Article Highlights
From Participant to Volunteer to Leader: Matt Smith on the IEEE Rising Stars Conference
04/23/2019 | Nolan Johnson, I-Connect007
Eileen Hibbler and Jason Emes on Improving the West Penn SMTA Chapter
04/22/2019 | Patty Goldman, I-Connect007
Innovative Battery and Pressure Sensor Technologies
04/19/2019 | Nolan Johnson, I-Connect007
DSG: Breaking Ground on the Smart Factory Revolution
04/17/2019 | Barry Matties, I-Connect007
A Working Definition of Automation
04/16/2019 | Happy Holden, I-Connect007

Latest Articles

Real-time SPC with AOI

While automated optical inspection (AOI) has been integrated successfully into many production lines, much additional useful data for the inspection process remains to be used. How? Enter statistical process control (SPC) . . . and a "catalyst."

Publisher's Executive Council Interview

SMT Magazine's Publisher's Executive Council consists of 38 electronics industry executives hand-picked by publisher Jim Collins.

New Products

Aqueous Circuit Board Cleaner; Turret-based Chip Shooters; Solder Machines

Practical ideas on Large-board Printing

Tips for production printing of the latest large-panel PCBs are provided, including handling, tooling, processing, vision and understencil alignment, and accessib

Achieving Long-term Stability in the SMD Placement Process

This article provides a short description of the MCT process, together with the essential fundamentals of placement accuracy. It then introduces a special calibration method which allows for placement accuracy testing to help meet today's pressing market demands.

TheSupply and Create E-Marketplace

May 30, 2001 - Co-branded exchange launched to re-market and sell high value, surplus semiconductor equipment.

EMI/RFI Industry Leaders Merge

May 29, 2001 - Instrument Specialties Co. and APM combined to create Laird Technologies.


ADHESIVES, COATINGS AND ENCAPSULANTS - Microcure 5100 - The Lambda Technologies MicroCure 5100 curing system features patented Variable Frequency Microwave (VFM) technology. This eliminates the hot spots and arcing associated with conventional microwave technology, allowing significantly faster curing of standard, qualified encapsulants and adhesives. By reducing cure times to five minutes or less, VFM meets the critical industry challenge of

Assembléon Mexicana S.A. de C.V. Celebrates Grand Opening in Guadalajara

May 24, 2001 - New company offers training, customer service engineering and application engineering.

Park Announces Major Expansion of its Nelco Singapore Facility

May 24, 2001 - Expansion program to increase facility's annual manufacturing capacity from $120M to $200M.

Online Assessment Tool Locates Electronics Employees

May 23, 2001 - Fitability for Employers offers powerful "job matching" and selection tools.


ADHESIVES, COATINGS AND ENCAPSULANTS - Reflow Encapsulant - The key characteristic of the SE-CURE 9101 reflow encapsulant is its dual functionality, it behaves like a flip chip flux and underfill encapsulant in a single component. The reflow encapsulant is an epoxy-based material which can be applied by dispensing and has excellent tack strength to hold components in place during processing. After components are reflowed, a secondary cure oper

WebQuote and Valor Partner in Online PCB eCommerce

May 22, 2001 - Partnership develops an integrated, Web-enabled PCB procurement solution driven directly from the design engineer's desktop.


ADHESIVES, COATINGS AND ENCAPSULANTS - Continuous Cure Oven - The 788 in-line, continuous cure oven incorporates a vertical transport mechanism to provide curing times of up to four hours within as little as 6' of factory floor space. A single 788 can reportedly replace up to three batch ovens, saving floor space allocation costs and eliminating the need for manual loading and unloading of batch ovens. Automated curing improves process consist

GE Electromaterials Launches Online PCB Design Site

May 21, 2001 - Online printed circuit board design center integrates the life-cycle design process and a platform for supply-line management.

Cookson Introduces e-Leaning System for PCB Manufacturers

May 21, 2001 - Cookson Performance Solutions introduces a comprehensive curriculum of 29 new online courses designed to train operators involved in PCB assembly.

Tektronix and GenRad Partner

May 21, 2001 - Tektronix's optical test equipment incorporated into GenRad's functional test systems to create a fully integrated optical test solution.

ATExpo Re-engineers Technical Conference

May 21, 2001 - Assembly Technology Expo features over 40 sessions developed by engineering experts with assembly experience.


ADHESIVES, COATINGS AND ENCAPSULANTS - Encapsulants - The "9000" series encapsulants made of a urethane resin cures with UV light in 15 to 90 sec. The encapsulants come in a full range of thixotropic viscosities, and because the encapsulants are aerobic and solvent-free they require no refrigeration during storage. Under these conditions, the shelf life is one year. The encapsulants may be used for chip-on-board, MCMs and smart cards. The enca


ADHESIVES, COATINGS AND ENCAPSULANTS - Environmentally-Benign Solder Replacement - "Poly-Solder" conductive adhesive provides highly stable electrical junctions with performance akin to solder joints. A patented contracting polymer binder system, filled with special penetrating conductive particles, is the key to stable electrical connections that endure temperature and humidity as well as thermal cycling. Engineered polymer compression during


ADHESIVES, COATINGS AND ENCAPSULANTS - Ormet - Ormet inks are a revolutionary conductive ink technology that can replace plated and etched copper traces on printed circuit boards. The inks are based on recent discoveries in powder metallurgy and polymers that allow the creation of silver-free thick film inks that fire at low temperatures yet achieve stable high electrical conductivity. The inks meet or exceed IPC, Mil Std, and Bellcore specifi


Large-panel Board Printing, Stencil Cleaning Guidelines, Dynamic Process Control and Component Placement are all featured in the June 2001 issue

Dow Corning and Krayden Form Strategic Supply Alliance

May 10, 2001 - Dedicated team to service the Rocky Mountain Region, Texas, Oklahoma and Mexico.


ADHESIVES, COATINGS AND ENCAPSULANTS - Liquid Photoimageable Soldermask - Aquamask H20/501 is waterborne, water-thinnable and said to reduce environmental hazards for operators. It is not air-polluting, and has IPC SM840B Class III approval and UL 94 V-0 rating. Improves resolution, flexibility and flex circuit performance. - Advanced Systems Inc.

Smart Sonic Introduces Industry's First Independent Stencil Dryer

May 7, 2001 - Elimination of the drying cycle allows the stencil cleaner to continue cleaning while drying is accomplished independently.


Important, often used surface mount technology terms and acronyms compiled by the editors of SMT Magazine.

Intrinsix and Sanmina Align; Sanmina Launches Circuit Performance Tool

WESTBORO, Mass.; SAN JOSE, Calif. — Intrinsix Corp., an independent ASIC and System design company, teamed with Sanmina Corp. to provide complete electronics design and manufacturing solutions.

Departments, Factories and Customers as One

To compete in today's fast-changing, competitive electronics industry, manufacturing enterprises must operate at a scale that is compatible with customer demands. But as they grow, they also must improve the flow and usefulness of manufacturing information.

3-D or 2-D - Choosing with Today's Technology

Recently, this question arose during a presentation: "Competitors are pushing three-dimensional (3-D) X-ray inspection as the best way to inspect ball grid arrays (BGA) and chip scale packages (CSP). Do I need to spend the extra money to ensure my production quality?" My answer, as usual, was yes — and no.

Integration of X-ray Inspection and Rework improves SMT yields

Limiting a manufacturer's vulnerability to loss of yield and profitability requires a well thought out proactive strategy. As the market pushes for smaller component designs, connections occur in significantly less space.

Stencil Cleaning

In recent years, stencil and misprinted printed circuit board (PCB) cleaning has become a significant issue for an increasing number of SMT manufacturers. In a typical PCB assembly line, solder paste is printed through screens or stencils.

NEPCON East and Electro Preview

NEPCON East is an opportunity to get "hands on" experience with innovative design, packaging, fabrication, assembly and test solutions. The conference offers many opportunities for attendees to gain new skills and update technical knowledge, such as product demonstrations, specifications available for review, workshops and more.

New Products

Combined AOI/AXI Inspection System; Hand-held Dispensing System; Cleaning/Rinsing/Drying System; Vectoral Imaging...

SMT 101: Adhesives, Epoxies and Dispensing

SMAs were developed in the 1980s specifically for bonding non-through-hole devices to printed circuit boards (PCB). Accordingly, SMAs were designed to provide qualities specific to SMT processing.


Links to industry association web sites important to SMT Magazine readers.

Get Beamed@Pall Microelectronics at SEMICON Europa

April 18, 2001 - Pall announces the first downloadable pocket show guide for SEMICON Europa.


TCM Manufacturing Software, 2-D Inspection Systems and Placement are all featured in the May 2001 issue.

Step 10: Rework & Repair

The rework and repair of printed circuit boards (PCB) has never been more critical to the success of contract electronics manufacturers (CEMs) and OEMs than it is now. As repair and rework have grown in importance, the tools and procedures necessary to properly perform the work have become increasingly sophisticated – from solder/desolder machines, soldering irons and tips to hand tools, solder paste application equipment, cleaning chemistries and more.

Defining Surface Mount Equipment Performance

The IPC 5-41 subcommittee, comprised of both SMT equipment users and suppliers, is developing the IPC-9850 standard, which simplifies the evaluation process by standardizing the performance parameters that describe placement machine capabilities.

SMT PERSPECTIVES - Complete Series

SMT Perspectives, the forum where SMT industry leaders express their opinions on the latest and hottest topics!


Now in one place is SMT's entire 2000 Step-by-Step Series that maps out the complete SMT process in 10 steps. Even for industry veterans, this series can serve as a resource that explains in detail the different aspects of SMT.


April 12, 2001 - Featuring Assembly Tools & Equipment

Speedline Announces Organizational Changes

April 11, 2001 - Franklin, MA - Speedline Technologies centralizes the management of its research and development, product development, manufacturing, procurement, and marketing functions.

SCI Systems and e4eNet enter eCollaboration partnership

QUINCY, MA - e4eNet enters into a joint development partnership for engineering collaboration services with SCI Systems.

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement requirements.

Publisher's Executive Council Interview

SMT Magazine's Publisher's Executive Council consists of 38 electronics industry executives hand-picked by publisher Jim Collins. They share their expertise and insights with our editorial staff and act as a sounding board for new editorial concepts and projects.

Step 4 — Printing

In the reflow soldering of surface mount assemblies, solder paste connects the leads or terminations of surface mount components to the lands. There are many variables in this process — paste, screen printer, paste application method and printing process.

Metal Stencil Overview

A definite learning curve exists when ordering the stencil for a printing process. When familiarization with its technologies helps produce desired results, the stencil becomes a constant in an otherwise variable assembly operation.

Is Outsourcing for Everyone?

Over the past few years, contract manufacturing (CM) activities have exploded. Before eagerly embracing this alternative, however, these elements should be evaluated: What factors are encouraging the trend? What criteria determine the decision to outsource? Should everything be outsourced? And, how is control maintained when products are made by others?

Micro Dispensing Comes of Age

With semiconductor components and packages continuing to shrink in size, dot diameters of 0.01" and under mandate an "integrated engineering" approach to the design of dispensing equipment.

Design for Assembly: High-density Circuits for Hand-held and Portable Products

Chip scale ball grid array (BGA) packaging is seen by many as a viable answer to the space restrictions necessitated by new generations of hand-held and portable electronics products, as well as to the demand for their higher functionality and performance.

