Basel e-Waste Conference Convenes
(June 23, 2008) BALI, Indonesia — Representatives from 170 countries kicked off a five-day informal meeting on Bali to discuss how to manage the trans-boundary traffic of hazardous waste. Indonesia's Environment Minister Rachmat Witoelar opened the conference, which will focus on the impacts of hazardous waste on human health and livelihoods.
Ascentec Acquires Datum Dynamics
(June 20, 2008) SHERWOOD, Ore. and PORTSMOUTH, R.I. — Ascentec Engineering acquired Datum Dynamics USA of Portsmouth, boosting its Northeast operations. The process tooling company supplies PCB assembly tooling and fixtures, and will join Ascentec's PCB process tooling services portfolio.
Report: Global Portable Electronics
(June 19, 2008) MONTREAL — Continuous technological development, digital options, and declining price points are among reasons for the growth of portable electronic products globally, according to "Global Portable Electronics Market," by Electronics.ca Publications.
Rockwell Collins Honors AVX
(June 17, 2008) MYRTLE BEACH, S.C. — AVX Corporation received the 2008 "Resistor/Capacitor Commodity Supplier of the Year" award from Rockwell Collins. The honor is based on quality, delivery, total cost of ownership, lead time, and customer service.
Manncorp Updates Benchtop Stencil Printer
(June 17, 2008) SAN DIEGO, Calif. and WILLOW GROVE, Pa. — Manncorp debuted an improved version of its Model 5500 benchtop stencil printer, which includes true vertical separation of the stencil from the PCB prior to the lifting of the stencil frame, designed for ultra-fine-pitch solder paste printing.
Agilent Intros High-density Matrix Modules
(June 17, 2008) SANTA CLARA, Calif. — Agilent launched new modules for its 34980A multifunction switch/measure unit. They are designed for aerospace/defense, consumer electronics, computers and peripherals, communications, semiconductor, and automotive industries routing low-frequency signals between stimulus, DUT, and measurement equipment when designing high-pin-count tests.
GW Equity Announces Sale of Houstech to Private Investor
GW Equity, announced the sale of its client Houstech Inc., a Houston, Texas-based company specializing in the assembly of PCBs, to a private investor based in Houston.
Webinar Targets Controlled Medical Device Manufacturing
(June 16, 2008) CHARLOTTE, N.C. — Camstar Systems will host a Webinar for medical device manufacturers on June 26, outlining how manufacturers can extend their SAP ERP and manufacturing applications into the plant floor with Camstar's packaged composite solution.
Zuken Ramps Up Support of FPGA Technology
(June 13, 2008) MUNICH, Germany and WESTFORD, Mass. — Zuken released a simulation kit for Altera's low-cost Cyclone III FPGA family of products, bolstering support of programmable devices in board designs. The kit is free to download for users of Zuken's CR-5000 advanced modular and robust electronics systems and PCB design suite.
SMTA, Koh Young Present on Solder Paste Measurement
(June 13, 2008) BOSTON — The SMTA Boston Chapter will host a technical presentation, titled "Advanced Solder Paste Measurement Techniques and Equipment" and live demonstrations on Koh Young solder paste measurement equipment, July 8th at Textron Defense Systems in Wilmington, Mass.
Zestron Qualifies Stencil Cleaner for Global Customer
(June 10, 2008) MANASSAS, Va. — A leading global contract manufacturer recently evaluated numerous cleaning agents to significantly improve its current stencil cleaning process. Upon an extended on-site cleaning evaluation, VIGON SC 200 was tested and confirmed to exceed the customer requirements.
Report: China's IC Market
(June 10, 2008) DUBLIN — Research and Markets released an overview of the Chinese market for ICs, with focus on four key emerging markets: Shenzhen, Suzhou, Tianjin, and Chengdu. The report includes the three IC segments: design, manufacturing, and packaging & testing.
European Workshop to Review Drafts of 2009 iNEMI Roadmap Chapters
The deadline is approaching to register for iNEMI's European workshop for the 2009 Roadmap, scheduled for June 18, 2008 at IMEC headquarters in Leuven, Belgium. The European workshop is one of three being held worldwide to solicit industry input and feedback.
Mouser Distributes Teridian ICs
(June 9, 2008) MANSFIELD, Texas — Mouser Electronics Inc. signed a global distribution agreement to carry Teridian Semiconductor, a supplier of mixed-signal integrated circuits used in energy, automation, networking, and secure access systems.
ACI Hosts Lead-free Workshop
(June 9, 2008) PHILADELPHIA — The American Competitiveness Institute (ACI), along with SMT and Indium Corporation, will host the free workshop "RoHS and Lead-free Updates, a Day with Dr. Ron Lasky," June 25 at ACI's campus in Philadelphia. The workshop will cover an update on the EU's RoHS law and critical issues in lead-free assembly.
Thermo Fisher Scientific Launches EDS X-Ray Microanalysis System
(June 9, 2008) MADISON, Wis. — Thermo Fisher Scientific Inc. unveiled the Thermo Scientific NORAN System 7, an advanced EDS X-ray microanalysis system. NORAN System 7 is equipped with a high-throughput pulse processor, spectral imaging capability, and a sophisticated software suite.
Low-cost Regions Lead Electronics Output
(June 6, 2008) MONTREAL — Electronics manufacturing in the U.S., Japan, and Western Europe accounted for less than 50% of electronics output for the first time in 2006 as the migration of volume manufacturing to low-cost locations continues, according to market analysts at Electronics.ca Publications.
SMTA Calls for Papers on Counterfeit Parts
(June 6, 2008) MINNEAPOLIS — SMTA and CALCE of the University of Maryland will host the "2nd Annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts," September 9–10, 2008 at the University of Maryland, and are requesting papers on solutions to the counterfeit problem.
FINE LINE Adds Electroformed Laser-cut Stencils
(June 6, 2008) COLORADO SPRINGS, Colo. — FINE LINE STENCIL, a division of FCT Assembly, announced ElectroLaser electroformed laser-cut stencils, made using a hybrid technology with laser-cut apertures and electroformed nickel surfaces.
VJ Electronix Appoints Director, Global Sales and Marketing
(June 5, 2008) LITTLETON, Mass. — VJ Electronix named Ronald Lindell as its director of global sales and marketing. Prior to joining VJ Electronix, Lindell served as the North American and global sales manager for the assembly test division of Teradyne.
From the Show: SMT/HYBRID/PACKAGING's International Integration
(June 5, 2008) NURNBERG, Germany — Long considered to be the second largest electronics tradeshow by Germans — second only to biannual Productronica — but a smaller local event by the rest of the world, SMT/HYBRID/PACKAGING 2008 succeeded in changing that perception.
FINE LINE, LPKF Partner for Laser-cut Stencils
(June 3, 2008) COLORADO SPRINGS, Colo. — FINE LINE STENCIL, a division of FCT Assembly, introduced a line of laser-cut stencils in partnership with LPKF. The laser-cut stencils accommodate designs with aperture pitches down to 0.4 mm.
Universal Brings AdVantisX to Asia
(June 3, 2008) BINGHAMTON, N.Y. — Universal Instruments introduced the newest platform in the Advantis pick-and-place series, AdVantisX, to the Asia market, for customers interested in low-cost, repeatable performance.
EFD Debuts Vacuum Pickup for Manual Assembly
(June 2, 2008) EAST PROVIDENCE, R.I. — EFD, a business of Nordson Corporation, released the ProcessMate PM100 vacuum pickup system to safely lift and position small or delicate parts in benchtop assembly processes.
Creative Materials Launches Reworkable Adhesive
(June 2, 2008) TYNGSBORO, Mass. — Creative Materials Inc. introduced a flexible, reworkable, electrically conductive adhesive that adheres to most silicone and fluorinated substrates. The product, named 102-32, boasts good low-temperature performance and broad application.
atg/LM Intros Octal-density Grid Tester
(June 2, 2008) WERTHEIM, Germany — atg Luther & Maelzer GmbH, in cooperation with the Capital Equipment Group (CEG) of Everett Charles Technologies, launched the LM800 Picomat universal grid tester for bare boards. LM800 Picomat is an octal density (35 mil) universal grid tester for high-technology PCBs.
