IPC's July Book-to-bill Stays Just Above Parity
(August 26, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries announced today the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The combined (rigid and flex) industry book-to-bill ratio in July 2009 retreated to 1.07. Booking to billing ratios for rigid PCBs stayed above parity, though the ratio for flexible circuits dropped below 1.00
Siemens SIPLACE Tour Brings Component Placement Demos across North America
(August 26, 2009) SUWANEE, GA Siemens Electronics Assembly Systems (SEAS) is taking its new-generation SIPLACE SX placement machine on the road to numerous cities throughout the Americas region beginning in September. The SIPLACE Road Show will include "Real Capacity on Demand" demonstrations, with modular placement and feeder changes shown. The SIPLACE SX pick-and-place system uses a SIPLACE MultiStar (Collect & Pick & Place) head.
Experts Hold Free Forums on Field Failures at IPC Midwest
On Thursday, September 24, 2009, industry experts will provide unique insight into the world of failure analysis in a series of Free Forums on acceptability, reliability and failure analysis held in conjunction with IPC Midwest 2009.
CENS: Taiwan Export Orders Indicate Upturn
(August 25, 2009) TAIPEI, Taiwan Taiwan's export, the growth engine of its economy, has shown clear sign of upturn, as orders received by the nation's exporters in July reached US$28.61 billion, down 8.77% year-on-year, the lowest decline in nine months, according to the Ministry of Economic Affairs (MOEA). China Economic News Service (CENS) reporter Philip Liu states that orders from China are up, while exports to the U.S. and Japan continue to be shaky.
Teknek Plans US Expansion
(August 24, 2009) GLASGOW, Scotland Contamination cleaning company Teknek plans to open a new U.S. facility in Charlotte, NC, in September. The facility will house sales and service, along with a North American fulfillment center and consumable production capacity for Teknek's contamination removal contact cleaning products.
Seika Introduces Spanish-language Line Card
(August 24, 2009) TORRANCE, CA Seika Machinery Inc. (SMI), a machinery, materials and engineering services provider, now offers its line card in Spanish. Offerings include board assembly, inspection and automated test equipment (ATE), and quality assurance (QA) products from Japanese brands.
1-Source Hiring to Combat Counterfeit and Defective Electronic Components
(August 18, 2009) PORT JEFFERSON STATION, NY As widespread counterfeiting of electronic components continues to be a major problem, 1-Source Electronic Components, electronic component distributor and supplier, released information on its efforts against counterfeit and defective electronic components, taking place through subsidiary ChipChecker Ltd.
ISO, MIL, CID, AS Certifications
Companies in the electronics assembly business and related supply chains received design, quality, and other certifications recently, covering design, process control, environmental requirements, traceability, record retention, continuous improvement, management practices, goods control, and other factors. These companies can provide certified products to medical, aerospace, space, and military customers.
SMART Group Lines Up Speakers for 25th Anniversary Seminar
(August 12, 2009) OXFORD, U.K. The line-up of speakers for the SMART Group 25th Anniversary Seminar has been announced, with keynotes in the morning and a choice of three sessions in the afternoon. The event will take place at the Oxfordshire Golf Club, October 22.
New JTAG, ICT, Cleanliness, and Other Test Products
(August 11, 2009) Following are the new products in boundary scan, functional test, ionic contamination, flying probe, combination systems, and other diagnostics and test equipment for the electronics industry.
productronica 2009 Columns: Photovoltaics, Green Electronics, Nanotech and More
(August 11, 2009) MUNICH, Germany Messe München's online forum hosts productronica 2009 exhibitors, experts in their field, voicing opinions about current electronic manufacturing industry trends. Potential topics include solar, eco-friendly electronics, micro and nanotechnologies, organic electronics, EMS trends, and advanced packaging.
ZESTRON Chooses Southeast Asia Technical Center
(August 10, 2009) MANASSAS, VA ZESTRON selected its latest Technical Center, located in Kulim High Tech Park, Malaysia. It features over 5,000 sq.ft. of floor space and will be equipped with the latest European, American, and Southeast Asian cleaning equipments such as spray-in-air, ultrasonic etc. for defluxing, misprint, and stencil cleaning applications. ZESTRON will officially open the Malaysian Technical Center by the end of August 2009.
Adrian L. Melnyk Appointed Autosplice President
(August 10, 2009) SAN DIEGO, CA Autosplice named Adrian L. Melnyk as president of the company's worldwide operations. Autosplice had grown in the past by providing custom solutions for pins and terminals, insertion equipment and printed circuit board (PCB) assemblies. Its future growth is more dependent on the ability to provide engineered solutions to total customer needs where it can be a turnkey supplier.
3M Names Exec VP for Electro and Communications Business
(August 10, 2009) ST. PAUL, MN 3M named Joaquin Delgado, Ph.D., to the position of executive vice president in charge of its Electro and Communications Business. Delgado also becomes a member of 3M's Operations Committee.
Robert Boguski Becomes Owner, President of Datest Corp.
(August 7, 2009) FREMONT, CA Robert Boguski is the new owner and president of in-circuit test (ICT) system manufacturer Datest Corp. Boguski brings 34 years of experience in the manufacture, design, assembly, and test of printed circuit boards (PCBs) and PCB assemblies, as well as 29 years' experience in management.
Molex Closes French Plant, Citing Violence
(August 7, 2009) LISLE, IL Molex Incorporated (NASDAQ: MOLX and MOLXA) is closing its plant in Villemur-sur-Tarn, France to evaluate its security. Molex asserts that this step was taken to help ensure the safety of employees and security of the facility after an employee and two security guards were injured in a violent incident at the site.
Inovaxe Names Ken Myers VP and GM
(August 7, 2009) SARASOTA, FL Component storage and MRP software solutions company Inovaxe Corp. appointed Ken Myers as vice president and general manager responsible for all operations. Myers has 20 years of experience in the electronics industry, and received his BSBA from the University of Missouri.
Murata Buys Panasonic Electronic Devices' MLCC Unit
(August 6, 2009) SMYRNA, GA Murata Manufacturing Company Ltd., supplier of ceramic passive components, purchased the multilayer ceramic capacitor (MLCC) business from Panasonic Electronic Devices (PED). Murata will acquire PEDs' technology, distributors and customers, aiming to increase its international competitiveness.
Cookson Reports 1H09 Revenue Drop
Commenting on the Group's results and outlook, Nick Salmon, Chief Executive, said, "We have faced very tough trading conditions throughout the first half of 2009. However, through the rapid implementation of our cost-reduction programs, all divisions have remained profitable.
Maxwell Technologies, ANSYS Release Ultracapacitor Library in Simplorer
(August 4, 2009) SOUTHPOINTE, PA ANSYS Inc. (NASDAQ: ANSS) released an ultracapacitor components library from Maxwell Technologies Inc. (NASDAQ: MXWL), an ANSYS customer, for use in Simplorer technology. Automotive, aerospace, and industrial power engineers developing hybrid vehicles and other electric-powered products and systems can easily use the energy-storage device models in their simulations.
iNEMI HFR-Free Leadership Program Launches
(August 3, 2009) HERNDON, VA iNEMI officially launched its HFR-Free Leadership Program with 22 companies participating. As an umbrella for several projects, program activities will provide a technical evaluation of key electrical and mechanical properties of HFR-free (low halogen) materials to ensure reliability and performance of replacement materials. Projects will also assess technology readiness and supply chain capabilities.
New Products for PCB Design and Device Programming
(August 3, 2009) These new PCB design and device programming products are focused on design for manufacturing (DfM), collaboration with MCAD mechanical design elements, fast in-system programming, and cost/performance analysis on circuit designs. Products featured come from PCB Matrix, Numerical Innovations, Vishay, Corelis, BPM, Zuken, and Screaming Circuits.
Aqueous Opens Online Cleaning University
(August 3, 2009) RANCHO CUCAMONGA, CA Aqueous Technologies opened its Aqueous University Online, aggregating information on products as well as links to published defluxing-related technical articles, video presentations, articles, and multiple technical webinars. Aqueous Technologies is a manufacturer of defluxing, cleanliness testing, and stencil cleaning equipment.
2009 PCB Orders Down 30% Year-to-Date, June Book-to-Bill Positive
(July 29, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries announced the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Rigid and flex PCBs saw positive book-to-bill ratios, at 1.12 and 1.02 respectively.
Lockheed Martin Selects Cuming Lehman Chambers for GPS Testing
(July 28, 2009) CHAMBERSBURG, PA Cuming-Lehman Chambers (CLCI) was awarded a contract to construct an advanced PIM Test Facility for Lockheed Martin Space Systems at their Newtown, PA facility. The Passive Intermodulation (PIM) shielded test chamber will support development and testing for several of Lockheed Martin's next-generation technologies including GPS III and MUOS.
Huawei Opens LTE Laboratory in North America
(July 28, 2009) PLANO, TX Telecommunications network solutions manufacturer Huawei opened a long term evolution (LTE) laboratory in Richardson, TX. Operators and Huawei's industry partners in North America are able to further explore the potential of LTE technology and experience Huawei's latest LTE products at the facility.
