under vision systems. The jointed arm can be twisted, turned and repositioned. Its 2" diameter capture area can be used for tip extraction, and the arm is made of high-temperature, ESD-safe plastic.

Epoxy Adhesive

Metregrip 355 is said to be a high-strength, low-viscosity, two-component adhesive system with a long working life. It was developed for bonding phenolic parts to steel or aluminum housings in the space shuttle. Reportedly easy to use in most structural-adhesive applications, it can be cured with both heat and room temperature. The adhesive reportedly has high tensile lap-shear values of more than 2,500 psi on aluminum, shows adhesive properties to a variety of substrates (e.g., brass, steel, co

Conductive Adhesive

The 118-09 is a two-component, solvent-resistant, electrically conductive ink, coating and adhesive that is said to be suitable for screen printing printed circuit lines. In addition to being solvent-resistant, the product also is flexible and capable of being cured at low temperatures. It reportedly features adhesion and low ohmic contact to indium/tin-oxide-sputtered glass and polyester. The adhesive provides adhesion to Kapton, Mylar, polycarbonate and other substrates.

Hand Tools/Assembly Fixtures

The MK Series pneumatic hand tools cover a number of options: cut and layover, cut and swage, or cut only. They are designed for post-component assembly prior to soldering. They are lightweight and offer ergonomic design to prevent operator fatigue. Unlike side cutters, the off-cuts from these tools drop to the PCB, eliminating flying lead waste. MK-3 tools feature trigger-activated, scissor-type blades. The MK-6 tools feature trigger-activated, V-type blades. Also available are the 360/380 "fli

Slides and Stages

The AccuSlide Model 2HB is a low-profile, pre-engineered, pre-assembled, ready-to-install linear-motion stage with pre-aligned AccuGlide linear guides and an integral pre-loaded ball-screw assembly. Available with a variety of ball-screw diameter and lead combinations, it can integrate with the company`s AXI-PAK motion control packages for a complete turnkey motion control solution. It is suitable for precise assembly, test and automation applications where rigidity and accuracy are required. Th

Workstation

The TechBench with Sub Monitor Alcove is an ergonomically designed product that holds monitors in a recessed fashion within the bench work surface. This workstation is said to provide ergonomic storage of tools and equipment and contains an integrated cable management system. The alcove positions the rear of the monitor down-

Solder-tip Cleaner

The Model ST1 is a battery-operated solder-tip cleaner. Two rotating "fybRglass" wheels clean oxidation and hardened flux residue from solder tips. Many tip configurations, including chisel, cone, spade and bevel, may be cleaned. The wheels are fully adjustable to accom-

Hand-/Glove-washing System

The CleanTech 400 automatic hand and glove washer includes the following features: no-touch-faucet options, a wall-mount option for space-saving benefits and a water-resistant design for safe, wet environment installation. Made of cast polymer and polyethylene construction, the system includes a stainless-steel plumbing plate and solution-tray enclosures.

Filtration System

The Ulti-Kleen filter is designed for the critical filtration in the IC-manufacturing process. This all-fluoropolymer filter is said to be the first and only of its kind to offer "guaranteed extractable levels." It is specifically targeted for use in ultra-high-purity chemicals of semiconductor devices with line widths of 0.25 µm and below. The filter is said to be the most advanced all-PTFE/PFA filter cartridge available to the semiconductor industry providing low-extractable levels guaran

Spray Nozzles

The company added hollow-cone-spray tips and a mini version to its line of ProMax Quick- Jet nozzles. The Quick WhirlJet hollow-cone-spray tips are available in standard and wide angles. The Mini ProMax Quick VeeJet spray nozzles measure just under 1" (2.54


Shot Meter

The Model 8300 Shot Meter uses controlled pressures of 0 to 30 psi and handles a variety of fluids ranging from watery adhesives to solder paste. A vacuum pull-back feature is said to eliminate messy and potentially harmful stringing. It oper-

Flip Chip Service

This manufacturer of advanced electronics products added the capability to handle flip chip parts. The modular placer has the ability to pick, vision inspect, and place flip chips and other bump-interconnection devices such as BGAs. The placer also applies flux during the process.

Interconnection Seminar

Held Wednesday, March 1, 9:00 a.m. to 4:00 p.m., this seminar, sponsored by the International Institute of Connector and Interconnection Technology, focuses on the basic connector areas needed for the everyday challenges of interconnection design, selection, evaluation and procurement. Taught by industry-recognized experts, it presents practical knowledge that will cover material selection through functionality, testing and performance criteria.

Thermal Labeling System

The TLS2200 thermal labeling system has been upgraded. This portable printer`s upgrade includes continuous label printing and PC compatibility. Free upgrades are available to existing customers and future upgrades will be Web-accessible. Continuous labeling features fixed length and banner printing options. The system can print up to 50 characters using the largest font size on continuous labels up to 4 ft long. The fixed length labeling option allows customization of the length of the label des

Flip Chip Underfill

Loctite 3567 is an epoxy-based liquid underfill reportedly compatible with polyimid-passivated flip chip, CSP and BGA assemblies. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150° to 165°C and penetrates gaps as small as 0.001". The underfill can be removed by heating for one minute at standard rework temperatures of 210° to 220°C where the epoxy will begin to partially decompose. The component can be removed when torque is applied.

