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Medical OEMs and others moving toward developing and producing small, portable products may want to investigate the emerging technology of thermal compression bonding or TCB. TCB is ideally suited for miniature products that use fine pitch flip chip devices undergoing PCB microelectronics assembly.
The I-Connect007 Editorial Team recently spoke with John Vaughan, Greg Halvorson, and Brett McCoy of Summit Interconnect about their capital expenditure (CapEx) strategies. They discuss the challenges they face when planning CapEx after acquiring fabricators with different capabilities, and the need to have dedicated funds ready for expenditures each year.
What is a quality management system (QMS)? Over the years I’ve had it explained to me and exposed to many different definitions and forms of what a QMS is. By the way it wasn’t always called a quality management system,...
There are some very simple steps to developing and sustaining a good partnership with your PCB vendor/partners, all based on treating your partners as you want to be treated. It's following the Golden Rule. But before you do that you...
Whether it’s from naturally occurring sources or induced by modern human ingenuity, electronic components, like everything else, are subject to regular exposure to radiation. It is vital to understand the various sources of...
