Koh Young Singapore Relocates Office to Pasir Panjang

Reading time ( words)

3D inspection technology leader Koh Young Technology has relocated its Singapore office to Pasir Panjang, Singapore. The new office will serve as a sales, training, service and application support facility for Koh Young’s best-in-class 3D solder paste inspection (SPI), automated optical inspection (AOI) systems, and Smart Factory solutions. 

“We have seen our growth accelerate in recent years in Southeast Asia since we opened our Singapore office in KA Place, Singapore, in December 2013,” said Peter (Jong Hoon) Shin, General Manager of Koh Young Singapore. “Our new office space is 20 percent larger than our previous office, and allows us to continue to enhance our ability to serve our customers at the highest levels. It provides more space for training, machine demonstrations and application support, and empowers our customers to derive the greatest advantage from their Koh Young equipment. Our goal is to always help our customers increase productivity and efficiency by improving their manufacturing process.” 

Koh Young Singapore is now located at 108 Pasir Panjang Road, Golden Agri Plaza #03-13, Singapore 118535, Tel. +65 6634 2814. 

About Koh Young Technology Inc.

Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Germany, Japan, Singapore, China and Korea. For more information, click here.   




Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.

Copyright © 2021 I-Connect007. All rights reserved.