Article Highlights
3D Printing and Medical Electronics: A Disruptive Beneficial Technology
12/11/2018 | Dan Feinberg, Technology Editor, I-Connect007
What is ESD and Why Should We Worry About It?
12/10/2018 | Pete Starkey, I-Connect007
Greg Vance on SMTA Ohio Chapter Updates
12/05/2018 | I-Connect007 Editorial Team
Electrolube on Managing Thermal Interfaces and Conformal Coatings
12/03/2018 | Pete Starkey, I-Connect007
Understanding the Benefits of CFX
11/30/2018 | Stephen Las Marias, I-Connect007

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Aerosol Coating

Staticide ESD is a permanent ESD acrylic coating that can reportedly be applied to most any insulative material or surface. It comes in a 16 oz aerosol spray can containing 12 oz of ESD coating. It is said to use a mixed-metal-oxide semiconductor as the static-dissipative agent in a clear acrylic-polymer coating. It does not contain carbon black, which can slough and leave black marks when rubbed. It also does not contain amines, quaternary ammonium salts or organic acid salt anti-stats. The pro

Static-dissipative Vinyl Upholstery

Microcon white is a static-dissipative vinyl for the company`s chair models. With this vinyl seating upholstery, the chairs are said to offer critical environments (including cleanrooms) static-dissipative protection in three colors: white, blue and black. Average component resistance to the ground is 1.2 x 107 W. The surface resistivity is 5.3 x 106 to 108 W per square surface at 500 V. Reportedly, the decay time from 5,000 V to technical zero is 0.44 seconds.

ESD Protection

New is this 11-member family of electrostatic discharge (ESD) protection devices, also known as transient voltage suppressors, which includes SOT, TSSOP, QSOP and MSOP packages. This family is said to bring three different approaches-low-capacitance diodes, zener diodes and a combination diode/zener-to the market, covering a range of configurations and surface mount packages. The products also reportedly meet and exceed ESD requirements of the International Standard IEC 61000-4-2. They provide p

Scaleable Test Solutions

The GR Versa Automotive Test (AT) is part of a family of scaleable functional test solutions based on the PXI standard. It reportedly is designed to meet the global manufacturing requirements of the automotive industry. The system combines the GPX621 (a 21 slot PXI/CompactPCI chassis) with PXIScan switching architecture that is said to enable virtually any instrument or resource to be routed to any test point on the unit under test (UUT). It also combines the TestStand multi-threaded test engine

14-slot Chassis

Reportedly the only 14-slot PXI chassis available, the PX2000-514 is a 19" rack-mountable unit that complies with the PXI and Compact PCI standards. All slots are said to have full PXI functionality. Separate forced-air cooling is provided for the power supply and PXI slots. Fan noise is said to be minimized by varying fan speed according to system temperature. Optional features include temperature and PSU monitoring, auxiliary I/O and user power supplies.

Burn-in Test Sockets

This family of burn-in test sockets for Direct Rambus (DR) memory devices will enable DRAM manufacturers to test devices that incorporate the memory management architecture developed by Rambus Inc., ensuring that they are fully tested and burned-in. The test sockets provide DR DRAM manufacturers a way to identify functional defects in singulated packages before assembly. They feature an open-top design for ease of use and are designed to accommodate the most popular IC package formats, including

Functional Tester

The Fas-Test in-line functional tester is said to include a buffer before and after the test procedure, a compression weight of up to 1,000 lb during the testing process, fixture change-out of less than three minutes, direct connect to a variety of fixtures, and System Monitor software designed to optimize and monitor production flow. The standard cycle time for each board application is reportedly 6 seconds plus the test time. A bar-code scanner works in conjunction with the test system to ensu

PCB Index Cycle Time Technology

This new technology reportedly allows the company to reduce by more than 50 percent the PCB index cycle time of the TCIL test handler used in the company`s automated in-line systems for ICT and functional testing. The technology makes use of a servo-driven PCB pusher mechanism in the TCIL that is equipped with extend-retract fingers for gripping the board for downstream movement after test completion. At the same time, it introduces the next board on the system`s DC motor-driven conveyor belt in


The KIC Recorder is a portable, self-contained thermal recorder with an internal memory for datalogging. The system can be connected to any PC or laptop for real-time profiling. It is designed for use in rework stations, high-temperature furnaces and similar applications in which the electronics cannot or need not be directly exposed to process temperatures. The recorder is said to provide a computerized display, high-capacity data storage and analysis capabilities. It is compatible with the com

Prototype Board/Parallel Port Interface

The PROTOPort parallel port interface is designed for use with the company`s prototype boards, which were designed for testing a user`s application circuits. In addition to the prototype boards, the new interface will work with any of the company`s application boards (such as the eight-channel 8/12 bit A/D or D/A boards, the six-channel counter-timer board or the 48-channel digital I/O board), and can be stacked one on top of the other (mezzanine up to 16 boards per addresses).

Solder Materials

The need for lead-free solders has reached critical mass, leading to global commitment to implementing lead-free solders. This is after a decade of concerted efforts in research in search of lead-free alloys that are suitable for electronics/microelectronics applications. Today, the industry has a menu of choices; however, there are still a wide range of opinions and emotions on the lead-free issue. In this article, the "design rules" and the technology behind lead-free solder development are ex

About the Site

SMT, the magazine for electronics assembly, is the only industry publication whose editorial is devoted exclusively to surface mount assembly of printed circuit boards. This focus allows SMT to cover in depth the technology developments and applications engineers are looking for.

Multi-lane Belt Feeder

Designed to meet the needs of low-volume, high-mix applications, this multi-lane belt feeder for SMDs provides for a large number of components while reportedly using the smallest amount of feeder space possible. The refresh time is said to be less than 0.5 seconds for most components. Any pressure on the components at the pickup point is relieved as soon as the belts stop running. The feeders service various Fuji, Panasonic, Siemens, Universal and Quad placement machine models.

Dual-beam Gantry Placement

A compact and flexible placement machine, the C7d reportedly handles a full range of components at a projected placement rate of 20,000 cph. Features include dual-beam-gantry design with three spindles per head, "fly by" vision centering on every component, 120 8 mm feeder capacity, a 3,000 lb quartz composite base for vibration dampening, linear motors and non-contact linear encoders, and independent servo-controlled theta on each spindle.

Off-line/in-circuit Programming

The BP-6500 machine picks, programs and places devices, reportedly combining the benefits of off-line and in-circuit programming. It is said to reduce cost and simplify SMT production lines by eliminating the need for programming during test. The machine allows programming and testing of almost all device types, as well as programming of different patterns simultaneously. Production line changeovers are said to be completed in minutes.

Fume Extraction/Purification

These filter units extract and purify fumes from hand soldering, wave soldering, reflow soldering and curing, soft-beam soldering, and laser applications. All units reportedly feature low noise levels, filter monitors and various filter options. The company also manufactures exhaust hoods, filter units and downdraft tables for the removal of dross dust during wavesoldering maintenance. Also available are explosion-rated filter units for filtration of flammable gases and a wide range of exhaust a

BGA/CSP Rework System

The Sniper II, an extension of the Sniper Split-vision BGA, CSP and QFP rework system, includes a multiple-profile storage system, said to be necessary for data-logging and automatic loading and storage of rework temperature profiles. Low-temperature convection rework technology is said to be enhanced with 16 multiple-segment profiles on the control system, which can be operated without a computer. Once connected to a Pentium processor, any number of profiles may be created and retrieved.

High-speed Chip Mounter

The MSF-SuperFlex high-speed, multifunctional chip mounter reportedly provides accurate component mounting at speeds up to 0.09 seconds per piece using a two-head, 10-nozzle system. It can handle components from 0603 to 55 mm QFPs, CSPs, BGAs and semiconductor chips.

Manufacturability/Testability Software

By automatically recovering board design data from CAD and BOMs, CIM Automation Software checks manufacturability and testability of the boards. The package then generates surface mount and through-hole placement equipment optimized programs, as well as in-circuit and flying-probe test data. Also generated are X-ray and optical-inspection system programs, paperless repair graphical displays, history and statistics, and shop-floor documentation.

Custom Material-handling Designs

This company recently opened a new, state-of-the-art facility in Lake Barrington, Ill., and also began operations in Europe with an Ireland office. At APEX, they will be demonstrating enhanced and new-generation machines, stressing the ability to provide flexible solutions to customers` material-handling requirements.

No-clean Paste

Easy Profile 256 is a no-clean, air or nitrogen reflowable solder paste designed to exhibit stable wetting behavior over a range of reflow profiles. The key characteristic of the paste is said to be its overall robustness and operator friendliness. It is reportedly suitable for CMs and other electronics assembly companies running low-volume, high-mix product lines requiring tolerance for various oven settings and board sizes.

Vapor-phase Reflow Ovens

This company manufacturers vapor-phase reflow ovens. Applications for such ovens include SMT reflow, lead-free solder reflow, curing, drying, mechanical attachment and plastic package testing. The advantages offered by these ovens reportedly include uniform temperatures; low-oxygen environment; fast, even heat transfer regardless of product size; minimum liquidus times; absolute limits to maximum temperatures; ease of use; short setup times; and high repeatability. In-line, batch and custom oven

Probes for Test Sockets

The Micro Pitch Probe is for device testing of 1 mm pitch and below. It is said to offer excellent electrical properties, long cycle life and reliable contact geometry. The probe features a short signal path of 4.75 mm (0.187"), its self-inductance is reportedly less than 1 nH, and the contact resistance is less than 70 mW.

Test Handler

The J411-03 test handler is designed for flexibility, reportedly allowing manufacturers to test several different products using the same platform. If integrated into the company`s robotic test handlers, PCBs and final products can be automatically loaded into the handler. It is said to be easily configured for various test systems, as well as handshaking with the controlling system using standard RS-232 protocol. The handler is CE-compliant and has a 9.8 x 31.1" footprint.

Solder Paste Inspection

The SE 300 high-speed, high-resolution, 3-D solder paste inspection system is said to be capable of performing 100 percent inspection at production line speeds. It automatically measures height, volume, area and bridging, and notifies the operator if any parameters begin trending outside the user-specified limits. There is a choice of two operating modes: high-speed mode, designed for fine-pitch QFPs and other traditional components, reportedly inspects 4 sq. inches per second; high-resolution m

Electronic Commerce and the Electronics Industry

Hyper-competition has shifted business models across virtually all markets, but perhaps none as dramatically as the electronics industry. A decade ago, product innovation itself was enough to support sustainable competitive advantage. But innovation creates opportunity, which spawns competition, forcing companies to either keep pace or wither on the vine.

High-strength and High-fatigue-resistant Lead-free Solder

Sn/Cu/In/Ga proves to be an interesting solution for high-strength and high-fatigue-resistant electronics applications.

DFM: Is the Industry There Yet?

Because DFM is still a relatively new concept, assemblers, designers and fabricators are often working on a different page when it comes to putting DFM to use.

Following the Money

IPC plans to head to Washington, D.C. for its 8th Annual Capitol Hill Day to garner support for the Printed Circuit Investment Act.

Lead-free Solder Alloy

The TAC 5 solder alloy (95.5Sn/4.0Ag/ 0.5Cu) has been incorporated into pastes, bars, wire and spheres. For surface mount assembly, it can work with existing equipment to produce solder joints with stability said to be equal to or greater than lead-bearing solder joints. In hybrid circuits, the alloy reportedly enhances thermal fatigue resistance. The company`s lead-free line also includes a no-clean flux that reportedly minimizes defects and improves wetting.

Ultrasonic Cleaner

The newest addition to the CYBERCLEAN line, the Series 4000 Model 24U ultrasonic cleaning system, is intended to clean hard-to-remove soils, such as baked-on fluxes from production fixturing, in a batch cleaning format. All systems in the line are PLC controlled, and all operations - cleaning, rinsing and drying - are said to be automatic. This specific model has a standard envelope of 16 × 24 × 20" and is configured to process five 18 × 24" fixtures per cycle. Customized baskets

Modular Chip Mounter

The CM201/202-D modular chip mounters reportedly offer unlimited expansion capabilities, flexibility and high productivity for component placement. Productivity is said to be enhanced with a 208-feeder capacity using double feeders and throughput that reportedly ranges from 13,850 to 27,700 chips per hour. The units handle component sizes from 0201 to 24 mm.

Stencil Inspection Workstation

Designed to increase verification speed and accuracy, ScanSTENCIL is a fully integrated, off-line stencil inspection workstation that combines a Windows-based software package with a high-resolution calibrated flatbed scanner to produce verification files for laser- or chemical-etched stencils. Using its calibrated scanner, the unit inputs stencils or screens and compares them to a known perfect Gerber file for accuracy and blockage.