New Products

Automated Robotic Soldering from Automation Unlimited Inc., a Division of MRSI Group Co., Woburn, Mass; Product-controlled Manufacturing from Siemens AG, Nuremberg, Germany; Microfocus X-ray from phoenix|x-ray Systems + Services, Camarillo, Calif....

Will Slowdown In Computer Industry Hamper EMS Growth?

The electronics manufacturing services (EMS) industry provides service at minimal cost. To remain strong in the low-profit margin computer market, however, large EMS providers should pursue scale economies, while smaller providers must closely define their niche.

Accepting the PCB Test and Inspection Challenge

The past couple years have witnessed a surge of interest in infrared (IR) technology as a mechanism for testing printed circuit boards (PCB) and assemblies. OEM and contract manufacturers (CM) are experimenting with innovative IR tests at various phases of the PCB production process.

CM News

Solectron Acquires Facility, Adds Management; MSL Adds Facility, Names Marketing VP; Visteon Develops Electronic Module...

OEM Print Engines

New is the Zebra PAX3 family of OEM print engines.

Handling Moisture-sensitive Devices

Moisture/reflow sensitivity of plastic encapsulated components is a critical manufacturing issue that cannot be dismissed with "easy-to-follow" assembly procedures.

Test Boards Simplify Flip Chip Underfill Processing

Used with nondestructive micro-imaging, test boards can cut costs and complexity by rendering results acoustically visible.

Step 3 — Solder Materials

This overview of both leaded and lead-free solder materials focuses on the properties and characteristics important to applications in electronics packaging and assembly.

New Products

Machine Vision Board; PC-based Field Solver; Wavelength Sensor and Circuit; Dam-and-fill Products ...

APEX 2001 Review

More than 6,900 attendees gathered at the second Electronics Assembly Process Exhibition and Conference (APEX), which was held from January 14 to 18, 2001 at the San Diego Convention Center in San Diego, Calif.

The 2000 VISION Awards

Innovation took center stage at SMT's 2000 VISION Awards ceremony, held in conjunction with the IPC/SMEMA Assembly Process Exhibition and Conference (APEX) in San Diego on January 16, 2001.

Survival in the SMT Soldering Equipment Market

Survival in the SMT Soldering Equipment Market Trends and strategies to help SMT soldering equipment manufacturers stay successful in the constantly changing market are detailed.

Trends in Miniaturization

Product designers increasingly specify smaller components to achieve more board density and provide more product functionality. The upswing of 0201 component use offers a dramatic impact on PCB real estate and allows new investment opportunities for manufacturers previously unable to capitalize on miniaturization trends.

EtroniX 2001: Six Shows in One

ANAHEIM, CA - EtroniX covers entire electronics supply chain -- from design, advanced packaging and components, to supply chain management, test, and production.

NEPCON Production & Support Exhibition and Conference and EtroniX Show Guide

This year, NEPCON Production & Support Exhibition and Conference (formerly NEPCON West) will be joined by five key industry events to form EtroniX. A new six-shows-under-one-roof event, EtroniX will provide solutions for the entire electronics supply chain — from design, advanced packaging and components, to supply chain management, test and production.

From Roadblock to Routine Placement Assembly

While often thought of as a fairly recent development, the printed circuit board (PCB) assembly process known as SMT has been available since the early 1950s. Since then, the need for increasingly smaller, lighter and faster electronics has been driving component, PCB and assembly equipment technologies in the direction of SMT.

Next-generation Reflow Technology

Worldwide lead-free solder paste implementation figures to quicken as components become more diverse, ranging from large ball grid arrays (BGA) to ever finer-pitched parts, and requiring the new reflow ovens to provide more precisely controlled thermal transfer.

Basic Metallurgy and Wavesoldering Trends

For wave soldering to be fully accepted in the electronics industry, metallurgists, industry and governing agencies must work together and extensive research must be conducted.

Automating the Dispensing Process

Manual, time/pressure and automated dispensing systems all have their appropriate places within the manufacturing support spectrum; the evolution of one system to the other follows a logical progression.

Step 2 — Process Control

The path to defect prevention starts with a good process quality plan. Process quality determines product quality, whose main goal is to limit and reduce variations toward creation of a healthy process. This plan should outline the methods used to monitor products and processes.

IPC Sets Dates for APEX 2002

NORTHBROOK, IL - IPC SMEMA Council's APEX 2002 will take place January 20-24, 2002 in San Diego.

SMT Announces VISION Award Winners

SAN DIEGO, CA - SMT Magazine recognizes outstanding innovations in new products and services for the electronics manufacturing industry at VISION Awards ceremony.

440-R SMT Detergent Nominated for EPA Award

440-R SMT Detergent used in the Smart Sonic Stencil Cleaning Process nominated to receive EPA's Presidential Green Chemistry Challenge Award.

3-D Solder Paste Inspection

As the geometry of surface mountable advanced packages decreases while product packaging density increases, solder paste-related problems continue to top many manufacturers' lists as the leading source of defects and is compounded by the fact that the new devices are more difficult and expensive to rework.

SMA Dispensing Trends

Each leading technique for SMA dispensing is outlined and explored as relating to modern SMT production environments, including a review of the fundamental tradeoffs between different SMA dispensing methods to achieve optimal SMT production results.

Automation Addresses Odd-form Assembly

It is no longer a question of whether capable handling equipment is available. Rather, are the technology and equipment properly matched to the task?

New Advances in AOI Technologies

A useful supplement to in-circuit test (ICT), automated optical inspection (AOI) accurately identifies and recognizes component variability on printed circuit boards (PCB), thereby improving overall system performance.

Contract Manufacturer in Motion

SAN JOSE, Calif. — Sanmina reportedly has become North America's largest high-end printed circuit board (PCB) fabrication service provider.

The Paperless Factory Comes of Age

An evolution in CIM software fulfills its promise: An advance well beyond simple document viewing that combines the benefits of effective data preparation, electronic revision control and automatic engineering change dissemination.

APEX 2001 pre-show coverage

If you're in electronics manufacturing, you gotta see this show!" is the mantra heard worldwide regarding January's APEX tradeshow.

SMT Adhesive Deposition: The Line to Success

Miniaturization is driving the design of new devices that use SMT components on both the bottom- and top-sides of printed circuit boards (PCB). Additionally, industry requirements for increased board reliability and faster throughput are stimulating demand for more robust board assembly processes, resulting in new manufacturing line configurations.

Publisher's Executive Council Interview

SMT Magazine's Publisher's Executive Council consists of 38 electronics industry executives hand-picked by publisher Jim Collins. They share their expertise and insights with our editorial staff and act as a sounding board for new editorial concepts and projects.

Machine Vision Placement Considerations

Machine vision's critical role in surface mount device (SMD) placement begins by locating printed circuit board (PCB) fiducial marks, assuring device alignment, and performing tolerance checking or inspection.

Lead-free Processing: Thermal Effect on Components

A major concern in the switch to lead-free solders is the impact higher reflow temperatures will have on surface mount components. Although numerous lead-free alloys have been proposed as replacements for conventional Sn/Pb, the feasible replacements mostly are Sn/Ag/Cu alloys.

Rethinking the Use of Commercial Components

By their sheer volume, the commercial industries have influenced the buying power of the military. Regardless of how critical a project, the parts needed to complete a design may not be an option. The same vendor who fulfilled critical specifications years ago is no longer interested in low-volume, poor yield, labor-intensive design-to-specification.

Publisher's Executive Council Interview

SMT Magazine's Publisher's Executive Council consists of 38 electronics industry executives hand-picked by publisher Jim Collins.

2000 Vision Awards

Vision Award 2000 - It takes vision to anticipate how technology will change and how products and services must evolve to stay current. Today's best companies seek these future challenges and respond with creativity and innovation. Each year, SMT Magazine recognizes outstanding companies whose products or services in surface mount technology serve as the benchmarks of excellence ...

Analyzing Lead-free Wavesoldering Defects

A European consortium and others have concluded that Pb-free soldering is technologically possible, but implementation issues first must be addressed, including the VOC-free flux technology and whether the process must be modified to accommodate required higher soldering temperatures.

How Clean Is Clean Enough?

A common question that rings through our technical support line is, "What is IPC's standard on cleanliness?" This is a simple, straightforward question often asked by industry novices, so a simple, straightforward answer usually is what they want. However, in most cases, this is not specific enough for their individual needs.

Roadmap to BGA Standards

At a 1994 meeting of the Surface Mount Council (SMC), the subject of SMT standards was at the top of the agenda. Emerging technologies forced a discussion as to what was becoming standard protocol. The meeting revealed there was no definitive standard for the new technologies.

Deep Recess Penetration

Conformal coatings are commonly used for mechanical and electrical isolation of electronic circuit assemblies, sensors and transducers, automotive components, medical devices, and various other industrial products.

Publisher's Executive Council Interview

Magazine's Publisher's Executive Council consists of 38 electronics industry executives hand-picked by publisher Jim Collins. They share their expertise and insights with our editorial staff and act as a sounding board for new editorial concepts and projects ...

New Products

Circuit Assembly Materials from Thermoset, Lord Chemical Products, Indianapolis, Ind.; Film Adhesives from APS TechFilm, Peabody, Mass.; X-ray Inspection from Glenbrook Technologies Inc., Randolph, N.J.; Tray Handling from Pro Automation Inc., Garden Grove, CA. ...

Component Specifier

High-voltage MOSFET from Fairchild Semiconductor, Acton, Mass.; Temperature Sensing from International Rectifier, El Segundo, Calif.; Power Supply from BIAS Power Technology, Roanoke, Va.; Dual Transformers from Bel Fuse Inc., Jersey City, N.J. ...

CM News

IBM VP Moves to Solectron; New President & CEO for GroupTech; Irish Manufacturing Commences; Organizational Overhaul ...

PCBs Challenge Test & Inspection

Printed circuit board (PCB) manufacturers continually are faced with test and inspection challenges. Increased board density is challenging traditional bed-of-nails in-circuit test (ICT) as well as visual inspection by human operators.

EMS Market for the North American Communications Industry

Telecommunication (telecom) and datacommunication (datacom) OEMs accept outsourcing as a viable business model because electronics manufacturing services (EMS) organizations are furthering their service expertise swiftly.

New Products

Depaneling Systems from MJ automec USA Inc., Grand Prairie, Texas; Stencil Printer from Automated Production Systems Inc., Huntingdon Valley, Pa; Profiling Equipment from Saunders Technology Inc., Hollis, N.H.; Four-head Placement from Manncorp, Huntingdon Valley, Pa ...

Soldering Equipment & Materials

Soldering is a critical step in the SMT process. Because high reliability and throughput rates rely on defect-free soldering, it is important that soldering equipment and materials meet the needs of the assembler.

Technology Drives Process Solutions

Ultra-small footprint passives, such as 0201 components, are a hot topic in the electronics industry. Existing as a compliment to high input/output (I/O) devices, such as chip scale packages (CSP) and flip chip technologies1, these components are needed for electronic package miniaturization.

Modern PCB Test Strategies

Design for test (DFT) is not the job of an individual, but a group with representatives from design engineering, test engineering, manufacturing and purchasing. Design engineering must specify the functional product and tolerance requirement.

