Practical ideas on Large-board Printing
Tips for production printing of the latest large-panel PCBs are provided, including handling, tooling, processing, vision and understencil alignment, and accessib
1998 SMT VISION AWARDS WINNERS
ADHESIVES, COATINGS AND ENCAPSULANTS - Microcure 5100 - The Lambda Technologies MicroCure 5100 curing system features patented Variable Frequency Microwave (VFM) technology. This eliminates the hot spots and arcing associated with conventional microwave technology, allowing significantly faster curing of standard, qualified encapsulants and adhesives. By reducing cure times to five minutes or less, VFM meets the critical industry challenge of
1997 SMT VISION AWARDS WINNERS
ADHESIVES, COATINGS AND ENCAPSULANTS - Reflow Encapsulant - The key characteristic of the SE-CURE 9101 reflow encapsulant is its dual functionality, it behaves like a flip chip flux and underfill encapsulant in a single component. The reflow encapsulant is an epoxy-based material which can be applied by dispensing and has excellent tack strength to hold components in place during processing. After components are reflowed, a secondary cure oper
1996 SMT VISION AWARDS WINNERS
ADHESIVES, COATINGS AND ENCAPSULANTS - Continuous Cure Oven - The 788 in-line, continuous cure oven incorporates a vertical transport mechanism to provide curing times of up to four hours within as little as 6' of factory floor space. A single 788 can reportedly replace up to three batch ovens, saving floor space allocation costs and eliminating the need for manual loading and unloading of batch ovens. Automated curing improves process consist
1995 SMT VISION AWARDS WINNERS
ADHESIVES, COATINGS AND ENCAPSULANTS - Encapsulants - The "9000" series encapsulants made of a urethane resin cures with UV light in 15 to 90 sec. The encapsulants come in a full range of thixotropic viscosities, and because the encapsulants are aerobic and solvent-free they require no refrigeration during storage. Under these conditions, the shelf life is one year. The encapsulants may be used for chip-on-board, MCMs and smart cards. The enca
1994 SMT VISION AWARDS WINNERS
ADHESIVES, COATINGS AND ENCAPSULANTS - Environmentally-Benign Solder Replacement - "Poly-Solder" conductive adhesive provides highly stable electrical junctions with performance akin to solder joints. A patented contracting polymer binder system, filled with special penetrating conductive particles, is the key to stable electrical connections that endure temperature and humidity as well as thermal cycling. Engineered polymer compression during
1993 SMT VISION AWARDS WINNERS
ADHESIVES, COATINGS AND ENCAPSULANTS - Ormet - Ormet inks are a revolutionary conductive ink technology that can replace plated and etched copper traces on printed circuit boards. The inks are based on recent discoveries in powder metallurgy and polymers that allow the creation of silver-free thick film inks that fire at low temperatures yet achieve stable high electrical conductivity. The inks meet or exceed IPC, Mil Std, and Bellcore specifi
1992 SMT VISION AWARDS WINNERS
ADHESIVES, COATINGS AND ENCAPSULANTS - Liquid Photoimageable Soldermask - Aquamask H20/501 is waterborne, water-thinnable and said to reduce environmental hazards for operators. It is not air-polluting, and has IPC SM840B Class III approval and UL 94 V-0 rating. Improves resolution, flexibility and flex circuit performance. - Advanced Systems Inc.
Intrinsix and Sanmina Align; Sanmina Launches Circuit Performance Tool
WESTBORO, Mass.; SAN JOSE, Calif. Intrinsix Corp., an independent ASIC and System design company, teamed with Sanmina Corp. to provide complete electronics design and manufacturing solutions.
Departments, Factories and Customers as One
To compete in today's fast-changing, competitive electronics industry, manufacturing enterprises must operate at a scale that is compatible with customer demands. But as they grow, they also must improve the flow and usefulness of manufacturing information.
3-D or 2-D - Choosing with Today's Technology
Recently, this question arose during a presentation: "Competitors are pushing three-dimensional (3-D) X-ray inspection as the best way to inspect ball grid arrays (BGA) and chip scale packages (CSP). Do I need to spend the extra money to ensure my production quality?" My answer, as usual, was yes and no.
NEPCON East and Electro Preview
NEPCON East is an opportunity to get "hands on" experience with innovative design, packaging, fabrication, assembly and test solutions. The conference offers many opportunities for attendees to gain new skills and update technical knowledge, such as product demonstrations, specifications available for review, workshops and more.
Speedline Announces Organizational Changes
April 11, 2001 - Franklin, MA - Speedline Technologies centralizes the management of its research and development, product development, manufacturing, procurement, and marketing functions.
Is Outsourcing for Everyone?
