Article Highlights
Plasmatreat on Atmospheric Pressure Plasma
07/20/2018 | Barry Matties, I-Connect007
Overcoming Growth Challenges
07/19/2018 | Neil Sharp, JJS Manufacturing
Tackling Reliability Challenges in Low-Temperature Soldering
07/18/2018 | Barry Matties and Stephen Las Marias, I-Connect007
Nearing Retirement, Juki's Bob Black Reflects on a Long Career
07/17/2018 | Barry Matties, I-Connect007
ASM Assembly Solutions on CFX
07/16/2018 | Barry Matties, I-Connect007

Latest Articles

Assembly Cell Software

Release 4.1 of the Model 3500 Automatic Component Assembly Cell Software includes enhancements that are said to be designed to increase accuracy, provide the operator with a greater choice of features and operations, and increase ease-of-use. Updates include lookup camera referencing, dynamic axis correction and a touch-based wafer punch-up routine. Wafer programming is said to be simplified, a tool-purge parameter has been added and jog options have been expanded. This version is designed for f

EMI Analysis

Sonnet Lite is a free 3-D planar electromagnetic (EM) analysis software suite. Based on the company`s full Sonnet em Suite EM analysis product line, this no-cost package is suitable for microstrip, stripline and two-layer circuits, including interlayer vias and vias to ground planes. Users can enter circuit layouts in a drawing editor, perform EM analyses, plot and print output results, export output data (S, Y, Z parameters) to other high-frequency simulators, as well as display and animate cir

Programmed Dispensing

The company has introduced PathMaster version 2.1 for use with its automatic dispensers and selective conformal coating systems. This latest version of the Windows-based programming software is said to offer all of the same features found in version 2.0, with the added multimedia help library and the Fast-Mask feature for conformal coating applications. It uses a multimedia help tutorial section to help users complete new or unfamiliar tasks, create or edit commands, download projects, and more.

Calibration Software

This product is a new release of the Calibration Manager software. Designed to meet ISO 9000, QS 9000 and other standards, this software combines a database and report writing capabilities to assist users in maintaining the full cycle of calibration management. The latest release, Version 3.0, is said to offer many new features, including electronic-signature tracking, auto-reminder, satellite module, Crystal Reports 7.0, easier to use select/sort capabilities, tag ID system and more.

Placement Conversion

SMS Linecontrol is an industry-approved software package that is tailored for SMT manufacturers seeking stable CAD-conversion software for SMT placement files. It reportedly is designed to enable operators to communicate freely with individual placement machines, minimize programming time and eliminate downloading complexities. The software also is said to offer seamless communication across different brands of equipment and is an integrated, multitasking product.

Solder Wires

The W300, W400 and W500 series of cored, high-purity solder wires include no-clean, water-soluble and rosin-based wires for use in rework and attachment of thermally sensitive components. The W300 Series no-clean wires consist of a blend of rosins designed for user flexibility and a high level of protection against corrosion. The W500 Series water-soluble wires are reportedly designed for a high level of wetting and ease of cleaning. The W400 Series is available with a rosin-based flux core.

Colorless Residue Paste

A no-clean, colorless residue solder paste, DSP 691 reportedly supports print speeds of 1 to 8" per second. It has a 24-hour stencil life, up to 48-hour tack time and 72-hour open time. The paste is said to be 100 percent ICT pin probable and leave clear, minimal post-solder residue. It will reflow with or without nitrogen, and is said to be tested and approved for the DEK ProFlow cassette package.

Static Control

The Minimeg is designed for accurate measurement of surface resistivity and surface-to-ground resistance of work surfaces. The unit is reportedly suitable for spot-checking dissipative and conductive surfaces. It operates on a 9 V battery and measures surface resistivity up to less than 1010 W/square or surface-to-ground resistance up to less than 109 W. Both NIST and non-NIST models are available.

ESD Simulator

The Model 930D "gun-style" ESD simulator is designed for use in a variety of applications, including electronic, automotive, military and medical. Its design is said to allow for quick change of resistor and capacitor networks, polarity modules, probe tip configuration and firing requirements. Designed for both air and contact discharges, the unit incorporates auto and manual modes and reportedly is adjustable from ±500 to ±26 kV.

Component Protection

Partfolio is a portable kitting system designed to securely store a range of small parts and protect sensitive components against damage from ESD at all stages of production. It is designed as an alternative to the "plastic bags in tote boxes" parts management approach still in common use. Advantages are said to include portability, quick setup and parts migration prevention when closed. Other advantages reportedly include improved quality control, increased productivity and decreased costs. To


ESD-compliant Lighting

The Imagelite Model 20 quartz-halogen fiber optic illuminator is an ESD-compliant product developed to provide shadow-free, glare-free, cold illumination for use in industrial and electronics manufacturing. Designed to meet the increasingly stringent demands of static-sensitive applications such as magneto-resistive head assembly and inspection in the semiconductor industry, the illuminator is also designed to work in virtually all microscopy, industrial and machine vision system applications.

APEX 2000 REVIEW

HERNDON, Va. - The National Electronics Manufacturing Initiative (NEMI) kicked off its Roadmap 2000 with a day-long working session immediately following the IPC SMEMA Council`s Electronics Assembly Process Exhibition and Conference (APEX) in Long Beach, Calif. An estimated 140 individuals representing more than 60 OEMs, contract manufacturers (CM), equipment vendors, suppliers, universities and government agencies participated in the meeting, which launches NEMI`s year-long activities to map th

NIS, SRT Acquired

WESTFORD, Mass. - GenRad Inc. announced that it acquired San Diego-based Nicolet Imaging Systems (NIS) and its sister company, Sierra Research and Technology (SRT), Westford, Mass., from ThermoSpectra Corp., a subsidiary of Thermo Instrument Systems Inc. The acquisition expands the range of test solutions GenRad provides to electronics manufacturers to include manual and automatic X-ray inspection, as well as rework and repair.

CBAR Teams Up with SMTnet

PORTLAND, Maine - SMTnet and the Center for Board Assembly Research (CBAR) at the Georgia Institute of Technology announced a partnership to share resources and technical content over the Web. The agreement provides for the distribution of SMTnet`s Electronics Forum over the CBAR Web site, providing convenient access to SMTnet`s community of electronics manufacturing professionals and Georgia Tech`s faculty and students. In addition, Georgia Tech will publish technical papers in the SMTnet prof

Juki Expands in North America, Europe

MORRISVILLE, N.C. - With its acquisition of the Zevatech PCB assembly division now complete, Juki Automation Systems is expanding its North American and European presence by taking over the former`s facilities in North Carolina, California and Switzerland. This is intended to strengthen customer service for new Juki customers as well as existing Zevatech customers.

Forecasting 2000 R&D Spending

COLUMBUS, Ohio - Total research and development (R&D) expenditures in the United States are expected to increase to more than $266 billion in 2000, according to the annual Battelle/R&D Magazine forecast. That total is almost 8 percent more than the $247 billion estimated to have been spent in 1999.

One Electronics Materials Company Acquires Another

ROCKY HILL, Conn. - Henkel KgaA, an international chemical company with 56,000 employees in 70 countries headquartered in Dusseldorf, Germany, assumed ownership of Multicore Solders and all of its global manufacturing and distribution sites. One of Henkel`s subsidiaries is Loctite. At the present time, it is expected that Loctite and Multicore will operate as distinct and separate companies, servicing their customers independently. Cooperation has already commenced in overlapping areas of produ

Keynote

General H. Norman Schwarzkopf delivered his keynote presentation to nearly 1,600 attendees. His speech, "Leadership: From the War Room to the Board Room," defined his principles for success in leading people. The General called upon his years of service as commander in chief, United States Central Command, and commander of operations for Desert Shield and Desert Storm in the 1991 Persian Gulf War. During his 35 years of service in the U.S. military, General Schwarzkopf was awarded many honors, i

Gala

More than 6,000 people showed up for the APEX Gala, held Wednesday, March 15, at the indoor/ outdoor Terrace Plaza Mall near the Long Beach Convention Center. The gala featured magicians, jugglers, acrobats and mimes roaming through the crowd, as well as a variety of food stands featuring entrees ranging from local favorites to ethnic classics. Also present at the gala was the rock group WAR, which performed live later in the evening.

Best Paper Awards

Two papers presented at APEX were recognized with Best Paper awards by the IPC. Dr. Shelgon Yee from Solectron, Milpitas, Calif., received the award for best U.S. technical paper for authoring "Optimization of Design and Process Parameters for CSP Solder Joints." The award for best international technical paper went to Caroline Beelen-Hendrix and Martin Veguld from Philips Center for Manufacturing Technology, Netherlands, for "Trends in Assembly Processes for Miniaturized Consumer Electronics."


SMT VISION Awards

The 8th annual SMT Magazine VISION Awards were presented at APEX on March 13, 2000, at the Hyatt adjacent to the Long Beach Convention Center. Fourteen companies received awards for innovation in the following categories: Adhesives/Coatings/Encapsulants, Assembly Tools, Cleaning, Components, Contract Services, Dispensing Equipment, Inspection, Pick-and-Place, Printing, Rework & Repair, Software, Soldering Equipment, Soldering Materials, and Testing. For a complete list of winners and more inform

2001 Already?

At the end of this year`s show, the IPC announced the dates for next year`s APEX - January 14 through 18, 2001, at the San Diego Convention Center. Papers are being sought in all areas dealing with: advanced packaging, assembly processes, factory equipment and automation, material developments, component technology, environmental concerns, electronic manufacturing services, test and quality, industry standards, and business issues.

Lead-Free Electronics Full Steam Ahead

Quite a bit has happened in the past year, as U.S. electronics manufacturers try to untie the lead-free knot laid before them. This comes after fighting so hard in the early 1990s for exemption from U.S. legislation calling for the elimination of lead from electronics assemblies.

Are You Ready for Lead free Reflow ?

New reflow profiles and oven configurations must be explored to meet the needs of lead-free solder paste.

Designing with CBGAs

An Experimental Approach for commercial and industrial electronics, PBGAs generally perform reliably over a -40° to 85°C temperature range. For aerospace and military assemblies demanding reliable operation over a wider temperature range, it is necessary to use CBGAs.

Soldering with Diode Lasers

Two trends have lifted laser soldering into new prominence: the replacement of wave soldering with reflow soldering, and the emergence of diode lasers with increased power output and high service life.

SMT Tab Receptacles Ensure Solder Joint Strength

A new development in SMT interconnection technology is tab receptacles with board-retention force equivalent to through-hole counterparts (roughly 30 to 35 lb). With solder joint strength ensured, the inherent advantages of SMT components put this new receptacle in a position to supplant the through-hole version even in environments such as automotive and appliance applications.

Power Management

The family of SmartOR power management products includes the CMPWR025, CMPWR100, CMPWR120 and CMPWR150. These single-chip solutions are said to be designed for solving the various power management challenges inherent in many of today`s PC and peripheral designs such as network interface cards, modems and power supplies. The line reportedly offers high current ratings as a standard feature and exclusive features that are said to provide the flexibility and simplicity required when adding an insta

Transformers

The company is extending its line of surface mount T1/E1 to include the industrial temperature range. This family of products is said to address high-port-density telecom applications, including WAN, internetworking interfaces, ISP servers, multiplexers, digital access and cross connect systems, channel banks, and cellular base stations. These applications may be in environments not suitable for standard temperature performers. The transformer family includes part numbers T1103 to T1114.

Power Converter

The QMT-100 is a "quarter-brick" DC/DC power converter that is said to have a full 30 A current capacity. It was developed for the continued demand in the telecommunications and industrial arenas for smaller, more robust electronic devices with lower voltage and higher current requirements. The new quarter-brick reportedly is replacing the half-brick for many applications that have size limitations but require high power. The product weighs 75 g and its dimensions are 1.45 x 2.28 x 0.50".


USB Connectors

This line of USB connectors, which includes both A and B series receptacles and cable assemblies, is designed to meet the demand for smaller, more reliable I/O interconnects while providing shielding and board-locking features. The Series A receptacles are available in the following configurations and styles: vertical and horizontal stack; through-hole and SMT; horizontal and upright; and standard and flanged-out shells. The Series B offerings include right-angle and vertical PC mount receptacle

Distribution Agreements Aplenty

Vishay Intertechnology Inc. and Avnet Inc. signed a worldwide distribution agreement that covers Vishay`s full line of electronic components. The agreement extends the existing relationship between Vishay, a designer, manufacturer and marketer of passive electronic components, discrete semiconductors and integrated circuits (IC), and Avnet, one of the largest distributors of semiconductors, interconnects, passive and electromechanical components, and computer products.

New Conformal Coatings Combine Protection with Environmental Safety

Providing Excellent dielectric resistance, these coatings feature insulative protection and resistance to various solvents and harsh environments.

Minimizing Solder Spatter Impact

Following reflow, memory-module gold connector fingers may exhibit solder spatter contamination, which could mean both a quality and a reliability issue for the product and manufacturing process problems.

Non-contact Inspection Systems for Automated PCB Assembly

Vision inspection of printed circuit boards (PCB) is a straightforward process. A PCB is mechanically placed in the pick-and-place machine using the board`s edge or tooling holes as guides. There may be significant tolerance variations in the circuit`s pattern relative to the board edge and lesser variations with respect to the tooling holes. Also, there may be minute differences in the outside dimensions because device enclosures are generally not carefully controlled during manufacture. It is

The Benefits of a Ramp-to-Spike Reflow Profile

The pains often associated with profiling may be reduced greatly if certain guidelines are followed and if there is a strong understanding of the variables that can be encountered during the reflow process.

Are You Ready for Lead-free Solder Paste?

Any lingering doubts about the global nature of the electronics assembly marketplace have been put to rest by the topic of lead-free processing. Although the United States currently has no restrictions on lead use in electronics assemblies, other markets are in the process of implementing them. As a result, manufacturers of both surface mount assemblies and hybrid circuits must meet the restrictions to remain competitive.

