A Look at the High-Reliability Interconnect Market
In an interview with I-Connect007, Mark Cormier of Miraco Inc. discusses his company's activities and capabilities, the latest trends and drivers in the high-reliability segment, and their strategies when it comes to managing their assembly work as well as their audit processes to find EMS providers.
Industry 4.0: Who Benefits?
After many cycles of ROI justification have occurred already in most PCB assembly manufacturing companies, people are realizing that innovation and investment in new systems may affect them in ways that are less than optimum, resulting in certain groups within the organization resisting pretty much every major innovation. Along comes Industry 4.0, which could certainly trigger a significant amount of “automated” objection from the shop floor.
Reliability Study of Bottom Terminated Components (Part 2)
In the finale of this two-part article series, the authors discussed their thermal cycle tests, as well as the impact of solder voids in the thermal pad of the BTC. They also touched on BTC thermal modeling, as well as determined the acceptable amount of solder voiding in a thermal pad for devices with power dissipation greater than 3W.
EIPC Summer Conference: Day 2
Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.
Beating the Supply Chain Challenge
SMTC’s Seth Choi, vice president of global supply chain management and procurement—who is also responsible for strategic sourcing, pricing, assurance of quality, speed-to-market, and the continuity of supply in order to support global SMTC procurement strategies—discusses how the supply chain has evolved over the past few years; the role of a supply chain manager in an EMS company; how SMTC is lowering their procurement costs; and what strategies they’ve set up in place to ensure the integrity and security of their manufacturing value chain.
EIPC Summer Conference, Berlin: Day 1
Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.
A Review of the Opportunities and Processes for Printed Electronics (Part 4): Applications
In Part 4 of this five-part article series, Happy Holden talks about the market applications for printed electronics. He writes that while there are several areas for application of PE solutions, such as in sensing, identification and security, and power, it is the display segment that is considered to be the most interesting potential application.
A Review of the Opportunities and Processes for Printed Electronics (Part 1)
As microsystems continue to move towards higher speed and microminiaturization, the demands for interconnection are opening up new opportunities for "innovative" interconnects. In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.
Inspection: The Last Line of Defense
Traditionally a non-value-added step, inspection is still the best, last line of defense against defects and a bad reputation. In this interview by I-Connect007 Publisher Barry Matties, Viscom’s Guido Bornemann discusses the true value of inspection and how to best use the tools to prevent defects, including head-in-pillow, from being shipped to customers.
American Standard Circuits’ Unique Offerings Contribute to Long-term Success
At the recent IMS RF and microwave show in Phoenix, Arizona, Anaya Vardya, CEO of American Standard Circuits, sat down with I-Connect007's Barry Matties to discuss the current market trends, the company's recent equipment investments, and where American Standard Circuits' growth will likely come from.
In-line Solder Penetration Testing with 3D X-ray Inspection
Although through-hole technology can be considered the oldest assembly technology in the field of PCB manufacturing, it still has its place even in this modern age of surface-mounted technology. To this end, through-hole components were devised for automatic assembly and for high thermal loads in the furnace, which led to the birth of through-hole reflow.
New Embedded Component Standard Finalized
Solberg Technical Consulting's Vern Solberg talks to I-Connect007 about the recently launched standard, the IPC-7092, which focuses on embedded component technology. According to Solberg, this new standard took the earlier standards involved with passive devices, and combined it with standards on newer technologies using active devices, to help form components that can be manufactured and placed on layers within the PCB.
In 3D Inspection, Can 'Length = Height' Mean No Escapes?
During the recent NEPCON China show in Shanghai, I interviewed Kobi Ventura of ALeader Europe, an Israeli-Chinese joint venture with ALeader Vision Technology Ltd., which focuses on SPI and AOI inspection equipment. All of the machines are built in a state-of-the-art factory in Guangdong, China. Utilizing a unique length-equals-height modeling approach to inspection, Kobi states that they offer 100% escape-free technology, and it comes with a guarantee.
High-Density Interconnect and Embedded Board Test
Consumers’ insatiable demand for feature-packed, thin, lightweight, and energy-efficient devices is spurring the need for HDI technology. With new electronic functions constantly being integrated into a SoC encapsulated in a less than 0.5 mm pitch array package, the future looks bright for embedded board test (EBT).
