Solder Printing Process Inputs Impacting Distribution of Paste Volume

The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Tips & Tricks: Generating Stencil Tooling

Many engineers are leaving the editing up to the stencil fabricator these days. From the outside, this may appear as a time saver for process engineers, but considering how many stencil redos have been required and how many processes that have run 'sort of OK,' there's a tremendous amount of scrap and rework that could be saved from just a little more attention paid to stencil tooling.

Improving Solder Paste Printing

Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

9 Ways to Keep Up with Changes in Manufacturing Technology

The world of manufacturing technology might not be quite as fast to change as consumer electronics, but it is evolving, and faster than you think. Recent evidence shows that companies are increasingly adopting 'servitized' business models and technology is a key enabler, so falling behind the times is not really an option.

Two Questions to Ask Yourself with PCB Continuous Strips of Parts

Sometimes, you don't want to buy a reel, full or partial, but still want your PCB parts all in one continuous strip. Everyone wants to use up their odds and ends, but once those are gone, it's easier for you if each part is one strip. If you want to save a little money and can use a longer turn-time, you might want to choose a short-run production service with continuous strips.

Insights from productronica

The recently held productronica was a busy exhibition. There were booths that were so crowded that people were standing in the aisle to talk with company representatives. But some booths were nearly empty. Read to find Dieter G. Weiss' comments on this biennial show.

Equipment Matters in Solder Paste Printing

The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

Tips & Tricks: What to Do if You Can't Have Reference Designators on Your Board

Sometimes, you can't have reference designators on your board. Perhaps it's because it's too densely populated and there isn't room. Or maybe, for aesthetic reasons, you've chosen to leave them off. Here's how you can address that issue.

What Matters Most is Communication

While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.

DFx on High-Density Assemblies

Use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process, and reliability. The type of end product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end products will look very similar, but specification limits would be different.

Is Your EMS Provider The One for You?

No matter where you are in your outsourcing journey, ensuring that your EMS provider is right for you is one of the most important success factors. The right partner should bring you years of pain-free manufacturing that has the ability to evolve and adapt to your needs as your business grows.

Via-in-Pad Plated over Design Considerations to Mitigate Solder Separation Failure

Under certain conditions, the use of VIPPO with other pad structures within a BGA footprint can result in a unique failure mode in which the BGA solder joint separates between the bulk solder and the intermetallic compound either at the package pad or PCB pad interface, depending on whichever is the weaker interface. It can be either a complete or partial separation and hence, may or may not be detected at ICT/functional test.

Video from productronica 2017: YXLON Moves Away from One-Size-Fits-All Approach

Keith Bryant, global director for electronics sales at YXLON International, speaks with I-Connect007 Technical Editor Pete Starkey about their latest X-ray inspection machines that are designed as a specific fit for its own market sector. He also talks about what's state of the art right now in X-ray inspection systems, as well as updates on the progress of the integration of SMART Group into the SMTA.

Nancy Jaster Brings Manufacturing, Design Background to Designers Council

Nancy Jaster was recently named the head of the IPC Designers Council. At the recent AltiumLive 2017 event, I spoke with Nancy about her unique background in both design and manufacturing, and how she hopes to use that experience and mindset to revitalize the Designers Council going forward, particularly with the International and student chapters. We also discussed her plans to bring more young people, particularly women, into the industry.

Video from productronica 2017: Rehm Discusses Trends Driving Product Development

Michael Hanke, chief customer officer of Rehm Thermal Systems, speaks with I-Connect007 Managing Editor Andy Shaughnessy about the importance of communicating with their customers when it comes to new process and technology trends. He also talks about Industry 4.0 and big data, and process monitoring and transparency.

Zuken Teams With Nano Dimension for 3D Printing Design Flow

At PCB West, Zuken shared a booth with Nano Dimension. Zuken has been working with Nano Dimension for some time, and adding support for 3D printing and nanotechnology to its design tool platforms. I sat down with Zuken’s Humair Mandavia and Nano Dimension’s Simon Fried to learn more about this alliance, and to find out more about this odd-looking box being demonstrated in Zuken’s booth.

How to Ensure Good Service from Your EMS Partner

What does good service mean from an EMS provider? Sure, it’s about consistently delivering products, on time, and to a high quality. But there's more to it than that. This article highlights two factors to consider when choosing an EMS provider to ensure good service and a strong, healthy and happy outsourcing partnership.

Video from productronica 2017: Heraeus Highlights Need for Highly Reliable and Compatible Assembly Materials

At the recent productronica 2017 event in Munich, Germany, Stefan Merlau, global product manager of assembly materials for Heraeus Electronics, discusses with I-Connect007 Managing Editor Andy Shaughnessy the biggest pain points of their customers, and how his company’s latest technologies are helping them address these issues. He also speaks about their outlook for the industry going into the new year.

Video from productronica 2017: Koh Young Focuses on Total Inspection Solution

At the show floor of productronica 2017, I-Connect007 Technical Editor Pete Starkey speaks with Managing Director Harald Eppinger of Koh Young Europe GmbH about the principles of Koh Young’s total 3D inspection solution for SMT process optimization and yield improvement.

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Blockchain for Manufacturing: What are the Opportunities?

Blockchain is one of the hottest topics in the tech world, and a buzzword that’s been popping up quite a bit over the last year or so. It is said to have the potential to radically simplify many business processes, by reducing risk and boosting transparency. In the manufacturing world, what are its opportunities?

Video from productronica 2017: Nordson ASYMTEK Highlights Bulk Dispensing Technology

At this week’s productronica, Nordson ASYMTEK highlights its the new Helios SD960 bulk and two-component dispensing system. Almar Thewissen, program manager for Industrial Applications, EMEA, at Nordson, discusses its applications with I-Connect007 Technical Editor Pete Starkey.

Video from productronica 2017: Goepel Highlights Updates on X-Line 3D In-line System

At productronica 2017 in Munich, Germany, Goepel electronic's Andreas Turk, head of AXI Systems, explains the latest enhancements to their X-Line 3D in-line system for high-end inspection. He also discusses the benefits of the Stingray Detector option.

Optimal Electronics Sets Sight on Growth

In an interview with SMT Magazine, Dr. Ranko Vujosevic, CEO and CTO of Optimal Electronics, speaks about the latest technology developments at his company, and his plans to sustain growth. He also talks about his paper on lights-out electronics assembly, the technologies that would support this vision, and the ultimate goal of Industry 4.0.

Solder Preforms 101: Ask the Expert

At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.

5 Simple Elements to Guarantee Outsourcing Success

Rather than viewing outsourcing as a way to offload unwanted tasks, OEMs should spend time carefully selecting and then maintaining a properly managed relationship with their chosen EMS partner. Here are five simple elements that you should focus on before, during and after an outsourcing strategy to guarantee it is a success.

Dealing with Vias-in-Pad

Screaming Circuits, a division of EMS firm Milwaukee Electronics, specializes in short-run, one-off, and prototype PCB assembly. In an interview with SMT Magazine, Duane Benson, CTO of Screaming Circuits, talks about the challenges when dealing with microvias and vias-in-pad from an assembly standpoint, and how in-circuit test issues, such as access to test points, can be addressed.

Two Prevalent Rework Heating Methods--Which One is Best?

There are two prevalent heating technologies in use throughout most electronic assembly operations for advanced component rework—the first method employs the use of hot air gas to heat up the component through the package, while the second much-used heating technology relies on infrared energy. This article highlights the pros and cons of the two methods, and discusses which one is the best to use for your application.

Happy Holden and Charles Pfeil Discuss the Past and Future of PCB Design, Part 1

When it comes to the PCB design community and the challenges facing it, as well as where design has been and where it’s heading, there aren’t many people as qualified to speak on the topic as long-time industry veterans Happy Holden and Charles Pfeil. Joined by I-Connect007’s Barry Matties at the recent AltiumLive 2017 event in San Diego, the three sat down for a discussion about the current state of PCB design, what the future holds, and what it means to be a designer.

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

What Does an OEM Really Gain from Outsourcing their Manufacturing?

But what does an OEM really gain when they make the move from an in-house manufacturing operation to an outsourced one? This article looks at two key benefits OEMs stand to gain once they relinquish control and hand over their production responsibility to an EMS provider.

Creating the Perfect Solder Joint

From a visual standpoint, a good solder joint should be smooth, bright, shiny, clean, and have a nice concave solder fillet. But how do you ensure that inside those joints, good intermetallic bonds are formed? Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint.

Cleaning Trends: The Challenges of Miniaturization and Proximity

At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.

Soldering Tip: Key to Good Solder Joints

In an interview with SMT Magazine, Enrique Moreno, technical support engineer at JBC Soldering, discusses the key parameters to consider during hand soldering to achieve the perfect solder joint. He also talks about the the increasing move towards automation and robotics soldering.

Achieving the Perfect Solder Joint: The Many Perspectives on Soldering

For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.

Surprising European EMS Market Numbers

If you think market analysis is always correct and predict the future exactly, you are mistaken. The latest annual reports from EMS companies with manufacturing sites in Europe have changed the picture on the European EMS industry quite a bit and caught us by surprise. Yes, you read that correctly: SURPRISE.

Should I Involve My EMS Partner in DFM?

OEMs are seeking the support of EMS providers with more than just manufacturing, but with design elements too. One of the main design services EMS providers will be likely to offer is design for manufacture (DFM). This article highlights why engaging your EMS partner in DFM is worthwhile, and will be valuable in securing the longevity of your product.

Choosing Solder Processes: Getting It Right

In an interview with SMT Magazine, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, shares his insights on the topic of achieving the perfect solder joint, from the perspective of a reflow oven supplier. He also talks about the latest developments in reflow ovens aimed at addressing voiding in solder joints.

Moving Toward the Zero-Defect Line

During the recent NEPCON South China exhibition in Shenzhen, Olivier Pirou, chief operating officer of Vi TECHNOLOGY, talks about achieving the perfect solder joint from the point of view of an inspection systems provider, and how manufacturers can strategize to achieve a zero-defect line.

Spreading the Word about SMTA—One Local Show at a Time

Eileen Hibbler of TEK Products, who currently sits on the Board of Directors of SMTA and is the VP of Membership, talks about educating the people in the industry; the importance of the local shows; SMTA's university chapters and their initiatives; and how SMTA is reaching out to millennials.

Test Solutions Your EMS Partner Should Offer

When looking to outsource your manufacturing, you need to know that your chosen EMS partner has good test solutions in place so that they can produce consistent, high-quality products to your customers’ requirements. This article highlights the importance of test, and outlines the different types of test your EMS partner should offer.

Joining Forces: SMTA and the SMART Group in Europe

Tanya Martin, executive director at SMTA, and Keith Bryant, global director of sales for YXLON International and chairman of the SMART Group, speak with I-Connect007 Managing Editor Patty Goldman about the latest initiatives within their associations, and discuss some interesting news about an upcoming merger.

A Guide to IPC Survey and Report Season

IPC Director of Market Research Sharon Starr found time to discuss the recently conducted and published surveys and research reports and a few others still in the works. These reports are free to survey participants, which is certainly a great incentive for taking the time to complete them. (Hint: That’s a call to action for those of you sitting on the sidelines.)