AOI System

The AIMS AOI systems have been revamped. The G5 received a new board-handling system that can handle very thin boards and employs full-rail board holding. The system employs a custom engineered telecentric optic that allows inspection of 0201s and 0.012" pitch components. The G4 was redesigned to improve ergonomics, sustainability and repeatability. Both systems have new illumination systems.

Socket Adapter

The 321 and 370 pin adapters convert BGAs and other small fine-pitch processors to a Socket 7-compatible PGA footprint. Their design allows for component placement on the bottom side of the interposer directly underneath the processor.

Filter Units

Filter units extract and purify fumes from hand soldering, wave soldering, reflow/ curing, soft beam soldering and laser applications. All units feature low noise level, filter monitors and various filter options. Other products include exhaust hoods and downdraft tables for the removal of dross dust during wavesolder maintenance.

Linear Motors

The range of ThrustTube tubular linear motors includes modular X-Y solutions, single-rail linear motor modules, shielded modules and ironless motors. Ironless motors eliminate force fluctuations to deliver smooth motion. Shielded modules reportedly have high-performance integral bellows and are available for linear motor applications up to 4 m per second velocity and 4 G acceleration. Single-rail modules feature cross sections similar to conventional ballscrews.

In-line Inspection

The XRV system is an automated in-line PCB inspection unit that combines visual and X-ray inspection. The system uses CCD cameras to check for missing or wrong components, misplacement, polarity and other visually evident defects. The integrated X-ray capability checks for BGA, microBGA, flip chip, J-leads and other hidden solder connections that cannot be seen visually.


Mats

Tacky Mats remove contamination from shoe heels and soles, and from mobile cart wheels. The mats come in packages of 30 sheets. Cleaning and washing of mats is said to be eliminated. Corner tabs are numbered to identify remaining sheets. Four sizes are available: 18 x 36", 18 x 45", 26 x 45" and 36 x 45".

No-clean Solder Paste

Delta 691 no-clean solder paste is reportedly formulated to provide excellent tack force, a tack time greater than 48 hours, 24-hour stencil life, 72-hour open time and prints up to 8" per second. Post-soldering residues are clear and pin testable. It has a nine-month refrigerated shelf life and can be used in an air or nitrogen reflow environment.

In-line Bonders

Automated in-line systems include the Model 3500-II die bonder, CBT 6000 high-speed ball bonder, 2470-V wedge bonder and 2460-V ball bonder. These machines` capabilities reportedly include high-precision die placement, relative-to referencing, and precision wedge and ball bonding with constant wire length capability.

Tilt Adjustment

The Task Control backrest tilt mechanism provides seated ergonomic tilt adjustment for a chair backrest with the touch of a paddle. This feature will be standard for chairs in the 1P, 1Q, 4L, 4M, 4P, 4V, 4X, 4Y, ERA, EOC, MOC, TOC, CHC Series and eight chairs in the Drafting Series. Each chair will be equipped with two seat control paddles that will allow chair and backrest adjustment from a seated position. The front paddle will adjust seat height and the back paddle will adjust backrest tilt.

Tape-and-reel

The NT-216 tape-and-reel system handles all discrete components up to the D-Pak size and all small passives with throughput up to 30,000 parts per hour. It accepts input from vibratory bowl feeders, lead frames and tube feeders, and outputs to tube or to tape widths from 8 to 16 mm. The system features a 16-position rotary turret that is synchronized with a rotary table used for laser marking and inspection. This vision system inspects for mark presence and lead integrity. It is able to perform

Dispensing Pump

The DV-7000 Heli-Flow pump provides consistent performance through its rotary positive-displacement auger design, and is capable of producing dots smaller than 0.38 mm with dispensable-grade solder pastes. The pump provides dispensing of medium- to high-viscosity fluids and pastes for applications including small-dot dispensing of solder paste, surface mount adhesives and silver epoxy. The pump`s closed-loop motor control with encoder feedback can be reversed to create a clean fluid cutoff.

Micro-abrasive Blasting

Using a variety of blasting media and small nozzles in the 0.018 to 0.080" range, this pencil-blast process offers solutions to a variety of production problems. Applications include cleaning contaminants and oxides from ceramic insulators and components, removing paper diffusion mask residue from silicon substrates, cutting slots and shapes in fragile materials such as silicon wafers and crystalline substrates, material removal of fine microburrs from waveguide packages, and surface preparation

Salt Lake City Gains Design Center

American Microsystems Inc. (AMI) opened a new design center in Salt Lake City to increase its mixed-signal and analog design talent. The center will also contribute to the ongoing development of precision analog functions supporting the company`s ASIC systems solutions. The center will be run by Donald Comers, Ph.D., who brings more than 20 years of experience in academics and industry. As director of the design center, Dr. Comers will report to the vice president of AMI`s Home, Office and Indus

New Brunswick Industries, El Cajon, Calif., announced that continuing growth is forcing the company out of its present 6,500 sq. ft. facility.

