diplan Acquisition Enhances Aegis Technology's Offerings
In addition to the technologies that diplan brings to Aegis's product line, the acquisition also greatly accelerates expansion into Europe and Asia--complementing Aegis' presence in North America, and established presence in the UK, Scandinavia, and Benelux.
Blackfox Delivers Benefits of Custom Solder Training
"It began with classroom theory, presentations, demonstrations on fasteners and soldering, and then switched to one-on-one training. Employees received feedback on their individual soldering performance," said Dan Watson, Olympus NDT quality engineer, of the five-day, on-site training program performed by Blackfox Training Institute.
Selecting the Right Potting Compound for Your Application
Many questions arise when trying to select an appropriate potting compound. An experienced materials expert can help identify the primary concerns, recommend materials, provide testing of the materials, and offer information on dielectric strength, adhesive characteristics, thermal conductivity, and more, through the testing process.
The Continued Evolution of JTAG Test Solutions
Board test technology is witnessing what could be the most dramatic changes since the introduction of boundary-scan in 1990. While the traditional standard, 1149.1, revolutionized the way PCBs are tested and programmed, new advancements have initiated developments and updates to both the IEEE 1149.x standards and associated proprietary test techniques.
Bringing USB to the PXI Test Environment
Very little has been said about combining PXI and USB products in a test system--yet USB is an extremely common interface on consumer and professional products, ubiquitous on many mobile devices. That means that USB may be a native control connection on a device that needs testing--so a test system, ideally, needs the capability of supporting USB for test.
Dr. Martin Anselm Provides AREA Consortium Update
Universal Instruments' Dr. Martin Anselm, manager of the AREA Consortium, joins Editor Andy Shaughnessy to discuss the group's projects focusing on assembly materials, processes, and reliability, and explains why this data is now more important than ever.
IPC Symposium Focuses on Lean for Assembly Industry
"Understanding the use of lean in an electronics manufacturing environment requires insight into our industry," says Susan Filz, IPC director of industry programs. "We've brought together lean experts from major electronics manufacturing companies to present at this event because they understand the unique challenges, and opportunities, our industry faces."
OKI on Business in China, Seminars, and Awards
Paul Wood, OK International's advanced product application manager, presented two papers at NEPCON South China and won the show's Best Presentation Award for his paper on micro BGA rework. Wood chats with Editor Marcy LaRont about the show, business in China, and how great seminars can lead to great equipment sales.
Fundamentals of Reflow Technology: Metallurgy of the Soldering Process, Part III
Mixing pure metals with alloying elements plays an important role in soldering technology, for instance, when lead is added to pure tin. If alloys of various compositions cool while their temperatures are continuously measured, we observe the same behavior as above, except that the temperature does not remain entirely constant. Instead, the speed at which the material cools shows a clear-cut change within a given temperature range.
Solder Paste Deposits and the Precision of Aperture Sizes
The quality of a stencil may be measured a number of ways: Smoothness of the cut wall, material quality, thickness and thickness uniformity of the material, proper aperture location, and proper aperture size. Here, though the testing of 12 stencils acquired and manufactured using different equipment and methods, the authors show that significant variability exists in aperture size precision between various stencil manufacturing sources.
Nordson Dage Experiencing Record Year
Keith Bryant, global sales director for Nordson Dage X-Ray Systems, expounds upon the importance of the South China market, the company's Jade flat-panel machine, and the company's expectations of a record year.
Fundamentals of Reflow Technology: Metallurgy of the Soldering Process
Soldering is a very specific science that must encompass a number of disciplines and demands considerable expertise to master. In its ultimate analysis, the process of soldering is all about the interaction of materials at a molecular, or even atomic, level. Arguably, to understand this fully, you need to be a bit of a scientist.
Xenon's Customized Automation Equipment a Hit
Dr. Hartmut Freitag, managing director for Xenon, introduced his company to the South China market as a first-time exhibitor at NEPCON South China and he plans to be back next year. With a large factory in Shenzhen, this German organization has alliances with local universities to help hire the best talent locally, and the company plans to expand R&D into this area as well.
DfE Online Helps Meet Environmental Regulations
The Surface Mount Technology Association (SMTA) and electronics and technology consultants Technology Forecasters Inc. (TFI), PlesTech, Ltd., and Harvey Stone announce the launch of DfE Online, a breakthrough training and certification program in Design for Environment (DfE).
TCO: From Buzzword to Reality - Six Key Factors to Consider Before "The Offshore Default"
With the U.S. economy hobbled and arguably in a recession, two wars behind us, and politicians in the public's crosshairs, onshoring has been making news. Domestic PCB fabrication revenue has declined 66% and more than half of all N.A. fabricators have closed. Surprisingly, applying a true TCO approach to procurement shows that the benefits of procuring overseas do not always exist.
SMT Trends & Technologies: A Pocket Full of Components
With batch sizes becoming smaller and smaller, much assembly time is wasted by an increased number of setup changes. Time-consuming elements often include loading or unloading feeders, changing feeders and nozzles, tuning and teaching new components, and ramping up. How can such challenges be addressed?
Blackfox, ProSkill to Provide Awareness and Training
The partnership was formed to provide awareness and training in the techniques and practices required to detect and avoid counterfeit components and the costs, legal issues, and risks associated with them to prevent infestation of counterfeit material into the supply chain.
Coenen on the Advantages of Jet Solder Paste Printing
MYDATA's Global Sales Director for Jet Printing, Nico Coenen, joins Editor Ray Rasmussen to discuss the advantages of jet solder paste printing. While not perfect for every application, this technology is gaining more and more acceptance in the industry.