Enclosed Media Printing as an Alternative to Metal Blades
The evolution of PCBs in terms of the miniaturization of assemblies, components, and ever-finer feature print patterns has not slowed, and as a result continues to present ever-increasing challenges to the makers of assembly equipment and solder paste printing technology, narrowing the process window. In this article, Michael L. Martel discusses how enclosed media print head technology has kept up to these challenges.
NEPCON China 2015 a Resounding Success in Shanghai
The three-day event was a complete success, bringing together nearly 22,000 trade visitors and high-quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide. NEPCON China keeps up with market trends and gathers resources from all stakeholders to present a comprehensive event that covers SMT, new electronics materials, soldering, dispensing, electronics automation, measurement and other innovative technologies and products across the world.
iNEMI Managing Director: New, Disruptive Technology on the Horizon
Dr. Haley Fu, managing director of Asia Pacific for iNEMI, and Publisher Barry Matties spoke recently. Fu gave her overview of the last eight years with iNEMI along with her opinion of what the most significant changes have been, globally and for the Asia market in particular. She predicts that in the future, the PCB will probably adopt optical architectures instead of copper, because using copper for the trace means that the land space and the property will not satisfy the future high-speed data transport rate.
Final Test Solution of WLCSP Devices
The common back-end process flow for mobile WLCSP devices is a single- or dual-insertion test at wafer probe. Since there is no final test prior to tape and reel, this equipment typically needs to provide a 5-side device inspection to identify potential device damage from sawing. The inspection efforts are quite demanding, with defect recognition requirements in the range of only 10 to only 20 microns, resulting in frequent time and cost intense human interaction and support requirements.
BGA or CGA: When Is It Right for You?
In this interview with TopLine President and Founder Martin Hart, I-Connect007 Publisher Barry Matties focuses on column grid array (CGA) and how CGA can solve delamination problems. CGAs, also known as CCGA, are not necessarily new but are making a strong comeback in the high reliability market.
A Look at Saki’s Approach to 2D, 3D and X-ray Technology
At NEPCON 2015, I-Connect007 Publisher Barry Matties sat down with Nori Koike, COO of Saki Japan, to discuss the latest demands for 3D and their approach to inspection. With more than 20 years of experience, they have built a line-up of tools that covers the inspection spectrum. Koike also stresses the importance of using inspection data as a tool to improve and automate the process.
Material Witness: How About that Technical Roadmap!
You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.
CyberOptics: Honing in on the High-Reliability Market with 3D AOI and SPI Platforms
I-Connect007 Publisher Barry Matties and CyberOptics’ Sean Langbridge spent time together in China recently, where they discussed, among other things, the company’s newest product launch, a 3D AOI and SPI platform. Langbridge also discusses the latest requirements for inspection.
IPC Validation Services 2014
Guest Editor Judy Warner talks with IPC's Director of Validation Services, Randy Cherry. Randy has been busy since launching IPC's Validation Services a year ago, with 16 QML audits completed and rapidly growing interest shown at this year's show. Randy also discusses future plans for auditing to IPC intellectual property standards 1071A and 1072, as well as to PCB standard 6012.
Jetting Strategies for mBGAs: A Question of Give and Take
Among the alternatives for the deposition of solder paste and other fluids on a PCB is jetting, which offers advantages concerning precise volume repeatability, software control and local volume control. The goal of this study is to examine the effect of piezo actuation profile on deposit quality with respect to positioning, shape and satellite levels in order to achieve adequate deposition quality for applications such as 0.4 mm BGA.
EchoStar’s Les Beller Shares the PCB Design-to-Fab Process
Recently, I-Connect007 Publisher Barry Matties had the opportunity to interview Les Beller of EchoStar Technologies. Beller’s career began in the early 1980s as a circuit board designer, eventually leading him to EchoStar, where he has managed the PWB design group and spent time as a PCB quality engineer. He is now a manufacturing process engineer specializing in DFx. In this interview, Beller focuses on the many challenges circuit board designers face, strategies for bridging the gap between circuit design and fabrication, and the future of circuit designers.
