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Indium Corporation to Showcase HIA Materials at ECTC

05/07/2024 | Indium Corporation
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.

AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East

04/22/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.

Indium to Host Free Webinar on Lead-Free Solder Paste for Automotive Applications

04/09/2024 | Indium Corporation
Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.

Indium Corporation to Present, Exhibit at EPP InnovationsFORUM

03/28/2024 | Indium Corporation
Indium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.

Indium Corporation, Industry Partners to Showcase Products “Live@APEX”

03/26/2024 | Indium Corporation
Indium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
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