Over the past few years, contract manufacturing (CM) activities have exploded. Before eagerly embracing this alternative, however, these elements should be evaluated: What factors are encouraging the trend? What criteria determine the decision to outsource? Should everything be outsourced? And, how is control maintained when products are made by others?
Automated Robotic Soldering from Automation Unlimited Inc., a Division of MRSI Group Co., Woburn, Mass; Product-controlled Manufacturing from Siemens AG, Nuremberg, Germany; Microfocus X-ray from phoenix|x-ray Systems + Services, Camarillo, Calif....
Will Slowdown In Computer Industry Hamper EMS Growth?
The electronics manufacturing services (EMS) industry provides service at minimal cost. To remain strong in the low-profit margin computer market, however, large EMS providers should pursue scale economies, while smaller providers must closely define their niche.
EtroniX 2001: Six Shows in One
ANAHEIM, CA - EtroniX covers entire electronics supply chain -- from design, advanced packaging and components, to supply chain management, test, and production.
NEPCON Production & Support Exhibition and Conference and EtroniX Show Guide
This year, NEPCON Production & Support Exhibition and Conference (formerly NEPCON West) will be joined by five key industry events to form EtroniX. A new six-shows-under-one-roof event, EtroniX will provide solutions for the entire electronics supply chain from design, advanced packaging and components, to supply chain management, test and production.
From Roadblock to Routine Placement Assembly
While often thought of as a fairly recent development, the printed circuit board (PCB) assembly process known as SMT has been available since the early 1950s. Since then, the need for increasingly smaller, lighter and faster electronics has been driving component, PCB and assembly equipment technologies in the direction of SMT.
Rethinking the Use of Commercial Components
By their sheer volume, the commercial industries have influenced the buying power of the military. Regardless of how critical a project, the parts needed to complete a design may not be an option. The same vendor who fulfilled critical specifications years ago is no longer interested in low-volume, poor yield, labor-intensive design-to-specification.
How Clean Is Clean Enough?
A common question that rings through our technical support line is, "What is IPC's standard on cleanliness?" This is a simple, straightforward question often asked by industry novices, so a simple, straightforward answer usually is what they want. However, in most cases, this is not specific enough for their individual needs.
Circuit Assembly Materials from Thermoset, Lord Chemical Products, Indianapolis, Ind.; Film Adhesives from APS TechFilm, Peabody, Mass.; X-ray Inspection from Glenbrook Technologies Inc., Randolph, N.J.; Tray Handling from Pro Automation Inc., Garden Grove, CA. ...
High-voltage MOSFET from Fairchild Semiconductor, Acton, Mass.; Temperature Sensing from International Rectifier, El Segundo, Calif.; Power Supply from BIAS Power Technology, Roanoke, Va.; Dual Transformers from Bel Fuse Inc., Jersey City, N.J. ...
Depaneling Systems from MJ automec USA Inc., Grand Prairie, Texas; Stencil Printer from Automated Production Systems Inc., Huntingdon Valley, Pa; Profiling Equipment from Saunders Technology Inc., Hollis, N.H.; Four-head Placement from Manncorp, Huntingdon Valley, Pa ...
Technology Drives Process Solutions
Ultra-small footprint passives, such as 0201 components, are a hot topic in the electronics industry. Existing as a compliment to high input/output (I/O) devices, such as chip scale packages (CSP) and flip chip technologies1, these components are needed for electronic package miniaturization.
Reworking Area-array Packages
Over the last several years, standard area-array devices [ball grid arrays (BGA), chip scale packages (CSP), flip chip, etc.] have become preferred packages in design and manufacturing. Reasons for moving away from traditional leaded packages include increased input/output (I/O) per unit of printed circuit board (PCB) area ...
Lead-free alloys will change soldering technology as well as the entire manufacturing process, including assembly materials and components. Additionally, this change highlight questions relating to awareness and dissemination of existing information, materials availability, soldering technology, and implementation requirements.
Chip Placement Machine from Juki Automation Systems, Morrisville, N.C.; Resettable Fuses from Raychem Circuit Protection, Div. of Tyco Electronics, Menlo Park, Calif.; Batch Cleaner from Speedline Technologies Asia, Division of Cookson Electronics, Singapore; Next-generation Vision System from Cognex Corp., Natick, Mass. ...
SMTA International 2000 Preview
SMTA International (SMTAI) will be held September 24 to 28, 2000, at the Donald Stephens Convention Center (formerly Rosemont Convention Center) in Rosemont (Chicago), Ill. Dedicated solely to surface mount, advanced packaging and related technologies, SMTAI is an event featuring a comprehensive technical conference and special symposiums.