A Conversation (and Day) with Joe Fjelstad, Part 5
Our five-part interview series with Verdant Electronics Founder Joe Fjelstad wraps up with a look back at the point when Fjelstad’s career began focusing on circuit board technology, and he details his patented Occam process, and why this game-changing, disruptive technology has yet to become standard practice in the industry. Also explained: Why Fjelstad has been referred to as an “iconoclastic polemicist,” and how a Native American story he heard long ago has resonated throughout his career and life.
0.3% Humidity, That's Super Dry!
Sitting down with Guest Editor Mark Thompson, Super Dry's Richard Heimsch describes their powerful new dry unit which is capable of 0.3 % relative humidity. Recovery after doors have been opened is lowered super fast in the storage cabinet, able to reach the "safe zone" within three minutes.
Reliability Assessment of No-clean and Water-soluble Solder Pastes, Part II
Twenty-five years ago, solder paste residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were available, either with solvent or by using water, with or without detergent. Now, the assembly world is mainly no-clean: paste formulation is safer in terms of chemical reliability and process costs are reduced without cleaning.
Shax Engineering: The Biggest Little Board Shop in the Bay Area
In a recent visit to Shax Engineering, Barry Matties had the opportunity to interview Isam Shakour, founder and president of Shax Engineering. This little San Jose, California company is a complete turnkey operation, providing PCB layout, fabrication, and assembly services. We discussed the company’s growth since its 1998 founding, and Shakour’s plans for Shax going into the future.
A Conversation (and Day) with Joe Fjelstad Part 3
In Part 3 of this interview series, Fjelstad divulges his interesting entry into the electronics manufacturing industry, including a brief diversion as a restaurateur. In this portion of the interview, the pair was touring the Evergreen Aviation and Space Museum (home of the Spruce Goose) where Fjelstad spoke frankly about his experience in Vietnam and how it has shaped his view about war, which he shares. Finally, the importance of education was discussed, as well as India, and why the rest of the manufacturing world should be paying attention to them.
Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
Optimization of a reflow profile often focuses on mitigating defects such as voiding, tombstoning, graping, and slumping/bridging. But little thought is given to the reflow profile’s effect on the electrical reliability of the no-clean flux residue. Because of the wide variation in size and thermal density of SMT components and PCBs, achieving a reflow profile that equally heats the entire assembly can be challenging and often impossible.
A Conversation (and Day) with Joe Fjelstad, Part 2
In Part 2 of this multi-part interview series, Verdant Electronics Founder and CEO Joe Fjelstad, and I-Connect007 Publisher Barry Matties discuss the future of what’s to come for the electronics industry, which, according to Fjelstad, has a lot to do with where we’ve just been in our quest for lead-free manufacturing. He also offers his view on the natural order of the evolution of personal political persuasions.
Enhancements in Consolidating Data Prep
Valor's principle of consolidating data once then using it in multiple areas downstream, for example stencil design, pick and place programming and test machine programming, has now been extended to include X-ray inspection programming. Mark Laing explains how.
A Conversation (and Day) with Joe Fjelstad, Part 1
I-Connect007 Publisher Barry Matties and industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met recently to spend a day together enjoying the Evergreen Aviation & Space Museum (home of the Spruce Goose), located in the Oregon community of McMinnville. Their conversation ebbed and flowed between a wide variety of topics, from the electronics industry, to political shenanigans and the “war against failure.” In Part 1 of this multi-part series, Fjelstad introduces his “war against failure” idea, and what went terribly wrong in the advent of lead-free manufacturing.
SJIT, Solder Joint Integrity Test, To Find Latent Defects in Printed Wiring Board Assembly
Capacitance method and IEEE 1149.1 or boundary scan method are often used to find opens between component leads and pads on a printed wiring board. These methods, however, can find complete opens or complete shorts only; and latent defects that can be complete defect after several years have not been found by the conversational method. This article talks about a method to find such latent defects by using 4-wire small resistance measurement technique.
