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RTW SMTAI: KIC's MB Allen on Smart Factory, CFX
11/14/2018 | Real Time with...SMTAI
How to Avoid Common Wave Soldering Issues
11/13/2018 | Neil Blundell, Blundell Production Equipment
Green Circuits' Joe O'Neil and Joe Garcia on the Best Kept Secret
11/12/2018 | Nolan Johnson, I-Connect007
Challenges and Opportunities with CFX
11/09/2018 | Stephen Las Marias, I-Connect007
I-Connect007 Survey Sees Bright Prospects for Low-Temperature Soldering
11/07/2018 | Stephen Las Marias, I-Connect007
This month, experts in the area of ball grid array (BGA) and chip scale package (CSP) technology discuss current and future BGA and CSP issues.
CSP On-board Assembly: Implementation and Qualification
The objectives of these studies are to develop optimized assembly processes, demonstrate the production assembly processes developed and provide reliable solder connections.
GISSMO System Implemented - CONCORD, Mass. Manufacturers' Services Ltd. implemented a global materials and supplier information system known as GISSMO. The move is a part of the company's strategy to build a supply-chain solution that will allow it to serve customers in a real-time environment.
PCB Magazine - The 700 Series PCB magazine incorporates a belt-driven precision spindle system that reportedly allows for quick and easy setup to PCB width as well as parallelism of the side panels. The color-coding and consecutive numbering system on the side panels, along with the width scale, are said to help facilitate width adjustment. A transport safety lock keeps the PCBs from sliding out of the magazine during transport and can be automatically unlocked in a loading station. The
Solder-bump-array technology, as on BGAs and CSPs, offers many advantages (and some disadvantages) that must be understood to prevent serious problems.
An Image Library of SMT Defects Section 4: BGA PCB Defects, Dimensions, Poke-thru
These images of SMT defects and attributes were compiled by consultant Tom Clifford. In Section 4, we showcase copper splash, over-etched and thin traces, solder on copper, and other defects. Some of these can cause electrical shorts.
IPC-A-610D for AOI: Integrated Verification Enables IPC-compliant PCB Inspection
IPC-A-610 is the universally accepted standard for electronics assembly defects. In this article Peter Krippner, Viscom AG, describes how IPC-A-610D is incorporated into post-reflow AOI systems to improve defect detection, reduce false calls, and eliminate missed defects during SMT assembly.
SMT Preventive Maintenance: Stop 5 Major Problems with Pick-and-place Nozzles
Quality nozzles and feeders are the core of pick-and-place. In this article, Zachery Shook, Count On Tools, describes five major issues associated with improper nozzle maintenance and/or the use of poor quality nozzles in the pick-and-place process.
Trust but Verify. Why Take the Risk? Detection of Counterfeit Components by K-Shell XRF Technique
Steve Glass, RMD Instruments, warns that counterfeit electronic components discovered by the defense industry has doubled since 2008. He busts a few myths about counterfeiting, such as “all counterfeit components come from China” and “counterfeits are so crude they can easily be detected.”
Insights behind Foxconn/Hon Hai Employee Suicides: Recommendations for Electronics Companies
Pamela J. Gordon and Fanny Lee, TFI, investigate the electronics industry’s role in the Foxconn suicide problem, and offer advice for OEMs considering implementing or changing their multi-national outsourcing strategy. Can electronics be manufactured at an effective cost and worker-satisfaction rate? Ultimately, it depends on both the customer and the manufacturer.
What Is Halide-free and What Does It Mean to Me?
With halogen-containing substances possible additions to the list of substances banned from electronics, many manufacturers are asking how this materials restriction will affect them and their processes. John Vivari, Nordson EFD, explains what halogens and halides are and why they matter, as well as where these elements appear in the electronics manufacturing bill of materials.
Is Cleaning Critical to PoP Assemblies?
Cleaning is a critical process in the electronics manufacturing industry. Effective cleaning improves product reliability by ensuring optimal surface resistance and preventing current leakage that can lead to PCB failure. This paper addresses the cleanliness level of PoP assemblies, including underneath PoP components and in between packages.
Manufacturing Representatives & EMS: Keys to a Solid Partnership
Ask a manufacturer's rep or an EMS sales manager about successful EMS-rep sales relationships and you'll most likely get a negative response. The EMS industry is littered with bad breakups. Usually, the root cause is the fact that neither party fully understood what they were getting into. What drives a good relationship?
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