Call for Papers: APEX 2009
(June 2, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries invites researchers, academics, technical experts, and other industry leaders to submit abstracts for the 2009 IPC APEX EXPO, to be held in Las Vegas, March 29 through April 2, 2009.
SMTA Chooses San Diego, CA to Host SMTAI 2009
The SMTA has announced that the highly respected SMTA International Conference and Exhibition will be held in San Diego, CA, October 4-8, 2009. The SMTA Board of Directors felt that to meet the needs of all members it was important to periodically have a presence on the West Coast.
Endicott Interconnect Technologies Hosts IPC Technology Interchange Event
Endicott Interconnect Technologies, Inc. (EI) hosted an IPC sponsored event entitled, "Will You Be Ready?: An Endicott Technology Interchange," on Wednesday, May 14, 2008.
Balver Zinn Offers Cobar Lineup in Germany
(May 30, 2008) BREDA, Holland — Cobar solder paste, fluxes, other soldering chemicals, as well as technical support, are now available directly through the Balve, Germany, installation of its parent company, Josef Jost GmbH & Co.KG (Balver Zinn), in addition to Cobar Europe's existing distribution network.
IPTE Debuts In-line Test Handler
(May 30, 2008) GENK, Belgium — IPTE added to its multifunctional test handler line, introducing the Multi Test Handler for parallel operation for test or flash programming. The system offers reportedly flexible automation settings to integrate with existing test equipment at line rates.
Connectronics Romania Expands, Opens New Plant
Connectronics Romania, a part of the Belgian Connect Systems Group, has opened a new production plant in Oradea. The new plant can accommodate more than 1,000 employees.
SMTAI Hits Both U.S. Coasts
(May 29, 2008) MINNEAPOLIS — The SMTA will bring its SMTA International Conference and Exhibition (SMTAI) to San Diego, Calif., October 4–8, in 2009, moving from the 2008 Orlando location. The plan for the immediate future will be to alternate SMTAI between the East and West Coasts.
JTAG Releases ICT-integration Module
(May 29, 2008) EINDHOVEN, The Netherlands — JTAG Technologies, an Aeroflex technology partner, launched the JT 2147/AGP boundary-scan interface for use with Aeroflex high-performance in-circuit test (ICT) platforms.
April Book-to-Bill Continues Positive Track
(May 27, 2008) BANNOCKBURN, Ill. — IPC's combined (rigid and flex) industry book-to-bill ratio reached 1.01 in April 2008, representing a steady positive in 2008, which began in January with a 0.97 book-to-bill ratio. The book-to-bill numbers are holding steady at a higher level than 2007, confirmed Denny McGuirk, IPC president.
NEPCON Tradeshows Begin in Vietnam
(May 27, 2008) BANGKOK, Thailand — In early May, Reed Tradex, a member of Reed Exhibitions, opened the first NEPCON event in Vietnam, joining the series of NEPCON events in Asia. NEPCON Vietnam is purported to be the country's only electronics manufacturing technology trade exhibition and conference.
DEK Upgrades Horizon Family
(May 23, 2008) WEYMOUTH, U.K. — DEK released a host of performance and productivity improvements across its entire Horizon product line. Upgrades affect accuracy, verification, and productivity, according to the company.
Nordson Corporation's 2Q Sales Grow 22% to $294 Million
"Nordson again experienced volume growth in every region where we operate. The largest increases came in Asia Pacific, the U.S. and Europe, where our strong local positions enable us to provide customers with leading technological solutions and unsurpassed support," continued Campbell.
PartnerTech: Contract Manufacturers Free Up Energy and Capital for Medical Device Companies
Medical device companies often want to focus on the development, sale and marketing of new applications. To revitalize this process, while
ensuring that capital is not tied up unnecessarily, the companies may
outsource production to contract manufacturers like PartnerTech.
IPC Initiates Scientific Dialogue on Proposed RoHS Expansion
IPC is urging all technical experts from member companies, and other stakeholders in the electronics industry, to participate in a special meeting June 18, 2008, in Brussels to discuss concerns about RoHS expansion.
Indium Promotes Santhanasamy
(May 20, 2008) CLINTON, N.Y. — Indium Corporation promoted Damian Santhanasamy to senior technical engineer. Based in Johor, Malaysia, Santhanasamy provides technical support to target accounts in Malaysia and Thailand.
2008 Sees UMDs Rising
(May 20, 2008) SCOTTSDALE, Ariz. — Ultra mobile devices (UMDs) will grow by 72.6% in 2008, encompassing ultra mobile PCs, mobile Internet devices, a percentage of high-end smartphones, and a percentage of high-end personal media players (PMPs). The technology sector is growing as other areas, such as desktop PCs, slow in the face of macro-economic downturns, reports In-Stat.
LaBarge's Tulsa Electronic Manufacturing Facility Generating Strong Sales
Ron Falk, general manager of LaBarge Inc. in Tulsa, has been in the electronic manufacturing services industry for 27 years and said their recent growth has been amazing, and running the opposite direction from most of the industry.
IPC Counters RoHS Expansion Discussion
(May 19, 2008) BANNOCKBURN, Ill. — IPC sent a call for all technical experts in the electronics industry to participate in a special meeting on June 18, 2008, in Brussels to discuss their concerns about a proposed RoHS expansion. Plans call for representatives of the European Commission to attend.
Asymtek Launches Spectrum S-822 Dual-Shuttle Dispenser
(May 19, 2008) CARLSBAD, Calif. — Asymtek, a Nordson company, introduced the Spectrum S-822 dispensing system with dual-shuttle stages to increase the productivity achieved in CSP underfill and other advanced electronics applications. The S-822 is a stand-alone system with controlled precision dispensing capabilities.
KIC Trying New Sales Approach
Freddie Chan, KIC International Sales, Inc.'s Vice President, Asia Operations, explains how his company is employing a new strategy for placing thermal profilers in reflow ovens. The company provides data that allows buyers to decide whether the price they are paying for a new oven is actually worth it according to the data procured.
Chinese Domestic Equipment Copies Can't Replace High End
The second floor of Nepcon China's main hall contains lower priced equipment, everything from pick-and-place and reflow ovens to AOI and screen printers. One printer even reportedly cost $2,500. Is this a threat to companies like Speedline? Not so, says Asia Vice President Kho Lik Wai. He explains that though these products are improving, they cannot compete for higher-end, higher volume customers.
Tyco Electronics Sells RF Unit
(May 13, 2008) PEMBROKE, Bermuda — Tyco Electronics Ltd. entered into a definitive agreement to sell its radio frequency (RF) components and subsystem business to Cobham Defense Electronic Systems, a subsidiary of Cobham plc, for $425 million in cash.
1-Source, ChipChecker Offer Anti-Counterfeit Service
(May 13, 2008) HONG KONG — Under a mutual interest in mitigating the growing problem of counterfeit and defective parts, 1-Source and ChipChecker teamed up to provide a suite of material management services for wholesale buyers of electronic components, the L-15 inspection and third-party testing service.
An Innovative Approach to Thermal Profiling
A new thermal profiler, ECD's Mega M.O.L.E. 20, promises to optimize reflow oven profiling for engineers while making life very simple for operators. While selling higher technology solutions in China has been difficult due to the focus on cost, ECD Vice President of Sales & Marketing Grant Peterson believes current market conditions will help his company's cause.
Indium Expands Pacific Sales
(May 9, 2008) CLINTON, N.Y. — Indium Corporation added Sherwin Kobak as regional sales manager in the Pacific region. Sherwin, based in Portland, Ore., is responsible for the sales growth of Indium's soldering products throughout northern Calif., Ore., Wash., Idaho, British Columbia, Alberta, and Saskatchewan.
Kyzen Presenting Globally
(May 9, 2008) NASHVILLE, Tenn. — Kyzen Corporation will present research information and exhibit cleaning products at shows around the U.S. and internationally, including Sweden and Canada, in May 2008. Charles Pitarys and Mike Bixenman will give talks as Kyzen representatives.