BOM Software

CheckPoint BOM Manager is designed for processing data at the front end of the PCB assembly process. It imports, parses, analyzes, and archives BOMs and approved vendor lists under electronic revision control. The software reportedly imports customer BOM data from a variety of sources, such as collimated ASCII files, CIM project files, Microsoft Excel spreadsheets and ODBC databases. It operates on Access or SQL Server to provide enterprise-wide PCB information control.

Stopping ESD

Staticide #2500, an electrostatic-dissipative clear coating, combines acrylic polymers with a semiconductor technology to provide permanent static dissipation, reportedly even under zero-humidity conditions. The semi-transparent coating is said to be usable on all nonporous insulated surfaces such as keyboards, computers, mice, oscilloscopes and workstations. In an aerosol spray can, it is suitable for cleanroom use and dries to the touch in minutes. It also meets Federal Standard E209 for zero

Printing and Inspection Machines

The Ultraprint 1500 can be configured with options that address demands of flexbility or performance, or both. It is capable of printing boards up to 22 × 20", and includes standard features such as automatic board-to-stencil alignment, a self-leveling dual- squeegee print head and programmable hard board stops. The Ultraprint 3000 Ultraflex is designed for double-sided products and can reportedly handle fine-pitch and µBGA technologies. It includes synchronized motion control, automat

Selective Soldering and Rework

The LS-100 is designed for selective soldering and rework of all types of components, from µBGAs to large QFPs and odd-shaped and hybrid devices. It is said to be ideal for soldering and desoldering RF shielding and various paste-in-hole and solder-paste-on-through-hole applications. This semiautomatic off-line rework system reportedly prevents overheating and thermal stress of components, the board and adjacent components, while enabling the programming of precise reflow profiles. It also

Thermal Profiling Software

The Navigator is a high-speed enhancement for the company`s Auto-Predict software option. It reportedly identifies the optimal reflow profile for lead-bearing or lead-free solder paste automatically. The software draws on a built-in database to determine the process window automatically, once the solder paste is selected. It is said to function as an expert system, eliminating the need for operator decision-making.

Flip Chip Bonding Service

To complement its turnkey electronics manufacturing, this company introduced a flip chip bonding service, featuring a fully automated Fuji flip chip bonder with a bonding force of up to 50 kg. The system`s high placement accuracy and units per hour are said to create an initial capacity of 200,000 pieces per month with a two-shift, five-day work week operation. This capacity can be expanded to 300,000 pieces per month by adding a third shift and additional equipment. As many flip chip substrates

In-line Functional PCB Tester

The Fas-Test in-line functional tester is designed to handle high-rate production requirements and serve as a quick, efficient PCB tester. Features include a buffer before and after the test procedure, a compression weight of up to 1,000 lb during the testing process, fixture changeout of less than three minutes, direct connect to a variety of fixtures, and a software package designed to optimize and monitor production flow lines. The standard cycle time for each board application is six seconds

Copper-protective Coating

The ENTEK CU-77 copper-protective coating system is an alternative to HASL and other metallic PCB finishes. It is designed for coating single-sided PCBs that require one soldering step (glue cure followed by wave soldering). The material delivers a thin coating (200 to 400 Å) and reportedly provides improved storage and handling capabilities compared to anti-tarnishes. PCBs coated with this are said to have up to a 12-month shelf life. The aqueous-based system is composed of a pre-clean cyc

Depanelization Router

The 105DP is an in-line, fully automated depanelization router for populated PCBs that is said to provide hands-off operation. The system receives a populated PCB panel, places it on the worktable, depanelizes the individual PCB assemblies, then transfers them to standard or customized output conveyor systems. The head can rotate 90° or 180° for off-loading routed circuits, reportedly in any orientation. The system is designed to interface with conveyors and is said to provide a stable

Flip Chip Wafer Bumper

This low-alpha-count flip chip bumping process is for both eutectic (Sn63/Pb37) and high-lead (Sn5/Pb95) solder bumps. The solder is processed with a measured alpha emission rate of 0.01 alphas per hour per cm2, said to be the lowest offered in the industry by a merchant wafer bumping provider. The process reportedly minimizes the potential for "soft errors" in ASIC and other microprocessor ICs with small gate dimensions (0.18 µm and below).

Six-vision System

The CP45FV uses a "six-head, six-vision" system that incorporates an on-the-fly vertical imaging system for component recognition. Using vertical imaging, the system aligns components using features on the bottom of the part without traveling to an optical centering station. This concept reportedly allows the machine to place components at speeds down to 0.19 seconds per placement. Components from 0201 to more than 2" square QFPs with 0.019" pitch, as well as CSPs, can be placed on the same plat

Aqueous Cleaning System

The CBW-218 OmniJet aqueous cleaning system features all stainless-steel (polished) construction, sustained high-solution heat capability, and a high-volume spray bar said to have great GPM concentration per sq. inch to clean even highly dense PCBs. A convection dryer features adjustable blow-off knives that produce high-velocity water-strip action.

Wafer-bump Reflow System

This multi-belt, continuous-conduction, wafer-bump reflow system reportedly provides highly controlled and repeatable reflow profiles. The wafers are heated by conduction from a conveyor belt in the heating zones, with subsequent transfer to an independent cool belt in the cooling zones. Its low-particulate environment reportedly maintains an atmosphere at less than 5 ppm O2.

The Total Cost of Ownership Equation

Automated selective conformal coating systems can increase production throughput and reduce wasted materials, which are factors that need to be considered when determining total cost of ownership.

Global Trends in Assembly Equipment Strategy

With CMs acquiring more and more OEM facilities, there is a plethora of two- to four-year-old equipment on the global market that is available for leasing.

Inspection Methodology

Frankly, I dislike the term inspection because it is a constant reminder that my assembly process still has too much variation. However, until my manufacturing process is capable of consistently producing zero defects, some form of inspection or monitoring is necessary to ensure the desired quality level. Surface mount assembly is a very complex sequence of events with a large number of individual activities. The trick is creating a balanced inspection and monitoring strategy without performing

Conference Breakdown

The APEX conference program is divided into six categories: SMT and Electronics Assembly, Assembly Equipment, Materials, Management & Business Issues, Quality and Process Control, and Advanced Technology. There are 30 sessions and more than 100 presentations, as well as three free keynotes and nine free forums. Highlights include a focus on lead-free alternatives, electronic data interchange (EDI) issues, design vs. manufacturability trade-offs for advanced packages, developments in wafer techno


APEX is offering more than 50 tutorials and workshops that will answer questions on SMT and related assembly technology, including advanced component packaging, assembly equipment, materials and processes, and quality assurance and process control.

1999 VISION Awards

For the eighth consecutive year, SMT Magazine rewards 14 worthy companies with its 1999 VISION Awards. This year marks a change in venue for the ceremony, as it takes place at APEX. Awards are presented in the following categories: Adhesives/Coatings/ Encapsulants, Assembly Tools, Cleaning, Components, Contract Services, Dispensing Equipment, Inspection, Pick-and-Place, Printing, Rework & Repair, Software, Soldering Equipment, Soldering Materials, and Testing.

IPC EMS Management Council Meeting

This meeting focuses on trends that critically affect the contract manufacturing (CM) business, including:

IPC SMEMA Management Council Meeting

The inaugural meeting of the IPC SMEMA Management Council promises to make as big a splash as APEX itself. For the first time, presidents, owners and senior officers of companies that supply the electronics assembly industry will work together to solve supply issues.

IPC Standards Development Meetings

One of the reasons APEX exists is to support standards development activities. IPC standards development and committee meetings are among the most important and unique activities taking place at APEX. What could be more important than seeing how decisions are made that affect the specifications customers and suppliers use? What could be more beneficial than having an impact on that process? Connect with the industry leaders who are writing these standards.

Free Forums

Make the most of your time at APEX 2000. All APEX attendees are invited to free forums. These educational sessions offer timely information in a relaxed and open environment. Because there are no written proceedings, panelists are often more candid in their remarks. Hear from expert panelists on a number of critical topics at no charge.

Special Events

Kick-off reception. Enjoy a free reception on the show floor Tuesday, March 14. Meet with colleagues and suppliers to review APEX`s opening day and to make plans to make the most of your time at APEX.

Wall Street Speaks on the CM Industry

A decade ago there was a handful of publicly traded CMs; today there are more than 20 publicly traded CM company stocks. Wall Street`s view and understanding of the CM industry have a profound effect on all companies. This free Wednesday morning keynote features three veteran analysts sharing their views on the dramatic changes occurring in the CM industry: Keith Dunne, managing director, BancBoston Robertson Stephens; Bill Cage, partner, J.C. Bradford and Co.; and David Enzer, managing director

Free Environmental Forums

Lead-free Solders: Implementation Issues. The adoption of lead-free solders by the electronics industry will not be a simple matter. It affects all parts of the supply chain from the component and board manufacturers, to the solder materials and soldering equipment suppliers, to the assemblers and their customers. This panel forum will discuss which technology options are being pursued and their implications. It is also a chance to ask questions of some of the leading experts in the field.

Modular Placement

With its SP2 placement system and three different placement modes, the KE-2030 SMT placement machine is said to offer a high degree of flexibility and speed in a modular machine. The machine reportedly features a placement rate of more than 20,000 components per hour. Two multi-nozzle laser heads with eight nozzles can pick and place components as small as 0201s and as large as 26.5 × 11 mm and 20 mm2. Three placement modes are possible. In parallel placement mode, the machine places up to

Dispensing Equipment

The Continuous-Flow piston pump for encapsulation materials is a high-throughput, positive-displacement pump with a repeatability said to be less than 1 percent. Its multi-piston design continuously feeds material with no recharge time. The Xyflex consists of four independently programmable heads that can reportedly dispense up to 140,000 dots per hour, depending on the application. This surface mount system dispenses solder paste, adhesives and conductive epoxies. The Pulse-Jet non-contact pump


PanaPRO/PanaCIM software reportedly provides the unique ability of component-to-panel traceability. In addition to providing complete setup verification, this software/bar-code scanner package records and verifies use of all components and PCBs. Defective parts can reportedly be quickly traced back to the assembler and part number.

Upgraded AOI Systems

The AIMS G5 AOI system has received a new board-handling system that can handle very thin boards and employs full rail-board holding. It is said to employ a custom-engineered telecentric optic for inspection of 0201- and 0.012"-pitch components. The G4 system has been redesigned to improve ergonomics, sustainability and repeatability. Both systems reportedly received a new, patent-pending illumination system.

Real-time X-ray Inspection

The Jewel Box provides real-time X-ray inspection with a high-resolution camera and 10 µm X-ray source for magnification up to 500X. The unit inspects PCBs with µBGAs, flip chips, ICs and other advanced packages. It reportedly allows the imaging of materials, such as aluminum, that conventional high-voltage systems cannot image. The patented X-ray camera technology is said to maintain void-size consistency in relation to solder bond area as voltage increases.

Reworkable Flip Chip Underfills

An epoxy-based liquid underfill, 3567 is compatible with polyimid-passivated flip chip, BGA and CSP assemblies. It is said to be the first commercially available reworkable underfill - it reportedly permits an area-array device to be replaced after testing determines it is defective, minimizing the discarding of entire boards. The epoxy-based liquid cures in five to 15 minutes when exposed to temperatures of 150° to 165°C and penetrates gaps as small as 0.001". Defective flip chip pack

Internet-access Screen Printer

The 265 Infinity screen printer reportedly combines faster handling and printing with documented 2.0 Cpk levels. For high-throughput operation, the printer incorporates patented on-the-fly fiducial capture, a 2Di stencil and post-print inspection package, as well as ProFlow direct imaging. Networking capability supports machine-to-machine file transfer, network integration and remote Internet access, reportedly without interrupting production.