New Brunswick Industries, El Cajon, Calif., announced that continuing growth is forcing the company out of its present 6,500 sq. ft. facility. Construction of a new 20,000 sq. ft. facility has already begun.

Lead-free Solders and Their Properties

Along with thermal, mechanical, creep and fatigue, melting point is one of the most important solder properties. Table 1 provides a list of lead-free solders that have been available for some time.1


Surface Mount Audio Transformer

The SEF Series of audio transformers offers a basic footprint that reportedly occupies less than 34 sq. cm (21.5 x 15.4 mm) and has a profile height of 7.8 mm. Frequency response is rated at 0.25 dB in the range from 200 to 4,000 Hz. Longitudinal balance is 60 dB over the same range. The transformer operates between -45 and 7 dB and is designed in its default configuration to meet FCC specifications under Regulation 15 for atmospheric noise. Primary impedances are all 600 W at 1 kHz. Secondary i

DC/DC Converters

The MT Series of high-density DC/DC converters can accommodate 12 V inputs for use in the battery power systems architecture becoming popular in portable equipment. The devices are available in metal-cased, full-brick, 150, 100 and 50 W versions. The converters are designed to achieve operating efficiencies as high as 90 percent with total isolation of input, output and baseplate. The series can be obtained with output voltages of 3.3, 5, 12, 15, 24 and 28 VDC.

SOT-323 Package

The Super323 Series bipolar transistors are designed to provide low-loss, high-power performance in miniature SOT-323 surface mount packaging. The devices handle collector currents between 1 and 1.5 A and can dissipate power up to 500 mW. Developed using an enhanced matrix geometry, Superb emitter process and a specially designed lead frame, the transistors feature NPN and PNP complementary types that exhibit a voltage as low as 0.2 V for a collector current of 1 A. These devices reportedly offe

Integrated Switcher

The TNY256 is designed to provide a cost-effective, energy-efficient solution for a wide range of applications. It delivers up to 11 W from a universal input and up to 19 W from a 230 VAC input. Auto-restart is said to lower secondary component cost by reducing short-circuit current. Line under-voltage sense is said to prevent voltage glitches during power up or power down. Frequency jitter is said to lower EMI.

15 and 25 W Converters

Now available with UL 1950 recognition to operational level, the NPH25 25 W and NPH15 15 W DC/DC converters are said to be ideal for the telecommunications and industrial distributed power systems where approved levels of isolation are demanded. The converters reportedly are compact, integrated wide-input devices featuring efficiency levels of up to 90 percent and power densities as high as 1.42 W per cm (23.4 W per inch). Devices in the 25 W series have footprints of 50 x 35 mm, while the 15 W

RF Shielding

This line of photo-chemically etched RF shielding cans has a patented removable cover designed to allow users to replace or repair internal components without damaging the surrounding shield. An etched line on the surface is broken to minimize RF leakage. The tab connecting the lid to the RF shield can be snipped and resoldered to minimize downtime. The RF shields are available in brass and 10-10 steel with solder plating, and can be custom designed to meet customer requirements. The RF shields

Ultra-miniature SMD Crystal

The FX532A SMD ceramic crystal measures 5.0 x 3.2 mm with a 1.0 mm profile. It has a frequency range of 14 to 40 MHz, and a frequency tolerance of ±100 ppm. The JITO-2 oscillators with reduced phase jitter reportedly offer a 67 percent reduction in phase jitter over competitively programmed oscillators and, in some frequency ranges, compare favorably with fixed-frequency oscillators. They are said to make microprocessor-based systems less prone to bit errors and to increase the reliability

SMT VCOs

Phase noise in this new line of CZM and CSM SMT VCOs has been improved to -130 dBc/Hz at 100 kHz, down from -120 dBc/Hz. They are designed to deliver -15 dBc (typical) harmonic suppression and a linear wideband tuning range. The series is available on tape-and-reel packaging in frequencies ranging from 45 MHz to 3.0 GHz. They are compatible with applications where high frequency and linear modulation are required, including cellular, PCS, WLAN/WWAN and wireless modems.

Filter Modules

The B6001, B6003 and B6005 filter modules are specifically designed to meet the requirements of the HomePNA 1M8 PHY specification for the 1 Mbps technology. All three products have been UL 1950 certified for supplementary insulation requirements. The B6001 is a 14-pin though-hole part that incorporates 10Base-T filtering and isolation. The B6003 and B6005 are both 16-pin surface mount parts. The latter also has 10Base-T filtering. The bandpass filter portion is designed to ensure the 6 to 9 MHz

Interactive Odd-form Component Catalog Debuts

The Interactive Odd-form Component Catalog, developed by Universal Instrument Corp.`s Odd Form/Final Assembly (OFA) Div., enables users to determine odd-form application feeder and placement head tooling by searching component category, part number or photo.


