New Cabinets, Automation Tools, Depaneling Products and Other Services for Assembly
These products for odd-form and final assembly, as well as in-line automation, include lead clippers and component handlers, storage cabinets that meet MSD and ESD standards, singulation systems to depanelize PCBs, laser cutting services for thin metal parts, and more.
Milara, Mirae Partner to Manufacture Combined Printer and Pick-and-Place System
Milara Inc., a vendor of fully and semiautomatic stencil printers for SMT and wafer applications, partnered with Mirae Corporation of Korea, combining technologies to produce a fast printer and pick-and-place system. The solder paste printing and component placement system, called the P3, will be launched at IPC APEX 2010 in Las Vegas.
Acculogic Manufacturing Test Systems Division Opens CA Office
Acculogic’s Manufacturing Test Systems Division, a global leader in electronic test and production solutions, recently opened a new testing services and support satellite office in Laguna Hills. The office will provide technical support, training, and contract services for Acculogic’s installed base of flying probe and boundary scan systems on the West Coast.
Workshops on Lean, Best Practices from Lean Enterprise Institute
A comprehensive lineup of workshops from the Lean Enterprise Institute (LEI) will show executives and managers how to apply lean business concepts to improve supply chain, logistics, service and administrative processes, as well as practice the new lean leadership behaviors needed to sustain the improvements. In addition, the workshop "Leading the High Velocity Organization" by Steven Spear, a senior lecturer at MIT and author of Chasing the Rabbit, will help executives and managers adopt the best practices of today’s most competitive companies.
The Gold Record: CES 2010 From a Manufacturing Perspective
In this video edition, I-Connect007 OEM Editor Dan Feinberg discusses his Consumer Electronics Show highlights: Faster processors, 3-D home entertainment, tablet mania, battery life and more.
Call for Papers: International Conference on Soldering and Reliability
The SMTA Technical Committee invites industry professionals to submit abstracts for the 2010 International Conference on Soldering and Reliability, being held this May in Toronto, ON, Canada. Abstracts are due by January 29, 2010. Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts.
Adept Wins $3.2M Order for Intelligent Robotics from Test Automation Equipment OEM
Adept Technology Inc. (Nasdaq:ADEP), a provider of intelligent vision-guided robotics and global robotics services, received a $3.2 million order for high-precision robots from a major international manufacturer of test automation equipment. The order is expected to be fulfilled and recognized as revenue in Q’03 FY 2010. The company selected Adept as its automation partner to provide high-speed robot systems for complex, precision handling operations.
Odd-form Components and Equipment for Electronics Assemblies
These new products include cables, connectors, a through-hole insertion system, device cooling hardware, and a report on the odd-form/connector industry, as well as a component order calculator, and more.
Google Nexus One Carries $174.15 Materials Cost, iSuppli Teardown Reveals
With its new Nexus One, Google Inc. has taken many of the latest smart-phone innovations and combined them in a single product that manages to be both cutting edge and cost competitive, according to a teardown conducted by iSuppli Corp.
Celestica Acquires Invec Solutions to Bolster After-market Services
Celestica Inc. (NYSE, TSX: CLS) has acquired Invec Solutions, provider of warranty management, repair, and parts management services to companies in the information technology (IT) and consumer electronics markets.
IPC Issues Call for Nominations for Corporate and Individual Awards
IPC — Association Connecting Electronics Industries will recognize volunteers who contribute their time and expertise to IPC standards development and other vital IPC activities, based on industry nominations. Industry members are encouraged to highlight the special achievements of their companies and their colleagues by nominating them for one or more awards. Awards will be presented at IPC APEX EXPO the week of April 5, 2010, at the Mandalay Bay Resort & Convention Center, Las Vegas.
IPC Solder Products Value Council Issues Report on Take Action Limits for SAC Lead-free Solder Processes
Following a two-year study on the effect of impurity limits on the performance of lead-free solder, the IPC Solder Products Value Council (SPVC) has announced the publication of a white paper, “Take Action Limits (TAL) for SAC305 Lead-Free Soldering Processes Utilizing Solder Baths/Pots.” The paper provides electronics manufacturers with better-defined limits to guide them on a more efficient use of solder, aiming to improve yields.
IMEC Looks to 2010 with Optimism
Luc Van den hove, CEO of IMEC, shares the research organizations ideas for 2010 from semiconductors and R&D perspective. Though he says the economic downturn did not significantly delay the semiconductor roadmap, lessons from previous recessions should be applied in ways that fit today's environment.
Microvia Reliability Failure Modes
With the move to HDI, more and more microvia failures are rearing their ugly heads. Paul Reid, Program Coordinator with PWB Interconnect Solutions, Inc., discusses the root causes for these failures and solutions with Editor Ray Rasmussen.
Confusion Over Lenovo's Rumored R&D Center in Taiwan
(December 28, 2009) TAIPEI, Taiwan — Steve Chuang, China Economic News Service (CENS), among other Asia-based news services, have reported that China-based notebook PCs maker Lenovo will set up an R&D center in Taiwan and increase its procurements from Taiwanese suppliers in the future, citing Ma Jianrong, the brand's director of government affairs division. However, these stories are refuted by other news agencies, such as Bloomberg.
Crane Acquiring RF Component Maker Merrimac Industries
Crane Co. (NYSE: CR), a diversified manufacturer of highly engineered industrial products, and Merrimac Industries Inc. (AMEX: MRM), designer and manufacturer of RF microwave components, assemblies and micro-multifunction modules (MMFM), signed a definitive agreement for Crane to acquire Merrimac in Q’01 2010 for an estimated $52 million. Crane will pay $16.00 cash per share of common stock of Merrimac and associated common stock purchase rights.
IPTE Divests Automation; Restructures Contract Assembly
IPTE NV (Euronext Brussels: IPTE) sold its automation division to Huub Baren and Vladimir Dobosch. The contract manufacturing division will operate under the name Connect Group. It will be managed by CEO Luc Switten and independent director Erik Dejonghe, who has been chairman of the board since June 2009. Only Connect Group, a market leader in its sector in the Benelux, will remain listed on Euronext Brussels.
ASYS and EKRA Americas to Merge
(December 22, 2009) ATLANTA — ASYS Inc. and EKRA Americas Inc. will merge under the name of ASYS Group Americas Inc. as of January 1, 2010. The regional headquartes for the Americas will be in Suwanee, GA. Personnel and offices will remain in Marlborough, MA; Hillsboro, OR; San Jose, CA; Mexico; and Brazil. The combined company will continue to sell automation products for the SMT, hybrid, semiconductor packaging, and solar markets.
Blakell Europlacer Adds New Products to Its UK Distribution Product Portfolio
Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, added a range of new products to complement its existing product lines, distributed exclusively within the U.K.
Corelis Expands to Europe
Boundary-scan test and measurement tools supplier Corelis Inc. appointed a new business unit under the name Corelis Europe to directly handle all business operations in the European market. Corelis Europe is based in Germany and is led by Andreas Bayer. Bayer has led A.R. Bayer DSP Systeme GmbH for the past 15 years, concentrating on custom DSP and FPGA design services for the telecom, industrial, and medical industries.
Solders, Metallizations, and Conductive Inks
These new solders, metallization formulas, and other conductive materials meet current SMT industry needs for finer-pitch paste print, and lead- and halogen-free PCB assembly.
Asustek Reduces Pegatron Holding to 25%, Values EMS Provider at $2.9B
Reuters reports that the netbook PC maker Asustek (2357.TW) will reduce its holding in Pegatron, its fully owned contract electronics manufacturing (CEM) subsidiary, to 25%, in a move to reduce any conflict of interest between the two sides. Asustek will reduce number of shares issued by 85%, with each Pegatron share valued at about T$40.60. Pegatron has had trouble competing with other EMS providers due to its attachment to OEM Asustek, Reuters suggests.
