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Conference

The NEPCON West conference offerings are separated into several types of classes: Tutorials, Professional Advancement Courses, Workshops and Technical Sessions.

Y2K Assembly Line

The Y2K assembly line is designed to allow attendees to witness a component attachment process at very low temperatures using a solder alternative. The line features bottomside in-line placement of bar-code labels, as well as the deposition of a solder alternative for the mechanical attachment of quad flat packs (QFP), BGAs, a flip chip and standard surface mount devices (SMD). The devices are cemented in place with a low-temperature heating process, and the flip chip device is underfilled with

Lead-free HDI Assembly Line

The evaluation and use of lead-free process materials has gained a lot of interest throughout the industry because of legislation that would ban lead use in the electronics industry. The lead-free HDI assembly line demonstrates the attachment of SMDs, BGAs, QFPs, and CSPs using a lead-free solder, lead-free component metallizations and a lead-free PCB pad finish for the top- and bottomside attachment processes.

PCMCIA Assembly Line

The PCMCIA line highlights the assembly of a high-volume consumer electronics product that incorporates many high-technology facets, including advanced design techniques, a variety of high- pin-count component packages and die, along with cutting edge PCB fabrication technology. The assembly equipment is outfitted for processing the thin laminate that is typically used in PCMCIA panels.

Lead-free PBGA Assembly Line

The PBGA line features the full population and assembly of a BGA lead-frame strip containing the circuitry and bonding pads for four PBGA devices. The die-attach process demonstrates the population of a laminate strip containing four PBGA packages containing gold bonding pads for gold-to-gold interconnect COB wire-bond die and the BGA package. The wire bondable die is attached with a silver-filled adhesive, followed by thermal cure, plasma clean and die wire bonding to the pad sites for each dev

Area-array Assembly Line

The Area-array line features the assembly processes, materials and methods necessary for forming CSPs. The die-attach process shows the population of an organic strip containing multiple package interconnects with chip-on-board (COB) wire-bond die for the formation of CSPs. Processes featured include dispensing die attach and subsequent device placement with a single machine, curing the die-attach adhesive, plasma cleaning the wire-bond pad sites, ball-wedge gold capillary wire-bonding, dispensi

Low-volume Batch Assembly Line

The low-volume batch line demonstrates the processing of flip chips, CSPs and PBGAs in a low-volume production line using low-volume production and prototyping equipment.

Contract Manufacturing Demonstration Line

Located in the Contract Manufacturing Demonstration Area in Hall C, the Contract Manufacturing Demonstration Line is a complete SMT line that produces live products for one of the participating contract manufacturer`s customers.

Pick-and-place Evaluation Center

The Pick-and-place Evaluation Center, located in Hall B, provides a strategic approach to evaluating assembly pick-and-place equipment. Four high-speed placement machines are on display, set up side-by-side, with third-party technical experts providing in-use feedback and interpretation of manufacturers` published machine specifications.

Keynote Addresses

Tuesday, February 29, at 8:00 a.m., John Madden, sportscaster/analyst, author and football coach, will kickoff NEPCON West 2000 with a keynote speech.


Packaging Session

The packaging session, Component Packaging for the 21st Century, will be held Tuesday, February 29, from 1:00 to 3:00 p.m. Packaging experts address the issues PCB assemblers need to understand to build the next generation of electronics products, including the impact of area-array packaging on the assembly floor, thermal management concerns, the effects of lead-free solder on component packages, and more.

Contract Manufacturing Senior Executive Forum

Presented by Technology Forecasters Inc. on Monday, February 28, from 7:30 a.m. to 7:00 p.m., this forum will be chaired by Pamela Gordon, certified management consultant and president of Technology Forecasters Inc.

Advanced Packaging Symposium

Held on Monday, February 28, from 9:00 a.m. to 4:00 p.m. and chaired by John Lau, Express Packaging Systems, the symposium will address wafer-level packaging and interconnection.

Contract Manufacturing Symposium

Presented by Sharon Mecum and Dr. Charles Mullen of Technology Forecasters Inc., "The Contract Manufacturing Game: Skills, Tools, and Insights for OEMs and Contract Electronics Manufacturers," will be held Tuesday, February 29, from 8:30 a.m. to 2:30 p.m.

ESD 101: Protecting Parts and Profits

Walk across the carpet, reach for the doorknob and a spark is created. That phenomenon is known as electrostatic discharge (ESD). An amount of static far below a human`s level of feeling can kill many of today`s sensitive electronic parts. It is crucial that anyone who handles electronic parts and assemblies has a serious awareness of these potential problems, and is taught proper techniques to avoid costly losses of hardware and reputation. ESD training is guaranteed to give a high return on in

Distribution Supply Chain Management

Suppliers continue to forge strong links in the value chain by adding new functions and processes. Many of these companies believe that their efforts at efficiency have tapped all the distribution value that the supply chain has to offer. They could not be further from the truth.

New Player in CM Market

NORMAN, Okla. - Hitachi Computer Products (America) Inc. announced it has established a contract manufacturing group to fabricate electronic components for small- to mid-range businesses. The Hitachi OMD CM group will operate in the company`s state-of-the-art production facility in Norman, Okla.

CMs Continue Strong Growth in 1999

NORTHBROOK, Ill. - The U.S. contract manufacturing (CM) market increased 21.5 percent in 1999, to $27.4 billion, according to a report from the IPC - Association Connecting Electronics Industries. The report included 66 companies with combined sales of $11.3 billion - 41 percent of the total estimated CM market. Computers and communications continue to be the largest markets for CMs, accounting for 53.4 and 26.8 percent of total 1999 sales, respectively.

CM Entrepreneur Wins Award

NEW YORK - Allen J. Berning, founder of Rochester, Minn.-based PEMSTAR Inc., was named the 1999 National Ernst & Young Entrepreneur of the Year in the Emerging Entrepreneur category. In five years, PEMSTAR has grown from a startup, into a $165 million company focused on high-precision electromechanical engineering and contract manufacturing, with facilities in six countries.

Flash Named to Prestigious List

FREMONT, Calif. - Flash Electronics Inc. was named to the IWGC 25 List for 1999. To be eligible for the list, which honors the 25 most successful small manufacturing firms in the United States, companies must have fewer than 500 employees, been in business for at least three years, be independent and have headquarters in the United States.