Surface Mount Buzzers

The Kingstate KSS Series ultra-miniature surface mount buzzers are available in various sizes, operating voltages and resonant frequencies. While reportedly designed primarily for use as ringers and alerts in wireless and cellular phone uses, these units are suitable for a variety of telecommunication and portable test equipment applications. Size choices range from 8.5 x 8.5 x 3.2 mm to 10.0 x 10.0 x 4.0 mm, with operating voltage ratings from 1.5 to 5.0 VDC at resonant frequencies of 2,700 to

SMT Connector

Featuring a distance of 4 to 5 mm between boards, the FX10 Series of parallel board-to-board surface mounted connectors are said to allow increased and improved transmission speeds. This reportedly is achieved, in part, through ground plenums on both mating assemblies. Ground stability is achieved with direct connection of the ground plenums to the board. Signal contacts are on 0.5 mm spacing, with ground plenum contact every 10 contact positions. Additional stability is provided with board sold

Plug and Sockets

The Firewire IEEE 1394 plug and sockets are now available for high-speed and wide bandwidth applications. These connectors are said to be suitable for devices from digital video, digital cameras and DVD players to cable modems, LAN connections and consumer-AV devices. The jacks are surface mount and feature snap-in PC tails to hold the connector in position. Also available are a horizontal through-hole mount and an upright through-hole mount. They reportedly are designed to withstand greater tha


Leadless Packages

These standard and custom leadless Cirpak packages for RFIC applications are said to feature plated and bonded copper (PBC) on alumina ceramic for electrical and thermal conductivity. This leadless design reportedly has been tested up to 6 GHz with excellent RF test results. Packages can be customized and are available with plated through-vias or edge metallization. Ceramic lids, with or without epoxy preform, also are available.

Filter Array

The 0612 low pass filter array is said to provide four equivalent RCR T-filters with a dual common ground, reportedly resulting in the equivalent of eight resistors and four capacitors in one chip. Primary applications are in signal filtering, EMI suppression, and mobile or cordless systems. It is said to feature the ability to filter four circuits with one package, providing distributed capacitance and shielded resistance. The integrated package also is said to have lower parasitic capacitance

Inductors

The tiny shielded inductors in the DS1608BL Series are said to be engineered for backlighting applications. They reportedly feature high breakdown voltage and efficiency with DC resistance 10 to 60 percent lower than currently available inductors. These magnetically shielded parts are designed with a flat top for pick-and-place operations. The heat-resistant materials are said to ensure trouble-free assembly and reflow soldering.

SMD Film Capacitors

These smaller series GMW and SMW surface mount film capacitors use a "naked" construction, and are said to offer sizes down to 1812 for applications where stability or self-healing are required. This series is said to be less susceptible to moisture than other types and cannot delaminate. They are offered in higher voltages than were commonly available in the past. The capacitance range is 1,000 pF to 1 µF in voltages up to 630 VDC.

Miniature Trimmer Capacitors

The company is extending the range of its A1 series miniature trimmer capacitors to 12 pF. With 13 turns of adjustment and positive stops, the A1_12 is said to be suitable for tuning applications in amplifiers, filters and oscillators. It is offered in PCB and SMT mountings, and high-voltage and nonmagnetic versions are available. Qs reportedly are greater than 1,000 at 200 MHz, and self-resonance is 1.2 GHz at 12 pF.

Miniaturized Inductors

Five new families of surface mount, high-current components in the 1813, 2218, 3020, 3114 and 3722 packages were added to the company`s selection of inductors. With footprint diameters ranging from 4.5 to 9.5 mm and height profiles as low as 3.2 mm, the inductors are said to be suitable for notebook computers, cell phones, pagers and other end products where space is at a premium. Typical applications include buck and boost DC/DC conversion and power line filtering circuits.

Trimmer Potentiometers

The company expanded its product line of single- and multiturn 3, 4 and 5 mm SMD trimmer potentiometers for high-density, high-performance applications. They are said to have cermet resistive elements rated from 10W to 2 MW. Environmental and performance testing to MIL-STD-202 and MIL-R-22097 is said to ensure reliability, and operating temperature range is -55o to 125oC. Applications include computer peripherals, power supplies, test/measurement equipment, and a variety of entertainment and tel

Metal-oxide Semiconductor Devices

The company introduced a range of eight new HDMOS devices. The 20 and 30 V P-channel MOSFETs are said to offer performance for low-voltage load switching applications, reportedly helping to increase battery life in portable equipment. Minimum threshold voltage is 0.7 or 1 V, which enables the devices to provide performance from a low-voltage source.

Crystal Oscillators

These new VCXOs are said to provide stable frequency sources for the telecommunications and instrumentation industries. They are suitable for use in phase-locked loops, clock recovery, reference signal tracking, synthesizers and frequency modulation/demodulation applications. The VCSAT (5.0 V) and VCSAXT (3.3 V) VCXOs reportedly have stabilities from ±25 to ±100 ppm. Pullability ranges from ±50 to ±100 ppm, and temperature ranges from -10o to 70oC or from -40o to 85oC.

Surface Mount Package

This three-terminal version of the company`s Powermite surface mount product line is designed to replace larger and higher profile D-PAK and TO-220 packages used for semiconductor devices. The devices are said to be less than 1.1 mm high and require 5.3 x 4.8 mm on a PCB. The product also reportedly has a rugged construction and provides thermal impedance and resistance characteristics.


Nepcon West

NEPCON West 2000, February 29 through March 2, at the Anaheim Convention Center, Anaheim, Calif., boasted a full conference schedule, the Technology Advancement Center (TAC), pick-and-place evaluation center, special industry events, and product introductions and news. The show hosted a myriad of companies, representing electronics design through test equipment, from the United States and around the world.

SMT Printer

PrinTEK Model 5000-APS is reported to be the largest SMT printer for batch-style, fine-pitch production. It is said to be suitable for large PCBs such as those used for backplane and motherboard production. The printer reportedly is designed to eliminate many challenges associated with assembling large SMT boards with two features: its tooling system and the stencil loading area.

Socket

Designed to meet the high-density packaging needs of the Intel Mobile Pentium III processor, the ultra-low-profile Micro PGA socket reportedly accepts various Intel mobile processors with speeds up to 650 MHz. With an overall height of 2.0 mm, these ZIF SMT sockets reportedly meet the low-profile and high-density needs of thin and light notebook PCs. The 495-circuit socket is based on a 1.27 mm grid array that is said to provide almost double the pin density in a third the size of traditional th

Soldering Tips

Long-life soldering tips, reportedly designed to meet the demands of high-production users, are said to deliver up to 3X the life of conventional tips. Manufactured from oxygen-free copper and iron, the tips have a polished, consistent finish. A selection of 22 tips is available for the PS-80 soldering iron, which reportedly allows the production user to solder virtually any through-hole or surface mount assembly.

Thickness Measurement

The company is said to offer a line of nondestructive coating-thickness-measurement instruments for use by the PCB, electronics, jewelry and metal-finishing industries. Using the CMI 900, measurement of plating/coating thickness, material composition analysis and assay of precious metals reportedly is possible. Measurements of extremely thin immersion coatings and thin films also can be performed. Designed for ease of use, the equipment is said to provide the user with high inspection productivi

Dispense Valve

DJ-2200 DispenseJet valve for flux applications is a non-contact dispense valve reportedly designed to offer a high-performance alternative to traditional methods such as dipping, screen printing and ultrasonic spray. Designed for use with the company`s Century Series automated dispensing platforms, the valve reportedly can apply flux for a range of assembly operations, including flip chip, CSP, BGA, MCM and ball attach. The product`s non-contact jet dispensing is said to eliminate the need for

Image Processor

The Advanced Image Processor (AIP II) is an upgraded software package for failure analysis, component inspection, assembly verification and quality control of components and boards. Features include: a library of measurements including ball diameter, moment ratio (melting of solder), elliptical pattern, solder density ranges, threshold library, and auto-void count; semiconductor device analysis including die-attach voiding and wire sweep; and colorized 3-D plots representing solder contour for e

Modular AOI System

The VPS 6053 is a modular, fully automated PCB inspection system that reportedly delivers high-speed AOI with full-depth, high-resolution inspection. A variety of camera types can be used to boost throughput. It incorporates an overhead gantry drive system with synchronous linear motors, and offers dual-vision/X-ray technologies. Windows NT drives the positioning system, which can be integrated with a computer network or LAN.

Self-contained Sensors

The 11 models in the AR600 series of line-scan camera laser displacement sensors reportedly have full-scale measurement spans from 0.125" with an accuracy of 0.00015" (4 µ), up to a full-scale span of 50" with accuracy of 0.05". The devices are said to be suitable for use in measurement systems and applications from 0.5 to 80" distance and operate at up to 1,250 samples per second. The sensors are self-contained and NEMA-4/IP-67 sealed for wet and dry environments.

Is it Time to Change CM Business Models?

Do we need new contract manufacturing (CM) business models for the new millennium? Industry trends are forcing changes in CM operative paradigms because of an open-ended total available market (TAM), rapid growth, merger mania, supply-chain mutations, margin shrinkage and e-commerce ebullience.


Communications Drives CM Industry

SAN ANTONIO - As dependence on communication electronics increases, end-user applications are expected to sustain dynamic growth in the CM industry. According to new strategic research from Frost & Sullivan, the market generated $11.83 billion in 1999, and a robust rate is forecasted through 2006.

Solectron Acquires Wireless Company

MILPITAS, Calif. - Solectron Corp. announced the signing of a letter of intent for the acquisition of AMERICOM Wireless Services, a privately held corporation specializing in wireless handset repair and refurbishment as well as outsourced technical customer support services. As part of the transaction, Solectron will gain specialized repair and testing equipment, and assume responsibility for AMERICOM`s business operations in Los Angeles; Louisville, Ky.; Baltimore; and Dallas.

High-speed PCBs Support Backplanes

SAN JOSE, Calif. - Sanmina Corp. announced the successful fabrication of high-speed PCBs to support Thomas & Betts MPI>SI backplane technology. This interconnect technology reportedly offers advantages in system speed, signal integrity, electrical performance and backplane density over conventional connector technology. It is expected to have applications in data communications and telecommunications equipment, including enterprise servers, workstations, routers, switches, and base stations.

Philips & TRC Team Up

BOCA RATON, Fla. - Technical Resources Corp. Inc. (TRC) announced its appointment as Philips Electronics Manufacturing Technology (EMT) Americas` exclusive representative for Florida and Puerto Rico. TRC has three offices in Boca Raton, Orlando and San Juan, Fla., and also represents Vitronics Soltec, GenRad, Christopher Associates, Celtronix, S.P. Precision International, KIC Thermal and AIM.

Singapore CM Wins Two Awards

SINGAPORE - Azuno Manufacturing Pte. Ltd., the CM business unit of Aztech Systems Ltd., won two Quality Awards from Allied Telesyn International (ATI) and P.T. Thomson Television Indonesia. ATI assessed its suppliers on a quarterly basis with a performance rating scheme before awarding Azuno with the Quality Award, which was presented during ATI`s annual Quality Conference in October 1999. P.T. Thomson contracted Azuno to perform SMT placement for their tuners, and the company exceeded the accep

PCB & CM Markets will Continue to Grow

OYSTER BAY, N.Y. - Shipments of printed circuit boards (PCB) will rise throughout the world during the next five years, and contract manufacturers (CM) will continue to see demand for their services climb, according to a new study from Allied Business Intelligence (ABI). Also, CMs are increasingly entering the PCB marketplace to close the gap between manufacturing and design.

Stereo Microscope

The LYNX stereo-zoom microscope is said to produce high-resolution images up to 120X on a large viewing area. Its patented Dynascope technology reportedly promotes operator comfort and eliminates eye, neck and back strain commonly associated with eyepiece technologies. Fatigue-free images are said to appear on a large viewing area that gives the operator freedom of head and body position. The pupil expansion also makes it routine for operators to wear glasses during use. It features a standard m

Low-noise CCD Camera

The Orbis XE CCD camera is for applications requiring low noise and high frame rates. This modular unit can incorporate a variety of sensors (including Kodak, Thomson, Site, Texas Instruments and others) to reportedly produce very low dark current, high quantum efficiency and enhanced near-UV response for greater signal-to-noise performance. The CCD sensors range from 600 x 500 to 4 x 4 K pixels, with noise floors as low as 5 e-. The camera is suitable for biomedical and scientific applications

Color CCD Camera

The TMC-7DSP 0.5" color CCD camera is said to provide color fidelity and full broad-band response in a high-resolution 0.5" CCD format. It outputs VBS (NTSC or PAL), Y/C or S-Video RGB and operates with a high-speed variable shutter (1/60 to 1/10,000 seconds) with through-the-lens auto/manual white balance, AGC on/off switch, and manual gain and hue controls. The DSP circuitry reportedly delivers a stable performance over a variety of conditions. The low-light sensitivity is 2 lux at F 1.4.

Precision-soldering System

The Pana Point Plus (SB) precision-soldering system is available in medium and extra-large sizes. This robotic platform reportedly provides automation of manual operations with minimal capital investment. The platform is said to offer conveyor handling and optional in/out dual shuttle for both linear and point-to-point soldering. This platform can be upgraded to the company`s Soft Beam, noncontact light-beam-soldering system.


Hot-bar Bonder

The Model 4000 is a computer-controlled bonding system for ACF, heat-seal and reflow-solder applications. It now includes Windows NT-based software capabilities

Convection Reflow Ovens

The QRS Plus Series of convection reflow ovens reportedly features a new conveyor system designed for reliable operation and low maintenance. The conveyor uses a chain-transfer system with ball bearings in all shafts and drives. An automatic independent pin-chain tensioning system is said to ensure correct tension as the chains expand and contract with changing oven temperatures. Extended rails reportedly allow for easier conveyor interface and ensure alignment between the oven and any SMEMA-com

Desoldering Tips

Endura Desoldering Tips reportedly feature an anti-clogging riser tube to ensure that solder is delivered to the collection chamber in a molten state. This is said to help prevent clogging and allow continuous work flow.

