Alejandro Castellanos, et al of Flextronics explains how this company uses X-ray inspection to fight head-in-pillow defects. Ronald Frosch of AT&S discusses a novel method for forecasting drop shock performance. Rob Humphrey of XJTAG looks at a variety of ways to achieve signal integrity in test fixtures. Alan Albee of Teradyne focuses on the changing economics of in-circuit test. And NK Chari of Agilentexplains solid management practices for PCBA test.
You’ll also find an article by Dan Hoz of Mentor Graphics, as well as columns by Dr. Jennie Hwang, Ray Rasmussen, Todd Kramer, and Sjef van Gastel.
All this, plus industry news highlights and upcoming events, can be found in this month’s issue of SMT Magazine.
The April issue of SMT Magazine addresses SMT Assembly Processes, including stencil paste printing/dispensing, component handling, ESD control, component placement, and odd-form placement.
The issue features 3M's James T. Adams, explaining how to find the perfect cover tape; Dr. Bill Coleman, vice president of technology at Photo Stencil, addressing the stencil printing of small apertures; Ricky Bennett and Eric Hanson covering low surface energy coatings; and many more articles and columns from industry experts, including, Zulki Khan, Eric Klaver, Karla Osorno, and Michael Ford.
It must be summer, because this month, SMT Magazine is turning up the heat on thermal management! Features include Gregor Langer, Markus Leitgeb, et al., who look into advanced thermal management solutions for high-power applications.
Carlos Montemayor investigates the high-temperature reliability limits for silicone adhesives, and Mark Challingsworth examines trends in thermal management for electronic circuits.
The March issue of SMT Magazine looks at the industry’s many environmental issues, including the impact of legislation with a focus on RoHS and REACH compliance and enforcement, ITAR compliance, conflict minerals, and corporate social responsibility.
Also included in this issue is our exclusive IPC APEX EXPO 2013 post-show coverage. Our veteran team of guest editors and staff bring you the latest from the show floor, including new technologies and products, a review of key panel discussions, and, of course, our in-depth Real Time with… video interviews.
The February issue of SMT Magazine addresses cleaning and coating: Conformal coating inspection methods; the effective removal of OA flux residues; plasma polymerization for conformal coating; benchtop PCB cleaning; and an in-depth comparison of conformal coatings.
This issue also features our exclusive IPC APEX EXPO 2013 Pre-show Coverage, which includes information on technical conference sessions, standards development meetings, certification programs, IPC Buzz Sessions, a Real Time with... video overview, and much more.
In this issue we focus on what's current and what the future holds for PEC.
Dr. Harry Zervos of IDTechEx presents a case study on printed electronics suppliers, cost structures, and challenges. Sumit Kumar Pal of Frost & Sullivan's Technical Insights explains how traditional processes are enabling next-gen technologies such as printed electronics.
And columnist Joe Fjelstad of Verdant Electronics puts printed electronics in historical perspective, discussing PEC's potential future uses and inherent limitations. I-Connect007 editor Richard Ayes discusses printed electronics assembly with Rafael Nestor Mantaring of Integrated Micro-Electronics Inc.
You’ll also find an article on inline AXI technology by a new contributor, Ondrej Simecek of Test Research Inc., as well as regular columns by Michael Ford and Ray Rasmussen.
All this, plus industry news highlights and upcoming events, can be found in this month's issue of SMT Magazine.
What better way to start the New Year than with a focus on management?
The January issue of SMT Magazine has every aspect covered, with articles from Components Direct’s Steve Martin addressing the impact of e-commerce on the component supply chain; George Henning of OCM Manufacturing advising how to choose between turnkey and consignment manufacturing; ESCATEC’s Daniel Pfeifer explaining how to give your global company a local advantage; and much more.
As always, read the latest columns from Editor Ray Rasmussen, Dr. Jennie S. Hwang; Karla Osorno; and more.