VJ Electronix Hosts Open House, SMTA Forum
(May 8, 2008) LITTLETON, Mass. — VJ Electronix will open its doors for an open house, coinciding with a technical presentation on advancements in BGA rework and X-ray inspection. The event is scheduled for 5:30 to 9 PM, Tuesday, May 20, 2008.
High-Mix U.S. EMS Chinese Subsidiary Facing Changing Market
Circuit Service Inc.'s China subsidiary, Changzhou CSI, is facing several challenges in a toughening Chinese market. Senior Manufacturing Engineer Michael Serio, a Changzhou resident, offers his opinions on the pace of business in China and the "marriage" of two vastly different cultures on the Nepcon show floor.
Jisso North America Coming to Atlanta
What is Jisso and why is it important to our industry? Technical Editor Bob Neves interviews Denny Fritz, Energy Consultant for MacDermid, about Jisso North America, scheduled for this month in Atlanta, GA. Task Groups are to discuss coordination of roadmaps, standardization of technology, the status of embedded components and optoelectronics and sensible environmental regulations.
Live EDGE 2008 Launches With Tree Ceremony
(May 6, 2008) CHICAGO — Premier Farnell plc and its companies Newark, Farnell, Premier Electronics, CPC, Farnell-Newark, and MCM launched its international competition Live EDGE — Electronic Design for the Global Environment, now in its second year. This year's competition includes a full-time student category, as well as open field.
Flextronics Shares Investigational Findings on PoP and Large Format Assembly
Jenson Lee, Staff Engineer with Flextronics, delivered two papers at the SMTA China East Conference, held in conjunction with Nepcon China 2008. His first paper dealt with package-on-package as it relates to the hand-held and mobile devices market, the other with large format assembly--a process still in its infancy in China.
Nordson Intros UV Cure Products at RadTech
(May 5, 2008) WESTLAKE, Ohio — Nordson Corporation is debuting several UV curing technologies at RadTech UV/EB. They include low- and high-power systems, cooler operation and environmental safeguards, and technology to protect heat-sensitive substrates.
Blending Eastern and Western Engineering for New Product Development
Chris Harvey, Electrolube's Technical Sales Manager, Far East Asia Export, reveals to Steve Gold how his company takes a different approach to R&D globally. Find out how the company blends Western creativity with Eastern market demands and engineering talent.
Corelis/EWA Name President and CEO
(May 2, 2008) CERRITOS, Calif. and HERNDON, Va. — George B. La Fever will take the helm as Corelis president and CEO, finalizing the transition of Corelis Inc. into EWA Technologies Inc., a wholly-owned subsidiary of the EWA corporate family of high-technology companies.
TFI Upgrades ODM Forecast, Lowers EMS
(May 2, 2008) ALAMEDA, Calif. — Technology Forecasters Inc. (TFI) issued a mid-year update to its five-year growth predictions for electronics manufacturing, with the actual 2007 data replacing estimates. TFI revised downward the forecasts for total available market (TAM) and EMS sector growth, and revised upward the forecast for ODM sector growth.
SMTAI Program Boasts 100 Tech Papers
(May 2, 2008) MINNEAPOLIS — The SMTA announced the program for its 21st annual SMTA International (SMTAI) conference, August 17–21 in Orlando, Fla. This year's program allows the attendee to choose from 24 courses, 100 technical papers, four focused symposia, and numerous free offerings throughout the conference.
Embedded ESD Technology Partnership Ready to Ramp Up
Steve Gold sits down with Lex Kosowski, President and CEO of Shocking Technologies; Robert Carter, Senior Marketing Manager with Oak-Mitsui Technologies; and George Dudnikov, Senior Vice President of Sanmina-SCI to discuss their quest to commercialize a new technology that embeds ESD protection into printed circuit boards.
TRUMPF Opens New Laser Factory in Connecticut
(May 1, 2008) FARMINGTON, Conn. — TRUMPF Inc. opened its new laser building, the Laser Innovation & Technical Excellence (LITE) Building, for research and manufacturing of new lasers and expanding production of laser resonators.
IPC, Jisso Sponsor Advanced Interconnect Seminar
(May 1, 2008) BANNOCKBURN, Ill. — IPC — and the Jisso International Council (JIC) are sponsoring a technical seminar, "Implementing Advanced Interconnect Technology Solutions," May 21–22, 2008, in Atlanta. Hosted by Georgia Institute of Technology, the event will provide information on the latest trends in interconnection technologies, led by speakers from JIC and the industry.
Lite-On Transfers Displays to Wistron
(May 1, 2008) TAIPEI, Taiwan — Lite-On Technology's Board of Directors approved the transfer of its digital display business to Wistron for around NT$9.2 billion. The transaction mostly involves the transfer of sales, assets, liabilities, inventory, equipment, IP, long-term investment, accrued warranty, and personnel.
Essemtec Forms JV with Reprint
(April 29, 2008) AESCH, Switzerland — Essemprint (UK) Ltd., a joint venture of Essemtec and Reprint, will take over product rights for the SP900/Spectrum lines. The company targets functionality improvements and cost reductions in printing systems.
Unimicron Expands Taiwan Capacity
(April 29, 2008) TAIPEI, Taiwan — Unimicron Technology Corp. will spend approximately NT$4 billion ($131.6 million U.S.) on expanding its Taiwan PCB fabrication plant's capacity, according to the China Economic News Service (CENS). Unimicron cited environmental and tax laws in China as pressures undermining expansion on the mainland.
ASSET Develops Tools Ahead of IJTAG Standard
(April 29, 2008) RICHARDSON, Texas — Anticipating ratification of a final internal JTAG (IJTAG) standard, ASSET InterTech Inc. is developing and will bring to market open embedded instrumentation tools based on the preliminary IEEE standard, P1687 IJTAG.
Laird Opens India Production
(April 29, 2008) CHENNAI, India — Laird Technologies Inc. opened its first manufacturing facility in India with a dedication ceremony. U.S.-based Laird, a unit of the U.K.-based Laird Group PLC, employs over 14,000 employees in more than 40 facilities located in 14 countries. The Chennai facility will host 1,000 to 1,200 employees.
ACE Develops Lead Tinning System
(April 28, 2008) SPOKANE VALLEY, Wash. — ACE Production Technologies Inc. introduced the LTS200 lead tinning system, which converts components from tin/lead to lead-free, or vice versa, for high-reliability or RoHS-compliant products.
EMS Splits from Scanfil
(April 25, 2008) SIEVI, Finland — Following similar moves by other EMS companies Nam Tai, BenQ, and Elcoteq, the board of directors at Scanfil will carry out a split of the contract manufacturer's business, with its electronics contract manufacturing business becoming a wholly owned sub-concern, Scanfil EMS Oy.
Misumi Intros Engineering Blog
(April 24, 2008) SCHAUMBURG, Ill. — Misumi USA, Inc. launched an engineering blog on its Website, www.misumiusa.com. The blog focuses on the latest mechanical component trends for assembly automation.
Hankuk Valence to Distribute Valor
(April 24, 2008) SHENZHEN, China — Valor Computerized Systems Ltd. appointed Hankuk Valence, a Korea-based electronics manufacturing solutions provider, to distributed its process engineering and manufacturing monitoring and control platforms in Korea.
Zollner Installs Additional Agilent AXI
(April 24, 2008) SANTA CLARA, Calif., and ZANDT, Germany — The Zollner Group, a global EMS provider, selected the Agilent Medalist x6000 automated X-ray inspection (AXI) system to enhance its test-and-inspection capabilities.
Asymtek Intros Slider Valve for Solder Paste
(April 24, 2008) CARLSBAD, Calif. — Asymtek launched the SV-100 slider valve for solder paste dispensing. It is reportedly up to 20% faster than standard auger dispensers. For solder paste types 4, 5, and 6, it dispenses dots of less than 300 µm.