FINE LINE STENCIL to Install LPKF ScanCheck System in San Jose Facility
Stencil product manufacturer FINE LINE STENCIL, a division of FCT Assembly, will install an LPKF ScanCheck system in its San Jose, CA stencil facility. The LPKF ScanCheck system can be used to examine stencils and masks made with any technology including laser cut, chemical etch, or electro-forming. The system checks for three parameters and detects apertures that are missing, placed incorrectly, or are the incorrect size, based on the Gerber artwork files. Accurate stencil apertures can prevent printing defects in SMT assembly.
Qualcomm's Viterbi Receives IEEE Medal of Honor
Global technical professional association IEEE announced that IEEE Life Fellow Andrew J. Viterbi, co-founder of Qualcomm Incorporated and developer of wireless technologies that became the international standard for third-generation cellular phones, has been named the 2010 IEEE Medal of Honor recipient. The Medal of Honor, IEEE’s highest award, will be presented June 26, 2010, in Montreal, Quebec, Canada as part of IEEE’s annual Honors Ceremony.
"Mr. Reliability" On SAC and SnAg Lead-Free Solder Joint Reliability
Werner Engelmaier, "Mr. Reliability," discusses his recent paper, "Solder Creep-Fatigue Model Parameters for SAC and SnAg Lead-Free Solder Joint Reliability Estimation," in detail with EMS007 Editor Steve Gold.
Dispensing Systems and Associated Materials Cure, Storage Products
These new products enable higher accuracy and better process control when dispensing underfills, adhesives, encapsulants, and other surface mount materials. They include dispensing systems, jetting systems, valves, component mixers, a materials curing system, and other products.
Smartphone Shipments to Reach 235M Units Next Year
Global shipments of cellphones (excluding white-brand models) are forecasted to grow 12% to 1.33 billion units in 2010, including 235 million smartphones, after holding steady in 2009, reports Quincy Liang of China Economic News Service (CENS). The prediction was made by the Topology Research Institute (TRi), a private market-research firm in Taiwan.
IDC Releases EMS Industry Forecast 2009-2013
Michael J. Palma, senior research analyst in the semiconductors team at IDC, published the “EMS Industry Forecast 2009–2013: Hints of Recovery” report. This IDC update provides IDC's electronic manufacturing services (EMS) industry forecast from 2008 through 2013. It includes forecasts for the EMS and original design manufacturing (ODM) sectors, product segments, and regions. This update also reviews the state of the industry and core forecast scenario and assumptions.
Henderson Forecast: Computer Equipment
Though the recession has virtually decimated the computer industry, Henderson Ventures analysts predict double-digit computer industry gains by 2011. This year, the traditional Q’04 holiday bump in sales is expected to reappear, after being waylaid last year by the onset of the financial crisis.
PCB Fab Partnership: Electronic Interconnect Collaborates with Flex Interconnect Technologies
PCB design, engineering, and manufacturing provider Electronic Interconnect (EI) will engage in a cooperative agreement with Flex Interconnect Technologies (FIT — Milpitas, CA) to jointly provide a wider range of PCB products. EI specializes primarily in rigid PCB types, while FIT provides design and manufacturing to final assembly of flexible circuits, rigid-flex, and HDI flex.
PCB Fab Merger: DDi Corp. Agrees to Acquire Coretec Inc.
DDi Corp. (NASDAQ: DDIC) and Coretec Inc. (TSX: CYY), providers of technologically advanced printed circuit board (PCB) engineering and manufacturing services, entered into a definitive agreement, pursuant to which DDi will acquire Coretec for approximately CDN $25.2 million (U.S. $23.5 million). DDi sees Coretec’s military/aerospace electronics presence in the U.S. as lucrative for the combined North American companies.
Products for PCB and Package Fabrication
These products and services include micromachining, via drilling, imaging, PCB singulation, and parts sourcing, all for the fabrication of advanced PCBs, substrates, and other structures. Laser platforms, microwashers, laser-free systems, routers, and other approaches are featured. A parts sourcing service brings together bare PCB tooling and fabrication from international partners.
Webinar Available on REACH
PTC and Tech-Clarity presented a webcast, "Prepare Your Products - and Your Business - for REACH," which reviews recent developments with the REACH regulation, how products and businesses will be impacted, and how leading companies are responding to the REACH challenge despite limited time and resources. Speakers are Jim Brown, president, Tech-Clarity and John Fox, director, product and market strategy, PTC.
Pushing the PCBA Inspection Envelope
Having released a new machine earlier this year at NEPCON China, VI Technology did not rest on its laurels. Chief Commercial Officer, Jean-Yves Gomez, elaborates on his company's newest equipment release. He also offers his perspective of how the EMS sector is doing.
Manufacturing Environment, Automation, and Final Assembly Products
The following products help manufacturers assemble quality products at high yields, preventing contamination, ESD shock, defects caused by vibration, and other problems. Robotic tooling for increased automation in assembly are also included.
November EMS Indicators Report Released
Charlie Barnhart & Associates LLC released its Leading Indicators report for November 2009. The report includes latency factors, such as global cost of labor, corporate costs by EMS type, and mark-up percent by volume/sector. Hysteretic factors include geographic pacing, sector pacing, capacity utilization by geography, and solution cycle by EMS type. Finally, probability factors covered include risk constants by geography.
TT Electronics Targets Medical Equipment Manufacturers
TT electronics’ component divisions — AB Mikroelektronik, BI Technologies, IRC, OPTEK Technology, Semelab, TT ims and Welwyn — are highlighting a range of products and services for the medical market. From passive components to optoelectronics and semiconductors, TT electronics’ products are being specified for a number of applications in medical equipment. In addition to components, TT electronics also provides complete solutions through advanced manufacturing services for medical systems, including design support, application engineering assistance, and advanced testing for medical electronics.
Stories From The Trenches: How a Circuit Board Guy Entered the Solar Cell Industry
In a Joint Chapter Technical Meeting, iMAPS New England, with ACerS NE and SMTA Boston, will host Don Cullen, managing director of photovoltaics at MacDermid. Cullen will give the talk on his move to the photovoltaics industry, and the industry's future as part of the electronics sector, January 19, 2010, at Courtyard Marriott Marlborough, MA.
IPC Study on the EMS Industry Forecasts Growth Through 2013
Despite economic setbacks in 2008 and 2009, the world market for electronics manufacturing services (EMS) will continue to grow, according to a report released by IPC — Association Connecting Electronics Industries. The comprehensive EMS study, 2008-2009 Analysis and Forecast for the EMS Industry, presents data and analysis on the EMS industry examining critical trends and providing forecasts, including the potential for market expansion.
The Demographics of productronica 2009
productronica 2009, November 10–13 in Munich, attracted 1,150 exhibitors and 28,000 visitors. 39% of exhibitors came from outside of Germany, while 42% of attendees were internationally based. Of all productronica attendees, 91% were decision makers, up from 88% in 2007.
Rework Companies Merge: FINETECH GmbH Acquires Martin GmbH
FINETECH GmbH aquired Martin GmbH, a manufacturer of rework and dispensing equipment located in Wesseling, Germany. The transaction was announced during productronica 2009, where both companies exhibited. Chris Underhill, Finetech, noted the complementary systems that Martin will bring to the Finetech rework and repair lines, as well as the cultural similarities for the two companies.
EMI and Beyonics to Partner for High-volume EMS
Express Manufacturing Inc. (EMI), a private U.S.-based electronics manufacturing services (EMS) provider is working with Beyonics Technology Limited (Beyonics), which is listed on the Singapore Exchange as a major Asia-based electronics manufacturer, to develop business platforms to address high-volume production in Asia with new product introduction (NPI) and product development in the U.S.
Relieving Soldering Pain Points
OK International Vice President, Tom Seratti, explains how his company has moved from simply identifying customer pain points to actually relieving the pain. He discusses the company's sales reorganization in Europe, and the centralization of back-end functions with parent company, Dover.
IPC Printed Board Defense Roadmap to Be Released at IPC Technology Interchange
With input from top military OEMs and after months of research, the IPC Printed Circuit Board (PCB) Executive Agent Task Force has created a roadmap to assist the newly appointed Department of Defense (DoD) PCB Executive Agent. IPC Printed Board Defense Roadmap will be released at IPC’s upcoming Technology Interchange, The North American PCB Industry: It Can and Will Support the Military Market, December 9–10, 2009, in Washington, D.C.