Combination X-ray/Vision Inspection

The XRV is an automated in-line PCB inspection unit that combines visual inspection with the advantages of X-ray. It uses CCD cameras to check for missing or wrong components, misplacement, polarity, and other visually evident defects. The integrated X-ray capability checks for BGA, µBGA, flip chip, J-leads and other hidden solder connections that cannot be seen by the naked eye. A typical PCB with 500 components is said to take less than 30 minutes to program. The system self-learns a PCB

Laser-light Guidance Assembly

The Guidemaster is a complete in-line component-placement system designed to integrate into existing manual assembly lines. Equipped with an in-line motorized conveyor and laser-light guidance system, the assembler is said to provide seamless in-line board flow and facilitate accurate manual part insertion. It comes with a PCB positioning and clamp mechanism to secure the board in a repeatable location, a PC configured with Windows NT, an intuitive operator interface, and a foot switch to trigge

Real-time Failure Analysis

The NXR-20HR real-time failure analysis system features an 8 µ microfocus X-ray source and 300X magnification for verification and inspection of SMT PCBs using BGAs, flip chips, µBGAs and other high-density packages. As a semiautomated system, it is designed to quickly and repeatedly identify hidden defects such as shorted or open solder joints, component misregistration, and voiding or unacceptable size variations in solder bumps. The system uses 5-axis sample manipulation (rotate and

Water-soluble Solder Paste and No-clean Wire Solder

Delta Elite 788 is a halogen-free, water-soluble solder paste with a tack time longer than 12 hours. The formulation is non-hygroscopic (moisture resistant). A low-volatility solvent, the paste reportedly provides long stencil life and high tack force, making it suitable for high-speed component placement. NC-601 no-clean wire solder is said to promote excellent activity and wetting, leaving virtually no post-soldering residue. Bellcore compliant, it comes in all standard diameters and at 1.1 pe

Component Placement Systems

There are seven models in the Meridian Series of SMT placement systems. All are said to offer high quality and productivity, low setup and operating costs, and effective line optimization and operation monitoring tools. The machines have a maximum placement rate of more than 28,000 cph, and can place chip and IC components. A Windows NT operating environment is used, and the machines feature a three-stage, soft-stop conveyor. They also reportedly meet the IPC-9850 standard.

Mini Fume Extractor

The Miniarm FX-32 has a reach of more than 3 ft, and consists of flexible, self-articulating plastic tube with a built-in damper and swivel function. It can be mounted to a wall, ceiling or directly to the workbench. The extractor is available in three models: standard gray for soldering smoke or small chemical and fume extraction; black for the ESD requirements of the electronics industry; and the gray Hygienic Arm for applications where there are high demands for cleanliness. The latter is pro

Vertical Reflow Oven

TOWER is said to be the first vertical reflow oven capable of high-volume PCB production. It is capable of performing eight unique board profiles simultaneously, meaning multiple pick-and-place lines can be fed into a single unit for box-build assembly. Typical applications include reflow, curing, and other thermal processes associated with conveyorized reflow ovens. The oven reportedly delivers the board-production throughput of 20` ovens in 7` of linear floor space.

Reflow Oven

The 1800EXL-SS oven is said to optimize reflow for boards with lead-bearing or lead-free solder paste. It is ISO 14000 certified for minimal environmental impact. The oven incorporates nine heating zones and two internal cooling zones within a 150" length, with throughput reportedly identical to conventional 183" ovens. An air-flux separation system is said to maintain the internal cleanliness of the oven chamber, extend maintenance intervals and minimize maintenance downtime.

The 10 Most Dreaded Questions For CMs

Electronics outsourcing continues to grow at about 25 percent per year; this trend is expected to continue into the foreseeable future. Traditional manufacturers recognize the prohibitive costs of electronics technology, capital and other resources. Many have set strategies in place to allow their companies to focus on particular core competencies, such as engineering or marketing, vs. hands-on manufacturing. They have recognized that this function can be best served by an outsourcing partnershi

Flexible Test Strategy Improves Efficiency

In the contract manufacturing sector, a pay-per-use test strategy is a proven testing solution for generating high-quality manufacturing services at low cost.

Flextronics Continues to Acquire

ROCHESTER, N.H. and SAN JOSE, Calif. - Cabletron Systems and Flextronics International announced they have entered into a definitive agreement in which Cabletron will divest manufacturing and repair services operations in Rochester, N.H. and Limerick, Ireland, to Flextronics. Under terms of the agreement, Flextronics will acquire manufacturing-related assets and inventories, and will also hire Cabletron`s worldwide manufacturing workforce of approximately 1,000.

Celestica Expands Relationship with IBM

TORONTO and ARMONK, N.Y. - Celestica Inc. entered into an agreement to significantly expand its existing relationship with IBM, specifically the Enterprise Systems Group and Microelectronics Div. The agreement provides for the sale and transfer of operations and assets in Rochester, Minn., and Vimercate and Santa Palomba, Italy.

CM Agreement Reached

SAN JOSE, Calif. - Sanmina Corp. and Harris Corp. signed a three-year strategic manufacturing agreement. Under its terms, Harris will outsource its commercial PCB assembly manufacturing to Sanmina. In addition, Sanmina is acquiring Harris` PCB assembly manufacturing assets and inventory and will lease the company`s ISO 9002-certified, state-of-the-art manufacturing facility in San Antonio.

Florida Facility Acquired

HAUPPAUGE, N.Y. - Boundless Manufacturing Services Inc. (BMS) acquired Boca Research Inc.`s 70,000 sq. ft. manufacturing facility in Boca Raton, Fla. BMS will assume manufacturing services, leasing and other support services, and also plans to staff the facility from Boca Research`s current team of manufacturing and supply chain associates.

CM Team to Serve Northeastern U.S.

MILFORD, N.H. - Citronics Corp., a New Hampshire-based CM, linked its resources with Sparton Corp. to develop joint business opportunities for Northeastern United States and international markets. With the addition of Citronics as its sixth alliance partner, Sparton is expanding its regional market coverage to 15 facilities throughout North America and Europe.

Two Sypris Subsidiaries Active in the Market

LOUISVILLE, Ky. - Sypris Solutions Inc. announced that its subsidiary, Group Technologies Inc., signed a subcontract with Raytheon Command Control & Communications Segment for the production of circuit card assemblies valued at $7.0 million. Initial funding of $4.7 million has been issued to begin the first year of this potentially multi-year program. Raytheon will use the delivered assemblies in support of the Navy`s cooperative engagement capabilities.

Canadian CM Expands Facilities

EDMONTON, Alberta, Canada - Mitronix Inc. announced the completion of the most recent expansion of the company`s facilities. Reportedly done because of a large increase in customer orders in 1999, the company expanded its facility to 13,000 sq. ft. and acquired additional assembly machines.

Resource-constrained CM Acquired

NORWALK, Ohio - EPIC Technologies Inc. was acquired by TMW Enterprises and Crawford-Greene LLC. EPIC will join an affiliate network of regional CMs, with approximately 900 employees in the United States and Europe and targeted sales in the $130 million range for 1999.

Solectron Is in the Zhone

MILPITAS, Calif. - Zhone Technologies Inc. and Solectron Corp. announced the signing of a letter of intent for Solectron to become Zhone`s virtual supply-chain partner. The proposed transaction is designed to allow Zhone to focus resources on the design and development of new products by having Solectron provide product life cycle and supply chain management.

Express Manufacturing Inc., Santa Ana, Calif., installed CR Technologys CRX-2000 automated X-ray inspection system to inspect BGAs and microBGAs on PCBs.

Express Manufacturing Inc., Santa Ana, Calif., installed CR Technology`s CRX-2000 automated X-ray inspection system to inspect BGAs and microBGAs on PCBs. The system will reportedly increase time-to-market requirements of the company`s customers by enhancing its inspection capabilities for higher end packaging techniques.

Flux and Cleaning

The selection of flux and cleaning processes plays a critical role in the manufacturing yield and product reliability of electronic assemblies. The subjects of flux and cleaning are interrelated - one cannot be discussed without the other. The function of flux is to remove oxides and other nonmetallic impurities from the soldering surface and prepare a clean surface for joining. After soldering, cleaning may be required to remove flux residues.

BGA Reballing

When working with ball grid arrays (BGA), two of the most commonly asked questions are, "Can I reuse components?" and "How do I reball the components?" While these are obviously relevant concerns, there are very few companies that are currently reballing. The following areas should be considered before starting.

NCMS Lead-free Solder Project

This article summarizes the results, conclusions and recommendations of a four-year-long study of alternative solder materials.

How to Profile a PCB

An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.

SMT Material Handling Support Systems

Modular storage and transport equipment can maximize production line efficiency and provide flexibility to support future work-flow changes.

Optimizing Performance in Reflow Soldering

A new method of managing process gases in reflow ovens offers precise control over the thermal process, effective removal of flux and good solder joint quality.

Preventive Maintenance for ATE Fixtures

This article describes one company`s technique performed as preventive probe maintenance (e.g., replacement of degraded probes) of HP3070 automated test equipment (ATE) fixtures. The general concept can be applied to other ATE systems/fixtures, as well.

APEX 2000

The IPC SMEMA Council`s Electronics Assembly Process Exhibition and Conference (APEX), taking place March 12 to 16, 2000, in Long Beach, Calif., was organized in response to an industry need for a trade show that is cost-effective and fair for exhibitors, and highly focused on the products and technology of the electronics assembly industry. APEX will feature all segments of the industry, from bare boards to tested assemblies, and is said to be the only show in North America that will showcase m

Contest Winners

The IPC recently announced the first six winners of its APEX Trivia Challenge, a contest run through the APEX Web site, The winners were the first to correctly answer three questions pertaining to IPC and the electronics manufacturing services industry. Each received a Palm V Connected Organizer.


Sixteen day-long tutorial sessions are planned to address the spectrum of electronics assembly, from the basics of SMT to advanced packaging materials. They will be held March 12 from 8:30 a.m. to 4:00 p.m.

Paper Awards

Two technical paper awards will be given at APEX. One award will be given to the author(s) of the best overall paper at the conference, while the second will be awarded


The push toward lead-free electronics assemblies is a main focus of APEX. At the center of the IPC`s efforts to educate the industry about the lead-free issue is the development of the IPC Roadmap for Lead-free Electronics Assemblies. Begun at IPCWorks, the roadmap provides guidelines for implementing lead-free soldering processes. Industry representatives will have an opportunity to provide input during APEX at a roadmap meeting taking place March 16.


Of the more than 50 workshops and tutorials taking place at APEX, nearly 25 are being offered by the IPC for the first time. Every aspect of electronics assembly processes is to be covered by these workshops. "Given its importance in the industry, process control measures and quality assurance are two topics highly represented in this program," said IPC vice president of professional development John Riley.

Telecom Technology Challenges Manufacturers

The intense growth of high-tech industries such as telecommunications has forced many equipment manufacturers to rethink their business strategies to meet the increased demands placed upon them by rapidly changing technology.

Fume-purification System

The company has added a vacuum control capability to its Purex 8000 series fume extraction systems. By automatically keeping airflow constant, this reportedly allows accurate temperature profiles to be

Air-sampling Units

The Model 2000B and 2100B air samplers allow quality engineers to simultaneously and independently sample air and monitor environmental conditions around their fabrication facilities at one to four separate locations for a specified time period automatically. The products are capable of providing four different samples, simultaneously, that can be analyzed for trace inorganic and


The company`s improved standard gooseneck design reportedly does not sag or sway for environments requiring a vibration-free light source. The gooseneck is covered by a PVC sleeving that is said to resist damage and wear. This new design is said to free operators of the strain and stress of having to physically adjust to their equipment. The lamps are ergonomically designed for ease-of-use and engineered for heavy production schedules.

Photoetched Shielding Components

The company uses photoetching for cost savings to manufacture board-level shielding components, such as custom fences with removable covers. This process is said to improve design flexibility, shorten lead times and eliminate hard tooling costs. Photoetching also reportedly allows the fabrication of board-level shielding components with close tolerances that cannot be duplicated by other methods. Fences, covers and mounting pins can be designed in any configuration, as can through holes and slot

Pressure-formed Housing

These pressure-formed housings, which are designed to protect PCBs, reportedly are manufactured from a pliable, heavy-gauge plastic called 0.060" Kydex. Each housing is pressure-formed from roll stock, hole punched and routed for air ventilation holes, line-bent to ensure a 360∞ enclosure, fitted with "canoe-clip" fasteners and final packed in a custom package.

LGA Socket

The cLGA socket system reportedly enables solderless chip-to-board and board-to-board interconnection. This solderless system is said to allow the user to avoid the termination and reliability problems caused by thermal expansion in high-pin-count devices. The socket uses a conventional BeCu contact with 30 µin Au over Ni plating. This low-profile connector design yields a 0.94 nH inductance. When fully mated, it has a total deflection of 0.012" with an average of 50 g normal force per cont

Surface Mount Adapters

The company now offers several new sizes of the PolyPod surface mount adapters for QFP packages. The QFP surface mount base can be soldered to a PCB and connected to emulators or logic analyzers, and can be used as a socket. The surface mount base reportedly has options for receptacles that can be used to interconnect to any test system, or the receptacles can be used to add height to extend the test equipment off the board. A socket cover also is available.