Four OEMs Choose Siemens

JOHNSON CITY, Tenn. - Omnipoint Corp., Panja, Wegener Communications Inc. and Woodward Automotive Products selected the Electronics Manufacturing Center (EMC) of Siemens Energy & Automation Inc. to provide printed circuit board assemblies (PCBA) and associated services. For Omnipoint, the EMC will provide PCBAs on a turnkey basis for the company`s Redhawk and Eagle wireless data modules. As part of the agreement, Siemens will also build, test and ship final product to Omnipoint`s worldwide custo

Personnel Moves at Manufacturers Services

CONCORD, Mass. - Manufacturers` Services Ltd. announced three personnel moves. Eugene Bullis was named CFO and executive vice president; Manuel Ruiz is now vice president of program management; and John MacInnes was appointed vice president and treasurer.

Solectron Forms Alliance, Acquires Canadian Repair Facility

MILPITAS, Calif. - Solectron Corp. has made a number of announcements in recent months. First, the company signed a definitive agreement with Acer Inc. to form a strategic alliance to provide global design, manufacturing and service solutions for OEM-branded PCs, servers and workstations. As a result of the alliance, customers will be able to access the extensive technology, motherboard and system-level design services, as well as global supply-base, manufacturing, distribution, logistics and Gl

Calibration Services Acquired

LOUISVILLE, Ky. - Sypris Solutions Inc. announced that its subsidiary, Bell Technologies Inc., signed a contract to purchase the Calibration and Repair Service business of Lucent Technologies. This purchase, expected to close by the end of last year, will combine the mobile calibration service operations of Lucent with the calibration and repair operations of Bell. The Lucent organization services its customers from field offices in Union, N.J., and Franklin, Tenn., as well as from 15 mobile cal

Flextronics Expands Hungarian Facility

SAN JOSE, Calif. - Flextronics International Ltd. is expanding its European manufacturing facilities in Tab, Hungary. This state-of-the-art facility is expanding to support the company`s growing customer base in Central and Eastern Europe, as well as to meet the needs of current customers.

Change the Solder Alloys and Laminate

The Scottish government has announced plans to invest $66.6 million toward creating a unique semiconductor business cluster that would make Silicon Glen a worldwide technology hotspot.

Investment in AOI Pays Off

An AOI machine with color highlight and zoom capability helped one CM improve its yield for critical-use end customers.

Growth Must Be Managed

SAN ANTONIO - The prodigious growth in the contract manufacturing industry has led to stability difficulties for CMs. According to a recent report from Frost & Sullivan, managing growth is essential for CMs to maintain control of operations.

Do Mergers and Acquisitions Make Everyone Happy?

ALAMEDA, Calif. - More than 100 mergers, acquisitions and strategic alliances between CMs and other companies were concluded during 1999, according to a new report from Technology Forecasters Inc.

Flip Chip is Production-ready

AUSTIN, Texas - XeTel Corp. announced that it has achieved production-ready status for board assemblies using 0.4 mm-pitch flip chip packages. Flip chip technology will reportedly enable smaller, thinner, and lighter products in the communications, computer and other electronics industries.


Two Facilities Acquired

ANDOVER, Mass. and PORTLAND, Ore. - Celestica Inc. completed its acquisition of Hewlett-Packard (HP) Co.`s surface mount center in Andover, Mass. The acquisition expands Celestica`s service offerings and brings its New England presence to more than 700 employees. The Andover operation will provide additional PCB assembly capabilities to the company`s service offerings in the Northeast United States, which currently includes systems integration, embedded systems design, logistics management and m

Largest Combination in the Industry Announced

SAN JOSE, Calif. and NIWOT, Colo. - Flextronics International Ltd. and the Dii Group Inc., which had combined sales of more than $3.8 billion in the last 12 months, signed a definitive merger agreement for a tax-free, stock-for-stock merger. The combined company will operate under the Flextronics International name, and will reportedly be the fourth largest provider of electronics manufacturing services, with strengths in telecommunications, consumer electronics, printed circuit board (PCB) fabr

Rick Rowe was appointed chief executive officer of MCMS Inc., Nampa, Idaho.

Rick Rowe was appointed chief executive officer of MCMS Inc., Nampa, Idaho. Prior to joining the company, Rowe was general manager of Honeywell-Measurex global system business, headquartered in Cupertino, Calif., with operations in Ireland, Germany, Finland, Japan, Asia-Pacific and Latin America, along with six North American operations.

Lead-free Solder

Tin/lead solder is the most commonly used solder for electronics assembly. How-ever, in the last year, there has been an industry-wide push to convert to lead-free solders. The reason behind the push is the increased awareness concerning lead use and its adverse effects on human health.

IRC Commits to MIL-Spec Market

Resistor manufacturer, IRC, has strengthened its commitment to the military market by ensuring that its lines of resistive products are qualified for military specification (MIL-Spec). Specializing in products for rugged and demanding applications, IRC offers one of the largest lines of military-approved electronic components for military, radar and aerospace.

First-pass Success Soars with New Design Method

Touting successful first-pass functional silicon rates of 90 percent and higher, American Microsystems Inc. introduced its MS-Master design methodology for submicron mixed-signal ASICs. The methodology is enabled by behavioral models that are generated from SPICE simulations and verified to produce working silicon on the first pass, drastically shortening design simulation time and helping customers get products to market faster.

2-D PSDs

The S5990-01 and S5991-01 surface mount 2-D position-sensitive detectors (PSD) reportedly provide detection over a large active area. Their pin-cushion-type detectors are said to be ideal for use in pointing devices such as computer mice and track balls, as well as for position measurement. Active area is 4 x 4 mm for the S5990-01 and 9 x 9 mm for the S5991-01. Position detection errors are reportedly held to ±70 µm for the former and ±150 µm for the latter.

