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This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.
As president and CEO of the global electronics industry association, I have many opportunities to visit electronics manufacturing companies worldwide. Recently, while in India, I had the pleasure of attending Integrated Electronics Manufacturing & Interconnections (IEMI), a celebration of 10 years of IPC activities in India, Sri Lanka, Bangladesh, and the middle east Africa region. I was encouraged by how much growth has occurred over the past decade. Poised to become a global manufacturing hub, India is emerging as a dynamic market for our industry. The government has opened its doors to foreign investors, laying out the red carpet for manufacturing companies, and the industry is thriving.
Mergers and acquisitions in North America in the PCB and EMS sectors during the first eight months of 2022 were down compared to the same period in 2021. In the PCB sector, we counted four deals in 2022 compared to seven during the...
Now more than ever we need to work with one another. The times have evolved to where no one can do it alone. All the challenges that were brought on by the pandemic have only accelerated the need for finding new and innovative ways to...
While the novelty may have worn off, let’s take one last look at my favorite BGA image. In part 2, we discussed issues of coplanarity, shorts and head in pillow. Now we will review the other common BGA assembly issues,...