SMTA International 2000 Products
BGA Inspection from O.C. White Co., Three Rivers, Mass.; Mobile Training Center from BEST Inc., Rolling Meadows, Ill.; Thermal Shock Resistant Epoxy from Loctite Corp., Rocky Hill, Conn.; SMT Pins, Headers from Zierick Manufacturing Corp., Mt. Kisco, N.Y. ...
Underfill Design and Process Considerations
As circuit densities have increased and product form factors have diminished, the electronics industry has spawned a variety of new methods for integrating chip-level designs more tightly with board-level assemblies. To a great degree, the emergence of technologies such as flip chip and chip scale packaging (CSP) have effectively blurred the traditional lines of demarcation between semiconductor die, chip packaging methods and printed circuit board (PCB) assembly-level processes.
Rework Process for MicroBGA and CSP
As electronic assemblies become smaller, fine-pitch micro ball grid arrays (microBGA) and chip scale packages (CSP) meet the requirements for smaller, faster and higher performance electronic products. These low-cost packages can be found in many products such as laptop computers, cell phones and other portable devices.
BGA Solder Joint Vibration Fatigue
When soldered to a substrate or PCB, BGAs can reduce substrate interconnection area, complexity and cost, as well as facilitate assembly automation. However, because of a general lack of compliance in BGA solder joints, their failure in a military vibration environment becomes a serious design concern.
Bridge OEM/CM Barriers with the Internet
Contract manufacturers (CM) can use the Internet to communicate through the entire business cycle, from order entry to post-fulfillment service. Quality, work in process (WIP) and other production-related information also can be shared. This level of communication brings the CM and its customers into a closer relationship, even if separated by oceans and continents.
Statistical Tools Promote Bottom-line Improvements
By reducing process variation, SPC helps maximize yields, minimize rework, increase profits, satisfy customers and meet vendor-certification standards
SMT 101 Step 6 - Component Placement
This step outlines several key issues necessary for understanding component placement using automated assembly equipment, including positioning, imaging, feeding and flexibility. It can serve as a primer or quick reference for anyone faced with specific component or application challenges, identifying the pros and cons of alternative approaches embodied in the types of equipment selected as part of an overall solution
To meet the needs of multiple operator shifts, the company has released a line of electric height-adjustable memory stations. Featuring a height range of 20", these units can be adjusted to meet sitting and standing applications, reportedly ensuring operator efficiency by allowing adjustment of the surface height from 30 to 50". Available in either 60 or 72" widths, these units are rated to 500 lb of static load, and feature the ability to preset operator height settings for different applicatio
Dynasolve d-Flux is designed for use in cleaning and degreasing PCBs and equipment used in PCB manufacturing. It is said to quickly dissolve flux, resins, rosins, oils and adhesives from PCBs, testing equipment, and processing equipment. This nonchlorinated, nonflammable (per DOT), noncarcinogenic, nonozone-depleting solvent was designed to replace solvents such as methylene chloride, acetone, MEK, mineral spirits, kerosene and 1,1,1-trichloroethane.
This combination of robotic equipment, metering valves and automatic-liquid dispensers is designed to provide consistent, precise applications of glues, silicones, epoxies, solder pastes and lubricants. The unit`s fully automatic mutiaxes configuration is said to enable full control of dispensing to be achieved over 3-D objects. The Z-axis control reportedly enables dispensing at various heights. Point or continuous dispensing are possible during the same-time operations as well as dispensing at
Laser Engraving System
Designed for ultra-high-speed marking on virtually any material, including metals, the Laser Mate II Nd:YAG laser engraving systems are self-contained with laser, base, PC, enclosure, and optional step-and-repeat table for high-volume production on trays or pallets. The graphical open architecture software features date coding, serializing, bar coding, etc. All text can be manipulated in several modes on the front screen, and the software operates in both vector and raster modes. No programming
Solder Paste Inspection
SE 300 high-speed, high-resolution, 3-D solder paste inspection system reportedly is capable of performing 100 percent inspection at production line speeds. The system automatically measures height, volume, area and bridging, and notifies the operator of any parameters trending outside user-specified limits. There is a choice of two operating modes: high-speed mode, designed for fine-pitch QFPs and other traditional components, that reportedly inspects 4 sq. in per second; and high-resolution mo
Flextronics Expands Across the Globe
SAN JOSE, Calif. and RALEIGH, N.C. - Flextronics International Ltd. entered into a definitive agreement to acquire Palo Alto Products International Pte. Ltd., a full-service product development company that provides industrial design, mechanical engineering and manufacturing services for the high-tech and consumer markets.
New Northeast Design Center Opened
CONCORD, Mass. - Manufacturers` Services Ltd. (MSL) opened a new Northeast Engineering and Design Center, expanding the company`s critical customer support during the early stages of product development and NPI. The center is located in one of the nation`s fastest growing regions for voice and data communications innovations, and is said to establish the largest center for PCB design in the Northeast with more than 30 design specialists.