Reflow Process Control

Profile Wizard is designed to simplify process control by recording optimized thermal processing profiles, then comparing them minutes, hours or days later to oven performance. Its array of three dual sensors is width adjustable from 3 to 26" to match the board width. The product rides on a belt or edge-rail conveyor to profile the edges and center of the oven, providing a complete thermal picture. Features include repeatable, reliable temperature sensors that reportedly will not degrade with ti

Reflow Ovens

The first in a series of high-performance reflow ovens designed for the semiconductor market is the Bravo, which is said to feature several new design innovations that provide the performance required for high-production manufacturing environments. The system reportedly provides operators with full control over the reflow system through a user-friendly operator interface, and it is the air-only version of this series of reflow ovens. A new convection heating technology preheats air at the intake

Squeegee Blades/Holders

Owners of deHaart Technologies screen and stencil printing machines can obtain squeegee blades and holders from this company. These blades and holders are said to meet or exceed the company`s OEM specifications and are "drop-in" replacements. The OEM squeegee blade line includes polyurethane blades, flat metal blades, adjustable-angle metal blades and squeegee blade holders for deHaart as well as other industry manufacturers, including DEK, Fuji, MPM, Panasonic and SMTech. The polyurethane squee

Mini Fume Extractor

The Miniarm FX-32 is a small fume extractor arm that is said to have a reach of more than 3`. It features a flexible, self-articulating plastic tube with a built-in damper and swivel function. The product can be mounted to the wall, ceiling or directly to the workbench for a variety of applications in the workspace or laboratory. Various fume hoods and nozzles reportedly make this arm a solution for a workspace that has problems with smokes, fumes or chemicals. Also available is a light package


Dynasolve 2000 Plus is a solvent designed for the removal of photoresist used during photolithography. It removes the photoresist and hinders the redeposition of the material. It is suitable for use in the production of ICs, semiconductor components, PCBs and other electronic components. This product is said to be safer than many currently used.

Digital Microscope

Micro-COMBICON ultra-high-density pluggable PCB terminal blocks use a spring-cage connection for fast and reliable termination with a 2.5 mm (0.098") pin spacing. The header, which mounts to the PCB, is available in a horizontal (MC 0.5/...-G-2.5) or vertical (0.5/...-G-2.5) configuration. The plug has front-entry terminations with individual test probes. The blocks are polarized and keyable to ensure a proper connection. The series accepts a #20 AWG wire and is available from 2 to 12 positions.

Process Control

Continuous quality improvement is a process control system that utilizes in-line inspection to help lower PCB assembly costs.

Publishers Executive Council Interview

SMT Magazine`s Publisher`s Executive Council consists of 38 electronic industry executives hand-picked by our publisher. They share their expertise and insights with our editorial staff and act as a sounding board for new ideas and concepts. These individuals also contribute much to the industry in general, working as leaders within their companies. This month`s Publisher`s Executive Council Interview features one of the industry`s leading innovators Surface Mount Equipment Manufacturers, Associ

Bonding System

The multi-use Model 860 Omni bonding system can be configured to bond flip chips as well as laser diodes and eutectic bonded die. The joystick-controlled system aligns and attaches die sizes from 0.006" square to 1" square at a throughput rate of up to 200 placements per hour with placement accuracy of ±5 µ. The basic platform is loaded with standard features such as an extend-retract cube beam splitter viewing system with illuminators and precision servo-motor- driven Z-motion with cl

Coordinate Measuring System

The YP20 is a 3-D coordinate measuring machine for close-tolerance parts applications. The system combines non-contact, auto-focusing optical/laser sensing technology and PC-based numerical control to provide 3-D inspection, measurement and analysis of microscopic surface features on ICs, PCBs, computer hard disks and machined materials. Operation within a Z-axis measurement range of 20 mm, it uses a semiconductor laser with reflective-activated focusing techniques to read and measure the workpi


The County counters and scales line counts all types of components. It is a microcomputer-based instrument that counts taped radial, axial and SMD components with added options. Accessories such as reel supports and handles are available. The S series is a motorized counter for taped SMD components. Motion control preset and memory functions can be operated by an interactive display while the system status is monitored by LEDs. The W series of electronic counting scales comes with digital displa

Convection Oven

The SMRO-0405 full-convection reflow system includes Windows 95/98 Oven Manager software to permit unlimited, real-time temperature profiling; continuous process status updates; historical overlay comparisons; program storage; and remote operations. The software also allows users to meet ISO 9000 and end-user documentation requirements. The oven has a 16" wide stainless-steel mesh belt, eight heating zones and dual cooling zones.

Gap-filler Pads

These conformable, high-heat-conducting gel pads are said to fit and adhere to most shapes and sizes of components, including protrusions and recessed areas. Thermal impedance of devices mounted on substrates or at heat-sink junctions is said to be eliminated, yielding higher temperature transfer gradients. Four series, each with a different construction, include a hardened-top surface or mesh reinforcement for demanding applications.

Fluid Dispenser

Model 1500DV is an air-powered dispenser that reportedly combines precise, repeatable fluid deposits with a vacuum pickup pen that simplifies placement of small, hard-to-handle components. Adhesive, solder paste or other assembly fluid is contained in a disposable barrel that the operator holds like a pen. A "teach" function allows the size of the first deposit to be set. With shot size stored in memory, the operator places the dispensing tip in position and presses an electric foot pedal to mak

Micro Fume Extractor

The Micro Arm Kit removes fumes from small solder pots and soldering under vision systems. The jointed arm can be twisted, turned and repositioned. Its 2" diameter capture area can be used for tip extraction, and the arm is made of high-temperature, ESD-safe plastic.

Epoxy Adhesive

Metregrip 355 is said to be a high-strength, low-viscosity, two-component adhesive system with a long working life. It was developed for bonding phenolic parts to steel or aluminum housings in the space shuttle. Reportedly easy to use in most structural-adhesive applications, it can be cured with both heat and room temperature. The adhesive reportedly has high tensile lap-shear values of more than 2,500 psi on aluminum, shows adhesive properties to a variety of substrates (e.g., brass, steel, co

Conductive Adhesive

The 118-09 is a two-component, solvent-resistant, electrically conductive ink, coating and adhesive that is said to be suitable for screen printing printed circuit lines. In addition to being solvent-resistant, the product also is flexible and capable of being cured at low temperatures. It reportedly features adhesion and low ohmic contact to indium/tin-oxide-sputtered glass and polyester. The adhesive provides adhesion to Kapton, Mylar, polycarbonate and other substrates.

Hand Tools/Assembly Fixtures

The MK Series pneumatic hand tools cover a number of options: cut and layover, cut and swage, or cut only. They are designed for post-component assembly prior to soldering. They are lightweight and offer ergonomic design to prevent operator fatigue. Unlike side cutters, the off-cuts from these tools drop to the PCB, eliminating flying lead waste. MK-3 tools feature trigger-activated, scissor-type blades. The MK-6 tools feature trigger-activated, V-type blades. Also available are the 360/380 "fli

Slides and Stages

The AccuSlide Model 2HB is a low-profile, pre-engineered, pre-assembled, ready-to-install linear-motion stage with pre-aligned AccuGlide linear guides and an integral pre-loaded ball-screw assembly. Available with a variety of ball-screw diameter and lead combinations, it can integrate with the company`s AXI-PAK motion control packages for a complete turnkey motion control solution. It is suitable for precise assembly, test and automation applications where rigidity and accuracy are required. Th


The TechBench with Sub Monitor Alcove is an ergonomically designed product that holds monitors in a recessed fashion within the bench work surface. This workstation is said to provide ergonomic storage of tools and equipment and contains an integrated cable management system. The alcove positions the rear of the monitor down-

Solder-tip Cleaner

The Model ST1 is a battery-operated solder-tip cleaner. Two rotating "fybRglass" wheels clean oxidation and hardened flux residue from solder tips. Many tip configurations, including chisel, cone, spade and bevel, may be cleaned. The wheels are fully adjustable to accom-

Hand-/Glove-washing System

The CleanTech 400 automatic hand and glove washer includes the following features: no-touch-faucet options, a wall-mount option for space-saving benefits and a water-resistant design for safe, wet environment installation. Made of cast polymer and polyethylene construction, the system includes a stainless-steel plumbing plate and solution-tray enclosures.

Filtration System

The Ulti-Kleen filter is designed for the critical filtration in the IC-manufacturing process. This all-fluoropolymer filter is said to be the first and only of its kind to offer "guaranteed extractable levels." It is specifically targeted for use in ultra-high-purity chemicals of semiconductor devices with line widths of 0.25 µm and below. The filter is said to be the most advanced all-PTFE/PFA filter cartridge available to the semiconductor industry providing low-extractable levels guaran

Spray Nozzles

The company added hollow-cone-spray tips and a mini version to its line of ProMax Quick- Jet nozzles. The Quick WhirlJet hollow-cone-spray tips are available in standard and wide angles. The Mini ProMax Quick VeeJet spray nozzles measure just under 1" (2.54

Shot Meter

The Model 8300 Shot Meter uses controlled pressures of 0 to 30 psi and handles a variety of fluids ranging from watery adhesives to solder paste. A vacuum pull-back feature is said to eliminate messy and potentially harmful stringing. It oper-

Flip Chip Service

This manufacturer of advanced electronics products added the capability to handle flip chip parts. The modular placer has the ability to pick, vision inspect, and place flip chips and other bump-interconnection devices such as BGAs. The placer also applies flux during the process.

Interconnection Seminar

Held Wednesday, March 1, 9:00 a.m. to 4:00 p.m., this seminar, sponsored by the International Institute of Connector and Interconnection Technology, focuses on the basic connector areas needed for the everyday challenges of interconnection design, selection, evaluation and procurement. Taught by industry-recognized experts, it presents practical knowledge that will cover material selection through functionality, testing and performance criteria.

Thermal Labeling System

The TLS2200 thermal labeling system has been upgraded. This portable printer`s upgrade includes continuous label printing and PC compatibility. Free upgrades are available to existing customers and future upgrades will be Web-accessible. Continuous labeling features fixed length and banner printing options. The system can print up to 50 characters using the largest font size on continuous labels up to 4 ft long. The fixed length labeling option allows customization of the length of the label des

Flip Chip Underfill

Loctite 3567 is an epoxy-based liquid underfill reportedly compatible with polyimid-passivated flip chip, CSP and BGA assemblies. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150° to 165°C and penetrates gaps as small as 0.001". The underfill can be removed by heating for one minute at standard rework temperatures of 210° to 220°C where the epoxy will begin to partially decompose. The component can be removed when torque is applied.

AOI System

The AIMS AOI systems have been revamped. The G5 received a new board-handling system that can handle very thin boards and employs full-rail board holding. The system employs a custom engineered telecentric optic that allows inspection of 0201s and 0.012" pitch components. The G4 was redesigned to improve ergonomics, sustainability and repeatability. Both systems have new illumination systems.

Socket Adapter

The 321 and 370 pin adapters convert BGAs and other small fine-pitch processors to a Socket 7-compatible PGA footprint. Their design allows for component placement on the bottom side of the interposer directly underneath the processor.

Filter Units

Filter units extract and purify fumes from hand soldering, wave soldering, reflow/ curing, soft beam soldering and laser applications. All units feature low noise level, filter monitors and various filter options. Other products include exhaust hoods and downdraft tables for the removal of dross dust during wavesolder maintenance.

Linear Motors

The range of ThrustTube tubular linear motors includes modular X-Y solutions, single-rail linear motor modules, shielded modules and ironless motors. Ironless motors eliminate force fluctuations to deliver smooth motion. Shielded modules reportedly have high-performance integral bellows and are available for linear motor applications up to 4 m per second velocity and 4 G acceleration. Single-rail modules feature cross sections similar to conventional ballscrews.

In-line Inspection

The XRV system is an automated in-line PCB inspection unit that combines visual and X-ray inspection. The system uses CCD cameras to check for missing or wrong components, misplacement, polarity and other visually evident defects. The integrated X-ray capability checks for BGA, microBGA, flip chip, J-leads and other hidden solder connections that cannot be seen visually.


Tacky Mats remove contamination from shoe heels and soles, and from mobile cart wheels. The mats come in packages of 30 sheets. Cleaning and washing of mats is said to be eliminated. Corner tabs are numbered to identify remaining sheets. Four sizes are available: 18 x 36", 18 x 45", 26 x 45" and 36 x 45".

No-clean Solder Paste

Delta 691 no-clean solder paste is reportedly formulated to provide excellent tack force, a tack time greater than 48 hours, 24-hour stencil life, 72-hour open time and prints up to 8" per second. Post-soldering residues are clear and pin testable. It has a nine-month refrigerated shelf life and can be used in an air or nitrogen reflow environment.