Automated Soldering Technology

The company has combined two essential elements of the automated soldering process-board-touch sensing and the soldering iron-into one, making the soldering iron tip the actual board-touch sensor. This "Sure-touch" technology is designed to simplify the soldering process and reportedly guarantees contact between the soldering iron and the solder joint itself for greater consistency and fewer defects. There is said to be no need for special programming to accommodate variations in height of indiv

Spot UV Light Source

The Model PK101 spot UV curing system features a high-intensity light source with a flexible light guide that is said to transmit energy and give users control for precision UV-curing (even in hard-to-reach areas). The unit`s internal shutter, which controls the curing exposure time, can be controlled by a manual foot pedal or a push button timer located on the face of the unit. The control of curing time and distance from the light guide to the work piece allows for rapid cures of UV materials

Reflow Solder/Curing Furnace

The Falcon 8000 Series reflow solder/curing furnaces reportedly feature the company`s Conduction + Convection heating and cooling technology, use of power and gas, throughput, small equipment footprint and repeatable profiles enabling high-volume production. Parts are transported through the furnace by sweeperbars that can operate continuously or in a timed-delay mode that is designed to produce temperature uniformity in the reflow/curing profile. The Series includes 8100 (10 heat zones) and the

Reflow Ovens

The first in a series of high-performance reflow ovens designed for the semiconductor market is the Bravo, which is said to feature several new design innovations that provide the performance required for high-production manufacturing environments. The system reportedly provides operators with full control over the reflow system through a user-friendly operator interface. A new convection heating technology preheats air at the intake of the blower reportedly to provide stable thermal energy for

Floodlight Curing System

The ELC-4001 is a high-energy, solid- state advanced floodlight curing system that reportedly delivers greater than 100 mW/cm2 of UV energy at a peak wavelength of 365 nm. The visible-light version is peaked at 450 nm and generates greater than 500 mW/cm2 of output. A 400 W lamp, available in either the standard 365 nm or 298 nm wavelength for applications requiring shortwave UV, is available.

Reflow Process Control

Profile Wizard is designed to simplify process control by recording optimized thermal processing profiles, then comparing them minutes, hours or days later to oven performance. Its array of three dual sensors is adjustable from 3 to 26" to match the board width. The product rides on a belt or edge/rail conveyor to profile the edges and center of the oven, providing a complete thermal picture. Features include repeatable, reliable temperature sensors that reportedly will not degrade with time or

Spot Lamp

The LUXOR visible light, fiber-optic spot lamp is said to cure adhesives through substrates that absorb UV light and allow for greater depth of cure compared with UV-light curing. This high-intensity light source (greater than 100 mW/cm2) can be used with advanced, single-pack, UV- and visible-light-cure adhesives in optoelectronics, fiber optics, lens bonding and other microassembly applications. It cures adhesives with a 460 nm visible blue light that reportedly is a safe alternative to UV lig


MicroBGA Rework

This micro-stencil and nozzle are designed specifically for the rework of Tessera`s microBGA component. The stencil reportedly fits the pattern and is the same size as the part. Because the stencil is viewed with a camera by a prism that views both the stencil and PCB pad pattern simultaneously, the operator is said to be able to align the stencil perfectly to the PCB. The stencil is trapezoidal etched, and can be lowered multiple times if solder paste is not 100 percent deposited in all holes.

Rework Stations

The Summit 2100 Series is designed to increase the speed and accuracy of rework, and handles BGAs, µBGAs and flip chips on boards up to 18 x 22" with 2" vertical clearance. Featuring Auto Profile Software, the series is said to automatically set and maintain proper reflow temperature for any board/component combination. A user-friendly, menu-driven interface allows the user to program the complete rework sequence. The series automates the entire rework process, including component removal,

Desoldering Station

The DS101-V Desoldering Station reportedly provides minimal dwell time, fast reflow and immediate extraction of molten solder. Its vacuum/temperature base unit features an aluminum and brass venturi vacuum generator and spike-free, low-voltage DC switching. The DS101-P integrates a diaphragm pump, making it a stand-alone and portable desoldering system.

Component Removal System

The Freedom HGR 2000 is a rework system for component placement, soldering and removal. It is suitable for BGA, µBGA, flip chip, and fine-pitch process development and prototype production. The system features Windows-based control software with one-touch cycle initiation. The topside heating system is said to apply precise quantities of forced convective heat directly to the component and has adjustable gas temperature, gas flow and nozzle height. A forced convective bottomside process hea

Recreate Original Assembly Conditions

The M-9006V is said to recreate the conditions of original assembly during the rework process. This user-friendly system can remove components, clean pads, dispense paste or adhesive, and remount components. It reportedly incorporates a fast-on/fast-off board-size under-heater that uses IR heat to prevent board warp. During removal and remounting of components, adjacent components are said to be safe from heat damage because of ultra-thin, hot-air shower nozzles. An AutoLift positioning arm prev

Rework System

The RW116 Rework System reportedly can rework PCBs with connector sizes up to 20 x 2" (on 24 x 24" boards) and uses forced-heated convection to preheat the PCB to effect faster processing, shorter rework cycles and less possibility

Reballing Kit

The Weller BGA Reballing Kit replaces solder balls on BGAs and reportedly enables users to reball the BGAs to the original condition. Included in the kit are six templates (with pitches from 1.00 to 1.50 mm, both full and staggered matrices), a vial of 10,000 eutectic solder balls, a clamping fixture, and straight and angled probes and tweezers. Also included are a screwdriver, spatula, squeegee, flux pen, Kapton tape, a dummy BGA (for practice) and an instruction manual.

SMT Rework

The 710 SolderLight incorporates IR technology into a hand-held soldering/desoldering tool for use on BGAs, QFPs, PLCCs, SOICs, SMDs, SMT sockets and connectors. Double- and single-sided PCBs are said to be easily soldered or desoldered. The company`s patented IR method reportedly eliminates hot-air/gas adjacent component movement and damage resulting from conventional contact rework methods.

Publishers Executive Council Interview

SMT Magazine`s Publisher`s Executive Council consists of 38 electronics industry executives hand-picked by publisher Jim Collins. They share their expertise and insights with our editorial staff and act as a sounding board for new editorial concepts and projects. These individuals also contribute much to the industry in general, working as leaders within their companies. This month`s Publisher`s Executive Council Interview features one of the industry`s leading innovators: DEK USA president Rich

Spot Lamp

The LUXOR visible light, fiber-optic spot lamp is said to cure adhesives through substrates that absorb UV light and allow for greater depth of cure compared with UV-light curing, according to the press release. This high-intensity light source (greater than 100 mW/cm2) can be used with advanced, single-pack, UV- and visible-light-cure adhesives in optoelectronics, fiber optics, lens bonding and other microassembly applications. It cures adhesives with a 460 nm visible blue light that reportedly


Rework System

The RW116 Rework System reportedly can rework PCBs with connector sizes up to 20 x 2" (on 24 x 24" boards) and uses forced-heated convection to preheat the PCB to effect faster processing, shorter rework cycles and less possibility of thermal stress to the PCB. This system, along with the company`s Series RW105 and RW110 systems, is said to use PLC-controlled individual solder fountains operating with fluid dynamics to generate stable waves and reduce turbulence. Nozzles are interchangeable to s

Desoldering Station

The DS101-V Desoldering Station reportedly provides minimal dwell time, fast reflow and immediate extraction of molten solder. Its vacuum/temperature base unit features an aluminum and brass venturi vacuum generator and spike-free, low-voltage DC switching. The DS101-P integrates a diaphragm pump, making it a stand-alone and portable desoldering system.

Reballing Kit

The Weller BGA Reballing Kit replaces solder balls on BGAs and reportedly enables users to reball the BGAs to the original condition. Included in the kit are six templates (with pitches from 1.00 to 1.50 mm, both full and staggered matrices), a vial of 10,000 eutectic solder balls, a clamping fixture, and straight and angled probes and tweezers. Also included are a screwdriver, spatula, squeegee, flux pen, Kapton tape, a dummy BGA (for practice) and an instruction manual.

SMT Rework

The 710 SolderLight incorporates IR technology into a hand-held soldering/desoldering tool for use on BGAs, QFPs, PLCCs, SOICs, SMDs, SMT sockets and connectors. Double- and single-sided PCBs are said to be easily soldered or desoldered. The company`s patented IR method reportedly eliminates hot-air/gas adjacent component movement and damage resulting from conventional contact rework methods.

Nozzles

NZ Nozzles for the company`s QX-2 convection rework tool are engineered to use a "focused-convection" design. These nozzles reportedly ensure that thermal energy is directed only to the target component, which is said to maximize efficiency and minimize board and adjacent component damage. An aperture in the nozzle allows the QX-2`s vacuum pickup to lift the component at the end of the reflow cycle. This ensures that the component is lifted off only after all solder connections have reflowed, wh

SMD Rework Station

The ESD-safe Model 852 SMD rework station is said to feature a built-in vacuum pickup with a range of 7 to 20 liters per minute and analog display of airflow control. A lamp alerts the operator when vacuum pickup is in use. Stainless steel nozzles (not included with this model) direct heated air onto component leads while reportedly preventing unwanted heat from affecting neighboring components. Two modes of operation are available: manual (for simple operation) or auto (for programmable process

SCREEN PRINTING

Owners of deHaart Technologies screen and stencil printing machines can obtain squeegee blades and holders from this company. These blades and holders are said to meet or exceed the company`s OEM specifications and are "drop-in" replacements. The OEM squeegee blade line includes polyurethane blades, flat metal blades, adjustable angle metal blades and squeegee blade holders for deHaart as well as other industry manufacturers, including DEK, Fuji, MPM, Panasonic and SMTech. The polyurethane squee

Vision Alignment System

The DEKalign 4 manual vision alignment system is for use on the company`s 248 and 260 surface mount screen printers. Operators can work interactively with this product to align substrates to the stencil before printing. This system reportedly maintains the tight tolerances in stencil-to-board positional accuracy required for fine-pitch devices and is configured for the Windows NT operator interface. On-screen prompts guide the operator through the process.

3-D Virtual Factory

Production PILOT reportedly gives engineers and designers the ability to conceive, analyze and verify assembly processes. Its 3-D virtual factory environment allows engineers to begin process planning earlier while simultaneously finding and correcting problems before investing in capital equipment or fabricating parts. The system`s three modules-PILOT Cell, PILOT Line and PILOT Yield-are said to give engineers flexibility to analyze various automated and manual assembly scenarios for feasibilit

ICT Program

Used to test PCBs, GC-ICT 4.1.4 creates ICT programs, prepares requests for quotes, analyzes board testability, processes legacy data and translates Gerber files. It is said to prepare boards accurately and quickly for ICT by integrating Gerber data, drill and BOM files giving new capabilities in data preparation. The program generates Testability Scout, a professional report that reportedly organizes key elements in an HTML, MS Word or plain text format. It states accessible and inaccessible te


Flip Chip Calculator

The Flip Chip Calculator is a software application that is available at no cost on the company`s Web site. It reportedly offers a way to determine the volume of underfill necessary to optimize flip chip-in-package and flip COB dispensing processes. Users input parameters including die proportions, fillet width and solder-bump profiles, then select a specific underfill material from the range of industry-standard fluids included in the program. The materials list can be edited to accommodate addi

Software Library

MVTools CE is said to be the first and only set of C/C++-based machine vision software tools based on Microsoft Windows CE, the new industry-standard operating system for embedded control applications. The software reportedly is designed to offer OEMs and systems integrators a library of vision development tools that combines sub-pixel accuracy with ease of use. It is suitable for automated manufacturing applications that require capabilities such as integrated vision and motion control. It has

Socket Modules

The company has announced that with the software release 3.43A comes eight new socket modules and support for 12,678 devices from 100 semiconductor manufacturers. The new software release reportedly adds 252 new devices and eight new socket modules, three of which are Actel socket modules. New device support is released simultaneously for both engineering and production programmers reportedly to make the transition from design to manufacturing as easy as possible.

Assembly Cell Software

Release 4.1 of the Model 3500 Automatic Component Assembly Cell Software includes enhancements that are said to be designed to increase accuracy, provide the operator with a greater choice of features and operations, and increase ease-of-use. Updates include lookup camera referencing, dynamic axis correction and a touch-based wafer punch-up routine. Wafer programming is said to be simplified, a tool-purge parameter has been added and jog options have been expanded. This version is designed for f

EMI Analysis

Sonnet Lite is a free 3-D planar electromagnetic (EM) analysis software suite. Based on the company`s full Sonnet em Suite EM analysis product line, this no-cost package is suitable for microstrip, stripline and two-layer circuits, including interlayer vias and vias to ground planes. Users can enter circuit layouts in a drawing editor, perform EM analyses, plot and print output results, export output data (S, Y, Z parameters) to other high-frequency simulators, as well as display and animate cir

Programmed Dispensing

The company has introduced PathMaster version 2.1 for use with its automatic dispensers and selective conformal coating systems. This latest version of the Windows-based programming software is said to offer all of the same features found in version 2.0, with the added multimedia help library and the Fast-Mask feature for conformal coating applications. It uses a multimedia help tutorial section to help users complete new or unfamiliar tasks, create or edit commands, download projects, and more.

Spot UV Light Source

The Model PK101 spot UV curing system features a high-intensity light source with a flexible light guide that is said to transmit energy and give users control for precision UV-curing (even in hard-to-reach areas). The unit`s internal shutter, which controls the curing exposure time, can be controlled by a manual foot pedal or a push button timer located on the face of the unit. The control of curing time and distance from the light guide to the work piece allows for rapid cures of UV materials

Reflow Ovens

The first in a series of high-performance reflow ovens designed for the semiconductor market is the Bravo, which is said to feature several new design innovations that provide the performance required for high-production manufacturing environments. The system reportedly provides operators with full control over the reflow system through a user-friendly operator interface. A new convection heating technology preheats air at the intake of the blower reportedly to provide stable thermal energy for

Reflow Solder/Curing Furnace

The Falcon 8000 Series reflow solder/curing furnaces reportedly feature the company`s Conduction + Convection heating and cooling technology, use of power and gas, throughput, small equipment footprint and repeatable profiles enabling high-volume production. Parts are transported through the furnace by sweeperbars that can operate continuously or in a timed-delay mode that is designed to produce temperature uniformity in the reflow/curing profile. The Series includes 8100 (10 heat zones) and the

Reflow Process Control

Profile Wizard is designed to simplify process control by recording optimized thermal processing profiles, then comparing them minutes, hours or days later to oven performance. Its array of three dual sensors is adjustable from 3 to 26" to match the board width. The product rides on a belt or edge/rail conveyor to profile the edges and center of the oven, providing a complete thermal picture. Features include repeatable, reliable temperature sensors that reportedly will not degrade with time or


MicroBGA Rework

This micro-stencil and nozzle are designed specifically for the rework of Tessera`s microBGA component. The stencil reportedly fits the pattern and is the same size as the part. Because the stencil is viewed with a camera by a prism that views both the stencil and PCB pad pattern simultaneously, the operator is said to be able to align the stencil perfectly to the PCB. The stencil is trapezoidal etched, and can be lowered multiple times if solder paste is not 100 percent deposited in all holes.

