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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
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One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
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September 2022 Issue of PCB007 Magazine Available Now
September 16, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In this issue of PCB007 Magazine, we explore ideas for mechanization/automation of your existing facility. At first blush, this theme would suggest a major concentration on manufacturing floor details, or maybe a heavy dose of new capital equipment and line design topics. As you'll learn, it's much more than that.
In our kick-off expert interview, Alex Stepinski makes the strategic-level case for a specific set of duties to be performed by a chief technology officer. Also featured in this issue: Michael Carano, speaking on the IPC Thought Leaders program and his insights on the industry and why upgrading capabilities are essential, plus Dana Korf discussing developments in materials that influence manufacturing processes. This brings us back to updating our brownfield facilities.
The rest of the issue contains articles and columns examining the technical details of board fabrication: microvia reliability advances, automating wet processes; thoughts on the manufacturing industry, and more.
Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.
Suggested Items
DDM Novastar Unveils Affordable NovaPlace Automatic Pick and Place Systems
05/06/2024 | DDM Novastar Inc.DDM Novastar, a prominent U.S. manufacturer specializing in SMT and PCB assembly equipment, proudly announces the recent launch of their NovaPlace Pick & Place systems. This new line introduces entry-level yet high-performance pick and place machines.
May Issue of SMT007 Magazine: Coming to Terms With AI
05/06/2024 | I-Connect007 Editorial TeamIn the May 2024 issue of SMT007 Magazine, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.