Capital Acquired to Increase Capability
LaGRANGE, Ohio - In an effort to aggressively maintain and pursue market share in the Midwest, as well as to create increased capacity for continued customer needs, Inservco Inc., a CM serving the low- to medium-volume marketplace, established a strategic affiliation with MCM Capital Partners L.P., Cleveland. Inservco reportedly is ranked as one of the top 100 CMs in the United States, and this venture is designed to give the company opportunity for continued innovations in the industry.
Delta Changes Name & Acquires CM
ALBUQUERQUE, N.M. - Delta Group Inc., a CM offering turnkey CM solutions and technical services for the aerospace/defense industries and commercial product suppliers, announced the changing of its corporate name to Delta Group Electronics Inc. This is designed to better reflect the scope of the company`s electronics manufacturing and technical services offerings.
Wanted: New Manufacturing Facilities
SAN DIEGO - Qtron Inc., a privately held CM, announced plans to move to a new site in San Diego. Increased levels of PCB assembly sales, coupled with customer pressure to provide system integration solutions, are the reasons sited for the move to larger and more efficient quarters.
CM Deals Completed, Extended
TORONTO; HAUPPAUGE, N.Y.; SAN JOSE, Calif.; and LOUISVILLE, Ky. -Several announcements previously reported in the SMT CM News have continued progressing. The following is an update on four such events:
Safety First at IEC
NEWARK, N.Y. - IEC Electronics Corp. announced that its manufacturing facilities in Newark, N.Y., and Edinburg, Texas, have both gone more than 500,000 hours without a lost-time accident. The Texas facility, which has approximately 570 employees, has reportedly been totaling up safety hours since January 4, 1999, and now has more than 975,000 hours logged without a lost-time accident. In Newark, about 930 employees have worked since November 1999 without a lost-time accident, passing 500,000 hou
The Cyclone 2000 placement/reflow/ rework system is said to be designed for precision placement and reflow soldering of CSPs, microBGAs and various other newly developed SMDs. It also performs as a component removal/PCB rework station. The combination of non-tactile laser height measurement, programmable AC servo-driven Z-axis with Z-force control, split vision with motorized zoom lenses, real-time temperature feedback, and advanced software and touch screen control reportedly ensure repeatabili
BGA Rework and Repair
Summit 2100RS can perform rework and repair on BGAs, CSPs and QFPs. The system`s automation allows performance of a single, continuous sequence to complete all four rework operations: removing components, non-contact site scavenging, solder paste applications, and placing and reflowing components. This is accomplished by adding a component print station to the rework and scavenging automated platform. The system has a menu-driven interface for programming the rework sequence.
The SDG-2000 placement system combines two vision placers with a connecting conveyor for a total of four heads, 200 tape/stick capacity, and 19,400 pph throughput. One vision placer is dedicated to high-speed chip placements and the other is used for ICs, QFPs, BGAs and connectors. Placers can be connected with the included conveyor for dual-gantry performance or used individually. Placers include laser alignment, 40 mm vision system and multiple field of recognition. Component range is from 040
The HFE line of products was reformulated and split into three groups. All are nonflammable, evaporate rapidly and contain no ozone-depleting solvents. The cleaner/ degreaser is a light-duty degreaser for the removal of oils, grease and other contaminants. The flux remover reportedly is safe on plastics. It removes type R, RMA and RA fluxes from PCBs, gold finders, contacts, connectors and relays. The contact cleaner is formulated to clean electrical contacts and switches. It can be used for han
The D-24 populated-board imaging system is an acoustic micro-imaging system that nondestructively images mounted components for internal defects. The system can scan an area up to 24 x 24". The system is said to be most sensitive to gap-type internal defects, such as delaminations, disbonds, voids and cracks. It has two modes of operations: single image, for boards populated with devices all having the same height and depth of interest, and multiple image, for boards with mixed components.
M-620 automated fluid dispenser is designed for dispensing processes such as flip chip and CSP underfill, dam and fill, silver epoxy, IC encapsulation, thermal grease, and lid seal. The system has a linear pump that reportedly delivers accurate, repeatable dispensing regardless of fluid viscosity. It also has the company`s Mass Flow Calibration technology, which is said to maintain a closed-loop dispensing process for accurate dispensing and fully automatic process control. Dual-mode contact and
Electrically Conductive Adhesive
A single-component, silver-filled, electrically conductive adhesive, 121-06 is said to be suitable for application by syringe dispensing. This product is designed for assembling PTC pills as well as electrical and electronic components. The resulting bond reportedly exhibits thermal cycling resistance, electrical and thermal conductivity. It is ready to use as supplied. Users apply the adhesive to the surface to be bonded by hand or automatic method and assembly. Best properties for most applica
Designed to provide consistent spacing between PCBs and components, Wash-Aways spacers are organic polymer spacers that locate and reinforce PCB components during soldering operations. After soldering, the spacers dissolve in most water-solvent baths, leaving uniform spacing between components and boards and providing free circulation of air, mechanical protection, optimum filleting, and greater accessibility for inspection, cleaning and conformal coating.