Counterfeit: A Quality Conundrum

The rise in the ingress of counterfeit materials into the supply chain has made them prolific, though yet, the extent is understated. What needs to be faced now is the need for incoming inspection, but at what cost to industry, and does anyone remember how to do it?

Rework and Reball Challenges for Wafer Level Packages

Amid the growing trend in package and PCB miniaturization, wafer-level packages (WLPs) have garnered recent popularity for their affordable cost, small footprint, and thin profile. Component suppliers must be prepared to support failure analysis for PCB-assembled WLPs, including fault isolation, nondestructive screening, as well as destructive analysis techniques.

Eight Factors a CEM Should Know About its Suppliers

Selecting a contract electronics manufacturer (CEM) that fits well with your outsourcing strategy can be a difficult and long process. But, by taking the time to research and investigate potential shortlisted partners, you are much more likely to reap the benefits further down the line.

Three Reasons to Use PCB Panel Routing Techniques

Most PCBs are individually routed—meaning they're not panelized. That doesn't mean that, sometimes, sending them to a PCB assembler in a panel isn't a good idea or even required. Generally, assemblers don't require panels, but there are some cases when they do.

IPC Status Update: Training, Standards, and More!

At the recent IPC Fall committee meetings that are co-located with the SMTA International conference and show, IPC’s president and CEO, John Mitchell, sat down for a chat with me for an update on what’s happening at IPC.

Update on IPC’s Validation Services and Hints of What’s to Come

SMTA International is the perfect time to get updates on IPC happenings. One that I’m always curious about is the Validation Services programs. At the busy show, I managed to find a quiet spot so Randy Cherry, IPC’s director of Validation Services, could fill me in on the latest.

RTW SMTAI: Mentor Eases Programming in Viscom Inspection Systems

Jesper Lykke, engineering manager for USA of Viscom AG, and Zac Elliott, technical marketing engineer at Mentor, speak with I-Connect007 Managing Editor Andy Shaughnessy about Viscom's adoption of the Valor Process Preparation and how it is helping users with their inspection programming.

Top Five BGA Challenges to Overcome

Higher reflow temperatures of lead-free rework increases the pressure for properly shielding the neighboring components. These developments are causing BGA rework challenges. This summary will discuss the most challenging aspects of BGA rework and options for solutions.

RTW SMTAI: EPTAC Discusses Manufacturing Training Trends

During SMTAI International 2017, Leo Lambert, vice president and technical director of EPTAC, discusses with I-Connect007 Managing Editor Andy Shaughnessy his company's recent expansion and the trends he's seeing in manufacturing training.

BTC and SMT Rework Challenges

In the assembly of bottom terminated components (BTC), the formation of voids has become a serious problem in many applications. In the SMT process, the reliability of solder joints becomes more of a concern, as less and less solder is allowed for each joint. The presence of voids can deteriorate the joint strength and eventually lead to joint failure.

RTW SMTAI: How Automation and Government Support Can Help Reshoring Drive

Alex Malek, vice president of sales and service for North America of SAKI, speaks with I-Connect007 Managing Editor Andy Shaughnessy about how automation and government investment can help bring back manufacturing jobs from overseas.

Institute of Circuit Technology Hayling Island Seminar 2017

This year’s event had a well-chosen and varied programme featuring presentations on process chemistry and R&D consortia, a discussion of controversial standards proposals and a review of the experiences of commissioning new technology in a start-up factory.

RTW SMTAI: AIM's Dr. Mehran Maalekian Speaks on New Alloys for Harsh Environments

Dr. Mehran Maalekian, R&D Manager at AIM Solder, speaks with I-Connect007 Managing Editor Andy Shaughnessy about new alloys that are targeted for high-temperature and demanding applications, particularly in harsh environments, where standard lead-free alloy such as SAC will not perform as well.

Is Hybrid Technology Gaining Momentum?

Over the past 20 years, ceramic hybrids have changed more and more to a backyard living in the European electronics industry, mainly driven by price pressure, specifically from the automotive electronics industry.

IPC’s David Bergman on Industry Training and Education

David Bergman, vice president of standards and technology at IPC, talks about the biggest issues facing the electronics manufacturing industry now. He also explains how the organization helps elevate the industry through its training, continuous education, and standards development.

How to Prevent Suspect Components from Entering Your Supply Chain

The success of any supply chain relies on quality and stability. If either of these elements are threatened, OEMs or their EMS provider will struggle to ensure supply chain excellence. Unfortunately, with the risk of counterfeit and other suspect components ever present, this can sometimes be difficult to achieve.

The Root Causes & Solutions for Warped PC Boards

There are two primary types of causes of board warping: process related at the fab or assembly shop, and layout related issues. If it's warped before assembly, it's between fab and layout. If it's flat before assembly and warped after, it's most likely between layout and assembly. That said, sometimes a fab problem won't show up until a pass through the reflow oven at your assembly partner.

RTW SMTAI: Alpha Discusses Solder Dross Reclamation

At the recent SMTA International 2017 exhibition in Rosemont, Illinois, Mitch Holtzer, director of Americas Reclaim Business of Alpha Assembly Solutions, talks with Managing Editor Andy Shaughnessy about the solder dross reclamation process, and discusses his new role in leading Alpha’s reclamation business.

Sensible Design: Thermal Management—The Heat is On

Thermal management materials are designed to prolong equipment life and reduce incidences of failure. They also maintain equipment performance parameters and reduce energy consumption by reducing operating temperatures, and minimising the risk of damage to surrounding components. Indirectly, they maintain brand reputation, as the reliability of the equipment will be very dependent upon the effectiveness of the thermal management technique used.

Implementing a Capacity Planning Tool

One of the more common challenges we see in the EMS world is that through the outsourcing of their manufacturing, many OEMs have forgotten the fundamentals of supply chain management and expect quick turnaround on orders without taking into consideration the whole supply chain constraints or the impact of not providing accurate forecasts to the EMS partner.

RTW SMTAI: MIRTEC on Staying Ahead of the Curve

Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.

RTW SMTAI: Gary Tanel Discusses How SMTA Helps the Industry Evolve

At the SMTA International 2017 exhibition in Rosemont, Illinois, Gary Tanel, president of the SMTA Dallas Chapter, speaks with I-Connect007 Publisher Barry Matties on a myriad of topics, including the goal of the SMTA as an industry association, and how it is helping the industry evolve. They also discussed challenges and strategies in bringing more young people to the industry.

Drying Boards after Rework Cleaning—To Do or Not to Do?

In cases where water soluble fluxes are being used in the rework process, in cases where the components need to have flux residues washed off, or in cases where the board needs to be cleaned with water for subsequent conformal coating touchup, proper drying and perhaps even bake out procedures need to be performed.

What's Up in Scandinavia's EMS Industry?

Scandinavia, consisting of Denmark, Norway, Sweden, and Finland, is relatively small in regards to the overall European EMS revenues, and counts for less than 6% of the European EMS production value. Nevertheless, more than 160 companies offer EMS services, not to mention companies who only manufacture cable harnesses or just do design work, box building, and after-sales services.

Rework and Reliability: Less is More!

Circuit boards are not always perfect after reflow or wave soldering. Scrapping boards with one or two defects is expensive, so rework happens. A good concept for rework is less is more, especially less flux. Use as little rework flux as possible, as in the old Brylcreem ads, "Just a little dab'll do ya."

Does My Outsourcing Project Fit with the EMS Provider's Strategy?

Once a decision has been made to outsource your electronics manufacturing, the next step is to find a suitable partner. This article highlights some of the questions, checks and balances a good EMS company will carry out before deciding to quote or partner with an OEM. Hopefully, by providing this insight, you will be better placed to find the right supplier for your outsourcing project.

RTW NEPCON South China: Rehm on Machine Communications and Vacuum Technology in Reflow

Ralf Wagenfuehr of Rehm Thermal Systems speaks about the need for a common communications platform as the industry moves toward Industry 4.0. He also talks about how their new ViCON software can help manufacturers achieve the smart factory vision.

RTW NEPCON South China: Vermes Discusses Piezo Technology in Microdispensing

During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Microdispensing GmbH, discusses their latest innovations in microdispensing, and how their piezo technology is addressing the trend towards miniaturization in PCB assemblies.

A Look Into PCBA Rework and Repair

Despite the many technology advances in the SMT process, there will always be a need for rework and repair of PCB assemblies. Most especially as the industry trend continues towards finer pitch and spacing, smaller and smaller components, and increasing high-reliability requirements from customers.

Whose Fault is That Bad Board?

Years ago, I held a position in an EMS company where projects were analysed before manufacturing. We found that even some of the best and most innovative circuits could not be manufactured. Why? Because the PCB designer, an electronic engineer, was not acquainted with the fabrication process. He had no idea about technological requirements necessary for electronic production. I know another designer who learned, finally, the importance of the thermal relief pad for heat restriction during reflow for a good soldering. His response? “Oh, was that what they were for? And to think I worked so much to remove them!”

RTW NEPCON South China: JBC Brings Digital Transformation to Hand Soldering Process

Enrique Moreno, technical support engineer at JBC Soldering SL, and I-Connect007 Managing Editor Stephen Las Marias discuss the latest developments in the hand soldering process, including robotics and automation. Moreno also talks about the opportunities in China, and why their Industry 4.0-enabled solutions are suitable for this market.

Should You Entrust Your EMS Provider With Your Supply Chain?

Managing your supply chain can be time consuming and expensive and, more importantly, it can distract you away from other key activities such as sales, marketing and product design. As an OEM, however, it's unlikely that your supply chain is a 'core' activity, that is, something that adds real value to your customers. So, what are your options?

Improving the Rework Process

An optimized SMT assembly process typically provides a yield of nearly 100%. Technology advancements—from the solder paste printing process, SPI, and parts placement, to reflow and wave soldering and AOI—have pushed the efficiency and accuracy of these steps in the SMT process such that a board assembly should be perfect at the end of the line. Still, EMS providers continually face the need to rework and repair PCBAs even after dialing in the perfect set-up.

The Past and the Future of the European EMS Industry

The EMS industry in Europe is still in a growth stage of its life cycle. This does not mean that there is enough space for everybody. Looking back over the past 10 years, we have seen tremendous changes in the number of companies, counting every separate legal entity.

House of Cards

With challenges like Industry 4.0 turning the manufacturing world upside down, we see solutions that are being quite brutally put together, through acquisition or partnership, which are expected to be perceived as being the solutions of tomorrow.

Cybersecurity: 4 Things OEMs Should Do to Protect Themselves

Manufacturing has been declared one of the top three most targeted industries for cyber attacks. While Industry 4.0 and expansion into cyber-physical systems will have a positive impact on the industry in terms of increasing efficiency, they open the door to even more security risks such as a hacker taking over production, or changing the output of the manufacturing process.

RTW NEPCON South China: Keith Bryant Discusses New Role and Goals at YXLON

Keith Bryant, the newly appointed Global Director of Electronics Sales at YXLON International, talks about his new role and goals at the company.

RTW NEPCON South China: KYZEN on Optimizing the Cleaning Process

At the NEPCON South China event happening this week in Shenzhen, China, Thomas Forsythe, executive vice president at KYZEN Corp., discusses the current cleaning challenges in the PCB assembly industry, and how manufacturers can optimize their cleaning process.