Digi-Key Corporation Re-Launches Toolbar
Electronic components distributor Digi-Key Corporation redesigned its toolbar for additional customization, language preferences, country-specific search, a resources menu for training and other needs, and new search capabilities.
September Book-to-Bill Above Parity: 1.08
IPC announced the September findings from its monthly North American PCB Statistical Program. “We’re finally starting to see the turnaround in the September numbers for the North American PCB industry,” said IPC president Denny McGuirk. “Both rigid PCB and flexible circuit sales and orders are up by double digits compared to August. Rigid PCB sales and orders are still below September of last year, but the rate of decline is shrinking. Flexible circuit business is ahead of September last year. The most promising indicator is the book-to-bill ratio at 1.08,” he added. “It has been above parity for five consecutive months.”
New Test and Inspection Products
These are the new advances in flying probes, in-circuit test (ICT), AOI, test contactors and probes, boundary scan, and more test and inspection systems.
Productronica Show Preview: Materials
The Munich Electronics Summit and productronica will take place November 10–13 in Munich. Following are consummables for component attach, cleaning, and more, including laminates, solders, adhesives, dispensing cartridges, cleaning formulae, etc., that will be featured at the show.
Productronica Show Preview: Equipment
The Munich Electronics Summit and productronica will take place November 10–13 in Munich. Following are exhibitor previews for the equipment at the show, including inspection systems, programmers, screen printers and tooling, pick-and-place systems, and more.
Endicott Interconnect Fabricates Set-up PCB for Space Application
Endicott Interconnect Technologies Inc. (EI) delivered a complex, ruggedized printed circuit board (PCB) to STI Electronics Inc. (STI), designed to meet the unique temperature, reliability, performance, vibration, and G-force requirements for a space application. EI, with support from STI, developed a unique method of fabricating a double-sided PCB with a single-tier cavity on a 50-mil copper core.
Celestica Posts 23% On-Year Revenue Drop in 3Q09
Revenue for the quarter was $1,556 million, compared to $2,031 million in the third quarter of 2008. The year-over-year change reflects the impact of weaker end-market demand, as well as higher restructuring costs in 2009 associated with the company's previously announced restructuring program.
China's Newly Announced RoHS-type Regulations to be Discussed at IPC It's Not Easy Being Green Conference
IPC’s “It’s Not Easy Being Green: Complying with Global Environmental Regulation,” November 10, 2009 in Irvine, CA, will host a detailed discussion of China’s MIIT’s initial list, or Catalogue, of products subject to Pb, Cd, Cr(VI), Hg, PBBs and PBDE restrictions. The new restrictions released on October 9, 2009, will be discussed along with the criteria for future products to be added to the catalogue.
Solder Attach Method Challenges Traditional BGA Paradigm
First-time paper presenter Adam Stanczak, Global Product Manager for Molex, explains how a new solder attach method can help designers move away from traditional BGAs. His paper, aimed largely at PCB designers, explains design hardships and technology verifications for PCB assemblies.
Terepac, IMEC Partner for Low-cost Flexible Electronics
Terepac Corporation and research center IMEC will collaborate on novel packaging technologies for flexible electronics. The initial driver for this shared research is a next-generation wireless ECG system, developed in the Human++ Program at Holst Centre, Eindhoven.
New Solders and Soldering Products
Following are the new solders, fluxes, reflow ovens and profilers, wave soldering systems, conveyors, rework tools, and more for reliable, repeatable soldering by hand, selective soldering system, wave, or reflow oven.
To Reduce E-Waste, Slow the Pace of Electronics Launches
Americans buy new cell phones every 18 months; Europeans buy them every 15 months; and the Japanese every 9 months. Global replacement rates for digital cameras range between two and three years. And U.S. businesses replace their PCs every four years. Where do most of these used products go? Directly into the trash. Indeed, in the United States alone, consumers throw away 400 million electronic products each year, according to a report by the Stanford Graduate School of Business.
Flextronics to Build Suzhou, China Facility to Support Computing Manufacturing, R&D
In a signing ceremony held today with Suzhou Wuzhong Economic Development Zone and Jiangsu Wuzhong Export Processing Zone, electronics manufacturing services (EMS) provider Flextronics (Nasdaq: FLEX) announced it will expand its presence in China through the development of a new facility in Wuzhong. The facility will support the growing demand for computing products in China and will include a design center and extended manufacturing capabilities in the Wuzhong Export Processing Zone (WEPZ). The design center will be completed by the end of 2009 and the manufacturing facility is expected to be completed by the end of 2010.
ECT, ScanCAD Partner on Process Management Work Instruction Software
Everett Charles Technologies (ECT), a Dover Company, finalized a strategic partnership with ScanCAD International, a global supplier of process management tools. This partnership provides for ScanCAD International to exclusively distribute and support the ProWorks process management work instruction software family of products globally within the electronics industry.
New Thermal Management Products
Whether metal preforms, two-part epoxies, gap filler pads, films, or other materials, these products are designed to dissipate heat away from thermally sensitive or high-heat components to heatsinks, copper planes, the air, or other thermal interface materials (TIMs).
Participate at APEX 2010
IPC is currently accepting abstracts from students, researchers, industry experts, and engineers in all areas of electronics and solar cell assembly for the 2010 IPC APEX Expo, April 6–8, 2010, at the Mandalay Bay Resort & Convention Center, Las Vegas. Abstracts are due in January 2010.
IPC World PCB Production Report: Flat in 2008, Decline in 2009
Worldwide production of printed circuit boards (PCBs) was flat in 2008, climbing a negligible 1% over 2007 to $50.8 billion, according to IPC's World PCB Production & Laminate Market Report for the Year 2008. Published annually, the report includes estimates of PCB production value and laminate market by product type and by country to help identify and quantify global PCB material and process equipment opportunities and constraints. The value of PCB production in 2009 is expected to end in a double-digit decline from 2008.
New Stencil Products
New stencil products for solder paste printing are designed for cleaner paste release, tighter aperture control, and other user benefits. Stencils, paste print monitors, and process control software debut from DEK, Transition Automation, Photo Stencil, Ascentech, Thin Metal Parts, and Cookson Electronics Engineered Products.
Essemtec to Use Production Solutions RED-E-SET Products
Production Solutions Inc., an engineering, design and manufacturing company, entered into an agreement with SMT production equipment maker Essemtec, in which Essemtec will use RED-E-SET products and technologies on its screen printers.
Official Twitter Hashtag Announced for SMTA International
The Surface Mount Technology Association (SMTA) released the official Twitter hashtag #smtai09, which will be used during the 2009 SMTA International (SMTAI) Conference and Exhibition, October 4-8 in San Diego. The use of tools like Twitter.com is one step towards the SMTA's larger commitment to employ social media throughout SMTA activities to better serve its members, reports the association.
More SMTAI Conference Highlights
Presentations on solder paste, reflow profiling, package-on-package (PoP) assembly, and other topics will be given by Indium Corporation authors and co-authors at SMTA International (SMTAI), October 4–8 in San Diego, CA.
EMS Provider JJS Invests in Logistics, Staff, Equipment
With electronics outsourcing increasingly being identified as a way to for OEMs to reduce risk and fix cost, recent growth at JJS Electronics Ltd. reinforces the optimism surrounding this industry. Now part of the Paragon Electronics Group, the EMS specialist has recently completed the first major phase of a seven-figure investment programme that has seen the arrival of a new logistics area, new people and new equipment shared between its facilities in Lutterworth, U.K. and Chomutov, Czech Republic.
IPC August PCB Book-to-Bill Ratios Steady at Parity
IPC announced the August findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Rigid PCBs remained above parity at 1.09, holding the combined rigid and flex PCB status at 1.07. “It’s slow going, but we’re seeing more signs of recovery in the North American PCB industry,” said IPC president Denny McGuirk. “Rigid PCB bookings are strengthening and that is keeping the book-to-bill ratio well above parity. It has been positive now for four consecutive months, which suggests that we should start to see the impact in sales growth this fall.”