In-line Bonders

Automated in-line systems include the Model 3500-II die bonder, CBT 6000 high-speed ball bonder, 2470-V wedge bonder and 2460-V ball bonder. These machines` capabilities reportedly include high-precision die placement, relative-to referencing, and precision wedge and ball bonding with constant wire length capability.

Tilt Adjustment

The Task Control backrest tilt mechanism provides seated ergonomic tilt adjustment for a chair backrest with the touch of a paddle. This feature will be standard for chairs in the 1P, 1Q, 4L, 4M, 4P, 4V, 4X, 4Y, ERA, EOC, MOC, TOC, CHC Series and eight chairs in the Drafting Series. Each chair will be equipped with two seat control paddles that will allow chair and backrest adjustment from a seated position. The front paddle will adjust seat height and the back paddle will adjust backrest tilt.


The NT-216 tape-and-reel system handles all discrete components up to the D-Pak size and all small passives with throughput up to 30,000 parts per hour. It accepts input from vibratory bowl feeders, lead frames and tube feeders, and outputs to tube or to tape widths from 8 to 16 mm. The system features a 16-position rotary turret that is synchronized with a rotary table used for laser marking and inspection. This vision system inspects for mark presence and lead integrity. It is able to perform

Dispensing Pump

The DV-7000 Heli-Flow pump provides consistent performance through its rotary positive-displacement auger design, and is capable of producing dots smaller than 0.38 mm with dispensable-grade solder pastes. The pump provides dispensing of medium- to high-viscosity fluids and pastes for applications including small-dot dispensing of solder paste, surface mount adhesives and silver epoxy. The pump`s closed-loop motor control with encoder feedback can be reversed to create a clean fluid cutoff.

Micro-abrasive Blasting

Using a variety of blasting media and small nozzles in the 0.018 to 0.080" range, this pencil-blast process offers solutions to a variety of production problems. Applications include cleaning contaminants and oxides from ceramic insulators and components, removing paper diffusion mask residue from silicon substrates, cutting slots and shapes in fragile materials such as silicon wafers and crystalline substrates, material removal of fine microburrs from waveguide packages, and surface preparation

Salt Lake City Gains Design Center

American Microsystems Inc. (AMI) opened a new design center in Salt Lake City to increase its mixed-signal and analog design talent. The center will also contribute to the ongoing development of precision analog functions supporting the company`s ASIC systems solutions. The center will be run by Donald Comers, Ph.D., who brings more than 20 years of experience in academics and industry. As director of the design center, Dr. Comers will report to the vice president of AMI`s Home, Office and Indus

New Brunswick Industries, El Cajon, Calif., announced that continuing growth is forcing the company out of its present 6,500 sq. ft. facility.

New Brunswick Industries, El Cajon, Calif., announced that continuing growth is forcing the company out of its present 6,500 sq. ft. facility. Construction of a new 20,000 sq. ft. facility has already begun.

Lead-free Solders and Their Properties

Along with thermal, mechanical, creep and fatigue, melting point is one of the most important solder properties. Table 1 provides a list of lead-free solders that have been available for some time.1

Surface Mount Audio Transformer

The SEF Series of audio transformers offers a basic footprint that reportedly occupies less than 34 sq. cm (21.5 x 15.4 mm) and has a profile height of 7.8 mm. Frequency response is rated at 0.25 dB in the range from 200 to 4,000 Hz. Longitudinal balance is 60 dB over the same range. The transformer operates between -45 and 7 dB and is designed in its default configuration to meet FCC specifications under Regulation 15 for atmospheric noise. Primary impedances are all 600 W at 1 kHz. Secondary i

DC/DC Converters

The MT Series of high-density DC/DC converters can accommodate 12 V inputs for use in the battery power systems architecture becoming popular in portable equipment. The devices are available in metal-cased, full-brick, 150, 100 and 50 W versions. The converters are designed to achieve operating efficiencies as high as 90 percent with total isolation of input, output and baseplate. The series can be obtained with output voltages of 3.3, 5, 12, 15, 24 and 28 VDC.

SOT-323 Package

The Super323 Series bipolar transistors are designed to provide low-loss, high-power performance in miniature SOT-323 surface mount packaging. The devices handle collector currents between 1 and 1.5 A and can dissipate power up to 500 mW. Developed using an enhanced matrix geometry, Superb emitter process and a specially designed lead frame, the transistors feature NPN and PNP complementary types that exhibit a voltage as low as 0.2 V for a collector current of 1 A. These devices reportedly offe

Integrated Switcher

The TNY256 is designed to provide a cost-effective, energy-efficient solution for a wide range of applications. It delivers up to 11 W from a universal input and up to 19 W from a 230 VAC input. Auto-restart is said to lower secondary component cost by reducing short-circuit current. Line under-voltage sense is said to prevent voltage glitches during power up or power down. Frequency jitter is said to lower EMI.

15 and 25 W Converters

Now available with UL 1950 recognition to operational level, the NPH25 25 W and NPH15 15 W DC/DC converters are said to be ideal for the telecommunications and industrial distributed power systems where approved levels of isolation are demanded. The converters reportedly are compact, integrated wide-input devices featuring efficiency levels of up to 90 percent and power densities as high as 1.42 W per cm (23.4 W per inch). Devices in the 25 W series have footprints of 50 x 35 mm, while the 15 W

RF Shielding

This line of photo-chemically etched RF shielding cans has a patented removable cover designed to allow users to replace or repair internal components without damaging the surrounding shield. An etched line on the surface is broken to minimize RF leakage. The tab connecting the lid to the RF shield can be snipped and resoldered to minimize downtime. The RF shields are available in brass and 10-10 steel with solder plating, and can be custom designed to meet customer requirements. The RF shields

Ultra-miniature SMD Crystal

The FX532A SMD ceramic crystal measures 5.0 x 3.2 mm with a 1.0 mm profile. It has a frequency range of 14 to 40 MHz, and a frequency tolerance of ±100 ppm. The JITO-2 oscillators with reduced phase jitter reportedly offer a 67 percent reduction in phase jitter over competitively programmed oscillators and, in some frequency ranges, compare favorably with fixed-frequency oscillators. They are said to make microprocessor-based systems less prone to bit errors and to increase the reliability


Phase noise in this new line of CZM and CSM SMT VCOs has been improved to -130 dBc/Hz at 100 kHz, down from -120 dBc/Hz. They are designed to deliver -15 dBc (typical) harmonic suppression and a linear wideband tuning range. The series is available on tape-and-reel packaging in frequencies ranging from 45 MHz to 3.0 GHz. They are compatible with applications where high frequency and linear modulation are required, including cellular, PCS, WLAN/WWAN and wireless modems.

Filter Modules

The B6001, B6003 and B6005 filter modules are specifically designed to meet the requirements of the HomePNA 1M8 PHY specification for the 1 Mbps technology. All three products have been UL 1950 certified for supplementary insulation requirements. The B6001 is a 14-pin though-hole part that incorporates 10Base-T filtering and isolation. The B6003 and B6005 are both 16-pin surface mount parts. The latter also has 10Base-T filtering. The bandpass filter portion is designed to ensure the 6 to 9 MHz

Interactive Odd-form Component Catalog Debuts

The Interactive Odd-form Component Catalog, developed by Universal Instrument Corp.`s Odd Form/Final Assembly (OFA) Div., enables users to determine odd-form application feeder and placement head tooling by searching component category, part number or photo.

Low Drop-out Voltage Regulators

The GMT-72XX line of micro-power low drop-out voltage regulators is designed to provide reliable and efficient solutions for mobile phones, palm computers, pagers, global positioning equipment and other portable applications. Compared to conventional LDO ICs, the new regulators are said to perform at low quiescent operating current, with significantly lower drop-out voltages. The voltage regulator family was specifically designed to operate in noise-prone, switch-mode environments. It reportedly


The NEPCON West conference offerings are separated into several types of classes: Tutorials, Professional Advancement Courses, Workshops and Technical Sessions.

Y2K Assembly Line

The Y2K assembly line is designed to allow attendees to witness a component attachment process at very low temperatures using a solder alternative. The line features bottomside in-line placement of bar-code labels, as well as the deposition of a solder alternative for the mechanical attachment of quad flat packs (QFP), BGAs, a flip chip and standard surface mount devices (SMD). The devices are cemented in place with a low-temperature heating process, and the flip chip device is underfilled with

Lead-free HDI Assembly Line

The evaluation and use of lead-free process materials has gained a lot of interest throughout the industry because of legislation that would ban lead use in the electronics industry. The lead-free HDI assembly line demonstrates the attachment of SMDs, BGAs, QFPs, and CSPs using a lead-free solder, lead-free component metallizations and a lead-free PCB pad finish for the top- and bottomside attachment processes.

PCMCIA Assembly Line

The PCMCIA line highlights the assembly of a high-volume consumer electronics product that incorporates many high-technology facets, including advanced design techniques, a variety of high- pin-count component packages and die, along with cutting edge PCB fabrication technology. The assembly equipment is outfitted for processing the thin laminate that is typically used in PCMCIA panels.

Lead-free PBGA Assembly Line

The PBGA line features the full population and assembly of a BGA lead-frame strip containing the circuitry and bonding pads for four PBGA devices. The die-attach process demonstrates the population of a laminate strip containing four PBGA packages containing gold bonding pads for gold-to-gold interconnect COB wire-bond die and the BGA package. The wire bondable die is attached with a silver-filled adhesive, followed by thermal cure, plasma clean and die wire bonding to the pad sites for each dev

Area-array Assembly Line

The Area-array line features the assembly processes, materials and methods necessary for forming CSPs. The die-attach process shows the population of an organic strip containing multiple package interconnects with chip-on-board (COB) wire-bond die for the formation of CSPs. Processes featured include dispensing die attach and subsequent device placement with a single machine, curing the die-attach adhesive, plasma cleaning the wire-bond pad sites, ball-wedge gold capillary wire-bonding, dispensi

Low-volume Batch Assembly Line

The low-volume batch line demonstrates the processing of flip chips, CSPs and PBGAs in a low-volume production line using low-volume production and prototyping equipment.

Contract Manufacturing Demonstration Line

Located in the Contract Manufacturing Demonstration Area in Hall C, the Contract Manufacturing Demonstration Line is a complete SMT line that produces live products for one of the participating contract manufacturer`s customers.

Pick-and-place Evaluation Center

The Pick-and-place Evaluation Center, located in Hall B, provides a strategic approach to evaluating assembly pick-and-place equipment. Four high-speed placement machines are on display, set up side-by-side, with third-party technical experts providing in-use feedback and interpretation of manufacturers` published machine specifications.

Keynote Addresses

Tuesday, February 29, at 8:00 a.m., John Madden, sportscaster/analyst, author and football coach, will kickoff NEPCON West 2000 with a keynote speech.

Packaging Session

The packaging session, Component Packaging for the 21st Century, will be held Tuesday, February 29, from 1:00 to 3:00 p.m. Packaging experts address the issues PCB assemblers need to understand to build the next generation of electronics products, including the impact of area-array packaging on the assembly floor, thermal management concerns, the effects of lead-free solder on component packages, and more.

Contract Manufacturing Senior Executive Forum

Presented by Technology Forecasters Inc. on Monday, February 28, from 7:30 a.m. to 7:00 p.m., this forum will be chaired by Pamela Gordon, certified management consultant and president of Technology Forecasters Inc.

Advanced Packaging Symposium

Held on Monday, February 28, from 9:00 a.m. to 4:00 p.m. and chaired by John Lau, Express Packaging Systems, the symposium will address wafer-level packaging and interconnection.

Contract Manufacturing Symposium

Presented by Sharon Mecum and Dr. Charles Mullen of Technology Forecasters Inc., "The Contract Manufacturing Game: Skills, Tools, and Insights for OEMs and Contract Electronics Manufacturers," will be held Tuesday, February 29, from 8:30 a.m. to 2:30 p.m.

ESD 101: Protecting Parts and Profits

Walk across the carpet, reach for the doorknob and a spark is created. That phenomenon is known as electrostatic discharge (ESD). An amount of static far below a human`s level of feeling can kill many of today`s sensitive electronic parts. It is crucial that anyone who handles electronic parts and assemblies has a serious awareness of these potential problems, and is taught proper techniques to avoid costly losses of hardware and reputation. ESD training is guaranteed to give a high return on in

Distribution Supply Chain Management

Suppliers continue to forge strong links in the value chain by adding new functions and processes. Many of these companies believe that their efforts at efficiency have tapped all the distribution value that the supply chain has to offer. They could not be further from the truth.

New Player in CM Market

NORMAN, Okla. - Hitachi Computer Products (America) Inc. announced it has established a contract manufacturing group to fabricate electronic components for small- to mid-range businesses. The Hitachi OMD CM group will operate in the company`s state-of-the-art production facility in Norman, Okla.