Zentech: Expanding EMS Solutions and Supporting Innovation
Zentech CEO and President Matt Turpin sat down with I-Connect007 Publisher Barry Matties recently for a wide-ranging discussion of the state of both domestic and global manufacturing, and Zentech’s recent acquisition that will significantly expand the company’s capabilities. They also focused on supply chain issues, automation, regulations, and the importance of STEM education in the U.S.
NEPCON China Showcases Latest Manufacturing Tech in Asia
Considered Asia's biggest, most influential SMT and electronics manufacturing event, NEPCON China 2015 attracted over 450 leading brands from 22 countries, who are showcasing this week the latest electronics manufacturing technologies and products across an exhibition area of 25,000 sqm. I-Connect007 is on hand again this year covering this event with exclusive interviews and photos from the show floor.
Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”
I-Connect007 Publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry, and Vaughan detailed Zentech’s involvement with National Manufacturing Day, a nationwide effort focused on STEM (Science, Technology, Engineering and Math) that simultaneously brought high school students together with 1,600 manufacturing companies from around the U.S.
Hunter Technology’s Two Newest CID Recipients Discuss Certification
I-Connect007 Guest Editor Kelly Dack spent time at Hunter Technology’s Silicon Valley plant, where he had the opportunity to sit down with two recent CID certification recipients, Jeff Davidson and Zev Gross, who recently completed Dack’s CID training program. The two also discuss the benefits of achieving certification and their plans to take the advanced course.
How to Streamline PCB Thermal Design
Thermal issues with a PCB design are mostly determined during the component selection and layout phases. After this point, only remedial actions are possible if components are found to run too hot. John Parry discusses how addressing thermal issues early in PCB design, starting at the system or enclosure level, can help streamline the entire process.
Doing Business in India and China
Electrolube Managing Director Ron Jakeman spoke to I-Connect007 Publisher Barry Matties at CPCA 2015 in Shanghai. The company, more than 70 years old, has evolved over the decades, from producing contact lubricants, to manufacturing globally, with subsidiaries worldwide, including Beijing, China. In this interview, manufacturing, state of the global markets, and even Indian cuisine are discussed.
Product Line Philosophy: Start Small...End Big
Ralph Savage, CEO of EasyBraid, talks to Kelly Dack about his company started their business, as well as some of the activites and technologies they are doing now, such as desoldering, stencil cleaning and a soldering technology based on the Curie principle. He also discussed the company's strategy in bringing world-class technology into the United States.
Raising a Unified Voice for an Advanced Manufacturing Economy
The electronics manufacturing industry is an important sector in the global economy, and John Hasselmann, VP of Government Relations at IPC, is an advocate for policies that will help our industry as well as the prosperity and welfare of billions of people.
Hunter Technology on Design Operations and Business Strategies
Immediately following IPC APEX EXPO 2015, Guest Editor Kelly Dack paid a visit to Hunter Technology’s facility in Milpitas, California, where he interviewed Ian Grover, vice president of design engineering, and Chris Alessio, vice president of sales and programs. Discussed are Hunter’s design operations as well as the company’s overall business strategy.
Trending at Freedom CAD: New Crop of Next‐Gen Designers
Scott McCurdy, director of sales and marketing at Freedom CAD Services, expresses his vision for what North America is bringing to the table in the world of circuit design. I‐Connect007 Publisher Barry Matties and McCurdy also discuss China, trends in product design, tools, and more.
Japan’s Thermosetting Plastics Association Represents at IPC APEX EXPO 2015
At the International Reception, held opening night of IPC APEX EXPO 2015, I-Connect Technical Editor Pete Starkey made the rounds and found some visitors from Japan, namely, Kazutaka Masaoka, from Thermosetting Plastics Association (JTPIA). In this brief interview conducted amongst the reception attendees, Masaoka-san and Starkey discuss Japanese vs. North American circuit board quality and business trends.
Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts
At IPC APEX EXPO 2015, I-Connect007 Technical Editor Pete Starkey caught up with EIPC's Michael Weinhold and Alun Morgan, who were happy to discuss both recent and ongoing focuses for EIPC, namely, reliability. Also touched on was the importance of the alignment of global standardization processes, especially for Asia.
Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans
I-Connect007 Publisher Barry Matties caught up with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox's expansion plans for North America (Tempe, Arizona and Guadalajara, Mexico) and Malaysia (Penang). Dill also describes the highly successful veteran’s training program, which is being spearheaded at the Blackfox headquarters in Longmont, Colorado.
Bob Neves Receives Award, Talks Bergman Tribute
I-Connect007 Publisher Barry Matties sat down with Bob Neves, one of the first recipients of the Dieter Bergman Fellowship award, to talk about the tribute held for Dieter on Wednesday night of IPC APEX EXPO 2015, and some of the reasons behind the newly created award.
Tin Whiskers: Why Testing Temperature Can Change the Outcome
Tin whisker phenomena have been observed and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. In this article, Dr. Jennie Hwang discusses why temperature is one of the key variables that drive the tin whisker phenomenon, mechanism and how the underlying science operates.
Minimizing the Risk of Tin Whisker Formation in Lead-Free Assemblies
Although tin whiskers are very small crystalline fibers, they have reportedly caused multiple NASA satellites to become inoperable, automotive accelerator pedals to become unusable and a nuclear reactor to malfunction. The risk, however, can be minimized by specifying material sets that are less likely to produce tin whiskers.
2015 EIPC Winter Conference, Munich: Day 1 Review
Ninety delegates, eleven countries represented and a thought-provoking two-day programme on themes of reliability in PCB fabrication and assembly, copper cleaning and advanced material solutions, advanced imaging and soldermask, and how to make PCBs smart and ready for Industry 4.0. Add the further attractions of a keynote by Walt Custer and the chance to visit a military aircraft assembly plant: the formula for another highly successful EIPC Conference, this time close to Munich Airport.
Essemtec Features Paraquda at Automaticon
At the upcoming AUTOMATICON 2015 exhibition, taking place March 17 - 20 in Warsaw, Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its award-winning Paraquda in booth B28, hall 1.
California Congressman Mike Honda Discusses American Manufacturing
Barry Matties, Publisher of I-Connect007, sat down with Congressman Honda, who represents District 17 in the Silicon Valley, and talked with him about American manufacturing, infrastructure, education and some of the current thinking in America. According to Honda, "The policies we pass and the things we do in D.C. that negatively impact our economy...a lot of those guys who don’t support some of the positive things we want to see happen don’t really understand that it impacts their districts, their social services, health and business."
Wearable Tech Back to a Healthy Development Pace
Wearable tech was a major sensation in 2014. The wearable tech industry generated extensive interest among media, investors, start-ups, wearable tech enthusiasts, technology leaders and trade fairs. Many events were held around wearable products and industry last year. The trend for early 2015 has seen the industry fall back into a healthy developmental pace. Investors are keen to see a return on their capital injections and former start-ups are now reaching maturity.
Nordson EFD Demos Fluid Dispensing Systems at MD&M
Nordson EFD, a Nordson company, the world's leading precision fluid dispensing systems manufacturer, will demonstrate its new series of automated fluid dispensing systems at MD&M West in Anaheim, California on February 10-12, 2015 in booth #3335. Nordson EFD's new systems combine precise dispensing with fast and easy programming and are easily integrated into any manufacturing operation. These closed-loop systems ensure that the dispensing process stays in control. Customers will benefit fro…
The Power of Counterfeit Component Detection, Prevention, and Mitigation Training
The counterfeit component landscape is changing, and there is a need to continuously improve and stay on top of current detection training techniques for the prevention and mitigation of counterfeit electronic components.
The Rise of Structural Electronics
Structural electronics is one of the most important technological developments of this century. It forms a key part of the dream, first formulated 30 years ago, of computing disappearing into the fabric of society. It also addresses, in a particularly elegant manner, the dream of Edison in 1880 that electricity should be made where it is needed.
Assembly and the Quest for Solder Alloy-Free Electronics (SAFE)
"As first brush, the title's suggestion that solder can be eliminated from the assembly process may appear absurd. Everyone related in any way to this industry knows solder is the universally accepted way of connecting components to printed circuits in electronic assemblies. Thus, the fact that many knowledgeable people in the industry might scoff at the notion solder can be eliminated comes both without surprise and a certain amount of resignation," writes Joe Fjelstad.
