-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
The Convergence of 5G and Automotive
January 8, 2020 | Barry Matties, I-Connect007Estimated reading time: 1 minute
Karthik Vijay is head of the applications engineering team for customers in Europe at Indium Corporation. He spoke with Barry Matties about what EMS or assemblers for automotive should consider, as well as how he thinks 5G will affect the marketplace and manufacturing.
Barry Matties: How do you see the automotive market and 5G?
Karthik Vijay: These are two massive markets, and we are really excited to play in these verticals with innovative material sets. To put that in the automotive perspective, opportunities with powertrain electrification platforms (e.g., 48V, hybrid electric vehicles, electric vehicles) and advanced driver assist systems (ADAS) are exploding. The foundations of this work will facilitate the innovations for the full-electric driverless car of the future. That’s what is making it really exciting because I see this as a once in a 20–30-year opportunity. Automotive typically doesn’t adapt to new material sets that quickly, and rightfully so because there’s a lot of reliability testing and lifetime criticality that needs to be validated. That’s still happening, but the goalposts are changing pretty fast. With 5G, we are involved in various stages of the ecosystem right from the material sets inside the components to the base-stations used. To give you an example of the convergence of 5G and automotive, V2X is a core platform that will be facilitated by 5G. That means that the vehicle is connected to everything: vehicle-to-vehicle, vehicle-to-tower, vehicle-to-people, etc. As mentioned, both the automotive and 5G markets are open to innovation, and it is a great time to be involved with new material sets.
Matties: What opportunities are you seeing? Vijay: If you look at electrification, a direct consequence of moving up the electrification chain is increased service temperatures. Standard alloys like tin/silver/copper [SAC] are not going to make the cut, and there is an immediate opportunity for high-reliability solders in PCB assembly.
To read this entire interview, which appeared in the December 2019 issue of SMT007 Magazine, click here.
Suggested Items
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.