Indian Surface Mount Technology Market Report
Frost & Sullivan’s research service, “Indian Surface Mount Technologies Market,” provides market dynamics and size with forecasts, trends, and competitive analysis. In this research, Frost & Sullivan's analysts examine placement equipment, inspection equipment, soldering equipment, screen printers, glue dispensers, cleaning equipment, and SMT software for various end-use verticals.
SMTAI Conference Preview: Paper Abstracts and Times
SMTA International (SMTAI) will hold its conference October 4 through 8 in San Diego, and the SMTAI Technical Committee reviewed more abstracts than any time in the past 5 years. The final selection consists of 120 papers with 18 short courses, as well as AIMS co-location, Emerging Technologies, the Lead-Free Symposium, the Contract Manufacturing Symposium, and a special keynote speaker from Jet Propulsion Labs. Following are some paper presentation highlights.
MYDATA Qualifies Alpha, AIM Solder Pastes for Jet Printing
MYDATA announces that two solder paste partners, Alpha and AIM, released solder pastes designed and qualified for the MYDATA MY500 Jet Printer. The new pastes will debut at the Elkom exhibition in Finland, September 23-25.
A Study on Copper Dissolution in Liquid Lead-Free Solders Under Static and Dynamic Conditions
In this study, copper dissolution was evaluated with four lead-free alloys (SAC305, K100LD, SC995e, SN100C) at temperatures 245, 260, 280 and 300°C with time duration of 20, 60, 300 and 600 seconds. Results show that K100LD and SN100C have the lowest rate of copper dissolution.
Leading Indicator Report for OEMs and EMS Providers
Charlie Barnhart & Associates LLC released the Leading Indicators Q4CY2009 report, tracking latency factors like global cost of labor, corporate EMS costs, and margins; hysteretic factors like geographic and sector pacing, as well as capacity utilization by geography; and probability factors such as risk constants by geography.
SMT Inspection Products
Electronics assemblers need to inspect assemblies for everything from polarity errors to component counterfeiting and beyond. The vision systems, digital microscopes, test services, automatic optical inspection (AOI) offerings, and other inspection products featured here were recently released by Soldertec Global, Marantz Business Electronics and Nutek, Keyence, GOEPEL electronics, Sonoscan’s SonoLab, Seika, Microscan, the SharpVue division of Aven, and Extech Instruments.
Research and Markets Releases Bare PCB Manufacturing Report
Research and Markets' "Bare Printed Circuit Board Manufacturing Industry" report for Q'02 2009 is a comprehensive market research guide on the industry. It provides the latest information on the industry's key financial data, competitive landscape, cost and pricing, and trends during the current economic recession.
Electronics Supply Chain: Slightly More Optimistic, Still in Recession
(September 8, 2009) SAN JOSE, CA — VentureOutsource.com published findings from its survey of nearly 300 electronics supply chain decision makers on the current business environment, volumes and expectations, and pricing trends. The results show a meaningful increase in optimism about the future, yet still no sign of irrational exuberance, or even a serious recovery before the end of 2009. The current market situation is not greatly changed since April 2009.
Almost 40% of Manufacturers Predict Revenue Increase in H'02 2009
(September 8, 2009) CHICAGO — Prime Advantage, a buying consortium for mid-sized industrial manufacturers, announced the findings of its fourth Prime Advantage Group Outlook (GO) Survey, revealing the top economic concerns of mid-sized industrial manufacturers for the remainder of 2009. The study results reflect a growing sense of optimism returning to the manufacturing sector, in terms of improved revenues, customer demand, and hiring expectations.
PCB Production Reports: IPC Market Research
(September 8, 2009) BANNOCKBURN, Ill. — The forecast for North American PCB production is down for 2009, but shows growth resuming in 2010. North American PCB manufacturers managed to push sales growth in 2008 slightly above 2007 levels, despite declines in the market for PCBs and PCB production in North America. Rigid PCB and flexible circuit producers have very different expectations for sales growth in 2009. These analyses come from four annual studies from IPC Market Research.
Juki Opens Western U.S. Headquarters
(September 8, 2009) MORRISVILLE, NC — Juki Automation Systems (JAS) opened its new western U.S. headquarters in Fremont, CA, gaining more space for customer training, demos of selective soldering and component placement offerings, warehousing and shipping, and other operations.
Bliss Opens Lean Manufacturing Solutions Center
(September 4, 2009) MILPITAS, CA Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, opened its Lean Manufacturing Solutions Center at its headquarters in Milpitas.
Valor Premiers Customer Support Portal
(September 4, 2009) RANCHO SANTA MARGARITA, CA Valor Computerized Systems Inc. launched a dedicated "Customer Support Portal," designed to provide customers with an advanced level of assistance, allowing them to log new support cases, and check and updated existing support cases. The portal is also designed to let customers search the Valor knowledge base for solutions and communicate via forums.
IPC Midwest: Free Forums, Standards Development, and Other Conference Highlights
(September 3, 2009) SCHAUMBURG, IL IPC Midwest's Conference Program and Standards Development Meetings, September 2024, will cover reliability and failure analysis, cleaning and alternatives, solder alloys, printing processes, and other relevant SMT assembly topics. Presenters include Chris Mahanna, Robisan Laboratory; Mike Bixenman, Ph.D., Kyzen; S. Manian Ramkumar, RIT; and many others from global companies.
IPC Midwest Exhibitor Preview I
(September 1, 2009) SCHAUMBURG, IL Following are some of the many new and flagship products that will be exhibited later this month at IPC Midwest, September 2324 in Schaumburg. The exhibition will include AOI systems from Mirtec and YESTech, selective soldering tools from Juki and ACE Production Technologies, solder paste inspection (SPI) from CyberOptics, and printing platforms from DEK, among a host of other exhibits.
EMS Providers Jaltek, Zollner, and Zurvahn Expand Services, Facilities
(September 1, 2009) Zurvahn expanded its Zurvahn Technology Center (ZTC) to provide engineering design services and quick-turn prototyping; Zollner Elektronik and EIT partnered to maximize U.S.-based offerings and global manufacturing; and Jaltek IDMS invested in new SMT, reflow, and inspection equipment for more flexibility in prototyping.
Copper Hits Lows on Equity Drop
(August 31, 2009) NEW YORK Reuters reports that U.S. copper futures extended a pull-back from last week's 11-month highs on August 31, as a sharp plunge in Chinese and U.S. equity markets curbed economic recovery hopes, and a firmer dollar combined to drag prices down to one-week lows.
IPC Sees Industry Strengthening Out of Recession
(August 31, 2009) BANNOCKBURN, IL IPC found in Survival Strategies and Success Measures in the Electronics Industry how companies are weathering the recession, the recession's impact on their relationships with suppliers, and how they measure success. The survey includes data from electronics OEMs, EMS companies, and PCB manufacturers and suppliers.
Taiwanese PCB Makers Post Solid Profits in H'01 2009
(August 28, 2009) TAIPEI, Taiwan Strongly rebounding demand for notebook PCs and liquid crystal display (LCD) TVs worldwide is driving Taiwanese printed circuit board (PCB) makers to rev up production, according to China Economic News Service (CENS). Taiwan's PCB fabricators have effectively fueled their profits for the first half of this year since the second quarter.
Elcoteq Streamlines Finland Operation; Trims Workforce
Elcoteq has decided to combine two current business areas, Home Communications and Personal Communications, under a new Strategic Business Unit (SBU), Consumer Electronics. Personnel reductions related to the organizational changes affect approximately 150 employees.
SME and Purdue Debut Green Certification Program
(August 27, 2009) DEARBORN, MI The Society of Manufacturing Engineers (SME) is collaborating with Purdue University's Technical Assistance Program to develop the Green Manufacturing Specialist Certificate. The curriculum focuses on such topics as sustainable manufacturing, energy efficiency, water conservation, recycling, design for the environment (DfE), and pollutants.
IPC's July Book-to-bill Stays Just Above Parity
(August 26, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries announced today the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The combined (rigid and flex) industry book-to-bill ratio in July 2009 retreated to 1.07. Booking to billing ratios for rigid PCBs stayed above parity, though the ratio for flexible circuits dropped below 1.00
Siemens SIPLACE Tour Brings Component Placement Demos across North America
(August 26, 2009) SUWANEE, GA Siemens Electronics Assembly Systems (SEAS) is taking its new-generation SIPLACE SX placement machine on the road to numerous cities throughout the Americas region beginning in September. The SIPLACE Road Show will include "Real Capacity on Demand" demonstrations, with modular placement and feeder changes shown. The SIPLACE SX pick-and-place system uses a SIPLACE MultiStar (Collect & Pick & Place) head.
Experts Hold Free Forums on Field Failures at IPC Midwest
On Thursday, September 24, 2009, industry experts will provide unique insight into the world of failure analysis in a series of Free Forums on acceptability, reliability and failure analysis held in conjunction with IPC Midwest 2009.
CENS: Taiwan Export Orders Indicate Upturn
(August 25, 2009) TAIPEI, Taiwan Taiwan's export, the growth engine of its economy, has shown clear sign of upturn, as orders received by the nation's exporters in July reached US$28.61 billion, down 8.77% year-on-year, the lowest decline in nine months, according to the Ministry of Economic Affairs (MOEA). China Economic News Service (CENS) reporter Philip Liu states that orders from China are up, while exports to the U.S. and Japan continue to be shaky.
Teknek Plans US Expansion
(August 24, 2009) GLASGOW, Scotland Contamination cleaning company Teknek plans to open a new U.S. facility in Charlotte, NC, in September. The facility will house sales and service, along with a North American fulfillment center and consumable production capacity for Teknek's contamination removal contact cleaning products.
Seika Introduces Spanish-language Line Card
(August 24, 2009) TORRANCE, CA Seika Machinery Inc. (SMI), a machinery, materials and engineering services provider, now offers its line card in Spanish. Offerings include board assembly, inspection and automated test equipment (ATE), and quality assurance (QA) products from Japanese brands.
1-Source Hiring to Combat Counterfeit and Defective Electronic Components
(August 18, 2009) PORT JEFFERSON STATION, NY As widespread counterfeiting of electronic components continues to be a major problem, 1-Source Electronic Components, electronic component distributor and supplier, released information on its efforts against counterfeit and defective electronic components, taking place through subsidiary ChipChecker Ltd.
ISO, MIL, CID, AS Certifications
Companies in the electronics assembly business and related supply chains received design, quality, and other certifications recently, covering design, process control, environmental requirements, traceability, record retention, continuous improvement, management practices, goods control, and other factors. These companies can provide certified products to medical, aerospace, space, and military customers.
SMART Group Lines Up Speakers for 25th Anniversary Seminar
(August 12, 2009) OXFORD, U.K. The line-up of speakers for the SMART Group 25th Anniversary Seminar has been announced, with keynotes in the morning and a choice of three sessions in the afternoon. The event will take place at the Oxfordshire Golf Club, October 22.
New JTAG, ICT, Cleanliness, and Other Test Products
(August 11, 2009) Following are the new products in boundary scan, functional test, ionic contamination, flying probe, combination systems, and other diagnostics and test equipment for the electronics industry.
productronica 2009 Columns: Photovoltaics, Green Electronics, Nanotech and More
(August 11, 2009) MUNICH, Germany Messe München's online forum hosts productronica 2009 exhibitors, experts in their field, voicing opinions about current electronic manufacturing industry trends. Potential topics include solar, eco-friendly electronics, micro and nanotechnologies, organic electronics, EMS trends, and advanced packaging.
ZESTRON Chooses Southeast Asia Technical Center
(August 10, 2009) MANASSAS, VA ZESTRON selected its latest Technical Center, located in Kulim High Tech Park, Malaysia. It features over 5,000 sq.ft. of floor space and will be equipped with the latest European, American, and Southeast Asian cleaning equipments such as spray-in-air, ultrasonic etc. for defluxing, misprint, and stencil cleaning applications. ZESTRON will officially open the Malaysian Technical Center by the end of August 2009.
Adrian L. Melnyk Appointed Autosplice President
(August 10, 2009) SAN DIEGO, CA Autosplice named Adrian L. Melnyk as president of the company's worldwide operations. Autosplice had grown in the past by providing custom solutions for pins and terminals, insertion equipment and printed circuit board (PCB) assemblies. Its future growth is more dependent on the ability to provide engineered solutions to total customer needs where it can be a turnkey supplier.
3M Names Exec VP for Electro and Communications Business
(August 10, 2009) ST. PAUL, MN 3M named Joaquin Delgado, Ph.D., to the position of executive vice president in charge of its Electro and Communications Business. Delgado also becomes a member of 3M's Operations Committee.
Robert Boguski Becomes Owner, President of Datest Corp.
(August 7, 2009) FREMONT, CA Robert Boguski is the new owner and president of in-circuit test (ICT) system manufacturer Datest Corp. Boguski brings 34 years of experience in the manufacture, design, assembly, and test of printed circuit boards (PCBs) and PCB assemblies, as well as 29 years' experience in management.
Molex Closes French Plant, Citing Violence
(August 7, 2009) LISLE, IL Molex Incorporated (NASDAQ: MOLX and MOLXA) is closing its plant in Villemur-sur-Tarn, France to evaluate its security. Molex asserts that this step was taken to help ensure the safety of employees and security of the facility after an employee and two security guards were injured in a violent incident at the site.
Inovaxe Names Ken Myers VP and GM
(August 7, 2009) SARASOTA, FL Component storage and MRP software solutions company Inovaxe Corp. appointed Ken Myers as vice president and general manager responsible for all operations. Myers has 20 years of experience in the electronics industry, and received his BSBA from the University of Missouri.
Murata Buys Panasonic Electronic Devices' MLCC Unit
(August 6, 2009) SMYRNA, GA Murata Manufacturing Company Ltd., supplier of ceramic passive components, purchased the multilayer ceramic capacitor (MLCC) business from Panasonic Electronic Devices (PED). Murata will acquire PEDs' technology, distributors and customers, aiming to increase its international competitiveness.
Cookson Reports 1H09 Revenue Drop
Commenting on the Group's results and outlook, Nick Salmon, Chief Executive, said, "We have faced very tough trading conditions throughout the first half of 2009. However, through the rapid implementation of our cost-reduction programs, all divisions have remained profitable.
Maxwell Technologies, ANSYS Release Ultracapacitor Library in Simplorer
(August 4, 2009) SOUTHPOINTE, PA ANSYS Inc. (NASDAQ: ANSS) released an ultracapacitor components library from Maxwell Technologies Inc. (NASDAQ: MXWL), an ANSYS customer, for use in Simplorer technology. Automotive, aerospace, and industrial power engineers developing hybrid vehicles and other electric-powered products and systems can easily use the energy-storage device models in their simulations.
iNEMI HFR-Free Leadership Program Launches
(August 3, 2009) HERNDON, VA iNEMI officially launched its HFR-Free Leadership Program with 22 companies participating. As an umbrella for several projects, program activities will provide a technical evaluation of key electrical and mechanical properties of HFR-free (low halogen) materials to ensure reliability and performance of replacement materials. Projects will also assess technology readiness and supply chain capabilities.
New Products for PCB Design and Device Programming
(August 3, 2009) These new PCB design and device programming products are focused on design for manufacturing (DfM), collaboration with MCAD mechanical design elements, fast in-system programming, and cost/performance analysis on circuit designs. Products featured come from PCB Matrix, Numerical Innovations, Vishay, Corelis, BPM, Zuken, and Screaming Circuits.
Aqueous Opens Online Cleaning University
(August 3, 2009) RANCHO CUCAMONGA, CA Aqueous Technologies opened its Aqueous University Online, aggregating information on products as well as links to published defluxing-related technical articles, video presentations, articles, and multiple technical webinars. Aqueous Technologies is a manufacturer of defluxing, cleanliness testing, and stencil cleaning equipment.
2009 PCB Orders Down 30% Year-to-Date, June Book-to-Bill Positive
(July 29, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries announced the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Rigid and flex PCBs saw positive book-to-bill ratios, at 1.12 and 1.02 respectively.
Lockheed Martin Selects Cuming Lehman Chambers for GPS Testing
(July 28, 2009) CHAMBERSBURG, PA Cuming-Lehman Chambers (CLCI) was awarded a contract to construct an advanced PIM Test Facility for Lockheed Martin Space Systems at their Newtown, PA facility. The Passive Intermodulation (PIM) shielded test chamber will support development and testing for several of Lockheed Martin's next-generation technologies including GPS III and MUOS.
Huawei Opens LTE Laboratory in North America
(July 28, 2009) PLANO, TX Telecommunications network solutions manufacturer Huawei opened a long term evolution (LTE) laboratory in Richardson, TX. Operators and Huawei's industry partners in North America are able to further explore the potential of LTE technology and experience Huawei's latest LTE products at the facility.
TFI's Gordon Chairs Green Manufacturing Conference
(July 27, 2009) ALAMEDA, CA Technology Forecasters Inc. (TFI) president Pamela J. Gordon will chair the Green Manufacturing Conference in Rosemont, IL, September 22-23. The conference covers sustainable manufacturing practices and their impact on revenue, competitiveness, and expenses.
EMS Market at $294B in 2008
(July 21, 2009) SAN JOSE, CA Revenue for the worldwide electronics manufacturing services (EMS) market was $294 billion in 2008, a 12% increase over 2007, reports Electronic Trend Publications (ETP). The EMS market will decline in 2009, but growth should return in 2010 and continue for many years. Electronics manufacturing industry revenue will reach $435 billion in 2013.
New Materials: Thermal Interfaces, Encapsulants, Adhesives, and More
(July 21, 2009) — Victrex, Huntsman, Wacker Chemie, Dymax, and other companies introduced new materials for electronics assembly, from underfills to thermal greases, glass-filled polymers, halogen-free resins, silicone rubbers, encapsulants, and more.
Reuters: Samsung Investing $4.3B for Environmentally Friendly Electronics
(July 20, 2009) SEOUL, South Korea Samsung Electronics will invest 5.4 trillion won ($4.3 billion) in green research and development and facilities to make it a leading eco-friendly company by 2013, report Cho Meeyoung and Rhee So-eui, Reuters.
IPC Executive Summit: Growth in the New Economy
(July 20, 2009) BANNOCKBURN, IL The IPC Electronics Industry Executive Summit was designed to equip executives with focused market information and opportunities to best capitalize on new growth areas. Titled "Survive and Thrive in the New Business Environment," the summit will be held October 2122, 2009, at the Wigwam Golf Resort and Spa in Litchfield, AZ.
Names in the News
(July 17, 2009) Following are the certification, new facilities, contract wins, and other announcements from global suppliers and electronics manufacturers from California to Bulgaria. BPM Microsystems, Isola, Victrex, High-Tech Conversions, Juki, ZESTRON, U.S. Circuit, Circuit Express, Molex, Newark, Vitronics Soltec, Horizon Die, Bliss Industries, Qualisystems, MIRTEC, Seratel, ACE Production Technologies, Kyzen, Cobar and DKL Metals, and Rogers Corporation share the news.
Microscan, Cogiscan Form Traceability Products Partnership
(July 14, 2009) RENTON, WA and BROMONT, Canada Data acquisition and control provider Microscan has partnered with Cogiscan Inc., a track, trace, and control solutions provider, for a long-term, high-level agreement including joint product development and cross-selling.
Charlie Barnhart EMS Forecast
(July 13, 2009) MAUI, HI Charlie Barnhart & Associates LLC released its projections for Q'03 CY2009 EMS industry. The analysts state that labor costs are expected to be generally flat, with marginal changes by region. Margins in all sectors (except automotive) are expected to remain relatively constant. Lead-times are expected to remain relatively flat to slightly down.
iSuppli Trims 2009 Chip, Electronics Forecasts
(July 10, 2009) EL SEGUNDO, CA Amid lingering economic woes and continuing poor visibility into future demand trends, iSuppli Corp. is reducing its forecasts for global semiconductor and electronic equipment revenue in 2009.
June ISM Manufacturing Report for Electronics
(July 2, 2009) The Institute of Supply Management (ISM) June Manufacturing Report On Business came out this week, surveying all kinds of manufacturing sectors to provide an overview of new orders, inventories, and the purchasing managers' index (PMI), among other economic indicators. Here are the key points in ISM's report for electronics manufacturing sectors.
Updated Report: EMS Industry Forecast
(July 2, 2009) MONTREAL, Canada Electronics.ca Publications released an update to its electronic manufacturing services (EMS) industry forecast from 2008 through 2013. It includes forecasts for the EMS and original design manufacturing (ODM) sectors, product segments, and regions. This update also reviews the state of the industry and Electronics.ca's core forecast.
Economy Affects Equipment Investments Globally: Henderson Ventures Report
(June 30, 2009) LOS ALTOS, CA Dismal Q'01 economic results are likely to mark the trough of the ongoing global recession. Rescue packages are starting to make a difference, and credit is becoming more available. Inventory divestures will start to slow. While all equipment-production regions will suffer in 2009, Japan will be heavily hit. Henderson Ventures published the following report.
May PCB Orders Outpace Shipments
(June 25, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries released the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program, showing the book-to-bill ratio above parity for the first time in 12 months. The rigid PCB book-to-bill reached 1.03 and the combined flex and rigid circuits book-to-bill hit 1.02.
Technology Forecasters Inc. Expands in Asia
(June 24, 2009) ALAMEDA, CA Technology Forecasters Inc. (TFI) announces its expansion into Asia and the successful completion of its first year in the Europe, Middle East, and Africa (EMEA) region. TFI provides strategic consulting services in the areas of electronics manufacturing, supply chain, and logistics; conducts corporate customer-satisfaction research; and helps companies design and implement profitable environmental strategies.
New Products: Solders and Soldering Systems
(June 23, 2009) These are the new hand soldering stations, solder pastes, wave solder pots and pumps, fluxes, and other products for the soldering process from companies such as Cooper Tools, Qualitek International, Henkel, ACE Production Technologies, FCT Assembly, Balver Zinn, and more.
IC Assembly Houses in Taiwan See Robust Business
(June 22, 2009) TAIPEI, Taiwan Taiwan's IC assembly firms are seeing revenues rise quarterly, with Advanced Semiconductor Engineering Inc. (ASE) and Siliconware Precision Industry Co. Ltd. expected to see respective revenues rise 50% this quarter and at least 20% next quarter, reports China Economic News Service (CENS) writer Ken Liu.
Revised Imm Ag Plating Standard Establishes Maximum Deposit Thickness
(June 16, 2009) BANNOCKBURN, IL IPC released IPC-4553A, "Specification for Immersion Silver Plating for Printed Boards." The revised specification sets requirements for use of immersion silver as a surface finish for PCBs, adding a maximum deposit thickness based on performance criteria; the minimum thickness requirement was provided in the original release. Revision A also establishes a single thickness range to avoid confusion between "thin" and "thick."
Teknek Issues Advisory on "Copycat" Parts
(June 16, 2009) RENFREW, U.K. Teknek, contact cleaning equipment maker, issued a global advisory regarding problems with contact cleaning machines. An increasing number of customer reports from U.S.-based users are showing problems with Teknek machines, originating in the use of nonstandard adhesives and other parts.
Nothing New? Not True with SMT
SMT, a leader in reflow technology, is moving into the North American market--assisting current customers with worldwide operations. President Manfred Maehl tells Steve Gold that the current economic climate is not an obstacle for his company, as technology is always attractive.
Munich Electronics Summit Program
(June 12, 2009) MUNICH, Germany The Munich Electronics Summit, debuting this year at productronica in November, consists of a private meeting for international corporate CEOs and a public forum with a keynote address and CEO Roundtable.
EI Institutes Quickturn Service for High-complexity PCBs
(June 9, 2009) ENDICOTT, NY Endicott Interconnect Technologies Inc. (EI) developed a dedicated Quick Turn Around (QTA) line, manufacturing various prototype/new product introduction (NPI) PCBs in the early design phase. EI cites increased demand from defense, medical, and other high-complexity/high-reliability electronics sectors.
Juki Intros Feeder Refurbishment Program
(June 8, 2009) MORRISVILLE, NC Juki Corporation started its Feeder Refurbishment Program to inspect, repair, and calibrate existing placement system feeders at minimal cost and turn-around time. As part of this program the company also will offer fully refurbished Juki feeders for purchase.
Supply Chain Tracker Notes Beginning of Recovery
(June 5, 2009) BANNOCKBURN, IL The spring 2009 edition of the quarterly business report, Supply Chain Tracker, from IPC Association Connecting Electronics Industries showed continuing economic contraction. However, it also indicated the first signs of recovery in the electronics industry.
EMS M&A Activity in North America
Jack Calderon, Managing Director at Lincoln International and IPC Board Member, discusses the conditions of the U.S. EMS industry, M&A activity and new markets, like solar. Many of the large, global players in the industry, according to Calderon, are eying the conversion of under-capacity plants to solar modular assembly plants to increase productivity.
Proposals Sought: Market and Technology Outlook for Military Electronics
(June 2, 2009) BANNOCKBURN, IL On behalf of its members, IPC Association Connecting Electronics Industries hopes to commission a study or parts of a study on the military electronics market and technology trends, and outlook for the future. The study would inform PCB fabs, EMS providers, and OEMs, as well as the supply chain supporting electronics assembly.
Professor Rao Tummala to Present Keynote at 2009 International Wafer-Level Packaging Conference (IWLPC)
(May 29, 2009) MINNEAPOLIS, MN Professor Rao Tummala, Advanced Packaging Editorial Advisory Board Member, will keynote the 6th Annual International Wafer-Level Packaging Conference (IWLPC), October 2730, 2009 at the Santa Clara Marriott Hotel in Santa Clara, CA.
April PCB Book-to-Bill Shows Glimpse of Recovery
(May 27, 2009) BANNOCKBURN, IL IPC announced the April findings from its monthly North American PCB Statistical Program. While sales and orders continued to decline, there was a marked improvement in the book-to-bill ratio. It is still slightly below parity, but increased for the third straight month. Rigid PCB orders have exceeded sales for the first time in over a year. The industry is seeing signs of recovery.
Assessing Harsh Environments: SMTAI Keynote from JPL
(May 26, 2009) MINNEAPOLIS, MN The SMTA annual meeting and awards ceremony at SMTA International, October 7, 2009, will feature Peter Barry, mission assurance manager at Jet Propulsion Laboratory (JPL), as the keynote speaker. He will present an overview of the role that mission assurance management plays in JPL projects.
New Products for Reflow Profile Verification
(May 26, 2009) MILWAUKIE, OR Participants in an ECD survey begun at APEX and continued through April were asked to answer specific questions about their practices regarding thermal processing. While over 90% of respondents were diligent in creating a correct reflow profile, nearly 60% did not display that same diligence when it came to verifying that profile on a regular basis. ECD conducted the study and shares the results.
Participate in the 2010 IPC APEX EXPO
(May 19, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries invites researchers, academics, technical experts, and industry leaders to submit abstracts for the 2010 IPC APEX EXPO at Mandalay Bay Resort and Convention Center, Las Vegas, April 69, 2010.
Digi-Key Adds Open Source BeagleBoard PCB
(May 18, 2009) THIEF RIVER FALLS, MN Digi-Key Corporation now stocks Revision C of the BeagleBoard from BeagleBoard.org. The product is said to fuel an active open source community with a flexible, fan-less and low-cost embedded development board. Revision C reportedly offers increased design flexibility with twice the memory (256 MB RAM), additional high-speed USB port, and an LCD expansion connector.
IEEE and NATO Standardization Agency Sign Technical Co-operation Agreement
(May 18, 2009) PISCATAWAY, NJ and BRUSSELS, Belgium IEEE-SA and the NATO Standardization Agency have signed a technical co-operation agreement to share knowledge of each organization's standards development activities and avoid duplication of technical standards. IEEE-SA and NSA will exchange information in the electrical, electronics, computer, and related fields and determine common-interest working projects.
productronica 2009 Debuts Munich Electronics Summit
(May 11, 2009) MUNICH, Germany Despite a difficult worldwide economic climate, productronica 2009 will host most of the world's leading electronics production manufacturers at its biennial productronica trade fair November 10 to 13 in Munich. The Munich Electronics Summit, held on the first day of the trade fair, will become an annual event linking productronica with electronica. The trade fair also has a new slogan, "Innovation all along the line."
World Electronic Industries 20082013 Report
(May 11, 2009) LYON, France Yole Développement is distributing "World Electronic Industries 2008 2013," from DECISION. This latest edition includes new markets like solid-state lighting and energy with photovoltaic panels. Additional updates were made to telecom and medical sections. The current economic crisis has reversed the electronics industry outlook: average annual growth between 2008 and 2013 should not exceed 3% per year.
40-100Gbps Transmission Over Copper
This paper, presented at DesignCon 2009, focuses on assessment and design of transmission systems for distribution of digital signals over standard Category-7A copper cables at speeds beyond 10Gbps. Results confirmed that with the aid of a decision-feedback equalizer and powerful coding techniques, 40Gbps transmission is feasible over 50m of CAT-7A copper cable and 100Gbps transmission can be achieved over 15m cables. Authors are Ali Enteshari and Mohsen Kavehrad of Penn State.
Auto Electronics Market: Recovery in 2011
(May 6, 2009) BOSTON The Strategy Analytics Automotive Electronics service report, "Automotive Electronics System Demand Forecast 2007 to 2016: Tough Times, But Future Gains," predicts that the market for automotive electronics will take until 2011 to exceed the peak hit in 2007.
Aravo Risk Debuts: Software to Control Supply Chain Risk
(May 6, 2009) SAN FRANCISCO, CA Aravo Solutions introduced a software-as-a-service (SaaS) product, Aravo Risk, for comprehensive supplier risk management. It is designed to prevent catastrophic supplier failures and supply disruptions, improve supplier performance management, and enhance supplier compliance initiatives.
SMT China Magazine Announces VISION Awards Winners
(May 5, 2009) SHANGHAI, China SMT China Magazine hosted the 3nd annual SMT China VISION Awards Presentation Ceremony on April 21, 2009 in Shanghai. More than 100 guests from participating companies and professionals from the industry attended the ceremony. Fifteen products won top honors and one local company received the Chinese Achievement Award.
Q'02 Facing Soft Market; March PCB Book-to-Bill Released
(April 27, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries released the March PCB industry book-to-bill ratios from its monthly North American Printed Circuit Board (PCB) Statistical Program. Rigid PCB orders saw slight improvement, but IPC president Denny McGuirk warned that the next quarter will see continued weakness in the PCB market.
On the Show Floor at Nepcon Shanghai
(April 21, 2009) SHANGHAI, China Following are the new and flagship products being promoted at this week's Nepcon China, April 21 to 24 at the Shanghai Everbright Center. International companies will exhibit advanced products for the Chinese assembly market, including inspection systems, halogen-free solder materials, rework systems, digital dispensers, XRF solder analyzers, and more.
Micronic Laser Systems Moves to Acquire MYDATA
(April 21, 2009) TÄBY, Sweden Micronic Laser Systems AB intends to acquire MYDATA automation AB. In the proposed transaction, Micronic would acquire MYDATA from Skanditek Industriförvaltning and the minority shareholders against payment in the form of newly issued shares in Micronic. Combining Micronic and MYDATA will create large potential within the market for electronic packaging using Micronic's and MYDATA's complementary imaging and deposition technologies.
World Printed Circuit Boards Report: 2007 to 2013
(April 20, 2009) DUBLIN Research and Markets released its latest market database with forecast, given for each component type by application end-user markets. PCB types covered in the forecast include single-sided, double-sided, multi-layer from 4 to 6 layers, multi-layer over 6 layers, and flexible/flex-rigid PCBs.