Scott Zerkle of Yamaha Motor IM leads off our line-up of features this month, with A Robot’s Place in SMT. Our comprehensive coverage of automation for assembly also includes Mentor’s Michael Ford, Zentech’s Waleid Jabai, Integrated Micro-Electronics’ Michael Hansson, and more!
This month, you’ll find feature articles by Dr. Peter Harrop of IDTechEx, and Joe Fjelstad of Verdant Electronics, as well as an article on alternative solvents by Rajat Basu and Ryan Hulse of Honeywell International. We’re also introducing a new columnist, Robert Voigt of DDM Novastar, who discusses how to select the right SMT equipment.
The Rise of Structural Electronics by Dr. Peter Harrop
3D Printing in Electronics—a Perspective by Joe Fjelstad
An Alternative Solvent with Low Global Warming Potential, by Rajat Basu and Ryan Hulse
The Way I See It: The Tipping Point, by Ray Rasmussen
SMT Quick Tips: How to Select a Stencil Printer, by Robert Voigt
The Short Scoop: Stencil Printing in PCB Cavities, by Rachel Miller-Short
SMT Magazine delves into alternatives to soldering this month, with experts from Lockheed Martin and Verdant Electronics, who offer their perspectives on this hot topic. In other articles, contributors from CML EurAsia offer their take on sourcing concepts for PCBs, and I-Connect007’s Richard Ayes interviews Jabil Circuits Inc on the topic of flexible manufacturing. Don’t miss this issue!
Technologists have studied tin whiskers for decades, but the proliferation of lead-free electronics has pushed these microscopic fibers to the forefront of assembly challenges. This month, the mitigation of tin whiskers is tackled, with articles by Dr. Ron Lasky (Indium); Dr. Viktor Karpov (Univ. of Toledo); Dr. Jennie Hwang (H-Technologies); Dr. Michael Osterman (CALCE); Andrzej Czerwinski (Institute of Electron Technology); Scott Sentz (AEM); and Dave Hillman (Rockwell Collins).
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In the November issue of SMT, feature article contributors Paul Wood (OK International/Metcal), Joerg Nolte (Ersa GmbH) and Bob Wettermann (BEST Inc.)deliver updates on the latest rework and repair processes and equipment.
Non-feature contributions include technical articles from Plasmatreat, Henkel, and Sonoscan. Plus, fresh Real Time with... videos straight from SMTAI 2014.
Industry experts from Indium, Mentor Graphics, and Alpha Circuit are on hand this month to guide us through issues related to thermal management, including latest trends, alternative approaches and streamlining PCB thermal design.
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Our year-end issue takes a look forward to 2015, with features from Mentor Graphics’ Michael Ford, Alpha Circuit’s Yash Sutariya, Sanmina’s Mulugeta Abtew, and IMI’s Frederick Blancas. Don’t miss this Outlook 2015 issue that addresses the supply chain, SMT advancements, production planning, and more!
This month, experts from Indium, Inventec, Vitronics, Micronic Mydata and BEST Inc. weigh in on soldering technologies and solutions, from reliability issues to position accuracy machines and alternatives to polyimide tape, and more!
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Videos: Real Time with…IPC APEX EXPO 2015: Brian Chung, Nordson Asymtek and Michael Ford, Mentor Graphics
We’ve seen a myriad of developments in lead-free solder and surface finishes since RoHS went into effect seven years ago. But the state of lead-free changes almost every day. In the October issue of SMT Magazine, our contributors and columnists explore the often confusing world of lead-free processes. Nihon Superior’s Tetsuro Nishimura discusses the bleeding edge of lead-free soldering. And a case study by Continental Corporation’s José Mar’a, Serv’n Olivares and Cynthia Gómez Aceves details how TOF SIMS analysis helped provide insight into wetting issues with lead-free HASL processes.
As always, this month we feature columns by our team of experts, including Ray Rasmussen, Michael Ford, Sjef van Gastel, Rachel Short, and Zulki Khan. All this, industry news highlights, and upcoming events can be found in this month’s issue of SMT Magazine.