Synchronous FETKY

Designated the IRF7807D1 and IRF7807D2, these low-voltage 30 V FETKYs are said to enable circuit designers to reduce the required footprint of the synchronous MOSFET solution, thereby increasing power density while providing the same efficiency and performance of an equivalent discrete solution. The D1 is in an SO-8 package and reportedly provides RDS(on) of 17 mΩ typical at Vgs = 4.5 V for on-state conditions. The D2 offers the same on-state performance, but integrates a 3 A-rated Schottky

N-channel HDMOS

This family of MOSFETs reportedly offers a combination of low on-resistance and low gate charge, and is said to provide optimum performance and high efficiency for switching applications such as DC/DC conversion. The HDMOS range includes eight N-channel devices. With drain source voltages up to 30 V, they are suited for low-voltage switching applications. On-resistance ranges from 40 up to 180 mΩ maximum. On-state losses are minimized, and they are said to improve efficiency in low-frequenc

Audible Signal Devices

The Mallory Sonalert II surface mount audible signals are said to have extremely small dimensions and reportedly are ideal for compact electronic products and systems such as pagers, portable telephones, scanners, computers and computer peripherals, hand-held instruments, and radar detectors. All offer high sound pressure levels (SPL) for such small units. The family consists of eight different models. Two include built-in drive circuitry, and the remaining six are transducer-only units intended


Miniature DC/DC Converters

The NMV series of single- and dual-output 1 W DC/DC converters will reportedly save PCB space, reduce component count, and minimize switching noise in new and existing industrial distributed power architectures. The converters offer board-mounted footprints as low as 1.17 cm2 and are said to allow designers to achieve significant PCB space savings by delivering full-specification performance from -40° to 85°C without a heat sink.

Tuning Fork Crystals

The TMX-11 SMD tuning fork crystals can be used for wireless telephone handset, watch/clock, audio/video and home appliance applications. The device`s dimensions are 7.3 x 4.1 x 2.0 mm - said to be ideal for applications that require a small footprint and the need to be surface mountable. It is available in the standard tuning fork frequency of 32.768 kHz and offers a ±20 ppm tolerance, a temperature range of -40° to 85°C, and a thermoplastic package that is heat resistant for ref

High-frequency Fundamental Crystals

These high-frequency fundamental (HFF) thickness shear-mode AT quartz crystal resonators have a frequency range of 200 MHz. The CC1F (ceramic lid) crystal series reportedly is designed for the latest in high-speed communication systems that require high-frequency references, such as fiber optic telecommunications, gigabit Ethernet, 10Base-T and frame relay applications. Low power dissipation, stability over temperature range, high shock and vibration resistance, and a large pulling range are rep

Programmable Plastic SMD Oscillator

Housed in a 9.8 x 14.0 x 4.7 mm plastic surface mount J-lead package, the EP1400SJ and EP1500SJ feature custom or standard frequencies ranging from 1 to 125 MHz. Options include tri-state or power-down functions, ±50 or ±100 ppm frequency stability, and CMOS or TTL output. The former is a 5.0 V device, and the latter offers 3.3 V for low-voltage applications. The series is also available in a 14 or 8-pin hermetically sealed package and a ceramic SMD package.

Switching Regulator Ics

The S-8321, S-8322, S-8323, S-8324, S-8327 and S-8328 Series CMOS switching regulator ICs measure 2.8 x 2.9 x 1.3 mm in SOT-23 packaging. They have an internal oscillation frequency of 30 to 100 kHz, with a high oscillation frequency of 250 kHz available. The regulators are available with an internal or external switching transistor with either pulse frequency modulation (PFM), pulse width modulation (PWM), or both PFM and PWM controls.

Silicon Chip

The QRC 1284X2 chip is said to be the single-chip solution to IEEE 1284 parallel-port line filtering and termination. The 28-pin QSOP package uses thin film (tantalum nitride) on silicon technology. In each chip, there are reportedly 17 capacitors, 17 pull-up resistors and nine termination resistors; for each of the 17 signal lines, a diode structure provides 8 kV of ESD protection.

Surface Mount Oscillators

Designed for applications requiring extremely small size, the S3883-32.768 kHz series surface mount oscillator is only 2 mm in height. This single device is said to replace up to four common but hard-to-match devices used by most companies building their own 32.768 kHz oscillator out of separate components. Available for 5.0 V operation with power consumption of 10 µA typical, 3.3 V operation with power consumption of 8 µA typical, and 2.7 V operation with power consumption of 7 µ

J-lead Terminal Configuration

This J-lead terminal configuration has been added to the Series 219 surface mount SPST DIP switch line. Ongoing miniaturization of electronic equipment and associated internal PCBs have necessitated that manufacturers further miniaturize components used on PCBs to allow for compact placement. Unlike conventional gull-wing surface mount terminal configurations, where the terminals extend away from the body of the DIP switch, the J-lead construction forms the terminal alongside and under the produ

Compact TCXOs

The CFPT-120 series of compact surface mount TCXOs offers frequency stability down to ±2 ppm over an operating temperature range from -10° to 60°C. Housed in a 10-pad package measuring 7.0 x 5.0 x 2.0 mm, the series is aimed at both high- and low-volume applications in the mobile communications industry. It is available in a range of frequencies between 12.6 and 19.8 MHz. For error correction in the incoming signal, a voltage control facility allows the end user to trim the freque

Tantalum Chip Capacitors

The TCM Series of molded chip tantalum capacitors are designed for use in thick-film hybrid circuits. They are also reportedly suitable for direct mounting on PCBs. These chip capacitors are said to offer good resistance to mechanical stress and moisture because of their fully molded construction. The TCR Series offers resistance against rush current. These capacitors are reported to have failure rates of 0.5 percent or less per 1,000 hours, even in low-impedance circuits. Capacitance can be as


Integrated Circuit

This CMOS IC is included in a series of VCXOs and TCXOs. The 2GIC features CMOS and TTL-compatible output waveforms, frequency capability ranging up to 100 MHz, integrated Automatic Gain Control (AGC) ensuring oscillator startup through many conditions, and an available supply of both 3.3 or 5.0 V.

Modular Connector System

The COMPODRE System consists of a shroud with internal pods that accept any combination of Mini-Fit and Micro-Fit connectors. The connector is designed to save space by consolidating multiple connector requirements into one package and is said to be a cost-effective way to customize interconnects. Its modular design reportedly requires no tools for assembly. The latch system on the shroud produces an audible click to indicate proper connection and also helps prevent accidental unmating and subse

Publishers Executive Council Interview

SMT Magazine`s Publisher`s Executive Council consists of 38 electronic industry executives hand-picked by group publisher Marsha Robertson. They share their expertise and insights with our editorial staff and act

CM Capabilities

GET Manufacturing offers: full-systems turnkey manufacturing through box build (PCBA-level through system build, integration, test and pack-out); low- to medium-volume short runs, engineering builds and prototypes; concurrent engineering of new OEM products using DFM, DFT and DRC; PTH and SMT (sub-0.4 mm pitch, 0402 packages, BGA/microBGA assembly, repair and failure analysis); IPC-610 certified personnel; product fulfillment and OEM worldwide sales order distribution; product repair and refurbi

Prototype Stress Screening

Screening Systems manufactures a wide range of environmental stress screening (ESS) products for highly accelerated life test (HALT) and highly accelerated stress screening (HASS) applications. The company offers HALT and HASS testing services on prototypes and early pro- duction units to empirically determine the products` operational limits. These services are said to be particularly valuable when a developer desires rapid results on a prototype.