Low Drop-out Voltage Regulators

The GMT-72XX line of micro-power low drop-out voltage regulators is designed to provide reliable and efficient solutions for mobile phones, palm computers, pagers, global positioning equipment and other portable applications. Compared to conventional LDO ICs, the new regulators are said to perform at low quiescent operating current, with significantly lower drop-out voltages. The voltage regulator family was specifically designed to operate in noise-prone, switch-mode environments. It reportedly

Conference

The NEPCON West conference offerings are separated into several types of classes: Tutorials, Professional Advancement Courses, Workshops and Technical Sessions.

Y2K Assembly Line

The Y2K assembly line is designed to allow attendees to witness a component attachment process at very low temperatures using a solder alternative. The line features bottomside in-line placement of bar-code labels, as well as the deposition of a solder alternative for the mechanical attachment of quad flat packs (QFP), BGAs, a flip chip and standard surface mount devices (SMD). The devices are cemented in place with a low-temperature heating process, and the flip chip device is underfilled with

Lead-free HDI Assembly Line

The evaluation and use of lead-free process materials has gained a lot of interest throughout the industry because of legislation that would ban lead use in the electronics industry. The lead-free HDI assembly line demonstrates the attachment of SMDs, BGAs, QFPs, and CSPs using a lead-free solder, lead-free component metallizations and a lead-free PCB pad finish for the top- and bottomside attachment processes.

PCMCIA Assembly Line

The PCMCIA line highlights the assembly of a high-volume consumer electronics product that incorporates many high-technology facets, including advanced design techniques, a variety of high- pin-count component packages and die, along with cutting edge PCB fabrication technology. The assembly equipment is outfitted for processing the thin laminate that is typically used in PCMCIA panels.

Lead-free PBGA Assembly Line

The PBGA line features the full population and assembly of a BGA lead-frame strip containing the circuitry and bonding pads for four PBGA devices. The die-attach process demonstrates the population of a laminate strip containing four PBGA packages containing gold bonding pads for gold-to-gold interconnect COB wire-bond die and the BGA package. The wire bondable die is attached with a silver-filled adhesive, followed by thermal cure, plasma clean and die wire bonding to the pad sites for each dev

Area-array Assembly Line

The Area-array line features the assembly processes, materials and methods necessary for forming CSPs. The die-attach process shows the population of an organic strip containing multiple package interconnects with chip-on-board (COB) wire-bond die for the formation of CSPs. Processes featured include dispensing die attach and subsequent device placement with a single machine, curing the die-attach adhesive, plasma cleaning the wire-bond pad sites, ball-wedge gold capillary wire-bonding, dispensi

Low-volume Batch Assembly Line

The low-volume batch line demonstrates the processing of flip chips, CSPs and PBGAs in a low-volume production line using low-volume production and prototyping equipment.

Contract Manufacturing Demonstration Line

Located in the Contract Manufacturing Demonstration Area in Hall C, the Contract Manufacturing Demonstration Line is a complete SMT line that produces live products for one of the participating contract manufacturer`s customers.

Pick-and-place Evaluation Center

The Pick-and-place Evaluation Center, located in Hall B, provides a strategic approach to evaluating assembly pick-and-place equipment. Four high-speed placement machines are on display, set up side-by-side, with third-party technical experts providing in-use feedback and interpretation of manufacturers` published machine specifications.


Keynote Addresses

Tuesday, February 29, at 8:00 a.m., John Madden, sportscaster/analyst, author and football coach, will kickoff NEPCON West 2000 with a keynote speech.

Packaging Session

The packaging session, Component Packaging for the 21st Century, will be held Tuesday, February 29, from 1:00 to 3:00 p.m. Packaging experts address the issues PCB assemblers need to understand to build the next generation of electronics products, including the impact of area-array packaging on the assembly floor, thermal management concerns, the effects of lead-free solder on component packages, and more.

Contract Manufacturing Senior Executive Forum

Presented by Technology Forecasters Inc. on Monday, February 28, from 7:30 a.m. to 7:00 p.m., this forum will be chaired by Pamela Gordon, certified management consultant and president of Technology Forecasters Inc.

Advanced Packaging Symposium

Held on Monday, February 28, from 9:00 a.m. to 4:00 p.m. and chaired by John Lau, Express Packaging Systems, the symposium will address wafer-level packaging and interconnection.

Contract Manufacturing Symposium

Presented by Sharon Mecum and Dr. Charles Mullen of Technology Forecasters Inc., "The Contract Manufacturing Game: Skills, Tools, and Insights for OEMs and Contract Electronics Manufacturers," will be held Tuesday, February 29, from 8:30 a.m. to 2:30 p.m.

ESD 101: Protecting Parts and Profits

Walk across the carpet, reach for the doorknob and a spark is created. That phenomenon is known as electrostatic discharge (ESD). An amount of static far below a human`s level of feeling can kill many of today`s sensitive electronic parts. It is crucial that anyone who handles electronic parts and assemblies has a serious awareness of these potential problems, and is taught proper techniques to avoid costly losses of hardware and reputation. ESD training is guaranteed to give a high return on in

Distribution Supply Chain Management

Suppliers continue to forge strong links in the value chain by adding new functions and processes. Many of these companies believe that their efforts at efficiency have tapped all the distribution value that the supply chain has to offer. They could not be further from the truth.