This month, experts from Flextronics, Ericsson AB, MTEK Consulting AB, and Speedline Technologies contribute to our features focusing on paste printing and component placement.
Miniaturization with the Help of Reduced Component-to-Component Spacing, by Jonas Sjoberg, et al., Dow Chemical Company
Solder Paste Printing: Quality Assurance Methodology, by Lars Bruno, Ericsson AB and Tord Johnson, MTEK Consulting AB
Enclosed Media Printing as an Alternative to Metal Blades, by Michael L. Martel, Speedline Technologies Inc.
SMT Quick Tips: Selecting an Automatic Pick-and-Place Machine, Part 3, by Robert Voigt, DDM Novastar
The repair and rework of packages is becoming more complex and expensive, especially with today’s advanced packages. In the November issue of SMT Magazine, our contributors and columnists get to the bottom of rework, modification and repair. Air-Vac Engineering’s Brian Czaplicki discusses the advanced rework of bleeding-edge packaging systems. And an article by Jet Propulsion Laboratory’s Reza Ghaffarian, Ph.D., details the rework and reliability of high-I/O CGA assemblies.
As always, this month we feature columns by our team of experts, including Ray Rasmussen, Dr. Jennie Hwang, Karla Osorno, and Eric Klaver.
All this, industry news highlights, and upcoming events can be found in this month’s issue.
This month, feature contributors from Keysight Technologies, XJTAG, Göpel and Sonoscan shed light on the trends and challenges of test and inspection.
High-Density Interconnect and Embedded Board Test, by Mark Lau, Keysight Technologies Inc.
Test Match—Partnering Specialist Boundary-Scan with ICT, by Robert Thompson, XJTAG
In-line Solder Penetration Testing with 3D X-ray Inspection, by Andreas Türk, Goepel Electronic
Acoustic Surface Flatness of Components and Boards, by Tom Adams, Sonoscan Inc.
Event Review: 6th Electronic Materials and Processes for Space Workshop (EMPS-6), by Barrie Dunn, EMPS
Interview: Inspection—the Last Line of Defense, by Barry Matties with Viscom’s Guido Bornemann
Across the Board: In-Circuit Pin Testing: An Excellent Potential Source of Value Creation, by Mitch Holtzer, Alpha
As 2013 comes to a close, our columnists look back on the past year and make predictions for the upcoming year. In the December issue of SMT Magazine, Publisher Ray Rasmussen wraps up 2013 and discusses what we might expect to see in 2014. Dr. Jennie S. Hwang looks back on her predictions from last year and details where she got it right, and wrong. Rachel Short explains why your relationship with your stencil maker will be so important in 2014. And Michael Forddiscusses why he believes electronics manufacturing is experiencing its "teen" years: Full of expectation, but lacking capital.
As always, this month we feature columns by our team of experts, including Sjef van Gastel, Zulki Khan, and Karla Osorno.
This month, SMT Magazine tackles the supply chain—from various approaches to making it work for you, to what history has shown about its many iterations, and how some suppliers are setting the bar very high for the future of supply chain management.
This month, we take on those pesky process failures—from soldering defects and device cleanliness, to challenges of mission-critical product and the link between head-in-pillow defects and warpage.
The War on Soldering Defects: HiP and NWO by Jason Fullerton
Declaring War on Failure in Electronics by Joe Fjelstad
Collaboration: OEM & EMS to Combat HiP Defects by Alex Chan et al.
Case Study: Detecting Process Defects by Bob Willis
Interview — Stencils: Why They Still Matter by Barry Matties
A Letter from the New Editor by Stephen Las Marias
Don't Allow Standards to Get the Better of You by Michael Ford
Selecting a Reflow Oven, Part 1 by Robert Voigt
Supply Chain Risk Mitigation Applications for the Grey Market by Stephan Halper
This month, Trace Labs’ Renee Michalkiewicz covers the corrosion and reliability characteristics of fluxes; Nihon Superior supplies a comprehensive analysis of lead-free solder joint reliability and Cisco offers a complete look at predicting pad crater failures. Steve Williams and BFK Solutions round out our line-up of features!