Small Prototypes to Mass Needs

Committed to serving and supporting companies with small prototype runs to mass production needs, Surface Mount Assemblies LLC offers: PCB assembly; through-hole; mixed-technology; test and burn-in; conformal coating/potting; turnkey capability; redesign of through-hole to surface mount or mixed-technology; wave solder; subassemblies; and quick-turn service. Engineering capabilities include design to specifications, product reengineering and board layout. In-circuit and functional testing are su

Laser

This 100 W, diode-pumped, Q-switched laser is called Scimitar. It is suitable for micromachining, semiconductor processing, welding, drilling, surface modification, cutting, trimming, soldering, texturing, percussion drilling, ablating/cladding, scintering, marking, engraving, rapid prototyping and laser forming. Standard units are available operating in CW mode or equipped with acousto-optic Q-switches providing operation from 1 to 50 kHz.

Electronic Label

The iButton is an electronic label with a memory chip. It is similar to a bar code because it has a unique (never-duplicated) 64-bit serial number that can be used for tracking purposes. Data can be written into the product and stored with the object on which it is attached. It allows the data (up to 8 KB) to be changed with just a touch. This product is suitable for applications where the data is required locally and changes relatively frequently, such as when tracking vehicles, trailers, shipp

Printer Applicators

Designed for the challenges presented by small product-identification requirements, chipboard cartons, small packages and similar applications, ValuePro 3240 is said to offer print and apply capability for labels as small as 0.5 x 0.5" (12.5 x 12.5 mm), with speeds up to 30 labels per minute. Its plug-and-play approach to automation reportedly allows installation on the line or use as a stand-alone system. When installed on-line, startup occurs by plugging in a photo eye to the external port or

Engraving System

The Viper 1810 engraving system features pre-loaded lead screws and ball slides for machine tool-like performance and rigidity said to be suitable for any industrial envi- ronment. The system comes with a high-speed spindle along with a diamond-drag tool used for fine-line markings on coated or raw surfaces. The control system works in a Windows 98 environment and can import directly from more than 20 different file formats.


Optimized BGA Inspection

The BGA II inspection package is an optimized version of the company`s machine vision hardware and software package for inspecting BGAs for missing, misplaced or improperly formed solder bumps. It reportedly combines the accuracy and reliability of the company`s original inspection package with MMX-accelerated inspection capability. The system is said to be able to inspect up to 10,000 solder bumps per second and offer support for large-format, high-resolution cameras. It also offers new softwar

NEPCON West 2000 will be held February 29 through March 2, with conferences running from February 27 through March 2, 2000, at the Anaheim Convention Center, Anaheim, Calif.

NEPCON West 2000 will be held February 29 through March 2, with conferences running from February 27 through March 2, 2000, at the Anaheim Convention Center, Anaheim, Calif. Scheduled features include a lead-free Technology Advancement Center (TAC) line and Contract Manufacturing Demonstration Line, pick-and-place evaluation center, a broadened technical conference, special industry events and the latest equipment. The show will host more than 700 exhibiting companies, representing electronics d

TAC

This year`s TAC, organized by RRA Technical Services Inc., will include five newly designed and developed assembly lines showing state-of-the-art assembly technology. New processes that will be demonstrated in TAC 2000 include a lead-free operation and another line that uses a solder paste alternative process.

Pick-and-place Evaluation Center

A strategic approach to evaluating assembly pick-and-place equipment will be unveiled at the new Pick-and-place Evaluation Center. In the 2,000 sq. ft. facility, visitors can evaluate pick-and-place equipment from some of the industry`s major manufacturers. Four high-speed placement machines will be on display, set up side-by-side, with third-party tech- nical experts providing in-use feedback and interpretation of manufacturers` published machine specifications. The physical demonstration of th

Conference

The conference kicks off February 27 and includes more than 100 sessions in the following tracks: design, assembly, HDI, inspection, management, packaging, test and contract manufacturing. The conference also features sessions on lead-free solder, including: Lead-free Soldering Options; Lead-free Soldering: Status and Technology Review; and Impact of Lead-free Solder on Global Manufacturing.

Special Events and Technology Feature Areas

Numerous special events, many of which are free to attendees, include: the opening day keynote speech by John Madden, football legend and broadcaster; Industry Keynote Address given by Dr. Buzz Aldrin, Astronaut; Contract Manufacturing Symposium; Contract Manufacturing Executive Forum; Advanced Packaging Symposium; International Panel Discussion, "Technology and Processes - What Does the Future Hold for the Industry?"; Excellence Awards; Best In Test Awards; Service Excellence Awards; and ASTE T

Product Launches

In its 35-year history, NEPCON West has been the launching pad for many new electronics manufacturing products and technologies, and this year, organizers expect more exhibitor product launches at this show than in any show in the event`s history.

Odd-form Assembly

With increasing demands placed on component structure, finding methods to improve automated odd-form component placement is paramount.

Reflow Oven Flexibility

A flexible reflow oven is required to accommodate multiple SMT manufacturing processes, functions and applications. Manufacturers using high-performance reflow ovens achieve increased productivity, throughput and profits via decreased production downtime.

The Complexity Factor

Traditional test strategies can no longer meet the demands of newer, more complex board design; looking at the test/inspection process from a new perspective may help address these issues.


Adhesive Deposition

When choosing whether to dispense adhesives with high-speed dispensing equipment or a stencil printer, a number of factors must be taken into consideration.

Web-based ATE Adapts to Test Future Technology

Easy access to test data and a broad range of tools for test program development are employed via Web-based technology.

Conversion Cost Update

When conversion cost is measured on a per lead basis, the evidence clearly indicates that the cost of transformation is declining.

Placement Equipment

Featuring unique centering and vision systems, modular designs and high throughput rates, today`s automated pick-and-place equipment is a far cry from the manual placement and handling machines of the past. Both fine-pitch and odd-form components can be placed on a PCB at the push of a button with some advanced machines. Other desirable options include small footprints, computer-compatibility and quick changeover times. SMT presents the following placement equipment selector roundup to highlight

High-volume Placement

The FCM, with speeds of up to 96,000 cph, has a footprint of 50 sq. ft. The slow movements of up to 16 independent placement modules, along with stationary feeders and boards, reportedly allow the unit to achieve a defect rate of less than 25 ppm, placing components as small as 0201. Vision modules allow placement of components down to 0.020" pitch.