Reworking Area-array Packages

Over the last several years, standard area-array devices [ball grid arrays (BGA), chip scale packages (CSP), flip chip, etc.] have become preferred packages in design and manufacturing. Reasons for moving away from traditional leaded packages include increased input/output (I/O) per unit of printed circuit board (PCB) area ...

Streamlining Production and Device Programming Processes

Increasing time-to-market pressure continually presents high-volume electronics manufacturers with the challenge to streamline production. Recent advances in manufacturing equipment and processes means that many traditional production constraints no longer exist.

Effects of Bi Contamination on Sn/Pb Eutectic Solder

Aternary phase diagram of Sn/Pb/Bi1 indicates the presence of a ternary eutectic composition of 16Sn/32Pb/52Bi with a melting temperature of 96°C. Additionally, two low-temperature binary eutectic reactions — 43Sn/57Bi at 139°C and 43.5Pb/56.5Bi at 125°C — extend into the ternary domains.

Mass Reflow Assembly 0201 of Components

The need to reduce the size and weight of electronic products continues as SMT advances. Size reductions of passive components, coupled with improved printed circuit board (PCB) technology, produces smaller, lighter and higher performing end products.

Step-by-Step: Cleaning

Lead-free alloys will change soldering technology as well as the entire manufacturing process, including assembly materials and components. Additionally, this change highlight questions relating to awareness and dissemination of existing information, materials availability, soldering technology, and implementation requirements.

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement requirements.

EMS News

Communications Drives Southeast Asia; Solectron and Nortel Continue to Deal; MSL Expands in U.S. and Overseas ...

Implementing AOI in a CM Environment

The SMT contract manufacturing (CM) world is undergoing dramatic changes. Many companies are growing more than 40 percent per year, as OEM companies in the telecommunication, computer and other industries divest themselves of assembly operations.

Board-support Analysis During Component Placement

Various board-support tooling systems are available for processing, including manually placed pins, automatic programmable arrays and custom-machined plates.

Industry Calendar

A listing of industry events.

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement requirements. Modern manufacturing techniques are useless if a board's components are out of date ...

New Products

Chip Placement Machine from Juki Automation Systems, Morrisville, N.C.; Resettable Fuses from Raychem Circuit Protection, Div. of Tyco Electronics, Menlo Park, Calif.; Batch Cleaner from Speedline Technologies Asia, Division of Cookson Electronics, Singapore; Next-generation Vision System from Cognex Corp., Natick, Mass. ...

SMTA International 2000 Preview

SMTA International (SMTAI) will be held September 24 to 28, 2000, at the Donald Stephens Convention Center (formerly Rosemont Convention Center) in Rosemont (Chicago), Ill. Dedicated solely to surface mount, advanced packaging and related technologies, SMTAI is an event featuring a comprehensive technical conference and special symposiums.

SMTA International 2000 Products

BGA Inspection from O.C. White Co., Three Rivers, Mass.; Mobile Training Center from BEST Inc., Rolling Meadows, Ill.; Thermal Shock Resistant Epoxy from Loctite Corp., Rocky Hill, Conn.; SMT Pins, Headers from Zierick Manufacturing Corp., Mt. Kisco, N.Y. ...

In-process Quality Control: The Route to Zero-defect Manufacture

The end goal of implementing AOI will determine where it should be placed in the line and what process control information will be generated.

Alternative processing for forming solder joints with lead-free solder alloys

This article describes the results of recently completed research that indicates liquid-phase enhanced sintering of solder paste may be an alternative processing technique for developing lead-free solder joints.

The Relationship Between Throughput and the Number of Placement Heads

More heads for a pick-and-place machine do not always add up to greater throughput.

DPMO: A Tool for Achieving World-class Process Quality

When used properly, DPMO is a more effective quality measurement tool than first-pass yield.

Underfill Design and Process Considerations

As circuit densities have increased and product form factors have diminished, the electronics industry has spawned a variety of new methods for integrating chip-level designs more tightly with board-level assemblies. To a great degree, the emergence of technologies such as flip chip and chip scale packaging (CSP) have effectively blurred the traditional lines of demarcation between semiconductor die, chip packaging methods and printed circuit board (PCB) assembly-level processes.


Reflow soldering surface mount components is now two decades old. While the fundamentals have not changed, there have been advances in component packaging and materials, plus a new generation of "convection-dominant" reflow ovens that promise vastly improved heat-transfer efficiency.

CM News

Large CMs Continue Impressive Growth; MCMS and Avail Partner; SMTC to Acquire Pensar; International Expansion Continues; EMI Expands Headquarters ...

PCB Fabrication: Achieving solderable finishes

Today's ultra-fine-pitch components create a challenge for manufacturers not only to meet board surface planarity requirements using conventional processes, but also to deliver more reliable products faster and cheaper.

EOL Automation: Pushing Profitability Forward

The advantages of EOL combine to generate an ROI that is more favorable than current automation processes.

Rework Process for MicroBGA and CSP

As electronic assemblies become smaller, fine-pitch micro ball grid arrays (microBGA) and chip scale packages (CSP) meet the requirements for smaller, faster and higher performance electronic products. These low-cost packages can be found in many products such as laptop computers, cell phones and other portable devices.

BGA Solder Joint Vibration Fatigue

When soldered to a substrate or PCB, BGAs can reduce substrate interconnection area, complexity and cost, as well as facilitate assembly automation. However, because of a general lack of compliance in BGA solder joints, their failure in a military vibration environment becomes a serious design concern.

Continuous Improvement Approaches for Wave Soldering

If an effective process control system can be implemented with the appropriate preparation and support, most of the problems that arise in the wavesoldering process can be eliminated or at least minimized to an acceptable level.


SEMICON West 2000, San Jose, Calif., SEMI, (650) 964-5111; Fax: (650) 967-5375; E-mail:; Web site: ...

New Products

Optical Inspection from Teradyne Inc.; Code Reader from Microscan Systems Inc.; Inspection Camera from Viscom USA; Solder Paste Inspection from CyberOptics Corp; Thermally Conductive Epoxy from Loctite Corp....

EMS News

Chinese Facility to be Developed; 'Mini-warehouse' Added to Service Offerings; Viasystems Completes Acquisition, Chooses Software; East Coast EMS Provider Expands; Qualcon Wins Award ...

Bridge OEM/CM Barriers with the Internet

Contract manufacturers (CM) can use the Internet to communicate through the entire business cycle, from order entry to post-fulfillment service. Quality, work in process (WIP) and other production-related information also can be shared. This level of communication brings the CM and its customers into a closer relationship, even if separated by oceans and continents.

Stencil Design for Mixed-technology Placement & Reflow

Reviewing stencil design requirements for mixed-technology boards is essential because full implementation allows through-hole components and surface mount devices (SMD) placement and the subsequent reflow of both simultaneously. This eliminates the need to wave or hand solder through-hole components. Material type, pin type, lead l

Nitrogen and Soldering: Reviewing the Issue of Inerting

While accepted in the wavesoldering process, nitrogen use in reflow ovens is frequently questioned despite a wealth of research.

Are You Ready for Lead-free Assembly?

The lead-free challenge lies in using technology that allows electronics assemblers to maintain optimal thermal processes in the reduced lead-free process window.

Drying Three Times Faster: Jet Manifolds vs. Air Knives

The physical removal of water on PCBs requires far less energy than evaporative removal. But unless air strikes with sufficient velocity to overcome the surface tension, physical removal does not occur.

Web-based Production Monitoring: A Window to the Future

Web-tracking and monitoring tools deliver the information access and control necessary to integrate vendors and customers into the supply chain. By Bryan Philips

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement requirements

CM News

Key Tronic Corp. signed a three-year agreement to manufacture microcircuit material for Cygnus Inc.'s GlucoWatch biographer, a frequent, automatic and noninvasive wrist-worn device for monitoring glucose levels in people with diabetes

Getting More Electronics Assembly Productivity

If mass customization problems can be overcome, it is possible to create an agile manufacturing facility that can handle complex customer demands.

Statistical Tools Promote Bottom-line Improvements

By reducing process variation, SPC helps maximize yields, minimize rework, increase profits, satisfy customers and meet vendor-certification standards

How Strategic OEM/CM Partnerships Can Win the Race-to-market

Products that come to market on budget but six months late will earn 33 percent less profit over five years. In contrast, coming out on time and 50 percent over budget cuts profits by only four percent


Tra-Duct 2958 is a two-part epoxy adhesive formulated for electronic bonding and sealing applications. It reportedly has a long pot life and short cure schedule

SMT 101 Step 6 - Component Placement

This step outlines several key issues necessary for understanding component placement using automated assembly equipment, including positioning, imaging, feeding and flexibility. It can serve as a primer or quick reference for anyone faced with specific component or application challenges, identifying the pros and cons of alternative approaches embodied in the types of equipment selected as part of an overall solution

Height-adjustable Workstations

To meet the needs of multiple operator shifts, the company has released a line of electric height-adjustable memory stations. Featuring a height range of 20", these units can be adjusted to meet sitting and standing applications, reportedly ensuring operator efficiency by allowing adjustment of the surface height from 30 to 50". Available in either 60 or 72" widths, these units are rated to 500 lb of static load, and feature the ability to preset operator height settings for different applicatio

Material-handling Systems

The First In, First Out (FIFO) Buffer is part of the company`s line of redesigned material handling systems. Model 8080 reportedly has been re-engineered and has a stronger drive-and-lift system as well as contemporary extruded metal supports and skins. It is now available in both single- and dual-lane configurations. Also new is the development of individually driven takeup sections for the conveyor belts, which is said to be an important part of dual-lane operation.

PCB-cleaning Film

Unlike conventional paper backing used on other cleaning tapes, Scapa 534 is designed with a polyester film backing that reportedly eliminates the common problem of dust and loose fibers contaminating the PCB. The film backing has a silicone-release coating that is said to make it easy to unwind when dispensing from the roll and a rubber-based adhesive that lifts contaminants from the board.


Dynasolve d-Flux is designed for use in cleaning and degreasing PCBs and equipment used in PCB manufacturing. It is said to quickly dissolve flux, resins, rosins, oils and adhesives from PCBs, testing equipment, and processing equipment. This nonchlorinated, nonflammable (per DOT), noncarcinogenic, nonozone-depleting solvent was designed to replace solvents such as methylene chloride, acetone, MEK, mineral spirits, kerosene and 1,1,1-trichloroethane.

Robotic-liquid Dispensing

This combination of robotic equipment, metering valves and automatic-liquid dispensers is designed to provide consistent, precise applications of glues, silicones, epoxies, solder pastes and lubricants. The unit`s fully automatic mutiaxes configuration is said to enable full control of dispensing to be achieved over 3-D objects. The Z-axis control reportedly enables dispensing at various heights. Point or continuous dispensing are possible during the same-time operations as well as dispensing at

Fume-extraction System

Lab-Evac 150 fume-extraction system features a self-contained work center to remove harmful fumes created from benchtop activities. It features three-stage filtration, including a pre-filter, a HEPA filter and a gas-phase filter. Advanced microprocessor technology reportedly provides continuous filter-condition monitoring, and visual and audible alarms alert the operator when a filter changeout is required. The system has a high-speed fan with variable airflow adjustments.


