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Dr. Wusheng Yin, the president of YINCAE Advanced Materials, is scheduled to speak at the SMTA International 2017, which will take place at the Donald Stephens Convention Center in Rosemont, Illinois, on September 17–21, 2017.
Dr. Yin will be presenting his white paper, "High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste," on September 20 at 9:00 am.
YINCAE Advanced Materials is pioneering the way with their unique solder joint encapsulants, underfill materials, die attach adhesives, wafer lever materials, optoelectronic materials, and conformal coatings.
To learn more about YINCAE, visit the YINCAE team at Booth 329.