Rotary Head

The SI-E1000 compact chip mounting machine features the Planet Head. Reportedly, this compact rotary head achieves precise, high-speed placement by controlling its planet gears with a fully closed rotary servo. Bidirectional head rotation is said to support optimal head control and reduce operating cycle time. The head features reflective and transmission part recognition.

Touchless Centering Placement Heads

The PlacePro Model 7100 employs six touchless centering placement heads mounted on a single gantry. It can reportedly place a wide range of component package types at rates up to 18,180 cph. A high-speed scan camera mounted on the gantry below the head assembly provides on-the-fly vision alignment of components as the gantry moves from the pick point to the placement position. Touchless component centering is performed using the high-speed vision processing system and either the scan camera or o

Fine-pitch Vision and Dispenser

Two new features for the CLM 9000 SMD pick-and-place system include a dual-camera Cognex vision system and an Archimedian screw valve dispenser. The vision system provides accurate placement of fine-pitch components down to 0.016", BGAs or special components. The dispenser allows precise dispensing of solder paste for prototyping without the need for stencil printing. The placement system can have up to 190 feeder inputs (100 inputs with in-line conveyor). Standard equipment includes a universal

Laser-aligned System

The KE 760 is an automatic, high-precision system for flexible surface mount assembly. The laser-aligned system can populate PCBs as large as 16 x 14" and incorporates a vision recognition system to detect missing or abnormal bumps on BGA packages. With a rated tact time of 0.32 seconds, the system reportedly achieves placement accuracy of ±0.002" for chips and ±0.001" for QFPs up to 2 x 2".

Chips and Large Parts

The GSM platform with FlexJet technology allows high-speed placement of both chips and large parts on a single platform. The platform reportedly reduces machine downtime related to changeover because it handles both chips and ICs. Lines consisting of multiple machines with this platform and technology are said to achieve high machine utilization because of the range of components that can be handled.


Windows Operating Environment

The Meridian Series SMT placement systems offer high ROI, low setup and operating costs, and effective line optimization and operation monitoring tools, with maximum placement rates exceeding 28,000 cph. All models are said to accurately place both chip and IC components. Features include a Windows NT operating environment and three-stage, soft-stop conveyors.

Low- to Medium-volume Placement

Designed for low- to medium-volume SMD placement, the P40`s capabilities include a variety of applications ranging from 0402 discrete components to 0.020" fine-pitch to BGAs, with a maximum feeder capability of 120 8 mm stick feeders (80 8 mm tape feeders). The units reportedly were designed for facilities where quick setup, ease of operation and high reliability are paramount. Component placement rates of up to 2,500 cph are typical.

Low-volume, High-mix

The MP1260`s single feeder change on-the-fly, multiple on-line placement programs, and complete inventory on one machine reportedly make it suitable for low-volume and high-mix assemblies. It is available with up to 10 placement heads and 328 feeder locations. The unit may also be configured with a mechanical gripper head and a dispenser in addition to the vacuum placement heads. Components placed range from 0201 chips to large (55 mm2) parts. The system can also dispense adhesives and solder pa

Six-nozzle Revolver Head

The SIPLACE 80 F5 handles standard and odd-shaped components via a traditional pick-and-place head, as well as advanced components, including bare die, CSPs, µBGAs and flip chips, by using a special six-nozzle revolver head. This head is capable of placing components ranging from 0603 to 32 x 32 mm, at a rate of 8,000 cph with an accuracy of 70 µm at 4 sigma. To place larger parts (up to 55 mm), the system uses a second head for pick-and-place at a rate of 1,800 cph with an accuracy of

Short Production Runs

MY9, the smallest footprint of the MY-Series machines, can handle up to 112 8 mm feeders, 105 SOIC tubes, or 80 8 mm tapes and 32 JEDEC trays with the optional tray exchanger. With this option and the new dual vision system, the machine is capable of placing components, QFPs, BGAs, and more advanced package technologies like flip chip, BGA and CSPs with pitch down to 0.16 mm.

Speed Enhancements

The 3Z is the latest version in the Contact 3 Series of SMT placement machines. Several speed enhancements reportedly have increased the maximum placement rate by more than 60 percent (13,000 cph). Faster motors with non-contact linear encoders are said to have increased head speed by 167 percent and table speed by 52 percent. Servo-driven Z axes increase cycle speed while improving placement force control. The unit retains its split-axis design with independent dual heads, 100 percent vision ce

4-axis Robot

The SR-424HSP robot has a total arm length of 420 mm. It can work within an area the size of a pallet. With four axes, multitasking capability, 32-bit control, arm height of 479 mm and weighing 21 kg, the robot can be used for pick-and-place applications. It reportedly has rotational speeds of up to 480° per second and repeatability accuracy to within ±0.02 mm. The robot controller is capable of simultaneously processing input and output signals during robot motion. The 32-bit controll

Optical Inspection

The GS•1 is an in-line system for automatic optical inspection of the SMT component placement process. It also provides measurements of positions in X, Y and theta (Q) of all components after placement. The system also offers inspection of polarity indicators, SPC software and programming by CAD data.

3-D Inspection and Taping

For use on the MP Series of machines, the MP200-3D provides a 3-D vision inspection and taping solution for two-sided components, including MSOPs and TSOPs fed from plastic tubes. The system reportedly features on-the-fly 3-D vision, fast changeover and low overall cost of ownership. The unit reportedly achieves throughputs of up to 6,500 parts per hour and is quickly changed to handle other part types. The system accepts tubes from 170 to 560 mm long to a stack height of 20 cm and accommodates

Three Heads, Double Vision

The CP-40CV fine-pitch placer combines CyberOptics laser sensors on its three heads and 256-level gray-scale bottomside vision. This lead-screw driven machine places components from 0402s up to 40 mm square QFPs with pitches down to 0.3 mm. It holds 104 tape feeders as well as standard and belt-driven stick feeders and waffle-pack trays. Software provides real-time machine operation, auto-optimization and on-screen error display. The system includes a three-stage conveyor and can handle PCBs up


BGA Scope

The PS-1000 is a video microscope designed to give users a side view of solder bumps beneath BGAs, CSPs or QFPs. A special prism directs the illumination ray to the object through a mirror at the edge and reflects the image. The scope is hand-held, and said to be compact and lightweight. Solder joints of QFPs or J-leads are also able to be monitored at approximately 100X if the prism is removed. With a CCD camera, images can be seen on a monitor, and reports can be made or printed out using a pe