The newly formulated Safe-Set activators are for use with cyanoacrylate Frame Fast and Sefar Mesh adhesives. These new activators are formulated to have minimal odor, be acetone-free, nonflammable and contain no ozone-depleting chemicals. They are available in aerosol (309) or nonaerosol (308). Both products reportedly yield fast-bonding cycle times and cure adhesives within seconds.

Shielding Gasket

The new low-profile beryllium/copper gasket is said to have a shielding effectiveness up to 100 dB attenuation levels. The finger-stock gasket reportedly measures 0.08 x 0.21" and closes gaps down to 0.025". Stick-on mounting provides pressure-sensitive adhesive for installation and may be used at ambient temperatures from -67° to 300°F. This gasket is said to be suitable for bidirectional applications found on electronic enclosures, is smooth to the touch and requires a low closing fo

Grip Tweezer

Lightweight and ergonomically designed to reduce fatigue, the SofTweezer line of soft-cushion grip tweezers is said to be both ESD and cleanroom safe. Eight different styles reportedly provide a range of grasping, holding and cutting capabilities that are suitable for restricted spaces and repetitive cycles. These products are made in Switzerland from antimagnetic, acid-resistant stainless steel.

EMI Shielding Gasket

Gore-Shield SMT gaskets are said to be high-performance EMI shielding gaskets that can be installed with standard pick-and-place equipment. The gaskets reportedly decrease the total cost of EMI shielding in cell phones and other wireless infrastructure. They employ a form factor and the company`s GS5200 material, a nickel filled expanded polytetrafluoroethylene that is said to be suitable for wireless applications. Rather than a continuous bead, these gaskets are a series of small pads that have

Laser Engraving System

Designed for ultra-high-speed marking on virtually any material, including metals, the Laser Mate II Nd:YAG laser engraving systems are self-contained with laser, base, PC, enclosure, and optional step-and-repeat table for high-volume production on trays or pallets. The graphical open architecture software features date coding, serializing, bar coding, etc. All text can be manipulated in several modes on the front screen, and the software operates in both vector and raster modes. No programming

Bar-code Label Printers

The XiIII industrial label printers feature a 12-gauge steel frame and all-metal casing to provide durability in punishing operating environments. The printers reportedly are designed to perform in any mission-critical application, including 24-hour duty cycles. These systems are said to enable system administrators to leverage wireless messaging and the Internet to stay in constant contact with their printers. They also initiate communication with other devices to provide network administrators

Solder Paste Inspection

SE 300 high-speed, high-resolution, 3-D solder paste inspection system reportedly is capable of performing 100 percent inspection at production line speeds. The system automatically measures height, volume, area and bridging, and notifies the operator of any parameters trending outside user-specified limits. There is a choice of two operating modes: high-speed mode, designed for fine-pitch QFPs and other traditional components, that reportedly inspects 4 sq. in per second; and high-resolution mo

Assembly Cells

The company`s HiSAC range of automated odd-form assembly cells reportedly incorporates a LeadScan Sensing System designed to provide on-the-fly inspection of odd-form, through-hole components. This sensing system is said to improve odd-form placement accuracy by detecting bent and missing leads before component insertion, and regardless of the number of leads or the lead shape or profile. The system uses a scanning technique to inspect each component as it is moved to the placement location.

SMD Rework Station

The ESD-safe Model 852 SMD rework station is said to feature a built-in vacuum pickup with a range of 7 to 20 liters per minute and analog display of airflow control. A lamp alerts the operator when vacuum pickup is in use. Stainless steel nozzles (not included with this model) direct heated air onto component leads while reportedly preventing unwanted heat from affecting neighboring components. Two modes of operation are available: manual (for simple operation) or auto (for programmable process


NZ Nozzles for the company`s QX-2 convection rework tool are engineered to use a "focused-convection" design. These nozzles reportedly ensure that thermal energy is directed only to the target component, which is said to maximize efficiency and minimize board and adjacent component damage. An aperture in the nozzle allows the QX-2`s vacuum pickup to lift the component at the end of the reflow cycle. This ensures that the component is lifted off only after all solder connections have reflowed, w

Implementing CSP Technology: A Controlled Approach to NPI

The contract manufacturer is now viewed more favorably by the OEM for its ability to respond quickly to packaging challenges and especially when the implementation of new assembly technologies, such as those with CSPs, are involved.

Explore Specific Niche Outsource Options

As outsourcing partners gain expertise and experience in certain manufacturing processes, companies are turning to contract manufacturers of all sizes to meet their specific manufacturing needs.

Flextronics Expands Across the Globe

SAN JOSE, Calif. and RALEIGH, N.C. - Flextronics International Ltd. entered into a definitive agreement to acquire Palo Alto Products International Pte. Ltd., a full-service product development company that provides industrial design, mechanical engineering and manufacturing services for the high-tech and consumer markets.

New Northeast Design Center Opened

CONCORD, Mass. - Manufacturers` Services Ltd. (MSL) opened a new Northeast Engineering and Design Center, expanding the company`s critical customer support during the early stages of product development and NPI. The center is located in one of the nation`s fastest growing regions for voice and data communications innovations, and is said to establish the largest center for PCB design in the Northeast with more than 30 design specialists.

Capital Acquired to Increase Capability

LaGRANGE, Ohio - In an effort to aggressively maintain and pursue market share in the Midwest, as well as to create increased capacity for continued customer needs, Inservco Inc., a CM serving the low- to medium-volume marketplace, established a strategic affiliation with MCM Capital Partners L.P., Cleveland. Inservco reportedly is ranked as one of the top 100 CMs in the United States, and this venture is designed to give the company opportunity for continued innovations in the industry.

Delta Changes Name & Acquires CM

ALBUQUERQUE, N.M. - Delta Group Inc., a CM offering turnkey CM solutions and technical services for the aerospace/defense industries and commercial product suppliers, announced the changing of its corporate name to Delta Group Electronics Inc. This is designed to better reflect the scope of the company`s electronics manufacturing and technical services offerings.

Wanted: New Manufacturing Facilities

SAN DIEGO - Qtron Inc., a privately held CM, announced plans to move to a new site in San Diego. Increased levels of PCB assembly sales, coupled with customer pressure to provide system integration solutions, are the reasons sited for the move to larger and more efficient quarters.

CM Deals Completed, Extended

TORONTO; HAUPPAUGE, N.Y.; SAN JOSE, Calif.; and LOUISVILLE, Ky. -Several announcements previously reported in the SMT CM News have continued progressing. The following is an update on four such events:

Safety First at IEC

NEWARK, N.Y. - IEC Electronics Corp. announced that its manufacturing facilities in Newark, N.Y., and Edinburg, Texas, have both gone more than 500,000 hours without a lost-time accident. The Texas facility, which has approximately 570 employees, has reportedly been totaling up safety hours since January 4, 1999, and now has more than 975,000 hours logged without a lost-time accident. In Newark, about 930 employees have worked since November 1999 without a lost-time accident, passing 500,000 hou

Adjustable Workbench

The Height-Right adjustable workbench is said to be ideal for testing, repairing and assembling electronic equipment. The workbench provides 15" of movement from the bottom to the top. It has 1,200 lb static capacity and a 600 lb dynamic capacity.

In-line Programming System

BP-6500 is an in-line programming system that combines pick-and-place and programming functions in one machine. The system can program eight parts concurrently. It places TSOP, µBGA, SOIC, PLCC and QFP after programming.

Automated Programmer

The PP 100 automated programming, handling and marking system programs fine-pitch ICs. The system has universal programming sites that work with a variety of fine-pitch devices quickly and with minimal cost. The system can have up to 12 programming sites, each with up to 84 pin drivers. The system reportedly has a throughput of up to 850 devices per hour. The pick-and-place handler is said to place devices in programming sockets to within 0.005". A laser for marking or labeling parts is optional

Pre-reflow AOI

The KS 100 in-line, pre-reflow inspection system features the proprietary Statistical Appearance Modeling technology. This technology reportedly learns inspection parameters and creates a mathematical model of a good PCB by seeing a few examples of good boards. The system is accurate to 10 µm and repeatable to 3 µm. The system inspects components, connectors, labels, logos and polarity marks.

Placement/reflow/rework System

The Cyclone 2000 placement/reflow/ rework system is said to be designed for precision placement and reflow soldering of CSPs, microBGAs and various other newly developed SMDs. It also performs as a component removal/PCB rework station. The combination of non-tactile laser height measurement, programmable AC servo-driven Z-axis with Z-force control, split vision with motorized zoom lenses, real-time temperature feedback, and advanced software and touch screen control reportedly ensure repeatabili

BGA Rework and Repair

Summit 2100RS can perform rework and repair on BGAs, CSPs and QFPs. The system`s automation allows performance of a single, continuous sequence to complete all four rework operations: removing components, non-contact site scavenging, solder paste applications, and placing and reflowing components. This is accomplished by adding a component print station to the rework and scavenging automated platform. The system has a menu-driven interface for programming the rework sequence.

Benchtop Dispensing

The Dispensit Contour 400-XYZ and 405-XYZ are benchtop dispense stations said to accommodate a variety of single-component time/pressure or positive displacement valves and material supply systems, from 10 cc to five-gallon transfer pumps. Each system has point-to-point and three axes continuous path dispensing.

Temperature Profiling

The Surveyor is a temperature analysis tool for frequent monitoring of reflow oven performance. The tool consists of an adjustable width gauge designed to carry six custom temperature sensors through a reflow oven and software that provides traffic light indication of oven performance. Clear "go/no-go" indicators reportedly simplify the profiling process and indicate if oven performance is drifting out of tolerance.

Four-head Placement

The SDG-2000 placement system combines two vision placers with a connecting conveyor for a total of four heads, 200 tape/stick capacity, and 19,400 pph throughput. One vision placer is dedicated to high-speed chip placements and the other is used for ICs, QFPs, BGAs and connectors. Placers can be connected with the included conveyor for dual-gantry performance or used individually. Placers include laser alignment, 40 mm vision system and multiple field of recognition. Component range is from 040


The HFE line of products was reformulated and split into three groups. All are nonflammable, evaporate rapidly and contain no ozone-depleting solvents. The cleaner/ degreaser is a light-duty degreaser for the removal of oils, grease and other contaminants. The flux remover reportedly is safe on plastics. It removes type R, RMA and RA fluxes from PCBs, gold finders, contacts, connectors and relays. The contact cleaner is formulated to clean electrical contacts and switches. It can be used for han

Acoustic Imaging

The D-24 populated-board imaging system is an acoustic micro-imaging system that nondestructively images mounted components for internal defects. The system can scan an area up to 24 x 24". The system is said to be most sensitive to gap-type internal defects, such as delaminations, disbonds, voids and cracks. It has two modes of operations: single image, for boards populated with devices all having the same height and depth of interest, and multiple image, for boards with mixed components.

Fine-pitch Lead Repair

The hand-operated benchtop Dana MLCS-1 corrects bent or skewed leads in fine-pitch components from 7 to 32 mm sq. With a footprint of 10 x 10", it is said to recondition packages with 0.5 mm pitch in less than 90 seconds, restoring lead pitch, sweep, standoff and coplanarity per JEDEC standards.