NEPCON South China 2017 Opens Today

NEPCON South China 2017, being held in conjunction with the Shenzhen Circuit Sourcing 2017 and Automotive World China, opens its doors today at the Shenzhen Convention and Exhibition Center to showcase nearly 600 companies catering to the electronics manufacturing industry. This year’s event, the largest ever in the show's 30-year history, features 45,000 square meters of exhibition space.

It was Acceptable in the Noughties

In many software products for manufacturing, the common approach previously was to show as many as possible, if not all, of the various data elements about products, machines and processes to engineers, who liked to feel totally in control of what they were doing. The need, however, to manage complex databases, to have detailed views of values and attributes of anything in the digital domain, rapidly became a major distraction to people performing their designated roles.

On the Smart Move: Industry 4.0 in Electronics Production

The industrial world is in motion, as we face a revolution in terms of processes, organizational structures, hardware and software in our companies. Many critics complain that terms like Industry 4.0 and smart factory are rather arbitrary and lack concrete meaning. That is correct. What is also true, however, is that technical progress always starts out with a vision, which is then put into concrete terms as time moves on.

Your 6-Point Guide to Finding the Right EMS Provider

If you have already outsourced part or all of your electronics manufacturing operation, then you'll already have a good understanding of what's expected. But, if you're looking to move EMS providers, then chances are something didn't go according to plan the first time. To avoid making the same mistake twice, or if you are considering outsourcing for the very first time, here are six points we recommend you consider to help find the right assembly partner for you.

Sourcing PCBA: Can Your EMS Supplier Do More?

You're in the market for some PCB assemblies for your new product and you need to find the right supplier. You've looked online, gotten recommendations from friends, and the choices are dizzying. Should you look domestically or overseas? What do you do now? Sourcing PCBA doesn't have to be difficult, but there are questions you need to answer.

The Ever Greener Grass

What we think we know is a less dynamic concept than actual reality. So many things progress so quickly, that we either as individuals or organizations, simply cannot keep up any longer. How then do we know whether the grass is really greener on the other side if we are not able to see clearly what is happening?

Empowering the Workforce Through Training: An Investment Return

Electronics manufacturers should take training seriously at all levels. To remain viable and competitive, it’s vital that they keep up with the latest technologies and practices in the electronics field. Perhaps more importantly, investment in employees keeps them engaged and excited in the performance of their daily work. Learning new methods and being exposed to new ideas is pivotal to personal growth.

What to Expect During the First Months of Trading with an EMS Provider

The start of an outsourcing partnership is an exciting time for an OEM, but it's also one that can be daunting. However much you've prepared for that big moment when you hand over responsibility for part or all of your manufacturing operation to your chosen EMS provider, it's still normal to question if you are making the right decision. This article explores five key areas that you and your chosen EMS partner should focus on during the initial months.

The EMS Skills Gap Epidemic

The manufacturing skills gap is real. Interviews with EMS industry executives across the country are united in their top concern for their businesses: finding new talent. Manufacturers can no longer afford to wait. It is time to educate and train the next generation of manufacturing.

6 Tips to Secure New Talent in Electronics Manufacturing

Closing the skills gap in engineering and electronics manufacturing is a topic that comes up for discussion time and time again. And many SMEs and large international companies within the industry have already taken positive steps to meet the demand for attracting and securing highly-skilled new talent.

New Challenges Facing Mil/Aero Segment

For this month's issue, we invited a sampling of professionals whose experience centers on the electronics industry in the military and aerospace world, including experts from design, PCB manufacturing, and the assembly arena to sit down with us for a frank discussion. Our discussion centered on the challenges associated with military work, including the new regulatory requirements for cybersecurity, dealing with leaded vs. lead-free components, and the differences and similarities with the commercial world.

Training and Education: Key to Improving Electronics Assembly

For this month's issue of SMT Magazine, we spoke with Luis Ramirez and Dan Prina of EMS firm MC Assembly to discuss the challenges of and strategies in improving the PCB assembly process from an EMS provider’s perspective. We also spoke with Manncorp's Tom Beck and Chris Ellis to get their viewpoints on the subject as an equipment provider.

Cleaning that Matters

James Yeoh, executive director of Zestron Precision Cleaning Sdn Bhd, discusses the challenges in the cleaning industry, and strategies that can help manufacturers address those issues. He also covers the need for continuous education when it comes to cleaning, and how automation can ensure the stability of cleaning systems.

Stephen V. Chavez Talks Mil/Aero PCB Design

Stephen V. Chavez, CID+, is the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS), a military contractor that builds all manner of cutting-edge tools for the American warfigher. He’s been designing military and aerospace PCBs for decades, and he’s a veteran of the United States Marine Corps. I caught up with Steph and asked for his thoughts on designing PCBs for the military and aerospace markets.

Soldering Fumes in Electronics Manufacturing: Damaging Effects and Solutions for Removal

No matter which soldering process you analyze, all of them have one aspect in common: They produce airborne pollutants, which may have a negative impact on employees, plants and products as well. This article discusses the damaging effects of soldering fumes, and solutions for their removal.

Verification of Inspection Results: Local, Central, Global?

With the need for flexibility in production processes amid increasing globalized manufacturing strategies, manufacturers should consider powerful inspection tools that not only provide central verification of numerous lines in local and overseas production sites, but also with a comprehensive presentation of inspection results.

QFN Center Pads on PCBs

Not all QFNs come with an exposed metal pad underneath, but most do, and that can still cause problems with reflow solder. The pad itself isn't the problem, but improper solder paste stencil layer design can be.

Process Step Elimination: Driven by Cost and Efficiency, Enabled by Process and Materials Innovation

Electronics manufacturing has evolved from the early days of hand soldering and wave soldering to the more modern SMT process. But while most modern electronics are produced using the SMT process, there are still some mixed technology applications that need both the SMT process and the wave soldering process. This article looks into the pin-in-paste (PiP) process, which enables the soldering of through-hole components during SMT processing, and eliminates the need for the wave process.

IMPACT Interview: Fern Abrams, IPC

At the recent IMPACT Washington D.C. 2017 event, I-Connect007's Patty Goldman speaks with IPC's Fern Abrams to get the inside story on the meeting with EPA.

How Much of My Electronics Manufacturing Should I Outsource?

Once you have decided to outsource to an EMS partner, you need to think about how much of your existing operation you plan to relinquish. This article looks at four distinct areas OEMs outsource—procurement, assembly, test and logistics—explores the benefits associated with relinquishing each of these, and highlights a number of questions that must be considered before any final decision is made.

The Need for Assembly Training and Education

While investing in the latest technologies and having a systems-based approach in your assembly processes are important, the key factors that will make you successful in your continuous improvement goal are the skills, training, and education of your workforce. However you look at it, the human factor remains a critical issue when it comes to your overall efficiency.

X-Ray Inspection of Lead and Lead-Free Solder Joints

As aerospace companies consider the shift to lead-free solder alloys and glues, concerns have been raised about whether their current X-ray inspection and quality-control procedures will still be valid. With lead solder, joints are easily interpreted by the operator or the system imaging software because lead provides excellent image contrasts due to relatively high X-ray absorption compared to that of PCB and component materials. Will this hold true as they shift to lead-free solder compounds?

IPC: Department of Labor Releases RFI to Seek Information on Overtime Regulations

This week, the Department of Labor (DOL) released a Request for Information (RFI) to gather additional feedback from the public on the overtime regulations, which define and delimit exemptions from the Fair Labor Standards Act’s minimum wage and overtime requirements for certain executive, administrative, professional, outside sales and other employees.

Pillarhouse International's Allan Jiang Discusses Selective Soldering Developments

At the recent NEPCON China event in Shanghai, Allan Jiang, sales manager at Pillarhouse International, discusses with I-Connect007 Managing Editor Stephen Las Marias some of the challenges in selective soldering, and technology developments to address these issues.

4 Ways Your EMS Partner Can Respond to Supply Chain Disruption

When disruptions to the electronic component supply chain occur, they are painful. Lead-times can extend overnight, prices can treble, and in some cases, parts are placed on allocation or discontinued altogether. These concerns amplify the need for EMS firms to have practices in place for dealing with supply chain disruption. This article discusses four ways your EMS partner can mitigate risks to your supply chain.

Counterfeit Electronic Components Identification: A Case Study

Counterfeit electronic components are finding their way into today's defense electronics. The problem gets even more complex when procuring diminishing manufacturing source parts. This article provides a brief introduction to counterfeit prevention and detection standards, particularly as they relate to the aerospace and defense sector.

Perspectives from a First-Timer

Brad Heath, president and CEO of EMS company VirTex, is a first-time attendee of IMPACT Washington D.C. In an interview with I-Connect007 Managing Editor Patty Goldman, he talks about his impressions of the recent IMPACT Washington D.C. event, and how he thinks the industry benefits from such meetings with the policy makers in the government.

STI Electronics' Dave Raby Shares His Insights on IMPACT Washington DC 2017

During the recent IMPACT Washington D.C. 2017 event, I-Connect007 Managing Editor Patty Goldman caught up with Dave Raby, president and CEO of EMS firm STI Electronics, to discuss about the event and their meetings with representatives of the government that came over to hear what the collective electronics manufacturing industry has to say.

The Role of Industry Associations in Training and Education

Industry associations, such as the IPC and the SMTA, help advance the electronics manufacturing industry through standardization, training, education, advocacy, and interaction through trade events, exhibitions and symposiums. They help members to become aware of the latest technology developments happening in their industry verticals, and of the market trends shaping the direction of the industry.

Using Lead-Free BGAs in a Tin/Lead Soldering Process

Several electronic market segments, such as those electronics used in harsh environments or that have life/system critical functionality, remain exempt from lead-free material restrictions such as the RoHS legislation. While these market segments can use solder containing lead, it is increasingly difficult to procure advanced components in non-ROHS compliant configurations. This article discusses several aspects of having lead-free BGA components in a tin/lead soldering process.

Thermal Indicator Technology for Aerospace Wire Harness Assemblies

Thermal indicator technology was developed into solder sleeves many years ago and has proven to be an effective means of providing visual indication of a reliable solder joint. This article talks about the two types of thermal indicators used in aerospace applications today, and the many benefits that this type of technology.

Mil/Aero Assembly Success

Davina McDonnell, director of marketing at Michigan-based EMS firm Saline Lectronics, discusses the latest technology and business trends driving the military and aerospace industries, the challenges in these markets—including supply chain issues such as obsolete parts and counterfeit components—and their strategies to stay ahead of the competition.

Field Failure is Not an Option

Audra Gavelis of IEC Electronics Corp. discusses the current challenges in electronics assembly for the military and aerospace markets and the new requirements they are getting from their customers. She also talks about strategies in dealing with component obsolescence and lifecycle issues, and new compliance issues that contract manufacturers are facing.

The Skills Gap – Meet People Where They Are!

A perennial concern in the U.S. electronics manufacturing industry is the lack of skilled talent in many parts of the country. According to a recent IPC member survey, most companies have a hard time recruiting qualified production workers, engineers, and other technical professionals.