New Player in CM Market

NORMAN, Okla. - Hitachi Computer Products (America) Inc. announced it has established a contract manufacturing group to fabricate electronic components for small- to mid-range businesses. The Hitachi OMD CM group will operate in the company`s state-of-the-art production facility in Norman, Okla.

CMs Continue Strong Growth in 1999

NORTHBROOK, Ill. - The U.S. contract manufacturing (CM) market increased 21.5 percent in 1999, to $27.4 billion, according to a report from the IPC - Association Connecting Electronics Industries. The report included 66 companies with combined sales of $11.3 billion - 41 percent of the total estimated CM market. Computers and communications continue to be the largest markets for CMs, accounting for 53.4 and 26.8 percent of total 1999 sales, respectively.

CM Entrepreneur Wins Award

NEW YORK - Allen J. Berning, founder of Rochester, Minn.-based PEMSTAR Inc., was named the 1999 National Ernst & Young Entrepreneur of the Year in the Emerging Entrepreneur category. In five years, PEMSTAR has grown from a startup, into a $165 million company focused on high-precision electromechanical engineering and contract manufacturing, with facilities in six countries.


Flash Named to Prestigious List

FREMONT, Calif. - Flash Electronics Inc. was named to the IWGC 25 List for 1999. To be eligible for the list, which honors the 25 most successful small manufacturing firms in the United States, companies must have fewer than 500 employees, been in business for at least three years, be independent and have headquarters in the United States.

Four OEMs Choose Siemens

JOHNSON CITY, Tenn. - Omnipoint Corp., Panja, Wegener Communications Inc. and Woodward Automotive Products selected the Electronics Manufacturing Center (EMC) of Siemens Energy & Automation Inc. to provide printed circuit board assemblies (PCBA) and associated services. For Omnipoint, the EMC will provide PCBAs on a turnkey basis for the company`s Redhawk and Eagle wireless data modules. As part of the agreement, Siemens will also build, test and ship final product to Omnipoint`s worldwide custo

Personnel Moves at Manufacturers Services

CONCORD, Mass. - Manufacturers` Services Ltd. announced three personnel moves. Eugene Bullis was named CFO and executive vice president; Manuel Ruiz is now vice president of program management; and John MacInnes was appointed vice president and treasurer.

Solectron Forms Alliance, Acquires Canadian Repair Facility

MILPITAS, Calif. - Solectron Corp. has made a number of announcements in recent months. First, the company signed a definitive agreement with Acer Inc. to form a strategic alliance to provide global design, manufacturing and service solutions for OEM-branded PCs, servers and workstations. As a result of the alliance, customers will be able to access the extensive technology, motherboard and system-level design services, as well as global supply-base, manufacturing, distribution, logistics and Gl

Calibration Services Acquired

LOUISVILLE, Ky. - Sypris Solutions Inc. announced that its subsidiary, Bell Technologies Inc., signed a contract to purchase the Calibration and Repair Service business of Lucent Technologies. This purchase, expected to close by the end of last year, will combine the mobile calibration service operations of Lucent with the calibration and repair operations of Bell. The Lucent organization services its customers from field offices in Union, N.J., and Franklin, Tenn., as well as from 15 mobile cal

Flextronics Expands Hungarian Facility

SAN JOSE, Calif. - Flextronics International Ltd. is expanding its European manufacturing facilities in Tab, Hungary. This state-of-the-art facility is expanding to support the company`s growing customer base in Central and Eastern Europe, as well as to meet the needs of current customers.

Change the Solder Alloys and Laminate

The Scottish government has announced plans to invest $66.6 million toward creating a unique semiconductor business cluster that would make Silicon Glen a worldwide technology hotspot.

Investment in AOI Pays Off

An AOI machine with color highlight and zoom capability helped one CM improve its yield for critical-use end customers.

Growth Must Be Managed

SAN ANTONIO - The prodigious growth in the contract manufacturing industry has led to stability difficulties for CMs. According to a recent report from Frost & Sullivan, managing growth is essential for CMs to maintain control of operations.

Do Mergers and Acquisitions Make Everyone Happy?

ALAMEDA, Calif. - More than 100 mergers, acquisitions and strategic alliances between CMs and other companies were concluded during 1999, according to a new report from Technology Forecasters Inc.


Flip Chip is Production-ready

AUSTIN, Texas - XeTel Corp. announced that it has achieved production-ready status for board assemblies using 0.4 mm-pitch flip chip packages. Flip chip technology will reportedly enable smaller, thinner, and lighter products in the communications, computer and other electronics industries.

