Real Time with... SMTAI: Mirtec’s Brian D’Amico Discusses Benefits of 3D Inspection Technologies


Reading time ( words)

At the recent SMTA International event in Rosemont, Illinois, Brian D'Amico, president of Mirtec, discusses with I-Connect007’s Andy Shaughnessy why more and more manufacturers are adopting 3D inspection technologies, such as 3D AOI and 3D SPI systems. He also mentions the increasing use of very small components, such as the 0201s and 01005s—and the advent of the 03015s.

"What 3D does for us is it allows us to measure the solder joint, how high the solder has crept up, and do full analysis. From a metrology point of view, we know exactly the dimensions—the x, y, z elements—for 3D. That’s the advantage of 3D. It guarantees that you are making boards correctly, maximizing your efficiency, and minimizing waste," says D'Amico.

Watch the interview here.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 2

04/14/2021 | Brent Fischthal, Koh Young America
A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not compromise, interrupt or slow that process.



Copyright © 2021 I-Connect007. All rights reserved.