Present at the Medical Electronics Symposium
(April 17, 2009) PHOENIX, AZ The SMTA and MEPTEC will cohost the 2009 Medical Electronics Symposia, September 1617, at Arizona State University in Phoenix, cosponsored by the ASU College of Nursing and Healthcare Innovation. Presenters can submit abstracts through May 29.
Imbera Raises $15M to Ramp Embedded Packaging in PCBs
(April 14, 2009) MELBOURNE, FL Imbera Electronics secured $15 million in series B funding from NorthZone Ventures, Index Ventures, and Conor Venture Partners. The company, which developed Integrated Module Board (IMB) technology for 3D packaging, will bring on-line a new high-volume manufacturing operation in Sangsong-ri, South Korea, and continue R&D for embedded technologies in Espoo, Finland.
ECD Debuts Thermal Quality Management Program: ThQM
(April 13, 2009) MILWAUKIE, OR ECD introduced its thermal quality management program, called ThQM, for OEMs and volume manufacturers. It is designed to directly address the dialog required between OEMs and contract assemblers, including OEM requirements, machine recipe development, and thermal profile verification. The program targets efficient and accurate communication about issues that must be communicated to both characterize and verify the reflow or wave soldering process.
MMI: Top 50 EMS Providers See 2008 Single-digit Growth
(April 9, 2009) BURLINGTON, VT Manufacturing Market Insider released its annual MMI Top 50, a list of the world's largest EMS providers. Sales of the Top 50 EMS providers for 2008 totaled $158.5 billion, a new high. Despite last year's bad economic news, Top 50 revenue grew collectively by 7.7% in 2008.
Present at SMTA International (SMTAI)
(April 8, 2009) MINNEAPOLIS The SMTA's 2009 Call for Papers for SMTAI, October 48, 2009 in San Diego, CA, has been extended, giving paper presenters and tutorial teachers until April 24 to submit abstracts.
Partnership Targets ESD Management
(April 8, 2009) GLOUCESTER, MA and SUNNYVALE, CA Dangelmayer Associates and SIMCO Electronics formed a collaborative alliance to better address the issues of electrostatic discharge (ESD) management throughout the product lifecycle from design to customer acceptance.
Consona Releases Cimnet Systems Paradigm 3.6 and Engenix 3.2.0 ERP
(April 7, 2009) INDIANAPOLIS Cimnet Systems, a Consona Corporation product line introduced Paradigm Version 3.6 (v3.6), Cimnet Systems' enterprise resource planning (ERP) software for the printed circuit board (PCB) industry and Engenix Version 3.2.0 (v3.2.0), a pre-production engineering application.
Reports: Military Electronics, Capital Equipment Investment, Flex PCB Forecasts
(April 7, 2009) Reports from Henderson Ventures reveal that equipment expenditures are on hold for many electronics assemblers, and the military electronics sector is growing. Overall, global electronic equipment production is predicted to fall by a massive 11.9% this year versus a 0.2% gain in 2008. Research and Markets updates their forecasts for flex and flex-rigid PCBs by region, product, and end-use sector through 2013.
Advisory Board Update: Dr. Hwang Chairs Board on NIST
(April 7, 2009) WASHINGTON D.C. Jennie S. Hwang, Ph.D., was appointed to the Chair for the Board on Assessment of NIST (National Institute of Standards and Technology) Electronics and Electrical Engineering Laboratory, U.S. Department of Commerce.
IPC Tracks Global EMS Financial Metrics
(April 7, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries launched its Global EMS Statistical Program to measure and track financial metrics quarterly for the worldwide electronics manufacturing services (EMS) industry. The first survey, for Q'01 2009 data, will be online this week.
Quality Sells at APEX: Test and Inspection ROI
(April 7, 2009) LAS VEGAS Smaller components on denser assemblies, leadless or no-lead packages, the threat of counterfeits, increased test coverage, and the cost of rework and warranties are some of the reasons inspection solder paste inspection (SPI), automatic optical inspection (AOI), and automatic X-ray inspection (AXI) companies and test providers were confident at APEX 2009. Here are some highlights from the show.
Combating Counterfeits: APEX Hosts Counterfeit Detection Ideas
(April 6, 2009) LAS VEGAS APEX typically showcases new products or applications that focus on a common challenge. This year, counterattacks against the increasing influx of counterfeit components, PCBs, and subassemblies were center stage. Inspection systems have evolved into counterfeit detectors; labeling systems have taken on new importance to identify proper parts; and supply chain management has emerged to prevent counterfeits from entering the finished PCB assembly.
APEX 2009: Technical Conference Closes Strong
(April 6, 2009) LAS VEGAS The 2009 IPC APEX Technical Conference and Expo, March 31 to April 2, 2009, drew many attendees to the educational and collaborative sessions focusing on electronics industry challenges and advances, like high-reliability lead-free, modern PCB cleaning, and counterfeit components.
From the Show: APEX Best Papers
(April 3, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
From the Show: SMT, PCMI Host Free Panel Today
(April 2, 2009) LAS VEGAS — Gail Flower, editor-at-large of SMT, hosted "Industry Cost Challenges: EMS Solutions," April 2 at APEX. The panel, co-produced with Susan Mucha of Powell-Mucha Consulting Inc., comprised EMS company representatives and a bill of materials (BOM) expert presenting case histories and lessons learned to attack problems in production, supply chain management, board failure, and time to market.
From the Show: Lead-free Soldering Presentation
(April 2, 2009) LAS VEGAS Keith Sweatman, Nihon Superior Co. Ltd.'s senior technical advisor, will present a paper titled "Hot Air Solder Levelling in the Lead-free Era," during Session 28, Surface Finishes, today at the IPC APEX technical conference, from 9 to 10 am.
From the Show: New Substrate Challenges FR-4
(April 1, 2009) LAS VEGAS Hollingsworth & Vose, a long-time player in the paper market, is debuting their ViaMat nonwoven aramid organic reinforcement material to the PCB fabrication sector, noting better coefficient of thermal expansion (CTE) than glass, less warpage, and tolerance of high heat applications.
From the Show: Counterfeiting Panel
(April 1, 2009) LAS VEGAS Jim Williams, Ph.D., chairman and founder of Polyonics, will hold a forum titled "Counterfeit Electronics" today, April 1, from 10:15-11:45 am. The forum will discuss action-oriented supply chain protection in a comprehensive strategy.
From the Show: Head-in-pillow Defects Presentation
(March 31, 2009) LAS VEGAS Soldering defects are immensely important to electronics assemblers, particularly those in high-reliability industries. Today at the APEX technical conference, Indium's Mario Scalzo will present on head-in-pillow defects.
SMT Celebrates Products and Services to the Electronics Assembly Industry With SMT VISION Awards
(March 30, 2009) LAS VEGAS SMT announced the winners of its 17th Annual SMT VISION Awards on Monday, March 30, 2009 during the IPC APEX Expo at the Mandalay Bay, Las Vegas. SMT hailed achievement in 18 categories, recognizing industry leaders in technology, efficiency, and environmental benefits, and quality. Award winning products represent the most innovative and useful tools for the surface mount electronics assembly sector.
Rigid PCB Book-to-Bill Remains Low in February, Flex Moves Up
(March 27, 2009) BANNOCKBURN, IL IPC released the February findings from its monthly North American PCB Statistical Program, offering a 0.90 book-to-bill ratio. Rigid PCB sales remain well below 2008 levels, but the more volatile flex circuit sales were down only 4.2% year-to-date. "The book-to-bill ratio for PCBs overall has stayed in negative territory for 10 months, and orders are still declining compared to last year," said IPC president Denny McGuirk.
Technology Supply Chain Business Outlook Survey
(March 23, 2009) SAN JOSE, CA Venture Outsource is conducting a reader survey to better understand the prevailing confidence in our business environment, expectations of business levels, and pricing trends. The "Technology Supply Chain Business Outlook Survey" findings will be published on Venture Outsource's Website.