CMs Continue Strong Growth in 1999

NORTHBROOK, Ill. - The U.S. contract manufacturing (CM) market increased 21.5 percent in 1999, to $27.4 billion, according to a report from the IPC - Association Connecting Electronics Industries. The report included 66 companies with combined sales of $11.3 billion - 41 percent of the total estimated CM market. Computers and communications continue to be the largest markets for CMs, accounting for 53.4 and 26.8 percent of total 1999 sales, respectively.

CM Entrepreneur Wins Award

NEW YORK - Allen J. Berning, founder of Rochester, Minn.-based PEMSTAR Inc., was named the 1999 National Ernst & Young Entrepreneur of the Year in the Emerging Entrepreneur category. In five years, PEMSTAR has grown from a startup, into a $165 million company focused on high-precision electromechanical engineering and contract manufacturing, with facilities in six countries.

Flash Named to Prestigious List

FREMONT, Calif. - Flash Electronics Inc. was named to the IWGC 25 List for 1999. To be eligible for the list, which honors the 25 most successful small manufacturing firms in the United States, companies must have fewer than 500 employees, been in business for at least three years, be independent and have headquarters in the United States.

Four OEMs Choose Siemens

JOHNSON CITY, Tenn. - Omnipoint Corp., Panja, Wegener Communications Inc. and Woodward Automotive Products selected the Electronics Manufacturing Center (EMC) of Siemens Energy & Automation Inc. to provide printed circuit board assemblies (PCBA) and associated services. For Omnipoint, the EMC will provide PCBAs on a turnkey basis for the company`s Redhawk and Eagle wireless data modules. As part of the agreement, Siemens will also build, test and ship final product to Omnipoint`s worldwide custo

Personnel Moves at Manufacturers Services

CONCORD, Mass. - Manufacturers` Services Ltd. announced three personnel moves. Eugene Bullis was named CFO and executive vice president; Manuel Ruiz is now vice president of program management; and John MacInnes was appointed vice president and treasurer.

Solectron Forms Alliance, Acquires Canadian Repair Facility

MILPITAS, Calif. - Solectron Corp. has made a number of announcements in recent months. First, the company signed a definitive agreement with Acer Inc. to form a strategic alliance to provide global design, manufacturing and service solutions for OEM-branded PCs, servers and workstations. As a result of the alliance, customers will be able to access the extensive technology, motherboard and system-level design services, as well as global supply-base, manufacturing, distribution, logistics and Gl

Calibration Services Acquired

LOUISVILLE, Ky. - Sypris Solutions Inc. announced that its subsidiary, Bell Technologies Inc., signed a contract to purchase the Calibration and Repair Service business of Lucent Technologies. This purchase, expected to close by the end of last year, will combine the mobile calibration service operations of Lucent with the calibration and repair operations of Bell. The Lucent organization services its customers from field offices in Union, N.J., and Franklin, Tenn., as well as from 15 mobile cal

Flextronics Expands Hungarian Facility

SAN JOSE, Calif. - Flextronics International Ltd. is expanding its European manufacturing facilities in Tab, Hungary. This state-of-the-art facility is expanding to support the company`s growing customer base in Central and Eastern Europe, as well as to meet the needs of current customers.

Change the Solder Alloys and Laminate

The Scottish government has announced plans to invest $66.6 million toward creating a unique semiconductor business cluster that would make Silicon Glen a worldwide technology hotspot.

Investment in AOI Pays Off

An AOI machine with color highlight and zoom capability helped one CM improve its yield for critical-use end customers.

Growth Must Be Managed

SAN ANTONIO - The prodigious growth in the contract manufacturing industry has led to stability difficulties for CMs. According to a recent report from Frost & Sullivan, managing growth is essential for CMs to maintain control of operations.

Do Mergers and Acquisitions Make Everyone Happy?

ALAMEDA, Calif. - More than 100 mergers, acquisitions and strategic alliances between CMs and other companies were concluded during 1999, according to a new report from Technology Forecasters Inc.

Flip Chip is Production-ready

AUSTIN, Texas - XeTel Corp. announced that it has achieved production-ready status for board assemblies using 0.4 mm-pitch flip chip packages. Flip chip technology will reportedly enable smaller, thinner, and lighter products in the communications, computer and other electronics industries.

Two Facilities Acquired

ANDOVER, Mass. and PORTLAND, Ore. - Celestica Inc. completed its acquisition of Hewlett-Packard (HP) Co.`s surface mount center in Andover, Mass. The acquisition expands Celestica`s service offerings and brings its New England presence to more than 700 employees. The Andover operation will provide additional PCB assembly capabilities to the company`s service offerings in the Northeast United States, which currently includes systems integration, embedded systems design, logistics management and m

Largest Combination in the Industry Announced

SAN JOSE, Calif. and NIWOT, Colo. - Flextronics International Ltd. and the Dii Group Inc., which had combined sales of more than $3.8 billion in the last 12 months, signed a definitive merger agreement for a tax-free, stock-for-stock merger. The combined company will operate under the Flextronics International name, and will reportedly be the fourth largest provider of electronics manufacturing services, with strengths in telecommunications, consumer electronics, printed circuit board (PCB) fabr

Rick Rowe was appointed chief executive officer of MCMS Inc., Nampa, Idaho.

Rick Rowe was appointed chief executive officer of MCMS Inc., Nampa, Idaho. Prior to joining the company, Rowe was general manager of Honeywell-Measurex global system business, headquartered in Cupertino, Calif., with operations in Ireland, Germany, Finland, Japan, Asia-Pacific and Latin America, along with six North American operations.

Lead-free Solder

Tin/lead solder is the most commonly used solder for electronics assembly. How-ever, in the last year, there has been an industry-wide push to convert to lead-free solders. The reason behind the push is the increased awareness concerning lead use and its adverse effects on human health.

IRC Commits to MIL-Spec Market

Resistor manufacturer, IRC, has strengthened its commitment to the military market by ensuring that its lines of resistive products are qualified for military specification (MIL-Spec). Specializing in products for rugged and demanding applications, IRC offers one of the largest lines of military-approved electronic components for military, radar and aerospace.

First-pass Success Soars with New Design Method

Touting successful first-pass functional silicon rates of 90 percent and higher, American Microsystems Inc. introduced its MS-Master design methodology for submicron mixed-signal ASICs. The methodology is enabled by behavioral models that are generated from SPICE simulations and verified to produce working silicon on the first pass, drastically shortening design simulation time and helping customers get products to market faster.

2-D PSDs

The S5990-01 and S5991-01 surface mount 2-D position-sensitive detectors (PSD) reportedly provide detection over a large active area. Their pin-cushion-type detectors are said to be ideal for use in pointing devices such as computer mice and track balls, as well as for position measurement. Active area is 4 x 4 mm for the S5990-01 and 9 x 9 mm for the S5991-01. Position detection errors are reportedly held to ±70 µm for the former and ±150 µm for the latter.

Synchronous FETKY

Designated the IRF7807D1 and IRF7807D2, these low-voltage 30 V FETKYs are said to enable circuit designers to reduce the required footprint of the synchronous MOSFET solution, thereby increasing power density while providing the same efficiency and performance of an equivalent discrete solution. The D1 is in an SO-8 package and reportedly provides RDS(on) of 17 mΩ typical at Vgs = 4.5 V for on-state conditions. The D2 offers the same on-state performance, but integrates a 3 A-rated Schottky

N-channel HDMOS

This family of MOSFETs reportedly offers a combination of low on-resistance and low gate charge, and is said to provide optimum performance and high efficiency for switching applications such as DC/DC conversion. The HDMOS range includes eight N-channel devices. With drain source voltages up to 30 V, they are suited for low-voltage switching applications. On-resistance ranges from 40 up to 180 mΩ maximum. On-state losses are minimized, and they are said to improve efficiency in low-frequenc

Audible Signal Devices

The Mallory Sonalert II surface mount audible signals are said to have extremely small dimensions and reportedly are ideal for compact electronic products and systems such as pagers, portable telephones, scanners, computers and computer peripherals, hand-held instruments, and radar detectors. All offer high sound pressure levels (SPL) for such small units. The family consists of eight different models. Two include built-in drive circuitry, and the remaining six are transducer-only units intended

Miniature DC/DC Converters

The NMV series of single- and dual-output 1 W DC/DC converters will reportedly save PCB space, reduce component count, and minimize switching noise in new and existing industrial distributed power architectures. The converters offer board-mounted footprints as low as 1.17 cm2 and are said to allow designers to achieve significant PCB space savings by delivering full-specification performance from -40° to 85°C without a heat sink.

Tuning Fork Crystals

The TMX-11 SMD tuning fork crystals can be used for wireless telephone handset, watch/clock, audio/video and home appliance applications. The device`s dimensions are 7.3 x 4.1 x 2.0 mm - said to be ideal for applications that require a small footprint and the need to be surface mountable. It is available in the standard tuning fork frequency of 32.768 kHz and offers a ±20 ppm tolerance, a temperature range of -40° to 85°C, and a thermoplastic package that is heat resistant for ref

High-frequency Fundamental Crystals

These high-frequency fundamental (HFF) thickness shear-mode AT quartz crystal resonators have a frequency range of 200 MHz. The CC1F (ceramic lid) crystal series reportedly is designed for the latest in high-speed communication systems that require high-frequency references, such as fiber optic telecommunications, gigabit Ethernet, 10Base-T and frame relay applications. Low power dissipation, stability over temperature range, high shock and vibration resistance, and a large pulling range are rep

Programmable Plastic SMD Oscillator

Housed in a 9.8 x 14.0 x 4.7 mm plastic surface mount J-lead package, the EP1400SJ and EP1500SJ feature custom or standard frequencies ranging from 1 to 125 MHz. Options include tri-state or power-down functions, ±50 or ±100 ppm frequency stability, and CMOS or TTL output. The former is a 5.0 V device, and the latter offers 3.3 V for low-voltage applications. The series is also available in a 14 or 8-pin hermetically sealed package and a ceramic SMD package.

Switching Regulator Ics

The S-8321, S-8322, S-8323, S-8324, S-8327 and S-8328 Series CMOS switching regulator ICs measure 2.8 x 2.9 x 1.3 mm in SOT-23 packaging. They have an internal oscillation frequency of 30 to 100 kHz, with a high oscillation frequency of 250 kHz available. The regulators are available with an internal or external switching transistor with either pulse frequency modulation (PFM), pulse width modulation (PWM), or both PFM and PWM controls.

Silicon Chip

The QRC 1284X2 chip is said to be the single-chip solution to IEEE 1284 parallel-port line filtering and termination. The 28-pin QSOP package uses thin film (tantalum nitride) on silicon technology. In each chip, there are reportedly 17 capacitors, 17 pull-up resistors and nine termination resistors; for each of the 17 signal lines, a diode structure provides 8 kV of ESD protection.

Surface Mount Oscillators

Designed for applications requiring extremely small size, the S3883-32.768 kHz series surface mount oscillator is only 2 mm in height. This single device is said to replace up to four common but hard-to-match devices used by most companies building their own 32.768 kHz oscillator out of separate components. Available for 5.0 V operation with power consumption of 10 µA typical, 3.3 V operation with power consumption of 8 µA typical, and 2.7 V operation with power consumption of 7 µ

J-lead Terminal Configuration

This J-lead terminal configuration has been added to the Series 219 surface mount SPST DIP switch line. Ongoing miniaturization of electronic equipment and associated internal PCBs have necessitated that manufacturers further miniaturize components used on PCBs to allow for compact placement. Unlike conventional gull-wing surface mount terminal configurations, where the terminals extend away from the body of the DIP switch, the J-lead construction forms the terminal alongside and under the produ

Compact TCXOs

The CFPT-120 series of compact surface mount TCXOs offers frequency stability down to ±2 ppm over an operating temperature range from -10° to 60°C. Housed in a 10-pad package measuring 7.0 x 5.0 x 2.0 mm, the series is aimed at both high- and low-volume applications in the mobile communications industry. It is available in a range of frequencies between 12.6 and 19.8 MHz. For error correction in the incoming signal, a voltage control facility allows the end user to trim the freque

Tantalum Chip Capacitors

The TCM Series of molded chip tantalum capacitors are designed for use in thick-film hybrid circuits. They are also reportedly suitable for direct mounting on PCBs. These chip capacitors are said to offer good resistance to mechanical stress and moisture because of their fully molded construction. The TCR Series offers resistance against rush current. These capacitors are reported to have failure rates of 0.5 percent or less per 1,000 hours, even in low-impedance circuits. Capacitance can be as

Integrated Circuit

This CMOS IC is included in a series of VCXOs and TCXOs. The 2GIC features CMOS and TTL-compatible output waveforms, frequency capability ranging up to 100 MHz, integrated Automatic Gain Control (AGC) ensuring oscillator startup through many conditions, and an available supply of both 3.3 or 5.0 V.