AdoptSMT: Pre-Owned Equipment Big Draw in Down Economy
Erhard Hoffman, managing director of AdoptSMT Group, discusses selling pre-owned SMT equipment to the China market, why his equipment is especially desirable in South China, and plans to expand business with Editor Marcy LaRont.
It's About the Environment...for Better or Worse
Michael Konrad, CEO of Aqueous Technologies Corporation, says "It's not easy being green," but it just makes sense. His essentially non-green, chemical-laden cleaning business produces zero discharge, and it's not the only one. Konrad says that regulation, for better or worse, is a huge driver for making the impossible possible in this industry. He's seen it happen.
Likelihood of Metal Vapor Arc by Tin Whiskers
For electronic equipment, tin whisker growth can produce unintended electrical shorts resulting in product failure. Under certain conditions, tin whiskers can initiate a metal vapor arc that can have destructive consequences. This study investigates the role of bias voltage, pressure, and whisker geometry on metal vapor arc formation, and presents a metric for whisker arc formation.
An Investigation of Whisker Growth on Tin-Coated Wire and Braid
Whiskers develop in any environment: Ground or vacuum/space, wet or dry, applied power versus no power. The authors analyzed 13 samples of tin-coated wire and braid, manufactured between 1965 and 2009, from five different suppliers, by scanning electron microscopy and energy dispersive X-ray to evaluate the material composition, size, and density of whiskers.
Miller Gives Update on Nordson Yestech's Latest Technology
Don Miller, president of Nordson Yestech, discusses why China is such a robust market for his company. He talks about their latest and greatest technology--something that pairs nicely with several Nordson partner businesses, providing a distinct edge in the marketplace.
Effectiveness of Conformal Coatings on Surface Mount Components as Tin Whisker Mitigation
In this study, sets of assembled quad flat packages were conformally coated and evaluated for tin whisker mitigation, as well as the coating coverage. Six coating materials were examined. Whisker growth was examined after specimens were subjected sequential to temperature cyclings, corrosive gases, and temperature and humidity conditions.
Zollner's New Facility to Focus on the Customer
John Burke, General Manager and COO of Zollner's newly-dedicated U.S. operations located in the Silicon Valley, joins Guest Editor Joe Fjelstad to profile the new facility, its capabilities, and near-term plans for growth in service to the company's many U.S.-based customers.
Nam Tai Enjoys 62.8% Sales Growth in Q2
Sales in the second quarter of 2012 were $205.1 million, an increase of 62.8%, as compared to sales of $126.0 million for the same quarter of 2011. Gross profit margin in the second quarter of 2012 was 9.2%, up 3.9% from 5.3% in the second quarter of last year.
Celestica's Q2 Revenue Drops; Acquires D&H Manufacturing
"We are pleased to announce that we have entered into an agreement to acquire D&H Manufacturing Company. This acquisition will strengthen our complex mechanical and systems integration offering, and allows us to provide additional value to our customers in the diversified markets segment of our business," said Craig Muhlhauser, president and CEO.
Staying Green When You Clean
Bill Schreiber, president of Smart Sonic, describes challenges involving cleaning pallets and stencils, their proprietary chemistry, and their womb-to-tomb turnkey process for cleaning--all while keeping the environment in mind.
2012 Medical Devices Outlook
The medical semiconductor market has largely followed the same ups and downs as the rest of the semiconductor industry, with total shipments declining slightly in 2011 after spiking in 2010. However, over the next several years, the market is projected to grow, with demand spurred on by a wave of new government-approved ultra-portable and implantable products and booming regional demand.
Second Star from the Right and Straight on 'Til Morning
William Shatner’s keynote address was packed with eager attendees at IPC APEX EXPO. A thread of serious environmental consciousness ran throughout Shatner’s performance. As well, many thought-provoking and inspirational questions were asked and answered with wit, insight, and wisdom.
IPC Sets Standards on Strain Gauge Tests
"The revision is about making sure there's a common, accepted practice for measuring manufacturing strain on printed board assemblies due to board flexure," said Intel Corporation's Jagadeesh Radhakrishnan, a co-chair of the task group that developed IPC/JEDEC-9704A.
Maxed Out: Do Not Adjust Your Set
Some of the innovations racing towards us will make you squeal with delight, such as the next-generation 4K2K displays, which will blow today's high-definition displays out of the water. For example, the current high-definition 1080p format presents images that contain 2 megapixels, but the next-generation 4K2K displays will boast 4096 x 2400 pixels (that's 10 megapixels). And there are even wall-size 8K4K displays on the drawing board.
From the Show: A Hands-on APEX Session
On the first day of APEX, IPC and three instructors from BEST decided to bring a more pragmatic approach to a PCB repair topic taught in the technical program. Along with 24 participants, the instructors from BEST led a hands-on reballing session. After a lively, highly participative 60-min. question and answer session on the fundamentals of reballing, the reballing process, and its various attributes, participants eagerly began the hands-on session.
IMI Enjoys 40% Revenue Growth in 2011
"Despite a global economy saddled with Eurozone struggles and U.S. weaknesses, we grew our revenues. IMI remained profitable in spite of a very volatile marketplace," said Arthur Tan, President and CEO. By expanding its global footprint in 2011, IMI has achieved a diversity of marketplaces, serving varied segments of the electronics industry in different parts of the world.
IEC's Fiscal 1Q12 Revenue Up 18%
W. Barry Gilbert, Chairman of the Board and CEO, stated, "While revenues were up for the entire company, earnings were down significantly from the prior quarter. Key sections of the company continue to perform quite well. We continue to increase our revenue and our organic growth was in line with our estimates at just over 12%."