Two Facilities Acquired

ANDOVER, Mass. and PORTLAND, Ore. - Celestica Inc. completed its acquisition of Hewlett-Packard (HP) Co.`s surface mount center in Andover, Mass. The acquisition expands Celestica`s service offerings and brings its New England presence to more than 700 employees. The Andover operation will provide additional PCB assembly capabilities to the company`s service offerings in the Northeast United States, which currently includes systems integration, embedded systems design, logistics management and m

Largest Combination in the Industry Announced

SAN JOSE, Calif. and NIWOT, Colo. - Flextronics International Ltd. and the Dii Group Inc., which had combined sales of more than $3.8 billion in the last 12 months, signed a definitive merger agreement for a tax-free, stock-for-stock merger. The combined company will operate under the Flextronics International name, and will reportedly be the fourth largest provider of electronics manufacturing services, with strengths in telecommunications, consumer electronics, printed circuit board (PCB) fabr

Rick Rowe was appointed chief executive officer of MCMS Inc., Nampa, Idaho.

Rick Rowe was appointed chief executive officer of MCMS Inc., Nampa, Idaho. Prior to joining the company, Rowe was general manager of Honeywell-Measurex global system business, headquartered in Cupertino, Calif., with operations in Ireland, Germany, Finland, Japan, Asia-Pacific and Latin America, along with six North American operations.

Lead-free Solder

Tin/lead solder is the most commonly used solder for electronics assembly. How-ever, in the last year, there has been an industry-wide push to convert to lead-free solders. The reason behind the push is the increased awareness concerning lead use and its adverse effects on human health.

IRC Commits to MIL-Spec Market

Resistor manufacturer, IRC, has strengthened its commitment to the military market by ensuring that its lines of resistive products are qualified for military specification (MIL-Spec). Specializing in products for rugged and demanding applications, IRC offers one of the largest lines of military-approved electronic components for military, radar and aerospace.

First-pass Success Soars with New Design Method

Touting successful first-pass functional silicon rates of 90 percent and higher, American Microsystems Inc. introduced its MS-Master design methodology for submicron mixed-signal ASICs. The methodology is enabled by behavioral models that are generated from SPICE simulations and verified to produce working silicon on the first pass, drastically shortening design simulation time and helping customers get products to market faster.

2-D PSDs

The S5990-01 and S5991-01 surface mount 2-D position-sensitive detectors (PSD) reportedly provide detection over a large active area. Their pin-cushion-type detectors are said to be ideal for use in pointing devices such as computer mice and track balls, as well as for position measurement. Active area is 4 x 4 mm for the S5990-01 and 9 x 9 mm for the S5991-01. Position detection errors are reportedly held to ±70 µm for the former and ±150 µm for the latter.

Synchronous FETKY

Designated the IRF7807D1 and IRF7807D2, these low-voltage 30 V FETKYs are said to enable circuit designers to reduce the required footprint of the synchronous MOSFET solution, thereby increasing power density while providing the same efficiency and performance of an equivalent discrete solution. The D1 is in an SO-8 package and reportedly provides RDS(on) of 17 mΩ typical at Vgs = 4.5 V for on-state conditions. The D2 offers the same on-state performance, but integrates a 3 A-rated Schottky

N-channel HDMOS

This family of MOSFETs reportedly offers a combination of low on-resistance and low gate charge, and is said to provide optimum performance and high efficiency for switching applications such as DC/DC conversion. The HDMOS range includes eight N-channel devices. With drain source voltages up to 30 V, they are suited for low-voltage switching applications. On-resistance ranges from 40 up to 180 mΩ maximum. On-state losses are minimized, and they are said to improve efficiency in low-frequenc


Audible Signal Devices

The Mallory Sonalert II surface mount audible signals are said to have extremely small dimensions and reportedly are ideal for compact electronic products and systems such as pagers, portable telephones, scanners, computers and computer peripherals, hand-held instruments, and radar detectors. All offer high sound pressure levels (SPL) for such small units. The family consists of eight different models. Two include built-in drive circuitry, and the remaining six are transducer-only units intended

Miniature DC/DC Converters

The NMV series of single- and dual-output 1 W DC/DC converters will reportedly save PCB space, reduce component count, and minimize switching noise in new and existing industrial distributed power architectures. The converters offer board-mounted footprints as low as 1.17 cm2 and are said to allow designers to achieve significant PCB space savings by delivering full-specification performance from -40° to 85°C without a heat sink.

Tuning Fork Crystals

The TMX-11 SMD tuning fork crystals can be used for wireless telephone handset, watch/clock, audio/video and home appliance applications. The device`s dimensions are 7.3 x 4.1 x 2.0 mm - said to be ideal for applications that require a small footprint and the need to be surface mountable. It is available in the standard tuning fork frequency of 32.768 kHz and offers a ±20 ppm tolerance, a temperature range of -40° to 85°C, and a thermoplastic package that is heat resistant for ref

High-frequency Fundamental Crystals

These high-frequency fundamental (HFF) thickness shear-mode AT quartz crystal resonators have a frequency range of 200 MHz. The CC1F (ceramic lid) crystal series reportedly is designed for the latest in high-speed communication systems that require high-frequency references, such as fiber optic telecommunications, gigabit Ethernet, 10Base-T and frame relay applications. Low power dissipation, stability over temperature range, high shock and vibration resistance, and a large pulling range are rep

Programmable Plastic SMD Oscillator

Housed in a 9.8 x 14.0 x 4.7 mm plastic surface mount J-lead package, the EP1400SJ and EP1500SJ feature custom or standard frequencies ranging from 1 to 125 MHz. Options include tri-state or power-down functions, ±50 or ±100 ppm frequency stability, and CMOS or TTL output. The former is a 5.0 V device, and the latter offers 3.3 V for low-voltage applications. The series is also available in a 14 or 8-pin hermetically sealed package and a ceramic SMD package.