Fluid Dispenser

M-620 automated fluid dispenser is designed for dispensing processes such as flip chip and CSP underfill, dam and fill, silver epoxy, IC encapsulation, thermal grease, and lid seal. The system has a linear pump that reportedly delivers accurate, repeatable dispensing regardless of fluid viscosity. It also has the company`s Mass Flow Calibration technology, which is said to maintain a closed-loop dispensing process for accurate dispensing and fully automatic process control. Dual-mode contact and

Electrically Conductive Adhesive

A single-component, silver-filled, electrically conductive adhesive, 121-06 is said to be suitable for application by syringe dispensing. This product is designed for assembling PTC pills as well as electrical and electronic components. The resulting bond reportedly exhibits thermal cycling resistance, electrical and thermal conductivity. It is ready to use as supplied. Users apply the adhesive to the surface to be bonded by hand or automatic method and assembly. Best properties for most applica

Electroformed Stencils

VECOPLUS electroformed stencils reportedly are ideal for fine-pitch and ultra-fine-pitch SMT applications including wafer bumping and flip chip, BGA and µBGA. Reportedly featuring smooth aperture walls and tight dimensional tolerances, the stencils allow users to precisely apply the amount of solder paste or other desired material. Available in thicknesses from 25 to 200 µm, the maximum sheet size of 740 x 600 mm suits many types of printing machines.

Placement Machine

The MCF compact flex high-speed flexible placement machine reportedly uses a flexible head design that places 28,800 cph at 0.7 seconds per QFP with 10 nozzle heads. Providing high productivity and multifunctional flexibility in a space of 5`8" wide x 7` deep, the machine table moves to minimize pick-and-place distances, and cameras located at each end side of the machine reduce head travel distances.

Back-end Services

Offering complete solutions for all aspects of back-end packaging, this company is said to examine the packaging operation to determine the package type and operations best suited for each specific component, allowing parts to be delivered without lead or device damage, and according to JEDEC standards. Services include: tape-and-reel packaging with in-line lead inspection; BGA and µBGA ball inspection and taping; drop test engineering services, lead form and trim; and lead/mark inspection

Rework System

AT-707 is a rework system reportedly offering a unique split-beam vision. The combination of light and split beam is said to provide clear vision of the component and the board. During alignment, the component is placed 90° to the board. Placement and reflow are co-located, eliminating errors caused by board movement after placement.

Dissolvable Spacers

Designed to provide consistent spacing between PCBs and components, Wash-Aways spacers are organic polymer spacers that locate and reinforce PCB components during soldering operations. After soldering, the spacers dissolve in most water-solvent baths, leaving uniform spacing between components and boards and providing free circulation of air, mechanical protection, optimum filleting, and greater accessibility for inspection, cleaning and conformal coating.

Solder-alternative Adhesive

CE 3101 electrically conductive adhesive is said to replace solder and provide ultra-fine-printing capability in SMD interconnect formation. This product also reportedly has a low-temperature-cure capability that makes it compatible with all flex substrates. A blend of fillers with controlled particle sizes makes the ultra-fine-pitch printing possible with this adhesive. Printing can be achieved with a screen or stencil on standard SMT equipment. It can cure as low as 130°C or through a typ


The adaptive artificial intelligence technology implemented in AIMS 3.l was developed to address the task of inspecting small and fine-pitch SMT components at any position in the assembly line. It inspects all components on every board for defects, such as missing component, reversed component, wrong component, bent/lifted leads and insufficient/excess solder, without any programming. The user is guided through the inspection process by a graphical interface that allows new operators to set up n

rework & repair

The LS-100 is a semiautomatic, off-line rework system that prevents overheating and thermal stress of components, the board, and adjacent components. It performs selective soldering and rework of all types of components, from µBGAs to large QFPs and even odd-shaped and hybrid devices. This system is ideal for soldering and desoldering RF shielding and various paste-in-hole and solder-paste-on-thorough-hole applications. It employs a YAG laser beam, a pyrometer for program and process contro

soldering Equipment

The Profile Series of reflow ovens features Dynamic Flow Engineering (DFE), which delivers superior thermal performance, filterless flux management and gas-to-gas cooling modules. Its multi-port blower produces overlapping cones of heat for more consistent board temperatures and even heating at lower recirculation volumes and power. The Aurora filterless flux management system removes up to 80 percent of flux contaminants. The series` Genesis cooling module (for nitrogen models) and Polaris cool

soldering materials

Polymeric technology was leveraged from the food and pharmaceutical industries to develop the Time/Temperature Indicator labels. Although paste is shipped with an expiration date, unpredictable environmental factors in shipping, storage and handling can negatively affect its viability and performance in day-to-day assembly line operations. The label is affixed to a jar of solder paste and uses a simple color to reflect time and temperature variations that the paste undergoes after shipping. The

ESD-compliant Bar-code Scanner

The IR-2000 ESD 2D scans 1-D and 2-D symbologies and is available in standard or high-density versions. It is rated and tested to discharge less than 20 V maximum, the average discharge time from 1,000 to less than 20 V does not exceed 15 seconds, and it has a surface resistivity greater than or equal to 105 W2 to less than 107 W2.

Heel Grounder

The MG-7010 series heel grounders are based on the company`s D-ring design. Features of the heel grounders reportedly include: a two-part heel cut with smudge-free interior, tab design ensuring effective contact, elastic relief band, and 1 or 2 MW value resistors.

Dual Continuous Monitor

The 3300 Moisture-barrier Bag was reportedly designed to meet the moisture-protection needs of the electronics market. It is said to offer long-term protection from moisture, high-frequency protection and static shielding to protect sensitive electronic components or parts. The bag is constructed of a multilayer 0.0036" film that provides puncture- and tear-resistance. The clean, opaque barrier film reportedly meets the requirements of EIA-583 Class I and contains no amines, amides or N-Octanoic

Aerosol Coating

Staticide ESD is a permanent ESD acrylic coating that can reportedly be applied to most any insulative material or surface. It comes in a 16 oz aerosol spray can containing 12 oz of ESD coating. It is said to use a mixed-metal-oxide semiconductor as the static-dissipative agent in a clear acrylic-polymer coating. It does not contain carbon black, which can slough and leave black marks when rubbed. It also does not contain amines, quaternary ammonium salts or organic acid salt anti-stats. The pro

Static-dissipative Vinyl Upholstery

Microcon white is a static-dissipative vinyl for the company`s chair models. With this vinyl seating upholstery, the chairs are said to offer critical environments (including cleanrooms) static-dissipative protection in three colors: white, blue and black. Average component resistance to the ground is 1.2 x 107 W. The surface resistivity is 5.3 x 106 to 108 W per square surface at 500 V. Reportedly, the decay time from 5,000 V to technical zero is 0.44 seconds.

Adhesives/Epoxies & Dispensing

Surface mount adhesives (SMA) are used in both wave and reflow soldering to maintain component positioning on the printed circuit board (PCB), and to ensure that parts are not displaced in transit through the assembly line (see sidebar).

Assembly tools

Unlike other depanelers, the SpeedRouter uses ultra-accurate linear motors with 5 µm resolution, as well as a vibration-absorbing granite base and rigid, cast-aluminum superstructure. It is the only depaneler to incorporate cutting disks for faster straight cuts and router bits for contour cuts in a single machine. The disks cut twice as fast as bits (approximately 6.4" per second, compared to 3.3" per second for bits) and are much less expensive per linear unit of board cut. A CAD link all


The first commercially available reworkable underfill, Loctite 3567 provides the reliability and processing ease of conventional thermoset underfills. It allows flip chips to be replaced on any device after testing determines that a chip is defective, minimizing board disposal and improving the cost-effectiveness of the manufacturing process. The underfill improves the reliability of BGA and CSP assemblies, particularly important for roughly handled consumer electronic applications. Simply heati


The Hydrojet in-line cleaner cleans and dries at more than twice the speed and in one-half the footprint of existing cleaning technology. The system uses patent-pending flow-dynamics technology instead of conventional air knives and spray nozzles. In drying, this new technology outperforms air knives up to 10:1 and delivers up to a 5:1 increase in energy efficiency, air usage and conveyor length, without the use of IR heating. It is available in three drying models (Mach I, II and III) offering


The Capillary Action Enhanced Surface Mount Header consists of square posts press-fit into round plated through-holes (PTH) on a header PCB. The assembly uses controlled capillary action to pull solder through the cavities between the pin and PTH. The resultant solder ring around the pin on the top side of the header indicates that the right amount of solder paste was used and the header is in the right position on the board. Placement tolerances are more forgiving because capillary action force

contract services

From manufacturing to materials and design to fulfillment, EMI allows OEMs to achieve greater return on investment and higher customer value. Strict adherence to quality control and procedures is achieved by the company`s quality control team. The company conducts continual internal evaluations to further enhance its services, technologies and personnel qualifications. Inspectors undergo training and continual education in evolving inspection standards, and test personnel are trained on customer

dispensing equipment

The Dual Chamber Linear Positive Displacement Pump is the most critical element of the MRSI-175 Encore automated dispense system. This design allows simultaneous dispensing and recharging of the encapsulant. The pump technology, combined with dual substrate conveyors, offers parallel processing capability (preheat and dispense). It delivers throughput more than 50 percent greater than conventional dispense pump technologies. With closed-loop, high-resolution encoder feedback, true volumetric dis


X-ray inspection has established itself as the state-of-the-art for nondestructive in-line and off-line inspection of hidden solder joints, particularly for BGAs, CSPs and flip chips. While revealing many defects (e.g., bridges, misalignment and voids), other critical defects are more difficult or impossible to detect, such as excess flux residue, surface structure and micro-cracking. The ERSASCOPE offers a cross-sectional, nondestructive visual image of hidden solder joints by looking under the


The Meridian Series consists of seven fully compatible SMT assembler models that offer a cost-effective chip and IC placement solution. It provides high quality and productivity, low setup and operating costs, and effective line optimization and operation monitoring tools. With placement rates exceeding 28,000 CPH, the series addresses a wide variety of production requirements for throughput and accuracy. The product line`s specifications are among the first expressed using the definitions and v


The Infinity`s ProFlow DirEKt Imaging increases print speed six-fold and supports advanced packaging applications. On-the-fly vision technology captures fiducial data 5X faster than previous versions. The 2Di stencil and post-print inspection package provides a five-fold increase in speed, while the Vortex under-screen cleaning system executes wet/dry/vacuum cleaning in a single cycle. The printer operates continuously at documented 2.0 Cpk levels. Its Common User Interface Hardware Module (CUIH

Squeegee Blades/Holders

Owners of deHaart Technologies screen and stencil printing machines can obtain squeegee blades and holders from this company. These blades and holders are said to meet or exceed the company`s OEM specifications and are "drop-in" replacements. The OEM squeegee blade line includes polyurethane blades, flat metal blades, adjustable angle metal blades and squeegee blade holders for deHaart as well as other industry manufacturers, including DEK, Fuji, MPM, Panasonic and SMTech. The polyurethane squee

3-D Virtual Factory

Production PILOT reportedly gives engineers and designers the ability to conceive, analyze and verify assembly processes. Its 3-D virtual factory environment allows engineers to begin process planning earlier while simultaneously finding and correcting problems before investing in capital equipment or fabricating parts. The system`s three modules - PILOT Cell, PILOT Line and PILOT Yield - are said to give engineers flexibility to analyze various automated and manual assembly scenarios for feasib

ICT Program

Used to test PCBs, GC-ICT 4.1.4 creates ICT programs, prepares requests for quotes, analyzes board testability, processes legacy data and translates Gerber files. It is said to prepare boards accurately and quickly for ICT by integrating Gerber data, drill and BOM files giving new capabilities in data preparation. The program generates Testability Scout, a professional report that reportedly organizes key elements in an HTML, MS Word or plain text format. It states accessible and inaccessible te

Flip Chip Calculator

The Flip Chip Calculator is a software application that is available at no cost on the company`s Web site. It reportedly offers a way to determine the volume of underfill necessary to optimize flip chip-in-package and flip COB dispensing processes. Users input parameters including die proportions, fillet width and solder-bump profiles, then select a specific underfill material from the range of industry-standard fluids included in the program. The materials list can be edited to accommodate addi

Software Library

MVTools CE is said to be the first and only set of C/C++-based machine vision software tools based on Microsoft Windows CE, the new industry-standard operating system for embedded control applications. The software reportedly is designed to offer OEMs and systems integrators a library of vision development tools that combines sub-pixel accuracy with ease of use. It is suitable for automated manufacturing applications that require capabilities such as integrated vision and motion control. It has

Socket Modules

The company has announced that with the software release 3.43A comes eight new socket modules and support for 12,678 devices from 100 semiconductor manufacturers. The new software release reportedly adds 252 new devices and eight new socket modules, three of which are Actel socket modules. New device support is released simultaneously for both engineering and production programmers reportedly to make the transition from design to manufacturing as easy as possible.