Rework Stations

The Summit 2100 Series is designed to increase the speed and accuracy of rework, and handles BGAs, µBGAs and flip chips on boards up to 18 x 22" with 2" vertical clearance. Featuring Auto Profile Software, the series is said to automatically set and maintain proper reflow temperature for any board/component combination. A user-friendly, menu-driven interface allows the user to program the complete rework sequence. The series automates the entire rework process, including component removal,

Electronic Loads

The company has launched its MML series of modular medium-power programmable DC electronic loads for engineering and manufacturing test applications. The loads are said to be suitable for testing AC/DC converters, DC/DC converters, power-storage devices and electronic components. Available in power levels from 100 to 600 W, these modules can be mounted in either a benchtop or 19" rack-mount chassis 7" (4 U) high.

Component Removal System

The Freedom HGR 2000 is a rework system for component placement, soldering and removal. It is suitable for BGA, µBGA, flip chip, and fine-pitch process development and prototype production. The system features Windows-based control software with one-touch cycle initiation. The topside heating system is said to apply precise quantities of forced convective heat directly to the component and has adjustable gas temperature, gas flow and nozzle height. A forced convective bottomside process hea

Oscilloscope Calibrator

The 5820A oscilloscope calibrator supports the calibration requirements of oscilloscopes with bandwidths up to 2.1 GHz. The calibrator can be equipped with a five-channel output option that facilitates hands-free automated calibration of multi-channel oscilloscopes. Other features reportedly include: 600 MHz leveled sine/300 ps edge is standard with the option to extend performance to 2.1 GHz leveled sine/150 ps edge; front panel current loop for calibrating current probes; DC voltage measuremen

LCR Meter

The Z9216 LCR meter measures resistors, inductors and capacitors at a 20X per second rate, with 0.05 percent accuracy. Component Q values and dissipation factors are displayed via front-panel LCD readouts. For remote operation, this instrument is equipped with RS-232, GPIB and Handler Port Interfaces. The unit accepts optional SMD tweezers, BNC fixture adapters and Kelvin clips. The unit stores and recalls nine instrument setups and has five test frequencies from 100 Hz to 100 kHz. Measurement a

Ionic System

The SMD-3 Ionograph is an ionic test system for analyzing the cleanliness of completed, cleaned PCBAs prior to conformal coating. The system is ETL certified to UL Standard 3111-1, as well as NFPA 196 and NEC500/501. It is designed for use with a PC, includes software to automate the test and data capture process, and allows the user to test to all pertinent IPC standards. The system can provide characterization of residues from both no-clean and clean fluxes. It has 600 M( sensitivity.

Test Chambers

The SE-Series environmental test chambers incorporate larger compressors. By doubling compressor horsepower, these chambers are said to provide very rapid temperature-change rates. The chambers can improve screening effectiveness by imparting greater levels of thermal stress to products under test. The high-volume air distribution system reduces gradients. Each chambers has the 7800 programmer/controller. It can graph, datalog, edit and offer on-screen context sensitive help. It has a 3.5" disk

Four Tip Styles

Four tip styles are available for the FLUXBUSTERS Series of probes. The tip designs reportedly improve the ability of the probe to make reliable contact to contaminated or unique targets on PCBs. Each tip is a modification of a existing tip designs. Three of the four tips are designed to contact vias. For filled vias, all three tips have sharp edges to cut through contaminants around the edge of the via.

Resistivity Meter

The Loresta GP is a microprocessor-based resistivity meter that contains in memory the data required to calculate the correction factors that affect resistivity measurements. It has selectable output for surface resistivity (W per square), volume resistivity (Wcm), resistance (W) or conductivity. The user can select manual or automatic measurement range from mW to MW (12-2 to 107). Options include an automated X-Y table, a printer and software for electronic transfer to a computer. A varied amou


Test-interface Unit

This test-interface unit features a socket with a removable clamshell lid for testing 600 pin BGA IC designs. The socket is mounted on an HP 83000 interface board with an aluminum frame for mechanical connection to the tester, and the assembled unit is reportedly tested to verify impedance and continuity of the test-interface unit. The company claims to be the only one that designs and produces each of the key components (the test socket or contactor, interface board, and frame/fixture), then as

Recreate Original Assembly Conditions

The M-9006V is said to recreate the conditions of original assembly during the rework process. This user-friendly system can remove components, clean pads, dispense paste or adhesive, and remount components. It reportedly incorporates a fast-on/fast-off board-size under-heater that uses IR heat to prevent board warp. During removal and remounting of components, adjacent components are said to be safe from heat damage because of ultra-thin, hot-air shower nozzles. An AutoLift positioning arm prev

Printer/Encoder

The R-140 radio-frequency identification (RFID) printer/encoder is said to be capable of printing and encoding "smart labels," which are printable labels embedded with 13.56 MHz RFID transponders in a single pass. The printer is said to be able to perform in a variety of mission-critical applications, including those with 24-hour duty cycles.

Static-dissipative Labels

Static charge is generated by bar-code labels during their use, up to 10,000 V. Static charge generated with Tribogard static-dissipative labels can barely be measured and reportedly is less than 25 V, using ASTM and EOS/ESD Association standards and methods. The labels are said to offer high-temperature resistance, clean protection, environmental independence, performance and thermal-transfer printability.

Label Dispenser

The LabelKwik Jr. label dispenser is suitable for electronics, automotive and related industries where small-label applications are standard. Designed with operator efficiency in mind, the tabletop dispenser is available for environments that demand a stainless-steel finish. Label sizes can run as small as 0.25 x 0.25", which is said to eliminate waste and operator fumbling to remove labels from backing material. Features reportedly include changeover of label rolls, clear label stock quality, c

Label Applicator

The LA3100 is a label applicator that is said to be suitable for the application of small labels to relatively flat surfaces. This heavy-duty yet compact unit is designed to apply labels without operator intervention, according to the press release. It uses components that are universally available and can operate as a stand-alone unit or be integrated into a conveyor system. Because supplies are loaded from the side, it reportedly takes less than 60 seconds to replenish the label stock/ribbon.

X-ray Inspection

The FXS-160.30 family of microfocus X-ray inspection systems are designed for large-area inspection tasks, such as PCB inspection. Modular setup and a variety of options, such as in-line capability, are available. Depending on the tube types, acceleration voltages up to 225 kV and geometrical magnifications up to 1,300 fold are reportedly available. Test samples are placed onto a table manipulator (3 axes) or are fixtured in an additional rotation and tilt unit.

Modular AOI System

The VPS 6053 is a modular, fully automated PCB inspection system that reportedly delivers high-speed AOI with full-depth, high-resolution inspection. A variety of camera types can be used to boost throughput. It incorporates an overhead gantry drive system with synchronous linear motors, and offers dual-vision/X-ray technologies. Windows NT drives the positioning system, which can be integrated with a computer network or LAN.

Self-contained Sensors

The 11 models in the AR600 series of line-scan camera laser displacement sensors reportedly have full-scale measurement spans from 0.125" with an accuracy of 0.00015" (4 µ), up to a full-scale span of 50" with accuracy of 0.05". The devices are said to be suitable for use in measurement systems and applications from 0.5 to 80" distance and operate at up to 1,250 samples per second. The sensors are self-contained and NEMA-4/IP-67 sealed for wet and dry environments.

Stereo Microscope

The LYNX stereo-zoom microscope is said to produce high-resolution images up to 120X on a large viewing area. Its patented Dynascope technology reportedly promotes operator comfort and eliminates eye, neck and back strain commonly associated with eyepiece technologies. Fatigue-free images are said to appear on a large viewing area that gives the operator freedom of head and body position. The pupil expansion also makes it routine for operators to wear glasses during use. It features a standard m


Low-noise CCD Camera

The Orbis XE CCD camera is for applications requiring low noise and high frame rates. This modular unit can incorporate a variety of sensors (including Kodak, Thomson, Site, Texas Instruments and others) to reportedly produce very low dark current, high quantum efficiency and enhanced near-UV response for greater signal-to-noise performance. The CCD sensors range from 600 x 500 to 4 x 4 K pixels, with noise floors as low as 5 e-. The camera is suitable for biomedical and scientific applications

Color CCD Camera

The TMC-7DSP 0.5" color CCD camera is said to provide color fidelity and full broad-band response in a high-resolution 0.5" CCD format. It outputs VBS (NTSC or PAL), Y/C or S-Video RGB and operates with a high-speed variable shutter (1/60 to 1/10,000 seconds) with through-the-lens auto/manual white balance, AGC on/off switch, and manual gain and hue controls. The DSP circuitry reportedly delivers a stable performance over a variety of conditions. The low-light sensitivity is 2 lux at F 1.4.

Convection Reflow Ovens

The QRS Plus Series of convection reflow ovens reportedly features a new conveyor system designed for reliable operation and low maintenance. The conveyor uses a chain-transfer system with ball bearings in all shafts and drives. An automatic independent pin-chain tensioning system is said to ensure correct tension as the chains expand and contract with changing oven temperatures. Extended rails reportedly allow for easier conveyor interface and ensure alignment between the oven and any SMEMA-com

Hot-bar Bonder

The Model 4000 is a computer-controlled bonding system for ACF, heat-seal and reflow-solder applications. It now includes Windows NT-based software capabilities for set up, user operation and process control across a variety of hot-bar applications. Said to be a configurable system, this model reportedly can drive up to four independent, precision hot-bar temperature controllers and can be configured with a variety of X-Y and/or rotary-motion systems. It is suitable for low- to medium-volume sol

Precision-soldering System

The Pana Point Plus (SB) Precision-soldering system is available in medium and extra-large sizes. This robotic platform reportedly provides automation of manual operations with minimal capital investment. The platform is said to offer conveyor handling and optional in/out dual shuttle for both linear and point-to-point soldering. This platform can be upgraded to the company`s Soft Beam, noncontact light-beam-soldering system.

Desoldering Tips

Endura Desoldering Tips reportedly feature an anti-clogging riser tube to ensure that solder is delivered to the collection chamber in a molten state. This is said to help prevent clogging and allow continuous work flow. The tips come in three configurations: Thermo Drive Tips, which deliver more heat and last longer; Precision Tips, for desoldering fine through-hole leads or leads in tight areas; and Precision Flo-Desoldering Tips, to remove solder from small pads and vias.

CSP and µBGA Test Applications

The 0.010" diameter Fuzz Button for test sockets is said to enable the company`s high-performance test sockets to employ 0.5 mm pitch. These small, cylindrically shaped electrical contacts with a low inductance and 0.100 k actuation performance are suitable for µBGA and CSP applications. Their composition is gold-plated beryllium-copper, molybdenum, tungsten and nickel-chromium. Suitable for electrical conduction for DC-to-microwave frequencies, they come in sizes from 0.010 to 0.50".

The company has combined two essential elements of the automated soldering process-board-touch sensing and the soldering iron-into one, making the soldering iron tip the actual board-touch sensor

The company has combined two essential elements of the automated soldering process-board-touch sensing and the soldering iron-into one, making the soldering iron tip the actual board-touch sensor. This "Sure-touch" technology is designed to simplify the soldering process and reportedly guarantees contact between the soldering iron and the solder joint itself for greater consistency and fewer defects. There is said to be no need for special programming to accommodate variations in height of indiv

Floodlight Curing System

The ELC-4001 is a high-energy, solid-state advanced floodlight curing system that reportedly delivers greater than 100 mW/cm2 of UV energy at a peak wavelength of 365 nm. The visible-light version is peaked at 450 nm and generates greater than 500 mW/cm2 of output. A 400 W lamp, available in either the standard 365 nm or 298 nm wavelength for applications requiring shortwave UV, is available.

Flip Chip Underfill Encapsulants

The ME-525 series of capillary-flow underfill encapsulants for flip chip devices protect the chip/joint interface by redistributing thermal stresses stemming from CTE mismatches between the board and the die. The thermoset materials isolate the solder bumps from forces that might fracture the interconnects, adding to performance and reliability. The series is said to be a high-Tg, low-CTE liquid epoxy formulated for high flow speed under the chip. The rheology reportedly permits such flows to pe


Assembly Service

A PCB assembly and modification service, this company also specializes in cables and harnesses. Its assembly line includes a vision-system-assisted stencil printer, a surface mount placement unit handling 4,000 cph (including testing of passive and discrete devices), IC insertion including DIPs (including lead trimming), and semiaqueous/closed-loop cleaning. Other features of the assembly line include: wave soldering performed under MIL-STD-2000, high-temperature standards; in-circuit tests usin

Sn/Ag/Cu Solders

This range of lead-free solders provides environmental benefits in meeting the WEEE Directive for 2004. Although the alloy (Sn/Ag/Cu) has a higher melting point than conventional tin/lead eutectics, it reportedly has a high resistance to thermal fatigue together with improved joint strength. Available as RMA and RA solder pastes and as RMA cored solder wire, the paste features the company`s Type 3 powder, which has an 11 percent flux content, 0.06 percent halogen and a typical viscosity of 180 P

Large-board Pick-and-Place

The 4796L high-speed placement machine is reportedly able to handle board sizes up to 18 x 20" (457 x 508 mm). It is said to achieve 0.1 second tact time for components ranging from 0201 up to SOP16s. The machine uses direct-drive technology, reportedly allowing theta corrections to occur on the fly for large part placement.