SMTAI 2011 Best Papers Announced
The SMTA is pleased to announce the Best Papers from SMTA International 2011. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Facing the Challenges of 2012 and Beyond
A diverse group of trends, including the return of manufacturing to the United States, the continued development of clean energy options and mobile communication devices, and the end of exemptions to RoHS chemical restrictions, all bring the potential to affect business in 2012.
Lingering Economic Uncertainties to Spur Declines in ECM
Following a year of expansion in 2011, the global electronics contract manufacturing business is expected to decline slightly in 2012, as continuing economic uncertainty in Europe and the United States constricts growth, according to an IHS iSuppli EMS & ODM Market Brief report from information and analysis provider IHS.
IPC APEX EXPO 2012 Includes Free Process Defect Clinic
Organized by IPC and the National Physical Laboratory (NPL), the free clinic will be held in the exhibit hall to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
Flextronics Expands Romania Facility, Targets Medical Market
Flextronics has expanded its facility in Timisoara, Romania, to include a dedicated medical operation to better serve medical equipment and medical disposables OEMs globally. The expansion includes a newly refurbished production area and 1,300 square meters of class-eight clean room area.
Past, Present and Future of Package-on-Package
Package-on-package (PoP) technology has enabled PCB designers to conserve board real estate and reduce crosstalk, while simplifying testing of the decoupled memory and logic devices. SMTAI keynote speaker Lee Smith of Amkor Technology discusses PoP technology, ongoing industry collaboration, and standards development.
IPC: EMS Industry Returns to Growth
After economic setbacks in 2009, the world market for electronics EMS returned to growth in 2010, according to a study released by IPC. The EMS market is projected to grow 14.8% globally and 10.2% in North America this year. The study includes forecasts through 2015, provided by New Venture Research Corporation.
SMTAI to Discuss PCB Technology Challenges
The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place Tuesday, October 18, 2011 during their annual conference, SMTA International, in Ft. Worth, Texas. Gil White, DDi Global, will chair the session and Laura Turbini, Ph.D., Research in Motion, will co-chair.
Building a "Due Diligence" Approach to Conflict Minerals Compliance: Can RoHS Provide a Model?
Sponsored by Republican U.S. Senator Sam Brownback of Kansas, Section 1502 of the Dodd-Frank Act is designed to provide corporate accountability and public transparency to the sourcing of gold, tantalum, tin and tungsten in an effort to choke the supply of such minerals from, and the revenue to, rebel-controlled mines.
Reid: RoHS Bolsters Materials and Interconnections
Paul Reid, Program Coordinator at PWB Inc., discusses what's new in reliability testing and why he believes this is the "Year of Design." He explains how RoHS requirements have furthered the development of more robust materials and interconnections, as well as how the effects of design are starting to be a major influence on reliability.
Study of Quality Benchmarks for EMS Industry Now Available
The report is designed to provide information to EMS companies interested in comparing their key 2010 operating variables to those of other EMS providers by net sales and type of product. The study covers financial and production data, assembly attributes, yields, defect rates (DPMO), customer returns, supplier performance, customer satisfaction and certification data.
Winland Electronics' Positive Sales Trend Continues in Q2
"The positive sales trends we have been experiencing continued into our second quarter," said Brian Lawrence, CFO and Senior VP. "Sales were up 7% on a sequential quarterly basis, the result of a large project sale to a new customer, and continued strong sales from our existing customers."
Nortech Systems Reports 13% Sales Increase in Q2
Nortech Systems Incorporated reported net sales of $27.8 million for the second quarter ended June 30, 2011, a 13% increase over net sales of $24.7 million for the second quarter of 2010. "Our two newest acquisitions led the sales growth for industrial and medical customers," said Mike Degen, President and CEO.
Henkel Continues Solid Performance in Q2
"Henkel continued its solid performance in the second quarter, despite the challenging market environment. We achieved high organic sales growth and outperformed once again our relevant markets," said CEO, Kasper Rorsted. "All our business sectors contributed to this growth and, with double-digit increases in our growth regions, we improved the share of total sales in these markets to 42%."
IPC's Data Exchange Standard for Conflict Minerals Regulation
IPC will begin development of a data exchange standard to help the electronics manufacturing industry comply with forthcoming U.S. Securities and Exchange Commission (SEC) regulations on conflict minerals at a kickoff meeting on September 22, 2011, held in conjunction with IPC Midwest Conference & Exhibition, Schaumburg, Illinois.
Incap's 1H Revenue Up 15% YoY
Sami Mykkänen, President and CEO of Incap Group, said, "Revenue developed favourably in the strategic focus areas of energy efficiency and well-being technology industries. The improving general economic situation has stimulated demand and the recovery of investment activities is especially evident in the increased sales of electrotechnical devices."
Moldable Solutions to Protect Electronics
Guest Editor Kelly Dack sits down with Dr. Brian Toleno, Director of Technical Service Engineering for Henkel Electronic Materials, to discuss a silver-plated copper (SPC) process for cost-effective treatment of various forms of the material. Dr. Toleno also shares an innovative, award-winning product called "Macromelt" which offers a moldable solution for incapsulative packaging of electronics.
Disruptive Climates the Focus of IPC Executive Summit
The event, scheduled for October 4–5, 2011, in San Jose, California, combines the strategic planning focus of IPC’s Management Meetings with the global business insights of its Market & Technology Conference. The summit will provide ideas and solutions that will help executives strategically map their companies' futures through today's disruptive climate.