Thin Metal Parts Adds Marketing Manager
(April 22, 2008) COLORADO SPRINGS, Colo. — Thin Metal Parts (TMP) hired Jeremy Hancock as product marketing manager, focused on increasing the market presence for TMP's expanding product capabilities through industry research, target account identification, and prospect/account analyses.
Camtek Launches High-density PCB AOI Series
(April 22, 2008) MIGDAL HAEMEK, Israel — Camtek Ltd. unveiled its Mustang line of automated optical inspection equipment targeting high-density PCBs used in mobile consumer products, such as cell phones and digital cameras. Mustang systems track defect types during inspection and handle a range of panel sizes and types.
Research and Markets Report: Printers
(April 22, 2008) DUBLIN, Ireland — Research and Markets Ltd. released its study on the global SMT screen printer market, including trends, challenges, geographic distribution, and other data. The report forecasts revenue in screen printers by region and by printer type.
Henkel Launches Harsh Environment Silicone
(April 21, 2008) IRVINE, Calif. — Henkel launched its Loctite 5210 fast cure thixotropic silicone material for devices in harsh environments. With improved production throughput, operating temperature flexibility, and storage, Loctite 5210 offers a reportedly cost-effective alternative to traditional hot-melt glues or other silicones.
Morey Corp. CTO Keynotes PCB East
(April 21, 2008) WOODRIDGE, Ill. — The Morey Corporation's chief technology officer (CTO), Emad S. Isaac, will keynote PCB East 2008, May 11 to 16 in Tinsley Park, Ill. He will address how an electronics manufacturing and assembly company identifies inherent design problems and develops best practices for communicating upstream to improve layout and manufacturability, along with other issues facing assemblers.
SMTA Boston Hosts XRF Summit
(April 21, 2008) BOXBOROUGH, Mass. — The SMTA's Boston chapter will bring together presenters from various inspection companies to discuss handheld X-ray fluorescence (XRF) devices at its meeting in Boxborough, Tuesday, April 22. The technical presentation, "Understanding and Effectively Using Handheld XRF Technology for Components and Materials Inspection," will include information on WEEE and RoHS substance levels, speed and accuracy of analyses, and system features.
TRI, ASSET Integrate Test Solutions
(April 18, 2008) RICHARDSON, Texas and TAIPEI, Taiwan — ASSET InterTech Inc. will integrate its boundary scan test solutions into Test Research Inc.'s (TRI's) in-circuit test (ICT) systems. The partnership targets reduced test costs for equipment manufacturers because boundary scan tests can be reused throughout every phase of a product's life cycle.
IPC Names Global Board Members
(April 17, 2008) BANNOCKBURN, Ill. — IPC revealed its recently elected Board of Directors. New chairman Nilesh Naik, CEO, OneSource Group (Texas), was elected. The new members — Rex Rozario, executive chairman, Graphic Plc (U.K); Zhou Xin, senior director, advanced technology R&D, Huawei Technologies (China); and Robert Black Jr., president and CEO, Juki Automation Systems, Inc. (N.C.), represent the global membership and global marketplace IPC serves.
Chinese Domestic Equipment Copies Can't Replace High End
The second floor of Nepcon China's main hall contains lower priced equipment, everything from pick-and-place and reflow ovens to AOI and screen printers. One printer even reportedly cost $2,500. Is this a threat to companies like Speedline? Not so, says Asia Vice President Kho Lik Wai. He explains that though these products are improving, they cannot compete for higher-end, higher volume customers.
SMTA Partners with MentorNet
(April 15, 2008) MINNEAPOLIS — The Surface Mount Technology Association (SMTA) formed a partnership with MentorNet to facilitate mentorship opportunities for its student members. The partnership allows members of the SMTA privileges to resources offered by MentorNet such as its one-on-one program, easy matching to SMTA members, and the resume database for students.
Cool Polymers Launches Heatsink Line
(April 15, 2008) WARWICK, R.I. — Cool Polymers Inc. introduced its next-generation thermally conductive injection-mold thermoplastics for heatsinks and thermal management solutions. The proprietary CoolPoly grades provide no antenna effect as metal heatsinks can, and are said to be up to 50% lighter than aluminum designs.
Microelectronics Center Opens at EI
(April 14, 2008) ENDICOTT, N.Y. — The Center for Advanced Microelectronics Manufacturing (CAMM), located at the Endicott Interconnect Technologies Inc. facility in Endicott, was inaugurated in late March, in a ceremony attended by business, political and community leaders. A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll format.
After Divestiture, Universal Plans Focused Approach to Global Market
CBA Croup Chairman and CEO Dr. Jean-Luc Pellissier joins EMS007 Editor Steve Gold for a discussion of the Vitronics-Soltec divestiture, the company's re-focusing effort, and how the R&D legacy in Binghamton must be relied upon for future growth to occur.
SMT China Hosts 2ndVISION Awards
(April 10, 2008) SHANGHAI, China — "China, despite the competition from neighborhood countries, appreciation of the RMB, tightening of government regulations; China's GDP is still growing at double digits," said Adonis Mak, group publisher, SMT China, during the magazine's presentation of its second annual VISION awards at Nepcon China. Winners received honors in SMT equipment, excellence in a specific metric, and China-centric awards. Following are the winners.
HP Consolidates Facilities Globally
(April 10, 2008) PALO ALTO, Calif. — HP will implement a major consolidation of facilities and security vendors for most of its worldwide facilities. This is expected to save tens of millions of dollars over the life of the new contracts, according to HP representatives.
Nepcon China Kicks Off in Shanghai
(April 8, 2008) SHANGHAI, China — Nepcon China, April 8–11 in Shanghai, will feature China-based and international exhibitors targeting the evolving Asia manufacturing base. Traditional low-mix/high-volume, medium- to high-mix/high-volume, and test-and-inspection are the focus of many exhibitors in this market. Following are some top products to look for at the show.
Moscow Event Draws International Exhibitors
(April 8, 2008) MOSCOW — ExpoElectronica exhibition and conference will take place April 15–18, 2008, in Moscow. ExpoElectronica is an officially audited tradeshow targeting electronics assembly operation in Russia and Eastern Europe. The show drew exhibitors from 21 countries in 2007. Following are some of the product highlights for the 2008 event.
Mentor, Agilent Pair Up for RF Design
(April 7, 2008) WILSONVILLE, Ore. and SANTA CLARA, Calif. — PCB design tool provider Mentor Graphics Corp. and Agilent Technologies Inc. jointly developed an RF design solution to improve productivity for the design of RF circuits on PCBs. The partnership targets shorter PCB design cycle times with increased collaboration, particularly in mixed-technology designs, which incorporate RF, analog, and digital components.
From the Show: IPC News Wraps Up APEX
(April 4, 2008) LAS VEGAS — IPC Printed Circuits Expo/APEX/Designers Summit, this week in Las Vegas, provided an international platform for diverse launches — in technology, collaborations, and products. IPC also unveiled several initiatives and awards at the show, including a joint symposium with the SMTA, volunteer and corporate honors, and best papers. APEX 2008 has come to a successful close, and IPC will return the show to Las Vegas in 2009.
From the Show: Henkel Acquires Adhesives Businesses
(April 3, 2008) LAS VEGAS — Henkel Corporation announced at APEX that they've acquired Ablestik and Emerson & Cuming for approximately $6 billion from National Starch. The companies will become part of Henkel's adhesives group, bringing in die attach, board-level interconnect, and related materials, along with intellectual property (IP) and a global manufacturing base.
From the Show: Designing for U.S. Volume Manufacturing
(April 2, 2008) LAS VEGAS — The standard mantra of the electronics manufacturing industry is that any volume of manufacturing will head overseas, and prototyping and new product introductions will stay domestic. While that argument holds true in many cases, certain exhibitors at the IPC Printed Circuits Expo/APEX/Designers Summit, taking place this week in Las Vegas, are introducing methods to keep larger-volume manufacturing in the U.S. and Europe.