Semiautomatic Benchtop Stencil Printers

The Speedprint SP200 features programmable pressure, speed and stroke print parameters; variable board/stencil separation; flexible system tooling; and a mylar alignment system. It is available with or without vision. The SP100 is a front-loading, semiautomatic benchtop stencil printer that features vertical board/stencil separation, flexible system tooling, and adjustable pressure, speed and stroke print parameters.

Automated Placement/Rework Station

The Pinnacle 500R rework system is an entry-level unit able to handle boards up to 14 x 20" and 2" high components. It is said to be specifically designed to rework µBGAs, BGAs and QFPs. The system aligns, places and reflows surface mount components. It includes an independent heating nozzle and vacuum pickup tube, thermal cycle libraries, and look up/down split-image component placement. Its Windows-based software program allows the user to create a rework profile and store it in memory. A

BGA-to-PGA Adapter

The AB356G-1 BGA-to-PGA adapter reportedly converts a 356-lead BGA with 1.27 mm ball pitch to a standard 20 x 20 footprint. The adapter is routed with a one-to-one interconnect and can be used for prototyping as well as production requirements where a reliable socket solution is required. It is available in single pieces or in pallet form for high-volume applications. The company also offers assembly services.

Photoetched Shielding Components

The company uses photoetching for cost savings to manufacture board-level shielding components, such as custom fences with removable covers. This process is said to improve design flexibility, shorten lead times and eliminate hard tooling costs. Photoetching also reportedly allows the fabrication of board-level shielding components with close tolerances that cannot be duplicated by other methods. Fences, covers, through-holes, slots and mounting pins can be designed in any configuration.

LGA Socket

The cLGA socket system reportedly enables solderless chip-to-board and board-to-board interconnection. This solderless system is said to allow the user to avoid the termination and reliability problems caused by thermal expansion in high-pin-count devices. The socket uses a conventional BeCu contact with 30 µin Au over Ni plating. This low-profile connector design yields a 0.94 nH inductance. When fully mated, it has a total deflection of 0.012" with an average of 50 g normal force per cont

Surface Mount Adapters

The company now offers several new sizes of the PolyPod surface mount adapters for QFP packages. The QFP surface mount base can be soldered to a PCB and connected to emulators or logic analyzers, and can be used as a socket. The surface mount base reportedly has options for receptacles that can be used to interconnect to any test system, or the receptacles can be used to add height to extend the test equipment off the board. A socket cover is available.

Lamps

The company`s improved standard gooseneck design reportedly does not sag or sway for environments requiring a vibration-free light source. The gooseneck is covered by PVC sleeving that is said to resist damage and wear. This new design is said to free operators from the strain and stress of having to physically adjust to their equipment. The lamps are ergonomically designed for ease-of-use and engineered for heavy production schedules.


Pressure-formed Housing

These pressure-formed housings, which are designed to protect PCBs, reportedly are manufactured from a pliable, heavy-gauge plastic called 0.060" Kydex. Each housing is pressure-formed from roll stock, hole punched and routed for air ventilation

Exatron Labels

This company offers a complete line of labels and ribbons for direct purchase for use on Exatron labeling equipment. Both stock and build-to-order labels are manufactured in white polyester, tan and white Kapton. They are reportedly engineered to high performance standards and survive all electronic processes. Providing one ribbon for all materials is said to ensure less changeover and label waste, improving product efficiency levels.

2-D Code Reader

Quadrus 2.0 is an upgraded, fully integrated 2-D code reader that is said to make it easier and more affordable for electronics manufacturers to use Data Matrix in their lot-tracking systems. It reportedly combines the CCD technology of a vision system with the ease of use and functionality of a bar-code scanner. By using a single setting, the product reportedly is capable of reading high-contrast printed black-on-white labels as well as low-contrast, laser-etched labels. The 2.0 version reporte

Automatic Label Placer

The DataPlace Model 100LP automatic label placer features placement rates of 3,600 pph, a dual-nozzle head, up to three 600 dpi printers and integration into existing manufacturing processes, reportedly without compromising standards for process integration and throughput. Its machine design is said to capitalize on the company`s experience with pick-and-place machines and vision systems.

Label Placer

The Model 8330 Label Placer is a high-speed, flexible label placement system that is said to be capable of applying a range of labels on PCBs at speeds up to 900 labels per hour. It can be used as part of an off-line or in-line process and is available in single- or dual-lane configurations for maximum throughput. As each PCB is fed into the system, adjustable tooling pins orient each board for label placement. An overhead gantry-style X-Y positioning system moves a placement head to the feeders

Conference

The NEPCON West conference offerings are separated into several types of classes: Tutorials, Professional Advancement Courses, Workshops and Technical Sessions.

Interconnection Seminar

Held Wednesday, March 1, 9:00 a.m. to 4:00 p.m., this seminar, sponsored by the International Institute of Connector and Interconnection Technology, focuses on the basic connector areas needed for the everyday challenges of interconnection design, selection, evaluation and procurement. Taught by industry-recognized experts, it presents practical knowledge that will cover material selection through functionality, testing and performance criteria.

Contract Manufacturing Symposium

Presented by Sharon Mecum and Dr. Charles Mullen of Technology Forecasters Inc., "The Contract Manufacturing Game: Skills, Tools, and Insights for OEMs and Contract Electronics Manufacturers," will be held Tuesday, February 29, from 8:30 a.m. to 2:30 p.m.

Advanced Packaging Symposium

Held on Monday, February 28, from 9:00 a.m. to 4:00 p.m. and chaired by John Lau, Express Packaging Systems, the symposium will address wafer-level packaging and interconnection.

Contract Manufacturing Senior Executive Forum

Presented by Technology Forecasters Inc. on Monday, February 28, from 7:30 a.m. to 7:00 p.m., this forum will be chaired by Pamela Gordon, certified management consultant and president of Technology Forecasters Inc.


Packaging Session

The packaging session, Component Packaging for the 21st Century, will be held Tuesday, February 29, from 1:00 to 3:00 p.m. Packaging experts address the issues PCB assemblers need to understand to build the next generation of electronics products, including the impact of area-array packaging on the assembly floor, thermal management concerns, the effects of lead-free solder on component packages, and more.

Keynote Addresses

Tuesday, February 29, at 8:00 a.m., John Madden, sportscaster/analyst, author and football coach, will kickoff NEPCON West 2000 with a keynote speech.

Pick-and-place Evaluation Center

The Pick-and-place Evaluation Center, located in Hall B, provides a strategic approach to evaluating assembly pick-and-place equipment. Four high-speed placement machines are on display, set up side-by-side, with third-party technical experts providing in-use feedback and interpretation of manufacturers` published machine specifications.

Contract Manufacturing Demonstration Line

Located in the Contract Manufacturing Demonstration Area in Hall C, the Contract Manufacturing Demonstration Line is a complete SMT line that produces live products for one of the participating contract manufacturer`s customers.

Low-volume Batch Assembly Line

The low-volume batch line demonstrates the processing of flip chips, CSPs and PBGAs in a low-volume production line using low-volume production and prototyping equipment.

Lead-free PBGA Assembly Line

The PBGA line features the full population and assembly of a BGA lead-frame strip containing the circuitry and bonding pads for four PBGA devices. The die-attach process demonstrates the population of a laminate strip containing four PBGA packages containing gold bonding pads for gold-to-gold interconnect COB wire-bond die and the BGA package. The wire bondable die is attached with a silver-filled adhesive, followed by thermal cure, plasma clean and die wire bonding to the pad sites for each dev

Area-array Assembly Line

The Area-array line features the assembly processes, materials and methods necessary for forming CSPs. The die-attach process shows the population of an organic strip containing multiple package interconnects with chip-on-board (COB) wire-bond die for the formation of CSPs. Processes featured include dispensing die attach and subsequent device placement with a single machine, curing the die-attach adhesive, plasma cleaning the wire-bond pad sites, ball-wedge gold capillary wire-bonding, dispensi

PCMCIA Assembly Line

The PCMCIA line highlights the assembly of a high-volume consumer electronics product that incorporates many high-technology facets, including advanced design techniques, a variety of high- pin-count component packages and die, along with cutting edge PCB fabrication technology. The assembly equipment is outfitted for processing the thin laminate that is typically used in PCMCIA panels.

Lead-free HDI Assembly Line

The evaluation and use of lead-free process materials has gained a lot of interest throughout the industry because of legislation that would ban lead use in the electronics industry. The lead-free HDI assembly line demonstrates the attachment of SMDs, BGAs, QFPs, and CSPs using a lead-free solder, lead-free component metallizations and a lead-free PCB pad finish for the top- and bottomside attachment processes.

Y2K Assembly Line

The Y2K assembly line is designed to allow attendees to witness a component attachment process at very low temperatures using a solder alternative. The line features bottomside in-line placement of bar-code labels, as well as the deposition of a solder alternative for the mechanical attachment of quad flat packs (QFP), BGAs, a flip chip and standard surface mount devices (SMD). The devices are cemented in place with a low-temperature heating process, and the flip chip device is underfilled with


New Silicon Chip

The QRC 1284X2 chip is designed to be the single-chip solution to IEEE 1284 parallel port line filtering and termination. The 28-pin QSOP package uses thin film (tantalum nitride) on silicon technology. In each chip, there are 17 capacitors, 17 pull-up resistors and nine termination resistors, and for each of the 17 signal lines, a diode structure provides 8 kV of ESD protection.

AOI System Introduces Synthetic Component Library

A universal component library of synthetic images was introduced as a standard feature on ViTechnology`s automated optical inspection (AOI) systems. This inspection and analysis capability reportedly allows for 100 percent component inspection at maximum throughput speeds. It is accomplished by analyzing key geometric features of runtime component images, as opposed to comparing gray-scale values to reference images or "golden boards."

IRC Expands Capabilities

Resistor manufacturer IRC expanded its series of integrated passive networks to include chip scale packaging (CSP). These integrated passive networks can be configured for a wide range of line termination and electromagnetic interference (EMI)/radio-frequency interference (RFI) filtering functions that are designed to meet the demands of wireless voice and data communications applications where high-density and high-frequency performance are critical.

Single Piece Board-to-board Connector

The new Series HO connectors have surface mount contacts on one side and pressure-actuated pad mating contacts on the other. Pads on the mating board do not have to be gold plated for further cost effectiveness, and they may be sized to absorb board misalignment. These low-profile connectors permit adjacent board spacing of only 3.9 mm (0.154"). Contact pitch is 1.25 mm (0.049") with 22 dual-row circuits provided. Current rating is 1.0 A AC/DC (250 V AC/DC). Contact material is copper alloy, cop

Resettable Circuit Protection Device

The new 2.6A 1812 Series surface mount, positive temperature coefficient resettable circuit protection device has been designed to protect multiple USB ports. It offers 0.050 W maximum on-board resistance, and protects electrical circuits against over-current conditions in a wide range of computer and peripheral applications, including USB ports, PC cards, modems, keyboard and mouse ports, printers, and network cards. The device conforms with USB standard voltage drop and safety requirements for

Subminiature TCXO

This subminiature TCXO is designed for portable, telecommunication, data and test equipment applications. The 312BE TCXO, which measures 7 x 5 x 2 mm, is said to be ideal for surface mount applications and has low-profile packaging with a ceramic base and a metal cover. The 312BE has a frequency range of 12,600 to 19,800 MHz. Frequency tolerance at 25∞C is -0.5 to 0.5 ppm, and frequency stability is -2.5 to 2.5 ppm over the operating temperature range of -20∞ to 75∞C. Storage t

Aluminum-electrolytic Capacitors

The new EYX snap-in aluminum-electrolytic capacitors were designed for use at high ambient temperatures and with high alternating currents. The capacitors are intended mainly for use in automotive and consumer electronics, as well as in telecommunications, where they are said to withstand temperatures of up to 125∞C and loads of up to 400 V. The capacitors are available in capacitance values from 47 to 33,000 µF with (nominal) voltage ratings of 10 to 400 V. They come in industry stan

Flat-top Inductor

The Model DR332 Dataline Series inductors provide filtering of RFI in a surface mount package that is compatible with automated assembly equipment, high-temperature soldering and immersion cleaning processes. The inductors are said to provide a cost-effective means for filtering RFI in high-speed data transmission lines. These data line chokes filter common-mode interference induced on the data transmission lines at frequencies of 10 kHz and higher while allowing data signals of up to almost 100

Ultra-thin Inductors

This new line of Power Wafer inductors is designed to meet the height restrictions of PC cards and other low-profile applications. The LPO2506 surface mount power inductor series has an above-board height of 1.19 mm and a footprint of 7.87 x 9.14 mm. Custom designs can reduce the height to as low as 0.9 mm, depending on board thickness. An on-board version with an overall height of 1.65 mm is also available. The series can handle currents up to 1.9 A rms. There are 15 inductance values ranging f

EMI Gaskets

GORE-SHIELD SMT gaskets can be installed with standard pick-and-place equipment. The gaskets are said to decrease the total cost of EMI shielding in cell phones and other wireless infrastructure. Rather than a continuous bead, the gaskets are a series of small GS 5200 pads that have a solderable shim attached and are packaged in EIA-standard tape-and-reel format. Using high-speed chipshooting SMT equipment, these pads are placed on the ground trace of the PCB, at typical rates of nine per second


Thin-film Chip Resistors

There are three different chip resistors in this line. The first are the rectangular thin-film chip resistors, designed for high precision with stability and reliability. They are said to be suitable for reflow soldering. Second in the line are ultra-precision thin-film chip resistors, designed to offer minimized aging with low TCR and tolerance values of ±5 ppm per ∞C and ±0.05 percent, respectively. Third in the line are MELF thin-film chip resistors, made of a tantalum alloy.