Four Ways to Buy Electronic Components and the Pros and Cons of Each

When you buy electronic components, there are a number of different supplier types available to you or your EMS partner. From dealing direct with an electronic manufacturer through to using brokers, there are benefits and pitfalls associated with each.

An Alternative Approach to Vertical Integration in Manufacturing

The days of OEMs owning large vertically integrated manufacturing assets are gone and will probably never return. Oddly, the large vertically integrated manufacturing capability of the OEMs started to be dismantled by the emergence of the EMS companies. Now, some of these same EMS companies are adopting the same, vertically integrated solutions themselves.

The Importance of Training for your Organization

In our recent survey on assembly training and education, another question we asked is about the importance of training to your organization. Around 85% of our respondents consider training really important to their workforce. In fact, the majority of respondents—47%—say it is very important.

Using Paste Flux for Rework

When using a hot air or IR rework system where the reflow cycle is mimicking the original SMT reflow profile, and when using flux for re-attachment, paste flux otherwise known as gel or tacky flux is the correct type of flux to use. Due to its high viscosity and tack properties, paste flux prevents components from being moved during hot-air reflow while being able to remain active for the complete time-temperature period.

Does Your EMS Provider Have an Industry 4.0 Roadmap?

At its simplest level, the Fourth Industrial Revolution or Industry 4.0, is about automation and connectivity. This should lead to faster, more efficient manufacturing--and therefore advantageous pricing. Additionally, it might also mean that products can be made in a different way. For example, new processes might allow late customization or configuration, faster delivery, or enhanced quality.

The Importance of Supplier Training

The human factor remains a critical issue when it comes to the overall efficiency of your PCB assembly lines. But how do you make sure your operators, engineers and supervisors have the proper knowledge and skill sets to perform at their peak levels, day in and day out?

Today’s Mil/Aero Enemies: Counterfeits, Obsolescence and Failure

The need for high-reliability electronics, components and assemblies that can perform in harsh operating conditions involving extreme temperatures, vibration, and moisture continue to challenge electronics assembly providers catering to the military and aerospace markets. These are on top of current manufacturing issues such as the miniaturization of products, shrinking component sizes, higher density board assemblies, and the obsolescence of electronic components.

Is Configure to Order Manufacturing the Right Strategy for Me?

This article looks at what the term Configure to Order (CTO) means, the importance of supply chain management, where responsibilities lie when setting up new agreements with an EMS provider, and some of the benefits OEMs can expect to see when adopting a CTO strategy.

The Importance of Conformal Coating, Now and in the Future

At the SMTA Michigan Expo and Tech Forum, held in Grand Rapids on May 11, Technical Editor Happy Holden spent a few minutes with AIM Solder’s Technical Marketing Manager Tim O’Neill to discuss O’Neill’s presentation on the topic of conformal coating over no-clean fluxes.

EMS Firm Tsukiden Electronics Seeing More Business in Prototypes

At the recent Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) held in Manila, Karen Flordiles, marketing supervisor at EMS firm Tsukiden Electronics Philippines Inc., talks about their customers' changing requirements and their manufacturing challenges. She also discussed new opportunities they are seeing in the EMS sector.

Technology Enabler Highlights Benefits of Having Design Services for an EMS Firm

At the 14th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) held last week in Manila, Robin Ramiso, design and development manager at Technology Enabler, discusses their activities, and the benefits of having a design services team for an EMS company with I-Connect007 Managing Editor Stephen Las Marias.

The Significance of the PCB in the Value Chain of the European EMS Industry

At SMT Nuremberg, Pete Starkey meets with Dieter Weiss, who comments upon the significance of the PCB in the value chain of the European EMS industry, and looks to a future where we embrace an open-minded attitude and a willingness to work together.

A New Player in the Philippine EMS Industry

There's a new EMS player in town. Come August 2017, Artem Global, a startup EMS firm in the Philippines, will start manufacturing operations, with services ranging from PCB assembly to box build, and even turnkey services. I-Connect007 Managing Editor Stephen Las Marias caught up with Artem Managing Director Art Ledonio at last week's PSECE event in Manila.

How Important DFM is for Your Electronics Assembly Partner

Each OEM will have their own set of criteria when it comes to selecting an appropriate EMS provider. But where does design for manufacture (DFM) support come into play? Is it a priority? Should it be? And what benefits does this service have to offer the OEM? This article explores some of the benefits DFM offers OEMs and how this service can help realize elements of an outsourcing strategy.

Better Together: How HDP User Group Showcases the Industry’s Best Side

HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.

Assembly Training and Education

Even if your PCB assembly process is optimized, there is always room for improvement. And no matter how successful your company has been in the past, you just can’t rest on your laurels. It is always in your best interest to strive towards a better operations model. We've created a survey to help us gauge the importance of training and education in your workforce, and the benefits that you get in ensuring that your operators and engineers have the most current knowledge and skill sets.

Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating – Influence of Electroless Pd Plating Film Thickness

This paper investigated the influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability. It was found out that the shape and thickness of the intermetallic compounds (IMCs) are among the key factors that affect solder joint reliability after multiple reflow cycles and thermal aging, respectively.

Happy Holden Second Recipient of I-Connect007 'Good for the Industry' Award

Our second 'Good for the Industry' award has been presented to Happy Holden. After working with Happy for a number of years it is clear to see that he is dedicated to improving the industry. He has a long history in the PCB industry, starting off with HP in the '70s. Not only did he develop HDI, but he then wrote the HDI Handbook, which is provided to readers at no charge.

High-Volume Test Strategies

In an interview with I-Connect007 during the recent NEPCON China event in Shanghai, Siegmund Hornig, director of global sales for Europe and Asia, for production board test division at Teradyne discusses the new testing demands from customers, and strategies to help them address their high-volume test requirements.

President Donald Trump Launches Workforce Development Week

Earlier this week President Donald Trump announced “Workforce Development Week.” As such, President Trump spent the last four days promoting job creation and even signed executive order expanding apprenticeship programs.

Koh Young Discusses Latest 3D AOI Innovations

Koh Young Technology's Scott Kim, overseas sales team manager, talks about the latest challenges and developments happening in inspection technologies, the new demands and requirements from customers, as well as the key factors to consider when it comes to buying inspection systems.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2

The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.

How to Make a Bad First Impression with an EMS Provider

Like any relationship, starting off on the wrong foot when finding an EMS provider can quickly trip you up and become painful in the long term. Regardless of the 'why', here are some good examples of what not to do when first approaching a potential EMS provider. This way, you can make sure that you don't end up wasting valuable time and effort finding the wrong EMS provider for your business.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1

Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.

AOI Capabilities Study with 03015 Components

More EMS companies are implementing AOI into their SMT lines to minimize repair costs and maintain good process and product quality, especially for new component types. This project focuses on the testing of 03015 components, which is challenging for AOI.

3D Inspection is the Way to Go

In an interview with SMT Magazine during NEPCON China, Guido Bornemann, head of sales in Asia for Viscom, discusses how inspection technology is keeping up with the latest requirements and demands from customers. He also explains why 3D technology is the best inspection technology to utilize in electronics assembly.

Saki Discusses Industry 4.0 and True 3D Technology

Quintin Armstrong, general manager for North America Sales and Service at Saki America, speaks to SMT Magazine about the Industry 4.0 strategy for inspection equipment providers. He also talks about why manufacturers are finding it more and more relevant to have an inspection line in their assembly lines now.

Why You Should Have Formal Business Reviews with Your EMS Provider

Your working relationship with your EMS provider is fundamentally a partnership. Therefore, it's important to ensure that you carve out time to meet with your EMS provider on a frequent basis – even if you are feeling particularly pleased about having handed over responsibility to them.

3D: Towards Better Inspection Capability

For this month's issue of SMT Magazine, we spoke with Mark McMeen, vice president of engineering at STI Electronics, to know more about the inspection challenges and requirements from an EMS provider's standpoint. We also talked with Jean-Marc Peallat, vice president of global sales at Vi TECHNOLOGY, to find out, from a supplier's perspective, how they are looking at these challenges and addressing them through their product development efforts.

HDP User Group 2017 European Meeting Highlights Technology Progress

The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.

2D X-ray Inspection With Materials and Thickness Identification

The need to inspect electronic components and assemblies non-destructively is the main driver behind the development of X-ray inspection technology. In many cases, X-ray inspection provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through-holes, TSVs, microbumps, and copper pillars.

The Need for 3D AOI

While the coplanarity of height-sensitive devices such as BGA packages and leaded components can be inspected in 2D using multi-angled colored lighting and side-angle cameras, these will be susceptible to an increase in false calls, a need for additional programming and cycle time, and possible escapes. These factors underscore the need for 3D technology in inspection strategies.

Will You Be RoHS 2-Compliant by 22 July 2017?

The year 2011 saw the legal initiation of the RoHS 2 recast and an update of the RoHS Directive 2011/65/EU, subsequently transpiring into UK law. The initiative granted transition periods of varying time scales to different categories of electrical and electronic equipment products. Now, 2017 sees the end of the transition period for EEE products that fall into one of the subsections of category nine – industrial monitoring and control instruments.

Shenzhen Axxon Discusses Acquisition and Dispensing Market Trends

Ivan Li, general manager at Shenzhen Axxon Automation Co. Ltd (China), discusses their recent acquisition by Mycronic, as well as the latest developments in the dispensing market. Also discussed is the China market, and how the company is staying ahead of the increasing competition in the dispensing industry.

RTW NEPCON CHINA: Teknek Discusses Contact Cleaning Technology Trends

Stephen Mitchell, managing director of Teknek, a contact cleaning solutions provider, discusses the latest trends in contact cleaning technology. He provides his outlook on China’s electronics manufacturing industry and intelligent manufacturing, and talks about how Teknek's contact cleaning systems are helping customers address their defects and productivity issues.

RTW NEPCON CHINA: Interflux to Revolutionize Solder Industry

At the recent NEPCON China event in Shanghai, Daniel Werkhoven, CEO of Belgium-based soldering chemistry provider Interflux Electronics N.V., talks with I-Connect007 Managing Editor Stephen Las Marias about how their new bismuth-based solder alloy will help improve the soldering process.

Tape and Reel Solder Preforms: A Success Story for the UD00 X86 SECO Board

SECO's latest product innovation, UDOO X86, is a real computer with an integrated Arduino 101 compatible board that is capable of running games and videos in 4K. But while the success of the UDOO X86 is impressive, so is SECO's ability to develop this game-changing product with low-cost technology for mass appeal and affordability.

Vapor Degreasing Chemistries to Remove Difficult Lead-Free and No-Clean Fluxes from PCBs

In line with increasing regulations on electronics manufacturing, many changes have been made to the electronics world, and thus the circuit board manufacturing process. Lead-free, no-clean and halide-free flux formulations have introduced new cleaning obstacles, especially on ever-shrinking component sizes. To maintain high cleanliness standards for modern circuitry, new sophisticated cleaning chemistries are required.

The Benefits of Postponement Manufacturing When Outsourcing

With the world changing at an incredible pace, OEMs agile enough to respond rapidly to customer demand stand a greater chance of survival compared to those that are not. This article looks into the late stage configuration technique and some of the benefits an OEM can expect to gain when outsourcing to an EMS provider that offers this service.