The adaptive artificial intelligence technology implemented in AIMS 3.l was developed to address the task of inspecting small and fine-pitch SMT components at any position in the assembly line. It inspects all components on every board for defects, such as missing component, reversed component, wrong component, bent/lifted leads and insufficient/excess solder, without any programming. The user is guided through the inspection process by a graphical interface that allows new operators to set up n
rework & repair
The LS-100 is a semiautomatic, off-line rework system that prevents overheating and thermal stress of components, the board, and adjacent components. It performs selective soldering and rework of all types of components, from µBGAs to large QFPs and even odd-shaped and hybrid devices. This system is ideal for soldering and desoldering RF shielding and various paste-in-hole and solder-paste-on-thorough-hole applications. It employs a YAG laser beam, a pyrometer for program and process contro
ESD-compliant Bar-code Scanner
The IR-2000 ESD 2D scans 1-D and 2-D symbologies and is available in standard or high-density versions. It is rated and tested to discharge less than 20 V maximum, the average discharge time from 1,000 to less than 20 V does not exceed 15 seconds, and it has a surface resistivity greater than or equal to 105 W2 to less than 107 W2.
Static-dissipative Vinyl Upholstery
Microcon white is a static-dissipative vinyl for the company`s chair models. With this vinyl seating upholstery, the chairs are said to offer critical environments (including cleanrooms) static-dissipative protection in three colors: white, blue and black. Average component resistance to the ground is 1.2 x 107 W. The surface resistivity is 5.3 x 106 to 108 W per square surface at 500 V. Reportedly, the decay time from 5,000 V to technical zero is 0.44 seconds.
ADHESIVES/ COATINGS/ ENCAPSULANTS
The first commercially available reworkable underfill, Loctite 3567 provides the reliability and processing ease of conventional thermoset underfills. It allows flip chips to be replaced on any device after testing determines that a chip is defective, minimizing board disposal and improving the cost-effectiveness of the manufacturing process. The underfill improves the reliability of BGA and CSP assemblies, particularly important for roughly handled consumer electronic applications. Simply heati
X-ray inspection has established itself as the state-of-the-art for nondestructive in-line and off-line inspection of hidden solder joints, particularly for BGAs, CSPs and flip chips. While revealing many defects (e.g., bridges, misalignment and voids), other critical defects are more difficult or impossible to detect, such as excess flux residue, surface structure and micro-cracking. The ERSASCOPE offers a cross-sectional, nondestructive visual image of hidden solder joints by looking under the
Owners of deHaart Technologies screen and stencil printing machines can obtain squeegee blades and holders from this company. These blades and holders are said to meet or exceed the company`s OEM specifications and are "drop-in" replacements. The OEM squeegee blade line includes polyurethane blades, flat metal blades, adjustable angle metal blades and squeegee blade holders for deHaart as well as other industry manufacturers, including DEK, Fuji, MPM, Panasonic and SMTech. The polyurethane squee
Used to test PCBs, GC-ICT 4.1.4 creates ICT programs, prepares requests for quotes, analyzes board testability, processes legacy data and translates Gerber files. It is said to prepare boards accurately and quickly for ICT by integrating Gerber data, drill and BOM files giving new capabilities in data preparation. The program generates Testability Scout, a professional report that reportedly organizes key elements in an HTML, MS Word or plain text format. It states accessible and inaccessible te
Sonnet Lite is a free 3-D planar electromagnetic (EM) analysis software suite. Based on the company`s full Sonnet em Suite EM analysis product line, this no-cost package is suitable for microstrip, stripline and two-layer circuits, including interlayer vias and vias to ground planes. Users can enter circuit layouts in a drawing editor, perform EM analyses, plot and print output results, export output data (S, Y, Z parameters) to other high-frequency simulators, as well as display and animate cir
This product is a new release of the Calibration Manager software. Designed to meet ISO 9000, QS 9000 and other standards, this software combines a database and report writing capabilities to assist users in maintaining the full cycle of calibration management. The latest release, Version 3.0, is said to offer many new features, including electronic-signature tracking, auto-reminder, satellite module, Crystal Reports 7.0, easier to use select/sort capabilities, tag ID system and more.
Colorless Residue Paste
A no-clean, colorless residue solder paste, DSP 691 reportedly supports print speeds of 1 to 8" per second. It has a 24-hour stencil life, up to 48-hour tack time and 72-hour open time. The paste is said to be 100 percent ICT pin probable and leave clear, minimal post-solder residue. It will reflow with or without nitrogen, and is said to be tested and approved for the DEK ProFlow cassette package.
