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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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Thank You to the I-Connect007 Team
March 25, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
During IPC APEX EXPO, the I-Connect007 team works very hard to bring you several great interviews that will keep you up to date on the latest industry activity. This year, we had Nolan Johnson, Andy Shaughnessy, Pete Starkey, and Happy Holden of I-Connect007 in front of the cameras.
We also send out a very special thank you to our guest interviewers, who sat in the I-Connect007 show floor studio to conduct many interviews. The list includes Tara Dunn, Dick Crowe, Joe Fjelstad, Steve Williams, and Kelly Dack. Their contributions are greatly appreciated.
Our show floor production crew included Bryson Matties, Bryan Bernas, and Mike Radogna. Michelle Te greeted the guests and ushered them into our studio for their interviews. And with the remote support of Shelly Stein, each video was published within minutes of being produced. Thanks goes out to the entire team!
Once again, we greatly appreciate all the combined efforts to help make this the best IPC APEX EXPO coverage in the industry.
To see the interviews, visit our Real Time with… IPC APEX EXPO website here.
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IMI Welcomes New CEO
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ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
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On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.