From the Show: Inspection Takes on Limited Access
(April 2, 2008) LAS VEGAS — Test-and-inspection is a key segment of functional, successful SMT operations. At this year's IPC Printed Circuits Expo/APEX/Designers Summit exhibits, inspection-and-test equipment providers are displaying new solutions to deal with miniaturized components, leadless and BGA packages, and RoHS/anti-RoHS screening requirements.
From the Show: APEX Opens
(April 1, 2008) LAS VEGAS — The IPC Printed Circuits Expo/APEX/Designers Summit opens today, April 1, with new product introductions, partnership announcements, and live product demonstrations taking center stage.
ANSYS Acquires EDA Provider Ansoft
(March 31, 2008) SOUTHPOINTE, Pa. and PITTSBURGH — ANSYS Inc. will buy Ansoft
Corporation for approximately $832 million in a mix of cash and ANSYS common stock, leading to a combined software provider with trailing 12-month revenues of $485 million. The acquisition of Ansoft is ANSYS' first foray into the broader EDA software industry.
From the Show: APEX Cleaning & Alternatives Subcommittee
(March 30, 2008) LAS VEGAS — The exhibition hall doesn't open until Tuesday, but the IPC APEX technical conference is underway today, with the Cleaning and Alternatives Subcommittee taking place from 8 to noon. Mike Bixenman, DBA, Kyzen and William Kenyon, Ph.D., Global Centre Consulting, host the session, part of the Standards Development Meetings at the tradeshow in Las Vegas. Following is a brief description of the committee goals.
EI, Unimicron Partner in Organic Substrates
(March 28, 2008) ENDICOTT, N.Y. — Endicott Interconnect Technologies Inc. (EI) entered into a sales and manufacturing agreement with Unimicron Technology Corp. to produce CoreEZ organic substrates at one of Unimicron's Taiwan facilities. The PCB maker will supply high volumes of CoreEZ products under EI specs and requirements.
Technical Highlights: APEX
(March 25, 2008) LAS VEGAS — Technical presentations will take center stage at IPC Printed Circuits Expo/APEX/Designers Summit, April 1–3 in Las Vegas. Following are previews of select presentations taking place at the show, as well as links to other aspects of the technical program.
Agilent Launches Blended Test Technology
(March 24, 2008) SANTA CLARA, Calif. — Agilent Technologies Inc. will demonstrate a hybrid boundary scan and VTEP vectorless test solution, Cover-Extend, at APEX in Las Vegas, April 1–3 and Nepcon China in Shanghai, April 8–11, launching under its VTEP v2.0 Powered suite. Cover-Extend technology allows in-circuit test (ICT) without physical test points, recovering up to 50% of test node access and protecting assemblies.
ITW Completes Vitronics Soltec Acquisition
(March 21, 2008) STRATHAM, N.H. — Illinois Tool Works (ITW) acquired Vitronics-Soltec from Francisco Partners, adding the soldering equipment company to other holdings in the SMT space, such as Kester and Speedline. Financial amounts were not disclosed.
Intel Honors 13 Companies with Supplier Quality Awards
(March 19, 2008) SANTA CLARA, Calif. — Intel Corp. has named the 13 winners of the company's most prestigious award for suppliers: the Supplier Continuous Quality Improvement (SCQI) award. The honor, bestowed for outstanding commitment to quality and performance excellence in 2007, recognizes companies that provided products and services deemed essential to Intel's business success. Intel has also given thirty-five 2007 Preferred Quality Supplier (PQS) awards.
Novagard Releases Potting, Encapsulant, Conformal Coating Series
(March 19, 2008) CLEVELAND — Novagard Solutions released RTV 800 Series UV/dual cure and UV gels for use in potting, encapsulating, and conformal coating of delicate components, PCBs, lighting assemblies, and various wiring/current-carrying electrical devices. Cure speeds can be less than 3 sec.
Nunes Offering Green SMTAI Keynote
(March 18, 2008) MINNEAPOLIS — The SMTA Annual Meeting and Awards Ceremony at SMTA International (SMTAI), August 20, 2008, in Orlando, Fla., will feature a keynote presentation by Sharon Nunes, Ph.D., VP, Big Green Innovations, IBM Systems & Technology Group (STG). In her talk, Nunes will discuss IBM's approach to environmental challenges globally, and highlight ways that IBM is helping to tackle some of these important issues.
YESTech Names Regional Sales Manager
(March 18, 2008) SAN CLEMENTE, Calif. — YESTech Inc., a business of Nordson Corporation, added Scott Roberson as a regional sales manager, responsible for managing sales activity in the southern U.S. and overseeing YESTech's AOI product line for microelectronics applications.
Valor, Nagoya Partner on Inspection
(March 18, 2008) YAVNE, Israel and TOKYO — Valor Computerized Systems Ltd. established a technological partnership agreement with Nagoya Electric of Japan, which develops advanced automatic inspection equipment. The companies will integrate ODB++ PCB modeling and Valor's Part Library (VPL) onto Nagoya systems to shorten inspection setup times.
Matheson Tri-Gas Acquires Five Star Gas
(March 18, 2008) BASKING RIDGE, N.J. — Matheson Tri-Gas Inc. completed its purchase of Five Star Gas & Gear, adding five branches in southern California. The acquired company will become a part of the Matheson Tri-Gas Industrial Gas Group business unit. The move is in line with Matheson Tri-Gas's strategy to expand in the U.S. as a vertically integrated gases supplier, said William J. Kroll, chairman, president, and CEO, Matheson Tri-Gas, and executive director, Taiyo Nippon Sanso.
ECT Manager Receives the Patriot Award
(March 17, 2008) POMONA, Calif. — Joe Burns, operation manager, contact products group (CPG), Everett Charles Technologies (ECT), was honored with the Patriot Award during a ceremony at ECT's Ostby Barton division in Warwick, R.I.
Custom Connectors Use FR4
(March 17, 2008) SAN DIEGO — Autosplice will provide a custom connector fabrication service to prototypers through volume manufacturing, incorporating FR4 headers rather than special moldings. The company asserts that FR4 optimizes flexibility, costs, reliability, and lead times. Connectors are panelized and available in various thicknesses and with a range of pins/terminals.
Nepcon China Approaches
(March 17, 2008) SHANGHAI, China — Nepcon China, April 8–11 in Shanghai, will feature recent product releases from Chinese and global companies. Following are product previews from Kyzen, Kester, and a host of other exhibitors, as well as program previews from SMTA China, who will run events in conjunction with Nepcon.
Viscom Opens Applications and Training Center in Mexico
(March 15, 2008) DULUTH, Ga. — Viscom opened an applications and training center in Guadalajara, Mexico. The center, which features an AOI and X-ray applications lab, as well as training facilities and a demo room, was established to meet increasing demand in the Mexican electronics market.
RMD Expands Americas Representation
(March 14, 2008) WATERTOWN, Mass. — RMD Instruments LLC formally appointed Southwest Systems Technology Inc. as its manufacturing representative for La., Okl., Ark., N.M., and Mexico. The company named Advanced Precision Sales/WittcoSales as its manufacturing representative for territories within southern Calif./Baja.
SME Reveals Innovations Initiative
(March 14, 2008) DEARBORN, Mich. — The Society of Manufacturing Engineers (SME) announced a member-driven initiative, "Innovations That Could Change The Way You Manufacture," to outline emerging technologies that are making a positive impact on manufacturing, provide an educational framework for SME members and manufacturing practitioners to keep up-to-date on the industry's latest, and showcase advancements.
Textron Hosts SMTA Tour
(March 14, 2008) WILMINGTON, Mass. — Textron Defense Systems will host an SMTA technical presentation, "Understanding and Effectively Using XRF Technology for Components and Materials Inspection," including XRF demo, definition of capabilities, and an SMT facility and product showcase tour. Attendance is limited to the first 70 registrants.
YESTech Expands in China
(March 14, 2008) SAN CLEMENTE, Calif. — YESTech Inc. opened a new location in Shanghai, China, co-located with parent company Nordson's China facility at the Zhangjiang Hi-Tech Park in Pudong. The 8,000-sq.m. facility houses around 200 employees and operates as a "Center Of Excellence." Each division hosts a specialized customer demonstration lab.