Switching Regulator Ics

The S-8321, S-8322, S-8323, S-8324, S-8327 and S-8328 Series CMOS switching regulator ICs measure 2.8 x 2.9 x 1.3 mm in SOT-23 packaging. They have an internal oscillation frequency of 30 to 100 kHz, with a high oscillation frequency of 250 kHz available. The regulators are available with an internal or external switching transistor with either pulse frequency modulation (PFM), pulse width modulation (PWM), or both PFM and PWM controls.

Silicon Chip

The QRC 1284X2 chip is said to be the single-chip solution to IEEE 1284 parallel-port line filtering and termination. The 28-pin QSOP package uses thin film (tantalum nitride) on silicon technology. In each chip, there are reportedly 17 capacitors, 17 pull-up resistors and nine termination resistors; for each of the 17 signal lines, a diode structure provides 8 kV of ESD protection.

Surface Mount Oscillators

Designed for applications requiring extremely small size, the S3883-32.768 kHz series surface mount oscillator is only 2 mm in height. This single device is said to replace up to four common but hard-to-match devices used by most companies building their own 32.768 kHz oscillator out of separate components. Available for 5.0 V operation with power consumption of 10 µA typical, 3.3 V operation with power consumption of 8 µA typical, and 2.7 V operation with power consumption of 7 µ

J-lead Terminal Configuration

This J-lead terminal configuration has been added to the Series 219 surface mount SPST DIP switch line. Ongoing miniaturization of electronic equipment and associated internal PCBs have necessitated that manufacturers further miniaturize components used on PCBs to allow for compact placement. Unlike conventional gull-wing surface mount terminal configurations, where the terminals extend away from the body of the DIP switch, the J-lead construction forms the terminal alongside and under the produ

Compact TCXOs

The CFPT-120 series of compact surface mount TCXOs offers frequency stability down to ±2 ppm over an operating temperature range from -10° to 60°C. Housed in a 10-pad package measuring 7.0 x 5.0 x 2.0 mm, the series is aimed at both high- and low-volume applications in the mobile communications industry. It is available in a range of frequencies between 12.6 and 19.8 MHz. For error correction in the incoming signal, a voltage control facility allows the end user to trim the freque


Tantalum Chip Capacitors

The TCM Series of molded chip tantalum capacitors are designed for use in thick-film hybrid circuits. They are also reportedly suitable for direct mounting on PCBs. These chip capacitors are said to offer good resistance to mechanical stress and moisture because of their fully molded construction. The TCR Series offers resistance against rush current. These capacitors are reported to have failure rates of 0.5 percent or less per 1,000 hours, even in low-impedance circuits. Capacitance can be as

Integrated Circuit

This CMOS IC is included in a series of VCXOs and TCXOs. The 2GIC features CMOS and TTL-compatible output waveforms, frequency capability ranging up to 100 MHz, integrated Automatic Gain Control (AGC) ensuring oscillator startup through many conditions, and an available supply of both 3.3 or 5.0 V.

Modular Connector System

The COMPODRE System consists of a shroud with internal pods that accept any combination of Mini-Fit and Micro-Fit connectors. The connector is designed to save space by consolidating multiple connector requirements into one package and is said to be a cost-effective way to customize interconnects. Its modular design reportedly requires no tools for assembly. The latch system on the shroud produces an audible click to indicate proper connection and also helps prevent accidental unmating and subse

Publishers Executive Council Interview

SMT Magazine`s Publisher`s Executive Council consists of 38 electronic industry executives hand-picked by group publisher Marsha Robertson. They share their expertise and insights with our editorial staff and act

CM Capabilities

GET Manufacturing offers: full-systems turnkey manufacturing through box build (PCBA-level through system build, integration, test and pack-out); low- to medium-volume short runs, engineering builds and prototypes; concurrent engineering of new OEM products using DFM, DFT and DRC; PTH and SMT (sub-0.4 mm pitch, 0402 packages, BGA/microBGA assembly, repair and failure analysis); IPC-610 certified personnel; product fulfillment and OEM worldwide sales order distribution; product repair and refurbi

Prototype Stress Screening

Screening Systems manufactures a wide range of environmental stress screening (ESS) products for highly accelerated life test (HALT) and highly accelerated stress screening (HASS) applications. The company offers HALT and HASS testing services on prototypes and early pro- duction units to empirically determine the products` operational limits. These services are said to be particularly valuable when a developer desires rapid results on a prototype.