Plexus Posts Fiscal Q3 Revenue of $559 Million
Dean Foate, President and CEO, commented, "Fiscal third quarter revenues were $559 million with EPS of $0.58. We experienced an exceptional level of forecast volatility during the quarter as customers broadly lowered their demand for the second half of our fiscal year."
Elecsys' EDMS Segment Posts 40% Sales Growth for FY2011
Sales for the company's Electronic Design and Manufacturing Services (EDMS) business segment increased 40% to approximately $13,807,000 for the fiscal year ended April 30, 2011, an increase of $3,945,000 from $9,862,000 in the prior fiscal year. The increase in sales was a result of steady increases in bookings and shipments over the past fiscal year.
Cleaning Technologies: Trends and Developments
As the developing electronics market sees modern and future electronics becoming smaller and smaller, the requirement for high performance and reliability becomes stronger than ever. To achieve good insulation resistance, and ensure adequate adhesion of conformal coatings and potting and encapsulation resins, the cleanliness of electronic assemblies is essential.
EPIC, Rocket Enter Marketing & Manufacturing Agreement
Under the terms of the agreement, the companies will engage in joint marketing and business development initiatives, featuring Rocket's world class prototype and new product introduction services and EPIC's award-winning volume manufacturing and supply chain capabilities.
Heraeus & Technica USA: The Latest in Solder Paste Tech
Anton Miric, Heraeus Product Line Director, and Frank Medina, Technica USA CEO, meet with Editor Pete Starkey to discuss the latest developments in solder pastes and adhesives, and their impact on the North American market.
BGA Routing Takes Center Stage in Vegas
Charles Pfeil, engineering director in Mentor Graphics' System Design Division, discusses his Designers Forum presentation "Effective BGA Fanouts." He predicts that large-scale BGAs will soon have over 2,000 pins and bring PCB designers a plethora of new routing issues.
RIT/CEMA Work to Solve Technical Issues
Dr. S. Manian Ramkumar, Ph.D., professor and Director of the Center for Electronics Manufacturing and Assembly (CEMA) at Rochester Institute of Technology, talks about the assistance his group provides the industry. Leading equipment and material suppliers have donated the latest and greatest equipment in support of efforts to help solve industry technical problems.
SMTA Releases SMT Certification Dates, Locations
The SMTA proudly announces four upcoming offerings of SMT Certification in Toronto, Schaumburg, Santa Clara and Fort Worth. Each program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma/Greenbelt. The program concludes on days two and three with an open- and closed-book examination.
Ryder Industries to Expand to Inland China
The new manufacturing facility will not only provide state-of-the-art production capabilities and environmental impact management, but it also will promote economic development. The new 70,000 square meter manufacturing complex will offer fully integrated plastic injection, screen printing and painting capabilities, as well as SMT/PCBA and box-build under one roof.
Cisco Executive to Keynote Atlanta SMTA Expo
The SMTA announced today that Mark Brillhart, Vice President, Technology and Quality, Cisco, would keynote on the state of the electronics industry at its 15th annual Atlanta SMTA Expo Thursday, April 21, 2011 at 9:30 a.m. at the Gwinnett Civic Center.
Think You Only Need AOI? Think Again
The whole idea of AOI is to help ensure that what's coming off the line is exactly the same as the original with which it's being compared. AOI probably did its job just fine, or maybe not: There is a known or expected false call and escape rate with the AOI process, which, by the way, is why it can't be used for first article inspection.
Nordson Reports 23% Sales Increase in Q1
"Our global team delivered the best first quarter performance in Nordson's history," said Nordson President and CEO, Michael F. Hilton. "Our model of differentiated technology, application know-how and direct sales and service enabled us to capture business in both established and emerging markets. The organization continues to deliver superior value to our customers."
Strong EMS Activity in 2010
There were 46 completed EMS transactions in 2010, nearly doubling the 24 recorded in 2009. Similar to previous years, vertical/horizontal convergences were the most common type of transaction with 15 transactions in 2010, or 33% of total activity, compared to 12 transactions in 2009.
ALPHA SACX Plus Solder Alloys Secures China Patent
"We have made a significant investment in the development of our SACX Plus® family of alloys with the intention of providing high-value, lead-free solder options to assemblers, and we are pleased that China has joined other countries in recognizing their uniqueness," said Mike Murphy, Global Product Manager for Wave Soldering Materials.
Enics, Axis Enter Strategic Partnership Agreement
"Axis chose Enics because of its competitive price/performance, size and strategic fit with Axis manufacturing and logistics requirements," said Per Ädelroth, Vice President Operations. Enics was selected among the best EMS companies in the world to become a global partner for AXIS.
Flextronics Posts Strong Q3 Results; Sales Up 19%
Adjusted net income for the third quarter ended December 31, 2010 was $193 million, an increase of $55 million or 40%, and adjusted EPS increased $0.08 or 47% to $0.25, compared to $138 million and $0.17, respectively, for the year ago quarter.
NEPCON China 2011 Highlights Auto Electronics of the Future
The twenty-first edition of NEPCON China, which will take place at the Shanghai Everbright Convention and Exhibition Center May 1-13, 2011, will bring together top international manufacturers of electronic equipment to showcase developing trends in auto electronics manufacturing.
Outlook and Trends 2011: A Perspective
For 2011, expect the continuing focus on smaller, faster, lighter, less expensive electronics products; lead-free reliability to become accepted as reasonable for consumer products; and continued efforts to develop technology-based strategies to combat the counterfeit components crisis.
IEC Electronics: IPC Standards Define Expectation Levels
"For contract manufacturers, the IPC standards define reasonable expectations for products. It adds some sanity and clarity for manufacturers and customers. It’s nice to have a document that defines the requirements," said Jake Slezak, Manufacturing Engineer at IEC Electronics Corporation.