KSR Adds Genesis Platform
(March 14, 2008) BINGHAMTON, N.Y. — KSR International selected the Genesis GC-120Q placement platform from Universal Instruments to meet objectives for in-house assembly speed and flexibility in a high-volume environment. KSR designs and manufactures electronics modules, controls, and closures for the transportation industry.
Assembléon, Valor Form Technology Partnership
(March 13, 2008) VELDHOVEN, the Netherlands and YAVNE, Israel — Assembléon BV and Valor Computerized Systems Ltd. have established a technology partnership, beginning by integrating Assembléon's pick-and-place machine interfaces into Valor's software products. Enhanced machine interfaces are available for Valor's process engineering control tool vPlan on Assembléon's A-, M-, and X-Series machines.
SMTA China Sponsors Certifications at Nepcon
(March 12, 2008) SHANGHAI, China — SMTA China will sponsor the SMTA Certified SMT Engineering Course and Examination, April 8–10 in Shanghai, in conjunction with NEPCON China 2008. SMTA China and ChinaECNet will organize the first course jointly with support by NEPCON China 2007.
IPC Names APEX's ITC Winners
(March 11, 2008) BANNOCKBURN, Ill. IPC — Association Connecting Electronics Industries chose products to highlight in the Innovative Technology Center (ITC) at the 2008 IPC Printed Circuits Expo/APEX/Designers Summit, April 1–3 in Las Vegas, showcasing new and emerging technologies from all segments of the electronic interconnect industry.
COTS Manufacturer Chooses XJTAG
(March 10, 2008) CAMBRIDGE, U.K. — Commercial off the shelf (COTS) and board-level designer/manufacturer Curtiss-Wright Controls Embedded Computing selected the XJTAG boundary scan development system to improve the process of debugging and testing its range of radar, video, and graphics products.
Nihon Superior, University of Queensland Collaborate
(March 10, 2008) OSAKA, Japan — Nihon Superior Co. Ltd. is collaborating with the University of Queensland (Australia) in the investigation of the growth and properties of the intermetallic compounds that form between solder alloys and the soldered substrate. The company sponsors research on lead-free solder at the university.
IPC Releases Board Ballot
(March 10, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries announced nominations for the IPC Board of Directors elections, which will take place at the IPC Annual Meeting luncheon, April 1, 2008, in Las Vegas, during APEX. Three officer and 10 director positions are open for election on IPC's Board for the period of April 2008 through March 2010.
Sono-Tek Creates Strategic Business Units
(March 10, 2008) MILTON, N.Y. — Sono-Tek Corporation formed two strategic business units (SBUs) reporting to Joseph Riemer, Ph.D., president. The SBUs comprise electronics and advanced energy, and ultrasonic coating solutions. The company also hired additional sales and applications development staff to complement the realignment.
IPC/JEDEC Plan March Reliability Conference
(March 7, 2008) RALEIGH, N.C. — IPC and JEDEC will present the International Conference on Reliability, Rework, and Repair of Lead-free Electronics, March 11–12, 2008, in Raleigh. This conference was planned to address the issues faced as a result of implementing a lead-free process, such as alloy choices, component compatibility, and solder concerns.
SMTA Awards PanPac Best of Conference
(March 7, 2008) MINNEAPOLIS — The Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition took place January 22–24, 2008 in Kauai, Hawaii. Speakers at PanPac promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. As rated by the attendees, "Best of Conference" was awarded to two presenters this year.
Sono-Tek Debuts Enhanced Website
(March 6, 2008) MILTON, N.Y. — Sono-Tek Corporation released a new company Website, located at www.SprayFluxing.com and www.Sono-Tek.com. Additional pages were added to the Sono-Tek site, focusing primarily on new ultrasonic spray fluxing products, solder recovery systems, and several new industries of growth into which Sono-Tek is expanding.
Trident Launches Inkjet for Printed Electronics
(March 6, 2008) BROOKFIELD, Conn. — Trident introduced the 256Jet-D inkjet print head globally, highlighting a durable, serviceable design and stainless steel construction. The print head enables various direct write, printable electronic applications with up to 5× higher resolution than screen printing, according to the company. The 256Jet-D suits printing traces, contacts, embedded passives, and components on PCBs, as well as flexible photovoltaics, fuel cells, and batteries.
Pre- vs. Post-reflow AOI Debate at APEX
(March 5, 2008) LAS VEGAS — Pamela Lipson, Ph.D., CEO, Imagen Inc. (Cambridge, Mass.) and Lyle Sherwood, VP and technical director, Landrex Technologies (Santa Clara, Calif.) will debate the impact of inspection pre- or post-reflow for electronics assemblers at APEX, April 1–3 in Las Vegas. Resources generally limit facilities to using inspection systems at select stages in manufacturing. Lipson and Sherwood will discuss the merits of deploying AOI prior to reflow or after.
PROMATION Intros High-volume Gate
(March 4, 2008) PLEASANT PRAIRIE, Wis. — PROMATION released an enhanced Passageway Gate system, the SCBL-77G, designed for high-volume production. The SCBL-77G offers a small footprint with a vertical buffering station to enable continuous production with the gate in use.
Hwang to Keynote "Women's Art, Women's Vision"
(March 4, 2008) WASHINGTON — Jennie Hwang, Ph.D., will keynote the celebration of Women's History Month organized by DoD Defense Supply Center, Federal Women's Program. The program theme is "Women's Art, Women's Vision." The luncheon, in conjunction with the Federal Woman of the Year award presentation, will take place March 26, 2008, at Whitehall Recreation Center.
Cobar Offering Bar Solder, SN100C Alloys in U.S.
(March 4, 2008) LONDONDERRY, N.H. — Cobar Solder Products, now part of the Balver Zinn Group, added bar solder and other solder products, including SN100C alloys, to its product offering of solder pastes, fluxes, and cored wire solders to U.S. electronics manufacturers. The additional products suit wave, selective, tinning, and similar applications.
Kyzen to Exhibit at ElectroTech 2008
(February 29, 2008) NASHVILLE — Kyzen Corporation will showcase AQUANOX A4625B and AQUANOX A4651US in representative Esman's booth D-120 at the ElectroTech Exhibition, February 28 to March 2, 2008 in Istanbul, Turkey.
January Book-to-Bill Below 1.00
(February 29, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics announced the January book-to-bill ratio for flexible and rigid PCBs fell below parity, ticking down to 0.97. The lower book-to-bill is typical of January, according to IPC, and should not be considered a downward trend.
Siemens E&A Appoints Americas Electronics VP
(February 29, 2008) NORCROSS, Ga. — Siemens Energy & Automation Inc. appointed Leonard D. Garrison II (Butch) as VP and GM, Electronics Assembly Systems Division (EA), effective immediately. Garrison was named acting VP in December 2007.
SMTA Opens Hutchins Grant Applications
(February 29, 2008) MINNEAPOLIS — The SMTA will accept applications for the $5000 Charles Hutchins Educational Grant through April 14, 2008. The grant is awarded annually to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field. Applicants must hold a student membership in the SMTA.
Electrolube Expands in U.S.
(February 28, 2008) NOVATO, Calif. — Electrolube, a division of HK Wentworth Ltd., opened corporate offices in Calif. and an operations center in Chicago as part of its Americas expansion plan. The company will build distribution, sales and marketing, and technical support from these U.S. bases.
SMTA's 1st President Passes
(February 27, 2008) MINNEAPOLIS — Norb Socolowski, first president of the SMTA and industry icon, passed away on February 14, 2008. He was 85. Norb is survived by wife Jean, who asks that any donations made in his memory be sent to the SMTA's Hutchins Educational Grant.
Henkel Nabs Prime Source Awards
(February 27, 2008) IRVINE, Calif. — The electronics and industrial groups of Henkel have been awarded "Prime Source Awards" from electronics distributor EIS (Atlanta, Ga.) The award ceremony included Jim Sharp, electronics group southeastern territory manager, Henkel; Ken Helfers, industrial group distribution account executive; and Bob Thomas, president and CEO, EIS.