Modular Connector System

The COMPODRE System consists of a shroud with internal pods that accept any combination of Mini-Fit and Micro-Fit connectors. The connector is designed to save space by consolidating multiple connector requirements into one package and is said to be a cost-effective way to customize interconnects. Its modular design reportedly requires no tools for assembly. The latch system on the shroud produces an audible click to indicate proper connection and also helps prevent accidental unmating and subse

Publishers Executive Council Interview

SMT Magazine`s Publisher`s Executive Council consists of 38 electronic industry executives hand-picked by group publisher Marsha Robertson. They share their expertise and insights with our editorial staff and act

CM Capabilities

GET Manufacturing offers: full-systems turnkey manufacturing through box build (PCBA-level through system build, integration, test and pack-out); low- to medium-volume short runs, engineering builds and prototypes; concurrent engineering of new OEM products using DFM, DFT and DRC; PTH and SMT (sub-0.4 mm pitch, 0402 packages, BGA/microBGA assembly, repair and failure analysis); IPC-610 certified personnel; product fulfillment and OEM worldwide sales order distribution; product repair and refurbi

Prototype Stress Screening

Screening Systems manufactures a wide range of environmental stress screening (ESS) products for highly accelerated life test (HALT) and highly accelerated stress screening (HASS) applications. The company offers HALT and HASS testing services on prototypes and early pro- duction units to empirically determine the products` operational limits. These services are said to be particularly valuable when a developer desires rapid results on a prototype.

Small Prototypes to Mass Needs

Committed to serving and supporting companies with small prototype runs to mass production needs, Surface Mount Assemblies LLC offers: PCB assembly; through-hole; mixed-technology; test and burn-in; conformal coating/potting; turnkey capability; redesign of through-hole to surface mount or mixed-technology; wave solder; subassemblies; and quick-turn service. Engineering capabilities include design to specifications, product reengineering and board layout. In-circuit and functional testing are su


This 100 W, diode-pumped, Q-switched laser is called Scimitar. It is suitable for micromachining, semiconductor processing, welding, drilling, surface modification, cutting, trimming, soldering, texturing, percussion drilling, ablating/cladding, scintering, marking, engraving, rapid prototyping and laser forming. Standard units are available operating in CW mode or equipped with acousto-optic Q-switches providing operation from 1 to 50 kHz.

Electronic Label

The iButton is an electronic label with a memory chip. It is similar to a bar code because it has a unique (never-duplicated) 64-bit serial number that can be used for tracking purposes. Data can be written into the product and stored with the object on which it is attached. It allows the data (up to 8 KB) to be changed with just a touch. This product is suitable for applications where the data is required locally and changes relatively frequently, such as when tracking vehicles, trailers, shipp

Printer Applicators

Designed for the challenges presented by small product-identification requirements, chipboard cartons, small packages and similar applications, ValuePro 3240 is said to offer print and apply capability for labels as small as 0.5 x 0.5" (12.5 x 12.5 mm), with speeds up to 30 labels per minute. Its plug-and-play approach to automation reportedly allows installation on the line or use as a stand-alone system. When installed on-line, startup occurs by plugging in a photo eye to the external port or

Engraving System

The Viper 1810 engraving system features pre-loaded lead screws and ball slides for machine tool-like performance and rigidity said to be suitable for any industrial envi- ronment. The system comes with a high-speed spindle along with a diamond-drag tool used for fine-line markings on coated or raw surfaces. The control system works in a Windows 98 environment and can import directly from more than 20 different file formats.

Optimized BGA Inspection

The BGA II inspection package is an optimized version of the company`s machine vision hardware and software package for inspecting BGAs for missing, misplaced or improperly formed solder bumps. It reportedly combines the accuracy and reliability of the company`s original inspection package with MMX-accelerated inspection capability. The system is said to be able to inspect up to 10,000 solder bumps per second and offer support for large-format, high-resolution cameras. It also offers new softwar

NEPCON West 2000 will be held February 29 through March 2, with conferences running from February 27 through March 2, 2000, at the Anaheim Convention Center, Anaheim, Calif.

NEPCON West 2000 will be held February 29 through March 2, with conferences running from February 27 through March 2, 2000, at the Anaheim Convention Center, Anaheim, Calif. Scheduled features include a lead-free Technology Advancement Center (TAC) line and Contract Manufacturing Demonstration Line, pick-and-place evaluation center, a broadened technical conference, special industry events and the latest equipment. The show will host more than 700 exhibiting companies, representing electronics d


This year`s TAC, organized by RRA Technical Services Inc., will include five newly designed and developed assembly lines showing state-of-the-art assembly technology. New processes that will be demonstrated in TAC 2000 include a lead-free operation and another line that uses a solder paste alternative process.

Pick-and-place Evaluation Center

A strategic approach to evaluating assembly pick-and-place equipment will be unveiled at the new Pick-and-place Evaluation Center. In the 2,000 sq. ft. facility, visitors can evaluate pick-and-place equipment from some of the industry`s major manufacturers. Four high-speed placement machines will be on display, set up side-by-side, with third-party tech- nical experts providing in-use feedback and interpretation of manufacturers` published machine specifications. The physical demonstration of th


The conference kicks off February 27 and includes more than 100 sessions in the following tracks: design, assembly, HDI, inspection, management, packaging, test and contract manufacturing. The conference also features sessions on lead-free solder, including: Lead-free Soldering Options; Lead-free Soldering: Status and Technology Review; and Impact of Lead-free Solder on Global Manufacturing.

Special Events and Technology Feature Areas

Numerous special events, many of which are free to attendees, include: the opening day keynote speech by John Madden, football legend and broadcaster; Industry Keynote Address given by Dr. Buzz Aldrin, Astronaut; Contract Manufacturing Symposium; Contract Manufacturing Executive Forum; Advanced Packaging Symposium; International Panel Discussion, "Technology and Processes - What Does the Future Hold for the Industry?"; Excellence Awards; Best In Test Awards; Service Excellence Awards; and ASTE T

Product Launches

In its 35-year history, NEPCON West has been the launching pad for many new electronics manufacturing products and technologies, and this year, organizers expect more exhibitor product launches at this show than in any show in the event`s history.

Odd-form Assembly

With increasing demands placed on component structure, finding methods to improve automated odd-form component placement is paramount.

Reflow Oven Flexibility

A flexible reflow oven is required to accommodate multiple SMT manufacturing processes, functions and applications. Manufacturers using high-performance reflow ovens achieve increased productivity, throughput and profits via decreased production downtime.

The Complexity Factor

Traditional test strategies can no longer meet the demands of newer, more complex board design; looking at the test/inspection process from a new perspective may help address these issues.

Adhesive Deposition

When choosing whether to dispense adhesives with high-speed dispensing equipment or a stencil printer, a number of factors must be taken into consideration.

Web-based ATE Adapts to Test Future Technology

Easy access to test data and a broad range of tools for test program development are employed via Web-based technology.

Conversion Cost Update

When conversion cost is measured on a per lead basis, the evidence clearly indicates that the cost of transformation is declining.

Placement Equipment

Featuring unique centering and vision systems, modular designs and high throughput rates, today`s automated pick-and-place equipment is a far cry from the manual placement and handling machines of the past. Both fine-pitch and odd-form components can be placed on a PCB at the push of a button with some advanced machines. Other desirable options include small footprints, computer-compatibility and quick changeover times. SMT presents the following placement equipment selector roundup to highlight

High-volume Placement

The FCM, with speeds of up to 96,000 cph, has a footprint of 50 sq. ft. The slow movements of up to 16 independent placement modules, along with stationary feeders and boards, reportedly allow the unit to achieve a defect rate of less than 25 ppm, placing components as small as 0201. Vision modules allow placement of components down to 0.020" pitch.

Rotary Head

The SI-E1000 compact chip mounting machine features the Planet Head. Reportedly, this compact rotary head achieves precise, high-speed placement by controlling its planet gears with a fully closed rotary servo. Bidirectional head rotation is said to support optimal head control and reduce operating cycle time. The head features reflective and transmission part recognition.

Touchless Centering Placement Heads

The PlacePro Model 7100 employs six touchless centering placement heads mounted on a single gantry. It can reportedly place a wide range of component package types at rates up to 18,180 cph. A high-speed scan camera mounted on the gantry below the head assembly provides on-the-fly vision alignment of components as the gantry moves from the pick point to the placement position. Touchless component centering is performed using the high-speed vision processing system and either the scan camera or o

Fine-pitch Vision and Dispenser

Two new features for the CLM 9000 SMD pick-and-place system include a dual-camera Cognex vision system and an Archimedian screw valve dispenser. The vision system provides accurate placement of fine-pitch components down to 0.016", BGAs or special components. The dispenser allows precise dispensing of solder paste for prototyping without the need for stencil printing. The placement system can have up to 190 feeder inputs (100 inputs with in-line conveyor). Standard equipment includes a universal

Laser-aligned System

The KE 760 is an automatic, high-precision system for flexible surface mount assembly. The laser-aligned system can populate PCBs as large as 16 x 14" and incorporates a vision recognition system to detect missing or abnormal bumps on BGA packages. With a rated tact time of 0.32 seconds, the system reportedly achieves placement accuracy of ±0.002" for chips and ±0.001" for QFPs up to 2 x 2".

Chips and Large Parts

The GSM platform with FlexJet technology allows high-speed placement of both chips and large parts on a single platform. The platform reportedly reduces machine downtime related to changeover because it handles both chips and ICs. Lines consisting of multiple machines with this platform and technology are said to achieve high machine utilization because of the range of components that can be handled.

Windows Operating Environment

The Meridian Series SMT placement systems offer high ROI, low setup and operating costs, and effective line optimization and operation monitoring tools, with maximum placement rates exceeding 28,000 cph. All models are said to accurately place both chip and IC components. Features include a Windows NT operating environment and three-stage, soft-stop conveyors.

Low- to Medium-volume Placement

Designed for low- to medium-volume SMD placement, the P40`s capabilities include a variety of applications ranging from 0402 discrete components to 0.020" fine-pitch to BGAs, with a maximum feeder capability of 120 8 mm stick feeders (80 8 mm tape feeders). The units reportedly were designed for facilities where quick setup, ease of operation and high reliability are paramount. Component placement rates of up to 2,500 cph are typical.

Low-volume, High-mix

The MP1260`s single feeder change on-the-fly, multiple on-line placement programs, and complete inventory on one machine reportedly make it suitable for low-volume and high-mix assemblies. It is available with up to 10 placement heads and 328 feeder locations. The unit may also be configured with a mechanical gripper head and a dispenser in addition to the vacuum placement heads. Components placed range from 0201 chips to large (55 mm2) parts. The system can also dispense adhesives and solder pa

Six-nozzle Revolver Head

The SIPLACE 80 F5 handles standard and odd-shaped components via a traditional pick-and-place head, as well as advanced components, including bare die, CSPs, µBGAs and flip chips, by using a special six-nozzle revolver head. This head is capable of placing components ranging from 0603 to 32 x 32 mm, at a rate of 8,000 cph with an accuracy of 70 µm at 4 sigma. To place larger parts (up to 55 mm), the system uses a second head for pick-and-place at a rate of 1,800 cph with an accuracy of

Short Production Runs

MY9, the smallest footprint of the MY-Series machines, can handle up to 112 8 mm feeders, 105 SOIC tubes, or 80 8 mm tapes and 32 JEDEC trays with the optional tray exchanger. With this option and the new dual vision system, the machine is capable of placing components, QFPs, BGAs, and more advanced package technologies like flip chip, BGA and CSPs with pitch down to 0.16 mm.

Speed Enhancements

The 3Z is the latest version in the Contact 3 Series of SMT placement machines. Several speed enhancements reportedly have increased the maximum placement rate by more than 60 percent (13,000 cph). Faster motors with non-contact linear encoders are said to have increased head speed by 167 percent and table speed by 52 percent. Servo-driven Z axes increase cycle speed while improving placement force control. The unit retains its split-axis design with independent dual heads, 100 percent vision ce

4-axis Robot

The SR-424HSP robot has a total arm length of 420 mm. It can work within an area the size of a pallet. With four axes, multitasking capability, 32-bit control, arm height of 479 mm and weighing 21 kg, the robot can be used for pick-and-place applications. It reportedly has rotational speeds of up to 480° per second and repeatability accuracy to within ±0.02 mm. The robot controller is capable of simultaneously processing input and output signals during robot motion. The 32-bit controll

Optical Inspection

The GS•1 is an in-line system for automatic optical inspection of the SMT component placement process. It also provides measurements of positions in X, Y and theta (Q) of all components after placement. The system also offers inspection of polarity indicators, SPC software and programming by CAD data.

