Article Highlights
3D Printing and Medical Electronics: A Disruptive Beneficial Technology
12/11/2018 | Dan Feinberg, Technology Editor, I-Connect007
What is ESD and Why Should We Worry About It?
12/10/2018 | Pete Starkey, I-Connect007
Greg Vance on SMTA Ohio Chapter Updates
12/05/2018 | I-Connect007 Editorial Team
Electrolube on Managing Thermal Interfaces and Conformal Coatings
12/03/2018 | Pete Starkey, I-Connect007
Understanding the Benefits of CFX
11/30/2018 | Stephen Las Marias, I-Connect007

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FINE LINE, LPKF Partner for Laser-cut Stencils

(June 3, 2008) COLORADO SPRINGS, Colo. — FINE LINE STENCIL, a division of FCT Assembly, introduced a line of laser-cut stencils in partnership with LPKF. The laser-cut stencils accommodate designs with aperture pitches down to 0.4 mm.

Universal Brings AdVantisX to Asia

(June 3, 2008) BINGHAMTON, N.Y. — Universal Instruments introduced the newest platform in the Advantis pick-and-place series, AdVantisX, to the Asia market, for customers interested in low-cost, repeatable performance.

MYDATA Acquires German Distributor

(June 3, 2008) BROMMA AND STOCKHOLM, Sweden — MYDATA has acquired its German distributor Royonic, an established partner to the equipment manufacturer in the German SMT market. The acquisition is part of MYDATA's strategy to develop and expand business in Germany.

EFD Debuts Vacuum Pickup for Manual Assembly

(June 2, 2008) EAST PROVIDENCE, R.I. — EFD, a business of Nordson Corporation, released the ProcessMate PM100 vacuum pickup system to safely lift and position small or delicate parts in benchtop assembly processes.

Creative Materials Launches Reworkable Adhesive

(June 2, 2008) TYNGSBORO, Mass. — Creative Materials Inc. introduced a flexible, reworkable, electrically conductive adhesive that adheres to most silicone and fluorinated substrates. The product, named 102-32, boasts good low-temperature performance and broad application.

atg/LM Intros Octal-density Grid Tester

(June 2, 2008) WERTHEIM, Germany — atg Luther & Maelzer GmbH, in cooperation with the Capital Equipment Group (CEG) of Everett Charles Technologies, launched the LM800 Picomat universal grid tester for bare boards. LM800 Picomat is an octal density (35 mil) universal grid tester for high-technology PCBs.

Call for Papers: APEX 2009

(June 2, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries invites researchers, academics, technical experts, and other industry leaders to submit abstracts for the 2009 IPC APEX EXPO, to be held in Las Vegas, March 29 through April 2, 2009.

SMTA Chooses San Diego, CA to Host SMTAI 2009

The SMTA has announced that the highly respected SMTA International Conference and Exhibition will be held in San Diego, CA, October 4-8, 2009. The SMTA Board of Directors felt that to meet the needs of all members it was important to periodically have a presence on the West Coast.

Endicott Interconnect Technologies Hosts IPC Technology Interchange Event

Endicott Interconnect Technologies, Inc. (EI) hosted an IPC sponsored event entitled, "Will You Be Ready?: An Endicott Technology Interchange," on Wednesday, May 14, 2008.

Balver Zinn Offers Cobar Lineup in Germany

(May 30, 2008) BREDA, Holland — Cobar solder paste, fluxes, other soldering chemicals, as well as technical support, are now available directly through the Balve, Germany, installation of its parent company, Josef Jost GmbH & Co.KG (Balver Zinn), in addition to Cobar Europe's existing distribution network.

IPTE Debuts In-line Test Handler

(May 30, 2008) GENK, Belgium — IPTE added to its multifunctional test handler line, introducing the Multi Test Handler for parallel operation for test or flash programming. The system offers reportedly flexible automation settings to integrate with existing test equipment at line rates.

Connectronics Romania Expands, Opens New Plant

Connectronics Romania, a part of the Belgian Connect Systems Group, has opened a new production plant in Oradea. The new plant can accommodate more than 1,000 employees.

SMTAI Hits Both U.S. Coasts

(May 29, 2008) MINNEAPOLIS — The SMTA will bring its SMTA International Conference and Exhibition (SMTAI) to San Diego, Calif., October 4–8, in 2009, moving from the 2008 Orlando location. The plan for the immediate future will be to alternate SMTAI between the East and West Coasts.

JTAG Releases ICT-integration Module

(May 29, 2008) EINDHOVEN, The Netherlands — JTAG Technologies, an Aeroflex technology partner, launched the JT 2147/AGP boundary-scan interface for use with Aeroflex high-performance in-circuit test (ICT) platforms.

MSI Reportedly Considering Sale of OEM Motherboard Business to Flextronics

Micro-Star International (MSI) is reportedly considering the sale of its motherboard manufacturing business to Flextronics, while keeping its brand motherboard business.

Mara Technologies Increases Capacity, Adds Assembleon Machines

Electronics manufacturing solutions provider, Mara Technologies Inc., has bought four additional Assembleon pick-and-place machines as a base for its latest expansion.

April Book-to-Bill Continues Positive Track

(May 27, 2008) BANNOCKBURN, Ill. — IPC's combined (rigid and flex) industry book-to-bill ratio reached 1.01 in April 2008, representing a steady positive in 2008, which began in January with a 0.97 book-to-bill ratio. The book-to-bill numbers are holding steady at a higher level than 2007, confirmed Denny McGuirk, IPC president.

NEPCON Tradeshows Begin in Vietnam

(May 27, 2008) BANGKOK, Thailand — In early May, Reed Tradex, a member of Reed Exhibitions, opened the first NEPCON event in Vietnam, joining the series of NEPCON events in Asia. NEPCON Vietnam is purported to be the country's only electronics manufacturing technology trade exhibition and conference.

Datapaq Data Logger Boasts 12 Channels

(May 23, 2008) CAMBRIDGE, U.K. — Datapaq's Q18 data logger provides 12 channels in a narrow footprint. It is said to use robust standard thermocouple (TC) connectors, for maximum ease of use and minimum cost of ownership for users.

DEK Upgrades Horizon Family

(May 23, 2008) WEYMOUTH, U.K. — DEK released a host of performance and productivity improvements across its entire Horizon product line. Upgrades affect accuracy, verification, and productivity, according to the company.

Nordson Corporation's 2Q Sales Grow 22% to $294 Million

"Nordson again experienced volume growth in every region where we operate. The largest increases came in Asia Pacific, the U.S. and Europe, where our strong local positions enable us to provide customers with leading technological solutions and unsurpassed support," continued Campbell.

EMRISE Receives Harsh-environment Contract

(May 22, 2008) RANCHO CUCAMONGA, Calif. — EMRISE CORPORATION received a $700,000 follow-on production order for electronic subassemblies from an existing international customer for use in a harsh-environment offshore drilling application.

PartnerTech: Contract Manufacturers Free Up Energy and Capital for Medical Device Companies

Medical device companies often want to focus on the development, sale and marketing of new applications. To revitalize this process, while ensuring that capital is not tied up unnecessarily, the companies may outsource production to contract manufacturers like PartnerTech.

ACE Debuts Nitrogen Peel-Off Jet

(May 21, 2008) SPOKANE VALLEY, Wash. — ACE Production Technologies Inc. introduced a nitrogen peel-off jet that can improve fine-pitch selective soldering results. It is said to mitigate wettability and bridging issues that occur with lead-free solders in wave and selective soldering systems.

IPC Initiates Scientific Dialogue on Proposed RoHS Expansion

IPC is urging all technical experts from member companies, and other stakeholders in the electronics industry, to participate in a special meeting June 18, 2008, in Brussels to discuss concerns about RoHS expansion.

Zetex Launches Bipolar Gate Drivers

(May 20, 2008) HAUPPAUGE, N.Y. — Zetex Semiconductors released the ZXGD3000 series of bipolar gate drivers, a lower-cost device that is designed for faster charging and discharging of gate capacitances than gate driver ICs.

Indium Promotes Santhanasamy

(May 20, 2008) CLINTON, N.Y. — Indium Corporation promoted Damian Santhanasamy to senior technical engineer. Based in Johor, Malaysia, Santhanasamy provides technical support to target accounts in Malaysia and Thailand.

Laird Nabs GM Award

(May 20, 2008) ST. LOUIS — Laird Technologies Inc. received the General Motors 2007 "Supplier of the Year" award for its significant contributions to GM's global product and performance achievements. The 16th annual award, themed the "Best of the Best," was presented during ceremonies in Jacksonville, Fla.

2008 Sees UMDs Rising

(May 20, 2008) SCOTTSDALE, Ariz. — Ultra mobile devices (UMDs) will grow by 72.6% in 2008, encompassing ultra mobile PCs, mobile Internet devices, a percentage of high-end smartphones, and a percentage of high-end personal media players (PMPs). The technology sector is growing as other areas, such as desktop PCs, slow in the face of macro-economic downturns, reports In-Stat.

Ovation Appoints MacRaild President

(May 20, 2008) BETHLEHEM, Pa. — Ovation Products added Neil MacRaild to the company as president. He will lead Ovation in product line expansion and growing its sales channels and global presence.

LaBarge's Tulsa Electronic Manufacturing Facility Generating Strong Sales

Ron Falk, general manager of LaBarge Inc. in Tulsa, has been in the electronic manufacturing services industry for 27 years and said their recent growth has been amazing, and running the opposite direction from most of the industry.

Global Innovation Selects Cimnet ERP

(May 19, 2008) INDIANAPOLIS — EMS provider for high-end commercial and military OEMs Global Innovation Corp. chose Cimnet Systems to provide ERP solutions to optimize its engineering operations.

IPC Counters RoHS Expansion Discussion

(May 19, 2008) BANNOCKBURN, Ill. — IPC sent a call for all technical experts in the electronics industry to participate in a special meeting on June 18, 2008, in Brussels to discuss their concerns about a proposed RoHS expansion. Plans call for representatives of the European Commission to attend.

Asymtek Launches Spectrum S-822 Dual-Shuttle Dispenser

(May 19, 2008) CARLSBAD, Calif. — Asymtek, a Nordson company, introduced the Spectrum S-822 dispensing system with dual-shuttle stages to increase the productivity achieved in CSP underfill and other advanced electronics applications. The S-822 is a stand-alone system with controlled precision dispensing capabilities.

Ten Minutes After

The IPC Printed Circuits Expo, APEX and the Designers Summit 2008 had barely opened on its first day before Charlie Capers became the unofficial first purchaser of the week. Find out what Trilogy Circuits purchased, why they purchased it and how small businesses approach spending at a trade show.

Zoiss Keynotes SMTA Harsh Environments Workshop

(May 16, 2008) MINNEAPOLIS — Edward J. Zoiss, director of R&D for Harris' Government Communications Systems and the Defense Communications and Electronics organizations will keynote the AIMS workshop, August 18 and 19 in Orlando.

EoPlex Expands for Antenna Manufacture

(May 16, 2008) Redwood City, Calif. — EoPlex Technologies disclosed $4 million additional funding to build its first full-scale production plant for the manufacture of advanced cell phone antennas. The investment brings the total for EoPlex's C-round to $12 million.

KIC Trying New Sales Approach

Freddie Chan, KIC International Sales, Inc.'s Vice President, Asia Operations, explains how his company is employing a new strategy for placing thermal profilers in reflow ovens. The company provides data that allows buyers to decide whether the price they are paying for a new oven is actually worth it according to the data procured.