Sono-Tek Assigned MediSonic Patent
(February 27, 2008) MILTON, N.Y. — Sono-Tek Corporation received a patent for MediSonic, a system of depositing thin organic films on complicated substrates, by the USPTO.
Nihon Presents on Lead-free at APEX
(February 26, 2008) OSAKA, Japan — Nihon Superior Co. Ltd. is contributing a paper, "Properties that are Important in a Lead-free Solder," to the technical conference at IPC Printed Circuit Expo/APEX/Designers Summit, April 1–3, 2008, in Las Vegas.
EI Recognizes Patenting Achievements
(February 26, 2008) ENDICOTT, N.Y. — Endicott Interconnect Technologies, Inc. (EI) honored 32 employees for patent applications filed, 23 employees for U.S. patents issued, and 16 employees for supplying trade secrets in 2007 at a February 8, 2008, ceremony in Binghamton, N.Y. EI employees contributed a total of 29 U.S. patent application filings, 18 U.S. patents issuances, and five trade secrets in 2007.
Kyzen Exhibits at SMTA Dallas
(February 25, 2008) NASHVILLE — Kyzen Corporation will showcase AQUANOX A4625 at the upcoming Dallas SMTA Vendor Show, March 5, 2008, in Dallas, Texas.
IPC, Tsinghua University Partner
(February 25, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries will undertake an initiative with Tsinghua University (Beijing) for a skill development program for electronics assembly. The program is slated to reach about 5,000 students in 500 vocational schools each year.
PDR Launches Flexible BGA/SMT Rework System
(February 25, 2008) WEST SUSSEX, U.K. — PDR released its professional hand-held rework system, the PDR IR-SolderLight Professional, targeting flexibility for SMT/BGA rework. The system is tip/nozzle free, gas free, sensitive to controls, clean, and is said to produce high-quality BGA rework without complications.
Enthone Plating Lab Opens
(February 22, 2008) WEST HAVEN, Conn. — Enthone Inc., a business of Cookson Electronics, opened its advanced plating applications laboratory at the West Haven facility, inviting local government officials to celebrate with employees and customers. Enthone began construction on the facility in July 2007.
FCT Develops Lead-free No-clean Paste
(February 22, 2008) GREELEY, Colo. — FCT Solder, a division of FCT Assembly, developed the NL900 no-clean lead-free solder paste for use in SAC and SN100C alloy systems. FCT is an authorized licensee of Nihon Superior Co. Ltd.'s SN100C product line. The paste offers repeatability and consistency, according to the company.
AAT Intros Low-standoff Cleaning Technology
(February 22, 2008) BURNET, Texas — Austin American Technology (AAT) released a calculated cleaning technology, Progressive Energy Dynamics (PED), targeting low-standoff components with spacing down to 1 mil in lead-free assembly environments. The approach incorporates a system of nozzles, manifolds, and pump technology.
Zestron Promotes Parthasarathy
(February 21, 2008) MANASSAS, Va. — Zestron promoted Ravi Parthasarathy, M.S.Ch.E., to senior process engineer, responsible for key account management in North America.
Ascentech Provides Henkel's SIR Testing
(February 21, 2008) CHESTER, Conn. — Ascentech LLC, North American distributor for GEN3 Systems Ltd. products, provided Henkel Corporation's Electronics Technology Center (Irvine, Calif.) with laboratory equipment for surface insulation resistance (SIR) and solderability testing, including the MUST III solderability tester and AUTO-SIR surface insulation resistance testing systems.
OEM Partnership Enhances MES
(February 21, 2008) BROMONT, Canada — Cogiscan Inc. and Kratzer Automation AG (Germany) entered into a OEM reselling agreement and partnership to integrate Cogiscan RFID tracking and traceability technology into Kratzer's EMS-focused products, including the intraFACTORY manufacturing execution system (MES).
Users Unsure on Converged Technologies
(February 20, 2008) SCOTTSDALE, Ariz. — In-Stat reports that conventional wisdom within the portable device industry is that consumers have a preference to use converged devices, meaning single devices that combine the functionality of previously separate devices. The research firm has found that wholesale adoption of a device that combines multiple devices is unrealistic, noting that a survey of U.S. businesspeople shows that users tend to remain loyal to older technology.
electronica 2008 Takes Broad View
(February 19, 2008) MUNICH, Germany — electronica 2008, November 11–14, 2008, in Munich, will present a range of electronics — from semiconductors and nanotechnology to automotive safety and EMS, following the motto, "Get the whole picture." The show includes four special focus areas and 15 specific sectors.
Sanmina Sells PC Business to Foxconn
(February 19, 2008) SAN JOSE, Calif. — Sanmina-SCI Corporation signed a definitive agreement with Foxteq Holdings Inc., a member of the Foxconn Technology Group, to sell certain assets of its personal computing business, along with associated logistics services in Hungary, Mexico, and the U.S. Beyond this sale to fellow EMS provider Foxconn, Sanmina also plans to transition a Mexico-based personal computing operation to PC-maker Lenovo Group.
SMTA Dallas Combines Conference and Vendor Days
(February 19, 2008) DALLAS — The SMTA Dallas Vendor Days and Technical Conference, March 5, 2008, at the Richardson Civic Center outside Dallas, promises a full exhibit hall along with several key technical presentations covering advanced packaging, counterfeit components, and related topics.
AOI System Inspects Multilayer Substrates
(February 15, 2008) MUNICH, Germany — EPP delivered several model STRATUS II AOI systems for inspection of electroplated gold, silver, and platinum. The AOI system's main application is inspection of screen-printed multilayers of ceramic thick film or LTCC substrates or LTCC foils.
Jim Raby to Deliver Keynote at Atlanta SMTA Expo
Jim Raby, renowned 50-year industry veteran, and founder, technical director and program manager at STI Electronics, will present the morning keynote, "An Industry Perspective: Past, Present and Future," at the 12th Annual Atlanta SMTA Expo.
Nihon Reviews Lead-free Wave at Flex Conference
(February 14, 2008) OSAKA, Japan — Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., showcased its SN100C products with FCT Assembly, a U.S.-based SN100C global partner, at the IPC's "International Conference on Flexible Circuits" in Phoenix, Ariz.
Optimal Focuses on Mexico
(February 13, 2008) AUSTIN, Texas — Optimal Electronics Corporation partnered with Test_ing, Tecnologia, Control y Automatizacion Industrial of Chihuhua City, Mexico, for sales and support in Mexico. Test_ing represents and supports Optimal Electronics' Optel MES software suite. Under the agreement, Optimal Electronics will work with the company to extend its MES software suite to communicate with automated test-and-inspection equipment.
WIN Highlights Automation
(February 12, 2008) ISTANBUL — The World of Industry (WIN) Electrotech exhibition will take place February 28 through March 2 in Istanbul. WIN Electrotech 2008 is a tradeshow centered on high-growth automation, electro-technology, and hydraulic and pneumatic sectors. Exhibitors will highlight equipment and consumables via regional distributors.
IPTE Releases Universal Scanner/AOI
(February 12, 2008) GENK, Belgium — The universal scanner system, EasyView, was introduced by IPTE to supplement its machine portfolio, offering a flexible in-line solution for barcode scans, component checks, and solder joint inspection. It uses an ADOMO camera system.
PROMATION Upgrades Manual Workstation
(February 11, 2008) PLEASANT PRAIRIE, Wis. — PROMATION released its latest version of the company's 1M in-line work station. The WT-100-2C XL is a 1000-mm-long workstation that can handle PCBs up to 18" × 18". The station has dual 500-mm drives, each with independent variable-speed control, front work surface, overhead lighting, and a rear parts bin panel.
Blue Thunder Offers ESD Products
(February 8, 2008) EAST WINDSOR, Conn. — Blue Thunder Technologies Inc., produced a line of ESD products for cleanroom and electronics assembly facilities. The offering includes worker attire, flooring, wipes and swaps, and other products.