The Model 930D "gun-style" ESD simulator is designed for use in a variety of applications, including electronic, automotive, military and medical. Its design is said to allow for quick change of resistor and capacitor networks, polarity modules, probe tip configuration and firing requirements. Designed for both air and contact discharges, the unit incorporates auto and manual modes and reportedly is adjustable from ±500 to ±26 kV.
APEX 2000 REVIEW
HERNDON, Va. - The National Electronics Manufacturing Initiative (NEMI) kicked off its Roadmap 2000 with a day-long working session immediately following the IPC SMEMA Council`s Electronics Assembly Process Exhibition and Conference (APEX) in Long Beach, Calif. An estimated 140 individuals representing more than 60 OEMs, contract manufacturers (CM), equipment vendors, suppliers, universities and government agencies participated in the meeting, which launches NEMI`s year-long activities to map th
NIS, SRT Acquired
WESTFORD, Mass. - GenRad Inc. announced that it acquired San Diego-based Nicolet Imaging Systems (NIS) and its sister company, Sierra Research and Technology (SRT), Westford, Mass., from ThermoSpectra Corp., a subsidiary of Thermo Instrument Systems Inc. The acquisition expands the range of test solutions GenRad provides to electronics manufacturers to include manual and automatic X-ray inspection, as well as rework and repair.
CBAR Teams Up with SMTnet
PORTLAND, Maine - SMTnet and the Center for Board Assembly Research (CBAR) at the Georgia Institute of Technology announced a partnership to share resources and technical content over the Web. The agreement provides for the distribution of SMTnet`s Electronics Forum over the CBAR Web site, providing convenient access to SMTnet`s community of electronics manufacturing professionals and Georgia Tech`s faculty and students. In addition, Georgia Tech will publish technical papers in the SMTnet prof
Juki Expands in North America, Europe
MORRISVILLE, N.C. - With its acquisition of the Zevatech PCB assembly division now complete, Juki Automation Systems is expanding its North American and European presence by taking over the former`s facilities in North Carolina, California and Switzerland. This is intended to strengthen customer service for new Juki customers as well as existing Zevatech customers.
One Electronics Materials Company Acquires Another
ROCKY HILL, Conn. - Henkel KgaA, an international chemical company with 56,000 employees in 70 countries headquartered in Dusseldorf, Germany, assumed ownership of Multicore Solders and all of its global manufacturing and distribution sites. One of Henkel`s subsidiaries is Loctite. At the present time, it is expected that Loctite and Multicore will operate as distinct and separate companies, servicing their customers independently. Cooperation has already commenced in overlapping areas of produ
General H. Norman Schwarzkopf delivered his keynote presentation to nearly 1,600 attendees. His speech, "Leadership: From the War Room to the Board Room," defined his principles for success in leading people. The General called upon his years of service as commander in chief, United States Central Command, and commander of operations for Desert Shield and Desert Storm in the 1991 Persian Gulf War. During his 35 years of service in the U.S. military, General Schwarzkopf was awarded many honors, i
More than 6,000 people showed up for the APEX Gala, held Wednesday, March 15, at the indoor/ outdoor Terrace Plaza Mall near the Long Beach Convention Center. The gala featured magicians, jugglers, acrobats and mimes roaming through the crowd, as well as a variety of food stands featuring entrees ranging from local favorites to ethnic classics. Also present at the gala was the rock group WAR, which performed live later in the evening.
Best Paper Awards
Two papers presented at APEX were recognized with Best Paper awards by the IPC. Dr. Shelgon Yee from Solectron, Milpitas, Calif., received the award for best U.S. technical paper for authoring "Optimization of Design and Process Parameters for CSP Solder Joints." The award for best international technical paper went to Caroline Beelen-Hendrix and Martin Veguld from Philips Center for Manufacturing Technology, Netherlands, for "Trends in Assembly Processes for Miniaturized Consumer Electronics."
SMT VISION Awards
The 8th annual SMT Magazine VISION Awards were presented at APEX on March 13, 2000, at the Hyatt adjacent to the Long Beach Convention Center. Fourteen companies received awards for innovation in the following categories: Adhesives/Coatings/Encapsulants, Assembly Tools, Cleaning, Components, Contract Services, Dispensing Equipment, Inspection, Pick-and-Place, Printing, Rework & Repair, Software, Soldering Equipment, Soldering Materials, and Testing. For a complete list of winners and more inform
At the end of this year`s show, the IPC announced the dates for next year`s APEX - January 14 through 18, 2001, at the San Diego Convention Center. Papers are being sought in all areas dealing with: advanced packaging, assembly processes, factory equipment and automation, material developments, component technology, environmental concerns, electronic manufacturing services, test and quality, industry standards, and business issues.