TFI's Gordon Chairs Green Manufacturing Conference
(July 27, 2009) ALAMEDA, CA Technology Forecasters Inc. (TFI) president Pamela J. Gordon will chair the Green Manufacturing Conference in Rosemont, IL, September 22-23. The conference covers sustainable manufacturing practices and their impact on revenue, competitiveness, and expenses.
EMS Market at $294B in 2008
(July 21, 2009) SAN JOSE, CA Revenue for the worldwide electronics manufacturing services (EMS) market was $294 billion in 2008, a 12% increase over 2007, reports Electronic Trend Publications (ETP). The EMS market will decline in 2009, but growth should return in 2010 and continue for many years. Electronics manufacturing industry revenue will reach $435 billion in 2013.
New Materials: Thermal Interfaces, Encapsulants, Adhesives, and More
(July 21, 2009) — Victrex, Huntsman, Wacker Chemie, Dymax, and other companies introduced new materials for electronics assembly, from underfills to thermal greases, glass-filled polymers, halogen-free resins, silicone rubbers, encapsulants, and more.
Reuters: Samsung Investing $4.3B for Environmentally Friendly Electronics
(July 20, 2009) SEOUL, South Korea Samsung Electronics will invest 5.4 trillion won ($4.3 billion) in green research and development and facilities to make it a leading eco-friendly company by 2013, report Cho Meeyoung and Rhee So-eui, Reuters.
IPC Executive Summit: Growth in the New Economy
(July 20, 2009) BANNOCKBURN, IL The IPC Electronics Industry Executive Summit was designed to equip executives with focused market information and opportunities to best capitalize on new growth areas. Titled "Survive and Thrive in the New Business Environment," the summit will be held October 2122, 2009, at the Wigwam Golf Resort and Spa in Litchfield, AZ.
Names in the News
(July 17, 2009) Following are the certification, new facilities, contract wins, and other announcements from global suppliers and electronics manufacturers from California to Bulgaria. BPM Microsystems, Isola, Victrex, High-Tech Conversions, Juki, ZESTRON, U.S. Circuit, Circuit Express, Molex, Newark, Vitronics Soltec, Horizon Die, Bliss Industries, Qualisystems, MIRTEC, Seratel, ACE Production Technologies, Kyzen, Cobar and DKL Metals, and Rogers Corporation share the news.
Microscan, Cogiscan Form Traceability Products Partnership
(July 14, 2009) RENTON, WA and BROMONT, Canada Data acquisition and control provider Microscan has partnered with Cogiscan Inc., a track, trace, and control solutions provider, for a long-term, high-level agreement including joint product development and cross-selling.
Charlie Barnhart EMS Forecast
(July 13, 2009) MAUI, HI Charlie Barnhart & Associates LLC released its projections for Q'03 CY2009 EMS industry. The analysts state that labor costs are expected to be generally flat, with marginal changes by region. Margins in all sectors (except automotive) are expected to remain relatively constant. Lead-times are expected to remain relatively flat to slightly down.
iSuppli Trims 2009 Chip, Electronics Forecasts
(July 10, 2009) EL SEGUNDO, CA Amid lingering economic woes and continuing poor visibility into future demand trends, iSuppli Corp. is reducing its forecasts for global semiconductor and electronic equipment revenue in 2009.
June ISM Manufacturing Report for Electronics
(July 2, 2009) The Institute of Supply Management (ISM) June Manufacturing Report On Business came out this week, surveying all kinds of manufacturing sectors to provide an overview of new orders, inventories, and the purchasing managers' index (PMI), among other economic indicators. Here are the key points in ISM's report for electronics manufacturing sectors.
Updated Report: EMS Industry Forecast
(July 2, 2009) MONTREAL, Canada Electronics.ca Publications released an update to its electronic manufacturing services (EMS) industry forecast from 2008 through 2013. It includes forecasts for the EMS and original design manufacturing (ODM) sectors, product segments, and regions. This update also reviews the state of the industry and Electronics.ca's core forecast.
Economy Affects Equipment Investments Globally: Henderson Ventures Report
(June 30, 2009) LOS ALTOS, CA Dismal Q'01 economic results are likely to mark the trough of the ongoing global recession. Rescue packages are starting to make a difference, and credit is becoming more available. Inventory divestures will start to slow. While all equipment-production regions will suffer in 2009, Japan will be heavily hit. Henderson Ventures published the following report.
May PCB Orders Outpace Shipments
(June 25, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries released the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program, showing the book-to-bill ratio above parity for the first time in 12 months. The rigid PCB book-to-bill reached 1.03 and the combined flex and rigid circuits book-to-bill hit 1.02.
Technology Forecasters Inc. Expands in Asia
(June 24, 2009) ALAMEDA, CA Technology Forecasters Inc. (TFI) announces its expansion into Asia and the successful completion of its first year in the Europe, Middle East, and Africa (EMEA) region. TFI provides strategic consulting services in the areas of electronics manufacturing, supply chain, and logistics; conducts corporate customer-satisfaction research; and helps companies design and implement profitable environmental strategies.
New Products: Solders and Soldering Systems
(June 23, 2009) These are the new hand soldering stations, solder pastes, wave solder pots and pumps, fluxes, and other products for the soldering process from companies such as Cooper Tools, Qualitek International, Henkel, ACE Production Technologies, FCT Assembly, Balver Zinn, and more.
IC Assembly Houses in Taiwan See Robust Business
(June 22, 2009) TAIPEI, Taiwan Taiwan's IC assembly firms are seeing revenues rise quarterly, with Advanced Semiconductor Engineering Inc. (ASE) and Siliconware Precision Industry Co. Ltd. expected to see respective revenues rise 50% this quarter and at least 20% next quarter, reports China Economic News Service (CENS) writer Ken Liu.
Revised Imm Ag Plating Standard Establishes Maximum Deposit Thickness
(June 16, 2009) BANNOCKBURN, IL IPC released IPC-4553A, "Specification for Immersion Silver Plating for Printed Boards." The revised specification sets requirements for use of immersion silver as a surface finish for PCBs, adding a maximum deposit thickness based on performance criteria; the minimum thickness requirement was provided in the original release. Revision A also establishes a single thickness range to avoid confusion between "thin" and "thick."
Teknek Issues Advisory on "Copycat" Parts
(June 16, 2009) RENFREW, U.K. Teknek, contact cleaning equipment maker, issued a global advisory regarding problems with contact cleaning machines. An increasing number of customer reports from U.S.-based users are showing problems with Teknek machines, originating in the use of nonstandard adhesives and other parts.
Nothing New? Not True with SMT
SMT, a leader in reflow technology, is moving into the North American market--assisting current customers with worldwide operations. President Manfred Maehl tells Steve Gold that the current economic climate is not an obstacle for his company, as technology is always attractive.
Munich Electronics Summit Program
(June 12, 2009) MUNICH, Germany The Munich Electronics Summit, debuting this year at productronica in November, consists of a private meeting for international corporate CEOs and a public forum with a keynote address and CEO Roundtable.
EI Institutes Quickturn Service for High-complexity PCBs
(June 9, 2009) ENDICOTT, NY Endicott Interconnect Technologies Inc. (EI) developed a dedicated Quick Turn Around (QTA) line, manufacturing various prototype/new product introduction (NPI) PCBs in the early design phase. EI cites increased demand from defense, medical, and other high-complexity/high-reliability electronics sectors.
Juki Intros Feeder Refurbishment Program
(June 8, 2009) MORRISVILLE, NC Juki Corporation started its Feeder Refurbishment Program to inspect, repair, and calibrate existing placement system feeders at minimal cost and turn-around time. As part of this program the company also will offer fully refurbished Juki feeders for purchase.
Supply Chain Tracker Notes Beginning of Recovery
(June 5, 2009) BANNOCKBURN, IL The spring 2009 edition of the quarterly business report, Supply Chain Tracker, from IPC Association Connecting Electronics Industries showed continuing economic contraction. However, it also indicated the first signs of recovery in the electronics industry.
EMS M&A Activity in North America
Jack Calderon, Managing Director at Lincoln International and IPC Board Member, discusses the conditions of the U.S. EMS industry, M&A activity and new markets, like solar. Many of the large, global players in the industry, according to Calderon, are eying the conversion of under-capacity plants to solar modular assembly plants to increase productivity.
Proposals Sought: Market and Technology Outlook for Military Electronics
(June 2, 2009) BANNOCKBURN, IL On behalf of its members, IPC Association Connecting Electronics Industries hopes to commission a study or parts of a study on the military electronics market and technology trends, and outlook for the future. The study would inform PCB fabs, EMS providers, and OEMs, as well as the supply chain supporting electronics assembly.
Professor Rao Tummala to Present Keynote at 2009 International Wafer-Level Packaging Conference (IWLPC)
(May 29, 2009) MINNEAPOLIS, MN Professor Rao Tummala, Advanced Packaging Editorial Advisory Board Member, will keynote the 6th Annual International Wafer-Level Packaging Conference (IWLPC), October 2730, 2009 at the Santa Clara Marriott Hotel in Santa Clara, CA.