RTW NEPCON CHINA: Mycronic Meets High-volume Demand with Solder Jet Printing

Mycronic VP for Global Dispensing and Managing Director Clemens Jargon discusses how the flexibility of solder jet printing helps reduce downtime in the line, thus increasing total line speed and enabling it to keep up with high-volume demand.

Business and Technical Developments at Super Dry Totech

At the recent SMT Hybrid Packaging show in Nuremberg, Germany, I-Connect007 Technical Editor Pete Starkey visits Super Dry Totech and spends a few minutes with CEO Jos Brehler and Sales Manager Terry Morgan to talk about the rationale behind ASYS Group's acquisition of stake in Super Dry Totech, as well as the latest technology developments happening at the company.

RTW NEPCON China: Data I/O on Securing the Supply Chain

At the recent NEPCON China show in Shanghai, Anthony Ambrose, president and CEO of Data I/O Corp., discusses the cybersecurity challenges facing the electronics manufacturing industry today amid the proliferation of connected devices and the Internet of Things.

Grow Your Own Training Programs

Negative connotations about manufacturing jobs as dirty, repetitive, and boring have plagued the industry for the last 20 years. Manufacturing lacks the sex appeal that jobs in tech use to entice potential employees. Due to the great shortage of skilled workers and the lackluster image of the industry, manufacturing companies have had to re-evaluate and re-design their HR strategies to recruit, hire and train new employees.

The Role of an Account Manager Within an EMS Provider

How do you start to compare EMS providers when it comes to their account management team? Does it really matter what role they play? And how crucial do you believe they are in helping you achieve your outsourcing objectives? This article looks in-depth at some of the common activities an account manager typically carries out on your behalf when you decide to partner with an EMS provider.

Zestron Technical Workshop Tackles Next Generation of Cleaning

Zestron recently held a technical workshop in Alabang, Muntinlupa City in the Philippines to help users address their cleaning challenges amid advancements in semiconductor device packaging.

Mentor Graphics: Connecting the Manufacturing Environment

Oren Manor serves as the director of business development for Mentor Graphics Valor Division. In this interview with SMT Magazine, Manor discusses the latest updates in their OML community, their case study regarding Phoenix Contact’s implementation of their IoT solution in its facilities, and what’s new in ODB++.

Why You Shouldn't Hide Your Supply Chain Issues

From a natural or man-made disaster that is completely out of your control to a breakdown in communication, there are many reasons why an OEM might find themselves faced with a problem in their supply chain. Whatever the reason for the disruption, one thing is certain: if you are planning to work with, or are already working with, an EMS provider, you shouldn't hide your supply chain issues.

Voiding Control at High-Power Die-Attach Preform Soldering

Voiding in the solder joint is a concern for high-reliability and high-performance devices. This paper discusses a study on voiding behavior of large pad high-power devices simulated with Cu coupon to Cu coupon sandwiches. A flux-coated preform was studied in this assembly, with variation in solder alloy type, quantity of solid flux coated on solder preform, Cu coupon pre-oxidation extent, reflow temperature, and pressure exerted onto the sandwich during reflow.

Enhancing Recruitment Efforts with Public-Private Partnerships

After nearly two decades of the dominance of the service economy, manufacturers in all industries have a challenge: recruiting and training the next generation of manufacturing employees. This article details how one EMS company has been addressing that challenge through collaborative efforts with educational institutions, other businesses and regional support networks.

SMTA West Penn Expo: Who Says There’s No Such Thing as a Free Lunch!

Bill Capen of DRS Technologies, the president of the SMTA West Pennsylvania Chapter, speaks with I-Connect007's Patty Goldman about the recent West Penn Expo & Tech Forum. He also talks about the group's upcoming chapter meetings this year, and the latest developments happening in the military segment.

The Benefits of Applying Flux Directly to a Micro BGA

Technology trends continue to drive miniaturization in electronic components. As a result, product designers are often forced into specifying smaller and smaller devices on their bill of materials. Sometimes, miniature devices offer OEMs cost savings, which is seen as a good thing; other times, there is simply no choice.

San Diego IPC Designers Council Meeting Held at Del Mar Show

The Del Mar Electronics and Manufacturing Show is a long-time favorite among PCB professionals. What better place to hold a meeting of the San Diego Chapter of the IPC Designers Council? Each year, the San Diego Chapter of the Designers Council hosts their largest meeting of the year at the Del Mar show. This year, approximately 50 PCB designers and electronics professionals attended the lunch-and-learn meeting.

Manufacturing Through the Eyes of Human Resources, Recruitment and New Hire Training

Perhaps more important than the technology and tools a manufacturing company has are its people. People are what make a company truly great and the process of recruiting talented, skilled, dedicated employees and training them properly for success is an important aspect of any manufacturing company.

Keeping an Eye on the Next Generation

Why should a company in our industry dedicate hours to providing professional development to a group of temporary student interns? Why should they open their doors to kids, some of whom haven’t even entered high school? For Indium, the short answer is, it makes them better. Read on to find out why.

IMPACT 2017: Electronics Industry Leaders Meet with Members of Congress and Trump Administration on Capitol Hill

IPC places a high priority on making our presence known in the halls of government to educate our government officials on the policies that will strengthen the advanced manufacturing industry.

Blackfox Program Trains Vets for Manufacturing Jobs

It's harder than ever for managers in the PCB manufacturing industry to find qualified staff, with some reporting that positions are remaining open for months at a time. On the other hand, there are thousands of soldiers, sailors, airmen and marines transitioning out of the service each year and seeking good jobs. In this interview, Allen Dill, president of Blackfox, discusses their program that offers manufacturing training to veterans, even while they are still in the military.

The Challenge of Filling PCB Assembly Positions

U.S. manufacturers are having a difficult time filling open positions. They cannot find workers with the necessary skills to fill the openings. If we look specifically at the PCB assembly industry, the rhetoric is similar. There are more openings than people to fill them. The discussions reveal that lower wages, lack of skills, and sometimes the reported low unemployment rate in the United States is part of the problem.

Predicting Solder Paste Transfer Efficiency and Print Volume

Being able to predict the transfer efficiency and print volume reproducibility of solder paste are valuable data points for any circuit assembly process. Knowing how many good boards that can be expected from a jar of solder paste is critical for a contract manufacturer working on paper thin margins.

The Complex World of Soldering

Industry veteran Happy Holden and Saline Lectronics Senior Process Engineer Cathy Cox discuss the various challenges and issues that users face in soldering, including the lack of a "one-size-fits-all" approach in the process, and some key factors that the PCB assembly industry should consider when it comes to different applications and markets.

RTW NEPCON China: Viscom Talks 3D AOI Developments

Guido Bornemann, head of sales for Asia at Viscom, speaks with I-Connect007 Editor Stephen Las Marias about inspection challenges such as false calls and improving first pass yields. He also talks about the latest developments in 3D AOI to address these issues as well as test strategies to achieve zero defects.

RTW NEPCON China: Metcal Highlights Innovation in Hand Soldering Technology

At NEPCON China, Bryan Gass, vice president of Metcal, discusses how their Connection Validation soldering station will revolutionize the hand soldering technology industry.

IMPACT Washington 2017 Just Around the Corner

IPC's Government Relations team has worked around-the-clock to ensure that IMPACT Washington D.C. 2017 is the best yet. During this two-and-a-half day event, executives from IPC-member companies will have the opportunity to speak with leaders in Congress and the Administration in support of our common priorities.

Virtex on Military and Aerospace Requirements

Brad Heath, VirTex CEO, and Upinder Singh, Vice President and General Manager at VirTex MTI, discuss their company's military and aerospace business, and how they are addressing the latest demands and requirements from their customers.

What a Tangled (Soldering) Web We Weave!

Soldering remains one of the most critical processes in the PCB assembly industry. Which is why it is of the utmost importance that the soldering process should be perfect. But soldering is just too complex a process, and further complicating the situation, the requirements and technologies vary between our industry’s market segments. There are just a lot of factors to consider before you put your boards into the reflow and let them run.

Your In-depth Guide to Reducing Electronics Manufacturing Waste

Waste is a common problem within the electronics manufacturing industry. Whether large volumes of faulty smartphones need recalling or small batches of complex PCB assemblies need reworking, waste can be time consuming and costly to rectify. This article discusses principles such as DMAIC, Six Sigma and Lean manufacturing to help you implement strategies to minimize your waste output.

Achieving Successful Flex Circuit Assemblies

In this article, Yousef Heidari, vice president of engineering at EMS firm SigmaTron International, talks about the varying challenges in flex-circuit assembly. Chief among these are the solder paste printing process, especially for designs that have multiple areas with fine-pitch components, as well as the subsequent handling of the assembly before final product integration.

The Building Blocks of Industry 4.0

At the recent IPC APEX EXPO, Kevin Decker-Weiss, director of sales at CircuitByte, joins panellist from Mentor Graphics and EMS firm Saline Lectronics in a roundtable on the building blocks of Industry 4.0 hosted by Scoop. Here is his take on that panel and the show.

JJS Stresses Need for Baking Prior to Flex Circuit Assembly

From an assembly perspective, baking the flex circuits prior to manufacturing assembly is crucial as they can be susceptible to delamination. In this interview, Russell Poppe, director of technology at JJS Manufacturing explains why, as well as discusses other challenges in flex circuit assembly and strategies to address them.

RTW IPC APEX EXPO: Metcal Brings Disruptive Technology in Hand Soldering

Christopher Larocca, president and CEO of OK International (of which Metcal is a division), tells I-Connect007 Publisher Barry Matties their strategy for improving the hand solder process. He describes a lack of process feedback to the operator as a core problem inherent in the hand soldering process, and discusses how OK International has developed an innovative solution to address the issue.

Fixturing: Key to Accurate Flex Circuit Assembly

Adrian Nishimoto, operation manager at Spectrum Assembly Inc., talks about the critical factors to consider during flex circuit assembly, such as fixturing and accurate thermal profiling. He also mentions why jet printers are suitable for use in assembling flex circuits.

Rework and Repair on Flex Circuits

With this surge in usage of flex, the standards for rework—replacing devices while still meeting the initial specification and functionality—and repair—repairing the physical damage on a flex circuit—of flex circuits has not kept pace.

Strategies for Addressing Flex Circuit Assembly Pain Points

In an interview with SMT Magazine, Steve Fraser, VP of Operations at Firstronic, discusses the key factors that have the greatest impact on the quality of flex circuit assemblies, the challenges they face during assembly, and their strategies to ensure the reliability of the products.

How to Solder SMT Components with Varying Solder Paste Heights

While miniaturized components offer product designers some benefits, such as energy efficiency and the ability to build in greater functionality, mixing "old and new" technology together on the same PCB design can add complexity at the build stage. As a result, it is sometimes necessary to change the way solder paste is applied to the PCB during production.

Supportive Tooling: The Magic Ingredient for Flex Circuit Assembly

Flex circuits have changed the way product development engineers can design and package their electronic products. Flex applications have opened the doors for PCBAs to move out of square, box enclosures and fit into small, tight, even oddly shaped three-dimensional spaces that can withstand harsh vibration and multiple flex uses. While these flex assemblies may perform in the same way a traditional rigid PCBA does, they have their own set of assembly rules and manufacturing nuances.