Chinese Domestic Equipment Copies Can't Replace High End

The second floor of Nepcon China's main hall contains lower priced equipment, everything from pick-and-place and reflow ovens to AOI and screen printers. One printer even reportedly cost $2,500. Is this a threat to companies like Speedline? Not so, says Asia Vice President Kho Lik Wai. He explains that though these products are improving, they cannot compete for higher-end, higher volume customers.

Competing in a Crowded X-Ray Inspection Field

Less than a year after its acquisition by Nordson, YESTech introduced a new 3-D x-ray inspection system. X-ray inspection is becoming more popular as both a test protocol and among inspection suppliers. YESTech President Don Miller offers his insights into the marketplace, why x-ray inspection is becoming easier to accept among contract manufacturers and how key differentiators separate vendors.

Tyco Electronics Sells RF Unit

(May 13, 2008) PEMBROKE, Bermuda — Tyco Electronics Ltd. entered into a definitive agreement to sell its radio frequency (RF) components and subsystem business to Cobham Defense Electronic Systems, a subsidiary of Cobham plc, for $425 million in cash.

1-Source, ChipChecker Offer Anti-Counterfeit Service

(May 13, 2008) HONG KONG — Under a mutual interest in mitigating the growing problem of counterfeit and defective parts, 1-Source and ChipChecker teamed up to provide a suite of material management services for wholesale buyers of electronic components, the L-15 inspection and third-party testing service.

An Innovative Approach to Thermal Profiling

A new thermal profiler, ECD's Mega M.O.L.E. 20, promises to optimize reflow oven profiling for engineers while making life very simple for operators. While selling higher technology solutions in China has been difficult due to the focus on cost, ECD Vice President of Sales & Marketing Grant Peterson believes current market conditions will help his company's cause.

Nihon Superior Singapore Celebrates 20 Years

(May 12, 2008) OSAKA, Japan — Nihon Superior Co. Ltd. will celebrate subsidiary Nihon Superior Trading (S) Pte. Ltd.'s 20th year of business, marking the occasion on May 24 in Singapore.

Sumitomo Creates Fine-pitch COF Process

(May 12, 2008) TOKYO — Sumitomo Metal Mining Co. (SMM) is preparing for full-scale production of chip-on-film (COF) boards made using a new method that can accommodate a wiring pitch as narrow as 20 µm. The decision to boost production capacity in COF aims to respond to today's increasingly higher-definition LCD televisions, SMM reports.

PROMATION Upgrades Buffer Software

(May 12, 2008) PLEASANT PRAIRIE, Wis. — PROMATION Inc. released an enhanced software interface for its SCBL-77 vertical buffer system with last-in/first-out and first-in/first-out (LIFO/FIFO) capabilities.

Xtreme Beats the Heat

Brian Toleno, Director Technical Service for Henkel Corporation, discusses the company's PowerstrateXtreme dispensable (PSX-D) thermal interface material--an IPC Innovative Technology Center winner--other company offerings and the IPC Printed Circuits Expo, APEX and the Designers Summit's move to Vegas.

ZESTRON Expands Asia/Pacific Staff

(May 9, 2008) MANASSAS, Va. — ZESTRON added to its sales and technical support organization in the Asia/Pacific, hiring Tiow Ping Sim as South Asia sales manager.

Indium Expands Pacific Sales

(May 9, 2008) CLINTON, N.Y. — Indium Corporation added Sherwin Kobak as regional sales manager in the Pacific region. Sherwin, based in Portland, Ore., is responsible for the sales growth of Indium's soldering products throughout northern Calif., Ore., Wash., Idaho, British Columbia, Alberta, and Saskatchewan.

Kyzen Presenting Globally

(May 9, 2008) NASHVILLE, Tenn. — Kyzen Corporation will present research information and exhibit cleaning products at shows around the U.S. and internationally, including Sweden and Canada, in May 2008. Charles Pitarys and Mike Bixenman will give talks as Kyzen representatives.

VJ Electronix Hosts Open House, SMTA Forum

(May 8, 2008) LITTLETON, Mass. — VJ Electronix will open its doors for an open house, coinciding with a technical presentation on advancements in BGA rework and X-ray inspection. The event is scheduled for 5:30 to 9 PM, Tuesday, May 20, 2008.

High-Mix U.S. EMS Chinese Subsidiary Facing Changing Market

Circuit Service Inc.'s China subsidiary, Changzhou CSI, is facing several challenges in a toughening Chinese market. Senior Manufacturing Engineer Michael Serio, a Changzhou resident, offers his opinions on the pace of business in China and the "marriage" of two vastly different cultures on the Nepcon show floor.

Jisso North America Coming to Atlanta

What is Jisso and why is it important to our industry? Technical Editor Bob Neves interviews Denny Fritz, Energy Consultant for MacDermid, about Jisso North America, scheduled for this month in Atlanta, GA. Task Groups are to discuss coordination of roadmaps, standardization of technology, the status of embedded components and optoelectronics and sensible environmental regulations.

Samsung Techwin, Valor Partner

(May 6, 2008) YAVNE, Israel — Samsung Techwin and Valor Computerized Systems Ltd. established a technology partnership for integration of Samsung Techwin's pick-and-place machine interfaces into Valor's software products.

Live EDGE 2008 Launches With Tree Ceremony

(May 6, 2008) CHICAGO — Premier Farnell plc and its companies Newark, Farnell, Premier Electronics, CPC, Farnell-Newark, and MCM launched its international competition Live EDGE — Electronic Design for the Global Environment, now in its second year. This year's competition includes a full-time student category, as well as open field.

Flextronics Shares Investigational Findings on PoP and Large Format Assembly

Jenson Lee, Staff Engineer with Flextronics, delivered two papers at the SMTA China East Conference, held in conjunction with Nepcon China 2008. His first paper dealt with package-on-package as it relates to the hand-held and mobile devices market, the other with large format assembly--a process still in its infancy in China.

Essemtec Provides LED-on-Flex Line

(May 5, 2008) AESCH, Switzerland — Essemtec launched a batch manufacturing solution for customers producing sensor strips on flex PCBs with LED components. Pick-and-place LEDs and UV curing of the adhesive occur on a FLX2010-based module.

Nordson Intros UV Cure Products at RadTech

(May 5, 2008) WESTLAKE, Ohio — Nordson Corporation is debuting several UV curing technologies at RadTech UV/EB. They include low- and high-power systems, cooler operation and environmental safeguards, and technology to protect heat-sensitive substrates.

NPL's New Approach Predicts Lead-Free Solder Joints Lifetime

NPL has developed a new approach to the gathering of materials data necessary for FEA modelling of lifetime prediction for new lead-free solder joints.

Blending Eastern and Western Engineering for New Product Development

Chris Harvey, Electrolube's Technical Sales Manager, Far East Asia Export, reveals to Steve Gold how his company takes a different approach to R&D globally. Find out how the company blends Western creativity with Eastern market demands and engineering talent.

Corelis/EWA Name President and CEO

(May 2, 2008) CERRITOS, Calif. and HERNDON, Va. — George B. La Fever will take the helm as Corelis president and CEO, finalizing the transition of Corelis Inc. into EWA Technologies Inc., a wholly-owned subsidiary of the EWA corporate family of high-technology companies.

TFI Upgrades ODM Forecast, Lowers EMS

(May 2, 2008) ALAMEDA, Calif. — Technology Forecasters Inc. (TFI) issued a mid-year update to its five-year growth predictions for electronics manufacturing, with the actual 2007 data replacing estimates. TFI revised downward the forecasts for total available market (TAM) and EMS sector growth, and revised upward the forecast for ODM sector growth.

SMTAI Program Boasts 100 Tech Papers

(May 2, 2008) MINNEAPOLIS — The SMTA announced the program for its 21st annual SMTA International (SMTAI) conference, August 17–21 in Orlando, Fla. This year's program allows the attendee to choose from 24 courses, 100 technical papers, four focused symposia, and numerous free offerings throughout the conference.

Embedded ESD Technology Partnership Ready to Ramp Up

Steve Gold sits down with Lex Kosowski, President and CEO of Shocking Technologies; Robert Carter, Senior Marketing Manager with Oak-Mitsui Technologies; and George Dudnikov, Senior Vice President of Sanmina-SCI to discuss their quest to commercialize a new technology that embeds ESD protection into printed circuit boards.

TRUMPF Opens New Laser Factory in Connecticut

(May 1, 2008) FARMINGTON, Conn. — TRUMPF Inc. opened its new laser building, the Laser Innovation & Technical Excellence (LITE) Building, for research and manufacturing of new lasers and expanding production of laser resonators.

IPC, Jisso Sponsor Advanced Interconnect Seminar

(May 1, 2008) BANNOCKBURN, Ill. — IPC — and the Jisso International Council (JIC) are sponsoring a technical seminar, "Implementing Advanced Interconnect Technology Solutions," May 21–22, 2008, in Atlanta. Hosted by Georgia Institute of Technology, the event will provide information on the latest trends in interconnection technologies, led by speakers from JIC and the industry.

Lite-On Transfers Displays to Wistron

(May 1, 2008) TAIPEI, Taiwan — Lite-On Technology's Board of Directors approved the transfer of its digital display business to Wistron for around NT$9.2 billion. The transaction mostly involves the transfer of sales, assets, liabilities, inventory, equipment, IP, long-term investment, accrued warranty, and personnel.

Walking the Walk with Lean Manufacturing

Steve Williams, the Printed Circuit Board Commodity Manager for Plexus Corporation, gives some insights into lean manufacture, why it is important and how he sees it implemented (or not) among his suppliers.

Living in a Lead-Free World

Phil Zarrow and Jim Hall of ITM Consultants speak with Steve Gold about the courses they taught at APEX--including a new course that addressed what OEMs wanting leaded assemblies must watch out for in an increasingly lead-free electronics manufacturing world.

Essemtec Forms JV with Reprint

(April 29, 2008) AESCH, Switzerland — Essemprint (UK) Ltd., a joint venture of Essemtec and Reprint, will take over product rights for the SP900/Spectrum lines. The company targets functionality improvements and cost reductions in printing systems.

Unimicron Expands Taiwan Capacity

(April 29, 2008) TAIPEI, Taiwan — Unimicron Technology Corp. will spend approximately NT$4 billion ($131.6 million U.S.) on expanding its Taiwan PCB fabrication plant's capacity, according to the China Economic News Service (CENS). Unimicron cited environmental and tax laws in China as pressures undermining expansion on the mainland.

ASSET Develops Tools Ahead of IJTAG Standard

(April 29, 2008) RICHARDSON, Texas — Anticipating ratification of a final internal JTAG (IJTAG) standard, ASSET InterTech Inc. is developing and will bring to market open embedded instrumentation tools based on the preliminary IEEE standard, P1687 IJTAG.

Laird Opens India Production

(April 29, 2008) CHENNAI, India — Laird Technologies Inc. opened its first manufacturing facility in India with a dedication ceremony. U.S.-based Laird, a unit of the U.K.-based Laird Group PLC, employs over 14,000 employees in more than 40 facilities located in 14 countries. The Chennai facility will host 1,000 to 1,200 employees.