Assembly Cell Software

Release 4.1 of the Model 3500 Automatic Component Assembly Cell Software includes enhancements that are said to be designed to increase accuracy, provide the operator with a greater choice of features and operations, and increase ease-of-use. Updates include lookup camera referencing, dynamic axis correction and a touch-based wafer punch-up routine. Wafer programming is said to be simplified, a tool-purge parameter has been added and jog options have been expanded. This version is designed for f

EMI Analysis

Sonnet Lite is a free 3-D planar electromagnetic (EM) analysis software suite. Based on the company`s full Sonnet em Suite EM analysis product line, this no-cost package is suitable for microstrip, stripline and two-layer circuits, including interlayer vias and vias to ground planes. Users can enter circuit layouts in a drawing editor, perform EM analyses, plot and print output results, export output data (S, Y, Z parameters) to other high-frequency simulators, as well as display and animate cir

Programmed Dispensing

The company has introduced PathMaster version 2.1 for use with its automatic dispensers and selective conformal coating systems. This latest version of the Windows-based programming software is said to offer all of the same features found in version 2.0, with the added multimedia help library and the Fast-Mask feature for conformal coating applications. It uses a multimedia help tutorial section to help users complete new or unfamiliar tasks, create or edit commands, download projects, and more.

Calibration Software

This product is a new release of the Calibration Manager software. Designed to meet ISO 9000, QS 9000 and other standards, this software combines a database and report writing capabilities to assist users in maintaining the full cycle of calibration management. The latest release, Version 3.0, is said to offer many new features, including electronic-signature tracking, auto-reminder, satellite module, Crystal Reports 7.0, easier to use select/sort capabilities, tag ID system and more.

Placement Conversion

SMS Linecontrol is an industry-approved software package that is tailored for SMT manufacturers seeking stable CAD-conversion software for SMT placement files. It reportedly is designed to enable operators to communicate freely with individual placement machines, minimize programming time and eliminate downloading complexities. The software also is said to offer seamless communication across different brands of equipment and is an integrated, multitasking product.

Solder Wires

The W300, W400 and W500 series of cored, high-purity solder wires include no-clean, water-soluble and rosin-based wires for use in rework and attachment of thermally sensitive components. The W300 Series no-clean wires consist of a blend of rosins designed for user flexibility and a high level of protection against corrosion. The W500 Series water-soluble wires are reportedly designed for a high level of wetting and ease of cleaning. The W400 Series is available with a rosin-based flux core.

Colorless Residue Paste

A no-clean, colorless residue solder paste, DSP 691 reportedly supports print speeds of 1 to 8" per second. It has a 24-hour stencil life, up to 48-hour tack time and 72-hour open time. The paste is said to be 100 percent ICT pin probable and leave clear, minimal post-solder residue. It will reflow with or without nitrogen, and is said to be tested and approved for the DEK ProFlow cassette package.

Static Control

The Minimeg is designed for accurate measurement of surface resistivity and surface-to-ground resistance of work surfaces. The unit is reportedly suitable for spot-checking dissipative and conductive surfaces. It operates on a 9 V battery and measures surface resistivity up to less than 1010 W/square or surface-to-ground resistance up to less than 109 W. Both NIST and non-NIST models are available.

ESD Simulator

The Model 930D "gun-style" ESD simulator is designed for use in a variety of applications, including electronic, automotive, military and medical. Its design is said to allow for quick change of resistor and capacitor networks, polarity modules, probe tip configuration and firing requirements. Designed for both air and contact discharges, the unit incorporates auto and manual modes and reportedly is adjustable from ±500 to ±26 kV.

Component Protection

Partfolio is a portable kitting system designed to securely store a range of small parts and protect sensitive components against damage from ESD at all stages of production. It is designed as an alternative to the "plastic bags in tote boxes" parts management approach still in common use. Advantages are said to include portability, quick setup and parts migration prevention when closed. Other advantages reportedly include improved quality control, increased productivity and decreased costs. To

ESD-compliant Lighting

The Imagelite Model 20 quartz-halogen fiber optic illuminator is an ESD-compliant product developed to provide shadow-free, glare-free, cold illumination for use in industrial and electronics manufacturing. Designed to meet the increasingly stringent demands of static-sensitive applications such as magneto-resistive head assembly and inspection in the semiconductor industry, the illuminator is also designed to work in virtually all microscopy, industrial and machine vision system applications.


HERNDON, Va. - The National Electronics Manufacturing Initiative (NEMI) kicked off its Roadmap 2000 with a day-long working session immediately following the IPC SMEMA Council`s Electronics Assembly Process Exhibition and Conference (APEX) in Long Beach, Calif. An estimated 140 individuals representing more than 60 OEMs, contract manufacturers (CM), equipment vendors, suppliers, universities and government agencies participated in the meeting, which launches NEMI`s year-long activities to map th

NIS, SRT Acquired

WESTFORD, Mass. - GenRad Inc. announced that it acquired San Diego-based Nicolet Imaging Systems (NIS) and its sister company, Sierra Research and Technology (SRT), Westford, Mass., from ThermoSpectra Corp., a subsidiary of Thermo Instrument Systems Inc. The acquisition expands the range of test solutions GenRad provides to electronics manufacturers to include manual and automatic X-ray inspection, as well as rework and repair.

CBAR Teams Up with SMTnet

PORTLAND, Maine - SMTnet and the Center for Board Assembly Research (CBAR) at the Georgia Institute of Technology announced a partnership to share resources and technical content over the Web. The agreement provides for the distribution of SMTnet`s Electronics Forum over the CBAR Web site, providing convenient access to SMTnet`s community of electronics manufacturing professionals and Georgia Tech`s faculty and students. In addition, Georgia Tech will publish technical papers in the SMTnet prof

Juki Expands in North America, Europe

MORRISVILLE, N.C. - With its acquisition of the Zevatech PCB assembly division now complete, Juki Automation Systems is expanding its North American and European presence by taking over the former`s facilities in North Carolina, California and Switzerland. This is intended to strengthen customer service for new Juki customers as well as existing Zevatech customers.

Forecasting 2000 R&D Spending

COLUMBUS, Ohio - Total research and development (R&D) expenditures in the United States are expected to increase to more than $266 billion in 2000, according to the annual Battelle/R&D Magazine forecast. That total is almost 8 percent more than the $247 billion estimated to have been spent in 1999.

One Electronics Materials Company Acquires Another

ROCKY HILL, Conn. - Henkel KgaA, an international chemical company with 56,000 employees in 70 countries headquartered in Dusseldorf, Germany, assumed ownership of Multicore Solders and all of its global manufacturing and distribution sites. One of Henkel`s subsidiaries is Loctite. At the present time, it is expected that Loctite and Multicore will operate as distinct and separate companies, servicing their customers independently. Cooperation has already commenced in overlapping areas of produ


General H. Norman Schwarzkopf delivered his keynote presentation to nearly 1,600 attendees. His speech, "Leadership: From the War Room to the Board Room," defined his principles for success in leading people. The General called upon his years of service as commander in chief, United States Central Command, and commander of operations for Desert Shield and Desert Storm in the 1991 Persian Gulf War. During his 35 years of service in the U.S. military, General Schwarzkopf was awarded many honors, i


More than 6,000 people showed up for the APEX Gala, held Wednesday, March 15, at the indoor/ outdoor Terrace Plaza Mall near the Long Beach Convention Center. The gala featured magicians, jugglers, acrobats and mimes roaming through the crowd, as well as a variety of food stands featuring entrees ranging from local favorites to ethnic classics. Also present at the gala was the rock group WAR, which performed live later in the evening.

Best Paper Awards

Two papers presented at APEX were recognized with Best Paper awards by the IPC. Dr. Shelgon Yee from Solectron, Milpitas, Calif., received the award for best U.S. technical paper for authoring "Optimization of Design and Process Parameters for CSP Solder Joints." The award for best international technical paper went to Caroline Beelen-Hendrix and Martin Veguld from Philips Center for Manufacturing Technology, Netherlands, for "Trends in Assembly Processes for Miniaturized Consumer Electronics."


The 8th annual SMT Magazine VISION Awards were presented at APEX on March 13, 2000, at the Hyatt adjacent to the Long Beach Convention Center. Fourteen companies received awards for innovation in the following categories: Adhesives/Coatings/Encapsulants, Assembly Tools, Cleaning, Components, Contract Services, Dispensing Equipment, Inspection, Pick-and-Place, Printing, Rework & Repair, Software, Soldering Equipment, Soldering Materials, and Testing. For a complete list of winners and more inform

2001 Already?

At the end of this year`s show, the IPC announced the dates for next year`s APEX - January 14 through 18, 2001, at the San Diego Convention Center. Papers are being sought in all areas dealing with: advanced packaging, assembly processes, factory equipment and automation, material developments, component technology, environmental concerns, electronic manufacturing services, test and quality, industry standards, and business issues.

Lead-Free Electronics Full Steam Ahead

Quite a bit has happened in the past year, as U.S. electronics manufacturers try to untie the lead-free knot laid before them. This comes after fighting so hard in the early 1990s for exemption from U.S. legislation calling for the elimination of lead from electronics assemblies.

Are You Ready for Lead free Reflow ?

New reflow profiles and oven configurations must be explored to meet the needs of lead-free solder paste.

Designing with CBGAs

An Experimental Approach for commercial and industrial electronics, PBGAs generally perform reliably over a -40° to 85°C temperature range. For aerospace and military assemblies demanding reliable operation over a wider temperature range, it is necessary to use CBGAs.

Soldering with Diode Lasers

Two trends have lifted laser soldering into new prominence: the replacement of wave soldering with reflow soldering, and the emergence of diode lasers with increased power output and high service life.

SMT Tab Receptacles Ensure Solder Joint Strength

A new development in SMT interconnection technology is tab receptacles with board-retention force equivalent to through-hole counterparts (roughly 30 to 35 lb). With solder joint strength ensured, the inherent advantages of SMT components put this new receptacle in a position to supplant the through-hole version even in environments such as automotive and appliance applications.