The company is extending its line of surface mount T1/E1 to include the industrial temperature range. This family of products is said to address high-port-density telecom applications, including WAN, internetworking interfaces, ISP servers, multiplexers, digital access and cross connect systems, channel banks, and cellular base stations. These applications may be in environments not suitable for standard temperature performers. The transformer family includes part numbers T1103 to T1114.
Distribution Agreements Aplenty
Vishay Intertechnology Inc. and Avnet Inc. signed a worldwide distribution agreement that covers Vishay`s full line of electronic components. The agreement extends the existing relationship between Vishay, a designer, manufacturer and marketer of passive electronic components, discrete semiconductors and integrated circuits (IC), and Avnet, one of the largest distributors of semiconductors, interconnects, passive and electromechanical components, and computer products.
Miniature Trimmer Capacitors
The company is extending the range of its A1 series miniature trimmer capacitors to 12 pF. With 13 turns of adjustment and positive stops, the A1_12 is said to be suitable for tuning applications in amplifiers, filters and oscillators. It is offered in PCB and SMT mountings, and high-voltage and nonmagnetic versions are available. Qs reportedly are greater than 1,000 at 200 MHz, and self-resonance is 1.2 GHz at 12 pF.
Five new families of surface mount, high-current components in the 1813, 2218, 3020, 3114 and 3722 packages were added to the company`s selection of inductors. With footprint diameters ranging from 4.5 to 9.5 mm and height profiles as low as 3.2 mm, the inductors are said to be suitable for notebook computers, cell phones, pagers and other end products where space is at a premium. Typical applications include buck and boost DC/DC conversion and power line filtering circuits.
The company expanded its product line of single- and multiturn 3, 4 and 5 mm SMD trimmer potentiometers for high-density, high-performance applications. They are said to have cermet resistive elements rated from 10W to 2 MW. Environmental and performance testing to MIL-STD-202 and MIL-R-22097 is said to ensure reliability, and operating temperature range is -55o to 125oC. Applications include computer peripherals, power supplies, test/measurement equipment, and a variety of entertainment and tel
NEPCON West 2000, February 29 through March 2, at the Anaheim Convention Center, Anaheim, Calif., boasted a full conference schedule, the Technology Advancement Center (TAC), pick-and-place evaluation center, special industry events, and product introductions and news. The show hosted a myriad of companies, representing electronics design through test equipment, from the United States and around the world.
Long-life soldering tips, reportedly designed to meet the demands of high-production users, are said to deliver up to 3X the life of conventional tips. Manufactured from oxygen-free copper and iron, the tips have a polished, consistent finish. A selection of 22 tips is available for the PS-80 soldering iron, which reportedly allows the production user to solder virtually any through-hole or surface mount assembly.
The company is said to offer a line of nondestructive coating-thickness-measurement instruments for use by the PCB, electronics, jewelry and metal-finishing industries. Using the CMI 900, measurement of plating/coating thickness, material composition analysis and assay of precious metals reportedly is possible. Measurements of extremely thin immersion coatings and thin films also can be performed. Designed for ease of use, the equipment is said to provide the user with high inspection productivi
DJ-2200 DispenseJet valve for flux applications is a non-contact dispense valve reportedly designed to offer a high-performance alternative to traditional methods such as dipping, screen printing and ultrasonic spray. Designed for use with the company`s Century Series automated dispensing platforms, the valve reportedly can apply flux for a range of assembly operations, including flip chip, CSP, BGA, MCM and ball attach. The product`s non-contact jet dispensing is said to eliminate the need for
The Advanced Image Processor (AIP II) is an upgraded software package for failure analysis, component inspection, assembly verification and quality control of components and boards. Features include: a library of measurements including ball diameter, moment ratio (melting of solder), elliptical pattern, solder density ranges, threshold library, and auto-void count; semiconductor device analysis including die-attach voiding and wire sweep; and colorized 3-D plots representing solder contour for e
Is it Time to Change CM Business Models?
Do we need new contract manufacturing (CM) business models for the new millennium? Industry trends are forcing changes in CM operative paradigms because of an open-ended total available market (TAM), rapid growth, merger mania, supply-chain mutations, margin shrinkage and e-commerce ebullience.
Communications Drives CM Industry
SAN ANTONIO - As dependence on communication electronics increases, end-user applications are expected to sustain dynamic growth in the CM industry. According to new strategic research from Frost & Sullivan, the market generated $11.83 billion in 1999, and a robust rate is forecasted through 2006.