3-D Inspection and Taping

For use on the MP Series of machines, the MP200-3D provides a 3-D vision inspection and taping solution for two-sided components, including MSOPs and TSOPs fed from plastic tubes. The system reportedly features on-the-fly 3-D vision, fast changeover and low overall cost of ownership. The unit reportedly achieves throughputs of up to 6,500 parts per hour and is quickly changed to handle other part types. The system accepts tubes from 170 to 560 mm long to a stack height of 20 cm and accommodates

Three Heads, Double Vision

The CP-40CV fine-pitch placer combines CyberOptics laser sensors on its three heads and 256-level gray-scale bottomside vision. This lead-screw driven machine places components from 0402s up to 40 mm square QFPs with pitches down to 0.3 mm. It holds 104 tape feeders as well as standard and belt-driven stick feeders and waffle-pack trays. Software provides real-time machine operation, auto-optimization and on-screen error display. The system includes a three-stage conveyor and can handle PCBs up

BGA Scope

The PS-1000 is a video microscope designed to give users a side view of solder bumps beneath BGAs, CSPs or QFPs. A special prism directs the illumination ray to the object through a mirror at the edge and reflects the image. The scope is hand-held, and said to be compact and lightweight. Solder joints of QFPs or J-leads are also able to be monitored at approximately 100X if the prism is removed. With a CCD camera, images can be seen on a monitor, and reports can be made or printed out using a pe

Carrier Tape for Thin Parts

Snappax is an interlocking cover and embossed carrier tape design that can be used to package very thin parts, such as metal stampings and flex circuits, while reportedly protecting their integrity and coplanarity in the package. The design uses tabs in the cover tape that "snap" into and are retained by corresponding receiver pockets in the carrier. Vertical movement of the part in the pocket is said to be controlled, preventing thin parts from bouncing and shingling between pockets, as well as

Marking Head

The FH Series marking head is a component-level, galvo-based scanning head featuring digital fiber optic technology, as well as marking speeds reportedly up to 180 characters per second. The head is designed to work with CO2 lasers from 10 to 125 W, which are used in the surface mount industry for marking chips and PCBs. Its Windows-based laser marking software, WinMark Pro, is said to allow users to import numerous file formats, mark directly from a database, and set up automated processes such

AOI Inspection

The Vi-3000 AOI system is said to be capable of 100 percent inspection of PCBs at speeds up to 150,000 components per hour. It reportedly employs a digital camera with 1,300 x 1,000 pixel resolution and a 48 x 37 mm field of view. The system`s image analysis software can be programmed using Gerber, CAD or ASCII/Centroid supplied data, and incorporates SPC software tools and a synthetic component library. Operators can reportedly select any combination of axial or pyramidal light sources and ambe

Code Reader/Decoder

DMC200 software is now available for installation in VC Series industrial smart cameras. The software is said to allow users to create ECC200 Data Matrix readers/decoders. The readers are customizable to address a variety of applications through changes to their optics or illumination. For those who prefer a plug-and-play product, a fully integrated MAC 300 ECC200 Data Matrix Reader is available. With a VC65 smart camera, optics and illumination incorporated in a compact aluminum housing, the MA

Hidden Solder Joint Inspection

The benchtop ERSASCOPE 3000 inspection system offers a cross-sectional, nondestructive visual image of hidden solder joints by looking under BGAs, microBGAs and flip chip components, as well as interior fillets of PQFP and PLCC components. Its cross-sectional scope (90° angle of view) is complemented by a look-down scope (0° angle of view) with up to 350X magnification. The stand is said to allow for quick change of scopes with rotational and angled views (180° stepless). The hold

Lead-free Adhesive

CE 3100 electrically conductive adhesive is a lead-free alternative to solder for SMD interconnection formation. It uses a proprietary oxide-reducing technology to reportedly provide electrical junction stability and reliability on common metal solderable surface finishes. The adhesive is said to cure completely in a typical solder eutectic reflow cycle; no post cure is needed. Because of this, it is compatible with existing SMT assembly processes. The adhesive`s low CTE results in good thermome

Dual Lasers

The GS-600 is based on a dual-laser system that is said to accurately drill blind vias in all laminates, pre-pregs, dielectrics and copper foils. It is compatible with the IPC NC-349 drill file format, and features computer automation and fully integrated loading and unloading technology. After an operator initiates a production run by loading a part number and pressing the start button, the system accesses the LAN interface to select the appropriate drill file. It then activates the automatic l

O-ring Nozzles

This company specializes in the manufacture of special nozzles for critical fine-pitch placement. It offers O-ring enhanced nozzle tips and cups to improve the vacuum seal between components and pickup nozzles. This is said to reduce skewing and ensure increased placement accuracy without slowing machine speeds. O-ring nozzles are reportedly available in many sizes for a variety of chip and IC placement machines.

2000 Industry Vision Forecast

As we prepare to head into 2000, the surface mount process has, in many ways, come full circle.

A Basic Guide to Solder Paste Handling

Solder paste is a combination of pre-alloyed spherical metal powder and flux medium.

Market Opportunities: Specialization vs.Globalization

As consolidation thrusts change upon the CM industry, mid-sized CMs are becoming almost nonexistent, resulting in an industry filled with large global players and small specialty shops

Various artilces

Analysts to Discuss the CM Industry - NORTHBROOK, Ill. — The IPC — Association Connecting Electronics Industries announced that three analysts will provide a financial overview of the domestic and global contract manufacturing service industry in the keynote session Wall Street Speaks on the EMS Industry at the IPC SMEMA Council Electronics Assembly Process Exhibition and Conference (APEX). The session will take place March 15, 2000, f

Product Review

Mobile Storage System - The UltraClean PureFlow mobile storage system features a self-recharging power cell and Class 10 compatibility that is said to guarantee fail-safe particle control during the transport of microelectronic components and other sensitive materials through a manufacturing facility. All systems are self-contained and incorporate a motorized impeller blower and filter that direct a continuous wash of filtered air downward throughout the stor

Keys to Quality Iimprovement

A company must have a strong internal organization to ensure performance excellence for customers who expect world-class service.

CM News

CMs Establish Operations in Mexico ... - NAMPA, Idaho — MCMS Inc. announced its intent to establish a 112,000 sq. ft. operation in Monterrey, Mexico. The facility will initially focus on printed circuit board (PCB) assembly and test, and will expand to include system assembly as well as a full range of order fulfillment services. The project was scheduled to commence at the beginning of October, with volume production by the first quarter of 200

New Products

Bar-code/Matrix Reader - The HawkEye Model 15HD bar/matrix code reader is a compact, fixed-position scanner/verifier. Using QuicSet, an integrated positioning feature that combines visual laser targeting and audio feedback, the reader can reportedly be aligned on a bar or matrix code symbol quickly without external equipment. It offers on-line verification for immediate and definitive in-line symbol quality control. The reader is 2.4 x 2.5", and features an integrated lighting system tha

No-clean Solder Paste Innovations

In the past few years, several innovations in the performance of no-clean solder pastes have been introduced.

Stencil Printer Optimization Study

Reducing the variation in the pad areas, the Six Sigma philosophies can be brought to bear on the stencil printing process.

Increased Yield and Reliability of the Flip Chip Process

There are a number of process parameters that affect yield and reliability for flip chip assemblies. This article examines some of these parameters and discusses how examination of each parameter's role in the process, followed by necessary adjustments, can increase yield and reliability.*


With the continuing evolution toward smaller components, higher board densities and more diverse mixes, process equipment is stressed to the limits of its capabilities.

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement require-ments. Modern manufacturing techniques are useless if a board's components are out of date, perform poorly or fail to satisfy end-user requirements. To assist manufacturers in this search, SMT Magazine presents Component Specifier, a new product section designed to spotlight state-of-the-a


Specific tools such as statistical quality control (SQC), inspection, repair and test are not only needed, they should be in place to ensure that products are built to meet required quality levels on a consistent basis.

Technology & Business Report

Each month, SMT Magazine's SMT Trends section polls industry leaders on topics at the heart of the surface mount industry. This month, we ask industry leaders for their opinions on the state of the industry and possible directions it will take in the future. Of key interest were topics related to global expansion and time-to-market.

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement requirements.

Line Efficiency and Productivity Measures

Data from both OEM and CM SMT lines were collected and analyzed to determine line efficiency, nonproductive assembly time and other productivity measures.

Manufacturing Partnerships into Y2K

As demands for products with increasingly smaller packages and enhanced performance grow, OEMs are looking for CMs that offer one-stop shopping.

CM News

Eight New Contracts Won - NIWOT, Colo. — The Dii Group Inc. announced that Dovatron, its contract manufacturing subsidiary, recently signed eight new programs with seven new customers and one existing customer, amounting to more than $200 million of annualized revenue. Two of the programs are printed circuit board (PCB) assembly in China for Matrox Corp., and PCB assembly and box build for home networking products for Tut Systems. The remaining bu

New Products

Chip Scale Test Contactor - The HP 95000 chip scale, auto-test contactor is designed for use with the HP 95000 tester. The contactor works with the tester to provide 1 GHz performance with less than 1 ns pulse widths for testing direct rambus DRAM. The contacts use 0.75 mm pitch, 1.3 to 1.6 nH self inductance, 0.02 to 0.09 capacitance and 9.3 GHz bandwidth at 1.0 dB for test results from -55 to 150°C with a typical life cycle of more than 100,000 insertions. OZ TEK, Hayward, Calif.

Product Labeling vs. ESD

One of the many potential sources for electrostatic discharge are standard PCB and component bar-code labels that utilize insulative materials able to generate up to 1,000 V or more when removed from the release liner.

Minimize ESD-induced Failures

Commitment at all levels of production is required to gain control of ESD.

Advances in Automated Selective Conformal Coating

Tri-mode applicator technology offers manufacturers both flexibility and dependability.

CIM-compatible Handling Equipment

The key to PCB-assembly optimization, programmable conveyor systems can link computer-integrated manufacturing equipment for maximum yields.

FCIP Delivers Flip Chip Benefits Without DCA Complications

Emerging technologies support adoption of FCIP solutions to meet performance requirements.

The 'Necessaries' of Machine Vision

While RS170 or charge-coupled/infrared (CCIR) cameras are common, the need for more detail and faster acquisition rates is rapidly driving frame grabbers in the direction of higher resolution, progressive-scan cameras.

Guidelines for Lead-free Processing

With legislative directives banning lead in electronics processes afloat in Japan and Europe, it is important to understand how converting to lead-free solders will affect the SMT process as a whole.

How to Choose SMT DC-DC Converters

Until recently, most DC-DC converters were only available as through-hole devices. As more become available as surface mount devices, users need to know how to choose the most appropriate one.

Improved Fault Coverage for Limited Access

Smaller components and boards have forced the creation of new test techniques.

The Role of X-ray Inspection in DFM

The supporting role that X-ray inspection plays for DFM is critical to the SMT process.


In the era of "no-clean" solder pastes, precision cleaning of assemblies has assumed a new dimension.

Soldering Equipment and Materials

Soldering is a critical step in the SMT process.

Publisher's Executive Council Survey

Q: How did you develop the rotary turret design for today's chipshooters?

Component Specifier

As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement require-ments. Modern manufacturing techniques are useless if a board's components are out of date, perform poorly or fail to satisfy end-user requirements. To assist manufacturers in this search, SMT Magazine presents Component Specifier, a new product section designed to spotlight state-of-the-a

Cleaning Up The Process

Two companies worked together to develop a process to control flux flow, eliminating buildup and reducing maintenance.

Managing Productivity and Relationships with OEMs

The heart of all OEM/CM relationships is trust derived from the knowledge of their capabilities and demands of the market.

Real-time Cost Estimates Measure

Real-time cost estimating is a useful tool when comparing capital equipment expenditures.

Quality Ensured with In-process Inspection

Integrating AOI systems at key locations in the assembly line has proven to be a cost-effective solution for improving yields.

CM News

Software Order Placed - HERZLIYA, Israel — SCI Systems Inc. placed a $3.8 million order for combined Tecnomatix Technologies Ltd. and Fuji Machine Manufacturing Co. Ltd. software and services. Tecnomatix will receive $2.1 million, with $1.7 to go to Fuji. The order is comprised of Tecnomatix UNICAM software for assembly planning, production monitoring, documentation and for interfacing with non-Fuji PCB assembly equipment, and a jointly developed

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