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SMTA Carolinas Chapter In-Person Technical Meeting to Improve SMT Quality with Accuracy and Force Validation
February 6, 2024 | SMTA Carolinas ChapterEstimated reading time: 1 minute
The Carolinas Chapter of the SMTA is hosting an evening dinner presentation on Thursday, February 22, 2024 from 6:00 - 8:00 pm ET at East West Charlotte in Mooresville, NC with CeTaQ General Manager Michael Sivigny, who will present on ways to improve SMT quality. Special thanks to our site sponsor, East West Manufacturing. Additional information about the event and the registration form is found at smta.org/events.
If you don't measure, you don't know. These are appropriate words for the application of statistical methods for measuring machine and process capabilities in SMT manufacturing. Only through diagnostic measurement and analysis of SMT equipment can quality performance improvement be realized. Measured mean values can be used to 'soft' calibrate machines to a higher level of accuracy than available through OEM standard calibrations.
With the complexity of highspeed automation combined with high accuracy requirements for product miniaturization, it is necessary to dig deeper with statistically significant data collection methods to understand and solve the root cause of sub-component machine failures which impact product quality.
When machines are allowed to run in 'maximum accuracy mode', they are more confident and capable of producing today's high reliability electronics with fewer defects. Defect contribution in each process step needs detailed analysis to reduce cost. When costs are minimized, the underlying inherent process efficiencies go way up which contributes to higher productivity and bottom-line profitability. The improvement effects of process optimization have several intrinsic benefits that can easily maintain high manufacturing productivity.
The presentation will discuss individual process step validation methods with real examples of improvement that contribute to DPMO reduction. Examples will include examples from laser marking, stencil printing, dispensing, and placement equipment. While each process step is characterized, the underlying objective is to verify OEM specifications and prove that machines are capable for intended quality performance. This allows engineers to streamline efforts and focus on other areas of process improvement. Register today as space is limited.
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The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
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Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow: