Goepel Offers Free Webinar on Eliminating False Calls with Full Coverage 2D/3D X-ray Inspection


Reading time ( words)

Goepel is pleased to announce their upcoming webinar, "Farewell to false calls resulting from reflections and shadows! Fast, full-coverage 2D/3D X-ray In-Line Inspection", to be presented on October 13, 2016 at 11 AM EST.

Those that deal with Automated Optical Inspection (AOI) of solder joints on PCBs are all too familiar with the discussion of false calls rate and test escape rates. Traditional AOI systems work with illumination of varying wavelengths and directions. Depending on the surfaces, the reflections and shadows visible in the camera image are properties used for a pass/fail determination. Changes in the solder resist, differing strong reflections from pins and solder joints as well as flux residue and slight contaminations influence such reflections and shadows – one reason for occurring false calls and escapes.

The webinar illustrates the usage of full-coverage X-ray inspection of all solder joints – whether visible or hidden. The result: fewest false calls and escapes. An integrated AOI module in the AXOI system X-Line · 3D handles the inspection of optical properties such as polarity and labelling which are not visible with X-ray.

Furthermore, possibilities and limits of failure detection will be shown in the webinar with many sample images.

As part of the agenda, you will learn more about the benefits of X-ray inspection (AXI) in comparison with Automated Optical Inspection (AOI). The possibilities and limits of failure detection for an AXI system will be discussed as well as the benefits of the combination of both inspection methods (AXI and AOI). Failure scenarios on QFN, BGA, THT, SO-IC- and QFP package types will also be covered. System concept of the AXOI system X-Line·3D will be reviewed in detail.

For more information and to register, visit Goepel's "Farewell to false calls resulting from reflections and shadows! Fast, full-coverage 2D/3D X-ray In-Line Inspection" event page.

About GOEPEL electronic

GOEPEL electronic is a technologically leading vendor of professional Automated Optical Inspection systems (AOI), Solder Paste Inspection (SPI) and Automated X-ray Inspection Systems (AXI). A network of branch offices in the UK, China, India and the USA, international distributors and service partners ensures the global availability of the products as well as the on-site support to several hundred system installations. Founded in 1991 and headquartered in Jena, Germany, GOEPEL electronic has currently more than 230 employees and generated revenue of 30 million Euro in 2015. GOEPEL electronic has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. GOEPEL electronics’ industry award winning products are relied on by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries. Further information about the company and its products can be found on the internet at www.goepel.com.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.