-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha's Sintering Technologies Take Center Stage at PCIM Asia
August 29, 2023 | MacDermid AlphaEstimated reading time: 2 minutes
MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Asia, held at Shanghai New International Expo Center - SNIEC, 29 - 31 August 2023. MacDermid Alpha’s experts and product portfolio will be on display in hall W2, booth 2F08. Our team of experts look forward to welcoming visitors and sharing innovative solutions for increased power, range, and reliability in EVs (Electric Vehicles).
Save the date –August 29, 2023, The Power Electronics - Product Overview, Processes, and Technical Roadmap
Zhao Yu, Business Development Manager at MacDermid Alpha will introduce our latest products and process technologies for power electronics. These include both sintering and soldering materials, the application of those processes, and our new product development direction to meet the evolving power electronics technology trends.
Zhao Yu has over 13 years of experience in semiconductor packaging and electronic assembly fields, specializing in silver bonding and soldering technologies. His team assists customers in the successful implementation of these sintering and soldering technologies in large-scale production.
Innovative technology to aid new-generation inverter design
MacDermid Alpha is powering the path to enhanced reliability of power inverters. This is achieved by improving the consistency of sintered joints and enabling higher operating temperatures. Highlighted at the show will be:
- Argomax® 2141, a recent addition to the portfolio, is ideal for sintering large packages or components on gold or silver substrates. A key advantage is its firm attachment to the inverter, and ability to cope with marginal component surfaces. Utilizing a pure silver bond line, the dispensable silver sintering paste exhibits excellent bond line thickness and adhesion. Argomax 2141, delivers excellent performance and reliability for inverters in extreme temperature swings.
- The ATROX® range offers superior reliability and performance with rapid heat dissipation for higher efficiencies and operating temperatures. The ATROX 800HT series, are thermosetting conductive die attach adhesives with high thermal conductivity (>70 W/m-K) are designed for the no-pressure assembly of high-power exposed pad semiconductor packages. The ATROX die attach and clip attach process provides low modulus materials for large die sizes as well as superior adhesion to copper clip surfaces. A leading high thermal film with excellent bond line control, ATROX CF200-1D, is an electrically conductive die attach film with thermal conductivity of >20 W/m-K with no die tilting resulting in a high-yield assembly process.
Today, China’s new energy vehicle market accounts for almost 25% of all automotive sales. This will continue to increase. MacDermid Alpha is in a unique position, being the only material supplier for all electronics manufacturing, to support this trend. Speaking recently at the opening of the MacDermid Alpha China Electronics Center (CEAC) in Pudong New Area, Shanghai, Tom Hunsinger (Vice President of Semiconductor Assembly) commented, “At the heart of an electric vehicle is the power inverter. Our materials, and our presence in China, help OEMs and Tier 1s develop the next-generation designs.”
Established global product brands in the electronic industry are part of MacDermid Alpha Electronic Solutions. These include Alpha®, Compugraphics™, Electrolube®, Kester®, and MacDermid Enthone®, bringing manufacturers a fully integrated ‘start to finish’ electronics roadmap.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.