Small Prototypes to Mass Needs

Committed to serving and supporting companies with small prototype runs to mass production needs, Surface Mount Assemblies LLC offers: PCB assembly; through-hole; mixed-technology; test and burn-in; conformal coating/potting; turnkey capability; redesign of through-hole to surface mount or mixed-technology; wave solder; subassemblies; and quick-turn service. Engineering capabilities include design to specifications, product reengineering and board layout. In-circuit and functional testing are su

Laser

This 100 W, diode-pumped, Q-switched laser is called Scimitar. It is suitable for micromachining, semiconductor processing, welding, drilling, surface modification, cutting, trimming, soldering, texturing, percussion drilling, ablating/cladding, scintering, marking, engraving, rapid prototyping and laser forming. Standard units are available operating in CW mode or equipped with acousto-optic Q-switches providing operation from 1 to 50 kHz.

Electronic Label

The iButton is an electronic label with a memory chip. It is similar to a bar code because it has a unique (never-duplicated) 64-bit serial number that can be used for tracking purposes. Data can be written into the product and stored with the object on which it is attached. It allows the data (up to 8 KB) to be changed with just a touch. This product is suitable for applications where the data is required locally and changes relatively frequently, such as when tracking vehicles, trailers, shipp

Printer Applicators

Designed for the challenges presented by small product-identification requirements, chipboard cartons, small packages and similar applications, ValuePro 3240 is said to offer print and apply capability for labels as small as 0.5 x 0.5" (12.5 x 12.5 mm), with speeds up to 30 labels per minute. Its plug-and-play approach to automation reportedly allows installation on the line or use as a stand-alone system. When installed on-line, startup occurs by plugging in a photo eye to the external port or


Engraving System

The Viper 1810 engraving system features pre-loaded lead screws and ball slides for machine tool-like performance and rigidity said to be suitable for any industrial envi- ronment. The system comes with a high-speed spindle along with a diamond-drag tool used for fine-line markings on coated or raw surfaces. The control system works in a Windows 98 environment and can import directly from more than 20 different file formats.

Optimized BGA Inspection

The BGA II inspection package is an optimized version of the company`s machine vision hardware and software package for inspecting BGAs for missing, misplaced or improperly formed solder bumps. It reportedly combines the accuracy and reliability of the company`s original inspection package with MMX-accelerated inspection capability. The system is said to be able to inspect up to 10,000 solder bumps per second and offer support for large-format, high-resolution cameras. It also offers new softwar

NEPCON West 2000 will be held February 29 through March 2, with conferences running from February 27 through March 2, 2000, at the Anaheim Convention Center, Anaheim, Calif.

NEPCON West 2000 will be held February 29 through March 2, with conferences running from February 27 through March 2, 2000, at the Anaheim Convention Center, Anaheim, Calif. Scheduled features include a lead-free Technology Advancement Center (TAC) line and Contract Manufacturing Demonstration Line, pick-and-place evaluation center, a broadened technical conference, special industry events and the latest equipment. The show will host more than 700 exhibiting companies, representing electronics d

TAC

This year`s TAC, organized by RRA Technical Services Inc., will include five newly designed and developed assembly lines showing state-of-the-art assembly technology. New processes that will be demonstrated in TAC 2000 include a lead-free operation and another line that uses a solder paste alternative process.

Pick-and-place Evaluation Center

A strategic approach to evaluating assembly pick-and-place equipment will be unveiled at the new Pick-and-place Evaluation Center. In the 2,000 sq. ft. facility, visitors can evaluate pick-and-place equipment from some of the industry`s major manufacturers. Four high-speed placement machines will be on display, set up side-by-side, with third-party tech- nical experts providing in-use feedback and interpretation of manufacturers` published machine specifications. The physical demonstration of th

Conference

The conference kicks off February 27 and includes more than 100 sessions in the following tracks: design, assembly, HDI, inspection, management, packaging, test and contract manufacturing. The conference also features sessions on lead-free solder, including: Lead-free Soldering Options; Lead-free Soldering: Status and Technology Review; and Impact of Lead-free Solder on Global Manufacturing.

Special Events and Technology Feature Areas

Numerous special events, many of which are free to attendees, include: the opening day keynote speech by John Madden, football legend and broadcaster; Industry Keynote Address given by Dr. Buzz Aldrin, Astronaut; Contract Manufacturing Symposium; Contract Manufacturing Executive Forum; Advanced Packaging Symposium; International Panel Discussion, "Technology and Processes - What Does the Future Hold for the Industry?"; Excellence Awards; Best In Test Awards; Service Excellence Awards; and ASTE T

Product Launches

In its 35-year history, NEPCON West has been the launching pad for many new electronics manufacturing products and technologies, and this year, organizers expect more exhibitor product launches at this show than in any show in the event`s history.

Odd-form Assembly

With increasing demands placed on component structure, finding methods to improve automated odd-form component placement is paramount.

Reflow Oven Flexibility

A flexible reflow oven is required to accommodate multiple SMT manufacturing processes, functions and applications. Manufacturers using high-performance reflow ovens achieve increased productivity, throughput and profits via decreased production downtime.


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