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Standards Committee Updates at IPC
November 20, 2015 | IPCEstimated reading time: 5 minutes
The 7-11 Test Methods Subcommittee to review a proposal by Gerard O’Brien, StandS Group, for using XRF to determine phosphorous content in ENIG. There was a discussion of a Validation Process and Method Review for IPC methods. They proposed that the TAEC review all released Test Methods, new and revised. Also proposed that IPC could potentially provide validation for Test Method operators and auditing to ensure proper testing.
The 7-12 Microsection Subcommittee met to continue the revision of IPC-9241, Microsectioning Guideline (formerly MS-810) and review the comments on KAVI. Feedback from the recently released TM 2.1.1F, Microsectioning, Manual Method and a proposed Microsectioning Training course were also discussed.
The D-32 Thermal Stress Test Methods Subcommittee met to discuss the next steps moving forward on the revision of TM 2.6.7.2, Thermal Shock and 2.6.27, Thermal Stress. A PIN is to be drafted and discussed at the next teleconference.
Process Control
The 7-23 Assembly Process Effects Handbook Subcommittee met to discuss the format and content of the new IPC-9111, Troubleshooting for Printed Board Assembly Processes, before going to Final Industry Review.
Product Assurance
The 7-30 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held in APEX 2016.
The 7-31b IPC-A-610 Task Group reviewed comments on IPC-A-610, Acceptability for Electronic Assemblies. The Task Group met a second day to resolve comments on criteria comment to both IPC-A-610, Acceptability for Electronic Assemblies, and IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The group also celebrated completion of the forthcoming IPC-A-610 Revision F Amendment 1.
The 7-31bc Telecom Addendum Task Group met to continue discussions on the revision of the document. The Task Group plans to update the addendum using Revision F of IPC-A-610, Acceptability for Electronic Assemblies as the base document.
The 7-31f Task Group responsible for IPC-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies, met to continue revision work on the document.
The 7-31j Task Group met to continue revising IPC-A-630, Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures. The Task Group also discussed and approved a new title for the standard that will be introduced with the revision.
The 7-31k Wire Harness Design Task Group and 7-31h IPC-HDBK-620 Handbook Task Group met to celebrate the forthcoming IPC-D-620, Design and Critical Process Requirements for Cable and Wiring Harnesses, and to open discussion on IPC-HDBK-620, Handbook and Guide to Supplement IPC-A-620.
The 7-31m Fiber Optic Cable Acceptability Task Group agreed to split the working draft IPC-A-640 into separate standards for design (IPC-D-640) and acceptance (IPC-A-640). Because most of the content for the design document is already on hand, the group will focus first on IPC-D-640, with plans to ballot by APEX/EXPO, and will pick up work on IPC-A-640 near that time, with a goal to publish later in 2016.
The 7-32c Electrical Continuity Task Group met to review industry responses to a survey on adjacency testing for bare printed board electrical test. Additional input on the need to specify a minimum retention period for electrical test data and clarification on when electrical testing for Class 3 product can be agreed upon between user and supplier drove the group to determine that a “B” revision to the IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards, should be developed for a 2016 release.
The 7-34 Repairability Subcommittee met to continue revising IPC-7711/21, Rework, Modification and Repair of Electronic Assemblies.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/26/2024 | Andy Shaughnessy, Design007 MagazineIn this week’s roundup, we have a variety of articles covering everything from design through assembly, and even box build. I’ve always wondered whether box build was all it was cracked up to be. Do customers really pick one EMS provider over another because one company offers box build? And if you’ve ever wanted to volunteer, IPC’s Thought Leaders Program is looking for a few good technologists to help them on their mission. Check out Stanton Rak’s article, which was published in the spring issue of IPC Community.
Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
04/25/2024 | Stanton Rak, SF Rak CompanyAs a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.