Capitol Connection: IMPACT Update—To CEOs on Why You Should Attend IMPACT Washington, D.C. 2017

Here at IPC, we place a high priority on making our presence known in the halls of government, because so many policy debates have a direct effect on the electronics manufacturing industry. IMPACT Washington, D.C. 2017 is a chance to join with fellow industry executives in advocating for better public policies for a stronger, more advanced manufacturing economy.

Dry Storage Cabinets' Role in Industry 4.0

At IPC APEX EXPO 2017, Rich Heimsch, Super Dry’s Director of the Americas, discusses the electronics manufacturing industry’s different versions of Industry 4.0, and his company's strategies in dealing with all of them. He also talks about Super Dry's latest storage developments.

Miniature Components on PCBs Requires Flexible Cleaning Methods

Smaller, more densely populated circuit boards make the issue of managing faults, quality and product longevity highly challenging. This is why so many companies consider their PCB cleaning as a mission-critical process. If the cleaning is not effective the device simply will not function reliably for the required life of the product.

Navigating the Complex World of Flex Circuit Assembly

We recently conducted a survey on flexible printed circuits to know more about the challenges that designers, fabricators, and assemblers face when dealing with flex circuits. We asked what steps in their processes have the biggest effect on yields; the challenge they face when dealing with flex circuit materials; as well as the factors that have the greatest impact on the quality of their flex circuit design, fabrication and assembly.

Assembly of Flexible Circuits

No matter the method, the assembly of electronic flexible circuits is tedious because of its inherent flexible nature. Therefore, we must give extra attention to the assembly process. This article details some of the key considerations when assembling flexible circuits.

What are the Most Important Principles of Lean Manufacturing?

Lean manufacturing is nothing new, but it remains an important philosophy for manufacturers seeking to grow and effectively contend in a competitive, global environment. Essentially, it provides you with the tools to successfully identify and eliminate waste within your operation.

RTW IPC APEX EXPO: Sanjay Huprikar Lays Out Plans to Grow IPC Membership

Sanjay Huprikar, IPCs vice president of member success, discusses IPCs plans to expand membership around the world.

Alpha Papers Investigate High-Reliability Solder Alloys

During SMTA International, Morgana Ribas, manager of Metals Technology Group at Alpha Assembly Solutions, presented a pair of papers that focus on the company’s reliability testing of solder alloys. I-Connect007 Managing Editor Andy Shaughnessy sat down with Morgana to discuss these papers, and some of the surprising results that the testing yielded.

Evaluating a PCB Assembler

When it comes to technology and quality, an SMT assembler's capabilities will be reflected when you go through the key elements in the SMT process. This article provides key points to consider in evaluating a PCB assembler, which allows you to test whether your circuit boards assembled in that factory conform to your required standard.

Weiner’s World – March 2017

The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.

Electrolube Talks Technologies Targeted at Automotive and LED Applications

Electrolube's Phil Kinner, global head for the conformal coatings business, talks about the trends shaping the company’s product innovation strategies, and their latest solutions and technologies to help address their customers’ greatest challenges.

Should You Use Your CEM Partner's Direct Ship Fulfillment Services?

Gone are the days when OEMs simply outsourced their printed circuit board assemblies to contract electronic manufacturers (CEMs). Today, many CEMs offer a much broader range of services, including an end-to-end outsourcing solution – the end point of which is direct ship fulfillment, whereby the CEM sends fully manufactured and tested products directly to the end customer.

Alpha on New Technologies to Tackle Voiding

Tom Hunsinger, vice president of marketing at Alpha Assembly Solutions, discusses with SMT Magazine how their company is addressing voiding—one of the greatest challenges in soldering. He talks about the latest market development trends that are shaping product innovation strategies at Alpha. Hunsinger also details some of their latest solder technologies, and how they are helping their customers address their soldering challenges.

Successful, Long-Term Growth at Prime Technological Services

Publisher Barry Matties sat down with Prime Technological Services CEO Greg Chesnutt at IPC APEX EXPO, to glean how they continue to find success and have been able to maintain such an impressive growth rate over the last four years.

Mike Carano on the First PCB Executive Forum Held at IPC APEX EXPO 2017

When John Mitchell came on board as president of IPC, he decided to tap the members of the Raymond E. Pritchard Hall of Fame for suggestions and advice. So he established the IPC Ambassador Council and tasked them to create special programs for IPC conferences. It is this group of people who put together the recent PCB Executive Forum that was presented at IPC APEX EXPO 2017.

Goepel electronic Talks Test and Inspection Innovations

Thomas Wenzel, managing director of the Embedded JTAG Solutions Business Development at Goepel electronic, discusses the latest technology innovations happening in the test and inspection segment, and the market trends shaping them.

Ray Pritchard Looks Back at IPC’s Beginning and His Role in Getting it Started

I have known Ray Pritchard for a long time—as long as I’ve been involved with IPC, in fact. He directed the organization for 35 years before turning over the reins. One could say he grew up with the organization—or vice versa. Ray was always a bundle of energy and still is, still joking and warm, a great people person, and I am sure he had a little something to do with the spirit of camaraderie and cooperation that is the hallmark of the IPC we know today.

RTW IPC APEX EXPO: Ray Prasad Discusses Revised IPC-7530 Reflow Profile Guidelines

IPC Hall of Famer Ray Prasad, chairman of the IPC-7530 committee, provides an overview of the newly revised IPC-7530, which provides users with guidelines on how to successfully profile and characterize PCB assemblies with high levels of efficiency.

Conflict Minerals – A Mixed Message?

While the EU is taking a more considered but arguably progressive approach towards banning conflict minerals, the US, in contrast, looks to be heading towards a relaxation or even abandonment of its rules.

SMT Xtra Discusses Expansion Plans in the US

At the IPC APEX EXPO 2017 event in San Diego, SMT Xtra's Alexandra Stovin, marketing and public relations manager, and Paul Pittman, sales manager for the United States and Canada, speaks with I-Connect007 Technical Editor Pete Starkey about their company’s expansion plans in the U.S. and the benefits they offer their customers.

RTW IPC APEX EXPO: Alpha Highlights Technologies Dedicated to Eliminating Solder Voids

Robert Wallace, marketing manager for the Americas at Alpha Assembly Solutions, discusses their new product introductions for this year and their level of customer support as these products are rolled out. He also talks about how these technologies are helping address the issue on solder voiding.

How Servitisation Can Enable Manufacturing Sales Growth

OEMs and EMS providers must implement strategies that enable sales growth – and one such strategy is servitisation, which is about putting the needs of your customers first.

RTW IPC APEX EXPO: Nordson Highlights Improvements in Dispensing and Conformal Coating Systems

Roberta J. Foster-Smith, global marketing communications manager for Nordson ASYMTEK, discusses the continued improvements in Nordson's dispensing and conformal coating equipment, especially when it comes to automation, precision and consistency in delivering ever-finer deposits to meet industry demands and customer needs.

RTW IPC APEX EXPO: Indium Discusses Industry Trends and Reliability Issues

Indium Corp. Product Manager Chris Nash talks with I-Connect007 Technical Editor Pete Starkey about how they are helping customers address their reliability issues, and discusses the success of their "Avoid the Void" campaign.

RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions

Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.

A New Power Design Methodology for PCB Designs

Advanced PCB design is an iterative process of analysis-fix-analysis. Historically, this process is very time-consuming, requiring analysis experts and PCB designers to work together to find and fix layout problems. This article describes a new PCB design methodology that allows a PCB designer to perform the power design without having to run expert-level analysis tools. This methodology provides the setup automation for advanced analysis without the need to understand every minute parameter, and can be completed in a few steps.

RTW IPC APEX EXPO: KIC on Smart Factory Technology Approach in Thermal Ovens

Bjorn Dahle, president of KIC Thermal, discusses with I-Connect007 Guest Editor Dick Crowe their approach to measuring temperatures in thermal ovens and networking the information to a main frame, to enable the process engineer to statistically monitor a specific process.

RTW IPC APEX EXPO: IPC Validation Services Update

Randy Cherry, IPC's Director of Validations Services speaks with Guest Editor Judy Warner. Randy gives an update on the QML and QPL programs, including updates on the newest QPL program for copper clad laminates. They also discuss the growing value of industry engagement with VS as the number of certified facilities increases.

RTW IPC APEX EXPO: Alpha Highlights Solder Reclaim Technology

Mitch Holtzer, director of Americas Reclaim Business for Alpha Assembly Solutions, discusses the company’s reclamation technology, which takes solder dross, used solder paste, and solder paste debris and converts it into reusable soldering materials. He also talks about how solder reclamation can help sustainability efforts, and how it helps customers when it comes to their waste materials.

RTW IPC APEX EXPO: Manncorp on Having a Solutions-centric Approach

Manncorp father-son team Henry Mann and Kyle Mann talk with I-Connect007 Guest Editor Kelly Dack about providing excellent guidance, service, training and support for companies who may be unsure of the best route to take in selecting the right SMT equipment.

How Can I Compare EMS Providers and Create My Shortlist?

Finding the right EMS provider for your business can be a challenge. And trying to compare EMS suppliers and create a shortlist is hard work. Unfortunately, there is no ultimate cheat sheet to help you find the perfect partner. But here's 15 or so questions that you may ask, in order to start collating meaningful data to be able to starting making informed comparisons between EMS providers you are considering partnering with.

RTW IPC APEX EXPO: Mentor Graphics Finishes Traceability Standard in Record Time

Michael Ford of Mentor Graphics and Editor Andy Shaughnessy discuss Mentor's work with traceability processes, including the new IPC traceability standard that was finished in record time.

RTW IPC APEX EXPO: Thomas Scales of Saline Lectronics Discusses Internet of Things

Thomas Scales of Saline Lectronics speaks with Guest Editor Dick Crowe about their company's approach to offering networking and process control solutions in the automated factory.

RTW IPC APEX EXPO: Mirtec Discusses Latest Developments in Inspection Technologies

Mirtec President Brian D’Amico talks about the latest in 2D and 3D AOI and SPI, and how to provide smaller users with affordable high-technology systems. He also talks about the sales success of the MV-6 OMNI series in-line full-3D AOI machine, which features advanced features such as 15-megapixel top-down camera and 3D digital multi-frequency Moire.

RTW IPC APEX EXPO: CyberOptics' Subodh Kulkarni Discusses Ultra-High-Resolution AOI

Dr. Subodh Kulkarni discusses the new bleeding-edge AOI technology CyberOptics has developed that will advance vision technology to a level not achievable today. MRS technology combines accuracy with speed, which have been mutually exclusive in the past.

RTW IPC APEX EXPO: 3D AOI Update With MEK

Henk Biemans of MEK Europe discusses with I-Connect007 Editor Andy Shaughnessy their latest developments in 3D AOI, and their efforts to educate their customers about this growing market.

RTW IPC APEX EXPO: Indium’s Eric Slezak Talks Project 99

Indium Corporation's Eric Slezak talks with I-Connect007 Guest Editor Steve Williams about the launch of their new Project 99 wave solder process flux system. Indium has created an exciting new spin on this technology by using a comic book theme, with "villains" representing common wave solder defects and "superheroes" representing their flux solutions to combat the problems.

