ACE Offers Unique BGA Cleansing Processing with World-class Coplanarity


Reading time ( words)

ACE Production Technologies, Inc. is pleased to announce that its component lead tinning services operation offers BGA cleansing with unmatched coplanarity.

“Many of our high reliability and military/aerospace customers need to remove the original BGA solder balls prior to converting BGA devices from RoHS to tin-lead or from tin-lead to lead-free,” said Roger Cox, Operations Manager of ACE Component Services. “The ideal method for doing this is the use of a special dynamic side wave process in combination with a nitrogen blow-off which has a significant advantage of minimizing the accumulation of molten solder.”

The de-balling process typically consists of the complete removal of the original BGA solder spheres and pad finish prior to other process steps including site preparation and placement of new solder spheres followed by reflowing to restore the BGA devices to their original specification or for conversion. Additional process steps can also include optical inspection of sphere condition, ball shear or XRF testing, ionic cleanliness and solderability testing.

“Due to the excellent repeatability of the ACE LTS lead tinning machines and its robotic presentation of the BGA to the molten solder in combination with a special dynamic side wave nozzle specifically for BGA ball cleansing and a heated nitrogen blow-off, we are able to maintain the coplanarity of BGAs within 0.003” (0.075mm),” stated Cox. “Our customers have told us we provide them with cleansed BGAs that are more flat than our competitors and are more consistent from part-to-part.” In addition, ACE Component Services has the ability to retin bottom terminated components such as QFNs and DFNs as small as 3mm x 3mm and with a lead pitch down to 0.5mm. Leaded fine-pitch SMT components such as QFPs can be re-tinned down to 0.012” (0.3mm) lead pitch with bridge free results.

About ACE

ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information click here, call 509-924-4898 or email sales@ace-protech.com.

 

Share

Print


Suggested Items

Excerpt: The Printed Circuit Assembler’s Guide to… Smart Data

04/07/2021 | Sagi Reuven and Zac Elliott, Siemens Digital Industries Software
Whenever we discuss data, keep in mind that people have been collecting data, verifying it, and translating it into reports for a long time. And if data is collected and processes are changed automatically, people still will be interpreting and verifying the accuracy of the data, creating reports, making recommendations, solving problems, tweaking, improving, and innovating. Whatever data collection system is used, any effort to digitalize needs to engage and empower the production team at the factory. Their role is to attend to the manufacturing process but also to act as the front line of communications and control.

Top 10 Most-Read SMT Articles of 2020

12/31/2020 | I-Connect007
As 2020 comes to a close, the I-Connect007 Editorial Team takes a look back at its most read articles. Here are the top 10 reads in SMT from the past year.

Meet Christine Davis, I-Connect007 Columnist

12/23/2020 | I-Connect007 Editorial Team
Meet Christine Davis, one of our newest columnists! Christine will share her expertise and lessons learned through her journey as one of the few women in the electronics industry to found and run her own company.



Copyright © 2021 I-Connect007. All rights reserved.