Thales Nederland Selects Valor
(February 7, 2008) YAVNE, Israel — Military electronics manufacturer Thales Nederland, a member of the international Thales Group, expanded its use of Valor Computerized Systems, Ltd., process control tools, selecting the Process Engineering Solution.
PROMATION Bolsters Wave, Buffer Lines
(February 7, 2008) PLEASANT PRAIRIE, Wis. — PROMATION added features to its assembly tools, enhancing the OUC-500 wave conveyor with fan banks and the SCBL-99 buffer station with upgraded software. The additions suit better process control and lead-free line management.
Grieve Releases 650°F Soldering Oven
(February 5, 2008) ROUND LAKE, Ill. — The Grieve Corporation released No. 851, a 650°F electrically heated belt conveyor oven for soldering. The oven includes two 4-ft. insulated heat zones with independent recirculated airflow and temperature controls, a 12-ft. cooling zone with tube-axial fans moving air through it, and a variable speed conveyor that operates between 1.3 and 15.3 inch/min.
Plexus Chooses AXI System
(February 5, 2008) SANTA CLARA, Calif. — Agilent Technologies Inc. supplied EMS provider Plexus with a 3D automatic X-ray inspection (AXI) system. Plexus added the Medalist ×6000 to its test-and-inspection equipment, using the system to detect defects and screen new products.
Oxford Instruments Debuts Trace Analyzer
(January 31, 2008) OXON, U.K. — Oxford Instruments Analytical Limited, a subsidiary of Oxford Instruments plc, released the X-Strata980 X-ray fluorescence (XRF) analyzer. The tool uses a high-power X-ray tube and large LN2 detector to measure small areas on complex samples. Empirical and fundamental parameter calibration options enable set data analysis or element identification.
ASTM Seeks Award Nominees
(January 31, 2008) WEST CONSHOHOCKEN, Pa. — Standards developing organization ASTM International is seeking nominations for the William T. Cavanaugh memorial award, an annual recognition of an individual with eminence and broad contributions to the field of national and international voluntary standards.
IPC Releases Long-Term Business Report
(January 30, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries put out "Geographic Strategies for Global Expansion in the Electronic Interconnect Industry: Where to Invest for Long-term Business Growth," commissioned on behalf of its Executive Market and Technology Forum members. The report is a comprehensive resource for companies making long-range plans for global and local expansion.
IEC Reports Strong First Quarter Results
"Continuing our look forward, we do not see at this time any slowdown in our orders. Our backlog has actually grown modestly during the quarter and, overall, we do not seem to be encountering recession sentiment in our markets as suggested by the securities markets and the media."
December Book-to-Bill Stays Positive
(January 29, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries released the December 2007 book-to-bill ratios for rigid and flex PCB production in North America. The book-to-bill slipped in rigid and flex segments, hitting 1.01 for combined markets.
EFD Releases PicoDot Jet Dispense
(January 29, 2008) EAST PROVIDENCE, R.I. — EFD Inc., a subsidiary of Nordson Corporation, debuted the next-generation PicoDot jetting dispense system, targeting high precision for a range of fluid viscosities. The dispense system suits miniaturized assemblies and 3D or uneven substrates for adhesive, coating, and other fluid applications.
Zestron Asia/Pacific Expands
(January 28, 2008) MANASSAS, Va. — ZESTRON Asia/Pacific relocated to a larger facility, in the Zun Xuan Industrial Park of Shanghai, China. The location features the company's largest Asia/Pacific Application Technology Center.
Vitronics Soltec Upgrades XPM2 Reflow
(January 28, 2008) STRATHAM, N.H. — Vitronics Soltec introduced an enhanced XPM2 reflow platform, XPM2+, featuring upgraded conveyor, cooling, electrical controls, software, and user interface, as well as a leaner external body.
Professional Development at APEX
(January 28, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries will promote reliability in lead-free, high-density interconnects (HDIs), design for reliability (DfR), and other topics for more than 60 professional development courses March 30–31 and April 3 at IPC Printed Circuits Expo/APEX/Designers Summit in Las Vegas. Courses are half- and full-day classes with expert speakers.
Master Bond Debuts Harsh-environment Adhesive
(January 28, 2008) HACKENSACK, N.J. — Master Bond released the EP11SIC silver-filled one-component conductive adhesive. It suits applications requiring electrical connections for sensitive components in severe operating conditions, resisting mechanical and thermal stresses.
TechSearch Lauds Embedded Components
(January 25, 2008) AUSTIN, Texas — TechSearch International released "Embedded Active Components and Integrated Passive: Technologies and Markets," a report detailing the technologies, processes, and infrastructure for embedded components. TechSearch expects embedded components to see double-digit growth across market segments in coming years.
IPC Calls for Midwest 2008 Papers
(January 24, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries issued a call for participation for the IPC Midwest Conference & Exhibition, September 23–28, 2008, in Schaumburg, Ill. Researchers, academics, technical experts, and industry leaders are invited to submit an abstract for the technical conference on any aspect of electronics manufacturing.
Sanmina-SCI Announces Earnings for Q1: Outlook Improving
"Our second quarter has historically been seasonally down, but we are cautiously optimistic about our outlook based on what we currently have in the pipeline from new and existing customers. We expect to continue to strengthen our results, improve profitability and generate free cash flow throughout fiscal 2008," continued Sola.
SOMACIS Opening Advanced PCB Plant
(January 23, 2008) MANFREDONIA, Italy — SOMACIS pcb industries will start production of a next-generation of PCBs at two R&D facilities in Italy, Castelfidardo and Manfredonia. The Manfredonia plant is under construction and will begin producing the high-technology PCBs in the first half of the year.
Zetex Unveils Current Monitor
(January 22, 2008) HAUPPAUGE, N.Y. — Zetex Semiconductors released the ZXCT1080 current monitor, boasting an extended common-mode-sensing voltage range of 3 to 60 V. The component reduces errors in translating actual measured current into input sense current required, as well as overall power consumption. An automotive AEC-Q100-qualified version also is in development.
IPC Issues Reports, Recommendations
(January 22, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries commissioned a report on miniaturization and electronics manufacturing, conducted by Prismark Partners (Cold Spring Harbor, N.Y.). The association also weighed in on the European Commission's review of RoHS, suggesting that the EU consider technical, environmental, and resource impacts of additional RoHS action.
ProtoDesign Chooses DEK Horizon 03i
(January 21, 2008) UTICA, Mich. and FLEMINGTON, N.J. — ProtoDesign, Inc., a design and electronics services firm targeting medical, industrial, security and public service sectors, partnered with DEK to use the Horizon 03i platform. ProtoDesign will implement the printing system on its automated production line, and expects to double throughput over the coming year.
The Morey Corp. Adds Management
(January 18, 2008) WOODRIDGE, Ill. — Matt W. Williams joined The Morey Corporation's sales and marketing team as business development manager, focused on the commercial telematics market. He will concentrate on wireless, GPS, vehicle data-bus technologies, and other telematics hardware nearing full-scale commercial adoption.
Sunburst Appoints Western Rep
(January 18, 2008) WEST BRIDGEWATER, Mass. — Silver Mountain Design will represent Sunburst EMS's line of manufacturing and design services in the western U.S. Silver Mountain operates offices in Nev., Ariz., N.M., and southern Calif.
Rockwell Intros Linear Stages
(January 18, 2008) MILWAUKEE — Rockwell Automation released the Allen-Bradley MP-Series line of integrated linear stages for OEMs and machine builders, targeting a range of load-carrying applications. The products are designed to be off-the-shelf replacements for proprietary designs, reportedly reducing time and costs of design, programming, and commissioning.
EI Develops High-complexity PCB
(January 17, 2008) ENDICOTT, N.Y. — Endicott Interconnect Technologies Inc. (EI) created a large, high-complexity PCB controller board that functions as the intelligence of a powerful and advanced optical packet switch. The PCB was fabricated for IBM Zurich Research Lab, and required deep blind vias joined with a proprietary EI process technology.