Industry 4.0: Nine Key Points Electronics Manufacturers Must Not Ignore

The Fourth Industrial Revolution is nothing if not massive and complicated. There is a huge amount of information out there, some useful and some perhaps less so. But, among the hype, there are a few consistent themes that really must not be ignored by manufacturers wishing to remain competitive in the future.

RTW IPC APEX EXPO: Electrolube Discusses New Conformal Coating Technologies

Phil Kinner, technical director of the coatings division at Electrolube, discusses with I-Connect007 Guest Editor Dick Crowe the latest trends happening in the coatings industry, and how their solutions help customers enhance the reliability of their electronics assemblies.

RTW IPC APEX EXPO: Kyzen’s Thomas Forsythe Talks Latest Developments in Aqueous Cleaning

Thomas Forsythe, executive vice president of Kyzen Corp., talks about the advantages of real-time concentration monitoring, data management and access to data as aqueous cleaning moves towards Industry 4.0.

Metcal Brings Big Science and High Reliability to Hand Soldering

Recently, Judy Warner visited the Metcal facility in Southern California and meet with Product Support Engineer Robert Roush. They talked about Metcal's patented hand-soldering technology, which promises to bring a new level of science and control to the world of hand-soldering.

RTW IPC APEX EXPO: Rehm Highlights Reflow Improvements for Reliable Solder Results

Michael Hanke, CCO of Rehm Thermal Systems, highlights the latest developments in their reflow solutions, which are targeted at improving the reliability of the soldering process. He also discusses their complete solution, which is inline with the Industry 4.0 trend.

RealTimewith...IPC: Mycronic Highlights Latest Capabilities of Jet Printing

Nico Coenen, global sales director of jet printing at Mycronic, discusses the latest developments in their jet printing technology. He also highlights how these advances align with their Mycronic 4.0 strategy.

Real Time with...IPC: Cogiscan Discusses Connectivity Solutions to Enable Industry 4.0

Francois Monette, VP Sales and Marketing at Cogiscan Inc., talks about how the industry can meet the challenge of connecting different machines, software and enterprise systems to enable Industry 4.0 for the electronics assembly industry.

Time-Lapse Video: The IPC APEX EXPO 2017 Show in Under Seven Minutes!

During IPC APEX EXPO 2017, we at I-Connect007 had our time-lapse camera running from setup to closing. The camera was positioned high in our studio, where we conducted our RealTimewith…IPC APEX EXPO video interviews, aimed down the main aisle.

Real Time with...IPC: CalcuQuote on Risk Assessment and RFQ Management

Chintan Sutaria, president of CalcuQuote, discusses how their RFQ management system, with its risk assessment feature, helps EMS customers improve their supply chain. He also talks about their new BidCQ solution is improving the bidding process.

Real Time with...IPC: IPC Market Research Update

Sharon Starr updated everyone on the Market Research services, industry forecasting and research projects her group publishes. She also mentioned a "call to action" for a meeting tomorrow with IPC members, seeking input on needed metrics for their new Pulse of the Industry program she will be rolling out this year, which will be a "Industry Health Scorecard".

Real Time with...IPC: Tim O'Neill Discusses Latest Developments in Lead-Free Soldering Market

With RoHS requirements in full swing, companies must adapt and adapt quickly as lead based soldering will be completely phased out by 2019 in Europe.

Real Time with...IPC: BEST Talks Rework Challenges and Opportunities

Bob Wettermann, president of BEST Inc., talks about the challenges in rework, and how his company is helping their customers address these problems. He also discusses his paper presentation at this week's technical conference.

Real Time with...IPC: Alpha Discusses Improving LED Reliability Issues

At this week's IPC APEX EXPO 2017 in San Diego, California, Steve Godber, LED Commercial Manager at Alpha Assembly Solutions, discusses with I-Connect007's Stephen Las Marias the reliability and voiding challenges in the LED market, and how the company is helping their customers address these issues through their solder technologies.

Real Time with...IPC 2017 Videos Now Available for Viewing

Over 70 video interviews from the IPC APEX EXPO 2017 show in San Diego, CA are now available for viewing. See the opening ceremony, hear from suppliers and others on their new products, learn more about the HDP Users Group. Don't miss the videos by IPC President John Mitchell and his staff.

Bringing SMT Assembly In-House: Case Studies of the Effects on Lead Time, Inventory, Quality, and Overall Cost

A growing number of low- to medium-volume manufacturers of specialized electronic products are reaping the rewards of bringing their SMT assembly in-house. How have some of these companies justified the cost of their endeavors? In this article, three OEM companies share their experiences.

11 Points to Consider When Buying Selective Soldering Equipment

Although there are clear benefits from investing in a selective soldering equipment, there are also a number of considerations to make prior to purchase. This article looks at 11 points that require further thought, to ensure you select the right piece of selective soldering equipment for your products.

Taking the "Process Approach" to RFQs in Electronics Contract Manufacturing

The ISO 9001:2015 standard can be applied to any organization, any management system and any process. While it is generic in its application, the specific implementation can be the difference between lagging and leading results. This article reviews how the process approach applies specifically to the request for quote process in the EMS industry.

Applying the New IPC Standard for Traceability Makes Compliance and Reporting Easier

IPC has created IPC-1782, a new standard and specification for traceability practices across all levels of electronics manufacturing, and specifically for electronics assembly. With this new standard, companies that are practicing basic levels of traceability can evolve to higher levels, and will be able to clearly define the expectations of what is required for compliance and conformance to customer needs.

What’s Driving the Rapidly Changing Electronics Assembly Industry

Since the EMS landscape has become so competitive, staying on top of new advances in technology and being able to rapidly adapt to changing customer needs, market demands, trends and technological advances is critical. This article highlights some examples of how electronics assembly technology developments have impacted the EMS industry in recent years and will likely continue shaping the industry in the future.

Help Wanted! Our 2017 Industry Hiring Survey

This month we conducted an industry survey on plans for hiring during the year. Included here is a summary of the results. We started by simply asking, “Do you plan to hire additional people this year?” More than half of the respondents answered yes while about a third said no—which we take as an optimistic sign that our industry plans to expand in 2017.

Continuous Improvement in Electronics Manufacturing

With so many variables and "opportunities" to create waste, electronics manufacturing services (EMS) companies have an on-going challenge to identify, address and then eliminate inefficient processes. This is where a continuous improvement approach can help.

The Shape of Things to Come

Where is our industry going? The beginning of a new year provides a good opportunity to look into the crystal ball and foretell what we think will be. So what are the general drivers of change in the high tech electronic product assembly business, and what specific new product and process types do we see that are a result of those drivers?

Achieving Repeatable, Consistent Control over the Selective Soldering Production Process

Selective soldering is a process with more than 100 different parameters that may impact soldering performance. A robust selective soldering process should have a wide process window that is able to handle variations in material quality. In this paper, critical process parameters are discussed as well as methods that can be used to widen the process window.

Investing in New Technologies

Electronics manufacturers are beginning to consider investing in new systems to take their processes to the next level. In our recent survey on the topic of new technology, the top reasons cited by manufacturers to invest in new technologies are to increase efficiency, improve yield, reduce cycle time, and the advance capability of the process.

Turning the Relationship Between the Electronic Product Assembly Employer and Recent Graduates Upside Down

The post-secondary educational system must change from being reactive to our industry’s (high tech electronic product assembly business) needs to being proactive. Students that graduate should act as change agents, challenging a company’s status quo by bringing the latest design, production equipment and process techniques to their new employers from their academic experience.

What to Look for When Auditing an Electronics Manufacturing Facility

Although a large amount of research can be carried out online when selecting an EMS partner, the only real way to satisfy an OEM whether an EMS provider will be a good fit or not is to meet the team and audit their processes. This article lists the approach many OEMs take and highlight some of the key questions they ask.

The Impact of Via and Pad Design on QFN Assembly

Thermal via arrays under QFN components are used to conduct heat away from the device. However, thermal vias can create more voids or result in solder protrusion onto the secondary side. This paper discusses a study on the impact of via size and via design on QFN voiding and solder protrusion.

Reflections on 40 Years of Test and Measurement and What Lies Ahead

Dr. James Truchard, President, CEO, and Cofounder of National Instruments, has penned his reflections on the last 40 years driving and leading some of the greatest progress and innovations the test and measurement industry has seen. In the article, he also leaves us with his thoughts on how he envisions the future to be.

The Time Has Come for Jet Printing

At the recent NEPCON South China 2016 trade show in Shenzhen, Thomas Bredin, area sales manager at Mycronic, discusses with I-Connect007's Stephen Las Marias the latest developments in jet printing technology, and their recent acquisition of Shenzhen Axxon Automation.

Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability

Lead free solder joint reliability in drop shock loading has been a recurring issue in mobile and handheld consumer electronics. Changing solder composition may offer an opportunity to improve joint drop reliability. This study focuses on different failure modes in circuit board assemblies as observed based on solder composition, board surface finish, and solder joint volume.

Understanding Rush PCB

I had an interesting interview recently with Rush PCB CEO Akber Roy, who goes by Roy. I was stunned by some of the things he told me about the Silicon Valley company, such as how Rush PCB can turn around full turn-key quotes in less than three hours. He also told me they can deliver full turn-key product in five days or less, sometimes three days.

Evaluation of the Use of ENEPIG in Small Solder Joints

When soldering to ENEPIG, all of the palladium is dissolved into the solder joint, and creates a palladium-rich region at the base of the solder joint. The shrinking solder joint sizes due to the ever decreasing size of parts cause the relative size of this palladium-rich microstructure to grow relative to the overall joint thickness. This study evaluates the impact of industry standard Pd thicknesses on thin solder joints through shear testing.

Six Sigma: What is it and How is it Used in Electronics Manufacturing?

Six Sigma is a defined, data-driven methodology aimed at process improvement and consistent output in manufacturing. This article discusses how it is used in electronics manufacturing, and the benefits it offers companies that have implemented it.

A New Organizational Model Using Logic, Cost-Effectiveness and Customer Service, Part 2

In previous articles, Tom Borkes talked extensively about one of the controllable components of labor cost: the counterweight to competing against low labor rates—using automation to reduce labor content. Over the next few months he will drill down into the other controllable component of labor cost: indirect labor.

More Than Just Dry Air: Controlling Oxidation and Intermetallics in Moisture-Sensitive Devices

Our new columnist Richard Heimsch will be focusing on the management of moisture sensitivity in his column “More Than Just Dry Air.” His inaugural article talks about controlling oxidation and intermetallics in moisture-sensitive devices.

CES 2017: Disruptive Technologies

Those of you that have read my previous columns covering CES 2017 know that at recent CES shows I have seen many drones, autonomous cars, IoT devices, robots, and many other items ranging from robots who stand in for your doctor to smart trash cans who tell you via Alexa, Google, or soon, Cortana on your own computer, that since you have thrown away two empty milk cartons in the last few days it may be time to order more milk; just say yes and consider it ordered.

Plating and Surface Finish: Assemblers' POV

Joemar Apolinario and Dnichols Dulang of EMS firm Integrated Micro-Electronics Inc. discuss with SMT Magazine the impact of plating and surface finishes on electronics assemblies. They highlight the impact on solderability, the problems with complex components and packages, as well as parameters to consider when it comes to surface finish selection.