April PCB Book-to-Bill Shows Glimpse of Recovery
(May 27, 2009) BANNOCKBURN, IL IPC announced the April findings from its monthly North American PCB Statistical Program. While sales and orders continued to decline, there was a marked improvement in the book-to-bill ratio. It is still slightly below parity, but increased for the third straight month. Rigid PCB orders have exceeded sales for the first time in over a year. The industry is seeing signs of recovery.
Assessing Harsh Environments: SMTAI Keynote from JPL
(May 26, 2009) MINNEAPOLIS, MN The SMTA annual meeting and awards ceremony at SMTA International, October 7, 2009, will feature Peter Barry, mission assurance manager at Jet Propulsion Laboratory (JPL), as the keynote speaker. He will present an overview of the role that mission assurance management plays in JPL projects.
New Products for Reflow Profile Verification
(May 26, 2009) MILWAUKIE, OR Participants in an ECD survey begun at APEX and continued through April were asked to answer specific questions about their practices regarding thermal processing. While over 90% of respondents were diligent in creating a correct reflow profile, nearly 60% did not display that same diligence when it came to verifying that profile on a regular basis. ECD conducted the study and shares the results.
Participate in the 2010 IPC APEX EXPO
(May 19, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries invites researchers, academics, technical experts, and industry leaders to submit abstracts for the 2010 IPC APEX EXPO at Mandalay Bay Resort and Convention Center, Las Vegas, April 69, 2010.
Digi-Key Adds Open Source BeagleBoard PCB
(May 18, 2009) THIEF RIVER FALLS, MN Digi-Key Corporation now stocks Revision C of the BeagleBoard from BeagleBoard.org. The product is said to fuel an active open source community with a flexible, fan-less and low-cost embedded development board. Revision C reportedly offers increased design flexibility with twice the memory (256 MB RAM), additional high-speed USB port, and an LCD expansion connector.
IEEE and NATO Standardization Agency Sign Technical Co-operation Agreement
(May 18, 2009) PISCATAWAY, NJ and BRUSSELS, Belgium IEEE-SA and the NATO Standardization Agency have signed a technical co-operation agreement to share knowledge of each organization's standards development activities and avoid duplication of technical standards. IEEE-SA and NSA will exchange information in the electrical, electronics, computer, and related fields and determine common-interest working projects.
productronica 2009 Debuts Munich Electronics Summit
(May 11, 2009) MUNICH, Germany Despite a difficult worldwide economic climate, productronica 2009 will host most of the world's leading electronics production manufacturers at its biennial productronica trade fair November 10 to 13 in Munich. The Munich Electronics Summit, held on the first day of the trade fair, will become an annual event linking productronica with electronica. The trade fair also has a new slogan, "Innovation all along the line."
World Electronic Industries 20082013 Report
(May 11, 2009) LYON, France Yole Développement is distributing "World Electronic Industries 2008 2013," from DECISION. This latest edition includes new markets like solid-state lighting and energy with photovoltaic panels. Additional updates were made to telecom and medical sections. The current economic crisis has reversed the electronics industry outlook: average annual growth between 2008 and 2013 should not exceed 3% per year.
40-100Gbps Transmission Over Copper
This paper, presented at DesignCon 2009, focuses on assessment and design of transmission systems for distribution of digital signals over standard Category-7A copper cables at speeds beyond 10Gbps. Results confirmed that with the aid of a decision-feedback equalizer and powerful coding techniques, 40Gbps transmission is feasible over 50m of CAT-7A copper cable and 100Gbps transmission can be achieved over 15m cables. Authors are Ali Enteshari and Mohsen Kavehrad of Penn State.
Auto Electronics Market: Recovery in 2011
(May 6, 2009) BOSTON The Strategy Analytics Automotive Electronics service report, "Automotive Electronics System Demand Forecast 2007 to 2016: Tough Times, But Future Gains," predicts that the market for automotive electronics will take until 2011 to exceed the peak hit in 2007.
Aravo Risk Debuts: Software to Control Supply Chain Risk
(May 6, 2009) SAN FRANCISCO, CA Aravo Solutions introduced a software-as-a-service (SaaS) product, Aravo Risk, for comprehensive supplier risk management. It is designed to prevent catastrophic supplier failures and supply disruptions, improve supplier performance management, and enhance supplier compliance initiatives.
SMT China Magazine Announces VISION Awards Winners
(May 5, 2009) SHANGHAI, China SMT China Magazine hosted the 3nd annual SMT China VISION Awards Presentation Ceremony on April 21, 2009 in Shanghai. More than 100 guests from participating companies and professionals from the industry attended the ceremony. Fifteen products won top honors and one local company received the Chinese Achievement Award.
Q'02 Facing Soft Market; March PCB Book-to-Bill Released
(April 27, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries released the March PCB industry book-to-bill ratios from its monthly North American Printed Circuit Board (PCB) Statistical Program. Rigid PCB orders saw slight improvement, but IPC president Denny McGuirk warned that the next quarter will see continued weakness in the PCB market.
On the Show Floor at Nepcon Shanghai
(April 21, 2009) SHANGHAI, China Following are the new and flagship products being promoted at this week's Nepcon China, April 21 to 24 at the Shanghai Everbright Center. International companies will exhibit advanced products for the Chinese assembly market, including inspection systems, halogen-free solder materials, rework systems, digital dispensers, XRF solder analyzers, and more.
Micronic Laser Systems Moves to Acquire MYDATA
(April 21, 2009) TÄBY, Sweden Micronic Laser Systems AB intends to acquire MYDATA automation AB. In the proposed transaction, Micronic would acquire MYDATA from Skanditek Industriförvaltning and the minority shareholders against payment in the form of newly issued shares in Micronic. Combining Micronic and MYDATA will create large potential within the market for electronic packaging using Micronic's and MYDATA's complementary imaging and deposition technologies.
World Printed Circuit Boards Report: 2007 to 2013
(April 20, 2009) DUBLIN Research and Markets released its latest market database with forecast, given for each component type by application end-user markets. PCB types covered in the forecast include single-sided, double-sided, multi-layer from 4 to 6 layers, multi-layer over 6 layers, and flexible/flex-rigid PCBs.
Present at the Medical Electronics Symposium
(April 17, 2009) PHOENIX, AZ The SMTA and MEPTEC will cohost the 2009 Medical Electronics Symposia, September 1617, at Arizona State University in Phoenix, cosponsored by the ASU College of Nursing and Healthcare Innovation. Presenters can submit abstracts through May 29.
Imbera Raises $15M to Ramp Embedded Packaging in PCBs
(April 14, 2009) MELBOURNE, FL Imbera Electronics secured $15 million in series B funding from NorthZone Ventures, Index Ventures, and Conor Venture Partners. The company, which developed Integrated Module Board (IMB) technology for 3D packaging, will bring on-line a new high-volume manufacturing operation in Sangsong-ri, South Korea, and continue R&D for embedded technologies in Espoo, Finland.
ECD Debuts Thermal Quality Management Program: ThQM
(April 13, 2009) MILWAUKIE, OR ECD introduced its thermal quality management program, called ThQM, for OEMs and volume manufacturers. It is designed to directly address the dialog required between OEMs and contract assemblers, including OEM requirements, machine recipe development, and thermal profile verification. The program targets efficient and accurate communication about issues that must be communicated to both characterize and verify the reflow or wave soldering process.
MMI: Top 50 EMS Providers See 2008 Single-digit Growth
(April 9, 2009) BURLINGTON, VT Manufacturing Market Insider released its annual MMI Top 50, a list of the world's largest EMS providers. Sales of the Top 50 EMS providers for 2008 totaled $158.5 billion, a new high. Despite last year's bad economic news, Top 50 revenue grew collectively by 7.7% in 2008.
Present at SMTA International (SMTAI)
(April 8, 2009) MINNEAPOLIS The SMTA's 2009 Call for Papers for SMTAI, October 48, 2009 in San Diego, CA, has been extended, giving paper presenters and tutorial teachers until April 24 to submit abstracts.
Partnership Targets ESD Management
(April 8, 2009) GLOUCESTER, MA and SUNNYVALE, CA Dangelmayer Associates and SIMCO Electronics formed a collaborative alliance to better address the issues of electrostatic discharge (ESD) management throughout the product lifecycle from design to customer acceptance.
Consona Releases Cimnet Systems Paradigm 3.6 and Engenix 3.2.0 ERP
(April 7, 2009) INDIANAPOLIS Cimnet Systems, a Consona Corporation product line introduced Paradigm Version 3.6 (v3.6), Cimnet Systems' enterprise resource planning (ERP) software for the printed circuit board (PCB) industry and Engenix Version 3.2.0 (v3.2.0), a pre-production engineering application.
Reports: Military Electronics, Capital Equipment Investment, Flex PCB Forecasts
(April 7, 2009) Reports from Henderson Ventures reveal that equipment expenditures are on hold for many electronics assemblers, and the military electronics sector is growing. Overall, global electronic equipment production is predicted to fall by a massive 11.9% this year versus a 0.2% gain in 2008. Research and Markets updates their forecasts for flex and flex-rigid PCBs by region, product, and end-use sector through 2013.