Straight Shots from a Solder Soldier

Indium Senior Technologist Dr. Ronald Lasky offers his candid opinions on key solder issues. Find out what Dr. Lasky thinks about lead-free solder reliability, the need for a SAC 305 replacement, and why halogen-free might become the biggest industry issue of 2008.

ACE Develops Lead Tinning System

(April 28, 2008) SPOKANE VALLEY, Wash. — ACE Production Technologies Inc. introduced the LTS200 lead tinning system, which converts components from tin/lead to lead-free, or vice versa, for high-reliability or RoHS-compliant products.

March Book-to-Bill Returns to Parity

(April 25, 2008) BANNOCKBURN, Ill. — IPC announced that March findings from its monthly North American PCB Statistical Program showed the book-to-bill climbing back to parity at 1.00. Shipments and bookings are up roughly 10% from March of last year.

EMS Splits from Scanfil

(April 25, 2008) SIEVI, Finland — Following similar moves by other EMS companies Nam Tai, BenQ, and Elcoteq, the board of directors at Scanfil will carry out a split of the contract manufacturer's business, with its electronics contract manufacturing business becoming a wholly owned sub-concern, Scanfil EMS Oy.

Misumi Intros Engineering Blog

(April 24, 2008) SCHAUMBURG, Ill. — Misumi USA, Inc. launched an engineering blog on its Website, The blog focuses on the latest mechanical component trends for assembly automation.

Hankuk Valence to Distribute Valor

(April 24, 2008) SHENZHEN, China — Valor Computerized Systems Ltd. appointed Hankuk Valence, a Korea-based electronics manufacturing solutions provider, to distributed its process engineering and manufacturing monitoring and control platforms in Korea.

Zollner Installs Additional Agilent AXI

(April 24, 2008) SANTA CLARA, Calif., and ZANDT, Germany — The Zollner Group, a global EMS provider, selected the Agilent Medalist x6000 automated X-ray inspection (AXI) system to enhance its test-and-inspection capabilities.

Laird Signs Distributor Altron

(April 24, 2008) ST. LOUIS, Mo. — Laird Technologies Inc. added German-based distributor Altron to sell its thermal interface, EMI, and signal integrity products.

Asymtek Intros Slider Valve for Solder Paste

(April 24, 2008) CARLSBAD, Calif. — Asymtek launched the SV-100 slider valve for solder paste dispensing. It is reportedly up to 20% faster than standard auger dispensers. For solder paste types 4, 5, and 6, it dispenses dots of less than 300 µm.

Henkel Purchases National Starch Adhesive & Electronics Materials Units

Watch exclusive video coverage of Henkel Global Marketing Manager Doug Dixon at his press presentation during APEX announcing a 3.8 billion euro acquisition. Alan Syzdek of National Starch will lead the combined businesses, which include 18 product development and 21 manufacturing sites spanning the globe.

Patch Antenna Performs with Two Frequency Bands

(April 23, 2008) FAIRVIEW, Pa. — Spectrum Control Inc. launched a single-element patch antenna that receives and/or transmits two frequency bands in one 45-mm package. This dual-frequency patch antenna is designed for space and cost savings compared to using two single-frequency patch antennae.

The Gold Record: Nepcon China, California Become Battlegrounds

Both exhibitions and environmental legislation can cause blood to boil. Find out why with a look at skirmishes taking place in both Shanghai and California.

Thin Metal Parts Adds Marketing Manager

(April 22, 2008) COLORADO SPRINGS, Colo. — Thin Metal Parts (TMP) hired Jeremy Hancock as product marketing manager, focused on increasing the market presence for TMP's expanding product capabilities through industry research, target account identification, and prospect/account analyses.

Camtek Launches High-density PCB AOI Series

(April 22, 2008) MIGDAL HAEMEK, Israel — Camtek Ltd. unveiled its Mustang line of automated optical inspection equipment targeting high-density PCBs used in mobile consumer products, such as cell phones and digital cameras. Mustang systems track defect types during inspection and handle a range of panel sizes and types.

Research and Markets Report: Printers

(April 22, 2008) DUBLIN, Ireland — Research and Markets Ltd. released its study on the global SMT screen printer market, including trends, challenges, geographic distribution, and other data. The report forecasts revenue in screen printers by region and by printer type.

Balver Zinn Enters Chinese Market

Business Development Manager Paul Salmon discusses his company's first foray into the vast China market. Find out how the privately held company is taking a measured approach to its Chinese venture.

Henkel Launches Harsh Environment Silicone

(April 21, 2008) IRVINE, Calif. — Henkel launched its Loctite 5210 fast cure thixotropic silicone material for devices in harsh environments. With improved production throughput, operating temperature flexibility, and storage, Loctite 5210 offers a reportedly cost-effective alternative to traditional hot-melt glues or other silicones.

Macrina Joins Microscan

(April 21, 2008) RENTON, Wash. — Microscan Systems Inc. appointed John Macrina as global VP of sales and service, effective at the beginning of May 2008. In January 2008, Jeff Timms (formerly of Siemens) joined Microscan as president.

Morey Corp. CTO Keynotes PCB East

(April 21, 2008) WOODRIDGE, Ill. — The Morey Corporation's chief technology officer (CTO), Emad S. Isaac, will keynote PCB East 2008, May 11 to 16 in Tinsley Park, Ill. He will address how an electronics manufacturing and assembly company identifies inherent design problems and develops best practices for communicating upstream to improve layout and manufacturability, along with other issues facing assemblers.

SMTA Boston Hosts XRF Summit

(April 21, 2008) BOXBOROUGH, Mass. — The SMTA's Boston chapter will bring together presenters from various inspection companies to discuss handheld X-ray fluorescence (XRF) devices at its meeting in Boxborough, Tuesday, April 22. The technical presentation, "Understanding and Effectively Using Handheld XRF Technology for Components and Materials Inspection," will include information on WEEE and RoHS substance levels, speed and accuracy of analyses, and system features.

Instructor Bob Willis Takes a Look at the Latest Assembly Issues

Noted industry technologist Bob Willis details some of the pressing questions his students asked during his classes at the IPC Technical Conference.

TRI, ASSET Integrate Test Solutions

(April 18, 2008) RICHARDSON, Texas and TAIPEI, Taiwan — ASSET InterTech Inc. will integrate its boundary scan test solutions into Test Research Inc.'s (TRI's) in-circuit test (ICT) systems. The partnership targets reduced test costs for equipment manufacturers because boundary scan tests can be reused throughout every phase of a product's life cycle.

The Best of the EMS Industry: IPC Innovative Technology Center Winners

We're highlighting the EMS industry winners of the IPC Innovative Technology Center Award--find out why each won this exciting recognition.

IPC Names Global Board Members

(April 17, 2008) BANNOCKBURN, Ill. — IPC revealed its recently elected Board of Directors. New chairman Nilesh Naik, CEO, OneSource Group (Texas), was elected. The new members — Rex Rozario, executive chairman, Graphic Plc (U.K); Zhou Xin, senior director, advanced technology R&D, Huawei Technologies (China); and Robert Black Jr., president and CEO, Juki Automation Systems, Inc. (N.C.), represent the global membership and global marketplace IPC serves.

Chinese Domestic Equipment Copies Can't Replace High End

The second floor of Nepcon China's main hall contains lower priced equipment, everything from pick-and-place and reflow ovens to AOI and screen printers. One printer even reportedly cost $2,500. Is this a threat to companies like Speedline? Not so, says Asia Vice President Kho Lik Wai. He explains that though these products are improving, they cannot compete for higher-end, higher volume customers.

Competing in China on One's Own Terms

Rather than submitting to the "grab market share at any cost" mindset many competitors seem to embrace in China, Europlacer Group Managing Director Derek Gaston explains how his company is employing the same model it uses for profitability in the western world in the Chinese market.

SMTA Partners with MentorNet

(April 15, 2008) MINNEAPOLIS — The Surface Mount Technology Association (SMTA) formed a partnership with MentorNet to facilitate mentorship opportunities for its student members. The partnership allows members of the SMTA privileges to resources offered by MentorNet such as its one-on-one program, easy matching to SMTA members, and the resume database for students.

Cool Polymers Launches Heatsink Line

(April 15, 2008) WARWICK, R.I. — Cool Polymers Inc. introduced its next-generation thermally conductive injection-mold thermoplastics for heatsinks and thermal management solutions. The proprietary CoolPoly grades provide no antenna effect as metal heatsinks can, and are said to be up to 50% lighter than aluminum designs.

Microelectronics Center Opens at EI

(April 14, 2008) ENDICOTT, N.Y. — The Center for Advanced Microelectronics Manufacturing (CAMM), located at the Endicott Interconnect Technologies Inc. facility in Endicott, was inaugurated in late March, in a ceremony attended by business, political and community leaders. A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll format.

Video - Are Mid-Sized Chinese EMS Companies Being Squeezed?

Speedy-Tech Electronics was recently acquired by IMI, a multinational EMS company. IMI's Alex Kot explains his compaany is trying to overcome several challenges, including retention of employees and reduced government incentives.

After Divestiture, Universal Plans Focused Approach to Global Market

CBA Croup Chairman and CEO Dr. Jean-Luc Pellissier joins EMS007 Editor Steve Gold for a discussion of the Vitronics-Soltec divestiture, the company's re-focusing effort, and how the R&D legacy in Binghamton must be relied upon for future growth to occur.

SMT China Hosts 2ndVISION Awards

(April 10, 2008) SHANGHAI, China — "China, despite the competition from neighborhood countries, appreciation of the RMB, tightening of government regulations; China's GDP is still growing at double digits," said Adonis Mak, group publisher, SMT China, during the magazine's presentation of its second annual VISION awards at Nepcon China. Winners received honors in SMT equipment, excellence in a specific metric, and China-centric awards. Following are the winners.

HP Consolidates Facilities Globally

(April 10, 2008) PALO ALTO, Calif. — HP will implement a major consolidation of facilities and security vendors for most of its worldwide facilities. This is expected to save tens of millions of dollars over the life of the new contracts, according to HP representatives.

Video: Dr. Ron Lasky Discusses RoHS, Halogen-free and Lead-free Solders

WEEE, RoHS and Green are here to stay. Interest in halogen free solders and assembly continues to grow, even in spite of the controversy of whether or not it is a valid green issue for solder.

Nepcon China Kicks Off in Shanghai

(April 8, 2008) SHANGHAI, China — Nepcon China, April 8–11 in Shanghai, will feature China-based and international exhibitors targeting the evolving Asia manufacturing base. Traditional low-mix/high-volume, medium- to high-mix/high-volume, and test-and-inspection are the focus of many exhibitors in this market. Following are some top products to look for at the show.

Moscow Event Draws International Exhibitors

(April 8, 2008) MOSCOW — ExpoElectronica exhibition and conference will take place April 15–18, 2008, in Moscow. ExpoElectronica is an officially audited tradeshow targeting electronics assembly operation in Russia and Eastern Europe. The show drew exhibitors from 21 countries in 2007. Following are some of the product highlights for the 2008 event.

Plexus - Walking the Walk with Lean Manufacturing

Steve Williams of Plexus gives some insights into lean manufacture, why it is important, and how he sees it implemented (or not) among his suppliers.

Mentor, Agilent Pair Up for RF Design

(April 7, 2008) WILSONVILLE, Ore. and SANTA CLARA, Calif. — PCB design tool provider Mentor Graphics Corp. and Agilent Technologies Inc. jointly developed an RF design solution to improve productivity for the design of RF circuits on PCBs. The partnership targets shorter PCB design cycle times with increased collaboration, particularly in mixed-technology designs, which incorporate RF, analog, and digital components.