Extended Temperature VCXOs

Two variations of the K1526 VCXO Series, the K1526 EAMX and the K1526 AQB, are now available. They are identical in most respects to other units in the series, having a four J-lead SOJ-20 industry-standard footprint with frequency performance from 2 to 80 MHz. Both versions provide temperature stability (±13 ppm maximum) over broad industrial temperature ranges. The products were originally developed for a telecommunications company. The primary application for both devices is to provide ph

Electromechanical Supercapacitors

The new BestCap electromechanical supercapacitors are based on an aqueous chemistry known as rechargeable hydrogen ion solid state (RHISS). This technology is said to be ideal for high-power pulsing and is designed for use in hand-held and mobile communications equipment to extend battery life. RHISS reportedly also results in an environmentally friendly nonhazardous material, designed to provide an advantage over other lithium- or nickel-based power sources. The capacitor provides a combination

TCXO Custom Chip

The Model RTVY-174 TCXO is for use in pagers, cell phones, two-way radios, GSM, PDC, and other wireless and telecom systems. It incorporates a custom IC chip and has a footprint of 6 x 3.5 mm. It has a ±2.5 ppm stability over the temperature range of -30∞ to 80∞C as a standard feature. The component is powered by a single 3.0 V supply; current drain is 2 mA maximum. Output voltage is 0.9 Vp-p minimum. It is capable of driving a 10 kW load shunted by 10 pF. The unit is available

TCXO

The CFPT-635 is an ultra-compact TCXO with frequency stability to within ±2.5 ppm over a temperature range from -30∞ to 80∞C. The device package measures 6.0 x 3.5 x 1.7 mm and weighs 115 mg. Its current consumption is less than 2 mA from a 3 V supply, reportedly suitable for mobile telecommunications devices. It is available in ex-stock with output frequencies of 12.8, 13.0, 14.4 and 16.8 MHz. Ageing is specified to within 1 ppm per year, and devices can be trimmed to nominal f

BGA MOSFET

The 30 V PowerTrench MOSFET BGA, FDZ5047N, offers a RDS(ON) of 2.5 mW typical (3.5 mW max), reportedly less than half the RDS(ON) of the industry`s highest performance SO-8 and in a smaller package size at less than 28 mm2. The BGA has a thickness of 0.8 mm. The component reportedly lowers heat dissipation, which boosts the efficiency and power density of DC/DC converters in notebook computers and voltage regulation modules. The device is offered in 5 x 6 mm and 5 x 5.5 mm package versions.

Calibration Software

This product is a new release of the Calibration Manager software. Designed to meet ISO 9000, QS 9000 and other standards, this software combines a database and report writing capabilities to assist users in maintaining the full cycle of calibration management. The latest release, Version 3.0, is said to offer many new features, including electronic-signature tracking, auto-reminder, satellite module, Crystal Reports 7.0, easier to use select/sort capabilities, tag ID system and more.

Placement Conversion

SMS Linecontrol is an industry-approved software package that is tailored for SMT manufacturers seeking stable CAD-conversion software for SMT placement files. It reportedly is designed to enable operators to communicate freely with individual placement machines, minimize programming time and eliminate downloading complexities. The software also is said to offer seamless communication across different brands of equipment and is an integrated, multitasking product.

Solder Wires

The W300, W400 and W500 series of cored, high-purity solder wires include no-clean, water-soluble and rosin-based wires for use in rework and attachment of thermally sensitive components. The W300 Series no-clean wires consist of a blend of rosins designed for user flexibility and a high level of protection against corrosion. The W500 Series water-soluble wires are reportedly designed for a high level of wetting and ease of cleaning. The W400 Series is available with a rosin-based flux core.

Colorless Residue Paste

A no-clean, colorless residue solder paste, DSP 691 reportedly supports print speeds of 1 to 8" per second. It has a 24-hour stencil life, up to 48-hour tack time and 72-hour open time. The paste is said to be 100 percent ICT pin probable and leave clear, minimal post-solder residue. It will reflow with or without nitrogen, and is said to be tested and approved for the DEK ProFlow cassette package.


Static Control

The Minimeg is designed for accurate measurement of surface resistivity and surface-to-ground resistance of work surfaces. The unit is reportedly suitable for spot-checking dissipative and conductive surfaces. It operates on a 9 V battery and measures surface resistivity up to less than 1010 W/square or surface-to-ground resistance up to less than 109 W. Both NIST and non-NIST models are available.

EMI Shielding Gasket

Gore-Shield SMT gaskets are said to be high-performance EMI shielding gaskets that can be installed with standard pick-and-place equipment. The gaskets reportedly decrease the total cost of EMI shielding in cell phones and other wireless infrastructure. They employ a form factor and the company`s GS5200 material, a nickel filled expanded polytetrafluoroethylene that is said to be suitable for wireless applications. Rather than a continuous bead, these gaskets are a series of small pads that have

ESD Simulator

The Model 930D "gun-style" ESD simulator is designed for use in a variety of applications, including electronic, automotive, military and medical. Its design is said to allow for quick change of resistor and capacitor networks, polarity modules, probe tip configuration and firing requirements. Designed for both air and contact discharges, the unit incorporates auto and manual modes and reportedly is adjustable from ±500 to ±26 kV.

Component Protection

Partfolio is a portable kitting system designed to securely store a range of small parts and protect sensitive components against damage from ESD at all stages of production. It is designed as an alternative to the "plastic bags in tote boxes" parts management approach still in common use. Advantages are said to include portability, quick setup and parts migration prevention when closed. Other advantages reportedly include improved quality control, increased productivity and decreased costs. To

ESD-compliant Lighting

The Imagelite Model 20 quartz-halogen fiber optic illuminator is an ESD-compliant product developed to provide shadow-free, glare-free, cold illumination for use in industrial and electronics manufacturing. Designed to meet the increasingly stringent demands of static-sensitive applications such as magneto-resistive head assembly and inspection in the semiconductor industry, the illuminator is also designed to work in virtually all microscopy, industrial and machine vision system applications.

ESD-compliant Bar-code Scanner

The IR-2000 ESD 2D scans 1-D and 2-D symbologies and is available in standard or high-density versions. It is rated and tested to discharge less than 20 V maximum, the average discharge time from 1,000 to less than 20 V does not exceed 15 seconds, and it has a surface resistivity greater than or equal to 105 W2 to less than 107 W2.

Heel Grounder

The MG-7010 series heel grounders are based on the company`s D-ring design. Features of the heel grounders reportedly include: a two-part heel cut with smudge-free interior, tab design ensuring effective contact, elastic relief band, and 1 or 2 MW value resistors.

Dual Continuous Monitor

Model 41137 monitors the ground integrity of two operators and a work surface with an RTT of less than 5 x 108. Red and green LEDs indicate grounding status. It monitors industry standard single-wire wrist straps. Other features include a data output signal, an audio alarm timeout, a mounting bracket, power supply and two remote jacks.

Moisture-barrier Bags

The 3300 Moisture-barrier Bag was reportedly designed to meet the moisture-protection needs of the electronics market. It is said to offer long-term protection from moisture, high-frequency protection and static shielding to protect sensitive electronic components or parts. The bag is constructed of a multilayer 0.0036" film that provides puncture- and tear-resistance. The clean, opaque barrier film reportedly meets the requirements of EIA-583 Class I and contains no amines, amides or N-Octanoic

Aerosol Coating

Staticide ESD is a permanent ESD acrylic coating that can reportedly be applied to most any insulative material or surface. It comes in a 16 oz aerosol spray can containing 12 oz of ESD coating. It is said to use a mixed-metal-oxide semiconductor as the static-dissipative agent in a clear acrylic-polymer coating. It does not contain carbon black, which can slough and leave black marks when rubbed. It also does not contain amines, quaternary ammonium salts or organic acid salt anti-stats. The pro


Static-dissipative Vinyl Upholstery

Microcon white is a static-dissipative vinyl for the company`s chair models. With this vinyl seating upholstery, the chairs are said to offer critical environments (including cleanrooms) static-dissipative protection in three colors: white, blue and black. Average component resistance to the ground is 1.2 x 107 W. The surface resistivity is 5.3 x 106 to 108 W per square surface at 500 V. Reportedly, the decay time from 5,000 V to technical zero is 0.44 seconds.

ESD Protection

New is this 11-member family of electrostatic discharge (ESD) protection devices, also known as transient voltage suppressors, which includes SOT, TSSOP, QSOP and MSOP packages. This family is said to bring three different approaches-low-capacitance diodes, zener diodes and a combination diode/zener-to the market, covering a range of configurations and surface mount packages. The products also reportedly meet and exceed ESD requirements of the International Standard IEC 61000-4-2. They provide p

Scaleable Test Solutions

The GR Versa Automotive Test (AT) is part of a family of scaleable functional test solutions based on the PXI standard. It reportedly is designed to meet the global manufacturing requirements of the automotive industry. The system combines the GPX621 (a 21 slot PXI/CompactPCI chassis) with PXIScan switching architecture that is said to enable virtually any instrument or resource to be routed to any test point on the unit under test (UUT). It also combines the TestStand multi-threaded test engine

14-slot Chassis

Reportedly the only 14-slot PXI chassis available, the PX2000-514 is a 19" rack-mountable unit that complies with the PXI and Compact PCI standards. All slots are said to have full PXI functionality. Separate forced-air cooling is provided for the power supply and PXI slots. Fan noise is said to be minimized by varying fan speed according to system temperature. Optional features include temperature and PSU monitoring, auxiliary I/O and user power supplies.

Burn-in Test Sockets

This family of burn-in test sockets for Direct Rambus (DR) memory devices will enable DRAM manufacturers to test devices that incorporate the memory management architecture developed by Rambus Inc., ensuring that they are fully tested and burned-in. The test sockets provide DR DRAM manufacturers a way to identify functional defects in singulated packages before assembly. They feature an open-top design for ease of use and are designed to accommodate the most popular IC package formats, including

Functional Tester

The Fas-Test in-line functional tester is said to include a buffer before and after the test procedure, a compression weight of up to 1,000 lb during the testing process, fixture change-out of less than three minutes, direct connect to a variety of fixtures, and System Monitor software designed to optimize and monitor production flow. The standard cycle time for each board application is reportedly 6 seconds plus the test time. A bar-code scanner works in conjunction with the test system to ensu

PCB Index Cycle Time Technology

This new technology reportedly allows the company to reduce by more than 50 percent the PCB index cycle time of the TCIL test handler used in the company`s automated in-line systems for ICT and functional testing. The technology makes use of a servo-driven PCB pusher mechanism in the TCIL that is equipped with extend-retract fingers for gripping the board for downstream movement after test completion. At the same time, it introduces the next board on the system`s DC motor-driven conveyor belt in

Recorder

The KIC Recorder is a portable, self-contained thermal recorder with an internal memory for datalogging. The system can be connected to any PC or laptop for real-time profiling. It is designed for use in rework stations, high-temperature furnaces and similar applications in which the electronics cannot or need not be directly exposed to process temperatures. The recorder is said to provide a computerized display, high-capacity data storage and analysis capabilities. It is compatible with the com

Prototype Board/Parallel Port Interface

The PROTOPort parallel port interface is designed for use with the company`s prototype boards, which were designed for testing a user`s application circuits. In addition to the prototype boards, the new interface will work with any of the company`s application boards (such as the eight-channel 8/12 bit A/D or D/A boards, the six-channel counter-timer board or the 48-channel digital I/O board), and can be stacked one on top of the other (mezzanine up to 16 boards per addresses).

Solder Materials

The need for lead-free solders has reached critical mass, leading to global commitment to implementing lead-free solders. This is after a decade of concerted efforts in research in search of lead-free alloys that are suitable for electronics/microelectronics applications. Today, the industry has a menu of choices; however, there are still a wide range of opinions and emotions on the lead-free issue. In this article, the "design rules" and the technology behind lead-free solder development are ex


About the Site

SMT, the magazine for electronics assembly, is the only industry publication whose editorial is devoted exclusively to surface mount assembly of printed circuit boards. This focus allows SMT to cover in depth the technology developments and applications engineers are looking for.

Multi-lane Belt Feeder

Designed to meet the needs of low-volume, high-mix applications, this multi-lane belt feeder for SMDs provides for a large number of components while reportedly using the smallest amount of feeder space possible. The refresh time is said to be less than 0.5 seconds for most components. Any pressure on the components at the pickup point is relieved as soon as the belts stop running. The feeders service various Fuji, Panasonic, Siemens, Universal and Quad placement machine models.

Dual-beam Gantry Placement

A compact and flexible placement machine, the C7d reportedly handles a full range of components at a projected placement rate of 20,000 cph. Features include dual-beam-gantry design with three spindles per head, "fly by" vision centering on every component, 120 8 mm feeder capacity, a 3,000 lb quartz composite base for vibration dampening, linear motors and non-contact linear encoders, and independent servo-controlled theta on each spindle.

Off-line/in-circuit Programming

The BP-6500 machine picks, programs and places devices, reportedly combining the benefits of off-line and in-circuit programming. It is said to reduce cost and simplify SMT production lines by eliminating the need for programming during test. The machine allows programming and testing of almost all device types, as well as programming of different patterns simultaneously. Production line changeovers are said to be completed in minutes.

Fume Extraction/Purification

These filter units extract and purify fumes from hand soldering, wave soldering, reflow soldering and curing, soft-beam soldering, and laser applications. All units reportedly feature low noise levels, filter monitors and various filter options. The company also manufactures exhaust hoods, filter units and downdraft tables for the removal of dross dust during wavesoldering maintenance. Also available are explosion-rated filter units for filtration of flammable gases and a wide range of exhaust a

BGA/CSP Rework System

The Sniper II, an extension of the Sniper Split-vision BGA, CSP and QFP rework system, includes a multiple-profile storage system, said to be necessary for data-logging and automatic loading and storage of rework temperature profiles. Low-temperature convection rework technology is said to be enhanced with 16 multiple-segment profiles on the control system, which can be operated without a computer. Once connected to a Pentium processor, any number of profiles may be created and retrieved.

High-speed Chip Mounter

The MSF-SuperFlex high-speed, multifunctional chip mounter reportedly provides accurate component mounting at speeds up to 0.09 seconds per piece using a two-head, 10-nozzle system. It can handle components from 0603 to 55 mm QFPs, CSPs, BGAs and semiconductor chips.