Unmasking a Counterfeit BGA
Although there are several main types of counterfeit components, by far the most abundant are components that have been stripped off used PCBs (E-scrap), refurbished, resurfaced and re-marked to reflect a newer single lot/date code. They are then misrepresented and resold and as original factory-new product.
IPC, NPL Host Soldering and Assembly Defects Webinar
According to Bob Willis, NPL Process Defects Database Consultant, the advent of lead-free technology made every step of the assembly process more difficult. "Common process problems today relate to the correct selection of printed board materials, surface finishes and soldering materials."
From electronica 2010: Electronics & EMS in India
QUAD Electronics' Andrew Scheele, Director, Corporate and Business Development, and Raminder Singh Soin, Managing Director, share their views with EMS Now's Philip Stoten during electronica 2010 on what makes the supply chain tick in India: Its successes, challenges and future, while drawing parallels with other manufacturing regions, both east and west of India.
Managing Dross in Soldering Processes
Wave, selective and related soldering processes involve large volumes of molten solder that are exposed to the atmosphere. Turbulence, oxygen exposure, temperature and other factors affect dross formation in wave soldering processes. Keith Sweatman and Keith Howell of Nihon Superior advise operators on how to reduce dross.
Considering a Halogen-Free Future? Know the Facts
To understand the halogen-free movement, one must fully comprehend the reason behind the push, as well as the differences between halogens and halides. This industry-sponsored effort is being driven primarily by increasingly environmentally-conscious customers, pressure from non-governmental environmental organizations and the desire by suppliers to be proactive.
United Against Counterfeiting: A Counterfeit EEE Parts Solution
Counterfeit electrical, electronic and electromechanical parts pose a significant threat in the global supply chain. Equipment failures or malfunctions can cause mission failures, health and safety concerns and could jeopardize national security. This paper will segment the market, address solutions and outline what each link in the supply chain can do to help eliminate the problem.
Rowland: New RoHS Annex Affects Assembly Industry
On September 24, 2010, the Exemption Annex to Directive 2002/95/EC was officially replaced by a new Exemption Annex (which is now a separate document) containing 39 Exemptions. According to the proposed RoHS recast, a four-year maximum validity period for the Exemptions is set to stimulate substitution efforts and transition the burden of proof to the Exemption applicant.
Conformal Coating vs. Encapsulation: Protecting Electronic Devices
Jade Bridges, R&D Manager at Electrolube Ltd., continues her look at conformal coatings this week. To ensure reliability of critical devices, it is essential that PCBs are protected to prevent reduced performance or, in the worst case, complete failure. This protection can be offered in the form of a conformal coating or potting and encapsulation resins.
Electroless Ni/Electroless Pd/Immersion Au/Electroless Au (ENEPIGEG) Plating Process For Gold Wire Bonding on Organic Package Substrates
This study examines the wire bonding reliability of electroless gold plating after heat treatment. Results indicate that in the ENIGEG process, the electroless Ni under the immersion Au/electroless Au diffused onto the surface of the gold plating by heat treatment and changed to nickel oxide, resulting in the prevention of wire bonding between the gold wire and the gold plating and a decrease in bonding strength.
New Solder Bumping Technology and Adapted Assembly Processes for 100 µm Pitch Flip-Chip Technology Using Capillary Flow or No-Flow Underfill, Part II
In the continuation of this paper, the authors present new cost-efficient solder bumping and adapted assembly technologies for the processing of flip-chips with a pitch of 100 µm or less and solder ball diameters of 60 µm or 50 µm, respectively.
New Solder Bumping Technology, Processes for 100 µm Pitch Flip-Chip Technology With Capillary Flow or No-Flow Underfill, Part I
The authors of this paper present new cost-efficient solder bumping and adapted assembly technologies for the processing of flip-chips with a pitch of 100 µm or less and solder ball diameters of 60 µm or 50 µm, respectively.
Section 14: PWB Vias, X-Sections
These images of SMT defects and attributes were compiled by consultant Tom Clifford. Section 14 includes images of partially filled vias, plugged vias, wide open vias, non-uniform via covers, annular ring defects, voids, top-side dimples and more. These images provide resources for training, quality control specs and standards and research.
Counterfeit Material Prevention and Detection
In this article, Paul Bodmer, Bruce Tostevin and Scott Mazur, Benchmark Electronics Inc., detail the methods used to prevent and detect counterfeit components for various industries such as telecommunications, military and aerospace. The objective is preventing counterfeit components and material from propagating into the manufacturing process.
Ionic Cleanliness Testing Research of PWBs for Purposes of Process Control, Part I
Many a company has learned the hard way that product reliability is directly related to the ionic cleanliness of a circuit board. In this study, the authors research low-residue and lead-free flux structures, identify solvent compositions that will dissolve these residue types and offer options for performing both bulk and site-specific ionic cleanliness testing methods.
Section 12: SMT Assemblies, T-Cycled Cracks
These images of SMT defects and attributes were compiled by consultant Tom Clifford. Section 12 includes images of non-collapsing BGA balls, CGAs, LCCCs, SMCs, gull-wings, x-sections and more. These images of SMT defects and attributes provide resources for training, quality control specs and standards and research
Component Performance Rising with Energy Requirements
Components that work as expected, and when required, are very important in general, and especially in harsh environments. After all, electronic systems are being used everywhere, from many thousands of feet underground or underwater to outer space.