From the Show: IPC News Wraps Up APEX

(April 4, 2008) LAS VEGAS — IPC Printed Circuits Expo/APEX/Designers Summit, this week in Las Vegas, provided an international platform for diverse launches — in technology, collaborations, and products. IPC also unveiled several initiatives and awards at the show, including a joint symposium with the SMTA, volunteer and corporate honors, and best papers. APEX 2008 has come to a successful close, and IPC will return the show to Las Vegas in 2009.

Flextronics R&D Pushes Industry Forward

Dr. Dongkai Shangguan and Aaron Unterborn sit down in the Real Time with...IPC studio for an update of Research and Design activities Flextronics over the past year and the content of an award-winning technical conference paper.

Henkel Purchases National Starch Adhesive and Electronics Materials Units

National Starch's Alan Syzdek will lead the combined businesses, which include 18 product development and 21 manufacturing sites spanning the globe. The move also strengthens Henkel's Asian presence--a key factor in combining the purchase of both the Emerson & Cuming and Abelstik product lines.

From the Show: Henkel Acquires Adhesives Businesses

(April 3, 2008) LAS VEGAS — Henkel Corporation announced at APEX that they've acquired Ablestik and Emerson & Cuming for approximately $6 billion from National Starch. The companies will become part of Henkel's adhesives group, bringing in die attach, board-level interconnect, and related materials, along with intellectual property (IP) and a global manufacturing base.

Video - Susan Mucha: EMS Selling Strategies

Susan Mucha discusses her presentation and how EMS providers must choose their customers wisely. She also discusses the release of a new book detailing EMS sales strategies.

From the Show: Designing for U.S. Volume Manufacturing

(April 2, 2008) LAS VEGAS — The standard mantra of the electronics manufacturing industry is that any volume of manufacturing will head overseas, and prototyping and new product introductions will stay domestic. While that argument holds true in many cases, certain exhibitors at the IPC Printed Circuits Expo/APEX/Designers Summit, taking place this week in Las Vegas, are introducing methods to keep larger-volume manufacturing in the U.S. and Europe.

From the Show: Inspection Takes on Limited Access

(April 2, 2008) LAS VEGAS — Test-and-inspection is a key segment of functional, successful SMT operations. At this year's IPC Printed Circuits Expo/APEX/Designers Summit exhibits, inspection-and-test equipment providers are displaying new solutions to deal with miniaturized components, leadless and BGA packages, and RoHS/anti-RoHS screening requirements.

From the Show: APEX Opens

(April 1, 2008) LAS VEGAS — The IPC Printed Circuits Expo/APEX/Designers Summit opens today, April 1, with new product introductions, partnership announcements, and live product demonstrations taking center stage.

ANSYS Acquires EDA Provider Ansoft

(March 31, 2008) SOUTHPOINTE, Pa. and PITTSBURGH — ANSYS Inc. will buy Ansoft Corporation for approximately $832 million in a mix of cash and ANSYS common stock, leading to a combined software provider with trailing 12-month revenues of $485 million. The acquisition of Ansoft is ANSYS' first foray into the broader EDA software industry.

From the Show: APEX Cleaning & Alternatives Subcommittee

(March 30, 2008) LAS VEGAS — The exhibition hall doesn't open until Tuesday, but the IPC APEX technical conference is underway today, with the Cleaning and Alternatives Subcommittee taking place from 8 to noon. Mike Bixenman, DBA, Kyzen and William Kenyon, Ph.D., Global Centre Consulting, host the session, part of the Standards Development Meetings at the tradeshow in Las Vegas. Following is a brief description of the committee goals.

EI, Unimicron Partner in Organic Substrates

(March 28, 2008) ENDICOTT, N.Y. — Endicott Interconnect Technologies Inc. (EI) entered into a sales and manufacturing agreement with Unimicron Technology Corp. to produce CoreEZ organic substrates at one of Unimicron's Taiwan facilities. The PCB maker will supply high volumes of CoreEZ products under EI specs and requirements.

February Book-to-Bill Rises to 0.99

(March 27, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries found that the February book-to-bill ratio for rigid and flex PCBs rose to 0.99, near parity. A rise in rigid PCB bookings drove the increase from 0.97 in January.

Jabil Reports Second Quarter Results, Lowers Expectations for 2008

"We expect revenue in the second half of fiscal 2008 to be consistent with the first half of the year, resulting in a year of modest growth but below our previous expectations. It appears the slowdown in end markets will reduce our growth rate and impede margin expansion for the next quarter or two."

Technical Highlights: APEX

(March 25, 2008) LAS VEGAS — Technical presentations will take center stage at IPC Printed Circuits Expo/APEX/Designers Summit, April 1–3 in Las Vegas. Following are previews of select presentations taking place at the show, as well as links to other aspects of the technical program.

P. Kay Metal Sharpens China Sales Strategy

A video interview with China Sales Manager Hardy Huang discusses why dross removal chemistry can succeed in a cost-conscious Chinese market.

Agilent Launches Blended Test Technology

(March 24, 2008) SANTA CLARA, Calif. — Agilent Technologies Inc. will demonstrate a hybrid boundary scan and VTEP vectorless test solution, Cover-Extend, at APEX in Las Vegas, April 1–3 and Nepcon China in Shanghai, April 8–11, launching under its VTEP v2.0 Powered suite. Cover-Extend technology allows in-circuit test (ICT) without physical test points, recovering up to 50% of test node access and protecting assemblies.

Siemens Divests Electronics

(March 21, 2008) FRANKFURT, Germany — Thomson Financial reports that a spokesman for Siemens AG confirmed the company's plans to divest its electronic assembly systems unit by the end of this year. EA makes assembly machines for electronic components and circuit boards.

ITW Completes Vitronics Soltec Acquisition

(March 21, 2008) STRATHAM, N.H. — Illinois Tool Works (ITW) acquired Vitronics-Soltec from Francisco Partners, adding the soldering equipment company to other holdings in the SMT space, such as Kester and Speedline. Financial amounts were not disclosed.

Celestica Announces Two Senior Leadership Appointments

Appointments will position Celestica for future success and enable the company to deliver an integrated, end-to-end supply chain solution to its customers

IPC Launches PCB Assembly Show in Shanghai, China

Partnering with Messe Munchen, the IPC Assembly Show will become part of Productronica China co-located with the CPCA Show and Semicon China.

Intel Honors 13 Companies with Supplier Quality Awards

(March 19, 2008) SANTA CLARA, Calif. — Intel Corp. has named the 13 winners of the company's most prestigious award for suppliers: the Supplier Continuous Quality Improvement (SCQI) award. The honor, bestowed for outstanding commitment to quality and performance excellence in 2007, recognizes companies that provided products and services deemed essential to Intel's business success. Intel has also given thirty-five 2007 Preferred Quality Supplier (PQS) awards.

Novagard Releases Potting, Encapsulant, Conformal Coating Series

(March 19, 2008) CLEVELAND — Novagard Solutions released RTV 800 Series UV/dual cure and UV gels for use in potting, encapsulating, and conformal coating of delicate components, PCBs, lighting assemblies, and various wiring/current-carrying electrical devices. Cure speeds can be less than 3 sec.

Nunes Offering Green SMTAI Keynote

(March 18, 2008) MINNEAPOLIS — The SMTA Annual Meeting and Awards Ceremony at SMTA International (SMTAI), August 20, 2008, in Orlando, Fla., will feature a keynote presentation by Sharon Nunes, Ph.D., VP, Big Green Innovations, IBM Systems & Technology Group (STG). In her talk, Nunes will discuss IBM's approach to environmental challenges globally, and highlight ways that IBM is helping to tackle some of these important issues.

YESTech Names Regional Sales Manager

(March 18, 2008) SAN CLEMENTE, Calif. — YESTech Inc., a business of Nordson Corporation, added Scott Roberson as a regional sales manager, responsible for managing sales activity in the southern U.S. and overseeing YESTech's AOI product line for microelectronics applications.

Valor, Nagoya Partner on Inspection

(March 18, 2008) YAVNE, Israel and TOKYO — Valor Computerized Systems Ltd. established a technological partnership agreement with Nagoya Electric of Japan, which develops advanced automatic inspection equipment. The companies will integrate ODB++ PCB modeling and Valor's Part Library (VPL) onto Nagoya systems to shorten inspection setup times.

Matheson Tri-Gas Acquires Five Star Gas

(March 18, 2008) BASKING RIDGE, N.J. — Matheson Tri-Gas Inc. completed its purchase of Five Star Gas & Gear, adding five branches in southern California. The acquired company will become a part of the Matheson Tri-Gas Industrial Gas Group business unit. The move is in line with Matheson Tri-Gas's strategy to expand in the U.S. as a vertically integrated gases supplier, said William J. Kroll, chairman, president, and CEO, Matheson Tri-Gas, and executive director, Taiyo Nippon Sanso.

Oeko-Institut Calls for Industry Input on RoHS Review

The Oeko-Institut e.V., which is under contract to the EU for the review of the RoHS, has drawn up a list of 46 substances for scrutiny, and is calling for industry input regarding the list of substances to be further analyzed.

Screaming Circuits Blog Hits 200 Articles

(March 17, 2008) CANBY, Ore. — Screaming Circuits has reached the 200-article mark on its design engineering blog, The blog was created as a resource to help electrical design engineers solve board layout and assembly problems.

ECT Manager Receives the Patriot Award

(March 17, 2008) POMONA, Calif. — Joe Burns, operation manager, contact products group (CPG), Everett Charles Technologies (ECT), was honored with the Patriot Award during a ceremony at ECT's Ostby Barton division in Warwick, R.I.

Custom Connectors Use FR4

(March 17, 2008) SAN DIEGO — Autosplice will provide a custom connector fabrication service to prototypers through volume manufacturing, incorporating FR4 headers rather than special moldings. The company asserts that FR4 optimizes flexibility, costs, reliability, and lead times. Connectors are panelized and available in various thicknesses and with a range of pins/terminals.

Nepcon China Approaches

(March 17, 2008) SHANGHAI, China — Nepcon China, April 8–11 in Shanghai, will feature recent product releases from Chinese and global companies. Following are product previews from Kyzen, Kester, and a host of other exhibitors, as well as program previews from SMTA China, who will run events in conjunction with Nepcon.

Viscom Opens Applications and Training Center in Mexico

(March 15, 2008) DULUTH, Ga. — Viscom opened an applications and training center in Guadalajara, Mexico. The center, which features an AOI and X-ray applications lab, as well as training facilities and a demo room, was established to meet increasing demand in the Mexican electronics market.

RMD Expands Americas Representation

(March 14, 2008) WATERTOWN, Mass. — RMD Instruments LLC formally appointed Southwest Systems Technology Inc. as its manufacturing representative for La., Okl., Ark., N.M., and Mexico. The company named Advanced Precision Sales/WittcoSales as its manufacturing representative for territories within southern Calif./Baja.

SME Reveals Innovations Initiative

(March 14, 2008) DEARBORN, Mich. — The Society of Manufacturing Engineers (SME) announced a member-driven initiative, "Innovations That Could Change The Way You Manufacture," to outline emerging technologies that are making a positive impact on manufacturing, provide an educational framework for SME members and manufacturing practitioners to keep up-to-date on the industry's latest, and showcase advancements.