Manufacturability/Testability Software

By automatically recovering board design data from CAD and BOMs, CIM Automation Software checks manufacturability and testability of the boards. The package then generates surface mount and through-hole placement equipment optimized programs, as well as in-circuit and flying-probe test data. Also generated are X-ray and optical-inspection system programs, paperless repair graphical displays, history and statistics, and shop-floor documentation.

Custom Material-handling Designs

This company recently opened a new, state-of-the-art facility in Lake Barrington, Ill., and also began operations in Europe with an Ireland office. At APEX, they will be demonstrating enhanced and new-generation machines, stressing the ability to provide flexible solutions to customers` material-handling requirements.

No-clean Paste

Easy Profile 256 is a no-clean, air or nitrogen reflowable solder paste designed to exhibit stable wetting behavior over a range of reflow profiles. The key characteristic of the paste is said to be its overall robustness and operator friendliness. It is reportedly suitable for CMs and other electronics assembly companies running low-volume, high-mix product lines requiring tolerance for various oven settings and board sizes.


Vapor-phase Reflow Ovens

This company manufacturers vapor-phase reflow ovens. Applications for such ovens include SMT reflow, lead-free solder reflow, curing, drying, mechanical attachment and plastic package testing. The advantages offered by these ovens reportedly include uniform temperatures; low-oxygen environment; fast, even heat transfer regardless of product size; minimum liquidus times; absolute limits to maximum temperatures; ease of use; short setup times; and high repeatability. In-line, batch and custom oven

Probes for Test Sockets

The Micro Pitch Probe is for device testing of 1 mm pitch and below. It is said to offer excellent electrical properties, long cycle life and reliable contact geometry. The probe features a short signal path of 4.75 mm (0.187"), its self-inductance is reportedly less than 1 nH, and the contact resistance is less than 70 mW.

Test Handler

The J411-03 test handler is designed for flexibility, reportedly allowing manufacturers to test several different products using the same platform. If integrated into the company`s robotic test handlers, PCBs and final products can be automatically loaded into the handler. It is said to be easily configured for various test systems, as well as handshaking with the controlling system using standard RS-232 protocol. The handler is CE-compliant and has a 9.8 x 31.1" footprint.

Solder Paste Inspection

The SE 300 high-speed, high-resolution, 3-D solder paste inspection system is said to be capable of performing 100 percent inspection at production line speeds. It automatically measures height, volume, area and bridging, and notifies the operator if any parameters begin trending outside the user-specified limits. There is a choice of two operating modes: high-speed mode, designed for fine-pitch QFPs and other traditional components, reportedly inspects 4 sq. inches per second; high-resolution m

Electronic Commerce and the Electronics Industry

Hyper-competition has shifted business models across virtually all markets, but perhaps none as dramatically as the electronics industry. A decade ago, product innovation itself was enough to support sustainable competitive advantage. But innovation creates opportunity, which spawns competition, forcing companies to either keep pace or wither on the vine.

High-strength and High-fatigue-resistant Lead-free Solder

Sn/Cu/In/Ga proves to be an interesting solution for high-strength and high-fatigue-resistant electronics applications.

DFM: Is the Industry There Yet?

Because DFM is still a relatively new concept, assemblers, designers and fabricators are often working on a different page when it comes to putting DFM to use.

Following the Money

IPC plans to head to Washington, D.C. for its 8th Annual Capitol Hill Day to garner support for the Printed Circuit Investment Act.

Lead-free Solder Alloy

The TAC 5 solder alloy (95.5Sn/4.0Ag/ 0.5Cu) has been incorporated into pastes, bars, wire and spheres. For surface mount assembly, it can work with existing equipment to produce solder joints with stability said to be equal to or greater than lead-bearing solder joints. In hybrid circuits, the alloy reportedly enhances thermal fatigue resistance. The company`s lead-free line also includes a no-clean flux that reportedly minimizes defects and improves wetting.

Ultrasonic Cleaner

The newest addition to the CYBERCLEAN line, the Series 4000 Model 24U ultrasonic cleaning system, is intended to clean hard-to-remove soils, such as baked-on fluxes from production fixturing, in a batch cleaning format. All systems in the line are PLC controlled, and all operations - cleaning, rinsing and drying - are said to be automatic. This specific model has a standard envelope of 16 × 24 × 20" and is configured to process five 18 × 24" fixtures per cycle. Customized baskets


Modular Chip Mounter

The CM201/202-D modular chip mounters reportedly offer unlimited expansion capabilities, flexibility and high productivity for component placement. Productivity is said to be enhanced with a 208-feeder capacity using double feeders and throughput that reportedly ranges from 13,850 to 27,700 chips per hour. The units handle component sizes from 0201 to 24 mm.

Stencil Inspection Workstation

Designed to increase verification speed and accuracy, ScanSTENCIL is a fully integrated, off-line stencil inspection workstation that combines a Windows-based software package with a high-resolution calibrated flatbed scanner to produce verification files for laser- or chemical-etched stencils. Using its calibrated scanner, the unit inputs stencils or screens and compares them to a known perfect Gerber file for accuracy and blockage.

BOM Software

CheckPoint BOM Manager is designed for processing data at the front end of the PCB assembly process. It imports, parses, analyzes, and archives BOMs and approved vendor lists under electronic revision control. The software reportedly imports customer BOM data from a variety of sources, such as collimated ASCII files, CIM project files, Microsoft Excel spreadsheets and ODBC databases. It operates on Access or SQL Server to provide enterprise-wide PCB information control.

Stopping ESD

Staticide #2500, an electrostatic-dissipative clear coating, combines acrylic polymers with a semiconductor technology to provide permanent static dissipation, reportedly even under zero-humidity conditions. The semi-transparent coating is said to be usable on all nonporous insulated surfaces such as keyboards, computers, mice, oscilloscopes and workstations. In an aerosol spray can, it is suitable for cleanroom use and dries to the touch in minutes. It also meets Federal Standard E209 for zero

Printing and Inspection Machines

The Ultraprint 1500 can be configured with options that address demands of flexbility or performance, or both. It is capable of printing boards up to 22 × 20", and includes standard features such as automatic board-to-stencil alignment, a self-leveling dual- squeegee print head and programmable hard board stops. The Ultraprint 3000 Ultraflex is designed for double-sided products and can reportedly handle fine-pitch and µBGA technologies. It includes synchronized motion control, automat

Selective Soldering and Rework

The LS-100 is designed for selective soldering and rework of all types of components, from µBGAs to large QFPs and odd-shaped and hybrid devices. It is said to be ideal for soldering and desoldering RF shielding and various paste-in-hole and solder-paste-on-through-hole applications. This semiautomatic off-line rework system reportedly prevents overheating and thermal stress of components, the board and adjacent components, while enabling the programming of precise reflow profiles. It also

Thermal Profiling Software

The Navigator is a high-speed enhancement for the company`s Auto-Predict software option. It reportedly identifies the optimal reflow profile for lead-bearing or lead-free solder paste automatically. The software draws on a built-in database to determine the process window automatically, once the solder paste is selected. It is said to function as an expert system, eliminating the need for operator decision-making.

Flip Chip Bonding Service

To complement its turnkey electronics manufacturing, this company introduced a flip chip bonding service, featuring a fully automated Fuji flip chip bonder with a bonding force of up to 50 kg. The system`s high placement accuracy and units per hour are said to create an initial capacity of 200,000 pieces per month with a two-shift, five-day work week operation. This capacity can be expanded to 300,000 pieces per month by adding a third shift and additional equipment. As many flip chip substrates

In-line Functional PCB Tester

The Fas-Test in-line functional tester is designed to handle high-rate production requirements and serve as a quick, efficient PCB tester. Features include a buffer before and after the test procedure, a compression weight of up to 1,000 lb during the testing process, fixture changeout of less than three minutes, direct connect to a variety of fixtures, and a software package designed to optimize and monitor production flow lines. The standard cycle time for each board application is six seconds

Copper-protective Coating

The ENTEK CU-77 copper-protective coating system is an alternative to HASL and other metallic PCB finishes. It is designed for coating single-sided PCBs that require one soldering step (glue cure followed by wave soldering). The material delivers a thin coating (200 to 400 Å) and reportedly provides improved storage and handling capabilities compared to anti-tarnishes. PCBs coated with this are said to have up to a 12-month shelf life. The aqueous-based system is composed of a pre-clean cyc


Depanelization Router

The 105DP is an in-line, fully automated depanelization router for populated PCBs that is said to provide hands-off operation. The system receives a populated PCB panel, places it on the worktable, depanelizes the individual PCB assemblies, then transfers them to standard or customized output conveyor systems. The head can rotate 90° or 180° for off-loading routed circuits, reportedly in any orientation. The system is designed to interface with conveyors and is said to provide a stable

Flip Chip Wafer Bumper

This low-alpha-count flip chip bumping process is for both eutectic (Sn63/Pb37) and high-lead (Sn5/Pb95) solder bumps. The solder is processed with a measured alpha emission rate of 0.01 alphas per hour per cm2, said to be the lowest offered in the industry by a merchant wafer bumping provider. The process reportedly minimizes the potential for "soft errors" in ASIC and other microprocessor ICs with small gate dimensions (0.18 µm and below).

Six-vision System

The CP45FV uses a "six-head, six-vision" system that incorporates an on-the-fly vertical imaging system for component recognition. Using vertical imaging, the system aligns components using features on the bottom of the part without traveling to an optical centering station. This concept reportedly allows the machine to place components at speeds down to 0.19 seconds per placement. Components from 0201 to more than 2" square QFPs with 0.019" pitch, as well as CSPs, can be placed on the same plat

Aqueous Cleaning System

The CBW-218 OmniJet aqueous cleaning system features all stainless-steel (polished) construction, sustained high-solution heat capability, and a high-volume spray bar said to have great GPM concentration per sq. inch to clean even highly dense PCBs. A convection dryer features adjustable blow-off knives that produce high-velocity water-strip action.

Wafer-bump Reflow System

This multi-belt, continuous-conduction, wafer-bump reflow system reportedly provides highly controlled and repeatable reflow profiles. The wafers are heated by conduction from a conveyor belt in the heating zones, with subsequent transfer to an independent cool belt in the cooling zones. Its low-particulate environment reportedly maintains an atmosphere at less than 5 ppm O2.

The Total Cost of Ownership Equation

Automated selective conformal coating systems can increase production throughput and reduce wasted materials, which are factors that need to be considered when determining total cost of ownership.

Global Trends in Assembly Equipment Strategy

With CMs acquiring more and more OEM facilities, there is a plethora of two- to four-year-old equipment on the global market that is available for leasing.

Inspection Methodology

Frankly, I dislike the term inspection because it is a constant reminder that my assembly process still has too much variation. However, until my manufacturing process is capable of consistently producing zero defects, some form of inspection or monitoring is necessary to ensure the desired quality level. Surface mount assembly is a very complex sequence of events with a large number of individual activities. The trick is creating a balanced inspection and monitoring strategy without performing

Conference Breakdown

The APEX conference program is divided into six categories: SMT and Electronics Assembly, Assembly Equipment, Materials, Management & Business Issues, Quality and Process Control, and Advanced Technology. There are 30 sessions and more than 100 presentations, as well as three free keynotes and nine free forums. Highlights include a focus on lead-free alternatives, electronic data interchange (EDI) issues, design vs. manufacturability trade-offs for advanced packages, developments in wafer techno

Tutorials/Workshops

APEX is offering more than 50 tutorials and workshops that will answer questions on SMT and related assembly technology, including advanced component packaging, assembly equipment, materials and processes, and quality assurance and process control.


1999 VISION Awards

For the eighth consecutive year, SMT Magazine rewards 14 worthy companies with its 1999 VISION Awards. This year marks a change in venue for the ceremony, as it takes place at APEX. Awards are presented in the following categories: Adhesives/Coatings/ Encapsulants, Assembly Tools, Cleaning, Components, Contract Services, Dispensing Equipment, Inspection, Pick-and-Place, Printing, Rework & Repair, Software, Soldering Equipment, Soldering Materials, and Testing.

IPC EMS Management Council Meeting

This meeting focuses on trends that critically affect the contract manufacturing (CM) business, including:

IPC SMEMA Management Council Meeting

The inaugural meeting of the IPC SMEMA Management Council promises to make as big a splash as APEX itself. For the first time, presidents, owners and senior officers of companies that supply the electronics assembly industry will work together to solve supply issues.

IPC Standards Development Meetings

One of the reasons APEX exists is to support standards development activities. IPC standards development and committee meetings are among the most important and unique activities taking place at APEX. What could be more important than seeing how decisions are made that affect the specifications customers and suppliers use? What could be more beneficial than having an impact on that process? Connect with the industry leaders who are writing these standards.

Free Forums

Make the most of your time at APEX 2000. All APEX attendees are invited to free forums. These educational sessions offer timely information in a relaxed and open environment. Because there are no written proceedings, panelists are often more candid in their remarks. Hear from expert panelists on a number of critical topics at no charge.

Special Events

Kick-off reception. Enjoy a free reception on the show floor Tuesday, March 14. Meet with colleagues and suppliers to review APEX`s opening day and to make plans to make the most of your time at APEX.

Wall Street Speaks on the CM Industry

A decade ago there was a handful of publicly traded CMs; today there are more than 20 publicly traded CM company stocks. Wall Street`s view and understanding of the CM industry have a profound effect on all companies. This free Wednesday morning keynote features three veteran analysts sharing their views on the dramatic changes occurring in the CM industry: Keith Dunne, managing director, BancBoston Robertson Stephens; Bill Cage, partner, J.C. Bradford and Co.; and David Enzer, managing director

Free Environmental Forums

Lead-free Solders: Implementation Issues. The adoption of lead-free solders by the electronics industry will not be a simple matter. It affects all parts of the supply chain from the component and board manufacturers, to the solder materials and soldering equipment suppliers, to the assemblers and their customers. This panel forum will discuss which technology options are being pursued and their implications. It is also a chance to ask questions of some of the leading experts in the field.

Modular Placement

With its SP2 placement system and three different placement modes, the KE-2030 SMT placement machine is said to offer a high degree of flexibility and speed in a modular machine. The machine reportedly features a placement rate of more than 20,000 components per hour. Two multi-nozzle laser heads with eight nozzles can pick and place components as small as 0201s and as large as 26.5 × 11 mm and 20 mm2. Three placement modes are possible. In parallel placement mode, the machine places up to

Dispensing Equipment

The Continuous-Flow piston pump for encapsulation materials is a high-throughput, positive-displacement pump with a repeatability said to be less than 1 percent. Its multi-piston design continuously feeds material with no recharge time. The Xyflex consists of four independently programmable heads that can reportedly dispense up to 140,000 dots per hour, depending on the application. This surface mount system dispenses solder paste, adhesives and conductive epoxies. The Pulse-Jet non-contact pump


Software/Scanner

PanaPRO/PanaCIM software reportedly provides the unique ability of component-to-panel traceability. In addition to providing complete setup verification, this software/bar-code scanner package records and verifies use of all components and PCBs. Defective parts can reportedly be quickly traced back to the assembler and part number.

Upgraded AOI Systems

The AIMS G5 AOI system has received a new board-handling system that can handle very thin boards and employs full rail-board holding. It is said to employ a custom-engineered telecentric optic for inspection of 0201- and 0.012"-pitch components. The G4 system has been redesigned to improve ergonomics, sustainability and repeatability. Both systems reportedly received a new, patent-pending illumination system.

Real-time X-ray Inspection

The Jewel Box provides real-time X-ray inspection with a high-resolution camera and 10 µm X-ray source for magnification up to 500X. The unit inspects PCBs with µBGAs, flip chips, ICs and other advanced packages. It reportedly allows the imaging of materials, such as aluminum, that conventional high-voltage systems cannot image. The patented X-ray camera technology is said to maintain void-size consistency in relation to solder bond area as voltage increases.

Reworkable Flip Chip Underfills

An epoxy-based liquid underfill, 3567 is compatible with polyimid-passivated flip chip, BGA and CSP assemblies. It is said to be the first commercially available reworkable underfill - it reportedly permits an area-array device to be replaced after testing determines it is defective, minimizing the discarding of entire boards. The epoxy-based liquid cures in five to 15 minutes when exposed to temperatures of 150° to 165°C and penetrates gaps as small as 0.001". Defective flip chip pack

Internet-access Screen Printer

The 265 Infinity screen printer reportedly combines faster handling and printing with documented 2.0 Cpk levels. For high-throughput operation, the printer incorporates patented on-the-fly fiducial capture, a 2Di stencil and post-print inspection package, as well as ProFlow direct imaging. Networking capability supports machine-to-machine file transfer, network integration and remote Internet access, reportedly without interrupting production.

Combination X-ray/Vision Inspection

The XRV is an automated in-line PCB inspection unit that combines visual inspection with the advantages of X-ray. It uses CCD cameras to check for missing or wrong components, misplacement, polarity, and other visually evident defects. The integrated X-ray capability checks for BGA, µBGA, flip chip, J-leads and other hidden solder connections that cannot be seen by the naked eye. A typical PCB with 500 components is said to take less than 30 minutes to program. The system self-learns a PCB

Laser-light Guidance Assembly

The Guidemaster is a complete in-line component-placement system designed to integrate into existing manual assembly lines. Equipped with an in-line motorized conveyor and laser-light guidance system, the assembler is said to provide seamless in-line board flow and facilitate accurate manual part insertion. It comes with a PCB positioning and clamp mechanism to secure the board in a repeatable location, a PC configured with Windows NT, an intuitive operator interface, and a foot switch to trigge

Real-time Failure Analysis

The NXR-20HR real-time failure analysis system features an 8 µ microfocus X-ray source and 300X magnification for verification and inspection of SMT PCBs using BGAs, flip chips, µBGAs and other high-density packages. As a semiautomated system, it is designed to quickly and repeatedly identify hidden defects such as shorted or open solder joints, component misregistration, and voiding or unacceptable size variations in solder bumps. The system uses 5-axis sample manipulation (rotate and

Water-soluble Solder Paste and No-clean Wire Solder

Delta Elite 788 is a halogen-free, water-soluble solder paste with a tack time longer than 12 hours. The formulation is non-hygroscopic (moisture resistant). A low-volatility solvent, the paste reportedly provides long stencil life and high tack force, making it suitable for high-speed component placement. NC-601 no-clean wire solder is said to promote excellent activity and wetting, leaving virtually no post-soldering residue. Bellcore compliant, it comes in all standard diameters and at 1.1 pe

Component Placement Systems

There are seven models in the Meridian Series of SMT placement systems. All are said to offer high quality and productivity, low setup and operating costs, and effective line optimization and operation monitoring tools. The machines have a maximum placement rate of more than 28,000 cph, and can place chip and IC components. A Windows NT operating environment is used, and the machines feature a three-stage, soft-stop conveyor. They also reportedly meet the IPC-9850 standard.


Mini Fume Extractor

The Miniarm FX-32 has a reach of more than 3 ft, and consists of flexible, self-articulating plastic tube with a built-in damper and swivel function. It can be mounted to a wall, ceiling or directly to the workbench. The extractor is available in three models: standard gray for soldering smoke or small chemical and fume extraction; black for the ESD requirements of the electronics industry; and the gray Hygienic Arm for applications where there are high demands for cleanliness. The latter is pro

Vertical Reflow Oven

TOWER is said to be the first vertical reflow oven capable of high-volume PCB production. It is capable of performing eight unique board profiles simultaneously, meaning multiple pick-and-place lines can be fed into a single unit for box-build assembly. Typical applications include reflow, curing, and other thermal processes associated with conveyorized reflow ovens. The oven reportedly delivers the board-production throughput of 20` ovens in 7` of linear floor space.

Reflow Oven

The 1800EXL-SS oven is said to optimize reflow for boards with lead-bearing or lead-free solder paste. It is ISO 14000 certified for minimal environmental impact. The oven incorporates nine heating zones and two internal cooling zones within a 150" length, with throughput reportedly identical to conventional 183" ovens. An air-flux separation system is said to maintain the internal cleanliness of the oven chamber, extend maintenance intervals and minimize maintenance downtime.

The 10 Most Dreaded Questions For CMs

Electronics outsourcing continues to grow at about 25 percent per year; this trend is expected to continue into the foreseeable future. Traditional manufacturers recognize the prohibitive costs of electronics technology, capital and other resources. Many have set strategies in place to allow their companies to focus on particular core competencies, such as engineering or marketing, vs. hands-on manufacturing. They have recognized that this function can be best served by an outsourcing partnershi

Flexible Test Strategy Improves Efficiency

In the contract manufacturing sector, a pay-per-use test strategy is a proven testing solution for generating high-quality manufacturing services at low cost.

Flextronics Continues to Acquire

ROCHESTER, N.H. and SAN JOSE, Calif. - Cabletron Systems and Flextronics International announced they have entered into a definitive agreement in which Cabletron will divest manufacturing and repair services operations in Rochester, N.H. and Limerick, Ireland, to Flextronics. Under terms of the agreement, Flextronics will acquire manufacturing-related assets and inventories, and will also hire Cabletron`s worldwide manufacturing workforce of approximately 1,000.

Celestica Expands Relationship with IBM

TORONTO and ARMONK, N.Y. - Celestica Inc. entered into an agreement to significantly expand its existing relationship with IBM, specifically the Enterprise Systems Group and Microelectronics Div. The agreement provides for the sale and transfer of operations and assets in Rochester, Minn., and Vimercate and Santa Palomba, Italy.

Dii Expands to Switzerland

NIWOT, Colo. - The Dii Group Inc. and Ascom Business Systems AG signed a memorandum of understanding in which Dovatron International, a wholly owned subsidiary of the Dii Group, will purchase Ascom`s manufacturing facility and related assets in Solothurn, Switzerland. The 400,000 sq. ft. Solothurn plant employs approximately 550 people and is responsible for the production of private branch exchanges (PBX) equipment and phone terminals, including DECT, ISDN and GSM satellite telephones. A long-t

CM Agreement Reached

SAN JOSE, Calif. - Sanmina Corp. and Harris Corp. signed a three-year strategic manufacturing agreement. Under its terms, Harris will outsource its commercial PCB assembly manufacturing to Sanmina. In addition, Sanmina is acquiring Harris` PCB assembly manufacturing assets and inventory and will lease the company`s ISO 9002-certified, state-of-the-art manufacturing facility in San Antonio.

Florida Facility Acquired

HAUPPAUGE, N.Y. - Boundless Manufacturing Services Inc. (BMS) acquired Boca Research Inc.`s 70,000 sq. ft. manufacturing facility in Boca Raton, Fla. BMS will assume manufacturing services, leasing and other support services, and also plans to staff the facility from Boca Research`s current team of manufacturing and supply chain associates.


CM Team to Serve Northeastern U.S.

MILFORD, N.H. - Citronics Corp., a New Hampshire-based CM, linked its resources with Sparton Corp. to develop joint business opportunities for Northeastern United States and international markets. With the addition of Citronics as its sixth alliance partner, Sparton is expanding its regional market coverage to 15 facilities throughout North America and Europe.

Two Sypris Subsidiaries Active in the Market

LOUISVILLE, Ky. - Sypris Solutions Inc. announced that its subsidiary, Group Technologies Inc., signed a subcontract with Raytheon Command Control & Communications Segment for the production of circuit card assemblies valued at $7.0 million. Initial funding of $4.7 million has been issued to begin the first year of this potentially multi-year program. Raytheon will use the delivered assemblies in support of the Navy`s cooperative engagement capabilities.

Canadian CM Expands Facilities

EDMONTON, Alberta, Canada - Mitronix Inc. announced the completion of the most recent expansion of the company`s facilities. Reportedly done because of a large increase in customer orders in 1999, the company expanded its facility to 13,000 sq. ft. and acquired additional assembly machines.

Resource-constrained CM Acquired

NORWALK, Ohio - EPIC Technologies Inc. was acquired by TMW Enterprises and Crawford-Greene LLC. EPIC will join an affiliate network of regional CMs, with approximately 900 employees in the United States and Europe and targeted sales in the $130 million range for 1999.

Solectron Is in the Zhone

MILPITAS, Calif. - Zhone Technologies Inc. and Solectron Corp. announced the signing of a letter of intent for Solectron to become Zhone`s virtual supply-chain partner. The proposed transaction is designed to allow Zhone to focus resources on the design and development of new products by having Solectron provide product life cycle and supply chain management.

Express Manufacturing Inc., Santa Ana, Calif., installed CR Technologys CRX-2000 automated X-ray inspection system to inspect BGAs and microBGAs on PCBs.

Express Manufacturing Inc., Santa Ana, Calif., installed CR Technology`s CRX-2000 automated X-ray inspection system to inspect BGAs and microBGAs on PCBs. The system will reportedly increase time-to-market requirements of the company`s customers by enhancing its inspection capabilities for higher end packaging techniques.

Flux and Cleaning

The selection of flux and cleaning processes plays a critical role in the manufacturing yield and product reliability of electronic assemblies. The subjects of flux and cleaning are interrelated - one cannot be discussed without the other. The function of flux is to remove oxides and other nonmetallic impurities from the soldering surface and prepare a clean surface for joining. After soldering, cleaning may be required to remove flux residues.

BGA Reballing

When working with ball grid arrays (BGA), two of the most commonly asked questions are, "Can I reuse components?" and "How do I reball the components?" While these are obviously relevant concerns, there are very few companies that are currently reballing. The following areas should be considered before starting.

NCMS Lead-free Solder Project

This article summarizes the results, conclusions and recommendations of a four-year-long study of alternative solder materials.

How to Profile a PCB

An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.


SMT Material Handling Support Systems

Modular storage and transport equipment can maximize production line efficiency and provide flexibility to support future work-flow changes.

Optimizing Performance in Reflow Soldering

A new method of managing process gases in reflow ovens offers precise control over the thermal process, effective removal of flux and good solder joint quality.

Preventive Maintenance for ATE Fixtures

This article describes one company`s technique performed as preventive probe maintenance (e.g., replacement of degraded probes) of HP3070 automated test equipment (ATE) fixtures. The general concept can be applied to other ATE systems/fixtures, as well.

APEX 2000

The IPC SMEMA Council`s Electronics Assembly Process Exhibition and Conference (APEX), taking place March 12 to 16, 2000, in Long Beach, Calif., was organized in response to an industry need for a trade show that is cost-effective and fair for exhibitors, and highly focused on the products and technology of the electronics assembly industry. APEX will feature all segments of the industry, from bare boards to tested assemblies, and is said to be the only show in North America that will showcase m

Contest Winners

The IPC recently announced the first six winners of its APEX Trivia Challenge, a contest run through the APEX Web site, www.apex2000.org. The winners were the first to correctly answer three questions pertaining to IPC and the electronics manufacturing services industry. Each received a Palm V Connected Organizer.

Tutorials

Sixteen day-long tutorial sessions are planned to address the spectrum of electronics assembly, from the basics of SMT to advanced packaging materials. They will be held March 12 from 8:30 a.m. to 4:00 p.m.

Paper Awards

Two technical paper awards will be given at APEX. One award will be given to the author(s) of the best overall paper at the conference, while the second will be awarded

Lead-free

The push toward lead-free electronics assemblies is a main focus of APEX. At the center of the IPC`s efforts to educate the industry about the lead-free issue is the development of the IPC Roadmap for Lead-free Electronics Assemblies. Begun at IPCWorks, the roadmap provides guidelines for implementing lead-free soldering processes. Industry representatives will have an opportunity to provide input during APEX at a roadmap meeting taking place March 16.

Workshops

Of the more than 50 workshops and tutorials taking place at APEX, nearly 25 are being offered by the IPC for the first time. Every aspect of electronics assembly processes is to be covered by these workshops. "Given its importance in the industry, process control measures and quality assurance are two topics highly represented in this program," said IPC vice president of professional development John Riley.

Telecom Technology Challenges Manufacturers

The intense growth of high-tech industries such as telecommunications has forced many equipment manufacturers to rethink their business strategies to meet the increased demands placed upon them by rapidly changing technology.


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