Section 11: SMT Assembly Defects
These images of SMT defects and attributes were compiled by consultant Tom Clifford. Section 11 includes images of odd via-fill, fiber debris, lead-on-land, bridges, tombstoning, dead-shorts, "type G" defects and more. These images of SMT defects and attributes provide resources for training, quality control specs and standards and research.
Lead-Free in Mission Critical: Failure Is Not An Option
To confidently use lead-free in high-reliability applications, especially considering the EU drive to impose RoHS on some areas currently exempt, it seems prudent to step back and determine where we are, how we got here and what remains to be done. ECD's Grant Peterson guides us through the concerns with lead-free.
Incap Posts 18% Revenue Growth in 1H
Sami Mykkänen, President and CEO, said, "The period's revenue fell short of expectations, as demand was low due to the general economic recession, especially at the beginning of the year. In the second quarter, demand picked up markedly and many customers estimated their needs would increase in the latter part of the year."
Digital Pseudo-Color Inspection Reveals Hidden Soldering Defects
Computational tools that render digitally processed images in pseudo-color can enable inspectors to recognize soldering defects, such as lifted leads and cold solder, in SMT mounting processes. With enhanced images, comparative evaluations to determine cases of defects or no defects are easily accomplished.
SigmaTron Posts 29% Revenue Growth in Fiscal 4Q10
Gary R. Fairhead, President and CEO, commented, "I am pleased to report our third consecutive profitable quarter and, perhaps even more significant, a quarter in which our revenue grew nicely from the levels in quarters two and three."
007 Asian Coverage Expands With SMT Merger
For years, I-Connect007 has been covering the electronics market in Asia. With video and written content, in Mandarin and English, I-Connect007 has been there, on the ground in Asia, digging for the next story. With the acquisition of SMT Magazine, I-Connect007 has deepened and widened its coverage of the Asian PCB assembly market.
Real Time With... Brings Events to Your Screen
Trade shows and conferences are vital to the PCB assembly world. Where else can you meet so many potential customers and suppliers? Still, you can't make every industry event, and if you can’t be there, our Real Time With... video coverage is the next best thing to being there.
Real Time with...EMS Technology Videos
I-Connect007's Real Time with... has produced over 3,000 video interviews, conference presentations and product reviews at major events around the world. Past events include IPC APEX Expo, productronica, IPC Midwest, SMTA International, Mexitronica, NEPCON China and many more.
An Image Library of SMT Defects Section 6: BGA PCB Defects, Metallic Contamination
These images of SMT defects and attributes were compiled by consultant Tom Clifford. Section 6 includes images of solder splash, copper peaks, loose copper as well as other PCB defects that can cause problems at solder stencil printing.
Practical Components Designs Custom Circuit Board Practice Kits and Boards
Practical Components, supplier of solder training kits and materials, mechanical IC samples, or dummy components and SMD production tools and equipment, now designs custom practice PCBs or complete kits.
PCBA in a Wind Tunnel: Watch Thermal Management in Action
In this video, Mike Haskell, Advanced Thermal Solutions (ATS), talks about heat sink design and instrumentation. Using a miniature wind tunnel, he demonstrates how heatsinks change air velocity to cool PCB components.
An Image Library of SMT Defects Section 5: BGA PCB Defects, Mask
These images of SMT defects and attributes were compiled by consultant Tom Clifford. Section 5 highlights bad design, mis-registration, bad mask definition, metal splash, and other via defects on PCBs.
Incap Inks Partnership with Kenyan Thames Electricals
According to the agreement, Incap will design and manufacture inverters for the customer, with the first production sets being delivered in August. An estimated total of 5,000 to 8,000 units will be delivered to the customer this year with annual revenue from these products estimated reach one million euro.
FCT Assembly to Hold Open House at CA Facility
FCT Assembly will hold an open house at its new CA facility on July 12, walking attendees through a variety of processes, from CAD design though laser cutting. Bob Dervaes, VP of technology and engineering for the solder division, will speak.
Outsourcing Out? Some OEMs Choosing Assembly
For years, the industry focused on convincing OEMs to abandon electronics manufacture in favor of outsourcing. Yet, today, some OEMs are looking to bring electronics manufacture in-house. MannCorp Sales Manager Ed Stone explains the factors that are driving OEMs to invest in electronics assembly operations, rather than using the current outsource mode.
Orbotech Outlook: Sustained PCB Growth to Be Driven by Underlying Market Recovery, New Consumer Electronics Devices, and Growing China Presence in PCBs
Barclays Capital offers their insights from Orbotech (ORBK) Analyst Day. The following is from Orbotech’s PCB division presentation. Management discussed the fact that Orbotech continues to supply PCB systems to all of the major PCB manufacturers worldwide, including Samsung, LT, Compeq, Hitachi, Unimicron, Daeduck, Multek, Toshiba, LG, AT&S. Together, these PCB suppliers account for ~80% of the PCBs used in handsets.
New Nozzles, Software, and Equipment for Selective and Wave Soldering
These soldering products include selective soldering equipment, custom nozzles, selective soldering programming software, a compact wave soldering system, and a component lead re-tinning machine.
SPI Built onto a Screen Printer: Pemtron Demos the System
In this video, Steve Wong, Pemtron, showcases Pemtron’s TROI 3D solder paste inspection (SPI) module built onto the SJ Innotech screen printer, at IPC APEX EXPO 2010.
Video Demos: New IC Placer and Printer Technology from Assembleon
In these videos, SMT tours Assembleon's booth at IPC APEX EXPO, looking inside IC placers, chip shooters, feeders, and the printer and squeegee technology on display.