Power Management

The family of SmartOR power management products includes the CMPWR025, CMPWR100, CMPWR120 and CMPWR150. These single-chip solutions are said to be designed for solving the various power management challenges inherent in many of today`s PC and peripheral designs such as network interface cards, modems and power supplies. The line reportedly offers high current ratings as a standard feature and exclusive features that are said to provide the flexibility and simplicity required when adding an insta


The company is extending its line of surface mount T1/E1 to include the industrial temperature range. This family of products is said to address high-port-density telecom applications, including WAN, internetworking interfaces, ISP servers, multiplexers, digital access and cross connect systems, channel banks, and cellular base stations. These applications may be in environments not suitable for standard temperature performers. The transformer family includes part numbers T1103 to T1114.

Power Converter

The QMT-100 is a "quarter-brick" DC/DC power converter that is said to have a full 30 A current capacity. It was developed for the continued demand in the telecommunications and industrial arenas for smaller, more robust electronic devices with lower voltage and higher current requirements. The new quarter-brick reportedly is replacing the half-brick for many applications that have size limitations but require high power. The product weighs 75 g and its dimensions are 1.45 x 2.28 x 0.50".

USB Connectors

This line of USB connectors, which includes both A and B series receptacles and cable assemblies, is designed to meet the demand for smaller, more reliable I/O interconnects while providing shielding and board-locking features. The Series A receptacles are available in the following configurations and styles: vertical and horizontal stack; through-hole and SMT; horizontal and upright; and standard and flanged-out shells. The Series B offerings include right-angle and vertical PC mount receptacle

Distribution Agreements Aplenty

Vishay Intertechnology Inc. and Avnet Inc. signed a worldwide distribution agreement that covers Vishay`s full line of electronic components. The agreement extends the existing relationship between Vishay, a designer, manufacturer and marketer of passive electronic components, discrete semiconductors and integrated circuits (IC), and Avnet, one of the largest distributors of semiconductors, interconnects, passive and electromechanical components, and computer products.

New Conformal Coatings Combine Protection with Environmental Safety

Providing Excellent dielectric resistance, these coatings feature insulative protection and resistance to various solvents and harsh environments.

Minimizing Solder Spatter Impact

Following reflow, memory-module gold connector fingers may exhibit solder spatter contamination, which could mean both a quality and a reliability issue for the product and manufacturing process problems.

Non-contact Inspection Systems for Automated PCB Assembly

Vision inspection of printed circuit boards (PCB) is a straightforward process. A PCB is mechanically placed in the pick-and-place machine using the board`s edge or tooling holes as guides. There may be significant tolerance variations in the circuit`s pattern relative to the board edge and lesser variations with respect to the tooling holes. Also, there may be minute differences in the outside dimensions because device enclosures are generally not carefully controlled during manufacture. It is

The Benefits of a Ramp-to-Spike Reflow Profile

The pains often associated with profiling may be reduced greatly if certain guidelines are followed and if there is a strong understanding of the variables that can be encountered during the reflow process.

Are You Ready for Lead-free Solder Paste?

Any lingering doubts about the global nature of the electronics assembly marketplace have been put to rest by the topic of lead-free processing. Although the United States currently has no restrictions on lead use in electronics assemblies, other markets are in the process of implementing them. As a result, manufacturers of both surface mount assemblies and hybrid circuits must meet the restrictions to remain competitive.

Surface Mount Buzzers

The Kingstate KSS Series ultra-miniature surface mount buzzers are available in various sizes, operating voltages and resonant frequencies. While reportedly designed primarily for use as ringers and alerts in wireless and cellular phone uses, these units are suitable for a variety of telecommunication and portable test equipment applications. Size choices range from 8.5 x 8.5 x 3.2 mm to 10.0 x 10.0 x 4.0 mm, with operating voltage ratings from 1.5 to 5.0 VDC at resonant frequencies of 2,700 to

SMT Connector

Featuring a distance of 4 to 5 mm between boards, the FX10 Series of parallel board-to-board surface mounted connectors are said to allow increased and improved transmission speeds. This reportedly is achieved, in part, through ground plenums on both mating assemblies. Ground stability is achieved with direct connection of the ground plenums to the board. Signal contacts are on 0.5 mm spacing, with ground plenum contact every 10 contact positions. Additional stability is provided with board sold

Plug and Sockets

The Firewire IEEE 1394 plug and sockets are now available for high-speed and wide bandwidth applications. These connectors are said to be suitable for devices from digital video, digital cameras and DVD players to cable modems, LAN connections and consumer-AV devices. The jacks are surface mount and feature snap-in PC tails to hold the connector in position. Also available are a horizontal through-hole mount and an upright through-hole mount. They reportedly are designed to withstand greater tha

Leadless Packages

These standard and custom leadless Cirpak packages for RFIC applications are said to feature plated and bonded copper (PBC) on alumina ceramic for electrical and thermal conductivity. This leadless design reportedly has been tested up to 6 GHz with excellent RF test results. Packages can be customized and are available with plated through-vias or edge metallization. Ceramic lids, with or without epoxy preform, also are available.

Filter Array

The 0612 low pass filter array is said to provide four equivalent RCR T-filters with a dual common ground, reportedly resulting in the equivalent of eight resistors and four capacitors in one chip. Primary applications are in signal filtering, EMI suppression, and mobile or cordless systems. It is said to feature the ability to filter four circuits with one package, providing distributed capacitance and shielded resistance. The integrated package also is said to have lower parasitic capacitance


The tiny shielded inductors in the DS1608BL Series are said to be engineered for backlighting applications. They reportedly feature high breakdown voltage and efficiency with DC resistance 10 to 60 percent lower than currently available inductors. These magnetically shielded parts are designed with a flat top for pick-and-place operations. The heat-resistant materials are said to ensure trouble-free assembly and reflow soldering.

SMD Film Capacitors

These smaller series GMW and SMW surface mount film capacitors use a "naked" construction, and are said to offer sizes down to 1812 for applications where stability or self-healing are required. This series is said to be less susceptible to moisture than other types and cannot delaminate. They are offered in higher voltages than were commonly available in the past. The capacitance range is 1,000 pF to 1 µF in voltages up to 630 VDC.

Miniature Trimmer Capacitors

The company is extending the range of its A1 series miniature trimmer capacitors to 12 pF. With 13 turns of adjustment and positive stops, the A1_12 is said to be suitable for tuning applications in amplifiers, filters and oscillators. It is offered in PCB and SMT mountings, and high-voltage and nonmagnetic versions are available. Qs reportedly are greater than 1,000 at 200 MHz, and self-resonance is 1.2 GHz at 12 pF.

Miniaturized Inductors

Five new families of surface mount, high-current components in the 1813, 2218, 3020, 3114 and 3722 packages were added to the company`s selection of inductors. With footprint diameters ranging from 4.5 to 9.5 mm and height profiles as low as 3.2 mm, the inductors are said to be suitable for notebook computers, cell phones, pagers and other end products where space is at a premium. Typical applications include buck and boost DC/DC conversion and power line filtering circuits.

Trimmer Potentiometers

The company expanded its product line of single- and multiturn 3, 4 and 5 mm SMD trimmer potentiometers for high-density, high-performance applications. They are said to have cermet resistive elements rated from 10W to 2 MW. Environmental and performance testing to MIL-STD-202 and MIL-R-22097 is said to ensure reliability, and operating temperature range is -55o to 125oC. Applications include computer peripherals, power supplies, test/measurement equipment, and a variety of entertainment and tel

Metal-oxide Semiconductor Devices

The company introduced a range of eight new HDMOS devices. The 20 and 30 V P-channel MOSFETs are said to offer performance for low-voltage load switching applications, reportedly helping to increase battery life in portable equipment. Minimum threshold voltage is 0.7 or 1 V, which enables the devices to provide performance from a low-voltage source.

Crystal Oscillators

These new VCXOs are said to provide stable frequency sources for the telecommunications and instrumentation industries. They are suitable for use in phase-locked loops, clock recovery, reference signal tracking, synthesizers and frequency modulation/demodulation applications. The VCSAT (5.0 V) and VCSAXT (3.3 V) VCXOs reportedly have stabilities from ±25 to ±100 ppm. Pullability ranges from ±50 to ±100 ppm, and temperature ranges from -10o to 70oC or from -40o to 85oC.

Surface Mount Package

This three-terminal version of the company`s Powermite surface mount product line is designed to replace larger and higher profile D-PAK and TO-220 packages used for semiconductor devices. The devices are said to be less than 1.1 mm high and require 5.3 x 4.8 mm on a PCB. The product also reportedly has a rugged construction and provides thermal impedance and resistance characteristics.

Nepcon West

NEPCON West 2000, February 29 through March 2, at the Anaheim Convention Center, Anaheim, Calif., boasted a full conference schedule, the Technology Advancement Center (TAC), pick-and-place evaluation center, special industry events, and product introductions and news. The show hosted a myriad of companies, representing electronics design through test equipment, from the United States and around the world.

SMT Printer

PrinTEK Model 5000-APS is reported to be the largest SMT printer for batch-style, fine-pitch production. It is said to be suitable for large PCBs such as those used for backplane and motherboard production. The printer reportedly is designed to eliminate many challenges associated with assembling large SMT boards with two features: its tooling system and the stencil loading area.


Designed to meet the high-density packaging needs of the Intel Mobile Pentium III processor, the ultra-low-profile Micro PGA socket reportedly accepts various Intel mobile processors with speeds up to 650 MHz. With an overall height of 2.0 mm, these ZIF SMT sockets reportedly meet the low-profile and high-density needs of thin and light notebook PCs. The 495-circuit socket is based on a 1.27 mm grid array that is said to provide almost double the pin density in a third the size of traditional th

Soldering Tips

Long-life soldering tips, reportedly designed to meet the demands of high-production users, are said to deliver up to 3X the life of conventional tips. Manufactured from oxygen-free copper and iron, the tips have a polished, consistent finish. A selection of 22 tips is available for the PS-80 soldering iron, which reportedly allows the production user to solder virtually any through-hole or surface mount assembly.

Thickness Measurement

The company is said to offer a line of nondestructive coating-thickness-measurement instruments for use by the PCB, electronics, jewelry and metal-finishing industries. Using the CMI 900, measurement of plating/coating thickness, material composition analysis and assay of precious metals reportedly is possible. Measurements of extremely thin immersion coatings and thin films also can be performed. Designed for ease of use, the equipment is said to provide the user with high inspection productivi

Dispense Valve

DJ-2200 DispenseJet valve for flux applications is a non-contact dispense valve reportedly designed to offer a high-performance alternative to traditional methods such as dipping, screen printing and ultrasonic spray. Designed for use with the company`s Century Series automated dispensing platforms, the valve reportedly can apply flux for a range of assembly operations, including flip chip, CSP, BGA, MCM and ball attach. The product`s non-contact jet dispensing is said to eliminate the need for

Image Processor

The Advanced Image Processor (AIP II) is an upgraded software package for failure analysis, component inspection, assembly verification and quality control of components and boards. Features include: a library of measurements including ball diameter, moment ratio (melting of solder), elliptical pattern, solder density ranges, threshold library, and auto-void count; semiconductor device analysis including die-attach voiding and wire sweep; and colorized 3-D plots representing solder contour for e

Modular AOI System

The VPS 6053 is a modular, fully automated PCB inspection system that reportedly delivers high-speed AOI with full-depth, high-resolution inspection. A variety of camera types can be used to boost throughput. It incorporates an overhead gantry drive system with synchronous linear motors, and offers dual-vision/X-ray technologies. Windows NT drives the positioning system, which can be integrated with a computer network or LAN.