Textron Hosts SMTA Tour

(March 14, 2008) WILMINGTON, Mass. — Textron Defense Systems will host an SMTA technical presentation, "Understanding and Effectively Using XRF Technology for Components and Materials Inspection," including XRF demo, definition of capabilities, and an SMT facility and product showcase tour. Attendance is limited to the first 70 registrants.

YESTech Expands in China

(March 14, 2008) SAN CLEMENTE, Calif. — YESTech Inc. opened a new location in Shanghai, China, co-located with parent company Nordson's China facility at the Zhangjiang Hi-Tech Park in Pudong. The 8,000-sq.m. facility houses around 200 employees and operates as a "Center Of Excellence." Each division hosts a specialized customer demonstration lab.

KSR Adds Genesis Platform

(March 14, 2008) BINGHAMTON, N.Y. — KSR International selected the Genesis GC-120Q placement platform from Universal Instruments to meet objectives for in-house assembly speed and flexibility in a high-volume environment. KSR designs and manufactures electronics modules, controls, and closures for the transportation industry.

CTS Corp Acquires Orion Manufacturing

"Orion has built a solid track record of providing competitive, on-time quality manufacturing services. Its business model complements CTS' EMS business and enhances our ability to add value in our target markets."

Assembléon, Valor Form Technology Partnership

(March 13, 2008) VELDHOVEN, the Netherlands and YAVNE, Israel — Assembléon BV and Valor Computerized Systems Ltd. have established a technology partnership, beginning by integrating Assembléon's pick-and-place machine interfaces into Valor's software products. Enhanced machine interfaces are available for Valor's process engineering control tool vPlan on Assembléon's A-, M-, and X-Series machines.

SMTA China Helps Raise Overall Competency Level of SMT Industry, Sponsors Engineer Certification Program

SMTA China announces that it will sponsor the upcoming SMTA Certified SMT Engineering Course and Examination from 8-10 April 2008 in Shanghai in conjunction with NEPCON China 2008.

SMTA China Sponsors Certifications at Nepcon

(March 12, 2008) SHANGHAI, China — SMTA China will sponsor the SMTA Certified SMT Engineering Course and Examination, April 8–10 in Shanghai, in conjunction with NEPCON China 2008. SMTA China and ChinaECNet will organize the first course jointly with support by NEPCON China 2007.

Silicon Forest Electronics Extends Global Manufacturing Reach, Partners with ACW Technology

Partnership Gives Customers Access to Global Manufacturing and Supply Services Across the UK, US and China.

IPC Names APEX's ITC Winners

(March 11, 2008) BANNOCKBURN, Ill. IPC — Association Connecting Electronics Industries chose products to highlight in the Innovative Technology Center (ITC) at the 2008 IPC Printed Circuits Expo/APEX/Designers Summit, April 1–3 in Las Vegas, showcasing new and emerging technologies from all segments of the electronic interconnect industry.

Multitest Delivers 1st MT2168

(March 10, 2008) ROSENHEIM, Germany — Multitest's MT2168 pick-and-place handler, which debuted at Semicon Europe 2007, was delivered to the first customer.

COTS Manufacturer Chooses XJTAG

(March 10, 2008) CAMBRIDGE, U.K. — Commercial off the shelf (COTS) and board-level designer/manufacturer Curtiss-Wright Controls Embedded Computing selected the XJTAG boundary scan development system to improve the process of debugging and testing its range of radar, video, and graphics products.

Nihon Superior, University of Queensland Collaborate

(March 10, 2008) OSAKA, Japan — Nihon Superior Co. Ltd. is collaborating with the University of Queensland (Australia) in the investigation of the growth and properties of the intermetallic compounds that form between solder alloys and the soldered substrate. The company sponsors research on lead-free solder at the university.

IPC Releases Board Ballot

(March 10, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries announced nominations for the IPC Board of Directors elections, which will take place at the IPC Annual Meeting luncheon, April 1, 2008, in Las Vegas, during APEX. Three officer and 10 director positions are open for election on IPC's Board for the period of April 2008 through March 2010.

Sono-Tek Creates Strategic Business Units

(March 10, 2008) MILTON, N.Y. — Sono-Tek Corporation formed two strategic business units (SBUs) reporting to Joseph Riemer, Ph.D., president. The SBUs comprise electronics and advanced energy, and ultrasonic coating solutions. The company also hired additional sales and applications development staff to complement the realignment.

IPC/JEDEC Plan March Reliability Conference

(March 7, 2008) RALEIGH, N.C. — IPC and JEDEC will present the International Conference on Reliability, Rework, and Repair of Lead-free Electronics, March 11–12, 2008, in Raleigh. This conference was planned to address the issues faced as a result of implementing a lead-free process, such as alloy choices, component compatibility, and solder concerns.

SMTA Awards PanPac Best of Conference

(March 7, 2008) MINNEAPOLIS — The Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition took place January 22–24, 2008 in Kauai, Hawaii. Speakers at PanPac promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. As rated by the attendees, "Best of Conference" was awarded to two presenters this year.

Plexus Receives Thermal Imaging Contract from Irisys

The multi-million pound contract is initially for the manufacture of the company's thermal imagers and is expected to develop to include people counting systems later this year.

Sono-Tek Debuts Enhanced Website

(March 6, 2008) MILTON, N.Y. — Sono-Tek Corporation released a new company Website, located at and Additional pages were added to the Sono-Tek site, focusing primarily on new ultrasonic spray fluxing products, solder recovery systems, and several new industries of growth into which Sono-Tek is expanding.

Trident Launches Inkjet for Printed Electronics

(March 6, 2008) BROOKFIELD, Conn. — Trident introduced the 256Jet-D inkjet print head globally, highlighting a durable, serviceable design and stainless steel construction. The print head enables various direct write, printable electronic applications with up to 5× higher resolution than screen printing, according to the company. The 256Jet-D suits printing traces, contacts, embedded passives, and components on PCBs, as well as flexible photovoltaics, fuel cells, and batteries.

Pre- vs. Post-reflow AOI Debate at APEX

(March 5, 2008) LAS VEGAS — Pamela Lipson, Ph.D., CEO, Imagen Inc. (Cambridge, Mass.) and Lyle Sherwood, VP and technical director, Landrex Technologies (Santa Clara, Calif.) will debate the impact of inspection pre- or post-reflow for electronics assemblers at APEX, April 1–3 in Las Vegas. Resources generally limit facilities to using inspection systems at select stages in manufacturing. Lipson and Sherwood will discuss the merits of deploying AOI prior to reflow or after.

PROMATION Intros High-volume Gate

(March 4, 2008) PLEASANT PRAIRIE, Wis. — PROMATION released an enhanced Passageway Gate system, the SCBL-77G, designed for high-volume production. The SCBL-77G offers a small footprint with a vertical buffering station to enable continuous production with the gate in use.

Hwang to Keynote "Women's Art, Women's Vision"

(March 4, 2008) WASHINGTON — Jennie Hwang, Ph.D., will keynote the celebration of Women's History Month organized by DoD Defense Supply Center, Federal Women's Program. The program theme is "Women's Art, Women's Vision." The luncheon, in conjunction with the Federal Woman of the Year award presentation, will take place March 26, 2008, at Whitehall Recreation Center.

Cobar Offering Bar Solder, SN100C Alloys in U.S.

(March 4, 2008) LONDONDERRY, N.H. — Cobar Solder Products, now part of the Balver Zinn Group, added bar solder and other solder products, including SN100C alloys, to its product offering of solder pastes, fluxes, and cored wire solders to U.S. electronics manufacturers. The additional products suit wave, selective, tinning, and similar applications.

ECD Appoints Asia Management

(March 3, 2008) MILWAUKIE, Ore. — ECD added E.H. Lim to handle sales and channel management in Asia. Lim was previously sales director for Vitronics-Soltec, responsible for its South Asia/Pacific sales region.

Myny Named Marketing Director of Koh Young

(February 29, 2008) SEOUL, South Korea — André Myny was appointed global marketing director of Koh Young Technology Inc. Myny has more than 10 years experience in the global circuit board assembly market.

Kyzen to Exhibit at ElectroTech 2008

(February 29, 2008) NASHVILLE — Kyzen Corporation will showcase AQUANOX A4625B and AQUANOX A4651US in representative Esman's booth D-120 at the ElectroTech Exhibition, February 28 to March 2, 2008 in Istanbul, Turkey.

January Book-to-Bill Below 1.00

(February 29, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics announced the January book-to-bill ratio for flexible and rigid PCBs fell below parity, ticking down to 0.97. The lower book-to-bill is typical of January, according to IPC, and should not be considered a downward trend.

Siemens E&A Appoints Americas Electronics VP

(February 29, 2008) NORCROSS, Ga. — Siemens Energy & Automation Inc. appointed Leonard D. Garrison II (Butch) as VP and GM, Electronics Assembly Systems Division (EA), effective immediately. Garrison was named acting VP in December 2007.

SMTA Opens Hutchins Grant Applications

(February 29, 2008) MINNEAPOLIS — The SMTA will accept applications for the $5000 Charles Hutchins Educational Grant through April 14, 2008. The grant is awarded annually to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field. Applicants must hold a student membership in the SMTA.

Scanfil to Boost EMS Business, Changes Strategy

The goal is to increase the contract manufacturing business with the company arrangement and by investing the retained earnings in areas of new business.

Electrolube Expands in U.S.

(February 28, 2008) NOVATO, Calif. — Electrolube, a division of HK Wentworth Ltd., opened corporate offices in Calif. and an operations center in Chicago as part of its Americas expansion plan. The company will build distribution, sales and marketing, and technical support from these U.S. bases.

RGT to Take Controlling Stake in Canadian EMS Provider Adeptron

"RGT provides the combination of a growth oriented strategic EMS industry player and a strong financial backer. RGT is committed to supporting Adeptron's vision of vertical integration and growth through M&A activity along with strong organic business development efforts."

SMTA's 1st President Passes

(February 27, 2008) MINNEAPOLIS — Norb Socolowski, first president of the SMTA and industry icon, passed away on February 14, 2008. He was 85. Norb is survived by wife Jean, who asks that any donations made in his memory be sent to the SMTA's Hutchins Educational Grant.

ZESTRON America Exhibiting at Houston SMTA

(February 27, 2008) MANASSAS, Va. — ZESTRON America will participate in the Houston SMTA Vendor Show and Technical Program, March 7 in Houston, Texas.

Henkel Nabs Prime Source Awards

(February 27, 2008) IRVINE, Calif. — The electronics and industrial groups of Henkel have been awarded "Prime Source Awards" from electronics distributor EIS (Atlanta, Ga.) The award ceremony included Jim Sharp, electronics group southeastern territory manager, Henkel; Ken Helfers, industrial group distribution account executive; and Bob Thomas, president and CEO, EIS.

Sono-Tek Assigned MediSonic Patent

(February 27, 2008) MILTON, N.Y. — Sono-Tek Corporation received a patent for MediSonic, a system of depositing thin organic films on complicated substrates, by the USPTO.

Winland Reforms Manufacturing and Operations to Support Growth Objectives

The restructuring is intended to support more aggressive EMS growth objectives and also better align the company to its 2008 and 2009 initiatives.