How to Choose Your Outsourcing Project Team

When you decide to outsource your manufacturing operation to an EMS provider, you not only have to choose the right partner – you also have to select your in-house outsourcing project team. With so many important decisions to make, it's easy to feel overwhelmed at times. But with the right people in situ, you will be perfectly placed to achieve success. Here's how you should go about assembling your outsourcing project team.

Choosing the Correct Flux—Advantages/Disadvantages

While often overlooked, the flux chosen for the selective soldering process has a great impact on solder joint quality, long term reliability and overall selective soldering performance. This article outlines the critical factors of commonly available selective soldering fluxes and how they impact the soldering quality, reliability and equipment performance.

The Influence of Clean Air on the Value-Added Chain in Electronics Production

A multitude of different processes in modern electronics production—from connection and separation technologies, surface processing such as marking and drilling, the utilisation of fluxes, up to production processes such as soldering, welding and gluing—generate harmful substances that might have extreme health impacts and affect production plants and products.

5 Reasons Why OEMs Outsource to EMS Providers

Why do original equipment manufacturers (OEMs) outsource to electronics manufacturing services (EMS) providers? This article provides five reasons why OEMs venture down an outsourcing path, and the benefits they gain along the way.

CES 2017: Press Day, LaunchIt and Showstoppers

Before the show opens, CES provides two days and evenings not open to the general attendees, to enable companies, large and small, an opportunity to present their new offerings to the press. These opportunities range from small meetings with individual members of the trade press to huge events such as those presented by Samsung, Asus, Sony, Intel, Panasonic and others, with literally several hundred in attendance.

Reducing Warpage on BGAs During Rework

This article highlights one of the challenges associated with BGA rework--the effect of device warpage. To address this, Bob Wettermann writes about strategies to reduce device warpage on BGAs to avoid shorts and open circuits post rework.

Editor's Note: Understanding Plating and Surface Finishing

This month’s issue of SMT Magazine focuses on the impact of plating and surface finishing in electronics assembly. True, plating and surface finishing may be more directly significant in PCB fabrication, but surely they are important issues as well when it comes to the assembly side. In fact, according to our recent survey, 82% of the respondents said surface finishing impacts their assembly process.

On Location at HKPCA: IPC’s Mitchell and Carmichael on Asia, the Global Industry Outlook, and Trump

While in Shenzhen, China recently, with the PCB industry’s biggest trade show as a backdrop, Publisher Barry Matties sat down once again to interview IPC President John Mitchell and IPC Asia President Phil Carmichael. This time they discussed trends they’re seeing in the Asia-Pacific region and what a Trump presidency means to the industry.

Breaking Down the Long, Complex Sales Cycle in the EMS Industry

The EMS industry is still considered a young industry, with roots based in the early contract manufacturing days of small harness and PCBA shops. This article discusses how the demand creation process has morphed since the EMS industry's birth around 30 or so years ago into what we might consider as typical in the contract electronics manufacturing industry today.

Successful Sales Strategies

At the recent NIDays 2016 event in Singapore, Matej Krajnc of National Instruments speaks with I-Connect007's Stephen Las Marias about the challenges for sales and marketing executives in the electronics manufacturing industry, effective sales strategies, and key attributes of a sales person. He also shares his outlook on some of the key technology trends for next year.

How to Build Up Trust in a Manufacturing Outsourcing Relationship

When you, as an OEM, entrust part or all of your manufacturing operation to an EMS provider, you want to know that this fundamental aspect of your business is in safe and capable hands. It takes time to establish trust. So how can you build it up into a strong and permanent structure? Read on.

Front Lines: Sales—a.k.a., Trench Warfare!

In his inaugural article for his column Front Lines, Craig Arcuri writes about sales—real sales—not pop sales ideas, not sales jargon of the day, not flavor of the month tactics. He talks about sales in the trenches, and provides simple steps to build a sales foundation that will help your company generate more sales.

Real Time With...HKPCA & IPC Show 2016: IPC Hand Soldering World Championship in China

IPC President John Mitchell speaks with Editor Stephen Las Marias about the highlights of this year’s IPC Hand Soldering World Championship, which was held in China for the first time. He discusses how IPC has managed to keep the event so popular and successful for such a long time.

The Hunt for the Best Pre-Owned SMT Equipment Supplier

There are many SMT equipment resellers out there, some with many years of experience and others that are merely intermediaries between a company that’s trying to sell their surplus equipment and you. With that in mind, think of what you can afford not only in terms of the cost of equipment, but also regarding installation, training and support.

How to Create the Perfect SMT Reflow Oven Profile

While EMS providers will have their own preference when it comes to machine type and brand, broadly speaking, the process steps they go through to produce PCBAs are the same. However, one step that can make all of the difference when it comes to quality and consistency is reflow. This article details how EMS companies can go about creating the perfect SMT reflow oven profile.

Sales and Marketing in a Digital Transformation Reality

While many of the common sales and marketing best practices apply to the PCB assembly industry, however, deep manufacturing and electronics design expertise is required to truly drive customer interactions from one-off transactions into long and sustaining relationships as the industry goes through rapid change such as the larger involvement of a younger generation in the workforce, and the move to digital transformation and smart manufacturing.

Meeting Current and Future Requirements of the Automotive Industry

Phil Kinner, technical director of Electrolube's Coatings Division, speaks with I-Connect007's Pete Starkey about the role of conformal coatings in various applications of the automotive industry. He talks about thermal shock testing, and provides updates on their collaboration with the National Physical Lab on condensation testing.

EMS Industry Sales and Marketing: Why Strategies Vary Widely

In this article, Susan Mucha of Powell-Mucha Consulting explains why sales and marketing strategies vary widely in the EMS industry. She provides a case study of four EMS firms and their approach to the sales and marketing process.

The Business of Doing Good

This is the time of year when many people look back to what they have done so far to get a handle on goals for the coming year. Businesses also engage in the same year-end assessment, this time with greater focus on the things they have been doing right and how to improve on aspects that need more work.

Disaster Recovery Planning: What to Look for in an EMS Partner

While you're unlikely to encounter a catastrophic event in your electronics manufacturing outsourcing venture, it's nevertheless prudent to ensure that you work with an EMS partner who has the capabilities to deal with such a scenario if it should occur. So what should you look for in an EMS provider's disaster recovery policy, to ensure you're covered?

Boundary Scan Meets Functional Test

This article discusses some fundamental aspects of the combination of boundary scan and functional test, as well as new technological solutions for embedded functional tests and their practical implementation.

Rework and Repair Standard Getting Updated

The IPC-7711/21 Rework of Electronic Assemblies/Repair and Modification of Printed Boards and Electronic Assemblies is being “upreved” from version “B” to version “C” and will soon be released to the industry. This article talks about a couple of notable changes that strengthened, modernized and brought together changes from the previous “B” version, which was approved in 2007.

How to Avoid a PCB Supply Shortage During Chinese New Year

The post-Christmas blues are bad enough, but getting caught out by a PCB supply shortage due to the week-long Chinese New Year is likely to cause both you and your EMS partner significant pain. By assessing both your current and future demand, and then working closely with your PCB suppliers, EMS provider and end users, you can take a number of steps to minimize the risk to your business.

Digi ConnectCore 6UL Creates a Big Buzz at electronica

Guy Volckaerts, director for EMEA embedded sales at Digi, speaks with I-Connect007's Judy Warner about Digi’s star-of-the-show at the recent electronica event in Germany—the Digi ConnectCore 6UL—a quick, simple, feature-rich, yet very flexible system-on-module solution for OEMS and developers.

Editor's Note: Selling Success in the PCBA Industry

I am neither a salesperson nor a marketing person, but over the course of my editorial work, and through speaking to technology and systems providers in the electronics manufacturing industry, I have learned a few things when it comes to sales and marketing, namely, the importance of collaboration, positive relationships, and technical knowledge. For example, sales and marketing teams must work together to make sure deals get closed and contracts are awarded.

LA/Orange County SMTA Tech Expo a Success

On November 3, I had the pleasure of attending the LA/OC SMTA Tech Expo in Long Beach, California, and meet with chapter President Kathy Palumbo and Vice President Scott Penin, to learn more about this annual event and the chapter’s ongoing activities.

Real Time with...HKPCA & IPC Show 2016 Slideshow - Day 2

The 2016 IPC Hand Soldering World Championship was held concurrently for the first time at the International Printed Circuit & APEX South China Fair (HKPCA and IPC Show 2016) in Shenzhen, China. View the slideshow here.

My Product is Too Large and Complex to Outsource to an EMS Provider

A number of projects that struggle to get off the ground over concerns relating to size, shape or complexity can easily be outsourced – providing the project is approached in the right way. This article explains how.

Tin Whisker Mitigation Methodologies Report from SMART Group, Part 2

Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In the second part of this two-part article series, Editor Pete Starkey concludes his review of the SMART Group's recent seminar, which is focused on tin whisker mitigation methodologies and strategies.

Solder Voiding, Autonomous Autos, and Statistics—So Much to Learn from Dr. Ron

While at the 2016 SMTA International conference and show, I had the lucky opportunity to talk with Indium Corporation’s Dr. Ron Lasky. He gave a great synopsis of the extensive testing done by Indium Corporation’s Chris Nash on solder voids, outlined in a paper co-authored by the two, which was being presented by Ron at the conference.

SMTA Tech Expo Panel Session: It Takes a Village to Discuss Proper Cleaning Solutions

An expert in cleaning processes, Barbara Kanegsberg is known as “The Cleaning Lady.” She moderated the technical session “Ask the Experts: Meeting the Challenges of Effective Cleaning, Defluxing in Southern California.” Here Barbara discusses the myriad of challenges regarding cleaning PCBs (particularly in heavily regulated California) and what transpired during the open forum technical session.

HKPCA & IPC Bring Hand-Soldering Competition World Championships to China

Helen Guo, member services director at IPC Greater China, discusses with I-Connect007's Edy Yu IPC’s activities and initiatives in China. She also discusses the upcoming International Printed Circuit and APEX South China Fair 2016, which will feature the hand-soldering competition world championship for the first time in China.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In this article, Editor Pete Starkey reviews a recent seminar by the SMART Group to discuss tin whisker mitigation methodologies and strategies.

3 Reasons Why Outsourcing to an EMS Provider Can Go Wrong

A true outsourcing partnership should deliver benefits to both the OEM and the EMS provider. However, there are always risks, and sometimes outsourcing can go wrong. This article highlights three reasons why the OEM/EMS provider partnership might turn sour.

Leadership in Your Company: Something to Worry About?

Leadership is an ingredient that most feel is important, even though many find it is hard to define. Some say that you will know good leadership when you see it. In this article, Tom Borkes of The Jefferson Project discusses the role of leadership, and how it can be taught in the academia.

The Fine Art of Providing a Single Source for Fab, Assembly

Jay Rupani, president of Precision Technologies, speaks with I-Connect007's Patty Goldman about what exactly his company does, what differentiates them and why. He also talks about why having a single source for bare board manufacturing and assembly saves customers time, money and much angst.