Sanmina: Automation in Production Lines
With so much discussion about the increasing amount of automation in the world of electronics assembly Editor Richard Ayes asked Gelston Howell, senior VP at Sanmina, to provide perspective on the state of manufacturing automation. Howell discusses the current state of automated electronics assembly systems, the inherent risks and challenges, and the future of robotics in manufacturing.
The Essential Pioneer's Survival Guide: Reshoring Made Simple
Companies are realizing the pros of offshoring are no longer what once they were and that the cons are becoming more significant. Is reshoring really commercially viable? This reshoring opportunity, coordinated with the seemingly unstoppable current market trends, can either be taken advantage of now, or if delayed, could represent the final loss of onshore manufacturing opportunity.
Assembly with Solder - An Unblinking Look at
While soldering holds many benefits in terms of offering a means of mass assembly of components to PCBs and is fundamentally simple, its application is much more complex and fraught with opportunity for defects to be generated, but it is also the demon we have elected to live with, for as the old saying suggests: "Better is the devil we know."
BEST, Inc.: Branching Out to Bare Board Rework
Bob Wetterman, president of BEST, Inc., joins Guest Editor Mark Thompson to discuss the company's move into reworking unpopulated boards, building products that facilitate faster rework and repair, and IPC certification and training.
Sustainability: What and Why?
Joe Fjelstad writes, "The resources of our planet are limited and thus are diminishing as we continue to unleash and ramp-up a seemingly never-ending flow of products to both serve and amuse us with output of the global electronics industry likely to be nearing the top of the list of 'offenders.' In that regard, we are becoming victims of our own success, to one degree or another."
Thru-hole Lead-free Soldering and Rework Concerns
Despite the industry's switch to SMT from thru-hole for almost three decades now, thru-hole has not disappeared yet, and don't expect it to any time soon. The most common way to solder thru-hole components en masse is by wave soldering. For tin/lead, the wave pot temperature for soldering thru-hole components is generally maintained at 260°C.
Supplier Selection Key to Assembly Reliability
As with any electronic assembly, or electronic device for that matter, the quality of the raw printed circuit board is the most critical link in the product reliability chain. According to Steve Williams, the key to managing this risk is the supplier selection and qualification process.
From the Show: A Hands-on APEX Session
On the first day of APEX, IPC and three instructors from BEST decided to bring a more pragmatic approach to a PCB repair topic taught in the technical program. Along with 24 participants, the instructors from BEST led a hands-on reballing session. After a lively, highly participative 60-min. question and answer session on the fundamentals of reballing, the reballing process, and its various attributes, participants eagerly began the hands-on session.
STEP 10 Rework and Repair: The Complete BGA Rework Process
Robert Avila and Wade Gay, Finetech, describe the steps to BGA rework, aided by video clips of rework in action. There are at least five steps in successfully completing the cycle for BGA rework. These steps, which include component removal, site cleaning, reballing, and soldering, do not change, independent of whether or not the BGA is on a PCB that is large, small, thin, or thick, etc.
Step-by-Step - Step 10: Rework & Repair
Modern PCBs, with higher component density and shrinking component and trace/space dimensions, can be successfully modified, reworked, and repaired even while being processed in today’s lead-free and mixed-alloy rework-and-repair environments.
SMT Welcomes Advisory Board Members
SMT Magazine welcomes Laura J. Turbini, Ph.D., and Harald Wack, Ph.D., to its Editorial Advisory Board. The Board offers insight on the industry, future trends, and market technology; members write columns such as "Speaking of Process Optimization," "Speaking of Cleaning," and more. Turbini and Wack will join 10 other industry experts that analyze the SMT industry from every possible angle.
New Electronics Industry Award Named After Company Founder
Vishay Intertechnology, Inc. announces that Dr. Felix Zandman, founder, chairman, CTO and business development officer, has had a new award named after him by the Electronic Components, Assemblies & Materials Association (ECA). The Dr. Felix Zandman Award was officially presented on March 20 at the CARTS (Capacitor and Resistor Technology Symposium) event in Palm Springs, Calif., in conjunction with the 25th anniversary of CARTS USA.