May Manufacturing Report: Growth Overall, But Supplies Tight
The manufacturing sector grew for the 10th consecutive month during May, driven by continued strength in new orders and production. Employment continues to grow. There are a number of reports, particularly in the tech sector, of shortages of components; this is the result of excessive inventory de-stocking during the downturn.
On the Show Floor at SMT Hybrid Packaging: Exhibits Preview II
The following dispensing products, inspection systems, pick-and-place equipment, dummy components and test boards, automation and support tools, and other products will be highlights of the SMT Hybrid Packaging show, June 8-10 in Nuremburg.
Medical Electronics Headed for Healthy Future Growth
This issue of the Henderson Forecast summary explores the rising costs of healthcare and the medical electronics market. Medical electronics growth slowed during the recession but is surging back, thanks to improved device design, expanded healthcare coverage in the U.S., and other factors.
Bed of Nails Test Fixture Using a PCB Rather than Wires
In this video, Craig Pynn, SiFO, shows SMT a bed of nails fixture made for in-circuit (ICT) and functional test (FT). The test fixture eliminates the wire bundle for better signal, less human intervention, and faster fixture turn-around with easy replication. SiFO is based in China.
Visit the Blakell Europlacer UK New Product Introduction and Process Day
Blakell Europlacer, designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, will host a New Product Introduction and Process Technology Day at its manufacturing headquarters in Poole, Dorset. U.K. on June 23. Activities include expert presentations, a live SMT assembly line, and World Cup viewing party.
Video Interview on Pick-and-Place Feeders: Refurbished or New?
Dee Claybrook, Rapid Tooling, discusses the benefits of refurbishing and repairing pick-and-place feeders. Juki legacy feeders are compatible with the latest systems. Watch this video interview from IPC APEX EXPO 2010, held in Las Vegas in April 2010.
On the Show Floor at SMT Hybrid Packaging: Exhibits Preview I
The following solders, flash programmers, reflow oven profilers, feeders and pick-and-place systems, printers, inspection systems, and other products will be highlights of the SMT Hybrid Packaging show, June 8-10 in Nuremburg. Stay tuned to SMT’s Website, www.smtonline.com
, for more previews of the tradeshow.
New Products for Process Control in the PCB Assembly Facility: MES/ERP, Barcode Readers, and More
These new products include machine controllers, ERP software, a barcode scanner, laser marker, ESD control, MES, and other line-control products.
Flextronics, Jabil, Celestica, Others Present Business Outlooks
Organic growth versus mergers/acquistions? Lead times improving? How are the end markets? EMS providers Flextronics, Celestica, Jabil, and other electronics supply chain companies shared outlooks at the 7th annual Credit Suisse Electronics Supply Chain Conference. Read the main points summarized by Credit Suisse analysts William Stein, CFA, and Rahul Chadha.
Dispensing Valve Maker VERMES Technik Spins Out of Woellner as VERMES Microdispensing, Essemtec and Promess Hold Stock
VERMES Technik, the manufacturer of fast piezoelectric dispensing valves, has been spun out of the Woellner Group and turned into VERMES Microdispensing GmbH. The two new stockholders are Essemtec and Promess.
Gartner: Worldwide Mobile Phone Sales Grew 17% YoY in Q01 2010, Smartphone Sales Grew 48.7%
Among the most successful vendors were those that controlled an integrated set of operating system (OS), hardware and services. Smartphone sales to end users saw their strongest year-on-year increase since 2006. RIM, a pure smartphone player, made its debut in the top five mobile devices manufacturers. Apple increased its market share by 1.2 percentage points. Android’s momentum continued into the first quarter of 2010, particularly in North America, where sales of Android-based phones increased 707% YoY.
Nitrogen Generation from On-Site Gas: Look Inside the N-20
Bob Wolff, On-Site Gas, opens up the N-20 nitrogen generation system, explaining how the system makes nitrogen from the ambient air, for use in electronics assembly processes. This video is from IPC APEX 2010 in Las Vegas.
Watch Nordson Asymtek Conformal Coating Dispense Technology
Dan Ashley, Nordson Asymtek, talks about dispensing applications for conformal coating. Spray, bead, and jetting dispense of coatings are discussed, as well as solder paste and underfill dispensing. Watch the Nordson Asymtek dispense heads in action in this video from IPC APEX EXPO 2010.
Video Demonstration: Christopher Associates Shows Panel Cleaner
At IPC APEX EXPO 2010, Michael Moreau of Christopher Associates demonstrates a modular, flexible circuit board panel cleaner. This panel cleaner can remove lint and other contaminants from both sides of a flex circuit panel, one side of a panel with SMT components on the other side, etc.
Season Group Explains Why It Acquired US-based EMS Headquarters
Season Group acquired the assets of DC Electronics, a San Antonio, TX EMS provider, retaining all DC Electronics employees in Season Group USA. Season Group tells SMT why it added U.S.-based electronics assembly to its Asian and Canadian locations.
Consumer Electronics Sales Overall Trend Down; LCD TVs, PCs Continue Growth
The percentage of U.S. broadband households purchasing CE continues to decline year over year, falling from 87% in 2007 to 76% in 2009, according to international research firm Parks Associates. LCD TVs and PCs are exceeded sales expectations, which could indicate better revenue streams for savvy consumer electronics OEMs.
Bigger Facility for Macrotron, Enhances eReader Production
EMS provider Macrotron Systems Inc. moved its Fremont manufacturing facility across town to a former Intel building. The facility offers 40,000 square feet for electronics manufacturing and customization, particularly for the company’s Dittobook eReader production.
A Bad Economy Can Actually Help Future Growth
Arnon Tuval, President of ORPRO Vision LLC, discusses the acquisition of Orbotech's AOI division. The change-over was important to both companies--they worked together to meet with customers, making sure the right actions were taken in the move forward. The bad economy actually helped--the company took its time and made sure no opportunities were missed.