Don’t miss new Real Time with… video content from HKPCA and productronica 2013!
It’s no secret that packages are becoming denser all the time. But how does this affect the PCB assembly process? In this issue of SMT Magazine, our expert contributors explain the ins and outs of high-density packaging, as well as tips and techniques for dealing with packages chock full of ever-increasing levels of technology.
Hear from our contributors and columnists as they discuss best practices for assembling today’s high-density packages. Atotech’s Olaf Kurtz, Jürgen Barthelmes, Eckart Klusmann, Robert Rüther, and Stephen Kenny discuss strategies for using layers of cost-effective palladium. And a team from Altera Corporation and Amkor Technologypresent a case study that evaluates the use of molded flip-chip BGA packages in 28nm FPGAs.
As always, catch up on the latest columns from Sjef van Gastel, Rachel Short, Michael Ford, Karla Osorno, Zulki Khan, and much more.
In Part 2 of our assembly process series, SMT Magazine helps make the connections! This month, we dig deeper into the no-clean vs. water-soluble solder paste argument, the overstress of components during the soldering process, the feasibility of low/no-silver solder pastes, the influence of microstructure on bismuth lead-free solders, and high-temperature assembly materials.
Plus: IPC APEX EXPO preview!
Thermal management is in the hot seat this month, with feature contributors from Koki Company Ltd., Christopher & Associates, Air-Vac Engineering, and Verdant Electronics, taking on a range of thermal management issues, including applications of lead-free alloy solder pastes, through-hole rework of thermally challenging components and assemblies, and so much more!
From our columns department, Jennie Hwang, Karla Osorno, Eric Klaver and Ray Rasmussen are on hand to enlighten and inform.
Don’t miss our highlights, with current headlines from throughout the industry and feature video from our Real Time with... series.
This month, our cover story from Shea Engineering Services probes the stencil manufacturing process, including stencil printing experiments. Also featured this month: Testing Intermetallic Fragility on ENIG upon Addition of Limitless Cu (Universal Instruments Corp.); Making Sense of Accuracy, Repeatability and Specification for Automated Fluid Dispensing (Nordson ASYMTEK); Big Ideas on Miniaturisation(DEK).
Don’t miss new Real Time with… video content from productronica 2013, SMTA and more!
The theme for the June issue of SMT Magazine is high-reliability with a focus on standards and specifications; counterfeit components; certification; security, testing, and quality assurance issues.
Read in-depth articles from the best in the industry including Ed Habtour, U.S. Army Material Systems Analysis Activity, and Cholmin Choi, Michael Osterman, and Abhijit Dasgupta, CALCE. The feature article presents a novel approach to improve reliability in U.S. Army vehicles. Lavanya Rammohan, Frost & Sullivan, explains the EMS provider’s role in combating counterfeit components.
As always, the June issue also includes several columns from our industry experts, including Derek Snider, Michael Ford, Rachel Miller-Short and Karla Osorno.
In Part 3 of our assembly process series, SMT Magazine uncovers what happens after the soldering process in an issue devoted to cleaning and coating. How clean is clean? Which cleaning process is best suited for which technology? These questions and more are addressed this month by experts from University of Denmark, AIM Solder and NexLogic.
Plus, show coverage from IPC APEX EXPO, including interviews, overviews, pictures and more!
The May issue of SMT Magazine focuses on soldering issues and features authors from Rehm Thermal Systems and Balver Zinn who examine the surface tension and load-carrying capacities of solder. Seth J. Homer and Dr. Ron Lasky of Indium Corporation discuss ways to reduce voiding in QFN packages.
Additional articles and columns from industry experts, including, Dr. Jennie Hwang, Zulki Khan, Sjef van Gastel, Karla Osorno, and new columnist Rachel Short can be found in the issue as well.
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