-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
True or False: CFX Edition
February 6, 2020 | David Bergman, vice president, Standards and Training, IPCEstimated reading time: 1 minute
Early in 2019, IPC published IPC-2591— Connected Factory Exchange (CFX), Version 1.0. This standard was developed by the IPC Connected Factory Initiative Subcommittee over a two-year period to address issues with machine-to-machine communication and provide the electronics manufacturing industry with a true plug-and-play system for any company to achieve Industry 4.0.
Since the release of the standard, there has been a lot of buzz regarding CFX within the industry from all segments, including EMS companies, equipment manufacturers, and software solution providers. The Subcommittee has grown to 275 members, with an additional 63 members on the 2-17-CN Connected Factory Initiative Subcommittee in China, and 94 companies have declared their support on the CFX website. Additionally, 24 companies have shared their CFX implementation roadmaps on the CFX website, with more roadmaps coming in on a regular basis. You can view the supporters, roadmaps, and a library of helpful CFX resources at ipc-cfx.org.
Still, with all of the buzz, there are also some misconceptions floating around the industry regarding CFX, how it is used, the need for middleware, and how it stacks up against other standards for Industry 4.0. Thus, I thought it would be fun to take some of those statements, using feedback from Subcommittee members, and play a little game of “True or False: CFX Edition.”
To read this entire article, which appeared in the January 2020 issue of SMT007 Magazine, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Gstar Announced the Strategic Move: Groundbreaking of Silicon Wafer Factory Construction in Indonesia
05/03/2024 | PRNewswireRecently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.