Advisory Board Update: Dr. Hwang Chairs Board on NIST
(April 7, 2009) WASHINGTON D.C. Jennie S. Hwang, Ph.D., was appointed to the Chair for the Board on Assessment of NIST (National Institute of Standards and Technology) Electronics and Electrical Engineering Laboratory, U.S. Department of Commerce.
IPC Tracks Global EMS Financial Metrics
(April 7, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries launched its Global EMS Statistical Program to measure and track financial metrics quarterly for the worldwide electronics manufacturing services (EMS) industry. The first survey, for Q'01 2009 data, will be online this week.
Quality Sells at APEX: Test and Inspection ROI
(April 7, 2009) LAS VEGAS Smaller components on denser assemblies, leadless or no-lead packages, the threat of counterfeits, increased test coverage, and the cost of rework and warranties are some of the reasons inspection solder paste inspection (SPI), automatic optical inspection (AOI), and automatic X-ray inspection (AXI) companies and test providers were confident at APEX 2009. Here are some highlights from the show.
Combating Counterfeits: APEX Hosts Counterfeit Detection Ideas
(April 6, 2009) LAS VEGAS APEX typically showcases new products or applications that focus on a common challenge. This year, counterattacks against the increasing influx of counterfeit components, PCBs, and subassemblies were center stage. Inspection systems have evolved into counterfeit detectors; labeling systems have taken on new importance to identify proper parts; and supply chain management has emerged to prevent counterfeits from entering the finished PCB assembly.
APEX 2009: Technical Conference Closes Strong
(April 6, 2009) LAS VEGAS The 2009 IPC APEX Technical Conference and Expo, March 31 to April 2, 2009, drew many attendees to the educational and collaborative sessions focusing on electronics industry challenges and advances, like high-reliability lead-free, modern PCB cleaning, and counterfeit components.
From the Show: APEX Best Papers
(April 3, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
From the Show: SMT, PCMI Host Free Panel Today
(April 2, 2009) LAS VEGAS — Gail Flower, editor-at-large of SMT, hosted "Industry Cost Challenges: EMS Solutions," April 2 at APEX. The panel, co-produced with Susan Mucha of Powell-Mucha Consulting Inc., comprised EMS company representatives and a bill of materials (BOM) expert presenting case histories and lessons learned to attack problems in production, supply chain management, board failure, and time to market.
From the Show: Lead-free Soldering Presentation
(April 2, 2009) LAS VEGAS Keith Sweatman, Nihon Superior Co. Ltd.'s senior technical advisor, will present a paper titled "Hot Air Solder Levelling in the Lead-free Era," during Session 28, Surface Finishes, today at the IPC APEX technical conference, from 9 to 10 am.
From the Show: New Substrate Challenges FR-4
(April 1, 2009) LAS VEGAS Hollingsworth & Vose, a long-time player in the paper market, is debuting their ViaMat nonwoven aramid organic reinforcement material to the PCB fabrication sector, noting better coefficient of thermal expansion (CTE) than glass, less warpage, and tolerance of high heat applications.
From the Show: Counterfeiting Panel
(April 1, 2009) LAS VEGAS Jim Williams, Ph.D., chairman and founder of Polyonics, will hold a forum titled "Counterfeit Electronics" today, April 1, from 10:15-11:45 am. The forum will discuss action-oriented supply chain protection in a comprehensive strategy.
From the Show: Head-in-pillow Defects Presentation
(March 31, 2009) LAS VEGAS Soldering defects are immensely important to electronics assemblers, particularly those in high-reliability industries. Today at the APEX technical conference, Indium's Mario Scalzo will present on head-in-pillow defects.
SMT Celebrates Products and Services to the Electronics Assembly Industry With SMT VISION Awards
(March 30, 2009) LAS VEGAS SMT announced the winners of its 17th Annual SMT VISION Awards on Monday, March 30, 2009 during the IPC APEX Expo at the Mandalay Bay, Las Vegas. SMT hailed achievement in 18 categories, recognizing industry leaders in technology, efficiency, and environmental benefits, and quality. Award winning products represent the most innovative and useful tools for the surface mount electronics assembly sector.
Rigid PCB Book-to-Bill Remains Low in February, Flex Moves Up
(March 27, 2009) BANNOCKBURN, IL IPC released the February findings from its monthly North American PCB Statistical Program, offering a 0.90 book-to-bill ratio. Rigid PCB sales remain well below 2008 levels, but the more volatile flex circuit sales were down only 4.2% year-to-date. "The book-to-bill ratio for PCBs overall has stayed in negative territory for 10 months, and orders are still declining compared to last year," said IPC president Denny McGuirk.
Technology Supply Chain Business Outlook Survey
(March 23, 2009) SAN JOSE, CA Venture Outsource is conducting a reader survey to better understand the prevailing confidence in our business environment, expectations of business levels, and pricing trends. The "Technology Supply Chain Business Outlook Survey" findings will be published on Venture Outsource's Website.
Upcoming Boston Technical Events
(March 20, 2009) BOSTON The SMTA Boston Chapter will cohost a technical presentation with IMAPS on April 21, preceding the opening of the SMTA Boston Academy, April 22-23. SMTA/IMAPS will present "Manufacturing & Reliability Challenges with QFN Packages in Pb and Pb-Free Environments." The Boston Academy will include seven courses on SMT, packages and components, PCBs, and lead-free and REACH.
New Services and Capabilities: Board Fab to LED Attach
EMS providers and PCB fabs announced new capabilities on their lists of services, including Molex's automated LED bonding capabilities, NBS's ITAR registration, Sunburst's added placement range, and Electronic Interconnect's SMT PCB design and manufacturing services. Also, TechBridge Solutions formed to offer low-cost electrical engineering and PCB layout.
IPC APEX Expo Preview: Innovative Technology Center, Task Groups, and More
(March 10, 2009) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries' 2009 IPC APEX EXPO, March 31April 2, 2009, at the Mandalay Bay Resort & Convention Center in Las Vegas, will host meetings, task groups, presentations, and the Innovative Technology Center (ITC) to showcase pressing issues and new ideas for electronics assembly.
1800 DINGGUY and Photo Stencil Develop Stencil Repair Technology
(March 9, 2009) COLORADO SPRINGS, CO Damage to stencils occurs from dropping something on the surface such as squeegee blades or print cartridges to bumping the print area during storage. This can occur frequently on the production floor and during preparations for a product run. 1800 DINGGUY and Photo Stencil created a technique to repair creases, dents, and other coining. Users can perform the repairs themselves on-site.
IPC Issues Call to Action on RoHS
(March 6, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries issued a call for assemblers and electronics companies creating products for the EU market to weigh in on the proposed changes to RoHS. Proposed revisions could make exemptions more difficult to obtain and add compliance requirements, such as eliminating TBBPA.
Universal Instruments Corporate Update: No Sale
(March 6, 2009) BINGHAMTON, NY Amid published rumors of a possible sale or investor change, Universal Instruments Corporation (UIC) representatives stated that the company is not being sold or bought out, but has made some changes to better adapt to changes in the global economy. Patriarch Partners LLC, which has been an investor in the equipment company since 2006, increased its presence.
Orpro Vision Acquiring Orbotech's Assembly AOI Business
(March 2, 2009) HAMELN, Germany Orbotech Ltd has signed an agreement to sell its European and American assembly business (automated optical inspection AOI systems) to the Italian company Orpro Services s.r.l that belongs to Fin.Pro S.p.A., beginning this April. Orpro Services will operate the business as an independent company under the name Orpro Vision with headquarters in Hameln.
January PCB Book-to-Bill Drops to 0.89
(March 2, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries saw its January findings from the monthly North American Printed Circuit Board (PCB) Statistical Program drop for rigid and flex PCBs. Flex circuits and rigid PCBs combined hit a book-to-bill ratio of 0.89, with flex staying fairly strong but rigid PCBs dipping significantly year-over-year.
Incap's 2008 Revenue Up 13% YoY
Incap Group's revenue amounted to approximately EUR 93.9 million, 13% higher than the previous year (2007: EUR 83.0 million). Because of tight competition on the contract manufacturing market, great pressure was directed at sales margins. However, the price level of certain products could be increased through price adjustments agreed upon with the customers.
Highlights: IPC/JEDEC Lead-free Conference
(February 23, 2009) BANNOCKBURN, IL Werner Engelmaier and SMT Editorial Advisory Board members Ray Prasad and Jennie Hwang, Ph.D., are among the technical experts examining critical issues for lead-free implementation, process, and reliability in workshops held at the IPC/JEDEC "Transitioning to Lead Free Strategies for Implementation" conference in Santa Clara, CA., March 35.
Passive Electronic Components: World Market Outlook
(February 23, 2009) MONTREAL The Paumanok Publications research group of Electronics.ca Publications released a report on the passives market, considering capacitors, resistors, and inductors, and the components' materials. The report was designed for end-users of passive electronic components that need to update their supply chain information for passive parts on an annual basis.
Participate in IPC Midwest
(February 20, 2009) BANNOCKBURN, IL IPC Association Connecting Electronics Industries issued a call for participation for the IPC Midwest Conference & Exhibition, September 2324, 2009 in Schaumburg, IL. The conference will be held on September 23 and professional development courses will take place on September 24.