Self-contained Sensors

The 11 models in the AR600 series of line-scan camera laser displacement sensors reportedly have full-scale measurement spans from 0.125" with an accuracy of 0.00015" (4 µ), up to a full-scale span of 50" with accuracy of 0.05". The devices are said to be suitable for use in measurement systems and applications from 0.5 to 80" distance and operate at up to 1,250 samples per second. The sensors are self-contained and NEMA-4/IP-67 sealed for wet and dry environments.

Is it Time to Change CM Business Models?

Do we need new contract manufacturing (CM) business models for the new millennium? Industry trends are forcing changes in CM operative paradigms because of an open-ended total available market (TAM), rapid growth, merger mania, supply-chain mutations, margin shrinkage and e-commerce ebullience.

Communications Drives CM Industry

SAN ANTONIO - As dependence on communication electronics increases, end-user applications are expected to sustain dynamic growth in the CM industry. According to new strategic research from Frost & Sullivan, the market generated $11.83 billion in 1999, and a robust rate is forecasted through 2006.

Solectron Acquires Wireless Company

MILPITAS, Calif. - Solectron Corp. announced the signing of a letter of intent for the acquisition of AMERICOM Wireless Services, a privately held corporation specializing in wireless handset repair and refurbishment as well as outsourced technical customer support services. As part of the transaction, Solectron will gain specialized repair and testing equipment, and assume responsibility for AMERICOM`s business operations in Los Angeles; Louisville, Ky.; Baltimore; and Dallas.

High-speed PCBs Support Backplanes

SAN JOSE, Calif. - Sanmina Corp. announced the successful fabrication of high-speed PCBs to support Thomas & Betts MPI>SI backplane technology. This interconnect technology reportedly offers advantages in system speed, signal integrity, electrical performance and backplane density over conventional connector technology. It is expected to have applications in data communications and telecommunications equipment, including enterprise servers, workstations, routers, switches, and base stations.

Philips & TRC Team Up

BOCA RATON, Fla. - Technical Resources Corp. Inc. (TRC) announced its appointment as Philips Electronics Manufacturing Technology (EMT) Americas` exclusive representative for Florida and Puerto Rico. TRC has three offices in Boca Raton, Orlando and San Juan, Fla., and also represents Vitronics Soltec, GenRad, Christopher Associates, Celtronix, S.P. Precision International, KIC Thermal and AIM.

Singapore CM Wins Two Awards

SINGAPORE - Azuno Manufacturing Pte. Ltd., the CM business unit of Aztech Systems Ltd., won two Quality Awards from Allied Telesyn International (ATI) and P.T. Thomson Television Indonesia. ATI assessed its suppliers on a quarterly basis with a performance rating scheme before awarding Azuno with the Quality Award, which was presented during ATI`s annual Quality Conference in October 1999. P.T. Thomson contracted Azuno to perform SMT placement for their tuners, and the company exceeded the accep

PCB & CM Markets will Continue to Grow

OYSTER BAY, N.Y. - Shipments of printed circuit boards (PCB) will rise throughout the world during the next five years, and contract manufacturers (CM) will continue to see demand for their services climb, according to a new study from Allied Business Intelligence (ABI). Also, CMs are increasingly entering the PCB marketplace to close the gap between manufacturing and design.

Stereo Microscope

The LYNX stereo-zoom microscope is said to produce high-resolution images up to 120X on a large viewing area. Its patented Dynascope technology reportedly promotes operator comfort and eliminates eye, neck and back strain commonly associated with eyepiece technologies. Fatigue-free images are said to appear on a large viewing area that gives the operator freedom of head and body position. The pupil expansion also makes it routine for operators to wear glasses during use. It features a standard m

Low-noise CCD Camera

The Orbis XE CCD camera is for applications requiring low noise and high frame rates. This modular unit can incorporate a variety of sensors (including Kodak, Thomson, Site, Texas Instruments and others) to reportedly produce very low dark current, high quantum efficiency and enhanced near-UV response for greater signal-to-noise performance. The CCD sensors range from 600 x 500 to 4 x 4 K pixels, with noise floors as low as 5 e-. The camera is suitable for biomedical and scientific applications

Color CCD Camera

The TMC-7DSP 0.5" color CCD camera is said to provide color fidelity and full broad-band response in a high-resolution 0.5" CCD format. It outputs VBS (NTSC or PAL), Y/C or S-Video RGB and operates with a high-speed variable shutter (1/60 to 1/10,000 seconds) with through-the-lens auto/manual white balance, AGC on/off switch, and manual gain and hue controls. The DSP circuitry reportedly delivers a stable performance over a variety of conditions. The low-light sensitivity is 2 lux at F 1.4.

Precision-soldering System

The Pana Point Plus (SB) precision-soldering system is available in medium and extra-large sizes. This robotic platform reportedly provides automation of manual operations with minimal capital investment. The platform is said to offer conveyor handling and optional in/out dual shuttle for both linear and point-to-point soldering. This platform can be upgraded to the company`s Soft Beam, noncontact light-beam-soldering system.

Hot-bar Bonder

The Model 4000 is a computer-controlled bonding system for ACF, heat-seal and reflow-solder applications. It now includes Windows NT-based software capabilities

Convection Reflow Ovens

The QRS Plus Series of convection reflow ovens reportedly features a new conveyor system designed for reliable operation and low maintenance. The conveyor uses a chain-transfer system with ball bearings in all shafts and drives. An automatic independent pin-chain tensioning system is said to ensure correct tension as the chains expand and contract with changing oven temperatures. Extended rails reportedly allow for easier conveyor interface and ensure alignment between the oven and any SMEMA-com

Desoldering Tips

Endura Desoldering Tips reportedly feature an anti-clogging riser tube to ensure that solder is delivered to the collection chamber in a molten state. This is said to help prevent clogging and allow continuous work flow.

Automated Soldering Technology

The company has combined two essential elements of the automated soldering process-board-touch sensing and the soldering iron-into one, making the soldering iron tip the actual board-touch sensor. This "Sure-touch" technology is designed to simplify the soldering process and reportedly guarantees contact between the soldering iron and the solder joint itself for greater consistency and fewer defects. There is said to be no need for special programming to accommodate variations in height of indiv

Spot UV Light Source

The Model PK101 spot UV curing system features a high-intensity light source with a flexible light guide that is said to transmit energy and give users control for precision UV-curing (even in hard-to-reach areas). The unit`s internal shutter, which controls the curing exposure time, can be controlled by a manual foot pedal or a push button timer located on the face of the unit. The control of curing time and distance from the light guide to the work piece allows for rapid cures of UV materials

Reflow Solder/Curing Furnace

The Falcon 8000 Series reflow solder/curing furnaces reportedly feature the company`s Conduction + Convection heating and cooling technology, use of power and gas, throughput, small equipment footprint and repeatable profiles enabling high-volume production. Parts are transported through the furnace by sweeperbars that can operate continuously or in a timed-delay mode that is designed to produce temperature uniformity in the reflow/curing profile. The Series includes 8100 (10 heat zones) and the

Reflow Ovens

The first in a series of high-performance reflow ovens designed for the semiconductor market is the Bravo, which is said to feature several new design innovations that provide the performance required for high-production manufacturing environments. The system reportedly provides operators with full control over the reflow system through a user-friendly operator interface. A new convection heating technology preheats air at the intake of the blower reportedly to provide stable thermal energy for

Floodlight Curing System

The ELC-4001 is a high-energy, solid- state advanced floodlight curing system that reportedly delivers greater than 100 mW/cm2 of UV energy at a peak wavelength of 365 nm. The visible-light version is peaked at 450 nm and generates greater than 500 mW/cm2 of output. A 400 W lamp, available in either the standard 365 nm or 298 nm wavelength for applications requiring shortwave UV, is available.

Reflow Process Control

Profile Wizard is designed to simplify process control by recording optimized thermal processing profiles, then comparing them minutes, hours or days later to oven performance. Its array of three dual sensors is adjustable from 3 to 26" to match the board width. The product rides on a belt or edge/rail conveyor to profile the edges and center of the oven, providing a complete thermal picture. Features include repeatable, reliable temperature sensors that reportedly will not degrade with time or

Spot Lamp

The LUXOR visible light, fiber-optic spot lamp is said to cure adhesives through substrates that absorb UV light and allow for greater depth of cure compared with UV-light curing. This high-intensity light source (greater than 100 mW/cm2) can be used with advanced, single-pack, UV- and visible-light-cure adhesives in optoelectronics, fiber optics, lens bonding and other microassembly applications. It cures adhesives with a 460 nm visible blue light that reportedly is a safe alternative to UV lig

MicroBGA Rework

This micro-stencil and nozzle are designed specifically for the rework of Tessera`s microBGA component. The stencil reportedly fits the pattern and is the same size as the part. Because the stencil is viewed with a camera by a prism that views both the stencil and PCB pad pattern simultaneously, the operator is said to be able to align the stencil perfectly to the PCB. The stencil is trapezoidal etched, and can be lowered multiple times if solder paste is not 100 percent deposited in all holes.

Rework Stations

The Summit 2100 Series is designed to increase the speed and accuracy of rework, and handles BGAs, µBGAs and flip chips on boards up to 18 x 22" with 2" vertical clearance. Featuring Auto Profile Software, the series is said to automatically set and maintain proper reflow temperature for any board/component combination. A user-friendly, menu-driven interface allows the user to program the complete rework sequence. The series automates the entire rework process, including component removal,

Desoldering Station

The DS101-V Desoldering Station reportedly provides minimal dwell time, fast reflow and immediate extraction of molten solder. Its vacuum/temperature base unit features an aluminum and brass venturi vacuum generator and spike-free, low-voltage DC switching. The DS101-P integrates a diaphragm pump, making it a stand-alone and portable desoldering system.

Component Removal System

The Freedom HGR 2000 is a rework system for component placement, soldering and removal. It is suitable for BGA, µBGA, flip chip, and fine-pitch process development and prototype production. The system features Windows-based control software with one-touch cycle initiation. The topside heating system is said to apply precise quantities of forced convective heat directly to the component and has adjustable gas temperature, gas flow and nozzle height. A forced convective bottomside process hea

Recreate Original Assembly Conditions

The M-9006V is said to recreate the conditions of original assembly during the rework process. This user-friendly system can remove components, clean pads, dispense paste or adhesive, and remount components. It reportedly incorporates a fast-on/fast-off board-size under-heater that uses IR heat to prevent board warp. During removal and remounting of components, adjacent components are said to be safe from heat damage because of ultra-thin, hot-air shower nozzles. An AutoLift positioning arm prev

Rework System

The RW116 Rework System reportedly can rework PCBs with connector sizes up to 20 x 2" (on 24 x 24" boards) and uses forced-heated convection to preheat the PCB to effect faster processing, shorter rework cycles and less possibility

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