-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Zero Defects International Announces Renewal of ITAR Registration
February 22, 2023 | Zero Defects InternationalEstimated reading time: Less than a minute
Zero Defects International [ZDI] has received notice of compliance with and renewed registration for ITAR, the International Traffic in Arms Regulation. The continuation of this conformance status enables users of each of the two ZDI services to maintain access to both services. The first is the outsourcing of printed circuit board [PCB] front-end engineering CAM services. This continues to be a very popular practice within the North American printed circuit board manufacturing industry but access to specific product design and technical information requires that ZDI and applicable users operate within parameters set by ITAR.
The second of these services involves the printed circuit board assembly [PCBA] testing that ZDI performs for customers in Silicon Valley as well as for companies in all regions of the United States. ITAR compliance is essential in order to utilize the necessary engineering data for test purposes.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Boeing Opens Research & Technology Center in Japan
04/23/2024 | BoeingBoeing today opened a Boeing Research & Technology (BR&T) Center in Japan that will focus on innovation to enable the commercial aviation industry meet its goal of net zero carbon emissions by 2050.
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).
Incap Estonia Teamed Up With Solaride to Fuel Youth Excitement for The World of Engineering
04/11/2024 | IncapIncap Estonia partnered with Solaride to ignite enthusiasm among young people for the world of engineering and sustainable technology. Together, they organised an inspiring day for students from grades 7 through 12 in Saaremaa. Held at Incap’s Kuressaare factory, this event brought together over 130 young minds eager to explore the innovative world of technology and learn more about advanced electronics manufacturing.
Mark Schulman Rocks Zuken Innovation World + integrate24
04/10/2024 | ZukenZuken USA, Inc. is excited to announce that the renowned drummer and motivational speaker, Mark Schulman, will be the keynote speaker at this year's Zuken Innovation World Americas (ZIW) conference, co-located with integrate24. Scheduled for September 17-19, 2024, in the vibrant city of Cleveland, Ohio, the conference aims to bring together the brightest minds in the PCB, Wire Harness, and Digital Engineering fields.