Solectron Acquires Wireless Company
MILPITAS, Calif. - Solectron Corp. announced the signing of a letter of intent for the acquisition of AMERICOM Wireless Services, a privately held corporation specializing in wireless handset repair and refurbishment as well as outsourced technical customer support services. As part of the transaction, Solectron will gain specialized repair and testing equipment, and assume responsibility for AMERICOM`s business operations in Los Angeles; Louisville, Ky.; Baltimore; and Dallas.
High-speed PCBs Support Backplanes
SAN JOSE, Calif. - Sanmina Corp. announced the successful fabrication of high-speed PCBs to support Thomas & Betts MPI>SI backplane technology. This interconnect technology reportedly offers advantages in system speed, signal integrity, electrical performance and backplane density over conventional connector technology. It is expected to have applications in data communications and telecommunications equipment, including enterprise servers, workstations, routers, switches, and base stations.
Philips & TRC Team Up
BOCA RATON, Fla. - Technical Resources Corp. Inc. (TRC) announced its appointment as Philips Electronics Manufacturing Technology (EMT) Americas` exclusive representative for Florida and Puerto Rico. TRC has three offices in Boca Raton, Orlando and San Juan, Fla., and also represents Vitronics Soltec, GenRad, Christopher Associates, Celtronix, S.P. Precision International, KIC Thermal and AIM.
Singapore CM Wins Two Awards
SINGAPORE - Azuno Manufacturing Pte. Ltd., the CM business unit of Aztech Systems Ltd., won two Quality Awards from Allied Telesyn International (ATI) and P.T. Thomson Television Indonesia. ATI assessed its suppliers on a quarterly basis with a performance rating scheme before awarding Azuno with the Quality Award, which was presented during ATI`s annual Quality Conference in October 1999. P.T. Thomson contracted Azuno to perform SMT placement for their tuners, and the company exceeded the accep
PCB & CM Markets will Continue to Grow
OYSTER BAY, N.Y. - Shipments of printed circuit boards (PCB) will rise throughout the world during the next five years, and contract manufacturers (CM) will continue to see demand for their services climb, according to a new study from Allied Business Intelligence (ABI). Also, CMs are increasingly entering the PCB marketplace to close the gap between manufacturing and design.
Low-noise CCD Camera
The Orbis XE CCD camera is for applications requiring low noise and high frame rates. This modular unit can incorporate a variety of sensors (including Kodak, Thomson, Site, Texas Instruments and others) to reportedly produce very low dark current, high quantum efficiency and enhanced near-UV response for greater signal-to-noise performance. The CCD sensors range from 600 x 500 to 4 x 4 K pixels, with noise floors as low as 5 e-. The camera is suitable for biomedical and scientific applications
Reflow Solder/Curing Furnace
The Falcon 8000 Series reflow solder/curing furnaces reportedly feature the company`s Conduction + Convection heating and cooling technology, use of power and gas, throughput, small equipment footprint and repeatable profiles enabling high-volume production. Parts are transported through the furnace by sweeperbars that can operate continuously or in a timed-delay mode that is designed to produce temperature uniformity in the reflow/curing profile. The Series includes 8100 (10 heat zones) and the
The LUXOR visible light, fiber-optic spot lamp is said to cure adhesives through substrates that absorb UV light and allow for greater depth of cure compared with UV-light curing. This high-intensity light source (greater than 100 mW/cm2) can be used with advanced, single-pack, UV- and visible-light-cure adhesives in optoelectronics, fiber optics, lens bonding and other microassembly applications. It cures adhesives with a 460 nm visible blue light that reportedly is a safe alternative to UV lig
The Summit 2100 Series is designed to increase the speed and accuracy of rework, and handles BGAs, µBGAs and flip chips on boards up to 18 x 22" with 2" vertical clearance. Featuring Auto Profile Software, the series is said to automatically set and maintain proper reflow temperature for any board/component combination. A user-friendly, menu-driven interface allows the user to program the complete rework sequence. The series automates the entire rework process, including component removal,
Component Removal System
The Freedom HGR 2000 is a rework system for component placement, soldering and removal. It is suitable for BGA, µBGA, flip chip, and fine-pitch process development and prototype production. The system features Windows-based control software with one-touch cycle initiation. The topside heating system is said to apply precise quantities of forced convective heat directly to the component and has adjustable gas temperature, gas flow and nozzle height. A forced convective bottomside process hea
Recreate Original Assembly Conditions
The M-9006V is said to recreate the conditions of original assembly during the rework process. This user-friendly system can remove components, clean pads, dispense paste or adhesive, and remount components. It reportedly incorporates a fast-on/fast-off board-size under-heater that uses IR heat to prevent board warp. During removal and remounting of components, adjacent components are said to be safe from heat damage because of ultra-thin, hot-air shower nozzles. An AutoLift positioning arm prev