Review from Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs
"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."
Review from Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies
"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."
Review from Jason Keeping, Global Process Subject Matter Expert, Celestica
"We live in a harsh world where protection is needed. Ruggedization is one of the fundamental processes that can help. This book provides a great summary of one of these key capabilities."
Review from Gus Becerra, Principal Manufacturing Engineer, Marvell
"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities.
"
Review from Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
"This book provides unprecedented visibility of SMT processes, asserting inspection technology as a key active contributor to zero-defect quality initiatives, rather than being limited to simple defect detection."
Review from Mike Cummings, Technical Director, TSI
"What I like about this book is it's not based on fear marketing; rather, it is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes."
Review from Tara Dunn
"This book is a terrific resource for both those new to flex design and those more experienced looking to streamline the design to fabrication transition."
Review from Bob Tise, R&D Engineer, EMP Shield
"PCB design is as much art as science. While reading this book will not, itself, make you a professional PCB designer, it will help you make better decisions and trade-offs, saving time and money."
Review from Lambert Schutters, General Manager,
ESCATEC Penang
"We need the right tools to create the best design for the intended purpose. This book is a great introduction and guide on how to approach the process holistically."
Review from Jan Pedersen, Director of Technology, NCAB Group
"The importance of total thermal resistance has been an eye opener for me from being focused on one material’s thermal conductivity to understanding the total thermal behavior of a material stackup."
Review from Michael Ingraham
"Finally, a book on stackup design for designers that focuses on high-speed applications. This is a much-needed resource for the design community, and there is no one better or more qualified to write it than Bill Hargin."
Review from Gerry Partida, VP of Technology, Summit Interconnect
"Michael Gay’s book is a concise and detailed explanation of the critical materials that makes up a PCB. His thorough explanation will help any engineer, designer and fabricator understand the impact of the material selection in a PCB stackup. This book is truly a gift to the electronics industry and I thank him for sharing his knowledge with us."
Review from Joe O'Neil, Principal, OAA Ventures
"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."
Review from Lee Ritchey, Founder and President, Speeding Edge
"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."
Review from Happy Holden, Consulting Technical Editor, I-Connect007
"This book provides good education, with examples and explanations to help the reader understand how the smart factory can improve performance and competitiveness."
Review from Denis Boulanger, Principal Manufacturing Engineer, Raytheon Technologies
"This book provides a comprehensive look at thermal management and PCB design issues from the fabricator’s perspective. I am glad that it exists now that I have 'gone over to the dark side,' where I am a consumer rather than a fabricator and/or material supplier.
"
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
"
Review from Farid Anani, VP of Operations, Computrol Inc.
"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally."
"
Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison
"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."
Review from John R. Watson, Legrand North America
"At a time when electronics are not just taking small steps but rather large leaps forward, this is an appropriate book for anyone working with PCB design. With countless and ever-changing steps involved in every design, it presents a clear understanding of the process. This book will be the go-to reference for all of our designers at Legrand North America."
Review from Alex Stepinski, vice president, GreenSource Fabrication
"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences.
"
Review from Dan Beaulieu, president, D.B. Management
"If you are serious about creating the best, most perfect data packages available today, do yourself a favor. Download and read this book. It’s simple—the better the package, the better the board.
"
Review from Happy Holden, Consulting Technical Editor, I-Connect007
"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."
Review from Andy Shaughnessy, Managing Editor, Design007 Magazine
"This book will help the reader gain a comprehensive understanding of the physical realities of insulated metal substrates and their applications in the thermal management of electronic assemblies."
Review from Judy Warner, director of community engagement at Altium
"This concise, yet very thorough eBook is destined to become every RF
and microwave engineer's PCB fabrication bible. ASC shares every key
aspect to successfully fabricate these incredibly challenging boards."
Review from Eric Bogatin
"The Printed Circuit Designer’s Guide to… Power Integrity by Example from Mentor, A Siemens Business, explores the specific problem of via-to-via coupling through a cavity starting from the ground floor."
Review from Dr. Helmut Schweigart, Technology Development Head, Zestron Europe.
"This micro eBook offers a comfortable approach to the selection, implementation, and testing of protective coating processes. It would be especially helpful for starters to use as a checklist for operational implementation."
Review from Eric Bogatin
"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."
Review from Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.
"I wish I had these books when I was starting out in my career."
Review from Andy Shaughnessy
"This book has everything you need to know about solderless assembly process, which could be the most innovative—and disruptive—technological development in our industry’s history."
Review from Eric Bogatin
"The Printed Circuit Designer's Guide to... Secrets of High-Speed PCBs, Part 1 pulls back the covers to illustrate the practical principles behind many of the confusing topics that arise in the overlap between manufacturing, materials, and signal integrity performance."
Review from Andy Shaughnessy
"There are plenty of PCB books available now, but not many focus on DFM. Altium’s new e-book, The Printed Circuit Designer's Guide to...Design for Manufacturing (DFM), has everything you need to know to get your board ‘right the first time."
Review from Andy Shaughnessy
"This may be the single best source of info about the AS9100 certification. Easy to digest yet full of details, it’s all here: from start to finish..."