-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Today’s Mil/Aero Enemies: Counterfeits, Obsolescence and Failure
July 3, 2017 | Stephen Las Marias, I-Connect007Estimated reading time: 1 minute
The military and aerospace markets require high-reliability electronics, components and assemblies that can perform in harsh operating conditions involving extreme temperatures, vibration, and moisture, to name a few. These issues continue to challenge electronics assembly providers. These are on top of current manufacturing issues such as the miniaturization of products, shrinking component sizes, higher density board assemblies, and the obsolescence of electronic components, as these systems, such as fighter jets and commercial planes, must function for up to 20 years.
In our recent survey on military and aerospace, a majority of the respondents point to obsolete parts and components—and also the dwindling number of sources for legacy parts—as among their biggest issues in military/aerospace electronics assembly. Another issue is the reliability data of commercial technology components and how they can be used in military and aerospace products.
Raw material and component lead times are also an issue, along with increasing requirements from customers such as inspection and documentation, and compliance to multiple regulatory standards, such as ITAR, DFARS, AS9100, and NADCAP.
One of the compliance issues highlighted in our survey, and also discussed during our interview with the team of mil/aero experts who helped us plan this issue, is cybersecurity. This group included Freedom CAD’s COO Scott Miller, Lenthor Engineering’s VP of Marketing Dave Moody and VP of Sales/Engineering John Rolle, and Zentech’s CEO and President Matt Turpin and VP John Vaughan. Our experts focused on cybersecurity, in particular, the NIST Special Publication 800-171, published by the National Institute of Standards and Technology, which describes the US government security controls for unclassified information in non-federal information systems and organizations.
To read the full version of this article, which appeared in the July 2017 issue of SMT Magazine, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.