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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 22, 2022 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication, and assembly communities. The roller coaster ride continues, with whiplash-inducing news from IPC about March North American shipment—they’re up from February but down from the same period a year ago.
We also have articles that cover everything from upskilling your labor force to using big data to help bring manufacturing back to North America. We have a review of one of our latest books, Printed Circuit Designer’s Guide to… Stackups: The Design within the Design, and a great column by Anaya Vardya about the need for American manufacturers to stop viewing one another as adversaries and start working together. We’re down to 200 domestic fabricators; cooperation may be the only answer.
As Ben Franklin said, “We must, indeed, all hang together or, most assuredly, we shall all hang separately.”
IPC Releases PCB Industry Results for March 2022
Published April 22
Good news, bad news: According to IPC, March North American PCB shipments rose 5.6% over the previous month but fell 11.7% YOY. As Shawn DuBravac says, supply chain issues are improving just as orders are dropping in various markets. Never a dull moment in this industry.
Training the Future Manufacturing Labor Force
Published April 19
There’s been a lot of talk about the need to “upskill” the PCB manufacturing labor force, but what does that entail, exactly? In this interview, Michael Connella, Matt Stevenson, and Debra Coburn discuss Sunstone Circuits’ plans to keep their staff trained on the latest in fabrication technology and processes.
Big Data Can Bring Your Business Back
Published April 20
It’s all about data. In this industry, you either manage your data or you get left behind. But big data may provide the advantage that North America needs to regain some of the work lost to overseas companies. In this article, Siemens’ Zac Elliott explains how big data just might be the differentiator that American companies have been waiting for.
The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design
Published April 18
The I-Connect007 book Printed Circuit Designer’s Guide to… Stackups: The Design within the Design has been flying off our virtual newsstand. No wonder: The stackup may be the most important part of your PCB design. One of our readers, signal integrity engineer Skyler Sopp, has written a review of this timely tome. Check it out.
Standard of Excellence: From Adversaries to Collaborators—Let’s Do This Together
Published April 20
Columnist Anaya Vardya makes a great point here: “Our domestic PCB industry could have stood stronger and been much more vibrant today if we had stood together, shoulder to shoulder as one united industry. But alas, we did not, and today this what we have: fewer than 200 companies striving to stay alive with our wagons still moving in a straight and vulnerable line instead of coming together in a circle of strength.” Don’t miss this column.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Gstar Announced the Strategic Move: Groundbreaking of Silicon Wafer Factory Construction in Indonesia
05/03/2024 | PRNewswireRecently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.