Carrier Tape for Thin Parts

Snappax is an interlocking cover and embossed carrier tape design that can be used to package very thin parts, such as metal stampings and flex circuits, while reportedly protecting their integrity and coplanarity in the package. The design uses tabs in the cover tape that "snap" into and are retained by corresponding receiver pockets in the carrier. Vertical movement of the part in the pocket is said to be controlled, preventing thin parts from bouncing and shingling between pockets, as well as

Marking Head

The FH Series marking head is a component-level, galvo-based scanning head featuring digital fiber optic technology, as well as marking speeds reportedly up to 180 characters per second. The head is designed to work with CO2 lasers from 10 to 125 W, which are used in the surface mount industry for marking chips and PCBs. Its Windows-based laser marking software, WinMark Pro, is said to allow users to import numerous file formats, mark directly from a database, and set up automated processes such

AOI Inspection

The Vi-3000 AOI system is said to be capable of 100 percent inspection of PCBs at speeds up to 150,000 components per hour. It reportedly employs a digital camera with 1,300 x 1,000 pixel resolution and a 48 x 37 mm field of view. The system`s image analysis software can be programmed using Gerber, CAD or ASCII/Centroid supplied data, and incorporates SPC software tools and a synthetic component library. Operators can reportedly select any combination of axial or pyramidal light sources and ambe

Code Reader/Decoder

DMC200 software is now available for installation in VC Series industrial smart cameras. The software is said to allow users to create ECC200 Data Matrix readers/decoders. The readers are customizable to address a variety of applications through changes to their optics or illumination. For those who prefer a plug-and-play product, a fully integrated MAC 300 ECC200 Data Matrix Reader is available. With a VC65 smart camera, optics and illumination incorporated in a compact aluminum housing, the MA

Hidden Solder Joint Inspection

The benchtop ERSASCOPE 3000 inspection system offers a cross-sectional, nondestructive visual image of hidden solder joints by looking under BGAs, microBGAs and flip chip components, as well as interior fillets of PQFP and PLCC components. Its cross-sectional scope (90° angle of view) is complemented by a look-down scope (0° angle of view) with up to 350X magnification. The stand is said to allow for quick change of scopes with rotational and angled views (180° stepless). The hold

Lead-free Adhesive

CE 3100 electrically conductive adhesive is a lead-free alternative to solder for SMD interconnection formation. It uses a proprietary oxide-reducing technology to reportedly provide electrical junction stability and reliability on common metal solderable surface finishes. The adhesive is said to cure completely in a typical solder eutectic reflow cycle; no post cure is needed. Because of this, it is compatible with existing SMT assembly processes. The adhesive`s low CTE results in good thermome

Dual Lasers

The GS-600 is based on a dual-laser system that is said to accurately drill blind vias in all laminates, pre-pregs, dielectrics and copper foils. It is compatible with the IPC NC-349 drill file format, and features computer automation and fully integrated loading and unloading technology. After an operator initiates a production run by loading a part number and pressing the start button, the system accesses the LAN interface to select the appropriate drill file. It then activates the automatic l

O-ring Nozzles

This company specializes in the manufacture of special nozzles for critical fine-pitch placement. It offers O-ring enhanced nozzle tips and cups to improve the vacuum seal between components and pickup nozzles. This is said to reduce skewing and ensure increased placement accuracy without slowing machine speeds. O-ring nozzles are reportedly available in many sizes for a variety of chip and IC placement machines.

2000 Industry Vision Forecast

As we prepare to head into 2000, the surface mount process has, in many ways, come full circle.


A Basic Guide to Solder Paste Handling

Solder paste is a combination of pre-alloyed spherical metal powder and flux medium.

Market Opportunities: Specialization vs.Globalization

As consolidation thrusts change upon the CM industry, mid-sized CMs are becoming almost nonexistent, resulting in an industry filled with large global players and small specialty shops

Various artilces

Analysts to Discuss the CM Industry - NORTHBROOK, Ill. — The IPC — Association Connecting Electronics Industries announced that three analysts will provide a financial overview of the domestic and global contract manufacturing service industry in the keynote session Wall Street Speaks on the EMS Industry at the IPC SMEMA Council Electronics Assembly Process Exhibition and Conference (APEX). The session will take place March 15, 2000, f

Product Review

Mobile Storage System - The UltraClean PureFlow mobile storage system features a self-recharging power cell and Class 10 compatibility that is said to guarantee fail-safe particle control during the transport of microelectronic components and other sensitive materials through a manufacturing facility. All systems are self-contained and incorporate a motorized impeller blower and filter that direct a continuous wash of filtered air downward throughout the stor

Keys to Quality Iimprovement

A company must have a strong internal organization to ensure performance excellence for customers who expect world-class service.

CM News

CMs Establish Operations in Mexico ... - NAMPA, Idaho — MCMS Inc. announced its intent to establish a 112,000 sq. ft. operation in Monterrey, Mexico. The facility will initially focus on printed circuit board (PCB) assembly and test, and will expand to include system assembly as well as a full range of order fulfillment services. The project was scheduled to commence at the beginning of October, with volume production by the first quarter of 200

New Products

Bar-code/Matrix Reader - The HawkEye Model 15HD bar/matrix code reader is a compact, fixed-position scanner/verifier. Using QuicSet, an integrated positioning feature that combines visual laser targeting and audio feedback, the reader can reportedly be aligned on a bar or matrix code symbol quickly without external equipment. It offers on-line verification for immediate and definitive in-line symbol quality control. The reader is 2.4 x 2.5", and features an integrated lighting system tha

No-clean Solder Paste Innovations

In the past few years, several innovations in the performance of no-clean solder pastes have been introduced.

Stencil Printer Optimization Study

Reducing the variation in the pad areas, the Six Sigma philosophies can be brought to bear on the stencil printing process.

Increased Yield and Reliability of the Flip Chip Process

There are a number of process parameters that affect yield and reliability for flip chip assemblies. This article examines some of these parameters and discusses how examination of each parameter's role in the process, followed by necessary adjustments, can increase yield and reliability.*


Rework/Repair

With the continuing evolution toward smaller components, higher board densities and more diverse mixes, process equipment is stressed to the limits of its capabilities.