Rapid Tooling Intros SMT Print Tooling Services
(February 20, 2009) PLANO, TX Rapid Tooling Inc. now provides SMT Print Tooling services. Dedicated tooling eliminates set up variation, reduces change over time, and reduces defects.
IPC APEX Expo Preview: Technical Courses and Tutorials
(February 17, 2009) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries is preparing for the 2009 IPC APEX EXPO, March 31April 2, 2009, at the Mandalay Bay Resort & Convention Center in Las Vegas. In total, 35 sessions with nearly 100 papers will present the industry's leading research and findings to stimulate new thinking and inspire the next generation of innovation.
Reverse Trend in Regional Sourcing: IPC
(February 13, 2009) BANNOCKBURN, IL In a survey conducted by IPC, 42% of responding companies cited changes in their customers' sourcing patterns from Asia back to North America or Europe in the past two years. Executives and marketing professionals at EMS, PCB, and supplier companies in North America and Europe were polled for the survey during November 2008.
Ernst & Young Report on Supply Chain Management
(February 10, 2009) HOUSTON Ernst & Young released a report, "Global Supply Chain: Balancing Cost Reduction and Performance Improvement," which includes responses from 250 supply executives from global companies. Ernst & Young assert that the slower economy demands increased supply chain efficiency.
Heraeus Intros No-clean Tin/lead Solder Paste
(February 10, 2009) WEST CONSHOHOCKEN, PA Heraeus released a tin/lead solder paste, F377, the result of a two-year development cycle that employed early customer involvement and design for Six Sigma tools. Formulated as a completely new platform, F377 surpasses performance benchmarks by using modern raw materials statistically proven in real-world testing to produce the most desirable and stable results.
IPC Midwest Looks for Speakers
(February 10, 2009) BANNOCKBURN, IL IPC Midwest, September 2324, 2009, in Schaumburg, IL, is recruiting paper presentations and classes in various aspects of PCB design and electronics assembly. Abstracts are due by April 14 to IPC Association Connecting Electronics Industries.
Agilent Focuses on Test, Sheds AOI/AXI Inspection Units
(February 9, 2009) SANTA CLARA, CA Agilent Technologies Inc. will exit the automated optical (AOI) and automated X-ray inspection (AXI) systems business, effective in March 2009. Company representatives cited a longer-term business strategy to focus on electronic test, referring to electronics test as a core competency for Agilent.
Viscom X7056 AOI/AXI Expanded PCB Size Range
(February 6, 2009) DULUTH, GA Viscom released a new version of the X7056RL, adding support for larger PCB sizes up to 24 × 20". The inspection system performs automatic optical inspection (AOI) and automated X-ray inspection (AXI) simultaneously. This is designed to improve throughput and increase detection of hidden defects, according to the company.
Aqueous Acquires AAT's MicroJet Defluxing Systems
(February 4, 2009) RANCHO CUCAMONGA, CA Aqueous Technologies Corp. has acquired all marketing, sales/distribution, and service rights for the MicroJet family of conveyorized (in-line) defluxing systems manufactured by Austin American Technology in Burnet, TX.
Bliss Industries to Host Silicon Valley Chapter SMTA Meeting
"Bliss Industries has been a member of the SMTA for many years and it is our turn to contribute to this great organization by hosting a meeting and working to increase membership in the chapter," said Ken Bliss CEO & VP Manufacturing, Bliss Industries, Inc.
January Manufacturing ISM Report On Business
(February 3, 2009) TEMPE, AZ Economic activity in the manufacturing sector failed to grow in January for the 12th consecutive month, and the overall economy contracted for the fourth consecutive month, say the nation's supply executives in the latest Manufacturing ISM Report On Business.
Consumer, Automotive Electronics Drop
(February 2, 2009) LOS ALTOS, CA Henderson Ventures reports that the consumer electronics sector, excluding cell phones and computers, will face declines in 2009. Game consoles will be a bright spot, however. Automotive electronics will continue to fall globally in 2009, moving into negative territory. Slumping vehicle demand and price pressures are to blame, Henderson asserts.
IPC December PCB Results: Book-to-Bill Ratios Dip
(February 2, 2009) BANNOCKBURN, IL IPC released the December findings from its monthly North American PCB Statistical Program, showing that the rigid PCB book-to-bill and the total industry book-to-bill ratios fell to about 0.90. Flex circuits showed a jump to above 1.00. The rigid circuits book-to-bill has been below parity for nine months, reflecting stagnant growth, said IPC president Denny McGuirk. The 2008 numbers showed a 1% gain over 2007.
Advisory Board Update: Harald Wack named President of ZESTRON Worldwide
(January 27, 2009) MANASSAS, VA ZESTRON appointed Harald Wack, Ph.D., to president of ZESTRON's worldwide operations, taking over for his father O.K. Wack, Ph.D. Harald Wack is an SMT Editorial Advisory Board member and has led ZESTRON America for the past seven years.
SMTA Adds Technical Committee Members
(January 26, 2009) MINNEAPOLIS The SMTA announced nine new members to the distinguished technical committee, which assembles the SMTA International (SMTAI) conference. Planning is underway for the SMTAI 2009 event, October 48, 2009 in San Diego, CA.
APEX Update: Designers Summit and Management Meetings
(January 23, 2009) LAS VEGAS IPC Association Connecting Electronics Industries released descriptions for several of the major events at IPC Printed Circuits Expo/APEX/Designers Summit, March 30 to April 2 in Las Vegas. The PCB Executive Management Meeting, EMS Management Council Meeting, and Designers Summit are detailed.
Get Ready for APEX: Preview of Technical Sessions and Noteworthy Events
(January 19, 2009) LAS VEGAS IPC's flagship tradeshow and conference for the electronics industry, IPC Printed Circuits Expo/APEX/Designers Summit, is scheduled to take place March 31 to April 2 at the Mandalay Bay in Las Vegas. These are some of the technical presentations, keynotes, and panels to attend while at the show.
Benchmark Electronics Announces Strategic Alliance with Cray
Benchmark Electronics, Inc. announced today that, through a joint effort with Cray Inc., it helped support Cray in its efforts to deliver a supercomputer system for Oak Ridge National Laboratory in Tennessee which set a new world record for computer speed. The system sustained performance of over a petaflop (a quadrillion mathematical calculations per second) on two scientific applications.
NBS Acquiring CA-based EMS/Mechanical Provider
(January 15, 2009) SANTA CLARA, CA NBS began proceedings to acquire CompServ, an electronic/mechanical services provider. CompServ specializes in engineering builds, quick-turn production, and volume manufacturing. Financial terms were not disclosed.
Flextronics Gives Update Following Nortel Bankruptcy Announcement
"Flextronics has been working to reduce its exposure to Nortel for some time now. During our November 2008 Analyst and Investor Meeting, I discussed in detail that Flextronics has organizationally aligned its operating and capital resources in such a way to mitigate the impact of business changes of any one customer," said Mike McNamara, Flextronics CEO.
Bretthauer Appointed CEO of LPKF Laser & Electronics
(January 13, 2009) GARBSEN, Germany The supervisory board of LPKF Laser & Electronics AG has appointed Ingo Bretthauer, Ph.D., as CEO of LPKF AG beginning Februrary 1, 2009. Bretthauer will serve with current board members Bernd Lange and Kai Bentz. He will focus on global sales.
SMTA Calls for SMTAI, IWLPC, and Other Conference Presenters
(January 12, 2009) MINNEAPOLIS The Surface Mount Technology Association (SMTA) is accepting abstracts for several of its 2009 technical and educational programs, including The International Conference on Soldering & Reliability, the AIMS Harsh Environment Electronics Symposium, SMTA International (SMTAI), and the International Wafer-Level Packaging Conference (IWLPC).
SMT Equipment Global Strategic Business Report
(January 9, 2009) DUBLIN Research and Markets released a report analyzing the worldwide markets for SMT equipment, including screen printers; placement equipment; reflow and wave soldering systems; cleaning equipment; optical, X-ray, and laser inspection machines; and repair and rework equipment.
iNEMI Collaborates with Industry on Environment
(January 9, 2009) HERNDON, VA iNEMI is organizing new initiatives to address environmental issues. iNEMI sponsored forums in 2008 to focus on strategic environmental topics for the electronics industry. In response to this input, iNEMI has identified and is developing new collaborative efforts.
R&D Initiatives Boost Flex Electronics
(January 8, 2009) LONDON Frost & Sullivan reports that the flexible electronics industry is set to bring about changes in the design and conceptualization of electronics devices in the consumer, medical, and military sectors. The emerging field has implications in reducing costs owing to printed manufacturing techniques developed for volume production.
IPC Updates PCB and Laminate Report
(January 6, 2009) BANNOCKBURN, IL IPC issued its "World PCB Production and Laminate Report for the Year 2007," presenting the PCB production and laminate market by region and product type worldwide. Highlights include an overview of the PCB industry, production details by region, special analysis of flexible printed boards, laminate market details by region, and historical trends in worldwide PCB production.
