-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Building A Better, Brighter LED Headlamp with Top-Side Alignment Process (TAP)
February 10, 2021 | Glenn Farris, Universal Instruments Corp.Estimated reading time: 1 minute
Abstract
An emerging trend in the automotive industry is the adoption of advanced LED headlamp lighting systems. These systems drive challenging placement requirements for LED packages. In this paper, we will review these unique challenges and discuss a novel approach to high-accuracy placement of LED packages enabling a scalable production solution.
Drivers
LED lighting technology for automotive headlamp applications provides improved safety and lighting intelligence. LED automotive headlamps are becoming the standard for even the most affordable automobiles and the automotive LED market is expected to reach $3B by 2022.
Challenges
LED automotive headlamps and emerging applications like LIDAR are complex, requiring ultra-precise assembly to achieve extreme performance standards. High-accuracy placement and exact LED alignment are essential in building brighter and more adaptive (color, direction, intensity) LED automotive headlamps.
Some of the manufacturing challenges of rapidly and accurately placing LEDs include:
- Requirements for accurate top-side vision correction
- Need for high throughput at 10–25µm accuracy
- Non-standard fiducials
- Need for material, process, and application know-how
The most effective way to achieve this is to utilize a top-side alignment (TAP) process for placement of LEDs.
Top-Side Alignment
Top-side alignment process (TAP) ensures an accurate, repeatable, high-speed and economical production solution for the placement of LEDs. The TAP process precisely places and aligns LEDs based on top-side features. A top-side inspection of LED (light-emitting diode) features is performed on a back-lit vacuum nest, followed by a bottom-side inspection of critical features. TAP eliminates the inaccuracies of alternative solutions caused by part movement during a post-inspection (top side only) pick process.
To read this entire paper, which appeared in the January 2021 issue of SMT007 Magazine, click here.
Suggested Items
Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
05/01/2024 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory has recently launched a collaboration with Toyota Motor North America that could reduce the nation’s reliance on foreign sources of battery materials.
Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow: