Koh Young Highlights Latest Technology at SMT Hybrid Packaging Show

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3D inspection technology leader Koh Young Technology showed off its latest technology developments, including the KSMART Solution, Koh Young's own field-proven AI platform – IP (Intelligent Platform), at the recent SMT Hybrid Packaging 2017 Show in Nuremberg, Germany. The exhibit was timely in part because Koh Young has proven the excellence of KSMART in Germany, the industrial powerhouse where the Industry 4.0 concept first emerged, according to Wolfgang Runte, sales manager of Koh Young Europe.

"At Koh Young Technology, we've been promoting a new theme, 'True 3D Now Powered by IP'," Runte said. "The new KSMART features that we've unveiled are based on IP, enabling Smart Factory realization. With KSMART, by using reliable full 3D measurement data, we're tracing and analyzing defect root causes earlier than ever before."

Key features of the KSMART solution that were highlighted included Link@KSMART, SPC@KSMART, and Library Manager. Another new feature for 3D Automated Optical Inspection (AOI), based on IP, is Auto Programming, which reduces the time needed to create new JOB files. Attendees also had the opportunity for a sneak preview of advances in Koh Young's inspection technology, and of new developments especially designed to serve the Automotive industry.

SMT Hybrid Packaging is the only event in Europe that takes a comprehensive view of microelectronics, bringing together 420 exhibitors and more than 15,000 visitors.

About Koh Young Technology Inc.

Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are in the United States, Germany, Japan, Singapore, China and Korea. For more information about the company, visit www.kohyoung.com.



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