Report: World PCB Automatic Test Equipment Markets
(January 6, 2009) DUBLIN Research and Markets released "World Printed Circuit Board Automatic Test Equipment Markets 2008," detailing the worldwide markets for automatic test equipment. This research service focuses on ATE used by the electronics industries: in-circuit test (ICT), functional test (FT), boundary scan, and manufacturing defect analyzers (MDAs).
Valor Acquires PCB Matrix
(January 6, 2009) YAVNE, Israel Valor Computerized Systems acquired the assets of PCB Matrix Corporation, a provider of EDA library generation tools for both land pattern and schematic symbols. Valor will expand its PCB design software line with the purchase, adding land pattern and schematic symbol generation.
STEP 10 Rework and Repair: The Complete BGA Rework Process
Robert Avila and Wade Gay, Finetech, describe the steps to BGA rework, aided by video clips of rework in action. There are at least five steps in successfully completing the cycle for BGA rework. These steps, which include component removal, site cleaning, reballing, and soldering, do not change, independent of whether or not the BGA is on a PCB that is large, small, thin, or thick, etc.
Silicone-Free Interface Material for High Thermal Conductivity
(December 30, 2008) MAHWAH, N.J. MH&W International introduced Keratherm U 90 thermal interface material (TIM) for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices.
Book-to-bill Hovers below 1.00 in November
(December 29, 2008) BANNOCKBURN, Ill. IPC announced that the combined rigid and flex PCB book-to-bill ratio dipped slightly in November, hitting 0.94. The ratio has hovered below parity since a two-month stretch in March and April 2008, where it hit 1.01.
Flexible Circuit Advocate, Timothy Meehan, Passes
(December 29, 2008) SAN FRANCISCO Tim Meehan, president of Eclectic Technologies Inc., a flexible circuit consulting firm, passed away. Meehan helped promote, develop, and expand flexible circuit technology. He was among the first to promote and extol to flex circuit manufacturers the advantages of adhesive-less flexible base materials.
The Shaughnessy Report: Hillman on Avoiding PCB Design Failures
Today, designing a reliable PCB is tougher than ever. But Dr. Craig Hillman, CEO of DfR Solutions, is taking designing for reliability to a new level. Craig discusses common PCB design failures and ways to avoid them, as well as the physics of failure.
Research and Markets Releases Flexible PCB Report
(December 18, 2008) DUBLIN Research and Markets put out a report on the market for flex circuits, titled, "Total World Flexible Printed Circuit Board Market." The study covers challenges to the flex PCB industry, drivers, restraints, product segments, technology trends, and other elements.
Worldwide EMS Will Grow, at a Slower Pace
(December 17, 2008) FRAMINGHAM, Mass. Following two years of double-digit revenue growth 20% in 2006 and 16% in 2007 the worldwide EMS industry (including ODMs) is expected to end 2008 with growth of 9.3%, reaching $291 billion in revenues, according to research firm IDC. In 2009, IDC expects the EMS industry to grow by 7.8%, assuming demand for electronics does not fall farther than expected.
Equipment Services Debuts SMT Feeder Calibration, Repair, Refurbishment Services
(December 16, 2008) BENICIA, Calif. Equipment Services LLC (ESL) began offering complete SMT feeder calibration, repair, and refurbishment services. The company cites losses in production time, machine operation, and replacement feeder expenses caused by malfunctioning or improperly calibrated feeders. The service also is designed to improve lean manufacturing operations.
P. Kay Metal Discusses Partnership, New MS2 Application
Dan Feinberg and Larry Kay, of P. Kay Metals, welcome Michael Carano, of OMG Electronic Chemicals, as a major new distribution partner for the company's proprietary dross elimination technology. The group discusses this new partnership and announces plans to introduce MS2 for the HASL process.
SMART Group Elects Bryant as New Chairman
At a committee meeting held December 3, 2008, Keith Bryant, European Sales Manager of Dage X-Ray Systems, was elected Chairman of SMART Group, taking over the position from outgoing Chairman, Paul Salmon.
Techcon Debuts IMP Dispensing Valve
(December 9, 2008) GARDEN GROVE, Calif. Techcon Systems, a product group of OK International, introduced the TS7000 interchangeable material path (IMP) series rotary valve. It is designed with no dead fluid volume, field replaceable feed screw/cartridge assembly, interchangeable with TS5000DMP feed screw auger inserts, flexible motor, syringe, and a needle mounting option.
Printing Electronics Report
(December 8, 2008) BOSTON IDTechEx published a report, "Printing Electronics Sharply Improves Performance," by Peter Harrop, Ph.D., chairman, outlining the advantages of thin films over traditional electronics. Self-powered electronics is progressing rapidly as use of thin films, increasingly printed, improves performance by ten to one hundred times, states Harrop.
IPC-9252A Specifies Requirements for Electrical Testing of Unpopulated PCBs
(December 5, 2008) BANNOCKBURN, Ill. IPC released IPC-9252A, "Requirements for Electrical Testing of Unpopulated Printed Boards." Developed by the IPC Electrical Continuity Testing Task Group, Revision A is a complete rewrite of the original standard. It defines levels of appropriate testing and assists in the selection of the test analyzer, test parameters, test data, and fixturing required to perform electrical testing on unpopulated printed boards and innerlayers.
Federal Electronics Receives ITAR Registration
Federal Electronics, Inc. has received official International Traffic in Arms Regulations (ITAR) registration from the U.S. Department of State, Bureau of Political-Military Affairs, certifying the company's dedication to adhering to regulations controlling the export and import of defense-related articles and services.
Fitch Ratings: 2009 Concerns for U.S. Technology
(December 4, 2008) NEW YORK Fitch Ratings put out its outlook for a majority of U.S. information technology (IT) sectors as negative for 2009. Sectors such as EMS and IT distributors will be affected by an economic downturn from a profitability standpoint, but this decline has historically been offset by working capital improvements, Fitch asserts.
Centipede, Topline Partner on Test
(December 4, 2008) SAN JOSE, Calif. Centipede Systems, manufacturer of connectors and sockets for electrical test, is partnering with TopLine to develop a cost-effective test evaluation tool. Centipede and TopLine will produce evaluation kits for alternative contactor technologies aimed at high-performance burn-in test for semiconductor devices.
Manncorp Debuts Benchtop Production Line
(December 2, 2008) SAN DIEGO, Calif. and WILLOW GROVE, Pa. The "Starter Lab" turnkey line from Manncorp targets low-cost precision prototyping or low-volume SMT assembly. It also is used by technical schools and colleges. The line includes a precision stencil printer, a computer-controlled pick-and-place unit and a lead-free reflow oven.
Research Report: EMS Rankings in Europe
(December 2, 2008) MONTREAL Electronics.ca Publications released "The European EMS Industry: An Analysis of the Top 50 European EMS Providers," providing an overview of the major European EMS providers. The report serves companies across the electronics supply chain including industry analysts from the financial, management, and government sectors.
Avnet Acquires Nippon Denso Industry
Harley Feldberg, global president of Avnet Electronics Marketing, commented, "This acquisition expands our presence and enhances our competitive position in one of the world's largest markets for electronic components." The transaction, which is expected to close by December 29, 2008, should be immediately accretive to earnings and supports Avnet's return on capital goals.
Henderson Evaluates Computer Sector
(December 1, 2008) LOS ALTOS, Calif. Modest PC prospects are forecast for 2009, according to the Henderson Forecast Summary from Henderson Ventures. The analyst firm also sees falling average selling prices (ASPs) as one reason for shrinking computer revenues in 2009.
Saki To Acquire MacroScience to Expand AOI and X-ray
(December 1, 2008) Japan and Hong Kong Japanese AOI manufacturer Saki Corporation signed a sale and purchase agreement with Schmidt Electronics, an Asia-Pacific conglomerate of advanced electronics and IT technology, acquiring a percentage in MacroScience Technology Limited (MSTL). Saki hopes to add X-ray technology to its inspection portfolio via the acquisition.
October PCB Results Maintain Level
(November 25, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries announced that the book-to-bill for rigid PCBs dropped incrementally to 0.95; the overall PCB book-to-bill results for North America in October 2008 rose slightly to 0.96. Rigid PCB orders and shipments declined a bit more than normal in October, due to weakening demand, but year-to-date growth over last year is positive, and the flexible circuit segment showed strong growth in October.
WYTAN to Merge with View Systems
Gunther Than, CEO of View Systems, says, "View's cutting-edge technologies and new products in development paired with WYTAN's manufacturing, assembly expertise and comprehensive engineering experience in the electronics industry will yield a beneficial partnership."
Sono-Tek Presents Ultrasonic Atomization Technology
(November 24, 2008) MILTON, N.Y. Sono-Tek debuted two ultrasonic systems for dispensing and depositing nano materials on target substrates to the nanotechnology market, targeting use on aerospace, homeland security, energy, biomedicine, and electronics manufacturing applications.
electronica 2008 Highlights
(November 20, 2008) MUNICH, Germany electronica 2008 attendance was stable this year despite the difficult financial situation facing many exhibitors and attendees, reported event coordinators Messe München International (MMI). Of the 2,800 exhibitors, 58% were international. Around 72,000 people attended.
Essemtec Premiers Pick-and-place for 3D-MID
(November 19, 2008) AESCH, Switzerland Essemtec developed a system to dispense and place in three dimensions, targeting 3D-MID technology. Molded interconnected device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are applied directly onto the surface of injection-molded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels.
A.C.E. Opens Selective Soldering Development Lab
(November 19, 2008) SPOKANE, Wash. To promote better selective soldering results from proper equipment usage and process development for products, A.C.E. Production Technologies established its Selective Soldering Process Development Lab. The company is using knowledge accumulated by its process development engineers for challenging assemblies.
Stoelting Approves Compatibility with ZESTRON Cleaning Agents
(November 19, 2008) MANASSAS, Va. Stoelting and ZESTRON completed material compatibility testing for cleaning equipment and products, conducted with the CBW Series, the TRITON in-line cleaning equipment, as well as the stand-alone wash system and Liquid Lock. At various concentrations and temperatures, compatibility existed between all wetted parts, which are exposed directly to VIGON and ATRON cleaning agents.
XDry Adds Staff, Workspace
(November 18, 2008) LAS VEGAS XDry Corporation opened a new facility in Montreal to support sales and service in the Americas. This brings separate managed warehousing, inspection, and testing facilities for its desiccant dry cabinets together. Coupled with the change XDry appointed a warehouse manager and office manager.
Mouser Launches European Catalog and Websites
(November 18, 2008) MANSFIELD, Texas Mouser Electronics Inc. debuted a European components and boards catalog initially available in English and German with other languages to follow. The company concurrently took live local Web domains, soon to be launched in local languages.
IPC Releases Free Land Pattern Calculator
(November 17, 2008) BANNOCKBURN, Ill. To help PCB designers work with greater accuracy and efficiency, IPC Association Connecting Electronics Industries partnered with PCB Matrix Corp. to include a free Land Pattern Calculator with IPC-7351A, "Generic Requirements for Surface Mount Design and Land Pattern Standard."
Closed-loop Preheater Control for Linear Ramp Profile, Selective Soldering Control
(November 17, 2008) STRATHAM, N.H. Preheating an assembly prior to selective soldering aids good soldering results, Vitronics Soltec asserts. Preheating must be controlled so that each assembly reaches the specified preheat temperature at a measurable and linear ramp rate. Vitronics Soltec released the mySelective 6748 with closed-loop preheater management feature to control board preheating dwell time and temperature for board- to-board repeatability and optimized process control.
Adeptron Reports Profitable 3Q08 Results
The company reported that third quarter sales increased by $1,456,000 or 18% over the third quarter of 2007 to $9,636,000. Gross margin improved to 15.5% compared to 10.5% for the same period last year.
Advice for Reducing Material Waste
(November 11, 2008) NEW YORK David R. Butcher from Industrial Market Trends, Thomas Publishing Company, outlines the industrial manufacturing world's response to energy costs and the price of raw materials. He notes that rising costs on both fronts have made 93% of midsized manufacturers nervous about raw materials costs, and 67% are worried about energy costs.
Seika Intros SAWA Ultrasonic Stencil Cleaner
(November 11, 2008) TORRANCE, Calif. Seika Machinery Inc. launched the SC-5000 tabletop ultrasonic stencil and misprint cleaner as part of its SAWA platform of products. The system features cleaning head, generator, foot pedal, 32 × 32" tray and 30 foam pads.
Sparton Disappointed with 1Q Fiscal 2009 Sales
Richard Langley, Interim CEO and President, stated that, "We are disappointed at the lower than expected sales. We are very pleased with the successful and consistent execution of the sonobuoy contracts this year, as well as the increase in the Aerospace sales and favorable forecast for future sales in the Medical market as well."
Cooper Tools Debuts Soldering Tip Recycling
(November 10, 2008) APEX, N.C. Cooper Tools created a recycling program for worn-out soldering tips. By recycling the copper and iron from used tips, end users will benefit the environment and preserve natural resources. For every two pounds of worn-out tips turned in for recycling, Cooper Tools offers a voucher toward new Weller tips. Any brand of soldering or desoldering tip is eligible.
ACI Hosts Free Nanotechnology Workshop
(November 10, 2008) PHILADELPHIA The American Competiveness Institute (ACI) will host "Competing in the 21st Century: The Nanotechnology Edge," November 12 at ACI in Philadelphia. Stephen J. Fonash, Ph.D., founding director of the Penn State Nanofabrication Facility, a national R&D user facility and one of the charter institutions of the National Science Foundation's (NSF) National Nanotechnology Infrastructure Network (NNIN), will speak.
TFI Discusses Success Sharing
(November 7, 2008) ALAMEDA, Calif. Technology Forecasters Inc.'s Kent Romanoff, environment strategic business advisor, posted a blog on success sharing, a financial arrangement whereby the business that has been engaged to provide a mission-critical product or service shares the risk of failure and the benefits of success with the company that is purchasing these services.
DuPont Teijin Films Joins Holst Centre Systems-in-Foil Research Program
(November 6, 2008) EINDHOVEN, the Netherlands DuPont Teijin Films joined the systems-in-foil program of Holst Centre, a research initiative of the Flemish and Dutch research centers IMEC and TNO. DuPont Teijin, as a major substrate vendor, completes the ecosystem of industrial players for its systems-in-foil program line.
October Manufacturing Report: Electronics Sectors Grow
(November 4, 2008) TEMPE, Ariz. Economic activity in the manufacturing sector failed to grow in October for the third consecutive month, and the overall economy concluded 83 consecutive months of growth, say the Institute for Supply Management (ISM) in "Manufacturing ISM Report On Business." Computer and electronic products was one of only two sectors to show growth. Contraction was reported in other industries such as paper products and fabricated metal industries.
IPC Partners With Auto Industry on IPC-A-610D
(November 3, 2008) BANNOCKBURN, Ill. In response to numerous inquiries from the automotive industry, IPC Association Connecting Electronics Industries will host a meeting with European automotive industry leaders including Porsche, Volvo, and Volkswagen to investigate adding automotive-specific requirements for electronics used in cars, trucks, and military vehicles to IPC-A-610D, "Acceptability of Electronic Assemblies."
Florida CirTech Debuts Improved ENIG Processes
(November 3, 2008) GREELEY, Colo. Genesis Materials Technology (GMT) improved the ENIG resistance of Florida CirTech's water-based AQ2000 LPI solder mask. AQ2000 LPI now is able to withstand the harsh chemical conditions found in the ENIG process. Florida CirTech additionally released a catalyst killer, CK300, to minimize skip and background plating during ENIG processing.
SMTAI 2009 Call for Papers
(October 30, 2008) SAN DIEGO, Calif. SMTA is inviting the industry to submit papers for the technical conference of SMTA International (SMTAI), October 48, 2009, in San Diego. Abstracts are due to the SMTA by March 27, 2009, for paper presentations, half-day courses, and full-day courses.
Business Objects, Valor Partner for Dashboard Solution
(October 28, 2008) YAVNE, Israel Software provider Valor Computerized Systems will enable its customers to monitor their manufacturing operations in real-time through dashboards linked directly to the manufacturing floor. The new capability is enabled by integrating technology from Business Objects.
September PCB Book-to-Bill Stays at 0.95
(October 27, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries announced the September findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. "Orders and shipments in September showed the usual end-of-quarter increase," said IPC president Denny McGuirk, "but the growth rate appears to be slowing."
Research Updates on PCBs, RoHS, Economy, and PCs
(October 27, 2008) Nikkei Business reports on PCB fabricator outlooks; IPC expresses its concerns and expert advisory on RoHS revisions; Christopher Associates speaks on the economic status for manufacturers watching Wall Street; and Electronics.ca Publications released "Personal Computers A Global Industry Outlook."
OK International Debuts Soldering and Rework Systems to Increase Throughput, Control
(October 24, 2008) GARDEN GROVE, Calif. OK International launched the Metcal MX-5000 Series soldering and rework system with increased power and an enhanced handpiece with energy and tip-saving features. The series targets high-performance hand soldering on complex assemblies.
Indium Intros Rosin-free No-clean Cored Wire Solder
(October 23, 2008) CLINTON, N.Y. Indium Corporation debuted CW-501, a colophony-free (free of rosin), no-clean, cored wire solder for use with lead-free alloys. Indium developed the product by adapting its solder paste alloys, and notes that rosin is an allergen.
MEPTEC/Advanced Packaging Announce Symposium Final Program
(October 23, 2008) SAN JOSE, Calif. MEPTEC, the MicroElectronics Packaging and Test Engineering Council, and Advanced Packaging
have finalized the program for their upcoming symposium titled "Packaging Developments and Innovations: From System Design to Integrated Delivery," to be held on Thursday, November 13, 2008, at the Wyndham Hotel, San Jose, Calif.
DYMAX Acquires Dispensing Company Tridak
(October 20, 2008) TORRINGTON and DANBURY, Conn. DYMAX Corporation acquired Tridak (Danbury), adding to its lines of standard and custom dispensing/filling equipment. Tridak's products suit dispensing and filling adhesives, pastes, solvents, lubricants, or other materials.