SMTA Discusses Counterfeit Components

(February 26, 2008) BOSTON — The SMTA Boston Chapter will host a technical presentation on fraudulent and counterfeit components March 4 in Boxborough, Mass. Don Trenholm will lead the talk.

Nihon Presents on Lead-free at APEX

(February 26, 2008) OSAKA, Japan — Nihon Superior Co. Ltd. is contributing a paper, "Properties that are Important in a Lead-free Solder," to the technical conference at IPC Printed Circuit Expo/APEX/Designers Summit, April 1–3, 2008, in Las Vegas.

EI Recognizes Patenting Achievements

(February 26, 2008) ENDICOTT, N.Y. — Endicott Interconnect Technologies, Inc. (EI) honored 32 employees for patent applications filed, 23 employees for U.S. patents issued, and 16 employees for supplying trade secrets in 2007 at a February 8, 2008, ceremony in Binghamton, N.Y. EI employees contributed a total of 29 U.S. patent application filings, 18 U.S. patents issuances, and five trade secrets in 2007.

Interview: David Bergman Discusses IPC's Agreement with Tsinghua University

The IPC has announced a new initiative with Tsinghua University in Beijing to develop a skill development program for electronics assembly.

Kyzen Exhibits at SMTA Dallas

(February 25, 2008) NASHVILLE — Kyzen Corporation will showcase AQUANOX A4625 at the upcoming Dallas SMTA Vendor Show, March 5, 2008, in Dallas, Texas.

IPC, Tsinghua University Partner

(February 25, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries will undertake an initiative with Tsinghua University (Beijing) for a skill development program for electronics assembly. The program is slated to reach about 5,000 students in 500 vocational schools each year.

PDR Launches Flexible BGA/SMT Rework System

(February 25, 2008) WEST SUSSEX, U.K. — PDR released its professional hand-held rework system, the PDR IR-SolderLight Professional, targeting flexibility for SMT/BGA rework. The system is tip/nozzle free, gas free, sensitive to controls, clean, and is said to produce high-quality BGA rework without complications.

Enthone Plating Lab Opens

(February 22, 2008) WEST HAVEN, Conn. — Enthone Inc., a business of Cookson Electronics, opened its advanced plating applications laboratory at the West Haven facility, inviting local government officials to celebrate with employees and customers. Enthone began construction on the facility in July 2007.

FCT Develops Lead-free No-clean Paste

(February 22, 2008) GREELEY, Colo. — FCT Solder, a division of FCT Assembly, developed the NL900 no-clean lead-free solder paste for use in SAC and SN100C alloy systems. FCT is an authorized licensee of Nihon Superior Co. Ltd.'s SN100C product line. The paste offers repeatability and consistency, according to the company.

AAT Intros Low-standoff Cleaning Technology

(February 22, 2008) BURNET, Texas — Austin American Technology (AAT) released a calculated cleaning technology, Progressive Energy Dynamics (PED), targeting low-standoff components with spacing down to 1 mil in lead-free assembly environments. The approach incorporates a system of nozzles, manifolds, and pump technology.

Article: "Adhesives for Increased Reliability in Medical Devices"

This article discusses the significant differences between the critical physical properties of flip-chip underfill versus board-level underfill, and how these properties affect the reliability of the underfilled device.

Zestron Promotes Parthasarathy

(February 21, 2008) MANASSAS, Va. — Zestron promoted Ravi Parthasarathy, M.S.Ch.E., to senior process engineer, responsible for key account management in North America.

Ascentech Provides Henkel's SIR Testing

(February 21, 2008) CHESTER, Conn. — Ascentech LLC, North American distributor for GEN3 Systems Ltd. products, provided Henkel Corporation's Electronics Technology Center (Irvine, Calif.) with laboratory equipment for surface insulation resistance (SIR) and solderability testing, including the MUST III solderability tester and AUTO-SIR surface insulation resistance testing systems.

OEM Partnership Enhances MES

(February 21, 2008) BROMONT, Canada — Cogiscan Inc. and Kratzer Automation AG (Germany) entered into a OEM reselling agreement and partnership to integrate Cogiscan RFID tracking and traceability technology into Kratzer's EMS-focused products, including the intraFACTORY manufacturing execution system (MES).

Nam Tai to Sell JIC Shares

Nam Tai Electronics, Inc. has announced that it is engaged in negotiations to sell its entire interest in its Hong Kong listed subsidiary, J.I.C Technology Company Limited, to an independent third party.

Users Unsure on Converged Technologies

(February 20, 2008) SCOTTSDALE, Ariz. — In-Stat reports that conventional wisdom within the portable device industry is that consumers have a preference to use converged devices, meaning single devices that combine the functionality of previously separate devices. The research firm has found that wholesale adoption of a device that combines multiple devices is unrealistic, noting that a survey of U.S. businesspeople shows that users tend to remain loyal to older technology.

Sanmina-SCI to Sell PC Business to Foxconn and Lenovo

Sanmina-SCI Corporation today announced it has signed a definitive agreement with Foxteq and Lenovo for the sale of certain assets of its personal computing business.

electronica 2008 Takes Broad View

(February 19, 2008) MUNICH, Germany — electronica 2008, November 11–14, 2008, in Munich, will present a range of electronics — from semiconductors and nanotechnology to automotive safety and EMS, following the motto, "Get the whole picture." The show includes four special focus areas and 15 specific sectors.

Sanmina Sells PC Business to Foxconn

(February 19, 2008) SAN JOSE, Calif. — Sanmina-SCI Corporation signed a definitive agreement with Foxteq Holdings Inc., a member of the Foxconn Technology Group, to sell certain assets of its personal computing business, along with associated logistics services in Hungary, Mexico, and the U.S. Beyond this sale to fellow EMS provider Foxconn, Sanmina also plans to transition a Mexico-based personal computing operation to PC-maker Lenovo Group.

SMTA Dallas Combines Conference and Vendor Days

(February 19, 2008) DALLAS — The SMTA Dallas Vendor Days and Technical Conference, March 5, 2008, at the Richardson Civic Center outside Dallas, promises a full exhibit hall along with several key technical presentations covering advanced packaging, counterfeit components, and related topics.

iNEMI to Present Progress and Plans at IPC Expo/Apex

iNEMI will review results from three projects and hold an open meeting of a fourth at IPC Printed Circuits Expo, APEX & the Designers Summit (March 29 -- April 3; Las Vegas, Nevada).

AOI System Inspects Multilayer Substrates

(February 15, 2008) MUNICH, Germany — EPP delivered several model STRATUS II AOI systems for inspection of electroplated gold, silver, and platinum. The AOI system's main application is inspection of screen-printed multilayers of ceramic thick film or LTCC substrates or LTCC foils.

Dissolvable Spacers Maintain Component Locations

(February 15, 2008) MANCHESTER, Conn. — Multi-Seals Inc. introduced Wash-Away dissolvable spacers, designed to provide consistent spacing between PCBs and components. The organic polymer spacers locate PCB components during soldering operations.

Jim Raby to Deliver Keynote at Atlanta SMTA Expo

Jim Raby, renowned 50-year industry veteran, and founder, technical director and program manager at STI Electronics, will present the morning keynote, "An Industry Perspective: Past, Present and Future," at the 12th Annual Atlanta SMTA Expo.

Nihon Reviews Lead-free Wave at Flex Conference

(February 14, 2008) OSAKA, Japan — Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., showcased its SN100C products with FCT Assembly, a U.S.-based SN100C global partner, at the IPC's "International Conference on Flexible Circuits" in Phoenix, Ariz.

Triton Electronik Completes the Acquisition of Positron Technologies

Through a $12 million investment Quebec Manufacturing Fund, Triton Electronik has successfully completed the acquisition of competitor Positron Technologies.

PPM Exclusive Supplier for QUAD Systems

(February 13, 2008) FREMONT, N.H. — Tyco Electronics Corporation has named Precision Placement Machines Inc. (PPM) as its exclusive supplier and manufacturer of replacement parts for its QUAD product line. The QUAD machines are used to assemble circuit boards.

Optimal Focuses on Mexico

(February 13, 2008) AUSTIN, Texas — Optimal Electronics Corporation partnered with Test_ing, Tecnologia, Control y Automatizacion Industrial of Chihuhua City, Mexico, for sales and support in Mexico. Test_ing represents and supports Optimal Electronics' Optel MES software suite. Under the agreement, Optimal Electronics will work with the company to extend its MES software suite to communicate with automated test-and-inspection equipment.

WIN Highlights Automation

(February 12, 2008) ISTANBUL — The World of Industry (WIN) Electrotech exhibition will take place February 28 through March 2 in Istanbul. WIN Electrotech 2008 is a tradeshow centered on high-growth automation, electro-technology, and hydraulic and pneumatic sectors. Exhibitors will highlight equipment and consumables via regional distributors.

IPTE Releases Universal Scanner/AOI

(February 12, 2008) GENK, Belgium — The universal scanner system, EasyView, was introduced by IPTE to supplement its machine portfolio, offering a flexible in-line solution for barcode scans, component checks, and solder joint inspection. It uses an ADOMO camera system.

Inside Plexus: A 'Quality' Visit

An exclusive video interview with Plexus PCB Commodity Manager Steve Williams reveals how strong quality systems are critical components for the success of North American electronics industry manufacturers.

PROMATION Upgrades Manual Workstation

(February 11, 2008) PLEASANT PRAIRIE, Wis. — PROMATION released its latest version of the company's 1M in-line work station. The WT-100-2C XL is a 1000-mm-long workstation that can handle PCBs up to 18" × 18". The station has dual 500-mm drives, each with independent variable-speed control, front work surface, overhead lighting, and a rear parts bin panel.

Aegis Expands Headquarters

(February 8, 2008) HORSHAM, Pa. — Aegis Software Corp. opened a new global headquarters in Horsham, outside Philadelphia. The new offices will meet Aegis' growing workforce demands and provide a training environment for the company's expanding customer base.

Blue Thunder Offers ESD Products

(February 8, 2008) EAST WINDSOR, Conn. — Blue Thunder Technologies Inc., produced a line of ESD products for cleanroom and electronics assembly facilities. The offering includes worker attire, flooring, wipes and swaps, and other products.

Flextronics to Acquire the FRIWO Mobile Power Business Unit of CEAG

FMP develops, produces and markets power supply and charging devices for mobile applications in the telecommunications sector.

KIC Marks 30 Years

(February 7, 2008) SAN DIEGO — KIC celebrated its 30th year of business in the electronics industry. Founded in 1977 by Casey Kazmierowicz, KIC entered the electronics industry with a continuous monitoring system for conveyorized furnaces for microcomputers.

Thales Nederland Selects Valor

(February 7, 2008) YAVNE, Israel — Military electronics manufacturer Thales Nederland, a member of the international Thales Group, expanded its use of Valor Computerized Systems, Ltd., process control tools, selecting the Process Engineering Solution.

PROMATION Bolsters Wave, Buffer Lines

(February 7, 2008) PLEASANT PRAIRIE, Wis. — PROMATION added features to its assembly tools, enhancing the OUC-500 wave conveyor with fan banks and the SCBL-99 buffer station with upgraded software. The additions suit better process control and lead-free line management.

Metris Acquires X-Tek

(February 5, 2008) LEUVEN, Belgium — Metris completed its stock-based acquisition of X-Tek Group, begun in 2007, with 100% stock purchase. The company notes that X-Tek's microfocus and computerized tomography (CT) X-ray system lines fit its technology portfolio.

