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High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating

05/29/2024 | Neil Hubble, Akrometrix
Moisture sensitivity requirements for non-hermetic surface mount devices are defined in the joint IPC/JEDEC standard J-STD-020E, “Joint IPC/JEDEC Standard for Moisture/Reflow Sensitivity Classification for Non-hermetic Surface-Mount Devices,” last updated in December 2014. This standard allows customers and suppliers to place electronics devices into specific categories, defined into 8 different moisture sensitivity levels (MSL). Test method criteria are defined within this standard to define MSL levels for different packages. A subsection of MSLs are shown in Figure 1 below, showing the MSL 3 and 4 used in this study.

Indium’s Wisdom Qu to Present at SMTA China South Technical Conference

09/29/2023 | Indium Corporation
Indium Corporation Regional Product Manager Wisdom Qu will present at the SMTA China South Technical Conference, held in conjunction with NEPCON Asia, on October 11 in Shenzhen, China.

SHENMAO's New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues

03/13/2023 | SHENMAO America, Inc.
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.

SHENMAO Offers Low-Temperature Lead-Free Solder Paste PF735-PQ10-10L for High-Speed Printing

02/22/2023 | SHENMAO
SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.

iNEMI Call for Participation: Package Warpage Prediction Project

01/04/2023 | iNEMI
iNEMI is continuing a series of projects addressing package warpage challenges with Phase 6 of the Package Warpage Prediction and Characterization project.
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