Tom Sharpe, SMT Corp., Will Keynote SMTAI with Counterfeit Awareness Message
The SMTA Annual Meeting and Awards Ceremony at SMTA International (SMTAI), October 27, 2010, will feature SMT Corporation's VP Tom Sharpe as the keynote speaker.
SMTC's First Quarter Revenue Up 37% YoY
John Caldwell, President and CEO: "We continue to see signs of economic recovery. We experienced wide spread increased customer orders in the first quarter and, thus far, in the second quarter. With this strong order intake combined with a large opening order backlog, we expect continued sequential second quarter revenue growth."
Present at IPC APEX EXPO 2011
Submissions dealing with reliability, head-on-pillow and lead-free repair and rework, as well as new research in growing areas such as photovoltaics and printed electronics are especially encouraged for IPC APEX 2011, April 12-15, 2011 in Las Vegas.
Small, Midsized Industrial Manufacturers Expect Better 2010, More Sustainable Products
The main challenge for small and midsized manufacturers in the year ahead will be to manage the increase in demand with capacity, monitoring how much of the uptick is due to inventory replenishment verses customer driven demand, and matching that with throughput and hiring decisions. This report comes from buying consortium Prime Advantage.
Williams Says He's Got "Big Shoes to Fill"
Dan Feinberg interviews his replacement as Chair of IPC's Government Relations Committee, DDi Corporation's Mikel Williams. Williams admits he's got some big shoes to fill, but is excited to support IPC in Washington D.C., especially as the organization works with the DoD and investigates "green" movements.
Watch Capacity Change on a Siemens SX Placement System
In this video, a Siemens technician adds capacity to a Siemens SX pick-and-place machine at APEX 2010. The many reasons to rent capacity, rather than purchase the maximum throughput/capacity on a system or upgrade traditionally, are discussed. Additional specifications of the SX placement machine are covered.
Henkel Reports Positive Q1 Results; Sales Up 7.8%
In the first quarter of 2010, Henkel generated sales of 3,512 million euros. In a recovering market environment, this constitutes an increase of 7.8% compared to the figure for the prior-year quarter. Henkel is confident of again outperforming its relevant markets in terms of organic sales growth.
NASA Anti-Counterfeiting Measures Fall Short of Validating Parts Authenticity
In 2009, a NASA probe project was delayed nine months and exceeded its budget by more than 20%, partly because of a counterfeit part. According to BrandWatch Technologies, brand security and product authentication solution provider, the problem extends beyond NASA’s dollars and timelines; risking personal safety, diminishing confidence in U.S. aerospace programs, and impacting the businesses of legitimate component manufacturers.
In-Stat Analysis: How Long Will the Apple Garden Last?
Apple, by all accounts, is a very successful high-tech company. The most recent success of the iPad demonstrates Apple’s unique position in the market as a device OEM and content aggregator, which allows it unprecedented interaction and interface to the customer for the device and the content and applications. In the process of developing a complete solution, Apple controls just about every step in the value chain. Jim McGregor provides this analysis on Apple for In-Stat.
Flexible Printed Circuit Boards: Global Strategic Business Report
This report from Research and Markets analyzes the worldwide markets for flex PCBs by end-use markets and production region (2007-2015). It includes an introduction to flex circuits, including PCB types, materials used to make flexible circuits, and the benefits of using flex over rigid PCBs.
EMS Merger and Acquisition Activity in Q01 Shows Expansion Drive: Lincoln International
There was an increase in Q'01 M&A activity compared to the previous four quarters. EMS companies are expanding well beyond their core manufacturing competencies. Overall, the economic conditions appear to have stabilized, creating created an opportunity for companies to pursue strategic investments within the EMS sector, according to this report from Lincoln International.
Pick-and-Place Takes Over More Functionalities: New Products
With changes in software, nozzles, drive systems, feeders, and other elements, pick-and-place systems can place bare die or LEDs, perform high-speed IC shooter functions, handle large connectors and other oddforms, etc. New products come from Siemens Electronics Assembly Systems, Count On Tools, Universal Instruments, Essemtec, MYDATA, Assembleon, and IPTE.
Etek Europe Launches Used SMT Division
Etek Europe Ltd, supplier of quality SMT equipment and services throughout Europe, launched a new division, Etek Used SMT, selling premium used equipment with a comprehensive warranty.
North American PCB Book-to-Bill Still Strong, Growing in March
“In the March data, we can really see the recovery in full swing,” said IPC President & CEO Denny McGuirk. “Rigid PCB bookings grew in double digits and continued to grow faster than shipments, which has kept the book-to-bill ratio strongly positive for the past 10 consecutive months. Both rigid PCBs and flexible circuits are gaining strength.”
IDC: Worldwide Electronic Manufacturing Services Will Return to Steady, But Uneven Growth in 2010
The EMS industry contracted by 11% in 2009, less than expected due to a resurgence of consumer spending late in the year. According to a new forecast from IDC, the EMS industry will enjoy a CAGR of 8% for the 2010-2014 forecast period. But the recovery is still on shaky ground, with periods of weakness expected into 2011.
New PCB Design and Device Programming Products
These design and device programming tools enable easier PCB assembly test, less complicated design updates, faster design, and easier integration of oddform components, among other benefits. Products come from ATS, EMA Design Automation, Numerical Algorithms Group, Stratford Digital and LogicSwap, ASTER Technologies, DfR Solutions and ARINC, Zuken, BPM Microsystems, and AVX.