Grieve Releases 650°F Soldering Oven

(February 5, 2008) ROUND LAKE, Ill. — The Grieve Corporation released No. 851, a 650°F electrically heated belt conveyor oven for soldering. The oven includes two 4-ft. insulated heat zones with independent recirculated airflow and temperature controls, a 12-ft. cooling zone with tube-axial fans moving air through it, and a variable speed conveyor that operates between 1.3 and 15.3 inch/min.

Inovar Adds Flying Prober

(February 5, 2008) LOGAN, Utah — Inovar Inc. expanded its EMS service capabilities by purchasing a SPEA 4040 Multimode flying probe test system. The 4040 Multimode enables probe contact on the bottom side of PCBs and does not require fixturing.

Plexus Chooses AXI System

(February 5, 2008) SANTA CLARA, Calif. — Agilent Technologies Inc. supplied EMS provider Plexus with a 3D automatic X-ray inspection (AXI) system. Plexus added the Medalist ×6000 to its test-and-inspection equipment, using the system to detect defects and screen new products.

Sunburst EMS Announces Strategic Acquisition of New England Wire Assemblies

"The acquisition of New England Wire Assemblies broadens our service portfolio with extensive cable assembly expertise and tooling. It enhances our product integration capabilities and allows both Sunburst and NEWire to leverage our complementary customer bases."

OK International Reduces Prices in Europe

(February 4, 2008) GARDEN GROVE, Calif.— OK International announced that prices in Europe for its soldering and rework equipment and tools were headed downwards by as much as 20%. This is based on market demands in an increasingly global market for electronics assembly equipment.

Celestica Announces Fourth Quarter and 2007 Financial Results

"We are pleased with the strong results our company delivered in the fourth quarter. Since implementing our turnaround plans 12 months ago, we have undergone a major transformation which has resulted in our best ever and industry leading inventory turns, strong margin recovery and an improving trend in returns on invested capital.

SMTA Chapter Officers Gather for Training

(February 1, 2008) MINNEAPOLIS, Minn. — The Surface Mount Technology Association (SMTA) will hold its annual Chapter Officer Forum on February 22 - 24 at the Sheraton Bloomington Hotel. The gathering begins with a facility tour hosted by the Upper Midwest SMTA Chapter and follows up with a tour of the SMTA Headquarters.

Nepcon 2008 UK Cancelled

Reed Exhibitions have announced the cancellation of Nepcon 2008 in the UK.

Oxford Instruments Debuts Trace Analyzer

(January 31, 2008) OXON, U.K. — Oxford Instruments Analytical Limited, a subsidiary of Oxford Instruments plc, released the X-Strata980 X-ray fluorescence (XRF) analyzer. The tool uses a high-power X-ray tube and large LN2 detector to measure small areas on complex samples. Empirical and fundamental parameter calibration options enable set data analysis or element identification.

ASTM Seeks Award Nominees

(January 31, 2008) WEST CONSHOHOCKEN, Pa. — Standards developing organization ASTM International is seeking nominations for the William T. Cavanaugh memorial award, an annual recognition of an individual with eminence and broad contributions to the field of national and international voluntary standards.

Flextronics Announces Third Quarter Results

Net sales increase 67% to record $9.1 billion. Adjusted net income increases 84% to $250 million. Adjusted EPS increases 30% to $0.30

IPC Releases Long-Term Business Report

(January 30, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries put out "Geographic Strategies for Global Expansion in the Electronic Interconnect Industry: Where to Invest for Long-term Business Growth," commissioned on behalf of its Executive Market and Technology Forum members. The report is a comprehensive resource for companies making long-range plans for global and local expansion.

IPC Issues Wage and Salary Reports for PCB and EMS Industries

IPC announces the release of two biennial studies - 2006-2007 IPC Wage Rate and Salary Report for the PCB Industry and 2006-2007 IPC Wage Rate and Salary Report for the EMS industry.

IEC Reports Strong First Quarter Results

"Continuing our look forward, we do not see at this time any slowdown in our orders. Our backlog has actually grown modestly during the quarter and, overall, we do not seem to be encountering recession sentiment in our markets as suggested by the securities markets and the media."

December Book-to-Bill Stays Positive

(January 29, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries released the December 2007 book-to-bill ratios for rigid and flex PCB production in North America. The book-to-bill slipped in rigid and flex segments, hitting 1.01 for combined markets.

EFD Releases PicoDot Jet Dispense

(January 29, 2008) EAST PROVIDENCE, R.I. — EFD Inc., a subsidiary of Nordson Corporation, debuted the next-generation PicoDot jetting dispense system, targeting high precision for a range of fluid viscosities. The dispense system suits miniaturized assemblies and 3D or uneven substrates for adhesive, coating, and other fluid applications.

Flextronics Completes Acquisition of Avail

Flextronics today announced that it has completed the previously announced acquisition of Avail Medical Products Inc., a privately-held, market leader in manufacturing disposable medical devices.

Zestron Asia/Pacific Expands

(January 28, 2008) MANASSAS, Va. — ZESTRON Asia/Pacific relocated to a larger facility, in the Zun Xuan Industrial Park of Shanghai, China. The location features the company's largest Asia/Pacific Application Technology Center.

Vitronics Soltec Upgrades XPM2 Reflow

(January 28, 2008) STRATHAM, N.H. — Vitronics Soltec introduced an enhanced XPM2 reflow platform, XPM2+, featuring upgraded conveyor, cooling, electrical controls, software, and user interface, as well as a leaner external body.

Professional Development at APEX

(January 28, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries will promote reliability in lead-free, high-density interconnects (HDIs), design for reliability (DfR), and other topics for more than 60 professional development courses March 30–31 and April 3 at IPC Printed Circuits Expo/APEX/Designers Summit in Las Vegas. Courses are half- and full-day classes with expert speakers.

Master Bond Debuts Harsh-environment Adhesive

(January 28, 2008) HACKENSACK, N.J. — Master Bond released the EP11SIC silver-filled one-component conductive adhesive. It suits applications requiring electrical connections for sensitive components in severe operating conditions, resisting mechanical and thermal stresses.

TechSearch Lauds Embedded Components

(January 25, 2008) AUSTIN, Texas — TechSearch International released "Embedded Active Components and Integrated Passive: Technologies and Markets," a report detailing the technologies, processes, and infrastructure for embedded components. TechSearch expects embedded components to see double-digit growth across market segments in coming years.

IPC Calls for Midwest 2008 Papers

(January 24, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries issued a call for participation for the IPC Midwest Conference & Exhibition, September 23–28, 2008, in Schaumburg, Ill. Researchers, academics, technical experts, and industry leaders are invited to submit an abstract for the technical conference on any aspect of electronics manufacturing.

Sanmina-SCI Announces Earnings for Q1: Outlook Improving

"Our second quarter has historically been seasonally down, but we are cautiously optimistic about our outlook based on what we currently have in the pipeline from new and existing customers. We expect to continue to strengthen our results, improve profitability and generate free cash flow throughout fiscal 2008," continued Sola.

SOMACIS Opening Advanced PCB Plant

(January 23, 2008) MANFREDONIA, Italy — SOMACIS pcb industries will start production of a next-generation of PCBs at two R&D facilities in Italy, Castelfidardo and Manfredonia. The Manfredonia plant is under construction and will begin producing the high-technology PCBs in the first half of the year.

Zetex Unveils Current Monitor

(January 22, 2008) HAUPPAUGE, N.Y. — Zetex Semiconductors released the ZXCT1080 current monitor, boasting an extended common-mode-sensing voltage range of 3 to 60 V. The component reduces errors in translating actual measured current into input sense current required, as well as overall power consumption. An automotive AEC-Q100-qualified version also is in development.

IPC Issues Reports, Recommendations

(January 22, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries commissioned a report on miniaturization and electronics manufacturing, conducted by Prismark Partners (Cold Spring Harbor, N.Y.). The association also weighed in on the European Commission's review of RoHS, suggesting that the EU consider technical, environmental, and resource impacts of additional RoHS action.

ProtoDesign Chooses DEK Horizon 03i

(January 21, 2008) UTICA, Mich. and FLEMINGTON, N.J. — ProtoDesign, Inc., a design and electronics services firm targeting medical, industrial, security and public service sectors, partnered with DEK to use the Horizon 03i platform. ProtoDesign will implement the printing system on its automated production line, and expects to double throughput over the coming year.

The Morey Corp. Adds Management

(January 18, 2008) WOODRIDGE, Ill. — Matt W. Williams joined The Morey Corporation's sales and marketing team as business development manager, focused on the commercial telematics market. He will concentrate on wireless, GPS, vehicle data-bus technologies, and other telematics hardware nearing full-scale commercial adoption.

Sunburst Appoints Western Rep

(January 18, 2008) WEST BRIDGEWATER, Mass. — Silver Mountain Design will represent Sunburst EMS's line of manufacturing and design services in the western U.S. Silver Mountain operates offices in Nev., Ariz., N.M., and southern Calif.

Rockwell Intros Linear Stages

(January 18, 2008) MILWAUKEE — Rockwell Automation released the Allen-Bradley MP-Series line of integrated linear stages for OEMs and machine builders, targeting a range of load-carrying applications. The products are designed to be off-the-shelf replacements for proprietary designs, reportedly reducing time and costs of design, programming, and commissioning.

EI Develops High-complexity PCB

(January 17, 2008) ENDICOTT, N.Y. — Endicott Interconnect Technologies Inc. (EI) created a large, high-complexity PCB controller board that functions as the intelligence of a powerful and advanced optical packet switch. The PCB was fabricated for IBM Zurich Research Lab, and required deep blind vias joined with a proprietary EI process technology.

IPC Designers Summit Focuses on Learning

(January 17, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries will present its 2008 Designers Summit, in conjunction with APEX, March 31 through April 3 in Las Vegas. The program includes workshops and exams for certifications, Designers Day, technical presentations, and networking.

iNEMI Begins 2009 Roadmap

(January 17, 2008) HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) is requesting input from industry experts to develop its 2009 Roadmap. Hewlett-Packard (HP) will host the North American kick-off meeting February 20–21, 2008, at its Cupertino, Calif., facility. The meeting is open to any interested in participating in iNEMI's next roadmap.

RoHS-compliant Shielding Released

(January 15, 2008) TAMPA, Fla. — Leader Tech used a new design and manufacturing process to create its Slot-Lok circuit board shielding (CBS) product. Slot-Lok joins the company's Flex-Tech product line, and is said to reduce standard design-to-delivery lead times.

Unicorn Investment Bank Buys Victron

"Victron combines strong execution capabilities with highly flexible operations, resulting in a unique and highly competitive business model."

IPC Issues Annual PCB Studies

(January 14, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries released three annual PCB studies: "2006–2007 Industry Analysis and Forecast for Flexible Circuits in North America," "2006–2007 Industry Analysis and Forecast for Rigid PCBs and Laminates in North America," and "Technology Trends for Printed Circuit Boards for the Year 2006." Growth in the PCB industry worldwide over the next two years is expected to be modest but steady.

KIC Upgrades Automatic Thermal Profiler

(January 14, 2008) SAN DIEGO — KIC's KIC Vision thermal profiling system is upgraded to include additional automatic capabilities. The Vision product is designed to replace manual periodic reflow profiling with automatic measurement of product profiles. The upgrades target increased automation, documentation, and traceability.