IPC and SMTA Release Cleaning Symposium Agenda
(October 14, 2008) ROSEMONT, Ill. The IPC Association Connecting Electronics Industries and SMTA will co-present their cleaning symposium, "High-Performance Electronics Assembly Cleaning" on October 2829, 2008, at the Crowne Plaza Chicago O'Hare hotel. The docket includes keynotes on residues' impacts and on equipment design, and sessions on standards, cleanliness assessment, lead-free cleaning, equipment and material advances, and the role of conformal coating.
Christopher Associates Releases HDI Market Data
(October 13, 2008) SANTA ANA, Calif. Matthew Holzmann, president of Christopher Associates, presented the keynote address to the IPC's HDI Technology Conference in Dallas, Texas, on the demand for high-density interconnect substrates in North America. With assistance from multiple sources, including Prismark Partners, Holzmann outlined existing and potential markets as well as current market conditions for these products. The major points of Holzmann's keynote are summarized here.
Preview the Upcoming Mexitrónica Show
(October 13, 2008) GUADALAJARA, Mexico Mexico's National Chamber for Electronics, Telecommunication, and IT Industries (CANIETI) in partnership with ROC Exhibitions Inc. will present Mexitrónica, October 2123, 2008, at Guadalajara, Mexico. The exposition and conference drew more than 6,000 attendees in 2007. Following are some of the highlights for the conference and show floor.
iNEMI: Sustainability Must Be Relative
Arizona State University Professor Brad Allenby challenges the industry to avoid focusing too much on "sustainability," and, instead, understand the total impact of electronic products on the global community, most of which is good.
Study Shows Flip Chip and WLP Growth
(October 7, 2008) AUSTIN, Texas The growth of flip chip and wafer-level packaging (WLP) is a bright spot in the electronics industry, according to TechSearch International's recently released study, "2008 Flip Chip and WLP Market Trends and Forecasts." The study projects a compound growth rate of more than 14% for flip chip units and 14% for WLPs between 2007 and 2012.
electronica 2008 on China, India, and Eastern Europe in the Global Electronics Market
(October 6, 2008) MUNICH, Germany Messe München released a white paper to discuss the desirability of China, India, and Eastern Europe to the electronics industry from the perspective of six industry leaders. The white paper, available in advance of electronica 2008, shows how executives regard these regions with respect to low-cost manufacturing, rising energy costs and wages, worker flexibility, regional infrastructure, environmental regulations, and IP security.
IMEC, Taiyo Nippon Sanso Collaborate on Green LEDs
(October 6, 2008) LEUVEN, Belgium and OSAKA, Japan Nanoelectronics research institute IMEC and semiconductor company Taiyo Nippon Sanso Corp. (TNSC) will jointly develop manufacturing technology for high-efficiency LED devices. This is TNSC's first collaboration with an advanced research center based in Europe.
Sonoscan Announces Advanced Thickness Measurement Method
(October 2, 2008) ELK GROVE VILLAGE, Ill. In a joint effort with a large component supplier to the cellular and video industries, Sonoscan developed an acoustic micro imaging technique that accurately measures the thickness of the bondline of the heat spreader adhesive in advanced microprocessor assemblies. The technique remains effective when the bondline is too thin for individual echoes to be separated.
ECD Plans October U.S. Launch for V-M.O.L.E. Thermal Profiler
(September 30, 2008) PORTLAND, Ore. Following a quick ramp-up and successful launch in Asia, ECD plans to bring its production verification thermal profiler, V-M.O.L.E., to customers in North America. The system complements ECD's MEGAM.O.L.E. 20, providing a method for assemblers to ensure reflow profiles stay in spec during production, following initial new product introduction (NPI) and process development.
August PCB Book-to-Bill Holds Steady at 0.95
(September 29, 2008) BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries reported the August findings from its monthly North American Printed Circuit Board (PCB) Statistical Program, showing that the combined rigid and flex PCB book-to-bill maintained its position at 0.95. The book-to-bill ratio has hovered between 0.94 and 0.96 since May 2008.
From the Show: Mirtec AOI in the U.S.
(September 24, 2008) SCHAUMBURG, Ill. Today at IPC Midwest, we met with Mirtec USA Inc., the U.S. branch of global inspection provider Mirtec Corp. The company celebrated its four-year anniversary in the U.S. this month, and discussed how their customer base in the U.S. has changed in that short time. When Mirtec USA was formed, the company had three systems sold in the country. Today, there are more than 285 operating here.
From the Show: IPC Midwest Grows in Size and Cooperation
(September 24, 2008) SCHAUMBURG, Ill. Not all tradeshows are bustling with activity. Sometimes a hurricane or a natural weather disruption can really wreck havoc on an event, but this year's IPC Midwest in the Renaissance Schaumburg Convention Center met with friendly skies and 80°F weather.
From the Show: Misumi's Configuration Tech Seminar
(September 23, 2008) ROSEMONT, Ill. On my way to IPC Midwest in Schaumburg, Ill., I made a slight detour to take in the Configuration Tech Seminar hosted by Misumi USA Inc. at National Manufacturing Week (NMW) in Rosemont. The seminar offered a straightforward and useful comparison of stock, configurable, and custom parts that would be of interest to all those EMS providers and original design manufacturers (ODMs) branching out into final product assembly for their OEMs.
ISO Plans Energy Management Standard
(September 16, 2008) WASHINGTON ISO project committee PC 242, which is to develop an international standard on energy management, held its first meeting in early September. The future ISO 50001 will establish a framework for industrial plants, commercial facilities, or entire organizations to manage energy.
Automatic Wave Loader Lowers Costs
(September 16, 2008) PLEASANT PRAIRIE, Wis. PROMATION developed a new platform for its automatic wave loading system that reportedly results in a cost reduction. The SDTF is an edge carry, drop, tilt, and feed automatic wave loading system that has been designed to accept PCBs from a flat line (0°) and then drop, angle, and transfer the PCB into the wave solder machine.
Enthone Acquires Ormecon in PCB Finishes Market
(September 8, 2008) WEST HAVEN, Conn. Enthone Inc., a business of Cookson Electronics, acquired Ormecon GmbH of Ammersbek, Germany, for an unannounced sum. The purchase adds to Enthone's PWB surface finishes product lines, including new coating technologies.
IBM Engineer Looks at Lead-Free Successes, Failures in Quest to Develop Better Supply Chain Practices
As the electronics manufacturing community struggles with high-reliability issues associated with lead-free processes, Matt Kelly, an IBM engineer, hopes his work will be a catalyst for sharing knowledge in a horizontal supply chain.
Nepcon South China: A Different Approach to China's SMT Capital Equipment Business
What happens when an industry veteran recognizes that Chinese equipment makers can become competitive with global brands? China Direct's founder, Todd La Marche, and his colleague, Olivier Grascoeur, explain how their company has bridged that perceived gap.
Nepcon South China: Shifting Product Development from R
Yearly product introductions are tough for some companies to achieve, let alone dual product introductions within six months. ECD introduced a product last spring with R&D in mind. This fall, the company is introducing the V-M.O.L.E., a thermal profiling unit that takes what was developed last spring from a lab tool to one that meets performance needs in a high-volume setting. Vice President of Marketing and Sales Grant Peterson takes viewers through his company's NPI process and reasoning.
IEEE 1149.7 Standard Cuts Space, Cost for Embedded Systems
(September 2, 2008) HOUSTON The IEEE working group for standard 1149 developed a two-pin compact test and debug solution to reduce strict pin-count, package size, and power constraints. Texas Instruments Inc. is driving ratification on IEEE 1149.7.
Dell Offers Information to Supply Chain in Hopes to End Lead-Free Hassles
Dell Senior Manager Dr. Randy Schueller needed to address server board field failures. His research led him to the realization that lead-free HASL, a seldom-used surface finish, was the best way to solve Dell's problems. His 2007 award-winning paper was written not only to document his work, but to help his suppliers better understand why they might benefit from investing in lead-free HASL. Schueller also discusses his company's perspective on immersion silver.
2008 SMTA Hutchins Grant Awarded to PBGA Reliability Student
(August 28, 2008) MINNEAPOLIS The 2008 Charles Hutchins Educational Grant recipient, Lei Nie, a graduate student in the field of mechanical engineering at the University of Maryland, has been selected by the SMTA Grant Committee for her project entitled "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process."
SCS Debuts Adhesion Promotion Technology
(August 28, 2008) INDIANAPOLIS Specialty Coating Systems (SCS) announced a new adhesion promotion technology, AdPro Plus, developed to improve adhesion of Parylene conformal coatings to various substrates. Strong adhesion of Parylene is critical to enable the coating to provide maximum benefit to the application.
Allied Adds Next-day Kitting Service
(August 27, 2008) FORT WORTH, Texas Allied Electronics has expanded its value-added services to include next-day kitting service. Customers can now order kitted products, such as Amphenol Industrial 97 Series connectors, and have them shipped within the next business day.
Essemtec Premiers Automated Printer with Sideways-moving Loading Drawer
(August 27, 2008) AESCH, Switzerland Essemtec AG debuted SP200-AV2, a new model of its automated stencil printer SP200. The printer is an advanced version of the previous-generation system and reportedly offers increased robustness, precision, and ease of use.