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement require-ments. Modern manufacturing techniques are useless if a board's components are out of date, perform poorly or fail to satisfy end-user requirements. To assist manufacturers in this search, SMT Magazine presents Component Specifier, a new product section designed to spotlight state-of-the-a

Test/Inspection

Specific tools such as statistical quality control (SQC), inspection, repair and test are not only needed, they should be in place to ensure that products are built to meet required quality levels on a consistent basis.

Technology & Business Report

Each month, SMT Magazine's SMT Trends section polls industry leaders on topics at the heart of the surface mount industry. This month, we ask industry leaders for their opinions on the state of the industry and possible directions it will take in the future. Of key interest were topics related to global expansion and time-to-market.

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement requirements.

Line Efficiency and Productivity Measures

Data from both OEM and CM SMT lines were collected and analyzed to determine line efficiency, nonproductive assembly time and other productivity measures.

Manufacturing Partnerships into Y2K

As demands for products with increasingly smaller packages and enhanced performance grow, OEMs are looking for CMs that offer one-stop shopping.

CM News

Eight New Contracts Won - NIWOT, Colo. — The Dii Group Inc. announced that Dovatron, its contract manufacturing subsidiary, recently signed eight new programs with seven new customers and one existing customer, amounting to more than $200 million of annualized revenue. Two of the programs are printed circuit board (PCB) assembly in China for Matrox Corp., and PCB assembly and box build for home networking products for Tut Systems. The remaining bu

New Products

Chip Scale Test Contactor - The HP 95000 chip scale, auto-test contactor is designed for use with the HP 95000 tester. The contactor works with the tester to provide 1 GHz performance with less than 1 ns pulse widths for testing direct rambus DRAM. The contacts use 0.75 mm pitch, 1.3 to 1.6 nH self inductance, 0.02 to 0.09 capacitance and 9.3 GHz bandwidth at 1.0 dB for test results from -55 to 150°C with a typical life cycle of more than 100,000 insertions. OZ TEK, Hayward, Calif.

Product Labeling vs. ESD

One of the many potential sources for electrostatic discharge are standard PCB and component bar-code labels that utilize insulative materials able to generate up to 1,000 V or more when removed from the release liner.


Minimize ESD-induced Failures

Commitment at all levels of production is required to gain control of ESD.

Advances in Automated Selective Conformal Coating

Tri-mode applicator technology offers manufacturers both flexibility and dependability.

CIM-compatible Handling Equipment

The key to PCB-assembly optimization, programmable conveyor systems can link computer-integrated manufacturing equipment for maximum yields.

FCIP Delivers Flip Chip Benefits Without DCA Complications

Emerging technologies support adoption of FCIP solutions to meet performance requirements.

The 'Necessaries' of Machine Vision

While RS170 or charge-coupled/infrared (CCIR) cameras are common, the need for more detail and faster acquisition rates is rapidly driving frame grabbers in the direction of higher resolution, progressive-scan cameras.

Guidelines for Lead-free Processing

With legislative directives banning lead in electronics processes afloat in Japan and Europe, it is important to understand how converting to lead-free solders will affect the SMT process as a whole.

How to Choose SMT DC-DC Converters

Until recently, most DC-DC converters were only available as through-hole devices. As more become available as surface mount devices, users need to know how to choose the most appropriate one.

Improved Fault Coverage for Limited Access

Smaller components and boards have forced the creation of new test techniques.

The Role of X-ray Inspection in DFM

The supporting role that X-ray inspection plays for DFM is critical to the SMT process.

Cleaning

In the era of "no-clean" solder pastes, precision cleaning of assemblies has assumed a new dimension.


Soldering Equipment and Materials

Soldering is a critical step in the SMT process.

Publisher's Executive Council Survey

Q: How did you develop the rotary turret design for today's chipshooters?

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement require-ments. Modern manufacturing techniques are useless if a board's components are out of date, perform poorly or fail to satisfy end-user requirements. To assist manufacturers in this search, SMT Magazine presents Component Specifier, a new product section designed to spotlight state-of-the-a

Cleaning Up The Process

Two companies worked together to develop a process to control flux flow, eliminating buildup and reducing maintenance.

Managing Productivity and Relationships with OEMs

The heart of all OEM/CM relationships is trust derived from the knowledge of their capabilities and demands of the market.

Real-time Cost Estimates Measure

Real-time cost estimating is a useful tool when comparing capital equipment expenditures.

Quality Ensured with In-process Inspection

Integrating AOI systems at key locations in the assembly line has proven to be a cost-effective solution for improving yields.

CM News

Software Order Placed - HERZLIYA, Israel — SCI Systems Inc. placed a $3.8 million order for combined Tecnomatix Technologies Ltd. and Fuji Machine Manufacturing Co. Ltd. software and services. Tecnomatix will receive $2.1 million, with $1.7 to go to Fuji. The order is comprised of Tecnomatix UNICAM software for assembly planning, production monitoring, documentation and for interfacing with non-Fuji PCB assembly equipment, and a jointly developed

New Products

1210 Fuses - The PolySwitch microSMD product family includes six resettable fuses ranging from 0.05 A at 30 V to 1 A at 6 V. It is said to be designed for overcurrent protection in computer, consumer electronics and industrial process control applications. The products in the group are the microSMD005, microSMD010, microSMD035, microSMD050, microSMD075 and microSMD100 devices. The devices were designed to the industry-standard 1210 (3.2 x 2.5 mm) footprint. Raychem Corp., Menlo Park, C

Soldering

The discovery in the pyramids of metals joined by soldering proved that this technique is not modern.


Publisher's Executive Council Survey

First of all, how did your appointment to the IPC Board of Directors come about?

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement require-ments. Modern manufacturing techniques are useless if a board's components are out of date, perform poorly or fail to satisfy end-user requirements. To assist manufacturers in this search, SMT Magazine presents Component Specifier, a new product section designed to spotlight state-of-the-

Assessing CM Quotes

OEMs must not only evaluate price when considering outsourcing, but the comprehension, accuracy and trust of the potential partner, as well.

CM News

Flextronics Acquires Finnish CM - SAN JOSE, Calif. — Flextronics International Ltd. entered into an agreement to acquire Kyrel EMS Oyj, a Finnish contract manufacturer. Kyrel has offered services since 1983, and has long-established relationships with customers in the telecom industry, including Nokia and Alcatel. The company has two operations in Finland and one in Luneville, France.

Selecting the Right ERP and MES Software System

To avoid choosing the wrong software system for your company, a careful evaluation of your company's needs and the supplier's offerings is a must.