Kitron in Cooperation with Dignitana

The cooperation means that Kitron ASA's Swedish subsidiary Kitron AB shall develop a new complete product including hardware, software, mechanics and industrial design according to Dignitana's specifications.

White Paper: 7 Things You Must Know in Selecting an EMS Partner for Military/Government

Mr. Evangelista reviews the key principles that ensure successful military electronics outsourcing.

EMS in Central and Eastern Europe

With the dollar weaker than it has been in years, is there any reason to consider Central and Eastern Europe for outsourced electronics manufacturing?

Mentor Begins 20th PCB Technology Awards

(January 11, 2008) WILSONVILLE, Ore. — Mentor Graphics Corporation opened its 20th annual Technology Leadership Awards competition, calling for entries in six categories for complex PCB designs. The awards recognize engineers and designers that use Mentor products to address design challenges and produce leading products.

Advisory Board Update: Hwang Joins U.S. Export Council

(January 11, 2008) WASHINGTON — The U.S. Secretary of Commerce appointed Jennie Hwang, Ph.D., SMT Editorial Advisory Board member, to a four-year term with the U.S. Department of Commerce's District Export Council.

Foxconn 2007 Revenues Grew 42.5% Year-on-Year

Foxconn Electronics said its revenues grew 42.5% on year to reach a new high of NT$1.237 trillion (US$38 billion) in 2007.

APEX Hosts iRobot Founder

(January 10, 2008) BANNOCKBURN, Ill. — Rodney Brooks, Ph.D., director of the Massachusetts Institute of Technology's (MIT's) computer science and artificial intelligence laboratory, founder of iRobot, and leader in robotics and artificial intelligence, will present the opening keynote of IPC Printed Circuits Expo/APEX/Designers Summit, April 1 in Las Vegas.

Ring in the New Rules

Environmental mandates continue to challenge the design and electronics supply chain as the industry moves into 2008.

Asymtek, YESTech Partner for Medical Apps

(January 8, 2008) CARLSBAD, Calif. — Asymtek and YESTech, both Nordson companies, co-developed a dispensing process that uses automatic optical inspection (AOI) technology to verify precision, accuracy, and reliability. The dispensing process targets medical-device manufacturers requiring traceability and validation.

2006 PCB Production Outpaced 2000

(January 8, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries issued its "World PCB Production and Laminate Market Report for the Year 2006," showing that the world PCB market expanded in 2006, for the third year in a row, to $47.6 billion.

Aqueous Names Accelonix as Distributor

(January 7, 2008) RANCHO CUCAMONGA, Calif. — Aqueous Technologies Corporation appointed Accelonix, a member of the Accelonix Group, as its distributor in France and the North African countries Tunisia, Algeria, and Morocco.

Indium's Ning-Cheng Lee Presents Globally

(January 7, 2008) CLINTON, N.Y. — Ning-Cheng Lee, Ph.D., VP of technology at Indium Corporation, will present diverse workshops in Thailand, Malaysia, and India throughout January 2008. Topics range from environmental impacts to high reliability, and center around lead-free soldering.

Cimnet Upgrades PCB-specific Software

(January 7, 2008) INDIANAPOLIS — Cimnet Systems, a Consona business unit, released new versions of three PCB-specific engineering and business software products: Paradigm v.3.5, iQuote v.3.2, and Engenix v.2.2.

CMK Sells JV Stake to Sumitomo Bakelite

(January 4, 2008) TOKYO — CMK Corp. sold its 49% interest in Malaysian PCB materials manufacturer SNC Industrial Laminates Sdn Bhd to Sumitomo Bakelite Co., reports The Nikkei Business Daily.

Lab Management Provider Opens

(January 3, 2008) AUBURN, Mass. — Labman One, LLC began business as a contract service company dedicated to improving the efficiency and productivity of high-tech laboratories. It aims to assist in laboratory management for small companies in advanced technology fields, managing debug and repair services, and reportedly adding to productivity and efficiency.

Taiyo Promotes Hole-plugging Ink

(January 2, 2008) CARSON CITY, Nev. — Taiyo America will allow customers to try its THP-100DX1 hole-plugging ink, on up to 12 PCB panels, at Applied Circuit Services (Exeter, N.H.) or HDI Via Fill Services (Santa Ana, Calif.). The hole fill is said to resist attack in over-plate applications, providing a planar copper surface without dishdowns from desmear.

Aqueous Releases Trident E-Learning Topic

(January 2, 2008) RANCHO CUCAMONGA, Calif. — Aqueous Technologies Corp. announced the "Trident Automatic Defluxing and Cleanliness Testing System" E-Learning presentation, available on the company's Website. The presentation introduces control, cleaning, test, drying, and configuration technologies for the Aqueous Trident system.

Video: Productronica Marketing Roundtable

This roundtable with EMSNow Editor Phil Stoten, I-Connect007 Editor Steve Gold and Protean Marketing's Rich Heimsch examines differences between international and local exhibitions from a marketing perspective.

Elcoteq Reorganizing in 2008

(December 26, 2007) ESPOO, Finland; RICHARDSON, Texas; and HONG KONG — Elcoteq SE will streamline and simplify its organization, effective January 1, 2008. The reorganization is part of the EMS provider's action plan announced in October 2007. The resulting structure should improve the company's ability to respond to customer needs, clarify responsibilities, speed up decision making, and improve Elcoteq's cost structure.

Master Bond Debuts Anti-Static Latex Coating

(December 26, 2007) HACKENSACK, N.J. — Master Bond Inc. released LTX-117G, a lower cost, electrically conductive, water-based adhesive, sealant, and coating. It is a one-part, UV-stable latex adhesive that incorporates non-metallic graphite filler to add conductivity.

Puritan Releases ESD-safe Swabs

(December 24, 2007) GUILFORD, Maine — Puritan Medical Products LLC created a line of ESD-safe swabs with primary applications in microelectronics induustry. The ESD Safe Swabs protect electronic circuitry and devices from the negative effects of ESD. An ESD event can cause an immediate product failure, or cause a product to fail later, affecting product lifespan as well as customer safety and satisfaction.

CTS Corporation Achieves AS9100 Certification for Aerospace Manufacturing at its Singapore Facility

AS9100 is the international quality management standard for designers and manufacturers of equipment for aerospace applications.

Jabil Net Income Increases 50 Percent

Net revenue for the first quarter of fiscal 2008 increased 4.5 percent to $3.4 billion compared to $3.2 billion for the same period of fiscal 2007.

Optimal Uses Calavista for Software Development

(December 20, 2007) AUSTIN, Texas — Optimal Electronics Corporation partnered with Calavista Software, a software development resources and tools company, to expand and improve the Optel manufacturing execution system (MES) suite.

Nihon Aids World Solar Challenge

(December 20, 2007) OSAKA, JAPAN — Nihon Superior Co. Ltd. sponsored the UltraCommuter vehicle in the Panasonic World Solar Challenge eco-car race, held this October. UltraCommuter was jointly developed by Nihon Superior, the University of Waikato (New Zealand), and HybridAuto.

SMTA Supports SMART Group Seminars at Nepcon UK

SMTA will bring a wealth of expertise and technical content to Nepcon, as they work with the SMART Group to create topical and relevant presentations tackling today's manufacturing challenges.

Zuken, LogicSwap Launch Design Migration Tool

(December 19, 2007) MUNICH, Germany and WESTFORD, Mass. — LogicSwap, migration software provider for Zuken's CADSTAR, launched a migration toolset for schematics, libraries, and PCB designs moving to CADSTAR from Cadence Allegro and Orcad, Mentor Graphics PADS PCB designer, and Altium Protel and P-CAD.

Valor, Digitaltest Partner

(December 19, 2007) YAVNE, Israel — Valor Computerized Systems Ltd. and Germany-based Digitaltest GmbH partnered to integrate their respective design-for-test and process engineering products for improved new product introduction (NPI), assembly, and test. Digitaltest's C-LINK will work with Valor's vPlan software on a common data model.

2008 IC Market Drivers Report

(December 18, 2007) PHOENIX — Electronics system shipments worldwide grew about 5% in 2007, hitting $1.21 trillion. The market is driven by demand for mobile communications devices, consumer products, notebook PCs, wireless, and automotive electronics, according to IC Insights' 2008 edition of its "IC Market Drivers" report. IC Insights finds that IC sales grew 5% to $220.3 billion this year.

Focal Spot Releases Verifier H X-ray Inspection

(December 18, 2007) SAN DIEGO — FocalSpot Inc. launched two configurations of the Verifier H series horizontal-beam X-ray inspection system. The FSX-H75 and H90 are designed to assess industrial, automotive, and medical electronics.

China Week in Review

Unimicron November Sales Reach NT$4B; GCE to Boost Notebook PCB Shipment in 2008; Vertex to Inject Hong Kong Investment; Hannstar Board Targets 40% of the Global Notebook PCB market

November 2007 Book-to-Bill Remains Positive

(December 17, 2007) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries announced today the November findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio for rigid and flex PCB production continued its positive trend, hitting 1.06.

Europe's Electronics Manufacturing Sector Grew 6.4% in 3Q

The electronics manufacturing industry in Europe registered a 6.4 percent growth in revenues for the third quarter, as compared to the previous quarter, according to ZVEI.

Iomega to Acquire EMS Provider ExcelStor Group

ExcelStor markets its products primarily to OEMs as an electronics manufacturing services provider and also sells its own ExcelStor-branded products through distributors throughout the world.

APEX 2008 Preview: Technical Sessions

(December 12, 2007) LAS VEGAS — IPC — Association Connecting Electronics Industries released highlights for its IPC Printed Circuits Expo/APEX/Designers Summit, April 1–3, 2008, in Las Vegas. The show includes a conference, free forums, standards development meetings, professional development courses, and exhibit floor.

Henkel Intros Quick-dry Toluene-free Conformal Coating

(December 12, 2007) IRVINE, Calif. — Henkel Corporation launched the next generation of its Hysol conformal coating material, a toluene-free, one-component, solvent-based acrylic conformal coating, PC62.

Sparton Corporation Announces the Award of a Record Level of New Business

Electronic Design and Manufacturing Service (EMS) provider Sparton Corporation (NYSE:SPA) has announced that the Company has secured a record number of new business opportunities for the Company

Palomar Partners with Vision for PWB and SMT

(December 11, 2007) CARLSBAD, Calif. — Palomar Technologies partnered with Vision Manufacturing, Inc. (VMI — Vista, Calif.), to add printed wiring board (PWB) and SMT services to its Palomar Microelectronics process development, prototyping, and low-volume assembly services.

NanoMarkets Sees Disposable Electronics at $26.2B by 2015

(December 11, 2007) GLEN ALLEN, Va. — NanoMarkets LLC expects the disposable electronics market — paper substrates, printed RFID tags, organic embedded devices — to grow to a $26.2 billion market by 2015. The analyst firm published its projections broken out by applications and device type, as well as corporate profiles of market leaders, in "Disposable Electronics: The First Wave for Printed and Organic Electronics."

PartnerTech Initiates Profitability Plan

An action program is being adopted to adjust costs to lower sales and to streamline operations. The measures are expected to steadily boost earnings during 2008.

Video: Interview With Meadville Group CTO Chris Katzko

Katzko describes the Meadville Group's technological prowess that now covers the full spectrum of PCB technology from CSP substrates to high performance backplanes.

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