High Expectations Force Action

In this issue, our roundtable participants grapple with issues pertaining to the growing needs of their OEM customers.

New Products

Thin-film Fuses - The Accu-Guard Series of thin-film fuses have current values from 150 mA to 5 A in sizes including 0603, 0805, 1206 and 0612. Featuring accurate current ratings and fast response time, the fuses are reportedly ideal for telecommunications applications, battery chargers and packs, hard disk drives, LCD screens and digital video camera equipment. The fuses are sold on tape-and-reel packaging and are compatible with high-speed automated assembly equipment. AVX Corp., Myrt

Quality Verification with Real-time X-ray

One can look at trends in packaging and assembly and predict that geometries will continue to shrink and PCBs will become more complex.

Lasers Offer a Tracing Alternative

Many industries have precise traceability requirements to which PCB assemblers must adhere. Laser marking offers assemblers a cost-effective alternative.

Get a Jump on the Lead Ban

The inside tract on what to expect over the coming years.


Program ICT for the UUT

The goal of in-circuit test is to ensure that the PCB is operational and ready for system assembly, i.e., the integrity of all units under test — connections, components and functional circuits — on the board must be checked.

How Heat Generation in Stencil Printing Affects Solder Joint Quality

The challenge of stencil printing in the midst of ongoing miniaturization is achieving repeatable solder paste deposition from print to print and pad to pad; this requires an understanding of paste rheology characteristics and the influences of temperature.

Soldering Application

Reflow with no-clean ovens and real-time thermal managers can maximize throughput and increase yield.

The User Benefits of a Supplier Partnership

Equipment suppliers have become a resource for process control expertise, even in the reflow operation.

Improved Performance Properties for Adhesives

Adhesive suppliers must meet the demands that improved designs in assembly equipment place on their products.

Two-dimensional, Closed-loop Inspection of Stencil Printing

Traditionally, post-print "paste on pad" inspection has been used to determine if the area of deposition on the board exceeds (or lacks) acceptable limits in either direction.

Trends in Wavesoldering Technology

The fundamental mass-joining technology has evolved to meet industry demands for better, faster and cheaper assembly.

Environmental Impact of Lead-free Solders

Although the movement to regulate and eliminate lead-bearing solders has picked up speed worldwide, there has been little published research on the environmental effects of the available lead-free formulations.

Environmentally Certified Technologies

Currently viewed by industry as "the bad guys," regulating agencies such as the U.S. Environmental Protection Agency have a plan to improve their image and help manufacturers attain their goals.

Understanding Placement Rate: A Common-sense Guide

Although there are currently no industry standards for specifying placement rate, the authors offer advice on how to determine a machine's realistic cph and how some machines perform closer to their advertised rates than others.


BGA/CSP Issues

This month, experts in the area of ball grid array (BGA) and chip scale package (CSP) technology discuss current and future BGA and CSP issues.

CSP On-board Assembly: Implementation and Qualification

The objectives of these studies are to develop optimized assembly processes, demonstrate the production assembly processes developed and provide reliable solder connections.

CM News

GISSMO System Implemented - CONCORD, Mass. — Manufacturers' Services Ltd. implemented a global materials and supplier information system known as GISSMO. The move is a part of the company's strategy to build a supply-chain solution that will allow it to serve customers in a real-time environment.

New Products

PCB Magazine - The 700 Series PCB magazine incorporates a belt-driven precision spindle system that reportedly allows for quick and easy setup to PCB width as well as parallelism of the side panels. The color-coding and consecutive numbering system on the side panels, along with the width scale, are said to help facilitate width adjustment. A transport safety lock keeps the PCBs from sliding out of the magazine during transport and can be automatically unlocked in a loading station. The

Troubleshooting BGAs

Solder-bump-array technology, as on BGAs and CSPs, offers many advantages (and some disadvantages) that must be understood to prevent serious problems.

An Image Library of SMT Defects Section 4: BGA PCB Defects, Dimensions, Poke-thru

These images of SMT defects and attributes were compiled by consultant Tom Clifford. In Section 4, we showcase copper splash, over-etched and thin traces, solder on copper, and other defects. Some of these can cause electrical shorts.

IPC-A-610D for AOI: Integrated Verification Enables IPC-compliant PCB Inspection

IPC-A-610 is the universally accepted standard for electronics assembly defects. In this article Peter Krippner, Viscom AG, describes how IPC-A-610D is incorporated into post-reflow AOI systems to improve defect detection, reduce false calls, and eliminate missed defects during SMT assembly.

SMT Preventive Maintenance: Stop 5 Major Problems with Pick-and-place Nozzles

Quality nozzles and feeders are the core of pick-and-place. In this article, Zachery Shook, Count On Tools, describes five major issues associated with improper nozzle maintenance and/or the use of poor quality nozzles in the pick-and-place process.

Trust but Verify. Why Take the Risk? Detection of Counterfeit Components by K-Shell XRF Technique

Steve Glass, RMD Instruments, warns that counterfeit electronic components discovered by the defense industry has doubled since 2008. He busts a few myths about counterfeiting, such as “all counterfeit components come from China” and “counterfeits are so crude they can easily be detected.”

Insights behind Foxconn/Hon Hai Employee Suicides: Recommendations for Electronics Companies

Pamela J. Gordon and Fanny Lee, TFI, investigate the electronics industry’s role in the Foxconn suicide problem, and offer advice for OEMs considering implementing or changing their multi-national outsourcing strategy. Can electronics be manufactured at an effective cost and worker-satisfaction rate? Ultimately, it depends on both the customer and the manufacturer.


What Is Halide-free and What Does It Mean to Me?

With halogen-containing substances possible additions to the list of substances banned from electronics, many manufacturers are asking how this materials restriction will affect them and their processes. John Vivari, Nordson EFD, explains what halogens and halides are and why they matter, as well as where these elements appear in the electronics manufacturing bill of materials.

Is Cleaning Critical to PoP Assemblies?

Cleaning is a critical process in the electronics manufacturing industry. Effective cleaning improves product reliability by ensuring optimal surface resistance and preventing current leakage that can lead to PCB failure. This paper addresses the cleanliness level of PoP assemblies, including underneath PoP components and in between packages.

Manufacturing Representatives & EMS: Keys to a Solid Partnership

Ask a manufacturer's rep or an EMS sales manager about successful EMS-rep sales relationships and you'll most likely get a negative response. The EMS industry is littered with bad breakups. Usually, the root cause is the fact that neither party fully understood what they were getting into. What drives a good relationship?
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